Power conversion equipment for railway vehicles

Abstract

To provide a power conversion device in which semiconductor modules in phases of a converter unit and an inverter unit are efficiently cooled.SOLUTION: A power conversion device 16 includes a converter unit 56 and an inverter unit 58 that are adjacent to each other in a direction in which phases intersect the advancing direction, and that are fixed to a cooling unit, and a plurality of heat pipes 60. Each of the phases in the converter unit and the inverter unit includes a first semiconductor module 82, and a second semiconductor module 84 and a third semiconductor module 86 that have a smaller heating amount than the first semiconductor module. The first semiconductor module is disposed on the wind incoming side or the wind discharging side of the second and third semiconductor modules when an advance is made in the advancing direction. The heat pipes are disposed in the phases of the converter unit and the inverter unit. A hydraulic fluid evaporating part on one end 62 is disposed between a cooling fin 74 and the first semiconductor module, and a hydraulic fluid condensing part on the other end 64 is disposed between the cooling fin and the second semiconductor module or third semiconductor module.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] An embodiment of the present invention relates to a power conversion device for a railway vehicle. [Background technology]

[0002] A three-level circuit power conversion device includes a converter unit that converts AC to DC, an inverter unit that converts DC to AC, and a cooling unit. The converter unit and inverter unit include semiconductor modules that generate heat during power conversion. In a power conversion device for a railway vehicle, the cooling unit absorbs the heat generated by the semiconductor modules of the converter unit and inverter unit, and cools the cooling unit using the wind generated by the vehicle's running. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6858244 [Patent Document 2] Patent No. 6735721 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide a power conversion device capable of efficiently cooling semiconductor modules of each phase of a converter section and an inverter section. [Means for solving the problem]

[0005] According to an embodiment, a power conversion device for a railway vehicle includes a cooling unit, a converter unit, an inverter unit, and a plurality of heat pipes. The cooling unit has cooling fins that are cooled by movement of one and the other of the railway vehicles in the traveling directions. The converter unit is adjacent to the cooling unit in a direction intersecting the traveling direction with a U phase and a V phase, and is fixed to the cooling unit. The converter unit generates heat when converting AC to DC. The inverter unit is adjacent to the converter unit in a direction intersecting the traveling direction, and the U phase, V phase, and W phase are adjacent to the converter unit in a direction intersecting the traveling direction, and is fixed to the cooling unit. The inverter unit generates heat when converting DC to AC. A plurality of heat pipes are provided between the cooling fins and the converter unit, and between the cooling fins and the inverter unit, respectively. The cooling portion has a first end along the traveling direction and a second end opposite to the first end. Each phase of the converter unit and each phase of the inverter unit are disposed adjacent the first end of the cooling portion; The system includes a first semiconductor module that generates heat during power conversion, a second semiconductor module that generates heat during power conversion and generates less heat than the first semiconductor module, and a third semiconductor module that generates heat during power conversion and generates less heat than the first semiconductor module. The first semiconductor module is located on the air intake side or the air exhaust side of the second semiconductor module and the third semiconductor module when traveling in the traveling direction. The heat pipes are provided for each phase of the converter unit and each phase of the inverter unit. An evaporator of the working fluid at one end of the heat pipe is located between the cooling fin and the first semiconductor module. A condenser of the working fluid at the other end of the heat pipe is located between the cooling fin and the second semiconductor module or the third semiconductor module. [Brief explanation of the drawings]

[0006] [Figure 1] 1 is a schematic side view of a portion of a railway vehicle according to an embodiment mounted on a rail; [Figure 2] 1 is a schematic diagram of a power conversion device according to a first embodiment. [Figure 3] 1 is a circuit diagram of a three-level power conversion device according to a first embodiment. [Figure 4] 2 is a three-level circuit diagram of each phase of the converter section and inverter section of the power conversion device according to the first embodiment. FIG. [Figure 5] FIG. 6 is a schematic diagram of a power conversion device according to a second embodiment. [Figure 6] FIG. 10 is a schematic diagram of a power conversion device according to a third embodiment. [Figure 7] FIG. 13 is a schematic diagram of a power conversion device according to a first modified example of the third embodiment. [Figure 8] FIG. 13 is a schematic diagram of a power conversion device according to a second modification of the third embodiment. [Figure 9] FIG. 10 is a circuit diagram of a three-level power conversion device according to a fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0007] A preferred embodiment of a railcar 10 will now be described with reference to the drawings.

[0008] [First embodiment] A railway vehicle 10 according to the first embodiment will be described with reference to Figures 1 to 4. In each figure, for the sake of convenience, the scale of each component will be changed as appropriate, and some components will be omitted or simplified.

[0009] Fig. 1 is a side view schematically showing a portion of a railway vehicle 10 according to an embodiment. The railway vehicle 10 shown in Fig. 1 runs on a dedicated passage (track) on which rails 100 or the like are laid. The railway vehicle 10 includes a bogie 12, a car body 14, and a power conversion device (rail vehicle power conversion device) 16.

[0010] An XYZ Cartesian coordinate system is set in Fig. 1. In this embodiment, the X direction in Fig. 1 indicates the fore-and-aft direction of the railway vehicle 10, the Y direction indicates the width direction of the railway vehicle 10, and the Z direction indicates the direction of gravity. The left side of the paper in Fig. 1 is the +X direction, the back side of the paper is the +Y direction, and the top of the paper is the +Z direction. Furthermore, the fore-and-aft direction of the railway vehicle 10 is the expected traveling direction of the railway vehicle 10 (a first direction (+X direction) and a second direction (-X direction) opposite to the first direction).

[0011] The bogie 12 includes, for example, a bogie frame 22, a plurality of axles 24, a plurality of wheels 26, an electric motor 28, and a bogie spring 30. A plurality of bogies 12 are provided, for example, under the floor of the car body 14, spaced apart in the expected traveling direction.

[0012] The bogie springs 30 are, for example, air springs. The bogie frame 22 is connected to the underfloor of the car body 14 via the bogie springs 30.

[0013] The axles 24 extend in the width direction of the railway vehicle 10. The multiple axles 24 are rotatably supported by the bogie frame 22. For example, a pair of axles 24 are provided at both ends of the bogie frame 22 along the expected running direction.

[0014] The wheels 26 are attached to both ends of the axle 24 in the width direction, and are placed on the rails 100. In this embodiment, one bogie 12 is provided with, for example, four wheels 26.

[0015] The electric motor 28 is supported by, for example, the bogie frame 22. The electric motor 28 rotates the axles 24. For example, a pair of electric motors 28 are provided so as to rotate each of the pair of axles 24. As a specific example, the electric motor 28 has a rotating shaft that rotates using three-phase AC power and a transmission mechanism that transmits the rotation of the rotating shaft to the axles 24.

[0016] The vehicle body 14 is long in the expected traveling direction (front-rear direction). The vehicle body 14 is formed in a substantially rectangular parallelepiped shape that is long in the front-rear direction. However, the shape of the vehicle body 14 is not limited to this shape and can be set as appropriate.

[0017] A pantograph 14a is provided on the ceiling of the car body 14, facing upward in the direction of gravity. The pantograph 14a is configured to be able to come into contact with an overhead wire 101 set on a rail 100 at a certain distance.

[0018] 1, the power conversion device 16 is arranged, for example, between the bogies 12 along the expected traveling direction. The power conversion device 16 has a housing 52 that is attached under the floor of the car body 14 of the railway vehicle 10. Various devices of the power conversion device 16, which will be described later, are provided in the housing 52.

[0019] The upper left diagram in Fig. 2 is a schematic diagram of the power conversion device 16 used in the railway vehicle 10 as seen from the carbody 14 side, the right diagram in Fig. 2 is a diagram as seen from the second direction (-X direction) of the expected running direction to the first direction (+X direction), and the lower left diagram in Fig. 2 is a diagram as seen from one side (-Y direction) in the width direction to the other side (+Y direction). Fig. 3 is a circuit diagram of each phase of the converter unit 56 and inverter unit 58 of the power conversion device 16. Fig. 4 is a circuit diagram of the converter unit 56, filter capacitor 57, and inverter unit 58 of the power conversion device 16.

[0020] As shown in FIG. 2, the power conversion device 16 includes a cooling unit 54, a converter unit 56, an inverter unit 58, and a plurality of heat pipes 60.

[0021] The housing 52 accommodates various devices such as a cooling unit 54, a converter unit 56, an inverter unit 58, and a plurality of heat pipes 60.

[0022] The housing 52 is open at least in the expected running direction (X direction), and air flows along the cooling section 54. The housing 52 may be open in the width direction (Y direction). The lower surface of the housing 52 may be open so as to expose the cooling fins 74.

[0023] The cooling unit 54 is made of a material with high thermal conductivity, such as aluminum, etc. As a specific example, the cooling unit 54 includes a heat receiving block 72 and a plurality of cooling fins 74 that are integrated with the heat receiving block 72, for example.

[0024] The heat receiving block 72 is disposed, for example, inside the housing 52. A part of the heat receiving block 72 may be disposed, for example, outside the housing 52.

[0025] The heat receiving block 72 may have various shapes, for example, a rectangular parallelepiped shape. A converter unit 56 and an inverter unit 58 are provided on the upper surface of the heat receiving block 72. The converter unit 56 and the inverter unit 58 are arranged side by side in the width direction of the railway vehicle 10. In this embodiment, for convenience, the end of the heat receiving block 72 on the first direction (+X direction) side is referred to as a first end 72a, the end on the second direction (-X direction) side is referred to as a second end 72b, the end on one side in the width direction (+Y direction side) is referred to as a third end 72c, and the end on the other side in the width direction (-Y direction side) is referred to as a fourth end 72d.

[0026] When the power converter 16 is installed under the floor of the vehicle body 14, the multiple cooling fins 74 extend downward in the direction of gravity (+Z direction) from the heat receiving block 72. The multiple cooling fins 74 form an air-receiving section. The multiple cooling fins 74 may be arranged inside the housing 52 or outside the housing 52.

[0027] The cooling fins 74 are formed in the shape of thin rectangular plates that are long in one direction (X direction). When the power conversion device 16 is installed under the floor of the carbody 14, the cooling fins 74 are arranged on the heat receiving block 72 with the width direction (Y direction) of the railway vehicle 10 as the thickness direction and the expected running direction (X direction) as the longitudinal direction. The multiple cooling fins 74 are arranged at predetermined intervals in the thickness direction of the cooling fins 74. Here, the predetermined intervals are, for example, equal intervals.

[0028] Note that it is preferable that one end 74a of the cooling fin 74 in the +X direction be arranged closer to the +X direction than the position of the first semiconductor module 82 closest to the +X direction. The one end 74a may be arranged closer to the +X direction than the first end 72a of the heat receiving block 72, or may be arranged closer to the -X direction. It is also preferable that the other end 74b of the cooling fin 74 in the -X direction be arranged closer to the -X direction than the position of the second semiconductor module 84 closest to the -X direction. The other end 74b may be arranged closer to the +X direction than the second end 72b of the heat receiving block 72, or may be arranged closer to the -X direction.

[0029] The multiple cooling fins 74 form multiple flow passages through which the traveling wind F1 or F2 flows along the traveling direction in the gaps between adjacent cooling fins 74 in the width direction. As the railway vehicle 10 travels, the multiple cooling fins 74 receive the traveling wind F1 or F2 that flows mainly along the expected traveling direction, and exchange heat with the traveling wind F1 or F2.

[0030] The power conversion device 16 converts AC power supplied from the overhead line 101 via, for example, a pantograph 14a attached to the upper side of the car body 14 from AC power to DC power using a converter unit 56, and converts the DC power into three-phase AC power using an inverter unit 58, and transmits the power to each electric motor 28.

[0031] The converter unit 56 is composed of a U phase and a V phase, and the inverter unit 58 is composed of a U phase, a V phase, and a W phase. The U phase and the V phase of the converter unit 56 are aligned in the width direction and adjacent to each other. The U phase, the V phase, and the W phase of the inverter unit 58 are aligned in the width direction and adjacent to each other.

[0032] In this embodiment, the converter unit 56 and the inverter unit 58 each have, for example, a three-level circuit configuration. Fig. 3 shows a three-level circuit diagram of each phase of the converter unit 56 and the inverter unit 58. Each phase of the converter unit 56 and the inverter unit 58 is made up of three semiconductor modules 82, 84, and 86 that house semiconductors such as switching elements and diodes.

[0033] In this embodiment, the phases of the converter unit 56 refer to the U phase and V phase of the converter unit 56. The phases of the inverter unit 58 refer to the U phase, V phase, and W phase of the inverter unit 58.

[0034] The first semiconductor module 82 is a so-called 2-in-1 module in which the upper and lower arms each include a pair of a switching element, typically an insulated gate bipolar transistor (IGBT), and an anti-parallel diode in one package. The first semiconductor module 82 houses two switching elements (a second switching element Q2 and a third switching element Q3) connected in series. The first semiconductor module 82 may also be a so-called 4-in-1 module.

[0035] The second semiconductor module 84 and the third semiconductor module 86 are chopper modules each including a switching element and an anti-parallel diode pair in the upper or lower arm, and a clamp diode in the lower or upper arm. The second semiconductor module 84 houses a first switching element Q1 and a first clamp diode D5 in a single package. The third semiconductor module 86 houses a fourth switching element Q4 and a second clamp diode D6 in a single package.

[0036] As shown in FIG. 2, semiconductor modules 82, 84, and 86 that constitute the respective phases of converter section 56 and inverter section 58 are provided on heat receiving block 72 of cooling section 54, on the side opposite to cooling fins 74.

[0037] In this embodiment, each phase of converter unit 56 and inverter unit 58 is arranged in a direction along the longitudinal direction of cooling fins 74, i.e., in the same direction as the direction in which cooling air F1 or F2 passes between cooling fins 74 (the expected direction in which railway vehicle 10 is traveling). Semiconductor modules 82, 84, 86 are installed in each phase of converter unit 56 and inverter unit 58.

[0038] In this embodiment, a first semiconductor module 82 accommodating a second switching element Q2 and a third switching element Q3 is disposed along the expected traveling direction of the railcar 10 on the inlet side of the cooling air F1 or the exhaust side of the cooling air F2, i.e., on the first end 72a side of the heat receiving block 72. The first semiconductor module 82 is disposed on the inlet side of the cooling air F1 or the exhaust side of the cooling air F2 relative to the second semiconductor module 84 and the third semiconductor module 86 when traveling in the expected traveling direction (travel direction). In this embodiment, when the first semiconductor module 82 is located on the inlet side of the cooling air F1 (the first end 72a side of the heat receiving block 72) along the first direction of the railcar 10, the third semiconductor module 86 and the second semiconductor module 84 are disposed in this order from the inlet side of the cooling air F1 toward the exhaust side (the second end 72b side of the heat receiving block 72). For this reason, in this embodiment, the second semiconductor module 84, the third semiconductor module 86, and the first semiconductor module 82 are arranged in order along the second direction of the railway vehicle 10, which is opposite to the first direction, from the inlet side of the cooling air F2 (the second end 72b side of the heat receiving block 72) to the exhaust side (the first end 72a side of the heat receiving block 72).

[0039] 2, the first semiconductor module of the U phase of the converter unit 56 is designated by the reference symbol 82CU, and the first semiconductor module of the V phase of the converter unit 56 is designated by the reference symbol 82CV. Similarly, the second semiconductor module of the U phase of the converter unit 56 is designated by the reference symbol 84CU, and the second semiconductor module of the V phase of the converter unit 56 is designated by the reference symbol 84CV. The third semiconductor module of the U phase of the converter unit 56 is designated by the reference symbol 86CU, and the third semiconductor module of the V phase of the converter unit 56 is designated by the reference symbol 86CV. In the following description of the converter unit 56, the first semiconductor module will be mainly described using the reference symbol 82, the second semiconductor module will be mainly described using the reference symbol 84, and the third semiconductor module will be mainly described using the reference symbol 86.

[0040] 2, the first semiconductor module for the U phase of the inverter unit 58 is designated by the reference symbol 82IU, the first semiconductor module for the V phase of the inverter unit 58 is designated by the reference symbol 82IV, and the first semiconductor module for the W phase of the inverter unit 58 is designated by the reference symbol 82IW. Similarly, the second semiconductor module for the U phase of the inverter unit 58 is designated by the reference symbol 84IU, the second semiconductor module for the V phase of the inverter unit 58 is designated by the reference symbol 84IV, and the second semiconductor module for the W phase of the inverter unit 58 is designated by the reference symbol 84IW. The third semiconductor module for the U phase of the inverter unit 58 is designated by the reference symbol 86IU, the third semiconductor module for the V phase of the inverter unit 58 is designated by the reference symbol 86IV, and the third semiconductor module for the W phase of the inverter unit 58 is designated by the reference symbol 86IW. In the following description of the inverter unit 58, the first semiconductor module will be primarily described using the reference numeral 82, the second semiconductor module will be primarily described using the reference numeral 84, and the third semiconductor module will be primarily described using the reference numeral 86.

[0041] The converter section 56 and inverter section 58 of the three-level circuit system according to this embodiment are configured as shown in FIG.

[0042] 4, a smoothing filter capacitor 57 is installed between the converter unit 56 and the inverter unit 58 to stabilize and smooth the DC power output from the converter unit 56 and supplied to the inverter unit 58. Note that the filter capacitor 57 is not shown in FIG.

[0043] Such a power conversion device 16 constitutes a power conversion unit together with a control unit (not shown) and the like. The control unit transmits and receives switching signals to and from the converter unit 56 of the power conversion device 16 and the inverter unit 58.

[0044] The switching element and the anti-parallel diode are formed of, for example, a silicon semiconductor, but the switching element and the anti-parallel diode are not limited to being formed of a silicon semiconductor and may be formed of any appropriate semiconductor. For example, the switching elements Q1, Q2, Q3, and Q4 shown in FIG. 3 may be configured by, for example, metal oxide semiconductor field effect transistors (MOSFETs). At least one of the switching element, the anti-parallel diode, and the clamp diode may be made of a wide bandgap semiconductor.

[0045] 2, the heat pipes 60 are arranged in the heat receiving blocks 72 in the same direction as the flow of the cooling air F1 or F2 and directly below the semiconductor modules 82, 84, and 86 of each phase. The heat pipes 60 may have, for example, a flat plate-like appearance and be arranged on the upper surface of the heat receiving block 72 opposite the cooling fins 74, or may have, for example, a flat plate-like or cylindrical appearance and be embedded in the heat receiving block 72, for example, by being pressed into it.

[0046] 2, the heat pipes directly below the first semiconductor module 82CU, third semiconductor module 86CU, and second semiconductor module 84CU of the U phase of the converter unit 56 are denoted by the reference symbol 60CU. The heat pipes directly below the first semiconductor module 82CV, third semiconductor module 86CV, and second semiconductor module 84CV of the V phase of the converter unit 56 are denoted by the reference symbol 60CV. In the following description of the converter unit 56, the heat pipes will mainly be denoted by the reference symbol 60.

[0047] Similarly, the heat pipes directly below the first semiconductor module 82IU, third semiconductor module 86IU, and second semiconductor module 84IU of the U phase of the inverter unit 58 are designated by the reference symbol 60IU. The heat pipes directly below the first semiconductor module 82IV, third semiconductor module 86IV, and second semiconductor module 84IV of the V phase of the inverter unit 58 are designated by the reference symbol 60IV. The heat pipes directly below the first semiconductor module 82IW, third semiconductor module 86IW, and second semiconductor module 84IW of the W phase of the inverter unit 58 are designated by the reference symbol 60IW. In the following description of the inverter unit 58, the heat pipes will mainly be designated by the reference symbol 60.

[0048] The heat pipes 60 are preferably arranged across and directly below each set of the first semiconductor module 82, second semiconductor module 84, and third semiconductor module 86 for each phase of the converter unit 56 and the inverter unit 58. One end 62 of each heat pipe 60 is arranged between the first end 72a and the second end 72b on the first end 72a side, and the other end 64 is arranged between the first end 72a and the second end 72b on the second end 72b side.

[0049] The heat pipes 60 are used for heat transfer. The outer shell of the heat pipe 60 is formed of, for example, a copper alloy. An example of the working fluid for the heat pipes 60 is water. One end 62 of each heat pipe 60 is the evaporation section of the working fluid (refrigerant) sealed inside, and the other end 64 is the condensation section of the working fluid. One end 62 of the heat pipe 60 is disposed on the heat receiving block 72 between the first semiconductor module 82 of each phase and the cooling fin 74. The other end 64 of the heat pipe 60 is disposed on the heat receiving block 72 between the second semiconductor module 84 of each phase and the cooling fin 74.

[0050] In this embodiment, each heat pipe 60 is used under conditions such that the working fluid (refrigerant) in the evaporator at one end 62 of the heat pipe 60 does not dry out, such as within an appropriate temperature range.

[0051] Next, the effects of the power conversion device 16 of the railway vehicle 10 configured as described above will be described. Here, an example in which the railway vehicle 10 travels in a first direction (+X direction) in the expected traveling direction, and an example in which the railway vehicle 10 travels in a second direction (-X direction) opposite to the first direction will be described.

[0052] When the railway vehicle 10 runs on the rails 100 in a first direction or a second direction, the converter unit 56 of the power conversion device 16 converts AC power input from the overhead line 101 via the pantograph 14a into DC power and outputs it to the inverter unit 58 through the filter capacitor 57. The inverter unit 58 converts the DC power output from the converter unit 56 into AC power.

[0053] At this time, in each phase of the converter unit 56 and the inverter unit 58, power is transmitted, for example, in the order of the second semiconductor module 84, the third semiconductor module 86, and the first semiconductor module 82. That is, power is input to the second semiconductor module 84, passed through the third semiconductor module 86, and output by the first semiconductor module 82.

[0054] Then, the power conversion device 16 supplies the AC power converted by the inverter unit 58 to each electric motor 28. Each electric motor 28 rotates using the supplied AC power. When the rotational force of the electric motor 28 is transmitted to the axle 24, the axle 24 and the wheel 26 rotate. This causes the railway vehicle 10 to travel along the rail 100 in a first direction or a second expected traveling direction. In other words, the power conversion device 16 drives the electric motor 28 of the railway vehicle 10 and is capable of outputting to the electric motor 28 electric power that moves the railway vehicle 10 in a predetermined traveling direction.

[0055] In the power conversion device 16, heat is generated due to power loss during power conversion when the converter unit 56 converts AC current to DC current and when the inverter unit 58 converts DC power to AC power. Heat is generated in the semiconductor modules 82, 84, and 86 of each phase of the converter unit 56 and the inverter unit 58. The heat generated in the semiconductor modules 82, 84, and 86 of each phase of the converter unit 56 and the inverter unit 58 is transferred to the cooling fins 74 via the heat receiving block 72 of the cooling unit 54.

[0056] In each phase of the converter unit 56, the heat generation amount of the first semiconductor module 82 is greater than the heat generation amounts of the second semiconductor module 84 and the third semiconductor module 86. In other words, the heat generation amount of each of the second semiconductor module 82 and the third semiconductor module 86 of the converter unit 56 during power conversion is less than that of the first semiconductor module.

[0057] Furthermore, in each phase of the inverter unit 58, the amount of heat generated by the first semiconductor module 82 may be greater than the amounts of heat generated by the second semiconductor module 84 and the third semiconductor module 86. In other words, the amount of heat generated by each of the second semiconductor module 82 and the third semiconductor module 86 of the inverter unit 58 during power conversion may be less than that of the first semiconductor module. The reason why the heat generated by the first semiconductor module 82 in each phase of the inverter unit 58 may be greater than that of the second semiconductor module 84 and the third semiconductor module 86 is thought to be because the first semiconductor module 82 has two switching elements Q2 and Q3.

[0058] Generally, the amount of heat generated in each phase of the converter unit 56 of the power conversion device 16 is greater than the amount of heat generated in each phase of the inverter unit 58 .

[0059] When one end 62 of the heat pipe 60 is heated, the working fluid inside the heat pipe 60 absorbs heat and evaporates. At this time, the vapor pressure at one end 62 of the heat pipe 60 becomes higher than the vapor pressure at the other end 64. Therefore, the working fluid that evaporates at one end 62 of the heat pipe 60 moves to the other end 64 of the heat pipe 60. The vaporized working fluid condenses into a liquid at the other end 64. The working fluid dissipates heat when it returns from a gas state to a liquid state. Therefore, heat input to one end 62 of the heat pipe 60 is output from the other end 64. Then, the working fluid that has returned to a liquid state at the other end 64 of the heat pipe 60 returns to the one end 62 of the heat pipe 60 via the wick inside the heat pipe 60. In this way, the working fluid circulates between one end 62 and the other end 64 of the heat pipe 60 while undergoing a phase change between a gas and a liquid. Therefore, the heat pipe 60 continues to transfer heat from a high-temperature portion to a low-temperature portion within a range that does not cause the working fluid to dry out. Even if the working fluid in the evaporator dries out, heat can still be transferred from one end 62 to the other end 64 of the heat pipe 60 due to the copper alloy material.

[0060] In this embodiment, one end 62 of the heat pipe 60 is disposed directly below the first semiconductor module 82 of each phase of the converter unit 56 and the inverter unit 58, and the other end 64 of the heat pipe 60 is disposed directly below the second semiconductor module 84. Therefore, heat from the first semiconductor module 82 is input to the one end 62 of the heat pipe 60 by the heat pipe 60, moves to the other end 64, and is output (radiated) from the other end 64.

[0061] Therefore, the heat generated by the first semiconductor module 82 is transferred to the heat receiving block 72 of the cooling unit 54, and also moves through one end 62 of the heat pipe 60 to the other end 64. Then, the heat generated at the other end 64 of the heat pipe 60 is transferred to the heat receiving block 72 of the cooling unit 54. Therefore, the heat generated by the first semiconductor module 82 is transferred to the heat receiving block 72 of the cooling unit 54 near the first semiconductor module 82, and also transferred through the other end 64 of the heat pipe 60 to the heat receiving block 72 of the cooling unit 54 near the other end 64 of the heat pipe 60.

[0062] Furthermore, the heat generated by the second semiconductor module 84 is transferred to the heat receiving block 72 of the cooling unit 54 in the vicinity of the second semiconductor module 84. Similarly, the heat generated by the third semiconductor module 86 is transferred to the heat receiving block 72 of the cooling unit 54 in the vicinity of the third semiconductor module 86.

[0063] For this reason, of the semiconductor modules 82, 84, and 86 of each phase, the heat of the first semiconductor module 82, which generates the greatest amount of heat, is transferred directly to the heat receiving block 72 of the cooling unit 54 near one end 62 of the heat pipe 60, and is also transferred to the heat receiving block 72 of the cooling unit 54 near the other end 64 of the heat pipe 60. Therefore, the heat of the first semiconductor module 82, which generates the greatest amount of heat, is transferred (thermally conducted) to a wider area of ​​the heat receiving block 72. At this time, the heat of the second semiconductor module 84 is transferred to the heat receiving block 72 of the cooling unit 54 near the other end 64 of the heat pipe 60. In addition, the heat of the third semiconductor module 86 is transferred to the heat receiving block 72 of the cooling unit 54 at a position between the one end 62 and the other end 64 of the heat pipe 60.

[0064] Therefore, in the railway vehicle 10 according to this embodiment, when heat is transferred to the heat receiving block 72, a locally large amount of heat transfer is prevented in the heat receiving block 72. In this embodiment, a portion of the heat from the first semiconductor module 82 is transferred from one end 62 of the heat pipe 60 to the other end 64, and a portion of the heat from the first semiconductor module 82 is transferred from one end 62 of the heat pipe 60 to the heat receiving block 72. Furthermore, a portion of the heat from the first semiconductor module 82 is transferred to the heat receiving block 72 from the other end 64 of the heat pipe 60, and a portion of the heat from the second semiconductor module 84 is transferred to the heat receiving block 72 near the other end 64 of the heat pipe 60. Therefore, in the power conversion device 16 according to this embodiment, heat from the first semiconductor module 82, which generates the largest amount of heat among the semiconductor modules 82, 84, and 86 of each phase, is dispersed and transferred to the heat receiving block 72. Furthermore, a portion of the heat from the third first semiconductor module 82 is transferred to the heat receiving block 72. For this reason, in the power conversion device 16 according to this embodiment, the area requiring locally high heat transfer is reduced when heat is transferred to the heat receiving block 72 of the cooling unit 54. Therefore, in the power conversion device 16 according to this embodiment, heat from the semiconductor modules 82, 84, 86 of each phase is transferred in a dispersed manner over a wide area, such as the contact surface between the heat pipe 60 and the heat receiving block 72 and the surrounding area. In other words, in the power conversion device 16 of the railway vehicle 10 according to this embodiment, heat generated by the converter unit 56 and the inverter unit 58 is transferred uniformly to the cooling unit 54.

[0065] The housing 52 is open in at least the expected traveling direction (first direction and second direction), and air flows along the cooling unit 54. Therefore, when the railcar 10 travels in the first direction, traveling wind (cooling wind) F1 hits one end 74a of the cooling fins 74 and escapes from the other end 74b of the cooling fins 74. At this time, the plurality of cooling fins 74 receive the traveling wind F1 flowing in the first direction as the railcar 10 travels. Heat exchange occurs between the plurality of cooling fins 74 and the traveling wind (atmosphere) F1, and heat generated in the semiconductor modules 82, 84, 86 of each phase of the inverter unit 58 and the converter unit 56 is dissipated to the atmosphere via the plurality of cooling fins 74.

[0066] For this reason, the cooling unit 54 cools the semiconductor modules 82, 84, 86 of each phase of the converter unit 56 and the inverter unit 58, which generate heat when performing power conversion. For this reason, the cooling unit 54 suppresses temperature increases in the semiconductor modules 82, 84, 86 of each phase of the converter unit 56 and the inverter unit 58, and attempts to make the temperatures of the semiconductor modules 82, 84, 86 in each phase uniform.

[0067] When the railway vehicle 10 travels in a second direction opposite to the first direction, traveling wind (cooling wind) F2 hits the other end 74b of the cooling fins 74 and exits from one end 74a of the cooling fins 74. At this time, the multiple cooling fins 74 receive the traveling wind F2 flowing in the second direction as the railway vehicle 10 travels. Therefore, the cooling unit 54 cools the semiconductor modules 82, 84, 86 of each phase of the converter unit 56 and the inverter unit 58. Therefore, the cooling unit 54 suppresses a temperature rise in the semiconductor modules 82, 84, 86 of each phase and attempts to make the temperatures of the semiconductor modules 82, 84, 86 uniform in each phase.

[0068] As described above, in the power conversion device 16 according to the present embodiment, the three semiconductor modules 82, 84, and 86 for each phase of the converter unit 56 and the inverter unit 58 are disposed on the heat receiving block 72 of the cooling unit 54, and the first semiconductor module 82, which generates the largest amount of heat, is disposed on the one end 62 side of the heat pipe 60. Therefore, in the power conversion device 16 according to the present embodiment, heat from the first semiconductor module 82, which is assumed to generate the largest amount of heat in each phase, is transferred to the cooling unit 54, and the heat moves from the one end 62 to the other end 64 of the heat pipe 60 and then transferred to the cooling unit 54, thereby cooling the three semiconductor modules 82, 84, and 86 for each phase. Therefore, according to the power conversion device 16 according to the present embodiment, when power conversion is performed, it is possible to suppress temperature increases in the semiconductor modules 82, 84, and 86 for each phase of the converter unit 56 and the inverter unit 58, and to maintain uniform temperatures in the semiconductor modules 82, 84, and 86 for each phase.

[0069] Therefore, according to this embodiment, it is possible to provide the power conversion device 16 that can efficiently cool the semiconductor modules 82, 84, and 86 of each phase of the converter section 56 and the inverter section 58.

[0070] In the present embodiment, an example has been described in which the U-phase and V-phase of the converter unit 56 are arranged in a direction (Y-direction) perpendicular to the traveling direction (X-direction). The U-phase and V-phase of the converter unit 56 may be adjacent to each other in a direction intersecting the traveling direction.

[0071] Similarly, in the present embodiment, an example has been described in which the U-phase, V-phase, and W-phase of the inverter unit 58 are arranged in a direction (Y-direction) perpendicular to the traveling direction (X-direction). The U-phase, V-phase, and W-phase of the inverter unit 58 may be arranged in order adjacent to each other in a direction intersecting the traveling direction.

[0072] In the present embodiment, an example has been described in which the first semiconductor module 82, the third semiconductor module 86, and the second semiconductor module 84 are arranged in this order along the expected traveling direction in each phase of the converter unit 56 and each phase of the inverter unit 58. The order of the second semiconductor module 84 and the third semiconductor module 86 may be reversed. That is, in either one of the phases of the converter unit 56 and the inverter unit 58, the second semiconductor module 84 may be arranged between the first semiconductor module 82 and the third semiconductor module 86. Therefore, it is sufficient that the condensation portion of the working fluid at the other end 64 of the heat pipe 60 is arranged between the cooling fin 74 and the second semiconductor module 84 or the third semiconductor module 86.

[0073] In the present embodiment, an example has been described in which the heat pipe 60 is arranged to straddle three semiconductor modules 82, 84, and 86 in each phase of the converter unit 56 and each phase of the inverter unit 58. It is also preferable that the evaporator portion at one end 62 of the heat pipe 60 is arranged between the cooling fin 74 and the first semiconductor module 82, and the condenser portion at the other end 64 is arranged between the cooling fin 74 and the third semiconductor module 86 in FIG. 2. In this case, the heat pipe 60 does not have to be arranged between the cooling fin 74 and the second semiconductor module 84.

[0074] 2 has been described as an example in which one heat pipe 60 is arranged for a set of the first semiconductor module 82, the second semiconductor module 84, and the third semiconductor module 86 for each phase of the converter unit 56 and the inverter unit 58. A plurality of heat pipes 60, such as two heat pipes 60, may be arranged side by side in the width direction (Y direction) for a set of the first semiconductor module 82, the second semiconductor module 84, and the third semiconductor module 86 for each phase of the converter unit 56 and the inverter unit 58.

[0075] Alternatively, one of the heat pipes 60 may be disposed directly below the set of the first semiconductor module 82, the second semiconductor module 84, and the third semiconductor module 86 for each phase of the converter unit 56 and the inverter unit 58, and the remaining heat pipes 60 may be disposed between the set of the first semiconductor module 82, the second semiconductor module 84, and the third semiconductor module 86 for the adjacent phase. That is, for example, one heat pipe 60 is disposed directly below the set of the first semiconductor module 82, the second semiconductor module 84, and the third semiconductor module 86 for the U phase and the V phase of the converter unit 56. Then, one heat pipe 60 is disposed between the set of the first semiconductor module 82, the second semiconductor module 84, and the third semiconductor module 86 for the U phase of the converter unit 56 and the set of the first semiconductor module 82, the second semiconductor module 84, and the third semiconductor module 86 for the V phase. In this case, the heat pipes 60 are positioned so as not to interfere with the fixation of the semiconductor modules 82, 84, and 86 to the heat receiving block 72. The heat generated by the first semiconductor module 82 of each phase can be transferred from one end 62 to the other end 64 of the heat pipes 60 and then transferred to the cooling unit 54. That is, when the heat pipes 60 are not in direct contact with the semiconductor modules 82, 84, and 86, heat from the first semiconductor module 82, for example, is transferred to the one end 62 of the heat pipe 60 via the heat receiving block 72 of the cooling unit 54. In this manner, the heat from the first semiconductor module 82 may be transferred directly to the one end 62 of the heat pipe 60, or may be transferred to the one end 62 of the heat pipe 60 via the heat receiving block 72 of the cooling unit 54. In either case, the heat input to the one end 62 of the heat pipe 60 is radiated from the other end 64, which has a lower temperature than the one end 62, and transferred to the heat receiving block 72 of the cooling unit 54.

[0076] In the present embodiment, an example has been described in which, for both the converter unit 56 and the inverter unit 58, the three semiconductor modules 82, 84, 86 for each phase are arranged on the heat receiving block 72 of the cooling unit 54, and the first semiconductor module 82, which generates the largest amount of heat, is arranged on the one end 62 side of the heat pipe 60. For example, for the converter unit 56, the three semiconductor modules 82, 84, 86 for the U and V phases may be arranged on the heat receiving block 72 of the cooling unit 54, and the first semiconductor module 82, which generates the largest amount of heat, may be arranged on the one end 62 side of the heat pipe 60, and another cooling structure may be adopted for the inverter unit 58.

[0077] In the power conversion device 16 according to the present embodiment, for example, a plurality of inverter units 58 may be connected to one converter unit 56. Furthermore, one inverter unit 58 may drive a plurality of electric motors 28 of the bogie 12 of the railway vehicle 10, for example.

[0078] [Second embodiment] A second embodiment of the power conversion device 16 will be described with reference to Fig. 5. The power conversion device 16 according to this embodiment is a modified example of the power conversion device 16 according to the first embodiment, and the contents described in the first embodiment will not be described as appropriate.

[0079] Fig. 5 shows a power conversion device 16 according to a second embodiment. As shown in Fig. 5, in the power conversion device 16 according to the present embodiment, a plurality of first semiconductor modules 82 are connected in parallel, a plurality of second semiconductor modules 84 are connected in parallel, and a plurality of third semiconductor modules 86 are connected in parallel for each phase (U phase and V phase) of the converter unit 56 and each phase (U phase, V phase, and W phase) of the inverter unit 58. For ease of explanation, it is assumed here that n (n is a natural number equal to or greater than 2) first semiconductor modules 82, second semiconductor modules 84, and third semiconductor modules 86 are connected in parallel for each phase of the converter unit 56 and the inverter unit 58.

[0080] The first semiconductor modules 82 for each phase of the converter unit 56 and the inverter unit 58 are arranged on the heat receiving block 72 of the cooling unit 54 in a direction (Y direction) perpendicular to the expected traveling direction (X direction). In FIG. 5, two first semiconductor modules 82CU1, 82CU2, ... are arranged in the U phase of the converter unit 56, and two first semiconductor modules 82CV1, 82CV2, ... are arranged in the V phase. Furthermore, two semiconductor modules are arranged in each of the U and V phases of the inverter unit 58, but are not shown in FIG. 5. In FIG. 5, two first semiconductor modules 82IW1, 82IW2, ... are arranged in the W phase of the inverter unit 58.

[0081] The second semiconductor modules 84 for each phase of the converter unit 56 and the inverter unit 58 are arranged on the heat receiving block 72 of the cooling unit 54 in a direction (Y direction) perpendicular to the expected traveling direction (X direction). In FIG. 5, two second semiconductor modules 84CU1, 84CU2, ... are arranged in the U phase of the converter unit 56, and two second semiconductor modules 84CV1, 84CV2, ... are arranged in the V phase. Furthermore, two semiconductor modules are arranged in each of the U phase and V phase of the inverter unit 58, but are not shown in FIG. 5. In FIG. 5, two second semiconductor modules 84IW1, 84IW2, ... are arranged in the W phase of the inverter unit 58.

[0082] The third semiconductor modules 86 for each phase of the converter unit 56 and the inverter unit 58 are arranged on the heat receiving block 72 of the cooling unit 54 in a direction (Y direction) perpendicular to the expected traveling direction (X direction). In FIG. 5, two third semiconductor modules 86CU1, 86CU2, ... are arranged in the U phase of the converter unit 56, and two third semiconductor modules 86CV1, 86CV2, ... are arranged in the V phase. Furthermore, two semiconductor modules are arranged in each of the U phase and V phase of the inverter unit 58, but these are not shown in FIG. 5. In FIG. 5, two third semiconductor modules 86IW1, 86IW2, ... are arranged in the W phase of the inverter unit 58.

[0083] Then, for example, a third semiconductor module 86 is arranged adjacent to each first semiconductor module 82 in the -X direction (toward the second end 72b relative to the first end 72a of the heat receiving block 72), and a second semiconductor module 84 is arranged adjacent to the third semiconductor module 86 in the -X direction (toward the second end 72b relative to the first end 72a of the heat receiving block 72).

[0084] The number of heat pipes 60 prepared is the same as the number of first semiconductor modules 82 for each phase of the converter unit 56 and the inverter unit 58. A heat pipe 60 is disposed between the cooling fin 74 and each set of the first semiconductor module 82, the third semiconductor module 86, and the second semiconductor module 84 arranged in the X direction for each phase of the converter unit 56 and the inverter unit 58.

[0085] 5, a heat pipe 60CU1 is arranged between the cooling fins 74 and the first semiconductor module 82CU1, third semiconductor module 86CU1, and second semiconductor module 84CU1 of the U phase of the converter unit 56. A heat pipe 60CU2 is arranged between the cooling fins 74 and the first semiconductor module 82CU2, third semiconductor module 86CU2, and second semiconductor module 84CU2 of the U phase of the converter unit 56. A heat pipe 60CV1 is arranged between the cooling fins 74 and the first semiconductor module 82CV1, third semiconductor module 86CV1, and second semiconductor module 84CV1 of the V phase of the converter unit 56. A heat pipe 60CV2 is arranged between the cooling fins 74 and the first semiconductor module 82CV2, third semiconductor module 86CV2, and second semiconductor module 84CV2 of the V phase of the converter unit 56.

[0086] 5, illustration of the two semiconductor modules and heat pipes for each of the U and V phases of the inverter unit 58 is omitted. A heat pipe 60IW1 is arranged between the cooling fins 74 and the first semiconductor module 82IW1, third semiconductor module 86IW1, and second semiconductor module 84IW1 for the W phase of the inverter unit 58. A heat pipe 60IW2 is arranged between the cooling fins 74 and the first semiconductor module 82IW2, third semiconductor module 86IW2, and second semiconductor module 84IW2 for the W phase of the inverter unit 58.

[0087] One end 62 of each heat pipe 60 is disposed between the first semiconductor module 82 and the cooling fin 74. The other end 64 of the heat pipe 60 is disposed between the second semiconductor module 84 and the cooling fin 74.

[0088] As in the power conversion device 16 of this embodiment, by connecting multiple semiconductor modules in parallel in each phase of the converter section 56 and the inverter section 58, the current density of the current flowing through the power conversion device 16 can be increased compared to the power conversion device 16 described in the first embodiment.

[0089] The power conversion device 16 according to this embodiment has the same effects as the power conversion device 16 described in the first embodiment. Therefore, according to the power conversion device 16 according to this embodiment, when performing power conversion, it is possible to suppress a rise in temperature of the semiconductor modules 82, 84, 86 in each phase of the converter unit 56 and the inverter unit 58, and to make the temperatures of the semiconductor modules 82, 84, 86 in each phase uniform.

[0090] Therefore, according to this embodiment, it is possible to provide the power conversion device 16 that can efficiently cool the semiconductor modules 82, 84, and 86 of each phase of the converter section 56 and the inverter section 58.

[0091] [Third embodiment] A third embodiment of the power conversion device 16 will be described with reference to Fig. 6. The power conversion device 16 according to this embodiment is a further modified example of the power conversion device 16 according to the first and second embodiments, and the contents described in the first and second embodiments will not be described as appropriate.

[0092] Fig. 6 shows a power converter 16 according to a third embodiment. The power converter 16 shown in Fig. 6 is a diagram in which terminal blocks 92a, 92b and AC terminals 94C, 94I are added to the upper left diagram of Fig. 2.

[0093] 6, the power conversion device 16 has a terminal block 92a on the converter unit 56 side and a terminal block 92b on the inverter unit 58 side. The terminal blocks 92a and 92b are provided, for example, in the housing 52 shown in FIG. 1. The terminal blocks 92a and 92b are provided, for example, on the first direction (+X direction) side with respect to the cooling unit 54. Note that the terminal block 92a of the converter unit 56 and the terminal block 92b of the inverter unit 58 may be integrated as long as they are electrically insulated from each other.

[0094] In the power conversion device 16 shown in the upper left diagram of FIG. 2 according to the first embodiment, when the power input is on the right side (−X direction) and the power output is on the left side (+X direction), the first semiconductor module 82 of the converter unit 56 is provided with an AC terminal (input terminal) 94CU on the converter unit 56 side that is electrically connected to the terminal block 92a. Note that FIG. 6 representatively shows an AC terminal 94CU1 connected to the first semiconductor module 82CU and an AC terminal 94CU3 connected to the third semiconductor module 86CU. Also, the first semiconductor module 82 of the inverter unit 58 is provided with an AC terminal (output terminal) 94IW on the inverter unit 58 side that is electrically connected to the terminal block 92b. Note that FIG. 6 representatively shows an AC terminal 94IW1 connected to the first semiconductor module 82IW and an AC terminal 94IW3 connected to the third semiconductor module 86IW. That is, the V-phase AC terminal of the converter unit 56 is not shown in FIG. 6. 6, the U-phase output terminal and the V-phase output terminal of the inverter unit 58 are not shown. In the following description, the terminal of the converter unit 56 will mainly be referred to as 94C, and the terminal of the inverter unit 58 will mainly be referred to as 94I.

[0095] In this way, one end of each phase AC terminal 94C on the converter unit 56 side protrudes toward the side where terminal block 92a is provided, and one end of each phase AC terminal 94I on the inverter unit 58 side protrudes toward the side where terminal block 92b is provided.

[0096] The AC terminal 94C of the converter unit 56 and the AC terminal 94I of the inverter unit 58 are each formed of a conductor called a bus bar.

[0097] According to the present embodiment, in the power conversion device 16, the AC terminal 94C of the converter unit 56 and the AC terminal 94I of the inverter unit 58 are provided in the same direction, i.e., the first direction side, relative to the converter unit 56 and the inverter unit 58. Furthermore, in the power conversion device 16, the terminal blocks 92a and 92b are provided on the first direction side. This allows a worker performing maintenance or the like to easily connect / disconnect the AC terminal 94C of each phase of the converter unit 56 to the terminal block 92a, and also to easily connect / disconnect the AC terminal 94I of each phase of the inverter unit 58 to the terminal block 92b. Therefore, the power conversion device 16 according to the present embodiment can improve the ease of connecting / disconnecting the AC terminal 94C of each phase of the converter unit 56 to the terminal block 92a and connecting / disconnecting the AC terminal 94I of each phase of the inverter unit 58 to the terminal block 92b.

[0098] Furthermore, the AC terminal 94C of the converter unit 56 of the power conversion device 16, the AC terminal 94I of the inverter unit 58, and the terminal blocks 92a and 92b are provided on the first direction side. This reduces the number of electrical connection positions between the converter unit 56 and the inverter unit 58 to one or two, for example. This allows the power conversion device 16 to be manufactured in a relatively compact size. Furthermore, by determining that the AC terminal 94C of the converter unit 56 of the power conversion device 16, the AC terminal 94I of the inverter unit 58, and the terminal blocks 92a and 92b are provided on the first direction side and clarifying the design concept, the converter unit 56 and the inverter unit 58 can be designed relatively easily.

[0099] Furthermore, the power conversion device 16 according to this embodiment has the same effects as the power conversion device 16 described in the first embodiment. Therefore, according to the power conversion device 16 according to this embodiment, when performing power conversion, it is possible to suppress a rise in temperature of the semiconductor modules 82, 84, 86 in each phase of the converter unit 56 and the inverter unit 58, and to make the temperatures of the semiconductor modules 82, 84, 86 in each phase uniform.

[0100] Therefore, according to this embodiment, it is possible to provide the power conversion device 16 that can efficiently cool the semiconductor modules 82, 84, and 86 of each phase of the converter section 56 and the inverter section 58.

[0101] [First Modification] A power conversion device 16 according to a first modification of the third embodiment will be described with reference to FIG.

[0102] The arrangement of the converter unit 56 and the inverter unit 58 of the power conversion device 16 in Fig. 7 according to the first modified example of the third embodiment is reversed in the width direction (Y direction) compared to the arrangement of the converter unit 56 and the inverter unit 58 of the power conversion device 16 according to the first embodiment in the upper left drawing of Fig. 2. That is, the arrangement of the inverter unit 58 and the converter unit 56 in the width direction can be selected as appropriate. Note that the heat pipes 60 are not shown in Fig. 7.

[0103] The power conversion device 16 according to this modification has the same effects as the power conversion devices 16 described in the first to third embodiments. Therefore, according to the power conversion device 16 according to this modification, when performing power conversion, it is possible to suppress a rise in temperature of the semiconductor modules 82, 84, 86 in each phase of the converter unit 56 and the inverter unit 58, and to make the temperatures of the semiconductor modules 82, 84, 86 in each phase uniform. Therefore, according to this modification, it is possible to provide a power conversion device 16 that can efficiently cool the semiconductor modules 82, 84, 86 in each phase of the converter unit 56 and the inverter unit 58.

[0104] [Second Modification] A power conversion device 16 according to a second modification of the third embodiment will be described with reference to FIG.

[0105] The arrangement of the converter unit 56 and the inverter unit 58 of the power conversion device 16 in Fig. 8 according to the second modification of the third embodiment in the assumed traveling direction (X direction) is reversed relative to the arrangement of the converter unit 56 and the inverter unit 58 of the power conversion device 16 according to the first modification of the third embodiment in Fig. 7. In other words, the arrangement of the inverter unit 58 and the converter unit 56 in the assumed traveling direction can be selected as appropriate. Note that the heat pipe 60 is not shown in Fig. 8.

[0106] The power conversion device 16 according to this modification has the same effects as the power conversion devices 16 described in the first to third embodiments. Therefore, according to the power conversion device 16 according to this modification, when performing power conversion, it is possible to suppress a rise in temperature of the semiconductor modules 82, 84, 86 in each phase of the converter unit 56 and the inverter unit 58, and to make the temperatures of the semiconductor modules 82, 84, 86 in each phase uniform. Therefore, according to this modification, it is possible to provide a power conversion device 16 that can efficiently cool the semiconductor modules 82, 84, 86 in each phase of the converter unit 56 and the inverter unit 58.

[0107] [Fourth embodiment] A fourth embodiment of the power conversion device 16 will be described with reference to Fig. 9. The power conversion device 16 according to this embodiment is a further modified example of the power conversion device 16 according to the first to third embodiments, including the modified examples, and the contents described in the first to third embodiments will not be described as appropriate.

[0108] In the first embodiment, as shown in FIG. 3, an example has been described in which the three-level power conversion device 16 is configured with a first semiconductor module 82 which is a 2-in-1 module, and second and third semiconductor modules 84, 86 which are two chopper modules.

[0109] 9 shows a three-level circuit diagram of each phase of the converter unit 56 and the inverter unit 58 according to this embodiment. Each phase of the converter unit 56 and the inverter unit 58 is made up of three semiconductor modules 82, 84, and 86 that house semiconductors such as switching elements and diodes.

[0110] For example, as shown in Fig. 9, the clamp diode D5 (see Fig. 3) of the second semiconductor module 84 may be changed to a switching element such as an IGBT, and a 2-in-1 module may be configured as a single package. Also, the clamp diode D6 (see Fig. 3) of the third semiconductor module 86 may be changed to a switching element such as an IGBT, and a 2-in-1 module may be configured as a single package.

[0111] The power conversion device 16 according to this embodiment has the same effects as the power conversion devices 16 described in the first to third embodiments. Therefore, according to the power conversion device 16 according to this embodiment, when performing power conversion, it is possible to suppress a rise in temperature of the semiconductor modules 82, 84, 86 in each phase of the converter unit 56 and the inverter unit 58, and to make the temperatures of the semiconductor modules 82, 84, 86 in each phase uniform.

[0112] Therefore, according to this embodiment, it is possible to provide the power conversion device 16 that can efficiently cool the semiconductor modules 82, 84, and 86 of each phase of the converter section 56 and the inverter section 58.

[0113] In the power conversion device 16 according to the present embodiment, the three-level circuit shown in Fig. 9 may be used for each phase of the converter unit 56, and the three-level circuit shown in Fig. 3 may be used for the inverter unit 58. In the power conversion device 16 according to the present embodiment, the three-level circuit shown in Fig. 3 may be used for each phase of the converter unit 56, and the three-level circuit shown in Fig. 9 may be used for the inverter unit 58.

[0114] As described above, according to the embodiment including the various modifications, it is possible to provide the power conversion device 16 that can efficiently cool the semiconductor modules 82, 84, 86 of each phase of the converter section 56 and the inverter section 58.

[0115] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. The following is a summary of the claims of this application at the time of filing. [Appendix 1] a cooling unit having cooling fins that are cooled by movement of the railway vehicle in one and the other traveling directions; a converter unit, the U-phase and the V-phase being adjacent to each other in a direction intersecting the traveling direction, fixed to the cooling unit, and generating heat when converting AC to DC; an inverter unit that is adjacent to the converter unit in a direction intersecting the traveling direction, and that is adjacent to a U phase, a V phase, and a W phase in a direction intersecting the traveling direction, and that is fixed to the cooling unit and generates heat when converting DC to AC; a plurality of heat pipes provided between the cooling fin and the converter unit, and between the cooling fin and the inverter unit; and Each phase of the converter unit and each phase of the inverter unit are a first semiconductor module that generates heat during power conversion; a second semiconductor module that generates heat during power conversion and generates less heat than the first semiconductor module; a third semiconductor module that generates heat during power conversion and generates less heat than the first semiconductor module; Equipped with the first semiconductor module is provided on an air intake side or an air exhaust side relative to the second semiconductor module and the third semiconductor module when traveling in the traveling direction; the heat pipes are provided for each phase of the converter unit and each phase of the inverter unit, an evaporating portion of the working fluid at one end of the heat pipe is disposed between the cooling fin and the first semiconductor module; a condensation portion of the working fluid at the other end of the heat pipe is disposed between the cooling fin and the second semiconductor module or the third semiconductor module. Power conversion equipment for railway vehicles. [Appendix 2] the heat pipes are respectively arranged across and directly below sets of the first semiconductor module, the second semiconductor module, and the third semiconductor module of each phase of the converter unit and the inverter unit. 2. A power conversion device for a railway vehicle according to claim 1. [Appendix 3] a housing in which the converter unit, the inverter unit, and the cooling unit are disposed; The housing is provided with a terminal block, the first semiconductor module, the second semiconductor module, and the third semiconductor module of each phase of the converter unit and the inverter unit are each provided with an AC terminal; the terminal block, the AC terminal of the converter unit, and the AC terminal of the inverter unit are provided on the same side of the first semiconductor module, that is, on the air intake side or the air exhaust side. 10. The power conversion device for a railway vehicle according to claim 1 or 2. [Appendix 4] the first semiconductor module is a module accommodating a plurality of switching elements that generate heat due to power conversion; 4. A power conversion device for a railway vehicle according to claim 1. [Explanation of symbols]

[0116] 10...railroad vehicle, 12...bogie, 14...car body, 14a...pantograph, 16...power conversion device, 22...bogie frame, 24...axle, 26...wheel, 28...electric motor, 30...bogie spring, 52...casing, 54...cooling section, 56...converter section, 57...filter capacitor, 58...inverter section, 60...heat pipe, 62...one end (evaporation section), 64...other end (condensation section), 72...heat receiving block, 7 4...cooling fin, 74a...one end, 74b...other end, 82, 82C, 82I...first semiconductor module, 84, 84C, 84I...second semiconductor module, 86, 86C, 86W...third semiconductor module, 92a, 92b...terminal block, 94C, 94I...AC terminal, 100...rail, 101...overhead wire, Q1-Q4...switching elements, D5, D6...clamp diodes.

Claims

1. a cooling unit having cooling fins that are cooled by movement of the railway vehicle in one and the other traveling directions; a converter unit, the U-phase and V-phase being adjacent to each other in a direction intersecting the direction of travel, fixed to the cooling unit, and generating heat when converting AC to DC; an inverter unit that is adjacent to the converter unit in a direction intersecting the traveling direction, and that is adjacent to a U-phase, a V-phase, and a W-phase in a direction intersecting the traveling direction, and that is fixed to the cooling unit and generates heat when converting DC to AC; a plurality of heat pipes provided between the cooling fin and the converter unit, and between the cooling fin and the inverter unit; and the cooling portion has a first end along the traveling direction and a second end opposite to the first end, Each phase of the converter unit and each phase of the inverter unit are a first semiconductor module disposed adjacent to the first end of the cooling unit and generating heat during power conversion; a second semiconductor module that generates heat during power conversion and generates less heat than the first semiconductor module; a third semiconductor module that generates heat during power conversion and generates less heat than the first semiconductor module; Equipped with the first semiconductor module is provided on an air intake side or an air exhaust side relative to the second semiconductor module and the third semiconductor module when traveling in the traveling direction; the heat pipes are provided for each phase of the converter unit and each phase of the inverter unit, an evaporating portion of the working fluid at one end of the heat pipe is disposed between the cooling fin and the first semiconductor module; a condensation portion of the working fluid at the other end of the heat pipe is disposed between the cooling fin and the second semiconductor module or the third semiconductor module. Power conversion equipment for railway vehicles.

2. 2. The power conversion device for a railway vehicle according to claim 1, wherein the heat pipes are respectively arranged directly below and straddling sets of the first semiconductor module, the second semiconductor module, and the third semiconductor module of each phase of the converter unit and the inverter unit.

3. a housing in which the converter unit, the inverter unit, and the cooling unit are disposed; The housing is provided with a terminal block, the first semiconductor module, the second semiconductor module, and the third semiconductor module of each phase of the converter unit and the inverter unit are each provided with an AC terminal; 3. The power conversion device for a railway vehicle according to claim 1, wherein the terminal block, the AC terminal of the converter unit, and the AC terminal of the inverter unit are arranged in the same direction, either on the air intake side or the air exhaust side, relative to the first semiconductor module.

4. 4. The power conversion device for a railway vehicle according to claim 1, wherein the first semiconductor module is a module accommodating a plurality of switching elements that generate heat due to power conversion.

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