Solid-state battery module

Abstract

According to one embodiment of the present invention, provided is a solid-state battery module comprising a substrate, a solid-state battery arranged on the substrate, and a wireless power-feeding circuit including a capacitor, the module having at least the capacitor or the solid-state battery arranged on the same main surface side of the substrate.

Description

[Technical Field]

[0001] The present invention relates to a solid-state battery module, and more particularly to a solid-state battery that is modularized so as to be mountable on a substrate. [Background technology]

[0002] Secondary batteries, which can be repeatedly charged and discharged, have been used for various applications. For example, secondary batteries are used as power sources for electronic devices such as smartphones and laptops. In secondary batteries, a liquid electrolyte is generally used as a medium for ion migration, which contributes to charging and discharging. In other words, so-called electrolytic solution is used in secondary batteries. However, such secondary batteries generally require safety in terms of preventing leakage of the electrolytic solution. In addition, organic solvents and the like used in the electrolytic solution are flammable, so safety is also required in this respect.

[0003] Therefore, research is being conducted on solid-state batteries that use a solid electrolyte instead of a liquid electrolyte. A solid-state battery has battery elements including a positive electrode layer, a negative electrode layer, and a solid electrolyte interposed between the positive electrode layer and the negative electrode layer. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-160968 Summary of the Invention [Problem to be solved by the invention]

[0005] It is known that charging efficiency decreases when the battery temperature is low when charging a battery, and in order to prevent this decrease in charging efficiency, a method of raising the temperature of the battery can be adopted. In this regard, one method is to raise the temperature of the battery using a heating element that generates heat in response to electromagnetic waves supplied during contactless power supply, i.e., wireless power supply, and to charge the battery using the power generated by using these electromagnetic waves (see Patent Document 1).

[0006] In the above-described embodiment, it is assumed that a heating element, i.e., a heating section, specialized for raising the temperature of the battery is used. Therefore, the inventors of the present application have found that there may be some points that can be improved in order to achieve efficient heating of the battery.

[0007] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a solid-state battery module that can preferably raise the temperature of a solid-state battery. [Means for solving the problem]

[0008] A solid-state battery module according to the present invention includes a substrate, a solid-state battery arranged on the substrate, and a wireless power supply circuit including a capacitor, wherein at least the capacitor and the solid-state battery are arranged on the same main surface side of the substrate. [Effects of the Invention]

[0009] According to the solid state battery module of the present invention, the solid state batteries that are the components thereof can be suitably heated. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a cross-sectional view schematically showing the configuration of a solid-state battery module according to one embodiment. [Figure 2] FIG. 2 is a circuit diagram of a wireless power supply circuit (power receiving unit) included in the solid-state battery module of FIG. 1 and a power transmitting unit provided externally. [Figure 3] FIG. 3 is a cross-sectional view schematically showing the configuration of a solid-state battery module according to one embodiment. [Figure 4] FIG. 4 is a circuit diagram of a wireless power supply circuit (power receiving unit) included in the solid-state battery module of FIG. 3 and a power transmitting unit provided externally. [Figure 5] FIG. 5 is a plan view schematically showing the placement of capacitors in the solid-state battery module of FIG. [Figure 6] FIG. 6 is a cross-sectional view schematically showing the configuration of a solid-state battery module according to one embodiment. [Figure 7] FIG. 7 is a circuit diagram of a wireless power supply circuit (power receiving unit) included in the solid-state battery module of FIG. 6 and a power transmitting unit provided externally. [Figure 8] FIG. 8 is a cross-sectional view schematically showing the configuration of a solid state battery module according to one embodiment. [Figure 9] FIG. 9 is a circuit diagram of a wireless power supply circuit (power receiving unit) included in the solid-state battery module of FIG. 8 and a power transmitting unit provided externally. [Figure 10] FIG. 10 is a cross-sectional view schematically showing the configuration of a solid state battery module according to one embodiment. [Figure 11] FIG. 11 is a circuit diagram of a wireless power supply circuit (power receiving unit) included in the solid-state battery module of FIG. 10 and a power transmitting unit provided externally. [Figure 12] FIG. 12 is a cross-sectional view schematically showing the configuration of a solid state battery module according to one embodiment. [Figure 13] FIG. 13 is a circuit diagram of a wireless power supply circuit (power receiving unit) included in the solid-state battery module of FIG. 12 and a power transmitting unit provided externally. [Figure 14] FIG. 14 is a cross-sectional view schematically showing the configuration of a solid state battery module according to one embodiment. [Figure 15] FIG. 15 is a circuit diagram of a wireless power supply circuit (power receiving unit) included in the solid-state battery module of FIG. 14 and a power transmitting unit provided externally. [Figure 16] FIG. 16 is a cross-sectional view schematically showing the configuration of a solid state battery module according to one embodiment. [Figure 17]FIG. 17 is a circuit diagram of a wireless power supply circuit (power receiving unit) included in the solid-state battery module of FIG. 16 and a power transmitting unit provided externally. [Figure 18] FIG. 18 is a cross-sectional view schematically showing the configuration of a solid state battery module according to one embodiment. [Figure 19] FIG. 19 is a cross-sectional view schematically showing the configuration of a solid state battery module according to one embodiment. [Figure 20] FIG. 20 is a cross-sectional view schematically showing the configuration of a solid state battery module according to one embodiment. [Figure 21A] FIG. 21A is a cross-sectional view illustrating a process for manufacturing a solid-state battery module according to one embodiment of the present invention. [Figure 21B] FIG. 21B is a cross-sectional view illustrating a process for manufacturing a solid state battery module according to one embodiment of the present invention. [Figure 21C] FIG. 21C is a cross-sectional view illustrating a process for manufacturing a solid state battery module according to one embodiment of the present invention. [Figure 21D] FIG. 21D is a cross-sectional view illustrating a process for manufacturing a solid state battery module according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, a solid-state battery module according to an embodiment of the present invention will be described in detail. Although the description will be made with reference to the drawings as necessary, the contents shown in the drawings are merely schematic and illustrative for understanding the present invention, and the appearance and dimensional ratios may differ from the actual product.

[0012] In this specification, the term "solid-state battery module" refers, in a broad sense, to a composite device composed of multiple components including a solid-state battery, and, in a narrow sense, to a composite device composed of a solid-state battery, circuit elements, a circuit connecting them, and a substrate.

[0013] The term "cross-sectional view" as used herein refers to the shape of a solid-state battery viewed from a direction substantially perpendicular to the stacking direction (in other words, the shape of a solid-state battery cut along a plane parallel to the thickness direction of the layers). The terms "planar view" and "planar shape" as used herein refer to a sketch of an object viewed from above or below along the thickness direction of the layers (i.e., the stacking direction).

[0014] The terms "upper and lower directions" and "left and right directions" used directly or indirectly in this specification correspond to the upper and lower directions and left and right directions in the drawings, respectively. Unless otherwise specified, the same symbols or signs indicate the same members or parts or the same meanings. In a preferred embodiment, the vertical downward direction (i.e., the direction in which gravity acts) can be considered to correspond to the "lower direction" / "bottom side," and the opposite direction can be considered to correspond to the "upper direction" / "top side."

[0015] In the present invention, the term "solid-state battery" broadly refers to a battery whose components are made of solids, and in the narrow sense refers to an all-solid-state battery whose components are all made of solids. In a preferred embodiment, the solid-state battery of the present invention is a stacked solid-state battery in which each layer constituting a battery unit is stacked on top of each other, and preferably each such layer is made of a sintered body. The term "solid-state battery" encompasses not only so-called "secondary batteries" that can be repeatedly charged and discharged, but also "primary batteries" that can only discharge. According to a preferred embodiment of the present invention, the "solid-state battery" is a secondary battery. The term "secondary battery" should not be overly limited to its name, and can also include, for example, an electricity storage device. In the present invention, the solid-state battery included in the module can also be referred to as a "solid-state battery element."

[0016] Fig. 1 is a cross-sectional view schematically showing the configuration of a modularized solid-state battery according to one embodiment of the present invention. As shown in Fig. 1, a solid-state battery module 1000 according to one embodiment of the present invention includes a solid-state battery 100 provided on a substrate 200. Specifically, the solid-state battery module 1000 includes the substrate 200 that facilitates mounting, and the solid-state battery 100 that is provided on the substrate 200 and protected from the external environment.

[0017] [Basic structure of solid-state batteries] The following first describes the basic configuration of a solid-state battery 100. The configuration of the solid-state battery described here is merely an example for understanding the invention and is not intended to limit the invention. The solid-state battery 100 has at least positive and negative electrode layers and a solid electrolyte. Specifically, the solid-state battery 100 has battery elements including battery structural units each consisting of a positive electrode layer 110, a negative electrode layer 120, and at least a solid electrolyte 130 interposed between them.

[0018] The layers of the solid-state battery 100 may be formed by firing, and the positive electrode layer, negative electrode layer, solid electrolyte, etc. may form fired layers. Preferably, the positive electrode layer, negative electrode layer, and solid electrolyte are fired together, and therefore the battery elements form a fired body.

[0019] The positive electrode layer is an electrode layer containing at least a positive electrode active material. The positive electrode layer may further contain a solid electrolyte. In a preferred embodiment, the positive electrode layer may be composed of a sintered body containing at least positive electrode active material particles and a solid electrolyte. On the other hand, the negative electrode layer is an electrode layer containing at least a negative electrode active material. The negative electrode layer may further contain a solid electrolyte. In a preferred embodiment, the negative electrode layer may be composed of a sintered body containing at least negative electrode active material particles and a solid electrolyte.

[0020] The positive electrode active material and the negative electrode active material are materials involved in the transfer of electrons in a solid-state battery. Charging and discharging are performed by transferring (conducting) ions between the positive electrode layer and the negative electrode layer via the solid electrolyte, and transferring electrons. It is preferable that each electrode layer, the positive electrode layer and the negative electrode layer, is a layer capable of absorbing and releasing lithium ions or sodium ions in particular. In other words, the solid-state battery is preferably an all-solid-state secondary battery in which charging and discharging are performed by transferring lithium ions or sodium ions between the positive electrode layer and the negative electrode layer via the solid electrolyte.

[0021] (Cathode active material) The positive electrode active material contained in the positive electrode layer 110 may be at least one selected from the group consisting of, for example, a lithium-containing phosphate compound having a Nasicon structure, a lithium-containing phosphate compound having an olivine structure, a lithium-containing layered oxide, and a lithium-containing oxide having a spinel structure. An example of a lithium-containing phosphate compound having a Nasicon structure is Li3V2(PO4)3. An example of a lithium-containing phosphate compound having an olivine structure is Li3Fe2(PO4)3, LiFePO4, and / or LiMnPO4. An example of a lithium-containing layered oxide is LiCoO2 and / or LiCo 1 / 3 Ni 1 / 3 Mn 1 / 3 Examples of lithium-containing oxides having a spinel structure include LiMn2O4 and / or LiNi 0.5 Mn 1.5 O4, etc. The type of lithium compound is not particularly limited, but may be, for example, a lithium transition metal composite oxide or a lithium transition metal phosphate compound. Lithium transition metal composite oxide is a general term for oxides containing lithium and one or more transition metal elements as constituent elements, and lithium transition metal phosphate compound is a general term for phosphate compounds containing lithium and one or more transition metal elements as constituent elements. The type of transition metal element is not particularly limited, but may be, for example, cobalt (Co), nickel (Ni), manganese (Mn), iron (Fe), etc.

[0022] In addition, the positive electrode active material capable of absorbing and releasing sodium ions may be at least one selected from the group consisting of sodium-containing phosphate compounds having a Nasicon structure, sodium-containing phosphate compounds having an olivine structure, sodium-containing layered oxides, and sodium-containing oxides having a spinel structure. For example, the sodium-containing phosphate compounds may be at least one selected from the group consisting of Na3V2(PO4)3, NaCoFe2(PO4)3, Na2Ni2Fe(PO4)3, Na3Fe2(PO4)3, Na2FeP2O7, Na4Fe3(PO4)2(PO2O7), and the sodium-containing layered oxide may be at least one selected from the group consisting of NaFeO2.

[0023] Alternatively, the positive electrode active material may be, for example, an oxide, a disulfide, a chalcogenide, or a conductive polymer. The oxide may be, for example, titanium oxide, vanadium oxide, or manganese dioxide. The disulfide may be, for example, titanium disulfide or molybdenum sulfide. The chalcogenide may be, for example, niobium selenide. The conductive polymer may be, for example, a disulfide, polypyrrole, polyaniline, polythiophene, polyparastyrene, polyacetylene, or polyacene.

[0024] (Negative electrode active material) The negative electrode active material contained in the negative electrode layer 120 may be at least one selected from the group consisting of an oxide containing at least one element selected from the group consisting of titanium (Ti), silicon (Si), tin (Sn), chromium (Cr), iron (Fe), niobium (Nb), and molybdenum (Mo), a carbon material such as graphite, a graphite-lithium compound, a lithium alloy, a lithium-containing phosphate compound having a Nasicon structure, a lithium-containing phosphate compound having an olivine structure, and a lithium-containing oxide having a spinel structure. An example of a lithium alloy is Li-Al. An example of a lithium-containing phosphate compound having a Nasicon structure is Li3V2(PO4)3 and / or LiTi2(PO4)3. An example of a lithium-containing phosphate compound having an olivine structure is Li3Fe2(PO4)3 and / or LiCuPO4. An example of a lithium-containing oxide having a spinel structure is Li4Ti5O. 12 etc.

[0025] In addition, the negative electrode active material capable of absorbing and releasing sodium ions may be at least one selected from the group consisting of sodium-containing phosphate compounds having a Nasicon structure, sodium-containing phosphate compounds having an olivine structure, and sodium-containing oxides having a spinel structure.

[0026] In the solid-state battery, the positive electrode layer and the negative electrode layer may be made of the same material.

[0027] The positive electrode layer and / or the negative electrode layer may contain a conductive material, which may include at least one of metal materials such as silver, palladium, gold, platinum, aluminum, copper, and nickel, and carbon.

[0028] Furthermore, the positive electrode layer and / or the negative electrode layer may contain a sintering aid, such as at least one selected from the group consisting of lithium oxide, sodium oxide, potassium oxide, boron oxide, silicon oxide, bismuth oxide, and phosphorus oxide.

[0029] There are no particular limitations on the thickness of the positive electrode layer and the negative electrode layer, but for example, they may each independently be 2 μm or more and 50 μm or less, particularly 5 μm or more and 30 μm or less.

[0030] (Positive electrode current collecting layer / Negative electrode current collecting layer) Although not essential elements of the electrode layer, the positive electrode layer 110 and the negative electrode layer 120 may each include a positive electrode current collecting layer and a negative electrode current collecting layer. The positive electrode current collecting layer and the negative electrode current collecting layer may each be in the form of a foil. However, if it is more important to improve electronic conductivity through co-firing, reduce the manufacturing cost of the solid-state battery, and / or reduce the internal resistance of the solid-state battery, the positive electrode current collecting layer and the negative electrode current collecting layer may each be in the form of a sintered body. The positive electrode current collecting layer and the negative electrode current collecting layer are preferably made of a material with high conductivity, such as silver, palladium, gold, platinum, aluminum, copper, and / or nickel. The positive electrode current collecting layer and the negative electrode current collecting layer may each have an electrical connection portion for electrical connection to the outside and may be configured to be electrically connectable to an end electrode. Note that when the positive electrode current collecting layer and the negative electrode current collecting layer are in the form of a sintered body, they may be made of a sintered body containing a conductive material and a sintering aid. The conductive materials contained in the positive electrode current collecting layer and the negative electrode current collecting layer may be selected from, for example, the same materials as the conductive materials that may be contained in the positive electrode layer and the negative electrode layer. The sintering aids contained in the positive electrode current collecting layer and the negative electrode current collecting layer may be selected from, for example, the same materials as the sintering aids that may be contained in the positive electrode layer and the negative electrode layer. As described above, the positive electrode current collecting layer and the negative electrode current collecting layer are not essential for a solid-state battery, and a solid-state battery that does not include such a positive electrode current collecting layer and a negative electrode current collecting layer is also conceivable. In other words, the solid-state battery included in the module of the present invention may be a solid-state battery without a current collecting layer.

[0031] (solid electrolyte) The solid electrolyte is a material capable of conducting lithium ions or sodium ions. In particular, the solid electrolyte layer 130, which constitutes a battery structural unit in a solid-state battery, may be a layer capable of conducting lithium ions between the positive electrode layer 110 and the negative electrode layer 120. The solid electrolyte layer need only be provided at least between the positive electrode layer and the negative electrode layer. In other words, the solid electrolyte layer may be present around the positive electrode layer and / or the negative electrode layer so as to extend from between the positive electrode layer and the negative electrode layer. The solid electrolyte contained in the solid electrolyte layer may include, for example, one or more of a crystalline solid electrolyte, a glass-based solid electrolyte, a glass-ceramic solid electrolyte, and the like.

[0032] The crystalline solid electrolyte is, for example, an oxide-based crystalline material and a sulfide-based crystalline material. Examples of the oxide-based crystalline material include a lithium-containing phosphate compound having a Nasicon structure, an oxide having a perovskite structure, an oxide having a garnet-type or garnet-like structure, and an oxide glass ceramic-based lithium ion conductor. Examples of the lithium-containing phosphate compound having a Nasicon structure include Li x M y (PO4)3 (1≦x≦2, 1≦y≦2, M is at least one selected from the group consisting of titanium (Ti), germanium (Ge), aluminum (Al), gallium (Ga) and zirconium (Zr)). An example of a lithium-containing phosphate compound having a Nasicon structure is, for example, Li 1.2 Al 0.2 Ti 1.8 (PO4)3, etc. An example of an oxide with a perovskite structure is La 0.55 Li 0.35 Examples of oxides with garnet or garnet-like structures include Li7La3Zr2O 12 Examples of sulfide-based crystal materials include thio-LISICON, for example, Li 3.25 Ge 0.25 P 0.75 S4 and Li 10 GeP2S12 The crystalline solid electrolyte may include a polymer material (for example, polyethylene oxide (PEO)).

[0033] Glass-based solid electrolytes include, for example, oxide-based glass materials and sulfide-based glass materials. Examples of oxide-based glass materials include 50Li4SiO4·50Li3BO3. Examples of sulfide-based glass materials include 30Li2S·26B2S3·44LiI, 63Li2S·36SiS2·1Li3PO4, 57Li2S·38SiS2·5Li4SiO4, 70Li2S·30P2S5, and 50Li2S·50GeS2.

[0034] The glass ceramic solid electrolyte is, for example, an oxide-based glass ceramic material or a sulfide-based glass ceramic material. As the oxide-based glass ceramic material, for example, a phosphate compound containing lithium, aluminum, and titanium as constituent elements (LATP) or a phosphate compound containing lithium, aluminum, and germanium as constituent elements (LAGP) can be used. LATP is, for example, Li 1.07 Al 0.69 Ti 1.46 (PO4)3, etc. Also, LAGP is, for example, Li 1.5 Al 0.5 Ge 1.5 (PO4), etc. Examples of sulfide-based glass ceramic materials include Li7P3S 11 and Li 3.25 P 0.95 Examples include S4.

[0035] In addition, examples of solid electrolytes capable of conducting sodium ions include sodium-containing phosphate compounds having a Nasicon structure, oxides having a perovskite structure, and oxides having a garnet or garnet-like structure. Examples of sodium-containing phosphate compounds having a Nasicon structure include Na x M y (PO4)3 (1≦x≦2, 1≦y≦2, M is at least one selected from the group consisting of Ti, Ge, Al, Ga and Zr).

[0036] The solid electrolyte layer may contain a sintering aid. The sintering aid contained in the solid electrolyte layer may be selected from the same materials as the sintering aids that may be contained in the positive electrode layer and the negative electrode layer, for example.

[0037] The thickness of the solid electrolyte is not particularly limited. The thickness of the solid electrolyte located between the positive electrode layer and the negative electrode layer may be, for example, 1 μm to 50 μm, 1 μm to 15 μm, or 10 μm to 40 μm, particularly 1 μm to 5 μm.

[0038] (end face electrode) A solid-state battery generally has end electrodes 140. In particular, end electrodes are provided on the side surfaces of the solid-state battery. More specifically, a positive end electrode 140A connected to the positive electrode layer 110 and a negative end electrode 140B connected to the negative electrode layer 120 are provided (see FIG. 1). Such end electrodes are preferably made of a material with high conductivity. Specific materials for the end electrodes are not particularly limited, but may include at least one selected from the group consisting of silver, gold, platinum, aluminum, copper, tin, and nickel.

[0039] [Basic structure of a solid-state battery module] The basic configuration of the solid-state battery module will be described below. As described above, the solid-state battery module 1000 according to one embodiment of the present invention includes the substrate 200 and the solid-state battery 100 provided on the substrate 200 (see FIG. 1). Therefore, by interposing the substrate 200 between the solid-state battery 100 and an external substrate, it is possible to prevent water vapor from entering the solid-state battery 100.

[0040] As shown in FIG. 1, the substrate 200 has a main surface larger than that of the solid-state battery. A printed circuit board can be used as the substrate 200. The type of substrate is not particularly limited, and it may be a resin substrate or a ceramic substrate. It may also be a rigid substrate or a flexible substrate. Examples of ceramic substrates include an alumina substrate, an LTCC substrate, and an HTCC substrate. The resin substrate may be made of a material in which a base material is impregnated with a resin. Examples of the base material include paper, glass fiber cloth, and resin film. The resin may be a thermoplastic resin and / or a thermosetting resin. Examples of the substrate include a paper-phenolic substrate in which a paper base material is impregnated with a phenolic resin, a paper-epoxy substrate in which a paper base material is impregnated with an epoxy resin, a glass-epoxy substrate in which a glass fiber cloth is impregnated with an epoxy resin, and a flexible substrate made of polyimide or PET (polyethylene terephthalate) resin. The wiring provided on the substrate may be made of at least one metal selected from the group consisting of Cu, Ni, Ag, Au, and Pt.

[0041] The substrate is preferably a member for electrically connecting the modularized solid-state battery to the outside. In other words, it can be said that the substrate serves as a terminal substrate for the external terminals of the solid-state battery. A solid-state battery module including such a substrate can mount the solid-state battery on another secondary substrate such as a printed wiring board with the substrate interposed therebetween. For example, the solid-state battery can be surface-mounted using solder or conductive paste. For these reasons, the solid-state battery module of the present invention is preferably an SMD (Surface Mount Device) type battery module.

[0042] [Characteristics of the present invention] The following describes the characteristics of the present invention. The description will be made with reference to the drawings. The contents shown in the drawings are merely schematic and illustrative for understanding the present invention, and the appearance and dimensional ratios may differ from the actual product. In each drawing, components having the same function may be assigned the same reference numerals. In the embodiments described below, descriptions of matters common to the above may be omitted, and only differences may be described. Furthermore, the various embodiments described below may be implemented in any combination, and are not limited to the embodiments described in this application.

[0043] 1, a solid-state battery module 1000 according to one embodiment includes a substrate 200, a solid-state battery 100 disposed on the substrate 200, and a wireless power supply circuit including a capacitor 300. At least the capacitor 300 and the solid-state battery 100 are disposed on the same main surface of the substrate 200.

[0044] The substrate 200 has two main surfaces facing each other. The capacitor 300 is disposed on one main surface of the substrate 200 via the wiring 220. In other words, the capacitor 300 is positioned on one main surface of the substrate 200 via the wiring 220. The solid-state battery 100 is disposed on one main surface of the substrate 200 via the end surface electrode 140. In other words, the solid-state battery 100 is positioned on one main surface of the substrate 200 via the end surface electrode 140. Here, the capacitor 300 and the solid-state battery 100 are disposed on the same main surface of the substrate 200. In other words, the capacitor 300 is disposed on the same main surface as the main surface of the substrate 200 on which the solid-state battery 100 is provided. In other words, the solid-state battery 100 is disposed on the same main surface as the main surface of the substrate 200 on which the capacitor 300 is provided.

[0045] The wireless power supply circuit may be mounted on the substrate 200 (not shown). Power may be transmitted to the solid-state battery module 1000 from an external power transmission circuit. Specifically, when the wireless power supply circuit receives electromagnetic waves (alternating magnetic fields) generated by the power transmission circuit, an induced current may flow in the wireless power supply circuit. The induced current flowing through the wireless power supply circuit may flow to a capacitor in the circuit. When a current flows through the capacitor, Joule heat is generated by the resistance component (internal resistance) of the capacitor, and the capacitor may generate heat.

[0046] In this embodiment, the solid-state battery module of the present disclosure can achieve the following effects.

[0047] In the past, batteries were heated using a heating element that generates heat in response to electromagnetic waves supplied during wireless power transfer, and the battery was charged using the power generated by these electromagnetic waves. This method relied on the use of a heating element specialized for heating batteries. To heat a battery using a heating element, it was necessary to irradiate the battery with electromagnetic waves that efficiently generate heat, but the electromagnetic waves used when charging a battery were not necessarily those that efficiently generate heat in the heating element. Therefore, it was difficult for the heating element to efficiently heat the battery.

[0048] In the solid-state battery module of the present disclosure, the capacitor may generate heat when the solid-state battery is charged. Because at least the capacitor and the solid-state battery are arranged on the same main surface of the substrate, the heat from the capacitor may be transferred to the solid-state battery, causing the solid-state battery to heat up. In other words, the capacitor used to charge the solid-state battery via wireless power transfer may also function as a heating device for the solid-state battery. Therefore, in the present disclosure, the solid-state battery can be suitably heated when being charged via wireless power transfer.

[0049] Furthermore, in the past, in order to perform both wireless power supply and battery temperature increase, it was necessary to select a material that would allow the heating element to efficiently generate heat using the electromagnetic waves used for wireless power supply. Furthermore, since there was a risk that the electromagnetic waves used for wireless power supply would heat metals other than the heating element, the materials and configuration of the secondary battery module were likely to be limited.

[0050] In the solid-state battery module of the present disclosure, the capacitor used to charge the solid-state battery via wireless power supply can function as a heating device for the solid-state battery. Therefore, a heating element specialized for heating the battery, as in the past, can be omitted, and the components and configuration of the secondary battery module are less likely to be limited. In other words, since the heating element can be omitted, it is easier to secure space for installing other battery components, etc. Furthermore, since the heating element can be omitted, the consumption of electrical energy, etc. required to drive the entire solid-state battery module can be reduced as a result.

[0051] FIG. 2 shows a circuit diagram including a wireless power supply circuit according to one embodiment, and describes charging of a solid-state battery by wireless power supply.

[0052] 2 includes a power receiving unit 1 and a power transmitting unit 2. Because power can be transmitted wirelessly from the power transmitting unit 2 to the power receiving unit 1, the power receiving unit 1 is also referred to as a wireless power supply circuit. The power receiving unit 1 includes a power receiving circuit 10, step-up / step-down circuits 20A and 20B, a battery charging circuit 30, and a load 40. The power transmitting unit 2 includes a power transmitting circuit 50.

[0053] First, the specific configuration of the power receiving unit 1 will be described.

[0054] Power can be transmitted wirelessly from the power transmitting unit 2 to the power receiving circuit 10. The power receiving circuit 10 includes a power receiving coil 11, a capacitor 300, a resistor 13, and a rectifier circuit 14.

[0055] The power receiving coil 11 generates an induced current when it receives electromagnetic waves from the power transmitting unit 2. The power receiving coil 11 and the capacitor 300 are electrically connected to each other. Specifically, the power receiving coil 11 and the capacitor 300 are connected in parallel to each other. When an induced current flows through the capacitor 300, Joule heat is generated due to the resistance component (internal resistance) of the capacitor 300, and the capacitor 300 may generate heat. Since the capacitor 300 may be provided on the same main surface as the main surface of the substrate 200 on which the solid-state battery 100 is provided, the heat generated by the capacitor 300 causes the temperature of the solid-state battery 100 to rise. Note that the resistor 13 in the power receiving circuit 10 may be, for example, the resistance component of the power receiving coil 11.

[0056] Rectifier circuit 14 rectifies the induced current generated by receiving coil 11 and converts AC to DC. In Fig. 2, rectifier circuit 14 is represented as a diode bridge circuit. A smoothing capacitor C1 is connected to the output of rectifier circuit 14, and the output voltage output from the rectifier circuit is smoothed.

[0057] The rectified and smoothed voltage is input to the step-up / step-down circuit 20A. The step-up / step-down circuit 20A converts the input voltage. For example, a DC-DC converter or an LDO (Low Dropout Regulator) may be used as the step-up / step-down circuit 20A. A smoothing capacitor C2 is connected to the output of the step-up / step-down circuit 20A, and smoothes the output voltage from the step-up / step-down circuit 20A. The smoothed output voltage of the step-up / step-down circuit 20A is input to a battery charging circuit 30 that controls charging of the solid-state battery. The output voltage from the battery charging circuit 30 is smoothed by a smoothing capacitor C3 and input to the solid-state battery 100, thereby charging the solid-state battery 100. The output voltage from the battery charging circuit 30 is also converted by a step-up / step-down circuit 20B. The output voltage from the step-up / step-down circuit 20B is smoothed by a smoothing capacitor C4 and then consumed by a load 40. The step-up / step-down circuit 20B may be, for example, a DC-DC converter or an LDO (Low Dropout regulator).

[0058] The power receiving unit may be mounted on a substrate of the solid-state battery module (not shown). Specifically, the wireless power supply circuit may be mounted on the substrate. Specifically, at least a part of the circuits and circuit elements constituting the wireless power supply circuit may be provided on the main surface of the substrate on which the solid-state battery is disposed and / or on the main surface opposite to the main surface of the substrate on which the solid-state battery is disposed.

[0059] The capacitor may be, for example, a ceramic capacitor, an electrolytic capacitor, and / or a film capacitor. Surface-mounted (SMD) capacitors are preferably used in terms of mounting on a substrate. Multilayer ceramic capacitors (MLCCs) may also be used as such capacitors. Multilayer ceramic capacitors have relatively high heat resistance and are easily miniaturized, which can contribute to the miniaturization of solid-state battery modules. The capacitors used in the present disclosure are commercially available.

[0060] The capacitor may be mounted on the substrate by, for example, solder and / or conductive resin.

[0061] The solder is not particularly limited, but may be at least one selected from the group consisting of Sn, Sb, Zn, Al, Bi, Cu, Ag, and Pb. Specifically, at least one selected from the group consisting of SnAgCu, SnAg, SnSb, AuSn, and AlZn solders may be used.

[0062] The conductive resin may be, for example, a conductive paste, which is composed of a resin material containing a conductive filler. The conductive paste may be Ag paste, Cu paste, Ni paste, or carbon paste. The conductive filler may be at least one selected from the group consisting of nickel, copper, aluminum, gold, and carbon, and the resin material may be at least one selected from the group consisting of epoxy resin, acrylic resin, silicone resin, and urethane resin.

[0063] The power receiving unit may further include other circuits, such as a wireless communication circuit (such as Wi-Fi, Bluetooth, NFC, RF-ID, Zig-Bee, and / or specific low-power radio), a protection circuit, a current path circuit, and / or a sensor circuit.

[0064] In one embodiment, other circuits that may be included in the power receiving unit may be provided on the main surface of the substrate on which the capacitor is provided. In other words, other circuits that may be included in the power receiving unit may be provided on the same plane as the substrate on which the capacitor is mounted. Such other circuits may include, for example, a battery charging circuit, a step-up circuit (DC-DC), a step-down circuit (DC-DC, LDO), a wireless power supply transmitting / receiving circuit, a wireless communication circuit (Wi-Fi, Bluetooth, NFC, RF-ID, ZigBee, and / or specified low-power radio, etc.), a protection circuit, a current path circuit, and / or a sensor circuit.

[0065] Next, a specific configuration of the power transmission unit 2 will be described.

[0066] The power transmitting circuit 50 includes a power transmitting coil 51, a capacitor 52, a resistor 53, and a power transmitting driver 54. The power transmitting driver 54 includes an AC power supply and supplies AC current to the power transmitting circuit 50. When AC current is supplied to the power transmitting coil 51, electromagnetic waves (alternating magnetic fields) are generated in the power transmitting coil 51. When the power receiving unit 1 receives the electromagnetic waves, power is transmitted from the power transmitting unit 2 to the power receiving unit 1. Note that the resistor 53 in the power transmitting circuit 50 may be, for example, a resistance component of the power transmitting coil 51.

[0067] The solid-state battery module of the present disclosure may further take the following forms.

[0068] In one embodiment, as shown in Fig. 1 , the capacitor 300 may be disposed on the substrate 200. The capacitor 300 may be disposed in contact with a main surface 210 (hereinafter also referred to as a first main surface) of the substrate 200 facing the solid-state battery 100. Specifically, the capacitor 300 may be mounted on the surface of the substrate 200 via a mounting pad. Since the solid-state battery 100 is disposed on the substrate 200, adopting this embodiment shortens the distance between the capacitor 300 and the solid-state battery 100. Therefore, it becomes easier to raise the temperature of the solid-state battery 100 by heat generated from the capacitor 300.

[0069] In one embodiment, as shown in FIG. 1 , the capacitor 300 may be provided between the solid-state battery 100 and the substrate 200. That is, the capacitor 300 may be disposed below the solid-state battery 100. From another perspective, the capacitor 300 may be disposed in a region where the solid-state battery 100 and the substrate 200 overlap. By adopting such an embodiment, the capacitor 300 and the solid-state battery 100 are positioned closer to each other. In other words, the capacitor 300 and the solid-state battery 100 are positioned closer to each other, which makes it easier to efficiently transfer heat generated by the capacitor 300 to the solid-state battery 100. In particular, a more effective effect is expected for all-solid-state batteries, which have a relatively high internal resistance, since the decrease in resistance due to temperature rise is relatively large.

[0070] As shown in FIG. 1 , when the capacitor 300 is provided between the solid-state battery 100 and the substrate 200, the minimum distance D1 between the solid-state battery 100 and an opposing surface 310 of the capacitor 300 facing the solid-state battery 100 in a cross-sectional view may be smaller than the minimum distance D2 between the solid-state battery 100 and the substrate 200. Note that the minimum distance D2 between the solid-state battery 100 and the substrate 200 may be the minimum distance between the substrate 200 and a surface of the solid-state battery 100 other than the end surface electrode 140 of the solid-state battery 100. For example, the minimum distance D1 may be greater than 0% and less than 50%, and preferably greater than 0% and less than 30%, of the minimum distance D2 between the solid-state battery 100 and the substrate 200. When the minimum distance D1 is within the above range, heat generated by the capacitor is more easily conducted to the solid-state battery 100.

[0071] In one embodiment, the capacitor is preferably a matching capacitor. In other words, the capacitor in the power receiving circuit of the present disclosure preferably resonates. Specifically, the matching capacitor preferably resonates together with the power receiving coil at a predetermined frequency. The matching capacitor generates a parallel resonance effect with the power receiving coil (inductance) at a resonance frequency f0. The resonance frequency f0 is calculated using the following formula (1): <Expression 1> TIFF0007800693000001.tif1566 [in formula (1) L is the inductance (H) C is capacitance (F). The receiving current flowing through the circuit including the matching capacitor increases, peaking at the resonance frequency f0.

[0072] As described above, the matching capacitor can resonate with the receiving coil when it satisfies equation (1), and is therefore also called a resonant capacitor. In addition, in the circuit diagram of Figure 2, the circuit including capacitor 300 and receiving coil 11 is also called resonant circuit 10LC.

[0073] The matching capacitor and the receiving coil resonate to increase the receiving current, and the matching capacitor through which the increased receiving current flows can generate heat. Specifically, the matching capacitor through which the increased receiving current flows generates heat due to its internal resistance, and the following equation is expressed: P = RI 2 In other words, the heat generated by the capacitor is proportional to the square of the current value, so the increased incoming current due to resonance causes the capacitor to generate more heat, which can effectively raise the temperature of the solid-state battery.

[0074] The frequency at which the receiving coil and matching capacitor resonate in the resonant circuit may be a frequency commonly used in wireless power transfer. For example, the resonant frequency f0 may be 100 kHz or higher and 10 GHz or lower. Alternatively, it may be a frequency that complies with the wireless power transfer standard. For example, it may be a frequency used in the Qi standard.

[0075] In the resonant circuit, the receiving current increases with a peak at the resonant frequency f0, as described above. In one embodiment, the frequency of the receiving current consumed as heat generated in the matching capacitor does not necessarily have to match the resonant frequency f0. For example, it may be a frequency in the range of −20% to +20% of the resonant frequency f0, preferably −15% to +15%, and more preferably −10% to +10%. If the resonant circuit receives electromagnetic waves within the above frequency range and the receiving current increases, the capacitor can be a “matching capacitor.” Within the above frequency range, it becomes easier to efficiently both heat up the solid-state battery and charge the solid-state battery.

[0076] The resonance between the matching capacitor and the receiving coil is not limited to resonance caused by electromagnetic waves (alternating magnetic fields) generated primarily for the purpose of power transmission, but may also be caused by wireless data reception, for example.

[0077] The resonance between the matching capacitor and the receiving coil may be, for example, a magnetic resonance resonance system. That is, a resonant circuit may be provided in the power transmitting unit, and a resonant circuit that resonates at the same resonant frequency as the resonant circuit in the power transmitting unit may be provided in the power receiving unit. By using magnetic resonance for wireless power transfer, power transmission efficiency is improved, and both charging of the solid-state battery and heat generation of the capacitor can be performed efficiently.

[0078] In one embodiment, the solid-state battery module 1000 may further include a covering portion covering the solid-state batteries and the capacitors. The covering portion 500 is a layer that covers at least the solid-state batteries and the capacitors. As shown in FIG. 1 , the solid-state batteries 100 and the capacitors 300 on the substrate 200 are largely and entirely enveloped by the covering portion 500. In other words, the solid-state batteries 100 and the capacitors 300 provided on the substrate 200 may be covered with the covering portion 500 so as to be entirely enclosed.

[0079] From another perspective, the capacitor may be disposed inside the outer surface of the covering portion that covers the solid-state battery. "Inside the outer surface of the covering portion" means the side facing the solid-state battery 100 from the surface of the covering portion that is exposed to the outside. In this embodiment, the capacitor can be said to be provided inside the covering portion. When the capacitor is disposed inside the outer surface of the covering portion, heat from the capacitor is more easily transferred to the solid-state battery via the covering portion, making it easier for the solid-state battery to heat up efficiently.

[0080] The covering portion covers the solid-state battery and the capacitor, thereby insulating the solid-state battery from the external environment. This can further suppress deterioration of battery characteristics due to water vapor (more specifically, the phenomenon in which water vapor from the external environment is mixed in and deteriorates the characteristics of the solid-state battery). Note that "water vapor" as used in this specification is not limited to gaseous water, but also includes liquid water. In other words, the term "water vapor" is used to broadly encompass anything related to water, regardless of its physical state. Therefore, "water vapor" can also be referred to as moisture, and liquid water can include condensed water formed by condensing gaseous water.

[0081] In one embodiment, as shown in Fig. 1, a covering portion 500 may be provided between the solid-state battery 100 and the capacitor 300. In the circuit diagram of Fig. 2, the covering portion 500 is positioned between the capacitor 300 and the solid-state battery 100. By adopting such a configuration, the gap between the solid-state battery 100 and the capacitor 300 can be reduced. Since the covering portion has a relatively higher thermal conductivity than the gap (air), providing the covering portion 500 between the solid-state battery 100 and the capacitor 300 makes it easier for heat generated from the capacitor to be efficiently conducted to the solid-state battery.

[0082] The coating portion may include a coating insulating layer. The coating insulating layer may be of any type as long as it exhibits insulating properties. For example, the coating insulating layer preferably corresponds to a resin layer. In other words, the coating insulating layer preferably contains a resin, which serves as the base material of the layer.

[0083] The material of the covering insulating layer may be any type as long as it exhibits insulating properties. For example, the covering insulating layer may contain a resin, which may be either a thermosetting resin or a thermoplastic resin. The covering insulating layer may contain an inorganic filler. As just one example, the covering insulating layer may be made of an epoxy-based resin containing an inorganic filler such as SiC, SiO2, or SiN. The resistivity of the covering insulating layer may be, for example, 10 6 It is sufficient if it is Ω·cm or more.

[0084] The covering portion may include a covering inorganic layer. The covering inorganic layer is provided so as to cover the covering insulating layer. The covering inorganic layer is positioned on the covering insulating layer, and therefore has a form that, together with the covering insulating layer, largely envelops the solid-state battery on the substrate as a whole. This covering inorganic layer may have, for example, a film form. Furthermore, the covering inorganic layer can also be configured to cover the side surfaces of the substrate. The covering insulating layer works together with the covering inorganic layer to form a suitable water vapor barrier, and the covering inorganic layer also works together with the covering insulating layer to form a suitable water vapor barrier.

[0085] In this specification, the term "barrier" means that the substrate has a water vapor permeability preventing property to such an extent that water vapor from the external environment does not pass through the substrate and cause undesirable deterioration of the characteristics of the solid-state battery. In a narrow sense, the term "barrier" means that the substrate has a water vapor permeability of 5×10 -3 g / (m 2 In short, the water vapor barrier layer is preferably 0 to 5×10 -3 g / (m 2 It has a water vapor transmission rate of less than 100% (100%).

[0086] The material of the coating inorganic layer is not particularly limited and may be metal, glass, oxide ceramics, or a mixture thereof. The coating inorganic layer may correspond to an inorganic layer having a thin film form, and in this case, it is preferably a metal film. As just one example, the coating inorganic layer may be made of a Cu-based and / or Ni-based material plated to a thickness of 2 to 50 μm.

[0087] In one embodiment, a plurality of capacitors may be provided in parallel on the substrate. As shown in Fig. 3, this differs from Fig. 1 in that a plurality of capacitors 300 are provided on the substrate. Each capacitor 300 is provided on the substrate 200 via wiring 220, and is arranged on the substrate 200 at a predetermined interval. In other words, the plurality of capacitors 300 are arranged side by side on the substrate 200 with a certain distance between them. By providing a plurality of capacitors 300 in parallel on the substrate 200, there are multiple points at which the solid-state battery 100 can be heated, making it easier to raise the temperature of the solid-state battery 100.

[0088] When multiple capacitors are provided on a substrate, the multiple capacitors are preferably connected in parallel to each other, as shown in the circuit diagram of Fig. 4. Parallel connection of multiple capacitors 300 divides the current flowing into the capacitors 300, making it easier to suppress thermal degradation of the capacitors 300. Parallel connection of the capacitors 300 also makes it possible to precisely set the parallel combined capacitance, making it easier to precisely set the resonant frequency f0.

[0089] In one embodiment, from the viewpoint of favorable thermal conduction of heat generated from the capacitor to the solid-state battery, it is preferable that the capacitor be arranged so as to overlap with the central region of the solid-state battery. FIG. 5 shows a schematic diagram of the solid-state battery module 1000 of FIG. 1 as viewed from direction A. In FIG. 5, the capacitor 300 is arranged in the central region of the solid-state battery 100. The "central region of the solid-state battery" refers to the central region of the main surface of the solid-state battery 100 facing the substrate 200. By arranging the capacitor 300 so as to overlap with the central region of the solid-state battery 100, heat generated from the capacitor 300 is more easily conducted evenly from the central region of the solid-state battery 100 to its surrounding regions. In other words, the temperature rise of the solid-state battery is prevented from being concentrated in a specific portion of the solid-state battery, and as a result, the temperature of the entire solid-state battery can be raised more quickly.

[0090] When multiple capacitors are provided, they may be arranged so that heat generated from the capacitors is evenly transferred to the solid-state battery. In other words, the capacitors may be arranged so as to sandwich the central region of the solid-state battery. For example, as shown in FIG. 5, the capacitors 300 may be arranged at positions A and A' that sandwich the central region. From a similar perspective, the capacitors 300 may also be arranged at positions B and B', C and C', D and D', or a combination of these. By providing multiple capacitors in this way, heat generated from the capacitors 300 is more easily transferred evenly to the solid-state battery 100. As a result, the temperature of the entire solid-state battery can be raised more quickly.

[0091] In one embodiment, the power receiving circuit 10 may further include a conductor portion, which may be arranged to be thermally conductive with the capacitor. As shown in FIG. 6, the power receiving circuit 10 differs from FIG. 1 in that a conductor portion 400 is arranged on a substrate 200. As shown in the circuit diagram of FIG. 7, the conductor portion 400 is arranged in the power receiving circuit 10. "Arranged to be thermally conductive" as used herein means that the conductor portion 400 is arranged so that at least a portion of the heat generated by the capacitor 300 can be transferred to the conductor portion 400. By adopting such an embodiment, it becomes easier to efficiently transfer heat generated from the capacitor 300 to the solid-state battery 100 via the conductor portion 400.

[0092] "Arranged so as to allow thermal conduction" includes direct contact between the conductor and the capacitor, thereby conducting heat from the capacitor to the conductor. It also includes the transfer of heat from the capacitor to the conductor by thermal radiation even when the conductor and the capacitor are not in contact with each other.

[0093] The conductor portion 400 that has received heat from the capacitor 300 can thermally conduct the heat to the solid-state battery 100. In this regard, it is preferable that the conductor portion 400 and the solid-state battery 100 are close to each other. In one embodiment, the conductor portion 400 and the solid-state battery 100 may be in contact with each other.

[0094] The conductor section 400 and the capacitor 300 are preferably connected to the same wiring. Also, the conductor section 400 and the capacitor 300 are preferably connected to the same mounting pad. By adopting such an embodiment, heat from the capacitor 300 is more easily conducted to the conductor section 400 via the wiring 220 or the mounting pad, and the temperature of the solid-state battery 100 is more easily raised.

[0095] The conductor portion may be a metal conductor portion. Specifically, the metal conductor portion may be made of at least one material selected from the group consisting of Cu, Ag, Au, Al, Ni, W, and Mo. When the capacitor is mounted on a substrate, the conductor portion may be made of Cu. An example of the conductor portion is a metal pin, such as a Cu pin. The conductor portion may also be a ceramic conductor portion. Specifically, the ceramic conductor portion may be made of SiC or AlN. The conductor portion may also be referred to as a thermally conductive post.

[0096] The conductor portion may be plated. For example, the surface of the conductor portion may be plated with at least one material selected from the group consisting of Au, Ni, and Sn. Plating the conductor portion makes it easier to solder the conductor portion to a substrate. The conductor portion may also be mounted to a substrate using a conductive member, etc., as described below.

[0097] The thermal conductivity of the conductor portion should be 100 W / m·K or more from the viewpoint of efficiently transferring heat from the capacitor to the solid-state battery.

[0098] In one embodiment, as shown in Fig. 6, the conductor portion is preferably disposed between the substrate and the solid-state battery. That is, the conductor portion 400 is preferably disposed below the solid-state battery 100, specifically the solid-state battery 100. From another perspective, the conductor portion 400 may be disposed in a region where the solid-state battery 100 and the substrate 200 overlap. The conductor portion 400 may be disposed on the first main surface 210 of the substrate 200. By adopting such an embodiment, the conductor portion 400 and the solid-state battery 100 are brought closer to each other, and it becomes easier to efficiently transfer heat generated from the capacitor 300 to the solid-state battery 100 via the conductor portion 400.

[0099] In one embodiment, as shown in FIG. 8 , the conductor section 400 and the solid-state battery 100 are preferably interconnected via a conductive member 700. In the circuit diagram shown in FIG. 9 , the conductive member 700 is provided between the conductor section 400 and the solid-state battery 100. The conductive member 700 may have conductive and adhesive properties. Due to such properties, one side of the conductive member 700 may contact the conductor section 400, and the other side may contact the solid-state battery 100. That is, the conductive member 700 can contact the conductor section 400 and the solid-state battery 100. This ensures electrical connection between the solid-state battery 100 and the conductor section 400 while improving the physical connection strength between them. To prevent short circuits, the conductive member is preferably spaced apart from the end surface electrodes. Alternatively, from a similar perspective, an insulating thermally conductive sheet may be provided between the conductive member and the end surface electrodes.

[0100] The conductive member may be a thermally conductive adhesive or a thermally conductive sheet. Examples of the thermally conductive adhesive include Ag paste, Cu paste, Ni paste, and carbon paste. The thermally conductive sheet may be a silicone-based, acrylic-based, or carbon fiber-based thermally conductive sheet.

[0101] The thermal conductivity of the conductive member should be 1 W / m·K or more from the viewpoint of efficiently transferring heat from the capacitor to the solid-state battery.

[0102] In one embodiment, as shown in FIG. 8 , the width of the conductive member 700 may be larger than the width of the surface of the conductor portion 400 facing the solid-state battery 100. The "width of the conductive member 700" refers to the length of the conductive member 700 in the extension direction of the main surface of the substrate 200. The "width of the surface of the conductor portion 400 facing the solid-state battery 100" also refers to the same length. With this configuration, the conductive member 700 contacts the conductor portion 400 and contacts the solid-state battery 100 in a planar manner. That is, in addition to improving the electrical connection and physical connection strength between the solid-state battery 100 and the conductor portion 400, the contact area between the conductive member 700 and the solid-state battery 100 is also increased. For example, heat from the capacitor 300 is more easily transferred from the conductor portion 400 to the entire surface of the solid-state battery 100. This allows for more efficient heat transfer to the solid-state battery 100.

[0103] 1 , in order to enable electrical control of the capacitor 300, the wiring 220 of the substrate 200 continues from the first main surface 210 side through the interior of the substrate 200 to the second main surface 230 side opposite the first main surface 210. Therefore, heat from the capacitor 300 arranged on the wiring 220 on the first main surface 210 of the substrate 200 may escape to the outside not only through the main surface side on which the capacitor 300 is provided but also through the second main surface 230 side of the substrate 200. In view of this, in one embodiment, the capacitor 300 may further include a low thermal conductivity portion 600 having a thermal conductivity relatively lower than that of the capacitor 300, and the low thermal conductivity portion 600 may be arranged adjacent to the capacitor 300 (see FIG. 10 ).

[0104] According to this configuration, the low thermal conductivity portion has a thermal conductivity relatively lower than that of the capacitor, which makes it easier to suppress the transfer of heat generated from the capacitor 300 through the wiring. For example, it makes it easier to suppress the transfer of heat from the first main surface 210 side to the second main surface 230 side of the substrate 200. This suppression makes it easier for the capacitor 300 to heat the solid-state battery more suitably.

[0105] In a more preferred embodiment, the capacitor 300 may be sandwiched between at least two low thermal conductive portions 600, as shown in FIG. 10 . As shown in the circuit diagram of FIG. 11 , the low thermal conductive portions 600 may be provided on both sides of the electrodes of the capacitor 300. Specifically, at least two low thermal conductive portions 600 may be provided in close proximity to the capacitor 300. Such an arrangement of the low thermal conductive portions 600 shortens the separation distance between the capacitor 300 and the low thermal conductive portions 600, thereby reducing the possibility of heat escaping to the outside from the main surface on which the capacitor 300 is provided. This suppression makes it easier for the capacitor 300 to heat the solid-state battery more effectively.

[0106] The low thermal conductive portion preferably has low thermal conductivity and resistance. Specifically, the thermal conductivity of the low thermal conductive portion may be 100 W / m·K or less. The resistance of the low thermal conductive portion may be 0 Ω or more and 1 Ω or less. The low thermal conductive portion may be a jumper resistor and / or a chip fuse having electrical shorting characteristics. The low thermal conductive portion may be made of a material containing an inorganic insulator such as alumina. The low resistance of the low thermal conductive portion makes it less likely to affect the resistance of the entire circuit, allowing current to flow efficiently to the capacitor.

[0107] In one embodiment, the low thermal conductivity portion may increase in resistance and go from a short circuit state to an insulated state when a current (trip current) equal to or greater than a predetermined current value flows. Alternatively, the low thermal conductivity portion may increase in resistance and go from a short circuit state to an insulated state when the temperature reaches or exceeds a predetermined temperature. For example, a resettable fuse 610 may be used as such a low thermal conductivity portion (see FIG. 12). As shown in the circuit diagram of FIG. 13, low thermal conductivity portions may be provided on both sides of the electrodes of capacitor 300.

[0108] By using a low-thermal-conductivity part that becomes insulated when the current exceeds a certain value (trip current), it becomes easier to control the current flowing through the capacitor or the heat stored in the capacitor. In other words, it becomes easier to control the thermal load of the capacitor. Therefore, for example, in a complex switching circuit, it becomes easier to control the current flowing into the capacitor. Note that if the insulated low-thermal-conductivity part no longer meets the specified conditions (for example, below the trip current), the resistance value of the insulated low-thermal-conductivity part decreases, and it may again become short-circuited. Resettable fuses can also be called "resettable fuses," "polymer PTC elements (PPTC elements)," or "polyfuses."

[0109] In one embodiment, as shown in FIG. 14 , two or more capacitors are provided, and the two or more capacitors include a first capacitor 300 and a second capacitor 350, where the first capacitor 300 is disposed between the substrate 200 and the solid-state battery 100, while the second capacitor 350 may be disposed in a portion that does not overlap with the solid-state battery 100.

[0110] The circuit diagram shown in Fig. 15 differs from the circuit diagram in Fig. 2 in that it includes a heating circuit 10H for heating the solid-state battery and a charging circuit 10L for charging the solid-state battery. The heating circuit 10H includes a first receiving coil 11, a first capacitor 300, and a first resistor 13. The charging circuit 10L includes a second receiving coil 15, a second capacitor 350, and a second resistor 16. Power is transmitted to both the heating circuit 10H and the charging circuit 10L by an alternating magnetic field from the power transmitting unit, and current flows through them.

[0111] When a current flows through the first capacitor 300 of the heating circuit 10H, Joule heat is generated due to the resistance component (internal resistance) of the first capacitor 300, and the capacitor 300 may heat up. Because the first capacitor 300 is disposed between the substrate 200 and the solid-state battery 100, the heat generated in the first capacitor 300 is transferred to the solid-state battery 100, and the temperature of the solid-state battery 100 may increase. Here, the heating circuit 10H is not electrically connected to the solid-state battery 100, and therefore the heating circuit 10H does not charge the solid-state battery 100. In other words, the first capacitor 300 can be said to be a heating capacitor for increasing the temperature of the solid-state battery 100.

[0112] On the other hand, the charging circuit 10L is electrically connected to the solid-state battery 100. Therefore, the power transmitted from the power transmitting unit 2 to the charging circuit 10L is sent to the solid-state battery 100, and the solid-state battery 100 is charged. As shown in FIG. 14 , the second capacitor 350 of the charging circuit 10L is disposed in a portion that does not overlap with the solid-state battery 100. When the second capacitor 350 is disposed in this manner, heat generated from the second capacitor 350 is relatively less likely to be transmitted to the solid-state battery 100. In that the second capacitor 350 does not contribute much to a temperature rise of the solid-state battery 100, the second capacitor 350 can be said to be a charging capacitor.

[0113] In this way, by dividing the roles into a circuit for heating the solid-state battery and a circuit for charging the solid-state battery, it is possible to stably both heat up the solid-state battery and charge the solid-state battery.

[0114] In one embodiment, as shown in FIG. 16 , a solid-state battery module 1000 further includes a conductor portion 400 arranged to be thermally conductive with the capacitor 300, and a low thermally conductive portion 600 having thermal conductivity relatively lower than that of the capacitor 300. In the circuit diagram shown in FIG. 17 , the solid-state battery module 1000 further includes the capacitor 300, the conductor portion 400, and the low thermally conductive portion 600. The capacitor 300, the conductor portion 400, and the low thermally conductive portion 600 may be arranged in this order from the inside to the outside along the extending direction of the main surface of the substrate 200. From another perspective, the conductor portion 400 may be arranged to sandwich the capacitor 300, and the low thermally conductive portion 600 may be arranged to sandwich the capacitor 300 and the conductor portion 400.

[0115] By adopting such an embodiment, the conductor portion 400 makes it easier to efficiently transfer heat generated from the capacitor 300 to the solid-state battery 100, and the low thermal conductivity portion makes it easier to suppress the heat generated from the capacitor 300 from transferring via the wiring. Furthermore, the heat of the capacitor 300 that is transferred to the conductor portion 400 also makes it easier to suppress the heat from transferring via the wiring 220. In other words, the heat generated from the capacitor 300 can be more suitably transferred to the solid-state battery 100.

[0116] The present invention can be embodied in various forms, which will be described below.

[0117] (The receiving coil is covered by the covering portion) In one embodiment, the receiving coil may be covered by the covering. That is, the receiving coil may be packaged together with the solid-state battery while being covered by the covering. As shown in FIG. 18 , the receiving coil 11 is disposed on the same principal surface as the substrate 200 on which the solid-state battery 100 is disposed. In other words, the receiving coil 11 is positioned on the same principal surface as the substrate 200 on which the capacitor 300 is disposed. The receiving coil 11 on the substrate 200 is entirely surrounded by the covering 500. In other words, the receiving coil 11 disposed on the substrate 200 may be covered by the covering 500 so as to be entirely surrounded. Covering the receiving coil with the covering facilitates miniaturization of the solid-state battery module. Furthermore, the receiving coil is more easily protected from external impacts and the like, making it easier to prevent damage to the receiving coil.

[0118] (The receiving coil is exposed to the outside.) In one embodiment, the receiving coil may be exposed to the outside. In other words, the receiving coil may be disposed outside the outer surface of the covering. For example, as shown in FIG. 19 , the receiving coil 11 may be disposed on the principal surface of the substrate opposite to the principal surface on which the capacitor and the solid-state battery are disposed. Alternatively, as shown in FIG. 20 , the receiving coil 11 may be disposed on the top surface of the solid-state battery 100. In other words, the receiving coil 11 may be disposed so as to sandwich the solid-state battery 100 between the receiving coil 11 and the substrate 200. In FIG. 20 , the receiving coil 11 and the substrate 200, which are disposed so as to sandwich the solid-state battery 100, are electrically connected via connection wiring 240 and substrate-receiving-coil connection wiring 250. The substrate-receiving-coil connection wiring 250 may be a metal rod or plate containing Cu, Ni, Al, Au, Ag, Pt, Zn, Ti, Mo, Nb, W, or an alloy thereof. By exposing the power receiving coil 11 to the outside, the power receiving coil 11 can more easily receive electromagnetic waves from the outside, and the power receiving current sent to the capacitor 300 can be increased. As a result, the capacitor 300 can more efficiently generate heat, and the temperature of the solid-state battery 100 can be more easily raised.

[0119] As shown in FIGS. 19 and 20 , a magnetic sheet 800 can be provided to suppress overcurrent to metals included in the components constituting the solid-state battery module 1000. For example, the magnetic sheet 800 and the power receiving coil 11 may be integrated, with the magnetic sheet 800 side of the integrated assembly facing the solid-state battery 100. In FIGS. 19 and 20 , the magnetic sheet 800 and the power receiving coil 11 are provided, but the magnetic sheet 800 is arranged closer to the solid-state battery 100, and the power receiving coil 11 is arranged more distally from the solid-state battery 100. In another embodiment, the magnetic sheet 800 may further cover the covering 500. The integrated assembly including the power receiving coil 11 and the magnetic sheet 800 is electrically connected to the solid-state battery by the connection wiring 240. Therefore, an induced current generated by the power receiving coil 11 can flow to the capacitor 300 and charge the solid-state battery. The capacitor 300, through which a current flows, may generate heat, thereby raising the temperature of the solid-state battery 100.

[0120] (Wireless power supply circuit covered by a coating) In one embodiment, the wireless power supply circuit may be covered by the covering. That is, the power receiving unit including the capacitor may be covered by the covering together with the solid-state battery and packaged. In this embodiment, the power receiving circuit 10, the step-up / step-down circuits 20A and 20B, the battery charging circuit 30, and the load 40 may be covered by the covering. For example, the wireless power supply circuit may be provided on the same principal surface of the substrate 200 on which the solid-state battery 100 is provided. Covering the wireless power supply circuit with the covering facilitates further miniaturization of the solid-state battery module. Furthermore, the wireless power supply circuit is more easily protected from external impacts and the like, making it easier to suppress damage to the wireless power supply circuit.

[0121] [Solid-state battery module manufacturing method] The solid-state battery module of the present disclosure can be obtained by preparing a solid-state battery including a battery building block having a positive electrode layer, a negative electrode layer, and a solid electrolyte between the electrodes, and then modularizing the solid-state battery.

[0122] The production of the solid state battery of the present invention can be broadly divided into the production of the solid state battery itself (hereinafter also referred to as a "pre-module battery"), which corresponds to a pre-stage of modularization, the preparation of the substrate, and modularization.

[0123] <<Manufacturing method of pre-module battery>> The pre-module battery can be manufactured by a printing method such as screen printing, a green sheet method using a green sheet, or a combination of these. That is, the pre-module battery itself may be manufactured in accordance with a conventional solid-state battery manufacturing method (thus, raw materials such as the solid electrolyte, organic binder, solvent, optional additives, positive electrode active material, and negative electrode active material described below may be those used in the manufacture of known solid-state batteries).

[0124] In the following, one production method will be described as an example for better understanding of the present invention, but the present invention is not limited to this method. Furthermore, the order of the following description and other chronological matters are merely for the convenience of explanation and are not necessarily binding.

[0125] (Laminated block formation) A solid electrolyte, an organic binder, a solvent, and optional additives are mixed to prepare a slurry, which is then fired to form a sheet containing the solid electrolyte. A paste for a positive electrode is prepared by mixing a positive electrode active material, a solid electrolyte, a conductive material, an organic binder, a solvent, and any additives. Similarly, a paste for a negative electrode is prepared by mixing a negative electrode active material, a solid electrolyte, a conductive material, an organic binder, a solvent, and any additives. Print the positive electrode paste onto the sheet, and if necessary, print the current collecting layer and / or negative layer. Similarly, print the negative electrode paste onto the sheet, and if necessary, print the current collecting layer and / or negative layer. A laminate is obtained by alternately stacking sheets printed with a positive electrode paste and sheets printed with a negative electrode paste. The outermost layer (top layer and / or bottom layer) of the laminate may be an electrolyte layer, an insulating layer, or an electrode layer.

[0126] (Battery firing body formation) After the laminate is pressure-bonded and integrated, it is cut to a predetermined size. The cut laminate is then degreased and fired to obtain a fired laminate. Note that the laminate may be degreased and fired before cutting, and then cut.

[0127] (Edge electrode formation) The positive electrode end electrode can be formed by applying a conductive paste to the exposed positive electrode side of the fired laminate. Similarly, the negative electrode end electrode can be formed by applying a conductive paste to the exposed negative electrode side of the fired laminate. The positive and negative electrode end electrodes may be provided so as to extend to the main surfaces of the fired laminate. The component of the end electrode may be at least one selected from silver, gold, platinum, aluminum, copper, tin, and nickel. Antimony, bismuth, indium, zinc, aluminum, etc., which form alloys with tin, may also be included.

[0128] The end electrodes on the positive and negative electrodes do not necessarily have to be formed after firing of the laminate, but may be formed before firing and then subjected to simultaneous firing.

[0129] By going through the above steps, a desired pre-module battery (corresponding to the solid-state battery 100) can finally be obtained.

[0130] <Preparation of substrate> In this step, the substrate is prepared.

[0131] Although not particularly limited, when a resin substrate is used as the substrate, its preparation may be carried out by stacking multiple layers and then heating and pressurizing them. For example, a substrate precursor is formed using a resin sheet composed of a base fiber cloth impregnated with a resin raw material. After forming the substrate precursor, this substrate precursor is subjected to heating and pressure in a press. On the other hand, when a ceramic substrate is used as the substrate, its preparation may be carried out, for example, by thermocompression bonding multiple green sheets to form a green sheet laminate and then firing the green sheet laminate to obtain a ceramic substrate. The preparation of the ceramic substrate may be carried out, for example, in accordance with the preparation of an LTCC substrate. The semi-lacquer substrate may have vias and / or lands. In such cases, for example, holes may be formed in the green sheets using a punch press or a carbon dioxide laser, and the holes may be filled with a conductive paste material. Alternatively, precursors of conductive portions such as vias and lands may be formed by printing a conductive paste material or solder. Note that lands may also be formed after firing the green sheet laminate.

[0132] Thereafter, a plurality of wirings 220 are formed at predetermined intervals on the first main surface 210 of the substrate 200 for electrical connection (see FIG. 21A). In this manner, the desired substrate 200 can be obtained.

[0133] <Placing electronic components, etc.> Next, at least an electronic component such as a capacitor 300 is placed on the wiring 220 located at a predetermined position. In addition, although not shown, a conductor portion 400 and / or a low thermal conductivity portion 600 may be placed on the wiring 220 provided on the substrate 200 (see FIG. 21B).

[0134] <Modularization> Next, the battery and substrate obtained above are used to form a module (see FIG. 21C).

[0135] First, the pre-module battery 100 is placed on the substrate 200, which has electronic components mounted on the first main surface 210. In other words, a "non-modular solid-state battery" is placed on the substrate (hereinafter, a battery used for modularization will also be simply referred to as a "solid-state battery").

[0136] Specifically, the solid-state battery 100 is placed on the substrate 200 so that the wiring 220 and the end surface electrode 140 of the solid-state battery are electrically connected to each other and the capacitor 300 and the solid-state battery 100 are positioned on the same main surface of the substrate. For example, the solid-state battery 100 may be placed on the substrate 200 so that the solid-state battery 100 and the capacitor 300 face each other. Although not shown, if the conductor section 400 is placed on the substrate 200, a conductive material may be applied to the surface of the solid-state battery that faces the conductor section.

[0137] At this time, the covering portion 500 is formed. The covering portion 500 preferably includes at least a covering insulating layer and further includes a covering inorganic layer (see FIG. 21D).

[0138] First, a covering insulating layer is formed to cover the solid-state battery 100 on the substrate 200. Therefore, raw materials for the covering insulating layer are provided so as to completely cover the solid-state battery on the substrate. When the covering insulating layer is made of a resin material, a resin precursor is applied to the substrate and cured to form the covering insulating layer. In a preferred embodiment, the covering insulating layer may be formed by applying pressure using a mold. As a mere example, the covering insulating layer that seals the solid-state battery on the substrate may be formed using a compression mold. If the resin material is a resin material typically used in molding, the raw materials for the covering insulating layer may be in the form of granules or may be thermoplastic. This molding is not limited to mold molding, but may also be performed through polishing, laser processing, and / or chemical treatment.

[0139] Preferably, the coated inorganic layer is formed after the formation of the coated insulating layer. Specifically, the coated inorganic layer is formed on the "coated precursor in which each solid state battery 100 is covered with a coated insulating layer on the substrate 200." For example, dry plating may be performed to form a dry plated film as the coated inorganic layer. More specifically, dry plating is performed to form the coated inorganic layer on exposed surfaces other than the bottom surface of the coated precursor (i.e., other than the bottom surface of the support substrate).

[0140] By going through the above steps, a module product can be obtained in which the solid-state batteries on the substrate are covered with the covering portion, that is, the "solid-state battery module" according to the present invention can be finally obtained.

[0141] Although the embodiments of the present invention have been described above, they are merely typical examples. Therefore, it will be readily understood by those skilled in the art that the present invention is not limited to these and that various other embodiments are possible.

[0142] The solid-state battery module of the present disclosure has the following features. <1> A solid-state battery module comprising: a substrate; a solid-state battery disposed on the substrate; and a wireless power supply circuit including a capacitor, wherein at least the capacitor and the solid-state battery are disposed on the same main surface side of the substrate. <2> The capacitor is disposed on the substrate. <1> The solid-state battery module according to claim 1. <3> the capacitor is between the substrate and the solid-state battery; <1> or <2> The solid-state battery module according to claim 1. <4> The capacitor is a matching capacitor. <1> ~ <3> 10. The solid-state battery module according to claim 9, <5> Further comprising a covering portion that covers the solid-state battery and the capacitor. <1> ~ <4> 10. The solid-state battery module according to claim 9, <6> the capacitor is disposed inside the outer surface of the covering portion that covers the solid-state battery; <5> The solid-state battery module according to claim 1. <7> A plurality of the capacitors are provided in parallel on the substrate. <2> ~ <6> The solid-state battery module according to claim 1. <8> The capacitor further includes a conductor portion, the conductor portion being disposed to be thermally conductive with the capacitor. <1> ~ <7> The solid-state battery module according to claim 1. <9> the conductor portion is disposed between the substrate and the solid-state battery. <8> The solid-state battery module according to claim 1. <10> The conductor portion and the solid-state battery are connectable to each other via a conductive member. <8> or <9> The solid-state battery module according to claim 1. <11> a width dimension of the conductive member that is larger than a width dimension of an opposing surface of the conductor portion that faces the solid-state battery; <10> The solid-state battery module according to claim 1. <12> The capacitor further includes a low thermal conductivity portion having a thermal conductivity relatively lower than that of the capacitor, the low thermal conductivity portion being disposed adjacent to the capacitor. <1> ~ <11> 10. The solid-state battery module according to claim 9, <13> the capacitor is sandwiched between at least two of the low thermal conductivity parts; <12> The solid-state battery module according to claim 1. <14> The low thermal conductivity part is a jumper resistor. <12> or <13> The solid-state battery module according to claim 1. <15> the low thermal conductivity part is a chip fuse; <12> or <13> The solid-state battery module according to claim 1. <16> The low thermal conductivity part is a resettable fuse. <12> or <13> The solid-state battery module according to claim 1. <17> the substrate further includes a conductor portion arranged to be thermally conductive with the capacitor, and a low thermal conductive portion having a thermal conductivity relatively lower than that of the capacitor, the capacitor, the conductor portion, and the low thermal conductive portion being arranged in this order from the inside to the outside along the extending direction of the main surface of the substrate; <1> The solid-state battery module according to claim 1. <18> two or more of the capacitors are provided, the two or more capacitors include a first capacitor and a second capacitor, the first capacitor is disposed between the substrate and the solid-state battery, and the second capacitor is disposed in a portion that does not overlap with the solid-state battery; <1> ~ <17> 10. The solid-state battery module according to claim 9, <19> a minimum distance between the solid-state battery and a surface of the capacitor facing the solid-state battery is smaller than a minimum distance between the solid-state battery and the substrate; <3> ~ <18> 10. The solid-state battery module according to claim 9, <20> The capacitor is arranged to overlap a central region of the solid-state battery. <1> ~ <18> 10. The solid-state battery module according to claim 9, <21> the wireless power supply circuit further includes a receiving coil, and the receiving coil and the capacitor are electrically connected to each other. <5> ~ <20> 10. The solid-state battery module according to claim 9, <22> The power receiving coil is covered by the covering portion. <21> The solid-state battery module according to claim 1. [Industrial Applicability]

[0143] The solid-state battery module of the present invention can be used in various fields where the use of batteries or the storage of electricity is expected. For example, the solid-state battery module of the present invention can be used in the fields of electricity, information, and communications where mobile devices are used (for example, the fields of electrical and electronic equipment or mobile devices including mobile phones, smartphones, laptop computers, digital cameras, activity monitors, arm computers, electronic paper, and small electronic devices such as RFID tags, card-type electronic money, and smart watches), household and small industrial applications (for example, power tools, golf carts, and household, nursing care, and industrial robots), large industrial applications (for example, forklifts, elevators, and harbor cranes), transportation systems (for example, hybrid cars, electric cars, buses, trains, electrically assisted bicycles, and electric motorcycles), power system applications (for example, various power generation systems, road conditioners, smart grids, and general household power storage systems), medical applications (medical devices such as earphones and hearing aids), pharmaceutical applications (medical management systems), IoT, and space and deep-sea applications (for example, space probes and submersible research vessels). [Explanation of symbols]

[0144] 1 Power receiving unit 2 Power transmission section 10 Receiving circuit 10H heating circuit 10L charging circuit 10LC resonant circuit 11 receiving coil, first receiving coil 13 Resistor, First Resistor 14 Rectifier circuit 15 Second receiving coil 16 The Second Resistance 20A, 20B step-up / step-down circuit 30 Battery charging circuit 40 Load 50 Power Transmission Circuit 51 Transmission coil 52 Capacitor 53 Resistance 54 Transmission Driver 100 solid state battery 110 Positive electrode layer 120 negative electrode layer 130 Solid electrolyte 140 End electrode 140A Positive end electrode 140B Negative electrode end surface 200 boards 210 First main surface of substrate 220 Wiring 230 Second main surface opposite to the first main surface of the substrate 240 Connection Wiring 250 PCB-receiving coil connection wiring 300 capacitor, first capacitor 310: Opposing surface of capacitor facing solid-state battery 310 350 Second Capacitor 400 Conductor 500 Covering part 600 Low thermal conductivity part 610 Resettable fuse 700 Conductive materials 800 Magnetic Sheet 1000 Solid-state Battery Module C1~C4 Smoothing capacitors D1 Minimum distance between the opposing surface of the capacitor and the solid-state battery D2 Minimum distance between solid-state battery and substrate

Claims

1. a substrate, a solid-state battery disposed on the substrate, and a wireless power supply circuit including a capacitor, wherein at least the capacitor and the solid-state battery are disposed on the same main surface side of the substrate; A solid-state battery module further comprising a low thermal conductive portion having a thermal conductivity relatively lower than that of the capacitor, the low thermal conductive portion being disposed adjacent to the capacitor.

2. The solid-state battery module according to claim 1 , wherein the capacitor is disposed on the substrate.

3. The solid-state battery module according to claim 1 , wherein the capacitor is located between the substrate and the solid-state battery.

4. The solid state battery module according to claim 1 , wherein the capacitor is a matching capacitor.

5. The solid-state battery module according to claim 1 , further comprising a covering portion that covers the solid-state batteries and the capacitors.

6. The solid-state battery module according to claim 5 , wherein the capacitor is disposed inside an outer surface of the covering portion that covers the solid-state battery.

7. The solid-state battery module according to claim 2 , wherein a plurality of the capacitors are provided in parallel on the substrate.

8. Further including a conductor portion, The solid-state battery module according to claim 1 , wherein the conductor portion is disposed to be capable of thermally conducting with the capacitor.

9. The solid-state battery module according to claim 8 , wherein the conductor portion is disposed between the substrate and the solid-state battery.

10. The solid-state battery module according to claim 8 or 9, wherein the conductor portion and the solid-state battery are connectable to each other via a conductive member.

11. The solid-state battery module according to claim 10 , wherein a width of the conductive member is larger than a width of an opposing surface of the conductor portion that faces the solid-state battery.

12. The solid-state battery module according to claim 1 , wherein the capacitor is sandwiched between at least two of the low thermal conductivity portions.

13. The solid-state battery module according to claim 1 or 12, wherein the low thermal conductivity portion is a jumper resistor.

14. The solid-state battery module according to claim 1 or 12, wherein the low thermal conductivity portion is a chip fuse.

15. The solid-state battery module according to claim 1 or 12, wherein the low thermal conductivity portion is a resettable fuse.

16. The capacitor further includes a conductor portion disposed to be thermally conductive with the capacitor, and a low thermal conductivity portion having a thermal conductivity relatively lower than that of the capacitor, The solid-state battery module according to claim 1 , wherein the capacitor, the conductor, and the low thermal conductivity portion are arranged in this order from the inside to the outside along an extending direction of the main surface of the substrate.

17. 4. The solid-state battery module according to claim 3, wherein two or more capacitors are provided, the two or more capacitors including a first capacitor and a second capacitor, the first capacitor being disposed between the substrate and the solid-state battery, while the second capacitor being disposed in a portion that does not overlap with the solid-state battery.

18. The solid-state battery module according to claim 3 , wherein a minimum distance between the solid-state battery and a surface of the capacitor facing the solid-state battery is smaller than a minimum distance between the solid-state battery and the substrate.

19. The solid-state battery module according to claim 1 , wherein the capacitor is disposed so as to overlap a central region of the solid-state battery.

20. The solid-state battery module according to claim 5 or 6, wherein the wireless power supply circuit further includes a receiving coil, and the receiving coil and the capacitor are electrically connected to each other.

21. The solid-state battery module according to claim 20 , wherein the receiving coil is covered by the covering portion.

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