Roll packaging

Abstract

The present invention provides a roll packaging body that can prevent cracks or breaks from occurring in a resin film. [Solution] The roll packaging body of the present invention comprises a winding core, a resin film, and a packaging film, wherein the axial dimension of the winding core is larger than the width dimension of the resin film, the resin film is wound in a roll shape on the outer peripheral surface of the winding core in an area excluding the outer peripheral surface of the end of the winding core, the packaging film is wound on the outer peripheral surface of the roll of resin film, the packaging film extends onto the side of the roll of resin film, and the resin film contains 30% by weight or more of an inorganic filler.

Description

[Technical Field]

[0001] The present invention relates to a roll package in which a resin film is wound around the outer peripheral surface of a winding core. [Background technology]

[0002] Conventionally, various resin films have been used to obtain electronic components such as semiconductor devices, laminates, printed wiring boards, etc. For example, in flexible printed wiring boards and multilayer printed wiring boards, resin films are used to form insulating layers for insulating between internal layers and to form insulating layers located on the surface layer portions.

[0003] In flexible printed wiring boards and the like, polyimide films are often used to form flexible insulating layers. Furthermore, before manufacturing flexible printed wiring boards and the like, raw resin film may be wound into a roll. Furthermore, the rolled raw film may be stored or transported. During this storage and transportation, the rolled raw film may be exposed to various environments and may be subjected to impacts.

[0004] Patent Document 1 below discloses a polyimide film roll in which a polyimide film having a thickness of 1 μm or more and 30 μm or less is wound into a roll and the rolled polyimide film is wrapped in a wrapping sheet material, which is made of a metal material.

[0005] On the other hand, in multilayer printed wiring boards, resin films containing inorganic fillers are used to form insulating layers with low dielectric loss tangents. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-370788 Summary of the Invention [Problem to be solved by the invention]

[0007] Resin films containing inorganic fillers are prone to cracks or breakage when they are bent or subjected to impact. When the content of inorganic fillers is low, cracks or breakage can be prevented, but when the content of inorganic fillers in the resin film is high, cracks or breakage are likely to occur when the resin film is bent or subjected to impact.

[0008] Furthermore, when a resin film containing an inorganic filler is wound into a roll to form a roll body, cracks or breaks are significantly likely to occur.

[0009] A cracked or broken resin film is likely to cause voids when laminated onto a substrate, and the use of a cracked or broken resin film significantly reduces the insulation reliability of the insulating layer.

[0010] An object of the present invention is to provide a roll packaging body that can prevent cracks or breaks from occurring in the resin film. [Means for solving the problem]

[0011] According to a broad aspect of the present invention, there is provided a roll packaging body comprising a winding core, a resin film, and a packaging film, wherein the axial dimension of the winding core is larger than the width dimension of the resin film, the resin film is wound in a roll shape on the outer peripheral surface of the winding core in an area excluding the outer peripheral surface of the end portion of the winding core, the packaging film is wound on the outer peripheral surface of the roll of resin film, the packaging film extends onto the side surface of the roll of resin film, and the resin film contains 30% by weight or more of an inorganic filler.

[0012] In a specific aspect of the roll packaging according to the present invention, a cushioning material is disposed on the outer peripheral surface of the end portion of the core.

[0013] In a specific aspect of the roll packaging according to the present invention, the core has openings on both axially opposite sides, and the packaging film is folded into the openings of the core.

[0014] In a specific aspect of the roll packaging according to the present invention, a buffer material is disposed on the outer peripheral surface of the end portion of the core via the packaging film.

[0015] In a particular aspect of the roll packaging body of the present invention, the roll packaging body is provided with a holding member for holding the winding core, the resin film, and the packaging film in a suspended state, and the holding member is attached to both axial sides of the winding core.

[0016] In a particular aspect of the roll packaging body of the present invention, the winding core has openings on both axial side portions, the holding member has a holding member main body and an insertion portion, and the insertion portion of the holding member is inserted into the opening of the winding core.

[0017] In a particular aspect of the roll packaging body of the present invention, in the axial direction of the winding core, the tip of the insertion portion of the holding member inserted into the opening of the winding core is positioned inside the end of the resin film.

[0018] In a specific aspect of the roll packaging according to the present invention, a buffer film is disposed between the roll of resin film and the packaging film.

[0019] In a specific aspect of the roll packaging according to the present invention, the resin film contains 60% by weight or more of the inorganic filler.

[0020] In a specific aspect of the roll packaging according to the present invention, the resin film contains a thermosetting compound and a curing agent.

[0021] In a specific aspect of the roll packaging according to the present invention, the thermosetting compound is an epoxy resin.

[0022] In a specific aspect of the roll packaging according to the present invention, the resin film is a B-stage film. [Effects of the Invention]

[0023] The roll packaging according to the present invention comprises a winding core, a resin film, and a packaging film. In the roll packaging according to the present invention, the axial dimension of the winding core is greater than the width dimension of the resin film. In the roll packaging according to the present invention, the resin film is wound in a roll shape on the outer peripheral surface of the winding core in an area excluding the outer peripheral surface of the end portion of the winding core, and the packaging film is wound on the outer peripheral surface of the roll of resin film, and the packaging film extends onto the side surface of the roll of resin film. In the roll packaging according to the present invention, the resin film contains 30% by weight or more of an inorganic filler. Since the roll packaging according to the present invention has the above configuration, it is possible to prevent cracks or breaks in the resin film. [Brief explanation of the drawings]

[0024] [Figure 1] FIG. 1 is a cross-sectional view schematically showing a roll packaging body according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a perspective view schematically showing a roll packaging body according to a second embodiment of the present invention. [Figure 3] FIG. 3 is a perspective view schematically showing a roll packaging body according to a third embodiment of the present invention. [Figure 4] FIG. 4 is a perspective view schematically showing the cushioning material. [Figure 5] FIG. 5 is a perspective view schematically showing the holding member. DETAILED DESCRIPTION OF THE INVENTION

[0025] The present invention will be described in detail below.

[0026] The roll packaging according to the present invention comprises a winding core, a resin film, and a packaging film. In the roll packaging according to the present invention, the axial dimension of the winding core is greater than the width dimension of the resin film. In the roll packaging according to the present invention, the resin film is wound in a roll shape on the outer peripheral surface of the winding core in an area excluding the outer peripheral surface of the end portion of the winding core, and the packaging film is wound on the outer peripheral surface of the roll of resin film, and the packaging film extends onto the side surface of the roll of resin film. In the roll packaging according to the present invention, the resin film contains 30% by weight or more of an inorganic filler. Since the roll packaging according to the present invention has the above configuration, it is possible to prevent cracks or breaks in the resin film.

[0027] Generally, resin films containing inorganic fillers are prone to cracking or breaking when bent or subjected to impact, making it difficult to obtain a good roll packaging body.

[0028] In the roll packaging according to the present invention, even though a resin film containing a relatively large amount of inorganic filler is wound into a roll, the occurrence of cracks or breaks in the resin film can be prevented.

[0029] Furthermore, in the roll packaging according to the present invention, cracks or breaks in the resin film can be prevented, so that voids are less likely to occur even when the resin film is laminated on a substrate.Furthermore, when an insulating layer is formed using the resin film, the insulating reliability can be improved.

[0030] Furthermore, in the roll packaging according to the present invention, it is possible to prevent the resin film from becoming misaligned when wound.

[0031] The resin film is preferably a resin film used to form an insulating layer in a printed wiring board.

[0032] Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.

[0033] Fig. 1 is a cross-sectional view schematically showing a roll packaging body according to a first embodiment of the present invention. Note that different parts in Fig. 1 and the figures described below can be interchanged with each other.

[0034] The roll packaging body 1 includes a core 3, a resin film 2, a packaging film 4, a cushioning material 5, a holding member 6, and a cushioning film .

[0035] The winding core 3 has openings 3a on both axial side portions. The inside of the winding core 3 is hollow. The winding core 3 is cylindrical.

[0036] The axial dimension of the winding core 3 is larger than the width dimension of the resin film 2 .

[0037] The resin film 2 is wound in a roll on the outer peripheral surface of the winding core 3 in an area excluding the outer peripheral surface of the end portion of the winding core 3. The resin film 2 is not wound on the outer peripheral surface of the end portion of the winding core 3. The winding core 3 and the resin film 2 are in contact on the outer peripheral surface of the winding core 3. Another film may be disposed between the winding core and the resin film. The resin film 2 is wound in a roll from one end to the other end in the length direction. The width direction of the resin film 2 corresponds to the axial direction of the winding core 3.

[0038] Since the resin film 2 is wound in a roll shape, the resin film 2 is wound one or more times around the outer peripheral surface of the winding core 3. The resin film 2 is a roll body. It is preferable that the resin film is wound two or more times around the outer peripheral surface of the winding core, and it is preferable that the resin film on the inner periphery and the resin film on the outer periphery are laminated together.

[0039] A buffer film 7 is disposed between the roll of resin film 2 and the packaging film 4. The resin film 2 and the buffer film 7 are in contact with each other on the outer peripheral surface of the resin film 2. The outer peripheral surface of the resin film 2 is protected by the buffer film 7. The buffer film 7 is wrapped around the outer peripheral surface of the resin film 2 one or more times. The buffer film may be wrapped around the outer peripheral surface of the resin film two or more times. A buffer film need not be used.

[0040] A packaging film 4 is wound on the outer peripheral surface of the roll of resin film 2. In this embodiment, the packaging film 4 is wound on the outer peripheral surface of the roll of resin film 2 with a buffer film 7 interposed therebetween. The packaging film may be wound directly on the outer peripheral surface of the roll of resin film without a buffer film interposed therebetween. The packaging film 4 extends onto the end of the winding core 3. The packaging film 4 is wound onto the outer peripheral surface of the end of the winding core 3. The buffer film 7 and the packaging film 4 are in contact with each other on the outer peripheral surface of the buffer film 7. The winding core 3 and the packaging film 4 are in contact with each other on the end of the winding core 3. The resin film 2 and the packaging film 4 are not in contact with each other on the outer peripheral surface of the resin film 2. The packaging film 4 extends onto the side of the roll of resin film 2. The portion of the packaging film that extends onto the side of the roll of resin film is located to the side of the side of the roll of resin film. As long as the packaging film reaches the side surface of the roll of resin film, the packaging film may or may not be in contact with the side surface of the roll of resin film. A space may be left between the packaging film and the side surface of the roll of resin film, or another member may be disposed therebetween.

[0041] The packaging film 4 is folded into the opening 3a of the winding core 3. Therefore, the packaging film 4 is well held in the roll packaging body 1. By folding the packaging film 4 into the opening 3a of the winding core 3, it is possible to prevent the packaging form from losing its shape.

[0042] A cushioning material 5 is disposed on the outer peripheral surface of the end of the winding core 3 with a packaging film 4 interposed therebetween. In this embodiment, the cushioning material 5 shown in FIG. 4(a) is used. The cushioning material 5 is disposed on the outer peripheral surface of the end of the winding core 3 with a packaging film 4 interposed therebetween. The cushioning material 5 has a rectangular parallelepiped shape, and the rectangular parallelepiped has an opening that corresponds to the size of the end of the winding core 3. The cushioning material 5 is inserted onto the winding core 3 from the outside to the inside in the axial direction of the winding core 3 so that the end of the winding core 3 is located within the opening of the cushioning material 5. The cushioning material 5 provides good protection for the packaging form and protects the side of the roll of the resin film 2. In the radial direction of the annularly wound packaging film 4, the cushioning material 5 extends to the outside of the packaging film 4. A cushioning material need not be used.

[0043] Instead of the cushioning material 5, for example, a cushioning material 5A shown in FIG. 4(b) may be used. The cushioning material 5A includes a first cushioning member 5a and a second cushioning member 5b. The cushioning material 5A has a shape obtained by cutting the cushioning material 5 in the center. The first cushioning member 5a and the second cushioning member 5b each have a semicircular recess. The cushioning material 5A, which is a combination of the first cushioning member 5a and the second cushioning member 5b, has a rectangular parallelepiped shape and an opening corresponding to the size of the end of the winding core. By fitting the recess of the first cushioning member 5a and the recess of the second cushioning member 5b of the cushioning material 5A onto the outer peripheral surface of the end of the winding core, the cushioning material 5A can be easily positioned on the outer peripheral surface of the end of the winding core. Compared to the cushioning material 5A, the cushioning material 5 is less likely to unintentionally detach from the roll package. Furthermore, the cushioning material 5A is easier to remove than the cushioning material 5. As the buffer material, only the first buffer member 5a or only the second buffer member 5b may be used.

[0044] The shape of the opening of the cushioning material can be changed depending on the shape of the end of the winding core. The outer shape of the cushioning material may be a polygon such as a square, or may be a circle.

[0045] Holding members 6 are attached to both axial sides of the winding core 3. In this embodiment, the holding member 6 shown in FIG. 5 is used. The holding member 6 is a member for holding the winding core 3, the resin film 2, and the packaging film 4 in a suspended state. As shown in FIG. 1, the holding member 6 does not have to hold the cushioning material 5 in a suspended state. The holding member may hold the cushioning material in a suspended state.

[0046] In the radial direction of the annularly wound packaging film 4, the holding member 6 extends to the outside of the packaging film 4. The holding member 6 has a holding member body 6a and an insertion portion 6b. The insertion portion 6b of the holding member 6 is inserted into the opening 3a of the winding core 3. The insertion portion 6b of the holding member 6 is inserted into the winding core 3 so that the insertion portion 6b of the holding member 6 is positioned within the opening 3a of the winding core 3 and the opening of the cushioning material 5. In the axial direction of the winding core 3, the tip of the insertion portion 6b of the holding member 6 inserted into the opening 3a of the winding core 3 is located inside the end of the resin film 2. This allows the winding core 3, the resin film 2, and the packaging film 4 to be more effectively held in a suspended state. In the axial direction of the winding core, the tip of the insertion portion of the holding member inserted into the opening of the winding core may be located outside the end of the resin film or may be aligned with the end of the resin film. A holding member may not be used.

[0047] As shown in Figure 1, the roll packaging 1 can be placed on a placement surface. A holding member 6 contacts the placement surface. A cushioning material 5 contacts the placement surface. The cushioning material does not have to contact the placement surface. When the roll packaging 1 is placed on the placement surface, the core 3, resin film 2, and packaging film 4 are held in a suspended state.

[0048] FIG. 2 is a perspective view schematically showing a roll packaging body according to a second embodiment of the present invention.

[0049] The roll packaging 11A includes a winding core 3, a resin film 2, and a packaging film 4A. The roll packaging 11A and the roll packaging 1 shown in FIG. 1 have the same configurations of the winding core 3 and the resin film 2.

[0050] Unlike the roll packaging 1, the roll packaging 11A does not include a cushioning material, a holding member, or a cushioning film.

[0051] A packaging film 4A is wound on the outer peripheral surface of the roll of resin film 2. The resin film 2 and packaging film 4A are in contact with each other on the outer peripheral surface of the resin film 2. The packaging film 4A extends onto the side of the roll of resin film 2. The winding core 3 and packaging film 4A are in contact with each other on the end of the winding core 3. The end of the packaging film 4 is in contact with the outer peripheral surface of the end of the winding core 3.

[0052] In the roll package 11A, the packaging film 4A is not folded into the opening 3a of the core 3.

[0053] It should be noted that a cushioning material, a holding member, or a cushioning film may be used for the roll packaging body 11A shown in FIG.

[0054] FIG. 3 is a perspective view schematically showing a roll packaging body according to a third embodiment of the present invention.

[0055] The roll packaging body 11B includes a winding core 3, a resin film 2, and a packaging film 4. The roll packaging body 11B and the roll packaging body 1 shown in FIG. 1 have the same configurations as the winding core 3, the resin film 2, and the packaging film 4.

[0056] Unlike the roll packaging 1, the roll packaging 11B does not include a cushioning material, a holding member, or a cushioning film.

[0057] The packaging film 4 is folded into the opening 3a of the winding core 3. As described above, the packaging films 4 of the roll packaging body 11B and the roll packaging body 1 are configured in the same way. However, in the roll packaging body 11B, no cushioning material or holding member is used, and therefore the end of the packaging film 4 does not contact the outer peripheral surface of the end of the winding core 3.

[0058] Note that a cushioning material or a holding member may be used for the roll packaging 11B shown in Fig. 3. By using a cushioning material 5 for the roll packaging 11B shown in Fig. 3, the end of the packaging film 4 comes into contact with the outer peripheral surface of the end of the winding core 3. By using a cushioning material 5 and a holding member 6 for the roll packaging 11B shown in Fig. 3, it is possible to obtain a roll packaging that differs from the roll packaging 1 shown in Fig. 1 only in the presence or absence of a cushioning film.

[0059] The roll packaging according to the present invention will be described in further detail below.

[0060] (winding core) The material of the winding core is not particularly limited, but is preferably a plastic resin, which has excellent processability, lightness, and strength.

[0061] Examples of the plastic resin include polyethylene (PE) resin, polypropylene (PP) resin, polystyrene (PS) resin, acrylonitrile butadiene styrene (ABS) resin, nylon resin, and polyvinyl chloride resin.

[0062] The axial dimension of the winding core is larger than the width dimension of the resin film.

[0063] The axial dimension of the winding core is preferably 20 cm or more, more preferably 25 cm or more, and preferably 100 cm or less, more preferably 95 cm or less.

[0064] The axial dimension of the core is preferably at least 1 cm larger than the width dimension of the resin film, and more preferably at least 2 cm larger.

[0065] From the viewpoint of reducing the weight of the roll package, the core preferably has openings on both axial sides, and the core is preferably cylindrical.

[0066] The resin film is wound in a roll shape on the outer peripheral surface of the winding core in a region excluding the outer peripheral surface of the end portion of the winding core. The outer shape of the portion of the winding core around which the resin film is wound is preferably circular. The portion of the winding core around which the resin film is wound preferably has an internal cavity.

[0067] When the winding core is cylindrical, the inner diameter and thickness of the winding core are appropriately set in consideration of the strength and lightness of the winding core, etc. For example, a winding core with an inner diameter of 7.6 cm (3 inches) and a thickness of 4 mm can be used.

[0068] (resin film) The resin film is wound in a roll shape on the outer peripheral surface of the winding core in an area excluding the outer peripheral surface of the end portion of the winding core. Thus, the resin film is wound around the outer peripheral surface of the winding core one or more times. The resin film is in a roll form.

[0069] The length of the resin film is preferably 20 m or more and preferably 300 m or less. When the length of the resin film is equal to or less than the upper limit, even when the resin film is wound onto the outer peripheral surface of the winding core, the winding slippage of the resin film can be effectively prevented.

[0070] The width of the resin film is preferably 20 cm or more, more preferably 25 cm or more, and is preferably 100 cm or less, more preferably 95 cm or less.

[0071] The resin film contains an inorganic filler, which will be described later. The resin film preferably contains a thermosetting compound and a curing agent, which will be described later.

[0072] Each component used in the resin film will be described in detail below.

[0073] [Inorganic filler] The resin film contains an inorganic filler. The use of the inorganic filler reduces the dimensional change of the cured product due to heat. Furthermore, the surface roughness of the cured product is further reduced, and the adhesive strength between the insulating layer and the metal layer is increased.

[0074] Examples of the inorganic filler include silica, talc, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.

[0075] From the viewpoints of reducing the surface roughness of the cured product, further increasing the adhesive strength between the insulating layer and the metal layer, forming finer wiring on the surface of the insulating layer, and imparting better insulating reliability to the insulating layer, the inorganic filler is preferably silica or alumina, more preferably silica, and even more preferably fused silica. The use of silica further reduces the thermal expansion coefficient of the cured product, effectively reduces the surface roughness of the cured product, and effectively increases the adhesive strength between the insulating layer and the metal layer. The silica is preferably spherical in shape.

[0076] From the viewpoint of promoting resin curing regardless of the curing environment, effectively increasing the glass transition temperature of the cured product, and effectively reducing the coefficient of linear thermal expansion of the cured product, it is preferable that the inorganic filler be spherical silica.

[0077] The inorganic filler has an average particle size of preferably 10 nm or more, more preferably 50 nm or more, even more preferably 100 nm or more, and preferably 5 μm or less, more preferably 3 μm or less, even more preferably 1 μm or less, and particularly preferably 0.5 μm or less. When the inorganic filler has an average particle size not less than the above lower limit and not more than the above upper limit, the adhesive strength between the insulating layer and the metal layer is further increased.

[0078] The median diameter (d50) at 50% is used as the average particle size of the inorganic filler. The average particle size can be measured using a particle size distribution measuring device using a laser diffraction scattering method.

[0079] The inorganic fillers are preferably spherical, and more preferably spherical silica. In this case, the surface roughness of the cured product is effectively reduced, and the adhesive strength between the insulating layer and the metal layer is effectively increased. When the inorganic fillers are spherical, the aspect ratio of each of the inorganic fillers is preferably 2 or less, more preferably 1.5 or less.

[0080] The inorganic filler is preferably surface-treated, more preferably with a coupling agent, and even more preferably with a silane coupling agent, which further reduces the surface roughness of the roughened cured product, further increases the adhesive strength between the insulating layer and the metal layer, allows finer wiring to be formed on the surface of the insulating layer, and provides the insulating layer with better inter-wiring insulation reliability and inter-layer insulation reliability.

[0081] Examples of the coupling agent include a silane coupling agent, a titanium coupling agent, and an aluminum coupling agent, etc. Examples of the silane coupling agent include methacrylsilane, acrylsilane, aminosilane, imidazolesilane, vinylsilane, and epoxysilane.

[0082] The content of the inorganic filler in 100% by weight of the resin film is 30% by weight or more. The content of the inorganic filler in 100% by weight of the resin film is preferably 50% by weight or more, more preferably 60% by weight or more, even more preferably 70% by weight or more, preferably 90% by weight or less, more preferably 85% by weight or less, even more preferably 83% by weight or less, and particularly preferably 80% by weight or less. When the content of the inorganic filler is above the lower limit and below the upper limit, the surface roughness of the insulating layer is further reduced, the adhesive strength between the insulating layer and the metal layer is further increased, and finer wiring is formed on the surface of the insulating layer. Furthermore, this amount of inorganic filler can reduce the thermal expansion coefficient of the insulating layer and simultaneously improve smear removal. When the content of the inorganic filler is above the lower limit, the dielectric loss tangent is effectively reduced.

[0083] [Thermosetting compound] The resin film preferably contains a thermosetting compound. The thermosetting compound is not particularly limited. Any conventionally known thermosetting compound can be used as the thermosetting compound.

[0084] Examples of the thermosetting compound include a styrene compound, a phenoxy compound, an oxetane compound, an epoxy compound, an episulfide compound, a (meth)acrylic compound, a phenol compound, an amino compound, an unsaturated polyester compound, a polyurethane compound, a silicone compound, and a polyimide compound. The thermosetting compound may be used alone or in combination of two or more.

[0085] The thermosetting compound is preferably an epoxy compound. The epoxy compound refers to an organic compound having at least one epoxy group. The thermosetting compound and the epoxy compound may be used alone or in combination of two or more.

[0086] Examples of the epoxy compound include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds, fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthylene ether type epoxy compounds, and epoxy compounds having a triazine nucleus in the skeleton.

[0087] From the viewpoint of further increasing the adhesive strength between the insulating layer and the metal layer, the epoxy compound preferably has an aromatic skeleton, preferably has a biphenyl skeleton, and is preferably a biphenyl-type epoxy compound.

[0088] From the viewpoint of further increasing the adhesive strength between the insulating layer and the metal layer, the content of the thermosetting compound in 100% by weight of the resin film is preferably 10% by weight or more, more preferably 20% by weight or more, preferably 70% by weight or less, more preferably 65% ​​by weight or less, even more preferably 60% by weight or less, and particularly preferably 55% by weight or less.

[0089] The molecular weight of the epoxy compound is more preferably not more than 1000. In this case, when the resin film is laminated on a substrate, the inorganic filler can be uniformly distributed.

[0090] The molecular weight of the epoxy compound and the molecular weight of the curing agent described below refer to the molecular weight that can be calculated from the structural formula when the epoxy compound or curing agent is not a polymer and when the structural formula of the epoxy compound or curing agent can be identified. When the epoxy compound or curing agent is a polymer, the molecular weight refers to the weight average molecular weight.

[0091] [Hardening agent] The resin film preferably contains a curing agent. The curing agent is not particularly limited. Conventionally known curing agents can be used as the curing agent. Only one type of the curing agent may be used, or two or more types may be used in combination.

[0092] Examples of the curing agent include cyanate ester compounds (cyanate ester curing agents), phenol compounds (phenol curing agents), amine compounds (amine curing agents), thiol compounds (thiol curing agents), imidazole compounds, phosphine compounds, acid anhydrides, active ester compounds, and dicyandiamide. When the thermosetting compound is an epoxy compound, the curing agent preferably has a functional group capable of reacting with the epoxy group of the epoxy compound.

[0093] Examples of the cyanate ester compounds include novolac cyanate ester resins, bisphenol cyanate ester resins, and prepolymers of these partially trimerized resins. Examples of the novolac cyanate ester resins include phenol novolac cyanate ester resins and alkylphenol cyanate ester resins. Examples of the bisphenol cyanate ester resins include bisphenol A cyanate ester resins, bisphenol E cyanate ester resins, and tetramethylbisphenol F cyanate ester resins.

[0094] Commercially available cyanate ester compounds include phenol novolac cyanate ester resins (PT-30 and PT-60 manufactured by Lonza Japan) and trimerized prepolymers of bisphenol cyanate ester resins (BA-230S, BA-3000S, BTP-1000S, and BTP-6020S manufactured by Lonza Japan).

[0095] Examples of the phenol compound include novolac type phenols, biphenol type phenols, naphthalene type phenols, dicyclopentadiene type phenols, aralkyl type phenols, and dicyclopentadiene type phenols.

[0096] Commercially available phenol compounds include novolac phenols (manufactured by DIC Corporation under the name "TD-2091"), biphenyl novolac phenols (manufactured by Meiwa Chemical Industry Co., Ltd. under the name "MEH-7851"), aralkyl phenol compounds (manufactured by Meiwa Chemical Industry Co., Ltd. under the name "MEH-7800"), and phenols having an aminotriazine skeleton (manufactured by DIC Corporation under the names "LA1356" and "LA3018-50P").

[0097] From the viewpoint of further reducing the dielectric loss tangent, the curing agent preferably contains an active ester compound. The active ester compound refers to a compound that contains at least one ester bond in its structure and has aromatic rings bonded to both sides of the ester bond. A preferred example of the active ester compound is a compound represented by the following formula (1):

[0098] [ka]

[0099] In the formula (1), X1 and X2 each represent a group containing an aromatic ring. Preferred examples of the group containing an aromatic ring include an optionally substituted benzene ring and an optionally substituted naphthalene ring. Examples of the substituent include a hydrocarbon group. The number of carbon atoms in the hydrocarbon group is preferably 12 or less, more preferably 6 or less, and even more preferably 4 or less.

[0100] Examples of the combination of X1 and X2 include a combination of an optionally substituted benzene ring and an optionally substituted benzene ring, and a combination of an optionally substituted benzene ring and an optionally substituted naphthalene ring.Furthermore, examples of the combination of X1 and X2 include a combination of an optionally substituted naphthalene ring and an optionally substituted naphthalene ring.

[0101] The active ester compound is not particularly limited. Commercially available products of the active ester compound include "HPC-8000-65T," "EXB9416-70BK," "EXB8100-65T," and "EXB-8000L-65MT" manufactured by DIC Corporation.

[0102] The molecular weight of the curing agent is preferably not more than 1000. In this case, when the resin film is laminated on a substrate, the inorganic filler can be uniformly distributed.

[0103] The total content of the thermosetting compound and the curing agent, and the total content of the epoxy compound and the curing agent, based on 100% by weight of the components in the resin film excluding the inorganic filler, is preferably 75% by weight or more, more preferably 80% by weight or more, and preferably 99% by weight or less, and more preferably 97% by weight or less. When the total content of the thermosetting compound and the curing agent, and the total content of the epoxy compound and the curing agent, are above the above-mentioned lower limit and below the above-mentioned upper limit, a better cured product is obtained, and the melt viscosity can be adjusted, resulting in better dispersibility of the inorganic filler. Furthermore, the resin film can be prevented from spreading to unintended areas during the curing process. Furthermore, dimensional change of the cured product due to heat can be further suppressed. Furthermore, when the total content of the thermosetting compound and the curing agent, and the total content of the epoxy compound and the curing agent, are above the above-mentioned lower limit, the melt viscosity does not become too low, and the insulating film tends to be less likely to spread excessively to unintended areas during the curing process. Furthermore, when the total content of the thermosetting compound and the curing agent, and the total content of the epoxy compound and the curing agent are not more than the upper limit, holes or irregularities in the circuit board are easily filled, and the inorganic filler tends to be less likely to be present unevenly.

[0104] The content of the curing agent in the resin film, based on 100% by weight of all components excluding the inorganic filler, is preferably 30% by weight or more, more preferably 40% by weight or more, and preferably 70% by weight or less, more preferably 60% by weight or less. When the content of the curing agent is equal to or more than the lower limit and equal to or less than the upper limit, a better cured product can be obtained, and the dielectric loss tangent can be effectively reduced.

[0105] [Thermoplastic resin] The resin film preferably contains a thermoplastic resin. Examples of the thermoplastic resin include polyvinyl acetal resin and phenoxy resin. The thermoplastic resin may be used alone or in combination of two or more.

[0106] From the viewpoint of effectively lowering the dielectric loss tangent and effectively increasing the adhesion of metal wiring regardless of the curing environment, the thermoplastic resin is preferably a phenoxy resin. The use of a phenoxy resin prevents the resin film from becoming less able to fill holes or irregularities in the circuit board and prevents the inorganic filler from becoming non-uniform. Furthermore, the use of a phenoxy resin makes it possible to adjust the melt viscosity, thereby improving the dispersibility of the inorganic filler and making it less likely for the resin film to wet and spread to unintended areas during the curing process. The phenoxy resin is not particularly limited. Conventionally known phenoxy resins can be used as the phenoxy resin. Only one type of the phenoxy resin may be used, or two or more types may be used in combination.

[0107] Examples of the phenoxy resin include phenoxy resins having a skeleton such as a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol S skeleton, a biphenyl skeleton, a novolac skeleton, a naphthalene skeleton, and an imide skeleton.

[0108] Commercially available phenoxy resins include, for example, "YP50," "YP55," and "YP70" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., and "1256B40," "4250," "4256H40," "4275," "YX6954BH30," and "YX8100BH30" manufactured by Mitsubishi Chemical Corporation.

[0109] From the viewpoint of obtaining a resin film with even better storage stability, the weight average molecular weight of the thermoplastic resin is preferably 5,000 or more, more preferably 10,000 or more, and preferably 100,000 or less, more preferably 50,000 or less.

[0110] The weight average molecular weight of the thermoplastic resin is a weight average molecular weight measured by gel permeation chromatography (GPC) and calculated as polystyrene.

[0111] The contents of the thermoplastic resin and the phenoxy resin are not particularly limited. The content of the thermoplastic resin (when the thermoplastic resin is a phenoxy resin, the content of the phenoxy resin) is preferably 1% by weight or more, more preferably 5% by weight or more, preferably 30% by weight or less, and more preferably 15% by weight or less, based on 100% by weight of the components in the resin film excluding the inorganic filler. When the content of the thermoplastic resin is above the lower limit and below the upper limit, the resin film has good embedding properties in holes or irregularities in a circuit board. When the content of the thermoplastic resin is above the lower limit, the resin film is more easily formed, and a better insulating layer is obtained. When the content of the thermoplastic resin is below the upper limit, the thermal expansion coefficient of the insulating layer is further reduced. The surface roughness of the cured product is further reduced, and the adhesive strength between the insulating layer and the metal layer is further increased.

[0112] [Curing accelerator] The resin film preferably contains a curing accelerator. Use of the curing accelerator further accelerates the curing rate. Rapid curing of the resin film makes the crosslinked structure in the cured product uniform, reduces the number of unreacted functional groups, and ultimately increases the crosslink density. The curing accelerator is not particularly limited, and conventionally known curing accelerators can be used. The curing accelerators may be used alone or in combination of two or more.

[0113] Examples of the curing accelerator include imidazole compounds, phosphorus compounds, amine compounds, and organometallic compounds.

[0114] Examples of the imidazole compound include 2-undecylimidazole, 2-heptadecylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole trimellitate, and 1-cyanoethyl-2-phenylimidazolium trimethylolate. limeritate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-dihydroxymethylimidazole.

[0115] The phosphorus compound may, for example, be triphenylphosphine.

[0116] Examples of the amine compound include diethylamine, triethylamine, diethylenetetramine, triethylenetetramine, and 4,4-dimethylaminopyridine.

[0117] Examples of the organometallic compound include zinc naphthenate, cobalt naphthenate, tin octoate, cobalt octoate, bisacetylacetonate cobalt(II), and trisacetylacetonate cobalt(III).

[0118] The content of the curing accelerator is not particularly limited. The content of the curing accelerator is preferably 0.005% by weight or more, more preferably 0.01% by weight or more, and preferably 5% by weight or less, more preferably 3% by weight or less, based on 100% by weight of the components in the resin film excluding the inorganic filler. When the content of the curing accelerator is equal to or greater than the lower limit and equal to or less than the upper limit, the resin film is cured efficiently. When the content of the curing accelerator is within a more preferred range, the storage stability of the resin film is further improved, and a better cured product is obtained.

[0119] [solvent] The resin film contains or does not contain a solvent. The solvent may be used to obtain a slurry containing the inorganic filler. The solvent may be used alone or in combination of two or more.

[0120] Examples of the solvent include acetone, methanol, ethanol, butanol, 2-propanol, 2-methoxyethanol, 2-ethoxyethanol, 1-methoxy-2-propanol, 2-acetoxy-1-methoxypropane, toluene, xylene, methyl ethyl ketone, N,N-dimethylformamide, methyl isobutyl ketone, N-methyl-pyrrolidone, n-hexane, cyclohexane, cyclohexanone, and naphtha, which is a mixture.

[0121] Most of the solvent is removed when the resin film is formed using the resin composition. However, some solvent may remain in the resin film. The smaller the amount of solvent remaining, the better. Therefore, the boiling point of the solvent is preferably 200°C or lower, more preferably 180°C or lower. The content of the solvent in the resin film is not particularly limited. The content of the solvent can be changed as appropriate to the extent that the layer shape of the resin film can be maintained.

[0122] [Other ingredients] For the purpose of improving impact resistance, heat resistance, resin compatibility, workability, etc., the resin film may contain a leveling agent, a flame retardant, a coupling agent, a colorant, an antioxidant, an ultraviolet degradation inhibitor, an antifoaming agent, a thickener, a thixotropy-imparting agent, and a thermosetting resin other than the thermosetting compound.

[0123] Examples of the coupling agent include a silane coupling agent, a titanium coupling agent, and an aluminum coupling agent, etc. Examples of the silane coupling agent include vinyl silane, amino silane, imidazole silane, and epoxy silane.

[0124] Examples of the other thermosetting resins include polyphenylene ether resins, divinylbenzyl ether resins, polyarylate resins, diallyl phthalate resins, polyimide resins, benzoxazine resins, benzoxazole resins, bismaleimide resins, and acrylate resins.

[0125] Methods for obtaining the resin film include, for example, an extrusion molding method in which a resin film material is melt-kneaded using an extruder, extruded, and then molded into a film using a T-die or circular die, a casting molding method in which a resin film material containing a solvent is cast into a film, and other conventionally known film molding methods. Alternatively, a resin film can be obtained by laminating a resin film material on a substrate and heating and drying it. Since these methods can be used to reduce thickness, extrusion molding and casting molding are preferred. Films include sheets.

[0126] A resin film that is a B-stage film can be obtained by forming the resin film material into a film and drying it by heating at, for example, 50 to 150°C for 1 to 10 minutes to an extent that curing by heat does not proceed too much.

[0127] The film-like resin film obtained by the drying process described above is called a B-stage film. The B-stage film is in a semi-cured state. The semi-cured product is not completely cured, and curing can continue.

[0128] The resin film is preferably a B-stage film.

[0129] From the viewpoint of further improving the lamination properties of the resin film (if the resin film is a B-stage film, the B-stage film) and further suppressing uneven curing of the resin film, the thickness of the resin film is preferably 5 μm or more, more preferably 10 μm or more, and preferably 200 μm or less, more preferably 100 μm or less.

[0130] [others] A substrate may be laminated on a first surface of the resin film, and a protective film may be laminated on a second surface of the resin film opposite to the first surface.

[0131] From the viewpoint of improving the operability and protective properties of the resin film, it is preferable that a substrate be laminated on the first surface of the resin film, and it is preferable that a protective film be laminated on the second surface opposite to the first surface of the resin film.

[0132] Examples of the substrate include metal foil, polyester resin films such as polyethylene terephthalate film and polybutylene terephthalate film, olefin resin films such as polyethylene film and polypropylene film, and polyimide film. The surface of the substrate may be subjected to a release treatment as necessary. The substrate may be a metal foil or a resin film. The substrate is preferably a resin film. When a metal foil is used as the substrate, the metal foil is preferably a copper foil.

[0133] From the viewpoint of improving the operability of the resin film and improving the lamination properties of the resin film, the thickness of the substrate is preferably 5 μm or more, more preferably 10 μm or more, and preferably 75 μm or less, more preferably 60 μm or less.

[0134] Examples of materials for the protective film include polyolefins such as polypropylene and polyethylene, polyethylene terephthalate, etc. The material for the protective film is preferably polyolefin, and more preferably polypropylene.

[0135] From the viewpoint of further improving the protective properties of the resin film, the thickness of the protective film is preferably 5 μm or more, more preferably 10 μm or more, and preferably 75 μm or less, more preferably 60 μm or less.

[0136] In the roll packaging body according to the present invention, when the base material and the protective film are laminated on the resin film, the base material or the protective film contacts the outer surface of the winding core, and the base material or the protective film contacts the packaging film or the buffer film.

[0137] (packaging film) The packaging film is wound around the outer peripheral surface of the resin film roll. The packaging film extends onto the side surface of the resin film roll. If the packaging film does not extend onto the side surface of the resin film roll, cracks or breaks are likely to occur in the resin film on the side surface. The reason why cracks or breaks occur in the resin film on the side surface when the packaging film does not extend onto the side surface of the resin film roll is not clear, but it is thought that this is because the solvent remaining in the resin film evaporates from the side surface of the resin film roll, reducing the bending resistance and impact resistance of the resin film.

[0138] From the viewpoint of preventing misalignment of the packaging film and effectively preventing misalignment of the resin film, when the winding core has openings on both axial side portions, it is preferable that the packaging film be folded into the openings of the winding core.

[0139] From the viewpoint of preventing misalignment of the packaging film, it is preferable that the packaging film be wrapped around the surface of the roll of the resin film one or more times, and more preferably two or more times.

[0140] The material of the packaging film is not particularly limited, and examples thereof include polyethylene, polypropylene, and polyvinylidene chloride.

[0141] The thickness of the packaging film is preferably 5 μm or more, more preferably 10 μm or more, and is preferably 50 μm or less, more preferably 45 μm or less.

[0142] (buffer material) In the roll packaging according to the present invention, a cushioning material is preferably arranged on the outer peripheral surface of the end portion of the core.

[0143] By arranging the cushioning material on the outer peripheral surface of the end of the winding core, it is possible to effectively prevent the resin film from slipping during winding. In addition, by arranging the cushioning material on the outer peripheral surface of the end of the winding core, it is possible to increase the impact resistance of the roll packaging body and prevent damage to the winding core (especially the end of the winding core).

[0144] From the viewpoint of increasing the impact resistance of the roll packaging by absorbing external impacts, the material of the cushioning material is preferably polystyrene foam, polyurethane foam, polyethylene foam, or polypropylene foam.

[0145] When the winding core has openings on both axial sides and the packaging film is folded into the openings of the winding core, it is preferable that a buffer material be disposed on the outer peripheral surface of the end of the winding core via the packaging film, which can more effectively prevent the resin film from slipping when wound.

[0146] In order to further increase the impact resistance of the roll packaging and further prevent damage to the winding core (especially the end of the winding core), it is preferable that the cushioning material be arranged so as to cover the entire outer surface of the end of the winding core.

[0147] (holding member) The roll packaging according to the present invention preferably includes a holding member. The holding member is a member for holding the winding core, the resin film, and the packaging film in a suspended state. When the roll packaging according to the present invention includes the cushioning material, the winding core, the resin film, the packaging film, and the cushioning material may be held in a suspended state, or the winding core, the resin film, and the packaging film excluding the cushioning material may be held in a suspended state.

[0148] A roll package equipped with a retaining member can, for example, when the roll package is packed in a packaging material such as a cardboard box, prevent the core, resin film, and packaging film from coming into contact with the packaging material, thereby further preventing cracks or breaks in the resin film due to impacts during transportation.

[0149] The holding members are preferably attached to both axial sides of the winding core.

[0150] When the winding core has openings on both axial sides, it is preferable that the holding member has a holding member body and an insertion portion, and that the insertion portion of the holding member is inserted into the opening of the winding core.

[0151] From the viewpoint of increasing the stability of the attached holding member and preventing damage to the winding core (especially the end of the winding core), it is preferable that the tip of the insertion portion of the holding member inserted into the opening of the winding core is positioned more inward than the end of the resin film in the axial direction of the winding core.

[0152] From the viewpoint of holding the core, the resin film, and the packaging film in a suspended state, the holding member preferably has a certain degree of strength. Examples of materials for the holding member include polypropylene (PP) resin, acrylonitrile butadiene styrene (ABS) resin, and polyethylene (PE) resin.

[0153] The shape of the holding member is not particularly limited, but is preferably a rectangular parallelepiped shape from the viewpoint of holding the core, the resin film, and the packaging film in a suspended state.

[0154] The shape of the insertion portion can be changed to correspond to the shape of the opening at the end of the winding core.The outer shape of the holding member is preferably a polygon, such as a square.

[0155] (Buffer film) In the roll packaging according to the present invention, it is preferable that a buffer film is disposed between the roll of resin film and the packaging film.

[0156] The provision of the buffer film further prevents cracks or breaks in the resin film due to external impacts, and also prevents condensation from forming on the resin film during use when the roll package is stored at low temperatures (for example, 5°C or below).

[0157] The buffer film is preferably made of, for example, polyethylene foam.

[0158] The present invention will be specifically described below by way of examples and comparative examples, but the present invention is not limited to the following examples.

[0159] The following cores, packaging films, cushioning materials, holding members, cushioning films, substrates, and protective films were prepared.

[0160] (winding core) Winding cores A and B having the shapes shown in Figure 1 were prepared. Details of winding cores A and B are as follows.

[0161] Core A: Material: Acrylonitrile butadiene styrene (ABS) resin Axial dimension of the core: 56cm Core thickness: 0.4cm Inner diameter of spool: 7.6cm

[0162] Core B: Material: Acrylonitrile butadiene styrene (ABS) resin Axial dimension of the core: 51cm Core thickness: 0.4cm Inner diameter of spool: 7.6cm

[0163] (packaging film) Packaging film A (Sanyo Chemical "Stretch film", thickness 15 μm) Packaging film B (Saran Wrap (registered trademark) manufactured by Asahi Kasei Corporation, thickness 11 μm)

[0164] (buffer material) Polyethylene foam having the shape shown in Figure 1

[0165] (holding member) A plastic holding member having the shape shown in FIG.

[0166] (Buffer film) Cushioning film (Sekisui Plastics "Lightron S")

[0167] (base material) Polyethylene terephthalate (PET) film ("AL5" manufactured by Lintec Corporation, thickness 38 μm)

[0168] (protective film) Protective film (Oji F-Tex "Alphan MA-411", thickness 15 μm)

[0169] Example 1 Preparation of Resin Film Material: 107 parts by weight of a cyclohexanone slurry (70% solids by weight) of aminophenylsilane-treated silica ("SOC2" manufactured by Admatechs Co., Ltd.) was prepared. To this slurry, 11 parts by weight of biphenyl-type epoxy resin ("NC3000H" manufactured by Nippon Kayaku Co., Ltd.), 5 parts by weight of bisphenol A-type epoxy resin ("850S" manufactured by DIC Corporation), 7.9 parts by weight of cyclohexanone, and 7.7 parts by weight of methyl ethyl ketone were added. The mixture was stirred at 1200 rpm for 60 minutes to confirm that no undissolved material remained. Next, 11 parts by weight of a methyl ethyl ketone mixed solution (50% solids by weight) of aminotriazine-modified phenol novolac curing agent ("LA-1356" manufactured by DIC Corporation) and 3 parts by weight of phenol novolac curing agent ("H4" manufactured by Meiwa Kasei Co., Ltd.) were added. The mixture was stirred at 1200 rpm for 60 minutes to confirm that no undissolved material remained. Next, a mixed solution (solids content 30 wt%) of bisphenolacetophenone-based phenoxy resin ("YX6954" manufactured by Mitsubishi Chemical Corporation) in methyl ethyl ketone and cyclohexanone was prepared. 2.5 parts by weight of this mixed solution (solids content 30 wt%), 0.1 parts by weight of 2-ethyl-4-methylimidazole ("2E4MZ" manufactured by Shikoku Chemicals Corporation), and 0.01 parts by weight of a leveling agent ("LS-480" manufactured by Kusumoto Chemicals Co., Ltd.) were added. The mixture was stirred at 1200 rpm for 30 minutes to obtain a resin film material (varnish).

[0170] Preparation of laminated film consisting of substrate, resin film and protective film: The obtained resin film material was applied to a substrate using a die coater, and then dried for 3 minutes at an average temperature of 100°C to volatilize the solvent. In this way, a resin film (B-stage film) having a thickness of 40 µm and a residual solvent content of 1.0 wt% or more and 3.0 wt% or less was formed on the substrate.

[0171] Thereafter, a protective film was thermally laminated at 50°C onto the surface of the resin film opposite to the substrate side, to obtain a laminated film in which the resin film was a B-stage film.

[0172] Preparation of roll packaging: The resulting laminate film was slit to a width dimension of 51 cm. A 100 m length of this laminate film was wound around the outer periphery of winding core A, excluding the outer periphery of the end of winding core A, to produce a roll of resin film (laminate film). A buffer film was wrapped around the outer periphery of the resulting roll of resin film (laminate film), one turn of which was wrapped around the outer periphery of winding core A, and packaging film A was wrapped around the outer periphery of this film two turns of which was then folded into the opening of winding core A. Next, a buffer material was placed on the outer periphery of the end of winding core A so that the outer periphery of the end of winding core A was completely covered via packaging film A. Next, the insertion portion of the holding member was inserted into the opening of winding core A so that the tip of the insertion portion of the holding member was positioned inside the end of the resin film in the axial direction of winding core A, thereby attaching the holding members to both axial sides of winding core A, thereby producing a roll package. When the roll package was placed on a mounting surface inside a cardboard box, the winding core A, the resin film, and packaging film A were held in a suspended state.

[0173] Example 2 A roll package was obtained in the same manner as in Example 1, except that no cushioning material was placed when the roll package was produced.

[0174] ( reference Example 3) A roll packaging body was obtained in the same manner as in Example 1, except that no buffer film was placed when preparing the roll packaging body, and the insertion portion of the holding member was inserted into the opening of the winding core so that the tip of the insertion portion of the holding member was positioned outside the end of the resin film in the axial direction of the winding core A.

[0175] (Comparative Example 1) In the same manner as in Example 1, a laminated film was obtained.

[0176] Preparation of roll packaging: The resulting laminate film was slit to a width dimension of 51 cm. A 100 m length of this laminate film was wound around the outer periphery of the winding core A, excluding the outer periphery of the end of the winding core A, to produce a roll of resin film (laminate film). Packaging film B was wrapped around the outside of the resulting roll of resin film (laminate film) twice, ensuring that packaging film B did not reach the side of the roll. Next, the insertion portion of the holding member was inserted into the opening of the winding core A so that the tip of the insertion portion of the holding member was positioned outside the end of the resin film in the axial direction of the winding core A, thereby attaching the holding members to both axial sides of the winding core A, thereby producing a roll package. When the roll package was placed on a mounting surface inside a cardboard box, the winding core A, the resin film, and packaging film B were held in a suspended state.

[0177] (Comparative Example 2) In the same manner as in Example 1, a laminated film was obtained.

[0178] Preparation of roll packaging: The resulting laminate film was slit to a width of 51 cm. A 100 m length of this laminate film was wound around the outer periphery of winding core B to produce a roll of resin film (laminate film). Because the width of the resin film (laminate film) and the axial dimension of winding core B were the same length, in Comparative Example 2, the resin film (laminate film) was wound around the entire outer periphery of the winding core. Packaging film B was wrapped around the outside of the resulting roll of resin film (laminate film) twice, ensuring that the packaging film B did not reach the side surfaces of the roll. Next, the inserting portion of the holding member was inserted into the opening of winding core B so that the tip of the inserting portion was positioned inside the end of the resin film in the axial direction of winding core B, thereby attaching the holding members to both axial sides of winding core B, thereby producing a roll package. When the roll package was placed on the mounting surface inside a cardboard box, winding core B, the resin film, and packaging film B were held in a suspended state.

[0179] (Comparative Example 3) A laminate film was obtained in the same manner as in Example 1. The obtained laminate film was slit to a width dimension of 51 cm. A 100 m roll of this laminate film was wound around the outer periphery of winding core B to produce a roll of resin film (laminate film). Because the width dimension of the resin film (laminate film) and the axial dimension of winding core B were the same length, in Comparative Example 3, the resin film (laminate film) was wound over the entire outer periphery of the winding core. Packaging film A was wound two times around the outer periphery of the obtained roll of resin film (laminate film), and the packaging film A was folded into the opening of winding core B. Next, the insertion portion of the holding member was inserted into the opening of winding core B so that the tip of the insertion portion of the holding member was positioned inside the end of the resin film in the axial direction of winding core B, thereby attaching the holding members to both axial sides of the winding core, thereby producing a roll package. When the roll package was placed on a mounting surface inside a cardboard box, winding core B, the resin film, and packaging film A were held in a suspended state.

[0180] (evaluation) (1) Cracks or breaks in the resin film Example 1 2, and reference examples 3. The roll package obtained in Comparative Example 1 was packed in a cardboard box with inner dimensions of 59 cm x 17 cm x 17 cm. The roll packages obtained in Comparative Examples 2 and 3 were packed in a cardboard box with inner dimensions of 54.5 cm x 17 cm x 17 cm. The roll packages packed in the cardboard box were transported for two days while maintaining a temperature of 5°C or less. After transportation, the roll packages were left to stand at room temperature for two hours or more, and then the resin film was visually observed to evaluate for cracks or breaks in the resin film.

[0181] [Criteria for determining cracks or breaks in resin film] ○: No cracks or breaks in the resin film ×: Cracks or breaks in the resin film

[0182] (2) Void Evaluation board construction: A 100mm x 100mm laminate was prepared, consisting of a 400µm thick glass epoxy substrate with a 25µm thick copper foil laminated thereon. The copper foil was etched to create 900 circular recesses, 30 in the vertical direction and 30 in the horizontal direction, each 100µm in diameter and 25µm deep, in an area 30mm long x 30mm wide on the laminate. The distance between the centers of adjacent circles was 900µm. In this way, an evaluation substrate was obtained.

[0183] Preparation of laminate of evaluation substrate and resin film: Example 1 2, and reference examples The roll package obtained in Comparative Example 1 was packed in a cardboard box with internal dimensions of 59 cm x 17 cm x 17 cm. The roll packages obtained in Comparative Examples 2 and 3 were packed in a cardboard box with internal dimensions of 54.5 cm x 17 cm x 17 cm. The roll packages packed in the cardboard box were transported for two days while maintaining a temperature of 5°C or less. After transportation, the roll packages were left to stand at room temperature for at least two hours, and then the laminate film was cut out from the roll package. The protective film of the laminate film was peeled off, and the exposed resin film surface was heated and pressed using a batch-type vacuum laminator MVLP-500IIA ​​(manufactured by Meiki Seisakusho Co., Ltd.) at a lamination pressure of 0.4 MPa and a lamination temperature of 90°C for 20 seconds, followed by heating and pressing at a press pressure of 0.8 MPa and a press temperature of 90°C for 20 seconds. Next, the substrate of the laminate film was peeled off, and a laminate of the evaluation substrate and resin film was obtained.

[0184] Void Observations: The obtained laminate was observed under an optical microscope in all recesses of the evaluation substrate to evaluate voids.

[0185] [Void Criteria] XX: No voids were observed in the recesses (the percentage of recesses with voids was 0%) ○: The percentage of recesses where voids were observed was less than 5% ×: The percentage of recesses where voids were observed was 5% or more.

[0186] (3) Winding slippage Example 1 2, and reference examples3. The roll package obtained in Comparative Example 1 was packed in a cardboard box with inner dimensions of 59 cm x 17 cm x 17 cm. The roll packages obtained in Comparative Examples 2 and 3 were packed in a cardboard box with inner dimensions of 54.5 cm x 17 cm x 17 cm. The roll packages packed in the cardboard boxes were stored in a refrigerator at a temperature of 5°C or less for one week. After storage, the cardboard box containing the roll packages was dropped from a height of 1 m from the ground. After the drop, the roll packages were visually observed and the winding misalignment of the resin film was evaluated.

[0187] [Criteria for determining winding misalignment] ○: No winding slippage △: There is a slight misalignment in the winding that does not cause any practical problems ×: There is a winding misalignment that is problematic in practical use.

[0188] The configuration of the roll package and the results are shown in Table 1 below.

[0189] [Table 1] [Explanation of symbols]

[0190] 1, 11A, 11B...Roll packaging 2...Resin film (roll of resin film) 3...spool core 3a…Aperture 4. Packaging film 5, 5A…Buffer material 5a...First buffer member 5b...Second buffer member 6...Retaining member 6a...Holding member body 6b...insertion section 7...Buffer film

Claims

1. The film comprises a core, a resin film (excluding photosensitive resin films), and a packaging film; The axial dimension of the winding core is larger than the width dimension of the resin film, the resin film is wound in a roll shape on the outer peripheral surface of the winding core in a region excluding the outer peripheral surface of the end portion of the winding core, the packaging film is wound on the outer peripheral surface of the roll of resin film, the packaging film extends onto a side surface of the roll of the resin film, a holding member for holding the core, the resin film, and the packaging film in a suspended state; The holding members are attached to both axial sides of the winding core, The winding core has openings on both axially opposite sides, the holding member has a holding member body and an insertion portion, The insertion portion of the holding member is inserted into the opening of the winding core, In the axial direction of the winding core, a tip of the insertion portion of the holding member inserted into the opening of the winding core is located inside an end of the resin film, The resin film contains an inorganic filler in an amount of 30% by weight or more, The roll packaging body, wherein the resin film is a resin film for printed wiring boards.

2. The roll packaging body according to claim 1 , wherein a cushioning material is disposed on the outer peripheral surface of the end portion of the winding core.

3. A roll packaging body as described in claim 1 or 2, wherein the packaging film is folded into the opening of the winding core.

4. The roll package according to claim 3 , wherein a cushioning material is disposed on the outer peripheral surface of the end portion of the winding core via the packaging film.

5. The roll packaging body according to any one of claims 1 to 4, wherein a buffer film is disposed between the roll of resin film and the packaging film.

6. The roll packaging according to any one of claims 1 to 5, wherein the resin film contains 60% by weight or more of the inorganic filler.

7. The roll packaging according to any one of claims 1 to 6, wherein the resin film contains a thermosetting compound and a curing agent.

8. The roll packaging according to claim 7, wherein the thermosetting compound is an epoxy resin.

9. The roll packaging according to any one of claims 1 to 8, wherein the resin film is a B-stage film.

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