Inspection device and inspection method

Abstract

To provide a substrate inspection device and inspection method which can more correctly perform alignment between a substrate and a probe of a probe card.SOLUTION: In an inspection device, each divided region 13a of an inspection region includes: a chuck top 70 on which a substrate W is placed; a pogo frame 80 which holds a probe card 90 that has a probe 91 that is brought into contact with an electrode on the substrate; a movement mechanism which holds and moves the chuck top; a first imaging unit which recognizes the substrate placed on the chuck top and a second imaging unit which recognizes the probe held by the holding part; an imaging part 60 which fixes the first imaging unit and the second imaging unit to a common housing 60a; and an imaging movement mechanism which moves the housing of the imaging part. Alignment between the probe and the substrate placed on the chuck top is performed on the basis of the imaging result by the first imaging unit and the second imaging unit in such a state that the chuck top on which the substrate is placed is located on the lower side of the probe card held by the pogo frame.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to an inspection device and an inspection method. [Background technology]

[0002] Patent Document 1 discloses an inspection device that moves a wafer placed on an alignment stage to a position where it will contact the probes of a probe card. This inspection device executes a process including a step of acquiring card centroid coordinates of the probe card with a first acquisition unit on the aligner side, and a step of acquiring reference coordinates in a target coordinate system of a reference target provided on a pogo frame with the first acquisition unit. The inspection device also executes a process including a step of acquiring common coordinates between a second acquisition unit on the pogo frame side and the first acquisition unit, a step of acquiring wafer centroid coordinates with the second acquisition unit, and a step of moving the aligner using a command including contact coordinates calculated based on the card centroid coordinates, the common coordinates, and the wafer centroid coordinates. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-166228 Summary of the Invention [Problem to be solved by the invention]

[0004] The technology according to the present disclosure more accurately aligns a substrate with a probe of a probe card in an inspection device that inspects the substrate. [Means for solving the problem]

[0005] One aspect of the present disclosure is an inspection device for inspecting a substrate, the inspection device comprising: a mounting member on which the substrate is placed; a holding section that holds a probe card having probes that contact electrodes on the substrate; a movement mechanism that holds and moves the mounting member; a first imaging unit that recognizes the substrate placed on the mounting member; and a second imaging unit that recognizes the probes of the probe card held in the holding section, the imaging section having the first imaging unit and the second imaging unit fixed to a common housing; and an imaging movement mechanism that moves the housing of the imaging unit, and the inspection device aligns the substrate placed on the mounting member with the probes of the probe card based on imaging results by the first imaging unit and the second imaging unit when the mounting member on which the substrate is placed is positioned below the probe card held in the holding section, The first imaging unit and the second imaging unit each have a camera whose optical axis extends in the vertical direction, and the cameras are provided coaxially. . [Effects of the Invention]

[0006] According to the present disclosure, in an inspection device that inspects a substrate, it is possible to more accurately align the substrate with the probes of the probe card. [Brief explanation of the drawings]

[0007] [Figure 1] 10A and 10B are diagrams for explaining a positioning method according to a comparative example. [Figure 2] 10A and 10B are diagrams for explaining a positioning method according to a comparative example. [Figure 3] 1 is a cross-sectional view showing an outline of the configuration of an inspection device according to the present embodiment. [Figure 4] 1 is a longitudinal sectional view showing an outline of the configuration of an inspection device according to the present embodiment. [Figure 5] FIG. 2 is a side cross-sectional view of one divided area of ​​the inspection area. [Figure 6] FIG. 2 is a perspective view of a housing of the imaging unit. [Figure 7] FIG. 2 is a cross-sectional view of the periphery of the pogo frame. [Figure 8] FIG. [Figure 9]10A and 10B are diagrams for explaining an inspection process involving a contact position determination process according to the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] In the semiconductor manufacturing process, a large number of semiconductor devices having predetermined circuit patterns are formed on a substrate such as a semiconductor wafer (hereinafter referred to as "wafer"). The formed semiconductor devices are inspected for electrical characteristics and sorted into good and bad products. The inspection of semiconductor devices is performed, for example, using an inspection device while the wafer is in the state before it is divided into individual semiconductor devices.

[0009] The testing device is equipped with a probe card having a large number of probes, which are needle-shaped contact terminals. When testing electrical characteristics, the wafer and the probe card are first brought close to each other, and the probes of the probe card come into contact with each electrode of a semiconductor device formed on the wafer. In this state, an electrical signal is supplied to the semiconductor device via each probe from a tester installed above the probe card. Then, based on the electrical signals received by the tester from the semiconductor device via each probe, it is determined whether the semiconductor device is defective or not.

[0010] To ensure that such electrical characteristic tests are performed appropriately, the test device aligns the probes of the probe card with the wafer, specifically, aligns the probes with the electrodes on the wafer.

[0011] 1, the inspection device 500 includes, for example, a pogo frame 502 that holds a probe card 501, a chuck top 503 on which a wafer W is placed, and an aligner 504 that moves the chuck top 503. The inspection device 500 also has an upper camera 510 for wafer recognition provided in an area that does not overlap with the probe card 501 in a plan view, and a lower camera 511 for probe card recognition fixed to the aligner 504. In this inspection device 500, for example, the probe 501a of the probe card 501 and the wafer W on the chuck top 503 are aligned based on the following imaging results. The result of imaging the probe card 501 by the lower camera 511 when the lower camera 511 is moved below the probe card 501 as shown in FIG. As shown in FIG. 2, the chuck top 503 is moved below the upper camera 510, which is positioned in an area that does not overlap with the probe card 501 in a plan view. The image of the wafer W on the chuck top 503 is captured by the upper camera 510.

[0012] However, the above-described alignment method leaves room for improvement in terms of the time required for alignment and alignment accuracy.

[0013] The technology according to the present disclosure makes it possible to quickly and accurately align a substrate with a probe of a probe card in a substrate inspection device.

[0014] Hereinafter, an inspection device and an inspection method according to the present embodiment will be described with reference to the drawings. In this specification and the drawings, elements having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0015] <Inspection equipment> 3 and 4 are a cross-sectional view and a longitudinal-sectional view, respectively, showing the outline of the configuration of the inspection device according to this embodiment.

[0016] 3 and 4 inspects a wafer W as a substrate, and more specifically, inspects the electrical characteristics of semiconductor devices as devices to be inspected formed on the wafer W. The inspection apparatus 1 has a housing 10, which is provided with a loading / unloading area 11, a transfer area 12, and an inspection area 13. The loading / unloading area 11 is an area where the wafer W is loaded and unloaded into the inspection apparatus 1. The transfer area 12 is an area connecting the loading / unloading area 11 and the inspection area 13. The inspection area 13 is an area where the electrical characteristics of the semiconductor devices formed on the wafer W are inspected.

[0017] The loading / unloading area 11 is provided with a port 20 for receiving a cassette C containing multiple wafers W, a loader 21 for accommodating a probe card (described later), and a control unit 22 for controlling the various components of the inspection apparatus 1. The control unit 22 is configured, for example, by a computer equipped with a CPU, memory, etc., and has a storage unit (not shown) for storing various information. The storage unit stores, for example, a program for implementing the inspection process. The program may be recorded on a computer-readable storage medium and installed from the storage medium to the control unit 22. The storage medium may be temporary or non-temporary. Some or all of the program may be implemented by dedicated hardware (circuit board). The storage unit may be, for example, a storage device such as a hard disk drive (HDD), a memory such as a RAM for storing temporarily required information related to the program's calculations, or a combination of these.

[0018] A transfer device 30 that can move freely while holding a wafer W or the like is disposed in the transfer area 12. This transfer device 30 transfers the wafer W between a cassette C in a port 20 in the carry-in / out area 11 and the inspection area 13. The transfer device 30 also transfers probe cards that require maintenance among those fixed to a pogo frame (described later) in the inspection area 13 to a loader 21 in the carry-in / out area 11. Furthermore, the transfer device 30 transfers a new or maintained probe card from the loader 21 into the inspection area 13.

[0019] A plurality of testers 40 are provided in the inspection area 13. Specifically, as shown in FIG. 4, the inspection area 13 is divided into three areas in the vertical direction (Z direction in the figure) and two areas in the horizontal direction (X direction in the figure), and each divided area 13a is provided with two testers 40 arranged in the horizontal direction. Also, each divided area 13a is provided with an aligner 50 as a movement mechanism for each tester 40, for example. Furthermore, each divided area 13a is provided with one imaging unit 60. That is, in each divided area 13a, the imaging unit 60 is provided so as to be shared between the testers 40 adjacent in the horizontal direction. The number and arrangement of the testers 40, aligners 50, and imaging units 60 can be selected arbitrarily.

[0020] The tester 40 transmits and receives electrical signals to and from the wafer W for testing electrical characteristics. The aligner 50 is configured to hold a chuck top 70 (described later) and move it in the horizontal direction (X direction and Y direction in FIG. 4, and the θ direction centered on the Z axis in FIG. 3) and the vertical direction (Z direction in FIGS. 3 and 4). The aligner 50 is also used to align the wafer W placed on the chuck top 70 with the probes of a probe card (described later).

[0021] The imaging unit 60 captures images of both the probes of the probe card and the wafer W placed on the chuck top 70.

[0022] The chuck top 70 is an example of a mounting member, and is configured to mount a wafer W. The chuck top 70 can hold the mounted wafer W by, for example, suction.

[0023] In this inspection apparatus 1, while the transport device 30 is transporting a wafer W toward one tester 40, another tester 40 can inspect the electrical characteristics of electronic devices formed on another wafer W.

[0024] <Inspection area> Next, the configuration of the inspection area 13 will be described in more detail with reference to Figs. 5 to 8. Fig. 5 is a side cross-sectional view of one divided area 13a of the inspection area 13. Fig. 6 is a perspective view of a housing of the imaging unit 60, which will be described later. Fig. 7 is a cross-sectional view of the periphery of a pogo frame, which will be described later. Fig. 8 is a top view of the imaging unit 60.

[0025] As described above, an aligner 50 and an imaging unit 60 are provided in each divided area 13a of the inspection area 13. Furthermore, as shown in Fig. 5, a pogo frame 80 and a probe card 90, which will be described later, are provided in each divided area 13a.

[0026] The aligner 50 includes, for example, an X stage 51 , a Y stage 52 , and a Z stage 53 .

[0027] The X-stage 51 moves along guide rails 51a extending in the horizontal direction (the X-direction in the figure). A drive unit (not shown) that drives the movement of the X-stage 51 is provided for the X-stage 51. The drive unit has, for example, a motor as a drive source that generates the driving force for the movement. The X-stage 51 is also provided with a position detection mechanism (not shown) that detects the position of the X-stage 51 in the X-direction, i.e., the position of the chuck top 70 in the X-direction. The position detection mechanism is, for example, a linear encoder.

[0028] The Y stage 52 moves on the X stage 51. Specifically, the Y stage 52 moves along guide rails 52a extending in the horizontal direction (the Y direction in the figure). A drive unit (not shown) that drives the movement is provided for the Y stage 52. The drive unit has, for example, a motor as a drive source that generates a driving force for the movement. In addition, the Y stage 52 is provided with a position detection mechanism (not shown) that detects the position of the Y stage 52 in the Y direction, i.e., the position of the chuck top 70 in the Y direction. The position detection mechanism is, for example, a linear encoder.

[0029] The Z stage 53 moves up and down (in the Z direction in the figure) by means of an extendable shaft 53a that can extend and retract in the vertical direction. A drive unit (not shown) that drives the movement is provided for the Z stage 53. The drive unit has, for example, a motor as a drive source that generates the driving force for the movement. The Z stage 53 is also provided with a position detection mechanism (not shown) that detects the position of the Z stage 53 in the Z direction, i.e., the position of the chuck top 70 in the Z direction. The position detection mechanism is, for example, a linear encoder.

[0030] Furthermore, the chuck top 70 is detachably held by suction on the Z stage 53. The chuck top 70 is held by suction on the Z stage 53 by vacuum suction or the like using a suction holding mechanism (not shown).

[0031] The aligner 50 is controlled by the control unit 22. Specifically, the aforementioned drive units of the X stage 51, Y stage 52, and Z stage 53 of the aligner 50 are controlled by the control unit 22. In addition, the position detection results of the aforementioned position detection mechanisms provided on the X stage 51, Y stage 52, and Z stage 53 are output to the control unit 22.

[0032] As described above, the imaging unit 60 captures images of both the probes 91 of the probe card 90 and the wafer W placed on the chuck top 70. The imaging unit 60 has a housing 60a. As shown in FIG. 6, both the first imaging unit 61 and the second imaging unit 62 are fixed to the housing 60a. In other words, in the imaging unit 60, the first imaging unit 61 and the second imaging unit 62 are fixed to a common housing 60a. The first imaging unit 61 is provided in the lower part of the housing 60a, and the second imaging unit 62 is provided in the upper part of the housing 60a.

[0033] The first imaging unit 61 recognizes the wafer W placed on the chuck top 70. Specifically, the first imaging unit 61 captures an image of the wafer W in order to recognize the wafer W placed on the chuck top 70. The first imaging unit 61 has a macro-view camera 61a that captures images at low resolution and a micro-view camera 61b that captures images at high resolution.

[0034] The second imaging unit 62 recognizes the probe 91 of the probe card 90. Specifically, the second imaging unit 62 captures an image of the probe 91 in order to recognize the probe 91 of the probe card 90. The second imaging unit 62 has a macro-view camera 62a that captures images at low resolution and a micro-view camera 62b that captures images at high resolution.

[0035] In the imaging section 60, the first imaging unit 61 and the second imaging unit 62 are provided coaxially. Specifically, as shown in the figure, the optical axes P1a and P2a of the macro field-of-view cameras 61a and 62a are coaxial, and the optical axes P1b and P2b of the micro field-of-view cameras 61b and 62b are also coaxial.

[0036] The imaging unit 60 is controlled by the control unit 22. The imaging result by the imaging unit 60 is output to the control unit 22.

[0037] Furthermore, the imaging unit 60 is configured to be movable in the horizontal direction (XY directions in FIG. 5, etc.) and the vertical direction (Z direction in FIG. 5, etc.) by an imaging movement mechanism 100 (see FIG. 8). Specifically, the housing 60a of the imaging unit 60 is configured to be movable in the horizontal direction and the vertical direction by the imaging movement mechanism 100. The imaging movement mechanism 100 will be described later.

[0038] 7, the tester 40 has a tester motherboard 41 on the bottom. A plurality of test circuit boards (not shown) are mounted in an upright state on the tester motherboard 41. In addition, a plurality of electrodes (not shown) are provided on the bottom surface of the tester motherboard 41. Furthermore, a pogo frame 80 is provided below the tester 40 .

[0039] The pogo frame 80 is an example of a holder, and holds the probe card 90. The pogo frame 80 also electrically connects the probe card 90 to the tester 40. For the above-mentioned electrical connection, the pogo frame 80 has pogo pins 81, and more specifically, has a pogo block 82 that holds a large number of pogo pins 81. A probe card 90 is fixed to the underside of the pogo frame 80 while being aligned at a predetermined position.

[0040] An exhaust mechanism (not shown) vacuum-adsorbs the tester motherboard 41 to the pogo frame 80, and the probe card 90 to the pogo frame 80. Due to the vacuum suction force for this vacuum adsorption, the lower end of each pogo pin 81 of the pogo frame 80 comes into contact with a corresponding electrode on the upper surface of a card body 92 (described later) of the probe card 90, and the upper end of each pogo pin 81 is pressed against a corresponding electrode on the lower surface of the tester motherboard 41.

[0041] The probe card 90 has a disk-shaped card body 92 with a plurality of electrodes provided on the upper surface thereof. The lower surface of the card body 92 is provided with a plurality of probes 91, which are needle-shaped contact terminals extending downward. The above-mentioned plurality of electrodes provided on the upper surface of the card body 92 are each electrically connected to a corresponding probe 91. During testing, the probes 91 each come into contact with an electrode (not shown) of a semiconductor device formed on the wafer W. Therefore, during electrical characteristic testing, electrical signals related to the test are transmitted and received between the tester motherboard 41 and the semiconductor device on the wafer W via the pogo pins 81, the electrodes provided on the upper surface of the card body 92, and the probes 91.

[0042] In order for the inspection device 1 to collectively inspect the electrical characteristics of a plurality of semiconductor devices formed on the wafer W, a large number of probes 91 are provided so as to cover substantially the entire lower surface of the card body 92.

[0043] In addition, a bellows 83 is attached to the underside of the pogo frame 80. The bellows 83 is a cylindrical, expandable member that hangs down to surround the probe card 90. In addition, the bellows 83 suction-holds the chuck top 70 at a position below the probe card 90, as shown by the dotted line in FIG.

[0044] The bellows 83 suction-holds the chuck top 70, thereby forming a sealed space S surrounded by the pogo frame 80 including the probe card 90, the bellows 83, and the chuck top 70. The sealed space S can be depressurized by a depressurization mechanism (not shown), thereby maintaining contact between the wafer W and the probes 91.

[0045] As described above, the housing 60a of the imaging unit 60 is configured to be movable in the horizontal direction and the vertical direction by the imaging movement mechanism 100 shown in FIG.

[0046] The imaging device moving mechanism 100 has a pair of guide rails 101 and a pair of moving rails 102 .

[0047] The guide rails 101 are provided so as to extend in the horizontal direction (the X direction in the drawing). In one embodiment, the guide rails 101 are provided so as to connect the partition walls 10a that separate the divided areas 13a of the same height to the side walls of the housing 10 of the inspection device 1. The pair of guide rails 101 are spaced apart from each other so that the chuck top 70 can pass between the guide rails 101.

[0048] The pair of moving rails 102 are provided so as to extend horizontally in a direction perpendicular to the guide rails 101 (the Y direction in the figure), and are configured to be movable along the guide rails 101 while supporting the housing 60a of the imaging unit 60. A drive unit (not shown) that drives the movement is provided for the pair of moving rails 102. The drive unit has, for example, a motor as a drive source that generates a driving force for the movement. In addition, the pair of moving rails 102 are provided with a position detection mechanism (not shown) that detects the position of the pair of moving rails 102 in the X direction, i.e., the position of the housing 60a of the imaging unit 60 in the X direction. The position detection mechanism is, for example, a linear encoder.

[0049] Furthermore, the pair of movable rails 102 support the housing 60a of the imaging unit 60 so that it can move in the direction in which the movable rails 102 extend (Y direction in the figure) and in the vertical direction (Z direction in the figure). A drive unit (not shown) is provided between the housing 60a of the imaging unit 60 and the pair of movable rails 102 to drive the movement in the direction in which the movable rails 102 extend and in the vertical direction. The drive unit has, for example, a motor as a drive source that generates a driving force for the movement. In addition, a position detection mechanism (not shown) is provided for the housing 60a of the imaging unit 60 to detect the position of the housing 60a in the direction in which the movable rails 102 extend and in the vertical direction. The position detection mechanism is, for example, a linear encoder.

[0050] The imaging device moving mechanism 100 is controlled by the control unit 22. Specifically, the aforementioned drive units for the moving rail 102 and the housing 60a are controlled by the control unit 22. In addition, the position detection results by the aforementioned position detection mechanisms provided on the moving rail 102 and the housing 60a are output to the control unit 22.

[0051] <Inspection process using inspection device 1> Next, an inspection process involving a process of determining a contact position using the inspection device 1 will be described with reference to Fig. 9. The contact position is a position in the horizontal direction (X direction and Y direction in Fig. 5, etc.) of the chuck top 70 when the wafer W supported on the chuck top 70 and the probe 91 are brought into contact with each other.

[0052] (Step S1: Transport) First, the wafer W to be inspected is transported to the desired tester 40 . Specifically, the transport device 30 and the like are controlled by the control unit 22, and the wafer W is removed from the cassette C in the port 20 of the loading / unloading area 11, loaded into, for example, the upper dividing area 13a, and placed on the chuck top 70 held by suction on the aligner 50 corresponding to the desired tester 40.

[0053] (Step S2: Movement of the chuck top 70) Next, as shown in FIG. 9, the chuck top 70 on which the wafer W is placed is moved to below the probe card 90. Specifically, the control unit 22 controls the aligner 50, and the chuck top 70 on which the wafer W is placed is moved to a predetermined temporary contact position.

[0054] (Step S3: Movement of the imaging unit 60) Furthermore, the imaging unit 60 is moved to a position between the probe card 90 and the chuck top 70 below the probe card 90 . Specifically, the control unit 22 controls the imaging moving mechanism 100, and the housing 60a of the imaging unit 60 is moved to the above-mentioned position. The order of steps S2 and S3 does not matter, and steps S2 and S3 may be performed simultaneously.

[0055] (Step S4: Imaging) Thereafter, imaging is performed by the first imaging unit 61 and the second imaging unit 62 from between the probe card 90 and the chuck top 70. In other words, the control unit 22 acquires a representative position of the wafer W using the first imaging unit 61 positioned between the probe card 90 and the chuck top 70, and acquires a representative position of the probe 91 using the second imaging unit 62 positioned between the probe card 90 and the chuck top 70.

[0056] Specifically, the representative position of the wafer W is acquired based on the imaging result of the first imaging unit 61 and the detection result of the position detection mechanism of the imaging movement mechanism 100. Furthermore, the representative position of the wafer W is, for example, the center of gravity of electrodes at multiple predetermined locations on the wafer W. The approximate position of each electrode is acquired based on an image acquired by the macro-view camera 61a. The exact position of each electrode is acquired based on an image acquired by the micro-view camera 61b. For example, the exact position of each electrode (specifically, position coordinates) can be acquired based on the output from the position detection mechanism of the imaging movement mechanism 100 when the center of the electrode is located at the center of the image acquired by the micro-view camera 61b.

[0057] Specifically, the representative position of the probe 91 is acquired based on the imaging result of the second imaging unit 62 and the detection result of the position detection mechanism of the imaging movement mechanism 100. Furthermore, the representative position of the probe 91 is, for example, the center of gravity position of the probes 91 at a plurality of predetermined locations on the probe card 90. The approximate position of each probe 91 is acquired based on an image acquired by the macro-view camera 62a. The exact position of each probe 91 is acquired based on an image acquired by the micro-view camera 62b. For example, the exact position (specifically, position coordinates) of each probe 91 can be acquired based on an output from the position detection mechanism of the imaging movement mechanism 100 when the tip of the probe 91 is located at the center of the image acquired by the micro-view camera 62b.

[0058] (Step S5: Alignment) Next, the wafer W placed on the chuck top 70 is aligned with the probes 91 of the probe card 90 based on the imaging results by the first imaging unit 61 and the second imaging unit 62. Specifically, the control unit 22 corrects the tentative contact position based on the imaging results by the first imaging unit 61 and the second imaging unit 62, and the corrected tentative contact position is determined as the contact position. Then, the control unit 22 controls the aligner 50 to move the chuck top 70 to the determined contact position.

[0059] The correction of the tentative contact position is performed, for example, based on the representative position of the wafer W acquired in step S4 and the representative position of the probe 91. More specifically, the tentative contact position is corrected so that the positional deviation of the representative position of the wafer W from the representative position of the probe 91 is offset.

[0060] (Step S6: Retraction of the imaging unit 60) Furthermore, the housing 60a of the imaging unit 60 is retracted to a region that does not overlap with the chuck top 70 in a plan view. Specifically, the control unit 22 controls the imaging movement mechanism 100, and the housing 60a of the imaging unit 60 and the portions of the imaging movement mechanism 100 that may interfere with the chuck top 70 are retracted to a region between adjacent chuck tops 70 in the same divided region 13a. The order of steps S5 and S6 does not matter, and steps S5 and S6 may be performed simultaneously.

[0061] (Step S7: Raise the chuck top 70) Thereafter, the control unit 22 controls the aligner 50 to raise the chuck top 70. The raising continues until the wafer W and the probe 91 come into contact with each other.

[0062] At this time, the reference height of the chuck top 70, which is the reference for determining how far the chuck top 70 should be raised, is determined, for example, as follows. That is, for example, when the representative position of the wafer W is acquired in step S4, the height of the wafer W placed on the chuck top 70 (specifically, the height of the electrodes) and the height of the probe 91 are also acquired, and the control unit 22 determines the reference height of the chuck top 70 from these heights. The height of the wafer W placed on the chuck top 70 is acquired based on the imaging result of the first imaging unit 61 and the detection result of the position detection mechanism related to the vertical position of the imaging movement mechanism 100. The height of the probe 91 is obtained based on the imaging result of the second imaging unit 62 and the detection result of the position detection mechanism related to the vertical position of the imaging movement mechanism 100.

[0063] (Step S8: Adsorption of the chuck top 70) Thereafter, under the control of the control unit 22, the chuck top 70 is attracted to the pogo frame 80 by suction. Specifically, while the wafer W and the probe 91 are in contact with each other, a pressure reduction mechanism (not shown) is controlled and the Z stage 53 of the aligner 50 is lowered, thereby separating the chuck top 70 from the aligner 50 and adsorbing it to the pogo frame 80.

[0064] (Step S9: Inspection) After the chuck top 70 and the aligner 50 are separated, an electrical characteristic test of the electronic devices formed on the wafer W is performed. An electrical signal for testing electrical characteristics is input from the tester 40 to the electronic device via the pogo pins 81, probes 91, and the like.

[0065] (Step S10: Carry-out) Thereafter, the inspected wafer W is carried out. Specifically, the chuck top 70 that has been adsorbed to the pogo frame 80 is transferred to and held by the aligner 50. Furthermore, the inspected wafer W on the chuck top 70 held by the aligner 50 is carried out of the inspection area 13 by the transfer device 30 and returned to the cassette C in the port 20 of the carry-in / out area 11. During the inspection in one tester 40, the aligner 50 or the like transports the wafer W to be inspected to another tester 40 and collects the inspected wafer W from the other tester 40.

[0066] <Major Effects of This Embodiment> In the embodiment described with reference to FIGS. 1 and 2 (hereinafter referred to as the comparative embodiment), the wafer W on the chuck top 503 in the inspection apparatus 500 is aligned with the probes 501a of the probe card 501 using the image of the wafer W, as in the present embodiment. However, unlike the present embodiment, when the wafer W is imaged in the comparative embodiment, the chuck top 503 is positioned in an area that does not overlap with the probe card 501 in a plan view, and there is a distance to the contact position below the probe card 501. Therefore, if there is distortion in the frame on which the aligner 504 is installed, the comparative embodiment may not be able to accurately align the wafer W with the probes 501a. In contrast, in the present embodiment, when the wafer W on the chuck top 70 is imaged, the chuck top 70 is positioned below the contact position of the probe card 90. Therefore, even if there is distortion in the housing 10 on which the aligner 50 is installed, the wafer W can be brought into more appropriate contact with the probes 91 than in the comparative embodiment. In other words, according to the present embodiment, the wafer W can be more accurately aligned with the probes 91 of the probe card 90. The distortion of the housing 10 and the like can occur on the order of μm due to, for example, expansion or contraction of the housing 10 caused by temperature changes, or changes in the center of gravity of the multiple aligners 50 inside the housing 10.

[0067] Also, unlike the comparative example, in this embodiment, there is no need to move the chuck top 70 between imaging the wafer W on the chuck top 70 and imaging the probe 91. Therefore, according to this embodiment, the time required to align the wafer W and the probe 91 can be reduced. Also, in the comparative example, there are cases where it is necessary to image a common target with the upper camera 510 and the lower camera 511. In this embodiment, such imaging is not necessary, and therefore, from this perspective as well, the time required for alignment can be reduced.

[0068] Furthermore, in this embodiment, the imaging unit 60 is provided so as to be shared among a plurality of horizontally arranged testers 40, i.e., among the pogo frames 80. Specifically, the imaging unit 60 is provided so as to be shared among horizontally adjacent testers 40, i.e., among the pogo frames 80. Therefore, compared to the case where an imaging unit 60 is provided for each tester 40, i.e., each pogo frame 80, costs can be reduced and the footprint of the inspection device 1 can be made smaller.

[0069] <Modification> In the above example, the first imaging unit 61 and the second imaging unit 62 are provided coaxially, but the optical axis of the first imaging unit 61 and the optical axis of the second imaging unit 62 may be misaligned. In this case, the contact position is determined, for example, as follows: That is, the provisional contact position after correction based on the imaging results of the first imaging unit 61 and the second imaging unit 62 is calibrated based on the positional relationship between the optical axis of the first imaging unit 61 and the optical axis of the second imaging unit 62, and the provisional contact position after correction and calibration is determined as the contact position. However, when there is a misalignment, it is difficult to accurately grasp the positional relationship between the optical axis of the first imaging unit 61 and the optical axis of the second imaging unit 62, and the relationship changes due to distortion of the housing 10 caused by temperature, etc. Therefore, if the first imaging unit 61 and the second imaging unit 62 are provided on the same axis, the above-mentioned calibration is not required, and the appropriate contact position can be obtained more reliably, that is, appropriate alignment can be performed more reliably.

[0070] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive, and the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0071] 1. Inspection equipment 50 Aligner 60 Imaging unit 60a housing 61 First imaging unit 62 Second imaging unit 70 Zipper Top 80 Pogo Frame 90 probe cards 91 Probe 100 Imaging movement mechanism W wafer

Claims

1. An inspection device for inspecting a substrate, a mounting member on which a substrate is placed; a holder for holding a probe card having probes that contact electrodes on a substrate; a moving mechanism that holds and moves the mounting member; an imaging section including a first imaging unit that recognizes the substrate placed on the mounting member and a second imaging unit that recognizes the probe of the probe card held in the holding section, the first imaging unit and the second imaging unit being fixed to a common housing; an imaging moving mechanism that moves the housing of the imaging unit, aligning the substrate placed on the mounting member with the probe of the probe card based on the imaging results by the first imaging unit and the second imaging unit in a state where the mounting member on which the substrate is placed is positioned below the probe card held by the holding section; An inspection device, wherein the first imaging unit and the second imaging unit each have a camera whose optical axis extends in the vertical direction, and the cameras are arranged coaxially with each other.

2. A plurality of the holding portions are arranged in a horizontal direction, The inspection device according to claim 1 , wherein the imaging unit is provided so as to be shared by a plurality of the holding units arranged in a horizontal direction.

3. The inspection device according to claim 1 , wherein the imaging moving mechanism moves the housing of the imaging unit in horizontal and vertical directions.

4. 4. The inspection device according to claim 1, wherein the first imaging unit has a camera that captures images at a low resolution and a camera that captures images at a high resolution.

5. 5. The inspection device according to claim 1, wherein the second imaging unit has a camera that captures images at a low resolution and a camera that captures images at a high resolution.

6. An inspection method for inspecting a substrate using an inspection device, comprising: The inspection equipment is a mounting member on which a substrate is placed; a holder for holding a probe card having probes that contact electrodes on a substrate; an imaging section having a first imaging unit that recognizes a substrate placed on the mounting member and a second imaging unit that recognizes the probe of the probe card held in the holding section, the first imaging unit and the second imaging unit being fixed to a common housing; the first imaging unit and the second imaging unit each have a camera whose optical axis extends in a vertical direction, and the cameras are provided coaxially; a step of moving the mounting member on which the substrate is placed below the probe card held by the holding unit; Thereafter, a step of capturing images by the first imaging unit and the second imaging unit from between the probe card and the mounting member; and then aligning the substrate placed on the mounting member with the probes of the probe card based on the imaging results obtained by the first imaging unit and the second imaging unit.

7. 7. The inspection method according to claim 6, wherein the alignment step includes a step of correcting a contact position, which is the position of the mounting member when the probe is brought into contact with the substrate placed on the mounting member, based on the imaging results obtained by the first imaging unit and the second imaging unit.

8. 8. The inspection method according to claim 6, further comprising the step of lifting the mounting member after the alignment.

9. 9. The inspection method according to claim 8, further comprising, between the step of taking the image and the step of lifting the mounting member, a step of retracting a housing of the imaging unit to an area that does not overlap with the mounting member in a plan view.

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