Apparatus for manufacturing resin molded products and method for manufacturing resin molded products

Abstract

To further improve performance in a manufacturing technology of a resin molded product using a heater.SOLUTION: A manufacturing method of a resin molded product includes: a step of arranging a first part constituting a resin molded product in a first mold; a step of placing a second part constituting the resin molded product in a second mold; a step of inserting a heater between the first mold and the second mold; a step of partially heating the first part and the second part with the heater; a step of evacuating the heater; a step of welding the first part and the second part; and a step of taking out the resin molded product containing the first part and the second part.SELECTED DRAWING: Figure 14

Description

[Technical Field]

[0001] The present invention relates to an apparatus for manufacturing a resin molded product, a method for manufacturing a resin molded product, and a mold. [Background technology]

[0002] Japanese Patent Application Laid-Open No. 2018-008404 (Patent Document 1) describes a technique related to a die slide injection method (DSI method), which is a type of injection molding method. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-008404 Summary of the Invention [Problem to be solved by the invention]

[0004] When a hollow molded product having an internal cavity is manufactured using injection molding technology, rather than manufacturing the hollow molded product as a single unit, it is sometimes possible to manufacture a plurality of partial molded products using injection molding technology and then bond the partial molded products together to produce the hollow molded product.

[0005] In this technique, for example, injection molding technology is also used when bonding multiple molded parts together, that is, instead of using an adhesive to bond the multiple molded parts together, the multiple molded parts are bonded together by injecting molten resin into the joining areas.

[0006] However, in the method of bonding multiple partial molded parts by pouring injected molten resin into the joint area, it can be difficult to obtain sufficient adhesive strength due to differences in the constituent materials and crystallinity of the multiple partial molded parts, and the small amount of heat applied to the joint area.

[0007] Therefore, for example, a technology has been developed for bonding multiple partial molded parts, in which, rather than using injected molten resin, a heater is inserted between the multiple partial molded parts, and the heat generated by the heater is used to melt the joints of the multiple partial molded parts themselves, and then pressure is applied to the melted joints to bond the multiple partial molded parts.

[0008] In this regard, the technique of bonding multiple molded parts using a heater is superior to the technique of bonding multiple molded parts using injected molten resin in that it can obtain sufficient bonding strength. However, even in the manufacturing technique of molded parts using a heater, innovations to further improve performance are desired. [Means for solving the problem]

[0009] In one embodiment, a manufacturing apparatus for resin molded products includes a first mold mounting section capable of mounting a first mold, a second mold mounting section capable of mounting a second mold having a cutout portion, and a heater movable to be inserted into a cavity formed by the first mold and the second mold, wherein when the heater is moved outside the cavity, the heater and the cutout portion overlap in a plan view.

[0010] An apparatus for manufacturing a resin molded product in one embodiment includes a heater swinging unit configured to swing a heater.

[0011] The apparatus for manufacturing a resin molded product in one embodiment includes a convection suppressing member that suppresses convection caused by heat generated by a heater inserted into a cavity.

[0012] In one embodiment, a manufacturing apparatus for resin molded products includes a centering mechanism that can be installed between the opposing first and second molds when a first mold is mounted in a first mold mounting section and a second mold is mounted in a second mold mounting section, and that can adjust the position of a heater inserted into a cavity to the center between the first and second molds.

[0013] In one embodiment, a manufacturing apparatus for resin molded products includes a first monitoring unit configured to be able to monitor the placement state of a first part, and a second monitoring unit configured to be able to monitor the placement state of a second part.

[0014] In one embodiment, a method for manufacturing a resin molded product includes a step of placing a first part that constitutes the resin molded product in a first mold, and a step of placing a second part that constitutes the resin molded product in a second mold.

[0015] In one embodiment, the mold has a cutout in which a portion of the heater can be placed.

[0016] The mold in one embodiment includes a recess in which a first portion constituting a resin molded product can be placed, and a chuck portion capable of fixing the first portion placed in the recess.

[0017] The mold in one embodiment includes a recess in which a second portion constituting a resin molded product can be placed, and a chuck portion capable of fixing the second portion placed in the recess. [Effects of the Invention]

[0018] According to one embodiment, it is possible to further improve the performance of the technology for manufacturing resin molded products using a heater. [Brief explanation of the drawings]

[0019] [Figure 1] FIG. 1 is a diagram illustrating a technique for manufacturing an integrated molded product by bonding two partial molded products that have been manufactured separately using injection molding technology. [Figure 2] FIG. 1 is a diagram illustrating a technique for manufacturing an integrated molded product by bonding two partial molded products that have been manufactured separately using injection molding technology. [Figure 3] 1(a) to 1(c) are schematic diagrams illustrating the "DSI method." [Figure 4] FIG. 1 is a diagram showing the configuration of a molded product manufacturing system that realizes the "HP-DSI method." [Figure 5] FIG. 2 is a diagram illustrating the operation of the molded product manufacturing system. [Figure 6] FIG. 2 is a diagram illustrating the operation of the molded product manufacturing system. [Figure 7] FIG. 1 is a diagram showing a schematic diagram of the "HP-IWM" system. [Figure 8] 1 is a flowchart outlining the operation of the "HP-IWM" system. [Figure 9] FIG. 1 is a diagram showing a configuration of an injection molding device. [Figure 10] 1A to 1C are diagrams illustrating the operation of an injection molding device. [Figure 11] 1A to 1C are diagrams illustrating the operation of an injection molding device. [Figure 12] FIG. 1 is a schematic diagram showing the configuration of a molded product manufacturing apparatus. [Figure 13] 10A and 10B are plan views showing the movement of the heater, in which FIG. 10A shows the heater in an inserted state, and FIG. 10B shows the heater in a retracted state. [Figure 14] 10 is a flowchart illustrating the operation of the molded product manufacturing apparatus. [Figure 15] 10 is a flowchart illustrating the operation of the molded product manufacturing apparatus. [Figure 16] 10A and 10B are diagrams illustrating the operation of the molded product manufacturing apparatus. [Figure 17] 17 is a diagram illustrating the operation of the molded product manufacturing apparatus following FIG. 16. FIG. [Figure 18] FIG. 10 is a plan view schematically showing a state in which a partially molded product fitted into a mold is fixed by a plurality of chuck portions. [Figure 19] 10A and 10B are diagrams showing an example of a method for fixing a partially molded product by a chuck portion. [Figure 20] 10A and 10B are diagrams showing an example of a method for fixing a partially molded product by a chuck portion. [Figure 21] 10A and 10B are diagrams showing another example of a method for fixing a partially molded product by a chuck portion. [Figure 22] 10A and 10B are diagrams showing another example of a method for fixing a partially molded product by a chuck portion. [Figure 23] 10A and 10B are diagrams illustrating the operation of the molded product manufacturing apparatus. [Figure 24] 24 is a diagram illustrating the operation of the molded product manufacturing apparatus following FIG. 23. FIG. [Figure 25] 25 is a diagram illustrating the operation of the molded product manufacturing apparatus following FIG. 24. FIG. [Figure 26] FIG. [Figure 27] 10A and 10B are diagrams illustrating the operation of the molded product manufacturing apparatus. [Figure 28] 28 is a diagram illustrating the operation of the molded product manufacturing apparatus following FIG. 27. [Figure 29] 29 is a diagram illustrating the operation of the molded product manufacturing apparatus following FIG. 28. FIG. [Figure 30] 29A to 29C are diagrams illustrating the operation of the molded product manufacturing apparatus. [Figure 31] 10 is a flowchart illustrating the operation of the molded product manufacturing apparatus. [Figure 32] 10 is a flowchart illustrating the operation of the molded product manufacturing apparatus. [Figure 33] FIG. 10 is a diagram illustrating room for improvement. [Figure 34] FIG. 10 is a diagram illustrating a first improvement point. [Figure 35] FIG. 1 is a diagram showing a "horizontal configuration" in schematic form. [Figure 36] FIG. 1 is a diagram illustrating a first solving means. [Figure 37] FIG. 1 is a diagram illustrating a specific configuration example 1. [Figure 38] FIG. 10 is a diagram illustrating a specific configuration example 2. [Figure 39] FIG. 10 is a diagram illustrating a configuration in which a centering mechanism is provided. [Figure 40] FIG. 10 is a diagram showing a fixing mechanism for fixing a heater configured as a non-contact heater. [Figure 41] FIG. 10 is a diagram showing a configuration example in which a centering mechanism, which is the third ingenuity, is adopted as a fixing mechanism for fixing a heater configured as a non-contact heater. [Figure 42] 10(a) and 10(b) are diagrams illustrating the operation of the centering mechanism. [Figure 43] FIG. 10 is a diagram showing a rack and pinion type centering mechanism. [Figure 44] 10A and 10B are diagrams illustrating a centering mechanism of a link mechanism type. DETAILED DESCRIPTION OF THE INVENTION

[0020] In all the drawings for explaining the embodiments, the same components are generally designated by the same reference numerals, and repeated explanations thereof will be omitted. In addition, hatching may be used even in plan views to make the drawings easier to understand.

[0021] <Basic manufacturing technology for hollow molded products> Hollow molded products having an internal cavity are formed, for example, by using injection molding technology. At this time, hollow molded products are rarely manufactured as a single unit by injection molding technology, and most hollow molded products are often manufactured by combining multiple partial molded products manufactured by injection molding technology.

[0022] For example, as shown in FIGS. 1 and 2, a partial molded product 1A and a partial molded product 1B, which are separately manufactured by injection molding, are bonded together to produce an integrally molded product 10.

[0023] Here, injection molding technology is also used when bonding multiple molded parts together. In other words, instead of using an adhesive to bond multiple molded parts, the multiple molded parts are bonded by injecting molten resin into the joint area. One such molding technology is called the "die slide injection method." In the following, the "die slide injection method" will be referred to as the "DSI method," and the "DSI method" will be explained.

[0024] <Explanation of the DSI Method> 3(a) to 3(c) are schematic diagrams illustrating the "DSI method."

[0025] 3(a), first, a mold 20A having a first molding area for forming the partial molded product 2A and a mold 20B having a second molding area for forming the partial molded product 2B are prepared. Then, with the molds 20A and 20B in a "mold closed" state, molten resin is poured into them to form the partial molded product 2A in the first molding area of ​​the mold 20A and the partial molded product 2B in the second molding area of ​​the mold 20B.

[0026] Next, as shown in Fig. 3(b), with the molds open, mold 20B is slid relative to mold 20A, so that partial molded products 2A and 2B are positioned opposite each other. After that, as shown in Fig. 3(c), with molds 20A and 20B in a "closed" state, molten resin is poured into the joint between partial molded products 2A and 2B. As a result, partial molded products 2A and 2B are bonded together by the molten resin to produce an integrated molded product.

[0027] <Room for improvement in the DSI Act> This type of injection molding technology is known as the "DSI method," but there is room for improvement in the "DSI method," as described below. Specifically, with the "DSI method," in which injected molten resin is poured into the joining area to bond partial molded parts 2A and 2B, it can be difficult to obtain sufficient adhesive strength due to differences in the constituent materials and crystallinity of partial molded parts 2A and 2B, as well as the small amount of heat applied to the joining area.

[0028] Therefore, for example, a technology has been developed to bond two partial molded parts together, which does not use injected molten resin as in the "DSI method," but rather inserts a heater between the two partial molded parts, uses the heat generated by the heater to melt the joint area between the two partial molded parts themselves, and then applies pressure to the molten joint area to bond the two partial molded parts.This technology, an improvement on the "DSI method," is called the "hot plate-die slide injection method" because it uses a heater.

[0029] Hereinafter, the "hot plate-die slide injection method" will be referred to as the "HP-DSI method," and this "HP-DSI method" will be explained.

[0030] <Explanation of the "HP-DSI method"> FIG. 4 is a diagram showing an example of the configuration of a molded product manufacturing system that realizes the "HP-DSI method."

[0031] 4, a molded product manufacturing system 100 has a mold clamping unit 30 attached to a movable movable platen 31. This mold clamping unit 30 is configured to be able to variably control the distance between the movable platen 31 and a fixed platen 35. A movable mold 32 and a fixed mold 33 can be disposed between the movable platen 31 and the fixed platen 35. As a result, for example, by variably controlling the distance between the movable platen 31 and the fixed platen 35 using the mold clamping unit 30, it is possible to shorten the distance between the movable mold 32 and the fixed mold 33 to perform "mold closing" and to increase the distance between the movable mold 32 and the fixed mold 33 to perform "mold opening."

[0032] At this time, when the movable mold 32 and the fixed mold 33 are "closed," an airtight space is formed between the movable mold 32 and the fixed mold 33, and a partial molded product is formed by pouring resin into this airtight space. In particular, in the molded product manufacturing system 100 shown in Fig. 4, when the movable mold 32 and the fixed mold 33 are "closed," two airtight spaces are formed in different positions, and, for example, partial molded product 45A is formed by pouring resin into one airtight space, and partial molded product 45B is formed by pouring resin into the other airtight space.

[0033] A slide mechanism 32A is attached to the movable mold 32, and this slide mechanism 32A is configured to be able to slide the position of the movable mold 32 relative to the fixed mold 33. A hot runner manifold (intra-mold flow path) 34 is formed inside the fixed mold 33, and by flowing resin into this hot runner manifold 34, the resin is injected into two sealed spaces that are formed when the movable mold 32 and the fixed mold 33 are "closed."

[0034] Next, as shown in FIG. 4, an injection device 41 that extrudes resin is connected to the fixed platen 35, and the resin extruded from the injection device 41 flows through the fixed platen 35 into a hot runner manifold 34 formed inside the fixed mold 33.

[0035] This injection device 41 has a hopper 40 for putting the resin raw material in, and a cylinder (barrel) 38. When the resin raw material is put into the hopper 40, the resin raw material is kneaded by a rotatable screw 37 arranged inside the cylinder 38. At this time, a heater 39 is arranged around the cylinder 38, and the resin raw material put into the cylinder 38 is heated by the heater 39 while being kneaded by the screw 37 to become a molten resin. A screw head backflow prevention ring 36 is provided inside the cylinder 38, which prevents the molten resin from flowing back when the screw 37 moves forward (during injection).

[0036] Next, a brief description will be given of the operation of manufacturing a molded product using the molded product manufacturing system 100 that realizes the "HP-DSI method."

[0037] 4, the movable mold 32 and the fixed mold 33 are placed between the movable platen 31 and the fixed platen 35. Then, the mold clamping device 30 moves the movable platen 31 so as to approach the fixed platen 35, thereby "closing" the space between the movable mold 32 and the fixed mold 33. As a result, two sealed spaces are formed between the movable mold 32 and the fixed mold 33, as shown in FIG.

[0038] Next, the resin raw material is introduced into the cylinder 38 from the hopper 40 of the injection device 41. The introduced resin raw material is heated by a heater 39 disposed around the cylinder 38, and the resin raw material is kneaded by a screw 37 disposed inside the cylinder 38. As a result, the resin raw material becomes molten resin. This molten resin is extruded from the inside of the cylinder 38. The extruded molten resin is injected into each of the two sealed spaces formed between the movable mold 32 and the fixed mold 33 via a hot runner manifold 34 formed inside the fixed mold 33. As a result, the molten resin solidifies in one sealed space to form a partial molded product 45A, and the molten resin solidifies in the other sealed space to form a partial molded product 45B.

[0039] 5, the mold clamping device 30 moves the movable platen 31 away from the fixed platen 35, thereby "opening" the space between the movable mold 32 and the fixed mold 33. Then, the slide mechanism 32A slides the movable mold 32 relative to the fixed mold 33. As a result, the partial molded product 45B is positioned opposite the partial molded product 45A.

[0040] Thereafter, the heater 42 is inserted between the partial molded product 45A and the slid partial molded product 45B by the heater slide mechanism provided in the molded product manufacturing system 100. That is, the heater 42 is inserted into the cavity formed between the fixed mold 33 and the slid movable mold 32. Then, the heat supplied from the heated heater 42 heats and melts the portion that will become the joining portion between the partial molded product 45A and the partial molded product 45B.

[0041] Next, the heater slide mechanism slides the heater 42 from the insertion position to the retracted position, and then the mold clamping device 30 moves the movable platen 31 closer to the fixed platen 35, thereby "closing" the space between the movable mold 32 and the fixed mold 33. As a result, pressure is applied to the molten joint between the partial molded products 45A and 45B, and the partial molded products 45A and 45B are welded together. Then, as shown in Fig. 6, the mold clamping device 30 moves the movable platen 31 away from the fixed platen 35, thereby "opening" the space between the movable mold 32 and the fixed mold 33, and then the integrated molded product 45 formed by welding the partial molded products 45A and 45B together is removed.

[0042] In this way, the "HP-DSI method" is realized, in which movable mold 32 is slid relative to fixed mold 33, and then partial molded products 45A and 45B are partially melted and bonded together by heat supplied from heater 42 to produce integrally molded product 45. This "HP-DSI method" is superior to the "DSI method" in that it can supply sufficient heat and pressure to the joint between partial molded products 45A and 45B, thereby achieving sufficient joint strength.

[0043] <Room for improvement in the HP-DSI method> As a result of further intensive research, the present inventors have newly discovered that there is room for improvement in the "HP-DSI method," and this room for improvement will be described below.

[0044] First, the first area for improvement will be described. For example, in the "HP-DSI method," injection molding is used to form a partial molded product 45A in one of two sealed spaces formed between a movable mold 32 and a fixed mold 33, and a partial molded product 45B in the other sealed space. Then, without removing the partial molded product 45A formed in one sealed space from the partial molded product 45B formed in the other sealed space, the partial molded product 45B is slid, and then the heater 42 melts and bonds the joints between the partial molded products 45A and 45B, thereby producing an integrated molded product 45. That is, in the "HP-DSI method," from the first process to the last, the partial molded products 45A and 45B are processed without being removed from between the movable mold 32 and the fixed mold 33.

[0045] Here, the synthetic resin constituting the partial molded products 45A and 45B tends to shrink. For this reason, in the "HP-DSI method," in which the partial molded products 45A and 45B are processed from the first to the last step without being removed from between the movable mold 32 and the fixed mold 33, shrinkage of the synthetic resin occurs during the steps, which may cause the partial molded products 45A and 45B to come apart. In this case, it becomes impossible to produce the integrally molded product 50. Thus, the first area of ​​improvement in the "HP-DSI method" is the tendency for the partial molded products 45A and 45B to come apart due to resin shrinkage.

[0046] Next, a second area for improvement will be described. In the "HP-DSI method," for example, a partial molded product 45A and a partial molded product 45B are combined to produce an integrally molded product 45. If the size of this integrally molded product 45 is large, the molded product manufacturing system 100 that implements the "HP-DSI method" must be enlarged. In particular, the "HP-DSI method" requires a slide mechanism 32A that slides the movable mold 32 relative to the fixed mold 33. Therefore, as the size of the integrally molded product 45 increases, the slide mechanism 32A must also be enlarged, which directly leads to an increase in the size of the molded product manufacturing system 100. Furthermore, the movable mold 32 itself and the fixed mold 33 themselves must also be enlarged. Therefore, the second area for improvement of the "HP-DSI method" is that as the size of the integrally molded product 45 increases, not only the movable mold 32 itself and the fixed mold 33 themselves but also the slide mechanism 32A must be enlarged. As a result, the molded product manufacturing system 100 including these components is likely to become larger.

[0047] Therefore, in this embodiment, an effort is made to overcome the first and second room for improvement described above. The technical idea behind this effort is described below.

[0048] The technical idea of ​​this embodiment is realized by a technique called "Hot Plate-Injection Welding Mold." In the following, the "Hot Plate-Injection Welding Mold" will be referred to as the "HP-IWM method," and this "HP-IWM method" will be explained.

[0049] <Explanation of the "HP-IWM method"> <<HP-IWM System Overview>> FIG. 7 is a diagram showing a schematic diagram of the "HP-IWM" system.

[0050] In FIG. 7, the "HP-IWM" system 150 includes an injection molding device 160, an injection molding device 170, a removal device 160A, a removal device 170A, a conveyor 160B, a conveyor 170B, a robot arm 180, a molded product manufacturing device 200, and a conveyor 190.

[0051] The injection molding device 160 is configured to produce a partial molded product 50A, and the partial molded product 50A produced by the injection molding device 160 is removed from the injection molding device 160 by a removal device 160A and transported by a conveyor 160B.

[0052] Similarly, injection molding apparatus 170 is configured to produce partial molded product 50B, and partial molded product 50B produced by injection molding apparatus 170 is removed from injection molding apparatus 170 by removal apparatus 170A and transported by conveyor 170B.

[0053] The robot arm 180 is configured to transport the partial molded product 50A transported by the conveyor 160B to the molded product manufacturing device 200, and to transport the partial molded product 50B transported by the conveyor 170B to the molded product manufacturing device 200.

[0054] The molded product manufacturing device 200 is configured to fit the partial molded products 50A and 50B transported by the robot arm 180 into respective molds, and apply heat supplied from a heater to the partial molded products 50A and 50B fitted into the molds, thereby partially melting and bonding the partial molded products 50A and 50B, thereby manufacturing the integrally molded product 50.

[0055] The robot arm 180 also has the function of transporting the integrally molded product 50 manufactured by the molded product manufacturing apparatus 200 from the molded product manufacturing apparatus 200 to the conveyor 190.

[0056] Next, an overview of the operation of the "HP-IWM" system 150 will be described.

[0057] FIG. 8 is a flowchart outlining the operation of the "HP-IWM" system.

[0058] 8, after injection molding apparatus 160 molds partial molded article 50A (S11), removal device 160A removes partial molded article 50A from injection molding apparatus 160 (S12). Then, partial molded article 50A removed by removal device 160A is transported by conveyor 160B (S13).

[0059] 8, after injection molding apparatus 170 molds partial molded article 50B (S21), removal device 170A removes partial molded article 50B from injection molding apparatus 170 (S22). Then, partial molded article 50B removed by removal device 170A is transported by conveyor 170B (S23).

[0060] Next, the partial molded product 50A transported by the conveyor 160B is carried into the molded product manufacturing apparatus 200 by the robot arm 180, and the partial molded product 50B transported by the conveyor 170B is also carried into the molded product manufacturing apparatus 200 by the robot arm 180. Thereafter, in the molded product manufacturing apparatus 200, the partial molded products 50A and 50B are each fitted into a mold (S31). Then, in the molded product manufacturing apparatus 200, the portions of the partial molded products 50A and 50B fitted into the mold that will become the joining portions are heated by a heater (S32). As a result, the portions of the partial molded products 50A and 50B that will become the joining portions are melted. Then, in the molded product manufacturing apparatus 200, the melted portions are welded together (S33), thereby bonding the partial molded products 50A and 50B together to manufacture the integrated molded product 50.

[0061] The integrally molded product 50 manufactured by the molded product manufacturing apparatus 200 is removed from the molded product manufacturing apparatus 200 (S34), and then transferred to the conveyor 190 by the robot arm 180.

[0062] In this manner, the "HP-IWM" system 150 can manufacture the integrally molded product 50.

[0063] <<Details of the "HP-IWM" system>> <<<Configuration of injection molding equipment>>> FIG. 9 is a diagram showing the configuration of the main parts of the injection molding devices 160 and 170. As shown in FIG.

[0064] 9, injection molding apparatus 160 has movable platen 52 and fixed platen 53 connected to tie bars 51, and movable platen 52 connected to tie bars 51 is configured to be movable. Movable mold 54 and fixed mold 55 can be disposed between movable platen 52 and fixed platen 53. In this way, by variably controlling the distance between movable platen 52 and fixed platen 53, injection molding apparatus 160 can close the distance between movable mold 54 and fixed mold 55 to perform "mold closing" and increase the distance between movable mold 54 and fixed mold 55 to perform "mold opening."

[0065] At this time, when the movable mold 54 and the fixed mold 55 are "closed," an airtight space is formed between the movable mold 54 and the fixed mold 55, and resin is poured into this airtight space to form the partially molded product 50A. In particular, a hot runner manifold (in-mold flow path) 56 is formed inside the fixed mold 55, and by pouring resin into this hot runner manifold 56, the resin can be injected into the airtight space formed when the movable mold 54 and the fixed mold 55 are "closed."

[0066] Next, as shown in Figure 9, the fixed mold 55 is connected to the injection unit 41. The injection unit 41 has the functions of rotating a screw and moving forward and backward, and is capable of plasticizing, melting, measuring, and injecting resin. The resin injected from the injection unit 41 flows into a hot runner manifold 56 formed inside the fixed mold 55.

[0067] The injection device 41 has a hopper 61 for receiving the resin raw material, and a cylinder (barrel) 59. When the resin raw material is received in the hopper 61, the resin raw material is kneaded by a rotatable screw 58 disposed inside the cylinder 59. At this time, a heater 60 is disposed around the cylinder 59, and the resin raw material received inside the cylinder 59 is heated by the heater 60 while being kneaded by the screw 58 to become a molten resin. A screw head backflow prevention ring 57 is provided inside the cylinder 59, which prevents the molten resin from flowing back when the screw 58 moves forward (during injection).

[0068] Furthermore, as shown in FIG. 9, the injection molding device 160 is equipped with a removal device 160A for removing the manufactured partial molded product 50A, and this removal device 160A is provided with a chuck 62 for adsorbing the partial molded product 50A.

[0069] <<<Operation of injection molding machine>>> Next, the operation of the injection molding device 160 will be described.

[0070] 9, movable mold 54 and fixed mold 55 are placed between movable platen 52 and fixed platen 53. Then, in injection molding apparatus 160, movable platen 52 is moved closer to fixed platen 53 to "close" the space between movable mold 54 and fixed mold 55. As a result, an airtight space is formed between movable mold 54 and fixed mold 55, as shown in FIG.

[0071] Next, resin raw material is charged into the cylinder 59 from the hopper 61 of the injection device 41, and the charged resin raw material is kneaded with the screw 58 disposed inside the cylinder 59 while being heated by the heater 60 disposed around the cylinder 59. As a result, the resin raw material becomes molten resin. This molten resin is metered into the interior of the cylinder 59 as the screw retreats, and is injected as the screw advances. The injected molten resin is poured into the sealed space formed between the movable mold 54 and the fixed mold 55 via a hot runner manifold 56 formed inside the fixed mold 55. As a result, the molten resin solidifies in the sealed space to form the partially molded product 50A.

[0072] 10, in the injection molding apparatus 160, the movable platen 52 is moved away from the fixed platen 53, thereby "mold opening" between the movable mold 54 and the fixed mold 55. Thereafter, as shown in FIG. 11, the partial molded product 50A is sucked by a chuck 62 provided in the removal device 160A. Then, the partial molded product 50A sucked by the chuck 62 is placed on, for example, a conveyor 160B shown in FIG. 7 and transported.

[0073] <<<Configuration of molding manufacturing equipment>>> FIG. 12 is a schematic diagram showing the external configuration of the molded product manufacturing apparatus 200. As shown in FIG.

[0074] 12, molded product manufacturing apparatus 200 can be provided not only as a dedicated device, but also by modifying a general-purpose press machine, for example. Specifically, it can be realized by installing a mold, a heater, a heater slide mechanism, and a heater slide control unit in a general-purpose press machine. This molded product manufacturing apparatus 200 is configured to manufacture an integrated molded product by partially melting and bonding two partial molded products using heat supplied from a heater, and has the following configuration.

[0075] The molded product manufacturing apparatus 200 includes a mold 70A, a mold 70B, a contact / non-contact control unit 71, a heater 72, a heater slide mechanism 73, and a heater slide control unit 74.

[0076] The mold 70A is configured so that the partial molded product 250A manufactured by one of the injection molding machines can be fitted into it, and is fixed to a stage. Therefore, the mold 70A can be said to be a fixed mold fixed to a stage. This stage functions as a mold mounting section 75A to which the mold 70A is mounted. In particular, a recess is formed in the mold 70A, and the partial molded product 250A is fitted into this recess.

[0077] Mold 70B is configured so that, for example, a partial molded product 250B manufactured by the other injection molding device can be fitted into it. Mold 70B is disposed in a position opposite mold 70A and is movable so that the distance between fixed mold 70A and mold 70B can be changed. Therefore, mold 70B can be said to be a movable mold. This mold 70B is attached to mold attachment portion 75B. In particular, a recess is formed in mold 70B, and partial molded product 250B is fitted into this recess.

[0078] The contact / non-contact control unit 71 is configured to control contact / non-contact between the partial molded product 250A fitted in the mold 70A and the partial molded product 250B fitted in the mold 70B. Specifically, the contact / non-contact control unit 71 controls contact / non-contact between the partial molded products 250A and 250B by controlling "mold closing" and "mold opening" between the mold 70A and the mold 70B. For example, the contact / non-contact control unit 71 is configured to be able to control "mold closing" and "mold opening" between the mold 70A and the mold 70B by controlling the movement of the mold 70B. The contact / non-contact control unit 71 can also be referred to as a variable control unit that variably controls the distance between the mold mounting unit 75A and the mold mounting unit 75B.

[0079] The heater 72 is configured so that it can be inserted between the partial molded product 250A fitted in the mold 70A and the partial molded product 250B fitted in the mold 70B, and is configured so that when inserted between the partial molded products 250A and 250B, it can heat the area that will be the joint between the partial molded products 250A and 250B.

[0080] In other words, the heater 72 is configured to be movable so as to be inserted into the cavity formed between the mold 70A in which the partial molded product 250A is placed and the mold 70B in which the partial molded product 250B is placed, and is configured so that when the heater 72 is inserted into the cavity, it can heat the area that will be the joint between the partial molded product 250A and the partial molded product 250B.

[0081] The heater slide mechanism 73 is fixed to any one of the mold 70A, mold 70B, mold mounting portion 75A, and mold mounting portion 75B, and is configured to slide the heater 72 in order to insert the heater 72 between the partial molded product 250A and the partial molded product 250B, or to retract the heater 72 from between the partial molded product 250A and the partial molded product 250B. In other words, the heater slide mechanism 73 is configured to be able to slide the heater 72 between an insertion position and a retracted position. The heater slide mechanism 73 is controlled by a heater slide control unit 74.

[0082] 12, a mold 70A is placed on a stage 75A, and a partial molded product (first work) 250A is fitted into this mold 70A. Meanwhile, a mold 70B is placed in a position opposite to the mold 70A, and a partial molded product (second work) 250B is fitted into this mold 70B. The contact / non-contact control unit 71 is configured to control the movement of the mold 70B by moving the stage 75B. In other words, the contact / non-contact control unit 71 is configured to control the distance or contact / non-contact between the partial molded product 250A fitted into the mold 70A and the partial molded product 250B fitted into the mold 70B by controlling the movement of the mold 70B. In other words, the contact / non-contact control unit 71 has the function of controlling the distance or "mold closing" / "mold opening" between the mold 70A and the mold 70B.

[0083] Next, the molded product manufacturing apparatus 200 has a heater 72. This heater 72 is connected to a heater slide mechanism 73, and is able to slide in the direction of the arrow in Fig. 12 (horizontally) by the heater slide mechanism 73. Specifically, a heater slide control unit 74 is configured to control the heater slide mechanism 73 and the temperature and output of the heater. By controlling the heater slide mechanism 73 by the heater slide control unit 74, the heater 72 is inserted between the partial molded product 250A and the partial molded product 250B, or is retracted from between the partial molded product 250A and the partial molded product 250B.

[0084] For example, FIGS. 13(a) and 13(b) are plan views seen from above in FIG. 12, illustrating the movement of the heater 72. The heater 72 is configured to be slidable between an insertion position (FIG. 13(a)) where it overlaps with the mold 70B in plan view and a retracted position (FIG. 13(b)) where it does not overlap with the mold 70B in plan view. Here, as shown in FIG. 13(a), when the heater 72 is placed at the insertion position where it overlaps with the mold 70B in plan view, the heating position by the heater 72 overlaps with the welding portion of the partial molded product 250B and the partial molded product 250A. This allows the heater 72 to heat the portion that will be the joining portion between the partial molded product 250A and the partial molded product 250B. The molded product manufacturing apparatus 200 is configured as described above.

[0085] <<<Heater types>>> Here, the heater 72 used in the "HP-IWM method" may be a non-contact heater or a contact heater. Examples of non-contact heaters include carbon heaters and halogen heaters, but any type of heater is acceptable as long as it can heat the partially molded product without contact by irradiating it with infrared or near-infrared rays. On the other hand, an example of a contact heater is a heating plate. The heating plate may be of any type, as long as it can heat the welded part, such as a metal plate made of iron, aluminum, brass, copper, or the like, heated with a cartridge heater; a ceramic heater in which the heating element is sandwiched between ceramics such as alumina or silicon nitride and insulated; or a film heater in which the heating element is sandwiched between heat-resistant films and insulated.

[0086] The advantage of using a non-contact heater is that it can heat the partially molded product in a clean state because it does not come into contact with the product, but it is difficult to control the temperature.In this regard, a contact heater has the advantage that it is easier to control the temperature than a non-contact heater.

[0087] Both non-contact heaters and contact heaters can be shaped to heat the entire projected surface of a partially molded product, or to selectively heat only the welded portion of a partially molded product. On the other hand, if there are areas in the welded portion that cannot be heated by the heater, the resin in the unheated portion will not melt, and that portion will not be bonded. Also, if there are areas in the welded portion that are selectively heated strongly by the heater, the resin in that portion will decompose and its strength will decrease. Therefore, heaters are required to have the ability to heat the welded portion uniformly by adjusting their shape and output characteristics.

[0088] The following describes in detail the operation of the molded product manufacturing apparatus 200, but the operation differs depending on whether the heater 72 is a non-contact heater or a contact heater. For this reason, we will first explain the operation when the heater 72 is configured as a non-contact heater, and then explain the operation when the heater 72 is configured as a contact heater.

[0089] <<<Operation of molding manufacturing equipment (in the case of non-contact heater)>>> 14 and 15 are flowcharts illustrating the operation of the molded product manufacturing apparatus.

[0090] First, as shown in Fig. 16, partial molded product 250A is fitted into mold 70A (S101 in Fig. 14), and partial molded product 250B is fitted into mold 70B (S102 in Fig. 14). Thereafter, as shown in Fig. 17, mold 70B is moved downward under the control of contact / non-contact control unit 71, thereby "mold closing" molds 70A and 70B to a position where the joint portions of partial molded products 250A and 250B are in tight contact with each other (S103 in Fig. 14).

[0091] Next, the partial molded products 250A and 250B are fixed with chucks. Specifically, FIG. 18 is a plan view schematically showing a state in which the partial molded products fitted into the mold are fixed with multiple chucks. In FIG. 18, the partial molded product 250A fitted into the mold 70A is fixed with multiple chucks 80A (S104 in FIG. 14). Similarly, the partial molded product 250B fitted into the mold 70B is fixed with multiple chucks 80B (S105 in FIG. 14). For example, the mold 70A has multiple chucks 80A that fix the partial molded product 250A. Similarly, the mold 70B has multiple chucks 80B that fix the partial molded product 250B. The number of chucks can be determined appropriately depending on the size of the molded products. Furthermore, fixing the partial molded product 250A (S104) and fixing the partial molded product 250B (S105) may be performed simultaneously.

[0092] 19 and 20 are diagrams showing an example of a method for fixing a partial molded product by a chuck portion. As shown in Fig. 19, a flange 90 is provided at the tip of a partial molded product 250A fitted into a mold 70A. The chuck portion 80A is composed of a partial core 81 and an air cylinder 82. At this time, as shown in Figs. 19 and 20, the partial core 81 is fitted into the flange 90 by the pushing force of the air cylinder 82, thereby fixing the partial molded product 250A by the chuck portion 80A.

[0093] 21 and 22 are diagrams showing another example of a method for fixing the partial molded product 250A by the chuck unit 80A and a method for fixing the partial molded product 250B by the chuck unit 80B. As shown in FIG. 21, the chuck unit 80A has a partial core 83A and an air cylinder 84A, and the partial core 83A is connected to the air cylinder 84A. Similarly, the chuck unit 80B has a partial core 83B and an air cylinder 84B, and the partial core 83B is connected to the air cylinder 84B. The tip end of the partial core 83A and the tip end of the partial core 83B have a "sawtooth shape" that makes them easy to press and remove. At this time, as shown in FIGS. 21 and 22, the partial core 83A is pressed against the end of the partial molded product 250A by the pushing force of the air cylinder 84A, thereby fixing the partial molded product 250A with the chuck unit 80A. Similarly, the partial core 83B is pressed against the end of the partial molded product 250B by the pushing force of the air cylinder 84B, whereby the partial molded product 250B can be fixed by the chuck portion 80B.

[0094] At this time, the chucking state of the partial molded products 250A and 250B can be monitored by checking the in / out state of the air cylinder with a limit switch. The chucking mechanism may be one of the types shown in Figures 19 and 21, or a combination of multiple types. Also, other mechanisms may be used as long as they are capable of chucking the partial molded products. For example, the air cylinders 84A and 84B may be hydraulic cylinders. Also, the partial cores 83A and 83B may be pressed against the ends of the partial molded products 250A and 250B by the elastic force of a spring. Alternatively, the partial cores 83A and 83B may be moved by a motor.

[0095] Next, under the control of the contact / non-contact control unit 71, the mold 70B is moved upward, thereby "opening" the molds 70A and 70B (S106 in FIG. 14). Thereafter, as shown in FIG. 23, the fitting state of the partial molded product 250A fitted into the mold 70A is monitored by the monitoring unit 91 (S107 in FIG. 14), and the fitting state of the partial molded product 250B fitted into the mold 70B is also monitored by the monitoring unit 91 (S108 in FIG. 14).

[0096] Specifically, the monitoring unit 91 includes an imaging device 92A, an imaging device 92B, and a monitoring control unit 93. The imaging device 92A is configured to capture an image of the fitted state of the partial molded product 250A, and the imaging device 92B is configured to capture an image of the fitted state of the partial molded product 250B. The monitoring control unit 93 is configured to monitor whether the fitted state of the partial molded product 250A is satisfactory based on the image captured by the imaging device 92A, and to monitor whether the fitted state of the partial molded product 250B is satisfactory based on the image captured by the imaging device 92B. Commercially available cameras for monitoring the state of molds can be used as the imaging devices 92A and 92B. The imaging devices 92A and 92B may monitor the states of the partial molded products 250A and 250B using a single device, or the states of the partial molded products 250A and 250B may be monitored separately using multiple devices.

[0097] As a result, for example, if the monitoring unit 91 determines that the fitting state of the partial molded product 250A and the fitting state of the partial molded product 250B are good, the operation of the molded product manufacturing apparatus 200 continues. On the other hand, if the monitoring unit 91 determines that at least one of the fitting states of the partial molded product 250A or 250B is not good, a measure can be taken to stop the operation of the molded product manufacturing apparatus 200. This is expected to prevent the production of defective products or damage to the mold.

[0098] Next, as shown in Fig. 24, the mold 70B is moved slightly downward under control of the contact / non-contact control unit 71, thereby partially "closing" the molds 70A and 70B (S109 in Fig. 14). Then, the heater slide control unit 74 controls the heater slide mechanism 73 to slide the heater 72 and insert it between the partial molded product 250A and the partial molded product 250B (S110 in Fig. 14).

[0099] Then, the heater 72 is heated (S111 in FIG. 14). As a result, the heat supplied from the heater 72 melts the portion that will become the joining portion between the partial molded product 250A and the partial molded product 250B. Thereafter, as shown in FIG. 25, the heater slide control unit 74 controls the heater slide mechanism 73 to slide the heater 72 and retract the heater 72 from between the partial molded product 250A and the partial molded product 250B (S112 in FIG. 15).

[0100] Next, under the control of the contact / non-contact control unit 71, the mold 70B is moved downward, thereby completely "closing" the mold 70A and the mold 70B (S113 in FIG. 15). At this time, as shown in FIG. 26, for example, a predetermined pressure is applied or a predetermined amount of pressure is applied for a predetermined time measured by a timer. This causes the molten resin to ooze out, welding the joints of the partial molded products 250A and 250B. As a result, the partial molded products 250A and 250B are integrated to form the integral molded product 50.

[0101] Next, as shown in Fig. 27, the fixation of the integrally molded product 50 by the chuck portion 80A is released (S114 in Fig. 15). Then, as shown in Fig. 28, the mold 70B is moved upward under the control of the contact / non-contact control unit 71, thereby "opening" the mold 70A and the mold 70B, and the hydraulic ejector pin 95 pushes up the integrally molded product 250 (S115 in Fig. 15). Thereafter, as shown in Fig. 29, the fixation of the integrally molded product 50 by the chuck portion 80B is released (S116 in Fig. 15). Subsequently, as shown in Fig. 30, the ejector pin 96 is ejected, and the integrally molded product 250 is finally removed (S117 in Fig. 15).

[0102] The order in which the chucks 80A and 80B are removed is not limited to this. In this example, the fixation by the chuck 80A is released first, but the A side and B side may be swapped and the fixation by the chuck 80B may be released first.

[0103] By operating the molded product manufacturing apparatus 200 in this embodiment as described above, the integrally molded product 250 can be manufactured.

[0104] <<<Operation of molding manufacturing equipment (in the case of contact heaters)>>> Next, the operation when the heater 72 is configured as a contact heater will be described, particularly taking an example where the heater 72 is configured as a heating plate.

[0105] 31 and 32 are flowcharts illustrating the operation of the molded product manufacturing apparatus.

[0106] The flowcharts shown in FIGS. 31 and 32 are almost the same as the flowcharts shown in FIGS. 14 and 15, and therefore differences will be mainly described.

[0107] First, steps S101 to S110 are the same. As a result, the heater 72 is inserted between the partial molded product 250A and the partial molded product 250B (S110 in FIG. 31). At this time, there are gaps between the heater 72 and the partial molded product 250A and the partial molded product 250B. In other words, the heater 72 is out of contact with the partial molded product 250A and the partial molded product 250B.

[0108] Next, the mold 70B is moved downward under the control of the contact / non-contact control unit 71, thereby "closing" the mold 70A and the mold 70B. As a result, the heater 72 comes into contact with and is sandwiched between the partial molded product 250A and the partial molded product 250B. The "closing" at this time is adjusted so that the pressing force is weak so as not to damage the heater 72.

[0109] Then, the heater 72 is heated while being in contact with the partial molded products 250A and 250B, thereby melting the portions that will become the joining portions of the partial molded products 250A and 250B (S201 in FIG. 32).

[0110] Thereafter, the mold 70B is moved upward under the control of the contact / non-contact control unit 71, thereby "opening" the molds 70A and 70B (S202 in FIG. 32). Next, the heater slide control unit 74 controls the heater slide mechanism 73 to slide the heater 72 and retract the heater 72 from between the partial molded products 250A and 250B (S112 in FIG. 32).

[0111] The subsequent steps are similar. In this manner, the molded product manufacturing apparatus 200 of this embodiment is operated to manufacture the integrally molded product 250.

[0112] <Features of the embodiment> Next, the features of this embodiment will be described.

[0113] The first feature of this embodiment is that the technology for manufacturing an integrated molded product by partially melting and bonding two partial molded products using heat supplied from a heater includes a step of fitting the partial molded products into a mold, which prevents the partial molded products from coming off the mold even if the resin that makes up the partial molded products shrinks.

[0114] For example, in the "HP-DSI method," the partially molded part is processed from the first to the last process without being removed from the mold. However, the synthetic resin that makes up the partially molded part has the property of shrinking. For this reason, if the partially molded part is processed from the first to the last process without being removed from the mold, the synthetic resin may shrink during the process, causing the partially molded part to come off the mold.

[0115] In this regard, in this embodiment, a partial molded product manufactured by another device is fitted into the mold. In this case, the mold can be designed taking into account the shrinkage of the resin that makes up the partial molded product, thereby reducing the possibility of the partial molded product coming off the mold. As a result, this embodiment can improve the manufacturing yield of integrally molded products.

[0116] In this embodiment, a further measure is taken to prevent the partial molded product from coming off the mold due to shrinkage of the synthetic resin that constitutes the partial molded product.

[0117] A second feature of this embodiment is that, as shown in Figures 18 to 22, for example, a chuck portion is provided to secure the partial molded product fitted into the mold. As a result, according to this embodiment, even if the partial molded product tries to be released from the mold, the partial molded product is secured by the check portion, and therefore, the partial molded product can be effectively prevented from coming off the mold. As a result, according to the second feature of this embodiment, the possibility of the partial molded product being released from the mold can be reduced, and the manufacturing yield of the integrally molded product can be further improved.

[0118] Next, a third feature of this embodiment is that it has a monitoring unit configured to monitor the fitting state of the partial molded product, as shown in FIG. 23, for example. As a result, even if the partial molded product has come off the mold, the monitoring unit can detect it. Furthermore, if the monitoring unit detects an abnormality, such as floating of the partial molded product, it is possible to stop the production line. Therefore, according to the third feature of this embodiment, it is possible to prevent the production of defective products, which also contributes to further improving the manufacturing yield of integrally molded products.

[0119] <The importance of heaters> The technical idea of ​​this embodiment is to manufacture an integrated molded product by melting and bonding the respective joining portions of multiple partial molded products using heat supplied from a heater. In the molded product manufacturing apparatus that embodies this technical idea, the heater plays an important role in improving the performance of the molded product manufacturing apparatus.

[0120] Therefore, in this embodiment, attention is focused on the heater, and various improvements are made to the heater to improve the performance of the molded product manufacturing apparatus.

[0121] Various heater-related innovations will be described below. The technical concept of the present embodiment described above is primarily a concept related to the "HP-IWM method," but the heater-related innovations described below can be widely applied to molded product manufacturing methods that use heaters. For this reason, the various heater-related innovations described below can be widely applied not only to molded product manufacturing apparatuses that implement the "HP-IWM method," but also to molded product manufacturing apparatuses that implement the "HP-DSI method." However, the following description will be given with particular reference to a molded product manufacturing apparatus that implements the "HP-IWM method."

[0122] <First improvement point> <<Room for improvement>> FIG. 33 is a diagram illustrating room for improvement.

[0123] 33, the joining portion between partial molded product 250A fitted in mold 70A and partial molded product 250B fitted in mold 70B is heated and melted by heater 72 inserted between mold 70A and mold 70B. Thereafter, since heater 72 gets in the way of welding the melted portions, heater 72 is retracted to the outside of mold 70A and mold 70B, for example, as shown in FIG.

[0124] At this time, in order to reliably retract the heater 72 to a position where it does not come into contact with the mold 70A and the mold 70B, the stroke L1 shown in FIG. 33 must be long. However, increasing the stroke L1 increases the overall length of the device, resulting in an increase in the size of the molded product manufacturing device. Furthermore, a longer stroke L1 means a longer cycle time for sliding the heater 72 between the insertion position and the retracted position, which leads to a decrease in throughput. Furthermore, the sliding distance of the heater 72 increases, which increases the deflection of the support portion supporting the heater 72. This means that it becomes difficult for the heater 72 to uniformly heat the joint area. For these reasons, it is desirable to make the sliding stroke of the heater 72 as short as possible.

[0125] <<Solution>> Therefore, in this embodiment, a measure is taken to shorten as much as possible the stroke for sliding the heater 72. The measure is described below.

[0126] FIG. 34 is a diagram illustrating the first improvement point.

[0127] 34, for example, mold 70B is provided with a cutout 300. This cutout 300 functions as a standby area (evacuation area) for heater 72. That is, when heater 72 moves to the standby area outside the cavity formed by molds 70A and 70B, heater 72 and cutout 300 overlap in a plan view. Thus, the first ingenuity is that mold 70B is provided with cutout 300 that serves as an evacuation area for heater 72. However, cutout 300 may be provided in mold 70A instead of mold 70B, or may be provided in both molds 70B and 70A.

[0128] As shown in Fig. 34, by providing the cutout portion 300, the stroke L2 for sliding the heater 72 is shorter than the stroke L1 shown in Fig. 33, which does not have the cutout portion 300. As a result, according to the first ingenuity, the stroke L2 is shortened, and as a result, the overall length of the device can be shortened, which makes it possible to prevent the molded product manufacturing device from becoming larger.

[0129] Furthermore, since the insertion position and the retracted position of the heater 72 are closer to each other, the cycle time for sliding the heater 72 back and forth can be shortened. This leads to improved throughput. Furthermore, shortening the sliding time of the heater 72 from the insertion position to the retracted position means that the time until the melted portion is welded after the heater 72 is retracted is shortened. And shortening the time until the melted portion is welded means that a drop in temperature of the melted portion can be suppressed. As a result, the melted portion can be welded while maintaining a high temperature state. Therefore, according to the first ingenuity, the joining reliability of the melted portion can also be improved.

[0130] Furthermore, since the length of the support portion (for example, the support arm) that supports the heater 72 can be shortened, it is possible to suppress the wobbling (deflection) of the support portion. As a result, according to the first ingenuity, it is possible to achieve uniform heating in the portion to be joined.

[0131] As described above, the first ingenuity of providing the cutout portion 300 in the mold 70B can shorten the sliding time of the heater 72. As a result, the first ingenuity can achieve, with a simple configuration, significant effects that could not be achieved with previous technologies: (1) suppression of an increase in the size of the molded product manufacturing equipment, (2) improvement in the manufacturing efficiency of the integrally molded product by improving throughput, and (3) improvement in the joining reliability of the joining portion by suppressing the temperature drop in the molten portion and realizing uniform heating. In this way, the first ingenuity has an extremely excellent technical significance in that it can achieve great effects without incurring costs.

[0132] <Second improvement point> <<Room for improvement>> The explanation so far has mainly been based on a configuration in which molds 70A and 70B are arranged opposite each other in a vertical direction (referred to as a "vertical configuration"), but a configuration in which molds 70A and 70B are arranged opposite each other in a horizontal direction (referred to as a "horizontal configuration") is also possible.

[0133] In particular, the second point of improvement is a point to address the room for improvement that becomes apparent in the "horizontal configuration." Below, we will first explain the room for improvement that becomes apparent in the "horizontal configuration."

[0134] FIG. 35 is a diagram showing a schematic diagram of the "horizontal configuration."

[0135] In FIG. 35, molds 70A and 70B are arranged horizontally opposite each other. A heater 72 is inserted into the gap between molds 70A and 70B. When the heater 72 is heated in this state, cold air flows into the gap from below and is warmed by the heater 72. The warmed air flows toward the upper side of the gap. When the heater 72 inserted into the gap between molds 70A and 70B heats the gap, convection occurs in the air present in the gap, resulting in a temperature difference between the upper and lower sides of the gap. In other words, a temperature distribution occurs in the gap. Such a temperature distribution in the gap prevents uniform heating, adversely affecting the welding of the molten portion. Therefore, it is desirable to minimize the temperature difference in the gap even when the heater 72 inserted into the gap between molds 70A and 70B is heated. In other words, it is desirable to suppress air convection, which is the cause of temperature nonuniformity in the gap.

[0136] <<First solution>> Therefore, in this embodiment, some measures are taken to improve the temperature uniformity in the gap between mold 70A and mold 70B. The following describes these measures.

[0137] FIG. 36 is a diagram illustrating the first solving means.

[0138] 36, a heater 72 that can be inserted into the gap between molds 70A and 70B is connected to a swinging mechanism 400. This swinging mechanism 400 has, for example, a forward / backward movement mechanism 410 configured to move the heater in the forward / backward direction, a rotatable motor 420, and an eccentric cam 430 attached to the motor. This allows the heater 72 connected to the swinging mechanism 400 to perform a swinging motion (swinging motion).

[0139] That is, the first solution involves connecting the oscillation mechanism 400 to the heater 72, which is inserted into the gap between the molds 70A and 70B, to perform an oscillation action on the heater 72. As a result, according to this embodiment, the oscillating heater 72 agitates the air present in the gap, thereby suppressing temperature non-uniformity caused by convection.

[0140] However, in the first solution described above, it is necessary to provide the swing mechanism 400 in the molded product manufacturing apparatus, which increases the manufacturing cost of the molded product manufacturing apparatus. Furthermore, because the heater 72 is swung, it is necessary to ensure a distance between the heater 72 and the molds 70A and 70B to avoid collisions between the heater 72 and the molds 70A and 70B. This means that the distance between the heater 72 and the partial molded product fitted into the mold 70A and the partial molded product fitted into the mold 70B increases, which leaves room for improvement in that the thermal energy generated by the heater 72 cannot be used efficiently.

[0141] <<Second solution>> For this reason, in this embodiment, further measures are taken to improve the temperature uniformity in the gap between mold 70A and mold 70B. These measures are described below.

[0142] The basic idea behind the second solution is to improve the temperature uniformity in the gap by providing a convection suppression member that suppresses air convection, which is the cause of temperature nonuniformity in the gap between mold 70A and mold 70B.

[0143] <<<Specific configuration example 1>>> A specific configuration that embodies this basic concept will be described below.

[0144] FIG. 37 is a diagram showing a specific configuration example 1. In FIG.

[0145] As shown in FIG. 37, mold 70A is provided with cover 440 to cover the upper side of the gap, and cover 450 to cover the lower side of the gap. This prevents cold air from flowing in from the lower side of the gap, while cover 440 prevents warm air from flowing out from the upper side of the gap. As a result, covers 440 and 450 prevent air convection caused by heat generated by heater 72 inserted in the gap. That is, covers 440 and 450 function as convection-suppressing members that suppress convection caused by heat supplied from the heater. Thus, specific configuration example 1 can improve the temperature uniformity in the gap.

[0146] From the viewpoint of suppressing convection, it is desirable to provide both cover 440 and cover 450 as shown in Fig. 37, but the effect of suppressing convection can also be obtained by providing only one of cover 440 and cover 450. Furthermore, Fig. 37 describes a configuration in which cover 440 and cover 450 are provided on mold 70A, but the present invention is not limited to this, and for example, cover 440 and cover 450 may be provided on mold 70B.

[0147] <<<Specific configuration example 2>>> FIG. 38 is a diagram showing a second specific configuration example.

[0148] As shown in FIG. 38, an outer frame 460 disposed outside the heater 72 is inserted into the gap together with the heater 72. That is, in Specific Configuration Example 2, a slide unit, which is an integral component consisting of the heater 72 and the outer frame 460 disposed outside the heater 72, is configured to slide using a heater slide mechanism. At this time, as can be seen from FIG. 38, the outer frame 460 functions as a convection suppression member that suppresses convection caused by heat supplied from the heater. In addition, by attaching covers 440 and 450 that prevent convection to the outside of the outer frame 460, the effect of suppressing convection can be further enhanced. In this way, Specific Configuration Example 2 can improve the temperature uniformity in the gap.

[0149] The outer frame 460 functions as a convection suppression member, but it also has another function, so the other function of the outer frame 460 will be explained below. For example, by arranging the heater 72 at the center in the thickness direction of the outer frame 460, the following advantages can be obtained. That is, when a partially molded product does not fit properly in the mold and protrudes, If a foreign object or the like protrudes from the mold, it will collide with the outer frame 460 before the heater 72. In this case, a torque abnormality or the like occurs in the heater slide mechanism that slides the outer frame 460. Therefore, by detecting this torque abnormality or the like and stopping the device, the heater 72 can be protected. In other words, the outer frame 460 not only functions as a convection suppression member, but also has the function of protecting the heater 72.

[0150] The slide unit may be provided on the mold 70A or on the stage 75A of the molded product manufacturing apparatus 200, or may be provided independently outside the molded product manufacturing apparatus 200. However, it is preferable to mount the slide unit by creating a recess for a guide mechanism such as a linear guide in the parting surface of the mold 70A. This not only makes it possible to control the heater position closer to the molded product, but also allows for design without considering the effects of deflection (bending) of the support portion, and shortens the distance between the parting surface of the mold 70A and the outer frame 460, further enhancing the effectiveness of the heater as a convection suppressing member.

[0151] As described above, according to the second solution, which is based on the basic idea of ​​providing a convection suppression member, it is possible to improve the temperature uniformity in the gap between the mold 70A and the mold 70B with the simple configurations shown in Specific Configuration Example 1 and Specific Configuration Example 2, without providing a rocking mechanism for rocking the heater 72. In other words, the second solution has an extremely excellent technical significance in that it can achieve great effects without incurring any costs.

[0152] <3rd point> Next, the third improvement point will be explained.

[0153] For example, if heater 72 is configured as a heating plate, which is a contact heater, heater 72 needs to be in uniform contact with both partial molded product 250A fitted in mold 70A and partial molded product 250B fitted in mold 70B. For this reason, when molds 70A and 70B are changed from "mold open" to "mold closed," heater 72 is desirably maintained in a state where it is positioned in the center between molds 70A and 70B.

[0154] Therefore, for example, as shown in FIG. 39 , a centering mechanism 500 is provided between the mold 70A and the mold 70B. This centering mechanism 500 includes a connection portion 510 connected to the heater 72, a spring 520A provided on the mold 70A side, and a spring 520B provided on the mold 70B side. In this centering mechanism 500, the spring constants of the springs 520A and 520B are set to the same value. Therefore, when the molds 70A and 70B are switched from "mold open" to "mold closed," the heater 72 fixed to the connection portion 510 remains positioned in the center between the molds 70A and 70B. That is, the dimensions "a," "b," and "c" shown in FIG. 39 are maintained at the same values. As a result, according to the third ingenuity, the heater 72, which is a heating plate, can be brought into uniform contact with both the partial molded product 250A and the partial molded product 250B at the same timing and with the same pressure. In a contact heater, the heat transfer between the molded products 250A, 250B and the heater 72 depends on the pressing pressure. Therefore, according to the third ingenuity, the heater 72 can uniformly heat the joining portions of the partial molded products 250A and 250B.

[0155] <<Application to non-contact heaters>> The above-described centering mechanism 500 is also effective when applied to a molded product manufacturing apparatus equipped with a heater 72 that is not only a contact heater but also a non-contact heater.

[0156] This point will be explained below.

[0157] For example, FIG. 40 shows an example of a fixing mechanism for fixing a heater 72 composed of a non-contact heater. In the fixing mechanism 600 shown in FIG. 40, the distance between the heater 72 and the mold 70A is mechanically adjusted using a shim or the like. Meanwhile, the distance between the heater 72 and the mold 70B is adjusted by the control of a contact / non-contact control unit 71 that moves the mold 70B. That is, in the configuration shown in FIG. 40, the distance between the heater 72 and the mold 70A ("A") and the distance between the heater 72 and the mold 70B ("B") are adjusted by different mechanisms. As a result, in the configuration shown in FIG. 40, it is difficult to align the distance between the heater 72 and the mold 70A and the distance between the heater 72 and the mold 70B to the same distance. This means that it is difficult for the heater 72 to uniformly heat the partial molded product 250A fitted in the mold 70A and the partial molded product 250B fitted in the mold 70B.

[0158] Therefore, it is effective to use the centering mechanism 500, which is the third ingenuity, as a fixing mechanism for fixing the heater 72, which is made up of a non-contact heater, for example.

[0159] Fig. 41 is a diagram showing a configuration example in which a centering mechanism, which is the third ingenuity, is employed as a fixing mechanism for fixing heater 72, which is a non-contact heater. Figs. 42(a) and 42(b) are diagrams schematically showing the operation of the centering mechanism shown in Fig. 41. Note that partial molded products 250A and 250B are omitted from Figs. 42(a) and 42(b).

[0160] 41, a centering mechanism 500 is connected to a frame 700, and a heater 72 fixed to the frame 700 is disposed in the center of the frame 700. In this configuration, because the centering mechanism 500, which is the third ingenuity, is connected to the frame 700, the distance between the frame 700 and the mold 70A and the distance between the frame 700 and the mold 70B can be made the same (FIGS. 42(a) and 42(b)). Furthermore, because the heater 72 is disposed in the center of the frame 700, the distance between the heater 72 and the partial molded product 250A fitted in the mold 70A is necessarily the same as the distance between the heater 72 and the partial molded product 250B fitted in the mold 70B. As a result, by connecting the centering mechanism 500, which is the third innovation, to the frame 700 that fixes the heater 72 consisting of a non-contact heater, it is possible to uniformly heat the partial molded product 250A fitted into the mold 70A and the partial molded product 250B fitted into the mold 70B.

[0161] Furthermore, when the heater 72 is constructed from a non-contact heater, as explained in the second ingenuity point above, from the viewpoint of achieving uniform heating, it is desirable to provide a convection suppression member in the gap between the mold 70A and the mold 70B to suppress the temperature distribution caused by air convection.

[0162] In this regard, in the configuration shown in Fig. 41, frame 700 functions as a convection suppression member. That is, frame 700 is employed to fix heater 72, which is a non-contact heater, and a configuration (configuration shown in Fig. 41) is employed in which centering mechanism 500, which is the third ingenuity, is connected to frame 700. In this case, the centering mechanism 500 allows heater 72 to be positioned in the center between molds 70A and 70B, and the frame 700 itself functions as a convection suppression member. This combines to produce a remarkable effect in that the partial molded product 250A fitted in mold 70A and the partial molded product 250B fitted in mold 70B can be heated uniformly.

[0163] Furthermore, by "closing" the molds 70A and 70B until they come into contact with the frame 700, not only can the gap between the heater 72 and the partially molded products 250A and 250B be reduced, but gaps where air can stagnate are also eliminated, further enhancing the convection suppression effect. Also, the temperature of the air inside the frame 700 rises, reducing heat radiation from the partially molded products 250A and 250B to the air, further improving heating efficiency.

[0164] <<Modifications>> Although the centering mechanism 500 has been described using, for example, a spring-type centering mechanism as an example, the centering mechanism 500 is not limited to this, and for example, a rack-and-pinion type centering mechanism 500A as shown in Figures 43(a) and 43(b) or a link mechanism type centering mechanism 500B as shown in Figures 44(a) and 44(b) can be used.

[0165] FIG. 43(a) is a front view of the rack and pinion type centering mechanism 500A, and FIG. 43(b) is a side view of the rack and pinion type centering mechanism 500A.

[0166] 43(a) and 43(b), the gear 1000 is housed in a gear box 1100, which is fixed to a guide rail 1200. A heater-including frame 1500 and a heater slide mechanism 73 that drives the heater-including frame 1500 are connected to the guide rail 1200. When the platen 1300 moves, the rack 1400 rotates the gear 1000, and the guide rail 1200 to which the heater-including frame 1500 is attached moves so that it is always centered between the molds 1600A and 1600B. In this way, the rack and pinion type centering mechanism 500A allows the heater-including frame 1500 to be positioned in the center between the molds 1600A and 1600B.

[0167] FIG. 44(a) is a front view of the link mechanism type centering mechanism 500B, and FIG. 44(b) is a side view of the link mechanism type centering mechanism 500B.

[0168] 44(a) and 44(b), when mold platen 1300 moves, the angle between long link 2000A and short link 2000B changes, and guide rail 1200, to which heater-including frame 1500 and heater slide mechanism 73 that drives heater-including frame 1500, are connected, moves so that they are always centered between molds 1600A and 1600B. In this way, link mechanism-type centering mechanism 500B allows heater-including frame 1500 to be positioned in the center between molds 1600A and 1600B.

[0169] In the rack and pinion type centering mechanism 500A and the link mechanism type centering mechanism 500B, the guide rail 1200 arranged in the center of the mold is designed to always be positioned in the center when the mold is opened or closed, thereby achieving the same effect as the spring type centering mechanism 500. In this case, the guide rail 1200, heater slide mechanism 73, gear box 1100, gear 1000, rack 1400, etc. that constitute the rack and pinion type centering mechanism 500A, and the long link 2000A, short link 2000B, etc. that constitute the link mechanism type centering mechanism 500B need to be positioned outside the mold 1600A and mold 1600B in the planar direction so as not to interfere with the mold 1600A and mold 1600B during "mold closing" (see Figures 43(b) and 44(b)).

[0170] The invention made by the inventor has been specifically described above based on the embodiments thereof, but it goes without saying that the present invention is not limited to the above-described embodiments and can be modified in various ways without departing from the spirit of the invention. [Explanation of symbols]

[0171] 1A Partial molded product 1B Partial molded product 2A Partial molded product 2B Partial molded product 10 Integrally molded product 20A mold 20B mold 30 Mold clamping device 31 Movable plate 32 Movable type 33 Fixed type 34 Hot runner manifold 35 Fixed plate 36 Screw head (including backflow prevention ring) 37 Screw 38 cylinders 39 Heater 40 Hopper 41 Injection device 45 Integrally molded product 45A Partial molded product 45B Partial molded product 50A partial molded product 50B Partial molded product 50 One-piece molded product 51 Tie bar 52 Movable plate 53 Fixed plate 54 Movable type 55 Fixed type 56 Hot runner manifold 57 Screw head (including backflow prevention ring) 58 screw 59 cylinders 60 Heater 61 Hopper 62 Zipper 70A mold 70B mold 71 Contact / non-contact control unit 72 Heater 73 Heater slide mechanism 74 Heater slide control section 75A mold mounting section 75B mold mounting section 80A chuck part 80B chuck part 81 Partial Core 82 Air cylinder 83A Partial Core 83B Partial Core 84A Air Cylinder 84B Air Cylinder 90 Tsuba 91 Monitoring Department 92A Imaging Device 92B Imaging device 93 Monitoring and control section 95 Hydraulic ejector pin 96 Ejector pin 100 injection molding equipment 150 "HP-IWM" system 160 Injection molding equipment 160A extraction device 160B Conveyor 170 Injection molding equipment 170A extraction device 170B Conveyor 180 Robot Arm 190 Conveyor 200 Molded product manufacturing equipment 250 One-piece molded product 250A Partial molded product 250B Partial molded product 300 Notch 400 Swing Mechanism 410 Forward and backward movement mechanism 420 motor 430 Eccentric Cam 440 Cover 450 cover 460 outer frame 500 Centering Mechanism 500A centering mechanism 500B Centering Mechanism 510 Connection 520A spring 520B spring 600 Fixing mechanism 700 frames 1000 gears 1100 gearbox 1200 guide rail 1300 model board 1400 racks 1500 Frame (including heater) 1600A mold 1600B mold 2000A long link 2000B Short Link

Claims

1. Equipment for manufacturing plastic molded products, including: a first mold mounting portion capable of mounting a first mold in which a first portion constituting the resin molded product is to be disposed; a second mold mounting portion, which is arranged at a position opposite to the first mold mounting portion and is capable of mounting a second mold on which a second portion constituting the resin molded product is to be disposed; a first chuck portion configured to be able to fix the first portion; a second chuck portion configured to be able to fix the second portion; a heater movable to be inserted into a cavity formed by the first mold and the second mold, for partially melting and bonding the first portion and the second portion; a first monitoring unit configured to monitor a fastening state of the first portion fastened by the first chuck unit; and a second monitoring unit configured to be able to monitor the fastening state of the second portion fastened by the second chuck unit;

2. 2. The apparatus for manufacturing a resin molded product according to claim 1, the first monitoring unit includes a first imaging unit capable of imaging an arrangement state of the first portion, The second monitoring unit includes a second imaging unit capable of capturing an image of the arrangement state of the second portion.

3. 2. The apparatus for manufacturing a resin molded product according to claim 1, The first mold mounting portion is fixed, while The second mold mounting portion is configured to be movable.

4. (a) placing a first part constituting a resin molded product in a first mold; (b) placing a second part constituting the resin molded product in a second mold; (c) inserting a heater between the first mold and the second mold; (d) partially heating the first portion and the second portion with the heater; (e) after the step (d), a step of retracting the heater; (f) after the step (e), a step of welding the first part and the second part together; (g) removing the resin molded product including the first portion and the second portion; Equipped with Before the step (c), a step of fixing the first part by bringing a first chuck portion into contact with the first part disposed in the first mold; a step of fixing the second part by bringing a second chuck portion into contact with the second part disposed in the second mold; and the step of fixing the first portion and the step of fixing the second portion are performed in a state where the first portion and the second portion are in close contact with each other, a step of releasing the fixation of the first portion by the first chuck portion and the fixation of the second portion by the second chuck portion after the step (f) and before the step (g), A method for manufacturing a resin molded product, wherein the process of releasing the fixation of the first part by the first chuck part and the fixation of the second part by the second chuck part is performed by moving the first chuck part away from the first part and moving the second chuck part away from the second part.

5. The method for producing a resin molded product according to claim 4, Before the step (c), a step of monitoring a fixed state of the first portion fixed by the first chuck portion; a step of monitoring a fixed state of the second portion fixed by the second chuck portion; The method for producing a resin molded product comprising the steps of:

6. The method for producing a resin molded product according to claim 5, the step of monitoring the placement state of the first portion uses a first imaging device; A method for manufacturing a resin molded product, wherein the step of monitoring the placement state of the second portion uses a second imaging device.

7. The method for producing a resin molded product according to any one of claims 4 to 6, the heater is a non-contact heater, The method for manufacturing a resin molded product, wherein the step (d) is performed in a state where the heater is not in contact with the first portion and the second portion.

8. The method for producing a resin molded product according to any one of claims 4 to 6, the heater is composed of a heating plate, The method for manufacturing a resin molded product, wherein the step (d) is performed in a state where the heater is in contact with the first portion and the second portion.

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