Ethylene-based resin composition, laminate and packaging film

Abstract

To provide an ethylenic resin composition excellent in heat sealability and heat resistance, capable of filling over a wide temperature range from a low temperature to a high temperature, and capable of filling over a wide temperature range also particularly when filling at high speed, a laminate composed of using the same, and a film for packaging.SOLUTION: An ethylenic resin composition includes: an ethylenic resin (B) comprising an ethylenic resin composition (A) where the ethylenic resin composition (A) is one or more ethylene α-olefin copolymers having characteristics of MFR and a density; and an ethylenic resin (C) having characteristics of a melting point measured by MFR and differential scanning calorimetry, and produced by a radical polymerization method.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to an ethylene-based resin composition, a laminate, and a packaging film. More specifically, the present invention relates to an ethylene-based resin composition, a laminate, and a packaging film using the same, which have excellent heat-sealing properties and heat resistance and allow contents to be filled at high speed over a wide sealing temperature range from low to high. [Background technology]

[0002] Conventionally, packaging films obtained by laminating a base layer, an intermediate layer, and a sealant layer have been used to package liquids, viscous substances, and liquids, viscous substances, etc. containing solid insoluble substances such as fibers and powders. The packaging film is filled with the liquid, viscous substance, etc. and heat-sealed to provide a packaging bag. Therefore, the packaging film is required to have heat-sealing properties and heat resistance appropriate for the contents to be packaged.

[0003] In terms of heat resistance, it is generally known that polyolefins with high melting points are superior to those with low melting points. For example, in the case of polyethylene, high-density polyethylene (HDPE) is superior to low-density polyethylene (LDPE) in this respect. However, packaging films made of high-melting-point polyolefins have poor heat seal strength and low-temperature heat sealability due to their high melting points, and therefore, when it comes to the demand for faster automatic filling and packaging of liquids, viscous materials, etc., the amount of heat supplied to the sealant layer is insufficient, making it difficult to reliably perform proper heat sealing.

[0004] On the other hand, packaging films using a low-melting-point polyolefin for the sealant layer can obtain heat resistance and rigidity by increasing the thickness of the sealant layer. However, if the thickness of the sealant layer is increased, it becomes difficult to achieve proper heat sealing with a small amount of heat supplied, and the sealant layer cannot be used for high-speed automatic filling and packaging.

[0005] Many attempts have been made to solve this problem; for example, an invention has been disclosed that uses a polyethylene resin composition that satisfies specific physical properties and is made of a copolymer of ethylene and an α-olefin having 3 to 20 carbon atoms and high-pressure low-density polyethylene (see Patent Documents 1 and 2). However, in all of these attempts, the sealing temperature range in which filling is possible is narrow.

[0006] In addition, an invention has been disclosed (see Patent Document 3) that consists of a laminate having three layers: a sealant layer, an intermediate layer, and a substrate layer, and the sealant layer and the intermediate layer each use a polyethylene resin composition that satisfies specific MFR, density, and temperature-rising elution fractionation (TREF) properties; however, the low-temperature sealing property is poor.

[0007] Furthermore, an invention has been disclosed (see Patent Document 4) that uses a resin composition for extrusion lamination that satisfies specific differential scanning calorimetry (DSC) characteristics and temperature-rising elution fractionation (TREF) characteristics, but there are no specifications regarding low-crystalline components with low elution temperatures, making it difficult to control sealing in low-temperature ranges and foaming after sealing. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-204628 [Patent Document 2] Japanese Patent Application Laid-Open No. 2015-145091 [Patent Document 3] Japanese Patent Application Laid-Open No. 2016-190450 [Patent Document 4] Japanese Patent Application Publication No. 2019-104770 Summary of the Invention [Problem to be solved by the invention]

[0009] The present invention has been made in view of the above-mentioned problems associated with the prior art, and has as its object to provide an ethylene-based resin composition which is excellent in heat-sealing properties and heat resistance and can be filled over a wide temperature range from low to high temperatures, particularly during high-speed filling, and a laminate and a packaging film each using the same. [Means for solving the problem]

[0010] As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that the above-mentioned problems can be solved by using an ethylene-based resin composition comprising an ethylene-based resin composition having specific composition and physical properties, and a laminate using the ethylene-based resin composition, and have thus completed the present invention.

[0011] That is, according to a first aspect of the present invention, there is provided an ethylene-based resin composition comprising an ethylene-based resin composition (A) having the following properties, wherein the ethylene-based resin composition (A) contains an ethylene-based resin (B) and an ethylene-based resin (C), each having the following properties: Ethylene-based resin composition (A): An ethylene-based resin composition that simultaneously satisfies the following properties (A-1) to (A-3): (A-1) MFR (190°C, 21.18N load) is 1 to 15g / 10min (A-2) Density: 0.915 to 0.940 g / cm 3 (A-3) The elution curve obtained by temperature rising elution fractionation (TREF) using orthodichlorobenzene satisfies the following (i) to (iii): (i) The sample has at least one peak at an elution temperature of 85°C or lower and at least one peak at an elution temperature of 85°C or higher. (ii) The proportion of the eluted matter ((a1)+(a2)+(a3)) having an elution temperature of 85° C. or lower is 45 to 90% by weight. (iii) The proportion of the eluted substance (a4) having an elution temperature of 85°C or higher is 10 to 55% by weight. (However, the total of the proportions of (a1), (a2), (a3), and (a4) is 100% by weight.) Ethylene-based resin (B): One or more types of ethylene-α-olefin copolymers that simultaneously satisfy the following properties (B-1) and (B-2): (B-1) MFR (190°C, 21.18N load) is 1 to 18g / 10min (B-2) Density: 0.910 to 0.940 g / cm 3 Ethylene-based resin (C): An ethylene-based resin produced by a radical polymerization method that simultaneously satisfies the following properties (C-1) to (C-2): (C-1) MFR (190°C, 21.18N load) is 1 to 15g / 10min (C-2) A melting point measured by a differential scanning calorimeter (DSC) of 100°C or less

[0012] The second aspect of the present invention provides the ethylene-based resin composition according to the first aspect, characterized in that the ethylene-based resin (C) is a copolymer of ethylene and a monomer having a polar group.

[0013] In addition, according to a third aspect of the present invention, there is provided an ethylene-based resin composition according to the first or second aspect, characterized in that the ethylene-based resin composition (A) further has the following property (A-3)': (A-3)' The elution curve obtained by temperature rising elution fractionation (TREF) using orthodichlorobenzene satisfies the following (iv) to (vii): (iv) The elution temperature has at least one peak at 55°C or lower and at least one peak between 55°C and 85°C. (v) The proportion of the eluted substance (a1) having an elution temperature of 55°C or lower is 5 to 30% by weight. (vi) The proportion of the eluate (a2) at an elution temperature of 55°C to 70°C is 1 to 30% by weight. (vii) The proportion of the eluate (a3) ​​eluted at an elution temperature of 70 to 85°C is 20 to 55% by weight. (However, the total of the proportions of (a1), (a2), (a3), and (a4) is 100% by weight.)

[0014] The fourth aspect of the present invention provides the ethylene-based resin composition according to any one of the first to third aspects, characterized in that the ethylene-based resin composition (A) further has the following property (A-3)": (A-3)" The elution curve obtained by temperature rising elution fractionation (TREF) using orthodichlorobenzene satisfies the following (viii) to (xi). (viii) The ratio of the proportion of eluted material (a1) having an elution temperature of 55°C or lower to the proportion of eluted material (a2) having an elution temperature of 55°C to 70°C is 1 to 5. (ix) The ratio of the proportion of the eluate (a3) ​​at an elution temperature of 70°C to 85°C to the proportion of the eluate (a2) at an elution temperature of 55°C to 70°C is 1 to 5. (x) The ratio of the proportion of eluates (a3) ​​having an elution temperature of 70 to 85°C to the proportion of eluates (a1) having an elution temperature of 55°C or lower is 1 to 5. (xi) The ratio of the proportion of eluates ((a1) + (a2)) having an elution temperature of 70°C or less to the proportion of eluates ((a3) + (a4)) having an elution temperature of 70°C or more is 0.2 to 1.2. (However, the total of the proportions of (a1), (a2), (a3), and (a4) is 100% by weight.)

[0015] Further, according to a fifth aspect of the present invention, there is provided an ethylene-based resin composition according to any one of the first to fourth aspects, characterized in that the ethylene-based resin composition (A) contains 60 to 95% by weight of the ethylene-based resin (B) and 5 to 40% by weight of the ethylene-based resin (C).

[0016] According to a sixth aspect of the present invention, there is provided an ethylene-based resin composition comprising an ethylene-based resin composition (A), characterized in that the ethylene-based resin composition (A) contains 60 to 95% by weight of an ethylene-based resin (B) and 5 to 40% by weight of an ethylene-based resin (C), each having the following properties: Ethylene-based resin (B): One or more types of ethylene-α-olefin copolymers that simultaneously satisfy the following properties (B-1) and (B-2): (B-1) MFR (190°C, 21.18N load) is 1 to 18g / 10min (B-2) Density: 0.910 to 0.940 g / cm 3 Ethylene-based resin (C): An ethylene-based resin produced by a radical polymerization method that simultaneously satisfies the following properties (C-1) and (C-2): (C-1) MFR (190°C, 21.18N load) is 1 to 15g / 10min (C-2) A melting point measured by differential scanning calorimetry (DSC) of 100°C or less

[0017] The seventh aspect of the present invention provides an ethylene-based resin composition according to any one of the first to sixth aspects, characterized in that the ethylene-based resin composition (A) further contains a high-pressure low-density polyethylene (D) having the following properties (D-1) to (D-2): (D-1) MFR (190°C, 21.18N load) is 1 to 20g / 10min (D-2) Density: 0.915 to 0.930 g / cm 3

[0018] The eighth aspect of the present invention provides an ethylene-based resin composition according to any one of the first to seventh aspects, characterized in that the ethylene-based resin composition (A) contains 60 to 85% by weight of the ethylene-based resin (B), 5 to 25% by weight of the ethylene-based resin (C), and 5 to 30% by weight of the high-pressure low-density polyethylene (D).

[0019] According to a ninth aspect of the present invention, there is provided a laminate having at least three layers, namely, a sealant layer (X), an intermediate layer (Y) and a substrate layer (Z), wherein the intermediate layer (Y) is formed using the ethylene-based resin composition according to any one of the first to eighth aspects.

[0020] According to a tenth aspect of the present invention, there is provided a laminate having at least three layers, namely, a sealant layer (X), an intermediate layer (Y) and a substrate layer (Z), wherein the sealant layer (X) is formed using the ethylene-based resin composition according to any one of the first to eighth aspects.

[0021] According to an eleventh aspect of the present invention, there is provided a packaging film using the laminate of the ninth or tenth aspect.

[0022] The twelfth aspect of the present invention provides the packaging film according to the eleventh aspect, characterized in that the film is a film for packaging contents containing a liquid. [Effects of the Invention]

[0023] According to the present invention, it is possible to provide an ethylene-based resin composition which has excellent heat-sealing properties and heat resistance, which has good cuttability because the amount of polymer pooling during filling is small in proportion to the density, and which can be filled over a wide temperature range from low to high even during high-speed filling, and a laminate and a packaging film each using the same. [Brief explanation of the drawings]

[0024] [Figure 1] 1 is an elution curve of the ethylene-based resin composition (A) used in the examples and comparative examples. DETAILED DESCRIPTION OF THE INVENTION

[0025] 1. Ethylene-based resin composition One aspect of the present invention is an ethylene-based resin composition comprising an ethylene-based resin composition (A) containing an ethylene-based resin (B) and an ethylene-based resin (C) (hereinafter also referred to as "the ethylene-based resin composition of the present invention" or "the ethylene-based resin composition (A) of the present invention"). Each component of the ethylene-based resin composition of the present invention will be described in detail below. 1-1. Ethylene-based resin (B) The ethylene-based resin (B) used in the present invention is one or more ethylene-α-olefin copolymers that simultaneously satisfy the properties (B-1) and (B-2) described below. The ethylene-α-olefin copolymer is preferably a random copolymer. The α-olefin used as a comonomer is preferably an α-olefin having 3 to 20 carbon atoms, more preferably 3 to 12 carbon atoms, and even more preferably 3 to 8 carbon atoms. Specific examples of the α-olefin include propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-heptene, 4-methyl-pentene-1, 4-methyl-hexene-1, and 4,4-dimethylpentene-1. Specific examples of the ethylene-α-olefin copolymer include ethylene-1-butene copolymer, ethylene-1-hexene copolymer, and ethylene-1-octene copolymer. From the viewpoint of resin strength, α-olefins having 6 or more carbon atoms are preferred.

[0026] The α-olefin used as a comonomer may be one type, or two or more types may be used simultaneously. For example, a multi-component copolymer using two or more types of α-olefins, such as a terpolymer, can also be used. Specific examples include ethylene-propylene-1-butene terpolymer and ethylene-propylene-1-hexene terpolymer. When two or more types are used, it is preferable from the viewpoint of resin strength that at least one of the α-olefins has six or more carbon atoms.

[0027] The method for producing the ethylene-α-olefin copolymer is not particularly limited as long as it can produce an ethylene-based resin (B) and an ethylene-based resin composition (A) that satisfy the physical properties described below, and the copolymer can be produced using a known catalyst such as a Ziegler catalyst or a metallocene catalyst. Among these, it is preferable to use an ethylene-α-olefin copolymer produced using a metallocene catalyst and having physical properties specific to metallocene catalysts, i.e., a metallocene-catalyzed ethylene-α-olefin copolymer.

[0028] The metallocene catalyst is a catalyst comprising (1) a transition metal compound of Group 4 of the periodic table containing a ligand having a cyclopentadienyl skeleton (hereinafter also referred to as "metallocene compound"), (2) a co-catalyst capable of activating the metallocene compound to a stable ionic state by reacting with the metallocene compound, and, as an optional component, (3) an organoaluminum compound, and any known metallocene catalyst can be appropriately selected and used. Each of the components (1) to (3) above will be explained below.

[0029] (1) Metallocene compounds The metallocene compound is not particularly limited, and known compounds can be used. For example, metallocene compounds disclosed in JP-A-58-19309, JP-A-59-95292, JP-A-59-23011, JP-A-60-35006, JP-A-60-35007, JP-A-60-35008, JP-A-60-35009, JP-A-61-130314, JP-A-3-163088, EP 420,436, U.S. Pat. No. 5,055,438, WO 91 / 04257, WO 92 / 07123, etc. can be used. Specifically, bis(cyclopentadienyl)zirconium dichloride, bis(indenyl)zirconium dichloride, bis(fluorenyl)zirconium dichloride, bis(azulenyl)zirconium dichloride, bis(4,5,6,7-tetrahydroindenyl)zirconium dichloride, (cyclopentadienyl)(3,4-dimethylcyclopentadienyl)zirconium dichloride, methylenebis(cyclopentadienyl) enyl)zirconium dichloride, methylene(cyclopentadienyl)(3,4-dimethylcyclopentadienyl)zirconium dichloride, isopropylidene(cyclopentadienyl)(3,4-dimethylcyclopentadienyl)zirconium dichloride, ethylene(cyclopentadienyl)(3,5-dimethylpentadienyl)zirconium dichloride, methylenebis(indenyl)zirconium dichloride, ethylene dimethylsilylenebis(2-methylindenyl)zirconium dichloride, ethylene 1,2-bis(4-phenylindenyl)zirconium dichloride, ethylene(cyclopentadienyl)(fluorenyl)zirconium dichloride, dimethylsilylene(cyclopentadienyl)(tetramethylcyclopentadienyl)zirconium dichloride, dimethylsilylenebis(indenyl)zirconium dichloride, dimethylsilylenebis(4,5,6,7-tetrahydroindenyl)zirconium dichloride, dimethylsilylene(cyclopentadienyl)(fluorenyl)zirconium dichloride, dimethylsilylene(cyclopentadienyl)(octahydrofluorenyl)zirconium dichloride, methylphenylsilylenebis[1-(2-methyl-4,5-benzo(indenyl)]zirconium dichloride, dimethylsilylenebis[1-(2-methyl-4,5-benzoindenyl)]zirconium dichloride, dimethylsilylenebis[1-(2-methyl-4H-azulenyl)]zirconium dichloride, dimethylsilylenebis[1-(2-methyl-4-(4-chlorophenyl)-4H-azulenyl)]zirconium dichloride, dimethylsilylenebis[1-(2-ethyl-4-(4-chlorophenyl)-4H-azulenyl)]zirconium dichloride, dimethylsilylenebis[1-(2-ethyl-4-naphthyl-4H-azulenyl)]zirconium dichloride, diphenylsilylenebis[1-(2-methyl-4-(4-chlorophenyl)-4H-azulenyl)]zirconium dichloride Examples of zirconium compounds include dimethylsilylenebis[1-(2-methyl-4-(phenylindenyl))]zirconium dichloride, dimethylsilylenebis[1-(2-ethyl-4-(phenylindenyl))]zirconium dichloride, dimethylsilylenebis[1-(2-ethyl-4-naphthyl-4H-azulenyl)]zirconium dichloride, dimethylsilylenebis[1-(2-ethyl-4-naphthyl-4H-azulenyl)]zirconium dichloride, dimethylgermylenebis(indenyl)zirconium dichloride, and dimethylgermylene(cyclopentadienyl)(fluorenyl)zirconium dichloride. Compounds in which hafnium is substituted for zirconium in the above examples can also be used. In some cases, a mixture of a zirconium compound and a hafnium compound can also be used. The metallocene compound may be used by supporting it on an inorganic or organic carrier, preferably a porous oxide of an inorganic or organic compound, such as an ion-exchange layered silicate, SiO2, Al2O3, MgO, ZrO2, TiO2, BO3, CaO, ZnO, BaO, ThO2, or a mixture thereof.

[0030] (2) Cocatalyst Examples of the co-catalyst include organoaluminum oxy compounds (aluminoxane compounds), ion-exchange layered silicates, Lewis acids, boron compounds, lanthanoid salts such as lanthanum oxide, and tin oxide.

[0031] (3) Organoaluminum compounds Examples of the organoaluminum compound include trialkylaluminums such as triethylaluminum, triisopropylaluminum, and triisobutylaluminum; dialkylaluminum halides; alkylaluminum sesquihalides; alkylaluminum dihalides; alkylaluminum hydrides; and organoaluminum alkoxides.

[0032] The polymerization method can be any method that allows efficient contact between the catalyst components and each monomer. Specifically, the polymerization can be carried out in the presence of these catalysts using a slurry method, a gas-phase fluidized bed method, a solution method, or a method using a pressure of 200 kg / cm. 2 As mentioned above, examples of the method include high-pressure bulk polymerization at a polymerization temperature of 100° C. or higher. A preferred production method is high-pressure bulk polymerization.

[0033] The ethylene-α-olefin copolymer can be selected from commercially available products, such as "Affinity" manufactured by DuPont Dow, and "Kernel" and "Harmolex" manufactured by Japan Polyethylene Corporation.

[0034] Next, the properties (B-1) and (B-2) of the ethylene-based resin (B) will be described in detail.

[0035] (B-1) Melt flow rate (MFR) The melt flow rate (MFR: 190°C, 21.18N load) of the ethylene resin (B) used in the present invention is 1 to 18g / 10min, preferably 2 to 15g / 10min, more preferably 2 to 12g / 10min. When the MFR is in the above range, excellent extrusion processability, hot tackiness, and resistance to foaming during high-temperature sealing are achieved. Here, MFR is a value measured in accordance with JIS-K6922-2:1997 Appendix (190°C, 21.18N load).

[0036] (B-2) Density The density of the ethylene-based resin (B) used in the present invention is 0.910 to 0.940 g / cm 3and preferably 0.916 to 0.938 g / cm 3 , more preferably 0.924 to 0.936 g / cm 3 When the density is within the above range, an excellent balance of rigidity, heat resistance, and heat sealability is achieved. Here, the density is measured in accordance with JIS-K6922-2:1997 Appendix (for low-density polyethylene) (measurement temperature: 23°C).

[0037] The ethylene-α-olefin copolymer used in the ethylene-based resin (B) may be one type alone or two or more types may be used. For example, by using two or more types of ethylene-α-olefin copolymers with different MFRs or densities in combination, the physical properties of the ethylene-based resin (B) and the ethylene-based resin composition (A) can be controlled within desired ranges. In particular, since ethylene-α-olefin copolymers produced using a metallocene catalyst have a narrow crystallinity distribution, the TREF physical properties described below can be easily controlled within desired ranges by blending various ethylene-α-olefin copolymers. Ethylene-α-olefin copolymers can also be produced using so-called Ziegler catalysts containing titanium and halogens. When ethylene-α-olefin copolymers with different physical properties are used in combination, the copolymers may be blended together or multi-stage polymerization may be used. Furthermore, a metallocene catalyst and a Ziegler catalyst can also be used in combination.

[0038] The content of the ethylene-based resin (B) in the ethylene-based resin composition (A) of the present invention is preferably 60 to 95% by weight, more preferably 60 to 85% by weight. When the content of the ethylene-based resin (B) is equal to or greater than the lower limit, it is preferred from the viewpoint of rigidity and heat resistance, and when it is equal to or less than the upper limit, it is preferred from the viewpoint of excellent pressure resistance and processability as well as blending with other additive components.

[0039] 1-2. Ethylene-based resin (C) The ethylene-based resin (C) used in the present invention is an ethylene-based resin produced by a radical polymerization method that simultaneously satisfies the properties (C-1) and (C-2) described below. The ethylene-based resin (C) is preferably a copolymer of ethylene and a monomer having a polar group. Specific examples of comonomers include acids and ester compounds such as vinyl acetate, methyl acrylate, ethyl acrylate, butyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, maleic anhydride, methacrylic acid, and metal ion-containing methacrylic acid. Among these, (meth)acrylic acid ester compounds such as methyl acrylate, ethyl acrylate, methyl methacrylate, and ethyl methacrylate are preferably used. The comonomer may be used alone or in combination of two or more kinds.

[0040] The ethylene resin (C) can be produced by a known high-pressure radical polymerization method using an autoclave reactor or a tubular reactor.

[0041] Next, the properties (C-1) and (C-2) of the ethylene-based resin (C) will be described in detail.

[0042] (C-1) Melt flow rate (MFR) The melt flow rate (MFR: 190°C, 21.18N load) of the ethylene resin (C) used in the present invention is 1 to 15g / 10min, preferably 2 to 12g / 10min, more preferably 2 to 10g / 10min. When the MFR is in the above range, pressure resistance and extrusion processability become good. Here, MFR is a value measured in accordance with JIS-K6922-2:1997 Appendix (190°C, 21.18N load).

[0043] (C-2) Melting point The melting point of the ethylene resin (C) used in the present invention is 100° C. or lower, preferably 60 to 100° C., and more preferably 70 to 100° C. When the melting point is within the above range, an excellent balance between heat resistance and filling ability is achieved. Here, the melting point refers to the maximum peak temperature among the melting peaks in the melting curve measured by differential scanning calorimetry (DSC).

[0044] The ethylene-based resin (C) may be used singly or in combination of two or more. For example, by using two or more ethylene-based resins having different MFRs or densities in combination, the physical properties of the ethylene-based resin (C) and the ethylene-based resin composition (A) can be controlled within desired ranges. The content of the ethylene resin (C) in the ethylene resin composition (A) of the present invention is preferably 5 to 40% by weight, more preferably 5 to 25% by weight. The content of the ethylene resin (C) is preferably at least the lower limit from the viewpoint of the balance between heat resistance and pressure resistance, and is preferably at most the upper limit from the viewpoint of processability.

[0045] 1-3. High-pressure low-density polyethylene (D) The ethylene-based resin composition (A) of the present invention preferably contains a high-pressure low-density polyethylene (D) that simultaneously satisfies the properties (D-1) and (D-2) described below. The high-pressure low-density polyethylene can be obtained by high-pressure radical polymerization and is also called high-pressure radical polymerization low-density polyethylene. High-pressure low-density polyethylene has high melt elasticity and is often used to improve necking, particularly during extrusion lamination.

[0046] (D-1) Melt flow rate (MFR) The melt flow rate (MFR: 190°C, 21.18 N load) of the high-pressure low-density polyethylene (D) used in the present invention is 1 to 20 g / 10 min, preferably 1 to 10 g / 10 min. When the MFR is in the above range, the balance between neck-in during processing and extensibility is improved. Here, MFR is a value measured in accordance with JIS-K6922-2:1997 Appendix (190°C, 21.18N load).

[0047] (D-2) Density The density of the high-pressure low-density polyethylene (D) used in the present invention is 0.915 to 0.930 g / cm 3 and preferably 0.915 to 0.925 g / cm 3 By having the density within the above range, the balance between neck-in during processing and extensibility is improved. Here, the density is measured in accordance with JIS-K6922-2:1997 Appendix (for low-density polyethylene) (measurement temperature: 23°C).

[0048] The content of the high-pressure low-density polyethylene (D) in the ethylene-based resin composition (A) of the present invention is preferably 5 to 30% by weight. When the content of the high-pressure low-density polyethylene (D) is equal to or greater than the lower limit, neck-in is improved and productivity is enhanced, and when it is equal to or less than the upper limit, low-temperature sealability and hot tackiness are enhanced, which is preferred.

[0049] 1-4. Ethylene-based resin composition (A) The ethylene-based resin composition (A) of the present invention contains an ethylene-based resin (B) and an ethylene-based resin (C), and optionally further contains a high-pressure low-density polyethylene (D). The ethylene-based resin composition (A) of the present invention preferably simultaneously satisfies the properties (A-1) to (A-3) described below, and optionally further satisfies the properties (A-3)' and (A-3)".

[0050] (A-1) Melt flow rate (MFR) The melt flow rate (MFR: 190°C, 21.18 N load) of the ethylene resin composition (A) used in the present invention is 1 to 15 g / 10 min, preferably 1 to 12 g / 10 min, more preferably 1 to 10 g / 10 min. When the MFR is in the above range, excellent extrusion processability, hot tackiness, and resistance to foaming during high-temperature sealing are achieved. Here, MFR is a value measured in accordance with JIS-K6922-2:1997 Appendix (190°C, 21.18N load).

[0051] (A-2) Density The density of the ethylene-based resin composition (A) used in the present invention is 0.915 to 0.940 g / cm 3 and preferably 0.920 to 0.938 g / cm 3 , more preferably 0.925 to 0.935 g / cm 3 When the density is within the above range, the heat sealability, heat resistance and pressure resistance are well balanced, and the rigidity is good. Here, the density is measured in accordance with JIS-K6922-2:1997 Appendix (for low-density polyethylene) (measurement temperature: 23°C).

[0052] (A-3) Temperature Rising Elution Fractionation (TREF) The ethylene-based resin composition (A) used in the present invention has a specific crystallinity distribution and satisfies the following properties.

[0053] In an elution curve obtained by TREF using orthodichlorobenzene as a solvent, the ethylene resin composition (A) has (i) at least one peak at an elution temperature of 85°C or less and at least one peak at an elution temperature of 85°C or more, (ii) the proportion of eluates ((a1) + (a2) + (a3)) at an elution temperature of 85°C or less is 45 to 90% by weight, and (iii) the proportion of eluates (a4) at an elution temperature of 85°C or more is 10 to 55% by weight (provided that the sum of (a1), (a2), (a3), and (a4) is 100% by weight). Here, (a1), (a2), and (a3) ​​represent (a1) an eluate having an elution temperature of 55°C or less, (a2) an eluate having an elution temperature of 55°C to 70°C, and (a3) ​​an eluate having an elution temperature of 70°C to 85°C, as described below.

[0054] The elution curve of the ethylene resin composition (A) has at least one peak at or below 85° C. The temperature range at which the maximum peak exists among the peaks at or below 85° C. is preferably 30° C. to 80° C. The number of peaks existing in the above range may be one or two or more.

[0055] The elution curve has at least one peak at or above 85° C. The upper limit of the temperature at which the maximum peak exists among the peaks at or above 85° C. is preferably 100° C. or lower, more preferably 95° C. or lower. The number of peaks existing within the above range may be one or two or more.

[0056] The proportion of the eluates ((a1)+(a2)+(a3)) having an elution temperature of 85°C or less is 45 to 90% by weight, preferably 45 to 65% by weight, based on 100% by weight of the entire ethylene-based resin composition (A). The eluates ((a1)+(a2)+(a3)) at 85°C or less are low-crystalline components and components in the intermediate range between low and high crystallinity. By ensuring that the content of ((a1)+(a2)+(a3)) is within the above range, excellent extrusion lamination processability is achieved. Furthermore, the crystallization rate during heat sealing is slowed and fluidity is improved, making the intermediate layer more easily crushed and improving low-temperature sealing properties.

[0057] The proportion of the eluate (a4) having an elution temperature of 85°C or higher is 10 to 55% by weight, preferably 35 to 55% by weight, based on 100% by weight of the entire ethylene-based resin composition (A). The eluate (a4) having an elution temperature of 85°C or higher is a component in the highly crystalline region, and by having the content of (a4) in the above range, excellent rigidity and heat resistance are achieved. In addition, the crystallization rate during heat sealing is increased, resulting in excellent seal appearance.

[0058] In an elution curve obtained by TREF using orthodichlorobenzene as a solvent, the ethylene resin composition (A) preferably has (iv) at least one peak at an elution temperature of 55°C or less and at 55 to 85°C, (v) 5 to 30% by weight of eluate (a1) having an elution temperature of 55°C or less, (vi) 1 to 30% by weight of eluate (a2) having an elution temperature of 55 to 70°C or less, and (vii) 20 to 55% by weight of eluate (a3) ​​having an elution temperature of 70 to 85°C or less (provided that the total of (a1), (a2), (a3), and (a4) is 100% by weight).

[0059] The elution curve of the ethylene-based resin composition (A) preferably has at least one peak at 55° C. or lower. Of the peaks at 55° C. or lower, the lower limit of the temperature at which the maximum peak exists is preferably 30° C. or higher. The number of peaks existing within the above range may be one or two or more.

[0060] The elution curve preferably has at least one peak between 55° C. and 85° C. The upper limit of the temperature at which the maximum peak exists among the peaks between 55° C. and 85° C. is preferably 80° C. or lower, and the lower limit of the temperature at which the maximum peak exists is preferably 70° C. or higher. The number of peaks present in the above range may be one or two or more.

[0061] The proportion of the elutable substance (a1) having an elution temperature of 55°C or less is preferably 5 to 30% by weight, more preferably 7 to 25% by weight, based on 100% by weight of the entire ethylene-based resin composition (A). The elutable substance (a1) having an elution temperature of 55°C or less is a component in the low crystalline region, and the influence of this component slows the crystallization rate during heat sealing, improving fluidity and making the intermediate layer more likely to be crushed. Therefore, by ensuring that the content of (a1) is within the above range, low-temperature sealability is improved.

[0062] The proportion of the eluate (a2) at an elution temperature of 55° C. to 70° C. is preferably 1 to 30% by weight, more preferably 3 to 20% by weight, based on 100% by weight of the entire ethylene-based resin composition (A). The eluate (a2) at 55° C. to 70° C. is a component closer to the low crystallinity region within the intermediate region between low crystallinity and high crystallinity, and due to the influence of this component, it is possible to maintain appropriate elasticity during heat sealing.

[0063] The proportion of the eluate (a3) ​​at an elution temperature of 70° C. to 85° C. is preferably 20 to 55% by weight, more preferably 20 to 45% by weight, based on 100% by weight of the entire ethylene-based resin composition (A). The eluate (a3) ​​at 70° C. to 85° C. is a component closer to the high crystallinity region within the intermediate region between low crystallinity and high crystallinity, and due to the influence of this component, appropriate elasticity is maintained during heat sealing, resulting in good extrusion lamination processability.

[0064] The ethylene resin composition (A) more preferably has an elution curve obtained by TREF using orthodichlorobenzene as a solvent such that (viii) the ratio of the proportion of eluates (a1) having an elution temperature of 55°C or less to the proportion of eluates (a2) having an elution temperature of 55 to 70°C is 1 to 5, (ix) the ratio of the proportion of eluates (a3) ​​having an elution temperature of 70 to 85°C to the proportion of eluates (a2) having an elution temperature of 55 to 70°C is 1 to 5, (x) the ratio of the proportion of eluates (a3) ​​having an elution temperature of 70 to 85°C to the proportion of eluates (a1) having an elution temperature of 55°C or less is 1 to 5, and (xi) the ratio of the proportion of eluates ((a1) + (a2)) having an elution temperature of 70°C or less to the proportion of eluates ((a3) + (a4)) having an elution temperature of 70°C or more is 0.2 to 1.2. (However, the total of the proportions of (a1), (a2), (a3), and (a4) is 100% by weight.)

[0065] The ratio of the proportion of eluate (a1) having an elution temperature of 55°C or less to the proportion of eluate (a2) having an elution temperature of 55°C to 70°C is preferably 1 to 5, more preferably 1 to 4. When the ratio of the proportion of (a1) to the proportion of (a2) is within the above range, good low-temperature sealability is achieved. On the other hand, if the ratio of the proportion of (a1) to the proportion of (a2) is greater than the above range, rigidity and heat resistance deteriorate. Also, if the ratio of the proportion of (a1) to the proportion of (a2) is less than the above range, low-temperature sealability deteriorates.

[0066] The ratio of the proportion of the eluate (a3) ​​having an elution temperature of 70°C to 85°C to the proportion of the eluate (a2) having an elution temperature of 55°C to 70°C is preferably 1 to 5, more preferably 2.5 to 5. When the ratio of the proportion of (a3) ​​to the proportion of (a2) is within the above range, an excellent balance of elasticity and rigidity during heat sealing is achieved, and extrusion lamination processability is also improved. On the other hand, if the ratio of the proportion of (a3) ​​to the proportion of (a2) is greater than the above range, low-temperature sealing properties are deteriorated. Furthermore, if the ratio of the proportion of (a3) ​​to the proportion of (a2) is less than the above range, extrusion lamination processability is deteriorated.

[0067] The ratio of the proportion of eluate (a3) ​​having an elution temperature of 70°C to 85°C to the proportion of eluate (a1) having an elution temperature of 55°C or lower is preferably 1 to 5, more preferably 1 to 4. When the ratio of the proportion of (a3) ​​to the proportion of (a1) is within the above range, an excellent balance between elasticity and crystallization rate during heat sealing is achieved, and extrusion lamination processability is also improved. On the other hand, if the ratio of the proportion of (a3) ​​to the proportion of (a1) is greater than the above range, low-temperature sealing properties are deteriorated. Furthermore, if the ratio of the proportion of (a3) ​​to the proportion of (a1) is less than the above range, rigidity, heat resistance, and extrusion lamination processability are deteriorated.

[0068] The ratio of the proportion of eluates ((a1) + (a2)) having an elution temperature of 70°C or less to the proportion of eluates ((a3) + (a4)) having an elution temperature of 70°C or more is preferably 0.2 to 1.2, more preferably 0.2 to 0.7. When the ratio of the proportion of ((a1) + (a2)) to the proportion of ((a3) + (a4)) is within the above range, an excellent balance between heat sealability, heat resistance, and pressure resistance is achieved, and hot tack properties and resistance to foaming during high-temperature sealing are excellent. On the other hand, if the ratio of the proportion of ((a1) + (a2)) to the proportion of ((a3) + (a4)) is greater than the above range, heat resistance deteriorates, and seal recession and foaming at high sealing temperatures are observed, impairing the seal appearance. Furthermore, if the ratio of the proportion of ((a1) + (a2)) to the proportion of ((a3) + (a4)) is less than the above range, low-temperature sealability and pressure resistance deteriorate.

[0069] [TREF measurement method] A specific method for measuring TREF will be described below. The sample was dissolved in orthodichlorobenzene (containing 0.5 mg / mL BHT) at 140 °C to form a solution. This was then loaded onto a TREF column at 140 °C, cooled to 100 °C at a rate of 8 °C / min, then cooled to 40 °C at a rate of 4 °C / min, and then cooled to -15 °C at a rate of 1 °C / min, where it was held for 20 minutes. The solvent, orthodichlorobenzene (containing 0.5 mg / mL BHT), was then passed through the column at a flow rate of 1 mL / min. The components dissolved in orthodichlorobenzene at -15 °C in the TREF column were eluted for 10 minutes. The column was then heated linearly to 140 °C at a rate of 100 °C / hour, and an elution curve was obtained.

[0070] The apparatus and measurement conditions are, for example, as follows. (TREF section) TREF column: 4.3mmφ×150mm stainless steel column Column packing material: 100 μm surface-deactivated glass beads Heating method: Aluminum heat block Cooling method: Peltier element (Peltier element is water-cooled) Temperature distribution: ±0.5℃ Temperature controller: Chino Digital Program Controller KP1000 (valve oven) Heating method: Air bath oven Temperature during measurement: 140℃ Temperature distribution: ±1℃ Valve: 6-way valve, 4-way valve (Sample injection section) Injection method: Loop injection method Injection volume: Loop size 0.1 mL Inlet heating method: Aluminum heat block Temperature during measurement: 140℃ (Detection unit) Detector: Fixed wavelength infrared detector FOXBORO MIRAN 1A Detection wavelength: 3.42 μm High temperature flow cell: Micro flow cell for LC-IR, Optical path length: 1.5 mm, window shape: 2φ×4 mm oblong, synthetic sapphire window plate Temperature during measurement: 140℃ (Pump section) Liquid transfer pump: Senshu Scientific SSC-3461 pump <Measurement conditions> Solvent: orthodichlorobenzene (containing 0.5 mg / mL BHT) Sample concentration: 5 mg / mL Sample injection volume: 0.1 mL Solvent flow rate: 1 mL / min

[0071] The ethylene-based resin composition (A) of the present invention may contain, within the limits not significantly impairing the effects of the present invention, antioxidants, heat stabilizers, weather stabilizers, light stabilizers, ultraviolet absorbers, antistatic agents, antifogging agents, crystal nucleating agents, neutralizing agents, metal deactivators, colorants, dispersants, slip agents, peroxides, organic or inorganic fillers, fluorescent brighteners, pigments, etc. Furthermore, the ethylene-based resin composition (A) of the present invention may contain small amounts of resin components other than the ethylene-based resin (B), the ethylene-based resin (C), and the high-pressure low-density polyethylene (D), within the limits not significantly impairing the effects of the present invention.

[0072] 2.Laminate The laminate of the present invention has at least three layers: a sealant layer (X), an intermediate layer (Y), and a substrate layer (Z), and the intermediate layer (Y) and / or the sealant layer (X) are made using the ethylene-based resin composition of the present invention. Preferably, the sealant layer (X) and the intermediate layer (Y) are laminated on the substrate layer (Z) by extrusion lamination or coextrusion lamination.

[0073] Examples of the substrate layer (Z) include films of paper, aluminum foil, cellophane, woven fabric, nonwoven fabric, and high-molecular-weight polymers. Examples include olefin polymers such as high-density polyethylene, medium-density polyethylene, low-density polyethylene, ethylene-vinyl acetate copolymer, ethylene-acrylic acid ester copolymer, ionomer, polypropylene, poly-1-butene, and poly-4-methylpentene-1; vinyl copolymers such as polyvinyl chloride, polyvinylidene chloride, polystyrene, polyacrylate, and polyacrylonitrile; polyamides such as nylon 6, nylon 66, nylon 7, nylon 10, nylon 11, nylon 12, nylon 610, and polymetaxylylene adipamide; polyesters such as polyethylene terephthalate, polyethylene terephthalate / isophthalate, and polybutylene terephthalate; polyvinyl alcohol, ethylene-vinyl alcohol copolymer, and polycarbonate. The substrate layer (Z) may be made of one type of film or two or more types of films. Furthermore, depending on the type of substrate, the film may be stretched. Examples of stretched films include uniaxially or biaxially oriented polypropylene films, stretched nylon films, stretched polyethylene terephthalate films, and stretched polystyrene films. Furthermore, the above-mentioned films may be coated with polyvinylidene chloride or polyvinyl alcohol, or may be vapor-deposited with aluminum, alumina, silica, or a mixture of alumina and silica. For packaging films for packaging contents containing liquids or viscous substances, the substrate layer (Z) may be biaxially oriented nylon films, biaxially oriented polyethylene terephthalate films, or such substrates vapor-deposited with silica or alumina.

[0074] When the ethylene-based resin composition is not used in the sealant layer (X) or the intermediate layer (Y), there are no particular limitations, and a conventionally known ethylene-based resin composition can be used, such as an ethylene-α-olefin copolymer or a blend composition of an ethylene-α-olefin copolymer and a high-pressure low-density polyethylene.

[0075] Typically, methods for producing laminates include, for example, dry lamination, wet lamination, extrusion, sandwich lamination, and coextrusion. For example, packaging films used for dry lamination, etc., can be produced by any method such as calendaring, air-cooled inflation, water-cooled inflation, and T-die molding. In addition, in the case of extrusion methods, there are methods such as extrusion lamination, dry lamination, sandwich lamination, and coextrusion lamination (including coextrusion without an adhesive layer, coextrusion with an adhesive layer, and coextrusion with an adhesive resin).

[0076] In the laminate of the present invention, when laminating the sealant layer (X) and the intermediate layer (Y) on at least one surface of the base layer (Z), an extrusion lamination method or a co-extrusion lamination method is preferably used. By using these methods, the productivity of the laminate is excellent. For example, from the viewpoints of productivity and quality, the tandem extrusion lamination method is preferably used as a method for producing a packaging film for packaging contents including liquids, viscous substances, etc. The tandem extrusion lamination method is a method for sequentially laminating two types of resin layers, for example, a method in which an intermediate layer (Y) is laminated as a first layer on a substrate layer (Z) by extrusion lamination, and then a sealant layer (X) is laminated as a second layer.

[0077] There are no particular limitations on the overall thickness of the laminate, the thickness of each layer, or the thickness ratio of each layer, and these can be appropriately selected depending on the contents, intended use, etc. The overall thickness of the laminate is, for example, 40 to 120 μm, the thickness of the base layer is 10 to 40 μm, and the thickness of the sealant layer is approximately 10 to 40 μm. The thickness of the intermediate layer can be approximately 20 to 40 μm. Furthermore, before lamination, the base layer can be subjected to a surface treatment such as corona discharge treatment, ozone treatment, or flame treatment to improve the adhesion of the base surface. Furthermore, to enhance adhesion, an anchor coating agent can be applied to the base before lamination. Examples of anchor coating agents include isocyanate-based, polyethyleneimine-based, and polybutadiene-based agents.

[0078] 3. Packaging film The packaging film of the present invention can be used as various packaging materials, such as food packaging materials, medical packaging materials, and packaging materials for industrial materials such as engine oil. In particular, it can be suitably used as a film for packaging contents containing liquids. For example, it can be used as a packaging material for containing liquids, liquids containing solid insoluble matter such as fibers and powders, and fluids such as viscous substances.

[0079] As a packaging form for liquid contents, for example, one or two pieces of packaging film using a laminate in which the above-mentioned base layer (X), intermediate layer (Y), and sealant layer (Z) are laminated in this order are sealed on two, three, or four sides using a conventional heat sealing machine to form a bag. The shape of the bag is generally rectangular, but can be any shape. [Example]

[0080] The present invention will be described in detail below with reference to examples, but the present invention is not limited to these examples. The measurement methods, evaluation methods, and resin materials used in the examples and comparative examples are as follows.

[0081] [Measurement method] (1) MFR: Measured in accordance with JIS K6922-2:1997 Appendix (190°C, 21.18N load). (2) Density: Measured in accordance with JIS K6922-2:1997 Appendix (23°C). (3) Differential scanning calorimetry (DSC): Performed in accordance with JIS-K7121:2010.

[0082] [Liquid filling evaluation method] (1) Liquid filling The liquid was filled under the following conditions using an automatic liquid filling and packaging machine (manufactured by Taisei Lamic Co., Ltd.). (Filling conditions) Sealing temperature: (Vertical) 170℃, (Horizontal) 120℃~195℃ Packaging: Three-sided seal Bag dimensions: 75mm wide x 65mm long Filling: Water (30℃) Filling amount: approx. 15g Filling speed: 15 m / min (Examples 1 to 5, Comparative Examples 1 to 3) 25 m / min (Examples 1 to 4, Comparative Examples 1 and 2)

[0083] (2) Criteria for determining filling suitability Filling was carried out under the above conditions with the horizontal sealing temperature changed, and the presence or absence of bag breakage, seal retraction, and water leakage was evaluated under the following pressure resistance conditions. (Pressure resistance conditions) A load of 100 kg was applied for 1 minute using a pressure tester (manufactured by Komatsu Ltd.), and the presence or absence of bag breakage, seal retraction, and water leakage was evaluated. (Evaluation criteria) ○: The appearance of the horizontal seal was good, and in the pressure resistance evaluation, there was no bag breakage, no seal retraction, no water leakage, and no foaming was observed. △: The appearance of the horizontal seal was good, but the pressure resistance evaluation showed bag breakage, seal retraction, and water leakage. ×: No seal recession or the like was observed in the pressure resistance evaluation, but bubbles were observed on the exterior of the horizontal seal. The pressure test was carried out immediately after filling.

[0084] [Resin used] P1: Ethylene-1-hexene copolymer (linear polyethylene (mLLD) produced using a metallocene catalyst, MFR 9 g / 10 min, density 0.920 g / cm 3 ) P2: Ethylene-1-hexene copolymer (linear polyethylene (ZN-LL) produced using a Ziegler catalyst, MFR 2 g / 10 min, density 0.936 g / cm 3 ) P3: Ethylene-1-hexene copolymer (linear polyethylene (mLLD) produced using a metallocene catalyst, MFR 4 g / 10 min, density 0.931 g / cm 3 ) P4: Ethylene-1-hexene copolymer (linear polyethylene (mLLD) produced using a metallocene catalyst, MFR 4 g / 10 min, density 0.927 g / cm 3 ) P5: Ethylene-1-hexene copolymer (linear polyethylene (mLLD) produced using a metallocene catalyst, MFR 16 g / 10 min, density 0.911 g / cm 3 ) P6: Ethylene-methyl acrylate copolymer (EMA) (MFR 3g / 10min, melting point 77℃) P7: Ethylene-methyl acrylate copolymer (EMA) (MFR 6g / 10min, melting point 90℃) P8: High-pressure low-density polyethylene (HPLD) (MFR 2 g / 10 min, density 0.919 g / cm 3 ) P9: High-pressure low-density polyethylene (HPLD) (MFR 4 g / 10 min, density 0.918 g / cm 3 ) In addition, the following commercially available products were used as ethylene-based resin compositions. P10: Japan Polyethylene Corporation Harmolex NH645A (MFR 8g / 10min, density 0.913g / cm 3 ) P11: Japan Polyethylene Corporation Harmolex NH646A (MFR 9g / 10min, density 0.914g / cm 3 ) P12: Japan Polyethylene Corporation Harmolex NH746A (MFR 10g / 10min, density 0.914g / cm 3 )

[0085] [Table 1]

[0086] [Example 1] 67% by weight of P1 was blended as the ethylene resin (B), 18% by weight of P6 as the ethylene resin (C), and 15% by weight of P8 as the high-pressure low-density polyethylene (D). These were thoroughly mixed in a blender, and pellets of the ethylene resin composition (A) were obtained using a 40 mmφ single-screw extruder. Using an extrusion lamination molding machine, a 500 mm wide, 15 μm thick biaxially oriented nylon film (Toyobo Co., Ltd., Harden Film N2102) was used as the base layer, and a two-component anchor coating agent (Dainichi Seikadyne 2710A, Seikadyne 2810C) was applied thereon with a Bowes roll, and ozone was sprayed in the lamination section, while the ethylene-based resin composition (A) was used as the intermediate layer resin composition, and melt extrusion lamination was performed at a take-up speed of 100 m / min and a coating thickness of 25 μm, to form an intermediate layer. The extrusion lamination molding machine was set so that the temperature of the resin extruded from the T die attached to the extruder with a diameter of 90 mmφ was 300 ° C., and the extrusion amount was adjusted so that the coating thickness was 25 μm when the cooling roll surface temperature was 25 ° C., the die width was 560 mm, and the take-up processing speed was 100 m / min. Furthermore, a sealant layer was laminated on top of this intermediate layer using the same extrusion laminating machine by melt extrusion laminating a sealant layer material (Kernel KC460S, manufactured by Japan Polyethylene Co., Ltd.) at an extrusion resin temperature of 280°C, a take-up speed of 100 m / min, and a coating thickness of 25 μm. The processed laminated film was aged in an oven at 40°C for 48 hours and then slit to a width of 150 mm to obtain a packaging film for evaluation. The evaluation results are shown in Table 2.

[0087] [Example 2] Except for using an ethylene-based resin composition (A) obtained by the following method, an evaluation film was produced in the same manner as in Example 1. The evaluation results are shown in Table 2. As the ethylene resin (B), 90% by weight of P1 and 10% by weight of P2 were blended. 68% by weight of the ethylene resin (B), 20% by weight of P6 as the ethylene resin (C), and 12% by weight of P8 as the high-pressure low-density polyethylene (D) were blended. These were thoroughly mixed in a blender, and pellets of the ethylene resin composition (A) were obtained using a 40 mmφ single-screw extruder.

[0088] [Example 3] Except for using an ethylene-based resin composition (A) obtained by the following method, an evaluation film was produced in the same manner as in Example 1. The evaluation results are shown in Table 2. 68% by weight of P3 was blended as the ethylene resin (B), 20% by weight of P6 as the ethylene resin (C), and 12% by weight of P8 as the high-pressure low-density polyethylene (D). These were thoroughly mixed in a blender, and pellets of the ethylene resin composition (A) were obtained using a 40 mmφ single-screw extruder.

[0089] [Example 4] Except for using an ethylene-based resin composition (A) obtained by the following method, an evaluation film was produced in the same manner as in Example 1. The evaluation results are shown in Table 2. 79% by weight of P4 was blended as the ethylene resin (B), 9% by weight of P7 as the ethylene resin (C), and 12% by weight of P8 as the high-pressure low-density polyethylene (D). These were thoroughly mixed in a blender, and pellets of the ethylene resin composition (A) were obtained using a 40 mmφ single-screw extruder.

[0090] [Example 5] Except for using an ethylene-based resin composition (A) obtained by the following method, an evaluation film was produced in the same manner as in Example 1. The evaluation results are shown in Table 2. As the ethylene-based resin (B), 19 wt% of P1, 8 wt% of P2, and 73 wt% of P5 were blended. 70 wt% of the ethylene-based resin (B), 20 wt% of P6 as the ethylene-based resin (C), and 10 wt% of P9 as the high-pressure low-density polyethylene (D) were blended. These were thoroughly mixed in a blender, and pellets of the ethylene-based resin composition (A) were obtained using a 40 mmφ single-screw extruder.

[0091] [Comparative Example 1] Except for using P10 as the ethylene-based resin composition (A), a film for evaluation was produced in the same manner as in Example 1. The evaluation results are shown in Table 2.

[0092] Comparative Example 2 Except for using P11 as the ethylene-based resin composition (A), a film for evaluation was produced in the same manner as in Example 1. The evaluation results are shown in Table 2.

[0093] Comparative Example 3 Except for using P12 as the ethylene-based resin composition (A), a film for evaluation was produced in the same manner as in Example 1. The evaluation results are shown in Table 2.

[0094] [Table 2]

[0095] [Evaluation results] The films of Examples 1 to 5 had good liquid filling properties and a wide range of transverse sealing temperatures from low to high, as shown in Table 2. Among them, Example 3 contained a good balance of low-crystalline and high-crystalline components, and showed results over a particularly wide range of filling temperatures. On the other hand, the films of Comparative Examples 1 to 3 have a narrower range of transverse sealing temperature than the films of the Examples, and are inferior in filling suitability.

Claims

1. An ethylene-based resin composition comprising an ethylene-based resin composition (A) having the following characteristics, wherein the ethylene-based resin composition (A) contains an ethylene-based resin (B) and an ethylene-based resin (C), each of which has the following characteristics: the ethylene-based resin (C) is a copolymer of ethylene and a (meth)acrylic acid ester, The ethylene-based resin composition (A) contains 60 to 95% by weight of the ethylene-based resin (B) and 5 to 40% by weight of the ethylene-based resin (C), The ethylene-based resin composition. Ethylene-based resin composition (A): An ethylene-based resin composition that simultaneously satisfies the following properties (A-1) to (A-3): (A-1) MFR (190°C, 21.18 N load) of 1 to 15 g / 10 min (A-2) Density is 0.915 to 0.940 g / cm ３ (A-3) In an elution curve obtained by temperature rising elution fractionation (TREF) with orthodichlorobenzene, the following (i) to (iii) are satisfied: (i) The compound has at least one peak at an elution temperature of 85°C or lower and at least one peak at an elution temperature of 85°C or higher. (ii) The proportion of eluates having an elution temperature of 85°C or less (eluates (a1) having an elution temperature of 55°C or less + eluates (a2) having an elution temperature of 55°C to 70°C + eluates (a3) ​​having an elution temperature of 70°C to 85°C) is 45 to 90% by weight. (iii) The proportion of the eluted substance (a4) having an elution temperature of 85° C. or higher is 10 to 55% by weight. (However, the total of the proportions of (a1), (a2), (a3), and (a4) is 100% by weight.) Ethylene-based resin (B): One or more ethylene-α-olefin copolymers that simultaneously satisfy the following properties (B-1) and (B-2) (at least one of the α-olefins is an α-olefin having 6 or more carbon atoms). (B-1) MFR (190°C, 21.18N load) of 4 to 18 g / 10 min (B-2) Density is 0.910 to 0.940 g / cm ３ Ethylene-based resin (C): An ethylene-based resin produced by radical polymerization that simultaneously satisfies the following properties (C-1) and (C-2): (C-1) MFR (190°C, 21.18 N load) of 1 to 15 g / 10 min (C-2) A melting point measured by differential scanning calorimetry (DSC) of 100°C or less

2. The ethylene-based resin composition according to claim 1, wherein the ethylene-based resin composition (A) further has the following property (A-3)': (A-3)' In an elution curve obtained by temperature rising elution fractionation (TREF) with orthodichlorobenzene, the following (iv) to (vii) are satisfied: (iv) The elution temperature has at least one peak at 55°C or less and at least one peak between 55°C and 85°C. (v) The proportion of the eluted substance (a1) having an elution temperature of 55° C. or less is 5 to 30% by weight. (vi) The proportion of the eluate (a2) at an elution temperature of 55°C to 70°C is 1 to 30% by weight. (vii) The proportion of the eluate (a3) ​​at an elution temperature of 70 to 85°C is 20 to 55% by weight. (However, the total of the proportions of (a1), (a2), (a3), and (a4) is 100% by weight.)

3. The ethylene-based resin composition according to any one of claims 1 to 2, wherein the ethylene-based resin composition (A) further has the following property (A-3)": (A-3)" The elution curve obtained by temperature rising elution fractionation (TREF) with orthodichlorobenzene satisfies the following (viii) to (xi): (viii) The ratio of the proportion of eluted substances (a1) having an elution temperature of 55°C or lower to the proportion of eluted substances (a2) having an elution temperature of 55°C to 70°C is 1 to 5. (ix) The ratio of the proportion of the eluate (a3) ​​at an elution temperature of 70 to 85°C to the proportion of the eluate (a2) at an elution temperature of 55 to 70°C is 1 to 5. (x) The ratio of the proportion of the eluate (a3) ​​having an elution temperature of 70 to 85°C to the proportion of the eluate (a1) having an elution temperature of 55°C or lower is 1 to 5. (xi) The ratio of the proportion of eluates ((a1) + (a2)) having an elution temperature of 70°C or less to the proportion of eluates ((a3) + (a4)) having an elution temperature of 70°C or more is 0.2 to 1.

2. (However, the total of the proportions of (a1), (a2), (a3), and (a4) does not exceed 100% by weight. %.)

4. The ethylene-based resin composition according to any one of claims 1 to 3, wherein the ethylene-based resin composition (A) further contains a high-pressure low-density polyethylene (D) having the following properties (D-1) to (D-2): (D-1) MFR (190°C, 21.18 N load) of 1 to 20 g / 10 min (D-2) Density is 0.915 to 0.930 g / cm ３

5. 5. The ethylene-based resin composition according to claim 4, wherein the ethylene-based resin composition (A) contains 60 to 85% by weight of the ethylene-based resin (B), 5 to 25% by weight of the ethylene-based resin (C), and 5 to 30% by weight of the high-pressure low-density polyethylene (D).

6. A laminate comprising at least three layers: a sealant layer (X), an intermediate layer (Y), and a substrate layer (Z), wherein the intermediate layer (Y) is formed using the ethylene-based resin composition according to any one of claims 1 to 5.

7. The laminated ... A laminate comprising the ethylene-based resin composition according to any one of claims 1 to 5.

8. A packaging film using the laminate according to claim 6 or 7.

9. 9. The packaging film according to claim 8, which is a film for packaging contents containing liquid.

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