Display substrate, its manufacturing method, and display device

Abstract

A display substrate, a manufacturing method thereof, and a display device are disclosed. The display substrate includes an opening region and an isolation region surrounding the opening region, the isolation region including a first flexible base and at least one isolation groove provided on one side of the first flexible base, each isolation groove being composed of a first inorganic film layer, an organic film layer and a second inorganic film layer arranged in a stacked manner, wherein the first inorganic film layer is arranged close to the first flexible base, the first inorganic film layer has a first end face facing the opening region, the organic film layer is arranged on a side of the first inorganic film layer away from the first flexible base, the organic film layer has a second end face facing the opening region, the second inorganic film layer is arranged on a side of the organic film layer away from the first flexible base, the second inorganic film layer has a third end face facing the opening region, the second end face is recessed in a direction away from the opening region relative to the first end face and the third end face, and the opposing surfaces of the first inorganic film layer and the second inorganic film layer and the second end face constitute the isolation groove.

Description

[Technical Field]

[0001] The present disclosure relates to the field of display technology, and more particularly to a display substrate, a manufacturing method thereof, and a display device. [Background technology]

[0002] Organic light-emitting diodes (OLEDs) are active light-emitting display devices with advantages such as self-luminance, wide viewing angles, high contrast, low power consumption, wide color gamut, light weight, and flexible formability. With the development of display technology, OLED technology is increasingly being applied to flexible displays. To improve the tensile properties of flexible OLED display panels, aperture regions are typically installed on the OLED display panel. The aperture regions increase the flexibility of the OLED display panel, enabling effects such as 3D curved surface application and dynamic micro-bending. Summary of the Invention [Means for solving the problem]

[0003] The present disclosure provides a liquid crystal display device including an opening region and an isolation region provided so as to surround the opening region, the isolation region including a first flexible base and at least one isolation groove provided on one side of the first flexible base, each of the isolation grooves being composed of a first inorganic film layer, an organic film layer and a second inorganic film layer that are stacked one on top of the other, wherein the first inorganic film layer is provided in proximity to the first flexible base, and has a first end face facing the opening region; the organic film layer is provided on a side of the first inorganic film layer remote from the first flexible base, and has a second end face facing the opening region; the second inorganic film layer is provided on a side of the organic film layer remote from the first flexible base, and has a third end face facing the opening region; the second end face is recessed from the first end face and the third end face in a direction away from the opening region, and the opposing surfaces of the first inorganic film layer and the second inorganic film layer and the second end face form the isolation groove. Regarding the display substrate.

[0004] In one alternative embodiment, the at least one isolation groove includes a first isolation groove, a first inorganic film layer constituting the first isolation groove includes a first barrier layer, and an organic film layer constituting the first isolation groove is a second flexible base.

[0005] In one alternative embodiment, the at least one isolation trench includes a second isolation trench, and the organic film layer constituting the second isolation trench is a first organic functional layer, which includes at least one of a planar layer, a pixel definition layer provided on a side of the planar layer away from the first flexible base, and a support layer provided on a side of the pixel definition layer away from the first flexible base.

[0006] In one alternative embodiment, a first groove and a first dam are provided in the first organic functional layer, the first groove being located on a side of the first dam away from the opening area, and the first groove penetrating the first organic functional layer.

[0007] In one alternative embodiment, the second inorganic film layer constituting the second isolation groove includes a first passivation layer, and the orthogonal projection of the first passivation layer onto the first flexible base covers the orthogonal projection of the first dam onto the first flexible base.

[0008] In one alternative embodiment, the first organic functional layer is the planar layer, and the at least one isolation groove further includes a third isolation groove provided on a side of the second isolation groove away from the first flexible base; the first inorganic film layer constituting the third isolation groove is the first passivation layer; the organic film layer constituting the third isolation groove is a second organic functional layer, and the second organic functional layer includes at least one of a pixel definition layer provided on a side of the first passivation layer remote from the first flexible base and a support layer provided on a side of the pixel definition layer remote from the first flexible base; the second inorganic film layer constituting the third isolation groove is a second passivation layer; Here, the second organic functional layer includes a third groove and a third dam, the third groove is located on a side of the third dam away from the opening area, the third groove penetrates the second organic functional layer, the orthogonal projection of the third dam onto the first flexible base is located within the range of the orthogonal projection of the first dam onto the first flexible base, and the orthogonal projection of the second passivation layer onto the first flexible base covers the orthogonal projection of the third dam onto the first flexible base.

[0009] In one alternative embodiment, the at least one isolation groove includes a first isolation groove and a second isolation groove, the second isolation groove being located on a side of the first isolation groove away from the first flexible base; a first inorganic film layer constituting the first isolation groove includes a first barrier layer, an organic film layer constituting the first isolation groove is a second flexible base, and a second inorganic film layer constituting the first isolation groove also serves as a first inorganic film layer constituting the second isolation groove, The organic film layer constituting the second isolation trench includes a planarization layer, and the second inorganic film layer constituting the second isolation trench includes a first passivation layer.

[0010] In one alternative embodiment, a second groove and a second dam are provided in the planar layer, the second groove being located on a side of the second dam away from the opening area, the second groove penetrating the planar layer; An orthogonal projection of the first passivation layer onto the first flexible base covers an orthogonal projection of the second dam onto the first flexible base.

[0011] In one alternative embodiment, the at least one isolation groove further includes a third isolation groove provided on a side of the second isolation groove away from the first flexible base; the first inorganic film layer constituting the third isolation groove is the first passivation layer; the organic film layer constituting the third isolation groove is a second organic functional layer, and the second organic functional layer includes at least one of a pixel definition layer provided on a side of the first passivation layer remote from the first flexible base and a support layer provided on a side of the pixel definition layer remote from the first flexible base; the second inorganic film layer constituting the third isolation groove is a second passivation layer; Here, the second organic functional layer includes a third groove and a third dam, the third groove is located on a side of the third dam away from the opening area, the third groove penetrates the second organic functional layer, the orthogonal projection of the third dam onto the first flexible base is located within the range of the orthogonal projection of the second dam onto the first flexible base, and the orthogonal projection of the second passivation layer onto the first flexible base covers the orthogonal projection of the third dam onto the first flexible base.

[0012] In one alternative embodiment, the display substrate comprises: The light-emitting device further includes a light-emitting material layer disposed on a side of the at least one isolation groove away from the first flexible base, the light-emitting material layer being discontinuous within each isolation groove.

[0013] In one alternative embodiment, the display substrate comprises: The light-emitting device further includes a packaging layer disposed on a side of the light-emitting material layer away from the first flexible base, the packaging layer being continuous within each of the isolation grooves.

[0014] In an alternative embodiment, the packaging layer comprises: a first inorganic packaging film layer provided on a side of the light emitting material layer away from the first flexible base, the orthogonal projection of the first flexible base covering the opening region and the isolation region; a first organic packaging film layer provided on a side of the first inorganic packaging film layer away from the first flexible base, the orthogonal projection of the first organic packaging film layer onto the first flexible base not overlapping the opening region and the isolation region; a second inorganic packaging film layer disposed on a side of the first organic packaging film layer away from the first flexible base, the second inorganic packaging film layer being orthogonally projected onto the first flexible base to cover the opening region and the isolation region; Includes.

[0015] In an alternative embodiment, the packaging layer comprises: a third inorganic packaging film layer disposed on a side of the light emitting material layer away from the first flexible base, the third inorganic packaging film layer being orthogonally projected onto the first flexible base to cover the opening region and the isolation region; a second organic packaging film layer provided on a side of the third inorganic packaging film layer away from the first flexible base, the second organic packaging film layer having an orthogonal projection onto the first flexible base that does not overlap the opening region; Includes.

[0016] In one alternative embodiment, the thickness of the organic film layer is equal to or greater than the thickness of the packaging layer and is not greater than five times the thickness of the packaging layer.

[0017] In an alternative embodiment, the thickness of the packaging layer is greater than or equal to 0.5 microns and less than or equal to 3 microns.

[0018] In one alternative embodiment, each of the isolation trenches is a closed structure surrounding the open area.

[0019] In one alternative embodiment, the first end surface is aligned with the third end surface.

[0020] In one alternative embodiment, the first flexible base has a fourth end surface facing the opening area, the fourth end surface recessed relative to the first end surface in a direction away from the opening area.

[0021] In one alternative embodiment, the second end face is recessed from the first end face and the third end face by an amount equal to or greater than 0.1 microns and equal to or less than 5.0 microns.

[0022] The present disclosure relates to a display device including any of the display substrates described above.

[0023] The present disclosure relates to a method for manufacturing a display substrate, the display substrate including an opening region and an isolation region provided so as to surround the opening region, the method for manufacturing the isolation region comprising: Providing a first flexible base; At least one isolation groove is formed on one side of the first flexible base, and each isolation groove is composed of a first inorganic film layer, an organic film layer, and a second inorganic film layer that are stacked one on top of the other; Including, Here, the first inorganic film layer is provided close to the first flexible base, the first inorganic film layer has a first end face facing the opening region, the organic film layer is provided on a side of the first inorganic film layer away from the first flexible base, the organic film layer has a second end face facing the opening region, the second inorganic film layer is provided on a side of the organic film layer away from the first flexible base, the second inorganic film layer has a third end face facing the opening region, the second end face is recessed in a direction away from the opening region relative to the first end face and the third end face, and the opposing surfaces of the first inorganic film layer and the second inorganic film layer and the second end face constitute the isolation groove.

[0024] In an alternative embodiment, after the step of forming at least one isolation groove on one side of the first flexible base, forming a light emitting material layer on a side of the at least one isolation groove away from the first flexible base, the light emitting material layer being discontinuous within each isolation groove; forming a packaging layer on the light emitting material layer on a side away from the first flexible base, the packaging layer being continuous within each of the isolation grooves; Further includes:

[0025] The above description is merely a summary of the technical solution of the present disclosure, which can be implemented according to the contents of this specification in order to more clearly understand the technical means of the present disclosure. In order to make the above and other objectives, features and advantages of the present disclosure more clear and understandable, specific embodiments of the present disclosure are exemplified below. [Brief explanation of the drawings]

[0026] In order to more clearly explain the technical solutions in the embodiments of the present disclosure or related art, the drawings used in the description of the embodiments or related art will be briefly described below. The drawings in the following description are merely some embodiments of the present disclosure, and it is obvious to those skilled in the art that other drawings can be derived based on these drawings without any creative effort. Note that the proportions in the drawings are for illustrative purposes only and do not represent actual proportions.

[0027] [Figure 1] FIG. 1 is a schematic diagram showing a cross-sectional structure of a display substrate in a related art. [Figure 2] 1 is a schematic diagram illustrating a planar structure of a display substrate according to an embodiment of the present disclosure. [Figure 3] 1 is a schematic diagram illustrating a cross-sectional structure of a first type of display substrate according to an embodiment of the present disclosure. [Figure 4] FIG. 2 is a schematic diagram illustrating a cross-sectional structure of a second type of display substrate according to an embodiment of the present disclosure. [Figure 5] FIG. 10 is a schematic diagram illustrating a cross-sectional structure of a third type of display substrate according to an embodiment of the present disclosure. [Figure 6] FIG. 10 is a schematic diagram illustrating a cross-sectional structure of a fourth type of display substrate according to an embodiment of the present disclosure. [Figure 7] 1 is a flowchart illustrating steps of a method for manufacturing a display substrate according to an embodiment of the present disclosure. [Figure 8] FIG. 10 is a schematic diagram illustrating a cross-sectional structure of a fifth type of display substrate according to an embodiment of the present disclosure. [Figure 9] FIG. 10 is a schematic diagram illustrating a cross-sectional structure of a sixth type of display substrate according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0028] In order to clarify the objectives, technical solutions and advantages of the embodiments of the present disclosure, the technical solutions in the embodiments of the present disclosure will be described more clearly and completely below with reference to the drawings of the embodiments of the present disclosure, and it is clear that the described embodiments are only some embodiments of the present disclosure and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present disclosure without any creative work fall within the scope of protection of the present disclosure.

[0029] In the related art, in order to block the intrusion of water and oxygen, several isolation structures 11 are usually provided in the peripheral region of the opening region, as shown in Fig. 1. However, the isolation structures 11 shown in Fig. 1 occupy a large amount of space in the peripheral region, which is detrimental to improving the pixel density and tensile properties of the display substrate.

[0030] In order to solve the above problems, in one embodiment of the present disclosure, a display substrate is provided, and referring to Figure 2, a schematic diagram showing the planar structure of a display substrate according to an embodiment of the present disclosure is provided. As shown in Figure 2, the display substrate includes an opening area HA and an isolation area TA arranged to surround the opening area HA.

[0031] As shown in FIG. 2, the display substrate may have an island bridge structure in which light-emitting elements are arranged in pixel islands PA, which may be located on the side of the isolation region TA away from the opening region HA. Connecting lines are provided in connection bridge regions between the pixel islands PA and between the opening regions HA. When an external force is applied to stretch the display substrate, distortion occurs mainly in the opening region HA and the connection bridge region, and the shape of the light-emitting elements in the pixel island PA remains unchanged. This prevents damage to the light-emitting elements in the pixel island PA and improves the tensile properties of the display substrate.

[0032] As shown in FIG. 2 , the display region of the display substrate may include a plurality of pixel islands PA arranged in a matrix. Each pixel island PA may include at least one pixel unit, and each pixel unit may include subpixels such as a red subpixel R, a green subpixel G, and a blue subpixel B. Each subpixel may include a pixel driving circuit and a light-emitting element. In an exemplary embodiment, each subpixel may have a shape such as a rectangle, a rhombus, a pentagon, or a hexagon. When a pixel unit includes three subpixels, the three subpixels may be arranged in a horizontal parallel arrangement, a vertical parallel arrangement, or a square arrangement (as shown in FIG. 2 ). When a pixel unit includes four subpixels, the four light-emitting units may be arranged in a horizontal parallel arrangement, a vertical parallel arrangement, or a square arrangement, although this disclosure is not limited thereto.

[0033] In a plane perpendicular to the display substrate, the underlayer and structural film layers in the opening region HA are all removed to form a through-hole structure, or the underlayer and structural film layers in the opening region HA are partially removed to form a blind via structure. In a plane parallel to the display substrate, the shape of the pull hole can include one or more of an "I" shape, a "T" shape, an "L" shape, and an "H" shape, and the present disclosure is not limited thereto.

[0034] Referring to Figures 3 to 6, 8 and 9, these are schematic diagrams showing the cross-sectional structure along II' in Figure 2, and the display substrate in the isolation region TA includes a first flexible base 01 and at least one isolation groove 02 provided on one side of the first flexible base 01, and each isolation groove 02 is composed of a first inorganic film layer 21, an organic film layer 22 and a second inorganic film layer 23 stacked one on top of the other.

[0035] Here, the first inorganic film layer 21 is arranged close to the first flexible base 01, and the first inorganic film layer 21 has a first end face facing the opening region HA, the organic film layer 22 is arranged on the side of the first inorganic film layer 21 away from the first flexible base 01, and the organic film layer 22 has a second end face facing the opening region HA, and the second inorganic film layer 23 is arranged on the side of the organic film layer 22 away from the first flexible base 01, and the second inorganic film layer 23 has a third end face facing the opening region HA.

[0036] The second end face is recessed relative to the first end face and the third end face in a direction away from the opening region HA, and the opposing surfaces of the first inorganic film layer 21 and the second inorganic film layer 23 and the second end face form an isolation groove 02.

[0037] In this embodiment, the number of isolation grooves 02 may be one as shown in Figures 3, 4 and 8, or may be three as shown in Figure 5, or two as shown in Figures 6 and 9, and in this embodiment, the number of isolation grooves 02 is not limited.

[0038] In this embodiment, the material of the first flexible base 01 may be, for example, polyimide that can withstand high temperatures, and the present disclosure is not limited thereto. In manufacturing the display substrate, a process-carrying glass substrate may be provided below the first flexible base 01, and after the manufacturing of the display substrate is completed, the first flexible base 01 may be separated from the glass substrate by a laser lift-off (LLO) process.

[0039] The material of the first inorganic film layer 21 can include at least one of inorganic materials such as silicon oxide, silicon nitride, aluminum oxide, and silicon oxynitride, and the present disclosure is not limited thereto.

[0040] The material of the second inorganic film layer 23 can include at least one of inorganic materials such as silicon oxide, silicon nitride, aluminum oxide, and silicon oxynitride, and the present disclosure is not limited thereto.

[0041] The material of the organic film layer 22 can include at least one of organic materials such as polyimide, acrylic, and polyethylene terephthalate, and the present disclosure is not limited thereto.

[0042] In a specific embodiment, by using dry etching and selecting appropriate etching gas components, it is possible to form the isolation groove 02 by making the etching rate of the etching gas for the organic film layer 22 greater than the etching rate of the etching gas for the first inorganic film layer 21 and the second inorganic film layer 23.

[0043] In this embodiment, the isolation groove 02 is located on the surface of the isolation region TA facing the opening region HA, with the opening of the isolation groove 02 facing the opening region HA. During the subsequent vapor deposition of the luminescent material layer 03, the isolation groove 02 is located on the side of the isolation region TA, and the luminescent material layer 03 is not deposited within the isolation groove 02, or is deposited only partially within the isolation groove 02. This results in a discontinuous luminescent material layer 03 within the isolation groove 02, which blocks the intrusion of water and oxygen between the inside and outside of the opening region HA and improves the reliability of the display substrate.

[0044] The manufacturing process of the packaging layer 04 is different from that of the luminescent material layer 03, and the packaging layer 04 can completely cover the isolation groove 02, the packaging layer 04 is continuous within the isolation groove 02, and the packaging layer 04 can completely cover the cross section of the luminescent material layer, which prevents water and oxygen from entering from the outside and further improves the reliability of the display substrate.

[0045] In the display substrate of this embodiment, by providing the isolation groove 02 on the side of the isolation area TA, it is possible to realize reliable packaging of the tensile display substrate. Meanwhile, compared with the technical solution in which the isolation groove 02 is provided on the front side of the isolation area TA (shown in Figure 1), this technical solution can reduce the space occupied by the isolation groove 02, thereby reducing the size of the isolation area TA. The saved space can be used to increase the size of the opening area HA to improve the tensile properties of the display substrate, and can also be used to increase the pixel islands PA to increase the pixel density of the display substrate.

[0046] In this embodiment, the opening region HA and the isolation trench 02 can be formed synchronously, and compared to the structure shown in FIG. 1, the mask process can be omitted, making the process less difficult and improving the yield.

[0047] In this embodiment, the structure of the isolation groove 02 can have various embodiments.

[0048] In a first alternative embodiment, as shown in FIG. 3, the at least one isolation groove 02 includes a first isolation groove 31, the first inorganic film layer 21 constituting the first isolation groove 31 includes a first barrier layer 32, and the organic film layer 22 constituting the first isolation groove 31 is a second flexible base 33.

[0049] The second flexible base 33 serves to support the display substrate, and the material may be the same as or different from that of the first flexible base 01, and the present disclosure is not limited thereto.

[0050] The first barrier layer 32 may be composed of multiple layers of inorganic materials and serves to block water and oxygen, as well as to block the diffusion of laser energy into the display substrate during the subsequent laser lift-off process.

[0051] In this embodiment, the second inorganic film layer 23 constituting the first isolation groove 31 includes, for example, at least one of a second barrier layer 311, a first gate insulating layer 312, a second gate insulating layer 313, and an interlayer dielectric layer 314, which are stacked one on top of the other, and the present disclosure is not limited thereto.

[0052] Here, the second barrier layer 311 can be composed of a multi-layer inorganic material and serves to block water and oxygen. The first gate insulating layer 312, the second gate insulating layer 313, and the interlayer dielectric layer 314 may all be film layers extending from the pixel island PA to the isolation region TA, and may be formed synchronously with the thin film transistors in the pixel island PA. The structure of the pixel island PA will be described in the following examples.

[0053] In a second type of optional embodiment, as shown in Figures 4 and 8, the at least one isolation groove 02 may include a second isolation groove 41, and the organic film layer 22 constituting the second isolation groove 41 is a first organic functional layer 42, which includes at least one of a planar layer 421, a pixel definition layer 422 provided on the side of the planar layer 421 away from the first flexible base 01, and a support layer 423 provided on the side of the pixel definition layer 422 away from the first flexible base 01.

[0054] 4, the first organic functional layer 42 may be a planarization layer 421. The planarization layer 421 is a film layer that extends from the pixel island PA to the isolation region TA and plays a role in planarization within the pixel island PA.

[0055] 8, the first organic functional layer 42 may be a stack of a pixel definition layer 422 and a support layer 423, which are film layers extending from the pixel island PA to the isolation region TA. The pixel definition layer 422 defines the light-emitting region of each sub-pixel in the pixel island PA, and the support layer 423 includes isolation columns 134 in the pixel island PA, which support a deposition mask.

[0056] The first organic functional layer 42 may be a pixel definition layer 422, a support layer 423, a planar layer 421 and a pixel definition layer 422 stacked together, or a planar layer 421 and a support layer 423 stacked together, and the present disclosure does not specifically limit the first organic functional layer 42.

[0057] As shown in Figures 4 and 8, a first groove 43 and a first dam 44 are provided in the first organic functional layer 42, the first groove 43 is located on the side of the first dam 44 away from the opening area HA, and the first groove 43 penetrates the first organic functional layer 42 in a first direction.

[0058] Here, the first direction is the direction in which the surface of the first organic functional layer 42 closer to the first flexible base 01 faces the surface away from the first flexible base 01. The groove bottom or second end face of the second isolation groove 41 includes the surface of the first dam 44 closer to the opening region HA.

[0059] By providing the first groove 43 and the first dam 44 in the first organic functional layer 42, it is possible to prevent the liquid material from overflowing into the open region HA in the subsequent process flow.

[0060] 4 and 8, the second inorganic film layer 23 constituting the second isolation groove 41 may include a first passivation layer 45, and the orthogonal projection of the first passivation layer 45 onto the first flexible base 01 covers the orthogonal projection of the first dam 44 onto the first flexible base 01. In this way, the first passivation layer 45 can completely isolate the first organic functional layer 42 and the light-emitting material layer 03 located on both sides thereof, preventing water and oxygen from penetrating into the light-emitting material layer 03 through the first organic functional layer 42, thereby improving the reliability of the display substrate.

[0061] As shown in Figures 4 and 8, the first inorganic film layer 21 constituting the second isolation groove 41 includes, for example, at least one of a second barrier layer 311, a first gate insulating layer 312, a second gate insulating layer 313, and an interlayer dielectric layer 314, which are stacked one on top of the other.

[0062] Here, the second barrier layer 311 may be composed of a multi-layer inorganic material and serves to block water and oxygen. As shown in Figures 4 and 8, the first gate insulating layer 312, the second gate insulating layer 313, and the interlayer dielectric layer 314 may all be film layers extending from the pixel island PA to the isolation region TA, and may be formed synchronously with the thin film transistors in the pixel island PA. In a third alternative embodiment, as shown in FIG. 9, the at least one isolation groove 02 further includes a third isolation groove 53 provided on the side of the second isolation groove 41 away from the first flexible base 01.

[0063] The structure of the second isolation trench 41 is the same as that described in the second embodiment, and therefore will not be described here. In this embodiment, as shown in FIG. 9, the organic film layer 22 constituting the second isolation trench 41 is a flat layer 421.

[0064] The first inorganic film layer 21 constituting the third isolation groove 53 is the first passivation layer 45. In other words, the first passivation layer 45 of the second inorganic film layer 23 constituting the second isolation groove 41 also serves as the first inorganic film layer 21 of the third isolation groove 53.

[0065] The organic film layer 22 constituting the third isolation groove 53 is a second organic functional layer 54, and the second organic functional layer 54 includes at least one of a pixel definition layer provided on the side of the first passivation layer 45 away from the first flexible base 01 and a support layer 423 provided on the side of the pixel definition layer 422 away from the first flexible base 01.

[0066] The second inorganic film layer 23 that constitutes the third isolation groove 53 is a second passivation layer 55 .

[0067] Here, a third groove 59 and a third dam 56 are provided in the second organic functional layer 54, the third groove 59 is located on the side of the third dam 56 away from the opening region HA, the third groove 59 penetrates the second organic functional layer 54, and the orthogonal projection of the third dam 56 onto the first flexible base 01 is located within the range of the orthogonal projection of the first dam 44 onto the first flexible base 01. By providing the third groove 59 and the third dam 56, it is possible to prevent the liquid material from overflowing into the opening region HA in a subsequent process flow.

[0068] The orthogonal projection of the second passivation layer 55 onto the first flexible base 01 covers the orthogonal projection of the third dam 56 onto the first flexible base 01. In this way, the second passivation layer 55 can completely isolate the second organic functional layer 54 and the light-emitting material layer 03 located on both sides of it, preventing water and oxygen from penetrating into the light-emitting material layer 03 through the second organic functional layer 54 and improving the reliability of the display substrate.

[0069] In a fourth alternative embodiment, as shown in FIG. 6, the at least one isolation groove 02 includes a first isolation groove 31 and a second isolation groove 41, and the second isolation groove 41 is provided on the side of the first isolation groove 31 away from the first flexible base 01.

[0070] The first inorganic film layer 21 constituting the first isolation groove 31 may include a first barrier layer 32, the organic film layer 22 constituting the first isolation groove 31 may be a second flexible base 33, and the second inorganic film layer 23 constituting the first isolation groove 31 also serves as the first inorganic film layer 21 constituting the second isolation groove 41. In this embodiment, the film layer structure of the first inorganic film layer 21, organic film layer 22, and second inorganic film layer 23 constituting the first isolation groove 31 is the same as that of the first isolation groove 31 in the above-described example, and therefore will not be described again here.

[0071] The organic film layer 22 constituting the second isolation trench 41 includes a planar layer 421, and the second inorganic film layer 23 constituting the second isolation trench 41 includes a first passivation layer 45. As one option, a second trench 51 and a second dam 52 are provided in the planar layer 421, the second trench 51 being located on a side of the second dam 52 away from the opening region HA, and the second trench 51 penetrating the planar layer 421 in the first direction. By providing the second trench 51 and the second dam 52, it is possible to prevent the liquid material from overflowing into the opening region HA in a subsequent process flow.

[0072] The orthogonal projection of the first passivation layer 45 onto the first flexible base 01 covers the orthogonal projection of the second dam 52 onto the first flexible base 01. In this way, the first passivation layer 45 can completely isolate the flat layer 421 and the light-emitting material layer 03 located on both sides of it, preventing water and oxygen from penetrating into the light-emitting material layer 03 through the flat layer 421 and improving the reliability of the display substrate.

[0073] The groove bottom or second end face of the second isolating groove 41 includes the surface of the second dam 52 on the side closer to the opening area HA.

[0074] As shown in FIG. 5, the at least one isolation groove 02 further includes a third isolation groove 53 provided on the side of the second isolation groove 41 away from the first flexible base 01 .

[0075] Here, the second isolation groove 41 may be located on the side of the first isolation groove 31 that is farther from the first flexible base 01, and the structure of the second isolation groove 41 and the first isolation groove 31 can be referred to the explanation in Figure 6 above, and the explanation will be omitted here.

[0076] The first inorganic film layer 21 constituting the third isolation groove 53 is the first passivation layer 45. In other words, the first passivation layer 45 of the second inorganic film layer 23 constituting the second isolation groove 41 also serves as the first inorganic film layer 21 of the third isolation groove 53.

[0077] The organic film layer 22 constituting the third isolation groove 53 is a second organic functional layer 54, and the second organic functional layer 54 includes at least one of a pixel definition layer provided on the side of the first passivation layer 45 away from the first flexible base 01 and a support layer provided on the side of the pixel definition layer away from the first flexible base 01.

[0078] The second inorganic film layer 23 that constitutes the third isolation groove 53 is a second passivation layer 55 .

[0079] Here, a third groove 59 and a third dam 56 are provided in the second organic functional layer 54, the third groove 59 is located on the side of the third dam 56 away from the opening region HA, the third groove 59 penetrates the second organic functional layer 54, and the orthogonal projection of the third dam 56 onto the first flexible base 01 is located within the range of the orthogonal projection of the second dam 52 onto the first flexible base 01. By providing the third groove 59 and the third dam 56, it is possible to prevent the liquid material from overflowing into the opening region HA in a subsequent process flow.

[0080] The orthogonal projection of the second passivation layer 55 onto the first flexible base 01 covers the orthogonal projection of the third dam 56 onto the first flexible base 01. In this way, the second passivation layer 55 can completely isolate the second organic functional layer 54 and the light-emitting material layer 03 located on both sides of it, preventing water and oxygen from penetrating into the light-emitting material layer 03 through the second organic functional layer 54 and improving the reliability of the display substrate.

[0081] As shown in Figures 3 to 6, 8 and 9, the display substrate may further include an emissive material layer 03 provided on the side of at least one isolation groove 02 away from the first flexible base 01, and the emissive material layer 03 is discontinuous within each isolation groove 02.

[0082] The light-emitting material layer 03 may include one or more film layers, such as a common organic layer, a cathode layer, and an optical coupling layer, and the present disclosure is not limited thereto. The light-emitting material layer 03 may be a film layer extending from the pixel island PA to the isolation region TA.

[0083] As shown in Figures 3 to 6, 8 and 9, the display substrate may further include a packaging layer 04 provided on the side of the light-emitting material layer 03 away from the first flexible base 01, and the packaging layer 04 is continuous within each isolation groove 02.

[0084] In an alternative embodiment, as shown in FIG. 6, the packaging layer 04 is a first inorganic packaging film layer 61 provided on a side of the light emitting material layer 03 away from the first flexible base 01, the orthogonal projection of which onto the first flexible base 01 covers the opening area HA and the isolation area TA; a first organic packaging film layer 62 provided on a side of the first inorganic packaging film layer 61 away from the first flexible base 01, the orthogonal projection of which onto the first flexible base 01 does not overlap the opening region HA and the isolation region TA; a second inorganic packaging film layer 63 provided on a side of the first organic packaging film layer 62 away from the first flexible base 01, the orthogonal projection of which onto the first flexible base 01 covers the opening area HA and the isolation area TA; may include:

[0085] In this embodiment, the first inorganic packaging film layer 61 completely envelops the opening area HA and the isolation area TA to ensure the integrity of the package, not only blocking water and oxygen from the opening area HA, but also forming pinpoints in the packaging layer 04 by the isolation grooves in the isolation area TA to further prevent peeling and failure of the edges of the film layer.

[0086] The first organic packaging film layer 62 is provided on the first inorganic packaging film layer, and the first organic packaging film layer 62 in the opening area HA and the isolation area TA is removed, exposing the surface of the first inorganic packaging film layer 61.

[0087] In areas other than the opening area HA and the isolation area TA, for example, in the pixel island PA, the first inorganic packaging film layer 61, the first organic packaging film layer 62, and the second inorganic packaging film layer 63 are stacked, and the second inorganic packaging film layer 63 is stacked on the first organic packaging film layer 62, forming a stacked structure of inorganic material / organic material / inorganic material. In the opening area HA and the isolation area TA, the second inorganic packaging film layer 63 is stacked on the first inorganic packaging film layer 61, forming a stacked structure of inorganic material / inorganic material.

[0088] Here, the materials of the first inorganic packaging film layer 61 and the second inorganic packaging film layer 63 can include at least one inorganic material such as silicon oxide, silicon nitride, and silicon oxynitride, and can be a single layer, a multi-layer, or a composite layer, which can prevent external water and oxygen from entering the light-emitting structure layer.

[0089] The first organic packaging film layer 62 can be made of a resin material, which serves to cover each film layer of the display substrate and improves the stability and flatness of the structure.

[0090] In another alternative embodiment, as shown in Figures 3 to 5, 8 and 9, the packaging layer 04 is a third inorganic packaging film layer 57 provided on a side of the light emitting material layer 03 away from the first flexible base 01, the orthogonal projection of which onto the first flexible base 01 covers the opening area HA and the isolation area TA; a second organic packaging film layer (58) provided on a side of the third inorganic packaging film layer (57) away from the first flexible base (01), the orthogonal projection of which onto the first flexible base (01) does not overlap with the opening region (HA); may include:

[0091] In this embodiment, the third inorganic packaging film layer 57 completely envelops the opening area HA and the isolation area TA to ensure the integrity of the package, not only blocking water and oxygen from the opening area HA, but also forming pinpoints in the packaging layer 04 by the isolation grooves in the isolation area TA to further prevent peeling and failure of the edges of the film layer.

[0092] The second organic packaging film layer 58 is disposed on the third inorganic packaging film layer 57, and the first organic packaging film layer in the opening region HA is removed, exposing the surface of the third inorganic packaging film layer 57.

[0093] In areas other than the opening area HA, such as the isolation area TA and pixel island PA, the third inorganic packaging film layer 57 and the second organic packaging film layer 58 are stacked to form an inorganic / organic laminate structure, which is completely covered by the third inorganic packaging film layer 57 in the opening area HA.

[0094] Here, the material of the third inorganic packaging film layer 57 can include at least one inorganic material such as silicon oxide, silicon nitride and silicon oxynitride, and can be a single layer, a multi-layer or a composite layer, which can prevent external water and oxygen from entering the light-emitting structure layer.

[0095] The second organic packaging film layer 58 can be made of a resin material, which serves to cover each film layer of the display substrate and improve the stability and flatness of the structure.

[0096] As an option, the thickness of the organic film layer 22 is equal to or greater than the thickness of the packaging layer 04 and is equal to or less than five times the thickness of the packaging layer 04. When the thickness of the packaging layer 04 is a, the thickness of the organic film layer 22 may be equal to or greater than a and equal to or less than 5*a. This can stabilize the structure of the packaging layer 04 in the isolation groove 02 and increase the adhesion of the packaging layer 04.

[0097] As an option, the thickness of the packaging layer 04 is 0.5 microns or more and 3 microns or less, but this disclosure is not limited thereto. For example, the thickness of the packaging layer 04 may be 1 micron, 1.5 microns, 2 microns, etc., and the specific thickness can be set according to actual needs.

[0098] The thickness of the film layer means the size of the film layer in the first direction.

[0099] In order to completely block the intrusion path of water and oxygen around the open area HA, each isolating groove 02 can be made into a closed structure surrounding the open area HA.

[0100] In one alternative embodiment, the first edge is aligned with the third edge. Because the first edge is aligned with the third edge, the first inorganic film layer 21 and the second inorganic film layer 23 can share a single mask, thereby simplifying the process and reducing costs. Furthermore, the first edge is aligned with the third edge, which can further reduce the size of the isolation region TA and provide space for improving the tensile properties and pixel density of the display substrate.

[0101] In one alternative embodiment, the second end face is recessed relative to the first end face and the third end face by at least 0.1 microns and at most 5.0 microns.

[0102] Specifically, the recession amount of the second end face with respect to the first end face may be 0.3 microns or more and 1.5 microns or less. The recession amount of the second end face with respect to the third end face may be 0.3 microns or more and 1.5 microns or less. That is, the groove depth of the isolation trench 02 may be 0.3 microns or more and 1.5 microns or less. Furthermore, the groove depth of the isolation trench 02 may be 0.5 microns or more and 1.5 microns or less.

[0103] In the manufacturing process of the display substrate, each film layer of the display substrate is first formed on a rigid substrate, and then the display substrate and the rigid substrate are separated by the LLO process. During the laser lift-off process, the packaging layer 04 in the opening area HA is prone to rupture, which may result in the package being damaged.

[0104] To solve the above problem, in one alternative embodiment, referring to FIG. 3, the first flexible base 01 has a fourth end face facing the opening area HA, and the fourth end face is recessed in a direction away from the opening area HA relative to the first end face.

[0105] Because the fourth end face is recessed relative to the first end face, i.e., the first end face protrudes relative to the fourth end face, the first end face serves to block cracks in the packaging layer 04 from extending upward along the side of the isolation area TA, preventing cracks in the packaging layer 04 within the opening area from extending to each isolation groove 02, preventing the package from failing, and improving the reliability of the display substrate package.

[0106] In a specific embodiment, the fourth end face may be recessed relative to the first end face and formed in synchronization with the isolation groove 02.

[0107] The recession amount of the fourth end face relative to the first end face may be 0.3 microns or more and 1.5 microns or less, and the recession amount of the fourth end face relative to the first end face may be 0.5 microns or more and 1.5 microns or less.

[0108] 4, 6, 8 and 9, in one alternative embodiment, the pixel island PA includes a pixel circuit disposed on the second barrier layer 311, and the thin film transistor in the pixel circuit may include a channel material 110, a first gate insulating layer 312, a first gate 112, a second gate insulating layer 313, a second gate 114, an interlayer dielectric layer 314, a source 121, and a drain 122. The structures of the thin film transistors shown in FIGS. 4, 6, 8 and 9 and the above-described thin film transistors are outlines of one example, and other stack structures, bottom gate structures, double gate structures, etc. are not limited in this example.

[0109] A planar layer 421 is coated on the pixel circuit, and serves to planarize the pixel circuit. The anode 132 is connected to the drain 122 through a via provided in the planar layer 421. The pixel definition layer 422 is provided on a side of the anode layer 132 away from the pixel circuit. A pixel opening is provided in the pixel definition layer 422, and material of the pixel definition layer in the pixel opening is removed to form an electroluminescent layer of a light-emitting element in the pixel opening. The pixel opening corresponds to the anode 132 and is used for depositing the electroluminescent layer 141. Support pillars 134 in the support layer 423 are provided on a side of the pixel definition layer 422 away from the first flexible base 01 in the non-pixel opening region and are used to support a deposition mask during deposition. In an exemplary embodiment, the support layer 423 and the pixel definition layer 422 can be formed by the same patterning process using a half-tone mask, and this disclosure is not limited thereto.

[0110] On the side of the pixel defining layer 422 and the anode 132 away from the pixel circuitry are provided an electroluminescent layer 141, a common organic layer 142, and a cathode and optical adjustment layer 143. The cathode and optical adjustment layer 143 is provided on the side of the common organic layer 142 away from the anode 132. A packaging layer 04 is provided on the side of the cathode and optical adjustment layer 143 away from the anode 132.

[0111] Here, the electroluminescent layer 141 and the common organic layer 142 can be deposited by evaporation. The common organic layer can include, for example, an electron transport layer, a hole transport layer, a resistive injection layer, a hole injection layer, etc. The electroluminescent layer 141 may be disposed between the electron transport layer and the hole transport layer and used to realize pixel light emission. The common organic layer is used to improve the luminous efficiency of the light-emitting layer. Examples of materials for the cathode layer include metal materials such as magnesium, silver, aluminum, copper, and lithium.

[0112] Another embodiment of the present disclosure further provides a display device, which may include the display substrate described in any of the embodiments.

[0113] Here, the pixel structure of the display substrate may be an organic light-emitting diode (OLED), a mini light-emitting diode (Mini LED), a micro light-emitting diode (Micro LED), a quantum dot light-emitting diode (Quantum Dot Light-Emitting Diode (QLED)), etc.

[0114] The display device of this embodiment may be any product or part with a 2D or 3D display function, such as a display panel, electronic paper, a mobile phone, a tablet, a television, a laptop computer, a digital photo frame, or a navigation system.

[0115] In another embodiment of the present disclosure, there is further provided a method for manufacturing a display substrate, wherein the display substrate includes an opening region and an isolation region surrounding the opening region, and with reference to FIG. 7 , the method for manufacturing the isolation region includes the following steps:

[0116] In step 71, a first flexible base is provided.

[0117] In step 72, at least one isolation groove is formed on one side of the first flexible base, and each isolation groove is composed of a first inorganic film layer, an organic film layer and a second inorganic film layer stacked one on top of the other.

[0118] Here, the first inorganic film layer is provided close to the first flexible base, the first inorganic film layer has a first end face facing the opening region, the organic film layer is provided on a side of the first inorganic film layer away from the first flexible base, the organic film layer has a second end face facing the opening region, the second inorganic film layer is provided on a side of the organic film layer away from the first flexible base, the second inorganic film layer has a third end face facing the opening region, the second end face is recessed in a direction away from the opening region relative to the first end face and the third end face, and the opposing surfaces of the first inorganic film layer and the second inorganic film layer and the second end face form an isolation groove.

[0119] The manufacturing method according to this embodiment can manufacture the display substrate of any of the above-described embodiments.

[0120] In an alternative embodiment, after step 72, the method further includes forming a light emitting material layer on a side of the at least one isolation groove away from the first flexible base, the light emitting material layer being discontinuous within each isolation groove. After forming the light emitting material layer, the method further includes forming a packaging layer on a side of the light emitting material layer away from the first flexible base, the packaging layer being continuous within each isolation groove.

[0121] In one alternative embodiment, step 71 may specifically include preparing a first flexible film. Step 72 may specifically include the following steps: first, using a film deposition process to sequentially form a first inorganic film, an organic film, and a second inorganic film on one side of the first flexible film; then, using a dry etching process to process the first inorganic film, the organic film, the second inorganic film, and the first flexible film, to simultaneously form an opening region, a first flexible base located in the isolation region, and at least one isolation groove located on one side of the first flexible base.

[0122] Here, the film formation process can include any one or more of sputtering, evaporation, and chemical vapor deposition.

[0123] Dry etching is a technique that uses plasma to etch films. When gases exist in the form of plasma, they have two characteristics. First, the chemical activity of these gases in plasma is much stronger than normal. By selecting the appropriate gas depending on the material being etched, they can react with the material more quickly and achieve thin film removal through etching. Second, by using an electric field to induce and accelerate the plasma, it can gain a certain amount of energy. When it collides with the surface of the object being etched, atoms of the material are released, allowing etching to be achieved through physical energy transfer.

[0124] In a specific embodiment, fabrication of the anode layer and pixel definition layer in the pixel island can be completed before a dry etching process is used to form the isolation trenches located in the opening regions and isolation regions.

[0125] In this embodiment, the fabrication of the anode layer and the pixel definition layer is placed before the dry etching process, which can avoid the fabrication process of the anode layer and the pixel definition layer from affecting the opening region and the isolation groove.

[0126] Each embodiment in this specification will be described in a stepwise manner, with the focus being on the differences between each embodiment and other embodiments, and reference will be made to the same and similar parts between the embodiments.

[0127] Finally, relational terms such as "first" and "second" are used herein merely to distinguish one entity or operation from another and do not necessarily require or imply that such an actual relationship or order exists between those entities or operations. Furthermore, the terms "comprise," "contain," or any other variation thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that includes a set of elements includes not only those elements but also other elements not expressly stated or inherent in such process, method, article, or apparatus. Without further limitation, an element qualified by the phrase "comprises one of" does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0128] The display substrate, its manufacturing method, and display device according to the present disclosure have been described in detail above. This specification uses specific examples to illustrate the principles and embodiments of the present disclosure. The explanation of the above examples is merely intended to facilitate understanding of the method and core idea of ​​the present disclosure. At the same time, those skilled in the art may make changes in the specific embodiments and application scope based on the idea of ​​the present disclosure. Therefore, the contents of this specification should not be construed as limiting the present disclosure.

[0129] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the invention disclosed herein. This disclosure is intended to cover any modifications, uses, or adaptations of the present disclosure, which modifications, uses, or adaptations follow the general principles of the present disclosure and include common knowledge or customary technical means known in the art but not disclosed in the present disclosure. The specification and examples are considered to be exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

[0130] It should be understood that the present disclosure is not limited to the exact construction described above and illustrated in the drawings, but that various modifications and variations are possible without departing from the scope thereof, which is limited only by the appended claims.

[0131] References herein to "one embodiment," "an embodiment," or "one or more embodiments" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of the disclosure, and "in one embodiment" does not necessarily refer to the same embodiment.

[0132] In this specification, many specific details have been described. However, it should be understood that embodiments of the present disclosure may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this specification.

[0133] In the claims, any reference signs between parentheses shall not be construed as a limitation on the scope of the claim. The word "comprise" does not exclude the presence of elements or steps not stated in a claim. The word "a" or "one" preceding an element does not exclude the presence of a plurality of such elements. The present disclosure may be implemented by hardware comprising several different elements, and by a suitably programmed computer. In a unit claim enumerating several devices, several of these devices may be specifically embodied by the same hardware. The use of words such as first, second, and third does not indicate an order. These words may be interpreted as names.

[0134] Finally, the above embodiments are only used to explain the technical solutions of the present disclosure and are not intended to limit them. Although the present disclosure has been described in detail with reference to the above embodiments, those skilled in the art will understand that the technical solutions described in each of the above embodiments may still be modified or some of the technical features may be replaced with equivalents, and such modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of each of the embodiments of the present disclosure.

Claims

1. an opening region and an isolation region provided so as to surround the opening region, the isolation region including a first flexible base and at least one isolation groove provided on one side of the first flexible base, each of the isolation grooves being composed of a first inorganic film layer, an organic film layer and a second inorganic film layer that are stacked one on top of the other; the first inorganic film layer is provided in proximity to the first flexible base, and has a first end face facing the opening region; the organic film layer is provided on a side of the first inorganic film layer away from the first flexible base, and has a second end face facing the opening region; the second inorganic film layer is provided on a side of the organic film layer away from the first flexible base, and has a third end face facing the opening region; the second end face is recessed from the first end face and the third end face in a direction away from the opening region, and opposing surfaces of the first inorganic film layer and the second inorganic film layer and the second end face form the isolation groove; the at least one isolation groove includes a second isolation groove, and an organic film layer constituting the second isolation groove is a first organic functional layer, the first organic functional layer including at least one of a planar layer, a pixel definition layer provided on a side of the planar layer remote from the first flexible base, and a support layer provided on a side of the pixel definition layer remote from the first flexible base; A display substrate characterized by:

2. 2. The display substrate of claim 1, wherein the at least one isolation groove includes a first isolation groove, a first inorganic film layer constituting the first isolation groove includes a first barrier layer, and an organic film layer constituting the first isolation groove is a second flexible base.

3. 2. The display substrate of claim 1, wherein a first groove and a first dam are provided in the first organic functional layer, the first groove being located on a side of the first dam away from the opening area, and the first groove penetrating the first organic functional layer.

4. 4. The display substrate of claim 3, wherein the second inorganic film layer constituting the second isolation groove includes a first passivation layer, and the orthogonal projection of the first passivation layer onto the first flexible base covers the orthogonal projection of the first dam onto the first flexible base.

5. the first organic functional layer is the planar layer, and the at least one isolation groove further includes a third isolation groove provided on a side of the second isolation groove away from the first flexible base; the first inorganic film layer constituting the third isolation groove is the first passivation layer, the organic film layer constituting the third isolation groove is a second organic functional layer, and the second organic functional layer includes at least one of a pixel definition layer provided on a side of the first passivation layer remote from the first flexible base and a support layer provided on the pixel definition layer on a side of the first passivation layer remote from the first flexible base; the second inorganic film layer constituting the third isolation groove is a second passivation layer, the second organic functional layer includes a third groove and a third dam, the third groove being located on a side of the third dam away from the opening region, the third groove penetrating the second organic functional layer, the orthogonal projection of the third dam onto the first flexible base being located within a range of the orthogonal projection of the first dam onto the first flexible base, and the orthogonal projection of the second passivation layer onto the first flexible base covering the orthogonal projection of the third dam onto the first flexible base; 5. The display substrate according to claim 4.

6. the at least one isolation groove includes a first isolation groove and a second isolation groove, the second isolation groove being provided on a side of the first isolation groove away from the first flexible base; a first inorganic film layer constituting the first isolation groove includes a first barrier layer, an organic film layer constituting the first isolation groove is a second flexible base, and a second inorganic film layer constituting the first isolation groove also serves as a first inorganic film layer constituting the second isolation groove, the organic film layer constituting the second isolation trench includes a planarization layer, and the second inorganic film layer constituting the second isolation trench includes a first passivation layer; 2. The display substrate according to claim 1.

7. a second groove and a second dam are provided in the flat layer, the second groove being located on a side of the second dam away from the opening region, and the second groove penetrating the flat layer; an orthogonal projection of the first passivation layer onto the first flexible base covering an orthogonal projection of the second dam onto the first flexible base; 7. The display substrate according to claim 6.

8. the at least one isolation groove further includes a third isolation groove provided on a side of the second isolation groove away from the first flexible base; the first inorganic film layer constituting the third isolation groove is the first passivation layer, the organic film layer constituting the third isolation groove is a second organic functional layer, and the second organic functional layer includes at least one of a pixel definition layer provided on a side of the first passivation layer remote from the first flexible base and a support layer provided on the pixel definition layer on a side of the first passivation layer remote from the first flexible base; the second inorganic film layer constituting the third isolation groove is a second passivation layer, the second organic functional layer includes a third groove and a third dam, the third groove being located on a side of the third dam away from the opening region, the third groove penetrating the second organic functional layer, an orthogonal projection of the third dam onto the first flexible base being located within a range of an orthogonal projection of the second dam onto the first flexible base, and an orthogonal projection of the second passivation layer onto the first flexible base covering the orthogonal projection of the third dam onto the first flexible base; 8. The display substrate according to claim 7.

9. a light-emitting material layer provided on a side of the at least one isolation groove away from the first flexible base, the light-emitting material layer being discontinuous within each isolation groove; 9. The display substrate according to claim 1, wherein the first and second electrodes are electrically connected to each other.

10. a packaging layer provided on a side of the light-emitting material layer away from the first flexible base, the packaging layer being continuous within each of the isolation grooves; 10. The display substrate according to claim 9.

11. The packaging layer comprises: a first inorganic packaging film layer provided on a side of the light emitting material layer away from the first flexible base, the orthogonal projection of the first flexible base covering the opening region and the isolation region; a first organic packaging film layer provided on a side of the first inorganic packaging film layer away from the first flexible base, the orthogonal projection of the first organic packaging film layer onto the first flexible base not overlapping the opening region and the isolation region; a second inorganic packaging film layer disposed on a side of the first organic packaging film layer away from the first flexible base, the second inorganic packaging film layer being orthogonally projected onto the first flexible base to cover the opening region and the isolation region; Including, The display substrate according to claim 10 .

12. The packaging layer comprises: a third inorganic packaging film layer provided on a side of the light emitting material layer away from the first flexible base, the third inorganic packaging film layer being orthogonally projected onto the first flexible base to cover the opening region and the isolation region; a second organic packaging film layer provided on a side of the third inorganic packaging film layer away from the first flexible base, the second organic packaging film layer having an orthogonal projection onto the first flexible base that does not overlap the opening region; Including, The display substrate according to claim 10 .

13. 13. The display substrate of claim 10, wherein the thickness of the organic film layer is equal to or greater than the thickness of the packaging layer and is equal to or less than five times the thickness of the packaging layer.

14. 14. The display substrate according to claim 10, wherein the thickness of the packaging layer is 0.5 microns or more and 3 microns or less.

15. 15. The display substrate according to claim 1, wherein each of the isolating grooves has a closed structure surrounding the opening region.

16. 16. The display substrate according to claim 1, wherein the first end surface is aligned with the third end surface.

17. 17. A display substrate according to claim 1, wherein the first flexible base has a fourth end face facing the opening region, the fourth end face being recessed relative to the first end face in a direction away from the opening region.

18. 18. The display substrate according to claim 1, wherein the recess amount of the second end face relative to the first end face and the third end face is 0.1 microns or more and 5.0 microns or less.

19. A display device comprising a display substrate described in any one of claims 1 to 18.

20. A method for manufacturing a display substrate, The display substrate includes an opening region and an isolation region provided so as to surround the opening region, and a manufacturing method of the isolation region includes: Providing a first flexible base; At least one isolation groove is formed on one side of the first flexible base, and each isolation groove is made of a first inorganic film layer, an organic film layer, and a second inorganic film layer that are stacked one on top of the other; Including, the first inorganic film layer is provided close to the first flexible base, the first inorganic film layer having a first end face facing the opening region, the organic film layer is provided on a side of the first inorganic film layer away from the first flexible base, the organic film layer having a second end face facing the opening region, the second inorganic film layer is provided on a side of the organic film layer away from the first flexible base, the second inorganic film layer has a third end face facing the opening region, the second end face being recessed in a direction away from the opening region relative to the first end face and the third end face, and the opposing surfaces of the first inorganic film layer and the second inorganic film layer and the second end face form the isolation groove, the at least one isolation groove includes a second isolation groove, and an organic film layer constituting the second isolation groove is a first organic functional layer, the first organic functional layer including at least one of a planar layer, a pixel definition layer provided on a side of the planar layer remote from the first flexible base, and a support layer provided on a side of the pixel definition layer remote from the first flexible base; A method for manufacturing a display substrate comprising the steps of:

21. After the step of forming at least one isolation groove on one side of the first flexible base, forming a light emitting material layer on a side of the at least one isolation groove away from the first flexible base, the light emitting material layer being discontinuous within each isolation groove; forming a packaging layer on the light emitting material layer on a side away from the first flexible base, the packaging layer being continuous within each of the isolation grooves; further comprising:

21. The method of claim 20.

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