Head and substrate processing machine

Abstract

To provide a head and a board-to-board machine capable of recognizing a reference member using side light incident from a direction oblique to the vertical direction.SOLUTION: A head includes a reference member and a diffusing member. The reference member is a member provided in the head of a board-to-board machine that performs a predetermined board-to-board work, and is imaged by an imaging device and optically recognized. The diffusing member is a member on which the reference member is arranged in the head, and diffusely reflects incident side light from a direction inclined with respect to the vertical direction in a plurality of directions including a direction toward the imaging device provided below in the vertical direction.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] This specification discloses a technique relating to a head and a substrate-related operating machine. [Background technology]

[0002] The component transfer device described in Patent Document 1 includes an imaging device, a reference member, a first light irradiation device, and a second light irradiation device. The imaging device images the components picked up by the picking device from below. The reference member is imaged simultaneously when the components are picked up by the imaging device, and is provided with a reference mark that serves as a reference when processing the component image. The first light irradiation device irradiates the components and reference member from below with light that is inclined at a predetermined angle with respect to the optical axis of the imaging device. The second light irradiation device irradiates the components and reference member from below with light that is parallel to the optical axis.

[0003] The reference member described in Patent Document 1 includes a light-shielding wall that blocks light irradiated from the first light irradiation device onto the reference mark. Therefore, of the light irradiated onto the reference mark, the light irradiated from the first light irradiation device is blocked, and the light irradiated from the second light irradiation device is mainly irradiated. As a result, the component transfer device described in Patent Document 1 aims to keep the brightness of the reference mark roughly constant regardless of the size of the component picked up by the picking device, and to stably capture images of the reference mark. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-103201 Summary of the Invention [Problem to be solved by the invention]

[0005] There is a demand for recognizing a reference member using side light incident from a direction inclined relative to the vertical direction.

[0006] In view of the above circumstances, this specification discloses a head and a substrate-related operation apparatus that can recognize a reference member using side light that is incident from a direction inclined relative to the vertical direction. [Means for solving the problem]

[0007] This specification discloses a head including a reference member and a diffusing member. The reference member is a member provided on a head of a substrate-related operation machine that performs a predetermined substrate-related operation on a substrate, and is imaged and optically recognized by an imaging device. The diffusing member is a member on the head on which the reference member is disposed, and diffuses incident lateral light from a direction inclined with respect to the vertical direction in multiple directions, including a direction toward the imaging device provided below the vertical direction. [Effects of the Invention]

[0008] The head includes a diffusing member, so that lateral light incident on the diffusing member from a direction inclined relative to the vertical direction is diffused and reaches the imaging device provided vertically below. Therefore, the reference member is recognized using the lateral light incident from a direction inclined relative to the vertical direction. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a diagram showing a configuration example of a substrate-related work line; [Figure 2] FIG. 2 is a plan view showing a configuration example of a component mounting machine. [Figure 3] 10A and 10B are schematic diagrams illustrating an example of a reference member and a base member as viewed from the imaging device side according to a reference embodiment. [Figure 4] 10A and 10B are side views showing configuration examples of a light source and an imaging device when capturing images of a reference member and a base member using incident light according to a reference embodiment. [Figure 5] 10 is a side view showing a configuration example of a light source and an imaging device when an image of a bump component is captured by side light according to a reference embodiment. FIG. [Figure 6]5A and 5B are schematic diagrams illustrating an example of a reference member and a diffusion member as viewed from the imaging device side in the embodiment. [Figure 7] 10 is a side view showing an example of the configuration of a light source and an imaging device when capturing images of a reference member, a diffusion member, and a bump component using side light in the embodiment. FIG. [Figure 8] 7 is a cross-sectional view showing an example of a cross section of the reference member and the diffusion member of FIG. 6. FIG. [Figure 9] 9 is a schematic diagram showing an example of an image of the reference member and the diffusion member in FIG. 8 captured by an imaging device. [Figure 10] FIG. 10 is a cross-sectional view showing another example of a cross section of the reference member and the diffusion member. [Figure 11] 11 is a schematic diagram showing an example of an image of the reference member and the diffusion member of FIG. 10 captured by an imaging device. FIG. [Figure 12] 10A and 10B are side views showing an example of the configuration of a light source and an imaging device when capturing images of a reference member, a diffusion member, and a non-bump component using incident light in the embodiment. [Figure 13] FIG. 10 is a block diagram showing an example of a control block related to the recognition of a reference member. [Figure 14] 10 is a flowchart illustrating an example of a control procedure for recognizing a reference member. [Figure 15] FIG. 10 is a schematic diagram showing an example of the relationship between the reference position of the head and the attitude of the component. DETAILED DESCRIPTION OF THE INVENTION

[0010] 1. Embodiment 1-1. Example of the configuration of the board-to-board work line WL0 In the substrate-related work line WL0, substrate-related work machines WM0 perform predetermined substrate-related work on substrates 90. There are no limitations on the types and number of substrate-related work machines WM0 that make up the substrate-related work line WL0. As shown in Fig. 1, the substrate-related work line WL0 of the embodiment is equipped with multiple substrate-related work machines WM0, including a printer WM1, a print inspection machine WM2, a component mounting machine WM3, a reflow furnace WM4, and a visual inspection machine WM5, and the substrates 90 are transported in the above order by a substrate transport device.

[0011] The printer WM1 prints solder at the mounting positions of multiple components 91 on the board 90. The print inspection machine WM2 inspects the printing condition of the solder printed by the printer WM1. As shown in FIG. 2, the component mounting machine WM3 mounts multiple components 91 on the board 90 on which solder has been printed by the printer WM1. There may be one or more component mounting machines WM3. When multiple component mounting machines WM3 are provided, the multiple component mounting machines WM3 can share the mounting work of multiple components 91.

[0012] The reflow furnace WM4 heats the board 90 on which multiple components 91 have been mounted by the component mounting machine WM3, melting the solder and performing soldering. The visual inspection machine WM5 inspects the mounting state of the multiple components 91 mounted by the component mounting machine WM3. In this way, the board-related work line WL0 uses multiple board-related work machines WM0 to sequentially transport the boards 90 and perform production processes including inspection processes to produce board products 900. Note that the board-related work line WL0 can also be equipped with board-related work machines WM0 such as a function inspection machine, a buffer device, a board supply device, a board inverting device, a shield mounting device, an adhesive application device, and an ultraviolet irradiation device as needed.

[0013] The substrate-related performing machines WM0 and the line management device LC0 that make up the substrate-related performing line WL0 are communicatively connected by a communication unit. The line management device LC0 and the management device HC0 are communicatively connected by the communication unit. The communication unit can communicatively connect them by wire or wirelessly, and various communication methods can be used.

[0014] In the embodiment, a local area network (LAN) is configured by the plurality of substrate-related performing machines WM0, the line management device LC0, and the management device HC0. Therefore, the plurality of substrate-related performing machines WM0 can communicate with each other via the communication unit. Furthermore, the plurality of substrate-related performing machines WM0 can communicate with the line management device LC0 via the communication unit. Furthermore, the line management device LC0 and the management device HC0 can communicate with each other via the communication unit.

[0015] The line management device LC0 controls the multiple substrate-related performing machines WM0 that make up the substrate-related performing line WL0 and monitors the operating status of the substrate-related performing line WL0. The line management device LC0 stores various control data for controlling the multiple substrate-related performing machines WM0. The line management device LC0 transmits the control data to each of the multiple substrate-related performing machines WM0. Furthermore, each of the multiple substrate-related performing machines WM0 transmits its operating status and production status to the line management device LC0.

[0016] The management device HC0 manages at least one line management device LC0. For example, the operating status and production status of the substrate-related performing machine WM0 acquired by the line management device LC0 are transmitted to the management device HC0 as necessary. The management device HC0 is provided with a storage device. The storage device can store various acquired data acquired by the substrate-related performing machine WM0. For example, various image data captured by the substrate-related performing machine WM0 is included in the acquired data. A record (log data) of the operating status acquired by the substrate-related performing machine WM0 is also included in the acquired data. The storage device can also store various production information related to the production of the board products 900.

[0017] 1-2. Example of component placement machine WM3 configuration The component mounting machine WM3 mounts a plurality of components 91 on a board 90. As shown in FIG. 2 , the component mounting machine WM3 includes a board transport device 11, a component supply device 12, a component transfer device 13, a component camera 14, a board camera 15, and a control device 16.

[0018] The board transport device 11 is configured, for example, by a belt conveyor or the like, and transports the board 90 in a transport direction (X-axis direction). The board 90 is a circuit board on which electronic circuits, electric circuits, magnetic circuits, etc. are formed. The board transport device 11 transports the board 90 into the component mounting machine WM3 and positions the board 90 at a predetermined position within the machine. After the component mounting machine WM3 has completed the mounting process of multiple components 91, the board transport device 11 transports the board 90 out of the component mounting machine WM3.

[0019] The component supply device 12 supplies a plurality of components 91 to be mounted on the board 90. The component supply device 12 includes a plurality of feeders 12a arranged along the conveyance direction (X-axis direction) of the board 90. Each of the plurality of feeders 12a is equipped with a reel. A carrier tape storing a plurality of components 91 is wound around the reel. The feeder 12a feeds the carrier tape by a pitch to supply the components 91 so that they can be picked up at a supply position located at the tip side of the feeder 12a. The component supply device 12 can also supply electronic components (e.g., lead components) that are relatively large compared to chip components and the like, arranged on a tray.

[0020] The component transfer device 13 includes a head driver 13a and a movable table 13b. The head driver 13a is configured to move the movable table 13b in the X-axis direction and the Y-axis direction (directions perpendicular to the X-axis direction in a horizontal plane) using a linear motion mechanism. A mounting head 20m is detachably (replaceably) attached to the movable table 13b using a clamping member. The mounting head 20m uses at least one holding member 30 to pick up and hold components 91 supplied by the component supply device 12, and mounts the components 91 on the board 90 positioned by the board transport device 11. The holding member 30 can be, for example, a suction nozzle or a chuck.

[0021] The component camera 14 and the board camera 15 may be made of known imaging devices. The component camera 14 is fixed to the base of the component mounting machine WM3 so that its optical axis faces upward in the vertical direction (the Z-axis direction, which is perpendicular to the X-axis and Y-axis directions). The component camera 14 can capture images of components 91 and the like held by the holding member 30 from below. The board camera 15 is mounted on the movable stage 13b of the component transfer device 13 so that its optical axis faces downward in the vertical direction (the Z-axis direction). The board camera 15 can capture images of the board 90 and the like from above. The component camera 14 and the board camera 15 capture images based on control signals sent from the control device 16. Image data of the images captured by the component camera 14 and the board camera 15 is sent to the control device 16.

[0022] The control device 16 includes a known arithmetic unit and memory device, and forms a control circuit. Information output from various sensors provided in the component placement machine WM3, image data, etc. are input to the control device 16. The control device 16 sends control signals to each device based on a control program and predetermined placement conditions, etc.

[0023] For example, the control device 16 causes the board camera 15 to capture an image of the board 90 positioned by the board transport device 11. The control device 16 processes the image captured by the board camera 15 to recognize the positioning state of the board 90. The control device 16 also causes the holding member 30 to pick up and hold the component 91 supplied by the component supply device 12, and causes the component camera 14 to capture an image of the component 91 held by the holding member 30. The control device 16 processes the image captured by the component camera 14 to recognize the posture of the component 91.

[0024] The control device 16 moves the holding member 30 toward above the intended placement position that is set in advance by a control program or the like. The control device 16 also corrects the intended placement position based on the positioning state of the board 90, the attitude of the component 91, and the like, and sets the placement position where the component 91 will actually be placed. The intended placement position and the placement position include a rotation angle in addition to the position (X-axis coordinate and Y-axis coordinate).

[0025] The control device 16 corrects the target position (X-axis coordinate and Y-axis coordinate) and rotation angle of the holding member 30 to match the mounting position. The control device 16 lowers the holding member 30 at the corrected rotation angle in the corrected target position to mount the component 91 on the board 90. The control device 16 repeats the above pick-and-place cycle to perform the mounting process of mounting multiple components 91 on the board 90.

[0026] 1-3. Head 20 configuration example A head 20 such as the mounting head 20m is provided with a reference member 21 at a position facing an imaging device 40 such as the component camera 14. The reference member 21 is a member provided on the head 20 of the substrate-related performing machine WM0, and is imaged and optically recognized by the imaging device 40. The substrate-related performing machine WM0 recognizes a reference position C0 of the head 20 based on the center position of the reference member 21, and performs various substrate-related performing operations based on the recognized reference position C0.

[0027] 1-3-1. Reference head 20 As shown in FIGS. 3 to 5, a plurality of (four in the figures) reference members 21 are provided on a base member 20a. The base member 20a is a member on which the reference members 21 are arranged in the head 20, and is formed, for example, in a cylindrical shape. The base member 20a has, for example, a plurality of (four) cylindrical holes 20a1 formed at equal positions (at the corners of a square when viewed from the imaging device 40 side). A cylindrical reference member 21 is embedded in each hole 20a1.

[0028] For example, the base member 20a is made of metal. The multiple (four) reference members 21 are made of a material (e.g., resin) with lower reflectivity than the base member 20a. In this case, the multiple (four) reference members 21 and the base member 20a can be imaged using incident light incident from a direction along the vertical direction (Z-axis direction). Specifically, as shown in FIG. 4, the light source 50 of the imaging device 40 of the reference embodiment includes an incident-light source 50a and an incident-light converter 50b.

[0029] The incident light source 50a is a light source that emits incident light. The incident light converter 50b converts the light emitted from the incident light source 50a into incident light and illuminates the multiple (four) reference members 21 and the base member 20a from below in the vertical direction (Z-axis direction). The incident light source 50a can be, for example, a known light-emitting diode, and the wavelength of the emitted light is not limited. The incident light converter 50b can be, for example, a half mirror.

[0030] As shown in FIG. 4, the incident light source 50a irradiates light horizontally toward the incident light converter 50b (arrow L11). The irradiated light from the incident light source 50a is reflected by the incident light converter 50b and travels toward the multiple (four) reference members 21 and the base member 20a (arrow L12). Because the base member 20a is made of metal, the incident light that reaches the base member 20a is totally reflected. The reflected light that is totally reflected by the base member 20a travels toward the lens 40b of the imaging device 40 (arrow L13). The reflected light that reaches the lens 40b passes through the lens 40b and travels toward the imaging element 40a (arrow L14).

[0031] The multiple (four) reference members 21 are formed of a material (e.g., resin) with a lower reflectivity than the base member 20a, so the amount of light reflected by the multiple (four) reference members 21 is less than the light reflected by the base member 20a. Therefore, in the image captured by the imaging device 40, the brightness of the area where the multiple (four) reference members 21 are provided is lower than that of the base member 20a, and the outer shape (circular in this case) of each of the multiple (four) reference members 21 can be recognized.

[0032] For example, assume that head 20 is mounting head 20m. As described above, mounting head 20m uses at least one holding member 30 to pick up and hold components 91 to be mounted on board 90, and mounts the components 91 on the positioned board 90. If the components 91 are bump components 91a with an array of bumps 92, it is difficult to capture an image of the bump components 91a using incident light.

[0033] 4, the incident light source 50a irradiates light horizontally toward the incident light converting unit 50b (arrow L21). The light emitted from the incident light source 50a is reflected by the incident light converting unit 50b and travels toward the bump component 91a (arrow L22). Because the bump component 91a has a hemispherical bump 92, the incident light that reaches the bump component 91a is scattered by the bump 92 and does not reach the lens 40b of the imaging device 40 (arrow L23).

[0034] 5, the light source 50 of the imaging device 40 of the reference embodiment includes a side-emitting light source 50c. The side-emitting light source 50c is a light source that emits side-emitting light. For example, a known light-emitting diode can be used as the side-emitting light source 50c, and the wavelength of the emitted light is not limited.

[0035] 5, the side-emitting light source 50c emits side-emitting light from a direction inclined with respect to the vertical direction (Z-axis direction) (arrow L31). The side-emitting light that reaches the bump component 91a is reflected by the bump 92 and travels toward the lens 40b of the imaging device 40 (arrow L32). The reflected light that reaches the lens 40b passes through the lens 40b and travels toward the imaging element 40a (arrow L33). This allows the imaging device 40 to capture an image of the bump component 91a.

[0036] However, it is difficult to capture images of the multiple (four) reference members 21 and the base member 20a using side light. Specifically, as shown in Fig. 5, since the base member 20a is made of metal, the side light emitted from the side-emitting light source 50c is totally reflected and does not reach the lens 40b of the imaging device 40 (arrows L41 and L42).

[0037] The imaging device 40 of the reference embodiment is required to capture images of the multiple (four) reference members 21 and base members 20a using incident light, and to capture images of the bump components 91a using side light. If the multiple (four) reference members 21 and base members 20a can be captured using side light, the multiple (four) reference members 21, base members 20a, and bump components 91a can be captured in one image capture. Thus, there is a demand for recognizing the reference members 21 using side light incident from a direction inclined with respect to the vertical direction (Z-axis direction).

[0038] 1-3-2. Head 20 of the embodiment The head 20 of the embodiment differs from the head 20 of the reference embodiment in that it includes a diffusion member 22 instead of a base member 20a. As shown in FIGS. 6 to 12, the head 20 of the embodiment includes a reference member 21 and a diffusion member 22. As described above, the reference member 21 is a member provided on the head 20 of the substrate-related performing machine WM0, and is imaged and optically recognized by the imaging device 40. The reference member 21 may take various forms as long as it can be imaged and optically recognized by the imaging device 40.

[0039] The diffusing member 22 is a member on which the reference member 21 is disposed in the head 20, and diffuses side light incident from a direction inclined with respect to the vertical direction (Z-axis direction) in multiple directions including the direction toward the imaging device 40 provided below in the vertical direction (Z-axis direction). The diffusing member 22 may take various forms as long as it can diffusely reflect the side light in multiple directions including the above-mentioned directions. Furthermore, the diffusing member 22 is provided with at least one reference member 21, and the number and arrangement of the reference members 21 are not limited.

[0040] As shown in FIGS. 6 to 8, the diffusing member 22 of the embodiment is formed, for example, in a cylindrical shape. The diffusing member 22 has, for example, a plurality of cylindrical (four in the figure) holes 22a formed at equal positions (at the corners of a square when viewed from the imaging device 40 side). A cylindrical reference member 21 is embedded in each hole 22a, and the diffusing member 22 is provided with a plurality of (four in this case) reference members 21. The head 20 of the embodiment includes one diffusing member 22 provided with a plurality of (four) reference members 21. The head 20 can also include a diffusing member 22 with at least one reference member 21 provided in each of a plurality of portions facing the imaging device 40.

[0041] Furthermore, at least the diffusion member 22 of the reference member 21 and the diffusion member 22 can be made of resin. In the embodiment, the reference member 21 and the diffusion member 22 are both made of resin. In this case, for example, each of the multiple (four) reference members 21 can be press-fitted into the hole 22a of the diffusion member 22 and fixed to a predetermined depth in the hole 22a with an adhesive.

[0042] As shown in FIG. 7, the light source 50 of the imaging device 40 of this embodiment includes a side-emitting light source 50c. The side-emitting light source 50c is a light source that emits side-emitting light. For example, a known light-emitting diode can be used as the side-emitting light source 50c, and the wavelength of the emitted light is not limited. As shown in FIGS. 7 and 8, the side-emitting light source 50c emits side-emitting light from a direction inclined with respect to the vertical direction (Z-axis direction) (arrow L51). Because the diffusing member 22 is made of resin, the side-emitting light incident on the diffusing member 22 is diffused in multiple directions, including a direction (arrow L52) toward the imaging device 40 located below in the vertical direction (Z-axis direction) (for example, arrow L52, arrow L52a, and arrow L52b).

[0043] Furthermore, the lateral light incident on the diffusing member 22 travels inside the diffusing member 22 and is diffusely reflected therein. The above-described diffuse reflection is repeated, and the diffusing member 22 acts as a secondary light source for the lateral light by the diffused reflection. The reflected light traveling in the vertical direction (Z-axis direction) toward the imaging device 40 provided below travels toward the lens 40b (arrow L52). The reflected light that reaches the lens 40b passes through the lens 40b and travels toward the imaging element 40a (arrow L53).

[0044] For example, the diffusing member 22 can be made of white resin. The reference member 21 can be made of black resin. The diffusing member 22 made of white resin has a higher reflectance for lateral light than the reference member 21 made of black resin. In other words, the diffusing member 22 has a reflectance that results in a higher brightness for lateral light than the reference member 21 in the image PC0 captured by the imaging device 40 of the reference member 21 and the diffusing member 22.

[0045] In other words, the multiple (four) reference members 21 have a lower reflectance of side light than the diffusing member 22, and therefore the brightness of the reflected light diffused by the multiple (four) reference members 21 is lower than the brightness of the reflected light diffused by the diffusing member 22. Therefore, in the image PC0 captured by the imaging device 40, the brightness of the area where the multiple (four) reference members 21 are provided is lower than the brightness of the diffusing member 22, and the outer shape (circular in this case) of each of the multiple (four) reference members 21 can be recognized.

[0046] 9 shows an example of an image PC0 captured by the imaging device 40 of the reference member 21 and the diffusion member 22 of FIG. 8. The surface of the reference member 21 shown in FIG. 8 that faces the imaging device 40 is embedded at the same position as the surface of the diffusion member 22. Therefore, side light is diffused in the peripheral area AR0 of the reference member 21, and the outer edge of the reference member 21 (the boundary between the reference member 21 and the diffusion member 22) shown in the image PC0 of FIG. 9 is blurred. When the outer edge of the reference member 21 is blurred, it becomes difficult to accurately recognize the center position of the reference member 21, and it also becomes difficult to accurately recognize the reference position C0 of the head 20.

[0047] 10, it is preferable that the reference member 21 is buried at a depth D0 at which the boundary between the reference member 21 and the diffusion member 22 becomes clear in an image PC0 captured by the imaging device 40 of the reference member 21 and the diffusion member 22. The depth D0 can be obtained by simulation, verification using an actual device, or the like.

[0048] 11 shows an example of an image PC0 captured by the imaging device 40 of the reference member 21 and the diffusion member 22 of FIG. 10. The reference member 21 shown in FIG. 10 is buried at the depth D0 described above. Therefore, even if side light is diffusely reflected in the peripheral area AR0 of the reference member 21, blurring of the outer edge of the reference member 21 is unlikely to appear on the surface of the diffusion member 22, and the boundary between the reference member 21 and the diffusion member 22 is clear in the image PC0 shown in FIG. 11. This improves the accuracy of recognizing the center position of the reference member 21, and improves the accuracy of recognizing the reference position C0 of the head 20.

[0049] In the above-described embodiment, the diffusing member 22 is made of resin. However, the diffusing member 22 can also be made of various materials capable of diffuse reflection (for example, glass, etc.). The diffusing member 22 may have an uneven surface formed thereon so as to diffusely reflect side light. For example, the surface of the diffusing member 22 can be unevenly formed by known surface processing such as blasting so as to diffusely reflect side light.

[0050] For example, assume that head 20 is mounting head 20m. As described above, mounting head 20m uses at least one holding member 30 to pick up and hold components 91 to be mounted on board 90, and mounts the components 91 on the positioned board 90. Furthermore, if the components 91 are bump components 91a having a plurality of bumps 92 arranged thereon, imaging device 40 can capture an image of bump components 91a using side light.

[0051] 7, the side-emitting light source 50c emits side-emitting light from a direction inclined with respect to the vertical direction (Z-axis direction) (arrow L61). The side-emitting light that reaches the bump component 91a is reflected by the bump 92 and travels toward the lens 40b of the imaging device 40 (arrow L62). The reflected light that reaches the lens 40b passes through the lens 40b and travels toward the imaging element 40a (arrow L63). This allows the imaging device 40 to capture an image of the bump component 91a.

[0052] In this way, the imaging device 40 can include a side-emitting light source 50c that emits side-emitting light when the component 91 is a bump component 91a having an array of multiple bumps 92. Furthermore, the imaging device 40 can obtain an image PC0 by capturing an image of the reference member 21, the diffusion member 22, and the bump component 91a using the side-emitting light source 50c.

[0053] The plurality of (four) reference members 21 and the diffusion member 22 can also be imaged using incident light. Specifically, as shown in FIG. 12 , the light source 50 of the imaging device 40 of this embodiment includes an incident-light source 50a and an incident-light converter 50b. The incident-light source 50a is a light source that irradiates incident light. The incident-light converter 50b converts the illumination light irradiated from the incident-light source 50a into incident light and illuminates the plurality of (four) reference members 21 and the diffusion member 22 from below in the vertical direction (Z-axis direction). The incident-light source 50a and the incident-light converter 50b can be known devices as described above in the reference embodiment.

[0054] 12, the incident-light source 50a irradiates light horizontally toward the incident-light converting unit 50b (arrow L71). The light emitted from the incident-light source 50a is reflected by the incident-light converting unit 50b and travels toward the multiple (four) reference members 21 and the diffusing member 22 (arrow L72). The incident light incident on the diffusing member 22 is diffused in multiple directions, including a direction toward the imaging device 40 provided below in the vertical direction (Z-axis direction) (arrow L73).

[0055] Furthermore, the incident light that is incident on the diffusing member 22 travels inside the diffusing member 22 and is diffusely reflected therein. The above-described diffuse reflection is repeated, and the diffusing member 22 acts as a secondary light source for the incident light due to the diffuse reflection. The reflected light traveling in the vertical direction (Z-axis direction) toward the imaging device 40 provided below travels toward the lens 40b (arrow L73). The reflected light that reaches the lens 40b passes through the lens 40b and travels toward the imaging element 40a (arrow L74).

[0056] In this way, the diffusing member 22 acts as a secondary light source by diffused reflection for both incident light and lateral light that are incident from a direction along the vertical direction (Z-axis direction). Therefore, the imaging device 40 can capture images of the multiple (four) reference members 21 and the diffusing member 22 using either incident light or lateral light.

[0057] Furthermore, as described above, for example, the diffusing member 22 can be made of white resin. The reference member 21 can be made of black resin. The diffusing member 22 made of white resin has a higher reflectance for lateral light than the reference member 21 made of black resin. The same applies to incident light. In other words, the diffusing member 22 has a reflectance that results in a higher brightness than the reference member 21 in the image PC0 captured by the imaging device 40 of the reference member 21 and the diffusing member 22 for both incident light and lateral light incident from a direction along the vertical direction (Z-axis direction).

[0058] In other words, the multiple (four) reference members 21 have lower reflectance for incident light and lateral light than the diffusing member 22, and therefore the brightness of the light diffused by the multiple (four) reference members 21 is lower than the brightness of the light diffused by the diffusing member 22. Therefore, in the image PC0 captured by the imaging device 40, the brightness of the area where the multiple (four) reference members 21 are provided is lower than the brightness of the diffusing member 22, and the outer shape (circular in this case) of each of the multiple (four) reference members 21 can be recognized.

[0059] If the component 91 is a non-bump component 91b that does not have bumps 92, the imaging device 40 can capture an image of the non-bump component 91b using incident light. Specifically, as shown in FIG. 12, the incident-light source 50a irradiates light horizontally toward the incident-light converter 50b (arrow L81). The irradiated light from the incident-light source 50a is reflected by the incident-light converter 50b and travels toward the non-bump component 91b (arrow L82). The reflected light reflected by the non-bump component 91b travels toward the lens 40b of the imaging device 40 (arrow L83). The reflected light that reaches the lens 40b passes through the lens 40b and travels toward the imaging element 40a (arrow L84). This allows the imaging device 40 to capture an image of the non-bump component 91b.

[0060] In this way, when the component 91 is a non-bump component 91b that does not have bumps 92, the imaging device 40 can include an incident light source 50a that irradiates incident light that is incident on the diffusion member 22 from a direction along the vertical direction (Z-axis direction). Furthermore, the imaging device 40 can obtain an image PC0 by capturing an image of the reference member 21, the diffusion member 22, and the non-bump component 91b using the incident light source 50a.

[0061] The imaging device 40 may also be equipped with both the incident-light source 50a and the side-light source 50c. In this case, the imaging device 40 can acquire an image PC0 by capturing an image of the reference member 21, the diffusion member 22, and the bump component 91a using the side-light source 50c. The imaging device 40 can also acquire an image PC0 by capturing an image of the reference member 21, the diffusion member 22, and the non-bump component 91b using the incident-light source 50a.

[0062] 1-4. Control example regarding recognition of reference member 21 The substrate-related performing operation machine WM0 includes a head 20, an imaging device 40, and a recognition unit 60. The head 20 and the imaging device 40 may have any of the configurations described above. The recognition unit 60 can be provided in various control devices. For example, the recognition unit 60 can be provided in the control device 16 of the component mounting machine WM3, the line management device LC0, the management device HC0, etc. The recognition unit 60 can also be formed on the cloud. As shown in FIG. 13, the recognition unit 60 in this embodiment is provided in the control device 16 of the component mounting machine WM3.

[0063] Control related to the recognition of the reference member 21 is executed according to the flowchart shown in Fig. 14. The imaging device 40 performs the process shown in step S11. The recognition unit 60 performs the processes shown in steps S12 and S13. As described above, the imaging device 40 can acquire an image PC0 obtained by capturing an image of the reference member 21, the diffusion member 22, and the bump component 91a using the side-emitting light source 50c (step S11).

[0064] The recognition unit 60 processes the image PC0 of the reference member 21, the diffusion member 22, and the bump component 91a captured by the imaging device 40 using the side-emitting light source 50c to recognize the reference position C0 of the head 20, and recognizes the posture of the bump component 91a based on the recognized reference position C0 (steps S12 and S13). The image processing method is not limited. For example, the recognition unit 60 can binarize the image PC0 to recognize the outer shape (circle in the above-mentioned example) of each of the multiple (four) reference members 21. The recognition unit 60 can also binarize the image PC0 to recognize the reference marks and bumps 92 of the bump component 91a.

[0065] 15, the recognition unit 60 calculates the center position of each of the multiple (four) reference members 21 based on the outer shapes (circles) of the recognized multiple (four) reference members 21. The recognition unit 60 further calculates the center position of the calculated center positions of the multiple (four) reference members 21, and recognizes the calculated center position as the reference position C0 of the head 20. The recognition unit 60 recognizes the orientation of the bump component 91a based on the recognized reference position C0.

[0066] 15, the target center position P0 of the bump component 91a is, for example, a position spaced a predetermined distance downward on the paper surface from the reference position C0 (arrow L91). As shown in the dashed rectangle LP0, the target orientation of the bump component 91a is a state in which the center position P1 of the bump component 91a coincides with the target center position P0 and the longitudinal direction of the bump component 91a is arranged along the horizontal direction on the paper surface. As shown in the solid rectangle LP1, the actual orientation of the bump component 91a is such that the center position P1 has moved to a position spaced a predetermined distance downward on the paper surface from the target center position P0 (arrow L92), and the bump component 91a has rotated a predetermined angle clockwise with respect to the target orientation.

[0067] In the above example, the recognition unit 60 calculates the center position P1 of the bump component 91a based on the recognized reference mark of the bump component 91a and the bump 92. The center position P1 is spaced a predetermined distance below the target center position P0 on the paper, and the recognition unit 60 can recognize the above-mentioned positional deviation. Furthermore, the recognition unit 60 calculates the inclination of the bump component 91a based on the recognized reference mark of the bump component 91a and the bump 92. The bump component 91a has rotated a predetermined angle clockwise with respect to the above-mentioned target orientation, and the recognition unit 60 can recognize the above-mentioned angular deviation.

[0068] As described above, the imaging device 40 can also acquire an image PC0 obtained by capturing an image of the reference member 21, the diffusion member 22, and the non-bump component 91b using the incident-light source 50a (step S11). The recognition unit 60 performs image processing on the image PC0 obtained by capturing an image of the reference member 21, the diffusion member 22, and the non-bump component 91b by the imaging device 40 using the incident-light source 50a to recognize the reference position C0 of the head 20, and recognizes the orientation of the non-bump component 91b based on the recognized reference position C0 (steps S12 and S13). The recognition unit 60 can recognize the orientation of the non-bump component 91b in the same manner as in the case of the bump component 91a.

[0069] 2.Other In the embodiment described above, the substrate-related operation machine WM0 is the component mounting machine WM3. However, the substrate-related operation machine WM0 is not limited to the component mounting machine WM3, and can be applied to various types of substrate-related operation machines WM0 that are equipped with the head 20 and the imaging device 40.

[0070] Furthermore, in the embodiment described above, the head 20 is the mounting head 20m. However, the head 20 is not limited to the mounting head 20m, and can be applied to various heads 20 that recognize the reference member 21 using at least side light. For example, the head 20 may be a transfer head that uses at least one holding member 30 to collect and hold solder balls to be supplied to the board 90, and supply the solder balls to the positioned board 90. Furthermore, in the embodiment described above, the imaging device 40 is the component camera 14. However, the imaging device 40 is not limited to the component camera 14, and can be applied to various imaging devices 40 that capture at least an image of the reference member 21.

[0071] 3. Examples of Effects of the Embodiments According to the head 20, since the head 20 is provided with the diffusing member 22, the side light incident on the diffusing member 22 from a direction inclined with respect to the vertical direction (Z-axis direction) is diffused and reaches the imaging device 40 provided below in the vertical direction (Z-axis direction). Therefore, the reference member 21 is recognized using the side light incident from a direction inclined with respect to the vertical direction (Z-axis direction). [Explanation of symbols]

[0072] 20: head, 20m: mounting head, 21: reference member, 22: diffusion member, 30: holding member, 40: imaging device, 50a: incident light source, 50c: side light source, 60: Recognition unit, 90: Substrate, 91: Component, 91a: Bump component, 91b: Non-bump component, 92: Bump, PC0: Image, C0: Reference position, D0: Depth, WM0: Substrate work machine.

Claims

1. a reference member that is provided on a head of a substrate-related operation machine that performs a predetermined substrate-related operation on a substrate, the reference member being imaged by an imaging device and optically recognized; a diffusing member that is a member on which the reference member is disposed in the head and that diffuses incident lateral light from a direction inclined with respect to the vertical direction in a peripheral region of the reference member in a plurality of directions including a direction toward the imaging device that is provided below the reference member in the vertical direction; A head comprising:

2. A member provided on a head of a substrate-related operation machine that performs a predetermined substrate-related operation on a substrate, the reference member being imaged by an imaging device and optically recognized; a diffusing member that is a member on which the reference member is disposed in the head and that diffuses and reflects side light incident from a direction inclined with respect to the vertical direction in a plurality of directions including a direction toward the imaging device provided below in the vertical direction; Equipped with The reference member is a head embedded in the diffusion member.

3. 3. The head according to claim 2, wherein the reference member is buried at a depth such that a boundary between the reference member and the diffusing member becomes clear in an image captured by the imaging device of the reference member and the diffusing member.

4. 4. The head according to claim 1, wherein at least the diffusion member of the reference member and the diffusion member is made of resin.

5. 4. The head according to claim 1, wherein the diffusion member has a surface formed with irregularities so as to diffuse the side light.

6. A head as described in any one of claims 1 to 5, wherein the diffusing member has a reflectivity that makes the image of the reference member and the diffusing member captured by the imaging device brighter than the reference member, for both incident light and lateral light that are incident from a direction along the vertical direction.

7. The head according to any one of claims 1 to 6, wherein the diffusing member acts as a secondary light source by diffuse reflection for both incident light and lateral light that are incident from a direction along the vertical direction.

8. A member provided on a head of a substrate-related work machine that performs a predetermined substrate-related work on a substrate, the reference member being imaged by an imaging device and optically recognized; a diffusing member that is a member on which the reference member is disposed in the head and that diffuses and reflects side light incident from a direction inclined with respect to the vertical direction in a plurality of directions including a direction toward the imaging device provided below in the vertical direction; a head comprising: the imaging device; a recognition unit that processes images of the reference member and the diffusion member captured by the imaging device and recognizes the reference position of the head; Equipped with the head is a mounting head that picks up and holds a component to be mounted on the board using at least one holding member, and mounts the component on the positioned board; the imaging device includes a side-emitting light source that irradiates the side-emitting light when the component is a bump component having a plurality of bumps arranged thereon; The recognition unit recognizes the reference position of the head by processing images of the reference member, the diffusion member, and the bump component captured by the imaging device using the side-light source, and recognizes the posture of the bump component based on the recognized reference position.

9. the head is a mounting head that picks up and holds a component to be mounted on the board using at least one holding member, and mounts the component on the positioned board; the imaging device includes an incident light source that irradiates incident light that is incident on the diffusion member from a direction along the vertical direction when the component is a non-bump component that does not have a bump, 9. The substrate-related operating machine according to claim 8, wherein the recognition unit recognizes the reference position of the head by processing an image of the reference member, the diffusion member, and the non-bump component captured by the imaging device using the incident light source, and recognizes the posture of the non-bump component based on the recognized reference position.

Images