Electronic device for stable electrical connection

Abstract

To provide an electronic device that provides a stable electrical connection between a printed circuit board and surrounding conductive components [Solution] The electronic device of the present invention comprises a housing having a bonding area and a printed circuit board having an overlap area that overlaps the bonding area and a non-overlapping area that does not overlap the bonding area, the printed circuit board including a plurality of metal layers and a plurality of lines, and the printed circuit board including a void portion where a portion of at least one or more metal layers of the plurality of metal layers near the bonding area is not formed.

Description

[Technical Field]

[0001] The present invention relates to an electronic device for stable electrical connection. [Background technology]

[0002] Antennas used in electronic devices include monopole antennas, and among these, inverted 'F' antennas and planar inverted 'F' antennas are widely used. The antenna includes a feed and a ground. The interpretation and characteristics of a monopole antenna assume that the ground is infinitely large and manufactured as a perfect conductor. However, actual grounds are neither infinitely large nor perfect conductors. Considering the components and structures within electronic devices, grounds are manufactured in various geometric shapes, and multiple grounds may function as a single ground. If the ground is not large enough, it will not perform its intended function and will act as a radiator. Typically, if the ground is circular, its diameter must be at least one wavelength of the signal. If the ground is large enough but not manufactured as a good conductor, all of the antenna's characteristics will be affected.

[0003] Electronic devices require a printed circuit board (PCB) to connect signals to an antenna, and the ground of the PCB functions as the antenna's ground and has a significant impact on the antenna's performance. Since the small area of ​​the PCB's ground alone cannot achieve adequate antenna performance, the connection between the PCB and other electrical / mechanical components within the electronic device is considered important. Therefore, the PCB's ground must be stably connected to other conductors to function as a wide ground, and the connection structure, including the PCB's ground, must be designed without deviation. Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention has been made in consideration of the above-mentioned conventional problems, and an object of the present invention is to provide an electronic device that achieves stable electrical connection between a printed circuit board and peripheral conductive components. [Means for solving the problem]

[0005] In order to achieve the above object, one aspect of the present invention provides an electronic device comprising a housing having a bonding area, and a printed circuit board having an overlap area that overlaps the bonding area and a non-overlapping area that does not overlap the bonding area, wherein the printed circuit board includes a plurality of metal layers and a plurality of lines, and the printed circuit board includes a void portion in which a portion of at least one of the plurality of metal layers near the bonding area is not formed. [Effects of the Invention]

[0006] According to the present invention, a stable electrical connection between a printed circuit board and a peripheral conductive component can be achieved, thereby reducing deviations in antenna performance within electronic devices.

[0007] The effects of the electronic device of the present invention are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a block diagram of an electronic device in a network environment in accordance with various embodiments. [Figure 2A] 1 illustrates an electronic device in an unfolded configuration according to various embodiments. [Figure 2B] 1A-1C illustrate an electronic device in a folded configuration according to various embodiments. [Figure 3]FIG. 1 is an exploded perspective view of an electronic device according to various embodiments. [Figure 4A] FIG. 1 is an exploded perspective view of a partial structure of an electronic device according to an embodiment. [Figure 4B] 4B is a diagram showing a coupling structure between a housing and a printed circuit board in the electronic device of FIG. 4A. [Figure 5A] 1 is a diagram illustrating a partial structure of an electronic device including a printed circuit board according to an embodiment. [Figure 5B] FIG. 1 illustrates a portion of a printed circuit board including multiple lines according to one embodiment. [Figure 6A] 1 is a diagram illustrating an area that is coupled to a printed circuit board among areas that constitute a housing of an electronic device according to an embodiment. [Figure 6B] 6B illustrates an area of ​​a printed circuit board of an electronic device that is coupled to a coupling area of ​​the housing of FIG. 6A, according to one embodiment. [Figure 6C] 6 is a diagram showing an area constituting a housing of an electronic device according to an embodiment, to which the structure of the printed circuit board of FIG. 5 is applied. [Figure 7] 1 is a diagram illustrating a partial structure of an electronic device including a printed circuit board according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] 1 is a block diagram of an electronic device in a network environment according to various embodiments. Referring to FIG. 1, in network environment 100, electronic device 101 communicates with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to one embodiment, electronic device 101 communicates with electronic device 104 via server 108. According to this embodiment, electronic device 101 includes processor 120, memory 130, input module 150, acoustic output module 155, display module 160, audio module 170, sensor module 176, interface 177, connecting terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identity module 196, and antenna module 197. In some embodiments, electronic device 101 omits at least one of these components (e.g., connecting terminal 178) or adds one or more other components. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (e.g., display module 160).

[0010] The processor 120 executes software (e.g., program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled to the processor 120 to perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculations, the processor 120 stores instructions or data received from other components (e.g., the sensor module 176 or the communication module 190) in the volatile memory 132, processes the instructions or data stored in the volatile memory 132, and saves the resulting data in the non-volatile memory 134. According to this embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or application processor) or an auxiliary processor 123 (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor bus processor, or a communication processor), which can operate independently or in conjunction with the main processor 121. For example, if electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to use less power or to specialize in designated functions than the main processor 121. The auxiliary processor 123 may be implemented separately from or as part of the main processor 121.

[0011] The auxiliary processor 123 controls at least a portion of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) is implemented as part of another functionally related component (e.g., the camera module 180 or the communication module 190). In one embodiment, the auxiliary processor 123 (e.g., a neural network processing unit) includes a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models are generated through machine learning. Such learning may occur, for example, within the electronic device 101 itself, where the artificial intelligence models are executed, or via a separate server (e.g., the server 108). The learning algorithm may be, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to these examples. The artificial intelligence model may include multiple artificial neural network layers, and the artificial neural network may be, for example, a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to these examples.The artificial intelligence model may additionally or alternatively include a software structure in addition to a hardware structure.

[0012] The memory 130 stores various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The data includes, for example, software (e.g., the program 140) and input or output data for instructions therefor. The memory 130 includes a volatile memory 132 or a non-volatile memory 134.

[0013] The programs 140 are stored as software in the memory 130 and include, for example, an operating system 142 , middleware 144 , or applications 146 .

[0014] The input module 150 receives instructions or data from outside the electronic device 101 (e.g., from a user) for use by components (e.g., the processor 120) of the electronic device 101. The input module 150 includes, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).

[0015] The audio output module 155 outputs audio signals external to the electronic device 101. The audio output module 155 may include, for example, a speaker or a receiver. The speaker is used for general purposes such as multimedia playback and recording playback. The receiver is used to receive incoming phone calls. In one embodiment, the receiver is implemented as a separate or part of the speaker.

[0016] The display module 160 visually presents information to an external (e.g., user) of the electronic device 101. The display module 160 includes, for example, a display, a holographic device, or a projector, and control circuitry for controlling the device. In one embodiment, the display module 160 includes a touch sensor configured to sense a touch or a pressure sensor configured to measure the strength of a force generated by a touch.

[0017] Audio module 170 converts sound into electrical signals, or vice versa. In one embodiment, audio module 170 acquires sound via input module 150 or outputs sound via acoustic output module 155 or an external electronic device (e.g., electronic device 102) (e.g., speakers or headphones) directly or wirelessly coupled to electronic device 101.

[0018] The sensor module 176 senses an operating state (e.g., power or temperature) of the electronic device 101 or an external environmental state (e.g., a user state) and generates an electrical signal or data value corresponding to the sensed state. In one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0019] Interface 177 supports one or more specified protocols used for electronic device 101 to directly or wirelessly interface with external electronic devices (e.g., electronic device 102). In one embodiment, interface 177 includes, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0020] The connection terminal 178 includes a connector through which the electronic device 101 is physically connected to an external electronic device (e.g., the electronic device 102). In one embodiment, the connection terminal 178 includes, for example, an HDMI (registered trademark) connector, a USB connector, an SD card (registered trademark) connector, or an audio connector (e.g., a headphone connector).

[0021] Haptic module 179 converts electrical signals into mechanical (e.g., vibration or movement) or electrical stimuli that can be perceived by a user through touch or kinesthetic sensation. In one embodiment, haptic module 179 includes, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0022] Camera module 180 captures still and video images and, in one embodiment, includes one or more lenses, an image sensor, an image signal processor, or a flash.

[0023] The power management module 188 manages the power supplied to the electronic device 101. In one embodiment, the power management module 188 is implemented as at least part of a power management integrated circuit (PMIC), for example.

[0024] Battery 189 provides power to at least one component of electronic device 101. According to one embodiment, battery 189 includes, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0025] The communication module 190 facilitates the establishment of a direct (e.g., wired) or wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and the execution of communication via the established communication channel. The communication module 190 includes one or more communication processors that operate independently of the processor 120 (e.g., an application processor) and facilitate the direct (e.g., wired) or wireless communication. According to the present embodiment, the communication module 190 includes a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication module). Among these communication modules, the relevant communication module communicates with an external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth®, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). Some types of such communication modules may be integrated into one component (e.g., a single chip) or implemented with multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 identifies or authenticates the electronic device 101 within a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in a subscriber identity module 196.

[0026] The wireless communication module 192 supports 5G networks and next-generation communication technologies, such as new radio access (NR) technology, which will replace 4G networks. NR technology supports high-capacity data transmission at high speeds (eMBB (enhanced mobile broadband)), terminal power minimization and multiple terminal connections (mMTC (massive machine-type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 supports high-frequency bands (e.g., mmWave bands) to achieve high data rates. The wireless communication module 192 supports various technologies for ensuring performance in high-frequency bands, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, and large-scale antennas. The wireless communication module 192 supports various requirements specified by the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to one embodiment, the wireless communication module 192 supports a peak data rate (e.g., 20 Gbps or more) for implementing eMBB, a loss coverage (e.g., 164 dB or less) for implementing mMTC, or a U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip) for implementing URLLC.

[0027] The antenna module 197 transmits or receives signals or power to or from the outside (e.g., an external electronic device). In one embodiment, the antenna module 197 includes an antenna including a radiator made of a conductor or conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module 197 includes multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the multiple antennas, for example, by the communication module 190. The signal or power is transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. In some embodiments, other components (e.g., a radio frequency integrated circuit (RFIC)) besides the radiator are implemented as part of the antenna module 197.

[0028] According to various embodiments, antenna module 197 forms an mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC supporting a designated high frequency band (e.g., the mmWave band) disposed on or adjacent a first side (e.g., bottom side) of the printed circuit board, and a plurality of antennas (e.g., array antennas) disposed on or adjacent a second side (e.g., top or side) of the printed circuit board for transmitting or receiving signals in the designated high frequency band.

[0029] At least some of the components are connected to each other via a peripheral communication method (e.g., a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and exchange signals (e.g., commands or data) between them.

[0030] In one embodiment, commands or data are transmitted or received between the electronic device 101 and the external electronic device 104 via a server 108 coupled to a second network 199. Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device 101. In one embodiment, all or part of the operations performed by the electronic device 101 are performed by one or more external electronic devices, such as the external electronic devices (102, 104) or the server 108. For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 101 requests one or more external electronic devices to perform the function or at least part of the service, instead of or in addition to performing the function or service itself. The one or more external electronic devices that receive the request perform at least part of the requested function or service, or an additional function or service related to the request, and communicate the results of the execution to the electronic device 101. The electronic device 101 processes the result directly or additionally and provides it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology is used. The electronic device 101 provides an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 includes an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device 104 or the server 108 is included in a second network 199. The electronic device 101 is applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies.

[0031] The electronic devices according to various embodiments disclosed herein may take various forms, including, for example, a portable communication device (e.g., a smartphone), a computing device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronic device. The electronic devices according to embodiments of the present invention are not limited to the above-mentioned devices.

[0032] The various embodiments and the terms used therein are not intended to limit the technical features described herein to specific embodiments, but should be understood to include various modifications, equivalents, or alternatives of the embodiments. In describing the drawings, like reference numerals are used to refer to similar or related components. The singular form of a noun corresponding to an item includes one or more of the item unless the relevant context clearly dictates otherwise. In this specification, each of the constructions such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" includes any or all possible combinations of the items listed with the construction. Terms such as "first," "second," "primarily," or "secondarily" are used merely to distinguish a component from other components and do not limit the component in other respects (e.g., importance or procedure). When a (e.g., first) component is referred to as "coupled" or "connected" to another (e.g., second) component, with or without terms such as "functionally" or "communicatively," it means that the component can be coupled to the other component directly (e.g., by wire), wirelessly, or via a third component.

[0033] The term "module" as used in various embodiments herein includes a unit implemented in hardware, software, or firmware, and is used interchangeably with terms such as logic, logic block, component, and circuit. A module may be an integrally configured component or the smallest unit or portion of a component that performs one or more functions. For example, in one embodiment, a module is implemented in the form of an application-specific integrated circuit (ASIC).

[0034] Various embodiments of the present specification may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) retrieves and executes at least one instruction from the one or more instructions stored in the storage medium. This enables the machine to operate to perform at least one function according to the retrieved at least one instruction. The one or more instructions may include code generated by a compiler or code executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, the term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves). This term does not distinguish between data being stored semi-permanently and data being stored temporarily in the storage medium.

[0035] According to one embodiment, a method according to various embodiments disclosed herein is provided in a computer program product. The computer program product is traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable recording medium (e.g., a compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store®), or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product is at least temporarily stored or temporarily generated on a machine-readable recording medium, such as the memory of a manufacturer's server, an application store server, or an intermediary server.

[0036] According to various embodiments, each of the above-described components (e.g., modules or programs) includes one or more entities, and some of the entities are separately located in other components. According to various embodiments, one or more of the above-described components or operations are omitted, or one or more other components or operations are added. Alternatively or additionally, multiple components (e.g., modules or programs) are integrated into a single component. In this case, the integrated component performs one or more functions of each of the multiple components in the same or similar manner as performed by the corresponding component of the multiple components before integration. According to various embodiments, operations performed by modules, programs, or other components are performed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations are performed in a different order, omitted, or one or more other operations are added.

[0037] FIG. 2A is a diagram illustrating an electronic device in an unfolded configuration according to various embodiments. FIG. 2B is a diagram illustrating an electronic device in a folded configuration according to various embodiments. Referring to FIGS. 2A and 2B, a foldable electronic device 201 according to this embodiment includes a pair of housings (210, 220) that are rotatably coupled via a hinge structure so as to fold relative to each other, a hinge cover 265 that covers foldable portions of the pair of housings (210, 220), and a display 261 (e.g., a flexible display or a foldable display) that is disposed in a space formed by the pair of housings (210, 220). In this specification, the surface on which the display 261 is disposed is defined as the front surface of the foldable electronic device 201, and the surface opposite the front surface is defined as the rear surface of the foldable electronic device 201. In addition, the surfaces surrounding the space between the front and rear surfaces are defined as side surfaces of the foldable electronic device 201.

[0038] In this embodiment, the pair of housings (210, 220) includes a first housing 210 including a sensor area 231, a second housing 220, a first rear cover 240, and a second rear cover 250. The pair of housings (210, 220) of the electronic device 201 are not limited to the shapes and combinations and / or connections of parts shown in Figures 2A and 2B, and may be realized by other shapes and combinations and / or connections of parts.

[0039] In this embodiment, the first housing 210 and the second housing 220 are disposed on opposite sides of the folding axis A and are disposed substantially symmetrically with respect to the folding axis A. In one embodiment, the angle or distance formed between the first housing 210 and the second housing 220 varies depending on whether the electronic device 201 is in an unfolded state, a folded state, or an intermediate state. In this embodiment, the first housing 210, unlike the second housing 220, includes a sensor area 231 in which various sensor modules (e.g., the sensor module 176 in FIG. 1 ) are disposed, but the first housing 210 and the second housing 220 have shapes symmetrical to each other in other areas. In some embodiments, the sensor area 231 is disposed in at least a portion of the second housing 220. In some embodiments, the sensor area 231 is replaced by at least a portion of the second housing 220. For example, the sensor area 231 includes a camera hole area, a sensor hole area, an under display camera (UDC) area, and / or an under display sensor (UDS) area.

[0040] In this embodiment, the first housing 210 is connected to the hinge structure when the electronic device 201 is in an unfolded state. The first housing 210 includes a first surface 211 arranged toward the front of the electronic device 201, a second surface 212 facing the opposite direction from the first surface 211, and a first side portion 213 surrounding at least a portion of the space between the first surface 211 and the second surface 212. The first side portion 213 includes a first side surface 213a arranged substantially parallel to the folding axis A, a second side surface 213b extending from one end of the first side surface 213a in a direction substantially perpendicular to the folding axis A, and a third side surface 213c extending from the other end of the first side surface 213a in a direction substantially perpendicular to the folding axis A and substantially parallel to the second side surface 213b. The second housing 220 is connected to the hinge structure when the electronic device 201 is in an unfolded state. The second housing 220 includes a third surface 221 disposed toward the front of the electronic device 201, a fourth surface 222 facing the opposite direction from the third surface 221, and a second side portion 223 surrounding at least a portion of the space between the third surface 221 and the fourth surface 222. The second side portion 223 includes a fourth side surface 223a disposed substantially parallel to the folding axis A, a fifth side surface 223b extending from one end of the fourth side surface 223a in a direction substantially perpendicular to the folding axis A, and a sixth side surface 223c extending from the other end of the fourth side surface 223a in a direction substantially perpendicular to the folding axis A and substantially parallel to the fifth side surface 223b. The first surface 211 and the third surface 221 face each other when the electronic device 201 is in the folded state.

[0041] In this embodiment, the electronic device 201 includes a recessed accommodating portion 202 that accommodates a display 261 through structural coupling between the first housing 210 and the second housing 220. The accommodating portion 202 has substantially the same size as the display 261. In this embodiment, the accommodating portion 202 has two or more different widths in a direction perpendicular to the folding axis A due to the sensor area 231. For example, the accommodating portion 202 has a first width W1 between a first portion 210a formed on an edge of the sensor area 231 of the first housing 210 and a second portion 220a of the second housing 220 that is parallel to the folding axis A, and a second width W2 between a third portion 210b that does not overlap the sensor area 231 of the first housing 210 and is parallel to the folding axis A, and a fourth portion 220b of the second housing 220. Here, the second width W2 is greater than the first width W1. In other words, the accommodating portion 202 is formed to have a first width W1 from the first portion 210a of the first housing 210 to the second portion 220a of the second housing 220, which have asymmetric shapes, and a second width W2 from the third portion 210b of the first housing 210 to the fourth portion 220b of the second housing 220. The first portion 210a and the third portion 210b of the first housing 210 are formed at different distances from the folding axis A. Meanwhile, the width of the accommodating portion 202 is not limited to the example shown in the figure. For example, the accommodating portion 202 may have three or more different widths depending on the shape of the sensor area 231 or the asymmetric shapes of the first housing 210 and the second housing 220.

[0042] In one embodiment, at least a portion of first housing 210 and second housing 220 are formed from any rigid metallic or non-metallic material suitable for supporting display 261 .

[0043] In this embodiment, sensor area 231 is formed adjacent to one corner of first housing 210. However, the arrangement, shape, or size of sensor area 231 is not limited to the example shown in the figure. In some embodiments, sensor area 231 is formed in another corner of first housing 210, or in any area of ​​the upper and lower corners. In some embodiments, sensor area 231 is arranged in at least a portion of second housing 220. In some embodiments, sensor area 231 is formed in a form extending between first housing 210 and second housing 220.

[0044] In one embodiment, electronic device 201 includes at least one component for performing various functions that is exposed and disposed on the front surface of electronic device 201 through sensor area 231 or through at least one or more openings formed in sensor area 231. For example, the component includes at least one or more of a front camera module, a receiver, a proximity sensor, an illuminance sensor, an iris recognition sensor, an ultrasonic sensor, or an indicator.

[0045] In this embodiment, the first rear cover 240 is disposed on the second surface 212 of the first housing 210 and has a substantially rectangular edge. At least a portion of the edge of the first rear cover 240 is surrounded by the first housing 210. The second rear cover 250 is disposed on the fourth surface 222 of the second housing 220 and has a substantially rectangular edge. At least a portion of the edge of the second rear cover 250 is surrounded by the second housing 220.

[0046] In this embodiment, the first rear cover 240 and the second rear cover 250 have substantially symmetrical shapes with respect to the folding axis A. In other embodiments, the first rear cover 240 and the second rear cover 250 have different shapes. In another embodiment, the first housing 210 and the first rear cover 240 are integrally formed, and the second housing 220 and the second rear cover 250 are integrally formed.

[0047] In one embodiment, the first housing 210, the second housing 220, the first rear cover 240, and the second rear cover 250 are coupled together to provide a space in which various components of the electronic device 201 (e.g., a printed circuit board, the antenna module 197 in FIG. 1 , the sensor module 176 in FIG. 1 , or the battery 189 in FIG. 1 ) are disposed. In one embodiment, at least one or more components are visually exposed on the rear surface of the electronic device 201. For example, at least one or more components are visually exposed through the first rear surface region 241 of the first rear cover 240. Here, the components include a proximity sensor, a rear camera module, and / or a flash. In this embodiment, at least a portion of the sub-display 262 is visually exposed through the second rear surface region 251 of the second rear cover 250. In one embodiment, the electronic device 201 includes an audio output module (e.g., the audio output module 155 in FIG. 1 ) disposed through at least a portion of the second rear cover 250.

[0048] In this embodiment, the display 261 is disposed in a housing 202 formed by the pair of housings (210, 220). For example, the display 261 is disposed so as to occupy substantially most of the front surface of the electronic device 201. The front surface of the electronic device 201 includes an area where the display 261 is disposed, as well as a partial area (e.g., an edge area) of the first housing 210 adjacent to the display 261 and a partial area (e.g., an edge area) of the second housing 220. The rear surface of the electronic device 201 includes the first rear cover 240, a partial area (e.g., an edge area) of the first housing 210 adjacent to the first rear cover 240, the second rear cover 250, and a partial area (e.g., an edge area) of the second housing 220 adjacent to the second rear cover 250. In one embodiment, the display 261 is a display having at least a partial area that is deformed into a flat or curved surface. In this embodiment, the display 261 includes a folding region 261c, a first region 261a on a first side (e.g., the right side) of the folding region 261c, and a second region 261b on a second side (e.g., the left side) of the folding region 261c. The first region 261a is located on the first surface 211 of the first housing 210, and the second region 261b is located on the third surface 221 of the second housing 220. However, the division of the regions of the display 261 is merely exemplary, and the display 261 may be divided into multiple regions depending on the structure or function of the display 261. For example, as shown in FIG. 2A , the region of the display 261 is divided by the folding region 261c extending parallel to the Y axis or the folding axis A, but the region of the display 261 may be divided based on another folding region (e.g., a folding region extending parallel to the X axis) or another folding axis (e.g., a folding axis parallel to the X axis). The area division of the display 261 as described above is only a physical division by the pair of housings (210, 220) and the hinge structure, and the display 261 essentially displays one screen via the pair of housings (210, 220) and the hinge structure.In one embodiment, the first region 261a includes a notch region formed along the sensor region 231, but otherwise has a shape that is substantially symmetrical to the second region 261b. In another embodiment, the first region 261a and the second region 261b have shapes that are substantially symmetrical with respect to the folding region 261c.

[0049] In this embodiment, the hinge cover 265 is disposed between the first housing 210 and the second housing 220 and is configured to cover the hinge structure. The hinge cover 265 is either hidden by at least a portion of the first housing 210 and the second housing 220 or exposed to the outside depending on the operating state of the electronic device 201. For example, as shown in FIG. 2A , when the electronic device 201 is in an unfolded state, the hinge cover 265 is hidden by the first housing 210 and the second housing 220 and is not exposed to the outside. As shown in FIG. 2B , when the electronic device 201 is in a folded state, the hinge cover 265 is exposed to the outside between the first housing 210 and the second housing 220. On the other hand, when the electronic device 201 is in an intermediate state in which the first housing 210 and the second housing 220 form an angle with each other, at least a portion of the hinge cover 265 is exposed to the outside between the first housing 210 and the second housing 220. In this case, the area of ​​the hinge cover 265 exposed to the outside is smaller than the exposed area of ​​the hinge cover 265 when the electronic device 201 is in the folded state. In this embodiment, the hinge cover 265 has a curved surface.

[0050] In operation of the electronic device 201 according to one embodiment, when the electronic device 201 is in an unfolded state (e.g., the state of the electronic device 201 in FIG. 2A ), the first housing 210 and the second housing 220 form a first angle (e.g., approximately 180°) with respect to each other, and the first region 261a and the second region 261b of the display 261 are oriented in substantially the same direction. The folding region 261c of the display 261 is substantially coplanar with the first region 261a and the second region 261b. In another embodiment, when the electronic device 201 is in an unfolded state, the first housing 210 rotates at a second angle (e.g., approximately 360°) relative to the second housing 220, thereby causing the first housing 210 and the second housing 220 to fold backward so that the second surface 212 and the fourth surface 222 face each other.

[0051] On the other hand, when the electronic device 201 is in a folded state (for example, the state of the electronic device 201 in FIG. 2B), the first housing 210 and the second housing 220 face each other. The first housing 210 and the second housing 220 form an angle of about 0 to about 10 degrees, and the first area 261a and the second area 261b of the display 261 face each other. At least a portion of the folding area 261c of the display 261 is deformed into a curved surface.

[0052] On the other hand, when the electronic device 201 is in the intermediate state, the first housing 210 and the second housing 220 form a specific angle with each other. The angle formed between the first region 261a and the second region 261b of the display 261 (e.g., a third angle, approximately 90 degrees) is larger than the angle formed when the electronic device 201 is in the folded state and smaller than the angle formed when the electronic device 201 is in the unfolded state. At least a portion of the folding region 261c of the display 261 is deformed into a curved surface. In this case, the curvature of the curved surface of the folding region 261c is smaller than the curvature of the curved surface of the folding region 261c when the electronic device 201 is in the folded state.

[0053] However, the various embodiments of the electronic device described herein are not limited to the form factor of the electronic device 201 described with reference to FIGS. 2A and 2B, but also apply to electronic devices of various form factors.

[0054] 3 is an exploded perspective view of an electronic device according to various embodiments. Referring to FIG. 3, an electronic device 301 according to this embodiment includes a display module 360 ​​(e.g., display module 160), a hinge assembly 330, a substrate 370, a first housing 310 (e.g., first housing 210), a second housing 320 (e.g., second housing 220), a first rear cover 340 (e.g., first rear cover 240) including a first rear area 341 (e.g., first rear area 241), and a second rear cover 350 (e.g., second rear cover 250) including a second rear area 351 (e.g., second rear area 251).

[0055] The display module 360 ​​includes a display 361 (e.g., display 261) and at least one layer or plate 362 on which the display 361 is mounted. In this embodiment, the plate 362 is disposed between the display 361 and the hinge assembly 330. The display 361 is disposed on at least a portion of one surface (e.g., the upper surface) of the plate 362. The plate 362 is formed in a shape corresponding to the display 361. For example, a portion of the plate 362 is formed in a shape corresponding to the notch region 364 of the display 361.

[0056] The hinge assembly 330 includes a first bracket 331, a second bracket 332, a hinge structure disposed between the first bracket 331 and the second bracket 332, a hinge cover 365 that covers the hinge structure when viewed from the outside, and a wiring member 333 (e.g., a flexible printed circuit (FPC)) that crosses the first bracket 331 and the second bracket 332.

[0057] In this embodiment, the hinge assembly 330 is disposed between the plate 362 and the substrate 370. As an example, the first bracket 331 is disposed between the first region 361a of the display 361 and the first substrate 371. The second bracket 332 is disposed between the second region 361b of the display 361 and the second substrate 372.

[0058] In this embodiment, a wiring member 333 and at least a portion of the hinge structure are disposed inside the hinge assembly 330. The wiring member 333 is disposed in a direction (e.g., the X-axis direction) that crosses the first bracket 331 and the second bracket 332. The wiring member 333 is disposed in a direction (e.g., the X-axis direction) that is perpendicular to the folding axis (e.g., the Y-axis or the folding axis A in FIG. 2A ) of the flexible region 361c of the electronic device 301.

[0059] The board 370 includes a first board 371 arranged on the first bracket 331 side and a second board 372 arranged on the second bracket 332 side. The first board 371 and the second board 372 are arranged inside a space formed by the hinge assembly 330, the first housing 310, the second housing 320, the first rear cover 340, and the second rear cover 350. Components for realizing various functions of the electronic device 301 are mounted on the first board 371 and the second board 372.

[0060] The first housing 310 and the second housing 320 are assembled together so as to be coupled to either side of the hinge assembly 330, with the display module 360 ​​coupled to the hinge assembly 330. The first housing 310 and the second housing 320 slide on either side of the hinge assembly 330 and are coupled to the hinge assembly 330.

[0061] In this embodiment, the first housing 310 includes a first rotational support surface 314, and the second housing 320 includes a second rotational support surface 324 that corresponds to the first rotational support surface 314. The first rotational support surface 314 and the second rotational support surface 324 include curved surfaces that correspond to the curved surfaces included in the hinge cover 365.

[0062] In this embodiment, when the electronic device 301 is in an unfolded state (e.g., the electronic device 201 in FIG. 2A ), the first rotation support surface 314 and the second rotation support surface 324 cover the hinge cover 365, so that the hinge cover 365 is not exposed or is only minimally exposed on the rear surface of the electronic device 301. On the other hand, when the electronic device 301 is in a folded state (e.g., the electronic device 201 in FIG. 2B ), the first rotation support surface 314 and the second rotation support surface 324 rotate along the curved surface included in the hinge cover 365, so that the hinge cover 365 is exposed to the maximum extent on the rear surface of the electronic device 301.

[0063] FIG. 4A is an exploded perspective view of a portion of an electronic device according to one embodiment. FIG. 4B is a diagram illustrating a coupling structure between a housing and a printed circuit board in the electronic device of FIG. 4A. Referring to FIGS. 4A and 4B, an electronic device 401 (e.g., electronic device 301) according to this embodiment includes at least one housing 420 (e.g., first housing 310 and / or second housing 320), and the at least one housing 420 includes a plurality of side members 425 that form a side frame for defining an internal space of the housing 420. In this embodiment, a slit 426 is formed between a pair of adjacent side members 425 among the plurality of side members 425. In one embodiment, one of the plurality of side members 425 has a rounded shape.

[0064] In this embodiment, at least one first power supply terminal 4251a is located on a first side member 4251 of the plurality of side members 425, and at least one second power supply terminal 4252a and / or at least one ground terminal 4252b is located on a second side member 4252 of the plurality of side members 425. In one embodiment, the plurality of side members 425 at least partially comprise an electrically conductive material.

[0065] In one embodiment, at least some of the side members 425 act as radiating conductors of an antenna. For example, a processor (e.g., processor 120) and / or a communication module (e.g., communication module 190) of the electronic device 401 communicates wirelessly through at least some of the side members 425 that act as radiating conductors of the antenna.

[0066] In one embodiment, at least some of the side members 425 are electrically coupled to the printed circuit board 470. For example, at least one first power supply terminal 4251a located on the first side member 4251 and / or at least one second power supply terminal 4252a located on the second side member 4252 are electrically coupled to a portion of the printed circuit board 470, and at least one ground terminal 4252b located on the second side member 4252 is electrically coupled to another portion of the printed circuit board 470, and a conductive material portion forming at least some of the side members 425 forms a part of an antenna between the portion where the at least one first power supply terminal 4251a and / or at least one second power supply terminal 4252a is located and the portion where the at least one ground terminal 4252b is located.

[0067] In this embodiment, the housing 420 includes a bottom surface 421 located within an internal space formed by the side members 425. The bottom surface 421 includes a bonding region 422 that is bonded to the printed circuit board 470 and a non-bonding region 423 that is not bonded to the printed circuit board 470. In this embodiment, the housing 420 includes a protruding rib 424 that protrudes from the bonding region 422. One surface (e.g., the upper surface) of the protruding rib 424 contacts a certain region (e.g., the overlap region A1) of the printed circuit board 470 to support the printed circuit board 470. In this embodiment, the protruding rib 424 is fastened to the printed circuit board 470. For example, the printed circuit board 470 and the protruding rib 424 include holes (4241, 4701), respectively, and the fixing member 4242 fixes the printed circuit board 470 to the protruding rib 424 via the hole 4701 of the printed circuit board 470 and the hole 4241 of the protruding rib 424. In one embodiment, the fixing member 4242 includes a screw, a hook, and / or other fixing structure. Meanwhile, the shape and structure of the bonding area 422 bonded to the printed circuit board 470 are not limited to the shape and structure of the protruding rib 424 described above, and components of various shapes and structures are possible.

[0068] 5A is a diagram illustrating a partial structure of an electronic device including a printed circuit board according to one embodiment. FIG. 5B is a diagram illustrating a portion of a printed circuit board including a plurality of lines according to one embodiment. Referring to FIG. 5A and FIG. 5B, an electronic device 501 (e.g., electronic device 401) according to this embodiment includes a housing 520 (e.g., housing 420) and a printed circuit board 570 (e.g., printed circuit board 470) coupled to the housing 520.

[0069] In this embodiment, the housing 520 includes a protruding rib 524 (e.g., protruding rib 424) protruding from a bonding region 522 (e.g., bonding region 422) that is bonded to the printed circuit board 570, a hole 5241 (e.g., hole 4241) formed in the protruding rib 524, and a fixing member 5242 (e.g., fixing member 4242) that fixes the printed circuit board 570 to the protruding rib 524 and fastens it to the hole 5241.

[0070] In an embodiment in which at least a portion of bonding region 522 is formed from a metal material, bonding region 522 includes burrs 5243. For example, burrs 5243 are formed on one surface (e.g., the top surface) of protruding rib 524 that contacts printed circuit board 570. Here, "burrs" refers to curled edges of cut metal.

[0071] In this embodiment, the printed circuit board 570 includes a plurality of metal layers 571, a plurality of printed solder resists 572, and a plurality of dielectrics 573. The plurality of metal layers 571 includes, for example, a first metal layer 571a (e.g., an upper layer), at least one second metal layer 571b (e.g., a middle layer), and a third metal layer 571c (e.g., a lower layer). The plurality of metal layers 571, the plurality of printed solder resists 572, and the plurality of dielectrics 573 are stacked along the thickness direction of the printed circuit board 570. In this embodiment, a first printed solder resist 572a of the plurality of printed solder resists 572 is located on the first metal layer 571a of the plurality of metal layers 571, and a second printed solder resist 572b of the plurality of printed solder resists 572 is located below the third metal layer 571c of the plurality of metal layers 571. Each of the plurality of dielectrics 573 is located between the first metal layer 571 and at least one second metal layer 571b, and / or between at least one second metal layer 571b and a third metal layer 571c, and when there are a plurality of second metal layers 571b, at least some of the plurality of dielectrics 573 are located between adjacent pairs of second metal layers 571b. The arrangement of the plurality of metal layers 571, the plurality of printed solder resists 572, and the plurality of dielectrics 573 as described above is not limited to the embodiment shown in the figure, and various arrangements may be used.

[0072] In one embodiment, at least some of the plurality of metal layers 571 are electrically coupled to a ground (e.g., ground terminal 4252b) of the antenna of the electronic device 501. As an example, at least one of the second metal layer 571b and the third metal layer 571c are coupled to the ground of the antenna of the electronic device 501. In some examples, only the third metal layer 571c is coupled to the ground of the antenna of the electronic device 501.

[0073] In this embodiment, the printed circuit board 570 includes an overlap region A1 that overlaps the bonding region 522 of the housing 520, and a non-overlapping region A2 that does not overlap the bonding region 522. For example, the overlap region A1 refers to the region that overlaps at least a portion of the protruding rib 524, while the non-overlapping region A2 refers to the region that does not overlap any portion of the protruding rib 524.

[0074] In this embodiment, the plurality of metal layers 571 includes a plurality of lines 574. As one example, the plurality of lines 574 are signal lines through which electrical signals pass. As another example, the plurality of lines 574 are part of a ground portion (e.g., ground terminal 4252b) that forms part of an antenna of the electronic device 501. As another example, the plurality of lines 574 are electrically coupled to a ground portion that forms part of the antenna of the electronic device 501.

[0075] In one embodiment, the multiple lines 574 are formed across both the overlap region A1 and the non-overlap region A2 of the printed circuit board 570. In other words, the multiple lines 574 are formed by making maximum use of substantially most of the limited area of ​​the printed circuit board 570, thereby maximizing the wiring efficiency for the printed circuit board 570.

[0076] In this embodiment, the printed circuit board 570 includes a void portion 575 in the non-overlapping region A2 where a portion of at least one metal layer (e.g., at least one second metal layer 571 and / or third metal layer 571c) of the multiple metal layers 571 near the bonding region 522 (e.g., one surface of the protruding rib 524) is not formed. This prevents a burr 5243 generated in the bonding region 522 from directly contacting a line formed in the at least one metal layer when the void portion 575 is formed in the at least one metal layer, thereby ensuring a stable electrical connection or reliable electrical isolation between the printed circuit board 570 and the ground portion (e.g., ground terminal 4252b) of the antenna of the electronic device 501.

[0077] In some embodiments, the void portion 575 is not formed in all of the multiple metal layers 571. For example, the void portion 575 is not formed in the first metal layer 571a, which is located farthest from the bonding region 522 (e.g., one side of the protruding rib 524) among the multiple metal layers 571, but is formed in at least some of the other metal layers (571b, 571c). This ensures that the multiple lines 574 pass through the overlap region A1 of the printed circuit board 570 that overlaps the bonding region 522 (e.g., one side of the protruding rib 524) where the burrs 5243 occur, thereby improving the routing efficiency of the lines 574.

[0078] In some embodiments, the void portion 575 is located only in the third metal layer 571 closest to the bonding region 522 (e.g., one side of the protruding rib 524). This improves the wiring efficiency of the multiple lines 574 passing over and / or under the multiple metal layers 571 while ensuring a stable electrical connection or reliable electrical isolation between the printed circuit board 570 and the ground portion of the antenna of the electronic device 501 (e.g., the ground terminal 4252b).

[0079] Fig. 6A is a diagram illustrating a region of a housing of an electronic device according to an embodiment that is coupled to a printed circuit board. Fig. 6B is a diagram illustrating a region of a printed circuit board of an electronic device according to an embodiment that is coupled to the coupling region of the housing of Fig. 6A. Fig. 6C is a diagram illustrating a region of a housing of an electronic device according to an embodiment to which the structure of the printed circuit board of Fig. 5 is applied. Referring to Figs. 6A to 6C, an electronic device 601 (e.g., electronic device 401) according to this embodiment includes at least one housing 620 (e.g., housing 420), and the at least one housing 620 includes a plurality of side members 625 (e.g., side member 425) that form a side frame for defining an internal space of the housing 620.

[0080] The electronic device 601 includes an antenna 680 that acts as a radiation conductor. A processor (e.g., processor 120) and / or a communication module (e.g., communication module 190) of the electronic device 601 communicates wirelessly via the antenna 680. In one embodiment, the antenna 680 has a plate shape. In one embodiment, the antenna 680 is formed of a metal material. In one embodiment, the antenna 680 is electrically coupled to at least one power supply terminal (6251a, 6252a) (e.g., first power supply terminal 4251a and / or second power supply terminal 4252a) and at least one ground terminal 6252b (e.g., ground terminal 4252b) formed on the side members 625. In one embodiment, at least a portion of the antenna 680 is coupled to a slit 626 (e.g., slit 426) between a pair of adjacent side members 625.

[0081] In this embodiment, the housing 620 includes a receiving portion 627 configured to receive the antenna 680. The shape and size of the receiving portion 627 correspond to the shape and size of the antenna 680.

[0082] In this embodiment, a coupling region 622 (e.g., coupling region 422) of housing 620 that overlaps overlap region A1 of printed circuit board 670 (e.g., printed circuit board 470) is located at a boundary 6271 of housing portion 627 in which antenna 680 is housed. This means that a portion of antenna 680 that acts as a ground (e.g., a portion connected to ground terminal 6252b) must be close to antenna 680 and must be far away from a portion where burrs (e.g., burr 5243) occur (e.g., coupling region 622), thereby ensuring a stable electrical connection and / or reliable electrical isolation between housing 620, printed circuit board 670, and antenna 680.

[0083] Furthermore, in an embodiment in which the electronic device 601 is a foldable electronic device (e.g., electronic device 201), when the electronic device 601 is in a substantially unfolded state (e.g., FIG. 2A ) and when the electronic device 601 is in a substantially folded state (e.g., FIG. 2B ), considering that the surface current density is large in the region of the antenna 680 located at the boundary 6271 of the receiving portion 627, applying the structure of the printed circuit board 570 described above with reference to FIG. 5A to the coupling region 622 located at the boundary 6271 of the receiving portion 627 can ensure stable electrical connection and / or reliable electrical isolation, thereby reducing performance deviations of the antenna 680.

[0084] FIG. 7 is a diagram illustrating a partial structure of an electronic device including a printed circuit board according to an embodiment. Referring to FIG. 7 , an electronic device 701 (e.g., electronic device 501) according to this embodiment includes a housing 720 (e.g., housing 520) and a printed circuit board 770 (e.g., printed circuit board 570) coupled to the housing 720. The housing 720 includes a protruding rib 724 (e.g., protruding rib 524), a hole 7241 (e.g., hole 5241), and a fixing member 7242 (e.g., fixing member 5242). The bonding region 722 (e.g., bonding region 522) includes a burr 7243 (e.g., burr 5243) formed on one surface (e.g., upper surface) of the protruding rib 724. The printed circuit board 770 includes a plurality of metal layers 771 (e.g., metal layer 571), a plurality of printed solder resists 772 (e.g., printed solder resist 572), and a plurality of dielectrics 773 (e.g., dielectric 573). The printed circuit board 770 includes an overlap region A1 (eg, overlap region A1) that overlaps the bonding region 722 of the housing 720 and a non-overlap region A2 (eg, non-overlap region A2) that does not overlap the bonding region 722.

[0085] The printed circuit board 770 includes a void portion 775 (e.g., void portion 575) in which a portion of at least one or more metal layers (e.g., at least one of the second metal layer 721b and / or the third metal layer 721c) of the plurality of metal layers 771 that is close to the bonding region 722 is not formed. In this embodiment, the void portion 775 is not formed in all of the plurality of metal layers 771. For example, the void portion 775 is not formed in the first metal layer 771a, but is formed in at least some of the other metal layers (771b, 771c). In this embodiment, the void portion 775 is located in the third metal layer 771c that is closest to the bonding region 722 (e.g., one side of the protruding rib 724).

[0086] In this embodiment, void portion 775 is located across at least a portion of overlap region A1 and at least a portion of non-overlapping region A2 of printed circuit board 770. In some embodiments, void portion 775 is located across substantially all of overlap region A1 and at least a portion of non-overlapping region A2 of printed circuit board 770. The above-described structure also prevents burr 7243 from directly contacting a line formed on at least one metal layer, as in the embodiment of printed circuit board 570 described with reference to FIGS. 5A and 5B , thereby ensuring a stable electrical connection or reliable electrical isolation between printed circuit board 770 and the ground portion of the antenna of electronic device 701 (e.g., ground terminal 4252b).

[0087] An electronic device 501 according to various embodiments comprises a housing 520 having a bonding area 522, and a printed circuit board 570 having an overlap area A1 that overlaps the bonding area 522 and a non-overlapping area A2 that does not overlap the bonding area 522, the printed circuit board 570 including a plurality of metal layers 571 and a plurality of lines 574, and the printed circuit board 570 including a void portion 575 in the non-overlapping area A2 where a portion of at least one or more metal layers (571b, 571c) of the plurality of metal layers 571 that are close to the bonding area 522 are not formed.

[0088] In one embodiment, the void portion 575 is not located in the metal layer 571 a of the plurality of metal layers 571 that is farthest from the bonding region 522 .

[0089] In one embodiment, the void portion 575 is located only in the metal layer 571c of the plurality of metal layers 571 that is closest to the bonding region 522 in the non-overlapping region A2.

[0090] In one embodiment, the plurality of lines 574 are formed in both the overlap region A1 and the non-overlap region A2.

[0091] In one embodiment, the electronic device further includes an antenna 680 including a ground portion, the ground portion being electrically coupled to the metal layer 571 c of the plurality of metal layers 571 that is closest to the coupling region 522 .

[0092] In one embodiment, the electronic device further includes an antenna 680 , the housing 620 includes a receiving portion 627 configured to receive the antenna 680 , and the coupling region 622 is located at a boundary 6271 of the receiving portion 627 .

[0093] In one embodiment, the plurality of lines 574 are lines through which signals travel.

[0094] In one embodiment, electronic device 601 further includes antenna 680 including a ground, where the ground is coupled to or forms at least a portion of the plurality of lines 574 .

[0095] In one embodiment, the housing 420 has a bottom surface 421 having a bonded area 422 and a non-bonded area 423 different from the bonded area 422, and the housing 420 includes protruding ribs (424, 524) protruding from the bonded area (422, 522) of the bottom surface 421 and contacting the metal layer 571c of the plurality of metal layers 571 that is closest to the bonded area (422, 522).

[0096] In one embodiment, the housing 420 includes a hole 4241 formed in the protruding rib 424 and a fixing member 4242 coupled to the hole 4241 to fix the printed circuit board 470 to the protruding rib 424 .

[0097] In one embodiment, the housing 520 includes a burr 5243 formed on the protruding rib 524 and meeting the metal layer 571 c of the plurality of metal layers 571 closest to the bonding region 522 .

[0098] In one embodiment, the printed circuit board 570 further includes at least one dielectric layer 573 located above or below at least one metal layer 571 of the plurality of metal layers 571 .

[0099] An electronic device (201, 501) according to various embodiments includes a first housing (210) and a second housing (220) having a coupling region (522), a hinge structure connecting the first housing (210) and the second housing (220), a display (261) including a first region (261a) located on the first housing (210), a second region (261b) located on the second housing (220), and a flexible region (261c) between the first region (261a) and the second region (261b), and a display (261) located on the first housing (210, 520). and a printed circuit board 570 having an overlapping area A1 that overlaps the bonding area 522 and a non-overlapping area A2 that does not overlap the bonding area 522, the printed circuit board 570 including a plurality of metal layers 571 and a plurality of lines 574, and the printed circuit board 570 including a void portion 575 in the non-overlapping area A2 where a portion of at least one or more metal layers (571b, 571c) of the plurality of metal layers 571 that are close to the bonding area 522 are not formed.

[0100] In one embodiment, the void portion 575 is not located in the metal layer 571 a of the plurality of metal layers 571 that is farthest from the bonding region 522 .

[0101] In one embodiment, the void portion 575 is located only in the metal layer 571c of the plurality of metal layers 571 that is closest to the bonding region 522 in the non-overlapping region A2.

[0102] In one embodiment, the plurality of lines 574 are formed in both the overlap region A1 and the non-overlap region A2.

[0103] In one embodiment, the electronic device (501, 601) further includes an antenna 680 including a ground portion, the ground portion being electrically coupled to the metal layer 571c of the plurality of metal layers 571 that is closest to the coupling region 522.

[0104] In one embodiment, the electronic device (501, 601) further includes an antenna 680, the housing 620 includes a receiving portion 627 configured to receive the antenna 680, and the coupling region 622 is located at a boundary 6271 of the receiving portion 627.

[0105] An electronic device 701 according to various embodiments includes a housing 720 having a bonding area 722, and a printed circuit board 770 having an overlap area A1 that overlaps the bonding area 722 and a non-overlapping area A2 that does not overlap the bonding area 722, wherein the printed circuit board (570, 770) includes a plurality of metal layers (571, 771) and a plurality of lines 574, and the printed circuit board 770 includes a void portion 775 in which a portion of at least one or more metal layers (771b, 771c) of the plurality of metal layers 771 that are close to the bonding area 722 are not formed.

[0106] In one embodiment, the void portion 775 is located across at least a portion of the overlap region A1 and at least a portion of the non-overlap region A2. [Explanation of symbols]

[0107] 100 Network Environment 101, 102, 104, 301, 401, 501, 601, 701, 800 Electronic equipment 108 servers 120 processors 121 Main Processor 123 Auxiliary Processor 130 memory 132 Volatile Memory 134 Non-volatile memory 136 internal memory 138 External Memory 140 Programs 142 Operating Systems 144 Middleware 146 Applications 150 Input Module 155 Acoustic Output Module 160, 360 display module 170 Audio Module 176 Sensor Module 177 Interface 178 Connecting terminal 179 Haptic Module 180 camera module 188 Power Management Module 189 Battery 190 Communication Module 192 Wireless Communication Module 194 Wired Communication Module 196 Subscriber Identity Module 197 Antenna Module 198, 199 First and second networks 201 Foldable Electronic Device 202 Storage Unit 210, 220 First and second housings 210a, 220a, 210b, 220b 1st to 4th parts 211, 212, 221, 222 1st to 4th sides 213, 223 First and second side sections 213a, 213b, 213c 1st to 3rd sides 223a, 223b, 223c 4th to 6th aspects 231 Sensor Area 240, 250 1st and 2nd rear covers 241, 251 First and second rear areas 261, 361 display 261a, 261b First and second areas 261c folding region 262 Sub-display 265, 365 hinge cover 310, 320 First and second housings 314, 324 First and second rotation support surfaces 330 Hinge Assembly 331, 332 First and second brackets 333 Wiring materials 340, 350 1st and 2nd rear covers 341, 351 First and second rear areas 361a, 361b First and Second Areas 361c Flexible Area 362 Plate 364 Cutout Area 370 PCB 371, 372 First and second substrates 420, 520, 620, 720 housing 421 bottom 422, 522, 622, 722 binding region 423 Unbonded area 424, 524, 724 protruding ribs 425, 625 side members 426, 626 slits 470, 570, 670, 770 Printed Circuit Boards 571, 771 Metal Layer 571a, 571b, 571c 1st to 3rd metal layers 572, 772 Printed solder resist 572a, 572b First and second printed solder resists 573, 773 Dielectrics 574 lines 575, 775 void part 627 Storage Unit 680 Antenna 771a, 771b, 771c 1st to 3rd metal layers 4241, 4701, 5241, 7241 holes 4242, 5242, 7242 fixing parts 4251, 4252 First and second side members 4251a, 4252a First and second power supply terminals 4252b, 6252b ground terminal 5243, 7243 Bali (burr) 6251a Power supply terminal 6271 Boundary A1 overlap area A2 Non-overlapping area

Claims

1. 1. An electronic device, comprising: a housing having a bonding area with a burr formed therein; a printed circuit board having an overlap region that overlaps the bonding region and a non-overlapping region that does not overlap the bonding region, The printed circuit board is formed by alternately stacking a plurality of metal layers including a plurality of lines and a plurality of dielectric layers; the burr is formed on an upper surface of a protruding rib in the joining region that contacts the printed circuit board in the overlap region; the printed circuit board includes a void portion in which a portion of at least one metal layer among the plurality of metal layers closest to the bonding region is not formed, in a portion corresponding to a burr formed on an upper surface of a protruding rib in the bonding region; The electronic device is characterized in that the plurality of lines are formed in both the overlapping region and the non-overlapping region.

2. 2. The electronic device according to claim 1, wherein the void portion is not located in the metal layer farthest from the bonding region among the plurality of metal layers.

3. 2. The electronic device according to claim 1, wherein the void portion is located only in a metal layer of the plurality of metal layers that is closest to the joining region in the non-overlapping region.

4. the electronic device further includes a ground portion forming part of the antenna; The electronic device of claim 1 , wherein the ground portion is electrically connected to a metal layer of the plurality of metal layers that is closest to the coupling region.

5. 2. The electronic device of claim 1, wherein the plurality of lines includes lines through which signals pass.

6. the electronic device further includes a ground portion forming part of the antenna; The electronic device of claim 1 , wherein the ground portion is coupled to the plurality of lines or forms at least a portion of the plurality of lines.

7. 10. The electronic device of claim 1, wherein the printed circuit board further comprises at least one dielectric layer located above or below at least one of the plurality of metal layers.

8. The electronic device according to claim 1 , wherein the void portion is located across at least a portion of the overlap region and at least a portion of the non-overlapping region.

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