Electronic device including a microphone module

Abstract

An electronic device according to various embodiments of the present disclosure may include a back plate including a first through hole, a flash lens, and a support structure including a second through hole that houses the flash lens and faces the back plate, with at least a portion of the flash member located within the first through hole, a support member that supports the flash member and includes a third through hole that faces at least a portion of the second through hole, and a microphone module located below the support member and covering the third through hole.

Description

[Technical Field]

[0001] Various embodiments of the present disclosure relate to electronic devices that include microphone modules. [Background technology]

[0002] With the development of information and communication technology and semiconductor technology, various functions are being integrated into a single portable electronic device. For example, an electronic device may implement not only a communication function but also an entertainment function such as a game, a multimedia function such as music / video playback, a communication and security function for mobile banking, a camera function for taking images / videos, a schedule management function, and an electronic wallet function. Such electronic devices are being miniaturized for convenient portability. Summary of the Invention [Problem to be solved by the invention]

[0003] Research into the design of electronic devices continues to improve their aesthetic appeal.

[0004] An electronic device (e.g., a mobile terminal) includes a microphone module, and the microphone module can capture external sounds through a microphone hole formed in the housing. However, if a separate microphone hole is provided in the housing or if the microphone hole is provided in the camera window or camera deco member, the aesthetic appeal may be diminished. Furthermore, if the microphone hole is provided in the camera window or camera deco member, a connecting member (e.g., a C-clip) is required to electrically connect the microphone module to the main printed circuit board, and the rear plate may be subjected to pressure from the connecting member.

[0005] According to various embodiments of the present disclosure, an electronic device can be provided that uses an interior space disposed between a flash member and a back plate as a microphone duct.

[0006] However, the problem to be solved by the present disclosure is not limited to the above problem, and can be expanded in various ways without departing from the spirit and scope of the present disclosure. [Means for solving the problem]

[0007] According to various embodiments of the present disclosure, an electronic device may include a back plate including a first through-hole, a flash lens, and a support structure including a second through-hole that houses the flash lens and faces the back plate, the support member including at least a portion of the flash member located within the first through-hole, a third through-hole that supports the flash member and faces at least a portion of the second through-hole, and a microphone module located below the support member and covering the third through-hole.

[0008] According to various embodiments of the present disclosure, an electronic device may include a back plate including a first through-hole, a support structure facing the back plate including a second through-hole, and a flash member extending from the support structure and including a protruding structure at least a portion of which is located within the first through-hole, a support member supporting the flash member and including a third through-hole facing at least a portion of the second through-hole, a printed circuit board coupled to the support member and including a fourth through-hole facing the third through-hole, and a microphone module disposed on the printed circuit board and covering the second through-hole, the third through-hole, and the fourth through-hole. [Effects of the Invention]

[0009] According to various embodiments of the present disclosure, the electronic device can utilize the internal space and through-holes disposed between the flash member and the back plate as microphone ducts, and the absence of a separate microphone hole exposed in the back plate can improve the aesthetics of the electronic device and reduce the manufacturing cost and time of the electronic device.

[0010] According to various embodiments of the present disclosure, the microphone module can be placed on the printed circuit board using a sealing member, and by eliminating the connecting member that applies pressure to the back plate, lifting of the back plate can be prevented or reduced. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a block diagram illustrating an electronic device in a network environment, according to various embodiments of the present disclosure. [Figure 2] 1 is a front perspective view of an electronic device according to various embodiments of the present disclosure. [Figure 3] FIG. 1 is a rear perspective view of an electronic device according to various embodiments of the present disclosure. [Figure 4] 1 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure. [Figure 5] 5a and 5b are front and rear views of a back plate with a flash member attached thereto, according to various embodiments of the present disclosure; [Figure 6] 1 is an exploded perspective view of an electronic device including a back plate and a support member according to various embodiments of the present disclosure. [Figure 7] 1 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure. [Figure 8] 1A to 1C are diagrams illustrating a coupling structure between a support member and a printed circuit board according to various embodiments of the present disclosure. [Figure 9] FIG. 10 is a cross-sectional view of an electronic device according to another embodiment of the present disclosure. [Figure 10] 10A and 10B are diagrams illustrating a structure in which a microphone module is arranged on a support member according to another embodiment of the present disclosure. [Figure 11] FIG. 11a is a front view of a flush member according to various embodiments of the present disclosure, and FIG. 11b is a rear view of a flush member according to various embodiments of the present disclosure. [Figure 12]1 is a perspective view of a flash member including a groove structure according to various embodiments of the present disclosure; FIG. [Figure 13] 1 is a perspective view of a flash member including a protrusion structure according to various embodiments of the present disclosure; [Figure 14] 13 is a cross-sectional view taken along the line A-A' in FIG. 12. [Figure 15] FIG. 14 is a cross-sectional view taken along the line B-B' of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0012] FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure.

[0013] 1 , electronic device 101 in network environment 100 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to one embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to one embodiment, electronic device 101 can include processor 120, memory 130, input module 150, acoustic output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identity module 196, or antenna module 197. In some embodiments, electronic device 101 may omit at least one of these components (e.g., connection terminal 178) or may include one or more other components. In various embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into one component (e.g., display module 160).

[0014] Processor 120 may, for example, execute software (e.g., program 140) to control at least one other component (e.g., a hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store instructions or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the instructions or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to one embodiment, processor 120 may include main processor 121 (e.g., a central processing unit or application processor) or auxiliary processor 123 (e.g., a graphics processing unit, a neural network processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) operable independently or in conjunction therewith. For example, if electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to use less power or to specialize in designated functions than the main processor 121. The auxiliary processor 123 may be implemented separately from or as part of the main processor 121.

[0015] The auxiliary processor 123 may, for example, control at least a portion of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active (e.g., executing an application) state. According to one embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another functionally related component (e.g., the camera module 180 or the communication module 190). According to one embodiment, the auxiliary processor 123 (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. Such learning may, for example, be performed within the electronic device 101 itself, where the artificial intelligence is executed, or via a separate server (e.g., the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the foregoing examples. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be one of, but is not limited to, a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the foregoing.In addition to hardware structures, the artificial intelligence model may additionally or alternatively include software structures.

[0016] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The data may include, for example, input or output data for software (e.g., the program 140) and its associated instructions. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0017] The programs 140 may be stored in the memory 130 as software and may include, for example, an operating system 142 , middleware 144 , or applications 146 .

[0018] Input module 150 may receive instructions or data from outside (e.g., a user) electronic device 101 for use by components (e.g., processor 120) of electronic device 101. Input module 150 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).

[0019] The audio output module 155 can output audio signals external to the electronic device 101. The audio output module 155 can include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing recordings. The receiver can be used to receive incoming phone calls. According to one embodiment, the receiver can be implemented separately from or as part of the speaker.

[0020] Display module 160 can visually provide information to an external (e.g., user) of electronic device 101. Display module 160 can include, for example, a display, a holographic device, or a projector and control circuitry for controlling the corresponding device. According to one embodiment, display module 160 can include a touch sensor configured to sense a touch or a pressure sensor configured to measure the strength of a force caused by the touch.

[0021] Audio module 170 can convert sound into electrical signals or vice versa. According to one embodiment, audio module 170 can acquire sound via input module 150 or output sound via acoustic output module 155 or an external electronic device (e.g., electronic device 102) (e.g., speakers or headphones) directly or wirelessly connected to electronic device 101.

[0022] The sensor module 176 may sense an operating state (e.g., power or temperature) of the electronic device 101 or an external environmental state (e.g., a user state) and generate an electrical signal or data value corresponding to the sensed state. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0023] Interface 177 may support one or more specified protocols that may be used to connect electronic device 101 directly or wirelessly with external electronic devices (e.g., electronic device 102). According to one embodiment, interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0024] Connection terminal 178 may include a connector through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to one embodiment, connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0025] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that can be perceived by a user via their sense of touch or kinesthetic sense. According to one embodiment, the haptic module 179 can include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0026] Camera module 180 is capable of capturing still and moving images. According to one embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0027] The power management module 188 may manage the power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0028] Battery 189 may provide power to at least one component of electronic device 101. According to one embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0029] Communications module 190 can support establishing a direct (e.g., wired) or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108) and performing communication over the established communication channel. Communications module 190 can operate independently of processor 120 (e.g., an application processor) and can include one or more communications processors that support the direct (e.g., wired) or wireless communication. According to one embodiment, communications module 190 can include wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or wired communication module 194 (e.g., a local area network (LAN) communication module, or a power line communication module). The appropriate communication module can communicate with the external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (WiFi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). Some types of such communication modules can be integrated into one component (e.g., a single chip) or implemented as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can use subscriber information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the subscriber identity module 196 to identify or authenticate the electronic device 101 within a communication network, such as the first network 198 or the second network 199.

[0030] The wireless communication module 192 may support 5G networks and next-generation communication technologies, such as new radio access (NR) technologies. NR technologies may support high-capacity data transmission at high speeds (eMBB (enhanced mobile broadband)), terminal power minimization and multi-terminal connection (mMTC (massive machine-type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 may support high-frequency bands (e.g., mmWave bands) to achieve high data rates. The wireless communication module 192 may support various technologies to ensure performance in high-frequency bands, such as beamforming, massive multiple-input and multiple-output (massive MIMO), full-dimensional multiple-input multiple-output (FD-MIMO), array antennas, analog beamforming, and large-scale antennas. The wireless communication module 192 can support various requirements defined by the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to one embodiment, the wireless communication module 192 can support a peak data rate (e.g., 20 Gbps or more) for implementing eMBB, a loss coverage (e.g., 164 dB or less) for implementing mMTC, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for implementing URLC.

[0031] The antenna module 197 can transmit or receive signals or power to or from the outside (e.g., an external electronic device). According to one embodiment, the antenna module can include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module 197 can include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 can be selected from the multiple antennas, for example, by the communication module 190. Signals or power can be transmitted or received between the communication module 190 and an external electronic device via the selected at least one antenna. According to some embodiments, other components other than the radiator (e.g., a radio frequency integrated circuit (RFIC)) can be further formed as part of the antenna module 197.

[0032] According to various embodiments, antenna module 197 may form an mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., an mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top or side) of the printed circuit board and capable of transmitting and receiving signals in the designated high frequency band.

[0033] At least some of the components are connected to each other via a peripheral communication method (e.g., a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and can exchange signals (e.g., commands or data) with each other.

[0034] According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via a server 108 connected to a second network 199. Each of the external electronic devices 102 or 104 may be the same or a different type of device as the electronic device 101. According to one embodiment, all or part of the operations performed by the electronic device 101 may be performed by one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 101 may request one or more external electronic devices to perform the function or at least part of the service rather than performing the function or service itself. The one or more external electronic devices receiving the request may perform at least part of the requested function or service, or additional functions or services related to the request, and communicate the results of the execution to the electronic device 101. The electronic device 101 may provide the result, with or without further processing, as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device 104 or the server 108 may be included in a second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies.

[0035] Electronic devices according to various embodiments disclosed herein may take various forms. The electronic devices may include, for example, portable communication devices (e.g., smartphones), computing devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or consumer electronic devices. Electronic devices according to embodiments herein are not limited to the aforementioned devices.

[0036] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features described herein to specific embodiments, but include various modifications, equivalents, or alternatives of the embodiments. In describing the drawings, like reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item can include one or more of the item, unless the relevant context clearly dictates otherwise. In this specification, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," "first," or "second" may be used simply to distinguish a component from other corresponding components and do not limit the component in other aspects (e.g., importance or order). When one (e.g., a first) component is referred to as "coupled" or "connected" to another (e.g., a second) component, in combination with or without the terms "functionally" or "communicatively," this means that the component may be connected to the other component directly (e.g., by wire), wirelessly, or via a third component.

[0037] The term "module" used in various embodiments herein may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integrated component or the smallest unit or portion of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0038] According to various embodiments, each of the aforementioned components (e.g., modules or programs) may include one or more entities, and some of the entities may be located separately in different components. According to various embodiments, one or more of the aforementioned components or operations may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as performed by the corresponding component of the multiple components before integration. According to various embodiments, operations performed by modules, programs, or other components may be performed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be performed in a different order or omitted, or one or more other operations may be added.

[0039] 2 and 3 are front and rear perspective views of an electronic device according to various embodiments of the present disclosure.

[0040] 2 and 3, electronic device 101 according to one embodiment may include housing 210 including front surface 210A, back surface 210B, and side surface 210C surrounding a space between front surface 210A and back surface 210B. In another embodiment (not shown), housing 210 may refer to a structure forming a portion of front surface 210A in FIG. 2 or back surface 210B and side surface 210C in FIG. 3. According to one embodiment, at least a portion of front surface 210A may be formed by a substantially transparent front plate 202 (e.g., a glass plate including various coating layers or a polymer plate). Back surface 210B may be formed by a back plate 211. Back plate 211 may be formed by, for example, glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. Side 210C may be formed by a side bezel structure (or "side member") 218 ​​that is coupled to front plate 202 and back plate 211 and comprises a metal and / or a polymer. In some embodiments, back plate 211 and side bezel structure 218 may be integrally formed and comprise the same material (e.g., glass, a metallic material such as aluminum, or ceramic). According to another embodiment, front surface 210A and / or front plate 202 may be interpreted as part of display 220. According to one embodiment, housing 210 may include front plate 202 and back plate 211.

[0041] According to one embodiment, electronic device 101 may include at least one or more of display 220, audio modules 203, 207, 214 (e.g., audio module 170 of FIG. 1 ), sensor module (e.g., sensor module 176 of FIG. 1 ), camera modules 205, 206 (e.g., camera module 180 of FIG. 1 ), key input device 217 (e.g., input module 150 of FIG. 1 ), and connector holes 208, 209 (e.g., connection terminal 178 of FIG. 1 ). In some embodiments, electronic device 101 may omit at least one of the components (e.g., connector hole 209) or may further include other components.

[0042] According to one embodiment, display 220 may be visually exposed, for example, through a substantial portion of front plate 202. In some embodiments, at least a portion of display 220 may be exposed through front plate 202 forming front surface 210A. According to one embodiment, display 220 may be a flexible or foldable display.

[0043] According to one embodiment, the surface of the housing 210 (or the front plate 202) may include a screen display area that is formed as the display 220 is visually exposed. In one example, the screen display area may include the front surface 210A.

[0044] In another embodiment (not shown), electronic device 101 may include a recess or opening formed in a portion of a screen display area (e.g., front surface 210A) of display 220 and may include at least one or more of audio module 214, a sensor module (not shown), a light emitting element (not shown), and camera module 205 aligned with the recess or opening. In another embodiment (not shown), the back of the screen display area of ​​display 220 may include at least one or more of audio module 214, a sensor module (not shown), a camera module 205, a fingerprint sensor (not shown), and a light emitting element (not shown).

[0045] In another embodiment (not shown), the display 220 may be coupled to or located adjacent to touch sensing circuitry, a pressure sensor that can measure the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-based stylus pen.

[0046] In some embodiments, at least a portion of the key input device 217 may be disposed in the side bezel structure 218 .

[0047] According to one embodiment, the audio modules 203, 207, 214 may include, for example, a microphone hole 203 and speaker holes 207, 214. The microphone hole 203 may have a microphone disposed therein for capturing external sounds, and in some embodiments, multiple microphones may be disposed therein to enable sensing of the direction of sound. The speaker holes 207, 214 may include an external speaker hole 207 and a call receiver hole 214. In some embodiments, the speaker holes 207, 214 and the microphone hole 203 may be implemented as a single hole, or a speaker may be included (e.g., a piezo speaker) without the speaker holes 207, 214.

[0048] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to, for example, an internal operating condition of the electronic device 101 or an external environmental condition. The sensor module (not shown) may include, for example, a first sensor module (not shown) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the front surface 210A of the housing 210, and / or a third sensor module (not shown) (e.g., an HRM sensor) and / or a fourth sensor module (not shown) (e.g., a fingerprint sensor) disposed on the back surface 210B of the housing 210. In some embodiments (not shown), the fingerprint sensor may be disposed on the back surface 210B of the housing 210, rather than on the front surface 210A (e.g., the display 220) of the housing 210. The electronic device 101 may further include a sensor module (not shown), such as at least one of a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (not shown).

[0049] According to one embodiment, the camera modules 205, 206 may include, for example, a front camera module 205 disposed on the front surface 210A of the electronic device 101, a back camera module 206 disposed on the back surface 210B, and / or a flash 204. The camera modules 205, 206 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 204 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (an infrared camera, a wide-angle and a telephoto lens) and image sensors may be disposed on one side of the electronic device 101.

[0050] According to one embodiment, the key input device 217 may be located on the side surface 210C of the housing 210. In another embodiment, the electronic device 101 may not include some or all of the aforementioned key input devices 217, and the key input devices 217 that are not included may be implemented in other forms, such as soft keys, on the display 220.

[0051] According to one embodiment, a light emitting element (not shown) can be disposed, for example, on the front surface 210A of the housing 210. The light emitting element (not shown) can provide, for example, status information in the form of light for the electronic device 101. In another embodiment, the light emitting element (not shown) can provide, for example, a light source in conjunction with the operation of the front camera module 205. The light emitting element (not shown) can include, for example, an LED, an IR LED, and / or a xenon lamp.

[0052] According to one embodiment, the connector holes 208, 209 may include, for example, a first connector hole 208 that may accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data to and from an external electronic device or a connector (e.g., an earphone jack) for transmitting and receiving audio signals to and from an external electronic device, and / or a second connector hole 209 that may accommodate a storage device (e.g., a subscriber identification module (SIM) card). According to one embodiment, the first connector hole 208 and / or the second connector hole 209 may be omitted.

[0053] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0054] 4, electronic device 101 may include a back plate 211, a first support member 230, a second support member 240, and a printed circuit board 250. The configuration of back plate 211 in FIG. 4 may be the same as or in part the configuration of back plate 211 in FIG. 3.

[0055] According to various embodiments, back plate 211 can form at least a portion of the exterior of electronic device 101. For example, back plate 211 can form the back (e.g., back side 210B in FIG. 2) and / or the side (e.g., side 210C in FIG. 2) of electronic device 101.

[0056] According to various embodiments, the first support member 230 can be disposed within a housing (e.g., housing 210 in FIG. 2). According to one embodiment, the first support member 230 can be disposed below the back plate 211 (e.g., in the +Z direction). For example, the first support member 230 can be disposed between the back plate 211 and the second support member 240. According to one embodiment, the first support member 230 can house an electronic component (e.g., audio module 170 in FIG. 1).

[0057] According to various embodiments, the second support member 240 can support components of the electronic device 101. For example, a component of the electronic device 101 (e.g., a printed circuit board 250 or a battery (e.g., battery 189 in FIG. 1)) can be mounted to the second support member 240. According to one embodiment, the second support member 240 can support components of the electronic device 101. 2 A display (e.g., display 220 in FIG. 2) may be disposed on one side of the support member 240, and a printed circuit board 250 may be disposed on the other side. According to one embodiment, the second support member 240 may form at least a portion of a side surface (e.g., side surface 210C in FIG. 2). According to one embodiment, the second support member 240 may be formed of a metallic material and / or a non-metallic (e.g., polymeric) material.

[0058] According to various embodiments, printed circuit board 250 can be disposed on second support member 240. According to one embodiment, at least a portion of printed circuit board 250 can be disposed between first support member 230 and second support member 240. According to one embodiment, printed circuit board 250 can house a processor (e.g., processor 120 of FIG. 1 ), memory (e.g., memory 130 of FIG. 1 ), and / or an interface (e.g., interface 177 of FIG. 1 ).

[0059] FIG. 5a is a front view of a back plate with a flash member attached thereto according to various embodiments of the present disclosure, and FIG. 5b is a back view of a back plate with a flash member attached thereto according to various embodiments of the present disclosure.

[0060] 5a and 5b, electronic device 101 may include a back plate 310 and a flash member 320 attached to back plate 310. The configurations of back plate 310 and flash member 320 in Figures 5a and 5b may be the same in whole or in part as the configurations of back plate 211 and flash 204 in Figure 3.

[0061] According to various embodiments, the back plate 310 may include a first through-hole 312. According to one embodiment, the back plate 310 may include a first surface 310a of the back plate 310 exposed to the exterior of the electronic device 101 and a second surface 31b opposite the first surface 310a. The first through-hole 312 may be a hole that penetrates at least a portion between the first surface 310a and the second surface 310b. According to one embodiment, the first through-hole 312 may accommodate at least a portion of the flash member 320.

[0062] According to various embodiments, the back plate 310 may include at least one camera hole 314. According to one embodiment, the at least one camera hole 314 may be positioned to correspond to a camera module (e.g., camera module 206 of FIG. 3). According to one embodiment, the camera hole 314 may be a hole that penetrates at least a portion of the back plate 310 between the first surface 310a and the second surface 310b. According to one embodiment, the first through-hole 312 may be separated from the at least one camera hole 314. According to one embodiment, at least a portion of the camera module (e.g., camera module 180 of FIG. 1) may be visually exposed to the outside of the electronic device 101 through the camera hole 314.

[0063] According to various embodiments, the flash member 320 can emit light to the outside of the electronic device 101. For example, the flash member 320 can include a flash lens 322 and a support structure 324 that houses the flash lens 322. According to one embodiment, the flash lens 322 can be a light emitting diode (LED) or a xenon lamp. According to one embodiment, the flash lens 322 can be electrically connected to a battery (e.g., battery 189 in FIG. 1 ) and / or a processor (e.g., processor 120 in FIG. 1 ). According to one embodiment, the support structure 324 can house the flash lens 322. The support structure 324 can be interpreted as a housing or case for the flash member 320. According to one embodiment, the support structure 324 can face a portion of the back plate 310 (e.g., the second surface 310 b).

[0064] According to various embodiments, at least a portion of the flash member 320 may be disposed within the first through-hole 312. For example, at least a portion of the flash member 320 may be visually exposed to the outside of the electronic device 101 through the first through-hole 312. According to one embodiment, light generated from a flash lens 322 of the flash member 320 may be transmitted to the outside of the electronic device 101 through the first through-hole 312. According to one embodiment, the flash member 320 may be disposed on the lower part (e.g., in the +Z direction) of the back plate 310. For example, the flash member 320 may be disposed on the second surface 310b of the back plate 310. According to one embodiment, the flash member 320 may not overlap in the thickness direction (e.g., in the Z-axis direction) with a camera module (e.g., the camera module 180 in FIG. 1 ) for acquiring an external image or a camera window (not shown) for protecting the camera module through the camera hole 314.

[0065] Figure 6 is an exploded perspective view of an electronic device including a back plate and a support member according to various embodiments of the present disclosure. Figure 7 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0066] 6 and 7, electronic device 101 may include a display 301, a back plate 310, a flash member 320, a support member 330, a printed circuit board 340, and a microphone module 350. The configurations of display 301, back plate 310, flash member 320, support member 330, and printed circuit board 340 in Figures 6 and / or 7 may be the same in whole or in part as the configurations of display 220, back plate 310, flash member 320, first support member 230, and printed circuit board 250 in Figures 2, 4, 5a, and / or 5b.

[0067] According to various embodiments, the back plate 310 can surround at least a portion of the flash member 320. For example, the back plate 310 can include a seventh surface 310c that surrounds at least a portion of the flash member 320 (e.g., the protruding structure 327). According to one embodiment, the seventh surface 310c can surround at least a portion between the first surface 310a and the second surface 310b of the back plate 310. According to one embodiment, the seventh surface 310c can form the first through-hole 312. For example, at least a portion of the space surrounded by the seventh surface 310c can be interpreted as the first through-hole 312.

[0068] According to various embodiments, the flush member 320 can be spaced apart from the back plate 310. According to one embodiment, the support structure 324 of the flush member 320 can include a third surface 320a facing the second surface 310b of the back plate 310 and a fourth surface 320b opposite the third surface 320a. The third surface 320a can be spaced apart from the second surface 310b of the back plate 310. According to one embodiment, the flush member 320 can include a protruding structure 327 extending or protruding from the third surface 320a of the support structure 324. At least a portion of the protruding structure 327 can face the seventh surface 310c of the back plate 310 while being spaced apart. According to one embodiment, the gap or space between the third surface 320a and the second surface 310b and / or the gap or space between the seventh surface 310c and the protruding structure 327 can be interpreted as the interior space 302 of the electronic device 101. For example, at least a portion of the interior space 302 may be located between the second surface 310b and the third surface 320a. According to one embodiment, at least a portion of sound or vibration transmitted from outside the electronic device 101 may be transmitted to the microphone module 350 through the interior space 302 disposed between the back plate 310 and the flash member 320 of the back plate 310.

[0069] According to various embodiments, the support structure 324 of the flash member 320 may include a second through-hole 326. According to one embodiment, the second through-hole 326 may penetrate the third surface 320a and the fourth surface 320b. According to one embodiment, the second through-hole 326 may face the back plate 310. For example, the second through-hole 326 may be connected to the internal space 302, and sound or vibration transmitted from outside the electronic device 101 may be transmitted to the microphone module 350 via the internal space 302 and the second through-hole 326.

[0070] According to various embodiments, the support structure 324 of the flash member 320 may include a second through-hole 326. According to one embodiment, the second through-hole 326 may penetrate the third surface 320a and the fourth surface 320b. According to one embodiment, the second through-hole 326 may face the back plate 310. For example, the second through-hole 326 may be connected to the internal space 302, and sound or vibration transmitted from outside the electronic device 101 may be transmitted to the microphone module 350 via the internal space 302 and the second through-hole 326.

[0071] According to various embodiments, at least a portion of the second through-hole 326 may be a groove or a recess. For example, the second through-hole 326 may include a first portion 326-1 and a second portion 326-2. According to one embodiment, the first portion 326-1 may extend from the interior space 302 and be formed on the third surface 320a. According to one embodiment, the second portion 326-2 may extend from the first portion 326-1 to the fourth surface 320b of the flash member 320. According to one embodiment, the first waterproofing member 361 may be attached on the second portion 362-2. For example, the first waterproofing member 361 may be attached on a groove formed by the second portion 326-2.

[0072] According to various embodiments, the support member 330 can support the flush member 320. For example, the flush member 320 can be coupled to the support member 330 using a seal member (e.g., first seal member 363). According to one embodiment, the support member 330 can include an eighth surface 330a facing the fourth surface 320b of the flush member 320 and a ninth surface 330b opposite the eighth surface 330a.

[0073] According to various embodiments, the support member 330 may include a third through-hole 332. According to one embodiment, the third through-hole 332 may face at least a portion of the second through-hole 326. For example, sound or vibration outside the electronic device 101 may be transmitted to the third through-hole 332 through the interior space 302 and the second through-hole 326. According to one embodiment, the third through-hole 332 may penetrate at least a portion between the eighth surface 330a and the ninth surface 330b.

[0074] According to various embodiments, the printed circuit board 340 may include a fourth through hole 342. According to one embodiment, at least a portion of the fourth through hole 342 may face at least a portion of the third through hole 332. For example, sound or vibrations outside the electronic device 101 may be transmitted to the fourth through hole 342 through the internal space 302, the second through hole 326, and the third through hole 332. According to one embodiment, the printed circuit board 340 may include a fifth surface 340a facing the support member 330 and a sixth surface 340b opposite the fifth surface 340a. According to one embodiment, the fourth through hole 342 may penetrate at least a portion between the fifth surface 340a and the sixth surface 340b. According to one embodiment, the printed circuit board 340 may be coupled to the support member 330. For example, the printed circuit board 340 may be coupled to the support member 330 via a second seal member 364. According to one embodiment, the printed circuit board 340 may be disposed on a lower portion (e.g., in the +Z direction) of the support member 330. For example, the printed circuit board 340 may be disposed on the ninth surface 330b of the support member 330.

[0075] According to various embodiments, the printed circuit board 340 can house at least one electronic component 303. For example, the printed circuit board 340 can house a microphone module 350. According to one embodiment, the microphone module 350 can be disposed on a sixth side 340b of the printed circuit board 340.

[0076] According to various embodiments, the microphone module 350 can acquire sounds outside the electronic device 101. For example, the microphone module 350 can acquire sounds transmitted through a first path P1. The first path P1 can be interpreted as the interior space 302, the second through-hole 326, the third through-hole 332, and the fourth through-hole 342. According to one embodiment, the first path P1 can be interpreted as a microphone duct. According to one embodiment, the microphone module 350 can cover the second through-hole 326, the third through-hole 332, and / or the fourth through-hole 342. For example, the microphone module 350 can overlap at least a portion of the second through-hole 326, the third through-hole 332, and / or the fourth through-hole 342. The configuration of the microphone module 350 may be the same as or similar to the configuration of the audio module 170 of FIG. 1 .

[0077] According to various embodiments, the electronic device 101 may include a first waterproofing member 361. According to one embodiment, the first waterproofing member 361 may reduce or prevent moisture or foreign matter from penetrating into the electronic device 101 through the second through-hole 326. According to one embodiment, the first waterproofing member 361 may be attached to a lower portion (e.g., in the +Z direction) of the flash member 320. For example, the first waterproofing member 361 may be disposed on the second portion 326-2 of the flash member 320 and cover the second through-hole 326. According to one embodiment, at least a portion of the first waterproofing member 361 may overlap the second through-hole 326. According to one embodiment, at least a portion of the first waterproofing member 361 may include a plurality of through-holes. For example, at least a portion of the first waterproofing member 361 may be formed in a mesh shape.

[0078] According to various embodiments, the electronic device 101 may include a second waterproofing member 362. According to one embodiment, the second waterproofing member 362 may reduce or prevent moisture or foreign matter from entering a gap (e.g., the internal space 302) between the back plate 310 and the flash member 320 from penetrating into the interior of the electronic device 101. According to one embodiment, the second waterproofing member 362 may be disposed between the back plate 310 and the flash member 320. For example, the second waterproofing member 362 may be disposed between the second surface 310b of the back plate 310 and the third surface 320a of the flash member 320. According to one embodiment, the second waterproofing member 362 may be a waterproof tape. According to one embodiment, the second waterproofing member 362 may be formed in the shape of a closed loop. For example, the second waterproofing member 362 may surround at least a portion of the first path P1 to reduce or prevent leakage of sound or vibration transmitted from the outside of the electronic device 101 to the microphone module 350. According to one embodiment, the second waterproofing member 362 can reduce or prevent transmission of light generated from the flash lens 322 into the interior of the electronic device 101. For example, the second waterproofing member 362 can absorb at least a portion of the light generated from the flash lens 322 of the flash member 320.

[0079] According to various embodiments, the electronic device 101 may include a first sealing member 363. According to one embodiment, the first sealing member 363 may connect the flash member 320 and the support member 330. For example, the first sealing member 363 may be an adhesive tape or glue. According to one embodiment, the first sealing member 363 may be disposed between the flash member 320 and the support member 330. For example, the first sealing member 363 may be disposed between the fourth surface 320b of the flash member 320 and the eighth surface 330a of the support member 330. According to one embodiment, the first sealing member 363 may reduce or prevent sound leakage or vibration from being transmitted to the microphone module 350. For example, the first sealing member 363 may reduce or prevent sound leakage or vibration from escaping from the space between the flash member 320 and the support member 330. According to one embodiment, the first sealing member 363 may be formed in the shape of a closed loop.

[0080] According to various embodiments, the electronic device 101 may include a second sealing member 364. According to one embodiment, the second sealing member 364 may reduce or prevent sound or vibration leakage from the microphone module 350. For example, the second sealing member 364 may reduce or prevent sound or vibration from escaping from the space between the support member 330 and the printed circuit board 340. According to one embodiment, the second sealing member 364 may be disposed between the support member 330 and the printed circuit board 340. For example, the second sealing member 364 may be disposed between the ninth surface 330b of the support member 330 and the fifth surface 340a of the printed circuit board 340. According to one embodiment, the second sealing member 364 may be formed in the shape of a closed loop. According to one embodiment, the second sealing member 364 may include foam. For example, the second sealing member 364 may be a sponge.

[0081] FIG. 8 is a diagram illustrating a coupling structure between a support member and a printed circuit board according to various embodiments of the present disclosure.

[0082] 8, the electronic device 101 may include at least one fastening structure 304 for coupling the support member 330 to a printed circuit board (e.g., the printed circuit board 340 in FIG. 7). The configuration of the support member 330 in FIG. 8 may be the same in whole or in part as the configuration of the first support member 230 in FIG. 4.

[0083] According to various embodiments, the fastening structure 304 can couple the support member 330 to a printed circuit board (e.g., the printed circuit board 340 in FIG. 7 ). For example, the fastening structure 304 can couple the support member 330 to the printed circuit board 340 together with the first seal member 363 (e.g., the first seal member 363 in FIG. 7 ). According to one embodiment, the support member 330 is fixed to the printed circuit board 340 by the fastening structure 304, which can reduce or prevent sound leakage between the support member 330 and the printed circuit board 340 due to the repulsive force of the second seal member (e.g., the second seal member 364 in FIG. 7 ). According to one embodiment, the fastening structure 304 can couple the support member 330 (e.g., the first support member 230 in FIG. 4 ), the printed circuit board 340, and the second support member (e.g., the second support member 240 in FIG. 4 ). For example, the support member 330 and the printed circuit board 340 may be coupled to the second support member 240 via a fastening structure 304. According to one embodiment, the fastening structure 304 may be a boss structure or a screw structure. According to one embodiment, the support member 330 may include an eighth surface 330a (e.g., the eighth surface 330a in FIG. 7 ) on which the first seal member 363 is located.

[0084] 9 is a cross-sectional view of an electronic device according to another embodiment of the present disclosure, illustrating a structure in which a microphone module is disposed on a support member according to another embodiment of the present disclosure.

[0085] 9 and 10, the electronic device 101 may include a display 301, a back plate 310, a flash member 320, a support member 330, a printed circuit board 340, a microphone module 350, a first waterproof member 361, a second waterproof member 362, and a first sealing member 363. The configurations of the display 301, the back plate 310, the flash member 320, the support member 330, the printed circuit board 340, the microphone module 350, the first waterproof member 361, the second waterproof member 362, and the first sealing member 363 in FIGS. 9 and 10 may be the same as or similar to the configurations of the display 301, the back plate 310, the flash member 320, the support member 330, the printed circuit board 340, the microphone module 350, the first waterproof member 361, the second waterproof member 362, and the first sealing member 363 in FIG.

[0086] According to various embodiments, the electronic device 101 may include a flexible printed circuit board 370. According to one embodiment, the flexible printed circuit board 370 may include a fifth through-hole 372 facing at least a portion of the third through-hole 332. For example, sound or vibrations outside the electronic device 101 may be transmitted to the fifth through-hole 372 through the internal space 302, the second through-hole 326, and the third through-hole 332. According to one embodiment, the flexible printed circuit board 370 may be attached to the support member 330 via a second seal member 374. According to one embodiment, the second seal member 374 may be disposed on a tenth surface 330c of the support member 330.

[0087] According to various embodiments, the flexible printed circuit board 370 can house electronic components (e.g., the microphone module 350 and / or the speaker module 305). According to one embodiment, at least a portion of the flexible printed circuit board 370 can be disposed between the microphone module 350 and the support member 330. According to one embodiment, the flexible printed circuit board 370 can be electrically connected to the electronic components 303 disposed on the printed circuit board 340. For example, the flexible printed circuit board 370 can include a connector structure 376 for connecting to the printed circuit board 340.

[0088] According to various embodiments, the microphone module 350 can acquire sounds outside the electronic device 101. For example, the microphone module 350 can acquire sounds transmitted through a second path P2. The second path P2 can be interpreted as the interior space 302, the second through-hole 326, the third through-hole 332, and the fifth through-hole 372. According to one embodiment, the second path P2 can be interpreted as a microphone duct. According to one embodiment, the microphone module 350 can be disposed below the flexible printed circuit board 370 (e.g., in the +Z direction). According to one embodiment, the length of the second path P2 can be shorter than the length of the first path (e.g., the first path P1 in FIG. 7 ). The resonant frequency of the electronic device 101 and / or the magnitude of the sound acquired by the microphone module 350 can be changed based on the length of the path through which the microphone module 350 acquires the sound. For example, using a flexible printed circuit board 370, the resonant frequency band and / or the loudness of sound entering the microphone module 350 of an electronic device 101 (e.g., FIG. 9) including a microphone module 350 arranged below the support member 330 (e.g., in the +Z direction) may be greater than the resonant frequency band and / or the loudness of sound entering the microphone module 350 of an electronic device (e.g., FIG. 7) including a microphone module 350 arranged below the printed circuit board 340.

[0089] FIG. 11a is a front view of a flush member according to various embodiments of the present disclosure, and FIG. 11b is a rear view of a flush member according to various embodiments of the present disclosure.

[0090] 11a and 11b, flash member 320 may include a flash lens 322 and a support structure 324. The configuration of flash member 320 in Figures 11a and 11b may be the same in whole or in part as the configuration of flash member 320 in Figures 5a and 5b.

[0091] According to various embodiments, the flash member 320 may include a first region 321 for facing a second waterproof member (e.g., second waterproof member 362 in FIG. 6). The first region 321 may be at least a portion of a third surface 320a of the flash member 320. According to one embodiment, the first region 321 may surround at least a portion of the flash lens 322.

[0092] According to various embodiments, at least a portion of sound or vibrations entering through the interior space 302 between the flash lens 322 and the first region 321 (e.g., the interior space 302 in FIG. 7 ) can be transmitted to the first portion 326-1. According to one embodiment, at least a portion of the sound or vibrations transmitted to the first portion 326-1 can be transmitted to the second portion 326-2. According to one embodiment, the cross-sectional area of ​​the second portion 326-2 can be greater than the cross-sectional area of ​​the first portion 326-1. For example, the second length l2 of the second portion 326-2 can be greater than the first length l1 of the first portion 326-1.

[0093] According to various embodiments, the flash member 320 can include a second region 323 for facing a first seal member (e.g., first seal member 363 of FIG. 6). The second region 323 can be at least a portion of the fourth surface 320b of the flash member 320. According to one embodiment, the second region 323 can surround at least a portion of the second portion 326-2.

[0094] According to various embodiments, the flash member 320 may include a third region 325 for facing the first waterproofing member (e.g., the first waterproofing member 361 in FIG. 6). According to one embodiment, the third region 325 may form at least a portion of the second portion 326-2. According to one embodiment, the third region 325 may be substantially parallel to the second region 323.

[0095] Figure 12 is a perspective view of a flash member including a groove structure according to various embodiments of the present disclosure, Figure 13 is a perspective view of a flash member including a protrusion structure according to various embodiments of the present disclosure, Figure 14 is a cross-sectional view taken along line A-A' of Figure 12, and Figure 15 is a cross-sectional view taken along line B-B' of Figure 13.

[0096] 12 to 15, the flash member 320 may include a protruding structure 327 extending from the support structure 324. According to one embodiment, the protruding structure 327 may be interpreted as a region of the flash member 320 surrounded by a first through-hole (e.g., the first through-hole 312 in FIG. 7) in a back plate (e.g., the back plate 310 in FIG. 7). According to one embodiment, at least a portion of the protruding structure 327 may be visually exposed to the outside of the electronic device (e.g., the electronic device 101 in FIG. 7). For example, light generated from the flash lens 322 may pass through the protruding structure 327 and be emitted to the outside of the electronic device 101. The configuration of the flash member 320 in FIGS. 12 to 15 may be entirely or partially the same as the configuration of the flash member 320 in FIG. 7.

[0097] According to various embodiments (e.g., FIGS. 12 and 14 ), the flash member 320 may include at least one groove structure 328 formed in the protruding structure 327. According to one embodiment, the groove structure 328 can increase the amount of air flowing into the microphone module (e.g., the microphone module 350 in FIG. 7 ). For example, the volume of the internal space (e.g., the internal space 302 in FIG. 7 ) between the back plate (e.g., the back plate 310 in FIG. 7 ) and the flash member 320 is increased by the groove structure 328, thereby increasing the amount (volume and / or mass) of air transmitted to the second through-hole 326 via the internal space 302. According to one embodiment, the groove structure 328 can guide air outside the electronic device 101 to the second through-hole 326. For example, the groove structure 328 can be disposed on the protruding structure 327 facing the second through-hole 326.

[0098] According to various embodiments (e.g., FIGS. 13 and 15 ), the flash member 320 may include at least one protruding structure 329 formed on the protruding structure 327. According to one embodiment, the protruding structure 329 may protrude toward a portion (e.g., the seventh surface 310c in FIG. 7 ) of the rear plate (e.g., the rear plate 310 in FIG. 7 ). According to one embodiment, the protruding structure 329 may increase the amount of air flowing into the microphone module 350. For example, a portion of the protruding structure 327 where the protruding structure 329 is not formed may be interpreted as a groove structure 328. According to one embodiment, the protruding structure 329 may guide the connection or coupling between the flash member 320 and the rear plate 310. For example, the rear plate (e.g., the rear plate 310 in FIG. 7 ) may include a groove (not shown) corresponding to the protruding structure 329, and the protruding structure 329 may be inserted into the groove. According to one embodiment, the flash member 320 may not include the groove structure 328 and / or the protruding structure 329.

[0099] According to various embodiments of the present disclosure, an electronic device (e.g., electronic device 101 of FIG. 2) includes a back plate (e.g., back plate 310 of FIG. 5a) including a first through-hole (e.g., first through-hole 312 of FIG. 5a), a flash lens (e.g., flash lens 322 of FIG. 11a), and a support structure (e.g., support structure 324 of FIG. 11a) that houses the flash lens and includes a second through-hole (e.g., second through-hole 326 of FIG. 7) facing the back plate, at least a portion of which is The device may include a flash member (e.g., flash member 320 in FIG. 7) disposed within the first through-hole, a support member (e.g., first support member 230 in FIG. 4 or support member 330 in FIG. 6) that supports the flash member and includes a third through-hole (e.g., third through-hole 332 in FIG. 7) facing at least a portion of the second through-hole, and a microphone module (e.g., microphone module 350 in FIG. 7) located below the support member and covering the second through-hole and the third through-hole.

[0100] According to various embodiments, the back plate includes a first surface (e.g., first surface 310a in FIG. 7 ) exposed to the outside of the electronic device and a second surface (e.g., second surface 310b in FIG. 7 ) opposite the first surface, the support structure of the flash member includes a third surface (e.g., third surface 320a in FIG. 7 ) facing the second surface and a fourth surface (e.g., fourth surface 320b in FIG. 7 ) opposite the third surface, and the second through-hole can penetrate at least a portion between the third surface and the fourth surface.

[0101] According to various embodiments, the microphone module can be configured to capture sound from outside the electronic device at least partially through an internal space (e.g., internal space 302 in FIG. 7 ) disposed between the second and third surfaces and through a second through-hole.

[0102] According to various embodiments, the electronic device may further include a printed circuit board (e.g., printed circuit board 340 in FIG. 7) housing at least one electronic component and disposed below the support member.

[0103] According to various embodiments, the printed circuit board includes a fifth surface (e.g., fifth surface 340a in FIG. 7) facing the support member, a sixth surface (e.g., sixth surface 340b in FIG. 7) opposite the fifth surface, and a fourth through-hole (e.g., fourth through-hole 342 in FIG. 7) penetrating between the fifth and sixth surfaces and facing the third through-hole, and the microphone module may cover the fourth through-hole and be positioned on the sixth surface.

[0104] According to various embodiments, the electronic device may further include a second seal member (e.g., second seal member 364 in FIG. 7) disposed between the support member and the printed circuit board.

[0105] According to various embodiments, the electronic device may further include a flexible printed circuit board (e.g., flexible printed circuit board 370 in FIG. 9 ) coupled to the support member and including a fifth through-hole (e.g., fifth through-hole 372 in FIG. 9 ) facing the third through-hole, and the microphone module may cover the fifth through-hole and be positioned below the flexible printed circuit board.

[0106] According to various embodiments, the back plate can include a seventh surface (e.g., seventh surface 310c in FIG. 7) that surrounds at least a portion of the flush member, and the flush member can include a protruding structure (e.g., protruding structure 327 in FIG. 7) that extends from the support structure and faces the seventh surface.

[0107] According to various embodiments, the flash member may include at least one of at least one groove structure formed in the protruding structure (e.g., groove structure 328 in FIG. 12 ) or at least one protruding structure protruding from the protruding structure toward the seventh surface (e.g., protruding structure 329 in FIG. 13 ).

[0108] According to various embodiments, the electronic device may further include at least one fastening structure (eg, fastening structure 304 in FIG. 8) for connecting the support member and the printed circuit board.

[0109] According to various embodiments, the electronic device may further include a first waterproof member (e.g., first waterproof member 361 in FIG. 7) disposed below the flash member and covering the second through-hole.

[0110] According to various embodiments, the second through-hole includes a first portion (e.g., first portion 326-1 in FIG. 7) extending from the interior space (e.g., interior space 302 in FIG. 7) and a second portion (e.g., second portion 326-2 in FIG. 7) extending from the first portion and having a first waterproofing member attached thereto, the second portion having a cross-sectional area greater than the cross-sectional area of ​​the first portion. According to various embodiments, the electronic device may further include a second waterproofing member (e.g., second waterproofing member 362 in FIG. 7) disposed between the flash member and the back plate.

[0111] According to various embodiments, the electronic device can further include a first seal member (eg, first seal member 363 of FIG. 7) disposed between the flash member and the support member.

[0112] According to various embodiments, the back plate may include at least one camera hole (e.g., camera hole 314 in FIG. 5a) spaced apart from the first through-hole, and the electronic device may further include a camera module (e.g., camera module 180 in FIG. 1) at least a portion of which is visually exposed to the outside of the electronic device through the at least one camera hole.

[0113] According to various embodiments of the present disclosure, an electronic device (e.g., electronic device 101 of FIG. 2) includes a back plate (e.g., back plate 310 of FIG. 5a) including a first through-hole (e.g., first through-hole 312 of FIG. 5a), Back Platethe support structure (e.g., support structure 324 in FIG. 7 ) including a second through-hole (e.g., second through-hole 326 in FIG. 7 ) facing the first through-hole; a flush member (e.g., flush member 320 in FIG. 7 ) extending from the support structure and including a protruding structure (protruding structure 327 in FIG. 7 ) at least a portion of which is located within the first through-hole; a support member (e.g., support member 330 in FIG. 7 ) supporting the flush member and including a third through-hole (e.g., third through-hole 332 in FIG. 7 ) facing at least a portion of the second through-hole; a printed circuit board (e.g., printed circuit board 340 in FIG. 7 ) coupled to the support member and including a fourth through-hole (e.g., fourth through-hole 342 in FIG. 7 ) facing the third through-hole; and a microphone module (e.g., microphone module 350 in FIG. 7 ) disposed on the printed circuit board and covering the second, third, and fourth through-holes.

[0114] According to various embodiments, the back plate includes a first surface (e.g., first surface 310a in FIG. 7 ) exposed to the outside of the electronic device and a second surface (e.g., second surface 310b in FIG. 7 ) opposite the first surface, the support structure of the flash member includes a third surface (e.g., third surface 320a in FIG. 7 ) facing the second surface and a fourth surface (e.g., fourth surface 320b in FIG. 7 ) opposite the third surface, and the second through-hole can penetrate at least a portion between the third surface and the fourth surface.

[0115] According to various embodiments, the microphone module can be configured to capture sound outside the electronic device at least in part through an internal space (e.g., internal space 302 in FIG. 7 ) disposed between the second and third surfaces, the second through-hole, the third through-hole, and the fourth through-hole.

[0116] According to various embodiments, the electronic device may further include a second seal member (e.g., second seal member 364 in FIG. 7) disposed between the support member and the printed circuit board.

[0117] According to various embodiments, the back plate may include a seventh surface (e.g., seventh surface 310c in FIG. 7) surrounding at least a portion of the protruding structure, and the flash member may include at least one of at least one groove structure (e.g., groove structure 328 in FIG. 12) formed in the protruding structure or at least one protrusion structure (e.g., protrusion structure 329 in FIG. 13) protruding from the protruding structure toward the seventh surface.

[0118] The electronic device including the microphone module of the present disclosure described above is not limited to the above-described embodiments and drawings, and it will be apparent to those skilled in the art to which the present invention pertains that various substitutions, modifications and alterations are possible within the technical scope of the present disclosure. [Explanation of symbols]

[0119] 100 Network Environment 101, 102, 104 Electronic equipment 108 servers 120 processors 121 Main Processor 123 Auxiliary Processor 130 memory 132 Volatile Memory 134 Non-volatile memory 140 Programs 142 Operating Systems 144 Middleware 146 Applications 150 Input Module 155 Acoustic Output Module 160 Display Module 170 Audio Module 176 Sensor Module 177 Interface 178 connection terminal 179 Tactile Module 180 camera module 188 Power Management Module 189 Battery 190 Communication Module 192 Wireless Communication Module 194 Wired Communication Module 196 Subscriber Identity Module 197 Antenna Module 198 First Network 199 Second Network 202 Front Plate 203 Audio Module 204 Flash 205 Front Camera Module 206 Rear Camera Module 207 External speaker hole 208 First connector hole 209 Second connector hole 210 Housing 210A front 210B Back 210C side 211 Back Plate 214 Speaker Hall 217 Key input device 218 Side bezel structure 220 Display 230 first support member 240 second support member 250 printed circuit boards 301 Display 302 Interior Space 303 Electronic Components 304 Fastening structure 305 Speaker Module 310 Back Plate 310a 1st page 310b 2nd side 310c page 7 312 First through hole 314 Camera Hole 320 Flash components 320a 3rd side 320b 4th page 321 First Area 322 Flash Lens 323 Second Area 324 Support structure 325 The Third Realm 326 Second Through Hole 327 Protruding structure 328 groove structure 329 Protrusion structure 330 Support member 330a Page 8 330b Page 9 330c page 10 332 Third Through Hole 340 Printed Circuit Board 340a 5th page 340b Page 6 342 Fourth Through-hole 350 Microphone Module 361 First waterproofing member 362 Second waterproofing material 363 First sealing member 364 Second sealing member 370 Flexible Printed Circuit Board 372 5th Through-hole 374 Second sealing member 376 Connector Structure

Claims

1. In an electronic device, a back plate including a first surface exposed to an exterior of the electronic device, a second surface opposite the first surface, and a first through hole; a flash member disposed at least partially within the first through-hole, the flash member comprising: flash lens; and a support structure that houses the flash lens, includes a second through-hole facing the second surface, and is spaced apart from the second surface; a flash member including: a support member supporting the flash member and including a third through-hole facing at least a portion of the second through-hole; and A microphone module disposed under the support member Including, An electronic device, wherein the microphone module is configured to acquire sound outside the electronic device through the first through hole, an internal space arranged between the second surface and the support structure, the second through hole, and the third through hole.

2. An electronic device as described in claim 1, wherein the support structure of the flash member includes a third surface facing the second surface and a fourth surface opposite the third surface, and the second through hole penetrates at least a portion of the flash member between the third surface and the fourth surface.

3. The electronic device of claim 1 further comprising a printed circuit board housing at least one electronic component and disposed below the support member.

4. the printed circuit board includes a fifth surface facing the support member, a sixth surface opposite the fifth surface, and a fourth through-hole penetrating between the fifth surface and the sixth surface and facing the third through-hole; The electronic device according to claim 3 , wherein the microphone module covers the fourth through-hole and is disposed on the sixth surface.

5. The electronic device of claim 4 , further comprising a second seal member disposed between the support member and the printed circuit board.

6. a flexible printed circuit board connected to the support member and including a fifth through hole facing the third through hole; The electronic device according to claim 3 , wherein the microphone module covers the fifth through-hole and is disposed below the flexible printed circuit board.

7. The electronic device of claim 3 , further comprising at least one fastening structure for connecting the support member and the printed circuit board.

8. the back plate includes a seventh surface that surrounds at least a portion of the flash member; The electronic device of claim 1 , wherein the flush member includes a protruding structure extending from the support structure and facing the seventh surface.

9. The electronic device of claim 8 , wherein the flash member includes at least one of at least one groove structure formed in the protruding structure or at least one protrusion structure protruding from the protruding structure toward the seventh surface.

10. The electronic device according to claim 2 , further comprising a first waterproofing member disposed below the flash member and covering the second through-hole.

11. the second through-hole includes a first portion extending from an internal space between the second surface and the third surface, and a second portion extending from the first portion and having the first waterproofing member attached thereto; The electronic device of claim 10 , wherein the second portion has a cross-sectional area greater than the cross-sectional area of ​​the first portion.

12. The electronic device of claim 1 , further comprising a second waterproofing member disposed between the flashing member and the back plate.

13. The electronic device of claim 1 , further comprising a first seal member disposed between the flash member and the support member.

14. the rear plate includes at least one camera hole spaced apart from the first through-hole; The electronic device of claim 1 , further comprising a camera module, at least a portion of which is visually exposed to an exterior of the electronic device through the at least one camera hole.

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