Camera module

Abstract

The camera module includes a first housing, a lens module disposed in the first housing, a second housing coupled to the first housing, a first printed circuit board disposed in the internal space between the first housing and the second housing, an image sensor disposed on the first printed circuit board, and a shield can disposed below the first printed circuit board within the second housing, the shield can having a rib that contacts the underside of the first printed circuit board.

Description

[Technical Field]

[0001] This embodiment relates to a camera module. [Background technology]

[0002] In recent years, ultra-miniature camera modules have been developed and are widely used in small electronic products such as smartphones, notebooks, and game consoles.

[0003] As automobiles become more widespread, miniature cameras are increasingly used in vehicles as well as in small electronic products. For example, they are equipped with black box cameras for vehicle protection or to collect objective information on traffic accidents, rearview cameras that allow drivers to monitor blind spots at the rear of the vehicle through a screen to ensure safety when reversing, and perimeter detection cameras that can monitor the area around the vehicle.

[0004] The camera may include a lens, a lens holder for accommodating the lens, an image sensor for converting an image of a subject captured by the lens into an electrical signal, and a printed circuit board on which the image sensor is mounted. The housing forming the exterior of the camera has a completely sealed structure to prevent contamination of internal components from foreign matter, including moisture. Summary of the Invention [Problem to be solved by the invention]

[0005] This embodiment provides a camera module that can improve the heat dissipation efficiency by improving the structure. [Means for solving the problem]

[0006] The camera module of this embodiment includes a first housing, a lens module arranged in the first housing, a second housing coupled to the first housing, a first printed circuit board arranged in the internal space between the first housing and the second housing, an image sensor arranged on the first printed circuit board, and a shield can arranged below the first printed circuit board within the second housing, the shield can having a rib that contacts the underside of the first printed circuit board.

[0007] The shielding can has a side plate, and the rib is at least partially bent inward from an upper end of the side plate so that the upper surface of the rib can contact the lower surface of the first printed circuit board, and the lower surface of the first printed circuit board is soldered to the upper surface of the rib.

[0008] An exposed portion where an electrode in the first printed circuit board is exposed may be disposed on the lower surface of the first printed circuit board facing the rib.

[0009] A plurality of ribs may be provided and may be arranged so as to be spaced apart from each other.

[0010] The first housing may be made of resin or plastic, and the shield can may be made of metal.

[0011] The shielding can may further include a second printed circuit board disposed below the first printed circuit board and spaced apart from the shielding can, the second printed circuit board being disposed below the rib.

[0012] The cross-sectional area of ​​the second printed circuit board may be smaller than the cross-sectional area of ​​the first printed circuit board.

[0013] The second printed circuit board may include a cable electrically connected to a lower surface of the second printed circuit board, and a flexible circuit board electrically connecting the first printed circuit board and the second printed circuit board.

[0014] A camera module according to another embodiment includes a first housing, a lens module disposed in the first housing, a second housing coupled to the first housing, a first printed circuit board disposed in the internal space between the first housing and the second housing, an image sensor disposed on the first printed circuit board, and a shielding can disposed below the first printed circuit board within the second housing, and the lower surface of the first printed circuit board is soldered to the upper surface of the shielding can. [Effects of the Invention]

[0015] According to the present invention, it is possible to provide a camera module capable of improving heat dissipation efficiency by transferring heat generated in a board module to the outside through a shield can. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a perspective view of a camera module according to a first embodiment of the present invention. [Figure 2] 1 is a cross-sectional view showing the internal configuration of a camera module according to a first embodiment of the present invention. [Figure 3] 1 is an exploded perspective view of a camera module according to a first embodiment of the present invention. [Figure 4] FIG. 4 is an exploded perspective view of FIG. 3, shown at another angle. [Figure 5] 1 is an exploded perspective view of a substrate module and a shield can according to a first embodiment of the present invention. FIG. [Figure 6] FIG. 2 is an exploded perspective view of a first printed circuit board and a shield can according to the first embodiment of the present invention. [Figure 7] FIG. 10 is a perspective view illustrating the state in which a substrate module and a shield can are coupled together according to a second embodiment of the present invention. [Figure 8] FIG. 10 is a perspective view of a shield can according to a second embodiment of the present invention. [Figure 9] FIG. 10 is a perspective view of a first printed circuit board according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0017] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0018] However, the technical concept of the present invention is not limited to the described embodiments, but can be embodied in various different forms, and one or more of the components of the embodiments can be selectively combined or substituted within the scope of the technical concept of the present invention.

[0019] Furthermore, unless otherwise clearly and specifically defined, terms (including technical and scientific terms) used in the embodiments of the present invention shall be interpreted as meanings that can be commonly understood by a person of ordinary skill in the art to which the present invention belongs, and commonly used terms such as predefined terms should be interpreted in light of the contextual meaning of the relevant art.

[0020] Furthermore, the terms used in the embodiments of the present invention are intended to explain the embodiments and are not intended to limit the present invention.

[0021] In this specification, the singular can also include the plural unless otherwise specified in the context, and when it is stated as "A and (and) at least one (or one or more) of B and C," it can include one or more of all possible combinations of A, B, and C.

[0022] Furthermore, when describing components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. are used only to distinguish the component from other components, and the terms do not limit the nature, order, or sequence of the components.

[0023] Furthermore, when a component is described as being 'coupled', 'coupled', or 'connected' to another component, it can include not only cases where the component is directly 'coupled', 'coupled', or 'connected' to the other component, but also cases where the component is 'coupled', 'coupled', or 'connected' by another component between the other component. Furthermore, when a component is described as being formed or located "above (above)" or "below (below)" of another component, "above (above)" or "below (below)" can include not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or located between the two components. Furthermore, when the term "above (above)" or "below (below)" is used, it can include not only the upper direction but also the lower direction based on one component.

[0024] The 'optical axis direction' used below is defined as the optical axis direction of the lens. Meanwhile, the 'optical axis direction' can correspond to the 'up and down direction', 'z-axis direction', etc.

[0025] The present invention will now be described in more detail with reference to the accompanying drawings.

[0026] FIG. 1 is an oblique view of a camera module according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view showing the internal configuration of a camera module according to a first embodiment of the present invention, FIG. 3 is an exploded oblique view of a camera module according to a first embodiment of the present invention, FIG. 4 is an exploded oblique view of FIG. 3 from a different angle, FIG. 5 is an exploded oblique view of a board module and a shield can according to a first embodiment of the present invention, and FIG. 6 is an exploded oblique view of a first printed circuit board and a shield can according to a first embodiment of the present invention.

[0027] 1 to 6, a camera module 100 according to an embodiment of the present invention may include a first housing 110, a second housing 120, a first printed circuit board 130, a second printed circuit board 140, a shield can 150, a cable 160, a lens module 170, a spacing member, and a flexible circuit board 190, but may be implemented without some of these components, and additional components are not excluded.

[0028] The camera module 100 may include a first housing 110. The first housing 110 may form the exterior of the camera module 100. The first housing 110 may be combined with the second housing 120. The first housing 110 may be disposed on one side of the second housing 120. The first housing 110 may be formed in a hexahedron shape with an open bottom. The first housing 110 may be combined with the second housing 120 by thermal fusion. The material of the first housing 110 may include plastic or resin. The lens module 170 may be disposed in the first housing 110.

[0029] The camera module 100 may include a second housing 120. The second housing 120 may form the exterior of the camera module 100. The second housing 120 may be combined with the first housing 110. The second housing 120 may be disposed on the other side of the first housing 110. The second housing 120 may have a hexahedral shape with an open top. A first printed circuit board 130, a second printed circuit board 140, a shielding can 150, a cable 160, a bracket 180, and a flexible circuit board 190 may be disposed in the second housing 120. The second housing 120 may be made of a material such as resin or plastic. Alternatively, the second housing 120 may be made of a metal material.

[0030] The camera module 100 may include a lens module 170. The lens module 170 may be disposed in the first housing 110. The lens module 170 may include at least one lens. The lens module 170 may include a plurality of lenses, and the plurality of lenses may be disposed along an optical axis direction. An outermost lens 172 among the lenses may be exposed above the first housing 110. A lens coupling part 112 may be formed on an upper surface of the first housing 110, protruding upward and having a receiving groove 112a formed therein so that the outermost lens 172 may be disposed therein. The plurality of lenses excluding the outermost lens 172 may be disposed in an opening 116 of the first housing 110. The lens module 170 may be coupled to the first housing 110. The lens module 170 may be screw-coupled to the first housing 110. The lens module 170 may be disposed to face an image sensor 131, which will be described later.

[0031] The camera module 100 may include a substrate module, which may include a first printed circuit board 130, a second printed circuit board 140, a spacing member, and a flexible circuit board 190.

[0032] The first printed circuit board 130 may be disposed in an internal space between the first housing 110 and the second housing 120. The first printed circuit board 130 may be disposed in the second housing 120. An image sensor 131 may be disposed on the first printed circuit board 130. The image sensor 131 may be disposed to face the lens module 170 in the optical axis direction. The image sensor 131 may form an image using light passing through the lens module 170.

[0033] The first printed circuit board 130 may have a rectangular cross-sectional shape. The first printed circuit board 130 may have four sides. The first printed circuit board 130 may have four side surfaces. A first groove 136 and a second groove 137 may be disposed on the side surface of the first printed circuit board 130. The first groove 136 and the second groove 137 may each be formed to be recessed more inward than other regions on the side surface of the first printed circuit board 130. The length of the first groove 136 in a direction perpendicular to the optical axis direction may be shorter than the length of the second groove 137. The first groove 136 may be disposed on three of the four side surfaces of the first printed circuit board 130. The second groove 137 may be disposed on the remaining side surfaces of the first printed circuit board 130 excluding the three side surfaces.

[0034] The second printed circuit board 140 may be disposed below the first printed circuit board 130. The second printed circuit board 140 may be disposed to be spaced apart from the first printed circuit board 130 in the vertical direction. The cross-sectional area of ​​the second printed circuit board 140 may be smaller than the cross-sectional area of ​​the first printed circuit board 130. The second printed circuit board 140 may have a rectangular cross-sectional shape. A cable 160 may be coupled to a lower surface of the second printed circuit board 140. The second printed circuit board 140 may be disposed within the shield can 150. A side surface of the second printed circuit board 140 may be spaced apart from an inner surface of the shield can 150.

[0035] Grooves may also be formed on a side surface of the second printed circuit board 140. A third groove 146 facing the first groove 136 in the vertical direction and a fourth groove 147 facing the second groove 137 in the vertical direction may be arranged on the side surface of the second printed circuit board 140.

[0036] The first printed circuit board 130 and the second printed circuit board 140 may be coupled to each other via a spacing member. The spacing member may include a bracket 180. The bracket 180 may be made of a metal material. The bracket 180 may be a shield can in which the first printed circuit board 130 and the second printed circuit board 140 are disposed. In this case, the shield can 150 having the first printed circuit board 130 disposed on the top and the second printed circuit board 140 disposed on the inside and received in the second housing 120 may be referred to as a first shield can, and the bracket 180 separating the first printed circuit board 130 and the second printed circuit board 140 may be referred to as a second shield can.

[0037] The bracket 180 may have an upper end coupled to the first printed circuit board 130 through the first groove 136 and a lower end coupled to the second printed circuit board 140 through the third groove 146. A plurality of the first grooves 136 and a plurality of the third grooves 146 may be provided, so that the first printed circuit board 130 and the second printed circuit board 140 may have a coupling structure in multiple regions via the bracket. The bracket 180 may be made of a metal material. The bracket 180 may include a side plate 184, the upper end of which supports the lower surface of the first printed circuit board 130 and the lower end of which is supported on the upper surface of the second printed circuit board 140. The side plate 184 may allow the first printed circuit board 130 and the second printed circuit board 140 to be spaced apart in the vertical direction. The areas of the bracket 180 coupled to the first groove 136 and the third groove 146 may be rib-shaped and extend upward and downward from the upper and lower ends of the side plate 184, respectively.

[0038] More specifically, the bracket 180 may include a side plate 184 disposed between the first printed circuit board 130 and the second printed circuit board 140, an upper rib 181 extending upward from an upper end of the side plate 184 to be coupled to the first groove 136, and a lower rib 182 extending downward from a lower end of the side plate to be coupled to the third groove 146. The upper rib 181 and the lower rib 182 may include regions that are bent at least once and may have regions that contact the upper surface of the first printed circuit board 130 and the lower surface of the second printed circuit board 140, respectively. As a result, the first printed circuit board 130 and the second printed circuit board 140 may be fixed to each other while being spaced apart in the vertical direction.

[0039] The first printed circuit board 130 and the second printed circuit board 140 may be electrically connected to each other via a flexible circuit board (FPCB) 190. The flexible circuit board 190 may have a region that is bent at least one time. The flexible circuit board 190 may be made of a flexible material, and may have an upper end electrically connected to the first printed circuit board 130 and a lower end electrically connected to the second printed circuit board 140. At least a portion of the flexible circuit board 190 may be disposed in the second groove 137 and the fourth groove 147, respectively.

[0040] The cable 160 may be coupled to a lower surface of the board module. The cable 160 may be coupled to a lower surface of the second printed circuit board 140. The cable 160 may be electrically connected to the second printed circuit board 140. The cable 160 may supply external power to the board module.

[0041] The cable 160 may be disposed in the second housing 120. An external terminal coupling part 128 extending downward and having a space for accommodating the cable 160 therein may be formed on a lower surface of the second housing 120. An external terminal may be coupled to the external terminal coupling part 128. The external terminal may provide power to the camera module 100 or transmit and receive signals to and from the camera module 100. A space within the external terminal coupling part 128 may be in communication with a space 121 within the second housing 120. A lower surface of the external terminal coupling part 128 may be open.

[0042] A shield can 150 may be disposed in the second housing 120. The shield can 150 may be disposed in a space 121 within the second housing 120. An outer surface of the shield can 150 may be disposed to face an inner surface of the second housing 120. The outer surface of the shield can 150 may be in contact with the inner surface of the second housing 120.

[0043] The shield can 150 may have an open top. A hole 156 may be formed in a bottom surface of the shield can 150 so that the cable 160 can pass through. A space 151 for accommodating the board module may be formed inside the shield can 150. The second printed circuit board 140 and the flexible circuit board 180 may be disposed in the space 151. That is, the remaining components of the board module, excluding the first printed circuit board 130, may be disposed in the space 151 inside the shield can 150, and the first printed circuit board 130 may be disposed above the shield can 150 via a rib 152, which will be described later.

[0044] The shield can 150 may be made of a metal material and may be integrally formed with the second housing 120 by insert injection molding.

[0045] The shield can 150 may support the lower surface of the first printed circuit board 130. An upper end of the shield can 150 may contact the lower surface of the first printed circuit board 130. The first printed circuit board 130 is soldered onto the shield can 150. The shield can 150 may be used for power supply or grounding of a board module including the first printed circuit board 130.

[0046] The shield can 150 may include a side plate 158 forming a side surface and a bottom plate (plate) 159 forming a bottom surface. The bottom plate 159 may have the above-mentioned hole 156 formed therein. The space 151 may be formed inside the side plate 158.

[0047] The shielding can 150 may include a rib 152 that supports the first printed circuit board 130. The rib 152 may support a lower surface of the first printed circuit board 130. The lower surface of the first printed circuit board 130 and an upper surface of the rib 152 are soldered together. The lower surface of the first printed circuit board 130 may be in contact with the rib 152.

[0048] The rib 152 may have a region at least partially parallel to the first printed circuit board 130 .

[0049] The rib 152 may include a vertical portion 153 extending upward from an upper end of the side plate 158 and a horizontal portion 154 bent inward from an end of the vertical portion 153. The horizontal portion 154 may be disposed to cover at least a portion of the space 151. The horizontal portion 154 may be disposed parallel to the first printed circuit board 130. An upper surface of the horizontal portion 154 may be in contact with a lower surface of the first printed circuit board 130. The lower surface of the first printed circuit board 130 is soldered to the upper surface of the horizontal portion 154. The upper surface of the horizontal portion 154 may be in surface contact with the lower surface of the first printed circuit board 130.

[0050] The ribs 152 may be provided in plurality and may be spaced apart from one another. When the cross section of the shield can 150 is formed in the shape of a rectangle having four sides, two ribs 152 may be arranged on each side. In this case, the plurality of ribs 152 having a single side may be arranged spaced apart from one another.

[0051] Meanwhile, the cross-sectional area of ​​an imaginary region connecting the inner ends of the horizontal portions 154 may be smaller than the cross-sectional area of ​​the second printed circuit board 140. This prevents the second printed circuit board 140 from accidentally leaving the space 151. The cross-sectional area of ​​the second printed circuit board 140 may be formed to correspond to or be smaller than the cross-sectional area of ​​the space 151.

[0052] An exposed portion 138 exposing an electrode in the first printed circuit board 130 may be disposed in an area facing the rib 152 on the lower surface of the first printed circuit board 130. The electrode may be a ground electrode.

[0053] A plurality of the exposed portions 138 may be provided. The plurality of exposed portions 138 may be arranged spaced apart from each other along the edge of the lower surface of the first printed circuit board 130 to form a pattern. The exposed portions 138 may be provided on the lower surface of the first printed circuit board 130 to correspond to the positions and number of the ribs 152. The plurality of exposed portions 138 may be arranged spaced apart from each other along the edge of the first printed circuit board 130. As a result, the first printed circuit board 130 forms a contact structure with the shield can 150 in different regions, thereby improving heat dissipation efficiency.

[0054] When the cross section of the first printed circuit board 130 is rectangular, the multiple exposed portions 138 arranged on one side may be arranged symmetrically with respect to each other with respect to the first groove 136 or the second groove 137.

[0055] Therefore, the exposed portion 138 is soldered to the rib 152 to ground the board module.

[0056] The above structure has the advantage of improving heat dissipation efficiency by transferring heat generated in the board module to the outside through the shield can. In particular, even if the first housing is made of plastic, the heat generated in the module can be transferred to the second housing through the shield can made of metal, thereby forming an efficient heat dissipation path.

[0057] In addition, the first printed circuit board on which the image sensor is mounted is firmly fixed on the shield can, which has the advantage of facilitating the focusing operation with the lens module.

[0058] FIG. 7 is a perspective view illustrating the state of connection between a substrate module and a shield can in the second embodiment of the present invention, FIG. 8 is a perspective view of the shield can in the second embodiment of the present invention, and FIG. 9 is a perspective view of a first printed circuit board in the second embodiment of the present invention.

[0059] Other parts of this embodiment are the same as those of the first embodiment, except for the arrangement of the ribs and exposed portions. In the following, only the characteristic parts of this embodiment will be described, and the first embodiment will be used for the remaining parts.

[0060] 7 to 9, the shield can 250 according to this embodiment may include a plurality of ribs 252. The plurality of ribs 252 may be disposed on the upper portion of the shield can 250. Each of the plurality of ribs 252 may include a vertical portion 253 extending upward from a side panel of the shield can 250 and a horizontal portion 254 bent inward from an upper end of the vertical portion 253. An upper surface of the horizontal portion 254 may support a lower surface of the first printed circuit board 230.

[0061] The shield can 250 may include a first side plate 257a, a second side plate 257b and a third side plate 257c adjacent to the first side plate 257a, and a fourth side plate 257d disposed to face the first side plate 257a. Three ribs 252 may be disposed on the upper portions of the first to third side plates 257a, 257b, and 257c, respectively.

[0062] The fourth side plate 257d, which is disposed to face the first side plate 257a, may have fewer ribs 252 than the other side plates. In one example, two ribs 252 may be disposed on an upper portion of the fourth side plate 257d. A separation space 258 may be formed between the two ribs 252.

[0063] The first printed circuit board 230 may be disposed on the upper part of the shielding can 250. A lower surface of the first printed circuit board 230 may be in contact with the rib 252. An exposed portion 238 where the copper foil is exposed may be formed on the lower surface of the first printed circuit board 230. The exposed portion 238 may be disposed to correspond to the number and positions of the ribs 252.

[0064] A first groove 236 and a second groove 237 may be disposed on a side surface of the first printed circuit board 230. The first groove 236 and the second groove 237 may each be formed to be recessed more inward than other regions of the side surface of the first printed circuit board 230. The length of the first groove 236 may be formed to be shorter than the length of the second groove 237.

[0065] The first printed circuit board 230 has a rectangular cross section, and a side surface of the first printed circuit board 230 where the first groove 236 is formed may be disposed to face the first to third side plates 257a, 257b, and 257c in the vertical direction. In addition, the side surface of the first printed circuit board 230 where the second groove 237 is disposed may be disposed to face the fourth side plate 257d in the vertical direction.

[0066] Therefore, when the first printed circuit board 230 is coupled to the upper surface of the shield can 250, a space in which the flexible circuit board 180 (see Figures 1 to 6) is disposed can be formed through the second groove 237 and the separation space 258.

[0067] The above structure has the advantage that the rib 252 can firmly fix the first printed circuit board 230 within the camera module, while at the same time providing a larger space for arranging the flexible circuit board for electrical connection with the second printed circuit board.

[0068] Although the embodiments of the present invention have been described above with reference to the accompanying drawings, it should be understood by those skilled in the art that the present invention can be embodied in other specific forms without changing the technical spirit or essential characteristics thereof. Therefore, it should be understood that the above-described embodiments are illustrative in all respects and are not limiting.

Claims

1. A first housing; a lens module disposed in the first housing; a second housing coupled to the first housing; a first printed circuit board disposed within the first housing and the second housing; a second printed circuit board disposed below the first printed circuit board; a flexible circuit board electrically connecting the first printed circuit board and the second printed circuit board; an image sensor disposed on the first printed circuit board; a shield can disposed below the first printed circuit board within the second housing, the second printed circuit board is disposed within the shielding can; the shield can includes a side panel and a rib that contacts the lower surface of the first printed circuit board; The rib includes a vertical portion extending upward from an upper end of the side panel and a horizontal portion bent inward from an upper end of the vertical portion, an exposed portion, through which electrodes in the first printed circuit board are exposed, is disposed on a lower surface of the first printed circuit board facing the rib; the exposed portion is soldered to the top surface of the horizontal portion; The ribs are provided in plurality and are arranged to be spaced apart from each other, A separation space is formed between the plurality of ribs, in which the flexible circuit board is disposed.

2. the first housing is made of resin or plastic; The camera module according to claim 1 , wherein the shield can is made of a metal.

3. The camera module of claim 1 , further comprising a bracket disposed between the first printed circuit board and the second printed circuit board.

4. The camera module according to any one of claims 1 to 3, wherein a cross-sectional area of ​​the second printed circuit board is smaller than a cross-sectional area of ​​the first printed circuit board.

5. The camera module of claim 1, further comprising a cable electrically connected to a lower surface of the second printed circuit board.

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