Exposure apparatus and inspection method

Abstract

In order to inspect whether or not a spatial light modulator has a defective element, this exposure device exposes an object to pattern light corresponding to drawing data and generated by a spatial light modulator having a plurality of elements, and comprises: a data output unit that outputs the drawing data to the spatial light modulator; an illumination optical system that irradiates the spatial light modulator with illumination light; a fist mobile object that holds the object; a projection optical system that projects an image of the pattern light generated by the spatial light modulator onto the object; a detection unit that detects the projected image of the pattern light; and a determination unit that, on the basis of a detection result from the detection unit, determines whether or not the spatial light modulator can generate the pattern light corresponding to the drawing data outputted from the data output unit.　

Description

[Technical Field]

[0001] The present invention relates to an exposure apparatus and an inspection method. [Background technology]

[0002] Traditionally, the lithography process for manufacturing electronic devices (microdevices) such as liquid crystal and organic electroluminescence (EL) display panels and semiconductor elements (integrated circuits, etc.) has used step-and-repeat projection exposure equipment (so-called steppers) or step-and-scan projection exposure equipment (so-called scanning steppers, also called scanners). This type of exposure equipment projects and exposes a mask pattern for the electronic device onto a photosensitive layer applied to the surface of an exposed substrate (hereinafter simply referred to as the substrate), such as a glass substrate, semiconductor wafer, printed wiring board, or resin film.

[0003] Because it takes time and money to fabricate a mask substrate on which the mask pattern is fixedly formed, an exposure apparatus is known that uses a spatial light modulation element (variable mask pattern generator) such as a digital mirror device (DMD) in which a large number of micromirrors that can be slightly displaced are regularly arranged instead of a mask substrate (see, for example, Patent Document 1). In the exposure apparatus disclosed in Patent Document 1, for example, illumination light obtained by mixing light from a laser diode (LD) with a wavelength of 375 nm and light from an LD with a wavelength of 405 nm in a multimode fiber bundle is irradiated onto the digital mirror device (DMD), and the reflected light from each of the large number of tilt-controlled micromirrors is projected onto the substrate for exposure via an imaging optical system and a microlens array.

[0004] If a defective element occurs in a DMD, it may be impossible to project a desired pattern onto a substrate by exposure, and therefore it is desirable to identify a DMD that includes a defective element. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2019-23748 Summary of the Invention

[0006] According to a first aspect of the disclosure, an exposure apparatus exposes an object with pattern light corresponding to drawing data generated by a spatial light modulator having a plurality of elements, and includes: a data output unit that outputs the drawing data to the spatial light modulator; an illumination optical system that irradiates illumination light onto the spatial light modulator; a first moving body that holds the object; a projection optical system that projects an image of the pattern light generated by the spatial light modulator onto the object; a detection unit that detects the projected image of the pattern light; and a determination unit that determines, based on a detection result of the detection unit, whether the spatial light modulator is able to generate pattern light corresponding to the drawing data output from the data output unit, wherein the detection unit has a plurality of pixels and includes an image sensor that captures the image of the pattern light projected from the spatial light modulator; and a detection optical system provided above the image sensor, and the detection optical system detects an image within one pixel of the image sensor. a first number of said elements greater than or equal to three; a first state in which the pattern light is imaged on the image sensor as shown in FIG. Among the first number of elements, a second number of elements that is equal to or greater than 2 and is less than the first number Included within the one pixel The pattern light is imaged on the imaging element so as to In the first state, the pattern light is imaged on the image sensor, and the determination unit based on a detection result of a first pattern image projected when at least the first number of the elements are made to generate a first inspection pattern and a detection result of a second pattern image projected when at least the first number of the elements are made to generate a second inspection pattern; determining whether the spatial light modulator has a defective element that cannot be driven in accordance with the drawing data output from the data output unit; In the second state, the position of the defective element is determined based on a detection result of a third pattern image projected when the first inspection pattern is generated on at least the second number of the elements, and a detection result of a fourth pattern image projected when the second inspection pattern is generated on at least the second number of the elements. .

[0007] According to a second aspect of the disclosure, an inspection method is an inspection method for inspecting a spatial light modulator of an exposure apparatus including: a spatial light modulator having a plurality of elements that generate pattern light corresponding to drawing data; an illumination optical system that irradiates the spatial light modulator with illumination light; and a projection optical system that projects an image of the pattern light generated by the spatial light modulator onto an object placed on a first moving body, wherein the inspection method is for inspecting a spatial light modulator of an exposure apparatus including: an imaging element having a plurality of pixels that captures an image of the pattern light projected from the spatial light modulator; of the first number greater than or equal to 3 The element Containsa first state in which the pattern light is imaged on the image sensor as shown in FIG. Among the first number of elements, a second number of elements that is equal to or greater than 2 and is less than the first number Included within the one pixel The pattern light is imaged on the imaging element so as to In the second state, the pattern light is imaged on the image sensor; and in the first state, based on a detection result of a first pattern image projected when at least the first number of the elements are made to generate a first inspection pattern and a detection result of a second pattern image projected when at least the first number of the elements are made to generate a second inspection pattern; determining whether the spatial light modulator has a defective element that cannot be driven in accordance with the drawing data; determining the position of the defective element based on a detection result of a third pattern image projected when the first inspection pattern is generated on at least the second number of the elements in the second state, and a detection result of a fourth pattern image projected when the second inspection pattern is generated on at least the second number of the elements; Includes.

[0008] According to a third aspect of the disclosure, an inspection method is a method for inspecting a spatial light modulator of an exposure apparatus including a spatial light modulator having a plurality of elements that generate pattern light corresponding to drawing data, an illumination optical system that irradiates the spatial light modulator with illumination light, and a projection optical system that projects an image of the pattern light generated by the spatial light modulator onto an object placed on a first moving body, the inspection method including: exposing a first pattern image projected when a first inspection pattern is generated by the spatial light modulator onto the object; exposing a second pattern image projected when a second inspection pattern is generated by the spatial light modulator onto the object; measuring the first pattern image and the second pattern image exposed onto the object using a measurement device to determine a difference between the first pattern image and the second pattern image; and determining whether or not the spatial light modulator has any defective elements that cannot be driven in accordance with the drawing data based on the difference, wherein the first inspection pattern is a defective element that is not capable of being driven in accordance with the drawing data among the plurality of elements. of part plural of No. 1 The second test pattern is a pattern in which the element is in an ON state. the plurality of first elements This is a pattern in which the signal is in the OFF state.

[0009] According to a fourth aspect of the disclosure, an inspection method is a method for inspecting a spatial light modulator of an exposure apparatus including a spatial light modulator having a plurality of elements that generate pattern light corresponding to drawing data, an illumination optical system that irradiates the spatial light modulator with illumination light, and a projection optical system that projects an image of the pattern light generated by the spatial light modulator onto an object placed on a first moving body, the inspection method including: exposing a photochromic element with a first pattern image projected when a first inspection pattern is generated on the spatial light modulator; exposing the photochromic element with a second pattern image projected when a second inspection pattern is generated on the spatial light modulator; measuring the first pattern image and the second pattern image exposed on the photochromic element using a measurement device to determine a difference between the first pattern image and the second pattern image; and determining whether or not the spatial light modulator has a defective element that cannot be driven according to the drawing data based on the difference; of part plural of No. 1 The second test pattern is a pattern in which the element is in an ON state. the plurality of first elements This is a pattern in which the signal is in the OFF state.

[0010] According to a fifth aspect of the disclosure, an exposure apparatus is an exposure apparatus that exposes an object with pattern light corresponding to drawing data generated by a spatial light modulator having a plurality of elements, and includes an illumination optical system that irradiates the spatial light modulator with illumination light, a first moving body that holds the object, a projection optical system that projects the pattern light generated by the spatial light modulator onto the object, and a measurement unit that obtains a measurement result of an image of the pattern light on the object, wherein the measurement unit obtains a difference between a measurement result of a first pattern image projected onto the object when a first inspection pattern is generated by the spatial light modulator and a measurement result of a second pattern image projected onto the object when a second inspection pattern is generated by the spatial light modulator, and measures whether or not the spatial light modulator has a defective element that cannot be driven according to the drawing data based on the difference, and the first inspection pattern is of part plural of No. 1 The second test pattern is a pattern in which the element is in an ON state. the plurality of first elements This is a pattern in which the signal is in the OFF state.

[0011] According to a sixth aspect of the disclosure, an exposure apparatus is an exposure apparatus that exposes an object with pattern light corresponding to drawing data generated by a spatial light modulator having a plurality of elements, and includes an illumination optical system that irradiates the spatial light modulator with illumination light, a first moving body that holds photochromic elements, a projection optical system that projects the pattern light generated by the spatial light modulator onto the photochromic elements, and a measurement unit that obtains measurement results of the photochromic elements onto which an image of the pattern light is projected, wherein the measurement unit obtains a difference between a measurement result of the photochromic elements when a first inspection pattern is generated by the spatial light modulator and a measurement result of the photochromic elements when a second inspection pattern is generated by the spatial light modulator, and determines whether the spatial light modulator has a defective element that cannot be driven according to the drawing data based on the difference, and the first inspection pattern is a measurement result of the photochromic elements among the plurality of elements. of part plural of No. 1 The second test pattern is a pattern in which the element is in an ON state. the plurality of first elements This is a pattern in which the signal is in the OFF state.

[0012] The configurations of the embodiments described below may be modified as appropriate, and at least a portion of the configuration may be replaced with other components. Furthermore, components that are not particularly limited in terms of their placement may be placed in any position that can achieve their function, not limited to the placement disclosed in the embodiments. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a perspective view showing the outline of the external configuration of an exposure apparatus according to one embodiment. [Figure 2]FIG. 2 is a diagram showing an example of the arrangement of the projection areas of the DMD projected onto the substrate by the projection units of the multiple exposure modules. [Figure 3] FIG. 3 is a diagram for explaining the state of the continuous exposure by each of the four specific projection areas in FIG. [Figure 4] FIG. 4 is an optical layout diagram showing a specific configuration of two exposure modules aligned in the X-axis direction (scanning exposure direction) as viewed in the XZ plane. [Figure 5] Figure 5(A) is a diagram showing a schematic diagram of a DMD, Figure 5(B) is a diagram showing the DMD when the power is OFF, Figure 5(C) is a diagram explaining the mirror in the ON state, and Figure 5(D) is a diagram explaining the mirror in the OFF state. [Figure 6] FIG. 6 is a diagram that schematically shows a state in which the DMD and the illumination unit are tilted by an angle θk in the XY plane. [Figure 7] FIG. 7 is a diagram for explaining in detail the imaging state of the micromirrors of the DMD by the projection unit. [Figure 8] FIG. 8 is a diagram showing a schematic configuration of an alignment device provided on a calibration reference portion attached to an end portion on a substrate holder of an exposure apparatus. [Figure 9] FIG. 9 is a view of the substrate holder as seen from the +Z direction. [Figure 10] Figure 10(A) is a diagram showing the schematic configuration of an inspection device including a magnifying imaging system provided in an inspection section provided at the end of a substrate holder, and Figure 10(B) is a diagram showing the schematic configuration of an inspection device not including a magnifying imaging system provided in an inspection section provided at the end of a substrate holder. [Figure 11] FIG. 11 is a functional block diagram of an inspection control device provided in the exposure apparatus. [Figure 12] FIG. 12 is a flowchart illustrating an example of processing executed by the inspection control device. [Figure 13] FIG. 13 is a flowchart showing the details of the inspection process. [Figure 14]Figure 14(A) is a diagram showing an image of the first test pattern projected onto the image sensor when there are no defective elements in the DMD, Figure 14(B) is a diagram showing an image of the first test pattern projected onto one pixel of the image sensor surrounded by a dotted line in Figure 14(A), Figure 14(C) is a diagram showing an image of the second test pattern projected onto the image sensor when there are no defective elements in the DMD, and Figure 14(D) is a diagram showing an image of the second test pattern projected onto one pixel of the image sensor surrounded by a dotted line in Figure 14(C). [Figure 15] Figure 15(A) is a diagram showing multiple elements included in an area of ​​a DMD corresponding to one pixel of an imaging element, and Figure 15(B) is a diagram explaining the case where multiple elements of a DMD are divided into blocks. [Figure 16] FIG. 16 is a diagram showing a plurality of elements of the DMD corresponding to one pixel of the imaging element. [Figure 17] 17(A) is a diagram showing a first modified example of the images of the first and second test patterns projected onto the image sensor when there are no defective elements on the DMD, and FIG. 17(B) is a diagram showing a second modified example of the images of the first and second test patterns projected onto the image sensor when there are no defective elements on the DMD.

[0014] A pattern exposure apparatus (hereinafter simply referred to as exposure apparatus) according to one embodiment will be described with reference to the drawings.

[0015] [Overall configuration of exposure device] 1 is a perspective view showing an outline of the external configuration of an exposure apparatus EX according to one embodiment. The exposure apparatus EX is an apparatus that projects exposure light, the intensity distribution of which is dynamically modulated in space by a spatial light modulator (SLM), onto an exposed substrate as an image. Examples of spatial light modulators include liquid crystal elements, digital micromirror devices (DMDs), and magneto-optic spatial light modulators (MOSLMs). The exposure apparatus EX according to this embodiment includes a DMD 10 as a spatial light modulator, but may also include other spatial light modulators.

[0016] In a specific embodiment, the exposure apparatus EX is a step-and-scan projection exposure apparatus (scanner) that exposes a rectangular (square) glass substrate used in display devices (flat panel displays) and the like. The glass substrate is a substrate P for flat panel displays, with at least one side or diagonal length of 500 mm or more and a thickness of 1 mm or less. The exposure apparatus EX exposes a projected image of a pattern created by a DMD onto a photosensitive layer (photoresist) formed with a certain thickness on the surface of the substrate P. After exposure, the substrate P is unloaded from the exposure apparatus EX and sent to a predetermined process step (film formation step, etching step, plating step, etc.) after the development step.

[0017] The exposure apparatus EX is equipped with a stage device that includes a pedestal 2 placed on active vibration isolation units 1a, 1b, 1c, and 1d (1d not shown), a base plate 3 placed on the pedestal 2, an XY stage 4A (first drive unit) that is movable two-dimensionally on the base plate 3, a substrate holder 4B (first movable body) that holds a substrate P (object) on a flat surface by suction on the XY stage 4A, and laser length measurement interferometers (hereinafter simply referred to as interferometers) IFX, IFY1 to IFY4 that measure the two-dimensional movement position of the substrate holder 4B (substrate P). Such a stage device is disclosed, for example, in U.S. Patent Publication No. 2010 / 0018950 and U.S. Patent Publication No. 2012 / 0057140.

[0018] In FIG. 1, the XY plane of the Cartesian coordinate system XYZ is set parallel to the flat surface of the base 3 of the stage device, and the XY stage 4A is set to be able to move translationally within the XY plane. In this embodiment, the direction parallel to the X axis of the coordinate system XYZ is set as the scanning movement direction of the substrate P (XY stage 4A) during scan exposure. The movement position of the substrate P in the X axis direction is sequentially measured by the interferometer IFX, and the movement position in the Y axis direction is sequentially measured by at least one (preferably two or more) of the four interferometers IFY1 to IFY4. The substrate holder 4B is configured to be able to move slightly in the Z axis direction perpendicular to the XY plane relative to the XY stage 4A and to be able to tilt slightly in any direction relative to the XY plane, allowing for active focus adjustment and leveling (parallelism) adjustment between the surface of the substrate P and the imaging plane of the projected pattern. Furthermore, the substrate holder 4B is configured to be able to rotate slightly (θz rotation) around an axis parallel to the Z axis in order to actively adjust the tilt of the substrate P in the XY plane.

[0019] The exposure apparatus EX further includes an optical table 5 that holds multiple exposure (drawing) module groups MU(A), MU(B), and MU(C), and main columns 6a, 6b, 6c, and 6d (6d is not shown) that support the optical table 5 from the pedestal 2. Each of the multiple exposure module groups MU(A), MU(B), and MU(C) is attached to the +Z side of the optical table 5. Each of the multiple exposure module groups MU(A), MU(B), and MU(C) includes an illumination unit ILU that is attached to the +Z side of the optical table 5 and that receives illumination light from an optical fiber unit FBU, and a projection unit PLU that is attached to the -Z side of the optical table 5 and has an optical axis parallel to the Z axis. Each of the exposure module groups MU(A), MU(B), and MU(C) further includes a DMD 10 that serves as an optical modulation unit that reflects the illumination light from the illumination unit ILU in the -Z direction and causes it to enter the projection unit PLU. The detailed configuration of the exposure module including the illumination unit ILU, the DMD 10, and the projection unit PLU will be described later.

[0020] A plurality of alignment systems (microscopes) ALG are attached to the -Z direction side of the optical surface plate 5 of the exposure apparatus EX to detect alignment marks formed at a plurality of predetermined positions on the substrate P. A calibration reference unit CU is provided at the -X direction end of the substrate holder 4B to confirm (calibrate) the relative positional relationship in the XY plane of the detection fields of the alignment systems ALG, to confirm (calibrate) the baseline error between the projection positions of the pattern images projected from the projection units PLU of each of the exposure module groups MU(A), MU(B), and MU(C) and the positions of the detection fields of the alignment systems ALG, or to confirm the position and image quality of the pattern images projected from the projection units PLU. Note that, although some of the modules are not shown in FIG. 1, in this embodiment, each of the exposure module groups MU(A), MU(B), and MU(C) includes, for example, nine modules arranged at regular intervals in the Y-axis direction, although the number of modules may be more or less than nine. In addition, although three rows of exposure modules are arranged in the X-axis direction in FIG. 1, the number of rows of exposure modules arranged in the X-axis direction may be two or less, or may be four or more.

[0021] 2 is a diagram showing an example of the arrangement of projection areas IAn of the DMD10 projected onto the substrate P by the projection units PLU of each of the exposure module groups MU(A), MU(B), and MU(C), and the Cartesian coordinate system XYZ is set in the same way as in FIG. 1. In this embodiment, the first row of exposure module groups MU(A), the second row of exposure module groups MU(B), and the third row of exposure module groups MU(C), which are arranged spaced apart in the X-axis direction, each comprise nine modules aligned in the Y-axis direction. The exposure module group MU(A) comprises nine modules MU1 to MU9 arranged in the +Y direction, the exposure module group MU(B) comprises nine modules MU10 to MU18 arranged in the -Y direction, and the exposure module group MU(C) comprises nine modules MU19 to MU27 arranged in the +Y direction. All modules MU1 to MU27 have the same configuration, and when exposure module group MU(A) and exposure module group MU(B) are positioned opposite each other in the X-axis direction, exposure module group MU(B) and exposure module group MU(C) are positioned back-to-back in the X-axis direction.

[0022] 2, the shape of the projection areas IA1, IA2, IA3, ..., IA27 (sometimes represented as IAn, where n is 1 to 27) by each of the modules MU1 to MU27 is, for example, a rectangle extending in the Y-axis direction with an aspect ratio of approximately 1:2. In this embodiment, as the substrate P is scanned and moved in the +X direction, spliced ​​exposure is performed at the -Y-direction end of each of the first row of projection areas IA1 to IA9 and the +Y-direction end of each of the second row of projection areas IA10 to IA18. Then, areas on the substrate P that were not exposed by each of the first and second rows of projection areas IA1 to IA18 are spliced ​​and exposed by each of the third row of projection areas IA19 to IA27. The center point of each of the projection areas IA1 to IA9 in the first column is located on a line k1 parallel to the Y axis, the center point of each of the projection areas IA10 to IA18 in the second column is located on a line k2 parallel to the Y axis, and the center point of each of the projection areas IA19 to IA27 in the third column is located on a line k3 parallel to the Y axis. The distance between lines k1 and k2 in the X axis direction is set to a distance XL1, and the distance between lines k2 and k3 in the X axis direction is set to a distance XL2.

[0023] Here, let us assume that the joint between the −Y-direction end of projection area IA9 and the +Y-direction end of projection area IA10 is OLa, the joint between the −Y-direction end of projection area IA10 and the +Y-direction end of projection area IA27 is OLb, and the joint between the +Y-direction end of projection area IA8 and the −Y-direction end of projection area IA27 is OLc. The state of the joint exposure will be described with reference to FIG. 3. In FIG. 3, the Cartesian coordinate system XYZ is set to be the same as in FIGS. 1 and 2, and the coordinate system X'Y' within projection areas IA8, IA9, IA10, and IA27 (and all other projection areas IAn) is set to be tilted by an angle θk with respect to the X and Y axes (lines k1 to k3) of the Cartesian coordinate system XYZ. That is, the entire DMD 10 is tilted by an angle θk within the XY plane so that the two-dimensional array of the numerous micromirrors of the DMD 10 becomes the coordinate system X'Y'.

[0024] The circular area encompassing each of the projection areas IA8, IA9, IA10, and IA27 in FIG. 3 (and all other projection areas IAn as well) represents the circular image field PLf' of the projection unit PLU. At the joint OLa, the projected image of the micromirrors arranged diagonally (at an angle θk) at the end of the projection area IA9 in the -Y' direction is set to overlap with the projected image of the micromirrors arranged diagonally (at an angle θk) at the end of the projection area IA10 in the +Y' direction. At the joint OLb, the projected image of the micromirrors arranged diagonally (at an angle θk) at the end of the projection area IA10 in the -Y' direction is set to overlap with the projected image of the micromirrors arranged diagonally (at an angle θk) at the end of the projection area IA27 in the +Y' direction. Similarly, Joint OLc In this case, the projection images of the micromirrors arranged diagonally (at an angle θk) at the end of the +Y' direction of the projection area IA8 and the projection images of the micromirrors arranged diagonally (at an angle θk) at the end of the -Y' direction of the projection area IA27 are set to overlap.

[0025] [Configuration of lighting unit] FIG. 4 is an optical layout diagram showing the specific configuration of module MU18 in exposure module group MU(B) and module MU19 in exposure module group MU(C) shown in FIGS. 1 and 2, viewed in the XZ plane. The Cartesian coordinate system XYZ in FIG. 4 is set to be the same as the Cartesian coordinate system XYZ in FIGS. 1 to 3. As is clear from the arrangement of each module in the XY plane shown in FIG. 2, module MU18 is shifted by a fixed distance in the +Y direction relative to module MU19, and they are installed back-to-back. Since the optical components in module MU18 and module MU19 are made of the same materials and have the same configuration, the optical configuration of module MU18 will be mainly described in detail here. The optical fiber unit FBU shown in FIG. 1 is composed of 27 optical fiber bundles FB1 to FB27 corresponding to the 27 modules MU1 to MU27 shown in FIG. 2.

[0026] The illumination unit ILU of the module MU18 is composed of a mirror 100 that reflects illumination light ILm traveling in the -Z direction from the output end of the optical fiber bundle FB18, a mirror 102 that reflects the illumination light ILm from mirror 100 in the -Z direction, an input lens system 104 that acts as a collimator lens, an illuminance adjustment filter 106, an optical integrator 108 that includes a micro fly's eye (MFE) lens and a field lens, etc., a condenser lens system 110, and an inclined mirror 112 that reflects the illumination light ILm from the condenser lens system 110 toward the DMD 10. The mirror 102, input lens system 104, optical integrator 108, condenser lens system 110, and inclined mirror 112 are arranged along an optical axis AXc that is parallel to the Z axis.

[0027] The optical fiber bundle FB18 is composed of one optical fiber line or a bundle of multiple optical fiber lines. The numerical aperture (NA, also called the divergence angle) of the illumination light ILm emitted from the output end of the optical fiber bundle FB18 (each optical fiber line) is set so that it can enter the subsequent input lens system 104 without being eclipsed. The position of the front focal point of the input lens system 104 is designed to be the same as the position of the output end of the optical fiber bundle FB18. Furthermore, the position of the back focal point of the input lens system 104 is set so that the illumination light ILm from a single or multiple point light sources formed at the output end of the optical fiber bundle FB18 is superimposed on the incident surface of the MFE lens 108A of the optical integrator 108. Therefore, the incident surface of the MFE lens 108A is Koehler illuminated by the illumination light ILm from the output end of the optical fiber bundle FB18. In the initial state, the geometric center point of the output end of the optical fiber bundle FB18 in the XY plane is located on the optical axis AXc, and the chief ray (center line) of the illumination light ILm from the point light source at the output end of the optical fiber line is parallel to (or coaxial with) the optical axis AXc.

[0028] The illumination light ILm from the input lens system 104 is attenuated by an illumination adjustment filter 106 to a value between 0% and 90%, and then passes through an optical integrator 108 (MFE lens 108A, field lens, etc.) and enters a condenser lens system 110. The MFE lens 108A is a two-dimensional array of many rectangular microlenses, each measuring several tens of micrometers square. Its overall shape in the XY plane is set to be approximately similar to the overall shape of the mirror surface of the DMD 10 (aspect ratio: approximately 1:2). The position of the front focal point of the condenser lens system 110 is set to be approximately the same as the position of the exit surface of the MFE lens 108A. Therefore, each of the illumination light beams from the point light sources formed on the exit side of each of the many microlenses of the MFE lens 108A is converted into approximately parallel beams by the condenser lens system 110, reflected by an inclined mirror 112, and then superimposed on the DMD 10 to form a uniform illumination distribution. A surface light source in which a large number of point light sources (light-converging points) are densely arranged two-dimensionally is generated on the exit surface of the MFE lens 108A, and therefore the MFE lens 108A functions as a surface light source member.

[0029] In module MU18 shown in FIG. 4, optical axis AXc, which is parallel to the Z axis and passes through condenser lens system 110, is bent by tilted mirror 112 and reaches DMD 10. The optical axis between tilted mirror 112 and DMD 10 is referred to as optical axis AXb. In this embodiment, a neutral plane including the center points of each of the numerous micromirrors of DMD 10 is set parallel to the XY plane. Therefore, the angle between the normal to this neutral plane (parallel to the Z axis) and optical axis AXb is the angle of incidence θα of illumination light ILm with respect to DMD 10. DMD 10 is attached to the underside of mount 10M, which is fixed to the support column of illumination unit ILU. To finely adjust the position and orientation of DMD 10, mount 10M is provided with a fine-motion stage that combines a parallel link mechanism and an extendable piezoelectric element, such as that disclosed in International Patent Publication No. 2006 / 120927.

[0030] [DMD configuration] Fig. 5(A) is a diagram showing a schematic of DMD 10, Fig. 5(B) is a diagram showing DMD 10 when the power is OFF, Fig. 5(C) is a diagram for explaining the mirror in the ON state, and Fig. 5(D) is a diagram for explaining the mirror in the OFF state. Note that in Fig. 5(A) to Fig. 5(D), mirrors in the ON state are indicated by hatching.

[0031] The DMD 10 has a plurality of micromirrors Ms whose reflection angles can be changed. In this embodiment, the DMD 10 is of a roll and pitch drive type that switches between an ON state and an OFF state by tilting the micromirrors Ms in the roll direction and in the pitch direction.

[0032] As shown in Figure 5(B), when the power is off, the reflective surface of each micromirror Ms is set parallel to the X'Y' plane. The arrangement pitch of each micromirror Ms in the X' direction is Pdx (μm), and the arrangement pitch in the Y' direction is Pdy (μm), but in practice, Pdx = Pdy.

[0033] Each micromirror Ms is turned ON by tilting around the Y' axis. FIG. 5C shows a case where only the central micromirror Ms is turned ON, while the other micromirrors Ms are in a neutral state (neither ON nor OFF). Each micromirror Ms is turned OFF by tilting around the X' axis. FIG. 5D shows a case where only the central micromirror Ms is turned OFF, while the other micromirrors Ms are in a neutral state. For simplicity, although not shown, the micromirrors Ms in the ON state are driven to tilt at a predetermined angle from the X'Y' plane so that illumination light irradiated onto the micromirrors Ms in the ON state is reflected in the X-axis direction of the XZ plane. The micromirrors Ms in the OFF state are driven to tilt at a predetermined angle from the X'Y' plane so that illumination light irradiated onto the micromirrors Ms in the OFF state is reflected in the Y-axis direction of the YZ plane. The DMD 10 generates an exposure pattern by switching each micromirror Ms between ON and OFF states.

[0034] The illumination light reflected by the mirror in the OFF state is absorbed by a light absorber (not shown).

[0035] Although the DMD 10 has been described as an example of a spatial light modulator and is therefore a reflective type that reflects laser light, the spatial light modulator may be a transmissive type that transmits laser light or a diffractive type that diffracts laser light. The spatial light modulator can modulate laser light spatially and temporally.

[0036] 4, illumination light ILm irradiated onto micromirrors Ms of the DMD 10 that are in the ON state is reflected in the X-axis direction within the XZ plane so as to head towards the projection unit PLU. On the other hand, illumination light ILm irradiated onto micromirrors Ms of the DMD 10 that are in the OFF state is reflected in the Y-axis direction within the YZ plane so as not to head towards the projection unit PLU.

[0037] A movable shutter 114 is removably provided in the optical path between the DMD 10 and the projection unit PLU to block light reflected from the DMD 10 during non-exposure periods. As shown on the module MU19 side, the movable shutter 114 is rotated to an angular position where it is removed from the optical path during exposure periods, and as shown on the module MU18 side, it is rotated to an angular position where it is inserted obliquely into the optical path during non-exposure periods. A reflective surface is formed on the DMD 10 side of the movable shutter 114, and light reflected therefrom from the DMD 10 is irradiated onto a light absorber 117. The light absorber 117 absorbs light energy in the ultraviolet wavelength range (wavelengths of 400 nm or less) without re-reflecting it and converts it into heat energy. For this reason, the light absorber 117 is also provided with a heat dissipation mechanism (heat dissipation fins and a cooling mechanism). Although not shown in Figure 4, the reflected light from the micromirror Ms of DMD10, which is in the OFF state during the exposure period, is absorbed by a similar light absorber (not shown in Figure 4) installed in the Y-axis direction (a direction perpendicular to the plane of the paper in Figure 4) with respect to the optical path between DMD10 and projection unit PLU, as described above.

[0038] [Configuration of the projection unit] The projection unit PLU attached to the underside of the optical table 5 is configured as a double-telecentric imaging projection lens system composed of a first lens system 116 and a second lens system 118 arranged along an optical axis AXa parallel to the Z axis. The first lens system 116 and the second lens system 118 are each configured to move translationally in the direction along the Z axis (optical axis AXa) by a micro-motion actuator relative to a support column fixed to the underside of the optical table 5. The projection magnification Mp of the imaging projection lens system formed by the first lens system 116 and the second lens system 118 is determined by the relationship between the array pitch Pd of the micromirrors on the DMD 10 and the minimum line width (minimum pixel dimension) Pg of the pattern image projected within the projection area IAn (n = 1 to 27) on the substrate P.

[0039] As an example, if the required minimum line width (minimum pixel dimension) Pg is 1 μm and the micromirror array pitches Pdx and Pdy are each 5.4 μm, the projection magnification Mp is set to approximately 1 / 6, taking into consideration the tilt angle θk in the XY plane of the projection area IAn (DMD 10) described above in Figure 3. The imaging projection lens system consisting of lens systems 116 and 118 inverts / flips a reduced image of the entire mirror surface of DMD 10 and forms an image on the projection area IA18 (IAn) on the substrate P.

[0040] The first lens system 116 of the projection unit PLU is movable along the optical axis AXa by an actuator to fine-tune the projection magnification Mp (approximately ±tens of ppm), while the second lens system 118 is movable along the optical axis AXa by an actuator to enable high-speed focus adjustment. Furthermore, to measure the positional change in the Z-axis direction of the surface of the substrate P with submicron accuracy, multiple oblique-incidence focus sensors 120 are provided below the optical surface plate 5. The multiple focus sensors 120 measure the overall positional change in the Z-axis direction of the substrate P, the positional change in the Z-axis direction of partial regions on the substrate P corresponding to each projection area IAn (n = 1 to 27), or the partial tilt change of the substrate P. It is preferable that the focus sensors 120 measure the focus position before exposure in accordance with the scanning exposure of the substrate P. Therefore, since the scanning directions are the +X and -X directions, it is desirable to arrange the focus sensors 120 before and after the projection unit PLU.

[0041] As explained above in Figure 3, the illumination unit ILU and projection unit PLU described above require the projection area IAn to be tilted by an angle θk in the XY plane, so the DMD 10 and illumination unit ILU in Figure 4 (at least the optical path portion from mirror 102 to mirror 112 along the optical axis AXc) are arranged so that they are tilted overall by an angle θk in the XY plane.

[0042] Figure 6 shows the DMD10 and Lighting unit ILU6 is a diagram schematically illustrating, in the XY plane, a state in which the XY axis and the micromirror Ms of the DMD 10 are tilted by an angle θk in the XY plane. In FIG. 6, the Cartesian coordinate system XYZ is the same as the coordinate systems XYZ in FIGS. 1 to 4, and the coordinate system X'Y' for arranging the micromirrors Ms of the DMD 10 is the same as the coordinate system X'Y' shown in FIG. 3. The circle containing the DMD 10 is the image field PLf on the object plane side of the projection unit PLU, with the optical axis AXa located at its center. Meanwhile, the optical axis AXb, which is obtained by bending the optical axis AXc that passes through the condenser lens system 110 of the illumination unit ILU by the tilted mirror 112, is arranged so as to be tilted by an angle θk from the line Lu that is parallel to the X axis, when viewed in the XY plane.

[0043] [DMD imaging optical path] Next, with reference to Figure 7, the imaging state of the micromirrors Ms of the DMD 10 by the projection unit PLU (imaging projection lens system) will be described in detail. The Cartesian coordinate system X'Y'Z in Figure 7 is the same as the coordinate systems X'Y'Z shown in Figures 3 and 6, and Figure 7 illustrates the optical path from the condenser lens system 110 of the illumination unit ILU to the substrate P. Illumination light ILm from the condenser lens system 110 travels along the optical axis AXc, is totally reflected by the tilted mirror 112, and reaches the mirror surface of the DMD 10 along the optical axis AXb. Here, the micromirror Ms located at the center of the DMD 10 is called Msc, and the micromirrors Ms located on the periphery are called Msa, and it is assumed that these micromirrors Msc and Msa are in the ON state.

[0044] If the tilt angle of the micromirror Ms in the ON state is, for example, 17.5° with respect to the X'Y' plane (XY plane), the angle of incidence θα (the angle of the optical axis AXb from the optical axis AXa) of the illumination light ILm irradiated onto the DMD 10 is set to 35.0° in order to make the chief rays of the reflected light Sc and Sa from each of the micromirrors Msc and Msa parallel to the optical axis AXa of the projection unit PLU. Therefore, in this case, the reflective surface of the tilted mirror 112 is also tilted by 17.5° (= θα / 2) with respect to the X'Y' plane (XY plane). The chief ray Lc of the reflected light Sc from the micromirror Msc is coaxial with the optical axis AXa, and the chief ray La of the reflected light Sa from the micromirror Msa is parallel to the optical axis AXa, so that the reflected light Sc and Sa enter the projection unit PLU with a predetermined numerical aperture (NA).

[0045] The reflected light Sc forms a telecentric image ic of the micromirror Msc, which has been reduced by the projection magnification Mp of the projection unit PLU, on the substrate P at the position of the optical axis AXa. Similarly, the reflected light Sa forms a telecentric image ia of the micromirror Msa, which has been reduced by the projection magnification Mp of the projection unit PLU, on the substrate P at a position separated from the reduced image ic in the +X' direction. As an example, the first lens system 116 of the projection unit PLU is composed of two lens groups G1 and G2, and the second lens system 118 is composed of three lens groups G3, G4, and G5. An exit pupil (also simply referred to as a pupil) Ep is set between the lens group G3 and the lens group G4 of the second lens system 118. A light source image of the illumination light ILm (a collection of numerous point light sources formed on the exit surface side of the MFE lens 108A) is formed at the position of the pupil Ep, resulting in a Koehler illumination configuration. The pupil Ep is also called the aperture of the projection unit PLU, and the size (diameter) of this aperture is one factor that determines the resolving power of the projection unit PLU.

[0046] When the DMD10 is ON, the specularly reflected light from the micromirror Ms is set to pass through without being blocked by the maximum aperture (diameter) of the pupil Ep, and the numerical aperture NAi on the image side (substrate P side) in the equation R=k1·(λ / NAi), which expresses the resolution R, is determined by the maximum aperture of the pupil Ep and the distance to the rear (image side) focal point of the projection unit PLU (lens groups G1 to G5 as an imaging projection lens system). Also, the numerical aperture NAo on the object plane (DMD10) side of the projection unit PLU (lens groups G1 to G5) is expressed as the product of the projection magnification Mp and the numerical aperture NAi; if the projection magnification Mp is 1 / 6, then NAo=NAi / 6.

[0047] In the configurations of the illumination unit ILU and projection unit PLU shown in FIGS. 7 and 4, the exit end of the optical fiber bundle FBn (n = 1 to 27) connected to each module MUn (n = 1 to 27) is set in an optically conjugate relationship with the exit end side of the MFE lens 108A of the optical integrator 108 by the input lens system 104, and the entrance end side of the MFE lens 108A is set in an optically conjugate relationship with the center of the mirror surface (neutral plane) of the DMD 10 by the condenser lens system 110. As a result, the illumination light ILm irradiated onto the entire mirror surface of the DMD 10 has a uniform illuminance distribution (for example, intensity unevenness within ±1%) due to the action of the optical integrator 108. Furthermore, the exit end side of the MFE lens 108A and the plane of the pupil Ep of the projection unit PLU are set in an optically conjugate relationship by the condenser lens system 110 and the lens groups G1 to G3 of the projection unit PLU.

[0048] [Configuration of calibration reference unit CU] 8 is a diagram showing a schematic configuration of an alignment device 60 provided in a calibration reference unit CU attached to an end portion on the substrate holder 4B of the exposure apparatus EX. The alignment device 60 includes a reference mark 60a and a two-dimensional image sensor 60e. The alignment device 60 is used to measure and calibrate the positions of various modules, and is also used to calibrate the alignment system ALG.

[0049] The position of each of the modules MU1 to MU27 is measured by projecting an image of a calibration pattern onto a reference mark 60a of the alignment device 60 using the projection unit PLU, and measuring the relative position between the reference mark 60a and the image of the calibration pattern.

[0050] Furthermore, alignment system ALG can be calibrated by using alignment system ALG to measure reference mark 60a of alignment device 60. That is, the position of alignment system ALG can be determined by using alignment system ALG to measure reference mark 60a of alignment device 60. Furthermore, it is possible to determine the relative positions of alignment system ALG and modules MU1 to MU27 using reference mark 60a.

[0051] Furthermore, alignment system ALG can measure the position of an alignment mark on substrate P placed on substrate holder 4B, using reference mark 60a of alignment device 60 as a reference.

[0052] [Configuration of Inspection Unit IU] Next, the configuration of the inspection unit IU will be described. Fig. 9 is a view of the substrate holder 4B as seen from the +Z direction. Fig. 10 is a view showing the schematic configuration of inspection devices 400a to 400i provided in the inspection unit IU provided at the end of the substrate holder 4B in the +X direction.

[0053] In this embodiment, the inspection unit IU is provided on the opposite side of the substrate holder 4B from the calibration reference unit CU in the X-axis direction.

[0054] As shown in FIG. 9, the inspection unit IU has multiple inspection devices 400a-400i arranged in a direction (Y-axis direction) perpendicular to the scanning exposure direction (X-axis direction) of the substrate P. The inspection devices 400a-400i are devices for inspecting whether the DMDs 10 of the modules MU1-MU27 are capable of generating pattern light according to pattern data (drawing data). Specifically, these devices are devices for inspecting whether the DMDs 10 have defective elements (defective micromirrors) that cannot be driven according to the drawing data. Here, a defective element refers to an element that cannot be driven according to the drawing data, for example, because the micromirrors Ms of the DMDs 10 are stuck in the ON or OFF state.

[0055] The inspection devices 400a-400i are provided to correspond to, for example, the modules MU1-MU9 included in the exposure module group MU(A). That is, they are arranged so that the pitch P1 between the centers of adjacent modules in the Y-axis direction is equal to the pitch P2 between the centers of adjacent inspection devices in the Y-axis direction. In the following description, unless there is a particular need to distinguish between them, the inspection devices 400a-400i will be referred to as inspection devices 400. The inspection devices 400 may be provided to correspond to the modules MU1-MU27. That is, 27 inspection devices 400 may be arranged in the inspection unit IU. The number of inspection devices 400 is not limited to the number shown in FIG. 9 and may be 8 or less, or 10 or more.

[0056] As shown in Fig. 10(A), the inspection apparatus 400 includes a magnifying imaging system 401 that magnifies and forms an image of the pattern projected by the projection unit PLU, and a CCD or CMOS image sensor 402 that captures the magnified image. The inspection apparatus 400 has a conjugate relationship between an object (micromirror Ms) at a predetermined position on the surface of the DMD 10, the image of the DMD 10 on the imaging plane IPo, and the image of the DMD 10 on the image sensor 402. As shown in Fig. 10(B), the inspection apparatus 400 may also have a CCD or CMOS image sensor 402 that directly captures the pattern image projected by the projection unit PLU. In this case, the image sensor 402 is provided in the same plane as the substrate P or the substrate holder 4B.

[0057] 9, the image sensor 402 is tilted in the XY plane by the angle (θk: see FIG. 6) that the DMD 10 is tilted in the XY plane. Note that the image sensor 402 does not have to be disposed tilted in the XY plane.

[0058] Here, when using an imaging element to check whether the DMD 10 has defective elements, it is conceivable to have a one-to-one correspondence between the pixels of the imaging element and the elements (micromirrors) Ms of the DMD 10. In this case, by projecting an image of a pattern generated by the DMD 10 onto each pixel of the imaging element, capturing the projected image, and checking each pixel in the captured image using image processing or the like, it is possible to easily check whether the corresponding element of the DMD 10 has a defect.

[0059] However, in an actual exposure apparatus, the image of the pattern generated by the DMD 10 is usually reduced by the projection unit PLU and projected onto the substrate P. For example, as described above, the image of the pattern generated by the DMD 10 is reduced to, for example, about 1 / 6 by the projection unit PLU. Therefore, when there is a one-to-one correspondence between the pixels of the image pickup element and the elements of the DMD 10, the image of the pattern reduced and projected by the projection unit PLU needs to be enlarged by the magnification imaging system 401 to an inverse number of the reduction ratio. This results in an increase in the size of the magnification imaging system 401, which leads to an increase in the size of the inspection apparatus 400. In addition, at least the size of the DMD 10 Number of elementsTherefore, an image sensor having the same number of pixels as the image sensor will be used.

[0060] Therefore, in this embodiment, the magnification of the magnifying imaging system 401 is set so that the pattern images projected from the plurality of elements Ms of the DMD 10 are included in each pixel IPX of the image sensor 402.

[0061] For example, as shown in FIG. 16, one pixel IPX1 (dashed line) of the image sensor 402 includes multiple elements (micromirrors) Ms (solid lines) of the DMD 10. The DMD 10 is divided into multiple regions (IPX1 to IPX4) so ​​that one pixel IPX1 of the image sensor 402 includes 2×2=4 elements Ms of the DMD 10. At this time, the projected pattern image generated by the four elements Ms of the DMD 10 is enlarged so that it is projected onto the corresponding one pixel IPX1 of the image sensor 402. This reduces the number of pixels required by the image sensor 402 (for example, 1 / 4 of the number required when one pixel of the pattern image corresponds one-to-one to a pixel of the image sensor), allowing the size of the image sensor 402 to be reduced. Furthermore, since the magnification of the magnifying imaging system 401 can be reduced, the size of the magnifying imaging system 401 can be reduced.

[0062] The number of DMD 10 elements included in each pixel of the image sensor 402 is determined by the relationship between the magnification of the magnifying imaging system 401, the minimum pitch between pixels of the image of the pattern projected onto the substrate P, and the arrangement pitch of the pixels of the image sensor 402.

[0063] [Configuration of inspection control device] FIG. 11 is a functional block diagram of an inspection control device 300 that determines whether or not a defective element exists in the DMD 10 of each of the modules MU1 to MU27 based on input from the inspection device 400, and identifies the module of the DMD 10 that has a defective element.

[0064] As shown in FIG. 11, the inspection control device 300 includes an inspection pattern output unit 310 , a determination unit 301 , and a stage driving unit 305 .

[0065] The test pattern output unit 310 outputs test pattern data ID1 to ID27 to the modules MU1 to MU27, respectively. The DMD 10 of each of the modules MU1 to MU27 generates a pattern based on the test pattern data ID1 to ID27.

[0066] The determining unit 301 determines whether or not a defective element exists in the DMD 10 of each of the modules MU1 to MU27 based on the data input from the inspection devices 400a to 400i, and identifies the module of the DMD 10 that has a defective element.

[0067] The stage driving unit 305 drives the XY stage 4A so that the modules MU1 to MU27 to be inspected are positioned above the inspection devices 400a to 400i.

[0068] [Detection of defective elements] Next, a description will be given of the processing executed by the inspection control device 300. Fig. 12 is a flowchart showing an example of the processing executed by the inspection control device 300.

[0069] In the process of FIG. 12, first, the stage driving unit 305 drives the XY stage 4A, and the inspection devices 400a to 400i are respectively Module It is positioned below MU1 to MU9 (step S11).

[0070] Next, the determination unit 301 performs an inspection process (step S13). Fig. 13 is a flowchart showing the details of the inspection process. The process in Fig. 13 is performed for each of the modules MU1 to MU9, but the following description will be given taking module MU1 as an example.

[0071] In the process of FIG. 13, first, the test pattern output unit 310 outputs pattern data ID1 of the first test pattern to the module MU1, and the module MU1 projects an image of a pattern (hereinafter referred to as the first pattern) generated by the DMD10 based on the pattern data ID1 (step S131).

[0072] Fig. 14(A) is a diagram showing an image of the first test pattern projected onto the image sensor 402 when there are no defective elements in the DMD 10, and Fig. 14(B) is a diagram showing an image of the first test pattern projected onto one pixel IPX1 of the image sensor 402, which is surrounded by a dotted line in Fig. 14(A). The first test pattern is a staggered pattern obtained by alternately switching the micromirror Ms of the DMD 10 between the ON state and the OFF state. In Figs. 14(A) and 14(B), the black areas indicate the OFF state.

[0073] Next, the determination unit 301 determines the projected first pattern for each pixel IPX of the image pickup element 402 of the inspection device 400a. Statue of The illuminance obtained in step S132 is set as the first illuminance.

[0074] Next, the check pattern output unit 310 outputs the pattern data ID1 of the second check pattern to the module MU1, and the module MU1 projects an image of the pattern (hereinafter referred to as the second pattern) generated by the DMD 10 based on the pattern data ID1 (step S133).

[0075] Fig. 14(C) is a diagram showing an image of the second test pattern projected onto the image sensor 402 when there are no defective elements in the DMD 10, and Fig. 14(D) is a diagram showing an image of the second test pattern projected onto one pixel IPX1 of the image sensor 402, which is surrounded by a dotted line in Fig. 14(C). The second test pattern is a staggered pattern obtained by reversing the ON and OFF states of the micromirrors Ms of the DMD 10 from those of the first test pattern.

[0076] Next, the determination unit 301 measures the illuminance of the projected image of the second pattern for each pixel IPX of the image pickup element 402 of the inspection device 400a (step S134). The illuminance acquired in step S134 is defined as the second illuminance. Here, the first illuminance and the second illuminance include the luminance value and gradation value of the image pickup element.

[0077] Next, the determination unit 301 compares the first illuminance with the second illuminance (step S135). Here, the number of pixels in the ON state in the first test pattern is equal to the number of pixels in the ON state in the second test pattern, and the number of pixels in the OFF state in the first test pattern is equal to the number of pixels in the OFF state in the second test pattern. Therefore, if there are no defective elements among the elements of the DMD 10 corresponding to each pixel IPX of the image sensor 402, the difference between the first illuminance and the second illuminance for each pixel IPX of the image sensor 402 should be approximately zero. Therefore, the determination unit 301 determines whether the difference between the first illuminance and the second illuminance for each pixel IPX of the image sensor 402 is within a predetermined range (e.g., within ±1%) (step S136).

[0078] If the difference between the first illuminance and the second illuminance is within a predetermined range for all pixels IPX of the image sensor 402 (step S136 / YES), the determination unit 301 determines that the DMD10 of the module MU1 does not have a defective element (step S137).

[0079] On the other hand, if the difference between the first illuminance and the second illuminance is not within the predetermined range for any pixel IPX of the image sensor 402 (step S136 / NO), the judgment unit 301 judges that the DMD10 of the module MU1 has a defective element (step S138).

[0080] The determination unit 301 stores the determination result in a storage unit (not shown), such as a nonvolatile memory (step S139).

[0081] The process of FIG. 13 is also performed on the other modules MU2 to MU9 included in the exposure module group MU(A), and the determination results as to whether or not the DMD 10 of each of the modules MU1 to MU9 has a defective element are stored in the storage unit.

[0082] 12, the determination unit 301 determines whether there are any exposure modules that have not yet been inspected (step S15). For example, when the inspection of modules MU1 to MU9 included in exposure module group MU(A) has been completed, the inspection of exposure module groups MU(B) and MU(C) has not been completed, so the determination in step S15 is YES.

[0083] If the determination in step S15 is YES, the process returns to step S11. Then, the stage driving unit 305 drives the XY stage 4A to position the inspection devices 400a to 400i below the modules MU18 to MU10 included in the exposure module group MU(B), respectively.

[0084] Thereafter, the above-described inspection process is carried out on the modules MU10 to MU18 (step S13).

[0085] When the inspection of the exposure module group MU(B) is completed, the process returns to step S11 because the exposure module group MU(C) has not yet been inspected (step S15 / YES). The stage driving unit 305 drives the XY stage 4A to position the inspection devices 400a-400i below the modules MU19-MU27 included in the exposure module group MU(C) (step S11). Next, the exposure module group MU(C) is inspected (step S13), and when the inspection of all exposure module groups MU(A)-MU(C) is completed, the determination in step S15 becomes NO.

[0086] If the determination in step S15 is NO, the determination unit 301 outputs the determination result stored in the storage unit (step S17) and ends the processing in Fig. 12. At this time, the determination unit 301 may, for example, display the determination result on a display device such as a liquid crystal display, or may print the determination result using a printer. For example, the determination unit 301 outputs whether or not the DMD10 has a defective element for each of the modules MU1 to MU27.

[0087] If a DMD 10 having a defective element is present, the determination unit 301 may calculate the degree of influence of the DMD 10 having the defective element on the exposure result of the pattern based on the recipe of the pattern to be exposed on the substrate P and the position of the DMD 10 having the defective element. In this case, the determination unit 301 may output the module including the DMD 10 having the defective element and the calculated degree of influence. Furthermore, the determination unit 301 may output the degree of influence and allow the operator to select whether to proceed with the exposure process. For example, the operator may be able to select whether to stop the exposure process, perform the exposure process using a normal DMD 10 without a defective element, or continue the exposure process as it will have a small impact on the exposure result. Furthermore, for example, the determination unit 301 may simulate the exposure result based on the recipe information of the pattern to be exposed on the substrate P and the position of the DMD 10 having the defective element, and output the simulation result. This allows the operator to more easily determine whether to continue the exposure process. It is also possible to determine thresholds for the number of defective elements and the number of defective elements that affect the scanning exposure pattern in advance, and after inspection, to select whether or not to continue the exposure process based on the inspection results obtained.

[0088] In addition, if the difference between the first illuminance and the second illuminance for multiple pixels IPX of the image sensor 402 is outside a predetermined range, the judgment unit 301 may determine that there are multiple areas in the DMD 10 that include defective elements, and output the result.

[0089] As described above in detail, according to this embodiment, the exposure apparatus EX includes a DMD 10 that generates a pattern corresponding to drawing data, an illumination unit ILU that irradiates illumination light onto the DMD 10, a projection unit PLU that reduces and projects an image of the pattern generated by the DMD 10 onto a substrate P placed on a substrate holder 4B, an inspection apparatus 400 that detects the projected pattern image, and a determination unit 301 that determines whether or not the DMD 10 has a defective element based on the detection result of the inspection apparatus 400. This makes it possible to inspect whether or not the DMD 10 has a defective element within the exposure apparatus EX.

[0090] In this embodiment, the determination unit 301 determines whether the DMD 10 has defective elements based on the detection result of the image of the first pattern projected when the first inspection pattern is generated on the DMD 10 and the detection result of the image of the second pattern projected when the second inspection pattern is generated on the DMD 10. The inspection device 400 detects the illuminance of the image of the first pattern and the illuminance of the image of the second pattern. The first inspection pattern is generated on the DMD 10. element The first test pattern is a houndstooth pattern obtained by alternately turning the first and second test patterns ON and OFF, and the second test pattern is a houndstooth pattern obtained by inverting the ON and OFF states of the first test pattern. This makes it possible to determine whether DMD 10 has defective elements by comparing the illuminance without inspecting each element of DMD 10.

[0091] 16, the inspection device 400 includes an image sensor 402 having a plurality of pixels IPX, and a magnifying imaging system 401 that magnifies the projected image of the pattern so that, when the plurality of elements Ms of the DMD 10 are divided into a plurality of regions, the image of the pattern generated in each of the plurality of regions is projected onto the corresponding pixels IPX1 to IPX4 of the image sensor 402. In other words, each of the pixels IPX1 to IPX4 of the image sensor 402 receives light from the plurality of elements Ms of the DMD 10. As a result, elementIn comparison with detecting defective elements of the DMD 10 using an imaging element 402 having pixels corresponding 1:1 to the DMD 10, it is possible to determine whether the DMD 10 has defective elements while suppressing an increase in the size of the inspection device 400.

[0092] Furthermore, in this embodiment, the exposure apparatus EX includes a plurality of modules (e.g., MU1 to MU9) that each include a DMD 10, an illumination unit ILU, and a projection unit PLU, and are arranged in a direction (Y axis direction) perpendicular to the scanning exposure direction (X axis direction) of the substrate P, and a plurality of inspection apparatuses 400 (inspection apparatuses 400a to 400i) are arranged in the Y axis direction to correspond to the plurality of modules MU1 to MU9. This allows inspection of the plurality of modules MU1 to MU9 in a shorter time than when one inspection apparatus 400 is used to inspect the plurality of modules MU1 to MU9.

[0093] In the above embodiment, the elements Ms of the DMD 10 corresponding to one pixel IPX of the image sensor 402 include 4×4=16 elements (FIG. 14) or 2×2=4 elements (FIG. 16), but this is not limited to this. The number of elements Ms of the DMD 10 corresponding to one pixel IPX of the image sensor 402 may be 5×5 or more, or may be 3×3, and the number of elements Ms of the DMD 10 corresponding to one pixel IPX of the image sensor 402 need not necessarily have an integer×integer relationship, but may be, for example, 1.5×1.5.

[0094] In the above embodiment, the inspection devices 400a to 400i may also serve as the alignment device 60 provided in the calibration reference unit CU. That is, the image sensor 402 of the inspection device 400 may be used as the two-dimensional image sensor 60e of the alignment device 60.

[0095] In the above embodiment, although there is a possibility that the inspection apparatus 400 may become large, an image of the projected pattern may be captured using an image sensor 402 having pixels IPX that correspond one-to-one to the elements Ms of the DMD 10, and a determination may be made based on the captured image as to whether the DMD 10 has defective elements. Furthermore, if the DMD 10 has defective elements, the positions of the defective elements may be identified based on the captured image.

[0096] In the above embodiment, instead of using the inspection device 400, a test pattern may be exposed onto the substrate P, and the substrate P exposed with the test pattern may be measured by a measurement device (microscope) to determine whether the DMD 10 has a defective element and identify the DMD 10 that has a defective element. Also, the test pattern exposed onto the substrate P may be irradiated with light, and the diffracted light may be measured to determine whether the DMD 10 has a defective element. Also, instead of the inspection device 400, a photochromic element may be arranged, and the test pattern may be exposed onto the photochromic element, and the exposure results may be observed and measured by the alignment system ALG to identify the defective element. When a pattern is exposed onto a substrate on which a photochromic element is arranged, The measuring device It may also be a microscope of an inspection device used in the inspection process of the exposed substrate P.

[0097] Furthermore, in the above embodiment, when the multiple elements Ms of the DMD 10 are divided into multiple regions, the magnifying imaging system 401 is used so that the image of the pattern generated in each of the multiple regions is projected onto the corresponding pixel IPX of the image sensor 402. However, as shown in FIG. 8B, the magnifying imaging system 401 may be omitted. In this case, the image sensor 402 is disposed on the substrate holder 4B so that its light receiving surface is positioned substantially identical to the best focus plane (best imaging plane) of the projection unit PLU in the Z axis direction. In this case, the pattern image, reduced by the projection unit PLU, is projected onto the image sensor 402. Even in such a case, the first irradiance of the image of the first pattern projected when the first test pattern is generated on the DMD 10 and the second irradiance of the image of the second pattern projected when the second test pattern is generated on the DMD 10 are compared across the entire image sensor 402, and it is determined whether the difference between the first irradiance and the second irradiance is within a predetermined range, thereby making it possible to determine whether or not a defective element exists in the DMD 10. Furthermore, since the magnifying imaging system 401 can be omitted, the inspection device 400 can be further miniaturized.

[0098] In the above embodiment, the image sensor 402 may be replaced with an illuminance sensor.

[0099] 13 in the above embodiment identifies whether the DMD 10 has a defective element, but does not identify the location of the defective element. The location of the defective element can be identified as follows.

[0100] FIG. 15A is a diagram showing elements (Ms) PX1 to PX16 included in the region of the DMD 10 corresponding to one pixel IPX1 of the image sensor 402 (first state). Here, let us assume that, for example, element PX6 is a defective element among the elements PX1 to PX16 shown in FIG. 15A. In this case, the process described in FIG. 13 shows that there is a defective element in the region of the DMD 10 corresponding to pixel IPX1 of the image sensor 402, but it is not clear which of the elements PX1 to PX16 included in that region is a defective element. element It is not possible to determine whether a particular element is defective.

[0101] In this case, for example, defective elements can be identified by repeatedly comparing the first illuminance of the image of the first pattern projected when a first test pattern is generated on some of the 4x4 elements PX1 to PX16 included in the area of ​​DMD10 corresponding to pixel IPX1 with the second illuminance of the image of the second pattern projected when a second test pattern is generated.

[0102] The method for identifying defective elements will be explained in more detail. For example, a block including multiple elements adjacent in the X-axis direction and the Y-axis direction among elements PX1 to PX16 is defined. The elements included in each block are included in one pixel IPX1 used in the first state (second state). The number of elements included in each block is less than the number of elements included in pixel IPX1. This is achieved by changing the magnification of the magnification imaging system 401, thereby changing the elements included in one pixel IPX1 for the same pixel between the first state and the second state.

[0103] For example, as shown in Figure 15(B), a block BLK1 including elements PX1, PX2, PX5, and PX6 is defined; a block BLK2 including elements PX2, PX3, PX6, and PX7 is defined; and a block BLK3 including elements PX3, PX4, PX7, and PX8 is defined. A block BLK4 including elements PX5, PX6, PX9, and PX10 is defined; a block BLK5 including elements PX6, PX7, PX10, and PX11 is defined; and a block BLK6 including elements PX7, PX8, PX11, and PX12 is defined. Furthermore, a block BLK7 including elements PX9, PX10, PX13, and PX14 is defined; a block BLK8 including elements PX10, PX11, PX14, and PX15 is defined; and a block BLK9 including elements PX11, PX12, PX15, and PX16 is defined. Note that in Figures 15(A) and 15(B), elements are drawn spaced apart to make the drawings easier to understand.

[0104] Next, the presence or absence of defective elements is determined by comparing the first illuminance of the image of the first pattern projected when the first test pattern is generated onto the elements included in each of blocks BLK1 to BLK9 with the second illuminance of the image of the second pattern projected when the second test pattern is generated. In the example of Figure 15(B), defective element PX6 is included in blocks BLK1, BLK2, BLK4, and BLK5, so it is determined that defective elements exist in blocks BLK1, BLK2, BLK4, and BLK5. In this case, element PX6 is the element common to blocks BLK1, BLK2, BLK4, and BLK5, so it can be determined that element PX6 is a defective element.

[0105] In this way, the plurality of elements included in the area of ​​the DMD 10 corresponding to one pixel of the image sensor 402 are divided into a plurality of blocks such that adjacent blocks in the X-axis direction and the Y-axis direction contain common elements, and the presence or absence of defective elements in each block is determined, thereby element Even if there is no 1:1 correspondence between the elements, it is possible to identify defective elements.

[0106] If the position of the defective element included in the DMD 10 has been identified, the determining unit 301 may determine and output the influence that the defective element will have on the exposure result of the pattern, taking into account the position of the defective element.

[0107] The above-described embodiment is a preferred example of the present invention. However, it is not limited to this, and various modifications are possible within the scope of the present invention. Furthermore, to identify defective elements in the DMD 10, the suspected defective elements may be switched ON / OFF and the elements Ms of the DMD 10 may be directly observed using the alignment device 60. In this case, it is desirable to observe at an optical magnification such that the pixels of the alignment device 60 are larger than the elements Ms of the DMD 10. Furthermore, in this embodiment, a houndstooth pattern in which adjacent elements Ms are switched ON / OFF is shown as an example. In addition, if one pixel IPX1 of the image sensor 402 contains 4 × 4 = 16 elements of the DMD 10, as shown in Figure 17(A), a houndstooth pattern in which four elements Ms are collectively turned ON or OFF may be used. Furthermore, the test pattern is not limited to a houndstooth pattern. When 16 (4 × 4) elements of the DMD 10 are included in one pixel IPX1 of the image sensor 402, as shown in FIG. 17B, the first test pattern and the second test pattern may be patterns other than a houndstooth pattern. Even if the test pattern is not a houndstooth pattern, all 16 elements in the pixel IPX1 are exposed once each in the first test pattern or the second test pattern. Using such a pattern makes it possible to identify defective elements. The test pattern of the present invention is not limited to this and can be designed as appropriate within the scope of the present invention.

[0108] Furthermore, defective elements may be identified as follows: The first test pattern is a pattern that turns on one specific element contained in the pixel IPX, and the second test pattern is a pattern that turns off all elements contained in the pixel IPX, and the difference between the test results of the first test pattern and the second test pattern is measured. By performing this operation on all elements contained in the pixel IPX, it is possible to identify the presence or absence of defective elements.

[0109] In addition, the following supplementary notes are disclosed in relation to the above-described embodiments. (Supplementary Note 1) A spatial light modulator that generates a pattern corresponding to drawing data, an illumination unit that irradiates illumination light onto the spatial light modulator, a projection unit that reduces and projects an image of the pattern generated by the spatial light modulator onto a substrate placed on a substrate holder, a detection unit that detects the projected image of the pattern, and a determination unit that determines whether or not the spatial light modulator has a defective element based on the detection result of the detection unit. An exposure apparatus comprising: (Appendix 2) An exposure apparatus as described in Appendix 1, wherein the judgment unit judges whether the spatial light modulator has a defective element based on the detection result of a first pattern image projected when a first inspection pattern is generated on the spatial light modulator and the detection result of a second pattern image projected when a second inspection pattern is generated on the spatial light modulator. (Supplementary Note 3) The exposure apparatus according to Supplementary Note 2, wherein the detection unit detects the illuminance of the first pattern image and the illuminance of the second pattern image. (Appendix 4) An exposure apparatus as described in Appendix 2 or Appendix 3, wherein the first inspection pattern is a staggered pattern obtained by alternately turning elements of the spatial light modulator ON and OFF, and the second inspection pattern is a staggered pattern obtained by inverting the ON state and the OFF state of the first inspection pattern. (Appendix 5) An exposure apparatus according to any one of Appendices 1 to 4, comprising a plurality of modules each including the spatial light modulator, the illumination unit, and the projection unit, arranged in a direction perpendicular to the scanning exposure direction of the substrate, and wherein the detection unit is arranged in a plurality of directions perpendicular to the scanning exposure direction so as to correspond to the plurality of modules. (Supplementary Note 6) The exposure apparatus according to any one of Supplementary Notes 1 to 5, wherein the detection unit is installed in the substrate holder. (Appendix 7) An exposure apparatus according to any one of Appendices 1 to 6, wherein the detection unit includes an image sensor having a plurality of pixels, and a magnification imaging system that magnifies the projected image of the pattern so that, when the elements of the spatial light modulator are divided into a plurality of regions, the image of the pattern generated in each of the plurality of regions is projected onto a corresponding pixel of the image sensor. (Supplementary Note 8) The exposure apparatus according to any one of Supplementary Note 1 to Supplementary Note 6, wherein the detection unit includes an imaging element onto which the image of the projected pattern is projected without being magnified. (Supplementary Note 9) The exposure apparatus according to Supplementary Note 7 or Supplementary Note 8, wherein the image sensor is used to measure the position of a module including the spatial light modulator, the illumination unit, and the projection unit. (Supplementary Note 10) The exposure apparatus according to any one of Supplementary Note 7 to Supplementary Note 9, wherein the detection unit includes an illuminance sensor that measures the illuminance of the projected image of the pattern. (Supplementary Note 11) In an exposure apparatus including a spatial light modulator that generates a pattern corresponding to drawing data, an illumination unit that irradiates the spatial light modulator with illumination light, and a projection unit that reduces and projects an image of the pattern generated by the spatial light modulator onto a substrate placed on a substrate holder, an inspection method for inspecting the spatial light modulator includes detecting the projected image of the pattern, and determining whether or not the spatial light modulator has a defective element based on a detection result of the image of the pattern; An inspection method including: (Supplementary Note 12) In an exposure apparatus including a spatial light modulator that generates a pattern corresponding to drawing data, an illumination unit that irradiates the spatial light modulator with illumination light, and a projection unit that projects an image of the pattern generated by the spatial light modulator onto a substrate placed on a substrate holder, an inspection method for inspecting the spatial light modulator, the inspection method including exposing the image of the pattern generated by the spatial light modulator onto the substrate, and measuring the substrate on which the image of the pattern has been exposed using a measurement device, thereby determining whether the spatial light modulator has a defective element. (Appendix 13) An inspection method for inspecting a spatial light modulator in an exposure apparatus comprising: a spatial light modulator that generates a pattern corresponding to drawing data; an illumination unit that irradiates the spatial light modulator with illumination light; and a projection unit that projects an image of the pattern generated by the spatial light modulator onto a substrate placed on a substrate holder, the inspection method including: exposing the image of the pattern generated by the spatial light modulator onto a photochromic element; and measuring the photochromic element onto which the image of the pattern has been exposed using a measurement device, thereby determining whether the spatial light modulator has a defective element. [Explanation of symbols]

[0110] 10 DMD Ms Micromirror 300 Inspection control device 301 Judgment section 400, 400a~400i inspection equipment 401 Magnifying imaging system 402 Image sensor EX exposure equipment P board ILU Lighting Unit PLU Projection Unit

Claims

1. An exposure apparatus that exposes an object with pattern light corresponding to drawing data generated by a spatial light modulator having a plurality of elements, a data output unit that outputs the drawing data to the spatial light modulator; an illumination optical system that irradiates the spatial light modulator with illumination light; a first moving body that holds the object; a projection optical system that projects an image of the pattern light generated by the spatial light modulator onto the object; a detection unit that detects an image of the projected pattern light; a determination unit that determines whether the spatial light modulator can generate pattern light corresponding to the drawing data output from the data output unit based on a detection result of the detection unit; Equipped with the detection unit includes an image pickup element having a plurality of pixels and configured to capture an image of the pattern light projected from the spatial light modulator, and a detection optical system provided above the image pickup element; the detection optical system forms an image of the pattern light on the image sensor in a first state in which the pattern light is formed on the image sensor so that a first number of the elements, equal to or greater than three, is included in one pixel of the image sensor, and a second state in which the pattern light is formed on the image sensor so that a second number of the elements, equal to or greater than two, of the first number of the elements, is included in one pixel of the image sensor; the determination unit determines whether the spatial light modulator has a defective element that cannot be driven in accordance with the drawing data output from the data output unit based on a detection result of a first pattern image projected when at least the first number of elements are made to generate a first inspection pattern in the first state and a detection result of a second pattern image projected when at least the first number of elements are made to generate a second inspection pattern, and determines the position of the defective element based on a detection result of a third pattern image projected when at least the second number of elements are made to generate the first inspection pattern in the second state and a detection result of a fourth pattern image projected when at least the second number of elements are made to generate the second inspection pattern. Exposure device.

2. the detection unit detects an illuminance of the first pattern image, an illuminance of the second pattern image, an illuminance of the third pattern image, and an illuminance of the fourth pattern image.

2. The exposure apparatus according to claim 1.

3. An exposure apparatus that exposes an object with pattern light corresponding to drawing data generated by a spatial light modulator having a plurality of elements, a data output unit that outputs the drawing data to the spatial light modulator; an illumination optical system that irradiates the spatial light modulator with illumination light; a first moving body that holds the object; a projection optical system that projects an image of the pattern light generated by the spatial light modulator onto the object; a detection unit that detects an image of the projected pattern light; a determination unit that determines, based on a detection result from the detection unit, whether or not the spatial light modulator has a defective element that cannot be driven in accordance with the drawing data output from the data output unit; Equipped with the determination unit determines a difference between a detection result by the detection unit of a first pattern image projected when a first inspection pattern is generated on the spatial light modulator and a detection result by the detection unit of a second pattern image projected when a second inspection pattern is generated on the spatial light modulator, and determines, based on the difference, whether or not the spatial light modulator has a defective element that cannot be driven in accordance with the drawing data output from the data output unit; the first inspection pattern is a pattern obtained by alternately arranging a plurality of elements in an ON state and a plurality of elements in an OFF state, the number of which is equal to the number of the plurality of elements in the ON state, among the plurality of elements; the second test pattern is a pattern obtained by inverting the ON state and the OFF state of the first test pattern. Exposure device.

4. the detection unit detects an illuminance of the first pattern image and an illuminance of the second pattern image.

4. The exposure apparatus according to claim 3.

5. the first inspection pattern is a pattern obtained by alternately arranging a plurality of elements in an ON state and a plurality of elements in an OFF state, the number of which is equal to the number of the plurality of elements in the ON state, among the plurality of elements; the second test pattern is a pattern obtained by inverting the ON state and the OFF state of the first test pattern.

2. The exposure apparatus according to claim 1.

6. the first inspection pattern is a staggered pattern, the second inspection pattern is a staggered pattern; 6. The exposure apparatus according to claim 3 or claim 5.

7. a plurality of modules each including the spatial light modulator, the illumination optical system, and the projection optical system, arranged in a direction perpendicular to a scanning exposure direction of the object; a plurality of the detection units are arranged in a direction perpendicular to the scanning exposure direction so as to correspond to the plurality of modules; 5. The exposure apparatus according to claim 1.

8. The detection unit moves translationally with the first moving body.

5. The exposure apparatus according to claim 1.

9. The exposure apparatus according to claim 8 , wherein the detection unit is provided on the first movable body.

10. the detection unit has an image sensor having a plurality of pixels and capturing an image of the pattern light projected from the spatial light modulator; 4. The exposure apparatus according to claim 3.

11. The imaging element is provided in approximately the same plane as the object.

11. The exposure apparatus according to claim 1.

12. the detection unit has a detection optical system above the imaging element, the detection optical system magnifies the image formed in substantially the same plane as the object and forms an enlarged image on the image sensor; The exposure apparatus according to claim 10.

13. the detection optical system forms an image of the pattern light on the image sensor so that one pixel of the image sensor includes two or more of the elements; the determination unit determines whether or not pattern light corresponding to the drawing data can be generated based on a detection result of the element included in the one pixel. The exposure apparatus according to claim 12.

14. a module unit having the spatial light modulator, the illumination optical system, and the projection optical system; the detection unit is used to detect the defective element and also to measure the position of the module unit; 3. The exposure apparatus according to claim 1.

15. the detection unit includes an illuminance sensor that measures the illuminance of the projected pattern light image.

3. The exposure apparatus according to claim 1.

16. 1. An inspection method for inspecting a spatial light modulator of an exposure apparatus including: a spatial light modulator having a plurality of elements that generate pattern light corresponding to drawing data; an illumination optical system that irradiates the spatial light modulator with illumination light; and a projection optical system that projects an image of the pattern light generated by the spatial light modulator onto an object placed on a first moving body, the method comprising: an imaging element having a plurality of pixels, the imaging element capturing an image of the pattern light projected from the spatial light modulator, in a first state in which the pattern light is imaged on the imaging element so that a first number of elements equal to or greater than three are included in one pixel of the imaging element, and a second state in which the pattern light is imaged on the imaging element so that a second number of elements equal to or greater than two, which is less than the first number, of the first number of elements are included in one pixel; determining whether the spatial light modulator has a defective element that cannot be driven in accordance with the drawing data based on a detection result of a first pattern image projected when at least the first number of the elements are made to generate a first inspection pattern in the first state and a detection result of a second pattern image projected when at least the first number of the elements are made to generate a second inspection pattern; determining the position of the defective element based on a detection result of a third pattern image projected when the first inspection pattern is generated on at least the second number of the elements in the second state, and a detection result of a fourth pattern image projected when the second inspection pattern is generated on at least the second number of the elements; An inspection method including:

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