Multilayer Patch Antenna
A multi-layer antenna system with parasitic elements addresses the challenge of supporting multiple millimeter-wave frequencies and polarizations, achieving efficient and compact communication capabilities.
Patent Information
- Application Number
- JP2023183253
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2018-09-28
- Filing Date
- 2023-10-25
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2039-09-13
AI Technical Summary
Existing wireless communication devices face challenges in efficiently supporting multiple millimeter-wave frequencies and polarizations due to limitations in antenna design, particularly in achieving broad bandwidth and compact antenna configurations for mmWave communication.
A multi-layer antenna system is implemented, utilizing a patch radiator and parasitic patch radiators in different layers, with parasitic elements positioned to receive and re-radiate signals in multiple frequency bands and polarizations, enhancing bandwidth and efficiency.
The system enables efficient radiation and reception of signals in multiple millimeter-wave frequency bands with improved bandwidth and compact design, supporting diverse communication capabilities.
Smart Images

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Abstract
Description
Priority
[0001]
[0001] This patent application claims priority to non-provisional application Ser. No. 16 / 147,232, entitled "Multi-Layer Patch Antenna," filed Sep. 28, 2018, which is assigned to the assignee of the present application and expressly incorporated herein by reference.
[0002]
[0002] Wireless communication devices are becoming increasingly prevalent and complex. For example, mobile telecommunications devices have progressed from simple telephones to smartphones with multiple communication capabilities (e.g., multiple cellular communication protocols, Wi-Fi, Bluetooth, and other short-range communication protocols), supercomputing processors, cameras, etc. Wireless communication devices have antennas that support wireless communication over a range of frequencies.
[0003]
[0003] With the development of wireless communication technologies, mobile communication devices may be configured to communicate using multiple millimeter-wave (mmWave) beams, e.g., above 25 GHz. For example, 5G devices may be configured to operate in the 28 GHz band (26.5-29.5 GHz) and the 39 GHz band (37-40 GHz). The mmWave receive (RX) beam may be aligned with the transmit (TX) beam of a 5G base station, sometimes referred to as a gNodeB, gNB, WLAN access point, or other source of communication signals. The receive beam may be from a pseudo-omni-directional (PO) codebook (i.e., steering angle range and granularity) with a relatively wide beamwidth, or from a narrow codebook with a relatively narrow beamwidth. Different antenna array element types and arrangements may be used to form beams of varying beamwidths (e.g., narrower beamwidths for data transmission). By varying the weights (signal amplitude and / or input feed signal phase) of the radiator array elements, the beam can be steered to various different scan angles and / or the beam can be switched between a PO beam and a narrower beam. overview
[0004]
[0004] An example of an antenna system includes a patch radiator that is conductive and configured to radiate energy in a first frequency band and in a second frequency band different from the first frequency band; a parasitic patch radiator that is conductive and configured to radiate energy in the first frequency band and overlaps the patch radiator; and at least one parasitic element that includes a conductor sized and positioned relative to the parasitic patch radiator such that the combination of the parasitic patch radiator and the at least one parasitic element radiates energy in the second frequency band.
[0005]
[0005] Implementations of such systems may include one or more of the following features: the lowest frequency in the first frequency band is at least 10% higher than the highest frequency in the second frequency band; the at least one parasitic element includes at least one conductor disposed adjacent each edge of the parasitic patch radiator; the parasitic patch radiator is square and configured to radiate energy in the first frequency band with at least one of two orthogonal polarizations and is centered with respect to the patch radiator, and the at least one parasitic element is symmetrically positioned and configured with respect to the parasitic patch radiator such that the combination of the parasitic patch radiator and the at least one parasitic element radiates energy in the second frequency band with at least one of the two orthogonal polarizations; the at least one parasitic element further includes another conductor disposed in an area diagonally adjacent each corner of the parasitic patch radiator; and the at least one parasitic element includes a conductive loop disposed around the parasitic patch radiator.
[0006]
[0006] Additionally or alternatively, implementations of such systems may include one or more of the following features: the patch radiator is disposed in a first layer of the system, and the parasitic patch radiator and at least one parasitic element are disposed in a second layer of the system that is different from the first layer of the system; the parasitic patch radiator is a first parasitic patch radiator, and the system further includes a second parasitic patch radiator disposed in a third layer of the system, the third layer being different from the first and second layers, and the second parasitic patch radiator configured to radiate energy in a second frequency band; the first parasitic patch radiator is disposed on a first side of the patch radiator, and the second parasitic patch radiator is disposed on a second side and overlaps the patch radiator; the system includes a plurality of parasitic elements, and the parasitic patch radiator and the plurality of parasitic elements are disposed symmetrically about a center point. The patch radiator is one of a plurality of patch radiators arranged in an array, and the parasitic patch radiator and at least one parasitic element are components of the array configured and arranged to be parasitically coupled to the plurality of patch radiators, and there are more parasitic patches than patch radiators in the array.
[0007]
[0007] An example of a multi-layer antenna system includes a multi-layered circuit board, a feed line configured to conduct electricity, a patch radiator coupled to the feed line, the patch radiator being conductive, having a rectangular shape, and disposed in a first layer of the multi-layered circuit board and configured to radiate energy in a first frequency band and in a second frequency band different from the first frequency band, and a parasitic patch radiator disposed in a second layer of the multi-layered circuit board, the patch radiator and the parasitic patch radiator overlapping, and the parasitic patch radiator is electrically conductive, has a rectangular shape, and has a first edge, a second edge, a third edge, and a fourth edge, each of the third edge and the fourth edge extending between the first edge and the second edge, and has a first electrical length of between 0.4 and 0.6 wavelengths in a substrate of a multi-layered circuit board in a first frequency band, and includes at least one parasitic element comprising a first conductor disposed adjacent to the first edge of the parasitic patch radiator and a second conductor disposed adjacent to the second edge of the parasitic patch radiator.
[0008]
[0008] Implementations of such systems may include one or more of the following features: the parasitic patch radiator and the at least one parasitic element are positioned and configured to provide, in combination, an electrical length in the substrate of between 0.4 and 0.6 wavelengths in the second frequency band for radiating energy in the second frequency band, and the lowest frequency in the first frequency band is at least 10% higher than the highest frequency in the second frequency band. The parasitic patch radiator is square, and the at least one parasitic element further includes a third conductor positioned adjacent a third edge of the patch radiator and a fourth conductor positioned adjacent a fourth edge of the patch radiator, wherein the parasitic patch radiator, the first conductor, and the second conductor are combined and configured to radiate energy in a first polarization and in a second frequency band, and the parasitic patch radiator, the third conductor, and the fourth conductor are combined and configured to radiate energy in a second polarization and in a second frequency band that is orthogonal to the first polarization.
[0009]
[0009] Additionally or alternatively, implementations of such systems may include one or more of the following features: The at least one parasitic element includes at least four conductive strips each disposed adjacent one of the first, second, third, and fourth edges of the parasitic patch radiator, and the at least one parasitic element further includes a square conductor each aligned with two of the four conductive strips.
[0010]
[0010] Additionally or alternatively, implementations of such systems may include one or more of the following features: the at least one parasitic element includes a conductive ring disposed around the parasitic patch radiator; the parasitic patch radiator is a first parasitic patch radiator, and the system further includes a second parasitic patch radiator disposed in a third layer of the multi-layered circuit board and configured to radiate energy in a second frequency band; and the at least one parasitic element is disposed in a second layer of the multi-layered circuit board.
[0011]
[0011] Another example of an antenna system includes a multi-layered circuit board; a feed line configured to conduct electricity; a patch radiator coupled to the feed line, the patch radiator being conductive and disposed in a first layer of the multi-layered circuit board and configured to radiate energy at a first frequency and a second frequency, the first frequency and the second frequency being greater than 5 GHz apart; and a plurality of parasitic patches disposed in a second layer of the multi-layered circuit board and configured to receive first energy at the first frequency from the patch radiator and re-radiate at least a portion of the received first energy at the first frequency, and to receive second energy at the second frequency from the patch radiator and re-radiate at least a portion of the received second energy at the second frequency.
[0012]
[0012] Implementations of such a system may include one or more of the following features: the plurality of parasitic patches are symmetrical about a center point; the plurality of parasitic patches each include four square patches that partially overlap the patch radiator; the center point is a center point of the patch radiator; and the first frequency is separated from the second frequency by approximately 11 GHz.
[0013]
[0013] Another example of an antenna system includes a feeding means for providing a first signal in a first frequency band and a second signal in a second frequency band; a first radiating means electrically coupled to the feeding means, the first signal received from the feeding means being radiated in the first frequency band and the second signal received from the feeding means being radiated in the second frequency band; a second radiating means parasitically receiving the first signal from the first radiating means and radiating the first signal in the first frequency band in the first frequency band; and a third radiating means, in combination with the second radiating means, parasitically receiving the second signal in the second frequency band and in combination with the second radiating means radiating the second signal in the second frequency band.
[0014]
[0014] Implementations of such systems may include one or more of the following features: the third radiating means combines with the second radiating means to parasitically receive a second signal in a second frequency band from the first radiating means; the lowest frequency in the first frequency band is at least 10% higher than the highest frequency in the second frequency band; the second radiating means and the third radiating means are disposed in a first layer of a multilayer circuit board; the system may include a fourth radiating means that parasitically receives the second signal in the second frequency band from the first radiating means and radiates the second signal in the second frequency band, the fourth radiating means being disposed in a second layer different from the first layer of the multilayer circuit board; the second radiating means radiates the first signal with two orthogonal polarizations, and the third radiating means is disposed symmetrically with respect to the second radiating means and combines with the second radiating means to radiate the second signal with two orthogonal polarizations.
[0015]
[0015] An example of a dual-band, dual-polarized antenna system includes a multi-layered circuit board, a plurality of feed lines configured to conduct electricity, a patch radiator coupled to the plurality of feed lines, the patch radiator being conductive, having a square shape, and disposed in a first layer of the multi-layered circuit board, the patch radiator shaped to radiate energy in a first frequency band of a different polarization in response to receiving energy in the first frequency band from the plurality of feed lines, and shaped to radiate energy in a second frequency band of a different polarization in response to receiving energy in the second frequency band from the plurality of feed lines, the second frequency band being different from the first frequency band, and disposed in a second layer of the multi-layered circuit board. a parasitic patch radiator disposed in a second layer of the multi-layered circuit board, the patch radiator and the parasitic patch radiator overlapping, the parasitic patch radiator being conductive and having a square shape with each edge having a length between 0.4 and 0.6 wavelengths of energy in the first frequency band in the multi-layered circuit board, the parasitic patch radiator comprising a conductive material disposed adjacent at least two orthogonal edges of the patch radiator, and the at least one parasitic element having a cumulative length of the patch radiator and the at least one parasitic element measured parallel to any edge of the parasitic patch radiator, the cumulative length of the patch radiator and the at least one parasitic element being between 0.4 and 0.6 wavelengths of energy in the second frequency band in the multi-layered circuit board.
[0016]
[0016] Implementations of such systems may include one or more of the following features: the lowest frequency in the first frequency band is at least 10% higher than the highest frequency in the second frequency band, the at least one parasitic element includes at least four conductive strips each positioned adjacent a respective edge of the parasitic patch radiator, and the at least one parasitic element further includes a square conductor each aligned with two of the four conductive strips. [Brief explanation of the drawings]
[0017] [Figure 1] FIG. 1 is a schematic diagram of a communication system. [Figure 2]
[0018] FIG. 2 is an exploded perspective view of simplified components of the mobile device shown in FIG. [Figure 3]
[0019] FIG. 3 is a top view of the printed circuit board shown in FIG. 2, including the antenna. [Figure 4]
[0020] FIG. 4 is a top view of the exemplary patch radiator system shown in FIG. [Figure 5]
[0021] FIG. 5 is a side view of the patch radiator system shown in FIG. [Figure 6]
[0022] FIG. 6 is a top view of an alternative patch radiator system with a loop parasitic element. [Figure 7]
[0023] FIG. 7 is a top view of a further alternative patch radiator system having another parasitic element. [Figure 8] FIG. 8 is a top view of a further alternative patch radiator system having another parasitic element. [Figure 9]
[0024] FIG. 9 is a side view of another exemplary patch radiator system. [Figure 10]
[0025] FIG. 10 is a top view of the patch radiator system shown in FIG. [Figure 11]
[0026] FIG. 11 is a block flow diagram of a method for parasitically receiving and re-radiating signals in different frequency bands. Detailed Description
[0018]
[0027] This specification describes techniques for arranging non-radiative metals in a multi-layer antenna. For example, a patch antenna may be driven to radiate different frequency signals and may be driven to radiate in multiple polarizations, e.g., two polarizations for each different frequency signal. For example, the patch antenna may be driven with a horizontally polarized signal (on the H-pol feed) and a vertically polarized signal (on the V-pol feed) in both lower frequencies (e.g., the 28 GHz band) and higher frequencies (e.g., the 39 GHz band). The driven patch radiates energy at both the lower and higher frequencies in both polarizations, with at least the higher-frequency energy coupling to a parasitic patch radiator located in a different layer from and overlapping the patch antenna. The parasitic patch radiator receives the higher-frequency energy from the patch antenna and re-radiates the energy at the higher frequencies. The at least one parasitic element is configured (e.g., sized, shaped, etc.) and arranged to operate in conjunction with the parasitic patch radiator to receive lower frequency energy from the patch antenna and re-radiate the lower frequency energy. For example, the parasitic patch radiator may resonate at a higher frequency, and the parasitic patch radiator in combination with the at least one parasitic element resonates at the lower frequency. However, other configurations may be used.
[0019]
[0028] The items and / or techniques described herein may provide one or more of the following capabilities, as well as other capabilities not mentioned. Multiple bands of signals may be radiated using a compact antenna configuration, for example, using a radiating patch antenna with a parasitic patch radiator and at least one parasitic element. Signals in multiple millimeter-wave frequency bands may be radiated from a thin, multi-layered antenna structure. The parasitic patch radiator may resonate in one frequency band or form part of a radiator resonating in a different frequency band. Bandwidth may be broadened in one or more bands, for example, in one or more millimeter-wave bands (e.g., the 28 GHz band and the 39 GHz band), compared to other antenna configurations. Other capabilities may be provided, and not all implementations according to the present disclosure must provide any, much less all, of the described capabilities. Furthermore, the effects described above may be achieved by means other than those described, and the items / techniques described above do not necessarily result in the effects described above.
[0020]
[0029] Referring to FIG. 1 , a communication system 10 includes a mobile device 12, a network 14, a server 16, and access points (APs) 18, 20. The system 10 is a wireless communication system in that the components of the system 10 can communicate with each other (at least sometimes using a wireless connection) directly or indirectly, e.g., via one or more of the network 14 and / or access points 18, 20 (and / or one or more other devices not shown, such as one or more base transceiver stations). In the case of indirect communication, the communication may be modified during transmission from one entity to another, e.g., by modifying header information, changing the format of data packets, etc. The illustrated mobile device 12 is a mobile wireless communication device (although these can communicate wirelessly or via a wired connection) including a mobile phone (including a smartphone), a laptop computer, and a tablet computer. Still other mobile devices, whether currently existing or developed in the future, may be used. Additionally, other wireless devices (mobile or not) may be implemented within system 10 and may communicate with each other and / or with mobile device 12, network 14, server 16, and / or APs 18, 20. For example, such other devices may include Internet of Things (IoT) devices, medical devices, home entertainment and / or automation devices, etc. Mobile device 12 or other devices may be configured to communicate in different networks and / or for different purposes (e.g., 5G, Wi-Fi communications, multiple frequencies of Wi-Fi communications, satellite positioning, one or more types of cellular communications (e.g., GSM (Global System for Mobile Communications), CDMA (Code Division Multiple Access), LTE (Long Term Evolution), etc.).The mobile device 12 is commonly referred to as user equipment (UE) in UMTS (Universal Mobile Telecommunications System) applications, but may also be referred to as a mobile station (MS), subscriber station, mobile unit, subscriber unit, wireless unit, remote unit, mobile device, wireless device, wireless communication device, remote device, mobile subscriber station, access terminal (AT), mobile terminal, wireless terminal, remote terminal, handset, terminal, user agent, mobile client, client, or some other suitable terminology.
[0021]
[0030] Referring to FIG. 2, one example of the mobile device 12 shown in FIG. 1 includes a top cover 52, a display layer 54, a printed circuit board (PCB) layer 56, and a bottom cover 58. The illustrated mobile device 12 may be a smartphone or a tablet computer, although the present description is not limited to such devices. The top cover 52 includes a screen 53. The PCB layer 56 includes one or more antennas configured to facilitate two-way communication between the mobile device 12 and one or more other devices, including other wireless communication devices. The bottom cover 58 has a bottom surface 59, and the sides 51, 57 of the top cover 52 and the bottom cover 58 provide edge surfaces. The top cover 52 and the bottom cover 58 may form a housing that holds the display layer 54, the PCB layer 56, and other components of the mobile device 12, which may or may not be on the PCB layer 56. For example, the housing may hold (e.g., house, enclose) an antenna system, front-end circuitry, intermediate frequency circuitry, and a processor, which will be described below. Additionally, the size and / or shape of PCB layer 56 may not correspond to the size and / or shape of either the top or bottom covers or otherwise to the perimeter of the device. For example, PCB layer 56 may have a cutout to receive a battery. Thus, those skilled in the art will understand that embodiments of PCB layer 56 other than those illustrated may be implemented.
[0022]
[0031] 3 , an example PCB layer 56 includes a main portion 60 and two antenna systems 62, 64. In the example shown, the antenna systems 62, 64 are located at opposite ends 63, 65 of the PCB layer 56 and, thus, in this example, of the mobile device 12 (e.g., of the housing of the mobile device 12). The main portion 60 may include a PCB 66 that includes front-end circuits 70, 72 (also referred to as radio frequency (RF) circuits), intermediate frequency (IF) circuits 74, and a processor 76. The front-end circuits 70, 72 are configured to provide signals to be radiated to the antenna systems 62, 64, and to receive and process signals received by and provided from the antenna systems 62, 64 to the front-end circuits 70, 72. The front-end circuits 70, 72 are configured to convert the IF signals received from the IF circuit 74 to RF signals (and optionally amplify them with a power amplifier) and provide the RF signals to the antenna systems 62, 64 for radiation. The front-end circuits 70, 72 are configured to convert RF signals received by the antenna systems 62, 64 to IF signals (e.g., using low-noise amplifiers and mixers) and send the IF signals to IF circuitry 74. The IF circuitry 74 is configured to convert the IF signals received from the front-end circuits 70, 72 to baseband signals and provide the baseband signals to a processor 76. The IF circuitry 74 is also configured to convert baseband signals provided by the processor 76 to IF signals and provide the IF signals to the front-end circuits 70, 72. The processor 76 is communicatively coupled to the IF circuitry 74, which in turn is communicatively coupled to the front-end circuits 70, 72, which are communicatively coupled to the antenna systems 62, 64, respectively.
[0023]
[0032] The antenna systems 62, 64 may be formed as part of the PCB layer 56 in a variety of ways. In FIG. 3 , dashed lines 71, 73 separating the antenna systems 62, 64 from the PCB 66 indicate functional separation of the antenna systems 62, 64 (and their components) from other portions of the PCB layer 56. The antenna systems 62, 64 may be integral with the PCB 66 and formed as integral components of the PCB 66, or may be separate from but attached to the PCB 66. Alternatively, one or more components of the antenna system 62 and / or the antenna system 64 may be integrally formed with the PCB 66, while one or more other components may be formed separately from and attached to the PCB 66 or may be part of the PCB layer 56. Alternatively, each of the antenna systems 62, 64 may be formed separately from and attached to the PCB 66 and coupled to front-end circuits 70, 72, respectively. In some embodiments, one or both of the front-end circuits 70, 72 are implemented with the antenna system 62 or 64 in a module and coupled to the PCB 66. For example, the module may be attached to the PCB 66 or may be separate from the PCB 66 and coupled thereto using, for example, a flexible cable or circuit. The antenna systems 62, 64 may be configured similarly or differently from one another. For example, one or more components of either of the antenna systems 62, 64 may be omitted. As an example, the antenna system 62 may include 4G and 5G radiators, while the antenna system 64 may not include (or may omit) the 5G radiators. In other examples, one of the antenna systems 62, 64 may be omitted entirely or may be configured for use with a non-cellular technology, such as WLAN technology.
[0024]
[0033] Display 61 (see FIG. 2) of display layer 54 covers approximately the same area as PCB 66 and may serve as a system ground plane for antenna systems 62, 64 (and possibly other components of device 12). Display 61 is located below antenna system 62 and above antenna system 64 (here, "above" and "below" are relative to mobile device 12; i.e., the top of mobile device 12 is above the other components, regardless of the orientation of device 12 with respect to the Earth).
[0025]
[0034] The antenna systems 62, 64 may be configured to transmit and receive mmWave energy and may be configured to steer to different scan angles and / or vary the size of the beamwidth, for example, between a PO beam and a narrower beam.
[0026]
[0035] Here, antenna systems 62, 64 are similarly configured with multiple radiators to facilitate communication with other devices in various directions relative to mobile device 12. In the example of FIG. 3, antenna system 62 includes an array 80 of patch radiator systems and an array 82 of dipole radiators. In other examples, one or more antenna systems may include only one or more dipole radiators, only one or more patch radiators, or a combination of one or more dipole radiators and one or more patch radiators. In other examples, one or more other types of radiators may be used alone or in combination with one or more dipole radiators and / or one or more patch radiators. The patch radiators are configured to radiate and receive signals primarily from above and below the plane of PCB layer 56, i.e., into and out of the page illustrating FIG. 3. The dipole radiators are configured to radiate signals primarily toward and receive signals from the sides of PCB layer 56, with the dipole radiators in antenna system 62 configured to radiate primarily toward the upper left of PCB layer 56 as shown in FIG. 3 and the dipole radiators in antenna system 64 configured to radiate primarily toward the lower right of PCB layer 56 as shown in FIG. 3. Locating antenna systems 62, 64 at or near corners of PCB layer 56 may help to provide spatial diversity (the directions relative to mobile device 12 to which signals may be transmitted and from which signals may be received), which may help to enhance MIMO (multiple-input multiple-output) capabilities, for example. Additionally, patch radiator array 82 may be configured to provide dual-polarized radiation and reception.
[0027]
[0036] 4-5, an example of a patch radiator system 110 for the array 80 of patch radiator systems of the antenna system 62 shown in FIG. 3 is shown, with FIG. 4 being a top view of the system 110 and FIG. 5 being a side view of the system 110. The patch radiator system 110 includes a multi-layered circuit board 111 that includes a high-band patch 112, parasitic elements 114, 115, 116, and 117, a radiating patch 118, a low-band patch 120, a horizontally polarized feed 122, a vertically polarized feed 124, a ground plane 128, and a substrate 130. The parasitic elements 114-117 may be considered parasitic patches. The patch radiator system 110 is configured as a dual-band, dual-polarized radiator system. It is not necessary to be configured for dual-polarized radiation; instead, one or more features in system 110 may be configured for single-polarized radiation (e.g., a single feed may be used, and / or one or more patches or other items may be sized and shaped for single-polarized radiation at the frequency of the transmitted and / or received signals). However, in the illustrated example, items are provided configured for dual-polarized radiation. In particular, system 110 may radiate in one or both of two orthogonal polarizations for two different 5G communications bands, for example, due to orthogonal edges of the radiators (e.g., patch radiators, parasitic radiators). For example, system 110 may be configured to radiate in different, here orthogonal, polarizations in both the 28 GHz band and the 39 GHz band. In FIG. 5 , parasitic element 117 is not shown for clarity. Radiation patch 118, low-band patch 120, and ground plane 128 are disposed in different layers of the system within substrate 130. The highband patch 112 and the parasitic elements 114 - 117 are located in the same layer of the system 110 , here on top of the substrate 130 .As shown in FIG. 5, when system 110 is oriented as shown, high-band patch 112 is positioned above radiating patch 118 (i.e., on the side of patch 118 opposite ground plane 128) and low-band patch 120 is positioned below radiating patch 118 (i.e., on the same side of radiating patch 118 as ground plane 128, such that low-band patch 120 is positioned between radiating patch 118 and ground plane 128).
[0028]
[0037] The feeds 122, 124 (also referred to as feedlines) are configured to conduct electricity to provide signals to the radiating patch 118. Each of the feeds 122, 124 is configured to provide signals to the radiating patch 118 at different frequencies, here in the 28 GHz and 39 GHz bands. The feeds 122, 124 are electrically coupled to the radiating patch 118 at appropriate locations to excite the radiating patch 118 to emit the respective polarization of the signal in response to receiving a signal from the feeds 122, 124. Here, the horizontally polarized feed 122 is coupled to the radiating patch 118 to excite the radiating patch 118 to emit a horizontally polarized signal at a frequency corresponding to the frequency of the energy in the signal provided by the feed 122. Similarly, the vertically polarized feed 124 is coupled to the radiating patch 118 to excite the radiating patch 118 to emit a vertically polarized signal at a frequency corresponding to the frequency of the energy in the signal provided by the feed 124. Feeds 122, 124 receive signals from a transmission line, e.g., a stripline, that is provided to radiating patch 118, with a ground plane 128 being the top of the stripline (the rest of which is not shown). The feeds pass through low-band patch 120 and are not in electrical contact with it.
[0029]
[0038] The radiating patch 118 is electrically conductive (e.g., a conductor made of a conductive material) and is electrically coupled to the feeds 122, 124 and configured to radiate signals received from the feeds 122, 124. While some energy in the signal received from either of the feeds 122, 124 may be lost during transmission, the radiating patch 118 radiates sufficient energy to convey a signal corresponding to the received information; i.e., the characteristics of the radiated signal will correspond to the characteristics of the received signal. As shown, the radiating patch 118 is rectangular, here a square, so that the radiating patch 118 can radiate signals in one or both of two orthogonal polarizations from each edge of the radiating patch 118. The radiating patch 118 is sized to radiate energy in a high-frequency band, e.g., the 39 GHz band (37-40 GHz). For example, each edge of the radiating patch 118 may have an electrical length of between 0.4 and 0.6 wavelengths in the substrate 130 in the 39 GHz band. Here, the edges of the radiating patch 118 are straight, although other configurations may be used (e.g., having slots extending inward from what would otherwise be straight edges). The radiating patch 118 is also configured to couple energy in a low frequency band, e.g., the 28 GHz band (26.5-29.5 GHz), into the low band patch 120. The lowest frequency in the high frequency band may be at least 10% higher than the highest frequency in the low frequency band.
[0030]
[0039] The highband patch 112 is electrically conductive and is configured and arranged to parasitically receive highband signals in a high frequency band and re-radiate the highband signals in a high frequency band (e.g., the 39 GHz band). The highband patch 112 is sometimes referred to as a parasitic patch. The highband patch 112 parasitically receives highband signals from the radiating patch 118 in that the highband patch 112 wirelessly couples to the radiating patch 118 and receives the highband signals from the energy radiated by the radiating patch 118. The highband patch 112 re-radiates one or more signals in response to receiving one or more signals from the radiating patch 118. The re-radiated highband signals may have less energy than the received highband signals, but remain the same signal in content. The highband patch 112 is arranged to overlap the radiating patch 118 to facilitate reception by the highband patch 112 of the highband signals radiated by the radiating patch 118. As shown, high-band patch 112 is centered relative to radiating patch 118, edge 113 of high-band patch 112 is parallel to edge 119 of radiating patch 118, and high-band patch 112 entirely overlaps radiating patch 118; however, other arrangements (e.g., only partial overlap with radiating patch 118, edge 113 of high-band patch 112 not parallel to edge 119 of patch 118, etc.) may be used. High-band patch 112 is rectangular, here square, with an edge length sized to radiate signals in the high band, e.g., the 39 GHz band. High-band patch 112 has an edge length 131 that is slightly shorter than edge length 133 of radiating patch 118 and, therefore, can radiate signals in the high band better (e.g., more efficiently) than radiating patch 118. The electrical length of each edge of highband patch 112, here edge length 131, may be between 0.4 and 0.6 wavelengths of a frequency in the high frequency band at substrate 130. Here, the edges of highband patch 112 are straight, so the physical length corresponds to the electrical length. However, other configurations may be used, for example, having one or more non-straight edges (e.g., having slots extending inward from the edges).Other examples of high-band patches may not be square, for example rectangular but with two different edge lengths, which can facilitate radiation in different frequency bands.
[0031]
[0040] The parasitic elements 114-117 are configured and arranged to parasitically receive low-band signals in combination with the high-band patch 112. That is, the parasitic elements 114-117 are configured and arranged such that the combination of the high-band patch 112 and the parasitic elements 114-117 parasitically receives low-band signals (in the low frequency band) from the radiating patch 118. Although four parasitic elements are shown, this is by way of example and other numbers of parasitic elements (e.g., one, two, three, or more than four) may be used. The combination of the high-band patch 112 and the parasitic elements 114-117 is configured to re-radiate low-band signals in the low frequency band (e.g., the 28 GHz band). The combination of the high-band patch 112 and the parasitic elements 114-117 re-radiates one or more signals in response to receiving one or more signals from the radiating patch 118. The combination of high-band patch 112 and parasitic elements 114-117 parasitically receives the low-band signal from radiating patch 118 in that high-band patch 112 and parasitic elements 114-117 are not physically coupled to radiating patch 118 (or to either feeds 122, 124), but rather are wirelessly coupled to radiating patch 118 and receive the low-band signal from the energy radiated by radiating patch 118. The re-radiated low-band signal may have less energy than the received low-band signal, but remains the same signal in content.
[0032]
[0041] Each of the parasitic elements 114-117 is positioned adjacent to a corresponding edge of the high-band patch 112, i.e., a close but non-zero distance from the corresponding edge of the high-band patch 112. The amount of isolation between the high-band patch 112 and each of the parasitic elements 114-117 may be selected to provide the desired performance of the system 110. The selected isolation may be a trade-off (e.g., return loss) between low-band and high-band performance, with smaller isolation improving low-band performance and degrading high-band performance, and larger isolation improving high-band performance and degrading low-band performance. In the example shown in FIGS. 4-5 , the isolation between the high-band patch 112 and the parasitic elements 114-117 is sufficient so that the parasitic elements 114-117 do not overlap with the radiating patch 118, but is small enough so that the parasitic elements 114-117 partially overlap with the low-band patch 120. This isolation is by way of example only, and other isolations may be used. In the example shown in Figures 4-5, the parasitic elements 114-117 are symmetrically positioned with respect to the radiating patch 118. Also, in the example shown in Figures 4-5, the parasitic elements 114-117 have lengths that are slightly longer than the lengths of the corresponding edges of the highband patch 112. Alternatively, the parasitic elements 114-117 can have the same lengths as the corresponding edges of the highband patch 112, with the ends of the parasitic elements 114-117 being collinear with the respective edges of the highband patch 112. In the example shown in Figures 4-5, the parasitic elements 114-117 are all separated from the highband patch 112 by the same amount and have equal widths, although other configurations (e.g., unequal separations and / or unequal widths) may be used.
[0033]
[0042] The parasitic elements 114-117 are sized and shaped to help parasitically receive and re-radiate signals in the low frequency band. Each of the parasitic elements 114-117 has an electrical width (width 132 in this example) such that the combined distance between the electrical width of two of the parasitic elements 114-117 (here, width 132) and the electrical length (here, length 131) of the corresponding edge of the high band patch 112 between these two parasitic elements 114-117 is approximately one-half the wavelength of the low band signal. For example, this distance (here, the cumulative length of length 131 plus twice width 132) may be between 0.4 and 0.6 wavelengths of a frequency in the low frequency band in the substrate 130.
[0034]
[0043] Low-band patch 120 is constructed and arranged to parasitically receive a low-band signal in the low frequency band and re-radiate the low-band signal in the low frequency band. Thus, low-band patch 120 is a parasitic patch. Low-band patch 120 parasitically receives the low-band signal from radiating patch 118 in that low-band patch 120 is not conductively coupled to radiating patch 118 (or to either feeds 122, 124), but rather wirelessly couples to radiating patch 118 and receives the low-band signal from energy radiated by radiating patch 118. The low-band signal re-radiated from low-band patch 120 may have less energy than the received low-band signal, but remains the same signal in content. The low-band signal re-radiated from low-band patch 120 may be received and re-radiated by a combination of high-band patch 112 and parasitic elements 114-117. Low-band patch 120 is positioned to overlap radiating patch 118 to facilitate reception by low-band patch 120 of the low-band signal radiated by radiating patch 118. As shown, low-band patch 120 is centered with respect to radiating patch 118, edge 121 of low-band patch 120 is parallel to edge 119 of radiating patch 118, and radiating patch 118 entirely overlaps low-band patch 120, although other arrangements (e.g., only partial overlap with radiating patch 118, edge 121 of low-band patch 120 not parallel to edge 119 of patch 118, etc.) may be used. In this example, low-band patch 120 is rectangular, here square, with an electrical edge length sized to radiate a signal in the low band, e.g., the 28 GHz band. Low-band patch 120 has an electrical edge length, here edge length 134, that is longer than the electrical edge length, here edge length 133, of radiating patch 118, and therefore can radiate signals in the low band better (e.g., more efficiently) than radiating patch 118. The electrical edge length of each edge of low-band patch 120 may be between 0.4 and 0.6 wavelengths of a frequency in the low frequency band at substrate 130. Other examples of low-band patches may not be square, such as rectangular but with two different edge lengths.This can facilitate radiation in different frequency bands.
[0035]
[0044] Other configurations
[0045] The above examples are non-exhaustive, and many other configurations may be used. The following description is directed to some of these other configurations, none of which (alone or in combination with the above description) is exhaustive.
[0036]
[0046] Other configurations of multiple parasitic elements or a single parasitic element may also be used. Referring to FIG. 6, an example of a patch radiator system 150 of the array 80 of patch radiator systems of antenna system 62 shown in FIG. 3 includes a high-band patch 152 and a single parasitic element 154; FIG. 6 is a top view of system 150. System 150 includes a radiating patch and may include other features (e.g., a low-band patch) similar to system 110 shown in FIGS. 4-5, although these features are not shown in FIG. 6 for simplicity. System 150 includes a single parasitic element 154 instead of parasitic elements 114-117 shown in FIG. 4. Parasitic element 154 is a loop disposed around high-band patch 152. Here, the loop is a square conductive ring, although other shapes may be used.
[0037]
[0047] 7, a top view, another example of a patch radiator system 160 includes the high-band patch 112, parasitic elements 114, 115, 116, and 117, radiating patch 118, low-band patch 120, horizontally polarized feed 122, and vertically polarized feed 124, as shown in FIG. 4, plus additional parasitic elements 164, 165, 166, and 167. Parasitic elements 164-167 are positioned diagonally adjacent to high-band patch 112 at the corners of system 160, with each of parasitic elements 164-167 aligned with two of parasitic elements 114-117, here conductive strips. The use of parasitic elements 164-167 can further improve radiation by system 160 (e.g., lower insertion loss compared to not using parasitic elements 114-117) in lower frequency bands, for example, where a quarter wavelength in the lower frequency band is approximately equal to the width of high-band patch 112 plus two widths of one of parasitic elements 164-167. In this example, another parasitic element 164-167 is a square conductor. The use of parasitic elements can also improve impedance matching from the feed to the radiating patch.
[0038]
[0048] 8, a top view, another example of a patch radiator system 170 includes a parasitic patch 172, parasitic elements 174, 175, 176, and 177, a radiating patch 178, a horizontally polarized feed 180, a vertically polarized feed 182, and additional parasitic elements 184, 185, 186, and 187. In this example, the parasitic elements 174-177 are each located proximate a respective edge of the parasitic patch 172 and are each a conductive strip having a length similar (here, equal) to the length of the respective edge of the parasitic patch 172. Each of the parasitic elements 184-187 is located at a respective corner of the system 170 and is aligned with a respective pair of parasitic elements 174-177. The parasitic patch 172 is smaller than the radiating patch 178. Radiating patch 178 completely overlaps parasitic patch 172, partially overlaps each of parasitic elements 174-177, and partially overlaps each of parasitic elements 184-187. Parasitic patch 172 is sized to radiate energy primarily within the desired frequency band (e.g., having an electrical edge length at the substrate of system 170 between 0.4 and 0.6 wavelengths of a frequency within the desired frequency band). Parasitic elements 174-177, 184-187 are sized, shaped, and positioned such that the combination of parasitic patch 172 and parasitic elements 174-177, 184-187 re-radiates energy received from radiating patch 178 primarily within the desired frequency band.
[0039]
[0049] Still other configurations are possible. For example, in patch radiator system 170 and / or other configurations, the low-band patch (such as low-band patch 120 shown in FIGS. 4-5) may be omitted.
[0040]
[0050] 9 and 10 , which are side and top views, respectively, another example of a patch radiator system 210 includes a radiating patch 212, parasitic patches 214, 215, 216, and 217, a feed 220, a substrate 222, and a ground plane 224. In this example, the radiating patch 212 may be configured to radiate signals in multiple frequency bands or multiple frequencies across a wide band, e.g., a band above 5 GHz (e.g., 11 GHz), provided via the feed 220. Here, each of the parasitic patches 214-217 is square, and there are four parasitic patches, although other shapes (e.g., non-square rectangles, hexagons, etc.) and / or other quantities of parasitic patches may be used. The parasitic patches 214-217 are configured (e.g., sized and shaped) and arranged to parasitically receive signals from the radiating patch 212 and re-radiate energy in multiple frequency bands.
[0041]
[0051] In one example, patch radiator system 210 is configured to radiate signals in multiple frequency bands, and each of parasitic patches 214-217 may have a length 230 (and width) that facilitates radiation in a higher frequency band, e.g., a frequency band above 50 GHz, such as in the 60 GHz band. For example, length 230 may be approximately half the wavelength (e.g., between 0.4 and 0.6 wavelengths) of the higher frequency signal fed to and radiated by radiating patch 212. Each of parasitic patches 214-217 may be separated from adjacent ones of parasitic patches 214-217 by gap length 232 such that array length 234 and gap length 232 of adjacent ones of parasitic patches 214-217 facilitate radiation of lower frequency signals, e.g., in the 28 GHz band. For example, array length 234 may be approximately half the wavelength (e.g., between 0.4 and 0.6 wavelengths) of the lower frequency signal fed to and radiated by radiating patch 212. Gap length 232 is sized to allow adjacent ones of parasitic patches 214-217 to operate in combination to radiate the lower frequency signal while allowing each individual one of the parasitic patches to radiate the higher frequency signal. As shown, the parasitic patches are positioned to overlap patch radiator 212 and are centered relative to patch radiator 212 and symmetrically positioned about center point 236, which is also the center point of patch radiator 212. Radiating patch 212 may similarly be configured to radiate in higher and lower frequency bands, e.g., sized as a multiple or fraction of a wavelength of the signal for transmission or reception.
[0042]
[0052] In another example, the parasitic patches are configured to reradiate energy across a wide frequency band. For example, the parasitic patches 214-217 may be sized to reradiate energy across a frequency band from 28 GHz to 39 GHz or from 57 GHz to 68 GHz, e.g., with a return loss below a threshold return loss (e.g., −5 dB or −10 dB) across that band. The size of the parasitic patches 214-217 and the size of the gaps 240, 242 between the parasitic patches 214-217 may be adjusted to affect the radiation by the parasitic patches 214-217, e.g., the return loss as a function of frequency. For example, the size of the gaps 240, 242 may affect the amount of radiation as a function of frequency, and the patch radiator system 210 may be configured to efficiently radiate signals across a frequency band of 11 GHz or greater. In some such embodiments, rather than each individual parasitic patch being configured to radiate a signal at the low end of a frequency band, two or more of the parasitic patches 214-217 may be configured in combination to radiate at all frequencies in the band.
[0043]
[0053] Referring to FIG. 11 and further to FIGS. 1-10, a method 250 for parasitically receiving and re-radiating signals in different frequency bands includes the stages shown. However, method 250 is by way of example only and not by way of limitation. Method 250 may be modified, for example, by adding, removing, rearranging, combining, or simultaneously executing stages, and / or by splitting a single stage into multiple stages. For example, stages 254 and 256 may be executed before, after, or simultaneously with stages 258 and 260, for example, for general use or for use in carrier aggregation techniques. Still other modifications to the method 250 shown and described are possible.
[0044]
[0054] At stage 252, the method 250 includes radiating a high-band signal in a first frequency band from the radiating patch and a low-band signal in a second frequency band from the radiating patch. For example, the feeds 122, 124 may convey respective high-band signals to the radiating patch 118, which radiates the high-band signals from the feeds 122, 124 in their respective polarizations. As another example, only one of the feeds 122, 124 may convey the high-band signal to the radiating patch 118. As another example, one of the feeds 122, 124 may convey the high-band signal to the radiating patch 118, while the other of the feeds 122, 124 simultaneously conveys the low-band signal to the radiating patch 118. As another example, the feeds 122, 124 may convey the low-band signal to the radiating patch 118, which radiates the low-band signal from the feeds 122, 124 in their respective polarizations. As another example, only one of the feeds 122, 124 may convey the low-band signal to the radiating patch 118. The high-band and low-band signals are typically provided to the feeds 122, 124 at different times, and typically only one signal is powered on each of the feeds 122, 124 at a time, although different signals may be provided to either of the feeds 122, 124 at the same time. The signals conveyed by the feeds 122, 124 to the radiating patch 118 may be the same signal or different signals (e.g., having different content), even if the signals are in the same frequency band.
[0045]
[0055] At stage 254, method 250 includes parasitically receiving the highband signal by the highband patch. For example, energy of the highband signal radiated by radiating patch 118 may be received by highband patch 112. Because highband patch 112 wirelessly receives the highband signal, highband patch 112 parasitically receives the highband signal. Although the energy received by highband patch 112 is less than all of the energy of the highband signal radiated by radiating patch 118, highband patch 112 still receives the highband signal.
[0046]
[0056] At stage 256, method 250 includes re-radiating the highband signal from the highband patch. For example, highband patch 112 radiates energy due to receiving the highband signal, and thus re-radiates the highband signal, even though the energy radiated by highband patch 112 is less than all of the energy of the highband signal that highband patch 112 received from radiating patch 118. Highband patch 112 is configured (e.g., shaped and aligned) to re-radiate the highband energy in each of the highband polarizations radiated by radiating patch 118. As another example, highband patch 152 or parasitic patch 172 re-radiate the highband signal energy received from radiating patch 118.
[0047]
[0057] At stage 258, method 250 includes parasitically receiving the low-band signal by a combination of the high-band patch and at least one parasitic element. For example, the energy of the low-band signal radiated by radiating patch 118 may be received by high-band patch 112 and parasitic elements 114-117, or high-band patch 152 and parasitic element 154, or high-band patch 112 and parasitic elements 114-117 and 164-167, or parasitic patch 172 and parasitic elements 174-177 and 184-187. Other examples of patch and parasitic element combinations may be used. Because high-band patch 112 and parasitic elements 114-117 wirelessly receive the low-band signal, high-band patch 112 and parasitic elements 114-117 parasitically receive the low-band signal. The combination of high-band patch 112 and parasitic elements 114-117 receives less energy than all of the energy of the low-band signal radiated by radiating patch 118, but the combination of high-band patch 112 and parasitic elements 114-117 receives the low-band signal.
[0048]
[0058] At stage 260, method 250 includes re-radiating the low-band signal from the combination of the high-band patch and at least one parasitic element. For example, high-band patch 112, in combination with parasitic elements 114-117, may radiate energy due to receiving the low-band signal, and thus the combination of high-band patch 112 and parasitic elements 114-117 radiates less than all of the energy of the low-band signal received from radiating patch 118, but re-radiates the low-band signal. When receiving only one low-band signal from radiating patch 118, fewer than all of the parasitic elements 114-117 (i.e., only the parasitic elements 114-117 corresponding to the polarization of the received signal) may re-radiate the energy of the low-band signal. High-band patch 112, in combination with parasitic elements 114-117, is configured (e.g., shaped or arranged) to re-radiate low-band energy in each of the low-band polarizations radiated by radiating patch 118. As another example, the combination of high-band patch 152 and parasitic element 154, or the combination of high-band patch 112 and parasitic elements 114-117 and other parasitic elements 164-167, or the combination of parasitic patch 172 and parasitic elements 174-177 and 184-187 re-radiate each of the low-band signals received from radiating patch 118 in the corresponding polarization.
[0049]
[0059] Other Considerations
[0060] The techniques described above are examples only and are not exhaustive, and configurations other than those described may be used.
[0050]
[0061] As used herein, "or" used in a list of items preceded by "at least one of" or preceded by "one or more of" indicates a disjunctive list, such as a list of "at least one of A, B, or C" or a list of "one or more of A, B, or C" meaning A or B or C or AB or AC or BC or ABC (i.e., A and B and C), or combinations with more than one feature (e.g., AA, AAB, ABBC, etc.).
[0051]
[0062] The systems and devices described above are examples only. Various configurations may omit, substitute, or add various procedures or components as appropriate. For example, features described with respect to particular configurations may be combined in various other configurations. Different aspects and elements of these configurations may be combined in a similar manner. Also, because technology evolves, many of the elements are examples only and do not limit the scope of the disclosure or claims.
[0052]
[0063] Specific details are set forth in this description to provide a thorough understanding of example configurations (including implementations). However, configurations may be practiced without these specific details. For example, well-known circuits, processes, algorithms, structures, and techniques are shown without unnecessary detail so as not to obscure the configurations. This description provides example configurations only and does not limit the scope, applicability, or configurations of the claims. Rather, the foregoing description of the configurations provides a description for implementing the described techniques. Various changes may be made in the function and arrangement of elements without departing from the spirit or scope of the present disclosure.
[0053]
[0064] Furthermore, more than one invention may be disclosed. The inventions described in the claims of the present application as originally filed are set forth below. [C1] In the antenna system, a patch radiator that is electrically conductive and configured to radiate energy in a first frequency band and in a second frequency band different from the first frequency band; a parasitic patch radiator that is conductive and configured to radiate energy in the first frequency band, the parasitic patch radiator overlapping the patch radiator; and at least one parasitic element comprising a conductor sized and positioned relative to the parasitic patch radiator such that the combination of the parasitic patch radiator and the at least one parasitic element radiates energy in the second frequency band. [C2] The system according to [C1], wherein the lowest frequency in the first frequency band is at least 10% higher than the highest frequency in the second frequency band. [C3] The system of [C1], wherein the at least one parasitic element comprises at least one conductor disposed adjacent each edge of the parasitic patch radiator. [C4] the parasitic patch radiator is square and configured to radiate energy in the first frequency band in at least one of two orthogonal polarizations, and is centered with respect to the patch radiator; The system of [C3], wherein the at least one parasitic element is symmetrically positioned and configured relative to the parasitic patch radiator such that a combination of the parasitic patch radiator and the at least one parasitic element radiates energy in the second frequency band in at least one of the two orthogonal polarizations. [C5] The system according to [C3], wherein the at least one parasitic element further comprises another conductor disposed in an area diagonally adjacent to each corner of the parasitic patch radiator. [C6] The system of [C3], wherein the at least one parasitic element comprises a conductive loop disposed around the parasitic patch radiator. [C7] The system described in [C1], wherein the patch radiator is arranged in a first layer of the system, and the parasitic patch radiator and the at least one parasitic element are arranged in a second layer of the system different from the first layer of the system. [C8] The system of [C7], wherein the parasitic patch radiator is a first parasitic patch radiator, and the system further comprises a second parasitic patch radiator disposed in a third layer of the system, the third layer being different from the first layer and the second layer, and the second parasitic patch radiator configured to radiate energy in the second frequency band. [C9] The system of [C8], wherein the first parasitic patch radiator is positioned on a first side of the patch radiator and the second parasitic patch radiator is positioned on a second side and overlaps the patch radiator. [C10] The system according to [C1], comprising a plurality of parasitic elements, wherein the parasitic patch radiator and the plurality of parasitic elements are arranged symmetrically about a center point. [C11] The system described in [C1], wherein the patch radiator is one of a plurality of patch radiators arranged in an array, the parasitic patch radiator and the at least one parasitic element are components of the array configured and arranged to be parasitically coupled to the plurality of patch radiators, and the array has more parasitic patches than patch radiators. [C12] In a multi-layer antenna system, a multi-layered circuit board; a feeder configured to conduct electricity; a patch radiator coupled to the feed line, the patch radiator being conductive, having a rectangular shape, disposed in a first layer of the multi-layered circuit board, and configured to radiate energy in a first frequency band and in a second frequency band different from the first frequency band; a parasitic patch radiator disposed in a second layer of the multi-layered circuit board, the patch radiator and the parasitic patch radiator overlapping, the parasitic patch radiator being conductive and having a rectangular shape and having a first edge, a second edge, a third edge, and a fourth edge, each of the third edge and the fourth edge extending between the first edge and the second edge, and having a first electrical length in the first frequency band of between 0.4 and 0.6 wavelengths in a substrate of the multi-layered circuit board; and at least one parasitic element comprising a first conductor positioned adjacent the first edge of the parasitic patch radiator and a second conductor positioned adjacent the second edge of the parasitic patch radiator. [C13] The system of [C12], wherein the parasitic patch radiator and the at least one parasitic element are arranged and configured to provide an electrical length in the substrate of between 0.4 and 0.6 wavelengths in the second frequency band for radiating energy in the second frequency band, and wherein a lowest frequency in the first frequency band is at least 10% higher than a highest frequency in the second frequency band. [C14] the parasitic patch radiator is square; the at least one parasitic element further comprises a third conductor disposed adjacent the third edge of the patch radiator and a fourth conductor disposed adjacent the fourth edge of the patch radiator; the parasitic patch radiator, the first conductor, and the second conductor are configured in combination to radiate energy in the second frequency band in a first polarization; The system of [C13], wherein the parasitic patch radiator, the third conductor, and the fourth conductor are configured to combine to radiate energy in the second frequency band in a second polarization that is orthogonal to the first polarization. [C15] The system of [C12], wherein the at least one parasitic element comprises at least four conductive strips each positioned adjacent one of the first edge, the second edge, the third edge, and the fourth edge of the parasitic patch radiator. [C16] The system according to [C15], wherein the at least one parasitic element further comprises square conductors aligned with two of the four conductive strips, respectively. [C17] The system of [C12], wherein the at least one parasitic element comprises a conductive ring disposed around the parasitic patch radiator. [C18] The system of [C12], wherein the parasitic patch radiator is a first parasitic patch radiator, and the system further comprises a second parasitic patch radiator disposed in a third layer of the multi-layered circuit board and configured to radiate energy in the second frequency band. [C19] The system of [C12], wherein the at least one parasitic element is located in the second layer of the multi-layered circuit board. [C20] In the antenna system, a multi-layered circuit board; a feeder configured to conduct electricity; a patch radiator coupled to the feed line, the patch radiator being electrically conductive and disposed in a first layer of the multi-layered circuit board, the patch radiator being configured to radiate energy at a first frequency and a second frequency, the first frequency and the second frequency being greater than 5 GHz apart; a plurality of parasitic patches disposed in a second layer of the multi-layered circuit board, the parasitic patches configured to receive first energy from the patch radiator at the first frequency and re-radiate at least a portion of the received first energy at the first frequency, and to receive second energy from the patch radiator at the second frequency and re-radiate at least a portion of the received second energy at the second frequency. [C21] The system according to [C20], wherein the plurality of parasitic patches are symmetric about a central point. [C22] The system of [C21], wherein the plurality of parasitic patches comprises four square patches each partially overlapping the patch radiator. [C23] The system according to [C21], wherein the center point is the center point of the patch radiator. [C24] The system of [C21], wherein the first frequency is separated from the second frequency by approximately 11 GHz. [C25] In the antenna system, a power supply means for providing a first signal in a first frequency band and a second signal in a second frequency band; first radiating means electrically coupled to the power supply means, the first radiating means radiating the first signal received from the power supply means in the first frequency band and the second signal received from the power supply means in the second frequency band; second radiating means for parasitically receiving the first signal from the first radiating means and radiating the first signal in the first frequency band in the first frequency band; and third radiating means in combination with the second radiating means for parasitically receiving the second signal in the second frequency band and in combination with the second radiating means for radiating the second signal in the second frequency band. [C26] The system of [C25], wherein the third radiating means combines with the second radiating means to parasitically receive the second signal in the second frequency band from the first radiating means. [C27] The system according to [C25], wherein the lowest frequency in the first frequency band is at least 10% higher than the highest frequency in the second frequency band. [C28] The system of [C25], wherein the second radiating means and the third radiating means are disposed in a first layer of a multi-layer circuit board. [C29] further comprising fourth radiating means for parasitically receiving the second signal in the second frequency band from the first radiating means and radiating the second signal in the second frequency band; The system of [C28], wherein the fourth radiating means is disposed in a second layer of the multilayer circuit board, the second layer being different from the first layer. [C30] the second radiating means radiates the first signal in two orthogonal polarizations; The system of [C28], wherein the third radiating means is positioned symmetrically with respect to the second radiating means and combines with the second radiating means to radiate the second signal in the two orthogonal polarizations.
Claims
1. 1. A patch radiator system comprising: A circuit board having a plurality of layers, none of the layers being coplanar; a patch radiator disposed in a first layer of the plurality of layers, the patch radiator having a first edge with a first length and a second edge with a second length, the second edge being substantially perpendicular to the first edge; a first feed configured to transmit signals at a first frequency and a second frequency to and from the patch radiator, the first feed connected to the patch radiator to cause it to radiate at a first polarization; a second feed configured to transmit signals at the first frequency and the second frequency to and from the patch radiator, the second feed connected to the patch radiator to cause it to radiate at a second polarization, the second frequency being different from the first frequency; a parasitic patch radiator disposed in a second layer of the plurality of layers, the parasitic patch radiator overlapping the patch radiator, the parasitic patch radiator being electrically conductive; a plurality of parasitic elements configured to re-radiate signals at the first frequency in combination with the parasitic patch radiator, each of the plurality of parasitic elements being electrically conductive and having a width that is less than the first length and the second length; A system comprising:
2. The system of claim 1 , wherein each parasitic element of the plurality of parasitic elements comprises a conductive strip.
3. 3. The system of claim 2, wherein a cumulative length of an edge of said parasitic patch radiator plus twice the width of each parasitic element of said plurality of parasitic elements is between 0.4 and 0.6 wavelengths of said first frequency.
4. The system of claim 3 , wherein the second frequency is higher than the first frequency.
5. The system of claim 2 , wherein each parasitic element of the plurality of parasitic elements has a length that is less than the first length and the second length.
6. 3. The system of claim 2, wherein the parasitic patch radiator has a third edge having a third length and a fourth edge having a fourth length, the third edge being approximately perpendicular to the fourth edge, and each parasitic element of the plurality of parasitic elements has a length that is less than the third length and the fourth length.
7. The system of claim 1 , wherein the plurality of parasitic elements comprises four parasitic elements having approximately the same size and shape.
8. The system of claim 7 , wherein the four parasitic elements are symmetrically positioned about the patch radiator.
9. The system of claim 8 , wherein the parasitic patch radiator is centered relative to the patch radiator.
10. The system of claim 9 , wherein the parasitic patch radiator and the patch radiator are substantially square.
11. The system of claim 1 , wherein a portion of each of the plurality of parasitic elements overlies the patch radiator, and another portion of each of the plurality of parasitic elements does not overlie the patch radiator.
12. The system of claim 1 , wherein no portion of any of the plurality of parasitic elements overlies the patch radiator.
13. The system of claim 1 , further comprising a ground plane disposed in a fourth layer of the plurality of layers.
14. The system of claim 13 , wherein the first layer is between a third layer and a fourth layer, and the third layer is above the first layer.
15. The system of claim 1 , wherein the first frequency and the second frequency are in different millimeter wave bands.
16. 2. The system of claim 1, wherein the first frequency is in a first 5G communications band and the second frequency is in a second 5G communications band different from the first 5G communications band.
17. 17. The system of claim 16, wherein the first frequency is approximately 26.5 GHz.
18. 17. The system of claim 16, wherein the second frequency is approximately 28 GHz.
19. The system of claim 1 , wherein the second polarization is orthogonal to the first polarization.
20. The system of claim 1 , wherein the first feed and the second feed are directly connected to the patch radiator.
21. 10. The system of claim 1, wherein the patch radiator system is included in an antenna system in a smartphone having a printed circuit board (PCB), the antenna system being attached to the PCB, the PCB including intermediate frequency circuitry.
22. 2. The system of claim 1, wherein the patch radiator system is included in an antenna system comprising an array of patch radiator systems, each patch radiator system in the array of patch radiator systems comprising a patch radiator, a first feed, a second feed, a parasitic patch radiator, and a plurality of parasitic elements.
23. 23. The system of claim 22, wherein there are four patch radiator systems in the array of patch radiator systems.
24. 24. The system of claim 23, wherein the antenna system further comprises an array of four other antennas.
25. In the antenna system, a power supply means for providing a first signal in a first 5G frequency band and a second signal in a second 5G frequency band; a first radiating means electrically coupled to the power feeding means, the first radiating means radiating the first signal received from the power feeding means in the first 5G frequency band and the second signal received from the power feeding means in the second 5G frequency band; the first radiating means having a substantially square shape; second radiating means for parasitically receiving the first signal from the first radiating means and radiating the first signal in the first 5G frequency band in the first 5G frequency band; third radiating means coupled with the second radiating means to parasitically receive the second signal in the second 5G frequency band and coupled with the second radiating means to radiate the second signal in the second 5G frequency band; A system comprising:
26. 26. The system of claim 25, wherein the third radiating means combines with the second radiating means to parasitically receive the second signal in the second 5G frequency band from the first radiating means.
27. 26. The system of claim 25, wherein a lowest frequency in the first 5G frequency band is at least 10% higher than a highest frequency in the second 5G frequency band.
28. 26. The system of claim 25, wherein the second radiating means and the third radiating means are disposed in a first layer of a multi-layer circuit board.
29. and fourth radiating means for parasitically receiving the second signal in the second 5G frequency band from the first radiating means and radiating the second signal in the second 5G frequency band; 30. The system of claim 28, wherein said fourth radiating means is disposed in a second layer of said multi-layer circuit board, said second layer being different from said first layer.
30. the second radiating means radiates the first signal in two orthogonal polarizations; 30. The system of claim 28, wherein the third radiating means is positioned symmetrically with respect to the second radiating means and combines with the second radiating means to radiate the second signal in the two orthogonal polarizations.
31. 26. The system of claim 25, wherein the first 5G frequency band comprises frequencies in approximately the 39 GHz band and the second 5G frequency band comprises frequencies in approximately the 28 GHz band.
32. 30. The system of claim 29, wherein a first radiating means is disposed in a third layer of the multi-layer circuit board, the third layer being different from the first layer and the second layer.
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