Resonance device

Abstract

To reduce influences a thermal stress transferred to a vibration area exerts upon vibration characteristics of a chip by preventing the thermal stress from being concentrated.SOLUTION: A resonator device 100 includes a crystal chip 110, two metal electrodes 120, and two groove portions 130. The crystal chip has a first surface 111 and a second surface 112 opposite to each other, and includes a first area Z1, a second area Z2 which surrounds the first area and is located between the first area and a third area, and the third area Z3 which surrounds the second area. The two metal electrodes are respectively disposed on the first surface and the second surface. The metal electrode includes a first electrode portion 121, a connecting portion 123, and a second electrode portion 122. The first electrode portion is disposed in the first area. The connecting portion is disposed in the second area. The second electrode portion is disposed in the third area. The connecting portion connects the first electrode portion and the second electrode portion, and the second electrode portion extends to an edge of the crystal chip. The two groove portions are respectively disposed on the first surface and the second surface and are disposed in the second area. A depth of each of the groove portions is equal to a thickness of each of the metal electrodes.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to electronic components, and more particularly to resonant devices. [Background technology]

[0002] A resonator is an electronic component that utilizes the piezoelectric properties and natural resonant frequency of a material. Quartz crystals are a common material used for resonators. Quartz crystal elements have stable piezoelectric properties and can provide functions such as accurate and wide-ranging reference frequencies, clock control, timing functions, and noise filtering. Quartz crystal elements can also be used as sensors for vibration and pressure, and as important optical components.

[0003] The working environment of resonator-related products is often close to systems such as wireless networks (Wi-Fi) and Bluetooth, and the temperature generated by these systems is transmitted to the vibration area through the metal wiring of the product, causing thermal stress, which affects the operating frequency of the product. In particular, with the current trend toward high frequency, high stability, and miniaturization, the problem of thermal stress cannot be ignored.

[0004] Therefore, one of the important research and development issues in this field is how to prevent thermal stress from concentrating and reduce the impact of thermal stress transmitted to the vibration area on the vibration characteristics of the chip. Summary of the Invention [Problem to be solved by the invention]

[0005] The problem to be solved by the present invention is how to prevent the concentration of thermal stress and reduce the influence of thermal stress transmitted to the vibration area on the vibration characteristics of the chip.

[0006] The present invention provides a resonator device with excellent vibration characteristics. [Means for solving the problem]

[0007] The resonator device of the present invention includes a crystal chip, two metal electrodes, and two grooves. The crystal chip has opposing first and second surfaces and includes a first region, a second region, and a third region. The second region surrounds the first region, the third region surrounds the second region, and the second region is located between the first and third regions. The two metal electrodes are disposed on the first and second surfaces, respectively. The metal electrodes include a first electrode portion, a connection portion, and a second electrode portion. The first electrode portion is disposed in the first region. The connection portion is disposed in the second region. The second electrode portion is disposed in the third region, and the connection portion connects the first electrode portion and the second electrode portion, and the second electrode portion extends to the edge of the crystal chip. Two grooves are disposed on the first and second surfaces, respectively, and in the second region, with the depth of each groove equal to the thickness of each metal electrode.

[0008] In one embodiment of the present invention, the second region described above is immediately adjacent to and completely surrounds the first region, the third region is immediately adjacent to and completely surrounds the second region, and the first region, second region, and third region do not overlap one another.

[0009] In one embodiment of the present invention, the above-mentioned first electrode portion completely covers the first region.

[0010] In one embodiment of the present invention, the above-mentioned first electrode portion is rectangular.

[0011] In one embodiment of the present invention, the above-mentioned first electrode portion has four corners, which are right angles or rounded corners.

[0012] In one embodiment of the present invention, the area of ​​the above-mentioned connection portion is equal to or greater than 1% and less than 100% of the area of ​​the second region.

[0013] In one embodiment of the present invention, the area of ​​the above-mentioned connection portion is 5% or more and 50% or less of the area of ​​the second region.

[0014] In one embodiment of the present invention, the area of ​​the second electrode portion is 25% or more of the area of ​​the third region.

[0015] In one embodiment of the present invention, the edges of the third region mentioned above are aligned with the edges of the first and second surfaces.

[0016] In one embodiment of the present invention, each of the aforementioned grooves includes a first section, a second section, a third section, and a fourth section connected in sequence, the first section and the third section extending along a first direction, the second section and the fourth section extending along a second direction perpendicular to the first direction, the first section, the second section, the third section, and the fourth section forming a plurality of folds, and a connecting section located between the first section and the fourth section separating the first section and the fourth section.

[0017] In one embodiment of the present invention, the above-mentioned resonator device further includes an opening disposed on the first surface and positioned in the third region, and the depth of the opening is equal to the thickness of each metal electrode.

[0018] In one embodiment of the present invention, the above-mentioned crystal chip has a plurality of corners, and the opening corresponds to at least one of the corners.

[0019] In one embodiment of the present invention, the crystal chip described above has a plurality of sides, and the opening extends along at least one of the sides.

[0020] In one embodiment of the present invention, the above-mentioned crystal chip has a plurality of sides, and the second electrode portion extends to at least one of the sides.

[0021] In one embodiment of the present invention, the above-mentioned resonant device further comprises at least one conductive adhesive corresponding to the second surface. [Effects of the Invention]

[0022] As described above, in the resonator device of the present invention, metal electrodes are installed on the upper and lower surfaces of the crystal chip along the edges of the crystal chip, surrounding the main vibration region, thereby preventing thermal stress from concentrating and reducing the impact of thermal stress transmitted to the vibration region on the vibration characteristics of the crystal chip, thereby achieving the goals of increasing thermal conductivity, optimizing uniformity, and adjusting the secondary frequency to realize a chip design with a wide temperature range.

[0023] In order to make the above-mentioned features and advantages of the present invention more clearly comprehensible, the following embodiments will be described in detail in conjunction with the accompanying drawings. [Brief explanation of the drawings]

[0024] [Figure 1] 1 is a three-dimensional schematic diagram of a resonator device according to one embodiment of the present invention; [Figure 2] 2 is a schematic three-dimensional view of the resonator device of FIG. 1 from another perspective. [Figure 3A] 2 is a schematic front view of the resonator device of FIG. 1. [Figure 3B] 2 is a schematic front view of the resonator device of FIG. 1. [Figure 4] 2 is a cross-sectional schematic view of the resonator device of FIG. 1 taken along section AA. [Figure 5] 2 is a cross-sectional schematic view of the resonator device of FIG. 1 taken along section line BB. [Figure 6A] FIG. 10 is a schematic three-dimensional view of a resonator device according to another embodiment of the present invention. [Figure 6B] FIG. 10 is a schematic three-dimensional view of a resonator device according to another embodiment of the present invention. [Figure 7A] 1 is a three-dimensional schematic diagram of a resonator device according to one embodiment of the present invention; [Figure 7B] FIG. 7B is a schematic front view of the resonator device of FIG. 7A. [Figure 8] 1 is a three-dimensional schematic diagram of a resonator device according to one embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0025] FIG. 1 is a three-dimensional schematic diagram of a resonator device according to one embodiment of the present invention. FIG. 2 is a three-dimensional schematic diagram of the resonator device of FIG. 1 from another perspective. In FIG. 2, the resonator device of FIG. 1 is rotated 180 degrees to more easily show the rear structure, for example. Referring to FIGS. 1 and 2, the resonator device 100 of this embodiment includes a crystal chip 110, two metal electrodes 120, two grooves 130, an opening 140, and at least one conductive adhesive 150. The crystal chip 110 has opposing first and second surfaces 111 and 112. The two metal electrodes 120 are disposed on the first and second surfaces 111 and 112, respectively. The two grooves 130 are disposed on the first and second surfaces 111 and 112, respectively. In this embodiment, the material of the crystal chip 110 is a piezoelectric material, such as a quartz crystal or other piezoelectric material.

[0026] In one embodiment, the resonator device 100 may further include a base and an upper cover. The crystal chip 110 is placed on the base via a conductive adhesive 150, and the upper cover is attached to the base to cover the crystal chip 110. The region between the two metal electrodes 120 is, for example, a vibration region. When a voltage difference is applied between the two metal electrodes 120, the vibration region deforms due to the inverse piezoelectric effect. When the voltage difference is removed, the vibration region vibrates, and a voltage change occurs between the two metal electrodes 120 due to the piezoelectric effect, resulting in a voltage signal being output from the two metal electrodes 120. The operation and implementation of the resonator device will not be described in detail herein, as sufficient teachings, suggestions, and implementation instructions can be obtained from ordinary skill in the art.

[0027] Figures 3A and 3B are schematic front views of the resonator device of Figure 1. Figure 4 is a schematic cross-sectional view of the resonator device of Figure 1 taken along section AA. Figure 5 is a schematic cross-sectional view of the resonator device of Figure 1 taken along section BB.

[0028] Referring to FIG. 3A, in this embodiment, the crystal chip 110 includes a first region Z1, a second region Z2, and a third region Z3. The second region Z2 surrounds the first region Z1, and the third region Z3 surrounds the second region Z2, with the second region Z2 being located between the first region Z1 and the third region Z3. The edges of the third region Z3 are aligned with the edges of the first surface 111 and the second surface 112. Specifically, the second region Z2 is directly adjacent to and completely surrounds the first region Z1, and the third region Z3 is directly adjacent to and completely surrounds the second region Z2. The first region Z1, the second region Z2, and the third region Z3 do not overlap with each other. Note that in FIG. 3A, the metal electrodes on the crystal chip are omitted, and the first region, the second region, and the third region are illustrated with different density halftone dots for easier identification.

[0029] 1, 3A, and 3B, in this embodiment, the metal electrode 120 includes a first electrode portion 121, a connecting portion 123, and a second electrode portion 122. The first electrode portion 121 is disposed in a first region Z1. The connecting portion 123 is disposed in a second region Z2. The second electrode portion 122 is disposed in a third region Z3. The connecting portion 123 connects the first electrode portion 121 and the second electrode portion 122.

[0030] In this embodiment, the first electrode portion 121 completely covers the first region Z1. The first electrode portion 121 is, for example, rectangular, but the present invention is not limited thereto. In this embodiment, the first electrode portion 121 has four right-angled corners, but in other embodiments, the corners may be rounded, and the present invention is not limited thereto.

[0031] In this embodiment, the two grooves 130 are disposed in the second region Z2. Referring to FIG. 4, the depth H1 of the grooves 130 is equal to the thickness W1 of each metal electrode 120, thereby exposing the first surface 111 and the second surface 112 of the crystal chip 110. Specifically, referring to FIG. 1, the grooves 130 include a first section 131, a second section 132, a third section 133, and a fourth section 134 connected in sequence. The first section 131 and the third section 133 extend along a first direction N1, and the second section 132 and the fourth section 134 extend along a second direction N2. The first section 131, the second section 132, the third section 133, and the fourth section 134 form multiple folds to surround the first electrode portion 121.

[0032] In this embodiment, the connection portion 123 is located between the first section 131 and the fourth section 134 and separates the first section 131 and the fourth section 134. In other embodiments, the shape of the connection portion 123 can be appropriately adjusted, and the present invention is not limited thereto. In one embodiment, the area of ​​the connection portion 123 is 1% or more and less than 100% of the area of ​​the second region Z2, but the present invention is not limited thereto. In another embodiment, the area of ​​the connection portion 123 is 5% or more and less than 50% of the area of ​​the second region Z2, but the present invention is not limited thereto.

[0033] In this embodiment, the second electrode portion 122 extends to the edge of the crystal chip 110. Specifically, the crystal chip 110 has a first side S1, a second side S2, a third side S3, and a fourth side S4. The first side S1 and the third side S3 extend along a first direction N1, and the second side S2 and the fourth side S4 extend along a second direction N2 perpendicular to the first direction N1. The second electrode portion 122 extends to the first side S1, the second side S2, the third side S3, and the fourth side S4.

[0034] In this embodiment, the opening 140 is disposed on the first surface 111 and is located in the third region Z3. That is, the second electrode portion 122 does not completely cover the third region Z3, and in fact, the opening 140 is further disposed in the third region Z3. In one embodiment, the area of ​​the second electrode portion 122 is 25% or more of the area of ​​the third region Z3, but the present invention is not limited thereto.

[0035] 5, in this embodiment, the depth H2 of the opening 140 is equal to the thickness W1 of each metal electrode 120, thereby exposing the first surface 111 of the crystal chip 110. In other words, the depth H2 of the opening 140 is equal to the depth H1 of the groove 130, and the opening 140 and the groove 130 can be considered to be hollow regions on the crystal chip 110, although the present invention is not limited thereto.

[0036] 3B, in this embodiment, the opening 140 extends to the first side S1 and the fourth side S4. For example, the crystal chip 110 has a plurality of corners R1, R2, R3, and R4, and the opening 140 corresponds to at least one of these corners, for example, the corner R1, but the present invention is not limited thereto.

[0037] In this embodiment, the conductive adhesive 150 includes a first adhesive 151 and a second adhesive 152 corresponding to the second surface 112 and the fourth side edge S4, and the first adhesive 151 corresponds to the opening 140, but the present invention is not limited thereto.

[0038] In this embodiment, the first region Z1 corresponds to the center position of the crystal chip 110. The first electrode portion 121 has a first side edge 1211 and a second side edge 1212 corresponding to the second side edge S2 and the fourth side edge S4, respectively, and a first distance X1 between the first side edge S1 and the first side edge 1211 is greater than a second distance X2 between the second side edge S2 and the second side edge 1212. In other words, the first electrode portion 121 is eccentrically disposed and slightly separated from the fourth side edge S4 on which the conductive adhesive 150 is provided, but the present invention is not limited thereto.

[0039] In the above-mentioned arrangement method, a metal layer structure is installed on the upper and lower surfaces of the crystal chip 110 along the edge of the crystal chip 110, surrounding the main vibration area, thereby increasing the heat conduction area, preventing thermal stress from concentrating in the surrounding area close to the conductive adhesive 150 of the crystal chip 110, and reducing the impact of thermal stress transmitted to the vibration area on the vibration characteristics of the crystal chip 100, thereby achieving the purpose of increasing thermal conductivity, optimizing uniformity, and adjusting the secondary frequency to realize a chip design with a wide temperature range.

[0040] The following description will be given with reference to other embodiments. It should be noted that the following embodiments continue to use the component numbers and some of the content of the above-described embodiments, and the same numbers are used to indicate the same or similar components, and the same technical content will not be described again. For the description of the omitted parts, please refer to the above-described embodiments, and therefore, the following embodiments will not be repeated.

[0041] 6A and 6B are schematic three-dimensional diagrams of multiple resonator devices according to another embodiment of the present invention. First, referring to Fig. 6A, in this embodiment, the resonator device 100B is slightly different from the resonator device 100 of Fig. 1, mainly in the arrangement of the metal electrodes 120B and the openings 140B.

[0042] In FIG. 1, opening 140 is rectangular, but the present invention is not limited thereto. In this embodiment, opening 140B is disposed on first surface 111 and includes first portion 141B and second portion 142B that are connected to each other. First portion 141B and second portion 142B form an angle facing fourth side S4 that is less than 180 degrees, forming a triangle, but the present invention is not limited thereto. In third region Z3 (FIG. 3A), the rest of the area other than opening 140B is covered with metal electrode 120B, but the present invention is not limited thereto.

[0043] Referring to FIG. 6B, in this embodiment, the resonator device 100C is slightly different from the resonator device 100B of FIG. 6A, the main difference being the placement of the metal electrode 120C and the opening 140C.

[0044] In this embodiment, the opening 140C is disposed on the first surface 111 and includes a first portion 141C, a second portion 142C, and a third portion 143C that are connected together. The first portion 141C and the third portion 143C are parallel to each other in the first direction N1, and the second portion 142C is parallel to each other in the second direction N2, thereby forming a C-shape, although the present invention is not limited thereto. In the third region Z3 (FIG. 3A), the portions other than the opening 140C are covered with the metal electrode 120C, although the present invention is not limited thereto.

[0045] Figure 7A is a three-dimensional schematic diagram of a resonator device according to one embodiment of the present invention. Figure 7B is a front schematic diagram of the resonator device of Figure 7A. Referring to Figures 7A and 7B, in this embodiment, the resonator device 100D is slightly different from the resonator device 100 of Figure 1, with the main difference being the arrangement of the metal electrode 120D and the opening 140D.

[0046] In this embodiment, the opening 140D includes a first portion 141D, a second portion 142D, and a third portion 143D, which are connected to each other and extend along the second side S2, the third side S3, and the fourth side S4, respectively. Here, the opening 140D and the groove 130 together form a hollow region for exposing the crystal chip 110.

[0047] In other words, the second electrode portion 122D of the metal electrode 120D extends to the first side S1, the second side S2, and the fourth side S4, but does not extend to the third side S3. That is, the second electrode portion 122D has a C-shape, but the present invention is not limited to this.

[0048] FIG. 8 is a three-dimensional schematic diagram of a resonator device according to one embodiment of the present invention. Referring to FIG. 8, in this embodiment, a metal electrode 120E includes a first electrode portion 121E, a second electrode portion 122E, and a connecting portion 123E. The connecting portion 123E corresponds to the second adhesive 152, and in the second region Z2 (FIG. 3A), the portion other than the connecting portion 123E is a groove portion 130E. The resonator device 100E does not include an opening, and the second electrode portion 122E is annular, but the present invention is not limited thereto.

[0049] As described above, in the resonator device of the present invention, metal electrodes are installed on the upper and lower surfaces of the crystal chip along the edges of the crystal chip, surrounding the main vibration region, thereby increasing the heat conduction area, preventing thermal stress from concentrating in the peripheral area close to the conductive adhesive of the crystal chip, and reducing the impact of thermal stress transmitted to the vibration region on the vibration characteristics of the crystal chip, thereby achieving the goals of increasing thermal conductivity, optimizing uniformity, and adjusting the secondary frequency to realize a chip design with a wide temperature range.

[0050] Although the present invention has been disclosed by the above embodiments, these are not intended to limit the present invention, and a person skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention, and therefore the protection scope of the present invention is defined by the appended claims. [Industrial Applicability]

[0051] The resonator device of the present invention can be applied to crystal devices. [Explanation of symbols]

[0052] 100, 100B, 100C, 100D, 100E resonator 110 Crystal Chip 111 1st surface 112 2nd surface 120, 120B, 120C, 120D, 120E metal electrode 121, 121E 1st electrode part 1211 1st side edge 1212 Second side 122, 122E, second electrode section 123, 123E Connecting Department 130, 130E Mitsubishi 131 Section 1 132 Section 2 133, Section 3 134, Section 4 140, 140B, 140C, 140D Openings Part 1 of 141B, 141C, and 141D Part 2 of 142B, 142C, and 142D Part 3 of 143C and 143D 150 conductive adhesive 151 Chapter 1 152 Chapter 2 AA, BB section line H1, H2 deep N1 Direction 1 N2, direction 2 Corners of R1, R2, R3, R4 S1 First side S2 Second side S3 Third side S4 Fourth side W1 thick X1 First distance X2 Second distance Z1 First Territory Z2 Second Territory Z3 Third Domain

Claims

1. A resonant device, comprising: a crystal chip having opposing first and second surfaces, the crystal chip including a first region, a second region, and a third region, the second region surrounding the first region, the third region surrounding the second region, and the second region being located between the first region and the third region; Two metal electrodes disposed on the first surface and the second surface, respectively, a first electrode portion disposed in the first region; a connection portion disposed in the second region; a second electrode portion disposed in the third region; two metal electrodes each including: the connecting portion connecting the first electrode portion and the second electrode portion, the second electrode portion extending to an edge of the crystal chip; two grooves provided on the first surface and the second surface, respectively, and disposed in the second region, each having a depth equal to the thickness of each of the metal electrodes; Including, each of the grooves includes a first section, a second section, a third section, and a fourth section connected in order, the first section and the third section extending along a first direction, the second section and the fourth section extending along a second direction perpendicular to the first direction, the first section, the second section, the third section, and the fourth section forming a plurality of folds, and the connecting section being located between the first section and the fourth section and separating the first section and the fourth section; the crystal chip has a first side edge, a second side edge, a third side edge, and a fourth side edge, the first side edge and the third side edge extend along the first direction, the second side edge and the fourth side edge extend along the second direction, the second electrode portion extends to the first side edge, the second side edge, the third side edge, and the fourth side edge, The resonator device further includes an opening disposed on the first surface and in the third region, the opening having a depth equal to a thickness of each of the metal electrodes, the opening extending to the first side edge and the fourth side edge.

2. 2. The resonator device of claim 1, wherein the second region is immediately adjacent to and completely surrounds the first region, the third region is immediately adjacent to and completely surrounds the second region, and the first region, the second region, and the third region do not overlap one another.

3. The resonator device according to claim 1 , wherein the first electrode portion completely covers the first region.

4. The resonator device according to claim 1 , wherein the first electrode portion is rectangular.

5. The resonator device according to claim 1 , wherein the first electrode portion has four corners, and the corners are right angles or rounded angles.

6. The resonator device according to claim 1 , wherein the area of ​​the connection portion is equal to or greater than 1% and less than 100% of the area of ​​the second region.

7. The resonator device according to claim 1 , wherein the area of ​​the connection portion is 5% to 50% of the area of ​​the second region.

8. The resonator device according to claim 1 , wherein the area of ​​the second electrode portion is 25% or more of the area of ​​the third region.

9. The resonator device of claim 1 , wherein edges of the third region are aligned with edges of the first surface and the second surface.

10. 2. The resonator device of claim 1, wherein the crystal chip has a plurality of corners, and the opening corresponds to at least one of the corners.

11. 11. The resonator device of claim 10, wherein the crystal chip has multiple sides, and the opening extends along at least one of the sides.

12. The resonator device according to claim 1 , wherein the crystal chip has a plurality of sides, and the second electrode portion extends to at least one of the sides.

13. The resonator device of claim 1 , further comprising at least one conductive adhesive corresponding to the second surface.

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