Expanding device, semiconductor chip manufacturing method, and semiconductor chip

Abstract

This expansion device 2 comprises: a clamping unit 214; an expansion ring 281; and an imaging unit 215 that captures images of the expanded state of a wafer W1 by the expansion ring 281 at multiple timings between a sheet member W2 expansion start St and expansion end Ed.

Description

[Technical Field]

[0001] The present invention relates to an expanding apparatus, a semiconductor chip manufacturing method, and a semiconductor chip, and more particularly to an expanding apparatus equipped with an expanding ring that divides a wafer into a plurality of semiconductor chips, a semiconductor chip manufacturing method, and a semiconductor chip. [Background technology]

[0002] BACKGROUND ART Expanding devices that include an expanding ring for dividing a wafer into a plurality of semiconductor chips have been known in the past. Such an expanding device is disclosed, for example, in Japanese Patent Application Laid-Open No. 2011-211053.

[0003] The above-mentioned Japanese Patent Application Laid-Open Publication No. 2011-211053 discloses an expanding device having a cylindrical portion that divides a wafer into multiple chips. This expanding device includes a support portion (clamp portion), the cylindrical portion, and an imaging portion. The support portion is configured to support (hold) a processing object having a wafer bonded to an adhesive sheet. The cylindrical portion is configured to expand the adhesive sheet supported by the support portion to divide the wafer into multiple chips. The imaging portion is configured to measure the spacing between the multiple chips after dividing the wafer into multiple chips. This allows the expanding device to detect areas where the spacing between the multiple chips has not increased (undivided areas). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-211053 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the expanding device of JP 2011-211053 A measures the spacing between the chips after dividing the wafer into chips, so it cannot detect whether the divided chips were divided near the end of the expansion process when the adhesive sheet of the processing object is being expanded. If the divided chips are divided near the end of the adhesive sheet expansion, it is highly likely that the wafer will not be divided into chips during the next or subsequent expansion of the adhesive sheet due to a slight change, such as a slightly softer adhesive sheet or a slightly smaller modified layer on the wafer. In such cases, the imaging unit of the expanding device of JP 2011-211053 A measures the spacing between the chips after dividing the wafer into chips, so it is unable to detect events that are highly likely to prevent the wafer from being divided into chips. For this reason, the expanding device of the above-mentioned Patent Publication No. 2011-211053 is unable to acquire events that would predictably prevent the wafer from being divided into multiple chips, which poses the problem that it is difficult to prevent the wafer from being divided into multiple chips in advance.

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide an expanding device, a semiconductor chip manufacturing method, and a semiconductor chip that can prevent a wafer from being divided into multiple semiconductor chips. [Means for solving the problem]

[0007] An expanding device according to a first aspect of the present invention includes a clamping unit that grips a wafer ring structure including a stretchable sheet member to which a wafer is attached, the wafer being divided along division lines to form a plurality of semiconductor chips; an expanding ring that expands the sheet member while the clamping unit is holding the wafer ring structure, thereby dividing the wafer into a plurality of semiconductor chips spaced apart from one another; and an imaging unit that images the expanded state of the wafer by the expanding ring at a plurality of times from the start to the end of expansion of the sheet member. a control unit that performs control to detect that the semiconductor chip has been divided in the image taken just before the expansion is completed, based on the images taken by the imaging unit at a plurality of timings, or to detect that the wafer has not been divided from the outside to the inside of the wafer; Equipped with.

[0008] In the expanding device according to a first aspect of the present invention, as described above, an imaging unit is provided that captures images of the expanded state of the wafer by the expanding ring at multiple timings between the start and end of the sheet member expansion. This allows the expanded state (division state) of the wafer near the end of expansion to be acquired based on the image captured at the timing closest to the end of expansion among the multiple imaging timings by the imaging unit, thereby making it possible to detect whether the divided semiconductor chips were divided near the end of expansion. If the divided semiconductor chips are divided near the end of the sheet member expansion, it is highly likely that the wafer will not be able to be divided into multiple semiconductor chips during the next or subsequent expansion of the sheet member due to a slight change, such as the same sheet member being slightly softer or the modified layer of the wafer being slightly smaller. In contrast, the present invention acquires the expanded state (division state) of the wafer near the end of the sheet member expansion, thereby identifying events that are likely to prevent the wafer from being divided into multiple chips. As a result, it is possible to obtain events that predict that the wafer will not be divided into multiple semiconductor chips, and thus it is possible to prevent the wafer from being divided into multiple semiconductor chips. An expansion device according to a second aspect of the present invention comprises a clamping unit that holds a wafer ring structure including an elastic sheet member to which a wafer is attached that will be divided along dividing lines to form a plurality of semiconductor chips; an expanding ring that expands the sheet member while the clamping unit is holding the wafer ring structure, thereby dividing the wafer into a plurality of semiconductor chips that are spaced apart from each other; and an imaging unit that images the expanded state of the wafer by the expanding ring at multiple times from the start of expansion of the sheet member to the end of expansion, and further comprises an expansion maintaining member that maintains the expanded state of the sheet member near the wafer, and the imaging unit is attached to the expansion maintaining member. This eliminates the need to provide a dedicated mounting member for mounting the imaging unit to the expanding device, thereby preventing an increase in the number of parts of the expanding device and a complicated structure.

[0009] In the expanding device according to the first aspect, preferably, the imaging unit captures a video including a plurality of captured images taken at each of a plurality of consecutive timings of the expanded state of the wafer by the expanding ring from the start of expanding the sheet member to the end of expanding. With this configuration, by using the imaging unit to capture a video including a plurality of captured images, the expanded state of the wafer from the start of expanding the sheet member to the end of expanding can be reliably and completely captured, and the timing at which the plurality of semiconductor chips are separated can be accurately captured.

[0011] In the expanding device according to the second aspect Preferably, the expansion and retention member includes a cylindrical pressure ring portion arranged to surround the wafer and a lid portion arranged to cover the wafer, and the imaging unit is attached to the lid portion of the expansion and retention member. With this configuration, the lid portion is provided in a position covering the upper opening of the cylindrical pressure ring portion arranged to surround the wafer, so that the imaging unit can be positioned above the wafer. As a result, by imaging the wafer from above with the imaging unit, it is possible to easily image the multiple semiconductor chips that have been divided and spaced apart from each other.

[0012] In the expanding device in which the imaging unit is disposed in the lid, the imaging unit is preferably disposed in the center of the lid in the radial direction of the pressing ring. With this configuration, the entire wafer surrounded by the cylindrical pressing ring can be easily imaged from above by the imaging unit.

[0013] In the expanding device according to the second aspectPreferably, the expansion-retaining member further includes a member-moving mechanism for moving the expansion-retaining member in the vertical direction, and the imaging unit images the expanded state of the wafer by the expand ring with the expansion-retaining member lowered by the member-moving mechanism covering the wafer. With this configuration, the expanded state of the wafer can be imaged by the imaging unit at a closer position, thereby enabling the acquisition of an image that more clearly captures the division of the multiple semiconductor chips on the wafer.

[0014] In the expanding device having the expansion-maintaining member including the lid, preferably, the device further includes an ultraviolet ray irradiator disposed below the imaging unit and irradiating ultraviolet rays from below onto the sheet member in the expanded state, and the expansion-maintaining member covers the wafer from above with a cylindrical pressure ring and the lid so that ultraviolet rays irradiated onto the sheet member from the ultraviolet ray irradiator do not leak out of the expansion-maintaining member. With this configuration, the expansion-maintaining member can be used not only as an attachment member for the imaging unit but also as a cover for blocking ultraviolet rays, thereby reducing the number of parts and the complexity of the structure compared to when a separate cover for blocking ultraviolet rays is provided.

[0015] The expanding device according to the first aspect preferably further includes a notification unit that notifies a user of an abnormality in the expanded state of the wafer based on an image of the expanded state of the wafer captured by the imaging unit. This configuration makes it possible to make the user aware of the abnormality in the expanded state of the wafer, thereby urging the user to improve the abnormality in the expanded state of the wafer.

[0016] The expanding device according to the first aspect preferably further includes a clamp moving mechanism for moving the clamp unit in the vertical direction, and is configured to expand the sheet member by moving the clamp unit downward with the upper end of the expand ring positioned at a predetermined vertical height, and the imaging unit images the expanded state of the wafer with the expand ring positioned at the predetermined height. This configuration maintains the height position of the wafer at the predetermined height in the expanded state, so that the imaging unit can stay focused on the wafer when imaging the expanded state of the wafer. As a result, unclear portions can be prevented from occurring in the image of the expanded state of the wafer captured by the imaging unit.

[0017] The expanding device according to the first aspect preferably further includes a squeegee unit disposed below the imaging unit and configured to locally press the wafer from below after the sheet member is expanded by the expanding ring, the imaging unit capturing images before the squeegee unit locally presses the wafer after the sheet member is expanded by the expanding ring, and capturing images after the squeegee unit locally presses the wafer. With this configuration, the number of semiconductor chips divided by the pressure of the squeegee unit can be obtained from the images captured by the imaging unit before the squeegee unit locally presses the wafer and after the squeegee unit locally presses the wafer.

[0018] The first aspect of this invention 3The method for manufacturing a semiconductor chip according to this aspect includes the steps of: forming a modified layer in the wafer by irradiating a wafer having a plurality of semiconductor chips with laser light from a laser irradiation unit that irradiates the laser light onto the wafer; and dividing the wafer into a plurality of individual semiconductor chips by expanding the sheet member with an expand ring while the wafer ring structure is being held by a clamp unit that holds the wafer ring structure, the expand ring taking images of the expanded state of the wafer by the expand ring at multiple times from the start to the end of the expansion of the sheet member. a step of detecting that the semiconductor chip has been divided in the image taken just before the completion of the expanding process based on the images taken by the imaging unit at a plurality of timings, or detecting that the wafer has not been divided from the outside to the inside of the wafer; Equipped with.

[0019] The first aspect of this invention 3In the semiconductor chip manufacturing method according to the aspect described above, a step of capturing images of the expanded state of the wafer by the expanding ring at multiple timings between the start and end of the sheet member expansion is provided. This allows the expanded state (division state) of the wafer near the end of the expansion to be acquired based on the image captured at the timing closest to the end of the expansion among the multiple imaging timings by the imaging unit, thereby making it possible to detect whether the divided semiconductor chips were divided near the end of the expansion. Here, if the divided semiconductor chips are divided near the end of the sheet member expansion, it is highly likely that the wafer will not be divided into multiple semiconductor chips during the next or subsequent expansion of the sheet member due to a slight change, such as the same sheet member being slightly softer or the modified layer of the wafer being slightly smaller. In contrast, the present invention captures the expanded state (division state) of the wafer near the end of the sheet member expansion, thereby identifying events that are likely to prevent the wafer from being divided into multiple chips. As a result, it is possible to obtain events that predict that a wafer will not be divided into multiple semiconductor chips, thereby obtaining a method for manufacturing semiconductor chips that can prevent a wafer from being divided into multiple semiconductor chips in advance.

[0020] The first aspect of this invention 4 The semiconductor chip according to this aspect includes a clamping unit that grips a wafer ring structure including a stretchable sheet member to which a wafer is attached, the wafer being divided along division lines to form a plurality of semiconductor chips; an expanding ring that expands the sheet member while the clamping unit is holding the wafer ring structure, thereby dividing the wafer into a plurality of semiconductor chips spaced apart from one another; and an imaging unit that images the expanded state of the wafer by the expanding ring at a plurality of times from the start to the end of the expansion of the sheet member. a control unit that performs control to detect that the semiconductor chip has been divided in the image taken just before the expansion is completed, based on the images taken by the imaging unit at a plurality of timings, or to detect that the wafer has not been divided from the outside to the inside of the wafer; The product is manufactured by an expanding device comprising:

[0021] The first aspect of this invention 4 The semiconductor chip according to the aspect is manufactured by an expanding device including an imaging unit that captures images of the expanded state of the wafer by the expanding ring at multiple timings from the start of the expansion of the sheet member to the end of the expansion. This allows the expanded state (division state) of the wafer near the end of the expansion to be acquired based on the image captured at the timing close to the end of the expansion among the multiple imaging timings by the imaging unit, thereby making it possible to detect whether the divided semiconductor chips were divided near the end of the expansion. Here, if the divided semiconductor chips are divided near the end of the expansion of the sheet member, it is highly likely that the wafer will not be able to be divided into multiple semiconductor chips during the next or subsequent expansion of the sheet member due to a slight change, such as the same sheet member being slightly softer or the modified layer of the wafer being slightly smaller. In contrast, the present invention captures the expanded state (division state) of the wafer near the end of the expansion of the sheet member, thereby identifying events that are highly likely to prevent the wafer from being divided into multiple chips. As a result, it is possible to obtain events that predict that a wafer will not be divided into multiple semiconductor chips, and thus it is possible to obtain a semiconductor chip that can be used to obtain a semiconductor chip manufacturing method that can prevent a wafer from being divided into multiple semiconductor chips. [Effects of the Invention]

[0022] According to the present invention, it is possible to prevent the wafer from being divided into a plurality of chips as described above. [Brief explanation of the drawings]

[0023] [Figure 1] 1 is a plan view showing a semiconductor wafer processing device provided with a dicing device and an expanding device according to a first embodiment. [Figure 2] 1 is a plan view showing a wafer ring structure processed in the semiconductor wafer processing apparatus according to the first embodiment. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. [Figure 4] FIG. 2 is a plan view of a dicing device disposed adjacent to the expanding device according to the first embodiment. [Figure 5] 10 is a side view of the dicing device arranged adjacent to the expanding device according to the first embodiment, as viewed from the Y2 direction side. FIG. [Figure 6] FIG. 1 is a plan view of an expanding device according to a first embodiment. [Figure 7] FIG. 2 is a side view of the expanding device according to the first embodiment as viewed from the Y2 direction side. [Figure 8] FIG. 2 is a side view of the expanding device according to the first embodiment as viewed from the X1 direction side. [Figure 9] 1 is a block diagram showing a control configuration of a semiconductor wafer processing apparatus according to a first embodiment. [Figure 10] 4 is a flowchart of the first half of a semiconductor chip manufacturing process by the semiconductor wafer processing apparatus according to the first embodiment. [Figure 11] 10 is a flowchart of the second half of the semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the first embodiment. [Figure 12] FIG. 2 is a side view showing a state in which a clamp unit is placed at a raised position in the expanding device according to the first embodiment. [Figure 13] FIG. 2 is a side view showing a state in which a clamping section is placed in a lowered position in the expanding device according to the first embodiment. [Figure 14] FIG. 2 is a side view showing a state in which an ultraviolet irradiating unit irradiates ultraviolet rays in the expanding device according to the first embodiment. [Figure 15] 4 is a timing chart showing the descent of a clamp unit from a raised position to a lowered position and the timing of imaging by an imaging unit in the expanding device according to the first embodiment. [Figure 16] FIG. 2 is a side view showing a state before a moving image is captured by an imaging section in the expanding device according to the first embodiment. [Figure 17] FIG. 2 is a schematic diagram showing the state of a wafer before video imaging in the expanding device according to the first embodiment. [Figure 18] 10 is a side view showing an example of a state of the first half of a moving image capturing period by an image capturing section in the expanding device according to the first embodiment. FIG. [Figure 19] 4 is a schematic diagram showing an example of an image captured by an imaging section in the first half of a moving image capturing period in the expanding device according to the first embodiment. FIG. [Figure 20] 10 is a side view showing an example of a state in the latter half of a moving image capturing period by an imaging section in the expanding device according to the first embodiment. FIG. [Figure 21] 4 is a schematic diagram showing an example of an image captured by an imaging section in the latter half of a moving image capturing period in the expanding device according to the first embodiment. FIG. [Figure 22] 10 is a side view showing an example of a state immediately before the end of a moving image capturing period by an image capturing section in the expanding device according to the first embodiment. FIG. [Figure 23] 4 is a schematic diagram showing an example of an image captured by an imaging section just before the end of a moving image capturing period in the expanding device according to the first embodiment. FIG. [Figure 24] FIG. 4 is a side view showing an example of a state after a moving image is captured by an imaging section in the expanding device according to the first embodiment. [Figure 25] 4 is a schematic diagram showing an example of a still image captured after a moving image is captured by an imaging section in the expanding device according to the first embodiment. FIG. [Figure 26] FIG. 2 is a plan view showing a notification unit in the expanding device according to the first embodiment. [Figure 27] 4 is a schematic diagram showing a state in which a tensile force is applied to a wafer in the expanding apparatus according to the first embodiment. FIG. [Figure 28] 4A and 4B are schematic diagrams for explaining that semiconductor chips are separated from the outer portion of a wafer in the expanding apparatus according to the first embodiment. [Figure 29] 4 is a schematic diagram showing an example of a state in which a semiconductor chip is detected by a dicing control calculation unit in the expanding device according to the first embodiment. FIG. [Figure 30] 4 is a timing chart showing timings of imaging by an imaging unit in the expanding device according to the first embodiment. [Figure 31] 4 is a schematic diagram showing an example in which semiconductor chips are separated from an inner portion of a wafer in the expanding apparatus according to the first embodiment. FIG. [Figure 32] 10 is a schematic diagram showing an example of a state in which a semiconductor chip is detected in a still image after dicing is completed by a dicing control calculation unit in the expanding device according to the first embodiment. FIG. [Figure 33] 4 is a flowchart of a wafer imaging process of the semiconductor wafer processing apparatus according to the first embodiment. [Figure 34] FIG. 10 is a plan view showing a semiconductor wafer processing apparatus provided with a dicing apparatus and an expanding apparatus according to a second embodiment. [Figure 35] 10 is a side view of a semiconductor wafer processing apparatus provided with a dicing apparatus and an expanding apparatus according to a second embodiment, as viewed from the Y2 direction. FIG. [Figure 36] 10 is a side view of a semiconductor wafer processing apparatus provided with a dicing apparatus and an expanding apparatus according to a second embodiment, as viewed from the X1 direction. FIG. [Figure 37] FIG. 10 is a block diagram showing a control configuration of a semiconductor wafer processing apparatus according to a second embodiment. [Figure 38] 10 is a flowchart of the first half of a semiconductor chip manufacturing process by the semiconductor wafer processing apparatus according to the second embodiment. [Figure 39] 10 is a flowchart of the second half of the semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the second embodiment. [Figure 40] FIG. 11 is a partial cross-sectional view showing an imaging unit and a nitrogen supply unit in an expansion-maintaining member of an expanding device according to a third embodiment. [Figure 41]FIG. 10 is a plan view showing a state in which a third mounting member of the nitrogen supply unit of the expanding device according to the third embodiment has been removed. [Figure 42] FIG. 10 is a plan view showing a third mounting member of the nitrogen supply unit of the expanding device according to the third embodiment. [Figure 43] FIG. 10 is a schematic diagram showing an image captured by an imaging unit before pressing by a squeegee unit in an expanding device according to a modified example of the first to third embodiments. [Figure 44] FIG. 10 is a schematic diagram showing an image captured by the imaging unit after pressing by the squeegee unit in the expanding device according to the modified examples of the first to third embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0024] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0025] [First embodiment] The configuration of a semiconductor wafer processing apparatus 100 according to a first embodiment of the present invention will be described with reference to FIGS.

[0026] (Semiconductor wafer processing equipment) 1, the semiconductor wafer processing apparatus 100 is an apparatus for processing a wafer W1 provided in a wafer ring structure W. The semiconductor wafer processing apparatus 100 is configured to form a modified layer on the wafer W1 and to divide the wafer W1 along the modified layer to form a plurality of semiconductor chips Ch (see FIG. 8).

[0027] 2 and 3, the wafer ring structure W will be described. The wafer ring structure W includes a wafer W1, a sheet member W2, and a ring-shaped member W3.

[0028] The wafer W1 is a thin, circular plate made of crystals of a semiconductor material that is used to make semiconductor integrated circuits. A modified layer is formed inside the wafer W1 along the dividing line by processing the wafer in the semiconductor wafer processing apparatus 100. That is, the wafer W1 is processed so that it can be divided along the dividing line. The sheet member W2 is a stretchable adhesive tape. An adhesive layer is provided on the upper surface W21 of the sheet member W2. The wafer W1 is attached to the adhesive layer of the sheet member W2. The ring-shaped member W3 is a metal frame that is ring-shaped in a plan view. The ring-shaped member W3 is attached to the adhesive layer of the sheet member W2 while surrounding the wafer W1.

[0029] The semiconductor wafer processing apparatus 100 is equipped with a dicing apparatus 1 and an expanding apparatus 2. Hereinafter, the vertical direction is referred to as the Z direction, the upward direction as the Z1 direction, and the downward direction as the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing apparatus 1 and the expanding apparatus 2 are aligned is referred to as the X direction, the X direction toward the expanding apparatus 2 in the X direction is referred to as the X1 direction, and the X direction toward the dicing apparatus 1 in the X direction is referred to as the X2 direction. The horizontal direction perpendicular to the X direction is referred to as the Y direction, one side of the Y direction is referred to as the Y1 direction, and the other side of the Y direction is referred to as the Y2 direction.

[0030] (dicing equipment) As shown in Figures 1, 4, and 5, the dicing device 1 is configured to form a modified layer by irradiating a laser having a wavelength that is transparent to the wafer W1 along the parting lines (streets). The modified layer refers to cracks and voids formed inside the wafer W1 by the laser. The method of forming a modified layer on the wafer W1 in this way is called dicing.

[0031] Specifically, the dicing device 1 includes a base 11, a chuck table unit 12, a laser unit 13, and an imaging unit .

[0032] The base 11 is a base on which the chuck table 12 is placed. The base 11 has a rectangular shape in a plan view.

[0033] <Chuck table section> The chuck table 12 includes a suction unit 12a, a clamp unit 12b, a rotation mechanism 12c, and a table movement mechanism 12d. The suction unit 12a is configured to suction the wafer ring structure W onto its upper surface on the Z1 side. The suction unit 12a is a table provided with suction holes and suction lines for suctioning the lower surface of the ring-shaped member W3 of the wafer ring structure W on the Z2 side. The suction unit 12a is supported by the table movement mechanism 12d via the rotation mechanism 12c. The clamp unit 12b is provided at the upper end of the suction unit 12a. The clamp unit 12b is configured to hold the wafer ring structure W held by the suction unit 12a. The clamp unit 12b holds the ring-shaped member W3 of the wafer ring structure W held by the suction unit 12a from the Z1 side. In this manner, the wafer ring structure W is gripped by the suction unit 12a and the clamp unit 12b.

[0034] The rotation mechanism 12c is configured to rotate the suction unit 12a in the circumferential direction around a rotation center axis C extending parallel to the Z direction. The rotation mechanism 12c is attached to the upper end of the table movement mechanism 12d. The table movement mechanism 12d is configured to move the wafer ring structure W in the X direction and the Y direction. The table movement mechanism 12d has an X-direction movement mechanism 121 and a Y-direction movement mechanism 122. The X-direction movement mechanism 121 is configured to move the rotation mechanism 12c in the X1 direction or the X2 direction. The X-direction movement mechanism 121 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Y-direction movement mechanism 122 is configured to move the rotation mechanism 12c in the Y1 direction or the Y2 direction. The Y-direction movement mechanism 122 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0035] <Laser section> The laser unit 13 is configured to irradiate a wafer W1 of the wafer ring structure W held by the chuck table 12 with laser light. The laser unit 13 is disposed on the Z1 side of the chuck table 12. The laser unit 13 includes a laser irradiation unit 13a, a mounting member 13b, and a Z-direction movement mechanism 13c. The laser irradiation unit 13a is configured to irradiate a pulsed laser light. The mounting member 13b is a frame to which the laser unit 13 and the imaging unit 14 are attached. The Z-direction movement mechanism 13c is configured to move the laser unit 13 in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 13c includes, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. Note that the laser irradiation unit 13a may be a laser irradiation unit that oscillates a continuous-wave laser light as the laser light, other than a pulsed laser light, as long as it can form a modified layer through multiphoton absorption.

[0036] <Imaging unit> The imaging unit 14 is configured to capture an image of the wafer W1 of the wafer ring structure W held by the chuck table 12. The imaging unit 14 is disposed on the Z1 direction side of the chuck table 12. The imaging unit 14 has a high-resolution camera 14a, a wide-angle camera 14b, a Z-direction movement mechanism 14c, and a Z-direction movement mechanism 14d.

[0037] The high-resolution camera 14a and the wide-angle camera 14b are near-infrared imaging cameras. The high-resolution camera 14a has a narrower viewing angle than the wide-angle camera 14b. The high-resolution camera 14a has higher resolution than the wide-angle camera 14b. The wide-angle camera 14b has a wider viewing angle than the high-resolution camera 14a. The wide-angle camera 14b has lower resolution than the high-resolution camera 14a. The high-resolution camera 14a is arranged on the X1 direction side of the laser irradiation unit 13a. The wide-angle camera 14b is arranged on the X2 direction side of the laser irradiation unit 13a. In this way, the high-resolution camera 14a, the laser irradiation unit 13a, and the wide-angle camera 14b are arranged adjacent to each other in this order from the X1 direction side to the X2 direction side.

[0038] The Z-direction movement mechanism 14c is configured to move the high-resolution camera 14a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 14c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 14d is configured to move the wide-angle camera 14b in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 14d has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0039] (Expanding device) As shown in FIGS. 1, 6, and 7, the expanding device 2 is configured to divide the wafer W1 to form a plurality of semiconductor chips Ch (see FIG. 8). The expanding device 2 is also configured to form sufficient gaps between the plurality of semiconductor chips Ch. Here, a modified layer is formed on the wafer W1 by irradiating the wafer W1 with a laser having a wavelength that is transparent to the wafer W1 along the dividing lines (streets) in the dicing device 1. In the expanding device 2, the wafer W1 is divided along the modified layer that was previously formed in the dicing device 1, thereby forming a plurality of semiconductor chips Ch.

[0040] Therefore, in the expanding device 2, the wafer W1 is divided along the modified layer by expanding the sheet member W2. In addition, in the expanding device 2, the sheet member W2 is expanded, and thus the gaps between the plurality of semiconductor chips Ch formed by division are widened.

[0041] The expansion device 2 includes a base 201, a cassette section 202, a lift-up hand section 203, a suction hand section 204, a base 205, a cold air supply section 206, a cooling unit 207, an expansion section 208, a base 209, an expansion maintenance member 210, a heat shrink section 211, an ultraviolet irradiation section 212, a squeegee section 213, and a clamp section 214.

[0042] <base> The base 201 is a base on which the cassette unit 202 and the lift-up hand unit 203 are installed. The base 201 has a rectangular shape in a plan view.

[0043] <Cassette section> The cassette unit 202 is configured to be able to accommodate a plurality of wafer ring structures W. The cassette unit 202 includes a wafer cassette 202a, a Z-direction moving mechanism 202b, and a pair of mounting units 202c.

[0044] A plurality of (three) wafer cassettes 202a are arranged in the Z direction. Each wafer cassette 202a has a storage space capable of storing a plurality of (five) wafer ring structures W. The wafer ring structures W are manually supplied and placed in the wafer cassette 202a. The wafer cassette 202a may store one to four wafer ring structures W, or may store six or more wafer ring structures W. One, two, or four or more wafer cassettes 202a may be arranged in the Z direction.

[0045] The Z-direction movement mechanism 202b is configured to move the wafer cassette 202a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 202b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 202b also has a mounting table 202d that supports the wafer cassette 202a from below. Multiple mounting tables 202d (three in total) are arranged to match the positions of the multiple wafer cassettes 202a.

[0046] A plurality (five) of pairs of mounting portions 202c are arranged inside the wafer cassette 202a. The ring-shaped member W3 of the wafer ring structure W is placed on the pair of mounting portions 202c from the Z1 direction side. One of the pair of mounting portions 202c protrudes in the X2 direction from the inner surface of the wafer cassette 202a on the X1 direction side. The other of the pair of mounting portions 202c protrudes in the X1 direction from the inner surface of the wafer cassette 202a on the X2 direction side.

[0047] <Lift-up hand part> The lift-up hand section 203 is configured to be able to take out the wafer ring structure W from the cassette section 202. The lift-up hand section 203 is also configured to be able to store the wafer ring structure W in the cassette section 202.

[0048] Specifically, the lift-up hand unit 203 includes a Y-direction movement mechanism 203a and a lift-up hand 203b. The Y-direction movement mechanism 203a has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The lift-up hand 203b is configured to support the ring-shaped member W3 of the wafer ring structure W from the Z2 direction side.

[0049] <Suction hand section> The suction hand portion 204 is configured to suck the ring-shaped member W3 of the wafer ring structure W from the Z1 direction side.

[0050] Specifically, the suction hand unit 204 includes an X-direction movement mechanism 204a, a Z-direction movement mechanism 204b, and a suction hand 204c. The X-direction movement mechanism 204a is configured to move the suction hand 204c in the X direction. The Z-direction movement mechanism 204b is configured to move the suction hand 204c in the Z direction. The X-direction movement mechanism 204a and the Z-direction movement mechanism 204b each have a drive unit including, for example, a linear conveyor module or a ball screw and a motor with an encoder. The suction hand 204c is configured to suck and support the ring-shaped member W3 of the wafer ring structure W from the Z1 direction. Here, the suction hand 204c generates negative pressure to support the ring-shaped member W3 of the wafer ring structure W.

[0051] <base> 7 and 8, the base 205 is a base on which the expanding section 208, the cooling unit 207, the ultraviolet irradiation section 212, and the squeegee section 213 are mounted. The base 205 has a rectangular shape in a plan view. In FIG. 8, the clamp section 214, which is positioned in the Z1 direction of the cooling unit 207, is indicated by a dotted line.

[0052] <Cold air supply section> The cool air supplying section 206 is configured to supply cool air to the sheet member W2 from the Z1 direction side when the expanding section 208 expands the sheet member W2.

[0053] Specifically, the cold air supply unit 206 has a supply unit main body 206a, a cold air supply port 206b, and a movement mechanism 206c. The cold air supply port 206b is configured to allow cold air supplied from the cold air supply device to flow out. The cold air supply port 206b is provided at the end of the supply unit main body 206a on the Z2 direction side. The cold air supply port 206b is located in the center of the end of the supply unit main body 206a on the Z2 direction side. The movement mechanism 206c has, for example, a linear conveyor module or a motor with a ball screw and an encoder.

[0054] The cold air supply device is a device for generating cold air. The cold air supply device supplies air cooled by, for example, a heat pump. Such a cold air supply device is installed on base 205. Cold air supply unit 206 and the cold air supply device are connected by a hose (not shown).

[0055] <Cooling unit> The cooling unit 207 is configured to cool the sheet member W2 from the Z2 direction side.

[0056] Specifically, the cooling unit 207 includes a cooling member 207a having a cooling body 271 and a Peltier element 272, and a Z-direction movement mechanism 207b. The cooling body 271 is made of a material with a large heat capacity and high thermal conductivity. The cooling body 271 is made of a metal such as aluminum. The Peltier element 272 is configured to cool the cooling body 271. Note that the cooling body 271 is not limited to aluminum, and may be made of another material with a large heat capacity and high thermal conductivity. The Z-direction movement mechanism 207b is a cylinder.

[0057] The cooling unit 207 is configured to be movable in the Z1 direction or the Z2 direction by a Z-direction movement mechanism 207b, which allows the cooling unit 207 to move to a position where it contacts the sheet member W2 and a position away from the sheet member W2.

[0058] <Expanding section> The expanding section 208 is configured to expand the sheet member W2 of the wafer ring structure W, thereby dividing the wafer W1 along the dividing lines.

[0059] Specifically, the expanding section 208 has an expanding ring 281. The expanding ring 281 is configured to support the sheet member W2 from the Z2 direction side, thereby expanding (expanding) the sheet member W2. The expanding ring 281 has a ring shape in a plan view. The structure of the expanding ring 281 will be described in detail later.

[0060] <base> The base 209 is a base material on which the cold air supply unit 206, the expansion and retention member 210 and the heat shrink unit 211 are mounted.

[0061] <Expansion maintenance member> As shown in FIGS. 7 and 8, the expansion maintaining member 210 is configured to press the sheet member W2 from the Z1 direction side so that the sheet member W2 near the wafer W1 does not shrink due to heating by the heating ring 211a.

[0062] Specifically, the expansion-retaining member 210 includes a pressure ring portion 210a, a lid portion 210b, and an intake portion 210c. The pressure ring portion 210a has a ring shape in a plan view. The lid portion 210b is attached to the pressure ring portion 210a so as to close the opening of the pressure ring portion 210a. The intake portion 210c is an intake ring having a ring shape in a plan view. Multiple intake ports are formed on the underside of the intake portion 210c on the Z2 direction side. The pressure ring portion 210a is configured to move in the Z direction by a Z-direction movement mechanism 210d. That is, the Z-direction movement mechanism 210d is configured to move the pressure ring portion 210a to a position where it presses the sheet member W2 and to a position away from the sheet member W2. The Z-direction movement mechanism 210d includes, for example, a linear conveyor module or a drive unit including a ball screw and a motor with an encoder. The Z-direction moving mechanism 210d is an example of the "member moving mechanism" in the claims. The structure of the expansion-retaining member 210 will be described in detail later.

[0063] <Heat shrink section> The heat shrink section 211 is configured to shrink the sheet member W2 expanded by the expanding section 208 by heating while maintaining the gaps between the plurality of semiconductor chips Ch.

[0064] The heat shrink unit 211 has a heating ring 211a and a Z-direction movement mechanism 211b. The heating ring 211a has a ring shape in a plan view. The heating ring 211a also has a sheathed heater that heats the sheet member W2. The Z-direction movement mechanism 211b is configured to move the heating ring 211a in the Z direction. The Z-direction movement mechanism 211b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0065] <Ultraviolet irradiation section> The ultraviolet irradiating unit 212 is configured to irradiate the sheet member W2 with ultraviolet rays Ut in order to reduce the adhesive strength of the adhesive layer of the sheet member W2. Specifically, the ultraviolet irradiating unit 212 has an ultraviolet illuminator. The ultraviolet irradiating unit 212 is disposed at the end of the squeegee unit 213 on the Z1 direction side of a pressing unit 213a (described later). The ultraviolet irradiating unit 212 is configured to irradiate the sheet member W2 with ultraviolet rays Ut while moving together with the squeegee unit 213.

[0066] <Squeegee Section> The squeegee unit 213 is configured to expand the sheet member W2 and then locally press the wafer W1 from the Z2 direction side to further divide the wafer W1 along the modified layer. Specifically, the squeegee unit 213 has a pressing unit 213a, a Z-direction moving mechanism 213b, an X-direction moving mechanism 213c, and a rotating mechanism 213d.

[0067] The pressing unit 213a is configured to press the wafer W1 from the Z2 direction side via the sheet member W2 and move using the rotation mechanism 213d and the X-direction movement mechanism 213c, thereby generating bending stress in the wafer W1 and dividing the wafer W1 along the modified layer. The pressing unit 213a presses the wafer W1 by contacting the wafer W1 via the sheet member W2 when raised to an elevated position on the Z1 direction side by the Z-direction movement mechanism 213b. The pressing unit 213a is lowered to a lower position on the Z2 direction side by the Z-direction movement mechanism 213b, thereby releasing the pressing unit 213a from contact with the wafer W1 and no longer pressing the wafer W1. The pressing unit 213a is a squeegee.

[0068] The pressing unit 213a is attached to the Z1-direction end of the Z-direction movement mechanism 213b. The Z-direction movement mechanism 213b is configured to move the pressing unit 213a linearly in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 213b is, for example, a cylinder. The Z-direction movement mechanism 213b is attached to the Z1-direction end of the X-direction movement mechanism 213c.

[0069] The X-direction movement mechanism 213c is attached to the end of the rotation mechanism 213d on the Z1 direction side. The X-direction movement mechanism 213c is configured to move the pressing unit 213a linearly in one direction. The X-direction movement mechanism 213c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0070] In the squeegee unit 213, the pressing unit 213a is raised to a raised position by the Z-direction movement mechanism 213b. In the squeegee unit 213, the pressing unit 213a locally presses the wafer W1 from the Z2 direction side via the sheet member W2, while the X-direction movement mechanism 213c moves the pressing unit 213a in the Y direction, thereby dividing the wafer W1. In the squeegee unit 213, the Z-direction movement mechanism 213b lowers the pressing unit 213a to a lowered position. In the squeegee unit 213, after the movement of the pressing unit 213a in the Y direction has finished, the rotation mechanism 213d rotates the pressing unit 213a by 90 degrees.

[0071] In the squeegee unit 213, the pressing unit 213a is raised to an elevated position by the Z-direction movement mechanism 213b. In the squeegee unit 213, after the pressing unit 213a rotates 90 degrees, the pressing unit 213a locally presses the wafer W1 from the Z2 direction side via the sheet member W2, while the pressing unit 213a is moved in the X direction by the X-direction movement mechanism 213c, thereby dividing the wafer W1.

[0072] <Clamp section> The clamp unit 214 is configured to grip the ring-shaped member W3 of the wafer ring structure W. Specifically, the clamp unit 214 has a gripping unit 214a, a Z-direction movement mechanism 214b, and a Y-direction movement mechanism 214c. The gripping unit 214a supports the ring-shaped member W3 from the Z2 direction side and presses the ring-shaped member W3 from the Z1 direction side. In this manner, the ring-shaped member W3 is gripped by the gripping unit 214a. The gripping unit 214a is attached to the Z-direction movement mechanism 214b. The Z-direction movement mechanism 214b is an example of a "clamp movement mechanism" in the claims.

[0073] The Z-direction movement mechanism 214b is configured to move the clamp unit 214 in the Z direction. Specifically, the Z-direction movement mechanism 214b is configured to move the gripper 214a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 214b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 214b is attached to the Y-direction movement mechanism 214c. The Y-direction movement mechanism 214c is configured to move the Z-direction movement mechanism 214b in the Y1 direction or the Y2 direction. The Y-direction movement mechanism 214c has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0074] (Control configuration of semiconductor wafer processing equipment) As shown in FIG. 9, the semiconductor wafer processing apparatus 100 includes a first control unit 101, a second control unit 102, a third control unit 103, a fourth control unit 104, a fifth control unit 105, a sixth control unit 106, a seventh control unit 107, an eighth control unit 108, an expansion control calculation unit 109, a handling control calculation unit 110, a dicing control calculation unit 111, and a memory unit 112.

[0075] The first control unit 101 is configured to control the squeegee unit 213. The first control unit 101 includes a central processing unit (CPU) and a storage unit having a read-only memory (ROM) and a random access memory (RAM). The first control unit 101 may include a hard disk drive (HDD) as the storage unit, in which stored information is retained even after the voltage is cut off. The HDD may be shared by the first control unit 101, the second control unit 102, the third control unit 103, the fourth control unit 104, the fifth control unit 105, the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108.

[0076] The second control unit 102 is configured to control the cool air supply unit 206 and the cooling unit 207. The second control unit 102 includes a CPU and a storage unit having a ROM, RAM, etc. The third control unit 103 is configured to control the heat shrink unit 211 and the ultraviolet ray irradiation unit 212. The third control unit 103 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the second control unit 102 and the third control unit 103 may include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0077] The fourth control unit 104 is configured to control the cassette unit 202 and the lift-up hand unit 203. The fourth control unit 104 includes a CPU and a storage unit having a ROM, RAM, etc. The fifth control unit 105 is configured to control the suction hand unit 204. The fifth control unit 105 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the fourth control unit 104 and the fifth control unit 105 may include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0078] The sixth control unit 106 is configured to control the chuck table unit 12. The sixth control unit 106 includes a CPU and a storage unit having a ROM, RAM, etc. The seventh control unit 107 is configured to control the laser unit 13. The seventh control unit 107 includes a CPU and a storage unit having a ROM, RAM, etc. The eighth control unit 108 is configured to control the imaging unit 14. The eighth control unit 108 includes a CPU and a storage unit having a ROM, RAM, etc. Note that the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108 may each include a storage unit such as an HDD that retains stored information even after the voltage is cut off.

[0079] The expansion control calculation unit 109 is configured to perform calculations related to the expansion process of the sheet member W2 based on the processing results of the first control unit 101, the second control unit 102, and the third control unit 103. The expansion control calculation unit 109 includes a CPU and a storage unit having a ROM, a RAM, etc. The detailed configuration of the expansion control calculation unit 109 will be described in detail later.

[0080] The handling control calculation unit 110 is configured to perform calculations related to the movement process of the wafer ring structure W based on the processing results of the fourth control unit 104 and the fifth control unit 105. The handling control calculation unit 110 includes a CPU and a storage unit having a ROM, a RAM, etc.

[0081] The dicing control calculation unit 111 is configured to perform calculations related to the dicing process of the wafer W1 based on the processing results of the sixth control unit 106, the seventh control unit 107, and the eighth control unit 108. The dicing control calculation unit 111 includes a CPU and a storage unit having a ROM, a RAM, etc.

[0082] The storage unit 112 stores programs for operating the dicing device 1 and the expanding device 2. The storage unit 112 includes a ROM, a RAM, an HDD, and the like.

[0083] (Semiconductor chip manufacturing process) The overall operation of the semiconductor wafer processing apparatus 100 will be described below with reference to FIGS.

[0084] In step S1, the wafer ring structure W is removed from the cassette unit 202. That is, after the wafer ring structure W accommodated in the cassette unit 202 is supported by the lift-up hand 203b, the lift-up hand 203b is moved in the Y1 direction by the Y-direction movement mechanism 203a, thereby removing the wafer ring structure W from the cassette unit 202. In step S2, the wafer ring structure W is transferred to the chuck table unit 12 of the dicing apparatus 1 by the suction hand 204c. That is, the wafer ring structure W removed from the cassette unit 202 is moved in the X2 direction by the X-direction movement mechanism 204a while being sucked by the suction hand 204c. Then, the wafer ring structure W moved in the X2 direction is transferred from the suction hand 204c to the chuck table unit 12, and then gripped by the chuck table unit 12.

[0085] In step S3, a modified layer is formed on the wafer W1 by the laser unit 13. In step S4, the wafer ring structure W having the wafer W1 on which the modified layer has been formed is transferred to the clamp unit 214 by the suction hand 204c. In step S5, the sheet member W2 is cooled by the cold air supply unit 206 and the cooling unit 207. That is, the wafer ring structure W held by the clamp unit 214 is moved (lowered) in the Z2 direction by the Z-direction movement mechanism 214b so as to contact the cooling unit 207, and cold air is supplied from the Z1 direction by the cold air supply unit 206, thereby cooling the sheet member W2.

[0086] In step S6, the wafer ring structure W is moved to the expanding unit 208 by the clamping unit 214. That is, the wafer ring structure W, from which the sheet member W2 has been cooled, is moved in the Y1 direction by the Y-direction moving mechanism 214c while being held by the clamping unit 214. In step S7, the sheet member W2 is expanded by the expanding unit 208. That is, the wafer ring structure W is moved in the Z2 direction by the Z-direction moving mechanism 214b while being held by the clamping unit 214. Then, the sheet member W2 comes into contact with the expanding ring 281 and is expanded by being pulled by the expanding ring 281. As a result, the wafer W1 is divided along the dividing lines (modified layers).

[0087] In step S8, the sheet member W2 in the expanded state is pressed from the Z1 direction side by the expansion maintaining member 210. That is, the pressing ring portion 210a is moved (lowered) in the Z2 direction by the Z direction moving mechanism 210d until it abuts against the sheet member W2. Then, the process proceeds from point A in FIG. 10 via point A in FIG. 11 to step S9.

[0088] 11, in step S9, after the sheet member W2 is pressed by the expansion maintaining member 210, the ultraviolet ray Ut is irradiated onto the sheet member W2 by the ultraviolet ray irradiating unit 212 while the wafer W1 is pressed by the squeegee unit 213. As a result, the wafer W1 is further divided by the squeegee unit 213. In addition, the adhesive strength of the sheet member W2 is reduced by the ultraviolet ray Ut irradiated from the ultraviolet ray irradiating unit 212.

[0089] In step S10, the sheet material W2 is heated and shrunk by the heat shrink unit 211, while the clamp unit 214 is raised. At this time, the intake unit 210c sucks in air near the heated sheet material W2. In step S11, the wafer ring structure W is transferred from the clamp unit 214 to the suction hand 204c. That is, the wafer ring structure W is moved in the Y2 direction by the Y-direction movement mechanism 214c while being held by the clamp unit 214. Then, at a position on the Z1 direction side of the cooling unit 207, the wafer ring structure W is released from the clamp unit 214 and then sucked by the suction hand 204c.

[0090] In step S12, the wafer ring structure W is transferred to the lift-up hand 203b by the suction hand 204c. In step S13, the wafer ring structure W is accommodated in the cassette unit 202. That is, the wafer ring structure W supported by the lift-up hand 203b is moved in the Y1 direction by the Y-direction movement mechanism 203a, and the wafer ring structure W is accommodated in the cassette unit 202. This completes the processing performed on one wafer ring structure W. Then, the process returns to step S1 from point B in FIG. 11 via point B in FIG. 10.

[0091] (Detailed configuration of the expansion unit, expansion maintaining member, ultraviolet irradiation unit, and squeegee unit) 12 and 13, the detailed configurations of the expanding section 208, the expansion-maintaining member 210, the ultraviolet irradiation section 212, and the squeegee section 213 will be described. For convenience, the heat shrink section 211 of the expanding device 2 is not shown in FIG.

[0092] 12 shows the expanding device 2 in a state before the sheet member W2 is expanded by the expanding ring 281. Here, the clamping portion 214 is disposed at the raised position Up. That is, the gripping portion 214a is disposed at the raised position Up by the Z-direction moving mechanism 214b.

[0093] 13 shows the expanding device 2 in a state where the sheet member W2 is being expanded by the expansion ring 281. Here, the clamp portion 214 is disposed at the lowered position Lw. That is, the gripping portion 214a has been moved in the Z2 direction from the raised position Up toward the lowered position Lw by the Z-direction moving mechanism 214b.

[0094] When the gripping portion 214a is moved in the Z2 direction from the raised position Up to the lowered position Lw, the sheet member W2 comes into contact with the upper end 281a of the expand ring 281 and stretches. At this time, the wafer W1 is pulled by the sheet member W2, generating tensile stress within the wafer W1, causing the wafer W1 to be divided along the modified layer formed on the wafer W1. As a result, multiple semiconductor chips Ch are formed.

[0095] <Expanding section> The expanding unit 208 has an expanding ring 281 that divides the wafer W1 into a plurality of semiconductor chips Ch spaced apart by a distance Mr by expanding the sheet member W2 while the clamping unit 214 grips the wafer ring structure W. That is, the expanding ring 281 is configured to expand the sheet member W2 by the clamping unit 214 that is moved in the Z2 direction from the raised position Up toward the lowered position Lw by the Z-direction moving mechanism 214b.

[0096] The expand ring 281 is fixed on the base 205. An upper end 281a of the expand ring 281 is disposed at a predetermined height position Hd in the Z direction. The predetermined height position Hd is a height position based on the upper surface of the base 205. In this way, the upper end 281a of the expand ring 281 is maintained at the predetermined height position Hd.

[0097] 14, the expansion maintaining member 210 is configured to maintain the expanded state of the sheet member W2 near the wafer W1. For convenience, the heat shrink section 211 of the expanding device 2 is not shown in FIG.

[0098] Specifically, the expansion-retaining member 210 has a pressure ring portion 210a and a cover portion 210b.

[0099] The pressure ring portion 210a has a cylindrical shape in a plan view and is disposed so as to surround the wafer W1. The lid portion 210b is provided so as to cover the opening of the pressure ring portion 210a in the Z1 direction. The lid portion 210b is provided on the inner side 1210a of the pressure ring portion 210a so as to close the opening of the pressure ring portion 210a in the Z1 direction. The lid portion 210b is provided at the end of the inner side 1210a of the pressure ring portion 210a on the Z1 direction side. The inner side 1210a is the radially inner side of the cylindrical pressure ring portion 210a.

[0100] The lid portion 210b has a through-hole 1210b formed therethrough in the Z direction. The through-hole 1210b is formed in the center of the lid portion 210b in the radial direction of the pressing ring portion 210a. The imaging unit 215 is attached to the through-hole 1210b so as to close the through-hole 1210b.

[0101] The ultraviolet irradiating unit 212 is configured to irradiate the expanded sheet member W2 with ultraviolet rays Ut from the Z2 direction side. The ultraviolet irradiating unit 212 is disposed at a position in the Z2 direction from the imaging unit 215. The ultraviolet irradiating unit 212 is also disposed at a position in the Z2 direction from the wafer W1 of the expanded sheet member W2.

[0102] Here, the ultraviolet rays Ut irradiated from the ultraviolet irradiating unit 212 are prevented from leaking out of the expansion maintaining member 210 by covering the wafer W1 from the Z1 direction side with the cylindrical pressure ring portion 210a and the lid portion 210b. In this way, the expansion maintaining member 210 not only has the function of maintaining the expanded state of the sheet member W2 near the wafer W1, but also the function of blocking the ultraviolet rays Ut. Furthermore, the expansion maintaining member 210 is made of a metal such as stainless steel to suppress deterioration of the material caused by blocking the ultraviolet rays Ut.

[0103] (Image capture unit and notification unit) The expanding device 2 of the first embodiment includes an imaging unit 215 and a notification unit 216.

[0104] <Imaging unit> The imaging unit 215 is configured to capture an image of the expanded state of the wafer W1 of the wafer ring structure W held by the clamp unit 214. That is, the imaging unit 215 is configured to capture an image of the expanded state (divided state) of the wafer W1 by the expand ring 281 in a state in which the upper end portion 281a is arranged at a predetermined height position Hd (see FIG. 13).

[0105] The imaging unit 215 is a wide-angle camera having a field of view capable of capturing an image of the entire wafer W1 in the expanded state from the Z1 direction side. The imaging unit 215 has multiple lighting units (not shown). The multiple lighting units are lights for illuminating the wafer W1 in the space covered by the expansion maintaining member 210 when the expansion maintaining member 210 covers the wafer W1 from the Z1 direction side. The space is the space surrounded by the sheet member W2 and wafer W1 in the expanded state and the expansion maintaining member 210. In this way, the imaging unit 215 is configured to capture an image of the expanded state of the wafer W1 by the expansion ring 281 when the expansion maintaining member 210, which has been lowered by the Z-direction movement mechanism 210d, covers the wafer W1.

[0106] The imaging unit 215 is attached to the expansion-retaining member 210. Specifically, the imaging unit 215 is attached to the lid portion 210b of the expansion-retaining member 210. Here, the imaging unit 215 is disposed at the center of the lid portion 210b in the radial direction of the pressing ring portion 210a. The radial direction of the pressing ring portion 210a is a direction approximately perpendicular to the Z direction.

[0107] 15, the imaging unit 215 is configured to capture images of the expanded state of the wafer W1 by the expand ring 281 at multiple times from the expansion start time St to the expansion end time Ed of the sheet member W2. Note that FIG. 15 is a timing chart showing an example of the imaging process by the imaging unit 215.

[0108] Specifically, the imaging unit 215 is configured to capture a video including a plurality of captured images taken at each of a plurality of consecutive timings of the expanded state (divided state) of the wafer W1 by the expand ring 281 from the expansion start time St to the expansion end time Ed of the sheet member W2. For example, when the time required for expanding the wafer W1 by the expand ring 281 is approximately 0.1 to 2 seconds, the imaging unit 215 is configured to capture the video at about 100 fps. The frame rate for capturing the video by the imaging unit 215 is set in advance by the user.

[0109] The imaging unit 215 is configured to start capturing video of the expanded state of the wafer W1 when the clamp unit 214 starts to descend from the raised position Up, and to end capturing video of the expanded state of the wafer W1 when the clamp unit 214 reaches the lowered position Lw.

[0110] Furthermore, the imaging unit 215 is configured to capture still images of the semiconductor chips Ch separated from the wafer W1 after completing the video imaging of the expanded state of the wafer W1.

[0111] In this way, imaging processing by imaging unit 215 is performed during moving image imaging period T and after moving image imaging ends Tp. Here, "before moving image imaging starts" refers to the time immediately before clamp unit 214 starts to descend from raised position Up. Moving image imaging period T is the period from when clamp unit 214 starts to descend from raised position Up to when clamp unit 214 reaches lowered position Lw. "Tp after moving image imaging ends" refers to the time immediately after clamp unit 214 reaches lowered position Lw.

[0112] For example, the moving image capturing period T can be divided into a first half T1, a second half T2, and a final half T3. The first half T1 is a period of the moving image capturing period T that precedes the second half T2 and the final half T3. The second half T2 is a period of the moving image capturing period T between the first half T1 and the second half T2. The final half T3 is a period of the moving image capturing period T that follows the second half T2.

[0113] Next, with reference to FIGS. 15 to 25, the imaging process by the imaging section 215 in each of the first half T1, second half T2, final half T3, and Tp after the end of video imaging will be described.

[0114] 16 and 17, before the start of video capture, the expand ring 281 abuts against the sheet member W2 near the wafer W1. The expansion maintaining member 210 has moved to an upper position so that the expand ring 281 does not abut against the sheet member W2 near the wafer W1. The upper position is a position near the expand ring 281 on the Z1 direction side of the sheet member W2 near the wafer W1. A crack Cr has been formed in the wafer W1 due to a modified layer in the wafer W1.

[0115] As shown in FIGS. 18 and 19, in the first half T1, a first captured image P1 is captured as part of a plurality of captured images of a moving image captured by the imaging unit 215. In the first half T1, the clamp unit 214 is lowered below the raised position Up. As a result, a tensile stress generated by the expansion of the sheet member W2 causes a portion of the wafer W1 to be divided into a plurality of semiconductor chips Ch. The portion of the wafer W1 is a portion outside the central wafer W1 that remains undivided. The imaging unit 215 captures the first captured image P1, which shows the central wafer W1 that remains undivided and the plurality of semiconductor chips Ch formed outside the central wafer W1, as part of the plurality of captured images of the moving image.

[0116] 20 and 21, in the latter half T2, a second captured image P2 is captured as part of a plurality of captured images of the moving image captured by the imaging unit 215. In the latter half T2, the clamp unit 214 is lowered below the height position of the clamp unit 214 in the first half T1. As a result, the tensile stress generated by the expansion of the sheet member W2 divides the entire wafer W1 into a plurality of semiconductor chips Ch. The imaging unit 215 captures the second captured image P2, in which the divided semiconductor chips Ch are displayed, as part of the plurality of captured images of the moving image.

[0117] 22 and 23, at the end of the process T3, the third captured image P3 is captured as one of the multiple captured images of the moving image captured by the imaging unit 215. At the end of the process T3, the clamp unit 214 is lowered below the height position of the clamp unit 214 at the latter half of the process T2. Here, similar to the latter half of the process T2, the entire wafer W1 is divided into multiple semiconductor chips Ch. The imaging unit 215 captures the third captured image P3, in which the multiple divided semiconductor chips Ch are displayed, as one of the multiple captured images of the moving image.

[0118] 24 and 25, the imaging unit 215 is configured to bring the sheet member W2 near the wafer W1 into contact with the expand ring 281 at time Tp after the completion of video imaging, and to image the plurality of semiconductor chips Ch with the sheet member W2 in an expanded state by the imaging unit 215. As a result, a still image Pe is acquired after the completion of the imaging.

[0119] <Information Department> The notification unit 216 is configured to notify of an abnormality in the expanded state of the wafer W1 based on the imaging result of the expanded state of the wafer W1 by the imaging unit 215. Here, the imaging result refers to a plurality of captured images (for example, a first captured image P1, a second captured image P2, and a third captured image P3) captured as a moving image by the imaging unit 215.

[0120] The notification unit 216 is a display unit that notifies the user of an abnormality in the expanded state of the wafer W1 by displaying it on a screen. The notification unit 216 may also be a notification unit that notifies the user of an abnormality in the expanded state of the wafer W1 by communication.

[0121] (Detailed configuration of the expansion control calculation unit) In the expanding device 2, the expansion control calculation unit 109 is configured to perform control to detect the semiconductor chips Ch divided in the wafer W1 based on a plurality of captured images taken as a moving image by the imaging unit 215. That is, the expansion control calculation unit 109 is configured to inspect the timing when the entire wafer W1 is divided into a plurality of semiconductor chips Ch, the change in the timing when the entire wafer W1 is divided into a plurality of semiconductor chips Ch, and the order in which the wafer W1 is divided when the wafer W1 is expanded.

[0122] Here, an overview of detecting divided semiconductor chips Ch based on multiple captured images will be described with reference to Figures 27 and 28. Figure 27 illustrates a state in which an outer portion of a wafer W1 is divided to form semiconductor chips Ch1, and then a portion of the wafer W1 inside the semiconductor chips Ch1 is divided to form semiconductor chips Ch2. Figure 28 illustrates the wafer W1 before expansion.

[0123] When expanding wafer W1, comparing the dividing force Ef applied to semiconductor chip Ch1 at the moment semiconductor chip Ch1 is divided with the dividing force Ef applied to semiconductor chip Ch2 at the moment semiconductor chip Ch2 is divided, the dividing force Ef applied to semiconductor chip Ch2 increases by the amount that the force stretching sheet member W2 increases due to the lowering of clamp unit 214. However, in this case, the gap between semiconductor chip Ch2 and wafer W1 increases in addition to the gap between semiconductor chip Ch1 and semiconductor chip Ch2, so the dividing force Ef applied to semiconductor chip Ch2 decreases by the amount that the tensile stress on wafer W1 has escaped.

[0124] 28, the length of the dividing line (crack Cr) of the wafer W1 is shorter in the outer portion (shown with hatching) of the wafer W1 than in the inner portion (shown without hatching) of the wafer W1. Furthermore, the number of semiconductor chips Ch to be divided is smaller in the outer portion (shown with hatching) of the wafer W1 than in the inner portion (shown without hatching). For these reasons, when the dividing force Ef is applied to the wafer W1, the outer portion (shown with hatching) of the wafer W1 is more likely to be divided into semiconductor chips Ch than the inner portion (shown without hatching). Therefore, the wafer W1 is divided from the outer portion (shown with hatching) of the wafer W1 toward the inside.

[0125] By detecting the divided semiconductor chips Ch using these, it is possible to inspect the timing at which the wafer W1 was divided into the semiconductor chips Ch and whether the wafer W1 is cracked from the outer portion (shown by hatching) onwards.

[0126] <Method for detecting divided semiconductor chips> As shown in FIG. 29, the expansion control calculation unit 109 is configured to perform control to detect the semiconductor chips Ch divided from the wafer W1 in each of the multiple captured images based on the outer shape of the semiconductor chips Ch in a planar view.

[0127] Here, in FIG. 29, a first captured image P1 is shown as an example of one of the multiple captured images. The outer shape in a plan view for detecting the semiconductor chip Ch by image processing is set in advance by the user based on the length in the X direction, the length in the Y direction, and a tolerance (for example, approximately 5%). In FIG. 29, the outer shape in a plan view of the semiconductor chip Ch is rectangular, as an example. When a figure that matches the predetermined outer shape of the semiconductor chip Ch in a plan view is detected in the first captured image P1, the expansion control calculation unit 109 is configured to perform control to detect this figure as the semiconductor chip Ch. Here, the detected semiconductor chip Ch is displayed with rectangular hatching.

[0128] As shown in Figure 30, the expansion control calculation unit 109 is configured to perform control to obtain the timing at which the semiconductor chip Ch is divided based on the detection of the semiconductor chip Ch in multiple captured images captured during the video imaging period T.

[0129] Specifically, the expansion control calculation unit 109 is configured to perform control to send an abnormality in the expanded state to the notification unit 216 based on the detection of a semiconductor chip Ch in an image taken near the end portion T3 (for example, the third captured image P3) among the multiple captured images. That is, when a semiconductor chip Ch is formed as a result of a portion of the wafer W1 that was not divided in the first half portion T1 and the second half portion T2 being divided in the last half portion T3, the abnormality in the expanded state is notified to the notification unit 216. Furthermore, the expansion control calculation unit 109 is configured to perform control to identify the semiconductor chip Ch detected in the image taken near the end portion T3 (for example, the third captured image P3), rather than in the image taken in the first half portion T1 (for example, the first captured image P1) and the image taken in the second half portion T2 (for example, the second captured image P2).

[0130] In this case, all the semiconductor chips Ch are separated on the wafer W1, but there is a high possibility that some portions of the wafer W1 will not be separated due to changes in the hardness of the sheet member W2, the state of the wafer W1, room temperature, etc. Therefore, by making the notification unit 216 aware of an abnormality in the expanded state, the user can be prompted to make changes such as increasing the descent speed of the Z-direction movement mechanism 214b of the clamp unit 214 or lowering the position of the descent position Lw of the clamp unit 214.

[0131] The expansion control calculation unit 109 is also configured to control the notification of an abnormality in the expanded state to the notification unit 216 based on the difference between the first detection of the semiconductor chip Ch and the first detection of the semiconductor chip Ch in the last few days. For example, this may occur if the first detection of the semiconductor chip Ch on the same day occurred in the latter half T2, but the first detection of the semiconductor chip Ch in the last few days occurred in the first half T1. In this case, there is a high possibility that there is an unexpected change in the lot of the sheet material W2 or the temperature inside the equipment. Therefore, the notification unit 216 can make the user aware of the abnormality in the expanded state, which can prompt the user to inspect the sheet material W2 or the equipment.

[0132] As shown in FIG. 31 , the expansion control calculation unit 109 is configured to control the notification unit 216 to notify the user of an abnormality in the expanding state based on the fact that the wafer W1 has not been divided from its outer portion toward its inner portion. For example, in the captured image, semiconductor chips Ch separated from the wafer W1 are detected inside the wafer W1 in the area Ar1 and the wafer W1 in the area Ar2. If semiconductor chips Ch are detected in at least one of the wafer W1 in the area Ar1 and the wafer W1 in the area Ar2 in the next captured image, it is determined that the wafer W1 has not been divided from its outer portion toward its inner portion. In this case, there is a high possibility that the sheet member W2 has not expanded uniformly, the wafer W1 has not been properly attached to the sheet member W2, or a modified layer formed within the wafer W1 is not uniform. Therefore, the notification unit 216 can inform the user of the abnormality in the expanding state, allowing the user to inspect the sheet member W2 or the dicing device 1.

[0133] As shown in Fig. 32, the expansion control calculation unit 109 is configured to perform control to acquire the number of divided semiconductor chips Ch based on the detection of semiconductor chips Ch in a post-capture still image Pe captured at time Tp after the end of video capture. The expansion control calculation unit 109 is configured to perform control to identify whether the division of the semiconductor chips Ch is good or not based on the acquired number of divided semiconductor chips Ch. Here, in Fig. 32, the detected semiconductor chips Ch are displayed with rectangular hatching.

[0134] (Wafer imaging processing) With reference to FIG. 33, the wafer imaging process performed by the expansion control calculation unit 109 and the imaging unit 215 of the semiconductor wafer processing apparatus 100 will be described below.

[0135] In step S101, it is determined whether the clamp unit 214 has reached the raised position Up. If the clamp unit 214 has reached the raised position Up, the process proceeds to step S102; if the clamp unit 214 has not reached the raised position Up, step S101 is repeated. In step S102, it is determined whether the clamp unit 214 has started to descend. If the clamp unit 214 has started to descend, the process proceeds to step S103; if the clamp unit 214 has not started to descend, step S102 is repeated.

[0136] In step S103, the imaging unit 215 starts capturing video of the wafer W1 in the expanded state. Here, the clamp unit 214 starts to descend, and the sheet member W2 abutting against the expand ring 281 is expanded by the descending clamp unit 214. In step S104, it is determined whether the clamp unit 214 has reached the lowered position Lw. If the clamp unit 214 has reached the lowered position Lw, the process proceeds to step S105; if the clamp unit 214 has not reached the lowered position Lw, step S104 is repeated.

[0137] In step S105, the imaging unit 215 captures a post-processing still image Pe, and then the wafer imaging process ends.

[0138] In a process other than the wafer imaging process in a method for manufacturing semiconductor chips Ch (the semiconductor chip manufacturing process), which is a manufacturing method for manufacturing semiconductor chips Ch, the dicing control calculation unit 111 performs a process (step) of forming a modified layer in the wafer W1 by irradiating the wafer W1, on which a plurality of semiconductor chips Ch are provided, with laser light from the laser irradiation unit 13a that irradiates the laser light. Also, the expansion control calculation unit 109 performs a process (step) of expanding the sheet member W2 with the expand ring 281 to divide the wafer W1 into a plurality of individual semiconductor chips Ch, with the clamp unit 214 that grips the wafer ring structure W gripping the wafer ring structure W, and imaging the expanded state of the wafer W1 by the expand ring 281 with the imaging unit 215 at multiple timings from the start to the end of the expansion of the sheet member W2.

[0139] The semiconductor chip Ch manufactured by such a manufacturing method of the semiconductor chip Ch is manufactured by the expanding device 2 including the clamping section 214, the expanding ring 281, and the imaging section 215.

[0140] (Effects of the first embodiment) In the first embodiment, the following effects can be obtained.

[0141] In the first embodiment, as described above, the expanding device 2 includes the imaging unit 215 that captures images of the expanded state of the wafer W1 by the expanding ring 281 at multiple timings between the expansion start time St and the expansion end time Ed of the sheet member W2. This allows the expanded state (divided state) of the wafer W1 close to the expansion end time Ed to be acquired based on an image captured by the imaging unit 215 at a timing close to the expansion end time Ed among the multiple imaging timings. Therefore, it is possible to detect whether the divided semiconductor chips Ch were divided close to the expansion end time Ed. If the wafer W1 is divided into the semiconductor chips Ch close to the end of the expansion of the sheet member W2, it is highly likely that the wafer W1 will not be divided into the semiconductor chips Ch during the next or subsequent expansion of the sheet member W2 due to a slight change, such as the same sheet member W2 being a slightly softer sheet or the modified layer of the wafer W1 being formed slightly smaller. In contrast, in the present invention, by acquiring the expanded state (divided state) of the wafer W1 nearing the end of expanding the sheet member W2, it is possible to acquire events that are considered to have a high probability of preventing the wafer W1 from being divided into a plurality of semiconductor chips Ch. As a result, it is possible to acquire events that are predicted to prevent the wafer W1 from being divided into a plurality of semiconductor chips Ch, and therefore it is possible to prevent the wafer W1 from being divided into a plurality of semiconductor chips Ch.

[0142] Furthermore, in the first embodiment, as described above, the imaging unit 215 captures a video including a plurality of captured images taken at each of a plurality of consecutive timings of the expanded state of the wafer W1 by the expand ring 281 from the expansion start time St to the expansion end time Ed of the sheet member W2. As a result, by performing video capturing including a plurality of captured images by the imaging unit 215, the expanded state of the wafer W1 from the expansion start time St to the expansion end time Ed of the sheet member W2 can be reliably and completely captured, and the timing at which the plurality of semiconductor chips Ch are divided can be accurately captured.

[0143] Furthermore, in the first embodiment, as described above, the expanding device 2 includes the expansion maintaining member 210 that maintains the expanded state of the sheet member W2 near the wafer W1. The imaging unit 215 is attached to the expansion maintaining member 210. This eliminates the need to provide a dedicated attachment member for attaching the imaging unit 215 to the expanding device 2, thereby preventing an increase in the number of parts of the expanding device 2 and a complicated structure.

[0144] Furthermore, in the first embodiment, as described above, the expansion maintaining member 210 includes a cylindrical pressure ring portion 210a arranged to surround the wafer W1. The expansion maintaining member 210 includes a lid portion 210b arranged to cover the upward opening of the pressure ring portion 210a. The imaging unit 215 is attached to the lid portion 210b of the expansion maintaining member 210. As a result, the lid portion 210b is arranged in a position to cover the upward opening of the cylindrical pressure ring portion 210a arranged to surround the wafer W1, so that the imaging unit 215 can be positioned above the wafer W1. As a result, by imaging the wafer W1 from above using the imaging unit 215, it is possible to easily image the multiple semiconductor chips Ch that have been divided and spaced apart from one another.

[0145] Furthermore, in the first embodiment, as described above, the imaging unit 215 is disposed at the center of the lid portion 210b in the radial direction of the pressure ring portion 210a, which allows the imaging unit 215 to easily capture an image of the entire wafer W1 from above while it is surrounded by the cylindrical pressure ring portion 210a.

[0146] Furthermore, in the first embodiment, as described above, the expanding device 2 includes the Z-direction moving mechanism 210d that moves the expansion maintaining member 210 in the up and down direction. The imaging unit 215 images the expanded state of the wafer W1 by the expand ring 281 in a state in which the expansion maintaining member 210, which has been lowered by the Z-direction moving mechanism 210d, covers the wafer W1. This allows the imaging unit 215 to image the expanded state of the wafer W1 from a closer position, making it possible to obtain an image that more clearly captures the division of the wafer W1 into the multiple semiconductor chips Ch.

[0147] Furthermore, in the first embodiment, as described above, the expanding device 2 is provided with an ultraviolet ray irradiation unit 212 that is disposed at a position in the Z2 direction of the imaging unit 215 and that irradiates ultraviolet rays Ut from below onto the sheet member W2 in an expanded state. The expansion maintaining member 210 covers the wafer W1 from above with a cylindrical pressure ring portion 210a and a lid portion 210b so that the ultraviolet rays Ut irradiated onto the sheet member W2 from the ultraviolet ray irradiation unit 212 do not leak out of the expansion maintaining member 210. This allows the expansion maintaining member 210 to be used not only as an attachment member for the imaging unit 215 but also as a cover for blocking ultraviolet rays Ut, thereby reducing the number of parts and reducing the complexity of the structure compared to when a separate cover for blocking ultraviolet rays is provided.

[0148] Furthermore, in the first embodiment, as described above, the expanding device 2 includes the notification unit 216 that notifies the user of an abnormality in the expanded state of the wafer W1 based on the image capturing result of the expanded state of the wafer W1 by the imaging unit 215. This allows the user to be made aware of the abnormality in the expanded state of the wafer W1, and therefore the user can be prompted to improve the abnormality in the expanded state of the wafer W1.

[0149] Furthermore, in the first embodiment, as described above, the expanding device 2 includes a Z-direction moving mechanism 214b that moves the clamp unit 214 in the vertical direction. The expanding device 2 is configured to expand the sheet member W2 by moving the clamp unit 214 downward using the Z-direction moving mechanism 214b while the upper end 281a of the expand ring 281 is positioned at a predetermined vertical height Hd. The imaging unit 215 captures an image of the expanded state of the wafer W1 by the expand ring 281 with the upper end 281a positioned at the predetermined vertical height Hd. This maintains the height position of the wafer W1 at the predetermined vertical height Hd in the expanded state, so that when the imaging unit 215 captures the expanded state of the wafer W1, the focus of the imaging unit 215 can be kept on the wafer W1. As a result, it is possible to prevent unclear portions from occurring in the image of the expanded state of the wafer W1 captured by the imaging unit 215.

[0150] Furthermore, in the first embodiment, as described above, the manufacturing method for semiconductor chips Ch includes a step of capturing images of the expanded state of the wafer W1 by the expand ring 281 using the imaging unit 215 at multiple timings from the start of expanding the sheet member W2 to the end of expanding the sheet member W2. This allows the expanded state (divided state) of the wafer W1 near the end of expanding to be acquired based on the captured image captured at the timing closest to the end of expanding among the multiple timings captured by the imaging unit 215. Therefore, it is possible to detect whether the divided semiconductor chips Ch were divided near the end of expanding the sheet member W2. If the divided semiconductor chips Ch are divided near the end of expanding the sheet member W2, it is highly likely that the wafer W1 will not be able to be divided into the multiple semiconductor chips Ch during the next or subsequent expansion of the sheet member W2 due to slight changes, such as the same sheet member W2 being a slightly softer sheet or the modified layer of the wafer W1 being slightly smaller. In contrast, in the present invention, by acquiring the expanded state (divided state) of the wafer W1 nearing the end of expanding the sheet member W2, it is possible to acquire an event that is considered to have a high probability of preventing the wafer W1 from being divided into a plurality of chips. As a result, it is possible to acquire an event that predicts that the wafer W1 will not be divided into a plurality of semiconductor chips Ch, thereby obtaining a method for manufacturing semiconductor chips Ch that can prevent the wafer W1 from being divided into a plurality of semiconductor chips Ch.

[0151] Furthermore, in the first embodiment, as described above, the semiconductor chips Ch are manufactured by the expanding device 2 including the imaging unit 215 that captures images of the expanded state of the wafer W1 by the expand ring 281 at multiple timings from the start to the end of the expansion of the sheet member W2. This allows the expanded state (divided state) of the wafer W1 near the end of the expansion to be acquired based on the image captured by the imaging unit 215 at the timing close to the end of the expansion. Therefore, it is possible to detect whether the divided semiconductor chips Ch were divided near the end of the expansion. If the divided semiconductor chips Ch are divided near the end of the expansion of the sheet member W2, it is highly likely that the wafer W1 will not be able to be divided into the multiple semiconductor chips Ch during the next or subsequent expansion of the sheet member W2 due to slight changes, such as the same sheet member W2 being a slightly softer sheet or the modified layer of the wafer W1 being formed slightly smaller. In contrast, in the present invention, by acquiring the expanded state (divided state) of the wafer W1 nearing the end of expanding the sheet member W2, it is possible to acquire an event that is considered to have a high probability of preventing the wafer W1 from being divided into a plurality of chips. As a result, it is possible to acquire an event that predicts that the wafer W1 will not be divided into a plurality of semiconductor chips Ch, and therefore it is possible to obtain semiconductor chips Ch that can be manufactured by a method that can prevent the wafer W1 from being divided into a plurality of semiconductor chips Ch.

[0152] [Second embodiment] 34 to 39, the configuration of a semiconductor wafer processing apparatus 300 according to the second embodiment will be described. In the second embodiment, unlike the first embodiment, a squeegee unit 3213 is disposed outside an expand ring 3281. Note that in the second embodiment, detailed description of the same configuration as in the first embodiment will be omitted.

[0153] (Semiconductor wafer processing equipment) As shown in FIGS. 34 and 35, the semiconductor wafer processing apparatus 300 is an apparatus for processing a wafer W1 provided on a wafer ring structure W.

[0154] The semiconductor wafer processing apparatus 300 is equipped with a dicing apparatus 1 and an expanding apparatus 302. The vertical direction is the Z direction, the upward direction is the Z1 direction, and the downward direction is the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing apparatus 1 and the expanding apparatus 302 are lined up is the X direction, the X1 direction is the expanding apparatus 302 side of the X direction, and the X2 direction is the dicing apparatus 1 side of the X direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction.

[0155] (dicing equipment) The dicing device 1 is configured to form a modified layer by irradiating the wafer W1 with a laser having a wavelength that is transparent to the wafer W1 along the dividing lines (streets).

[0156] Specifically, the dicing device 1 includes a base 11, a chuck table unit 12, a laser unit 13, and an imaging unit .

[0157] (Expanding device) As shown in FIGS. 35 and 36, the expanding apparatus 302 is configured to divide the wafer W1 into a plurality of semiconductor chips Ch.

[0158] The expansion device 302 includes a base 201, a cassette section 202, a lift-up hand section 203, a suction hand section 204, a base 205, a cold air supply section 206, a cooling unit 207, an expansion section 3208, a base 209, an expansion maintenance member 210, a heat shrink section 211, an ultraviolet irradiation section 212, a squeegee section 3213, a clamp section 214, an imaging section 215, and an alarm section 216.

[0159] <Expanding section> The expanding section 3208 is configured to expand the sheet member W2 of the wafer ring structure W, thereby dividing the wafer W1 along the dividing line.

[0160] Specifically, the expanding section 3208 has an expanding ring 3281 and a Z-direction moving mechanism 3282 .

[0161] The expand ring 3281 is configured to support the sheet member W2 from the Z2 direction side, thereby expanding (expanding) the sheet member W2. The expand ring 3281 has a ring shape in a plan view. The Z-direction movement mechanism 3282 is configured to move the expand ring 3281 in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 3282 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The Z-direction movement mechanism 3282 is attached to the base 205. In the expanded state, the upper end 3281a of the expand ring 3281 is maintained at a predetermined height position Hd by the Z-direction movement mechanism 3282.

[0162] <Squeegee Section> The squeegee unit 3213 is configured to expand the sheet member W2 and then press the wafer W1 from the Z2 direction to further divide the wafer W1 along the modified layer. Specifically, the squeegee unit 3213 has a pressing unit 3213a, an X-direction moving mechanism 3213b, a Z-direction moving mechanism 3213c, and a rotating mechanism 3213d.

[0163] The pressing unit 3213a is configured to move in the Z1 direction by the Z-direction moving mechanism 3213c, and then move by the rotating mechanism 3213d and the X-direction moving mechanism 3213b while pressing the wafer W1 from the Z2 direction via the sheet member W2, thereby generating bending stress in the wafer W1 and dividing the wafer W1 along the modified layer. The pressing unit 3213a is a squeegee. The pressing unit 3213a is attached to the Z1 direction end of the rotating mechanism 3213d. The Z-direction moving mechanism 3213c is configured to move the rotating mechanism 3213d in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 3213c has, for example, a cylinder. The Z-direction moving mechanism 3213c is attached to the Z1 direction end of the X-direction moving mechanism 3213b. The X-direction moving mechanism 3213b has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder. The X-direction movement mechanism 3213b is attached to the end of the base 205 on the Z1 direction side.

[0164] In the squeegee unit 3213, after being moved in the Z1 direction by the Z-direction moving mechanism 3213c, the pressing unit 3213a presses the wafer W1 from the Z2 direction side via the sheet member W2, while the X-direction moving mechanism 3213b moves the pressing unit 3213a in the Y direction, thereby dividing the wafer W1. In addition, in the squeegee unit 3213, after the pressing unit 3213a has finished moving in the Y direction, the rotating mechanism 3213d rotates the pressing unit 3213a by 90 degrees. In addition, in the squeegee unit 3213, after being rotated 90 degrees, the X-direction moving mechanism 3213b moves the pressing unit 3213a in the X direction while the pressing unit 3213a presses the wafer W1 from the Z2 direction side via the sheet member W2, thereby dividing the wafer W1.

[0165] (Control configuration of semiconductor wafer processing equipment) As shown in FIG. 37, semiconductor wafer processing apparatus 300 includes a first control unit 101, a second control unit 102, a third control unit 103, a fourth control unit 3104, a fifth control unit 3105, a sixth control unit 3106, a seventh control unit 3107, an eighth control unit 3108, a ninth control unit 3109, an expansion control calculation unit 3110, a handling control calculation unit 3111, a dicing control calculation unit 3112, and a memory unit 3113. The first control unit 101, the second control unit 102, the third control unit 103, the fifth control unit 3105, the sixth control unit 3106, the seventh control unit 3107, the eighth control unit 3108, the ninth control unit 3109, the expansion control calculation unit 3110, the handling control calculation unit 3111, the dicing control calculation unit 3112, and the memory unit 3113 have the same configuration as the first control unit 101, the second control unit 102, the third control unit 103, the fourth control unit 104, the fifth control unit 105, the sixth control unit 106, the seventh control unit 107, the eighth control unit 108, the expansion control calculation unit 109, the handling control calculation unit 110, the dicing control calculation unit 111, and the memory unit 112 of the first embodiment, respectively, and therefore their explanations will be omitted.

[0166] The fourth control unit 3104 is configured to control the expanding unit 3208. The fourth control unit 3104 includes a CPU and a storage unit having a ROM, a RAM, etc. The fourth control unit 3104 may include, as the storage unit, an HDD or the like that retains stored information even after the voltage is cut off.

[0167] (Semiconductor chip manufacturing process) The overall operation of the semiconductor wafer processing apparatus 300 will now be described with reference to FIGS.

[0168] Steps S1 to S6, step S8, and step S11 are the same as steps S1 to S6, step S8, and step S11 in the semiconductor chip manufacturing process of the first embodiment, respectively, and therefore will not be described.

[0169] In step S307, the sheet member W2 is expanded by the expanding unit 3208. That is, the expanding ring 3281 is moved in the Z1 direction by the Z-direction moving mechanism 3282. The wafer ring structure W is moved in the Z2 direction by the Z-direction moving mechanism 214b while being held by the clamping unit 214. Then, the sheet member W2 comes into contact with the expanding ring 3281 and is pulled by the expanding ring 3281, thereby expanding. As a result, the wafer W1 is divided along the division lines (modified layers).

[0170] 39, in step S309, the heat shrink unit 211 heats and shrinks the sheet member W2, and the ultraviolet irradiation unit 212 irradiates the sheet member W2 with ultraviolet rays Ut while the clamp unit 214 rises. At this time, the air intake unit 210c sucks in air near the heated sheet member W2. In step S310, the clamp unit 214 moves the wafer ring structure W to the squeegee unit 3213. That is, the wafer ring structure W, while held by the clamp unit 214, is moved in the Y2 direction by the Y-direction movement mechanism 214c.

[0171] In step S311, after the wafer ring structure W is moved to the squeegee portion 3213, the wafer W1 is pressed by the squeegee portion 3213. As a result, the wafer W1 is further divided by the squeegee portion 3213.

[0172] (Detailed configuration of the expansion control calculation unit) The detailed configuration of the expansion control calculation unit 3110 is the same as the detailed configuration of the expansion control calculation unit 109 in the first embodiment, so a description thereof will be omitted. Note that other configurations of the second embodiment are the same as the configurations of the first embodiment, so a description thereof will be omitted.

[0173] (Effects of the second embodiment) In the second embodiment, the following effects can be obtained.

[0174] In the second embodiment, similarly to the first embodiment, the expanding device 302 includes an imaging unit 215 that captures images of the expanded state of the wafer W1 by the expanding ring 3281 at multiple timings between the expansion start time St and the expansion end time Ed of the sheet member W2. This makes it possible to prevent the wafer W1 from being divided into multiple semiconductor chips Ch. Note that other effects of the second embodiment are similar to those of the first embodiment, and therefore description thereof will be omitted.

[0175] [Third embodiment] 40 to 42, the configuration of a semiconductor wafer processing apparatus 400 according to the third embodiment will be described. Unlike the first embodiment, the third embodiment includes an expanding apparatus 402 that includes both an imaging unit 4215 and a nitrogen supply unit 4217. Note that in the third embodiment, detailed description of the same configuration as in the first embodiment will be omitted.

[0176] (Semiconductor wafer processing equipment) As shown in FIG. 40, a semiconductor wafer processing apparatus 400 is an apparatus for processing a wafer W1 provided on a wafer ring structure W.

[0177] The semiconductor wafer processing apparatus 400 is equipped with a dicing apparatus 1 and an expanding apparatus 402. The vertical direction is the Z direction, the upward direction is the Z1 direction, and the downward direction is the Z2 direction. The horizontal direction perpendicular to the Z direction in which the dicing apparatus 1 and the expanding apparatus 402 are lined up is the X direction, the X1 direction is the expanding apparatus 402 side of the X direction, and the X2 direction is the dicing apparatus 1 side of the X direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction.

[0178] (dicing equipment) The dicing device 1 is configured to form a modified layer by irradiating the wafer W1 with a laser having a wavelength that is transparent to the wafer W1 along the dividing lines (streets).

[0179] Specifically, the dicing device 1 includes a base 11, a chuck table unit 12, a laser unit 13, and an imaging unit .

[0180] (Expanding device) As shown in FIGS. 40 and 41, the expanding apparatus 402 is configured to divide the wafer W1 into a plurality of semiconductor chips Ch.

[0181] The expansion device 402 includes a base 201, a cassette section 202, a lift-up hand section 203, a suction hand section 204, a base 205, a cold air supply section 206, a cooling unit 207, an expansion section 208, a base 209, an expansion maintenance member 4210, a heat shrink section 211, an ultraviolet irradiation section 212, a squeegee section 213, a clamp section 214, an imaging section 4215, an alarm section 216, and a nitrogen supply section 4217.

[0182] <Expansion maintenance member> As shown in FIG. 40, the expansion-retaining member 4210 has a pressure ring portion 4210a and a lid portion 210b.

[0183] The pressing ring portion 4210a has an air release hole 4211a. The air release hole 4211a is a hole that allows oxygen inside the expansion-retaining member 4210 to flow out using nitrogen supplied from the nitrogen supply portion 4217. The air release hole 4211a penetrates the pressing ring portion 4210a in the radial direction. The air release hole 4211a is formed on the Z2 direction side of the pressing ring portion 4210a.

[0184] A through-hole 1210b penetrating in the Z direction is formed in the lid portion 210b. The through-hole 1210b is formed in the center portion of the lid portion 210b in the radial direction of the pressing ring portion 4210a. An imaging unit 4215 is disposed inside the through-hole 1210b. A nitrogen supply unit 4217 is attached to the edge portion of the through-hole 1210b on the Z1 direction side. The through-hole 1210b is covered by the nitrogen supply unit 4217.

[0185] <Imaging unit> The imaging unit 4215 is configured to capture an image of the expanded state of the wafer W1 of the wafer ring structure W held by the clamp unit 214. Here, the imaging unit 4215 is a fisheye camera having an angle of view that allows the imaging of the entire wafer W1 in the expanded state from the Z1 direction side.

[0186] <Nitrogen supply unit> As shown in Figures 40 and 41, the nitrogen supply unit 4217 is configured to flow nitrogen into the space within the expansion maintenance member 4210 immediately before ultraviolet irradiation by the ultraviolet irradiation unit 212, so that oxygen is not supplied to the portion of the sheet member W2 where the adhesive strength is to be reduced during ultraviolet irradiation by the ultraviolet irradiation unit 212.

[0187] Nitrogen supply unit 4217 includes a first mounting member 4217a, a second mounting member 4217b, a third mounting member 4217c, and a nitrogen supply hose 4217d.

[0188] The first mounting member 4217a is attached to the edge of the through-hole 1210b on the Z1-direction surface of the cover portion 4210b of the expansion retaining member 4210. The first mounting member 4217a has an X-shape when viewed from the Z1-direction side. The imaging unit 4215 is attached to the center of the Z2-direction surface of the first mounting member 4217a with multiple (four) screws 4217e.

[0189] The second mounting member 4217b is attached to the surface of the first mounting member 4217a on the Z1 direction side. The second mounting member 4217b has a circular ring shape when viewed from the Z1 direction side. The second mounting member 4217b is a spacer that forms a space between the first mounting member 4217a and the third mounting member 4217c for allowing nitrogen supplied from the nitrogen supply hose 4217d to flow in.

[0190] 40 and 42, the third mounting member 4217c is attached to the surface of the second mounting member 4217b on the Z1 direction side. The second mounting member 4217b has a circular shape when viewed from the Z1 direction side. The third mounting member 4217c is a cover that covers the through-hole 1210b from the Z1 direction side.

[0191] Here, the first attachment member 4217a, the second attachment member 4217b, and the third attachment member 4217c are all attached to the edge portion of the through-hole 1210b of the cover portion 210b on the Z1 direction side by a plurality of (four) screws 4217f.

[0192] The nitrogen supply hose 4217d is configured to supply nitrogen to the space inside the expansion maintaining member 4210 through the space between the first mounting member 4217a and the third mounting member 4217c. The nitrogen supply hose 4217d is attached to the center of the third mounting member 4217c in the horizontal direction via a hose joint 4217g. The nitrogen supply hose 4217d is connected to a nitrogen supply source (not shown).

[0193] In this way, oxygen in the expansion-maintaining member 4210 is expelled by nitrogen through the air release holes 4211a, and therefore oxygen is not supplied to the portion of the sheet member W2 where the adhesive strength is to be reduced during ultraviolet irradiation, and therefore the adhesive strength of the sheet member W2 can be reduced by ultraviolet irradiation from the ultraviolet irradiation unit 212. Note that other configurations of the third embodiment are similar to those of the first embodiment, and therefore description thereof will be omitted.

[0194] (Effects of the third embodiment) In the third embodiment, the following effects can be obtained.

[0195] In the third embodiment, as in the first embodiment, the expanding device 402 includes an imaging unit 4215 that captures images of the expanded state of the wafer W1 by the expanding ring 281 at multiple times between the expansion start time St and the expansion end time Ed of the sheet member W2. This makes it possible to prevent the wafer W1 from being divided into multiple semiconductor chips Ch. Note that other effects of the third embodiment are similar to those of the first embodiment, and therefore description thereof will be omitted.

[0196] [Variations] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, not by the description of the above embodiments, and includes all modifications (variations) within the meaning and scope of the claims.

[0197] For example, in the above-described first to third embodiments, the imaging unit 215 (4215) captures an image of the sheet member W2 expanded by the expand ring 281 (3281), but the present invention is not limited to this. In the present invention, as in the modified example shown in FIGS. 43 and 44, the imaging unit 215 (4215) may capture a captured image Ps1 and a captured image Ps2 before and after the squeegee unit 213 (3213) presses the wafer W1. Here, the captured image Ps1 is an image captured by the imaging unit 215 (4215) before the wafer W1 is pressed. Furthermore, the captured image Ps2 is an image captured by the imaging unit 215 (4215) after the wafer W1 is pressed. That is, the expanding device 2 (302, 402) is disposed below the imaging unit 215 (4215) and includes a squeegee unit 213 (3213) that locally presses the wafer W1 from below after the sheet member W2 is expanded by the expand ring 281 (3281). The imaging unit 215 (4215) captures an image before the squeegee unit 213 (3213) locally presses the wafer W1 after the expand ring 281 (3281) expands the sheet member W2, and also captures an image after the squeegee unit 213 (3213) locally presses the wafer W1. This makes it possible to obtain the number of semiconductor chips Ch divided by the pressure of the squeegee unit 213 (3213) from the captured image Ps1 taken by the imaging unit 215 (4215) before the wafer W1 is locally pressed by the squeegee unit 213 (3213) and the captured image Ps2 taken by the imaging unit 215 (4215) after the wafer W1 is locally pressed by the squeegee unit 213 (3213).

[0198] In the above first to third embodiments, an example was shown in which the imaging unit 215 (4215) is configured to capture a video including a plurality of captured images, but the present invention is not limited to this. In the present invention, the imaging unit may be configured to perform high-speed imaging including a plurality of captured images. That is, the imaging unit captures the expanded state of the wafer by the expanding ring from the start of expansion of the sheet member to the end of expansion using high-speed imaging, capturing a plurality of captured images at multiple consecutive timings that are shorter than those used in normal video imaging. In this way, by performing high-speed imaging using the imaging unit, the expanded state of the wafer from the start of expansion of the sheet member to the end of expansion can be obtained in detail, and the timing at which the multiple semiconductor chips are separated can be obtained in more detail.

[0199] In the first to third embodiments, the imaging unit 215 (4215) is configured to capture a moving image including a plurality of captured images captured at each of a plurality of consecutive timings, but the present invention is not limited to this. In the present invention, the imaging unit may intermittently capture a plurality of captured images as still images.

[0200] In the above first to third embodiments, an example has been shown in which the imaging unit 215 (4215) is attached to the expansion-retaining member 210 (4210), but the present invention is not limited to this. In the present invention, the imaging unit may be attached to the upper base of the expanding device.

[0201] In the above first to third embodiments, the imaging unit 215 is attached to the cover portion 210b of the expansion-retaining member 210 (4210), but the present invention is not limited to this. In the present invention, the imaging unit may be attached to the pressing ring portion.

[0202] In the above first to third embodiments, the imaging unit 215 is attached to the center of the cover portion 210b of the expansion maintaining member 210 (4210) by way of example, but the present invention is not limited to this. In the present invention, the imaging unit may be attached to a location other than the center of the cover portion.

[0203] In the first to third embodiments, the expansion-retaining member 210 (4210) has the cover portion 210b, but the present invention is not limited to this. In the present invention, the expansion-retaining member does not have to have a cover portion.

[0204] In the first to third embodiments, the notification unit 216 is a display unit that notifies the user of an abnormality in the expanded state of the wafer W1 by displaying it on a screen, but the present invention is not limited to this. In the present invention, instead of notifying the user of an abnormality in the expanded state of the wafer by the notification unit, the abnormality in the expanded state of the wafer may be recorded in a memory unit.

[0205] In the above first to third embodiments, an example was shown in which the expansion control calculation unit 109 (3110) is configured to perform control to detect a semiconductor chip Ch divided on the wafer W1 when the outer shape of the semiconductor chip Ch in a plan view matches the shape of the semiconductor chip Ch divided on the wafer W1 in a plurality of captured images captured by the imaging unit 215, but the present invention is not limited to this. In the present invention, the expansion control calculation unit may be configured to perform control to detect divided semiconductor chips by acquiring the distance between adjacent detected semiconductor chips based on the horizontal position coordinates, inclination, and dimensions of the detected semiconductor chip.

[0206] In the first to third embodiments, the expanding device 2 (302, 402) includes the squeegee unit 213 (3213), but the present invention is not limited to this. In the present invention, the expanding device does not necessarily include the squeegee unit.

[0207] In addition, in the above first to third embodiments, for convenience of explanation, an example has been shown in which the control processing of the expansion control calculation unit 109 (3110) is explained using a flow-driven flowchart in which processing is performed sequentially according to a processing flow, but the present invention is not limited to this. In the present invention, the control processing of the expansion control calculation unit may be performed by event-driven processing in which processing is performed on an event-by-event basis. In this case, the control processing may be performed completely event-driven, or may be performed by combining event-driven and flow-driven processing. [Explanation of symbols]

[0208] 2, 302, 402 Expanding device 12b Clamp part 210, 4210 Expansion retention member 210a, 4210a Pressing ring part 210b Lid 210d Z-direction movement mechanism (movement mechanism for components) 212 Ultraviolet irradiation unit 213, 3213 Squeegee part 214 Clamp section 214b Z-direction movement mechanism (clamp movement mechanism) 215,4215 Imaging unit 216 Information Department 281, 3281 Expanding Ring 281a, 3281a (of the expansion ring) upper end 1210a (Inside of the pressure ring) Ch, Ch1, Ch2 semiconductor chips Ed Expand End Hd Predetermined height position P1 First captured image (multiple captured images) P2 Second captured image (multiple captured images) P3 Third captured image (multiple captured images) St Expand Start Ut ultraviolet light W wafer ring structure W1 wafer W2 sheet material

Claims

1. a clamping unit configured to grip a wafer ring structure including a stretchable sheet member to which a wafer to be divided along division lines to form a plurality of semiconductor chips is attached; an expand ring that divides the wafer into the plurality of semiconductor chips spaced apart from one another by expanding the sheet member while the clamping portion holds the wafer ring structure; an imaging unit that images an expanded state of the wafer by the expanding ring at a plurality of timings from the start of expanding the sheet member to the end of expanding the sheet member; and a control unit that performs control to detect that the semiconductor chip has been divided in the image taken just before the expansion is completed, based on the images taken by the imaging unit at the multiple timings, or to detect that the wafer has not been divided from the outside to the inside of the wafer.

2. A clamping section for gripping a wafer ring structure including a stretchable sheet member to which a wafer to be divided along a dividing line to form a plurality of semiconductor chips is attached; an expand ring that divides the wafer into the plurality of semiconductor chips spaced apart from one another by expanding the sheet member while the clamping portion holds the wafer ring structure; an imaging unit that images an expanded state of the wafer by the expanding ring at a plurality of timings from the start of expanding the sheet member to the end of expanding the sheet member, an expansion maintaining member for maintaining the expanded state of the sheet member near the wafer; An expanding device, wherein the imaging unit is attached to the expansion-maintaining member.

3. The expanding device according to claim 1 or 2, wherein the imaging unit captures the expanded state of the wafer by the expanding ring by video imaging including a plurality of captured images taken at each of the plurality of consecutive timings from the start of expansion of the sheet member to the end of expansion.

4. The expansion retention member is a cylindrical pressing ring portion disposed so as to surround the wafer; a lid portion provided to cover the The expanding device according to claim 2 , wherein the imaging unit is attached to the cover portion of the expansion-maintaining member.

5. The expanding device according to claim 4 , wherein the imaging unit is disposed at a center of the lid portion in a radial direction of the pressing ring portion.

6. Further comprising a member moving mechanism for moving the expansion-retaining member in an up-down direction, The expanding device according to claim 2 , wherein the imaging unit images the expanded state of the wafer by the expanding ring when the expansion maintaining member lowered by the member moving mechanism covers the wafer.

7. an ultraviolet irradiation unit that is arranged below the imaging unit and irradiates ultraviolet rays from below onto the sheet member in an expanded state; The expansion device described in claim 4, wherein the expansion maintenance member covers the wafer from above with the cylindrical pressing ring portion and the lid portion so that ultraviolet light irradiated from the ultraviolet irradiation portion onto the sheet member does not leak out from the expansion maintenance member to the outside.

8. The expanding device according to claim 1 or 2, further comprising a notification unit that notifies an abnormality in the expanded state of the wafer based on an image of the expanded state of the wafer taken by the imaging unit.

9. Further provided is a clamp moving mechanism that moves the clamp unit in the up and down direction, The sheet member is expanded by moving the clamp portion downward using the clamp moving mechanism while the upper end of the expand ring is positioned at a predetermined height in the vertical direction, The expanding device according to claim 1 or 2, wherein the imaging unit images the state of the wafer expanded by the expanding ring with its upper end positioned at the predetermined height position.

10. a squeegee unit that is arranged below the imaging unit and that locally presses the wafer from below after the sheet member is expanded by the expand ring; The expanding device according to claim 1 or 2, wherein the imaging unit takes an image before the squeegee unit locally presses the wafer after the sheet member is expanded by the expanding ring, and takes an image after the squeegee unit locally presses the wafer.

11. a step of irradiating a wafer having a plurality of semiconductor chips with laser light from a laser irradiation unit that irradiates the laser light, thereby forming a modified layer in the wafer; a step of dividing the wafer into the plurality of individual semiconductor chips by expanding the sheet member with an expanding ring while a clamp unit grips the wafer ring structure, the expanding ring including the stretchable sheet member to which the wafer is attached, and capturing images of the expanded state of the wafer by the expanding ring at multiple timings from the start to the end of the expansion of the sheet member; and detecting that the semiconductor chip has been divided in the image taken just before the expansion is completed, based on the images taken by the imaging unit at the multiple timings, or detecting that the wafer has not been divided from the outside to the inside of the wafer.

12. a clamping unit that grips a wafer ring structure including an elastic sheet member to which a wafer is attached that will be divided along dividing lines to form a plurality of semiconductor chips; an expanding ring that divides the wafer into the plurality of semiconductor chips spaced apart from one another by expanding the sheet member while the clamping unit grips the wafer ring structure; an imaging unit that images the expanded state of the wafer by the expanding ring at multiple timings from the start of expansion of the sheet member to the end of expansion; and a control unit that detects that the semiconductor chips have been divided in the image just before the end of expansion based on the images taken by the imaging unit at the multiple timings, or that the wafer has not been divided from the outside to the inside of the wafer.

Images