Metal card with insert coil and manufacturing method thereof

Abstract

The metal card according to an embodiment of the present invention includes an antenna layer, a wireless IC chip having a chip coil for wireless communication with the antenna layer built therein, and an insert coil structure for supporting the wireless IC chip. The insert coil structure is fitted into an upper portion of a support body adjacent to the chip coil, and includes an insert coil in which a path is formed to transmit a wireless signal of the chip coil to an antenna coil of the antenna layer by wire.

Description

[Technical Field]

[0001] The present invention relates to a metal card and a manufacturing method thereof. More specifically, the present invention relates to a metal card including an insert coil and a manufacturing method thereof. [Background technology]

[0002] Generally, credit cards can not only be used in place of cash, but in recent years have been developed as smart cards with built-in IC chips that can store large amounts of information, and are actively used not only for payment but also as various membership cards.

[0003] In this smart card market, efforts are being made to develop special cards using a variety of materials, especially to develop differentiated metal credit cards for VIP customers, and metal cards have been offered to special customers as high-quality credit cards with a metallic luster.

[0004] However, due to the characteristics of metal, conventional metal cards often have limitations on RF functionality and use with automated teller machines (ATMs), as the antenna is difficult to operate when communicating with a reader device in a contactless manner.

[0005] More specifically, in conventional metal cards, due to the characteristics of metal, interference occurs between the wireless antenna coil of the wireless IC chip and each metal, causing communication problems in the antenna and reducing the efficiency of data transmission and reception through the antenna.

[0006] To prevent this phenomenon, which would result in a decrease in the transmission and reception efficiency of the metal card's antenna, a method has been proposed in which a shielding layer is placed between each metal, and an intermediate coil such as a wireless booster coil is provided to increase the antenna's transmission and reception efficiency, and this is linked to the wireless antenna coil of the wireless IC chip.

[0007] As described above, a metal card of the previously proposed method provided with a wireless booster coil is configured such that, inside the metal card, the wireless booster coil and the wireless antenna coil of the IC chip are separated by a certain distance and are inductively connected to the antenna layer. However, it is by no means easy to adjust the distance between the wireless booster coil and the wireless antenna coil of the IC chip during manufacturing. As a result, communication between the wireless booster coil and the IC chip is not smoothly performed depending on the separation distance between them, and there is a problem that it becomes difficult to operate the metal card.

[0008] As a result, even if a wireless booster coil is utilized, in the non-contact communication of the metal card with the current technology, there still remains a problem that the sensitivity of the antenna decreases and the efficiency of transmitting and receiving antenna data decreases, resulting in a limitation in the RF function. Summary of the Invention Problems to be Solved by the Invention

[0009] The present invention was created to solve the above problems. By incorporating an insert coil that communicates wirelessly with the wireless IC chip into an insert coil structure that supports the wireless IC chip, and configuring a part of the insert coil to be connected to the antenna coil of the antenna layer by wire, it is an object of the present invention to provide a metal card and a manufacturing method that can achieve both an improvement in the antenna sensitivity of the metal card and an improvement in the efficiency of transmitting and receiving antenna data. Means for Solving the Problems

[0010] In order to solve the above problems, a metal card with an insert coil according to an embodiment of the present invention comprises an antenna layer, a wireless IC chip having a built-in chip coil for wireless communication with the antenna layer, and an insert coil structure supporting the wireless IC chip, wherein the insert coil structure comprises an insert coil inserted into an upper part of a support body adjacent to the chip coil and having a path formed to transmit a wireless signal from the chip coil to the antenna coil of the antenna layer via a wired connection.

[0011] To solve the above problems, a method for manufacturing a metal card having an insert coil according to an embodiment of the present invention includes the steps of: forming a metal card body by stacking a metal layer, an electromagnetic wave shielding layer, and an antenna layer in this order; milling an insert coil structure receiving portion so that the antenna coil of the antenna layer is exposed in a certain region of the metal card body; milling a through hole in a previously prepared insert coil structure; inserting the processed insert coil structure into the insert coil structure receiving portion; and inserting a wireless IC chip into an upper part of a support body of the insert coil structure. [Effects of the Invention]

[0012] According to an embodiment of the present invention, the antenna sensitivity of the metal card can be improved by providing an insert coil, thereby increasing the data transmission and reception efficiency of the antenna.

[0013] As a result, according to an embodiment of the present invention, a metal card and a manufacturing method thereof can be provided that can achieve both improved antenna sensitivity of the metal card and improved data transmission and reception efficiency of the antenna, by connecting a portion of the insert coil to the antenna coil of the antenna layer by wire via a through hole formed vertically to a depth from the insert coil built into the insert coil structure that supports the wireless IC chip to the bottom of the support body of the insert coil structure and a contact pad attached to the through hole. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is an exploded perspective view of a metal card including an insert coil according to an embodiment of the present invention. FIG. [Figure 2] 1A and 1B are diagrams illustrating the structure of an antenna layer according to an embodiment of the present invention. [Figure 3] 1A and 1B are diagrams for explaining upper and lower patterns of an insert coil according to an embodiment of the present invention. [Figure 4] 1 is a side cross-sectional view of a metal card equipped with an insert coil according to an embodiment of the present invention. [Figure 5] 1 is a process flow diagram illustrating a method for manufacturing a metal card including an insert coil according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0015] The following merely illustrates the principles of the present invention. Therefore, those skilled in the art will be able to devise various devices and methods that embody the principles of the present invention and are within the concept and scope of the present invention, even though not explicitly described or shown herein. It should be understood that all conditional terms and embodiments listed herein are, in principle, expressly intended only for the purpose of helping the concept of the present invention to be understood, and are not limiting to the embodiments and conditions specifically listed in this specification.

[0016] For example, throughout this specification, when a certain part is said to be "connected" to another part, this includes not only the case where they are "directly connected" but also the case where they are "indirectly connected" via another member therebetween. Furthermore, when a certain part is said to "include" a certain component, this does not exclude other components, and means that it may further include other components, unless otherwise specified.

[0017] Moreover, all detailed descriptions reciting specific embodiments, as well as principles, aspects, and embodiments of the present invention, should be understood to be intended to encompass structural and functional equivalents of such items, including not only currently known equivalents but also equivalents developed in the future, i.e., any elements invented to perform the same function, regardless of structure.

[0018] The above-mentioned objects, features, and advantages will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, which will enable those skilled in the art to easily implement the technical concept of the present invention. Note that, in implementing the present invention, if it is deemed that a detailed description of known technologies related to the present invention may obscure the gist of the present invention, the detailed description will be omitted.

[0019] FIG. 1 is an exploded perspective view of a metal card equipped with an insert coil according to an embodiment of the present invention.

[0020] Referring to FIG. 1, a metal card 100 according to an embodiment of the present invention may include an antenna layer 160, a wireless IC chip 110 having a built-in chip coil for wireless communication with the antenna layer 160, and an insert coil structure 120 supporting the wireless IC chip 110.

[0021] In addition, an insert coil may be inserted into the upper part of the support body of the insert coil structure 120 adjacent to the chip coil, and the insert coil may have a path formed therein to transmit the wireless signal of the chip coil to the antenna coil of the antenna layer 160 via a wired connection.

[0022] The metal card 100 may have a body formed by stacking the antenna layer 160, the electromagnetic wave shielding layer 150, and the metal layer 140 in this order.

[0023] Here, in order to accommodate the insert coil structure 120, the metal card body may be opened in a certain area of ​​the metal card body to a depth up to the location where the antenna coil of the antenna layer 160 is exposed, thereby forming insert coil structure accommodating portions 141, 151.

[0024] An epoxy sheet 170 may be disposed on the lower surface of the antenna layer 160, and a print sheet 180 may be disposed on the lower surface of the epoxy sheet 170.

[0025] Here, the epoxy sheet 170 can be manufactured using an epoxy material that is highly heat resistant and difficult to bend, and can reduce distortion of the metal card 100, thereby improving the precision and uniformity of the product, and the print sheet 180 may be formed with magnetic or user information printed on it.

[0026] FIG. 2 is a diagram for explaining the structure of the antenna layer according to an embodiment of the present invention, and FIG. 3 is a diagram for explaining the upper and lower patterns of the insert coil according to an embodiment of the present invention.

[0027] Referring to FIG. 2, the structure of the antenna layer 160 according to the embodiment of the present invention may be such that the antenna coil of the antenna layer 160 is wound around the outer edge region of the antenna layer 160.

[0028] The insert coil structure receiving portion 151 may be formed by opening a certain area of ​​the antenna layer 160 to a depth up to where the antenna coil is exposed in order to receive the insert coil structure 120.

[0029] As a result, the insert coil structure accommodating portion 151 accommodates the insert coil structure 120, and the insert coil structure 120 can support the wireless IC chip 110 for wireless communication with the antenna layer 160.

[0030] Here, the wireless IC chip 110 may have a built-in chip coil for wireless communication with the antenna layer 160, and an insert coil may be built into the upper part of the support body of the insert coil structure 120 adjacent to the chip coil.

[0031] The insert coil may also be a path formed to transmit the wireless signal of the chip coil to the antenna coil of the antenna layer 160 by wire.

[0032] Therefore, the wireless IC chip 110 supported by the insert coil structure 120 can communicate with the antenna layer 160 wirelessly.

[0033] FIG. 3(a) is a diagram showing an upper pattern of the insert coil 121 when the insert coil structure 120 according to the embodiment of the present invention is fitted into the insert coil structure receiving portion.

[0034] Referring to FIG. 3(a), the insert coil 121 according to an embodiment of the present invention may be inserted into the upper part of the support body of the insert coil structure 120 adjacent to the chip coil, with a path formed to transmit the wireless signal of the chip coil to the antenna coil of the antenna layer 160 via a wired connection.

[0035] Here, a through hole may be formed vertically so that a portion of the insert coil 121 is electrically connected to the antenna coil of the antenna layer 160, and the through hole may include a first through hole 125 and a second through hole 126.

[0036] More specifically, the first through-hole 125 may be formed vertically to a depth of the lower part of the support body at one end of the insert coil 121 adjacent to the upper part of the support body.

[0037] Also, the second through-hole 126 may be formed vertically at the other end of the insert coil 121 to a depth reaching the bottom of the support body.

[0038] Here, the first through-hole 125 and the second through-hole 126 may be formed vertically from a conductive material so that a portion of the insert coil 121 is electrically connected to the antenna coil of the antenna layer 160. For example, the conductive material may be metal itself, or may be an electrically conductive plastic, a conductive adhesive, or other conductive polymer material.

[0039] For example, the first through hole 125 and the second through hole 126 may be formed by plating the inside of the first through hole 125 and the second through hole 126 with copper, iron, aluminum, gold, or silver, which have excellent electrical conductivity, or may be formed by applying an anisotropic conductive film or other conductive adhesive or a resin solution of a conductive polymer material containing metal powder, which then hardens and solidifies over time.

[0040] FIG. 3(b) is a diagram showing a lower pattern of the insert coil 121 when the insert coil structure 120 according to the embodiment of the present invention is fitted into the insert coil structure receiving portion.

[0041] Referring to FIG. 3(b), the first through hole 125 and the second through hole 126 may be formed vertically from the insert coil 121 inserted into the upper part of the support body of the insert coil structure 120 to the lower part of the support body.

[0042] Here, a contact pad may be disposed on the lower part of the support body so that a portion of the insert coil 121 is electrically connected to the antenna coil of the antenna layer 160 through the first through-hole 125 and the second through-hole 126.

[0043] More specifically, the contact pads may include a first contact pad 131 and a second contact pad 132, and the first contact pad 131 may be attached to the first through hole 125 so that one end of the insert coil 121 is electrically connected to the antenna coil.

[0044] The second contact pad 132 may be attached to the second through-hole 126 so that the other end of the insert coil 121 is electrically connected to the antenna coil.

[0045] Furthermore, if moisture or dust enters the remaining space inside the first through hole 125 and the second through hole 126, it may cause an operational error in the metal card 100, so to prevent this, either a conductive material or a non-conductive material may be filled in.

[0046] For example, the remaining space inside the first through-hole 125 and the second through-hole 126 may be filled with a conductive material or an electrically conductive adhesive (ECA), or if it has sufficient electrical conductivity, it may be filled with a non-conductive plastic material such as polyvinyl chloride (PVC) material to reduce weight.

[0047] FIG. 4 is a side cross-sectional view of a metal card equipped with an insert coil according to an embodiment of the present invention.

[0048] Referring to FIG. 4, the metal card 100 may have a metal card body formed by stacking a metal layer 140, an electromagnetic wave shielding layer 150, and an antenna layer 160 in this order, and an insert coil structure 120 supporting a wireless IC chip 110 may be inserted into the metal card body.

[0049] Here, in order to accommodate the insert coil structure 120, the metal card body may open a certain area of ​​the metal card body to a depth up to the portion of the antenna layer 160 where the antenna coil is exposed, thereby forming insert coil structure accommodating portions 141 and 151.

[0050] An insert coil structure 120 supporting a wireless IC chip 110 may be inserted into the insert coil structure accommodating portion 141, 151, and the wireless IC chip 110 may have a chip coil 111 built in for wireless communication with the antenna layer 160.

[0051] Here, an upper adhesive sheet made of a thermoplastic resin may be applied between the chip coil 111 and an upper part of the support body of the insert coil structure 120 adjacent to the chip coil 111 .

[0052] An insert coil 121 having a path formed therein may be inserted into the upper portion of the support body so that a wireless signal from the chip coil 111 can be transmitted to the antenna coil of the antenna layer 160 via a wire.

[0053] In addition, a first through-hole 125 and a second through-hole 126 may be formed vertically from a conductive material so that a portion of the insert coil 121 is electrically connected to the antenna coil of the antenna layer 160 .

[0054] The first through-hole 125 and the second through-hole 126 may be formed vertically to a depth from the insert coil 121 inserted into the upper part of the support body of the insert coil structure 120 to the lower part of the support body.

[0055] Here, a contact pad may be attached to the lower part of the support body so as to be connected to the first through-hole 125 and the second through-hole 126 by wire, and a portion of the insert coil 121 may be electrically connected to the antenna coil of the antenna layer 160.

[0056] More specifically, the contact pads may include a first contact pad 131 and a second contact pad 132, and the first contact pad 131 may be vertically connected to the first through hole 125 so that one end of the insert coil 121 is electrically connected to the antenna coil.

[0057] The second contact pad 132 may be connected perpendicularly to the second through hole 126 so that the other end of the insert coil 121 is electrically connected to the antenna coil.

[0058] Here, the contact pads including the first contact pad 131 and the second contact pad 132 may have a lower adhesive sheet made of a thermoplastic resin applied to a bonding area with the insert coil structure 120 .

[0059] In an embodiment of the present invention, the upper adhesive sheet and the lower adhesive sheet may be hot melt sheets.

[0060] Here, the hot melt sheet is melted by heating, and materials such as thermoplastic resins have the characteristic of solidifying when cooled after being heated and melted, so such materials can be used as a film-shaped hot melt adhesive.

[0061] In one embodiment, the upper adhesive sheet and the lower adhesive sheet may be adhesive sheets that take into consideration the adhesive strength of the bonding area between the chip coil 111 built into the wireless IC chip 110 and the insert coil structure 120 and the bonding area between the insert coil structure 120 and the contact pads 131, 132.

[0062] Furthermore, the upper and lower adhesive sheets are made of a material suitable for metal materials, unlike adhesives used for plastic sheets, to realize hot melt sheets.

[0063] In order for the wireless IC chip 110 to perform wireless communication with the antenna coil of the antenna layer 160, a portion of the insert coil 121 is vertically connected to the contact pads 131, 132 via the through holes 125, 126, thereby achieving efficient wireless communication sensitivity for the metal card 100.

[0064] As shown in FIG. 4, the insert coil 121 may be fixed so as to be in close contact with the wireless IC chip 110 at a very close distance, thereby significantly improving the communication sensitivity between the insert coil 121 and the wireless IC chip 110.

[0065] That is, in the case of conventional technology, a wireless booster coil or the like is arranged at a position approximately at the lower layer of the molding position where the wireless IC chip is housed, and therefore the communication performance and sensitivity are reduced, whereas the insert coil 121 according to the embodiment of the present invention is fixed in close contact with the wireless IC chip 110 at a very close distance, and is formed to have high communication performance and sensitivity.

[0066] Furthermore, since the transmission and reception signals of the insert coil 121 according to the embodiment of the present invention are directly connected to the antenna layer 160 located below by a wired connection, direct communication can be performed between the wireless IC chip 110 and the antenna layer 160 without a separate induction process of wireless signals between the wireless booster coil and the antenna layer. Therefore, since there is no separate interference or obstruction of wireless signals, efficient communication performance can be maintained between the antenna layer 160 and the wireless IC chip 110.

[0067] Furthermore, the insert coil structure 120 is formed in a shape that supports the wireless IC chip 110, which has the advantage of making it easy to attach the wireless IC chip 110 while also improving communication performance.

[0068] FIG. 5 is a process flow diagram illustrating a method for manufacturing a metal card equipped with an insert coil according to an embodiment of the present invention.

[0069] First, a metal layer 140, an electromagnetic wave shielding layer 150, and an antenna layer 160 are laminated in this order to form a metal card body (S101).

[0070] Then, a receiving portion for the insert coil structure is milled so that the antenna coil of the antenna layer is exposed in a predetermined region of the metal card body (S103).

[0071] Thereafter, through holes are milled in the insert coil structure prepared in advance (S105).

[0072] Here, a first through hole 125 may be formed vertically to a depth reaching the bottom of the support body at one end of the insert coil 121 adjacent to the top of the support body of the insert coil structure 120 into which the wireless IC chip 110 is inserted, by milling.

[0073] Also, a second through-hole 126 may be milled at the other end of the insert coil 122, extending vertically to the bottom of the support body.

[0074] Then, the processed insert coil structure is fitted into the insert coil structure receiving portion (S107).

[0075] Here, the through holes 125 and 126 formed deep to the bottom of the support body may be connected to the contact pads 131 and 132 by wires, and may be electrically connected to the antenna coil of the antenna layer 160.

[0076] More specifically, the insert coil 121 may be electrically connected to the antenna coil of the antenna layer 160 by wire via a first contact pad 131 attached to the first through hole 125.

[0077] The insert coil 121 may be electrically connected to the antenna coil of the antenna layer 160 by wire via a second contact pad 132 attached to the second through-hole 126 .

[0078] Also, a thermoplastic resin may be applied to the bonding areas between the contact pads 131 and 132 and the insert coil structure 120 to form a lower adhesive sheet.

[0079] An insert coil 121 having a path formed therein may be inserted into the upper part of the support body of the insert coil structure 120 to transmit the wireless signal of the chip coil 111 to the antenna coil of the antenna layer 160 via a wire.

[0080] Thereafter, a wireless IC chip is fitted into the upper part of the support body of the insert coil structure, and a first press process is performed (S109).

[0081] Here, a thermoplastic resin may be applied between the upper portion of the support body of the insert coil structure 120 adjacent to the chip coil 111 and the chip coil 111 to form an upper adhesive sheet.

[0082] While preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the specific embodiments described above, and it goes without saying that various modifications can be made by a person having ordinary skill in the art to which the invention pertains without departing from the gist of the present invention as claimed in the claims, and these modified embodiments should not be understood individually from the technical ideas and perspectives of the present invention.

Claims

1. In metal cards, an antenna layer; a wireless IC chip having a built-in chip coil for wireless communication with the antenna layer; an insert coil structure supporting the wireless IC chip; Equipped with The insert coil structure includes: a wireless metal card including an insert coil fitted into an upper part of the support body adjacent to the chip coil, the insert coil having a path formed therein for transmitting a wireless signal from the chip coil to the antenna coil of the antenna layer by wire;

2. The wireless metal card according to claim 1 , further comprising a through-hole formed vertically from a conductive material such that a portion of the insert coil is electrically connected to the antenna coil of the antenna layer.

3. The through hole is a first through-hole formed vertically to a depth reaching a lower portion of the support body at one end of the insert coil adjacent to an upper portion of the support body into which the wireless IC chip is inserted; a second through-hole formed vertically at the other end of the insert coil to a depth reaching a lower portion of the support body; The wireless metal card of claim 2 , comprising:

4. The insert coil structure includes: The wireless metal card according to claim 3 , further comprising a contact pad on a lower portion of the support body, the contact pad being connected to the through hole by a wire and electrically connected to the antenna coil of the antenna layer.

5. The contact pads are a first contact pad attached to the first through hole so that the insert coil is electrically connected to the antenna coil; a second contact pad attached to the second through hole so that the insert coil is electrically connected to the antenna coil; The wireless metal card of claim 4 , comprising:

6. 5. The wireless metal card according to claim 4, further comprising a lower adhesive sheet formed by applying a thermoplastic resin to a bonding area between the contact pad and the insert coil structure.

7. The wireless metal card according to claim 1 , further comprising an upper adhesive sheet formed by applying a thermoplastic resin between the chip coil and an upper portion of the support body adjacent to the chip coil.

8. The metal card is a metal card body formed by laminating a metal layer, an electromagnetic wave shielding layer, and the antenna layer in this order; The metal card body is an insert coil structure receiving portion formed by opening a predetermined region of the metal card body to a depth corresponding to a portion of the antenna layer where the antenna coil is exposed, in order to receive the insert coil structure; The wireless metal card of claim 1 , comprising:

9. In a method for manufacturing a metal card, forming a metal card body by laminating a metal layer, an electromagnetic wave shielding layer, and an antenna layer in this order; milling an insert coil structure receiving portion so that the antenna coil of the antenna layer is exposed in a predetermined region of the metal card body; Milling a through hole in a pre-prepared insert coil structure; fitting the processed insert coil structure into the insert coil structure receiving portion; inserting a wireless IC chip into an upper portion of a support body of the insert coil structure; A method for manufacturing a wireless metal card, comprising:

10. The step of milling the through holes comprises: milling a first through-hole formed vertically to a depth reaching a lower portion of the support body at one end of the insert coil adjacent to an upper portion of the support body of the insert coil structure into which the wireless IC chip is inserted; milling a second through-hole at the other end of the insert coil, the second through-hole being formed vertically to a depth extending to a lower portion of the support body; The method for manufacturing a wireless metal card according to claim 9, comprising:

11. The step of fitting the insert coil structure includes: the through holes formed to a depth of the lower portion of the support body are connected to contact pads by wires, thereby electrically connecting the through holes to the antenna coil of the antenna layer; a step of applying a thermoplastic resin to a bonding area between the contact pad and the insert coil structure to form a lower adhesive sheet; The method for manufacturing a wireless metal card according to claim 10, further comprising:

12. The step of connecting the insert coil structure to the antenna coil includes: electrically connecting the insert coil to the antenna coil of the antenna layer by wire via a first contact pad attached to the first through hole; electrically connecting the insert coil to the antenna coil of the antenna layer by wire via a second contact pad attached to the second through hole; The method for manufacturing a wireless metal card according to claim 11, comprising:

13. In the step of fitting the insert coil structure, 10. The method for manufacturing a wireless metal card according to claim 9, wherein an insert coil having a path formed therein is fitted into an upper portion of a support body of an insert coil structure adjacent to a chip coil built in a wireless IC chip so that a wireless signal from the chip coil is transmitted via a wire to an antenna coil of the antenna layer.

14. The step of inserting the wireless IC chip includes: The method for manufacturing a wireless metal card according to claim 13, further comprising the step of applying a thermoplastic resin between an upper portion of the support body of the insert coil structure adjacent to the chip coil and the chip coil to form an upper adhesive sheet.

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