Substrate processing apparatus and substrate processing method

Abstract

A substrate processing apparatus according to one embodiment of the present disclosure comprises a substrate holding unit (31), an imaging device (60), and a control unit (18). The substrate holding unit (31) holds and rotates the substrate to be processed. The imaging device (60) images the substrate held by the substrate holding unit (31). The control unit (18) controls units. Additionally, the control unit (18) includes an execution unit (18a), an acquisition unit (18b), and a detection unit (18d). The execution unit (18a) executes a series of substrate processing operations on a substrate delivered from outside and held by the substrate holding unit (31). The acquisition unit (18b) acquires image data by imaging, using the imaging device (60), the substrate following substrate processing. On the basis of the acquired image data and stored reference data, the detection unit (18d) detects a positional deviation of the substrate in the rotation direction following substrate processing.

Description

[Technical Field]

[0001] The disclosed embodiments relate to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] BACKGROUND ART Conventionally, single-wafer processing, in which substrates such as semiconductor wafers (hereinafter also referred to as wafers) are processed one by one, is performed while the substrate is held and rotated in a substrate holder (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5847661 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique capable of detecting slippage in the rotational direction on a substrate. [Means for solving the problem]

[0005] A substrate processing apparatus according to one aspect of the present disclosure includes a substrate holding unit, an imaging device, and a control unit. The substrate holding unit holds and rotates a substrate to be processed. The imaging device images the substrate held by the substrate holding unit. The control unit controls each unit. The control unit also includes an execution unit, an acquisition unit, and a detection unit. The execution unit performs a series of substrate processing operations on the substrate that has been brought in from outside and held by the substrate holding unit. The acquisition unit images the substrate after substrate processing using the imaging device to acquire image data. The detection unit detects a positional deviation in the rotational direction of the substrate after substrate processing based on the acquired image data and stored reference data. [Effects of the Invention]

[0006] According to the present disclosure, slippage in the rotational direction of a substrate can be detected. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram showing a schematic configuration of a substrate processing system according to an embodiment. [Figure 2] FIG. 2 is a schematic diagram showing an example of a specific configuration of a processing unit according to the embodiment. [Figure 3] FIG. 3 is a block diagram illustrating an example of the configuration of the control device according to the embodiment. [Figure 4] FIG. 4 is a diagram illustrating an example of the acquisition process according to the embodiment. [Figure 5] FIG. 5 is a diagram illustrating an example of difference data according to the embodiment. [Figure 6] FIG. 6 is a diagram showing the correlation between the X coordinate of the peak caused by the notch and the position of the notch in the rotational direction. [Figure 7] FIG. 7 is a diagram illustrating the prediction process according to the embodiment. [Figure 8] FIG. 8 is a diagram for explaining another example of the control process according to the embodiment. [Figure 9] FIG. 9 is a diagram for explaining another example of the control process according to the embodiment. [Figure 10] FIG. 10 is a flowchart showing an example of a procedure of a control process executed by the substrate processing system according to the embodiment. [Figure 11] FIG. 11 is a flowchart showing an example of the procedure of the positional deviation detection process executed by the substrate processing system according to the embodiment. [Figure 12] FIG. 12 is a flowchart showing an example of the procedure of the time-dependent change detection process executed by the substrate processing system according to the embodiment. [Figure 13] FIG. 13 is a flowchart showing another example of the procedure of the control process executed by the substrate processing system according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of a substrate processing apparatus and a substrate processing method disclosed herein will be described in detail with reference to the accompanying drawings. Note that the present disclosure is not limited to the embodiments described below. It should be noted that the drawings are schematic, and the dimensional relationships and ratios of elements may differ from the actual situation. Furthermore, the dimensional relationships and ratios may differ between the drawings.

[0009] Conventionally, single-wafer processing, in which substrates such as semiconductor wafers (hereinafter also referred to as wafers) are processed one by one, is performed while the substrate is held and rotated in a substrate holder. Therefore, if the substrate is processed while not being held firmly, the substrate may slip along the direction of rotation, which may result in insufficient substrate processing or problems such as the processing liquid splashing onto the inner walls of the chamber.

[0010] On the other hand, while conventional technology can detect positional deviations of substrates placed on a substrate holder from a transport device, it cannot detect slippage in the rotational direction that may occur after single-substrate processing.

[0011] Therefore, there is a need to develop a technology that can overcome the above-mentioned problems and detect slippage in the rotational direction of a substrate.

[0012] <Outline of the substrate processing system> First, a schematic configuration of a substrate processing system 1 according to an embodiment will be described with reference to Fig. 1. Fig. 1 is a diagram showing a schematic configuration of the substrate processing system 1 according to an embodiment. The substrate processing system 1 is an example of a substrate processing apparatus. In the following, to clarify the positional relationship, mutually orthogonal X-axis, Y-axis, and Z-axis are defined, and the positive direction of the Z-axis is defined as the vertically upward direction.

[0013] 1, the substrate processing system 1 includes a loading / unloading station 2 and a processing station 3. The loading / unloading station 2 and the processing station 3 are provided adjacent to each other.

[0014] The carry-in / out station 2 includes a FOUP placement section 11 and a transport section 12. On the FOUP placement section 11, a plurality of FOUPs H are placed, each accommodating a plurality of substrates, in this embodiment, semiconductor wafers W (hereinafter referred to as wafers W), in a horizontal position.

[0015] The transfer section 12 is provided adjacent to the FOUP placement section 11 and includes a substrate transfer device 13 and a transfer section 14. The substrate transfer device 13 includes a wafer holding mechanism that holds the wafer W. The substrate transfer device 13 is capable of moving in the horizontal and vertical directions and rotating about a vertical axis, and transfers the wafer W between the FOUP H and the transfer section 14 using the wafer holding mechanism.

[0016] The processing station 3 is provided adjacent to the transport section 12. The processing station 3 includes a transport section 15 and a plurality of processing units 16. The plurality of processing units 16 are provided side by side on both sides of the transport section 15.

[0017] The transfer section 15 includes a substrate transfer device 17 therein. The substrate transfer device 17 includes a wafer holding mechanism that holds the wafer W. The substrate transfer device 17 is capable of moving in the horizontal and vertical directions and rotating about a vertical axis, and transfers the wafer W between the delivery section 14 and the processing unit 16 using the wafer holding mechanism.

[0018] The processing unit 16 performs predetermined substrate processing on the wafer W transferred by the substrate transfer device 17 .

[0019] The substrate processing system 1 also includes a control device 4. The control device 4 is, for example, a computer, and includes a control unit 18 and a storage unit 19. The storage unit 19 stores programs that control various processes executed in the substrate processing system 1. The control unit 18 controls the operation of the substrate processing system 1 by reading and executing the programs stored in the storage unit 19.

[0020] Such a program may be recorded on a computer-readable storage medium and installed from that storage medium into the storage unit 19 of the control device 4. Examples of computer-readable storage media include hard disks (HDs), flexible disks (FDs), compact disks (CDs), magnetic optical disks (MOs), and memory cards.

[0021] In the substrate processing system 1 configured as described above, first, the substrate transfer device 13 in the loading / unloading station 2 removes the wafer W from the FOUP H placed on the FOUP placement unit 11 and places the removed wafer W on the delivery unit 14. The wafer W placed on the delivery unit 14 is then removed from the delivery unit 14 by the substrate transfer device 17 in the processing station 3 and carried into the processing unit 16.

[0022] The wafer W carried into the processing unit 16 is processed by the processing unit 16, and then carried out of the processing unit 16 by the substrate transfer device 17 and placed on the delivery section 14. Then, the processed wafer W placed on the delivery section 14 is returned to the FOUP H of the FOUP placement section 11 by the substrate transfer device 13.

[0023] <Processing unit configuration> Next, the configuration of the processing unit 16 according to this embodiment will be described with reference to Fig. 2. Fig. 2 is a schematic diagram showing an example of a specific configuration of the processing unit 16. As shown in Fig. 2, the processing unit 16 includes a chamber 20, a substrate processing section 30, a liquid supply section 40, a collection cup 50, and an imaging device 60.

[0024] The chamber 20 accommodates a substrate processing unit 30, a liquid supply unit 40, a collection cup 50, and an imaging device 60. A fan filter unit (FFU) 21 is provided on the ceiling of the chamber 20. The FFU 21 forms a downflow within the chamber 20.

[0025] The substrate processing unit 30 includes a substrate holding unit 31, a support unit 32, and a drive unit 33, and performs a given substrate processing on a placed wafer W. The substrate holding unit 31 holds the wafer W horizontally. The support unit 32 is a member extending in the vertical direction, and its base end is rotatably supported by the drive unit 33, with its tip end supporting the substrate holding unit 31 horizontally. The drive unit 33 rotates the support unit 32 around a vertical axis.

[0026] The substrate processing unit 30 rotates the support column 32 using the drive unit 33, thereby rotating the substrate holding unit 31 supported by the support column 32, and thereby rotating the wafer W held by the substrate holding unit 31.

[0027] A holding member 31a for holding the wafer W from the side is provided on the upper surface of the substrate holding unit 31 included in the substrate processing unit 30. The wafer W is held horizontally by the holding member 31a while being slightly spaced apart from the upper surface of the substrate holding unit 31. The wafer W is held by the substrate holding unit 31 with the surface on which substrate processing is performed facing upward.

[0028] The substrate holder 31 is not limited to holding the substrate by the holding member 31a, and may hold the wafer W horizontally, for example, by adsorbing the lower surface of the wafer W. Furthermore, the substrate holder 31 may be an electrostatic chuck or the like.

[0029] The liquid supply unit 40 supplies a processing fluid to the wafer W. The liquid supply unit 40 includes nozzles 41a and 41b, an arm 42 that horizontally supports the nozzles 41a and 41b, and a pivoting and lifting mechanism 43 that pivots and raises and lowers the arm 42.

[0030] Nozzle 41a is connected to processing liquid supply source 46a via valve 44a and flow rate regulator 45a. Processing liquid supply source 46a is a tank that stores processing liquid. The processing liquid is used, for example, for liquid processing of wafer W (e.g., etching processing, cleaning processing, etc.).

[0031] The nozzle 41b is connected to a DIW supply source 46b via a valve 44b and a flow rate regulator 45b. The DIW supply source 46b is, for example, a tank that stores DIW (Deionized Water). The DIW is used, for example, for rinsing the wafer W.

[0032] In the example of Figure 2, an example is shown in which the liquid supply unit 40 supplies a processing liquid and a rinsing liquid (DIW) to the wafer W, but the present disclosure is not limited to such an example and may be configured to supply other chemical liquids to the wafer W.

[0033] Recovery cup 50 is disposed to surround substrate holding part 31, and collects the processing liquid scattered from wafer W due to the rotation of substrate holding part 31. A drainage port 51 is formed in the bottom of recovery cup 50, and the processing liquid collected by recovery cup 50 is discharged from drainage port 51 to the outside of processing unit 16. In addition, an exhaust port 52 is formed in the bottom of recovery cup 50, which discharges gas supplied from FFU 21 to the outside of processing unit 16.

[0034] The imaging device 60 is disposed, for example, near the peripheral edge of the wafer W and above the wafer W, and captures an image of the wafer W held by the substrate holder 31. The imaging device 60 is disposed, for example, at a position where it can capture an image of the contour Wa (see FIG. 4) of the outer peripheral edge of the wafer W.

[0035] <Detection process details> Next, details of the detection process according to the embodiment will be described with reference to Fig. 3 to Fig. 7. Fig. 3 is a block diagram showing an example of the configuration of the control device 4 according to the embodiment. As shown in Fig. 3, the control device 4 includes a control unit 18 and a storage unit 19.

[0036] The control device 4 is also connected to the above-described substrate processing unit 30, liquid supply unit 40, and imaging device 60. In addition to the functional units shown in Fig. 3, the control device 4 may also have various functional units that known computers have, such as various input devices and audio output devices.

[0037] The storage unit 19 is realized by, for example, a semiconductor memory element such as RAM or flash memory, or a storage device such as a hard disk or optical disk. The storage unit 19 has a reference data storage unit 19a, a captured image storage unit 19b, and a positional deviation angle storage unit 19c. Details of these storage units will be described later. The storage unit 19 also stores information used for various processes in the control unit 18.

[0038] The control unit 18 is realized by, for example, a CPU, a micro processing unit (MPU), a graphics processing unit (GPU), or the like executing a program stored in the storage unit 19 using the RAM as a working area.

[0039] Furthermore, the control unit 18 may be realized by an integrated circuit such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field Programmable Gate Array).

[0040] Control unit 18 has an execution unit 18a, an acquisition unit 18b, a creation unit 18c, a detection unit 18d, a notification unit 18e, and a prediction unit 18f, and realizes or executes the functions and actions of the control processing described below. Note that the internal configuration of control unit 18 is not limited to the configuration shown in Fig. 3, and may be any other configuration that performs the control processing described below.

[0041] Execution unit 18a performs a series of substrate processing on wafer W that has been brought in from outside processing unit 16 and held by substrate holder 31. Execution unit 18a controls substrate processing unit 30 and the like to rotate wafer W at a given rotation speed and controls liquid supply unit 40 and the like to supply a given amount of processing liquid onto wafer W, for example, in accordance with a recipe designated by an operator or the like.

[0042] The execution unit 18a also performs a rinse process using DIW on the wafer W after the liquid processing using the processing liquid has been completed. Furthermore, the execution unit 18a also performs a drying process such as spin drying on the wafer W after the rinse processing has been completed.

[0043] The acquiring unit 18b acquires image data by capturing an image of the wafer W after the substrate processing has been performed by the executing unit 18a using the imaging device 60. The acquiring unit 18b may also acquire other image data by capturing an image of the wafer W before the substrate processing has been performed by the executing unit 18a using the imaging device 60. Details of the acquisition process performed by the acquiring unit 18b will be described with reference to FIG.

[0044] 4A and 4B are diagrams for explaining an example of an acquisition process according to an embodiment. As shown in (a) of Fig. 4A, the acquisition unit 18b acquires an image of the wafer W held by the substrate holder 31 (see Fig. 2) by using the imaging device 60 (see Fig. 2) before the substrate is processed.

[0045] In this captured image before the substrate processing, for example, the outline Wa of the outer peripheral edge of the wafer W and the notch N formed in the outer peripheral edge of the wafer W are recorded. Note that this image data before the substrate processing is stored, for example, in the reference data storage unit 19a of the storage unit 19 as reference data.

[0046] 4(b), the acquiring unit 18b uses the imaging device 60 to capture an image of the wafer W held by the substrate holding unit 31 after the substrate processing, and acquires a captured image of the wafer W. The captured image after the substrate processing also records the contour Wa of the outer circumferential edge of the wafer W and the notch N formed at the outer circumferential edge of the wafer W.

[0047] Note that these captured images may be subjected to various types of image processing (for example, edge detection processing) in order to clarify the contour Wa and the notch N.

[0048] Returning to the explanation of Fig. 3, the creation unit 18c creates difference data of the contour Wa of the outer peripheral edge of the wafer W, using the image data of the wafer W after the substrate processing acquired by the acquisition unit 18b and the reference data stored in the reference data storage unit 19a.

[0049] The reference data used by the creating unit 18c during the creating process is, for example, image data of the wafer W before the substrate processing, acquired by the acquiring unit 18b. Details of this creating process will be described with reference to FIGS.

[0050] The creation unit 18c first identifies the X and Y coordinates of multiple points at which the contour Wa is located, which are stored in the reference data (for example, image data of the wafer W before the substrate processing). Similarly, the creation unit 18c also identifies the X and Y coordinates of multiple points at which the contour Wa is located, which are stored in the image data of the wafer W after the substrate processing.

[0051] Next, at the same X coordinate value, the creation unit 18c subtracts the Y coordinate value of the contour Wa in the image data of the wafer W after the substrate processing from the Y coordinate value of the contour Wa in the image data of the wafer W before the substrate processing. That is, at the same X coordinate value, the creation unit 18c calculates the difference between the Y coordinate value of the contour Wa before the substrate processing and the Y coordinate value of the contour Wa after the substrate processing.

[0052] If no slippage occurs in the rotational direction of the wafer W after the substrate processing, the contour Wa of the wafer W before the substrate processing and the contour Wa of the wafer W after the substrate processing will basically all coincide. Therefore, in this case, for the same X coordinate value, the Y coordinate value of the contour Wa of the wafer W before the substrate processing and the Y coordinate value of the contour Wa of the wafer W after the substrate processing will be approximately equal (i.e., the difference will be approximately zero).

[0053] On the other hand, as shown in Figure 4, if slippage occurs in the rotational direction of the wafer W after substrate processing, the contour Wa of the wafer W before substrate processing and the contour Wa of the wafer W after substrate processing will no longer match at the X coordinate where the notch N is located.

[0054] Fig. 5 is a diagram showing an example of difference data according to the embodiment, which is a diagram showing an example of difference data when two image data as shown in Fig. 4 are obtained before and after substrate processing. Note that Fig. 5 shows data in which the transition of the difference is smoothed by the moving average method.

[0055] As shown in Fig. 5, peak P1 located at X = X1 is a peak caused by notch N before substrate processing (see Fig. 4(a)). This is because, at X = X1, the value of Y is large before substrate processing because notch N is located, whereas after substrate processing, the value of Y is small because notch N is not located.

[0056] 5, the negative peak P2 located at X=X2 is a peak caused by the notch N after the substrate processing (see FIG. 4(b)). This is because, at X=X2, the notch N is not located before the substrate processing and the value of Y is small, whereas after the substrate processing, the notch N is located and the value of Y is large.

[0057] Returning to the description of Fig. 3, the detector 18d detects the positional deviation in the rotational direction of the wafer W after the substrate processing based on the image data acquired after the substrate processing and the reference data stored in the reference data storage unit 19a.

[0058] For example, as shown in FIG. 5, when a peak P1 equal to or greater than a given threshold value A and a peak P2 equal to or less than a given threshold value −A are detected in the differential data, the detection unit 18d can determine that a rotational positional deviation has occurred in the wafer W after substrate processing.

[0059] Furthermore, the detection unit 18d can estimate the amount of misalignment of the notch N after substrate processing, i.e., the amount of positional misalignment in the rotational direction, based on the difference between the X values ​​(here, X1 and X2) at the two peaks P1 and P2 detected in the differential data.

[0060] 6 is a diagram showing the correlation between the X coordinate of the peak caused by the notch N and the position in the rotation direction of the wafer W. In the data shown in FIG. 6, the position in the rotation direction of the wafer W when the notch N is located approximately in the center of the image data (for example, the case shown in FIG. 4(a)) is defined as 180 (deg).

[0061] As shown in FIG. 6, it can be seen that in the image data of the contour Wa, the value of X of the peak caused by the notch N and the position in the rotation direction of the wafer W have a very high correlation.

[0062] Therefore, the detection unit 18d calculates the position of the notch N before the substrate processing shown in Fig. 5 (i.e., the position in the rotation direction of the wafer W) based on the correlation shown in Fig. 6. Furthermore, the detection unit 18d calculates the position of the notch N after the substrate processing (i.e., the position in the rotation direction of the wafer W) based on the correlation shown in Fig. 6.

[0063] The detection unit 18d can then calculate the rotational position deviation angle of the wafer W after substrate processing by taking the difference between the calculated rotational position of the wafer W before substrate processing and the rotational position of the wafer W after substrate processing.

[0064] As described above, in the embodiment, slippage in the rotational direction of the wafer W can be detected by detecting the positional deviation of the wafer W in the rotational direction based on image data after substrate processing.

[0065] In the present disclosure, the correlation used to calculate the position in the rotational direction of the wafer W is not limited to the linear correlation shown in Fig. 6. For example, data storing the correlation between the position in the rotational direction of the wafer W and the peak X value may be prepared in advance as a table, and the table may be referenced when calculating the position in the rotational direction of the wafer W.

[0066] Returning to the explanation of Fig. 3, when the positional deviation angle of the wafer W calculated by the detection unit 18d is equal to or greater than a given threshold value, the notification unit 18e notifies the operator that a positional deviation has occurred in the wafer W. This allows the operator to recognize the abnormal state of the substrate holding unit 31.

[0067] Furthermore, when the positional deviation angle of the wafer W is equal to or greater than a given threshold value, the notification unit 18e may store a captured image of the wafer W during processing. The captured image is, for example, a video, and is stored in the captured image storage unit 19b of the storage unit 19.

[0068] Furthermore, the notification unit 18e may associate the captured image during substrate processing stored in the captured image storage unit 19b as described above with log information indicating that an abnormal state has been notified for the same wafer W.

[0069] In this way, for a wafer W for which slippage in the rotation direction has been detected, by storing the captured images during processing in the storage unit 19, the operator can later check the details of the defect again using the stored captured images. Also, by associating the captured images during substrate processing with log information indicating that an abnormal state has been notified, the operator can easily check the captured images at the time of the abnormality.

[0070] In addition to the above detection process, the detection unit 18d calculates the rotational misalignment angle for each of the multiple wafers W that are subsequently loaded into the processing unit 16, and stores the calculated misalignment angles in the misalignment angle memory unit 19c of the memory unit 19.

[0071] Then, the prediction unit 18f predicts the holding state of the substrate holding unit 31 based on the changes over time of the plurality of positional deviation angles stored in the positional deviation angle storage unit 19c. Fig. 7 is a diagram for explaining the prediction process according to the embodiment.

[0072] As shown in FIG. 7, in the positional deviation angle memory unit 19c according to the embodiment, data of multiple wafers W are plotted in an XY space in which the horizontal axis represents time (or the number of processed wafers W) and the vertical axis represents the positional deviation angle of the wafer W.

[0073] The prediction unit 18f predicts the holding state of the substrate holding unit 31 based on the change over time in the positional deviation angle as shown in Fig. 7. The prediction unit 18f predicts the holding state of the substrate holding unit 31 by, for example, linear regression analysis.

[0074] 7, for example, the time course of the misalignment angle regresses to a straight line with the misalignment angle = 0 until time T0. That is, in the example of FIG. 7, there is no noticeable change in the misalignment angle of the wafer W until time T0, and it is estimated that a good holding state is maintained.

[0075] On the other hand, after time T0, the change in the positional deviation angle over time regresses to a sloped straight line L. Therefore, the prediction unit 18f predicts at time T1 that the holding state will become abnormal at time T2, which is the point of intersection between the straight line L and the upper limit (or lower limit) of the positional deviation angle at which the holding state is considered to be maintained in a good state.

[0076] In this way, in the embodiment, it is possible to accurately predict the holding state of substrate holder 31 based on the change in the positional deviation angle over time. Therefore, according to the embodiment, based on the obtained prediction, an operator can prepare parts such as substrate holder 31 in advance and plan maintenance.

[0077] In the example of Figure 7, the prediction unit 18f predicts the holding state of the substrate holding unit 31 by linear regression analysis, but the present disclosure is not limited to such an example, and the holding state of the substrate holding unit 31 may be predicted using various analysis methods.

[0078] <Another example of control processing> Next, another example of the various processes in the control unit 18 will be described with reference to Figures 8 and 9. In the above embodiment, an example has been shown in which a positional deviation in the rotational direction is detected based on the position of the notch N (see Figure 4) shown in image data captured by the imaging device 60, but the present disclosure is not limited to such an example.

[0079] 8 is a diagram illustrating another example of the control process according to the embodiment. In the example of Fig. 8, slippage in the rotation direction of the wafer W is detected based on a line C of a pattern shape formed on the surface of the wafer W.

[0080] For example, the detection unit 18d (see Figure 3) calculates the rotational position of the wafer W before substrate processing based on the orientation of the line C of the pattern shape shown on the wafer W before substrate processing shown in (a) of Figure 8 (for example, the inclination angle of the line C).

[0081] Furthermore, the detection unit 18d calculates the position in the rotation direction of the wafer W before the substrate processing, based on the orientation of the line C (for example, the inclination angle of the line C) of the pattern shape shown on the wafer W after the substrate processing shown in (b) of Fig. 8. The line C of the pattern shape shown on the wafer W is detected by, for example, Hough transform processing.

[0082] In this case, the inclination angle of the line C does not necessarily coincide with the position in the rotation direction (rotation angle) of the wafer W. Therefore, it is advisable to prepare in advance a table containing data that stores the correlation between the inclination angle of the line C at a given location on the wafer W and the position in the rotation direction (rotation angle) of the wafer W, and to refer to this table when calculating the position in the rotation direction of the wafer W from the inclination angle of the line C.

[0083] The detection unit 18d can then calculate the rotational position deviation angle of the wafer W after substrate processing by taking the difference between the calculated rotational position of the wafer W before substrate processing and the rotational position of the wafer W after substrate processing.

[0084] In the present disclosure, the indicator for detecting the position of the wafer W in the rotational direction is not limited to the notch N or the patterned line C. For example, the position of the wafer W in the rotational direction may be detected based on the position of an inscription such as a lot number marked on the back surface of the wafer W. In this case, the imaging device 60 should be disposed so as to be able to capture an image of the back surface of the wafer W.

[0085] Furthermore, in the above embodiment, image data of the wafer W before substrate processing is used as reference data, but the present disclosure is not limited to such an example. Fig. 9 is a diagram for explaining another example of the detection process according to the embodiment. Note that in Fig. 9, the contour Wa of the outer peripheral edge of the wafer W and the notch N are indicated by dashed lines for ease of understanding.

[0086] 9, a given elliptical approximation curve O is used as reference data. In this example, the detection unit 18d calculates the absolute position of the notch N after the substrate processing (i.e., the absolute position in the rotational direction of the wafer W) based on a given correlation by calculating the difference between the elliptical approximation curve O and the contour Wa of the wafer W after the substrate processing. This also makes it possible to detect slippage in the rotational direction of the wafer W.

[0087] Furthermore, by using the process of detecting the absolute position of the notch N as described above, the processing unit 16 can perform alignment of the wafer W in the rotational direction (so-called alignment process).

[0088] Specifically, for example, the control unit 18 uses the imaging device 60 to capture an image of the wafer W that has been loaded and held by the substrate holding unit 31, and based on the captured image data of the wafer W, calculates the difference between the contour Wa of the wafer W in the captured image data and the elliptical approximation curve O. In this way, the control unit 18 determines the absolute position of the wafer W in the rotational direction.

[0089] Next, the control unit 18 determines whether or not the absolute position of the wafer W in the rotation direction is aligned with a given set position. If the absolute position of the wafer W in the rotation direction is aligned with the given set position, the control unit 18 determines that the alignment of the wafer W is aligned, and ends the series of alignment processes.

[0090] On the other hand, if the absolute position of the wafer W in the rotational direction is deviated from a given set position, the control unit 18 returns the wafer W to the substrate transfer device 17 and adjusts the position of the substrate holder 31 in the rotational direction.

[0091] At this time, the control unit 18 may adjust the rotational position of the substrate holding unit 31 based on the absolute rotational position of the wafer W detected above so that the absolute rotational position of the wafer W is within a given range.

[0092] Next, the control unit 18 uses the imaging device 60 to image the wafer W that has been loaded again and held by the substrate holding unit 31, and based on the obtained imaging data of the wafer W, calculates the difference between the contour Wa of the wafer W in the imaging data and the elliptical approximation curve O. As a result, the control unit 18 again determines the absolute position of the wafer W in the rotational direction.

[0093] Next, the control unit 18 again determines whether the absolute position of the wafer W in the rotation direction is aligned with the given set position, and then the control unit 18 repeats the above process until the absolute position of the wafer W in the rotation direction is aligned with the given set position.

[0094] As a result, in the embodiment, it is possible to perform alignment of the wafer W in the rotational direction in the processing unit 16. Therefore, according to the embodiment, it is possible to perform alignment of the wafer W in the rotational direction without using a dedicated alignment adjustment device, thereby reducing the cost of the substrate processing system 1.

[0095] The substrate processing apparatus (substrate processing system 1) according to the embodiment includes a substrate holding unit 31, an imaging device 60, and a control unit 18. The substrate holding unit 31 holds and rotates a substrate (wafer W) to be processed. The imaging device 60 captures an image of the substrate (wafer W) held by the substrate holding unit 31. The control unit 18 controls each unit. The control unit 18 also includes an execution unit 18a, an acquisition unit 18b, and a detection unit 18d. The execution unit 18a performs a series of substrate processing operations on a substrate (wafer W) that has been brought in from outside and held by the substrate holding unit 31. The acquisition unit 18b acquires image data by capturing an image of the substrate (wafer W) after the substrate processing using the imaging device 60. The detection unit 18d detects a positional deviation in the rotational direction of the substrate (wafer W) after the substrate processing based on the acquired image data and stored reference data. This makes it possible to detect slippage in the rotational direction of the wafer W.

[0096] Furthermore, in the substrate processing apparatus (substrate processing system 1) according to the embodiment, the detector 18d calculates the positional deviation angle of the substrate (wafer W) in the rotational direction after the substrate processing based on the image data and the reference data, thereby enabling slippage of the wafer W in the rotational direction to be detected with high accuracy.

[0097] Furthermore, in the substrate processing apparatus (substrate processing system 1) according to the embodiment, the acquisition unit 18b acquires separate image data by capturing an image of a substrate (wafer W) that has been carried in from outside and held by the substrate holder 31 before a series of substrate processing operations. The acquisition unit 18b also stores the acquired separate image data as reference data. This makes it possible to detect slippage of the wafer W in the rotational direction that occurs during substrate processing.

[0098] In the substrate processing apparatus (substrate processing system 1) according to the embodiment, the control unit 18 further includes a creation unit 18c that creates difference data of the contour Wa of the outer peripheral edge of the substrate (wafer W) using the image data and the reference data. The detection unit 18d detects the positional deviation of the substrate (wafer W) in the rotational direction after the substrate processing based on the difference data. This allows slippage of the wafer W in the rotational direction to be detected with high accuracy.

[0099] In the substrate processing apparatus (substrate processing system 1) according to the embodiment, the detection unit detects the positional deviation of the substrate in the rotational direction after the substrate processing based on the pattern shape of the substrate surface shown in the image data and the pattern shape of the substrate surface shown in the reference data. This makes it possible to detect slippage of the wafer W in the rotational direction.

[0100] Furthermore, in the substrate processing apparatus (substrate processing system 1) according to the embodiment, the control unit 18 further includes a notification unit 18e that notifies the operator that a positional deviation has occurred in the substrate (wafer W) when the calculated positional deviation angle is equal to or greater than a given threshold value. This allows the operator to recognize the abnormal state of the substrate holder 31.

[0101] Furthermore, in the substrate processing apparatus (substrate processing system 1) according to the embodiment, when the calculated positional deviation angle is less than a given threshold value, the detection unit 18d stores the positional deviation angle in the storage unit 19. This allows the storage unit 19 to store a change in the positional deviation angle over time.

[0102] Furthermore, in the substrate processing apparatus (substrate processing system 1) according to the embodiment, the control unit 18 further includes a prediction unit 18f that predicts the holding state of the substrate holding unit 31 based on changes over time in the stored plurality of positional deviation angles. This makes it possible to accurately predict the holding state of the substrate holding unit 31.

[0103] Furthermore, in the substrate processing apparatus (substrate processing system 1) according to the embodiment, the acquiring unit 18b acquires image data of the substrate (wafer W) held by the substrate holding unit 31 before or after substrate processing. The detecting unit 18d detects the position (absolute position) of the substrate (wafer W) in the rotational direction relative to the substrate holding unit 31 based on the acquired image data and the stored reference data. This allows the wafer W to be aligned in the rotational direction without using a dedicated alignment adjustment device, thereby reducing the cost of the substrate processing system 1.

[0104] <Control processing procedure> Next, the procedure of the control process according to the embodiment will be described with reference to Figures 10 to 13. Figure 10 is a flowchart showing an example of the procedure of the control process executed by the substrate processing system 1 according to the embodiment.

[0105] In the control process according to the embodiment, first, the control unit 18 causes the substrate holding part 31 to hold the wafer W that has been carried into the processing unit 16 (step S101).

[0106] Next, the control unit 18 stores the reference data (step S102). For example, the control unit 18 captures an image of the wafer W before the substrate processing using the imaging device 60, and stores the image data of the wafer W as reference data. The reference data is stored in the reference data storage unit 19a of the storage unit 19, for example.

[0107] Next, the control unit 18 supplies a processing liquid, a rinse liquid, and the like to the wafer W while rotating the wafer W held by the substrate holding unit 31, thereby performing a given process on the wafer W (step S103).

[0108] Next, the control unit 18 performs a positional deviation detection process to detect a positional deviation in the rotation direction of the wafer W held by the substrate holding unit 31 (step S104). The positional deviation detection process will be described in detail later.

[0109] Finally, the control unit 18 performs a time-dependent change detection process to detect a time-dependent change in the holding state of the wafer W held by the substrate holding unit 31 (step S105), and ends the series of control processes. The time-dependent change detection process will be described in detail later.

[0110] 11 is a flowchart showing an example of the procedure of the misalignment detection process executed by the substrate processing system 1 according to this embodiment. In this misalignment detection process, first, the control unit 18 acquires image data of the processed wafer W held by the substrate holder 31 using the imaging device 60 (step S201).

[0111] Next, the control unit 18 generates difference data of the contour Wa of the outer circumferential edge of the wafer W using the image data of the wafer W after the substrate processing and the reference data stored in the reference data storage unit 19a (step S202).

[0112] Next, the control unit 18 determines whether two peaks P1 and P2 are detected in the difference data of the created contour Wa (step S203). If two peaks P1 and P2 are not detected in the difference data (step S203, No), the control unit 18 determines that no slippage has occurred in the rotational direction of the wafer W (step S204), and ends the series of positional deviation detection processes.

[0113] On the other hand, if two peaks P1 and P2 are detected in the differential data (step S203, Yes), the control unit 18 calculates the positional deviation angle of the wafer W based on the detected two peaks P1 and P2 (step S205).Then, the control unit 18 determines whether the calculated positional deviation angle of the wafer W is within a given range (step S206).

[0114] If the positional deviation angle of the wafer W is within the given range (step S206, Yes), the series of positional deviation detection processes ends. On the other hand, if the positional deviation angle of the wafer W is not within the given range (step S206, No), the control unit 18 notifies the fact that a positional deviation has occurred in the wafer W held by the substrate holding unit 31 (step S207).

[0115] Then, the control unit 18 stores the image of the wafer W during the substrate processing, captured by the imaging device 60, in the captured image storage unit 19b of the storage unit 19 (step S208), and ends the series of positional deviation detection processes.

[0116] FIG. 12 is a flowchart showing an example of the procedure of the time-dependent change detection process executed by the substrate processing system 1 according to the embodiment.

[0117] In this time-dependent change detection process, first, the control unit 18 stores the positional deviation angle of the wafer W detected in the process of step S205 in the positional deviation angle storage unit 19c of the storage unit 19 (step S301).

[0118] In the process of step S203 described above, if it is determined that no slippage occurs in the rotation direction of the wafer W, the positional deviation angle of the wafer W is stored as zero in the positional deviation angle storage unit 19c of the storage unit 19.

[0119] Next, the control unit 18 performs linear regression analysis of the change in the positional deviation angle over time in the XY space in which the change in the positional deviation angle over time for the plurality of wafers W is plotted (step S302).

[0120] Next, the control unit 18 determines whether there is a significant difference in the slope of the line created by the linear regression analysis (step S303). If it is determined that there is a significant difference in the slope of the line created by the linear regression analysis (step S303, Yes), the control unit 18 predicts the timing when the positional deviation angle of the wafer W will deviate from the allowable range (step S304).

[0121] Furthermore, the control unit 18 notifies the operator of the predicted deviation timing (step S305) and ends the series of time-dependent change detection processes. On the other hand, if it is determined that there is no significant difference in the slope of the line created by the linear regression analysis (step S303, No), the series of time-dependent change detection processes ends.

[0122] 13 is a flowchart showing another example of the procedure of the control process executed by the substrate processing system 1 according to this embodiment. In this control process, the processing unit 16 performs an alignment process on the wafer W.

[0123] In another example of the control process, first, the control unit 18 causes the substrate holding unit 31 to hold the wafer W that has been carried into the processing unit 16 (step S401). Then, the control unit 18 causes the imaging device 60 to acquire image data of the wafer W held by the substrate holding unit 31 (step S402).

[0124] Next, the control unit 18 uses the image data of the wafer W after the substrate processing and the reference data stored in the reference data storage unit 19a to create difference data of the contour Wa of the outer peripheral edge of the wafer W (step S403). In this case, for example, an elliptical approximation curve O is used as the reference data.

[0125] Next, the control unit 18 detects the absolute position in the rotation direction of the wafer W held by the substrate holding unit 31 based on the created difference data (step S404). Then, the control unit 18 determines whether the absolute position in the rotation direction of the wafer W is within a given range (step S405).

[0126] If the absolute position of the wafer W in the rotational direction is within the given range (step S405, Yes), the control process ends. On the other hand, if the absolute position of the wafer W in the rotational direction is not within the given range (step S405, No), the control unit 18 returns the wafer W from the substrate holder 31 to the substrate transfer device 17 (step S406).

[0127] Furthermore, the control unit 18 adjusts the position of the substrate holding unit 31 in the rotational direction based on the absolute position of the wafer W in the rotational direction detected in the process of step S404 so that the absolute position of the wafer W in the rotational direction falls within a given range (step S407). Then, the process returns to step S401.

[0128] The substrate processing method according to the embodiment includes a holding step (step S101), an executing step (step S103), an acquiring step (step S201), and a detecting step (steps S203 to S205). In the holding step (step S101), a substrate (wafer W) carried in from outside is held by the substrate holder 31. In the executing step (step S103), a series of substrate processes are performed on the substrate (wafer W). In the acquiring step (step S201), the substrate (wafer W) after the substrate processing is imaged by the imaging device 60 to acquire image data. In the detecting step (steps S203 to S205), a positional deviation in the rotational direction of the substrate (wafer W) after the substrate processing is detected based on the acquired image data and stored reference data. This makes it possible to detect slippage in the rotational direction of the wafer W.

[0129] In the substrate processing method according to the embodiment, the detecting step (steps S203 to S205) calculates the positional deviation angle of the substrate (wafer W) in the rotational direction after the substrate processing based on the image data and the reference data. This makes it possible to accurately detect slippage of the wafer W in the rotational direction.

[0130] The substrate processing method according to the embodiment further includes a storing step (step S102). In the storing step (step S102), the substrate (wafer W) that has been brought in from outside and held by the substrate holder 31 is imaged by the imaging device 60 before a series of substrate processing steps to acquire separate image data, and the acquired separate image data is stored as reference data. This makes it possible to detect slippage in the wafer W in the rotational direction that occurs during substrate processing.

[0131] The substrate processing method according to the embodiment further includes a notification step (step S207). The notification step (step S207) notifies the operator that a positional deviation has occurred in the substrate (wafer W) when the calculated positional deviation angle is equal to or greater than a given threshold value. This allows the operator to recognize the abnormal state of the substrate holder 31.

[0132] Furthermore, in the substrate processing method according to the embodiment, in the detecting step (steps S203 to S205), if the calculated positional deviation angle is less than a given threshold value, the positional deviation angle is stored in the storage unit 19. This allows the storage unit 19 to store a change in the positional deviation angle over time.

[0133] The substrate processing method according to the embodiment further includes a prediction step (step S304). The prediction step (step S304) predicts the holding state of the substrate holding part 31 based on changes over time in the stored plurality of positional deviation angles. This allows the holding state of the substrate holding part 31 to be predicted with high accuracy.

[0134] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above embodiments, and various modifications are possible without departing from the spirit thereof. For example, in the above embodiments, an example is shown in which reference data, captured images, changes in positional deviation angle over time, etc. are stored in the memory unit 19 provided in the control device 4 of the substrate processing system 1, but the present disclosure is not limited to such an example. For example, in the present disclosure, the reference data, captured images, changes in positional deviation angle over time, etc. may be stored in a separate storage device connected to the control device 4 via a network.

[0135] The disclosed embodiments should be considered in all respects as illustrative and not restrictive. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0136] W wafer (an example of a substrate) Wa Contour 1. Substrate processing system (an example of a substrate processing device) 4. Control device 16 Processing Unit 18 Control Unit 18a Executive Department 18b Acquisition Department 18c Creation Department 18d Detector 18e Notification Department 18f Prediction Department 19 Memory section 19a Reference data storage section 19b Captured image storage unit 19c Position deviation angle memory section 31 Board holding part 60 Imaging device

Claims

1. a substrate holder that holds and rotates a substrate to be processed; an imaging device that images the substrate held by the substrate holding unit; a control unit that controls each unit; Equipped with The control unit an execution unit that executes a series of substrate processing operations on the substrate that is carried in from outside and held by the substrate holder; an acquisition unit that acquires image data by capturing an image of the substrate after the substrate processing using the imaging device; a detection unit that detects a positional deviation in a rotational direction of the substrate after the substrate processing based on the acquired image data and stored reference data; A substrate processing apparatus having:

2. The detection unit calculates a positional deviation angle in a rotational direction of the substrate after the substrate processing based on the image data and the reference data. The substrate processing apparatus according to claim 1 .

3. The acquisition unit acquires another image data by capturing an image of the substrate carried in from outside and held by a substrate holding unit before a series of substrate processing operations, and stores the acquired another image data as the reference data. The substrate processing apparatus according to claim 1 .

4. The control unit a creating unit that creates difference data of the contour of the outer peripheral edge of the substrate using the image data and the reference data, The detection unit detects a positional deviation in a rotational direction of the substrate after the substrate processing based on the difference data. The substrate processing apparatus according to any one of claims 1 to 3.

5. The detection unit detects a positional deviation in a rotational direction of the substrate after substrate processing based on a pattern shape of the surface of the substrate indicated in the image data and a pattern shape of the surface of the substrate indicated in the reference data. The substrate processing apparatus according to any one of claims 1 to 3.

6. The control unit and a notification unit that notifies the occurrence of a positional deviation in the substrate when the calculated positional deviation angle is equal to or greater than a given threshold value. The substrate processing apparatus according to claim 2 .

7. When the calculated positional deviation angle is less than a given threshold value, the detection unit stores the positional deviation angle in a storage unit. The substrate processing apparatus according to claim 2 or 6.

8. The control unit a prediction unit that predicts the holding state of the substrate holder based on the time-dependent changes in the stored plurality of positional deviation angles. The substrate processing apparatus according to claim 7 .

9. the acquisition unit acquires image data of the substrate held by the substrate holder before or after substrate processing; The detection unit detects the position of the substrate in a rotational direction relative to the substrate holder based on the acquired image data and the stored reference data. The substrate processing apparatus according to claim 1 .

10. a step of holding a substrate carried in from outside by a substrate holding unit; performing a series of substrate processes on the substrate; a step of capturing an image of the substrate after the substrate processing using an imaging device to acquire image data; detecting a positional deviation in a rotational direction of the substrate after substrate processing based on the acquired image data and stored reference data; A substrate processing method comprising:

11. The detecting step calculates a positional deviation angle of the substrate in a rotational direction after the substrate processing based on the image data and the reference data. The substrate processing method according to claim 10.

12. The method further includes a step of capturing an image of the substrate carried in from outside and held in a substrate holding unit by the imaging device before a series of substrate processing steps to acquire different image data, and storing the acquired different image data as the reference data. The substrate processing method according to claim 10.

13. and when the calculated positional deviation angle is equal to or greater than a given threshold value, notifying that a positional deviation has occurred in the substrate. The substrate processing method according to claim 11 .

14. The detecting step stores the calculated positional deviation angle in a storage unit when the calculated positional deviation angle is less than a given threshold value. The substrate processing method according to claim 11 or 13.

15. and predicting the holding state of the substrate holder based on the stored changes over time of the plurality of positional deviation angles. The substrate processing method according to claim 14.

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