Photoresist underlayer compositions and methods for forming electronic devices

Abstract

To provide a photoresist underlayer composition and a method for forming an electronic device.SOLUTION: Provided is a photoresist underlayer composition comprising: a curable compound including a group represented by the following formula (1) (where each R1 is independently H, C1-30 alkyl or C3-30 cycloalkyl; Ar1 is an aromatic ring or condensed aromatic ring system having 5 to 30 C atoms, Ar1 being substituted or unsubstituted; Ar2 is an aromatic ring selected from a 6-membered carbocyclic aromatic ring, a 5- or 6-membered heteroaromatic ring, or a condensed aromatic ring system having 5 to 30 C atoms, and Ar2 optionally containing a condensed cyclic imide moiety, a condensed oxazole moiety, a condensed imidazole moiety, or a condensed thiazole moiety); and a solvent.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates generally to the field of electronic device manufacturing, and more specifically to the field of photoresist underlayer compositions for use in the manufacture of electronic devices such as semiconductor devices. [Background technology]

[0002] It is well known in lithography processes that when a resist pattern is relatively tall relative to its width (high aspect ratio), the resist pattern can collapse due to surface tension from the developer used. Multilayer resist processes (e.g., 3- and 4-layer processes) have been devised that can address this problem of pattern collapse when a high aspect ratio is desired. Such multilayer processes use a resist top layer, one or more intermediate layers, and a bottom layer (i.e., underlayer). In such multilayer resist processes, the top photoresist layer is typically imaged and developed to provide a resist pattern. The pattern is then typically transferred to one or more intermediate layers by etching. Each intermediate layer is selected to use a different etch process, e.g., a different plasma etch. Finally, the pattern is typically transferred to an underlayer by etching. Such intermediate layers can be composed of a variety of materials, typically having antireflective properties, while underlayer materials are typically composed of high-carbon content materials. The underlayer materials are typically selected to provide desired antireflective properties, planarization properties, and etch selectivity.

[0003] Current technologies for underlayer formation include chemical vapor deposition (CVD) carbon and solution-processed high-carbon content polymers. CVD materials have several significant limitations, such as high cost of ownership, an inability to form a planarizing layer over topography on the substrate, and high absorbance at 633 nm, which is used for pattern alignment. For these reasons, the industry is moving toward solution-processed high-carbon content materials for underlayers. Typically, it is desirable for the underlayer material to have the following properties: the ability to be cast onto a substrate by spin coating to form a uniform coating; thermally cure upon heating with low outgassing and sublimation; soluble in common processing solvents for good equipment compatibility; suitable optical properties (e.g., n and k values) to work in conjunction with silicon hard masks and back surface antireflective coefficient (BARC) layers currently used to impart the low reflectivity required for photoresist imaging; high carbon content for reduced etch rate; low to medium temperature cure; thermally stable up to over 400°C to avoid damage during subsequent processing; good gap filling and planarization properties; and resistance to stripping by common solvents used in overcoated photoresists or other layers.

[0004] It is well known that relatively low molecular weight materials have relatively low viscosity and can flow into substrate features such as vias and trenches to provide a planarizing layer. The underlayer material should be capable of planarization with relatively low outgassing up to 400° C. For use as a high carbon content underlayer, it is desirable for any composition to be thermally cured upon heating.

[0005] (Patent Document 1) is C 5~6 Aromatic ring and C 9~30 an aromatic core selected from a fused aromatic ring system and at least two substituents of formula (1) attached to the aromatic core; [ka] (In the formula, Ar 1 is an aromatic ring or fused aromatic ring system having 5 to 30 carbons; Z is OR 1, protected hydroxyl, carboxyl, protected carboxyl, SR 1 , protected thiol, -OC(=O)-C 1~6 Alkyl, halogen and NHR 2 and each R 1 is H, C 1~10 Alkyl, C 2~10 Unsaturated hydrocarbyl and C 5~30 aryl; each R 2 is H, C 1~10 Alkyl, C 2~10 Unsaturated hydrocarbyl, C 5~30 Aryl, C(=O)-R 1 and S(=O)2-R 1 x is an integer from 1 to 4; and * indicates the point of attachment to the aromatic core. and three or more substituents of the formula: ##STR00001##

[0001] While the described photoresist underlayer compositions have beneficial properties, compositions that enable increased thermal stability at higher cure temperatures are becoming increasingly important. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] U.S. Patent Application Publication No. 2020 / 0142309A1 Summary of the Invention [Problem to be solved by the invention]

[0007] There is a need in the art for photoresist underlayer compositions useful in forming electronic devices and methods of using such compositions that address one or more problems associated with the prior art. [Means for solving the problem]

[0008] According to a first aspect of the present invention, an underlayer composition is provided, the underlayer composition comprising a compound represented by the following formula (1): [ka] (In the formula, R 1 are independently H, C 1~30 Alkyl or C 3~30 is cycloalkyl; Ar 1 is an aromatic ring or fused aromatic ring system having 5 to 30 carbon atoms, and Ar 1 is substituted or unsubstituted; Ar 2 is an aromatic ring selected from a 6-membered carbocyclic aromatic ring, a 5- or 6-membered heteroaromatic ring, or a fused aromatic ring system having 5 to 30 carbon atoms; Ar 2 optionally comprises a fused cyclic imide moiety, a fused oxazole moiety, a fused imidazole moiety, or a fused thiazole moiety, and Ar 2 is substituted or unsubstituted; Y 1 is a single covalent bond or -O-, -C(O)-, -C(O)O-, -S-, -S(O)2-, -N(R 2 )-, -C(O)N(R 2 )-, -C(O)N(R 2 )C(O)-, -(CH2) y - or a combination thereof, and R 2 is H, C 1~10 Alkyl, C 2~10 Unsaturated hydrocarbyl, C 5~30 Aryl, C(O)-R 3 or S(O)2-R 3 and R 3 is H, C 1~10 Alkyl, C 2~10 Unsaturated hydrocarbyl and C 5~30 aryl, and y is an integer from 1 to 6; x1 is an integer from 2 to 5; and * indicates a bonding site to a portion of the curable compound other than the group represented by formula (1), provided that two [ka] The group is Ar 1 On the condition that they are not in the ortho position to each other, ** indicates Ar 1(indicating the point of attachment to the aromatic ring carbon of and a solvent.

[0009] In accordance with a further aspect of the present invention, a coated substrate is provided, comprising: an electronic device substrate; a photoresist underlayer formed from a photoresist underlayer composition as described herein on a surface of the electronic device substrate; and a photoresist composition layer on the photoresist underlayer, which, in addition to its use as a photoresist underlayer, can function as a planarization layer, a gap fill layer, a protective layer, or a combination thereof.

[0010] According to a further aspect of the present invention, a method for forming an electronic device is provided. The method includes: (a) providing an electronic device substrate; (b) coating a layer of a photoresist underlayer composition as described herein on a surface of the electronic device substrate; and (c) curing the layer of photoresist underlayer composition to form a photoresist underlayer. In a further aspect, the method further includes: (d) forming a photoresist layer over the photoresist underlayer; (e) patternwise exposing the photoresist layer to activating radiation; (f) developing the exposed photoresist layer to form a pattern in the photoresist layer; and (g) transferring the pattern to the photoresist underlayer. In a further aspect, the method further includes coating one or more of a silicon-containing layer, an organic antireflective coating layer, or a combination thereof over the photoresist underlayer before step (d). In a further aspect, the method further includes transferring the pattern to one or more of a silicon-containing layer, an organic antireflective coating layer, or a combination thereof after step (f) and before step (g). In a further aspect, the method further comprises the steps of: (h) transferring the pattern to a layer of the electronic device substrate below the patterned photoresist underlayer; and (i) removing the patterned photoresist underlayer.

[0011] When an element is said to be "on" or "over" another element, it will be understood that it may be directly adjacent to the other element or that intervening elements may be present between them. In contrast, when an element is said to be "directly on" another element, there are no intervening elements present. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0012] It will also be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections are not intended to be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Thus, a first element, component, region, layer, or section discussed below could be referred to as a second element, component, region, layer, or section without departing from the teachings of the present invention.

[0013] As used throughout this specification, the following abbreviations shall have the following meanings unless the context clearly indicates otherwise: °C = degrees Celsius; g = grams; mg = milligrams; L = liters; mL = milliliters; Å = angstroms; nm = nanometers; μm = microns = micrometers; mm = millimeters; sec. = seconds; min. = minutes; hr. = hours; DI = deionized; and Da = Daltons. "Wt %" refers to weight percent based on the total weight of the referenced composition, unless otherwise specified.

[0014] Unless otherwise specified, "aliphatic," "aromatic," "alkyl," and "aryl" include heteroaliphatic, heteroaromatic, heteroalkyl, and heteroaryl, respectively. The terms "heteroaliphatic," "heteroaromatic," "heteroalkyl," "heteroaryl," etc. refer to aliphatic, aromatic, alkyl, and aryl groups, respectively, having one or more heteroatoms such as nitrogen, oxygen, sulfur, phosphorus, or silicon replacing one or more carbon atoms in the radical, as in, for example, an ether or thioether.

[0015] "Aliphatic" refers to open-chain (linear or branched) and cyclic aliphatic, unless otherwise specified. Aliphatic structures can be saturated (e.g., alkanes) or unsaturated (e.g., alkenes or alkynes). Aliphatic refers to aliphatic radicals, including aliphatic monoradicals, diradicals, and higher radicals. Unless otherwise specified, "aliphatic" includes "heteroaliphatic." In preferred embodiments, aliphatic radicals do not contain heteroatoms.

[0016] "Alkyl" refers to linear, branched, and cyclic alkyls unless otherwise specified. As used herein, "alkyl" refers to an alkane radical, including alkane monoradicals, diradicals (alkylenes), and higher radicals. Unless otherwise specified, "alkyl" includes "heteroalkyls." In preferred embodiments, alkyl radicals do not contain heteroatoms. When the number of carbons is not specified for any alkyl or heteroalkyl, 1 to 12 carbons are contemplated.

[0017] "Aromatic" and "aryl" include aromatic carbocycles and aromatic heterocycles. The terms "aromatic" and "aryl" refer to aromatic radicals, including monoradicals, diradicals (arylenes), and higher radicals. In preferred embodiments, the aromatic or aryl radical is an aromatic carbocycle.

[0018] Unless otherwise specified, "substituted" means that one or more of the hydrogens has been replaced with a halogen, C 1~6 Alkyl, Halo-C 1~6 Alkyl, C 1~6 Alkoxy, Halo-C 1~6 Alkoxy, C 5~30 Aryl and C 5~30 Aryloxy, preferably halogen, C 1~6 Alkyl, Halo-C 1~4 Alkyl, C 1~6 Alkoxy, Halo-C 1~4 Alkoxy and phenyl, more preferably halogen, C 1~6 Alkyl, C 1~6"Halo" refers to a moiety substituted with one or more non-hydrogen substituents selected from alkoxy, phenyl, and phenoxy. Unless otherwise specified, substituted moieties preferably have 1 to 3 substituents, more preferably 1 or 2 substituents. "Halo" refers to fluoro, chloro, bromo, and iodo.

[0019] "Oligomer" and "oligomeric" refer to low molecular weight polymers containing a small number of total units, e.g., 2-10, and capable of further curing. As used herein, the term "polymer" includes oligomers. The term "curing" refers to any process, such as polymerization or condensation, that increases the overall molecular weight of the coated underlayer material, removes solubility-promoting groups from the oligomer, or increases the overall molecular weight and removes solubility-promoting groups. "Curable" refers to any material that can be cured under certain conditions. As used herein, "gap" refers to any gap on a semiconductor substrate that is intended to be filled with the gap-fill composition.

[0020] The articles "a" and "an" refer to the singular and the plural. Unless otherwise stated, all amounts are percentages by weight and all ratios are by weight. All numerical ranges are inclusive and combinable in any order, except where it is clear that such numerical ranges are constrained to add up to 100%. DETAILED DESCRIPTION OF THE INVENTION

[0021] The photoresist underlayer composition of the present invention comprises a curable compound and a solvent. The curable compound has the following formula (1): [ka] (In the formula, R 1 are independently H, C 1~30 Alkyl or C 3~30 is cycloalkyl; Ar 1 is an aromatic ring or fused aromatic ring system having 5 to 30 carbon atoms, and Ar 1is substituted or unsubstituted; Ar 2 is an aromatic ring selected from a 6-membered carbocyclic aromatic ring, a 5- or 6-membered heteroaromatic ring, or a fused aromatic ring system having 5 to 30 carbon atoms; Ar 2 optionally comprises a fused cyclic imide moiety, a fused oxazole moiety, a fused imidazole moiety, or a fused thiazole moiety, and Ar 2 is substituted or unsubstituted; Y 1 is a single covalent bond or -O-, -C(O)-, -C(O)O-, -S-, -S(O)2-, -N(R 2 )-, -C(O)N(R 2 )-, -C(O)N(R 2 )C(O)-, -(CH2) y - or a combination thereof, and R 2 is H, C 1~10 Alkyl, C 2~10 Unsaturated hydrocarbyl, C 5~30 Aryl, C(O)R 3 or S(O)2R 3 and R 3 is H, C 1~10 Alkyl, C 2~10 Unsaturated hydrocarbyl and C 5~30 aryl, and y is an integer from 1 to 6; x1 is an integer from 2 to 5; and * indicates a bonding site to a portion of the curable compound other than the group represented by formula (1), provided that two [ka] The group is Ar 1 On the condition that they are not in the ortho position to each other, ** indicates Ar 1 (indicating the point of attachment to the aromatic ring carbon of Then, [ka] A group is defined herein as one or more "R 1 Also called an "alkynyl group."

[0022] Each R1 is H, C 1~6 Alkyl or C 3~14 Preferably, each R is independently selected from cycloalkyl. More preferably, each R 1 is H. Each Ar 1 are preferably independently selected from pyridine, benzene, naphthalene, acenaphthylene, quinoline, isoquinoline, fluorene, carbazole, anthracene, phenanthrene, pyrene, coronene, triphenylene, chrysene, phenalene, benz[a]anthracene, dibenz[a,h]anthracene, benzo[a]pyrene or pentacene, more preferably from benzene, naphthalene, anthracene, phenanthrene, pyrene, coronene, triphenylene, chrysene, phenalene, benz[a]anthracene, dibenz[a,h]anthracene and benzo[a]pyrene, even more preferably from benzene, naphthalene, anthracene, phenanthrene, pyrene, coronene, triphenylene, chrysene and phenalene, and most preferably from each Ar 1 is benzene or naphthalene.

[0023] Ar 2 is preferably selected from pyridine, benzene, naphthalene, acenaphthylene, quinoline, isoquinoline, fluorene, carbazole, anthracene, phenanthrene, pyrene, coronene, triphenylene, chrysene, phenalene, benz[a]anthracene, dibenz[a,h]anthracene, benzo[a]pyrene or pentacene, more preferably from benzene, naphthalene, anthracene, phenanthrene, pyrene, coronene, triphenylene, chrysene, phenalene, benz[a]anthracene, dibenz[a,h]anthracene and benzo[a]pyrene, even more preferably from benzene, naphthalene, anthracene, phenanthrene, pyrene, coronene, triphenylene, chrysene and phenalene, and most preferably from each Ar 2 is benzene or naphthalene. 1 and Ar 2 Optional substituents for include, for example, halogen, C 1~6 Alkyl, C 1~6Haloalkyl, C 1~6 Alkoxy, C 1~6 Includes haloalkoxy, phenyl and phenoxy.

[0024] Ar 2 is preferably a C having a single or fused ring system 6~50 Carbocyclic aromatic or C 2~50Heterocyclic aromatics. Suitable aromatic cores include, for example, those selected from pyridine, benzene, naphthalene, quinoline, isoquinoline, carbazole, anthracene, phenanthrene, pyrene, coronene, triphenylene, chrysene, phenalene, benz[a]anthracene, dibenz[a,h]anthracene, oxazole, isoxazole, thiazole, isothiazole, triazole and benzo[a]pyrene, more preferably from benzene, naphthalene, carbazole, anthracene, phenanthrene, pyrene, coronene, triphenylene, chrysene, phenalene, benz[a]anthracene, dibenz[a,h]anthracene and benzo[a]pyrene, even more preferably from benzene, naphthalene, anthracene, phenanthrene, pyrene, coronene, triphenylene, chrysene and phenalene. The aliphatic core can be substituted or unsubstituted, linear, branched or cyclic, and saturated or unsaturated (alkane, alkene, or alkyne). Suitable aliphatic and heteroaliphatic cores include, for example, those selected from methane, ethane, propane, butane, pentane, hexane, heptane, octane, nonane, decane, methylmethane, dimethylmethane, dimethyl ether, butene, butyne, dimethyl sulfide, trimethylamine, and tetramethylsilane, cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, cyclononane, cyclodecane, cyclopropene, cyclobutene, cyclopentene, cyclohexene, cycloheptene, 1,3-cyclohexadiene, 1,4-cyclohexadiene, 1,5-cyclooctadiene, norbornene, adamantane, tetrahydropyran, tetrahydrothiophene, pyrrolidine, tetrahydro-2H-pyran, tetrahydro-2H-thiopyran, piperidine, and dioxane. x1 is typically an integer from 2 to 4; more typically, x1=1.

[0025] R 1 Two of the alkynyl groups are typically meta to each other, such that two such groups are in the meta position relative to each other, such as Ar 1Typically, the R groups are on the same aromatic ring. The curable compound may contain one or more groups of formula (1). For example, the curable compound may contain 1 to 10 groups of formula (1), more typically 1 to 6, 1 to 4, or 2 to 4 groups of formula (1). When the curable compound contains multiple groups of formula (1), each R 1 , Ar 1 , Ar 2 , Y 1 and x1 may be independently selected.

[0026] In a preferred embodiment, the curable compound has the following formula (2): [ka] (In the formula, each R 1 , Ar 1 , Ar 2 , Y 1 and x1 are independently selected and are as described above with respect to formula (1); R 4 are independently H, C 1~30 Alkyl or C 3~30 cycloalkyl; x2 is an integer from 1 to 10; x3 is an integer from 0 to 5; and Y 2 is a single covalent bond or a group having a valence of x2 + x3) Y 2 is not particularly limited. When x2+x3=1, Y2 is a monovalent atom or a monovalent group, and when x2+x3=2 or more, Y2 is a single covalent bond or a linking group.

[0027] In one preferred embodiment, Y2 is a single covalent bond. In another preferred embodiment, Y2 is a divalent or trivalent linking group. Exemplary linking groups for Y2 include O, S, N(R 5 ) r , S(O), S(O)2, C(O), C(O)O, C(O)N(R 5 ), C(O)N(R 5 )C(O), CR 6 R 7, bis-imide moiety, bis-etherimide moiety, bis-ketoimide moiety, bis-benzoxazole moiety, bis-benzimidazole moiety, bis-benzothiazole moiety, C 1~30 Alkylene, C 3~30 Cycloalkylene, C 3~30 Heterocycloalkylene, C 6~30 Arylene, C 3~30 heteroarylene, and combinations thereof; R 5 is hydrogen, C 1~30 Alkyl, C 1~30 Heteroalkyl, C 3~30 Cycloalkyl, C 1~30 Heterocycloalkyl, C 2~30 Alkenyl, C 2~30 Alkynyl, C 6~30 Aryl, C 7~30 Aryl alkyl, C 7~30 Alkylaryl, C 2~30 Heteroaryl, C 3~30 Heteroarylalkyl, C 3~30 Alkylheteroaryl, **-C(=O)-C 5~30 Aryl or **-S(=O)2-C 5~30 aryl, ** is the point of attachment to N; r is 0 or 1; R 6 and R 7 is H, C 1~10 Alkyl and C 5~10 aryl; R 6 and R 7 can be taken together with the carbons to which they are attached to form a 5- or 6-membered ring which can be fused to one or more aromatic rings.

[0028] Y 2 =CR 6 R 7 In this case, a suitable linking group is represented by the following formula (A): [ka] (wherein * represents different Ar 2 (indicates the point of attachment to a group, etc.) The fluorenyl portion of Y 2 Suitable bis-imide moiety linking groups for are shown by formula (B) and formula (C), where Z 1 is a single covalent bond or C 5~30 Arylene, and * is a different Ar 2 Suitable bis-etherimide and bis-ketoimide moieties are of formula (C), where Z 1 are O or -C(=O)-, and * indicates different Ar 2 Suitable bis-benzoxazole, bis-benzimidazole and bis-benzthiazole moieties are of formula (D), where G is O, NH and S, respectively, and Z is O, NH and S, respectively. 2 is a single covalent bond or C 5~30 Arylene, and * is a different Ar 2 Indicates the point of attachment to a group, etc. [ka]

[0029] The curable compound typically has a weight average molecular weight (M) of 400 to 10,000 Daltons (Da), preferably 400 to 3000 Da, and more preferably 800 to 1500 Da. w The molecular weight is determined by gel permeation chromatography (GPC) using polystyrene standards.

[0030] Suitable hardenable compounds for use in the photoresist underlayer composition include, for example: [ka] [ka]

[0031] The curable compound may be present in the coating composition in a wide range, for example, from 1 to 100% by weight, more typically from 10 to 100%, 50 to 100%, 90 to 99% or 95 to 99% by weight, based on the total solids of the coating composition. It may be desirable for the curable compound to be present in a relatively small amount, for example, from 1 to 50% or 1 to 30% by weight, based on the total solids of the coating composition.

[0032] The curable compounds described above can be readily prepared by those skilled in the art using known synthetic techniques. For example, the compounds can be prepared by mixing reactants, such as an aryl halide or alkyl halide, with an aromatic alkyne, a suitable catalyst, such as a copper or palladium catalyst, a base, and a solvent. The solvent is typically an organic solvent, such as toluene, benzene, tetrahydrofuran, dioxane, or a combination thereof. The reaction is carried out at a temperature and for a time effective to induce reaction of the reactants in the reaction mixture to form the curable compound. The reaction temperature is typically 0 to 200°C, preferably 25 to 100°C. The reaction time is typically 5 minutes to 96 hours, preferably 2 to 24 hours. The product compound can be purified by techniques known in the art, such as column chromatography.

[0033] The underlayer composition includes one or more solvents to dissolve the components of the composition and facilitate its coating on a substrate. Preferably, the one or more solvents are selected from organic solvents conventionally used in the manufacture of electronic devices. Suitable organic solvents include hydrocarbons such as xylene, mesitylene, cumene, and limonene; ketones such as cyclopentanone, cyclohexanone (CHO), methyl ethyl ketone, and methyl-2-n-amyl ketone; alcohols such as 3-methoxybutanol, 3-methyl-3-methoxybutanol, 1-methoxy-2-propanol, and 1-ethoxy-2-propanol; ethers such as propylene glycol methyl ether (PGME), propylene glycol ethyl ether (PGEE), ethylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, propylene glycol dimethyl ether, diethylene glycol dimethyl ether, anisole, and ethoxybenzene; and propylene glycol monomethyl ether. Examples of suitable solvents include, but are not limited to, esters such as propylene glycol monoethyl ether acetate (PGMEA), propylene glycol monoethyl ether acetate, ethyl lactate (EL), methyl hydroxyisobutyrate (HBM), ethyl pyruvate, butyl acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, tert-butyl acetate, tert-butyl propionate, propylene glycol mono-tert-butyl ether acetate, and benzyl propionate; cyclic or acyclic carbonate esters such as propylene carbonate, dimethyl carbonate, ethylene carbonate, and diphenyl carbonate; lactones such as γ-butyrolactone (GBL); lactams such as N-methylpyrrolidone; and any combination of the foregoing. Among these, preferred solvents are PGME, PGEE, PGMEA, EL, HBM, CHO, GBL, and combinations thereof. The total solvent content (i.e., the cumulative solvent content of all solvents) in the Underlayer composition is 50 to 99 wt %, typically 80 to 99 wt %, and more typically 90 to 99 wt %, based on the Underlayer composition. The desired solvent content will depend, for example, on the desired thickness of the coated Underlayer and the coating conditions.

[0034] The present photoresist underlayer compositions may also include one or more coating additives typically used in such compositions, such as a hardener, a crosslinker, a surface leveling agent, a flow additive, etc. When used in the composition, the hardener is typically present in an amount of 1 to 20 wt %, preferably 1 to 3 wt %, based on total solids. When used, the crosslinker is typically present in an amount of 1 to 30 wt %, preferably 3 to 10 wt %, based on total solids. When used, the surface leveling agent is typically present in an amount of 0.01 to 5 wt %, preferably 0.01 to 1 wt %, based on total solids. When used, the flow additive is typically present in an amount of 0.01 to 5 wt %, preferably 0.01 to 3 wt %, based on total solids.

[0035] A hardener may optionally be used in the photoresist underlayer composition to aid in curing the composition after coating. A hardener is any component that causes the composition to harden on the surface of the substrate. Preferred hardeners are acids and thermal acid generators. Suitable acids include, but are not limited to, arylsulfonic acids such as p-toluenesulfonic acid, alkylsulfonic acids such as methanesulfonic acid, ethanesulfonic acid, and propanesulfonic acid, perfluoroalkylsulfonic acids such as trifluoromethanesulfonic acid, and perfluoroarylsulfonic acids. A thermal acid generator is any compound that liberates an acid upon exposure to heat. Thermal acid generators are well known in the art and are commonly available commercially, such as from King Industries, Norwalk, Connecticut. Exemplary thermal acid generators include, without limitation, amine-blocked strong acids such as amine-blocked dodecylbenzenesulfonic acid. It will also be appreciated by those skilled in the art that certain photoacid generators can liberate acid upon heating and function as thermal acid generators.

[0036] Any suitable crosslinker may be used in the present composition, provided that such crosslinker has at least two, and preferably at least three, moieties that can react with the present aromatic resin reaction product under suitable conditions, such as acidic conditions. Exemplary crosslinkers include novolac resins, epoxy-containing compounds, melamine compounds, guanamine compounds, isocyanate-containing compounds, benzocyclobutene, and the like, preferably epoxy, methylol, C1-C6 10 Alkoxymethyl and C2-C 10 The crosslinking agent may be any of the above-mentioned crosslinkers having two or more, preferably three or more, more preferably four substituents selected from acyloxymethyl. Suitable crosslinking agents are well known in the art and are commercially available from various sources. Examples of suitable crosslinking agents include those of formula (3), (4), (5) and (6). [ka]

[0037] The underlayer composition may optionally include one or more surface leveling agents (or surfactants). Any suitable surfactant may be used, but such surfactants are typically nonionic. Exemplary nonionic surfactants include those containing alkyleneoxy bonds, such as ethyleneoxy, propyleneoxy, or a combination of ethyleneoxy and propyleneoxy bonds.

[0038] The underlayer compositions of the present invention and films formed therefrom can exhibit beneficial properties in one or more of gap filling, surface planarization, thermal stability, solvent strip resistance, and film quality characteristics. The compositions preferably substantially fill, and more preferably completely fill, gaps in semiconductor substrates. Preferably, the gaps are substantially or completely void-free.

[0039] Photoresist underlayers prepared from the compositions described herein can be used in forming electronic devices according to a method comprising: (a) providing an electronic device substrate; (b) coating a layer of a photoresist underlayer composition as described herein on a surface of the electronic device substrate; and (c) curing the layer of photoresist underlayer composition to form a photoresist underlayer.

[0040] Suitable substrates onto which the Underlayer composition can be coated include electronic device substrates. A variety of electronic device substrates can be used in the present invention, including packaging substrates such as multichip modules; flat panel display substrates; integrated circuit substrates; substrates for light-emitting diodes (LEDs) such as organic light-emitting diodes (OLEDs); semiconductor wafers; polycrystalline silicon substrates; and the like, with semiconductor wafers being preferred. Such substrates are typically composed of one or more of silicon, polysilicon, silicon oxide, silicon nitride, silicon oxynitride, silicon germanium, gallium arsenide, aluminum, sapphire, tungsten, titanium, titanium-tungsten, nickel, copper, and gold. Suitable substrates can be in the form of wafers such as those used in the manufacture of integrated circuits, optical sensors, flat panel displays, integrated optical circuits, and LEDs. As used herein, the term "semiconductor wafer" is intended to encompass "semiconductor substrates," "semiconductor devices," and various packages for various levels of interconnection, such as single-chip wafers, multiple-chip wafers, packages for various levels, or other assemblies requiring solder connections. Such substrates can be of any suitable size. A preferred wafer substrate diameter is 200 mm to 300 mm, although wafers having smaller and larger diameters may be suitably used in accordance with the present invention. As used herein, the term "semiconductor substrate" includes any substrate having one or more layers or structures that may optionally contain active or operable portions of a semiconductor device. A semiconductor device refers to a semiconductor substrate upon which at least one microelectronic device has been or will be fabricated.

[0041] Optionally, a layer of adhesion promoter can be applied to the substrate surface prior to coating with the underlayer composition. If an adhesion promoter is desired, any suitable adhesion promoter for polymer films can be used, such as a silane, preferably an organosilane such as trimethoxyvinylsilane, triethoxyvinylsilane, or hexamethyldisilazane, or an aminosilane coupler such as gamma-aminopropyltriethoxysilane. Particularly suitable adhesion promoters include those sold under the names AP 3000, AP 8000, and AP 9000S, available from DuPont Electronics & Industrial (Marlborough, Massachusetts).

[0042] The present Underlayer composition can be coated onto an electronic device substrate by any suitable means, such as spin coating, slot die coating, doctor blading, curtain coating, roller coating, spray coating, dip coating, etc. Of these, spin coating is preferred. In a typical spin coating method, the present composition is applied to a substrate spinning at a speed of 500 to 4000 rpm for a period of 15 to 90 seconds to obtain a desired layer of the Underlayer composition on the electronic device substrate. It will be appreciated by those skilled in the art that the height of the Underlayer composition layer can be adjusted by varying the spin speed.

[0043] After being coated on the substrate, the Underlayer composition layer is optionally baked at a relatively low temperature to remove any organic solvents and other relatively volatile components from the layer. Typically, the substrate is baked at a temperature of 80 to 150°C, although other suitable temperatures can be used. Baking times are typically 10 seconds to 10 minutes, preferably 30 seconds to 5 minutes, although longer or shorter times can be used. When the substrate is a wafer, such a baking step can be carried out by heating the wafer on a hotplate. After solvent removal, a layer, film, or coating of the Underlayer coating composition on the substrate surface is obtained.

[0044] The layer is then sufficiently cured to form an aromatic photoresist underlayer under conditions such that the film does not intermix with subsequently applied coating layers, such as photoresists or other layers coated directly on the aromatic underlayer, while still maintaining the desired antireflective properties (n and k values) and etch selectivity of the underlayer film. The underlayer can be cured in an oxygen-containing atmosphere, such as air, or in an inert atmosphere, such as nitrogen, preferably in an oxygen-containing atmosphere. This curing step is preferably carried out in a hotplate-type apparatus, although oven curing can also be used. Typically, such curing is carried out by heating the underlayer to a cure temperature of 150°C or higher, preferably 170°C or higher, and more preferably 200°C or higher. The selected cure temperature and time should be sufficient to cure the aromatic underlayer. Suitable temperature ranges for curing the aromatic underlayer are 150-450°C, preferably 170-350°C, and more preferably 200-250°C. Such a curing step may take from 10 seconds to 10 minutes, preferably 1 to 3 minutes, and more preferably 1 to 2 minutes, although other suitable times may be used.

[0045] An initial bake step may not be necessary if the curing step is performed so that rapid release of solvent and curing of by-products do not impair the quality of the underlying film. For example, a ramp bake starting at a relatively low temperature and then gradually increasing to a temperature of 200°C or higher can produce acceptable results. In some cases, it may be worthwhile to use a multi-stage curing process, such as a two-stage process in which the first stage has a lower bake temperature of less than 150°C and the second stage has a higher bake temperature of 200°C or higher. A multi-stage curing process can facilitate uniform filling and planarization of existing substrate surface topography, such as filling trenches and vias.

[0046] After curing the underlayer, one or more processing layers, such as a photoresist, a silicon-containing layer, a hard mask layer, a back surface antireflective coating (i.e., BARC) layer, etc., can be coated on the cured underlayer. For example, a photoresist can be coated, such as by spin coating, directly onto the surface of a silicon-containing layer or other interlayer that resides directly on the resin underlayer, or alternatively, the photoresist can be coated directly onto the cured underlayer. Various photoresists can be suitable, including those used in 193 nm (ArF) lithography and EUV lithography, such as those sold under the Epic™ brand available from DuPont Electronics & Industrial (Marlborough, Massachusetts). Suitable photoresists can be either positive-acting or negative-acting. After coating, the photoresist layer is then imaged (exposed) using patterned activating radiation, and the exposed photoresist layer is then developed using an appropriate developer to provide a patterned photoresist layer. As used herein, references to exposing a photoresist layer to activating radiation indicate that the radiation can form a latent image in the photoresist layer. The photoresist layer can be exposed to activating radiation through a patterned photomask having optically opaque and optically transparent regions or by direct writing. The pattern is then transferred from the photoresist layer to an underlying layer by an appropriate etching technique. Typically, the photoresist is also removed during such an etching step. The pattern is then transferred to the substrate and the underlying layer is removed by an appropriate etching technique known in the art, such as plasma etching. After patterning the substrate, the underlying layer is removed using conventional techniques. The electronic device substrate is then processed according to conventional means.

[0047] The cured underlayer can be used as the bottom layer in a multi-layer resist process. In such a process, a layer of the underlayer composition is coated on a substrate and cured as described above. One or more intermediate layers are then coated on the aromatic underlayer. For example, a silicon-containing layer or hard mask layer can be coated directly on the aromatic underlayer. An exemplary silicon-containing layer, such as a silicon-BARC, can be deposited by spin-coating on the underlayer and subsequently curing, or an inorganic silicon layer, such as SiON or SiO, can be deposited on the underlayer by chemical vapor deposition (CVD). Any suitable hard mask can be used, deposited on the underlayer by any suitable technique, and optionally cured. Optionally, an organic BARC layer can be placed directly on the silicon-containing layer or hard mask layer and appropriately cured. Next, a photoresist, such as that used in 193 nm lithography, is coated directly on the silicon-containing layer (in a three-layer process) or directly on the organic BARC layer (in a four-layer process). The photoresist layer is then imaged (exposed) using patterned activating radiation, and the exposed photoresist layer is then developed using an appropriate developer to provide a patterned photoresist layer. The pattern is then transferred from the photoresist layer to the layer immediately below it using an appropriate etching technique known in the art, such as plasma etching. This results in a patterned silicon-containing layer in a three-layer process, and a patterned organic BARC layer in a four-layer process. When a four-layer process is used, the pattern is then transferred from the organic BARC layer to the silicon-containing layer or hard mask layer using an appropriate pattern transfer technique, such as plasma etching. After the silicon-containing layer or hard mask layer is patterned, the aromatic underlayer is then patterned using an appropriate etching technique, such as O2 or CF4 plasma. Any remaining patterned photoresist and organic BARC layer are removed during the etching of the aromatic underlayer.The pattern is then transferred to the substrate, such as by a suitable etching technique that removes any remaining silicon-containing or hard mask layers, followed by removal of any remaining patterned aromatic underlayer, to provide a patterned substrate.

[0048] The hardened underlayer of the present invention can also be used in a self-aligning double patterning process. In such a process, a layer of the underlayer composition is preferably coated onto a substrate by spin coating. Any remaining organic solvent is removed, and the underlayer composition layer is hardened to form a hardened underlayer. A suitable intermediate layer, such as a silicon-containing layer, is then coated onto the hardened underlayer. A layer of a suitable photoresist is then coated onto the intermediate layer, such as by spin coating. The photoresist layer is then patternwise imaged (exposed) to activating radiation, and the exposed photoresist layer is then developed using a suitable developer to provide a patterned photoresist layer. The pattern is then transferred from the photoresist layer to the intermediate layer and hardened underlayer by a suitable etching technique to expose portions of the substrate. Typically, the photoresist is also removed during such etching step. A conformal silicon-containing layer is then disposed over the patterned hardened underlayer and the exposed portions of the substrate. Such a silicon-containing layer is typically an inorganic silicon layer, such as SiON or SiO, conventionally deposited by CVD. Such conformal coating results in a silicon-containing layer on exposed portions of the substrate surface and on the underlying pattern. That is, such silicon-containing layer substantially covers the sides and top surface of the patterned underlying layer. The silicon-containing layer is then partially etched (deburred) to expose the top surface of the patterned polyarylene resin underlying layer and a portion of the substrate. After this partial etching step, the pattern on the substrate includes a plurality of features, each of which includes a line or post of the cured underlying layer, with the silicon-containing layer directly adjacent the side of each cured underlying feature, also referred to as a sidewall spacer. The hardened underlying layer is then removed, such as by etching, to expose the substrate surface that was underneath the cured underlying layer pattern, resulting in a patterned silicon-containing layer on the substrate surface, where such patterned silicon-containing layer is doubled (i.e., the lines and / or posts are doubled) compared to the patterned cured underlying layer.

[0049] In addition to their use in forming photoresist underlayers and patterns as described above, the underlayer compositions of the present invention are useful for forming planarizing layers, gap-filling layers, and protective layers in the manufacture of integrated circuits. When used as such layers, one or more intervening layers of material, such as silicon-containing layers, other aromatic resin layers, hard mask layers, etc., typically reside between the cured layer of the underlayer composition and any photoresist layer. Typically, such planarizing layers, gap-filling layers, and protective layers are ultimately patterned.

[0050] The following non-limiting examples illustrate the present invention. [Example]

[0051] Synthesis Examples Example 1 Bis(4-(3,5-dibromophenoxy)phenyl)methanone (10.91 g), cuprous iodide (0.46 g), and triethylamine (7.29 g) were added to 80 g of 1,4-dioxane at room temperature. The reaction mixture was purged with nitrogen for 1 hour. Bis(triphenylphosphine)palladium(II) chloride (1.12 g) was added to the reaction mixture, and the mixture was heated to 70° C. Ethynyltrimethylsilane (11.53 g) was slowly added to the reaction mixture using an addition funnel. The reaction mixture was then stirred overnight at 70° C. under nitrogen. After completion of the reaction, the reaction mixture was cooled to room temperature, filtered, and the solvent was evaporated. The resulting residue was then dissolved in THF (100 g). Potassium carbonate (11.40 g), methanol (100 g), and water (10 g) were added, and the reaction mixture was stirred overnight at room temperature. The solvent was removed, and water (100 mL) was added. The mixture was extracted three times with ethyl acetate, and the combined organic phase was washed with water, washed with brine, and then dried over NaSO. The solvent was removed under reduced pressure, and the residue was purified by column chromatography to give bis(4-(3,5-diethynylphenoxy)phenyl)methanone (compound I-1) as a white solid (5.99 g, 81% yield). [ka]

[0052] Example 2 5,5'-((sulfonylbis(4,1-phenylene))bis(oxy))bis(1,3-dibromobenzene) (11.49 g), cuprous iodide (0.46 g), and triethylamine (7.29 g) were added to 80 g of 1,4-dioxane at room temperature. The reaction mixture was purged with nitrogen for 1 hour. Bis(triphenylphosphine)palladium(II) chloride (1.12 g) was added to the reaction mixture, and the mixture was heated to 70°C. Ethynyltrimethylsilane (11.53 g) was slowly added to the reaction mixture using an addition funnel. The reaction mixture was then stirred overnight at 70°C under nitrogen. After the reaction was complete, the reaction mixture was cooled to room temperature, filtered, and the solvent was evaporated. The resulting residue was then dissolved in THF (100 g). Potassium carbonate (11.40 g), methanol (100 g), and water (10 g) were added, and the reaction mixture was stirred overnight at room temperature. The solvent was removed, and water (100 mL) was added. The mixture was extracted three times with ethyl acetate, and the combined organic phases were washed with water, washed with brine, and then dried over Na2SO4. The solvent was removed under reduced pressure, and the residue was purified by column chromatography to give 5,5'-((sulfonylbis(4,1-phenylene))bis(oxy))bis(1,3-diethynylbenzene) (compound I-2) as a white solid (6.06 g, 76% yield). [ka]

[0053] Example 3 9,9-Bis(4-(3,5-dibromophenoxy)phenyl)-9H-fluorene (13.09 g), cuprous iodide (0.46 g), and triethylamine (7.29 g) were added to 80 g of 1,4-dioxane at room temperature. The reaction mixture was purged with nitrogen for 1 hour. Bis(triphenylphosphine)palladium(II) chloride (1.12 g) was added to the reaction mixture, and the mixture was heated to 70°C. Ethynyltrimethylsilane (11.53 g) was slowly added to the reaction mixture using an addition funnel. The reaction mixture was then stirred overnight at 70°C under nitrogen. After the reaction was complete, the reaction mixture was cooled to room temperature, filtered, and the solvent was evaporated. The resulting residue was then dissolved in THF (100 g). Potassium carbonate (11.40 g), methanol (100 g), and water (10 g) were added, and the reaction mixture was stirred overnight at room temperature. The solvent was removed, and water (100 mL) was added. The mixture was extracted three times with ethyl acetate, and the combined organic phase was washed with water, washed with brine, and then dried over Na2SO4. The solvent was removed under reduced pressure, and the residue was purified by column chromatography to obtain 9,9-bis(4-(3,5-diethynylphenoxy)phenyl)-9H-fluorene (compound I-3) as a white solid (7.47 g, 78% yield). [ka]

[0054] Example 4 4,4'-(oxybis(4,1-phenylene))bis(2,3,5-triphenylcyclopenta-2,4-dien-1-one) (7.83 g), 1,3,5-triethynylbenzene (3.75 g), and gamma-butyrolactone (50.36 g) were added to a 500 mL flask. The mixture was stirred at 120 °C for 6 hours under nitrogen. After completion of the reaction, the reaction mixture was cooled to room temperature, precipitated in 100 mL of water, and filtered. The residual solid was purified by column chromatography to give compound I-4 as a pale yellow solid (3.50 g, 34% yield) and compound I-5 as a pale yellow solid (2.06 g, 20% yield). [ka]

[0055] Example 5 (Comparative) A mixture of 4,4'-(oxybis(4,1-phenylene))bis(2,3,5-triphenylcyclopenta-2,4-dien-1-one) and 1,3,5-tris(phenylethynyl)benzene in a molar ratio of 1:1.08 and a concentration of 30-40 wt% solids in gamma-butyrolactone was heated to a target temperature of 200 °C until a Mw of 8800 Da was obtained (approximately 10-15 h). The reactor was then cooled to 120 °C to stop further reaction. Cyclohexanone was added to dilute the polyarylene polymer to form a stock solution. 1 L of the stock solution was added to 10 L of isopropanol over 30 minutes. The solution was then stirred for 1 hour, and the resulting precipitate was filtered, washed twice with 1 L of IPA, air-dried, and vacuum-dried at 50 °C to yield 327.3 g of oligomeric compound I-6 (comparison). [ka]

[0056] Example 6 (Comparative) 4-Iodophenylacetate (24.75 g), cuprous iodide (0.17 g), and triethylamine (27.32 g) were added to 22.82 g of 1,4-dioxane at room temperature. The reaction mixture was purged with nitrogen for 1 hour. Bis(triphenylphosphine)palladium(II) chloride (0.63 g) was added to the reaction mixture, and the mixture was heated to 70°C. A solution of 1,3,5-triethynylbenzene (4.5 g) in degassed 1,4-dioxane (20 g) was then slowly added to the reaction mixture via syringe pump. After the addition was complete, the reaction was stirred overnight at 70°C under nitrogen. After the reaction was complete, the reaction mixture was cooled to room temperature, and the solvent was evaporated. The residue was diluted with ethyl acetate and filtered to remove solids. The solution was evaporated, and the residue was purified by column chromatography to give a pale yellow solid. The resulting solid was then dissolved in THF (38 g) under nitrogen. Lithium hydroxide monohydrate (3.81 g) and water (16 g) were added, and the mixture was stirred at 60° C. for 1 hour. The mixture was then cooled to room temperature, and the solvent was removed. The residue was diluted with ethyl acetate and water and then treated with hydrochloric acid until the pH of the aqueous layer reached 1. The organic phase was separated, and the aqueous phase was extracted with ethyl acetate. The organic layers were combined and washed with water. The solvent was removed under reduced pressure, and the residue was purified by column chromatography to give 7.7 g (61% yield) of 1,3,5-tris((4-hydroxyphenyl)ethynyl)benzene compound I-7 (comparison) as a pale yellow solid. [ka]

[0057] Solubility evaluation Examples 7 to 13 The curable compounds prepared in the synthesis examples above, including any solvents added during the example description, were diluted with PGME or PGMEA to 5 wt. % solids based on the total weight of the mixture. The resulting mixtures were shaken and then visually inspected. The mixtures were also tested using a turbidity meter (Orbeco-Hellige Co). If the turbidity value was 1.00 or less, the compound was rated as soluble ("S"). If the turbidity value was greater than 1.00, the compound was rated as not soluble ("NS"). The results of the turbidity measurements are reported in Table 1.

[0058] [Table 1]

[0059] Thermal stability evaluation Examples 14 to 20 The thermal stability of curable compounds I-1 to I-7 was evaluated using a TA-Instruments Q500 Thermal Gravimetric Analyzer under the following conditions: air atmosphere, 10°C / min temperature ramp from room temperature to 700°C. The temperature at which the material lost 5% of its weight ("Td 5% The results are shown in Table 2.

[0060] [Table 2]

[0061] Lower layer composition preparation Examples 21 to 27 The materials shown in Table 3 were combined to form an Underlayer composition with a solids content of approximately 4.5 wt %, and the dilution of each solution was adjusted for a target coated film thickness (after curing) of 100 nm.

[0062] [Table 3]

[0063] Solvent peel resistance evaluation Examples 28 to 34 The Underlayer compositions were spin-coated onto each 200 mm silicon wafer using an ACT-8 Clean Track (Tokyo Electron Limited) at 1500 ± 200 rpm and then cured to form films at the temperatures and times shown in Table 4. The initial film thicknesses were measured using a Therma-Wave OptiProbe™ metrology tool. A PGME / PGMEA (70 / 30 by weight) release agent was then applied to each of the films for 90 seconds, followed by a post-release bake in air at 105°C for 60 seconds. The thickness of each film was remeasured to determine the amount of film thickness lost. The difference in film thickness before and after contact with the release agent is reported in Table 4 as the percentage of film thickness remaining on the wafer (% Film Remaining). This value indicates the degree of crosslinking of the polymer layer.

[0064] [Table 4]

[0065] Gap filling and planarization evaluation Examples 33 to 36 The gap-filling and planarization performance of the underlayer compositions of the present invention was evaluated using 2 x 2 inch silicon substrates with various patterned features. The features were formed in a 100 nm thick PECVD silicon oxide layer coated on the substrate. Prior to coating the underlayer composition, the substrates underwent a dehydration bake at 150°C for 60 seconds. The underlayer compositions were coated on each substrate individually using an ACT-8 Clean Track (Tokyo Electron Limited) at 1500 ± 200 rpm to achieve a target film thickness after curing of approximately 100 nm. The coated compositions were cured on a hotplate under the temperature and time conditions shown in Table 5. Cross-sectional images were taken with a Hitachi High-Tech S4800 CD-SEM.

[0066] Gap-filling performance was evaluated by visual inspection of a 45 nm 1:1 line / space (groove) pattern overcoated with an underlayer using SEM images. Gap-filling performance was considered "good" if no voids or bubbles were observed in the groove pattern and "poor" if any voids or bubbles were observed. The planarization performance of the underlayer composition was evaluated from the SEM images using Hitachi offline CD measurement software by measuring the difference in underlayer thickness (ΔFT) in the deep groove pattern and open areas of the film. Underlayers with a ΔFT of less than 30 nm were considered to have "good" planarization, while those with a ΔFT of 30 nm or greater were considered to have "poor" planarization. The results are shown in Table 5.

[0067] [Table 5]

Claims

1. 1. A photoresist underlayer composition comprising: The following formula (1): 【Chemistry 1】 (In the formula, R １ are each independently H, C １～３０ Alkyl or C ３～３０ is cycloalkyl; Ar １ is an aromatic ring or fused aromatic ring system having 5 to 30 carbon atoms, and Ar １ is substituted or unsubstituted; Ar ２ is an aromatic ring selected from a 6-membered carbocyclic aromatic ring, a 5- or 6-membered heteroaromatic ring, or a fused aromatic ring system having 5 to 30 carbon atoms; Ar ２ optionally comprises a fused cyclic imide moiety, a fused oxazole moiety, a fused imidazole moiety, or a fused thiazole moiety, and Ar ２ is substituted or unsubstituted; Y １ is a single covalent bond or —O—, —C(O)—, —C(O)O—, —S—, —S(O) ２ -, -N(R ２ )-, -C(O)N(R ２ )-, -C(O)N(R ２ )C(O)-,-(CH ２ ) ｙ - or a combination thereof, R ２ is C １～１０ Alkyl, C ２～１０ Unsaturated hydrocarbyl, C ５～３０ Aryl, C(O)R ３ or S(O) ２ R ３ and R ３ is H, C １～１０ Alkyl, C ２～１０ Unsaturated hydrocarbyl and C ５～３０ aryl, and y is an integer from 1 to 6; x １ is an integer from 2 to 5; and * indicates a bonding site to a portion of the curable compound other than the group represented by formula (1), However, two 【Chemistry 2】 The group is Ar １ On the condition that they are not in the ortho position to each other, ** is Ar １ (indicating the point of attachment to the aromatic ring carbon) and a curable compound comprising a group of The method includes the steps of: a first organic solvent; and a second organic solvent different from the first organic solvent, wherein the first organic solvent has a boiling point of less than 200°C; and the second organic solvent has a boiling point of 200°C or higher.

1. A photoresist underlayer composition comprising:

2. Ar １ 2. The photoresist underlayer composition of claim 1, wherein is pyridine, benzene, naphthalene, acenaphthylene, quinoline, isoquinoline, fluorene, carbazole, anthracene, phenanthrene, pyrene, coronene, triphenylene, chrysene, phenalene, benz[a]anthracene, dibenz[a,h]anthracene, benzo[a]pyrene, or pentacene.

3. Ar １ is C ６ The photoresist underlayer composition of claim 1 which is a carbocyclic aromatic ring.

4. R １ The photoresist underlayer composition of claim 1 , wherein: is H.

5. The curable compound has the following formula (2): 【Transformation 3】 (In the formula, R １ and R ４ are each independently H, C １～３０ Alkyl or C ３～３０ is cycloalkyl; Ar １ are each independently an aromatic ring or fused aromatic ring system having 5 to 30 carbon atoms; Ar １ is substituted or unsubstituted; Ar ２ are each independently an aromatic ring selected from a 6-membered carbocyclic aromatic ring, a 5- or 6-membered heteroaromatic ring, or a fused aromatic ring system having 5 to 30 carbon atoms; Ar ２ optionally includes a fused cyclic imide moiety, and Ar ２ is substituted or unsubstituted; Y １ are each independently a single covalent bond, or —O—, —C(O)—, —C(O)O—, —S—, or —S(O) ２ -, -N(R ２ )-, -C(O)N(R ２ )-, -C(O)N(R ２ )C(O)-,-(CH ２ ) ｙ - or combinations thereof, and R ２ is C １～１０ Alkyl, C ２～１０ Unsaturated hydrocarbyl, C ５～３０ Aryl, C(O)R ３ or S(O) ２ R ３ and R ３ is H, C １～１０ Alkyl, C ２～１０ Unsaturated hydrocarbyl and C ５～３０ aryl, and y is an integer from 1 to 6; x １ is an integer from 1 to 5, However, x １ is at least one 【Chemistry 4】 is an integer from 2 to 5 for the group, and two 【Transformation 5】 The group is Ar １ On the condition that they are not in the ortho position to each other, ** is Ar １ indicates the point of attachment to the aromatic ring carbon; x ２ is an integer from 1 to 5; x ３ is an integer from 0 to 5; and Y ２ is a single covalent bond, or x ２ +x ３ 10. The photoresist underlayer composition of claim 1, wherein:

6. 10. The photoresist underlayer composition of claim 1 further comprising a hardener, a surface leveling agent, or a flow additive.

7. The photoresist underlayer composition of claim 1 further comprising a polymer.

8. The photoresist underlayer composition of claim 1 further comprising a crosslinker.

9. A coated substrate, an electronic device substrate; a photoresist underlayer formed from the photoresist underlayer composition of any one of claims 1 to 8 on a surface of the electronic device substrate; a photoresist composition layer over the photoresist underlayer; A coated substrate comprising:

10. 1. A method of forming an electronic device, comprising: (a) providing an electronic device substrate; (b) coating a layer of the photoresist underlayer composition of any one of claims 1 to 8 on the surface of the electronic device substrate; (c) curing the layer of the photoresist underlayer composition to form a photoresist underlayer; A method comprising:

11. (d) forming a photoresist layer over the photoresist underlayer; (e) patternwise exposing the photoresist layer to activating radiation; (f) developing the exposed photoresist layer to form a pattern in the photoresist layer; (g) transferring the pattern into the photoresist underlayer; The method of claim 10 further comprising:

12. 12. The method of claim 11, further comprising coating one or more of a silicon-containing layer, an organic anti-reflective coating layer, or a combination thereof over the photoresist underlayer before step (d).

13. 13. The method of claim 12, further comprising, after step (f) and before step (g), transferring the pattern to the one or more of the silicon-containing layer, the organic antireflective coating layer, or the combination thereof.

14. (h) transferring the pattern to a layer of the electronic device substrate beneath the patterned photoresist underlayer; (i) removing the patterned photoresist underlayer; The method of claim 11 further comprising:

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