Laminated materials

Abstract

The present invention relates to a multilayer member which comprises a glass member that has a linear transmittance of 80% or more at a wavelength of 850 nm, a bonding layer that is arranged on the glass member, while containing a resin, and an Si-SiC member that is arranged on the bonding layer. With respect to this multilayer member, the average linear expansion coefficient α of the Si-SiC member over the range of from 20°C to 200°C is from 2.85 ppm / °C to 4.00 ppm / °C.

Description

[Technical Field]

[0001] The present invention relates to a laminated member. [Background technology]

[0002] In a system kitchen, the work table, cooking appliances, etc. are connected by a worktop. Materials for the worktop include stainless steel, artificial marble, and ceramics.

[0003] The cooking device is installed in an opening provided in the worktop. The cooking device has a top plate on which an object to be heated (such as a pot) is placed. Materials for the top plate include crystallized glass (see Patent Document 1), ceramics, etc. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2012-148958 Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, there has been a demand for the worktop and the top plate to be made of the same material in terms of design of system kitchens, and therefore, the application of the heating element used in the top plate of a cooking appliance to the worktop has been considered.

[0006] The heating element used in the top plate is required to have excellent temperature rise properties and impact resistance. The inventors evaluated a laminated member having a glass member, a resin bonding layer, and a Si-SiC member as the heating element and found that although the heating element had excellent temperature rise properties and impact resistance, there was room for improvement in thermal shock resistance.

[0007] Therefore, an object of the present invention is to provide a laminated member that is excellent in temperature rise resistance, impact resistance, and thermal shock resistance. [Means for solving the problem]

[0008] As a result of intensive research into the above-mentioned problems, the inventors discovered that a laminated member having a glass member with a predetermined linear transmittance, a bonding layer containing a resin, and a Si-SiC member, wherein the average linear expansion coefficient α of the Si-SiC member is within a predetermined range, has excellent temperature rise properties, impact resistance, and thermal shock resistance, and thus arrived at the present invention.

[0009] That is, the inventors have found that the above problems can be solved by the following configuration. [1] A glass member having an in-line transmittance of 80% or more at a wavelength of 850 nm; a bonding layer containing a resin on the glass member; a Si—SiC member on the bonding layer, The Si-SiC member has an average linear expansion coefficient α of 2.85 to 4.00 ppm / °C at 20 to 200°C. [2] The laminated member according to [1], wherein the glass member has an average linear expansion coefficient β of 1.50 to 5.00 ppm / °C at 20 to 200°C. [3] The glass member contains, in terms of mole percentages on an oxide basis, 55.0 to 85.0 mol% of SiO2, 1.5 to 14.5 mol% of Al2O3, 3.0 to 14.0 mol% of B2O3, and 0 to 3.5 mol% of P2O5, The laminated member according to [1] or [2], wherein the total content of the SiO2, Al2O3, B2O3, and P2O5 in the glass member is 70.0 to 97.0% in terms of mole percentage based on oxides. [4] The laminated member according to [3], wherein the content of the B2O3 contained in the glass member is 8.5 mol % or less. [5] The laminated member according to any one of [1] to [4], wherein the glass member contains 0 to 13.0 mol % of Na2O in terms of mole percentage based on oxides. [6] The laminated member according to any one of [1] to [5], wherein the glass member contains, in terms of oxide-based mole percentage, 0.0001 to 0.0115 mole % of Fe2O3. [7] The laminated member according to any one of [1] to [6], wherein the glass member has an in-line transmittance of 90% or more at a wavelength of 850 nm. [8] The thickness of the glass member is 2 to 40 mm; The laminated member according to any one of [1] to [7], wherein the Si—SiC member has a thickness of 0.5 to 15 mm. [9] The laminated member according to any one of [1] to [8], wherein the Si—SiC member has a thermal conductivity of 190 to 300 W / m·K at 20° C.

[10] A laminated member according to any one of [1] to [9], wherein the absolute value |α-β| obtained by subtracting the average linear expansion coefficient α of the Si-SiC member at 20 to 200°C from the average linear expansion coefficient β of the glass member at 20 to 200°C is 2.00 ppm / °C or less.

[11] The laminated member according to any one of [1] to

[10] , wherein the Si—SiC member has a Young's modulus of 300 to 420 GPa.

[12] The laminate member according to any one of [1] to

[11] , wherein the Si—SiC member has a metal Si content of 8 to 60 mass %.

[13] The laminated member according to any one of [1] to

[12] , wherein the resin has a heat resistance temperature of 120 to 300°C.

[14] The laminated member according to any one of [1] to

[13] , wherein the bonding layer has an average linear expansion coefficient γ at 20 to 200°C of 2 to 200 ppm / °C.

[15] Density: 2.40-2.85g / cm 3 The laminated member according to any one of [1] to

[14] , wherein

[16] The laminated member according to any one of [1] to

[15] , wherein the amount of warpage is 0.25 mm or less.

[17] A second bonding layer provided on the Si-SiC member; The laminated member according to any one of [1] to

[16] , further comprising a second Si—SiC member bonded to the Si—SiC member via the second bonding layer. [Effects of the Invention]

[0010] According to the present invention, a laminated member having excellent temperature rise resistance, impact resistance, and thermal shock resistance can be provided. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a cross-sectional view schematically showing a laminated member according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0012] The terms used in the present invention have the following meanings. A numerical range expressed using "to" means a range that includes the numerical values ​​before and after "to" as the lower and upper limits.

[0013] [Laminated member] The laminated member of the present disclosure comprises a glass member having an in-line transmittance of 80% or more at a wavelength of 850 nm, a bonding layer containing a resin on the glass member, and a Si-SiC member on the bonding layer, wherein the Si-SiC member has an average linear expansion coefficient α of 2.85 to 4.00 ppm / °C at 20 to 200°C.

[0014] The laminated member of the present disclosure has excellent temperature rise properties, impact resistance, and thermal shock resistance. Although the details of the reasons for this are not yet clear, it is presumed that the following reasons are generally involved.

[0015] That is, it is presumed that by using glass members with an in-line transmittance of 80% or more at a wavelength of 850 nm, sufficient infrared light for heating was transmitted, causing the temperature of the laminated members to rise rapidly.

[0016] It is also presumed that the inclusion of a resin-containing bonding layer allows the bonding layer to function as a buffer material, improving impact resistance.

[0017] Furthermore, since the average linear expansion coefficient α of the Si-SiC member is within the above range, the difference in expansion coefficient with the resin-containing bonding layer is small, which reduces the generated stress and is presumably responsible for improved thermal shock resistance.

[0018] Hereinafter, a laminated member according to one embodiment of the present invention will be described with reference to the drawings.

[0019] 1 is a cross-sectional view schematically illustrating a laminated member according to one embodiment of the present invention. The laminated member 100 includes a glass member 101, a bonding layer 103 disposed on the glass member 101, and a Si—SiC member 105 disposed on the bonding layer 103. The laminated member 100 has a layered structure in which the glass member 101, the bonding layer 103, and the Si—SiC member 105 are laminated in this order.

[0020] [Si-SiC materials] In one embodiment of the present invention, the Si—SiC member refers to a sintered member made of a composite material containing silicon carbide (SiC) and silicon (Si) (metallic Si).

[0021] The Si-SiC member 105 is preferably a ceramic containing 40 to 92 mass% SiC and 8 to 60 mass% Si, more preferably 50 to 87 mass% SiC and 13 to 50 mass% Si, even more preferably 55 to 82 mass% SiC and 18 to 45 mass% Si, particularly preferably 60 to 77 mass% SiC and 23 to 40 mass% Si, and most preferably 65 to 72 mass% SiC and 28 to 35 mass% Si, based on the total mass of the Si-SiC member.

[0022] If the Si-SiC member 105 has Si and SiC contents within the above ranges, the Si-SiC member 105 has an excellent balance between thermal properties and mechanical properties.

[0023] The composition of the Si-SiC member 105 is not particularly limited as long as it contains SiC and Si, and may contain components derived from sintering aids, trace amounts of impurities (Fe, etc.), etc. The sintering aid is not particularly limited, but examples thereof include BeO, BC, BN, Al, and AlN.

[0024] The thickness of Si—SiC member 105 is preferably 0.5 to 15 mm, more preferably 1.5 mm or more, further preferably 2.0 mm or more, and particularly preferably 2.5 mm or more.

[0025] The thickness of Si—SiC member 105 is more preferably 10.0 mm or less, further preferably 7.5 mm or less, and particularly preferably 5.5 mm or less.

[0026] Si—SiC member 105 can be made thin by being supported by glass member 101. Because Si—SiC member 105 can be made thin, rapid temperature increase and decrease becomes possible.

[0027] The thickness of the Si—SiC member 105 can be measured using, for example, a vernier caliper or a digital tape measure.

[0028] The average linear expansion coefficient α of the Si—SiC member 105 at 20 to 200° C. is 2.85 to 4.00 ppm / ° C. Hereinafter, the average linear expansion coefficient α of the Si—SiC member 105 at 20 to 200° C. will also be simply referred to as the average linear expansion coefficient α.

[0029] The average linear expansion coefficient α is preferably 2.90 ppm / °C or more, more preferably 2.95 ppm / °C or more, and particularly preferably 3.00 ppm / °C or more.

[0030] The average linear expansion coefficient α is preferably 3.40 ppm / °C or less, more preferably 3.20 ppm / °C or less, and particularly preferably 3.10 ppm / °C or less.

[0031] If the average linear expansion coefficient α of the Si-SiC member 105 is within the above range, it is easy to match the average linear expansion coefficients of the Si-SiC member 105 and the glass member 101. Furthermore, since the thermal conductivity and strength of the Si-SiC member 105 can be increased, the temperature rise rate can be increased and impact resistance can also be improved.

[0032] In particular, if the average linear expansion coefficient α is 3.00 to 3.10 ppm / °C, the Si-SiC member will have a better balance between thermal conductivity and strength.

[0033] The average linear expansion coefficient α can be measured using a dilatometer or a thermomechanical analyzer (TMA) in a temperature range of 20°C to 200°C.

[0034] One method for adjusting the average linear expansion coefficient α of the Si—SiC member 105 to fall within the above range is to adjust the contents of SiC and Si to fall within the above range.

[0035] The thermal conductivity of the Si-SiC member 105 at 20° C. is preferably 130 to 300 W / m·K.

[0036] The thermal conductivity of the Si-SiC member 105 at 20° C. is more preferably 190 W / m·K or more, further preferably 210 W / m·K or more, and particularly preferably 225 W / m·K or more.

[0037] The thermal conductivity of the Si-SiC member 105 at 20° C. is more preferably 270 W / m·K or less, further preferably 260 W / m·K or less, and particularly preferably 250 W / m·K or less.

[0038] If the thermal conductivity of the Si-SiC member 105 is within the above range, the heating member will have improved thermal uniformity. Furthermore, if the thermal conductivity of the Si-SiC member 105 is within the above range, it will be possible to prevent a decrease in yield due to variations in thermal conductivity during the manufacture of the Si-SiC member 105, and it will be easier to stabilize the quality of the Si-SiC member 105.

[0039] The thermal conductivity can be measured by a laser flash method.

[0040] One method for adjusting the thermal conductivity of the Si—SiC member 105 to fall within the above range is to adjust the content of SiC and Si to fall within the above range.

[0041] The Young's modulus of the Si—SiC member 105 is preferably 300 to 420 GPa, more preferably 320 GPa or more, further preferably 350 GPa or more, and particularly preferably 370 GPa or more.

[0042] The Young's modulus of the Si—SiC member 105 is more preferably 410 GPa or less, further preferably 400 GPa or less, and particularly preferably 390 GPa or less.

[0043] The lower the Young's modulus, the higher the thermal shock resistance. The Si-SiC member 105 is preferable because its Young's modulus satisfies the above range, thereby improving its thermal shock resistance. Furthermore, the Si-SiC member 105 has a lower Young's modulus than other silicon carbide ceramics, and is therefore preferable because it has high thermal shock resistance.

[0044] The Young's modulus can be measured at 20° C. by the elastic modulus test method (ultrasonic pulse method: dynamic elastic modulus) described in the Japanese Industrial Standards (JIS R1602:1995).

[0045] One method for adjusting the Young's modulus of the Si—SiC member 105 to fall within the above range is to adjust the content of SiC and Si to fall within the above range.

[0046] The bending strength of the Si—SiC member 105 is preferably 130 to 300 MPa, more preferably 200 MPa or more, further preferably 220 MPa or more, and particularly preferably 230 MPa or more.

[0047] The bending strength of Si—SiC member 105 is more preferably 260 MPa or less, further preferably 250 MPa or less, and particularly preferably 240 MPa or less.

[0048] When the bending strength of the Si-SiC member 105 satisfies the above range, cracking of the Si-SiC member 105 and therefore the laminated member 100 due to a falling object can be prevented, and impact resistance can be improved.

[0049] The bending strength can be measured at 20°C by the bending strength test method (four-point bending strength) described in the Japanese Industrial Standards (JIS R1601:2008).

[0050] The Vickers hardness (Hv) of the Si—SiC member 105 is preferably 20 to 27 GPa.

[0051] The Vickers hardness is more preferably 21 GPa or more, further preferably 22 GPa or more, and particularly preferably 23 GPa or more.

[0052] The Vickers hardness is more preferably 26 GPa or less, further preferably 25 GPa or less, and particularly preferably 24 GPa or less.

[0053] When the Vickers hardness of the Si—SiC member 105 satisfies the above range, the scratch resistance of the Si—SiC member 105 and therefore the laminated member 100 is improved.

[0054] Vickers hardness can be measured at 20°C using a Vickers hardness tester system.

[0055] [Glass components] There are no particular limitations on the glass composition of the glass member 101. Examples of glass member 101 include soda-lime glass, borosilicate glass, aluminosilicate glass, and alkali-free glass. Furthermore, the glass member 101 may be chemically strengthened glass (chemically strengthened glass), physically strengthened glass by air cooling or the like (physically strengthened glass), or glass that has been subjected to a crystallization process (crystallized glass).

[0056] A description will be given of a preferred glass composition of the glass member 101. In this specification, the glass composition (content of the target component of the glass member) is expressed in mole percentage (mol %) based on oxides.

[0057] The glass member 101 contains SiO2, which is the main component of glass.

[0058] In order to improve the weather resistance of the glass, the SiO2 content is preferably 55.0 mol % or more, more preferably 57.0 mol % or more, even more preferably 60.0 mol % or more, and particularly preferably 62.0 mol % or more.

[0059] The SiO2 content is preferably 85.0 mol % or less, more preferably 83.0 mol % or less, even more preferably 80.0 mol % or less, and particularly preferably 78.0 mol % or less, in order to lower the melting temperature of the glass and improve manufacturability.

[0060] Glass member 101 may or may not contain Al2O3, but it is preferable that it contains Al2O3 because it is useful for increasing the weather resistance of the glass and lowering the linear expansion coefficient.

[0061] The Al2O3 content is preferably 1.5 mol % or more, more preferably 3.0 mol % or more, even more preferably 5.0 mol % or more, and particularly preferably 8.0 mol % or more, in order to increase the Young's modulus of the glass.

[0062] The Al2O3 content is preferably 14.5 mol% or less from the viewpoint of increasing the acid resistance of the glass, and more preferably 14.0 mol% or less, even more preferably 13.5 mol% or less, and particularly preferably 13.0 mol% or less from the viewpoint of suppressing devitrification of the glass (enabling the devitrification temperature to be lowered) and suppressing an increase in the melting temperature of the glass to improve clarification.

[0063] Glass member 101 may or may not contain B2O3, but preferably contains B2O3 because it is useful for adjusting the linear expansion coefficient of the glass.

[0064] The content of B2O3 is preferably 3.0 mol % or more, more preferably 4.0 mol % or more, even more preferably 4.5 mol % or more, and particularly preferably 5.0 mol % or more, in order to suppress the linear expansion coefficient of the glass.

[0065] The B2O3 content is preferably 14.0 mol% or less from the viewpoint of improving the weather resistance of the glass, and is preferably 11.5 mol% or less, more preferably 10.0 mol% or less, even more preferably 8.5 mol% or less, and particularly preferably 7.5 mol% or less from the viewpoint of increasing the Young's modulus of the glass.

[0066] Glass member 101 may or may not contain RO. RO refers to at least one of MgO, CaO, SrO, and BaO. The RO content represents the total amount of MgO, CaO, SrO, and BaO.

[0067] The content of RO is preferably 2.0 mol% or more, more preferably 3.0 mol% or more, even more preferably 4.0 mol% or more, and particularly preferably 5.0 mol% or more, from the viewpoints of lowering the melting temperature of the glass to enhance the solubility and controlling the linear expansion coefficient.

[0068] From the viewpoints of lowering the devitrification temperature of the glass to improve manufacturability and controlling the linear expansion coefficient, the content of RO is preferably 25.0 mol% or less, more preferably 20.0 mol% or less, even more preferably 16.0 mol% or less, and particularly preferably 15.0 mol% or less.

[0069] MgO may be contained in order to lower the melting temperature of the glass to increase the meltability and to control the linear expansion coefficient.

[0070] The content of MgO is preferably 1.0 mol % or more, more preferably 2.0 mol % or more, even more preferably 2.5 mol % or more, and particularly preferably 3.0 mol % or more.

[0071] The content of MgO is preferably 15.0 mol% or less, more preferably 12.0 mol% or less, even more preferably 10.0 mol% or less, and particularly preferably 9.0 mol% or less, from the viewpoints of lowering the devitrification temperature of the glass to improve manufacturability and controlling the linear expansion coefficient.

[0072] CaO may be contained in order to lower the melting temperature of the glass to increase the meltability and to control the linear expansion coefficient.

[0073] The CaO content is preferably 0.5 mol % or more, and more preferably 1.0 mol % or more.

[0074] The CaO content is preferably 10.0 mol % or less, and more preferably 8.0 mol % or less.

[0075] SrO may be contained to lower the melting temperature of the glass to increase the meltability and to control the linear expansion coefficient.

[0076] The SrO content is preferably 0 mol % or more, more preferably 0.01 mol % or more, and even more preferably 0.1 mol % or more.

[0077] The SrO content is preferably 5.0 mol % or less, more preferably 3.0 mol % or less, and even more preferably 2.0 mol % or less.

[0078] BaO may be contained to lower the melting temperature of the glass to increase productivity and to control the linear expansion coefficient.

[0079] The BaO content is preferably 0 mol % or more, and more preferably 0.01 mol % or more.

[0080] The BaO content is preferably 3.0 mol % or less, and more preferably 2.0 mol % or less.

[0081] Even if BaO is not intentionally added, it may be mixed in as an impurity from raw materials such as limestone, dolomite, and strontium carbonate, or from the manufacturing process.

[0082] Glass member 101 may or may not contain R2O. R2O refers to at least one of Li2O, Na2O, and K2O. The R2O content represents the total amount of Li2O, Na2O, and K2O.

[0083] R2O is a component that promotes the melting of glass raw materials and is useful for adjusting the linear expansion coefficient, melting temperature, and the like.

[0084] In order to satisfactorily exert the above effects, the content of R2O is preferably 0 mol % or more, and more preferably 0.01 mol % or more.

[0085] The content of R2O is preferably 15.0 mol% or less, more preferably 10.0 mol% or less, still more preferably 6.0 mol% or less, and particularly preferably 5.0 mol% or less, from the viewpoint of reducing the linear expansion coefficient of the glass and reducing stress generated during temperature changes.

[0086] When Li2O is not contained, the total amount of R2O, that is, Na2O and K2O, is preferably 0 mol % or more, and more preferably 0.01 mol % or more.

[0087] When Li2O is not contained, the total amount of R2O, i.e., Na2O and K2O, is preferably 13.0 mol% or less, more preferably 10.0 mol% or less, even more preferably 5.0 mol% or less, and particularly preferably 3.0 mol% or less, in order to reduce the linear expansion coefficient.

[0088] Li2O is a component that promotes the melting of glass raw materials and is useful for adjusting the linear expansion coefficient, melting temperature, and the like.

[0089] The content of Li2O is preferably 0 mol % or more, and more preferably 0.01 mol % or more.

[0090] The content of Li2O is preferably 10.0 mol% or less, more preferably 7.0 mol% or less, and even more preferably 5.0 mol% or less, from the viewpoint of reducing the linear expansion coefficient of the glass and reducing stress generated during temperature changes.

[0091] Na2O is a component that promotes the melting of glass raw materials and is useful for adjusting the linear expansion coefficient, melting temperature, and the like.

[0092] The content of Na2O is preferably 0 to 13.0 mol %. The Na2O content is more preferably 0.01 mol % or more. The Na2O content is more preferably 10.0 mol % or less, further preferably 5.0 mol % or less, and particularly preferably 3.0 mol % or less. If the Na2O content is 13.0 mol % or less, the linear expansion coefficient of the glass can be reduced, and the stress generated during temperature changes can be reduced.

[0093] K2O is a component that promotes the melting of glass raw materials and is useful for adjusting the linear expansion coefficient, melting temperature, and the like.

[0094] The content of K2O is preferably 0 mol % or more, and more preferably 0.01 mol % or more.

[0095] The content of K2O is preferably 3.0 mol% or less, more preferably 1.0 mol% or less, and even more preferably 0.1 mol% or less, from the viewpoint of reducing the linear expansion coefficient of the glass and reducing the stress generated when exposed to high temperatures.

[0096] Glass member 101 may or may not contain ZrO2. When ZrO2 is contained, the chemical resistance of the glass can be improved.

[0097] The content of ZrO2 is preferably 0 mol % or more, more preferably 0.01 mol % or more, and even more preferably 0.1 mol % or more, in order to satisfactorily exert the above effects.

[0098] The content of ZrO2 is preferably 5.0 mol % or less, more preferably 3.0 mol % or less, and even more preferably 2.0 mol % or less, from the viewpoint of lowering the devitrification temperature of the glass and increasing productivity.

[0099] Glass member 101 may or may not contain P2O5. When P2O5 is contained, crystallization of the glass can be suppressed and the glass can be stabilized.

[0100] The content of P2O5 is preferably 0 mol% or more, more preferably 0.05 mol% or more, and even more preferably 0.1 mol% or more, in order to satisfactorily exert the above-mentioned effects.

[0101] The P2O5 content is preferably 3.5 mol % or less, more preferably 3.0 mol % or less, and even more preferably 2.0 mol % or less, from the viewpoints of being able to stabilize the glass without making the melting temperature of the glass too high and being able to suppress phase separation of the glass and improve transparency.

[0102] Glass member 101 may or may not contain Fe2O3. The inclusion of Fe2O3 improves the clarity of the glass without impairing the color of the glass, and allows for temperature control of the bottom substrate of the melting furnace. Furthermore, it becomes easier to adjust the linear transmittance of glass member 101 at a wavelength of 850 nm to within the range described below, allowing for the production of a stable product.

[0103] The content of Fe2O3 is preferably 0.0001 mol % or more, more preferably 0.0005 mol % or more, and even more preferably 0.0010 mol % or more, in order to satisfactorily exert the above effects.

[0104] In order to maintain the color of the glass, the content of Fe2O3 is preferably 0.0115 mol % or less, more preferably 0.0100 mol % or less, even more preferably 0.0080 mol % or less, and particularly preferably 0.0050 mol % or less.

[0105] Glass member 101 may or may not contain ZnO. The ZnO content is preferably 0 mol % or more, more preferably 0.01 mol % or more, even more preferably 0.1 mol % or more, and particularly preferably 0.5 mol % or more.

[0106] The ZnO content is preferably 15.0 mol % or less, more preferably 12.0 mol % or less, even more preferably 10.0 mol % or less, and particularly preferably 8.0 mol % or less, from the viewpoint of lowering the devitrification temperature of the glass and increasing productivity.

[0107] Glass member 101 may contain other components (for example, TiO2, Y2O3, Gd2O3, etc.) in addition to the above, as long as the effects of the present invention are not impaired. The total content of other components is preferably 10.0 mol % or less.

[0108] The glass member 101 may contain, as appropriate, sulfates, chlorides, fluorides, halides, hydroxides, SnO2, Sb2O3, As2O3, or the like as a fining agent when the glass is melted.

[0109] Furthermore, in order to adjust the color tone, coloring components such as Ni, Co, Cr, Mn, V, Se, Au, Ag, and Cd may be contained.

[0110] Furthermore, when it is desired to positively color the material, a coloring component such as Fe, Ni, Co, Cr, Mn, V, Se, Au, Ag, or Cd may be contained in an amount of 0.0001 mol % or more.

[0111] When at least one selected from the group consisting of sulfates, chlorides, fluorides, halides, hydroxides, SnO2, Sb2O3, and As2O3 is contained among the other components, the total content of the components from this group is preferably 0.01 mol% or more, more preferably 0.02 mol% or more, and even more preferably 0.05 mol% or more, from the viewpoint of clarity.

[0112] The total content of these elements is preferably 5.0 mol % or less, more preferably 2.0 mol % or less, and even more preferably 1.0 mol % or less, in order not to affect the glass properties.

[0113] SiO2, Al2O3, B2O3 and P2O5 are network formers of glass.

[0114] The total content of SiO2, Al2O3, B2O3 and P2O5 in the glass member 101 is preferably 70.0 mol% or more, more preferably 75.0 mol% or more, even more preferably 78.0 mol% or more, and particularly preferably 80.0 mol% or more, in order to enhance the stability and chemical durability of the glass structure.

[0115] The total content of SiO2, Al2O3, B2O3 and P2O5 is preferably 97.0 mol% or less, more preferably 95.0 mol% or less, even more preferably 93.0 mol% or less, and particularly preferably 90.0 mol% or less, from the viewpoint of suppressing an increase in the melting temperature of the glass and improving the clarity.

[0116] A preferred embodiment of the glass composition of glass member 101 is 55.0 to 85.0 mol% SiO2, 1.5 to 14.5 mol% Al2O3, 3.0 to 14.0 mol% B2O3, 0 to 3.5 mol% P2O5, and 70.0 to 97.0% SiO2 + Al2O3 + B2O3 + P2O5, where the total content of SiO2, Al2O3, B2O3, and P2O5 in glass member 101 is 70.0 to 97.0% expressed as a molar percentage on an oxide basis, which provides better glass properties.

[0117] There are no particular limitations on the thickness of glass member 101, as long as it is thick enough to support Si—SiC member 105. Specifically, the thickness of glass member 101 is preferably 2 to 40 mm.

[0118] The thickness of glass member 101 is more preferably 3 mm or more, further preferably 5 mm or more, particularly preferably 10 mm or more, and most preferably 15 mm or more.

[0119] The thickness of glass member 101 is more preferably 35 mm or less, further preferably 30 mm or less, and particularly preferably 25 mm or less.

[0120] If the thickness of the glass member 101 is within the above range, it can maintain sufficient strength as a supporting member.

[0121] The thickness of the glass member 101 can be measured using, for example, a vernier caliper or a digital tape measure.

[0122] The average linear expansion coefficient β of the glass member 101 at 20 to 200° C. is preferably 1.50 to 5.00 ppm / ° C. Hereinafter, the average linear expansion coefficient β of the glass member 101 at 20 to 200° C. will also be simply referred to as the average linear expansion coefficient β.

[0123] The average linear expansion coefficient β is more preferably 2.00 ppm / °C or more, further preferably 2.50 ppm / °C or more, and particularly preferably 2.60 ppm / °C or more.

[0124] The average linear expansion coefficient β is more preferably 4.50 ppm / °C or less, further preferably 4.00 ppm / °C or less, and particularly preferably 3.50 ppm / °C or less.

[0125] If the average linear expansion coefficient β of the glass member 101 is within the above range, the average linear expansion coefficients of the glass member 101 and the Si—SiC member 105 can be easily matched.

[0126] The average linear expansion coefficient β can be measured using a dilatometer or a thermomechanical analyzer (TMA) in a temperature range of 20°C to 200°C.

[0127] The absolute value |α-β| of the value obtained by subtracting the average linear expansion coefficient β of the glass member 101 from the average linear expansion coefficient α of the Si-SiC member 105 is preferably 2.00 ppm / °C or less. The absolute value |α-β| is more preferably 1.00 ppm / °C or less, further preferably 0.50 ppm / °C or less, and particularly preferably 0.30 ppm / °C or less.

[0128] By setting the absolute value |α−β| to the above-mentioned value or less, warping of the resulting laminated member 100 can be prevented.

[0129] The linear transmittance of the glass member 101 at a wavelength of 850 nm is 80% or more, preferably 85% or more, more preferably 90% or more, and even more preferably 92% or more. If the linear transmittance of the glass member 101 at a wavelength of 850 nm is 80% or more, the amount of infrared light transmitted can be sufficient for heating. The upper limit of the linear transmittance of the glass member 101 is 100%.

[0130] The linear transmittance is the transmittance of light that is transmitted linearly through the glass member 101 in its thickness direction, with the incident angle of the incident light being 0°, and can be measured at 20° C. using a spectrophotometer.

[0131] Methods for adjusting the linear transmittance of glass member 101 to fall within the above range include adjusting the Fe2O3 content in glass member 101 to fall within the above range, and depositing an anti-reflection film to suppress surface reflection of glass member 101. As a method for depositing an anti-reflection film, commonly known techniques can be used, such as wet coating using spray coating, spin coating, flow coating, or the like, or dry coating using sputtering, vapor deposition, or the like.

[0132] The Young's modulus of the glass member 101 is preferably 40 to 120 GPa.

[0133] The Young's modulus of the glass member 101 is more preferably 45 GPa or more, further preferably 50 GPa or more, and particularly preferably 65 GPa or more.

[0134] The Young's modulus of the glass member 101 is more preferably 100 GPa or less, further preferably 95 GPa or less, and particularly preferably 90 GPa or less.

[0135] If the Young's modulus of the glass member 101 is within the above range, it will maintain sufficient strength as a supporting member and the amount of warping can be reduced.

[0136] The Young's modulus of the glass member 101 can be measured at 20° C. by the ultrasonic pulse method described in the Japanese Industrial Standards (JIS R1602:1995).

[0137] The melting temperature of the glass member 101 is preferably 1000 to 2000°C.

[0138] The melting temperature of the glass member 101 is more preferably 1300° C. or higher, further preferably 1400° C. or higher, and particularly preferably 1500° C. or higher.

[0139] The melting temperature of the glass member 101 is more preferably 1900° C. or lower, further preferably 1800° C. or lower, and particularly preferably 1700° C. or lower.

[0140] If the melting temperature of the glass member 101 is within the above range, the clarity of the glass and the meltability of the raw materials are excellent, and defects in the glass can be suppressed.

[0141] The melting temperature of the glass member 101 was measured by measuring the viscosity using a rotational viscometer. 2 The temperature T2 (°C) at which the viscosity becomes dPa·s is shown.

[0142] The devitrification temperature of the glass member 101 is preferably 800 to 1600°C.

[0143] The devitrification temperature of the glass member 101 is more preferably 900°C or higher, further preferably 1000°C or higher, and particularly preferably 1100°C or higher.

[0144] The devitrification temperature of the glass member 101 is more preferably 1500°C or lower, further preferably 1400°C or lower, and particularly preferably 1350°C or lower.

[0145] If the devitrification temperature of glass member 101 is within the above range, defects that occur during glass production are reduced.

[0146] The devitrification temperature of the glass member 101 is the maximum temperature at which no crystals precipitate on the surface or inside of the glass when crushed glass particles are placed in a platinum dish and heat-treated for 17 hours in an electric furnace controlled at a constant temperature, as determined by observation with an optical microscope after the heat treatment.

[0147] [Joining layer] The bonding layer 103 is a member that bonds the glass member 101 and the Si—SiC member 105 together.

[0148] Examples of resins contained in the bonding layer 103 include epoxy resin, silicone resin, fluororesin, and polyimide resin. Epoxy resin, silicone resin, and fluororesin are preferred because they have better heat resistance. The resins may be used alone or in combination of two or more.

[0149] The resin content is preferably 40 to 100 mass % relative to the total mass of bonding layer 103, more preferably 50 to 90 mass %, and even more preferably 60 to 80 mass %.

[0150] If the resin content is within the above range, the adhesion between glass member 101 and Si--SiC member 105 via bonding layer 103 is superior, and the difference in expansion coefficient between them can be reduced.

[0151] The bonding layer 103 may or may not contain components other than resin (hereinafter also referred to as "other components") Specific examples of other components include a plasticizer and a filler.

[0152] When bonding layer 103 contains other components, the content of the other components is preferably 10 to 50 mass %, more preferably 20 to 40 mass %, and even more preferably 25 to 35 mass %, relative to the total mass of bonding layer 103. If the content of the other components is 40 mass % or less, the adhesion between glass member 101 and Si—SiC member 105 via bonding layer 103 is better.

[0153] The bonding layer 103 can be produced using, for example, a heating press. A resin film constituting the bonding layer 103 is sandwiched between the glass member 101 and the Si-SiC member 105 (this configuration is called a temporary laminate). The temporary laminate is heated to a temperature equal to or higher than the softening point of the resin film, and pressure is applied to press the temporary laminate to bond the glass member 101 and the Si-SiC member 105. To prevent bubbles from being trapped during bonding, it is preferable to press the temporary laminate in a vacuum atmosphere.

[0154] To enhance the anchor effect, the contact surface of the glass member 101 with the resin film (bonding layer 103) and the contact surface of the Si-SiC member 105 with the resin film (bonding layer 103) may be appropriately roughened by blasting or the like.

[0155] The thickness of the bonding layer 103 is preferably 0.001 to 0.300 mm.

[0156] The thickness of the bonding layer 103 may be 0.005 mm or more, 0.008 mm or more, or 0.010 mm or more.

[0157] The thickness of the bonding layer 103 may be 0.150 mm or less, 0.050 mm or less, or 0.030 mm or less.

[0158] The thickness of the bonding layer 103 can be calculated using digital data of photographs taken by SEM cross-section observation and image processing software.

[0159] The linear transmittance of the bonding layer 103 at a wavelength of 850 nm is preferably 88% or more, more preferably 91% or more, even more preferably 93% or more, and particularly preferably 95% or more. If the linear transmittance of the bonding layer 103 is 88% or more, the amount of infrared light transmitted can be sufficient for heating. The upper limit of the in-line transmittance of the bonding layer 103 is 100%.

[0160] The linear transmittance is the transmittance of light that is transmitted linearly through the bonding layer 103 in its thickness direction when the incident angle of the incident light is 0°, and can be measured at 20° C. using a spectrophotometer.

[0161] The heat resistance temperature of the resin contained in the bonding layer 103 is preferably 120 to 420° C. In addition, from the viewpoint of stress relaxation during use at high temperatures, 120 to 300° C. is more preferable.

[0162] The heat resistance temperature of the resin contained in the bonding layer 103 is more preferably 140° C. or higher, particularly preferably 160° C. or higher, and most preferably 180° C. or higher.

[0163] The heat resistance temperature of the resin contained in bonding layer 103 may be 280° C. or lower, 260° C. or lower, or 240° C. or lower.

[0164] The heat resistance temperature of the resin contained in the bonding layer 103 is determined by thermogravimetry (TGA) performed in an air atmosphere, and is defined as the temperature at which the mass of the object to be measured decreases by 1% by mass.

[0165] The average linear expansion coefficient γ of the bonding layer 103 at 20 to 200° C. is preferably 2 to 200 ppm / ° C. Hereinafter, the average linear expansion coefficient γ of the bonding layer 103 at 20 to 200° C. will also be simply referred to as the average linear expansion coefficient γ.

[0166] The average linear expansion coefficient γ is more preferably 4 ppm / °C or more, further preferably 7 ppm / °C or more, and particularly preferably 10 ppm / °C or more.

[0167] The average linear expansion coefficient γ is more preferably 100 ppm / °C or less, further preferably 50 ppm / °C or less, particularly preferably 30 ppm / °C or less, and most preferably 20 ppm / °C or less.

[0168] If the average linear expansion coefficient γ of the bonding layer 103 is within the above range, the adhesion is excellent and the difference in expansion coefficient with the Si—SiC member can be reduced, so that the laminate member 100 has excellent thermal shock resistance.

[0169] The average linear expansion coefficient γ can be measured using a dilatometer or a thermomechanical analyzer (TMA) in a temperature range of 20°C to 200°C.

[0170] As a method for adjusting the average linear expansion coefficient γ of the bonding layer 103 to fall within the above range, there is a method in which the above-mentioned types of resin are used and a filler such as carbon or silica is blended therein.

[0171] When a resin film is used to prepare the bonding layer 103, the Young's modulus of the resin film is preferably 0.05 GPa or more, more preferably 0.10 GPa or more, and even more preferably 0.15 GPa or more, in order to increase the adhesion between the Si-SiC member 105 and the glass member 101 and maintain the shape of the entire member.

[0172] When a resin film is used to prepare the bonding layer 103, the Young's modulus of the resin film is preferably 3.5 GPa or less, more preferably 3.0 GPa or less, even more preferably 2.0 GPa or less, particularly preferably 1.0 GPa or less, and most preferably 0.5 GPa or less, in order to reduce the stress generated by the difference in expansion coefficient with the Si-SiC member.

[0173] The stress generated by the difference in expansion coefficient between the Si--SiC member and the resin layer increases as the Young's modulus of the resin layer increases, and decreases as the Young's modulus of the resin layer decreases.

[0174] The Young's modulus can be measured at 25° C. by the elastic modulus test method described in the Japanese Industrial Standards (JIS K7171).

[0175] [Physical properties of laminated materials] The amount of warpage of the laminated member 100 is preferably 0.25 mm or less, more preferably 0.20 mm or less, even more preferably 0.10 mm or less, and particularly preferably 0.05 mm or less.

[0176] If the amount of warping of the laminated member 100 is equal to or less than the above-mentioned value, stress concentration at a specific location can be prevented when stress is generated, thereby further improving impact resistance. Furthermore, when the laminated member 100 is installed in a kitchen, it is possible to avoid a situation in which the warping of the laminated member 100 distorts the surrounding area, causing reflections on the laminated member 100 and reducing the design quality. Furthermore, when a heated object is placed on the laminated member 100, it is possible to prevent the heated object from wobbling.

[0177] The lower limit of the warpage of the laminated member 100 is 0 mm.

[0178] The amount of warpage of the laminated member 100 can be measured by a non-contact three-dimensional shape measuring device.

[0179] Methods for keeping the amount of warping of the laminated member 100 within the above range include adjusting the thicknesses of the glass member 101, bonding layer 103, and Si-SiC member 105, and the types and contents of the components constituting each member (layer) as described above.

[0180] The density of the laminated member 100 is 2.40 to 2.85 g / cm 3 is preferred.

[0181] The density of the laminated member 100 is 2.45 g / cm 3 More preferably, 2.50 g / cm 3 More preferably, 2.55 g / cm 3 The above is particularly preferred.

[0182] The density of the laminated member 100 is 2.80 g / cm 3 Less than 2.75 g / cm is more preferable. 3 More preferably, 2.70 g / cm 3 The following are particularly preferred:

[0183] If the density is within the above range, workability is improved when the laminated member is incorporated into a housing as a heating member.

[0184] The density is a value obtained by dividing the total mass of the laminated member 100 by the total volume of the laminated member 100. The total mass of the laminated member 100 can be measured by a mass measuring device. The total volume of the laminated member 100 can be measured by a digital tape measure.

[0185] Methods for setting the density of the laminated member 100 within the above range include adjusting the thickness of the glass member 101, bonding layer 103, and Si-SiC member 105, and the types and contents of the components constituting each member (layer) as described above.

[0186] The area of ​​the top surface of the laminated member 100 on the Si-SiC member 105 side (the main surface of the laminated member 100 on the Si-SiC member 105 side) is 0.01 to 10 m 2 is preferred.

[0187] The area of ​​the top surface of the laminated member 100 is 0.07 m 2 More than 0.15m is preferable. 2 More preferably, 0.30m or more 2 More than 0.60m is particularly preferable. 2 The above is most preferable.

[0188] The area of ​​the top surface of the laminated member 100 is 8 m 2 Less than 4m is preferable 2 Less than 2m is more preferable 2 The following is particularly preferred: 1m 2 The following are most preferred:

[0189] If the area of ​​the top surface of the laminated member 100 is within the above range, workability is improved when incorporating it into a housing as a heating member.

[0190] The area of ​​the top surface is calculated by measuring the dimensions of the laminated member 100 with a digital tape measure.

[0191] [Method for manufacturing laminated member] An example of a method for manufacturing the laminated member 100 is a method in which a bonding layer 103 is placed between the glass member 101 and the Si-SiC member 105, and the glass member 101 and the Si-SiC member 105 are bonded together via the bonding layer 103.

[0192] A more detailed example of a method for manufacturing the laminated member 100 includes a method in which the glass member 101, the bonding layer 103, and the Si-SiC member 105 are laminated in this order, and then bonded together at a temperature of 150 to 380°C.

[0193] Other Aspects A laminated member of another embodiment (hereinafter also referred to as "another embodiment of the laminated member") that is an example of the laminated member of the present invention and differs from the above-described laminated member 100 will be described.

[0194] Another embodiment of the laminated member further includes a second bonding layer provided on the Si-SiC member 105, and a second Si-SiC member bonded to the Si-SiC member 105 via the second bonding layer. The second Si—SiC member is configured in the same manner as the above-described Si—SiC member 105, and therefore a description thereof will be omitted.

[0195] The stacked structure of the Si-SiC member 105 and the second Si-SiC member makes it easy to fabricate a stacked member with a complex shape. For example, to provide a space for inserting a temperature sensor in the stacked member, a groove can be formed in advance in one of the Si-SiC member 105 and the second Si-SiC member, and then the other member can be bonded together, making it easy to provide the space in the stacked member.

[0196] The method for bonding the Si-SiC member 105 and the second Si-SiC member with the second bonding layer is not particularly limited, but examples include bonding using a resin such as epoxy resin or fluororesin, bonding using a molten metal such as tin or indium, and bonding using glass frit. If the laminated member is to be used as a heating member, bonding using a metal is preferred from the standpoints of heat resistance and thermal conductivity.

[0197] In terms of heat resistance and thermal conductivity, glass frit has high heat resistance but low thermal conductivity, while resin has low heat resistance and thermal conductivity, so joining using a metal is preferred. Specific examples of metals include indium, tin, tin-based alloys, and lead-based alloys. Among them, tin metal and tin-based alloys are preferred in terms of thermal conductivity, heat resistance, and environmental impact.

[0198] An example of joining using molten metal will be described. The Si-SiC member 105 and the second Si-SiC member are heated to a desired temperature, for example, 250°C to 270°C. While applying ultrasonic waves to the joining surfaces of the heated Si-SiC member and the second Si-SiC member, metal that has been melted at a temperature close to the desired temperature (for example, 250°C to 270°C) is applied, and then the joining surfaces are overlapped.

[0199] Another embodiment of the laminated member may further include a third bonding layer provided on the second Si-SiC member and a third Si-SiC member bonded to the second Si-SiC member via the third bonding layer. The third bonding layer is configured similarly to the second bonding layer. The third Si-SiC member is configured similarly to the Si-SiC member 105. However, in terms of thickness, the laminated member of another embodiment preferably does not include the third bonding layer and the third ceramic member.

[0200] The laminated member of the present invention may have a configuration that allows the laminated member to be cooled rapidly.

[0201] For example, the laminated member 100 may have a flow path between at least one of the glass member 101 and the bonding layer 103 and the Si—SiC member 105 and the bonding layer 103. Alternatively, the laminated member 100 may be processed so that at least one of the glass member 101 and the Si—SiC member 105 has a flow path.

[0202] In addition, the stacked member of another embodiment may have a flow path in at least one of between glass member 101 and bonding layer 103, between Si-SiC member 105 and bonding layer 103, between Si-SiC member 105 and the second bonding layer, and between the second Si-SiC member and the second bonding layer. Alternatively, the stacked member of another embodiment may be processed so that at least one of glass member 101, Si-SiC member 105, and second Si-SiC member has a flow path. The laminated members can be cooled by passing water through the channels.

[0203] The laminated member of the present invention may be provided with an anti-reflection coating that increases transmittance and irradiation efficiency.

[0204] For example, the laminated member 100 may have an anti-reflection film on the main surface of the glass member 101 opposite to the bonding layer 103 side and / or on the main surface of the glass member 101 on the bonding layer 103 side.

[0205] Furthermore, in another embodiment of the stacked member, an anti-reflection film may be provided on the main surface of Si—SiC member 105 on the bonding layer 103 side or on the main surface of the second Si—SiC member on the second bonding layer side.

[0206] By providing an anti-reflection film on a surface that transmits infrared rays, it is possible to increase irradiation efficiency (heating efficiency).

[0207] The laminated member of the present invention may be equipped with a temperature sensor.

[0208] For example, the laminated member 100 may include a temperature sensor inside the Si—SiC member 105. Alternatively, the laminated member of another embodiment may include a temperature sensor inside the Si—SiC member 105 or inside the second Si—SiC member.

[0209] A specific example of a configuration with a temperature sensor is a configuration in which a temperature sensor is inserted into a hole drilled in the side of the Si-SiC member 105 or the second Si-SiC member. In this case, the temperature sensor is placed directly below the main surface of the Si-SiC member 105 opposite the bonding layer 103 side, or directly below the main surface of the second Si-SiC member opposite the second bonding layer. The temperature sensor is placed so as not to come into contact with the bonding layer 103 or the second bonding layer and so as not to be exposed. The temperature sensor can measure the main surface temperature of the Si-SiC member 105 opposite the bonding layer 103 side, or the main surface temperature of the second Si-SiC member opposite the second bonding layer.

[0210] The laminated member of the present invention can be suitably used as a heating member.The laminated member of the present invention can be suitably used as a heating member for, for example, a cooking device.

[0211] The laminated member of the present invention may also be used as a kitchen worktop (top plate).

[0212] The laminated member of the present invention may also function as both a top plate for a cooking appliance and a kitchen worktop. [Example]

[0213] Hereinafter, one embodiment of the present invention will be described with reference to examples, but the present invention is not limited to these examples.

[0214] [Glass components] The glasses prepared are shown in Table 1.

[0215] [Table 1]

[0216] [Glass production procedure] Glasses (iA) to (v) and (vii) to (xi) in Table 1 were prepared as follows, so as to achieve the glass compositions shown in Table 1, expressed in mole percentages based on oxides. Commonly used glass raw materials, such as oxides, hydroxides, carbonates, sulfates, halides, or nitrates, were appropriately selected and weighed out to yield 10,000 g of glass. The mixed raw materials were then placed in a platinum crucible and placed in a resistance-heated electric furnace at 1500 to 1700°C, where they were melted for approximately 12 hours, degassed, and homogenized. The resulting molten glass was poured into a mold and held at a temperature of glass transition point + 50°C for 1 hour, after which it was cooled to room temperature at a rate of 0.5°C / min to obtain a glass block.

[0217] The glass (vi) in Table 1 was synthetic quartz glass (product name: AQ) manufactured by AGC Corporation.

[0218] Each of the obtained glass blocks was cut, ground and polished to obtain glass members (300 mm long, 300 mm wide).

[0219] [Physical properties of glass components] The obtained glass member was subjected to the following measurements. The measurement results are shown in Table 1.

[0220] The thickness was measured at 20°C using a digital tape measure.

[0221] The average linear expansion coefficient β was measured in the temperature range of 20°C to 200°C using a high-precision thermal dilatometer "DIL402 Expedis" manufactured by Netsch.

[0222] The in-line transmittance was measured using a spectrophotometer at 20° C. and a wavelength of 850 nm. The glass of (xi) in Table 1 was cloudy and it was clear that the linear transmittance would be less than 80%, so the linear transmittance was not measured.

[0223] The Young's modulus was measured at 20°C by the ultrasonic pulse method described in the Japanese Industrial Standards (JIS R1602:1995).

[0224] The melting temperature (T2) was measured using a rotational viscometer. 2 The temperature T2 (°C) at which the viscosity becomes dPa·s is shown. The melting temperatures (T2) of the glasses (iv) and (v) in Table 1 could not be measured, so were calculated by extrapolation.

[0225] The devitrification temperature is the maximum temperature (°C) at which no crystals precipitate on the surface or inside of the glass when crushed glass particles are placed in a platinum dish and heat-treated for 17 hours in an electric furnace controlled at a constant temperature, and observed under an optical microscope after heat treatment.

[0226] The phase separation was evaluated by observing the glass member with a scanning electron microscope (SEM). When no phase separation was observed, it was marked as "◯", and when phase separation was observed, it was marked as "X".

[0227] [Si-SiC materials] The fabricated Si-SiC components are shown in Table 2.

[0228] [Table 2]

[0229] [Si-SiC component manufacturing procedure] The Si-SiC members (a-1) to (a-3) were fabricated as follows. α-SiC powder A1 was sieved using a 325-mesh sieve to obtain α-SiC powder A2 (maximum particle size 44 μm, average particle size 8 μm). α-SiC powder A2 was washed with mixed acid (hydrofluoric acid:nitric acid = 2:1 (mass ratio)) and pure water to obtain α-SiC powder A3 (iron content 2.1 mass ppm). α-SiC powder A3, pure water, and acrylic resin emulsion (binder) were mixed to obtain a slurry (solid concentration approximately 75 mass%).

[0230] The slurry was then poured into a plaster mold to obtain a green body (size: 320 mm × 320 mm × 16 mm). The green body was dried at 50 °C for 14 days and then fired at 1900 °C in an electric furnace under an inert argon atmosphere to obtain a sintered body. The porosity of the sintered body was 18.2%. The sintered body A1 was then transferred to another electric furnace, where it was infiltrated with molten high-purity silicon in a vacuum at 1500°C to obtain a Si-SiC component with all pores filled with high-purity silicon. The iron content in the Si-SiC component was 2.2 ppm.

[0231] Next, the Si-SiC members were processed to have a length of 30 cm, a width of 30 cm, and a thickness shown in Table 2, to obtain Si-SiC members (a-1) to (a-3).

[0232] The Si-SiC member (b) was produced in the same manner as the Si-SiC member (a-1), except that the solid content of the slurry was changed to about 79 mass %.

[0233] The Si-SiC member (c) was produced in the same manner as the Si-SiC member (a-1), except that the solid content of the slurry was changed to about 61 mass %.

[0234] The Si-SiC member (d) was fabricated as follows. A kneader (manufactured by Miyazaki Iron Works Co., Ltd., model number: MP100) was charged with 48.2 mass% SiC powder (manufactured by Pacific Random Co., Ltd., model number: GMF-12S (average particle size 0.7 μm)), 25.0 mass% silicon powder (manufactured by Yamaishi Metal Co., Ltd., model number: No. 700 (average particle size 2.5 μm)), 5.5 mass% Metrolose (manufactured by Shin-Etsu Chemical Co., Ltd., model number SM8000) as a binder, and 21.5 mass% pure water, and the mixture was kneaded for 6 hours to obtain a clay.

[0235] The obtained clay was placed in an extrusion molding machine (manufactured by Miyazaki Iron Works Co., Ltd., model number: FM100) and extrusion molded under conditions of a head pressure of 1.0 MPa and a discharge rate of 1200 g / min to obtain a molded body. The obtained molded body was dried at 50°C for 14 days, and then heated in an air atmosphere at 450°C for 3 hours to degrease it, obtaining a degreased body. The obtained degreased body was baked in a carbon furnace for 10 -3 The mixture was fired at 1700°C for 2 hours in a vacuum atmosphere of 100 Pa to obtain a sintered body. The resulting sintered body was impregnated with Si at 1500°C in an argon atmosphere to obtain a Si-SiC component. The resulting Si-SiC component was machined to a length of 30 cm, a width of 30 cm, and a thickness shown in Table 2 to obtain Si-SiC component (d).

[0236] The Si-SiC member (e) was produced in the same manner as the Si-SiC member (a-1), except that the solid content of the slurry was changed to about 77 mass %.

[0237] The Si-SiC member (f) was produced in the same manner as the Si-SiC member (a-1), except that the solid content of the slurry was changed to about 58 mass %.

[0238] [Physical properties of Si-SiC components] The following measurements were carried out on the obtained Si—SiC members (a-1) to (f). The measurement results are shown in Table 2.

[0239] The amount (composition) of each component of the Si-SiC member was measured using an inductively coupled plasma mass spectrometer ICP-MS (manufactured by Shimadzu Corporation).

[0240] The thickness was measured at 20°C using a vernier caliper (AD-5764A) manufactured by A&D Co., Ltd.

[0241] The average linear expansion coefficient α was measured in the temperature range of 20°C to 200°C using a differential thermal dilatometer (TMA) "TMA4000SA" manufactured by Bruker AXS.

[0242] The thermal conductivity was measured at a temperature of 20°C using a laser flash method thermal property measuring device "MODEL LFA-502" manufactured by Kyoto Electronics Manufacturing Co., Ltd.

[0243] Young's modulus was measured at 20°C using an Autocom universal testing machine "AC-300KN" manufactured by TSE Corporation, according to the elastic modulus test method (dynamic elastic modulus method) described in the Japanese Industrial Standards (JIS R1602:1995).

[0244] The bending strength was measured at 20°C using an Autocom universal testing machine "AC-300KN" manufactured by TSE Corporation, according to the bending strength test method (four-point bending strength) described in the Japanese Industrial Standards (JIS R1601:2008).

[0245] The Vickers hardness was measured at 20° C. using a Vickers hardness tester system (manufactured by Nippon Steel & Sumikin Technology Co., Ltd.) by pressing with a pressing load of 10 kgf for 15 seconds.

[0246] [Joining layer] The following measurements were carried out on the resin films shown in Table 3. The measurement results are shown in Table 3. The resin films shown in Table 3 serve as bonding layers of laminated members.

[0247] [Table 3]

[0248] The thickness was measured with a digital tape measure.

[0249] The in-line transmittance was measured at 20° C. and 850 nm using a spectrophotometer.

[0250] The heat resistance temperature was determined by thermogravimetry (TGA) in an air atmosphere, and the temperature at which the mass of the resin film decreased by 1% by mass was determined.

[0251] The average linear expansion coefficient γ was measured in the temperature range of 20°C to 200°C using a differential thermal dilatometer (TMA) "TMA4000SA" manufactured by Bruker AXS. The average linear expansion coefficient γ of the resin film and the average linear expansion coefficient γ of a bonding layer obtained using the resin film, which will be described later, were the same value.

[0252] The Young's modulus was measured at 25° C. using a universal testing machine (model 5966) manufactured by Instron Corporation according to the elastic modulus testing method described in the Japanese Industrial Standards (JIS K7171).

[0253] [Laminated member] The laminated members produced are shown in Table 4.

[0254] [Table 4]

[0255] [Preparation procedure] Samples (laminated members) of Examples 1 to 14 and 18 to 25 were produced as follows so that the respective members were combined as shown in Table 4. Samples of Examples 15 to 17 were also prepared. Examples 1 to 5, 7, 9 to 14, and 20 to 24 are working examples, and Examples 6, 8, 15 to 19, and 25 are comparative examples.

[0256] First, using SiC polishing paper, the surface of the glass member shown in Table 1 that comes into contact with the resin film was processed to a surface roughness of Ra = 0.2 mm. Similarly, using SiC polishing paper, the surface of the Si-SiC member shown in Table 2 that comes into contact with the resin film was processed to a surface roughness of Ra = 0.2 mm. Next, a resin film shown in Table 3 was sandwiched between a glass member and a Si-SiC member, heated to a temperature 20°C above the softening point of the resin film, and pressed for 5 minutes under a pressure of 2 MPa to bond the glass member and the Si-SiC member via the bonding layer. In this way, samples (laminate members) of Examples 1 to 14 and 18 to 25 were obtained.

[0257] [Evaluation of laminated members] The samples of each example were evaluated as follows, and the evaluation results are shown in Table 4 above.

[0258] (Temperature rise evaluation) The sample of each example was irradiated with infrared rays (850 nm) using nine 2 kW infrared lamps for two minutes, and the temperature rise was evaluated. The evaluation criteria were as follows: ◯ when the temperature of the outermost surface of the sample exceeded 200°C; x when the temperature of the outermost surface of the sample did not exceed 200°C. The laminated member samples of Examples 1 to 14 and 18 to 25 were irradiated with infrared rays from the glass member side and evaluated based on the outermost surface temperature of the Si-SiC member side. The laminated member samples of Examples 15 to 17 were evaluated based on the outermost surface temperature of the side opposite to the infrared irradiated side.

[0259] (Impact resistance evaluation) A 533g steel ball was dropped onto each sample to evaluate its impact resistance. The impact resistance evaluation was performed on three samples (n=3) for each example. A support frame made of rubber plates 3mm thick, 15mm wide, and A50 hardness was attached to the outer periphery of the sample, clamping and fixing it from above and below. The steel ball was dropped so that it was within a distance of 25mm from the center of the sample. The evaluation criteria were as follows: the ball was dropped from a height of 20 cm; if two or more of the three samples broke, it was marked as "X"; if one of the three samples broke, it was marked as "△"; if none of the three samples broke, it was marked as "〇"; and if it was marked as "△" or above, it was considered a pass. A steel ball was dropped from the Si-SiC member side of the laminated member samples of Examples 1 to 14 and 18 to 24. Note that the impact resistance of Samples 17 and 25 was not evaluated.

[0260] (Heat resistance evaluation) The samples of each example were heated at a temperature of 230°C for 24 hours, and visually evaluated for changes in appearance. The evaluation criteria were ◯ if there was no change in appearance (discoloration, bubbles, generation of foreign matter, bleeding of the bonding layer, etc.), and × if there was a change in appearance. Note that the heat resistance of the sample of Example 25 was not evaluated.

[0261] (Warpage amount) The amount of warpage of each sample was measured using a non-contact three-dimensional shape measuring device "NH-5Ns" manufactured by Mitaka Koki Co., Ltd., to measure the three-dimensional properties of the sample surface in accordance with ISO25178-605, and to determine the maximum tilt-type flatness of the sample surface. Specifically, the sample was placed on a precision surface plate, and the height of each point on the top surface of the sample was measured using a laser autofocus microscope. The value of the gap created when the top surface of the sample was sandwiched between two parallel flat surfaces, i.e., the maximum tilted flatness, was calculated as the amount of warpage.

[0262] (density) The mass of each sample was calculated by dividing it by the volume measured using a digital tape measure manufactured by Digi-Tech Corporation.

[0263] (area) The area of ​​the top surface of each sample (the exposed main surface of the Si-SiC member in the case of a laminated member, or one of the main surfaces in the case of a single member) was determined from the dimensions measured using a digital tape measure manufactured by Digitec Corporation.

[0264] (thickness of bonding layer) The thickness of the bonding layer (resin) of the samples of Examples 1 to 14 and 18 to 25 was calculated by SEM cross-sectional observation.

[0265] (Thermal shock resistance evaluation) Laminated members 15 mm wide and 100 mm long were fabricated using the same combinations as in samples 1 to 14 and 18 to 24, and the Si-SiC member side was heated using a hot plate to create a temperature difference between it and the glass, and thermal shock resistance was evaluated. Specifically, the surface of the Si-SiC member was heated using a hot plate set to 220°C, and the glass member side was cooled using a cooling plate cooled to 10°C by running cooling water through it, and the temperature difference was maintained for 1 hour. The evaluation criteria were as follows: if cracks or cloudiness were found in the adhesive layer by visual inspection, it was rated as ×, and if no change was found, it was rated as O. Note that the samples of Examples 15 to 17 and Example 25 were not evaluated for thermal shock resistance.

[0266] The results in Table 4 show that the laminated members of the present invention have a fast temperature rise rate, high impact resistance and thermal shock resistance, and are suitable as heating members (Examples 1 to 5, 7, 9 to 14, and 20 to 24).

[0267] Although various embodiments have been described above with reference to the drawings, it goes without saying that the present invention is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications or alterations within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present invention. Furthermore, the components of the above-described embodiments may be combined in any manner without departing from the spirit of the invention.

[0268] This application is based on a Japanese patent application filed on June 10, 2020 (Patent Application No. 2020-101051), a Japanese patent application filed on September 25, 2020 (Patent Application No. 2020-161312), and a Japanese patent application filed on January 20, 2021 (Patent Application No. 2021-007287), the contents of which are incorporated by reference into this application. [Explanation of symbols]

[0269] 100 Laminated member 101 Glass components 103 Bonding layer 105 Si-SiC components

Claims

1. a glass member having an in-line transmittance of 80% or more at a wavelength of 850 nm; a bonding layer containing a resin on the glass member; a Si—SiC member on the bonding layer, The Si—SiC member has an average linear expansion coefficient α of 2.85 to 4.00 ppm / °C at 20 to 200°C, The bonding layer has an average linear expansion coefficient γ of 2 to 200 ppm / °C at 20 to 200°C.

2. The laminated member according to claim 1, wherein the glass member has an average linear expansion coefficient β of 1.50 to 5.00 ppm / °C at 20 to 200°C.

3. The glass member has 55.0 to 85.0 mol % of SiO in terms of oxide-based mole percentage. ２ and 1.5 to 14.5 mol % Al ２ O ３ and 3.0 to 14.0 mol% B ２ O ３ and 0 to 3.5 mol % P ２ O ５ and, The SiO in the glass member ２ , the Al ２ O ３ , the above B ２ O ３ and the P ２ O ５ The laminated member according to claim 1 or 2, wherein the total content of is 70.0 to 97.0% in mole percentage based on oxides.

4. The B contained in the glass member ２ O ３ The laminate member according to claim 3, wherein the content of is 8.5 mol% or less.

5. The glass member contains 0 to 13.0 mol % of Na in terms of mole percentage based on oxides. ２ The laminated member according to any one of claims 1 to 4, comprising O.

6. The glass member contains 0.0001 to 0.0115 mol % of Fe, expressed as a mole percentage based on oxides. ２ O ３ The laminated member according to any one of claims 1 to 5, comprising:

7. The laminated member according to any one of claims 1 to 6, wherein the glass member has an in-line transmittance of 90% or more at a wavelength of 850 nm.

8. The thickness of the glass member is 2 to 40 mm, The laminated member according to any one of claims 1 to 7, wherein the Si-SiC member has a thickness of 0.5 to 15 mm.

9. The laminated member according to any one of claims 1 to 8, wherein the Si-SiC member has a thermal conductivity of 190 to 300 W / m K at 20 ° C.

10. The absolute value |α-β| of the value obtained by subtracting the average linear expansion coefficient β of the glass member at 20 to 200 ° C. from the average linear expansion coefficient α of the Si-SiC member at 20 to 200 ° C. is 2.00 ppm / ° C. or less. The laminated member according to any one of claims 1 to 9.

11. The laminated member according to any one of claims 1 to 10, wherein the Si-SiC member has a Young's modulus of 300 to 420 GPa.

12. The laminated member according to any one of claims 1 to 11, wherein the metal Si content of the Si-SiC member is 8 to 60 mass%.

13. The laminated member according to any one of claims 1 to 12, wherein the resin has a heat resistance temperature of 120 to 300 ° C.

14. Density is 2.40 to 2.85 g / cm ３ The laminated member according to any one of claims 1 to 13,

15. The laminated member according to any one of claims 1 to 14, wherein the amount of warpage is 0.25 mm or less.

16. a second bonding layer provided on the Si—SiC member; The laminated member according to any one of claims 1 to 15, further comprising: a second Si-SiC member joined to the Si-SiC member via the second joining layer.

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