Microfluidic chip

Abstract

To provide a microchannel chip having increased bonding strength between one substrate and the other substrate.SOLUTION: A microchannel chip comprises: first substrate having a channel on a front side; a sheet member that has a sheet body joined to the front side of the first substrate and an electrode provided on the sheet body; and a second substrate joined to a front side of the sheet member. The first substrate and the second substrate are thicker than the sheet body, respectively.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a microchannel chip. [Background technology]

[0002] BACKGROUND ART In the fields of biotechnology and biochemistry, for example, microchannel chips are known as devices for examining cells that constitute organs of the human body (see, for example, Patent Document 1).

[0003] The method for manufacturing a microchannel chip described in Patent Document 1 includes the steps of: patterning hot melt on one substrate by screen printing to form channels in areas where there is no hot melt; forming electrodes corresponding to the channels on the other substrate by ion plating; aligning and stacking the one substrate and the other substrate so that the channels and electrodes face each other; and bonding the two substrates by thermocompression bonding to weld the hot melt. Thus, in Patent Document 1, the one substrate and the other substrate are joined by welding the hot melt. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-249346 Summary of the Invention [Problem to be solved by the invention]

[0005] When an electrode structure is formed on at least one surface of a microchannel, the electrodes protrude from the surface, which usually results in gaps between the rigid bonding surfaces, making it difficult to obtain sufficient bonding strength. To achieve sufficient bonding strength, it is necessary to devise a way to accommodate the thickness of the electrodes and prevent gaps from occurring.

[0006] As in Patent Document 1, a method using hot melt is known as a method for absorbing the thickness of the electrodes. However, hot melt has the property of being easily liquefied by heat. If the substrates are pressed together strongly to increase the bonding strength after the hot melt has liquefied, the hot melt may flow into the flow path. On the other hand, if the substrates are not pressed together sufficiently, the bonding strength between one substrate and the other may decrease.

[0007] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a micro-channel chip in which one substrate and the other substrate are bonded to each other with higher bonding strength. [Means for solving the problem]

[0008] One embodiment of the microchannel chip comprises a sheet member having a first substrate on the front side of which a channel is provided, a sheet body joined to the front side of the first substrate, and an electrode provided on the sheet body, and a second substrate joined to the front side of the sheet member, wherein the thickness of the first substrate and the thickness of the second substrate are each greater than the thickness of the sheet body.

[0009] As such, the sheet member has electrodes and is different from the hot melt adhesive of Patent Document 1, which welds and bonds the two substrates. In other words, even when the sheet member is interposed between the first and second substrates and heated and compressed, the sheet member is less likely to liquefy, resulting in a stronger bond between the first and second substrates than the hot melt adhesive of Patent Document 1. Furthermore, the thicknesses of the first and second substrates are each greater than the thickness of the sheet itself. Therefore, when the sheet member including the sheet itself and electrodes is sandwiched between the first and second substrates, the sheet member conforms to the surfaces of the first and second substrates, resulting in a stronger bond between the first and second substrates via the sheet member.

[0010] In a preferred embodiment, a plurality of the electrodes are provided along the flow path. Therefore, the resistance, impedance, or capacitance (electrostatic capacity) between any two of the plurality of electrodes can be measured. Here, when a fluid containing particles flows through the flow path, the resistance, impedance, or capacitance (electrostatic capacity) differs between when a particle is located between any two electrodes and when it is not. Therefore, if a change occurs in the measured resistance, impedance, or measured capacitance (electrostatic capacity), it is determined that a particle has been located between the two electrodes. Therefore, for example, when a fluid containing particles flows through the flow path and the tip of an injection member is pierced into the particle to inject another fluid (e.g., a gene modification reagent) in the injection member, the position of the particle can be accurately detected.

[0011] In a preferred embodiment, the electrode includes a first electrode provided on the back side of the sheet body and exposed to the flow path of the first substrate. Therefore, since the first electrode can contact the fluid flowing through the flow path, it is possible to measure the resistance or impedance between any two of the multiple first electrodes. Therefore, for example, when applying an embodiment in which the tip of an injection member is pierced into a particle flowing through the flow path to inject another fluid (e.g., a gene modification reagent) in the injection member, it is possible to accurately detect the position of the particle by detecting changes in the measured resistance or impedance.

[0012] In a preferred embodiment, the electrode includes a second electrode provided on the front side of the sheet body. Therefore, the capacitance (electrostatic capacity) between any two of the multiple second electrodes can be measured. Therefore, for example, when applying an embodiment in which the tip of an injection member is pierced into particles flowing through a flow channel to inject another fluid (e.g., a gene modification reagent) from the injection member, the position of the particles can be accurately detected by detecting changes in the measured capacitance (electrostatic capacity).

[0013] In a preferred embodiment, the electrodes include a first electrode provided on the back side of the sheet body and exposed to the flow path of the first substrate, and a second electrode provided on the front side of the sheet body, and the first electrode and the second electrode do not overlap when viewed in a plane.

[0014] A first electrode is provided on the back side of the sheet member, and a second electrode is provided on the front side. Therefore, for example, when a fluid containing particles flows through a flow path, the first electrode can detect changes in resistance or impedance, and the second electrode can detect changes in capacitance (electrostatic capacity). Furthermore, because the first electrode and the second electrode do not overlap in a planar view, changes in resistance, impedance, and capacitance (electrostatic capacity) can be detected more accurately than when the first electrode and the second electrode overlap in a planar view.

[0015] In a preferred embodiment, the electrodes intersect the flow path of the first substrate in a plan view, which makes it easier to detect the presence of a particle between two electrodes when measuring the resistance, impedance, or capacitance between any two of the electrodes arranged along the flow path.

[0016] In a preferred embodiment, the first substrate or the second substrate and the sheet body are bonded by direct bonding, and the direct bonding includes bonding using a silane coupling agent, bonding using plasma activation, and bonding using an excimer lamp or a low-pressure mercury lamp.

[0017] According to this, when the first substrate and the sheet main body are directly bonded, the flow path can be firmly sealed by the sheet main body with a simple structure. Furthermore, when the second substrate and the sheet main body are bonded with an adhesive, the flow of the adhesive into the flow path can be prevented. The first or second substrate can be bonded to the sheet main body by thermocompression bonding or plasma activation bonding, but direct bonding is also possible, in which the contact surface of the sheet main body and the contact surface of the first or second substrate are directly molecularly bonded at the interface after surface modification using a silane coupling agent, or activation using an excimer lamp or low-pressure mercury lamp.

[0018] In a preferred embodiment, the thickness of the sheet body is 5 micrometers or less, thereby increasing the flexibility of the sheet body. Therefore, when a sheet member including the sheet body and the first electrode is sandwiched between a first substrate and a second substrate, the sheet member conforms to the surfaces of the first substrate and the second substrate, and the first substrate and the second substrate are more firmly bonded via the sheet member. Thus, even if the sheet body has electrodes, the flexibility of the sheet body reduces the step caused by the thickness of the electrodes, so that even when the first substrate or the second substrate is directly bonded to the sheet body, a decrease in bonding strength can be suppressed.

[0019] In a preferred embodiment, wiring is bonded to the electrodes, and at least one of the first substrate and the second substrate is provided with a through-hole through which the wiring can be inserted. This allows the wiring to be drawn out from the back side of the first substrate. This allows for a smaller installation space on the sides of the micro-channel chip than when the wiring is drawn out from the side of the first substrate.

[0020] In a preferred embodiment, wiring is bonded to the electrodes, and a notch through which the wiring can be inserted is provided on a side surface of at least one of the first substrate and the second substrate. Therefore, the wiring bonded to the first substrate or the second substrate can be drawn out to the side of the micro-channel chip, which is advantageous in terms of space when arranging other components on the back side of the micro-channel chip, for example. [Effects of the Invention]

[0021] According to the present invention, it is possible to provide a micro-channel chip in which the bonding strength between one substrate and the other substrate is higher. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 1 is a schematic perspective view showing a micro-channel chip according to the first embodiment. [Figure 2] FIG. 2 is an exploded perspective view of FIG. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is an exploded view of FIG. [Figure 5] FIG. 5 is a schematic diagram of the micro-channel chip according to the first embodiment, viewed from above. [Figure 6] FIG. 6 is a schematic diagram showing particles flowing through the channels in the microchannel chip of FIG. [Figure 7] FIG. 7 is a flowchart showing the manufacturing procedure of the micro-channel chip according to the first embodiment. [Figure 8] FIG. 8 is a schematic diagram of the micro-channel chip according to the first modified example, viewed from above. [Figure 9] FIG. 9 is a schematic perspective view showing the micro-channel chip according to the second embodiment. [Figure 10] FIG. 10 is an exploded perspective view of FIG. [Figure 11] FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. [Figure 12] FIG. 12 is an exploded view of FIG. [Figure 13] FIG. 13 is a schematic diagram of the micro-channel chip according to the second embodiment, viewed from above. [Figure 14] FIG. 14 is a diagram showing particles flowing through the channels in the microchannel chip of FIG. [Figure 15]FIG. 15 is a schematic cross-sectional view showing the micro-channel chip according to the third embodiment. [Figure 16] FIG. 16 is an exploded view of FIG. [Figure 17] FIG. 17 is a schematic diagram of the micro-channel chip according to the third embodiment, viewed from above. [Figure 18] FIG. 18 is a schematic perspective view showing the micro-channel chip according to the fourth embodiment. [Figure 19] FIG. 19 is a cross-sectional view taken along line XIX-XIX in FIG. [Figure 20] FIG. 20 is an exploded view of FIG. [Figure 21] FIG. 21 is a schematic diagram of the vicinity of the notch in the seat body as viewed from below. [Figure 22] FIG. 22 is a schematic diagram of the vicinity of the notch in the sheet member as viewed from below. [Figure 23] FIG. 23 is a schematic diagram showing the side of the micro-channel chip according to the second modified example, viewed from below. DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that identical or corresponding parts in each drawing are designated by the same reference numerals, and their description will be omitted where appropriate. Furthermore, the components in the following embodiments or examples include those that are easily replaceable by those skilled in the art, or those that are substantially identical. Furthermore, the components described below can be combined as appropriate, and if there are multiple embodiments or examples, they can also be combined. Note that an XYZ Cartesian coordinate system is used in the following description. The X axis is perpendicular to the Y axis. The Z axis is perpendicular to both the X axis and the Y axis. The direction parallel to the X axis is referred to as the X direction, the direction parallel to the Y axis is referred to as the Y direction, and the direction parallel to the Z axis is referred to as the Z direction. One of the X directions is referred to as the +X direction, and the other is referred to as the -X direction. One of the Y directions is referred to as the +Y direction, and the other is referred to as the -Y direction. One of the Z directions is referred to as the +Z direction, and the other is referred to as the -Z direction. Furthermore, in this specification, the side on which the front surface of the first substrate, second substrate, and sheet member is located is referred to as the front side, and the side on which the back surface is located is referred to as the back side.

[0024] [First embodiment] First, a micro-channel chip 100 according to the first embodiment will be described. FIG. 1 is a schematic perspective view showing the micro-channel chip according to the first embodiment. FIG. 2 is an exploded perspective view of FIG. 1. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 1. FIG. 4 is an exploded view of FIG. 3. FIG. 5 is a schematic view of the micro-channel chip according to the first embodiment as seen from above. FIG. 6 is a schematic view showing particles flowing through channels in the micro-channel chip of FIG. 5.

[0025] The microchannel chips shown in the following embodiments and modified examples are not particularly limited in their applications, and by analyzing substances in the channels, they can be used in a variety of fields, such as DNA testing, biological material analysis, drug discovery and development, organic synthesis, water quality analysis, as well as measuring the quantity of capsules and resin microparticles used in industrial products.

[0026] 1 to 4, micro-channel chip 100 includes a first substrate 1, a second substrate 2, and a sheet member 3. Micro-channel chip 100 is a plate-like member having a rectangular shape in a plan view. First substrate 1 and second substrate 2 are made of, for example, a rectangular thermoplastic resin, and can be produced by various methods such as injection molding.

[0027] The first substrate 1 includes a substrate body 11, an inlet pipe 12, and an outlet pipe 13. The first substrate 1 can be manufactured by, for example, injection molding. A flow path 14 is provided on a surface 111 of the substrate body 11. In other words, the flow path 14 is provided on the front side of the substrate body 11. The flow path 14 extends along the Y direction. As shown in FIGS. 3 and 4, the cross-sectional shape of the flow path 14 is rectangular. The width of the flow path 14 in the X direction is L1, and the height of the flow path 14 in the Z direction is L2. The width L1 is preferably, for example, 5 micrometers or more and 1 mm or less. The height L2 is preferably, for example, 5 micrometers or more and 1 mm or less. A fluid containing particles 200 (see FIG. 6) flows through the flow path 14. The particles 200 are, for example, cells, and the fluid containing the particles 200 can be, for example, a cell culture medium. Although not shown, an injection member is provided midway along the flow path 14. The tip of the injection member has a sharp shape. The injection member can be moved in a direction intersecting the flow channel 14, and the tip of the injection member can be pierced into the particles 200 flowing in the flow channel 14 to inject another fluid (for example, a gene modification reagent) in the injection member.

[0028] An inlet pipe 12 and an outlet pipe 13 are fixed to the back surface 112 of the substrate body 11. In other words, the inlet pipe 12 and the outlet pipe 13 are provided on the back side of the substrate body 11. A through-hole 121 penetrates the inlet pipe 12 in the vertical direction. A through-hole 131 penetrates the outlet pipe 13 in the vertical direction. The through-hole 121, the flow path 14, and the through-hole 131 are connected to each other. That is, as shown by the arrows in FIG. 1 , a fluid containing particles 200 (see FIG. 6 ) enters the flow path 14 from the through-hole 121 of the inlet pipe 12, flows through the flow path 14 from the Y1 side to the Y2 side, and after another fluid is injected into the particles 200 from the tip of the injection member midway through the flow path 14 as described above, the fluid passes through the flow path 14 and is discharged from the outlet pipe 13.

[0029] Through holes 15 are provided in the substrate body 11. The through holes 15 are through holes that penetrate the substrate body 11 in the Z direction. As shown in FIG. 1, wiring 210 is inserted into the through holes 15. As shown in FIG. 4, the first substrate 1 has a thickness T1. It is desirable that the thickness T1 be, for example, not less than 500 micrometers and not more than 2 mm.

[0030] The second substrate 2 is disposed on the Z1 side of the micro-channel chip 100. The second substrate 2 can be manufactured by, for example, injection molding. The front surface 22 and the back surface 21 of the second substrate 2 are flat. As shown in FIG. 4, the thickness of the second substrate 2 is thickness T2. The second substrate 2 is bonded to the front side of the sheet member 3. The thickness T2 is preferably, for example, not less than 500 micrometers and not more than 2 mm.

[0031] The sheet member 3 is disposed between the first substrate 1 and the second substrate 2. The sheet member 3 includes a sheet body 31 and a first electrode 4 (electrode). As shown in FIGS. 5 and 6 described below, a plurality of first electrodes 4 (electrodes) are provided along the Y direction, which is the longitudinal direction of the channel 14, but for simplicity, only one electrode 4 is shown in FIGS. 1 to 4. The electrode can extract an electrical signal to the outside of the micro-channel chip 100, and is not particularly limited. For example, as described below, the passage speed and physical properties of particles 200 passing through the micro-channel chip 100 can be measured from the resistance, impedance, capacitance, and reactance.

[0032] The front surface 312 and the back surface 311 of the sheet body 31 are flat. The first electrode 4 (electrode) is bonded to the back surface 311 of the sheet body 31. In other words, the first electrode 4 (electrode) is provided on the back side of the sheet body 31. The sheet body 31 can be made of, for example, a cycloolefin polymer resin (COP resin), which is a high-performance thermoplastic transparent resin. Because the cycloolefin polymer resin (COP resin) is flexible, when it is disposed between the first substrate 1 and the second substrate 2, it suppresses an increase in the overall thickness of the micro-channel chip 100 due to the thickness of the first electrode 4 (electrode). Furthermore, by modifying the front and back surfaces of the cycloolefin polymer resin (COP resin) with a silane coupling agent, the sheet body 31 can be directly bonded to the first substrate 1, and also to the second substrate 2. The sheet body 31 and the second substrate 2 can be bonded to each other using a UV (Ultra Violet) adhesive or the like. The material of the sheet body 31 is not limited to cycloolefin polymer resin (COP resin), but may be cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), dimethylpolysiloxane (PDMS), or the like.

[0033] The first electrode 4 (electrode) includes an electrode portion 401 and a conductive pad 402. The first electrode 4 (electrode) extends in the X direction. That is, the first electrode 4 (electrode) intersects with the flow channel 14. As shown in FIGS. 1 and 2, the electrode portion 401 extends in the X direction from the pad 402. The electrode portion 401 is exposed to the flow channel 14. Therefore, the fluid flowing through the flow channel 14 can come into contact with the electrode portion 401. The through-hole 15 is provided at a position corresponding to the pad 402. A wiring 210 is joined to the pad 402. That is, as shown in FIG. 1, the tip of the wiring 210 is joined to the pad 402, and the wiring 210 extends toward the outside (X2 side) of the micro-channel chip 100 through the through-hole 15. As shown in FIG. 4, the thickness of the sheet body 31 is T3. The thickness of the first electrode 4 (electrode) is T4. The thickness T3 is preferably, for example, 5 micrometers or less, and the thickness T4 is preferably, for example, 0.1 micrometers or more and 10 micrometers or less.

[0034] Here, the thickness T1 of the first substrate 1 and the thickness T2 of the second substrate 2 are each greater than the thickness T3 of the sheet main body 31. The thickness T1 of the first substrate 1, the thickness T2 of the second substrate 2, and the thickness T3 of the sheet main body 31 are each greater than the thickness T4 of the first electrode 4 (electrode).

[0035] As shown in FIG. 5, a plurality of first electrodes 4 (electrodes) are provided along the Y direction (i.e., along the longitudinal direction of the flow channel 14). Specifically, on the X1 side (left side in FIG. 5) of the flow channel 14, first electrodes 41 and 42 are arranged along the Y direction. The number of first electrodes 41 and 42 is not particularly limited and may be three or more. Also, on the X2 side (right side in FIG. 5) of the flow channel 14, first electrodes 43 and 44 are arranged along the Y direction. The number of first electrodes 43 and 44 is not particularly limited and may be three or more. The first electrodes 4 (electrodes) extend perpendicular to (intersect with) the flow channel 14.

[0036] As described above, a fluid containing particles 200 flows from the Y1 side (upstream side) to the Y2 side (downstream side) in the flow path 14 shown in Fig. 6 as indicated by the arrow. Specifically, particles 200 indicated by the two-dot chain line are positioned at a first position P1, and then move in the direction of the arrow (from the Y1 side to the Y2 side) to a second position P2 indicated by the solid line.

[0037] Here, for example, the resistance and impedance between the first electrode 41 and the first electrode 43 differ when the particle 200 is located at the first position P1 and when it is located at the second position P2. That is, the resistance and impedance between the first electrode 41 and the first electrode 43 when the particle 200 is located between the first electrode 41 and the first electrode 43 changes compared to the resistance and impedance when the particle 200 is not located between the first electrode 41 and the first electrode 43. This is because the particle 200 acts as a resistor when a current flows between the first electrode 41 and the first electrode 43. Therefore, by detecting the resistance and impedance between the first electrode 41 and the first electrode 43 and detecting a sudden change in the resistance or impedance, it is determined that the particle 200 is located between the first electrode 41 and the first electrode 43. The resistance and impedance to be detected can be changed as appropriate, for example, between the first electrode 41 and the first electrode 42, or between the first electrode 41 and the first electrode 44. It is also possible to simultaneously detect the resistance and impedance at multiple intervals, such as between the first electrode 41 and the first electrode 43, between the first electrode 43 and the first electrode 42, and between the first electrode 42 and the first electrode 44.

[0038] Next, a manufacturing procedure for the micro-channel chip according to the first embodiment will be briefly described below with reference to a flowchart shown in FIG.

[0039] (Step ST1) As shown in Fig. 7, first, a first electrode 4 (electrode) is formed on the sheet main body 31 (step ST1). Specifically, the first electrode 4 is bonded to the back surface 311 of the sheet main body 31 using a technique such as screen printing, gravure offset printing, flexographic printing, vapor deposition, sputtering, or transfer printing. In other words, the first electrode 4 is provided on the back side of the sheet main body 31. The sheet member 3 is produced by forming the first electrode 4 (electrode) on the sheet main body 31.

[0040] (Step ST2) Next, the sheet member 3 is die-cut (step ST2). Specifically, the sheet member 3 produced in step ST1 is die-cut into a predetermined shape (for example, a rectangle in plan view) using a die.

[0041] (Step ST3) Next, the sheet member 3 is bonded to the first substrate 1 (step ST3). As described above, the first electrode 4 (electrode) is directly bonded to the back surface 311 of the sheet main body 31. As a surface treatment prior to bonding, a method using a silane coupling agent for surface modification is preferred. Other surface activation methods include activating the bonding surfaces using an excimer lamp or low-pressure mercury lamp before bonding. Furthermore, plasma activation bonding can be performed after activating the surfaces with argon or oxygen plasma under atmospheric pressure or in a vacuum. Direct bonding can be performed by heating the sheets to a temperature of, for example, 70°C to 110°C and applying a pressure of, for example, 1 MPa to 10 MPa. Since the sheet main body 31 is flexible, it deforms by the thickness of the electrode 4, resulting in a tight bond between the sheet member 3 and the first substrate 1 without any gaps due to unevenness.

[0042] (Step ST4) Next, the second substrate 2 is bonded to the sheet member 3 (step ST4). The sheet member 3 and the second substrate 2 can be bonded directly to each other as in step ST3 described above. Furthermore, since the flow path 14 is sealed by the sheet member 3, bonding can be performed using a UV adhesive.

[0043] As described above, the micro-channel chip 100 according to this embodiment includes a first substrate 1 having a channel 14 on its front side, a sheet member 3 having a sheet body 31 bonded to the front side of the first substrate 1 and a first electrode 4 (electrode) provided on the sheet body 31, and a second substrate 2 bonded to the front side of the sheet member 3. The thickness T1 of the first substrate 1 and the thickness T2 of the second substrate 2 are each greater than the thickness T3 of the sheet body 31.

[0044] As described above, the sheet member 3 has the first electrode 4 (electrode) and is different from the hot melt adhesive of Patent Document 1, which fuses the two substrates together. In other words, even when the sheet member 3 is interposed between the first substrate 1 and the second substrate 2 and heated and pressed together, the sheet member 3 is unlikely to liquefy, preventing the material from flowing into the flow path, as occurs with the hot melt adhesive of Patent Document 1. Furthermore, the thickness T1 of the first substrate 1 and the thickness T2 of the second substrate 2 are each greater than the thickness T3 of the sheet body 31. Therefore, even if a gap occurs between the first electrode 4 (electrode) and the two substrates when the sheet member 3 is sandwiched between the first substrate 1 and the second substrate 2, the gap can be absorbed by the first substrate 1 and the second substrate 2 when the sheet member 3 is sandwiched between the first substrate 1 and the second substrate 2.

[0045] Since a plurality of first electrodes 4 (electrodes) are provided along the flow channel 14, the resistance and impedance between any two of the plurality of first electrodes 4 (electrodes) can be measured. Here, when a fluid containing particles 200 flows through the flow channel 14, the resistance and impedance differ depending on whether the particles 200 are located between any two electrodes or not. Therefore, if a change in resistance or impedance occurs, it is determined that the particles 200 are located between the two electrodes. Therefore, when applying an embodiment in which the tip of an injection member is pierced into the particles 200 flowing through the flow channel 14 and another fluid (e.g., a gene modification reagent) in the injection member is injected, the position of the particles 200 can be accurately detected.

[0046] The first electrode 4 (electrode) is provided on the back side of the sheet body 31 and is exposed to the flow path 14 of the first substrate 1. Therefore, when a fluid flows through the flow path 14, the first electrode 4 (electrode) can be brought into contact with the fluid, making it easy to measure the resistance and impedance of the fluid.

[0047] In a plan view, the first electrode 4 (electrode) intersects with the flow path 14 of the first substrate 1. This makes it easier to detect that the particle 200 is positioned between the two electrodes when measuring the resistance or impedance between any two of the multiple first electrodes 4 (electrodes) arranged along the flow path 14. This allows for accurate control of the injection timing by the injection member.

[0048] The first substrate 1 or the second substrate 2 and the sheet main body 31 are bonded by direct bonding, which includes bonding using a silane coupling agent, bonding using plasma activation, and bonding using an excimer lamp or a low-pressure mercury lamp.

[0049] The first substrate 1 or second substrate 2 can be bonded to the sheet body 31 by thermocompression bonding or plasma activation bonding, but direct bonding is also possible by activating the contact surface using a silane coupling agent, or by activating the contact surface with an excimer lamp or low-pressure mercury lamp, and then molecularly bonding the contact surface of the sheet body 31 directly to the contact surface of the first substrate 1 or second substrate 2 at the interface.

[0050] Furthermore, when the first substrate 1 and the sheet body 31 are bonded together using an adhesive such as the hot melt adhesive disclosed in Patent Document 1, the adhesive may flow into the flow path 14. However, the direct bonding of the present embodiment can further prevent foreign matter from flowing into the flow path 14.

[0051] When the first substrate 1 and the sheet body 31 are directly bonded, the flow path 14 can be sealed by the sheet body 31 firmly with a simple structure. Also, when the second substrate 2 and the sheet body 31 are bonded with an adhesive, the adhesive can be prevented from flowing into the flow path 14.

[0052] The thickness of the sheet body 31 is 5 micrometers or less, which increases the flexibility of the sheet body 31. Therefore, when the sheet member 3 including the sheet body 31 and the first electrode 4 is sandwiched between the first substrate 1 and the second substrate 2, the sheet member 3 conforms to the surfaces of the first substrate 1 and the second substrate 2, and the first substrate 1 and the second substrate 2 are more firmly bonded via the sheet member 3. In this way, even if the sheet body 31 has the first electrode 4, the flexibility of the sheet body 31 reduces the thickness of the first electrode 4, so that even if the first substrate 1 and the second substrate 2 are directly bonded, a decrease in bonding strength can be suppressed.

[0053] Wiring 210 is joined to the first electrode 4 (electrode), and the first substrate 1 is provided with through-holes (penetrating holes) 15 through which the wiring 210 can be inserted, so that the wiring 210 can be drawn out from the underside of the first substrate 1. This allows the arrangement space for the micro-channel chip 100 to be smaller than when the wiring 210 is drawn out from the side surface of the first substrate 1.

[0054] [First Modification] Next, a first modified example will be described. Fig. 8 is a schematic diagram of the micro-channel chip according to the first modified example, viewed from above.

[0055] A micro-channel chip 100A according to the first modification is provided with a channel 14A. Channel 14A includes a wide portion 141 and a narrow portion 142. The width of wide portion 141 in the X direction is greater than the width of narrow portion 142 in the X direction.

[0056] A plurality of first electrodes 4 (electrodes) are provided along the Y direction (i.e., along the longitudinal direction of the flow channel 14). Specifically, first electrodes 41 and 42 are arranged along the Y direction on the X1 side (left side in FIG. 8) across the flow channel 14. Also, first electrodes 43 and 44 are arranged along the Y direction on the X2 side (right side in FIG. 8) across the flow channel 14.

[0057] Here, the electrode portion 401 of the first electrode 41 and the electrode portion 401 of the first electrode 43 are arranged in a left-right pair, and the two electrode portions 401 face the narrow width portion 142. Similarly, the electrode portion 401 of the first electrode 42 and the electrode portion 401 of the first electrode 44 are arranged in a left-right pair, and the two electrode portions 401 face another narrow width portion 142.

[0058] As described above, in the micro-channel chip 100A according to the first modified example, the channel 14A has a wide portion 141 and a narrow portion 142, and the pair of electrode portions 401 of the first electrode 4 (electrode) are arranged in the narrow portion 142. This allows the resistance and impedance between the pair of electrode portions 401 to be detected more accurately than in the first embodiment.

[0059] [Second embodiment] Next, a micro-channel chip according to a second embodiment will be described. Fig. 9 is a schematic perspective view showing the micro-channel chip according to the second embodiment. Fig. 10 is an exploded perspective view of Fig. 9. Fig. 11 is a cross-sectional view taken along line XI-XI in Fig. 9. Fig. 12 is an exploded view of Fig. 11. Fig. 13 is a schematic view of the micro-channel chip according to the second embodiment as seen from above. Fig. 14 shows particles flowing through channels in the micro-channel chip of Fig. 13.

[0060] 9 to 12, micro-channel chip 100B includes first substrate 1B, second substrate 2B, and sheet member 3B. Micro-channel chip 100B according to the second embodiment differs from micro-channel chip 100 according to the first embodiment in the position at which an electrode (second electrode 5) is arranged, as will be described in detail below.

[0061] The first substrate 1B comprises a substrate body 11, an inlet pipe 12, and an outlet pipe 13. A flow path 14 is provided on a front surface 111 of the substrate body 11. In other words, the flow path 14 is provided on the front side of the substrate body 11. The inlet pipe 12 and the outlet pipe 13 are fixed to a back surface 112 of the substrate body 11. In other words, the inlet pipe 12 and the outlet pipe 13 are provided on the back side of the substrate body 11. The first substrate 1B differs from the first substrate 1 in that it does not have a through hole 15, but is otherwise the same as the first substrate 1 in terms of material, thickness, etc.

[0062] The second substrate 2B is provided with a through hole 23. The second substrate 2B differs from the second substrate 2 in that it has the through hole 23, but is otherwise the same as the second substrate 2 in terms of material, thickness, etc.

[0063] The sheet member 3B includes a sheet body 31 and a second electrode 5 (electrode). The second electrode 5 (electrode) is bonded to a surface 312 of the sheet body 31. In other words, the second electrode 5 (electrode) is provided on the front side of the sheet body 31. Therefore, the second electrode 5 (electrode) does not come into contact with the fluid containing particles 200 flowing through the flow path 14. The second electrode 5 (electrode) includes an electrode portion 501 and a pad 502. A wiring 210 is bonded to the pad 502. The through-hole 23 is arranged corresponding to the pad 502. The material, shape, and formation method of the second electrode 5 are the same as those of the first electrode 4.

[0064] As shown in FIG. 13, a plurality of second electrodes 5 (electrodes) are provided along the Y direction (i.e., along the longitudinal direction of the flow channel 14). Specifically, second electrodes 51 and 52 are arranged along the Y direction on the X1 side (left side in FIG. 13) of the flow channel 14. The number of second electrodes 51 and 52 is not particularly limited and may be three or more. Also, second electrodes 53 and 54 are arranged along the Y direction on the X2 side (right side in FIG. 13) of the flow channel 14. The number of second electrodes 53 and 54 is not particularly limited and may be three or more. The second electrodes 5 (electrodes) extend perpendicular to (intersect with) the flow channel 14.

[0065] 14, a fluid containing particles 200 flows from the Y1 side (upstream side) to the Y2 side (downstream side) as indicated by the arrow in the flow channel 14. Specifically, particles 200 indicated by the two-dot chain line are positioned at a first position P1, and then move in the direction of the arrow (from the Y1 side to the Y2 side) to a second position P2 indicated by the solid line.

[0066] Here, the dielectric constant of the fluid and the dielectric constant of the particle 200 are different. Therefore, for example, the capacitance (electrostatic capacity) between the second electrode 51 and the second electrode 53 differs between when the particle 200 is located at the first position P1 and when it is located at the second position P2. That is, the capacitance (electrostatic capacity) between the second electrode 51 and the second electrode 53 when the particle 200, which serves as a dielectric, is disposed between the second electrode 51 and the second electrode 53 changes compared to the capacitance (electrostatic capacity) when the particle 200 (dielectric) is not present between the second electrode 51 and the second electrode 53. Therefore, when the capacitance (electrostatic capacity) between the second electrode 51 and the second electrode 53 is detected and the capacitance (electrostatic capacity) changes suddenly, it is determined that the particle 200 is located between the second electrode 51 and the second electrode 53. Note that the capacitance (electrostatic capacity) to be detected can be changed as appropriate, for example, between the second electrode 51 and the second electrode 52, or between the second electrode 51 and the second electrode 54, etc. It is also possible to simultaneously detect the capacitance (electrostatic capacity) of multiple distances, such as between second electrode 51 and second electrode 53, between second electrode 53 and second electrode 52, and between second electrode 52 and second electrode 54.

[0067] As described above, according to this embodiment, the second electrode 5 (electrode) is provided on the front side of the sheet body 31. Therefore, the capacitance (electrostatic capacity) between any two of the multiple second electrodes 5 (electrodes) can be measured. Here, when a fluid containing particles 200 flows through the flow path 14, the capacitance (electrostatic capacity) differs between when the particles 200 are located between any two electrodes and when they are not located between the electrodes. Therefore, if a change in the measured capacitance (electrostatic capacity) occurs, it is determined that the particles 200 are located between the two electrodes. Therefore, when applying an embodiment in which the tip of an injection member is pierced into the particles 200 flowing through the flow path 14 to inject another fluid (e.g., a gene modification reagent) in the injection member, the position of the particles 200 can be accurately detected. Furthermore, because the second electrode 5 (electrode) is disposed on the front side of the sheet body 31, the flow path 14 is sealed by the back surface 311 of the sheet body 31, making it difficult for fluid to leak from the flow path 14.

[0068] [Third embodiment] Next, a micro-channel chip according to a third embodiment will be described.

[0069] Fig. 15 is a schematic cross-sectional view showing the micro-channel chip according to the third embodiment. Fig. 16 is an exploded view of Fig. 15. Fig. 17 is a schematic view of the micro-channel chip according to the third embodiment as seen from above.

[0070] The micro-channel chip 100C according to the third embodiment is a combination of the first and second embodiments. Specifically, as shown in FIGS. 15 and 16, the sheet member 3C includes a sheet main body 31, a first electrode 4 (electrode), and a second electrode 5 (electrode). The first electrode 4 (electrode) is bonded to a back surface 311 of the sheet main body 31. In other words, the first electrode 4 (electrode) is provided on the back side of the sheet main body 31. The first electrode 4 (electrode) includes an electrode portion 401 and a pad 402. A wiring 210 is bonded to the pad 402. The second electrode 5 (electrode) is bonded to a front surface 312 of the sheet main body 31. In other words, the second electrode 5 (electrode) is provided on the front side of the sheet main body 31. The second electrode 5 (electrode) includes an electrode portion 501 and a pad 502. A wiring 210 is bonded to the pad 502.

[0071] A through hole 15 is provided in the substrate body 11 of the first substrate 1. A through hole 23 is provided in the second substrate 2C.

[0072] As shown in FIG. 17, a plurality of first electrodes 4 (electrodes) are provided along the Y direction (i.e., along the longitudinal direction of the flow channel 14). Specifically, first electrodes 41C, 42C, and 43C are arranged along the Y direction on the X2 side (right side in FIG. 17) of the flow channel 14. Furthermore, a plurality of second electrodes 5 (electrodes) are provided along the Y direction (i.e., along the longitudinal direction of the flow channel 14) on the X1 side (left side in FIG. 17) of the flow channel 14. Specifically, second electrodes 51C and 52C are arranged along the Y direction. The first electrodes 4 and second electrodes 5 are arranged alternately in the Y direction. That is, the second electrode 51C is arranged adjacent to the first electrode 41C on the Y2 side, and the first electrode 42C is arranged adjacent to the second electrode 51C on the Y2 side. Further, the second electrode 52C is arranged adjacent to the first electrode 42C on the Y2 side, and the first electrode 43C is arranged adjacent to the second electrode 52C on the Y2 side. The number of first electrodes 4 and second electrodes 5 is not particularly limited. In this way, the first electrodes 4 and second electrodes 5 are arranged so as not to overlap each other in a plan view.

[0073] As described above, in the micro-channel chip 100C, the first electrode 4 is provided on the back side of the sheet member 3C, and the second electrode 5 is provided on the front side. Therefore, when a fluid containing particles 200 flows through the channel 14, the first electrode 4 can detect changes in resistance and impedance, and the second electrode 5 can detect changes in capacitance (electrostatic capacity).

[0074] Furthermore, since the first electrode 4 and the second electrode 5 do not overlap in a planar view, changes in resistance, impedance, and capacitance (electrostatic capacitance) can be detected more accurately than when the first electrode 4 and the second electrode 5 overlap in a planar view.

[0075] [Fourth embodiment] Next, a micro-channel chip 100D according to a fourth embodiment will be described.

[0076] Fig. 18 is a schematic perspective view showing a micro-channel chip according to a fourth embodiment. Fig. 19 is a cross-sectional view taken along line XIX-XIX in Fig. 18. Fig. 20 is an exploded view of Fig. 19. Fig. 21 is a schematic view of the vicinity of a notch in a sheet main body as viewed from below. Fig. 22 is a schematic view of the vicinity of a notch in a sheet member as viewed from below.

[0077] In the micro-channel chip 100D according to the fourth embodiment, as shown in Fig. 21, a semicircular notch 300 is provided in the side portion on the X2 side of the substrate body 11D of the first substrate 1. The notch 300 is recessed toward the X1 side in a plan view. Therefore, as shown in Fig. 22, when a sheet member 3 is laminated on the upper side of the first substrate 1, the lower surface of the pad 402 of the first electrode 4 is exposed through the notch 300. A wiring 210 is joined to the lower surface of the pad 402. In other words, the tip of the wiring 210 is joined to the lower surface of the pad 402, extends downward along the inside of the notch 300, and then extends toward the X2 side.

[0078] As described above, in micro-channel chip 100D according to the fourth embodiment, semicircular notch 300 is provided on the side of first substrate 1. Therefore, wiring 210 joined to first electrode 4 can be drawn out to the side of micro-channel chip 100D. This is advantageous in terms of space when arranging other components below micro-channel chip 100D, for example.

[0079] [Second Modification] Next, a description will be given of a micro-channel chip 100E according to a second modified example. Figure 23 is a schematic diagram of the side of the micro-channel chip according to the second modified example, viewed from below.

[0080] In the micro-channel chip 100E, a rectangular notch 300A in plan view is provided on the side of the substrate body 11E on the X2 side. The notch 300A is recessed toward the X1 side in plan view. A plurality of notches 300A are arranged at intervals along the Y direction. In FIG. 23, three notches 300A are provided, but the number of notches 300A is not particularly limited. As shown in FIG. 23, when a sheet member 3 is laminated on the upper side of the first substrate 1E, the lower surface of the pad 402 of the first electrode 4 is exposed through the notch 300A. Wires 220, 230, and 240 are joined to the lower surface of the pad 402. In other words, the wire 220 curves and extends toward the Y2 side from the pad 402 corresponding to the notch 300A closest to the Y2 side among the three notches 300A. The wiring 230 extends toward the X2 side from the pad 402 corresponding to the central notch 300A of the three notches 300A. The wiring 240 extends and curves toward the Y1 side from the pad 402 corresponding to the notch 300A closest to the Y1 side of the three notches 300A.

[0081] As described above, the micro-channel chip 100E according to the second modification has multiple rectangular notches 300A formed in the Y direction. As such, the shape of the notches is not limited to semicircular, and various shapes such as rectangular are applicable. Furthermore, it becomes possible to lead out the wiring 220, 230, and 240 in any direction from the pads 402 corresponding to each notch 300A. Note that various shapes such as triangular, semicircular, rectangular, and the like are applicable to the shape of the notches. [Explanation of symbols]

[0082] 1, 1B 1st board 2, 2B 2nd board 3, 3B, 3C Sheet material 4 1st electrode (electrode) 5 Second electrode (electrode) 11 Board body 12 Inflow pipe 13 Outflow pipe 14 Flow path 15, 23 through holes 31 Seat body 41, 42, 43, 44 1st electrode 41C, 42C, 43C 1st electrode 51, 52, 53, 54 2nd electrode 51C, 52C 2nd electrode 100, 100B, 100C, 100D, 100E Microfluidic Chip 111 Surface 112 Back side 121, 131 through holes 200 particles 210, 220, 230, 240 wiring 300, 300A notch 311 Back side 312 Surface 401 Electrode section 402 Pad 501 Electrode section 502 Pad P1 1st position P2 2nd position

Claims

1. a first substrate having a flow path provided on its front side; a sheet member including: a sheet body joined to the front side of the first substrate; and a plurality of electrodes provided on the sheet body and arranged at intervals in a direction in which the flow channels extend, each electrode intersecting the flow channels; a second substrate bonded to the front side of the sheet member, a thickness of the first substrate and a thickness of the second substrate are each greater than a thickness of the sheet body; the flow path includes a wide portion and a narrow portion having a width narrower than that of the wide portion in a direction perpendicular to the direction in which the flow path extends, The plurality of electrodes are provided in the narrow portion. Microfluidic chip.

2. The electrode includes a first electrode provided on the back side of the sheet body and exposed to the flow path of the first substrate. The microchannel chip according to claim 1 .

3. the first substrate or the second substrate and the sheet main body are joined by direct bonding, The direct bonding is Bonding using a silane coupling agent, bonding using plasma activation, bonding using an excimer lamp or a low-pressure mercury lamp, etc. The microchannel chip according to claim 1 or 2.

4. The thickness of the sheet body is 5 micrometers or less. The microchannel chip according to claim 1 .

5. Wiring is connected to the electrode, At least one of the first substrate and the second substrate is provided with a through hole through which the wiring can be inserted. The microchannel chip according to claim 1 .

6. Wiring is connected to the electrode, At least one side surface of the first substrate and the second substrate is provided with a notch through which the wiring can be inserted. The microchannel chip according to claim 1 .

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