In-vehicle sensor device

Abstract

To provide an in-vehicle sensor device which can make it easier for a sound vibration sensor to be equipped into a vehicle.SOLUTION: An in-vehicle sensor device 100 is equipped in a vehicle Ve and includes an ultrasonic microphone 20, a sensor housing 30, and a sound vibration sensor 70. The ultrasonic microphone 20 has a sending-receiving unit 24 for sending or receiving ultrasonic sounds. A sensor housing 30 stores at least a part of the ultrasonic microphone 20. The sound vibration sensor 70 is stored in the sensor housing 30 with the ultrasonic microphone 20 and can detect sounds or vibrations in an audible region.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The disclosure in this specification relates to an on-board sensor device mounted on a vehicle. [Background technology]

[0002] Patent Document 1 describes a transducer array mounted on a vehicle, which transmits and receives acoustic signals such as ultrasonic waves, enabling the measurement of the distance between the vehicle and surrounding objects. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2016 / 184603 Summary of the Invention [Problem to be solved by the invention]

[0004] Acoustic signals include not only ultrasonic waves as disclosed in Patent Document 1, but also sounds and vibrations in the audible range. The installation of a sound vibration sensor that detects such sounds or vibrations in the audible range in a vehicle is being considered. However, when a sound vibration sensor is installed in a vehicle in addition to an ultrasonic sensor as disclosed in Patent Document 1, the installation can be difficult due to the complexity of the configuration.

[0005] The present disclosure aims to provide an in-vehicle sensor device that can easily mount a sound vibration sensor on a vehicle. [Means for solving the problem]

[0006] In order to achieve the above object, one disclosed aspect is an on-board sensor device mounted on a vehicle (Ve), comprising: an ultrasonic sensor (20) having a transceiver (24) that receives and / or transmits ultrasonic waves; a sensor housing (30) that houses at least a portion of the ultrasonic sensor; and a sound vibration sensor (70) that is housed in the sensor housing together with the ultrasonic sensor and detects sound or vibration in the audible range. The sound vibration sensor is disposed separately from the transceiver on the rear side (BS) of the transceiver, and the sensor housing defines a hollow space (58) between the sound vibration sensor and the transceiver. It is said to be an in-vehicle sensor device. Another disclosed embodiment is an on-board sensor device mounted on a vehicle (Ve), comprising: an ultrasonic sensor (20) having a transceiver (24) that receives and / or transmits ultrasonic waves; a sensor housing (30) that houses at least a portion of the ultrasonic sensor; and a sound vibration sensor (70) that is housed in the sensor housing together with the ultrasonic sensor and detects sound or vibration in the audible range, wherein the ultrasonic sensor defines a hollow space (220) facing the transceiver on the rear side of the transceiver, the sensor housing supports the ultrasonic sensor in a state that allows displacement due to sound or vibration in the audible range, and a compression section (240) is provided inside the sensor housing that compresses the hollow space due to displacement of the ultrasonic sensor, and the transceiver is an on-board sensor device that is shared with the sound vibration sensor.

[0007] child Rera In this aspect, the sensor housing for the ultrasonic sensor also houses a sound vibration sensor that detects sound or vibration. Therefore, by installing the ultrasonic sensor in a vehicle, it is possible to install the sound vibration sensor in the vehicle as well. As a result, the configuration can be simplified compared to an aspect in which the sound vibration sensor is installed in a vehicle as a separate structure from the ultrasonic sensor. Therefore, it is easy to install the sound vibration sensor in a vehicle.

[0008] It should be noted that the reference numbers in parentheses above and in the claims merely indicate an example of the correspondence with the specific configurations in the embodiments described below, and do not limit the technical scope in any way. Furthermore, claims not explicitly stated in the claims may be combined together if no particular problems arise in the combination. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a diagram illustrating an example of a location where an in-vehicle sensor device according to the present disclosure is installed; [Figure 2] 1 is a longitudinal cross-sectional view showing a configuration of an on-vehicle sensor device according to a first embodiment of the present disclosure. [Figure 3] 1 is a diagram showing the electrical configuration of an object detection system including an on-vehicle sensor device and an ECU. [Figure 4] 10A and 10B are diagrams for explaining a method of attaching an on-board sensor device to a vehicle. [Figure 5] FIG. 4 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a second embodiment of the present disclosure. [Figure 6] FIG. 10 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a third embodiment of the present disclosure. [Figure 7] FIG. 10 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a fourth embodiment of the present disclosure. [Figure 8] FIG. 10 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a fifth embodiment of the present disclosure. [Figure 9] FIG. 10 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a sixth embodiment of the present disclosure. [Figure 10] FIG. 10 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a seventh embodiment of the present disclosure. [Figure 11] FIG. 13 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to an eighth embodiment of the present disclosure. [Figure 12] FIG. 13 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a ninth embodiment of the present disclosure. [Figure 13] FIG. 10 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a tenth embodiment of the present disclosure. [Figure 14] FIG. 23 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to an eleventh embodiment of the present disclosure. [Figure 15] FIG. 29 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a twelfth embodiment of the present disclosure. [Figure 16] FIG. 29 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a thirteenth embodiment of the present disclosure. [Figure 17] FIG. 29 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a fourteenth embodiment of the present disclosure. [Figure 18] FIG. 23 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a fifteenth embodiment of the present disclosure. [Figure 19] FIG. 26 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a sixteenth embodiment of the present disclosure. [Figure 20] FIG. 23 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a seventeenth embodiment of the present disclosure. [Figure 21] FIG. 26 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to an eighteenth embodiment of the present disclosure. [Figure 22]FIG. 26 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a nineteenth embodiment of the present disclosure. [Figure 23] FIG. 10 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a twentieth embodiment of the present disclosure. [Figure 24] FIG. 21 is a longitudinal cross-sectional view showing the configuration of an on-vehicle sensor device according to a twenty-first embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, several embodiments will be described with reference to the drawings. Note that corresponding components in each embodiment are given the same reference numerals, and redundant description may be omitted. When only a portion of the configuration is described in each embodiment, the configuration of another embodiment described previously can be applied to the remaining portion of the configuration. Furthermore, in addition to the combinations of configurations explicitly stated in the description of each embodiment, configurations of several embodiments can also be partially combined together even if not explicitly stated, as long as there is no particular problem with the combination.

[0011] [Installation location of acoustic sensor device] An on-vehicle sensor device 100 according to the present disclosure is mounted on a vehicle Ve, as shown in Figures 1 and 2. The on-vehicle sensor device 100 can be installed in various locations on the vehicle Ve, such as the front, side, and rear of the vehicle. The on-vehicle sensor device 100 is held in a plate-shaped external structure 10 of the vehicle Ve, with the ultrasonic transmission / reception surface 24a exposed on the outer surface.

[0012] The external structure 10 on the front of the vehicle is, for example, a front bumper center portion Pf1 and a front bumper corner portion Pf2, etc. The on-vehicle sensor device 100 installed on the external structure 10 on the front of the vehicle is oriented with the transmitting / receiving surface 24a facing the front Ze of the vehicle Ve, and is used to detect targets outside the vehicle Ve, mainly in the front Ze.

[0013] The external structure 10 on the side of the vehicle is, for example, a front bumper side portion Ps1, a rear bumper side portion Ps2, a side mirror cover Ps3, a side step Ps4, etc. The on-vehicle sensor device 100 installed on the external structure 10 on the side of the vehicle is oriented with the transmitting / receiving surface 24a facing the right Mi or left Hi of the vehicle Ve, and is used to detect targets outside the vehicle Ve, mainly on the sides.

[0014] The external structure 10 on the rear surface of the vehicle is, for example, a rear bumper center portion Pb1 and a rear bumper corner portion Pb2, etc. The on-vehicle sensor device 100 installed on the external structure 10 on the rear surface of the vehicle is oriented with the transmitting / receiving surface 24a facing the rear Go of the vehicle Ve, and is used to detect targets outside the vehicle Ve, mainly in the rear Go.

[0015] Here, the longitudinal direction and left-right direction in this disclosure are defined with reference to a vehicle Ve stationary on a horizontal plane. Specifically, the longitudinal direction (forward Ze and backward Go) is defined along the longitudinal direction (direction of travel) of the vehicle Ve. The left-right direction (right Mi and left Hi) is defined along the width direction of the vehicle Ve. Furthermore, the up-down direction (upward Ue) is defined along the vertical direction of the horizontal plane that defines the longitudinal direction and left-right direction. For simplicity of description, the following description may omit the reference symbols indicating each direction as appropriate.

[0016] (First embodiment) The on-vehicle sensor device 100 according to the first embodiment of the present disclosure shown in FIG. 2 includes an ultrasonic microphone 20 that receives and transmits ultrasonic waves, and a sound vibration sensor 70 that detects sounds or vibrations in the audible range. Ultrasonic waves are sound waves with high frequencies that are inaudible to the human ear, specifically, sound waves of 20 kHz or higher. The audible range is a frequency band lower than ultrasonic waves, specifically, the range from 20 Hz to 20 kHz. The on-vehicle sensor device 100, together with the external structure 10 and the adhesive layer 120, constitute an on-vehicle sensor installation structure.

[0017] The external structure 10 is, for example, a front bumper or rear bumper, and is formed in the shape of a flat or slightly curved plate from a resin material such as polypropylene. The external structure 10 has a vehicle outer surface 11 that is exposed to the outside of the vehicle Ve, facing the front Ze, rear Go, or side of the vehicle Ve. The back side of the vehicle outer surface 11 of the external structure 10 forms a smooth vehicle inner surface 12 to which an adhesive layer 120 is attached. A mounting opening 15 is formed in the external structure 10. The mounting opening 15 is a flat through-hole that penetrates the external structure 10 in the plate thickness direction. The mounting opening 15 exposes the transmitting / receiving surface 24a of the on-vehicle sensor device 100 to the vehicle outer surface 11.

[0018] The adhesive layer 120 is formed of double-sided tape, an adhesive material, or the like. The adhesive layer 120 is formed as a thin film that is thinner than the external structure 10. Each surface of the adhesive layer 120 is bonded to the vehicle interior surface 12 and the in-vehicle sensor device 100, respectively. The adhesive layer 120 fixes the in-vehicle sensor device 100 to the vehicle interior surface 12.

[0019] In the following description, the direction in which the vehicle outer surface 11 and the transmitting / receiving surface 24a face is referred to as the front side FS, and the direction in which the vehicle inner surface 12 faces is referred to as the back side BS. The space in front of the external structure 10 is referred to as the outer space OS, the space in back of the vehicle sensor device 100 (rear cover 50) is referred to as the inner space IS, and the space around the vehicle sensor device 100 is referred to as the side space SS. The outer space OS is the space outside the vehicle from which ultrasonic waves and audible sounds arrive. The inner space IS is the space inside the vehicle Ve. The side space SS is the space located above, below, left, and right of the vehicle sensor device 100 along the vehicle inner surface 12.

[0020] [Configuration of on-board sensor device] The in-vehicle sensor device 100 is composed of an ultrasonic microphone 20, a sensor housing 30, a sound vibration sensor 70, a circuit board 80, and the like.

[0021] The ultrasonic microphone 20 is configured to be able to transmit and receive ultrasonic waves. The ultrasonic microphone 20 transmits ultrasonic probe waves toward the outside space OS. The ultrasonic microphone 20 receives probe waves (reflected waves) reflected by an object present in the outside space OS, and outputs a detection signal according to the reception result of the reflected waves. The ultrasonic microphone 20 includes a microphone housing 21, a piezoelectric element 25, and a microphone filler 27.

[0022] The microphone housing 21 is formed in a cylindrical shape with a bottom from a metal material such as aluminum. The microphone housing 21 has a receiving bottom 22 and a side wall 23. The receiving bottom 22 is formed in a thin plate shape at the bottom of the microphone housing 21. A piezoelectric element 25 is fixed to the inner surface of the receiving bottom 22. The receiving bottom 22 functions as a diaphragm and, together with the piezoelectric element 25, forms a transceiver 24 that receives and / or transmits ultrasonic waves. The outer surface of the receiving bottom 22 becomes a transmitting / receiving surface 24a exposed to the external space OS when attached to the external structure 10 of the on-vehicle sensor device 100. The side wall 23 is formed in a cylindrical shape that surrounds the periphery of the receiving bottom 22.

[0023] The piezoelectric element 25 is formed in a thin film shape. The piezoelectric element 25 is housed in the internal space of the microphone housing 21, which is partitioned (enclosed) by the receiving bottom 22 and the side wall 23. The piezoelectric element 25 is electrically connected to the circuit board 80 via the microphone lead wire 26. The piezoelectric element 25 generates minute vibrations based on an input electrical signal, enabling the transmitter / receiver 24 to transmit ultrasonic waves (probing waves). The piezoelectric element 25 converts the vibrations of ultrasonic waves (reflected waves) arriving at the transmitter / receiver 24 into electrical signals, thereby enabling the detection of the reflected waves.

[0024] The microphone filler 27 is filled into the internal space of the microphone housing 21 and is formed of silicone rubber, urethane foam, or the like that hardens within the internal space. The microphone filler 27 covers the transceiver 24 from the rear side BS and seals the piezoelectric element 25. The microphone filler 27, together with the end face of the rear side BS of the side wall portion 23, forms the rear surface of the ultrasonic microphone 20 (hereinafter referred to as the microphone rear surface 29).

[0025] The sensor housing 30 is a housing structure that houses an ultrasonic sensor, a sound vibration sensor 70, a circuit board 80, etc. The sensor housing 30 is made up of a housing main body 40, a rear cover 50, a retainer 60, etc.

[0026] The housing body 40 is formed in a box shape from a resin material such as polybutylene terephthalate (PBT), etc. The housing body 40 is formed with a housing peripheral wall 41, a middle partition wall 42, and a connector connection portion 48.

[0027] The housing peripheral wall 41 is formed in a cylindrical shape. The housing peripheral wall 41 has a microphone support portion 44, a cover fixing portion 45, and a board fixing portion 46. The microphone support portion 44 is formed on the inner peripheral surface of the housing peripheral wall 41 at a portion closer to the front side FS than the intermediate partition wall 42. The microphone support portion 44 supports the ultrasonic microphone 20 via a cushion portion 52 (described later). The cover fixing portion 45 is formed on the inner peripheral surface of the housing peripheral wall 41 at an end portion on the rear side BS. The cover fixing portion 45 holds the rear cover 50. The board fixing portion 46 is a stepped surface portion formed on the inner peripheral surface of the housing peripheral wall 41. The board fixing portion 46 is formed between the cover fixing portion 45 and the intermediate partition wall 42, facing the rear side BS. The board fixing portion 46 supports the circuit board 80 from the front side FS.

[0028] The intermediate partition wall 42 extends from the inner circumferential surface of the housing peripheral wall 41 toward the inner circumferential side of the housing peripheral wall 41. The intermediate partition wall 42 divides the internal space of the housing main body 40 into a microphone accommodating chamber 42a and a board accommodating chamber 42b. The microphone accommodating chamber 42a is defined on the front side FS of the intermediate partition wall 42. At least a portion of the ultrasonic microphone 20 is accommodated in the microphone accommodating chamber 42a. The board accommodating chamber 42b is defined on the back side BS of the intermediate partition wall 42. The circuit board 80 and the rear cover 50 are accommodated in the board accommodating chamber 42b. A connection opening 42c is further formed in the intermediate partition wall 42. The connection opening 42c is a flat through-hole that penetrates the intermediate partition wall 42 in the plate thickness direction. The connection opening 42c connects the microphone accommodating chamber 42a and the board accommodating chamber 42b to each other.

[0029] The connector connection portion 48 is provided at an end of the rear surface side BS of the housing peripheral wall 41. The connector connection portion 48 is provided in a cylindrical shape extending from the outer circumferential surface of the housing peripheral wall 41 along the vehicle interior surface 12. The connector connection portion 48 may be provided in an inclined position toward the rear surface side BS relative to the vehicle interior surface 12. Terminal pins and the like electrically connected to the circuit board 80 are exposed inside the connector connection portion 48. A connector 140 (see FIG. 4) for electrically connecting the circuit board 80 to an external ECU 90 (see FIG. 3) is connected to the connector connection portion 48.

[0030] In addition to the ultrasonic microphone 20, the sound vibration sensor 70, and the circuit board 80, the housing main body 40 further houses a cushion section 52, a damper section 53, a front filler 54, a rear filler 55, a viscoelastic tube 57, and a moisture absorbent 59.

[0031] The cushion portion 52 and the damper portion 53 elastically support the ultrasonic microphone 20 relative to the housing main body 40 so as to enable transmission of sound and vibration from the ultrasonic microphone 20 to an air layer 58 (described later). The cushion portion 52 is formed in a cylindrical shape (O-ring shape) from a fill-and-cure type silicone rubber or the like. The cushion portion 52 may be a member formed by injection molding. The cushion portion 52 is housed in the microphone housing chamber 42a. The cushion portion 52 is sandwiched between the microphone support portion 44 of the housing peripheral wall 41 and the side wall portion 23 of the microphone housing 21, and is disposed in a radially compressed (crushed) state.

[0032] The damper portion 53 is formed in the shape of a thick plate using sponge, foam rubber, or the like. A damper opening 53a is formed in the damper portion 53. The damper opening 53a is a through-hole that passes through the center of the damper portion 53 in the plate thickness direction. The damper portion 53 is located on the inner circumferential side of the cushion portion 52 and is housed in the microphone housing chamber 42a. The damper portion 53 is disposed between the intermediate partition wall 42 and the microphone back surface 29 in a state compressed in the plate thickness direction.

[0033] The front filler 54 and the rear filler 55 are filled in the substrate accommodating chamber 42b and are made of a viscoelastic material such as silicone rubber or urethane foam that hardens within the substrate accommodating chamber 42b. The front filler 54 and the rear filler 55 seal the sound vibration sensor 70, the circuit board 80, and other components. At least one of the front filler 54 and the rear filler 55 may be made of a porous, low-elasticity material such as sponge. The front filler 54 fills the substrate accommodating chamber 42b and the connection opening 42c, which are closer to the front side FS than the circuit board 80. The rear filler 55 fills the space closer to the rear side BS than the circuit board 80, in other words, the space between the circuit board 80 and the rear cover 50.

[0034] The viscoelastic tube 57 is formed into a cylindrical shape from a viscoelastic material such as silicone rubber. The viscoelastic tube 57 functions as a sound guide tube (acoustic path tube). An end of the viscoelastic tube 57 on the rear side BS contacts the front mounting surface 81 of the circuit board 80. An end of the viscoelastic tube 57 on the front side FS contacts the microphone rear surface 29 of the ultrasonic microphone 20. The viscoelastic tube 57 is arranged between the front mounting surface 81 and the microphone rear surface 29 in a state where it is slightly compressed in the axial direction.

[0035] The viscoelastic tube 57 is inside the housing peripheral wall 41 (front filler 54), and forms an air layer 58 on the front side FS (transmitter / receiver side) of the circuit board 80. The air layer 58 is a hollow space defined between the sound vibration sensor 70 and the transceiver 24. The air layer 58 (the air inside the air layer 58) transmits sound and vibrations arriving at the transceiver 24 from the microphone back surface 29 to the sound vibration sensor 70.

[0036] The moisture absorbent 59 is made of a porous material such as silica gel. The moisture absorbent 59 is disposed inside the air layer 58 and absorbs water vapor (moisture) generated inside the air layer 58. In other words, the moisture absorbent 59 suppresses the occurrence of condensation in the air layer 58. The moisture absorbent 59 may be attached to the microphone back surface 29 or the like, or may be applied to the microphone back surface 29 or the like. The amount of moisture absorbent 59 disposed inside the air layer 58 is determined according to the volume of the air layer 58, and the larger the volume of the air layer 58, the greater the amount of moisture absorbent 59.

[0037] The rear cover 50 is made of a resin material such as polypropylene. The rear cover 50 has a rectangular plate shape that is larger overall than the circuit board 80. The rear cover 50 is fitted into the cover fixing portion 45 while the rear filler 55 is crushed between the rear cover 50 and the circuit board 80. The rear cover 50 is joined to the cover fixing portion 45 by adhesion, welding, or the like. The rear filler 55 may function as an adhesive to fix the rear cover 50 to the housing main body 40. The rear cover 50 is located on the rear side BS of the circuit board 80 and the rear filler 55, and together with the housing main body 40, forms a sealed board accommodating chamber 42b.

[0038] The retainer 60 is formed in a flat, tubular shape with a flange from a resin material such as PBT. The retainer 60 is a member that holds the housing main body 40 relative to the external structure 10. The retainer 60 has a surrounding wall 61 that surrounds the housing main body 40 and a holding portion 62 that is held relative to the external structure 10. The surrounding wall 61 is formed thicker than the peripheral housing wall 41 of the housing main body 40. The surrounding wall 61 holds the housing main body 40 by being fitted onto the peripheral housing wall 41. A notch 61a is formed in the surrounding wall 61. The notch 61a is a missing portion provided in the surrounding wall 61 to avoid the connector connection portion 48 protruding toward the outer periphery of the housing main body 40. The holding portion 62 is a flange-shaped portion that protrudes toward the outer periphery from the end of the front side FS of the surrounding wall 61. The holding portion 62 is attached to the vehicle inner surface 12 via an adhesive layer 120 formed of double-sided tape, adhesive material, or the like.

[0039] The sound vibration sensor 70 is housed in the sensor housing 30 together with the ultrasonic microphone 20. The sound vibration sensor 70 is disposed on the rear side BS of the transceiver 24, separate from the transceiver 24. The sound vibration sensor 70 detects sounds or vibrations in the audible range. The sound vibration sensor 70 has a MEMS (Micro Electro Mechanical Systems) microphone 170.

[0040] The MEMS microphone 170 is a microphone element that converts audible sound or vibration into an electrical signal. The MEMS microphone 170 functions as a condenser microphone that outputs a change in capacitance of a thin diaphragm (membrane) that vibrates due to sound pressure as an electrical signal (detection signal). The MEMS microphone 170 is surface-mounted on the front mounting surface 81 of the circuit board 80. The MEMS microphone 170 is housed inside the viscoelastic tube 57 and is in contact with the air layer 58. The MEMS microphone 170 detects audible sound or vibration that arrives at the ultrasonic microphone 20 from outside the vehicle Ve and is transmitted to the air layer 58. Note that instead of the MEMS microphone 170, an electret condenser microphone or the like can be used as the audible sound microphone element of the sound vibration sensor 70.

[0041] The circuit board 80 is a glass epoxy board or the like, and has an overall rectangular plate shape. The circuit board 80 is accommodated in the board accommodation chamber 42b and fixed to the board fixing portion 46 in a position aligned with the receiving bottom portion 22. The circuit board 80 is attached to the board fixing portion 46 with double-sided tape, an adhesive, or the like. The circuit board 80 may be fixed to the housing main body 40 by using the rear filler 55 as an adhesive. Both surfaces of the circuit board 80 form a front mounting surface 81 and a rear mounting surface 82. The front mounting surface 81 is a mounting surface facing the front side FS. A MEMS microphone 170 is mounted on the front mounting surface 81. A microphone lead wire 26 drawn from the ultrasonic microphone 20 is connected to the front mounting surface 81. The rear mounting surface 82 is a mounting surface facing the rear side BS. Terminal pins and the like are connected to the rear mounting surface 82. A signal processing circuit 180 (see FIG. 3) electrically connected to the piezoelectric element 25 and the MEMS microphone 170 is formed on the circuit board 80.

[0042] [Electrical configuration of an object detection system using an on-board sensor device] The object detection system 190 is an in-vehicle system that detects the relative position, size, relative speed, etc. of targets existing around the vehicle Ve. The object detection system 190 includes a plurality of in-vehicle sensor devices 100 and an ECU 90. Details of the electrical configurations of the in-vehicle sensor devices 100 and the ECU 90 will be described below based on FIG. 3 and with reference to FIG. 2.

[0043] The in-vehicle sensor device 100 is connected to the ECU 90 and other in-vehicle sensor devices 100 by a plurality of external connection lines 85. Each external connection line 85 is formed by a wire harness or the like. In the in-vehicle sensor device 100, a connection line (hereinafter referred to as a first connection line) for electrically connecting the sound vibration sensor 70 to the ECU 90 is shared with a connection line (hereinafter referred to as a second connection line) for electrically connecting the ultrasonic microphone 20 to the ECU 90. That is, the external connection line 85 as the first connection line also serves as the second connection line; in other words, the external connection line 85 has the functions of both the first connection line and the second connection line.

[0044] The external connection lines 85 include a power supply line 86, a GND line 87, and a communication line 88. The power supply line 86 supplies a power supply voltage to each on-board sensor device 100. The GND line 87 supplies a ground voltage to each on-board sensor device 100. The communication line 88 forms a communication bus that realizes data communication between the on-board sensor device 100 and the ECU 90. A communication bus based on a data communication standard such as LIN, DSI3, or CAN (registered trademark) is used for the communication connection between the on-board sensor device 100 and the ECU 90. Note that a communication bus based on a high-speed serial communication standard such as LVDS, Ethernet (registered trademark), or A2B may also be used for the communication connection between the on-board sensor device 100 and the ECU 90.

[0045] A signal processing circuit 180 is provided on the circuit board 80 of the on-vehicle sensor device 100. The signal processing circuit 180 is electrically connected to the piezoelectric element 25 of the ultrasonic microphone 20 and the sound detection element (such as the MEMS microphone 170) of the sound vibration sensor 70. The signal processing circuit 180 processes the output signals (detection signals) of the ultrasonic microphone 20 and the sound vibration sensor 70, and outputs the respective detection results to the ECU 90. The function of the signal processing circuit 180 may be provided by a single dedicated chip such as an ASIC, or may be provided by an electric circuit formed by combining multiple IC chips.

[0046] The signal processing circuit 180 has amplifiers 181a and 181b, AD converters 182a and 182b, signal processing units 183a and 183b, converters 184a and 184b, and a bus interface 185. The amplifier 181a, AD converter 182a, signal processing unit 183a, and converter 184a are connected to the piezoelectric element 25 and are configured to process the output signal of the piezoelectric element 25. The converter 184a provides the detection result of the ultrasonic microphone 20 to the bus interface 185.

[0047] The amplifier 181b, AD converter 182b, signal processing unit 183b, and converter 184b are connected to the sound vibration sensor 70 and are configured to process the output signal of the sound vibration sensor 70. The converter 184b converts the output signal of the sound vibration sensor 70 into feature information, specifically, spectral information indicating the power for each frequency. By converting the output signal into feature information, the converter 184b compresses the volume of data to be transferred to the ECU 90. The converter 184b provides the feature information (spectral information) to the bus interface 185.

[0048] The bus interface 185 is communicatively connected to the ECU 90 via a communication line 88. The bus interface 185 transfers the detection results (sonar results) of the ultrasonic microphone 20 and feature amounts (audible sound feature amounts) based on the detection results of the sound vibration sensor 70 to the ECU 90 via the communication bus (communication line 88). Note that in a configuration in which high-speed communication is possible between the signal processing circuit 180 and the ECU 90, raw data before conversion into feature amounts, in other words, digitally converted uncompressed digital signals, may be transferred from the bus interface 185 to the ECU 90.

[0049] The ECU 90 is an on-board computer mounted on the vehicle Ve, and is an external device provided outside the sensor housing 30. The ECU 90 may be a dedicated ECU that processes the detection results of the on-board sensor devices 100, or may be an integrated ECU that has other functions. The ECU 90 is electrically connected to multiple on-board sensor devices 100. The ECU 90 includes a power supply unit 91, a communication unit 92, and a calculation unit 93.

[0050] The power supply unit 91 is connected to each on-vehicle sensor device 100 via a power supply line 86. The power supply unit 91 supplies each on-vehicle sensor device 100 with the power supply power required for detecting ultrasonic waves and audible sounds. The communication unit 92 is a bus master and is connected to each on-vehicle sensor device 100 via a communication line 88. The communication unit 92 receives the detection results and feature amounts transferred by each signal processing circuit 180. The communication unit 92 provides the received detection results and feature amounts to the calculation unit 93. The calculation unit 93 is a processing unit mainly composed of, for example, a microcomputer. Based on the detection results and feature amounts obtained from the communication unit 92, the calculation unit 93 generates target information such as the relative position, size, and relative speed of targets around the vehicle.

[0051] [Installation method for on-board sensor device] Next, the details of the method for attaching the on-vehicle sensor device 100 described above to the external structure 10 will be described based on Fig. 4 and with reference to Fig. 2. The method for attaching the on-vehicle sensor device 100 includes a retainer attachment step, a sensor mounting step, and a connector connection step, in this order.

[0052] In the retainer attachment process, after the mounting opening 15 is formed in the external structure 10, the retainer 60 is attached to the external structure 10. In a configuration in which double-sided tape is used as the adhesive layer 120, one adhesive surface of the adhesive layer 120 is attached to the attachment surface of the holding portion 62 facing the front side FS. Then, with the center of the holding space 63 defined on the inner periphery of the surrounding wall 61 and the center of the mounting opening 15 aligned, the other adhesive surface of the adhesive layer 120 is attached to the vehicle interior surface 12. Through the above process, the retainer 60 is fixed to the external structure 10.

[0053] In the sensor mounting process, the sensor housing 30 is mounted to the retainer 60. The sensor housing 30 is inserted into the holding space 63 from the back side BS with the transceiver 24 facing the front side FS. The sensor housing 30 is fitted into the surrounding wall 61 with the connector connection portion 48 oriented to be housed in the cutout portion 61a. By mounting the sensor housing 30 to the retainer 60, the transmitting and receiving surface 24a of the ultrasonic microphone 20 is exposed to the outer space OS through the mounting opening 15 and is generally flush with the vehicle outer surface 11. The sensor mounting process physically fixes the on-vehicle sensor device 100 to the external structure 10.

[0054] In the connector connecting process, the connector 140 is fitted into the connector connecting portion 48. A plurality of external connection lines 85 including a power supply line 86, a GND line 87, and a communication line 88 are connected to the connector 140. By attaching the connector 140, the in-vehicle sensor device 100 is electrically connected to the ECU 90 and other in-vehicle sensor devices 100.

[0055] (Summary of the first embodiment) In the first embodiment described so far, the sensor housing 30 for the ultrasonic microphone 20 also houses the sound vibration sensor 70 that detects sound or vibration. Therefore, by mounting the ultrasonic microphone 20 on the vehicle Ve, it is possible to also mount the sound vibration sensor 70 on the vehicle Ve. As described above, the configuration can be simplified compared to an embodiment in which the sound vibration sensor 70 is mounted on the vehicle Ve as a configuration independent of the ultrasonic microphone 20. This makes it easier to mount the sound vibration sensor 70 on the vehicle Ve.

[0056] More specifically, the number of steps required for mounting the ultrasonic microphone 20 and the sound vibration sensor 70 to the vehicle Ve, such as forming the mounting opening 15, attaching the retainer 60, and connecting the connector 140, can be reduced compared to a mode in which the ultrasonic microphone 20 and the sound vibration sensor 70 are mounted separately. As a result, it becomes easy to mount multiple sound vibration sensors 70 on the vehicle Ve.

[0057] Additionally, in the first embodiment, the sound vibration sensor 70 is housed in a sensor housing 30 and disposed on the rear side BS of the external structure 10. Therefore, sound or vibration arriving from the external space OS can be transmitted to the sound vibration sensor 70 via the ultrasonic microphone 20 without passing through the external structure 10 (front bumper, etc.). As a result, the detection of sound or vibration by the sound vibration sensor 70 is less affected by the characteristics of the external structure 10. In other words, by being separated from the external structure 10, the sensor characteristics are less dependent on the vehicle model, grade, etc. As a result, by performing inspection and adjustment at the sensor factory where the on-vehicle sensor device 100 is manufactured, it is possible to easily guarantee the characteristics of the on-vehicle sensor device 100 after shipment.

[0058] Furthermore, the sound vibration sensor 70 of the first embodiment is disposed separately from the transceiver 24 on the rear side BS of the transceiver 24. In this manner, if the sound vibration sensor 70 is provided separately from the transceiver 24, the characteristics of the sound vibration sensor 70 are less likely to be affected by the ultrasonic microphone 20. As a result, it becomes possible to appropriately adjust the characteristics of the sound vibration sensor 70 at a sensor factory or the like.

[0059] Furthermore, in the sensor housing 30 of the first embodiment, an air layer 58 is defined between the sound vibration sensor 70 and the transceiver 24. With this configuration, sound or vibration input to the transceiver 24 is transmitted to the air layer 58, and the sound vibration sensor 70 can detect vibrations of the air inside the air layer 58. As a result, it is possible to improve the detection sensitivity of sound or vibration in the audible range using a condenser microphone.

[0060] Additionally, in the first embodiment, the circuit board 80 is housed in the sensor housing 30, and the sound vibration sensor 70 has a MEMS microphone 170 that is surface-mounted on the circuit board 80. In this way, by configuring the MEMS microphone 170 to be surface-mounted on the circuit board 80, it is possible to omit wiring for electrically connecting the sound vibration sensor 70 and the circuit board 80. As a result, the configuration of the in-vehicle sensor device 100 can be further simplified.

[0061] In the first embodiment, the viscoelastic tube 57, which is formed in a cylindrical shape from a viscoelastic material, defines an air layer 58 on the transceiver 24 side (front side FS) of the circuit board 80. With this configuration, deformation of the viscoelastic tube 57 makes it possible to form the air layer 58 between the circuit board 80 and the microphone rear surface 29 while absorbing dimensional variations between them. Furthermore, because both ends of the viscoelastic tube 57 are pressed against the rear mounting surface 82 of the circuit board 80, it is less likely that the filler will seep into the viscoelastic tube 57 before hardening.

[0062] Furthermore, in the first embodiment, a moisture absorbent 59 that absorbs water vapor in the air layer 58 is disposed inside the air layer 58. Therefore, condensation in the air layer 58 caused by temperature changes around the on-vehicle sensor device 100 is less likely to occur. As a result, it is less likely that moisture from condensation will adhere to the sound vibration sensor 70, gradually changing the characteristics of the sound vibration sensor 70.

[0063] Additionally, in the first embodiment, the first connection line for electrically connecting the sound vibration sensor 70 to the ECU 90 is shared with the second connection line for electrically connecting the ultrasonic microphone 20 to the ECU 90. Sharing the external connection line 85 in this way enables simplification and cost reduction compared to a configuration in which the first connection line and the second connection line are provided separately.

[0064] Furthermore, in the first embodiment, the in-vehicle sensor device 100 and the ECU 90 are communicatively connected via a communication bus, which allows the ultrasonic microphone 20 and the sound vibration sensor 70 to share the communication line 88. Therefore, the configuration for connecting the in-vehicle sensor device 100 to the ECU 90 can be further simplified.

[0065] In the first embodiment, the output signal of the sound vibration sensor 70 is converted into feature information by the converter 184b. The feature information is then transferred to the ECU 90. With the above configuration, data transferred to the ECU 90 can be compressed. As a result, real-time data transfer from the external structure 10 to the ECU 90 is possible without employing a communication bus capable of high-speed communication. Such feature information is not limited to the above spectrum and may be changed as appropriate.

[0066] In the first embodiment, the ultrasonic microphone 20 corresponds to the "ultrasonic sensor," the microphone filler 27 corresponds to the "filled covering portion," and the microphone back surface 29 corresponds to the "rear side surface." Also, the air layer 58 corresponds to the "hollow space," the circuit board 80 corresponds to the "sensor board," the external connection line 85 corresponds to the "first connection line" and the "second connection line," the ECU 90 corresponds to the "external device," and the converter 184b corresponds to the "output conversion portion."

[0067] Second Embodiment The on-vehicle sensor device 100 of the second embodiment shown in FIG. 5 is a modified example of the first embodiment. In the second embodiment, the sound vibration sensor 70 is not surface-mounted on the circuit board 80 but is disposed at a position separated from the circuit board 80. As in the first embodiment, the sound vibration sensor 70 includes a MEMS microphone 170 or an electret condenser microphone. The sound vibration sensor 70 has a sensor lead wire 72. The sensor lead wire 72 is an electrical wiring extending from the main body of the sound vibration sensor 70 to the rear surface side BS, and is embedded in the front filler 54 together with the microphone lead wire 26. The sensor lead wire 72 is connected to the front mounting surface 81 by soldering or the like. The sound vibration sensor 70 is electrically connected to the circuit board 80 via the sensor lead wire 72.

[0068] The sound vibration sensor 70 is indirectly supported by the housing body 40. Here, being indirectly supported by the housing body 40 means being supported by the housing body 40 via a member having a higher elastic modulus than air. The sound vibration sensor 70 is attached to the front surface of the front filler 54 facing the front side FS, and its back surface is fixed by the front filler 54. In the housing body 40 of the second embodiment, a configuration equivalent to the intermediate partition wall 42 (see FIG. 2) is omitted.

[0069] The air layer 58 is formed in a flat shape between the sound vibration sensor 70 and the microphone rear surface 29. The air layer 58 is partitioned by the sound vibration sensor 70, the microphone rear surface 29, the damper part 53, etc. The air inside the air layer 58 transmits the audible sound or vibration input to the ultrasonic microphone 20 to the sound vibration sensor 70.

[0070] The second embodiment described so far also has the same effects as the first embodiment, and enables a simplified configuration for mounting the sound vibration sensor 70 on the vehicle Ve together with the ultrasonic microphone 20. As a result, it becomes easier to mount the sound vibration sensor 70 on the vehicle Ve.

[0071] Additionally, in the second embodiment, the sound vibration sensor 70 is indirectly supported by the housing body 40 of the sensor housing 30. With such a support structure, the sound vibration sensor 70 can reliably detect sound or vibration transmitted through the air layer 58. As a result, it is possible to improve the detection sensitivity of sound or vibration in the audible range.

[0072] (Third embodiment) The on-vehicle sensor device 100 of the third embodiment shown in Fig. 6 is a modified example of the second embodiment. The sound vibration sensor 70 of the third embodiment has a piezoelectric element 270 as an audible sound microphone element instead of the MEMS microphone 170 (see Fig. 2). The piezoelectric element 270 is bonded to a thin-film metal plate to form a monomorph type diaphragm or a bimorph type diaphragm. The piezoelectric element 270 is electrically connected to a circuit board 80 via a sensor lead wire 72.

[0073] The sound vibration sensor 70 is directly supported by the housing main body 40. The sound vibration sensor 70 is attached to the side of the intermediate partition wall 42 facing the front side FS, and its rear surface is fixed by the intermediate partition wall 42. The sound vibration sensor 70, together with the microphone rear surface 29 and the damper section 53, defines the air layer 58 and is in contact with the air layer 58. The sound vibration sensor 70 uses a piezoelectric element 270 to detect sound or vibration in the audible range that is transmitted from the ultrasonic microphone 20 through the air in the air layer 58.

[0074] The third embodiment described so far also has the same effects as the first and second embodiments, and makes it possible to simplify the configuration in which the ultrasonic microphone 20 and the sound vibration sensor 70 are mounted on the vehicle Ve.

[0075] Additionally, in the third embodiment, the sound vibration sensor 70 is directly supported by the housing body 40 of the sensor housing 30. In this way, with a support structure in which the sound vibration sensor 70 is fixed to a portion of the housing body 40, the sound vibration sensor 70 can reliably detect sound or vibration transmitted through the air layer 58. As a result, it is possible to improve the detection sensitivity of sound or vibration in the audible range.

[0076] (Fourth embodiment) The in-vehicle sensor device 100 of the fourth embodiment shown in FIG. 7 is another modified example of the first embodiment. The ultrasonic microphone 20 of the fourth embodiment has an accommodating recess 28. The accommodating recess 28 is formed in the microphone filler 27. The accommodating recess 28 is a concave recess formed by recessing the center of the microphone back surface 29 toward the piezoelectric element 25. The accommodating recess 28 is formed in a cylindrical hole shape. A portion of the front side FS of the viscoelastic tube 57 is inserted into the accommodating recess 28. The viscoelastic tube 57 fits over the inner circumferential surface of the accommodating recess 28. The bottom wall surface of the accommodating recess 28, together with the viscoelastic tube 57, defines an air space 58. Sound or vibration in the audible range input to the ultrasonic microphone 20 is transmitted to the MEMS microphone 170 through the air inside the air space 58.

[0077] The fourth embodiment described so far also has the same effects as the first embodiment, and makes it possible to simplify the configuration in which the ultrasonic microphone 20 and the sound vibration sensor 70 are mounted on the vehicle Ve.

[0078] Additionally, in the fourth embodiment, a concave accommodating recess 28 that defines at least a portion of the air layer 58 is formed in the microphone filler 27. In this way, by providing a space inside the ultrasonic microphone 20, it is possible to reduce the thickness of the in-vehicle sensor device 100 while maintaining or expanding the volume of the air layer 58. In the fourth embodiment, the accommodating recess 28 corresponds to the "recess."

[0079] Fifth Embodiment The on-vehicle sensor device 100 of the fifth embodiment shown in Fig. 8 is a modified example of the fourth embodiment. The housing main body 40 of the fifth embodiment is provided with a microphone holding protrusion 42d. The microphone holding protrusion 42d is formed on the middle partition wall 42. The microphone holding protrusion 42d stands upright from the inner edge of the middle partition wall 42 facing the connection opening 42c toward the front side FS.

[0080] The sound vibration sensor 70 is affixed to the top surface of the microphone holding protrusion 42d facing the front side FS and is fixed to the microphone holding protrusion 42d. The sound vibration sensor 70 is electrically connected to the circuit board 80 via a sensor lead wire 72. Most of the sound vibration sensor 70 is housed in the accommodating recess 28 provided in the ultrasonic microphone 20. An air space 58 is defined between the sound vibration sensor 70 and the inner circumferential surface and bottom wall surface of the accommodating recess 28. The sound vibration sensor 70 measures sound or vibration in the audible range that is transmitted through the air in the air space 58 inside the accommodating recess 28.

[0081] The fifth embodiment described so far also has the same effects as the fourth embodiment, and enables a simplified configuration for mounting the sound vibration sensor 70 on the vehicle Ve together with the ultrasonic microphone 20. In addition, a configuration in which the accommodating recess 28 is formed in the ultrasonic microphone 20 and the sound vibration sensor 70 is accommodated in the accommodating recess 28 enables the in-vehicle sensor device 100 to be made thinner.

[0082] (Sixth embodiment) The on-vehicle sensor device 100 of the sixth embodiment shown in Figure 9 is a modified example of the fifth embodiment. In the housing body 40 of the sixth embodiment, the configuration corresponding to the microphone holding protrusion 42d (see Figure 8) is omitted. The sound vibration sensor 70 is supported by the inner edge of the side surface of the intermediate partition wall 42 facing the front side FS, which faces the connection opening 42c. The sound vibration sensor 70 is housed in the housing recess 28 provided in the ultrasonic microphone 20. An air layer 58 is defined between the sound vibration sensor 70 and the bottom wall surface of the housing recess 28.

[0083] In the sixth embodiment described so far, as in the fifth embodiment, the ultrasonic microphone 20 has a housing recess 28 formed therein, and the sound vibration sensor 70 is housed in the housing recess 28. This makes it possible to reduce the thickness of the in-vehicle sensor device 100.

[0084] Seventh Embodiment The on-vehicle sensor device 100 of the seventh embodiment shown in FIG. 10 is yet another modified example of the first embodiment. The sound vibration sensor 70 of the seventh embodiment has a monomorph type diaphragm or bimorph type diaphragm including a piezoelectric element 270, or a plate-thickness type piezoelectric element, as in the third embodiment. The sound vibration sensor 70 is attached to the microphone back surface 29 by a sensor adhesive layer 74. The sensor adhesive layer 74 is formed of double-sided tape, adhesive material, or the like. The sound vibration sensor 70 is held to the microphone back surface 29 via the sensor adhesive layer 74.

[0085] The back surface of the sound vibration sensor 70 is directly supported by the housing main body 40. The sound vibration sensor 70 is held on the inner edge of the side surface of the intermediate partition wall 42 facing the front side FS, which faces the connection opening 42c. The sound vibration sensor 70 detects audible sounds or vibrations transmitted from the ultrasonic microphone 20 using a piezoelectric element 270.

[0086] The seventh embodiment described so far also has the same effects as the first embodiment, and makes it possible to simplify the configuration in which the ultrasonic microphone 20 and the sound vibration sensor 70 are mounted on the vehicle Ve.

[0087] Additionally, in the seventh embodiment, the sound vibration sensor 70 is held by the microphone back surface 29 of the ultrasonic microphone 20. With this configuration, the air layer 58 (see FIG. 2) can be omitted, and the configuration of the in-vehicle sensor device 100 can be simplified.

[0088] In the seventh embodiment, the sound vibration sensor 70 is held on the microphone back surface 29 via a sensor adhesive layer 74. With this configuration, sound or vibration input to the ultrasonic microphone 20 is easily transmitted to the ultrasonic microphone 20. As a result, the detection sensitivity of the sound vibration sensor 70 can be ensured.

[0089] Eighth Embodiment The on-vehicle sensor device 100 of the eighth embodiment shown in FIG. 11 is a modified example of the seventh embodiment. Like the seventh embodiment, the sound vibration sensor 70 of the eighth embodiment has a monomorph or bimorph diaphragm formed by bonding a piezoelectric element 270 and a metal plate 73 together. The sound collection surface on the front side FS of the sound vibration sensor 70 is held to the microphone back surface 29 via a sensor adhesive layer 74. The holding surface on the back side BS of the sound vibration sensor 70 is attached to the front surface of the front filler 54 and is fixed to the front filler 54. The sound vibration sensor 70 is indirectly supported by the housing main body 40 via the front filler 54. The sound vibration sensor 70 detects audible sound or vibration transmitted from the ultrasonic microphone 20 to the metal plate 73 using the piezoelectric element 270.

[0090] The eighth embodiment described so far also has the same effects as the seventh embodiment, and enables a simplified configuration for mounting the sound vibration sensor 70 on the vehicle Ve together with the ultrasonic microphone 20. In addition, since the sound vibration sensor 70 is held by the microphone back surface 29 of the ultrasonic microphone 20, the configuration of the in-vehicle sensor device 100 can be simplified.

[0091] Ninth embodiment The on-vehicle sensor device 100 of the ninth embodiment shown in Fig. 12 is another modified example of the seventh embodiment. In the ninth embodiment, a vibration transmission unit 75 is provided between the microphone rear surface 29 and a metal plate 73. The vibration transmission unit 75 is formed in a flat plate shape using a material having a higher elastic modulus than the damper unit 53, such as a metal material (e.g., aluminum) or a resin material. The damper unit 53 may be formed in a partial cone shape or a partial pyramid shape whose longitudinal cross section is trapezoidal.

[0092] Both sides of the vibration transmission unit 75 are pressed firmly against the microphone back surface 29 and the metal plate 73, respectively, and are tightly attached to the microphone back surface 29 and the metal plate 73. The vibration transmission unit 75 is in contact only with the center portion of the front surface of the sound vibration sensor 70. The vibration transmission unit 75 transmits sound or vibration input to the ultrasonic microphone 20 to the metal plate 73.

[0093] The ninth embodiment described so far also has the same effects as the seventh embodiment, and enables a simplified configuration in which the sound vibration sensor 70 is mounted on the vehicle Ve together with the ultrasonic microphone 20. In addition, the detection sensitivity of the sound vibration sensor 70 can be improved by the configuration in which the vibration transmitter 75 transmits vibrations from the ultrasonic microphone 20 to the sound vibration sensor 70.

[0094] Tenth Embodiment The tenth embodiment of the on-vehicle sensor device 100 shown in FIG. 13 is a modified example of the ninth embodiment. The ultrasonic microphone 20 of the tenth embodiment has a vibration transmission unit 75. The vibration transmission unit 75 is formed by a microphone filler 27. The vibration transmission unit 75 is a convex portion that protrudes from the rear side BS and is provided in the center of the microphone rear surface 29. The top of the vibration transmission unit 75 is pressed against the center of the metal plate 73. Sound or vibration input to the ultrasonic microphone 20 is transmitted to the metal plate 73 by the vibration transmission unit 75.

[0095] The tenth embodiment described so far also has the same effects as the ninth embodiment, and enables a simplified configuration for mounting the sound vibration sensor 70 on the vehicle Ve together with the ultrasonic microphone 20. In addition, the detection sensitivity of the sound vibration sensor 70 can be improved by the configuration in which the vibration transmission unit 75 provided on the microphone back surface 29 transmits vibrations to the sound vibration sensor 70.

[0096] Eleventh Embodiment The on-vehicle sensor device 100 of the eleventh embodiment shown in FIG. 14 is yet another modified example of the first embodiment. The on-vehicle sensor device 100 is provided with a back sound conduit 157. The back sound conduit 157 is formed integrally with the viscoelastic tube 57. The back sound conduit 157 is formed in a cylindrical shape. The back sound conduit 157 penetrates the circuit board 80 in the plate thickness direction, and defines a cylindrical back sound guiding space 157a extending from the air layer 58 to the back side BS. The end of the back side BS of the back sound conduit 157 is fitted into a sound guiding recess 51 provided in the rear cover 50. The sound guiding recess 51 forms a thin plate portion in the rear cover 50.

[0097] With the above configuration, sound and vibration generated in the inner space IS is transmitted from the thin plate portion and the rear sound conducting space 157a to the air layer 58. As a result, the sound vibration sensor 70 can detect sound or vibration in the inner space IS (for example, engine sound, motor sound, etc.) in addition to sound or vibration in the outer space OS.

[0098] The eleventh embodiment described so far also has the same effects as the first embodiment, and makes it possible to simplify the configuration in which the ultrasonic microphone 20 and the sound vibration sensor 70 are mounted on the vehicle Ve.

[0099] In addition, the on-vehicle sensor device 100 according to the eleventh embodiment is equipped with a cylindrical rear sound guide tube 157. The rear sound guide tube 157 introduces sound or vibration from the inner space IS located on the rear side BS of the housing main body 40 to the air layer 58. As described above, it is possible to detect sound or vibration in the inner space IS without increasing the number of sound vibration sensors 70 provided in the on-vehicle sensor device 100. In the eleventh embodiment, the rear sound guide tube 157 corresponds to the "sound guide tube portion."

[0100] Twelfth Embodiment The on-vehicle sensor device 100 of the twelfth embodiment shown in FIG. 15 is a modified example of the eleventh embodiment. In the rear cover 50 of the twelfth embodiment, a sound guide opening 51a is formed instead of the sound guide recess 51 (see FIG. 14). The sound guide opening 51a is a through hole that penetrates the rear cover 50 in the plate thickness direction. An end of a rear sound guide tube 157 is fitted into the sound guide opening 51a. The sound guide opening 51a and the rear sound guide space 157a are closed from the rear side BS by a sound guide membrane 51b. The sound guide membrane 51b is formed in a thin film shape from a waterproof material that allows sound and vibration to pass through (for example, Gore-Tex, registered trademark).

[0101] The twelfth embodiment described so far also achieves the same effects as the eleventh embodiment, and enables a simplified configuration in which the sound vibration sensor 70 is mounted on the vehicle Ve together with the ultrasonic microphone 20. Additionally, in the twelfth embodiment, sound or vibration generated in the inner space IS is transmitted from the sound conducting membrane 51b and the rear sound conducting space 157a to the air layer 58. As a result of the above, detection of sound or vibration in the inner space IS can be realized without increasing the number of sound vibration sensors 70.

[0102] Thirteenth Embodiment The on-vehicle sensor device 100 of the thirteenth embodiment shown in FIG. 16 is another modified example of the eleventh embodiment. The on-vehicle sensor device 100 is provided with a side sound guide tube 158. The side sound guide tube 158 is formed integrally with the viscoelastic tube 57. The side sound guide tube 158 is formed in a cylindrical shape. The side sound guide tube 158 defines a cylindrical side sound guide space 158a extending from the air layer 58 toward the peripheral housing wall 41. The end of the side sound guide tube 158 opposite the air layer 58 is fitted into a sound guide opening 41a provided in the peripheral housing wall 41. The sound guide opening 41a and the side sound guide space 158a are closed from the outer periphery by a sound guide membrane 41b. The sound guide membrane 41b is made of a material that transmits sound and vibrations, similar to the sound guide membrane 51b of the twelfth embodiment (see FIG. 15).

[0103] The thirteenth embodiment described so far also has the same effects as the eleventh embodiment, and makes it possible to simplify the configuration in which the ultrasonic microphone 20 and the sound vibration sensor 70 are mounted on the vehicle Ve.

[0104] In addition, the on-vehicle sensor device 100 according to the thirteenth embodiment is equipped with a cylindrical side sound guide tube 158. The side sound guide tube 158 introduces sound or vibration from the side space SS located on the side of the housing main body 40 into the air layer 58. As described above, it is possible to detect sound or vibration in the side space SS without increasing the number of sound vibration sensors 70 provided in the on-vehicle sensor device 100. In the thirteenth embodiment, the side sound guide tube 158 corresponds to the "sound guide tube portion."

[0105] (Fourteenth embodiment) The vehicle-mounted sensor device 100 of the fourteenth embodiment shown in Fig. 17 is another modified example of the second embodiment. A moisture absorbent 59 is provided in the air layer 58 of the vehicle-mounted sensor device 100. The moisture absorbent 59 is formed in a chip shape and attached to the microphone back surface 29. The moisture absorbent 59 absorbs water vapor generated in the air layer 58 and suppresses the occurrence of condensation in the air layer 58.

[0106] (Fifteenth embodiment) 18 shows a fifteenth embodiment of the on-vehicle sensor device 100, which is yet another modification of the first embodiment. In the fifteenth embodiment, the moisture absorbent 59 is omitted. In this manner, the presence or absence of the moisture absorbent 59 may be changed as appropriate.

[0107] Sixteenth Embodiment An on-vehicle sensor device 200 of a sixteenth embodiment shown in Fig. 19 is yet another modified example of the first embodiment. In the on-vehicle sensor device 200, the transceiver 24 is shared with the sound vibration sensor 70. More specifically, the piezoelectric element 25 constituting the transceiver 24 detects ultrasonic waves as well as sounds and vibrations in the audible range, thereby also functioning as the sound vibration sensor 70. Below, the ultrasonic microphone 20 and the housing main body 40 provided in the on-vehicle sensor device 200 of the sixteenth embodiment will be described in detail.

[0108] The ultrasonic microphone 20 has a compartment housing 221 and a vibration membrane 222. The compartment housing 221 is formed in a cylindrical shape with a bottom from a metal material such as aluminum or a resin material such as silicone rubber. The compartment housing 221 is housed inside the microphone housing 21 with its bottom wall, which is formed in a thin plate shape, facing the back side BS. The compartment housing 221, together with the microphone housing 21, defines an internal microphone space 220 inside the ultrasonic microphone 20.

[0109] The microphone internal space 220 is located on the back side BS of the piezoelectric element 25 and is a sealed, airtight hollow space facing the piezoelectric element 25. The back surface of the piezoelectric element 25 is exposed to the microphone internal space 220. The piezoelectric element 25 can detect pressure fluctuations occurring in the microphone internal space 220 in addition to vibrations occurring in the receiving bottom 22.

[0110] Vibration membrane 222 is formed in the center of microphone back surface 29. A hollow microphone internal space 220 is provided inside microphone filler 27, allowing vibration membrane 222 to be elastically deformable in the film thickness direction. When vibration membrane 222 deforms in the film thickness direction, a pressure fluctuation occurs in microphone internal space 220.

[0111] As in the first embodiment, the housing body 40 supports the ultrasonic microphone 20 in a state that allows displacement due to sound or vibration in the audible range. The ultrasonic microphone 20 is elastically supported via the cushion portion 52 and the damper portion 53, allowing it to be slightly displaced along the axial direction of the housing peripheral wall 41. The housing body 40 is provided with a compression portion 240 that compresses the microphone internal space 220 due to displacement of the ultrasonic microphone 20.

[0112] The compression portion 240 is formed by a compression protrusion 241. The compression protrusion 241 is formed in the center of one of both side surfaces of the intermediate partition wall 42 that faces the front side FS. The compression protrusion 241 has a shape that protrudes from the intermediate partition wall 42 toward the front side FS, and the top surface of the compression protrusion 241 abuts against the vibration membrane 222. The compression protrusion 241 serves as a pressing surface 248 that directly presses against the vibration membrane 222.

[0113] According to the above configuration, when the ultrasonic microphone 20 is displaced due to audible sound or vibration input to the ultrasonic microphone 20, the diaphragm 222 in contact with the pressing surface 248 vibrates. This causes a pressure fluctuation in the microphone internal space 220, and the piezoelectric element 25 can measure the audible sound or vibration by detecting the generated pressure fluctuation.

[0114] The sixteenth embodiment described so far also has the same effects as the first embodiment, and makes it possible to simplify the configuration in which the ultrasonic microphone 20 and the sound vibration sensor 70 are mounted on the vehicle Ve.

[0115] Additionally, the ultrasonic microphone 20 of the sixteenth embodiment defines an internal microphone space 220 facing the transceiver 24 on the rear side BS of the transceiver 24. The sensor housing 30 supports the ultrasonic microphone 20 in a state that allows displacement due to audible sound or vibration. A compression section 240 is provided inside the sensor housing 30, which compresses the internal microphone space 220 due to displacement of the ultrasonic microphone 20. The piezoelectric element 25 of the transceiver 24 is also used as the sound vibration sensor 70. As described above, the piezoelectric element 25 also functions as the sound vibration sensor 70, which further simplifies the configuration of the in-vehicle sensor device 200. In the sixteenth embodiment, the internal microphone space 220 corresponds to a "hollow space."

[0116] (Seventeenth embodiment) An on-vehicle sensor device 200 according to a seventeenth embodiment shown in Fig. 20 is a modified example of the sixteenth embodiment. In the ultrasonic microphone 20 according to the seventeenth embodiment, a component corresponding to the diaphragm 222 (see Fig. 19) is omitted. The microphone internal space 220 is defined as a substantially airtight space by a partition housing 221, a damper portion 53, a compression piston portion 242, etc.

[0117] The compression piston portion 242 has a configuration equivalent to the compression protrusion 241 (see FIG. 19). The compression piston portion 242 is formed in a cylindrical or rectangular columnar shape from a metal or resin material. The compression piston portion 242 is fixed to the center of one of the two side surfaces of the intermediate partition wall 42 that faces the front side FS. Most of the compression piston portion 242 is housed in the microphone internal space 220. The top surface (pressure surface 248) of the compression piston portion 242 that faces the front side FS faces the back surface of the piezoelectric element 25. The outer surface of the compression piston portion 242 faces the inner surface of the partition housing 221 with a small gap therebetween.

[0118] According to the above configuration, when the ultrasonic microphone 20 is displaced due to audible sound or vibration input to the ultrasonic microphone 20, the distance between the pressing surface 248 and the piezoelectric element 25 increases or decreases. This causes a pressure fluctuation in the microphone internal space 220, and the piezoelectric element 25 can measure the audible sound or vibration by detecting the pressure fluctuation generated in the microphone internal space 220.

[0119] The seventeenth embodiment described so far also achieves the same effects as the sixteenth embodiment, and enables a simplified configuration in which the sound vibration sensor 70 is mounted on the vehicle Ve together with the ultrasonic microphone 20. Additionally, in the seventeenth embodiment, the piezoelectric element 25 also serves as the function of the sound vibration sensor 70, so the configuration of the in-vehicle sensor device 200 can be further simplified.

[0120] (Eighteenth embodiment) An on-vehicle sensor device 200 according to an eighteenth embodiment shown in Fig. 21 is a modified example of the seventeenth embodiment. A compression piston portion 242 according to the eighteenth embodiment is provided slidably relative to a compartment housing 221. A microphone internal space 220 is partitioned as a generally airtight space by the compartment housing 221, the compression piston portion 242, etc.

[0121] The compression piston portion 242 is held by the intermediate partition wall 42 via a bushing 243. The bushing 243 is formed in a thin plate shape from silicone rubber or the like. When the ultrasonic microphone 20 is displaced by audible sound or vibration, the compression piston portion 242 increases the pressure in the microphone internal space 220 by means of the pressing surface 248. By detecting such pressure fluctuations, the piezoelectric element 25 is able to measure audible sound or vibration.

[0122] The eighteenth embodiment described so far also achieves the same effects as the seventeenth embodiment, and enables a simplified configuration in which the sound vibration sensor 70 is mounted on the vehicle Ve together with the ultrasonic microphone 20. Additionally, in the eighteenth embodiment, the piezoelectric element 25 also serves as the function of the sound vibration sensor 70, so the configuration of the in-vehicle sensor device 200 can be further simplified.

[0123] (Nineteenth embodiment) The on-vehicle sensor device 200 of the nineteenth embodiment shown in FIG. 22 is another modified example of the seventeenth embodiment. The compression piston portion 242 of the nineteenth embodiment has a contact point 244. The contact point 244 is formed in a plate shape using rubber, double-sided tape, or the like. The contact point 244 is attached to the tip of the compression piston portion 242 that protrudes from the intermediate partition wall 42 to the front side FS. The compression piston portion 242 indirectly contacts the back surface of the piezoelectric element 25 via the contact point 244.

[0124] The rear side BS of the compression piston portion 242 is directly fixed by the intermediate partition wall 42. Most of the front side FS of the compression piston portion 242 is housed in the microphone internal space 220. The microphone internal space 220 is a space that is open to the rear side BS. The compression piston portion 242 is inserted into the microphone internal space 220 through an opening formed in the bottom wall of the partition housing 221.

[0125] According to the above configuration, when the ultrasonic microphone 20 is displaced due to audible sound or vibration input to the ultrasonic microphone 20, the compression piston portion 242 fixed relatively to the housing main body 40 presses the piezoelectric element 25 by the contact point 244. The piezoelectric element 25 detects the vibration input by the contact point 244, thereby becoming able to measure the audible sound or vibration.

[0126] The nineteenth embodiment described so far also achieves the same effects as the seventeenth embodiment, and enables a simplified configuration in which the sound vibration sensor 70 is mounted on the vehicle Ve together with the ultrasonic microphone 20. Additionally, in the nineteenth embodiment, the piezoelectric element 25 also serves as the function of the sound vibration sensor 70, so the configuration of the in-vehicle sensor device 200 can be further simplified.

[0127] (Twentieth embodiment) The on-vehicle sensor device 200 of the twentieth embodiment shown in FIG. 23 is a modified example of the nineteenth embodiment. In the on-vehicle sensor device 200 of the twentieth embodiment, the compression piston portion 242 is indirectly held by the intermediate partition wall 42. The back surface of the compression piston portion 242 is fixed relatively to the center of the intermediate partition wall 42 via a bushing 243. The bushing 243 is formed into a plate shape using rubber, double-sided tape, or the like. The compression piston portion 242 has a pressing surface 248 facing the front side FS in direct contact with the back surface of the piezoelectric element 25. When the ultrasonic microphone 20 is displaced by audible sound or vibration, the compression piston portion 242 presses the piezoelectric element 25 with the pressing surface 248. As described above, the piezoelectric element 25 is capable of measuring audible sound or vibration.

[0128] The twentieth embodiment described so far also achieves the same effects as the nineteenth embodiment, and enables a simplified configuration in which the sound vibration sensor 70 is mounted on the vehicle Ve together with the ultrasonic microphone 20. Additionally, in the twentieth embodiment, the piezoelectric element 25 also serves the function of the sound vibration sensor 70, so the configuration of the in-vehicle sensor device 200 can be further simplified.

[0129] Twenty-first embodiment An on-vehicle sensor device 300 of a twenty-first embodiment shown in Fig. 24 is yet another modified example of the first embodiment. The sensor housing 30 of the on-vehicle sensor device 300 includes a sub-housing 340 in addition to a housing main body 40, a rear cover 50, and a retainer 60. The sub-housing 340 is provided on the rear side BS of the holding portion 62 of the retainer 60. The sub-housing 340 houses a sound vibration sensor 70 and a sub-board 380. The sound vibration sensor 70 is electrically connected to the sub-board 380 by a sensor lead wire 72.

[0130] The in-vehicle sensor device 300 according to the twenty-first embodiment described above also achieves the same effects as the first embodiment, and enables a simplified configuration in which the sound vibration sensor 70 is mounted on the vehicle Ve together with the ultrasonic microphone 20. The audible sound microphone element of the sound vibration sensor 70 housed in the sub-housing 340 may be changed as appropriate from among the MEMS microphone 170 audible sound microphone element, the electret condenser microphone, the piezoelectric element 270, etc.

[0131] (Other embodiments) Although several embodiments of the present disclosure have been described above, the present disclosure should not be construed as being limited to the above-described embodiments, and can be applied to various embodiments and combinations within the scope that does not deviate from the gist of the present disclosure.

[0132] The transceiver 24 in the above embodiment is configured to both receive and transmit ultrasonic waves. However, the transceiver 24 may be configured to only receive or transmit ultrasonic waves. Furthermore, the sound vibration sensor 70 may be configured to only detect either sound or vibration in the audible range.

[0133] The sensor housing 30 does not necessarily have to include the retainer 60. In such a configuration, a configuration equivalent to the holding portion 62 is provided on the housing main body 40. The housing main body 40 is directly fixed to the vehicle interior surface 12 by the holding portion 62 and the adhesive layer 120.

[0134] The vehicle Ve equipped with the on-vehicle sensor device 100 is not limited to a general private passenger car, but may be a rental car vehicle, a manned taxi vehicle, a ride-sharing vehicle, a freight vehicle, a bus, etc. Furthermore, the on-vehicle sensor device 100 can be equipped in a vehicle exclusively for unmanned driving used for mobility services. In addition, the number and installation positions of the on-vehicle sensor devices 100 are optimized as appropriate depending on the type of the vehicle Ve, the purpose of the vehicle Ve, and the traffic environment and laws and regulations of the country or region in which the vehicle Ve is used.

[0135] In the above embodiment, the functions provided by the signal processing circuit 180 and the ECU 90 can be provided by software and hardware that executes the software, software alone, hardware alone, or a combination of these. Furthermore, when such functions are provided by electronic circuits as hardware, the functions can also be provided by digital circuits including a large number of logic circuits or analog circuits.

[0136] (Disclosure of technical ideas) This specification discloses multiple technical ideas described in the following multiple clauses. Some clauses may be written in a multiple dependent form, with the subsequent clause referring to the preceding clause as an alternative. Furthermore, some clauses may be written in a multiple dependent form, referring to another multiple dependent clause. These multiple dependent clauses define multiple technical ideas.

[0137] (Technical thought 1) An on-board sensor device mounted on a vehicle (Ve), an ultrasonic sensor (20) having a transceiver (24) for receiving and / or transmitting ultrasonic waves; a sensor housing (30) that accommodates at least a portion of the ultrasonic sensor; and a sound vibration sensor (70) that is housed in the sensor housing together with the ultrasonic sensor and detects sound or vibration in the audible range. (Technical thought 2) The on-vehicle sensor device according to Technical Idea 1, wherein the sound vibration sensor is disposed separately from the transceiver on the rear side (BS) of the transceiver. (Technical Thought 3) The on-vehicle sensor device according to Technical Concept 2, wherein the sensor housing defines a hollow space (58) between the sound vibration sensor and the transmitter / receiver. (Technical Thought 4) a sensor substrate (80) accommodated in the sensor housing; The on-vehicle sensor device according to Technical Concept 3, wherein the sound vibration sensor has a MEMS microphone (170) surface-mounted on the sensor substrate. (Technical Thought 5) The vehicle-mounted sensor device according to Technical Idea 4 further comprises a viscoelastic tube (57) formed in a cylindrical shape from a viscoelastic material, which defines the hollow space on the transmitter / receiver side of the sensor board. (Technical Thought 6) The ultrasonic sensor further includes a filling covering portion (27) that covers the transmitter / receiver from the rear side, The vehicle-mounted sensor device according to any one of Technical Concepts 3 to 5, wherein the filling and covering portion is formed with a recessed recess (28) that defines at least a part of the hollow space. (Technical Thought 7) The vehicle-mounted sensor device according to any one of Technical Concepts 3 to 6, further comprising a moisture absorbent (59) disposed inside the hollow space and absorbing water vapor in the hollow space. (Technical Thought 8) An on-board sensor device described in any one of technical ideas 3 to 7, further comprising a cylindrical sound-guiding tube portion (157, 158) that introduces sound or vibration into the hollow space from at least one of an inner space (IS) located on the back side of the sensor housing or a lateral space (SS) located on the side of the sensor housing. (Technical Thought 9) The on-vehicle sensor device according to any one of Technical Ideas 2 to 8, wherein the sound vibration sensor is held by a rear surface (29) of the ultrasonic sensor. (Technical Thought 10) The on-vehicle sensor device according to Technical Idea 9, wherein the sound vibration sensor is held on the back side surface via a sensor adhesive layer (74). (Technical Thought 11) 11. The on-vehicle sensor device according to any one of Technical Ideas 2 to 10, wherein the sound vibration sensor is supported directly or indirectly by the sensor housing. (Technical Thought 12) An on-board sensor device described in any one of technical ideas 2 to 11, wherein a first connection line for electrically connecting the sound vibration sensor to an external device (90) provided outside the sensor housing is shared with a second connection line for electrically connecting the ultrasonic sensor to the external device. (Technical Thought 13) An on-vehicle sensor device according to any one of technical ideas 2 to 12, further comprising an output conversion unit (184b) that converts the output signal of the sound vibration sensor into information on features to be transferred to an external device (90) provided outside the sensor housing. (Technical Thought 14) The ultrasonic sensor defines a hollow space (220) facing the transceiver on the rear side of the transceiver, the sensor housing supports the ultrasonic sensor in a state that allows displacement due to sound or vibration in the audible range; a compression section (240) that compresses the hollow space by displacement of the ultrasonic sensor is provided inside the sensor housing; The vehicle-mounted sensor device according to Technical Idea 1, wherein the transmitter / receiver is shared with the sound vibration sensor. (Technical thought 2-1) An on-board sensor device mounted on a vehicle (Ve), an ultrasonic sensor (20) having a transceiver (24) for receiving and / or transmitting ultrasonic waves; a sound vibration sensor (70) for detecting sounds or vibrations in the audible range; An in-vehicle sensor device in which a first connection line for electrically connecting the sound vibration sensor to an external device (90) is shared with a second connection line for electrically connecting the ultrasonic sensor to the external device. (Technical thought 2-2) An on-board sensor device mounted on a vehicle (Ve), an ultrasonic sensor (20) having a transceiver (24) for receiving and / or transmitting ultrasonic waves, and defining a hollow space (220) facing the transceiver on the rear side of the transceiver; a sensor housing (30) that houses at least a portion of the ultrasonic sensor and supports the ultrasonic sensor in a state that allows displacement due to sound or vibration in an audible range; a compression section (240) provided inside the sensor housing and compressing the hollow space in response to displacement of the ultrasonic sensor; An in-vehicle sensor device comprising: [Explanation of symbols]

[0138] Ve vehicle, BS rear side, IS inner space, SS side space, 20 ultrasonic microphone (ultrasonic sensor), 220 microphone inner space (hollow space), 24 transmitter / receiver, 27 microphone filler (filled covering portion), 28 accommodation recess (recessed portion), 29 microphone rear (rear side), 30 sensor housing, 240 compression portion, 57 viscoelastic tube, 157 rear sound guide tube (sound guide tube portion), 158 side sound guide tube (sound guide tube portion), 58 air layer (hollow space), 59 moisture absorbent, 70 sound vibration sensor, 170 MEMS microphone, 74 sensor adhesive layer, 80 circuit board (sensor board), 184b converter (output conversion portion), 85 external connection line (first connection line, second connection line), 90 ECU (external device), 100, 200, 300 in-vehicle sensor device

Claims

1. An on-board sensor device mounted on a vehicle (Ve), an ultrasonic sensor (20) having a transceiver (24) for receiving and / or transmitting ultrasonic waves; a sensor housing (30) that houses at least a portion of the ultrasonic sensor; a sound vibration sensor (70) that is housed in the sensor housing together with the ultrasonic sensor and detects sound or vibration in an audible range; The sound vibration sensor is disposed on the rear side (BS) of the transceiver as a separate body from the transceiver, The sensor housing defines a hollow space (58) between the sound vibration sensor and the transmitter / receiver.

2. A sensor substrate (80) accommodated in the sensor housing is further provided, The on-vehicle sensor device according to claim 1 , wherein the sound vibration sensor has a MEMS microphone (170) surface-mounted on the sensor substrate.

3. 3. The vehicle-mounted sensor device according to claim 2, further comprising a viscoelastic tube (57) formed in a cylindrical shape from a viscoelastic material, defining the hollow space on the transmitter / receiver side of the sensor board.

4. The ultrasonic sensor further includes a filling covering portion (27) that covers the transmitter / receiver from the rear side, 2. The vehicle-mounted sensor device according to claim 1, wherein the filling and covering portion has a recessed recess (28) that defines at least a part of the hollow space.

5. The on-vehicle sensor device according to claim 1, further comprising a moisture absorbent (59) disposed inside the hollow space and absorbing water vapor in the hollow space.

6. The vehicle-mounted sensor device described in claim 1 further comprises a cylindrical sound-conducting tube portion (157, 158) that introduces sound or vibration into the hollow space from at least one of an inner space (IS) located on the back side of the sensor housing or a lateral space (SS) located on the side of the sensor housing.

7. 2. The vehicle-mounted sensor device according to claim 1, wherein the sound vibration sensor is held by a rear surface (29) of the ultrasonic sensor.

8. The on-vehicle sensor device according to claim 7, wherein the sound vibration sensor is held on the rear surface via a sensor adhesive layer (74).

9. The on-vehicle sensor device according to any one of claims 1 to 8, wherein the sound vibration sensor is supported directly or indirectly by the sensor housing.

10. 2. The in-vehicle sensor device according to claim 1, wherein a first connection line for electrically connecting the sound vibration sensor to an external device (90) provided outside the sensor housing is shared with a second connection line for electrically connecting the ultrasonic sensor to the external device.

11. The vehicle-mounted sensor device according to claim 1, further comprising an output conversion unit (184b) that converts the output signal of the sound vibration sensor into feature information to be transferred to an external device (90) provided outside the sensor housing.

12. An on-board sensor device mounted on a vehicle (Ve), an ultrasonic sensor (20) having a transceiver (24) for receiving and / or transmitting ultrasonic waves; a sensor housing (30) that houses at least a portion of the ultrasonic sensor; a sound vibration sensor (70) that is housed in the sensor housing together with the ultrasonic sensor and detects sound or vibration in an audible range; The ultrasonic sensor defines a hollow space (220) facing the transceiver on the rear side of the transceiver, the sensor housing supports the ultrasonic sensor in a state that allows displacement due to sound or vibration in the audible range; A compression section (240) is provided inside the sensor housing to compress the hollow space by displacement of the ultrasonic sensor, The transmitter / receiver is an in-vehicle sensor device that is shared with the sound vibration sensor.

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