Temperature compensated oscillator manufacturing equipment

Abstract

To provide a manufacturing apparatus of a temperature compensation type oscillator capable of further reducing a manufacturing time while having a small size.SOLUTION: A manufacturing apparatus 10 of a TCXO 100 comprises: a plurality of measurement units 12 that measure a frequency of the TCXO 100 in a state where a compensation is turned off; a writing unit 14 that writes a compensation value to the TCXO 100; a plurality of confirmation units 16 that measure the frequency in a state where the compensation is turned on; and a controller 20. In the measurement unit 12 and the confirmation unit 16, the TCXO 100 and a probe 60 are heated or cooled by Peltiers 46 and 70, the plurality of measurement units 12, the writing unit 14, and the plurality of confirmation units 16 are arranged in a U-shape.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This specification discloses an apparatus for manufacturing a temperature compensated oscillator in which frequency fluctuations due to temperature changes are compensated for. [Background technology]

[0002] Conventionally, oscillators using a resonator (such as a quartz crystal resonator or a resonator with a MEMS structure) have been widely known. Here, the oscillation frequency of the resonator fluctuates depending on the temperature of the environment in which the resonator is placed. Furthermore, the frequency fluctuation characteristics of the resonator relative to temperature (hereinafter referred to as "temperature characteristics") differ depending on the solid state of the resonator. Therefore, temperature-compensated oscillators that can compensate for the temperature characteristics of the resonator and output a high-precision reference clock have been proposed.

[0003] When manufacturing a temperature-compensated oscillator, the temperature characteristics of the temperature-compensated oscillator are measured, and a compensation value corresponding to the measurement results is written into the temperature-compensated oscillator. Patent Document 1 discloses a technique for adjusting such compensation values. In the technique described in Patent Document 1, the temperature-compensated oscillator is placed in a temperature chamber, the frequency of the temperature-compensated oscillator is measured while changing the temperature of the temperature chamber, compensation value data is created based on the measured frequency, and the compensation value data is stored in the temperature-compensated oscillator. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-076774 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the case of the technology described in Patent Document 1, frequencies corresponding to multiple temperatures are measured using a single temperature bath. In this case, it takes time to change the temperature of the temperature bath, which lengthens the time required to manufacture a temperature-compensated oscillator.

[0006] Therefore, it is conceivable to provide multiple temperature baths set to different target temperatures. In this case, the temperature of the temperature-compensated oscillator can be changed by sequentially placing the temperature-compensated oscillator in the multiple temperature baths. With such a configuration, the time required for heating or cooling can be significantly reduced, thereby shortening the manufacturing time for the temperature-compensated oscillator. However, the temperature baths are usually large, equipped with heaters, heat pumps, refrigeration machines, etc. If multiple such temperature baths are provided, the overall manufacturing equipment becomes larger.

[0007] Therefore, this specification discloses a manufacturing apparatus for a temperature compensated oscillator that is compact and can further reduce the manufacturing time. [Means for solving the problem]

[0008] The manufacturing apparatus for a temperature compensated oscillator disclosed in this specification is a manufacturing apparatus for a temperature compensated oscillator in which frequency fluctuations due to temperature changes are compensated, and includes a plurality of measurement units that heat or cool the oscillator to a target temperature with the compensation turned off and measure the frequency of the oscillator in that state, the plurality of measurement units having different target temperatures; a writing unit that writes a compensation value used in the compensation into the oscillator; a plurality of confirmation units that heat or cool the oscillator to a target temperature with the compensation turned on and measure the frequency of the oscillator in that state, the plurality of confirmation units having different target temperatures; a transport mechanism that transports a carrier holding the oscillator along a transport path; and a temperature compensation unit that measures the temperature and frequency measured by the plurality of measurement units. and a controller that instructs the writing unit to write the compensation value determined by the frequency measured by the plurality of confirmation units and judges whether the written compensation value is appropriate based on the frequency measured by the plurality of confirmation units, wherein the measurement unit and the confirmation unit each have a carrier-side Peltier element that heats or cools the oscillator via the carrier, a probe that comes into contact with the oscillator to measure the frequency of the oscillator, and a probe-side Peltier element that heats or cools the probe, the transport path is approximately U-shaped and includes an outbound path, a turning portion, and a return path, the plurality of measurement units are arranged on the outbound path of the transport path, the writing unit is arranged at the turning portion of the transport path, and the plurality of confirmation units are arranged on the return path of the transport path.

[0009] In this case, the number of the measurement units may be the same as the number of the confirmation units, and the combination of multiple target temperatures for the multiple measurement units may be the same as the combination of multiple target temperatures for the multiple confirmation units.

[0010] Furthermore, the plurality of measurement units may be arranged so that the target temperature changes in a predetermined direction as the temperature moves toward the downstream side of the outbound path, and the plurality of confirmation units may be arranged so that the target temperature changes in the predetermined direction as the temperature moves toward the downstream side of the return path.

[0011] The carrier may have a plurality of accommodating recesses formed on its upper surface, each accommodating one of the oscillators, and the probe may include a probe body, a probe needle protruding from the bottom surface of the probe body and contacting the oscillator accommodated in the accommodating recess, a measurement circuit for measuring the frequency of the oscillator, a probe-side Peltier element for cooling or heating the probe body and the probe needle, and a thermal insulating element made of a thermal insulating material and arranged between the measurement circuit and the probe body to insulate the measurement circuit.

[0012] In addition, the carrier may have a suction hole communicating with the storage recess, and both the measurement unit and the confirmation unit may be formed on the mounting surface on which the carrier is placed, and may include a suction groove communicating with the suction hole, and an aspirator that sucks the storage recess through the suction groove and the suction hole.

[0013] Furthermore, both the measurement unit and the confirmation unit may include an inspection space for temporarily accommodating the carrier, partition plates provided at the upstream end and downstream end of the inspection space in the conveying direction, respectively, for opening and closing the inspection space, and a dry air source for supplying dry air to the inspection space, and the controller may close the inspection space with the partition plate during the period in which the frequency is measured, and move the partition plate to an open position to open the inspection space during the period in which the carrier is being conveyed. [Effects of the Invention]

[0014] According to the temperature-compensated oscillator manufacturing apparatus disclosed in this specification, both the oscillator and the probe are cooled or heated by a Peltier element. Because a Peltier element is significantly smaller than a temperature bath, the overall apparatus can be made smaller. Furthermore, because a measurement unit and a confirmation unit are provided for each target temperature, the time required for heating or cooling can be reduced. As a result, according to the temperature-compensated oscillator manufacturing apparatus disclosed in this specification, it is possible to both miniaturize the apparatus and shorten the manufacturing time. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a schematic plan view of a TCXO manufacturing apparatus. [Figure 2] 2 is a cross-sectional view taken along the line AA in FIG. 1. [Figure 3] FIG. 1 is a block diagram showing the configuration of a TCXO. [Figure 4] FIG. 1 is a diagram illustrating an example of temperature characteristics of a quartz crystal resonator. [Figure 5] FIG. 1 is a perspective view of a TCXO and a carrier. [Figure 6] FIG. 10 is a schematic plan view of another example of a manufacturing apparatus. [Figure 7] FIG. 10 is a schematic plan view of another example of a manufacturing apparatus. [Figure 8] FIG. 10 is a schematic plan view of a manufacturing apparatus according to a comparative example. DETAILED DESCRIPTION OF THE INVENTION

[0016] A manufacturing apparatus 10 for a temperature compensated crystal oscillator 100 (hereinafter referred to as "TCXO 100") will be described below with reference to the drawings. Fig. 1 is a schematic plan view of the manufacturing apparatus 10. Fig. 2 is a cross-sectional view taken along line AA in Fig. 1.

[0017] First, before describing the manufacturing apparatus 10, the TCXO 100 will be described. FIG. 3 is a block diagram showing the configuration of the TCXO 100. The TCXO 100 is a crystal oscillator that compensates for frequency fluctuations due to temperature changes. Specifically, the TCXO 100 includes a voltage-controlled crystal oscillator 106 (hereinafter referred to as "VCXO 106"). The VCXO 106 includes a crystal unit 102 made of quartz, electrodes 104 that apply voltage to the crystal unit 102, an oscillation circuit (not shown), and a variable capacitance element (not shown). The oscillation circuit amplifies the output signal of the crystal unit 102 and feeds it back to the crystal unit 102, causing the crystal unit 102 to oscillate and output an oscillation signal based on the oscillation of the crystal unit 102. The variable capacitance element serves as a load capacitance for the oscillation circuit. By providing this load capacitance, the frequency of the output signal from the VCXO 106 changes depending on the output voltage from a compensation signal generating circuit 110 (described later).

[0018] The compensation signal generating circuit 110 outputs a voltage signal to compensate for frequency fluctuations due to temperature changes. Specifically, the crystal unit 102 has a temperature characteristic in which its output frequency varies as a cubic function depending on the temperature. Furthermore, the temperature characteristics of each crystal unit 102 vary from one crystal unit 102 to another. FIG. 4 shows an example of the temperature characteristics of a crystal unit 102. In FIG. 4, the solid line, bold line, and dashed line respectively represent the temperature characteristics of a randomly selected first, second, and third crystal unit 102. As shown in FIG. 4, the frequency deviation of the crystal unit 102 varies as a cubic function with respect to temperature. Furthermore, the specific shape of the temperature characteristics varies from crystal unit 102 to another.

[0019] The compensation signal generating circuit 110 outputs a voltage signal, i.e., a compensation signal, that compensates for frequency fluctuations caused by such temperature changes. Outputting an appropriate compensation signal suppresses fluctuations in the output frequency from the TCXO 100. As mentioned above, the temperature characteristics of each crystal unit 102 vary. Therefore, the appropriate compensation value that can suppress frequency fluctuations differs for each crystal unit 102. The memory 112 stores the correspondence between the compensation value and temperature appropriate for the crystal unit 102. The temperature sensor 108 detects the temperature of the TCXO 100. The compensation signal generating circuit 110 compares the temperature detected by the temperature sensor 108 with the data stored in the memory 24 to identify an appropriate compensation value and outputs a compensation signal corresponding to the identified compensation value.

[0020] The TCXO 100 is also provided with a plurality of terminals 120a to 120e. The first terminal 120a is a terminal for applying a voltage to the VCXO 106. The second terminal 120b is a terminal for extracting an output signal from the TCXO 100. The third terminal 120c is a terminal for applying a drive voltage to the compensation signal generating circuit 110. The fourth terminal 120d is a terminal for applying a drive voltage to the temperature sensor 108. The fifth terminal 120e is a terminal used for accessing the memory 112. In the following description, when the plurality of terminals 120a to 120e are not to be distinguished from one another, they will be referred to as "terminals 120" with the alphabetical subscripts omitted. The terminals 120 are formed on one surface of the TCXO 100, as shown in FIG. 5.

[0021] To manufacture such TCXOs 100, it is necessary to measure the temperature characteristics of the crystal unit 102 mounted in each TCXO 100 and record compensation values ​​appropriate to those temperature characteristics in memory 112. Furthermore, prior to shipping, the temperature characteristics of the TCXOs 100 with recorded compensation values ​​must be measured to confirm that frequency fluctuations are within an allowable value and that the recorded compensation values ​​are appropriate. The manufacturing apparatus 10 shown in Figures 1 and 2 measures the temperature characteristics, writes the compensation values, and confirms the compensation values.

[0022] The manufacturing apparatus 10 has a plurality of measurement units 12Tn (n=1, 2, . . . , 7), a writing unit 14, a plurality of confirmation units 16Tn, a transport mechanism 18, and a controller 20. In the following, the reference numerals of the measurement units and confirmation units will be omitted as appropriate and will be referred to as "measurement unit 12" and "confirmation unit 16."

[0023] The measurement unit 12 is a unit that measures the frequency of the TCXO 100 with compensation by the compensation signal generating circuit 110 turned off. A target temperature Tn is set for each measurement unit 12. The measurement unit 12 measures the frequency while the TCXO 100 is heated or cooled to the target temperature Tn. The detailed configuration of the measurement unit 12 will be described later.

[0024] Here, "compensation off" refers to any state that is not specifically limited, as long as the frequency of the output signal from VCXO 106 is not modified in response to temperature. Therefore, for example, compensation may be turned off by not applying a drive voltage to compensation signal generating circuit 110, or by outputting a meaningless signal as a compensation value from compensation signal generating circuit 110 (i.e., a signal that is always constant regardless of temperature). Furthermore, compensation may be turned off by providing a switch between compensation signal generating circuit 110 and VCXO 106 and turning off the switch.

[0025] The ranges of the plurality of target temperatures Tn are determined according to the specifications of TCXO100, specifically, according to the required operating temperature range. For example, if the operating temperature range of TCXO100 is specified as -45°C to 85°C, the plurality of target temperatures Tn are set within the range of -45°C to 85°C. That is, in this case, the target temperature T1 = -45°C and the target temperature T7 = 85°C. And each target temperature Tn is set so as to satisfy T1 < T2 < T3 < T4 < T5 and T6 < T7. In FIG. 1, the number of measurement units 12 is set to 7, but the number of measurement units 12 may be changed as appropriate. The frequencies measured by the measurement units 12 are output to the controller 20 together with the corresponding target temperatures Tn.

[0026] The writing unit 14 is a unit that writes a compensation value to the TCXO100 that has passed through the plurality of measurement units 12. The compensation value to be written to the TCXO100 is instructed by the controller 20.

[0027] The confirmation unit 16 is a unit that measures the frequency of the TCXO100 with the compensation by the compensation signal generation circuit 110 turned on. The target temperature Tn is also set for each confirmation unit 16. Each confirmation unit 16 measures the frequency with the TCXO100 heated or cooled to the target temperature Tn. The combinations of the plurality of target temperatures Tn for the plurality of confirmation units 16 are the same as the combinations of the plurality of target temperatures Tn for the plurality of measurement units 12. Therefore, the target temperature T1 set for the first confirmation unit 16T1 is the same as the target temperature T1 set for the first measurement unit 12T1. The frequencies measured by the confirmation units 16 are output to the controller 20 together with the corresponding target temperatures Tn.

[0028] The transport mechanism 18 transports the TCXO 100 along a predetermined transport path 26. As will be described in detail later, the TCXO 100 is transported housed in a carrier 80 shown in FIG. 5. The configuration of the transport mechanism 18 is not particularly limited as long as it can transport the TCXO 100 together with the carrier 80. Therefore, the transport mechanism 18 may include, for example, a conveyor, rollers, etc.

[0029] As shown by the bold arrows in FIG. 1, the transport path 26 is generally U-shaped and includes an outgoing path 26o, a returning path 26r parallel to the outgoing path 26o, and a turning portion 26t that turns back from the outgoing path 26o to the returning path 26r. The measurement units 12 are arranged in a line on the outgoing path 26o. The verification units 16 are also arranged in a line on the returning path 26r. The writing unit 14 is located at the turning portion 26t. The TCXO 100 passes through the measurement units 12 in order, is then sent to the writing unit 14, and then passes through the verification units 16 in order.

[0030] Next, the specific configurations of the measurement unit 12 and the confirmation unit 16 will be described. The confirmation unit 16 has the same configuration as the measurement unit 12, except that it turns on the compensation of the TCXO 100 when measuring the frequency. Therefore, the configuration of the measurement unit 12 will be described below with reference to Figures 2 and 5. Note that Figure 5 shows a portion of the carrier 80 cut away.

[0031] The TCXO 100 is placed in the manufacturing apparatus 10 while housed in a carrier 80 shown in FIG. 5. The carrier 80 is a block-shaped member made of a metal with high thermal conductivity (e.g., aluminum or copper). The upper surface of the carrier 80 is formed with a plurality of (eight in the illustrated example) housing recesses 82 for housing the TCXO 100. Each housing recess 82 is large enough to house almost the entire TCXO 100. Furthermore, a suction hole 84 is formed in the bottom surface of each housing recess 82, penetrating in the thickness direction. Note that the shape and number of the housing recesses 82 in FIG. 5 are merely an example. The shape and number of the housing recesses 82 may be changed as appropriate. The TCXO 100 is fitted into the housing recess 82 with its terminals 120 facing upward and exposed to the outside.

[0032] As shown in FIG. 2, the measurement unit 12 includes a base 30 on which the carrier 80 is placed and a probe 60 that measures the frequency of the TCXO 100. A stage plate 32 is partially embedded in the base 30. The stage plate 32 is a plate made of a metal with high thermal conductivity. When measuring the frequency, the TCXO 100 is positioned on this stage plate 32. A suction groove 34 that communicates with the suction hole 84 of the carrier 80 is formed on the surface of the stage plate 32. The suction device 50 sucks the TCXO 100 through the suction groove 34 and the suction hole 84. As a result, the TCXO 100 is attracted to the bottom surface of the installation recess 82, effectively preventing the TCXO 100 from unintentionally floating up.

[0033] An inspection space 38 is formed above the stage plate 32. The inspection space 38 is a space surrounded by the stage plate 32, the partition plate 36, and the cover member 40. The cover member 40 is a plate material that covers the upper surface of the inspection space 38. The cover member 40 has a plurality of inspection holes 42 formed therein for passing probe needles 64 (described later). When the carrier 80 is positioned on the stage plate 32, each inspection hole 42 is located directly above the TCXO 100 held by the carrier 80. The inspection holes 42 are opened and closed by a slidable shutter 44 on the upper side of the cover member 40.

[0034] The partition plates 36 are disposed at the upstream and downstream ends of the testing space 38 in the conveying direction, and function as doors that open and close the testing space 38. In the example shown in FIG. 2, the partition plate 36 opens and closes the testing space 38 by moving up and down. When the partition plate 36 moves up, the testing space 38 is opened, allowing the carrier 80 to move into and out of the testing space 38. When the partition plate 36 moves down, the testing space 38 is closed.

[0035] Dry air is supplied to the testing space 38 from a dry air source 52. The dry air source 52 includes, for example, a dryer that dries the air and a pump that sends the dried air into the testing chamber. By filling the testing space 38 with dry air in this manner, condensation can be effectively prevented even when the carrier 80 is cooled.

[0036] A carrier-side Peltier element 46 is disposed below the stage plate 32. The carrier-side Peltier element 46 has a Peltier element. As is well known, a Peltier element has a pair of heat sinks (not shown). When a voltage is applied, one heat sink (hereinafter referred to as the "heat sink") generates heat and the other heat sink (hereinafter referred to as the "heat absorption plate") absorbs heat. When a voltage is applied, the carrier-side Peltier element 46 heats or cools the carrier 80 and TCXO 100 on the stage plate 32. Whether heating or cooling is performed is selected depending on the target temperature Tn. When the target temperature Tn is higher than room temperature, the carrier-side Peltier element 46 is disposed in a position where the heat sink contacts the stage plate 32 so that the carrier 80 can be heated. When the target temperature Tn is lower than room temperature, the carrier-side Peltier element 46 is disposed in a position where the heat absorption plate contacts the stage plate 32 so that the carrier 80 can be cooled. By providing the carrier-side Peltier element 46 in this manner, the carrier 80 and the TCXO 100 can be cooled or heated efficiently.

[0037] A carrier-side chiller 48 is also disposed below the carrier-side Peltier element 46. The carrier-side chiller 48 is provided to reduce the temperature difference between the heat-generating plate and heat-absorbing plate of the carrier-side Peltier element 46. Therefore, when the carrier-side Peltier element 46 heats the carrier 80, the carrier-side chiller 48 heats the heat-absorbing plate of the carrier-side Peltier element 46. Also, when the carrier-side Peltier element 46 cools the carrier 80, the carrier-side chiller 48 cools the heat-generating plate of the carrier-side Peltier element 46. The carrier-side chiller 48 has a flow path (not shown) through which a refrigerant for heating or cooling the carrier-side Peltier element 46 flows. This flow path may be independent for each measurement unit 12, or may be connected among multiple measurement units 12. In either case, providing the carrier-side chiller 48 can reduce the temperature difference between the heat-generating plate and heat-absorbing plate of the carrier-side Peltier element 46, thereby reducing the load on the carrier-side Peltier element 46.

[0038] As is clear from the above explanation, the carrier 80 and the stage plate 32 function as heat transfer members that transfer heat from the carrier-side Peltier element 46 to the TCXO 100, or from the TCXO 100 to the carrier-side Peltier element 46. Members other than this heat transfer member (e.g., the cover member 40, the partition plate 36, the base 30, etc.) may be made of a material with low thermal conductivity, such as resin. With such a configuration, the efficiency of cooling or heating by the carrier-side Peltier element 46 can be further improved.

[0039] A probe 60 is disposed on the upper side of the cover member 40. The probe 60 measures the frequency of the TCXO 100. The probe 60 can access any TCXO 100 by moving in the horizontal and vertical directions.

[0040] The probe 60 has a probe body 62, a probe needle 64, a heat insulating element 68, a measurement circuit 66, a probe-side Peltier element 70, and a probe-side chiller 72. The probe body 62 is made of a metal with high thermal conductivity. The probe needle 64 is a needle-shaped member that protrudes downward from the bottom surface of the probe body 62. The probe needle 64 is made of a metal with high thermal conductivity. The probe needle 64 is in mechanical contact with a terminal 120 of the TCXO 100, thereby being electrically connected to the terminal 120.

[0041] More specifically, the probe 60 is provided with four types of probe needles 64 (only two types are shown in FIG. 2 ) that contact and are electrically connected to the first terminal 120a, the second terminal 120b, the third terminal 120c, and the fourth terminal 120d, respectively. The frequency of the TCXO 100 can be measured by applying a voltage to the TCXO 100 or receiving a signal from the TCXO 100 via these four types of probe needles 64. Note that, because access to the memory 112 is not required when measuring the frequency, no probe needle 64 is provided that contacts the fifth terminal 120e.

[0042] A probe-side Peltier element 70 is attached to the side of the probe body 62. The probe-side Peltier element 70 heats or cools the probe body 62 and the probe needle 64. Whether heating or cooling is performed is selected depending on the target temperature Tn. Furthermore, a probe-side chiller 72 is attached behind the probe-side Peltier element 70. This reduces the temperature difference between the heat-generating and heat-absorbing plates of the probe-side Peltier element 70. Note that if there is a large difference between the target temperature Tn and room temperature, multiple Peltier elements may be stacked, as in the probe 60 shown on the left side of Figure 2.

[0043] The measurement circuit 66 is a circuit that measures the frequency of the TCXO 100 electrically connected to the probe needle 64. The measurement circuit 66, for example, supplies a drive voltage to the probe needle 64 and performs frequency analysis on the signal acquired via the probe needle 64.

[0044] The heat insulating element 68 is made of a heat insulating material (for example, foam) and is a member disposed between the measurement circuit 66 and the probe body 62. The heat insulating element 68 insulates the measurement circuit 66 from the probe-side Peltier element 70. This prevents the measurement circuit 66 from becoming excessively hot or cold.

[0045] Next, a description will be given of the flow of manufacturing the TCXO 100 using the manufacturing apparatus 10. Prior to being loaded into the manufacturing apparatus 10, the TCXO 100 is accommodated in the accommodation recess 82 of the carrier 80. The inspection space 38 is filled with dry air by the dry air source 52. Furthermore, the Peltier elements 46 and 70 and the chillers 48 and 72 are driven, and the stage plate 32 and the probe 60 are cooled or heated to the target temperature Tn.

[0046] The carrier 80 loaded into the manufacturing apparatus 10 is transported by the transport mechanism 18 to the stage plate 32 of the most upstream measurement unit 12T1. When the carrier 80 reaches the stage plate 32, the partition plate 36 descends, closing the testing space 38. The suction device 50 is also activated, and the TCXO 100 is sucked onto the bottom surface of the storage recess 82.

[0047] Once the TCXO 100 and probe 60 have cooled to target temperature T1 = -45°C, frequency measurement begins. Specifically, first, the shutter 44 is opened. In this state, the probe 60 moves directly above the TCXO 100 being measured. Next, the probe 60 descends until the probe needle 64 comes into contact with the terminal 120 of the TCXO 100 being measured. At this time, the probe needle 64 has been cooled to target temperature T1 by the probe-side Peltier element 70. Therefore, even when the probe needle 64 comes into contact with the TCXO 100, there is almost no heat transfer between the probe needle 64 and the TCXO 100, and the TCXO 100 can be maintained at target temperature T1.

[0048] When the probe needle 64 contacts the terminal 120, the measurement circuit 66 of the probe 60 applies an appropriate voltage and signal to the TCXO 100, driving it. At this time, compensation by the compensation signal generation circuit 110 is turned off. The measurement circuit 66 transmits the frequency of the signal output from the TCXO 100, along with the target temperature T1, to the controller 20. The controller 20 temporarily stores the received frequency and target temperature T1 in the memory 24.

[0049] Once the frequency of one TCXO 100 has been measured, the probe 60 moves directly above the next TCXO 100 and measures the frequency of the next TCXO 100. By repeating this operation, the probe 60 measures the frequencies of all of the multiple TCXOs 100 held by the carrier 80.

[0050] Once the frequencies of all the TCXOs 100 have been measured, the carrier 80 is transported to the next measurement unit 12T2. Specifically, the probe 60 retracts upward, and the shutter 44 closes. The suction device 50 stops driving, and the suction of the TCXOs 100 is released. Furthermore, the partition plate 36 rises, and the inspection space 38 is opened. In this state, the transport mechanism 18 transports the carrier 80 to the next measurement unit 12T2.

[0051] The next measurement unit 12T2 also uses a similar procedure to measure the frequency of the TCXO 100. When such frequency measurements have been completed for all measurement units 12Tn, the transport mechanism 18 transports the carrier 80 to the writing unit 14.

[0052] The writing unit 14 writes the compensation values ​​into the memory 112 of the TCXO 100. Specifically, the controller 20 identifies compensation values ​​appropriate for each TCXO 100 based on a combination of the target temperature Tn and frequency measured by the multiple measuring units 12T1 to 12T7. The controller 20 then instructs the writing unit 14 to write the identified compensation values. The writing unit 14 accesses the memory 24 via the fifth terminal 120e of the TCXO 100 and writes the compensation values ​​into the memory 24.

[0053] Once the compensation values ​​have been written to all TCXOs 100, the transport mechanism 18 transports the carrier 80 to the first confirmation unit 16T1. The confirmation unit 16 measures the frequency of the TCXO 100 held by the carrier 80. This procedure is almost identical to the procedure for measuring frequency by the measurement unit 12. However, the confirmation unit 16 measures the frequency with compensation by the compensation signal generating circuit 110 turned on. For example, the confirmation unit 16T1 drives the TCXO 100 while applying a drive voltage to the compensation signal generating circuit 110 via the third terminal 120c, and measures the frequency of the output signal. The confirmation unit 16T1 transmits the measured frequency and target temperature T1 to the controller 20.

[0054] Once the first confirmation unit 16T1 has successfully measured the frequencies of all TCXOs 100, the transport mechanism 18 transports the carrier 80 to the next confirmation unit 16T2. This confirmation unit 16T2 also measures the frequencies of the TCXOs 100 using a similar procedure. Once these frequency measurements have been completed for all confirmation units 16T1-16T7, the controller 20 determines whether the compensation values ​​written to each TCXO 100 are appropriate. That is, the confirmation unit 16 drives the TCXOs 100 with compensation from the compensation value generation circuit turned on. Therefore, if the compensation values ​​are appropriate, the frequency of the signal output from the TCXO 100 remains approximately constant even when the target temperature Tn changes. On the other hand, if the frequencies measured by the confirmation unit 16 vary depending on the target temperature Tn, it can be determined that there is a problem with the compensation values. Therefore, the controller 20 determines whether the compensation values ​​of each TCXO 100 are appropriate based on the frequencies and target temperatures Tn transmitted from the multiple confirmation units 16T1-16T7. The TCXO 100 with an inappropriate compensation value is put back into the manufacturing equipment 10, and the compensation value is identified, written, and checked again.

[0055] As is clear from the above description, the manufacturing apparatus 10 uses the carrier-side Peltier element 46 to cool or heat the TCXO 100. This configuration significantly reduces the size of the apparatus compared to conventional manufacturing techniques that use a temperature bath. Specifically, when using a temperature bath, the entire internal space of the temperature bath, which is significantly larger than the TCXO 100, must be heated or cooled to the target temperature Tn. In this case, a heat pump device, an electric heater, a refrigeration machine, or the like must be provided to heat or cool the temperature bath. However, the heat pump device, the electric heater, and the refrigeration machine are all significantly larger than a Peltier element, resulting in an increase in the size of the apparatus.

[0056] Therefore, when a temperature bath is used, if both multiple measurement units 12 and multiple confirmation units 16 are provided, there is a problem that the entire manufacturing apparatus becomes very large. Therefore, when a temperature bath is used, it is considered to perform frequency measurement before writing a compensation value and frequency measurement after writing the compensation value in the same temperature bath. This will be explained with reference to Fig. 8. Fig. 8 is a schematic diagram showing the configuration of a manufacturing apparatus 10* of a comparative example.

[0057] The manufacturing apparatus 10* of the comparative example has multiple (seven in the illustrated example) temperature baths 200Tn arranged in a line. Note that, hereinafter, the "Tn" indicating the target temperature Tn in the reference numerals of the temperature baths will be omitted. A writing unit 14 is arranged downstream of the temperature bath 200. Note that, although the temperature bath 200 is illustrated in a simplified form in FIG. 8, the temperature bath 200 is typically large, and therefore the total length of the manufacturing apparatus 10* is approximately 10 m. Also, in FIG. 8, the thick arrow indicates the transport path 90 for the TCXO 100 in the manufacturing apparatus 10*.

[0058] In the manufacturing apparatus 10* of the comparative example, first, the TCXO 100, before the compensation value is written, passes through the multiple temperature baths 200 in order, and the frequency is measured. The controller 20 determines the compensation value based on the measured frequency. The writing unit 14 writes the determined compensation value to the memory 112 of the TCXO 100. The TCXO 100, with the compensation value written, is returned to the first temperature bath 200 by the transport mechanism 18. The TCXO 100 then passes through the multiple temperature baths 200 in order again, and the frequency is measured with compensation turned on.

[0059] As is clear from the above description and FIG. 8 , the comparative example manufacturing apparatus 10* using the temperature bath 200 tends to be large overall. Furthermore, if measurements of the TCXO 100 before and after writing the compensation value are performed in the same temperature bath 200 to avoid this increase in size, the transport distance of the TCXO 100 becomes longer. This results in a correspondingly longer lead time for manufacturing the TCXO 100. Furthermore, in the manufacturing apparatus 10*, the temperature baths 200 are large, so it takes time for each temperature bath 200 to reach the target temperature Tn. Furthermore, in the comparative example manufacturing apparatus 10*, the TCXO 100 is transported mounted on a substrate called a transport carrier board (not shown). This transport carrier board is often large and has a large heat capacity. Therefore, even if the TCXO 100 is placed together with the transport carrier board into the temperature bath 200 that has reached the predetermined target temperature Tn, it takes time for the transport carrier board and the TCXO 100 to reach the target temperature Tn. As a result, the manufacturing apparatus 10* of the comparative example leads to a longer lead time for manufacturing the TCXO 100.

[0060] On the other hand, in the manufacturing apparatus 10 disclosed in this specification, the carrier-side Peltier element 46 heats or cools the TCXO 100 via the stage plate 32 and the carrier 80. This allows the overall apparatus to be significantly smaller than the comparative example that uses a temperature bath. Furthermore, since the carrier 80 often has a smaller heat capacity than the transport carrier board, this example allows the TCXO 100 to reach the target temperature Tn quickly. As a result, the lead time for manufacturing the TCXO 100 can be shortened.

[0061] Furthermore, because the configuration for heating or cooling the TCXO 100 can be made smaller, the measurement unit 12 and the confirmation unit 16 can be provided separately. Furthermore, multiple measurement units 12 and multiple confirmation units 16 can be arranged in a generally U-shape, as shown in FIG. 1. In this case, the transport path 26 of the manufacturing apparatus 10 is significantly shorter than the transport path 90 of the comparative example shown in FIG. 8. As a result, the lead time for manufacturing the TCXO 100 can be shortened.

[0062] Furthermore, in the manufacturing apparatus 10, the multiple measuring units 12 and the multiple confirmation units 16 are all arranged so that the target temperature Tn increases as the unit approaches the downstream side in the conveyance direction. Therefore, even if the frequency of the quartz crystal unit 102 exhibits hysteresis with respect to the temperature fluctuation direction, the compensation value can be properly confirmed. That is, some quartz crystal units 102 may exhibit different temperature characteristics when the ambient temperature is increased and when the ambient temperature is decreased. In this case, the appropriateness of the compensation value set based on the frequency measured while the temperature is increased cannot be determined based on the frequency measured while the temperature is decreased. In the manufacturing apparatus 10 shown in FIG. 1, the direction of change in the target temperature Tn of the multiple measuring units 12 used to set the compensation value is aligned with the direction of change in the target temperature Tn of the multiple confirmation units 16 used to determine the appropriateness of the compensation value. Therefore, even if the quartz crystal unit 102 exhibits hysteresis, the appropriateness of the compensation value can be properly determined.

[0063] The configurations described above are merely examples. The manufacturing apparatus 10 may have other configurations as appropriate, as long as they have the configuration described in claim 1. For example, the number of measurement units 12 and confirmation units 16 may be changed as appropriate. Furthermore, the target temperature Tn does not have to change in only one direction; instead, it may increase and then decrease, or decrease and then increase, as shown in FIG. 6 . By using such a configuration, if the TCXO 100 is routed along the transport path 26, both the compensation value applied when the temperature increases and the compensation value applied when the temperature decreases can be identified and confirmed. Furthermore, if the TCXO 100 does not have temperature hysteresis, the direction of change of the target temperature Tn in the multiple measurement units 12 may be different from the direction of change of the target temperature Tn in the multiple confirmation units 16, as shown in FIG. 7 .

[0064] Furthermore, the configuration of the probe 60 and the area around the testing space 38 may be modified as appropriate. For example, the testing space 38 may be configured to be always open as long as the temperature of the TCXO 100 can be appropriately controlled. Furthermore, the dry air source 52 may be omitted as long as condensation can be prevented. Furthermore, the manufacturing apparatus of the present application is not limited to the TCXO described above, and may be used to manufacture other oscillators, such as MEMS oscillators and RTC oscillators. Furthermore, some or all of the carrier-side chiller 48 and the probe-side chiller 72 may be replaced with other heat dissipation elements, such as fins. [Explanation of symbols]

[0065] 10,10* Manufacturing equipment, 12 Measurement unit, 14 Writing unit, 16 Verification unit, 18 Transport mechanism, 20 Controller, 24 Memory, 26 Transport path, 26o Outward path, 26r Return path, 26t Turn-back section, 30 Base, 32 Stage plate, 34 Suction groove, 36 Partition plate, 38 Inspection space, 40 Cover member, 42 Inspection hole, 44 Shutter, 46 Carrier side Peltier, 48 Carrier side chiller, 50 Aspirator, 52 Dry air source, 60 Probe, 62 Probe body, 64 Probe needle, 66 Measuring circuit, 68 Heat insulating element, 70 Probe side Peltier, 72 Probe side chiller, 80 Carrier, 82 Storage recess, 84 Suction hole, 90 Transport path, 100 TCXO, 102 Crystal oscillator, 104 Electrode, 106 Voltage controlled crystal oscillator, 108 temperature sensor, 110 compensation signal generating circuit, 112 memory, 120 terminal, 200 temperature bath.

Claims

1. A manufacturing apparatus for a temperature-compensated oscillator in which frequency fluctuations due to temperature changes are compensated for, a plurality of measurement units each having a different target temperature, each of which is configured to heat or cool the oscillator to a target temperature with the compensation turned off and measure the frequency of the oscillator in that state; a write unit for writing a compensation value used in the compensation into the oscillator; a plurality of confirmation units each having a different target temperature, each of which is configured to heat or cool the oscillator to a target temperature with the compensation turned on and measure the frequency of the oscillator in that state; a transport mechanism that transports a carrier holding the oscillator along a transport path; a controller that instructs the writing unit to write the compensation value according to the temperature and frequency measured by the plurality of measuring units, and judges whether the written compensation value is appropriate based on the frequency measured by the plurality of checking units; Equipped with The measurement unit and the confirmation unit both a carrier-side Peltier element that heats or cools the oscillator via the carrier; a probe that contacts the oscillator to measure the frequency of the oscillator; a probe-side Peltier element for heating or cooling the probe; It has the conveying path is substantially U-shaped and includes an outgoing path, a turning portion, and a returning path; the plurality of measurement units are arranged on the outgoing path of the transport path, the writing unit is disposed at a turning point of the transport path, the plurality of confirmation units are arranged on the return path of the conveying path; 2. A manufacturing apparatus for a temperature compensated oscillator, comprising:

2. 2. The temperature-compensated oscillator manufacturing apparatus according to claim 1, The number of the measurement units is the same as the number of the confirmation units; a combination of target temperatures for the plurality of measurement units is the same as a combination of target temperatures for the plurality of verification units; 2. A manufacturing apparatus for a temperature compensated oscillator, comprising:

3. 3. The manufacturing apparatus for a temperature compensated oscillator according to claim 2, the plurality of measurement units are arranged such that the target temperature changes in a predetermined direction toward the downstream side of the outward path, the plurality of confirmation units are arranged such that the target temperature changes in the predetermined direction as the temperature moves downstream on the return path.

2. A manufacturing apparatus for a temperature compensated oscillator, comprising:

4. 4. An apparatus for manufacturing a temperature compensated oscillator according to claim 1, the carrier has a plurality of accommodating recesses formed on its upper surface, each accommodating one of the oscillators; The probe is A probe body; a probe needle that protrudes from the bottom surface of the probe body and contacts the oscillator accommodated in the accommodation recess; a measurement circuit for measuring the frequency of the oscillator; a probe-side Peltier element for cooling or heating the probe body and the probe needle; an insulating element made of a thermal insulating material and disposed between the measurement circuit and the probe body to insulate the measurement circuit; Equipped with 2. A manufacturing apparatus for a temperature compensated oscillator, comprising:

5. 5. The temperature compensated oscillator manufacturing apparatus according to claim 4, the carrier has a suction hole communicating with the accommodating recess, The measurement unit and the confirmation unit both a suction groove formed on a mounting surface on which the carrier is mounted and communicating with the suction hole; a suction device that sucks the accommodation recess through the suction groove and the suction hole; Equipped with 2. A manufacturing apparatus for a temperature compensated oscillator, comprising:

6. 4. An apparatus for manufacturing a temperature compensated oscillator according to claim 1, The measurement unit and the confirmation unit both an inspection space for temporarily accommodating the carrier; partition plates provided at the upstream end and downstream end of the testing space in the conveying direction, respectively, for opening and closing the testing space; a dry air source that supplies dry air to the testing space; wherein the controller closes the inspection space with the partition plate during a period in which the frequency is measured, and moves the partition plate to an open position to open the inspection space during a period in which the carrier is transported.

2. A manufacturing apparatus for a temperature compensated oscillator, comprising:

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