Method and apparatus for intermixed layers to enhance metal reflow - Patent Application 20070122999

Abstract

Described herein are methods and apparatus for filling features on a substrate. In some embodiments, the method of filling features on a substrate includes depositing a first metallic material in and on the feature disposed in the substrate by a chemical vapor deposition (CVD) process in a first processing chamber at a first temperature, depositing a second metallic material on the first metallic material in a second processing chamber at a second temperature and a first bias power to form a seed layer of the second metallic material, etching the seed layer in the second processing chamber at a second bias power greater than the first bias power to form a mixed layer in the feature including the first metallic material and the second metallic material, and heating the substrate to a third temperature greater than the second temperature to reflow the second metallic material.

Description

[Technical Field]

[0001] TECHNICAL FIELD Embodiments of the present disclosure relate generally to semiconductor processing of semiconductor substrates. [Background technology]

[0002] Semiconductor devices, such as integrated circuits (ICs), typically have electronic circuit elements, such as transistors, diodes, and resistors, integrated and fabricated on a single body of semiconductor material, such as a wafer or substrate. These various circuit elements are connected by conductive connectors to form complete circuits, which may contain millions of individual circuit elements. Interconnects provide electrical connections between the various electronic elements of an integrated circuit and form connections between the circuit elements and the device's external contact elements, such as pins, that connect the integrated circuit to other circuits. These interconnects can be constructed across multiple layers and can be connected within or between layers by trenches / vias. As smaller form factors continue to be pursued, interconnects must be further scaled down to enable smaller form factor semiconductor devices. Due to their small size, trenches / vias with 3 nm and smaller node structures present challenges during formation. Reflow processes are often used to fill trenches / vias. However, the inventors have discovered that for smaller form factor semiconductor devices, conventional reflow processes can leave voids in the trenches / vias.

[0003] Accordingly, the present inventors have provided an improved method and apparatus for filling features on a substrate. Summary of the Invention

[0004] Described herein are methods and apparatus for filling features on a substrate. In some embodiments, the method of filling features on a substrate includes depositing a first metallic material in and on a feature disposed in the substrate by a chemical vapor deposition (CVD) process in a first processing chamber at a first temperature, depositing a second metallic material on the first metallic material in a second processing chamber at a second temperature and a first bias power to form a seed layer of the second metallic material, etching the seed layer in the second processing chamber at a second bias power greater than the first bias power to form a mixed layer in the feature including the first metallic material and the second metallic material, and heating the substrate to a third temperature greater than the second temperature to reflow the second metallic material in the feature.

[0005] In some embodiments, a method of filling features on a substrate includes depositing a first metallic material in the feature on the substrate by a chemical vapor deposition (CVD) process at a first temperature in a first processing chamber; depositing a copper-containing material on the first metallic material by a physical vapor deposition (PVD) process in a second processing chamber at a second temperature and a first bias power to form a seed layer; etching the seed layer at a second bias power greater than the first bias power to form a mixed layer in the feature comprising the first metallic material and the copper-containing material; and heating the substrate to a third temperature greater than the second temperature to reflow the copper-containing material on the substrate.

[0006] In some embodiments, a non-transitory computer-readable medium having instructions stored thereon that, when executed, cause the medium to perform a method for filling features on a substrate, the method including depositing a first metallic material in and on a feature disposed in the substrate by a chemical vapor deposition (CVD) process in a first processing chamber at a first temperature; depositing a second metallic material on the first metallic material in a second processing chamber at a second temperature and a first bias power to form a seed layer of the second metallic material; etching the seed layer in the second processing chamber at a second bias power greater than the first bias power to form a mixed layer in the feature comprising the first metallic material and the second metallic material; and heating the substrate to a third temperature greater than the second temperature to reflow the second metallic material in the feature.

[0007] Other and additional embodiments of the present disclosure are described below.

[0008] Embodiments of the present disclosure, briefly outlined above and discussed in more detail below, can be understood by reference to exemplary embodiments thereof as illustrated in the accompanying drawings. However, the accompanying drawings depict only typical embodiments of the present disclosure and, therefore, should not be considered limiting in scope, as the present disclosure may embrace other embodiments that are equally effective. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 illustrates a multi-chamber processing tool suitable for performing methods for processing substrates according to some embodiments of the present disclosure. [Figure 2] FIG. 2 illustrates a processing chamber for depositing a second metal material and etching the second metal material according to some embodiments of the present disclosure. [Figure 3]3 is a schematic side view of a portion of the substrate support of the processing chamber of FIG. 2 in a deposition or etching position, according to some embodiments of the present disclosure. [Figure 4] 3 is a schematic side view of a portion of the substrate support of the processing chamber of FIG. 2 in a heating or reflow position, according to some embodiments of the present disclosure. [Figure 5] 5 illustrates a method 500 for filling features on a substrate according to some embodiments of the present disclosure. [Figure 6A] 1 is a schematic cross-sectional view of a portion of a substrate having features and a barrier layer disposed within the features, according to some embodiments of the present disclosure. [Figure 6B] 1 is a schematic cross-sectional view of a portion of a substrate having a first metallic material deposited in a feature to form a liner layer according to some embodiments of the present disclosure. [Figure 6C] 1 is a schematic cross-sectional view of a portion of a substrate having a seed layer of a second metallic material deposited within a feature according to some embodiments of the present disclosure. [Figure 6D] 4 is a schematic cross-sectional view of a portion of a substrate after etching a seed layer of a second metallic material according to some embodiments of the present disclosure. [Figure 6E] 1 is a schematic cross-sectional view of a portion of a substrate having a reflowed second metallic material according to some embodiments of the present disclosure. [Figure 6F] 1 is a schematic cross-sectional view of a portion of a substrate with features completely filled with filler material; DETAILED DESCRIPTION OF THE INVENTION

[0010] For ease of understanding, the same reference numerals have been used, where possible, to designate identical elements common to the figures. The figures are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated in other embodiments unless specifically stated otherwise.

[0011] Interconnects used in integrated circuits can be constructed across multiple layers, and these interconnects can be connected within / between layers by one or more features, such as trenches or vias, formed in a substrate. The methods and apparatus described herein represent a gap-fill process that utilizes reflow of a fill material to form these interconnects. A substrate typically includes multiple layers deposited within one or more features of the substrate. For example, a liner layer comprising a first metallic material is deposited within one or more features, followed by a fill material comprising a second metallic material. Deposition of the fill material by the methods described herein advantageously forms a mixed layer comprising the first metallic material and the second metallic material within one or more features.

[0012] After depositing the fill material, the temperature of the substrate is increased to reflow the fill material. The inventors have observed that the intermixed layer advantageously improves filling of the one or more features during the reflow process and reduces voids within the one or more features. The inventors have further observed that a liner layer deposited by a chemical vapor deposition (CVD) process advantageously forms a more amorphous atomic structure compared to a physical vapor deposition (PVD) process, which promotes intermixing of the first metallic material and the second metallic material.

[0013] FIG. 1 illustrates a multi-chamber processing tool 100 suitable for performing methods for processing substrates according to some embodiments of the present disclosure. Examples of multi-chamber processing tools 100 include the CENTURA® and ENDURA® tools, all of which are commercially available from Applied Materials, Inc., Santa Clara, California, USA. The methods described herein can also be performed using other multi-chamber processing tools coupled with suitable processing chambers or in other suitable processing chambers. For example, in some embodiments, the methods of the present invention discussed above can be advantageously performed in a multi-chamber processing tool with limited or no vacuum breaks between processes. For example, reduced vacuum breaks may limit or prevent contamination of substrates being processed in the multi-chamber processing tool. Other processing chambers, including processing chambers available from other manufacturers, can also be used with the teachings described herein, as appropriate.

[0014] The multi-chamber processing tool 100 includes a vacuum-tight processing platform 101, a factory interface 104, and a system controller 102. The processing platform 101 includes multiple processing chambers, such as 114A, 114B, 114C, and 114D, that are operably coupled to a transfer chamber 103 that is under vacuum. The factory interface 104 is operably coupled to the transfer chamber 103 by one or more load lock chambers, such as 106A and 106B shown in FIG. 1 .

[0015] In some embodiments, the factory interface 104 includes at least one docking station 107 and at least one factory interface robot 138 to facilitate substrate transfer. The at least one docking station 107 is configured to receive one or more front-opening unified pods (FOUPs). Four FOUPs, identified as 105A, 105B, 105C, and 105D, are shown in FIG. 1 . The at least one factory interface robot 138 is configured to transfer substrates from the factory interface 104 through the load lock chambers 106A and 106B to the processing platform 101. The load lock chambers 106A and 106B each have a first port coupled to the factory interface 104 and a second port coupled to the transfer chamber 103. In some embodiments, the load lock chambers 106A and 106B are coupled to one or more service chambers (e.g., service chambers 116A and 116B). To facilitate the transfer of substrates between the vacuum environment of the transfer chamber 103 and the substantially ambient environment (e.g., atmospheric environment) of the factory interface 104, the load lock chambers 106A and 106B are coupled to a pressure control system (not shown) that pumps down and vents the load lock chambers 106A and 106B.

[0016] The transfer chamber 103 has a vacuum robot 142 disposed therein. The vacuum robot 142 can transfer substrates 121 between the load lock chambers 106A and 106B, the service chambers 116A and 116B, and the processing chambers 114A, 114B, 114C, and 114D. In some embodiments, the vacuum robot 142 includes one or more upper arms rotatable about corresponding shoulder axes. In some embodiments, the one or more upper arms are coupled to corresponding forearm and wrist members such that the vacuum robot 142 can extend into and exit from processing chambers coupled to the transfer chamber 103.

[0017] Processing chambers 114A, 114B, 114C, and 114D are coupled to transfer chamber 103. Processing chambers 114A, 114B, 114C, and 114D may each comprise a chemical vapor deposition (CVD) chamber, an atomic layer deposition (ALD) chamber, a physical vapor deposition (PVD) chamber, a plasma-enhanced atomic layer deposition (PEALD) chamber, a pre-clean / annealing chamber, or other similar chamber type. For example, processing chamber 114A is a CVD chamber. In some embodiments, processing chamber 114A is a Volta® CVD processing chamber, commercially available from Applied Materials, Inc. of Santa Clara, California, USA.

[0018] Other types of processing chambers may also be used, provided that the results of substrate processing are known to be dependent on the chamber component surface texturing taught herein.

[0019] The system controller 102 controls the operation of the multi-chamber processing tool 100 using direct control of the service chambers 116A and 116B and the processing chambers 114A, 114B, 114C, and 114D, or alternatively, by controlling computers (or controllers) associated with the service chambers 116A and 116B and the processing chambers 114A, 114B, 114C, and 114D. The system controller 102 generally includes a central processing unit (CPU) 130, memory 134, and support circuits 132. The CPU 130 may be one of any form of general-purpose computer processor that can be used in an industrial setting. The support circuits 132 are conventionally coupled to the CPU 130 and may include cache, clock circuits, input / output subsystems, power supplies, etc. The memory 134 may store software routines, such as the processing methods described above, that, when executed by the CPU 130, transform the CPU 130 into the system controller 102. These software routines may also be stored and / or executed by a second controller (not shown) located remotely from the multi-chamber processing tool 100 .

[0020] In operation, the system controller 102 enables data collection and feedback from each corresponding chamber and system to optimize performance and provide instructions to system components of the multi-chamber processing tool 100. For example, the memory 134 can be a non-transitory computer-readable storage medium having instructions that, when executed by the CPU 130 (or the system controller 102), perform the methods described herein.

[0021] FIG. 2 illustrates a processing chamber 200 for depositing a second metal material and etching the second metal material, according to some embodiments of the present disclosure. The processing chamber 200 is illustratively described herein with respect to a physical vapor deposition (PVD) chamber. However, methods and apparatus of the present principles can also be used in other processing chambers. The processing chamber 200 can be one of processing chambers 114A, 114B, 114C, and 114D. In some embodiments, the processing chamber 200 further includes a collimator 218 disposed therein. The processing chamber 200 generally includes an upper sidewall 202, a lower sidewall 203, a ground adapter 204, and a lid assembly 211, which define a body 205 that encloses an interior volume 206. The interior volume 206 includes a central portion having a diameter approximately the same as a given diameter of a substrate to be processed, and a peripheral portion that surrounds the central portion. Furthermore, the internal volume 206 includes an annular region near the target above the substrate, the inner diameter of the annular region being substantially equal to or greater than the diameter of the substrate such that a major portion of the plasma is located at a location that is both above the substrate and radially outward of the substrate.

[0022] An adapter plate 207 can be disposed between the upper sidewall 202 and the lower sidewall 203. A substrate support 208 is disposed within the interior volume 206 of the processing chamber 200. The substrate support 208 can include, for example, an electrostatic chuck (ESC) 251 having a puck 261. The substrate support 208 is configured to support a substrate having a given diameter (e.g., 150 mm, 200 mm, 300 mm, 450 mm, or other similar diameter). The lower sidewall 203 defines a substrate transfer port 209 for transferring the substrate into and out of the interior volume 206. In some embodiments, the processing chamber 200 is configured to deposit a second metal material, such as copper, cobalt, or aluminum, on the substrate 201. The substrate 201 can be the substrate 121 shown in FIG. 1.

[0023] A gas source 210 is coupled to the processing chamber 200 to supply a processing gas to the internal volume 206. In some embodiments, the processing gas may include inert, non-reactive, and reactive gases as needed. Examples of processing gases that may be supplied by the gas source 210 include, but are not limited to, argon (Ar), helium (He), neon (Ne), nitrogen (N), oxygen (O), and water vapor (H2O), among others. A pumping system 212 is coupled to the processing chamber 200 and connected to the internal volume 206 to control the pressure in the internal volume 206. In some embodiments, the pumping system 212 can also be used to remove backside gas from the substrate 201 to minimize cooling of the substrate 201. In some embodiments, the pressure level in the processing chamber 200 can be maintained at about 1 Torr or less during deposition. In some embodiments, the pressure level in the processing chamber 200 can be maintained at about 500 mTorr or less during deposition.

[0024] The ground adapter 204 can support a target, such as target 214. The target 214 is fabricated from the material to be deposited on the substrate. The target 214 can be coupled to a source assembly that includes a power source 217 for the target 214. In some embodiments, the power source 217 can be an RF power source, which can be coupled to the target 214 through a match network 216. In some embodiments, the power source 217 can alternatively be a DC power source, in which case the match network 216 is omitted. In some embodiments, the power source 217 can include both a DC power source and an RF power source.

[0025] A magnetron 270 is positioned above the target 214. The magnetron 270 may include multiple magnets 272 supported by a base plate 274 connected to a shaft 276, which may be axially aligned with the central axis of the processing chamber 200 and the substrate 201. The magnet 272 generates a magnetic field near the front surface of the target 214 within the processing chamber 200 to generate a plasma, resulting in a significant ion flux impacting the target 214 and causing sputter ejection of the target material. The magnet 272 may be rotated about the shaft 276 to increase the uniformity of the magnetic field across the surface of the target 214. The magnet 272 rotates about the central axis of the processing chamber 200 within an annular region extending from near the outer diameter of the substrate to near the outer diameter of the interior volume 206. Generally, the magnet 272 can be rotated so that the innermost position of the magnet during rotation of the magnet 272 is positioned above or outside the diameter of the substrate being processed (e.g., so that the distance from the axis of rotation to the innermost position of the magnet 272 is equal to or greater than the diameter of the substrate being processed).

[0026] The processing chamber 200 further includes an upper shield 213 and a lower shield 220, or a one-piece shield. A collimator 218 is disposed within the interior volume 206 between the target 214 and the substrate support 208. In some embodiments, the collimator 218 can be electrically biased to control the ion flux toward the substrate and the angular distribution of neutrals at the substrate, and to increase the deposition rate through an added DC bias. Electrically biasing the collimator reduces ion losses toward the collimator and advantageously increases the ion-to-neutral ratio at the substrate. To facilitate biasing the collimator 218, a collimator power supply (not shown) is coupled to the collimator 218. In some embodiments, the collimator 218 can be electrically isolated from grounded chamber components, such as the ground adapter 204. For example, as shown in FIG. 2, the collimator 218 is coupled to the upper shield 213.

[0027] In some embodiments, a set of magnets 296 can be disposed adjacent to the ground adapter 204 to help generate a magnetic field to guide ions expelled from the target 214. The magnetic field formed by the set of magnets 296 can, alternatively or in combination, prevent ions from striking the sidewalls of the chamber (or the sidewalls of the upper shield 213) and guide ions vertically through the collimator 218. For example, the set of magnets 296 can be configured to generate a magnetic field having substantially vertical magnetic field lines at its periphery. The substantially vertical magnetic field lines advantageously guide ions through the interior volume. The set of magnets 296 can be stationary or movable to adjust the position of the set of magnets 296 in a direction parallel to the central axis of the processing chamber 200.

[0028] An RF power source 280 can be coupled to the processing chamber 200 through the substrate support 208 to provide bias power to the substrate support 208. The bias power described herein is provided in connection with processing an exemplary 300 mm substrate and can be scaled according to the diameter or size of the substrate 201 (i.e., for larger or smaller substrates). For example, the RF power source 280 can provide bias power of greater than zero watts to about 1000 watts for a 300 mm diameter substrate 201. In some embodiments, the RF power source 280 can have a frequency between about 2 MHz and about 200 MHz, such as about 13.56 MHz. In operation, the magnet 272 is rotated to form a plasma 265 in the annular portion of the internal volume 206, thereby sputtering the target 214. When a collimator 218 is present, the plasma 265 can be formed above the collimator 218 to sputter the target 214 above the collimator 218. The radius of rotation of magnet 272 is larger than the radius of substrate 201 to ensure that little to no sputtered material resides above substrate 201 .

[0029] The collimator 218 is positively biased to force the second metal material through the collimator 218. Furthermore, most, if not all, of the sputtered neutral material moving toward the central region of the collimator 218 will likely collide with and deposit on the collimator walls. Because the directionality of the metal neutral particles cannot be changed, advantageously, most, if not all, of the metal neutral particles do not deposit on the substrate 201. To ensure there is enough space for the sputtered metal ions to change trajectories, the collimator 218 is positioned at a predetermined height above the substrate support 208.

[0030] In some embodiments, a bottom shield 220 can be provided near the collimator 218 and inside the ground adapter 204 or upper sidewall 202. The collimator 218 includes a plurality of apertures for directing a flux of gas and / or material into the interior volume 206. The collimator 218 can be coupled to a collimator power supply via a process tool adapter 238. A shield ring 226 can be disposed adjacent to the bottom shield 220, intermediate the bottom shield 220 and the adapter plate 207 within the processing chamber 200. Through adjusted positioning calibration between the substrate support 208 and a robot blade (not shown), the substrate 201 (shown in an elevated heating or reflow position supported on lift pins 240) is centered with respect to the longitudinal axis of the substrate support 208. Thus, during processing, the substrate 201 can be centered in the processing chamber 200, and the shield ring 226 can be radially centered around the substrate 201.

[0031] In operation, the robot blade of the vacuum robot 142, with the substrate 201 disposed thereon, extends through the substrate transfer port 209. The substrate support 208 can be lowered to allow the substrate 201 to be transferred to lift pins 240 extending from the substrate support 208. The raising and lowering of the substrate support 208 can be controlled by a drive 242 coupled to the substrate support 208. The substrate support 208 can be lowered when the lift pins 240 are raised to reach a heating position or a reflow position. Similarly, the substrate 201 can be lowered onto the substrate receiving surface 244 of the substrate support 208 by lowering the lift pins 240 and raising the substrate support 208 to an etching position or a deposition position. Once the substrate 201 is positioned on the substrate receiving surface 244 of the substrate support 208, a sputter deposition process or an etching process can be performed on the substrate 201.

[0032] During the deposition process, material is sputtered from the target 214 and deposited on the surface of the substrate 201. To maintain a plasma formed from the process gases supplied by the gas source 210, the target 214 and the substrate support 208 are biased relative to one another by a power supply 217 or an RF power supply 280. Ions from the plasma accelerate toward and collide with the target 214, thereby displacing target material from the target 214. The displaced target material and process gases form a layer having a desired composition on the substrate 201. To reduce or prevent unwanted deposition, a deposition ring 236 can be disposed around the substrate support 208 and can be electrically isolated from the substrate 201 during processing.

[0033] After sputter deposition or etching of the filler material, lift pins 240 can be utilized to lift the substrate 201 to a position spaced apart from the substrate support 208. This position can be adjacent to the adapter plate 207 and above one or both of the shield ring 226 and the reflector ring 248. The adapter plate 207 includes one or more lamps 250 coupled to the adapter plate 207 at a position intermediate the underside of the reflector ring 248 and a recess 252 in the adapter plate 207. The lamps 250 provide optical and / or radiant energy at visible or near-visible wavelengths, such as wavelengths within the infrared (IR) and / or ultraviolet (UV) spectrums. To perform the reflow process, energy from the lamps 250 is focused radially inward toward the backside (i.e., underside) of the substrate 201 to heat the substrate 201 and the materials deposited thereon. The reflective surfaces of the chamber components surrounding the substrate 201 serve to focus the energy toward the backside of the substrate 201 and away from other chamber components. If it reaches those chamber components, the energy will be lost and / or unused. After the substrate 201 is controlled to the third temperature, the substrate 201 is lowered to a position above the substrate receiving surface 244 of the substrate support 208. The substrate 201 can be removed from the processing chamber 200 through the substrate transfer port 209 for further processing.

[0034] FIG. 3 shows a cross-sectional view 300 of a portion of the substrate support 208 of the processing chamber 200, including the ESC 251 and lamps 250, in a deposition or etching position (the substrate 201 is in a lowered position not shown in FIG. 2). When the lamps 250 are operating, they emit infrared or ultraviolet heat. The substrate 201 is supported by a puck 261 interfaced with the ESC 251. Lift pins 240 allow the substrate 201 to be lifted from the substrate receiving surface 244 of the puck 261 when the substrate 201 is in a heating or reflow position. The cross-sectional view 400 in FIG. 4 shows the substrate 201 and substrate support 208 in a heating or reflow position (the substrate 201 is in a higher position shown in FIG. 2). In the reflow position, the substrate support 208 is lowered 402 as the lift pins 240 raise 404 the substrate 201 , allowing the underside 406 of the substrate 201 to be exposed to heat radiation 408 from the lamps 250 .

[0035] FIG. 5 illustrates a method 500 for filling features on a substrate. Method 500 can be performed using any suitable multi-chamber processing tool (e.g., multi-chamber processing tool 100). At 502, a first metal material is deposited in a feature on a substrate (e.g., substrate 201) to form a liner layer. In at least some embodiments, the feature can be a trench, via, or other similar feature. This liner layer advantageously improves the bonding quality of subsequently deposited fill material and reduces electromagnetic interference. FIG. 6A illustrates a schematic cross-sectional view 600A of a portion of substrate 201 prior to deposition of the first metal material. FIG. 6A illustrates substrate 201 having feature 610 and a barrier layer 602 disposed within feature 610. Substrate 201 generally includes a dielectric material, e.g., a silicon-containing material such as silicon oxide and its derivatives, e.g., fluorine-doped silicon dioxide (FSG), carbon-doped oxide (SiCOH), porous carbon-doped oxide (SiCOH), or other similar derivatives. When used, the barrier layer 602 prevents metallic diffusion of the first metallic material into the dielectric material of the substrate 201. In some embodiments, the barrier layer 602 is made of a metal or metal nitride, and can be deposited on the substrate 201 by a suitable deposition process, such as a PVD process, a CVD process, or other similar process.

[0036] FIG. 6B shows a schematic cross-sectional view 600B of a portion of substrate 201 with a first metallic material deposited within feature 610 to form liner layer 604. The first metallic material is deposited in a first processing chamber (e.g., processing chamber 114A) by a CVD process at a first temperature. In some embodiments, the first metallic material is deposited without bias power. The first metallic material can be deposited with or without a plasma. In some embodiments, the first metallic material is cobalt, tungsten, aluminum, silver, ruthenium, rhodium, iridium, or tantalum. In some embodiments, the first temperature is between about 150 degrees Celsius and about 250 degrees Celsius. In some embodiments, the thickness of the deposited first metallic material (i.e., the thickness of the liner layer) is less than 35 angstroms. In some embodiments, the first metallic material is deposited to a thickness of between about 14 angstroms and about 30 angstroms.

[0037] At 504, a second metallic material or fill material is deposited on the first metallic material in a second processing chamber (e.g., one of processing chambers 114B, 114C, 114D) at a second temperature and a first bias power to form a seed layer of the second metallic material. In some embodiments, the second metallic material is deposited by a PVD process. In some embodiments, the second metallic material comprises copper, cobalt, or aluminum. In some embodiments, before depositing the second metallic material on the substrate, the substrate is placed in a deposition position (e.g., the position shown in FIG. 3 ) in the second processing chamber. In some embodiments, the first processing chamber and the second processing chamber are part of a multichamber processing tool (e.g., multichamber processing tool 100), and the first processing chamber and the second processing chamber are each operably coupled to a vacuum transfer chamber.

[0038] 6C shows a schematic cross-sectional view 600C of a portion of substrate 201 with a seed layer 606 of a second metallic material deposited in feature 610. In some embodiments, the second temperature is between about 15 degrees Celsius and about 350 degrees Celsius. In some embodiments, the second temperature is between about 15 degrees Celsius and about 35 degrees Celsius. In some embodiments, the first bias power is between about 5 watts and about 120 watts for a 300 mm diameter substrate. The first bias power can be scaled according to the diameter or size of substrate 201.

[0039] At 506, a portion of a seed layer (e.g., seed layer 606) is etched in a second processing chamber by physical bombardment with metal ions at a second bias power greater than the first bias power to form an intermixed layer in the feature, the intermixed layer comprising the first and second metallic materials, disposed between liner layer 604 and seed layer 606. In some embodiments, the physical bombardment is by metal ions comprising the second metallic material. In some embodiments, the second bias power is between about 120 Watts and about 1000 Watts for a 300 mm diameter substrate. The second bias power can be scaled according to the diameter or size of the substrate. In some embodiments, the first bias power and the second bias power have a frequency between about 2 MHz and about 200 MHz. During this etching process, energetic ions of the second metallic material bombard the seed layer 606, thereby forcing particles of the second metallic material into interstitial voids in the liner layer 604 to form the intermixed layer. During this etching process, the high-energy ions of the second metallic material also bombard the bottom of the seed layer 606, thereby advantageously removing particles of the second metallic material from the bottom of the seed layer 606 and redepositing the removed particles on the sidewalls of the seed layer 606, which aids in a subsequent reflow process. Figure 6D shows a schematic cross-sectional view 600D of a portion of the substrate 201 after etching the seed layer 606. A mixed layer 608 is disposed between the liner layer 604 and the seed layer 606.

[0040] At 508, the substrate is heated to a third temperature, higher than the second temperature, to reflow at least a portion of the remaining second metallic material to at least partially fill the feature. The inventors have observed that when the second metallic material is disposed on the intermixed layer 608, the second metallic material reflows better (i.e., fewer or no voids in the feature) than when the second metallic material is disposed on the liner layer 604 without the intermixed layer 608 between the second metallic material and the liner layer 604. The third temperature should be sufficient to maintain the mobility of the second metallic material. In some embodiments, the third temperature is between about 100 degrees Celsius and about 400 degrees Celsius. In some embodiments, before heating the substrate, the substrate is placed in an elevated heating position above the deposition position. FIG. 6E shows a schematic cross-sectional view 600E of a portion of a substrate 201 having reflowed second metallic material 612.

[0041] Optionally, at 510, additional second metallic material may be deposited in the feature (e.g., feature 610) in a second processing chamber. In some embodiments, the additional second metallic material may be deposited at a second temperature. Optionally, at 512, the additional second metallic material is etched in the second processing chamber. This additional etching process may mix particles of the additional second metallic material into intermixed layer 608. Optionally, at 514, the substrate is heated to reflow the additional second metallic material in feature 610. In some embodiments, 510 and 514 may be repeated, with or without repeating the etching of 512, until feature 610 is completely filled with the fill material (i.e., reflowed second metallic material 612) without any voids or gaps in feature 610, as shown in FIG. 6F .

[0042] While the forgoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof.

Claims

1. 1. A method of filling features on a substrate, comprising: depositing a first metallic material into features disposed in the substrate and onto the substrate at a first temperature by a chemical vapor deposition (CVD) process in a first processing chamber; depositing a second metallic material on the first metallic material in a second processing chamber at a second temperature and a first bias power to form a seed layer of the second metallic material; etching a portion of the seed layer in the second processing chamber at a second bias power greater than the first bias power to form an intermixed layer of the first metallic material and the second metallic material in the feature comprising the first metallic material and the second metallic material; and heating the substrate to a third temperature greater than the second temperature to reflow at least a portion of the remaining portion of the second metallic material to at least partially fill the feature. A method comprising:

2. depositing an additional second metallic material on the seed layer in the second processing chamber at the second temperature; and After depositing the additional second metallic material, heating the substrate to the third temperature to reflow the additional second metallic material. The method of claim 1 further comprising:

3. The method of claim 1 , wherein the first bias power and the second bias power have a frequency between about 2 MHz and about 200 MHz.

4. the first bias power is between about 5 watts and about 120 watts; and the second bias power is between about 120 watts and about 1000 watts; The method of claim 1 , wherein the method is at least one of:

5. The method of claim 1 , wherein the first temperature is between about 150 degrees Celsius and about 250 degrees Celsius.

6. The method of claim 1 , wherein the second temperature is between about 20 degrees Celsius and about 350 degrees Celsius.

7. The method of claim 1 , wherein the third temperature is between about 100 degrees Celsius and about 400 degrees Celsius.

8. The method of claim 1 , wherein the second metallic material is deposited in a physical vapor deposition (PVD) chamber.

9. The method of any of claims 1 to 8, wherein the second metallic material comprises copper, cobalt or aluminum.

10. The method according to any one of claims 1 to 8, wherein the first metallic material is cobalt, tungsten, aluminum, silver, ruthenium, rhodium, iridium or tantalum.

11. placing the substrate in a deposition position prior to depositing the second metallic material on the substrate; and placing the substrate at an elevated heating position above the deposition position prior to heating the substrate; The method of any one of claims 1 to 8, further comprising:

12. 9. The method of claim 1, wherein the first processing chamber and the second processing chamber are part of a multi-chamber processing tool, each of the first processing chamber and the second processing chamber is operably coupled to a vacuum transfer chamber, and wherein depositing the first metallic material and depositing the second metallic material is performed without breaking vacuum.

13. The method of any preceding claim, wherein the thickness of the deposited first metallic material is less than 30 Angstroms.

14. 10. A non-transitory computer readable medium having instructions stored thereon that, when executed, cause the performance of a method for filling features on a substrate, the method comprising the method of any of claims 1 to 8.

15. 15. The non-transitory computer-readable medium of claim 14, wherein the second metallic material comprises copper, cobalt, or aluminum.

16. placing the substrate at a first position prior to depositing the second metallic material on the substrate; 15. The non-transitory computer-readable medium of claim 14, further comprising:

17. placing the substrate at a second position above the first position before heating the substrate; 15. The non-transitory computer-readable medium of claim 14, further comprising:

18. 15. The non-transitory computer-readable medium of claim 14, wherein the first processing chamber and the second processing chamber are part of a multi-chamber processing tool, and wherein each of the first processing chamber and the second processing chamber is operably coupled to a vacuum transfer chamber.

19. 15. The non-transitory computer-readable medium of claim 14, wherein the deposited first metallic material has a thickness of less than 30 angstroms.

20. 15. The non-transitory computer-readable medium of claim 14, wherein the first metallic material is cobalt, tungsten, aluminum, silver, ruthenium, rhodium, iridium, or tantalum.

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