LED lighting devices for ships

Abstract

To provide a marine LED lighting device that can sufficiently dissipate heat generated from an LED board and a power supply board without using metal components that come into contact with outside air.SOLUTION: Light emitted from an LED component 27 arranged in an interior space S enclosed by a body 2 and a glove 3 is transmitted through the glove 3 and diffused to an outside. The marine LED lighting device comprises: a power supply board 4 which is arranged on a mounting base 7 of the body 2 across a first space S1 and has a semiconductor component 22 mounted thereon; and an LED board 5 which is arranged on the power supply board 4 across a second space S2 and has the LED component 27 mounted thereon. A heat-dissipating connection member 6 arranged in the first space S1 and having one end attached to the mounting base 7 of the body 2 and the other end in contact with the semiconductor component 22 mounted on the power supply board 4 is provided. A heat-dissipating board 12 facing the first space S1 is provided in the mounting base 7 of the body 2. A heat-dissipating plate 29 facing the second space S2 is provided in the LED board 5.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an LED lighting device for a vessel, and more particularly to a heat dissipation structure thereof. [Background technology]

[0002] High-brightness LEDs have traditionally been used in lighting devices, but marine lighting devices, in particular, require durability to prevent breakdowns during navigation. In particular, lighting devices that contain heat-generating components such as LEDs and semiconductors can become unstable and shorten their lifespan due to heat generation, and salt and moisture can cause corrosion and deterioration of the components, resulting in reduced insulation and rust. For this reason, LED lighting devices for marine use require heat dissipation and waterproofing. Heat-generating components that come into contact with the outside air are generally equipped with metal heat dissipation fins, which have excellent heat dissipation properties, but these are not suitable for heat-generating components on ships that are exposed to saltwater. Conventional lighting devices have an integrated globe because condensation inside the globe can cause breakdowns.

[0003] Patent Document 1 describes an LED lamp in which a lens frame is attached to an opening in a housing, a metal ring-shaped heat dissipation member is attached to a circular hole in the lens frame, a lens is provided at the front of the inner periphery of this heat dissipation member, and an LED board is provided at the rear. With this LED lamp, heat generated from the LED is released to the outside from around the lens via the heat dissipation member. However, there is a problem in that the heat that escapes to the backside of the LED board is trapped inside the housing along with heat generated by the LED driver (power supply board) housed inside the housing, and is not sufficiently dissipated. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5148538 specification Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention was made in consideration of the above-mentioned conventional problems, and aims to provide an LED lighting device for ships that can sufficiently dissipate heat generated from the LED board and power board without using metal parts that come into contact with the outside air. [Means for solving the problem]

[0006] The means for solving the above problem is In an LED lighting device for ships, light emitted from an LED component arranged in an internal space surrounded by a main body and a globe is diffused to the outside by passing through the globe. a power supply board on which semiconductor components are mounted, the power supply board being disposed on the mounting base of the main body across a first space; The power supply substrate is disposed with a second space therebetween, The aforementioned and an LED substrate on which LED components are mounted, A gap is formed between the inner surface of the globe and each outer periphery of the power supply substrate and the LED substrate, The device is characterized in that a heat dissipation connecting member is provided, which is arranged in the first space, has one end attached to the mounting base of the main body, and the other end contacts the semiconductor component mounted on the power supply board. In this method, heat generated by the semiconductor components on the power supply board is thermally conducted to the heat dissipation connecting member, and is radiated to the first space through the surface of the heat dissipation connecting member, and is also thermally conducted to the mounting base of the main body through the heat dissipation connecting member, and is radiated to the outside through the outer surface of the main body. Also, heat generated by the LED components on the LED board is radiated to the internal space of the globe and the second space.

[0007] It is preferable that a heat dissipation board facing the first space is provided on the mounting base of the main body, and the heat dissipation board is in contact with the heat dissipation connecting member. In this means, heat generated by the semiconductor components on the power supply board is thermally conducted to the heat dissipation board through the heat dissipation connecting member, and is dissipated from the entire surface of the heat dissipation board into the first space.

[0008] The LED substrate is preferably provided with a heat sink facing the second space. In this method, heat generated by the LED components on the LED board is dissipated from the entire surface of the heat sink into the second space.

[0009] a first spacer that regulates the spacing of the first space is provided between the mounting base and the power supply board; It is preferable that a second spacer be provided between the power supply board and the LED board to regulate the distance of the second space. In this means, the size of the first space is determined by the first spacer, and the size of the second space is determined by the second spacer. Heat generated in the semiconductor components on the power supply board is thermally conducted to the mounting board via the first spacer, heat generated in the LED components on the LED board is thermally conducted to the power supply board via the second spacer, and heat is thermally conducted from the power supply board to the mounting board via the first spacer.

[0010] The heat dissipation connecting member and the semiconductor component are preferably in contact with each other via a heat dissipation sheet, which ensures heat dissipation for components that are susceptible to heat deterioration on the power supply board and promotes heat conduction from the power supply board to the mounting board. According to this means, the heat dissipation sheet also serves to ensure insulation, and electrical insulation can be ensured between the heat dissipation connecting member and the semiconductor component.

[0011] It is preferable that the bare wire portion of the power cable connected to the semiconductor component, the mounting surface of the power supply board, and the mounting surface of the LED board are coated. This improves water resistance against moisture that penetrates into the inside of the globe through the inside of the power cable connected to the semiconductor component.

[0012] The glove is preferably detachably attached to the main body. According to this method, the globe is detachable from the main body, so if condensation occurs inside the globe, the globe can be removed to remove the moisture inside and then attached to the main body, allowing the lighting device to be used for a long period of time.

[0013] It is preferable that the earth wire of the power cable that passes through the mounting base of the main body is connected to the heat dissipation board. This method reduces the noise voltage and provides sufficient electromagnetic compatibility for marine electrical equipment. [Effects of the Invention]

[0014] According to the present invention, the heat generated from the LED board and power supply board can be sufficiently dissipated without using metal parts that come into contact with the outside air, which has the effect of stabilizing the operation of these parts and improving their durability. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is an exploded perspective view of an LED lighting device for a marine vessel according to an embodiment of the present invention; [Figure 2] Cross-sectional view of an LED lighting device for ships. [Figure 3] FIG. 2 is an exploded perspective view of the heat dissipation board, the power supply board, the heat dissipation connecting member, and the heat dissipation sheet, viewed obliquely from below. [Figure 4] A perspective view of the main body from diagonally above with the globe and LED board removed. [Figure 5] An enlarged view showing the connection between the power cable and the power supply board. [Figure 6] FIG. [Figure 7] 10A and 10B are diagrams showing the results of conducted emissions tests. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

[0017] 1 shows a marine LED lighting device (hereinafter sometimes simply referred to as lighting device) 1 according to an embodiment of the present invention. The lighting device 1 includes a main body 2, a globe 3, a power supply board 4, an LED board 5, and a heat dissipation connecting member 6.

[0018] The main body 2 is made of synthetic resin such as glass fiber-reinforced polybutylene terephthalate (PBT) resin, and is composed of a circular mounting base 7, a first cylindrical portion 8, and a second cylindrical portion 9.

[0019] As shown in FIG. 2, the mounting base 7 has an annular groove 11 formed on its outer periphery in which a packing 10 is fitted. A circular heat dissipation substrate 12 made of anodized aluminum is mounted on the mounting base 7. A rubber bushing 13 is attached to the mounting base 7 to guide the power cable A, which is a three-core cabtyre cable, from the second cylindrical portion 9 side through the mounting base 7 and the heat dissipation substrate 12 to the first cylindrical portion 8 side. A cylindrical coaming 7a is provided on the back surface of the mounting base 7, i.e., the surface on the second cylindrical portion 9 side, so as to surround the rubber bushing 13. Silicone resin 7b is filled inside the coaming 7a. This silicone resin 7b is formed by the sheath A of the power cable A. s and covers the three-core cords A1, A2, and A3 exposed from its end face. The first cylindrical portion 8 side and the second cylindrical portion 9 side of the power cable A are sealed with silicone resin 7b and rubber bushing 13. A first spacer 15 consisting of three hexagonal pillars is attached to the heat dissipation substrate 12 with a mounting screw 14 that is inserted through the mounting base 7 and the heat dissipation substrate 12 from the second cylindrical portion 9 side. In addition, a heat dissipation connecting member 6 (described below) is attached to the heat dissipation substrate 12 with a mounting screw 16 that is inserted through the mounting base 7 and the heat dissipation substrate 12 from the second cylindrical portion 9 side. It is preferable to apply a waterproof coating to the threaded portions of the mounting screws 14 and 16.

[0020] The first cylindrical portion 8 has an internal thread 17 formed on its inner surface. The first cylindrical portion 8 is adapted to be fitted with a globe 3, which will be described later.

[0021] The second cylindrical portion 9 has an outer diameter smaller than that of the first cylindrical portion 8, and has an external thread 18 formed on its outer surface. The second cylindrical portion 9 is adapted to be attached to a mounting base (not shown).

[0022] The globe 3 is milky white and made of a light-transmitting material such as polycarbonate. The globe 3 is cylindrical and has an opening 19 at one end and a spherical head 20 at the other end. The opening 19 is sized to be inserted into the first cylindrical portion 8 of the main body, and has a male thread 21 formed on its outer surface that screws into the female thread 17 of the first cylindrical portion 8 of the main body 2. When the globe 3 is attached to the main body 2, the open end of the opening 19 presses against the gasket 10 of the main body 2, sealing the inside of the globe 3 from the outside.

[0023] The power supply board 4 has a circular shape that can be accommodated in the first cylindrical portion 8 of the main body 2. A power circuit (not shown) including semiconductor components 22 such as transistors is mounted on the surface of the mounting base 7 facing the heat dissipation substrate 12 (the bottom surface in the figure). In FIG. 1, reference numeral 23 denotes input terminals to which two power cords A1 and A2 and a ground wire A3 of the power cable A, which is routed internally through the rubber bushing 13, are connected. Reference numeral 24 denotes an output terminal to the LED board 5. The power supply board 4 is placed on a first spacer 15 with its mounting surface, i.e., the semiconductor components 22, facing the heat dissipation substrate 12 of the main body 2, thereby being separated from the mounting base 7 of the main body 2 by a first space S1. The first spacer 15 regulates the spacing of the first space S1 to a predetermined distance. An insulating wall 25 protrudes toward the mounting base 7 from the outer periphery of the power supply board 4 to ensure a creepage distance between the power supply circuit including the semiconductor components 22 and the globe 3. The insulating wall 25 is cut out at a portion that would interfere with the heat dissipation connecting member 6 (described later). On the side opposite to the mounting surface of the power supply board 4, that is, on the spherical head 20 side of the globe 3, a recess 4a is formed in which three second spacers 26 are arranged in the same positions as the first spacers 15.

[0024] The second spacer 26 is made of a hexagonal support pillar, with a male screw formed at one end and a screw hole formed at the other end. The male screw of the second spacer 26 is inserted through the recess 4a of the power supply board 4 and screwed into the screw hole of the first spacer 15, thereby fixing the power supply board 4 onto the first spacer 15.

[0025] The LED board 5 has a circular shape that can be accommodated in the first cylindrical portion 8 of the main body 2. An LED drive circuit (not shown) including LED components 27 is mounted on the surface facing the spherical head 20 of the globe 3. In FIG. 1, reference numeral 28 denotes an input terminal connected to the output terminal 24 of the power supply board 4 via a wire (not shown). A circular heat sink 29 made of anodized aluminum and having the same diameter as the LED board 5 is placed on the side opposite the mounting surface of the LED board 5. The heat sink 29 has a notch 30 for passing a wire (not shown) connecting the output terminal 24 of the power supply board 4 to the input terminal 28 of the LED board 5. The LED board 5 is placed on the second spacer together with the heat sink 29, with the mounting surface (i.e., the LED components 27) facing the spherical head 20 of the globe 3, so that the LED board 5 is positioned on the mounting base 7 of the main body 2 across the second space S2. The second spacer 26 regulates the spacing of the second space S2 to a predetermined value. The second spacer 26 is formed to be shorter than the first spacer 15, and the second space S2 is smaller than the first space S1.

[0026] The LED substrate 5 is fixed onto the second spacer 26 by screwing a mounting screw 31 inserted through the LED substrate 5 and the heat sink 29 from the spherical head 20 side of the globe 3 into the second spacer 26.

[0027] The heat dissipating connecting member 6 is made of anodized aluminum and, as shown in FIG. 3 , has a flat contact portion 32, two leg portions 33 bent 90 degrees from both side edges of the contact portion 32 and extending perpendicular to the heat dissipating substrate 12, and two foot portions 34 bent 90 degrees from the leg portions 33 and extending parallel to the heat dissipating substrate 12. The contact portion 32 and the leg portions 33 form an inverted U-shape. The heat dissipating connecting member 6 is positioned so that the foot portions 34 are placed on the heat dissipating substrate 12 and the contact portion 32 contacts the semiconductor components 22 of the power supply board 4 via the heat dissipating sheet 35. The heat dissipating connecting member 6 is fixed to the heat dissipating substrate 12 by screwing the mounting screws 16, which are inserted through the mounting base 7 and the heat dissipating substrate 12 from the second cylindrical portion 9 side, into the foot portions 34. The heat dissipating sheet 35 is preferably made of silicone rubber, which has insulating, thermally conductive, and flame-retardant properties. As shown in FIG. 4, the leg portions 34 are formed as large as possible so as to increase the contact area with the heat dissipation board 12 without interfering with surrounding members.

[0028] As shown in FIG. 5, the bare wire portion of the power cable A connected to the input terminal 23 of the power supply board 4, the mounting surface of the power supply board 4, and the mounting surface of the LED board 5 are coated with a waterproof coating agent 36.

[0029] 5, the earth wire A3 of the power cable A is connected to the input terminal 23 of the power supply board 4, and further, as shown in Fig. 4, the earth wire A4 is connected from the input terminal 23 to between the first spacer 15 and the heat dissipation board 12. In this way, the earth wire A3 of the power cable A is electrically connected to the heat dissipation board 12.

[0030] As shown in Figure 6, the power cord A coming out of the silicone resin 7b of the coaming 7a on the back side of the mounting base 7, i.e., on the side of the second cylindrical portion 9, is in a position eccentric from the center of the second cylindrical portion 9, so it is gathered to the center of the second cylindrical portion 9 by an insulation lock tie 37 and wired to the mounting portion (not shown).

[0031] Marine electrical equipment such as the marine LED lighting device 1 of this embodiment requires dustproofness (IP5X: protection from dust particles) and waterproofness (IPX6: not adversely affected by water jets from all directions) as specified by IEC standards, as well as electromagnetic compatibility (EMC) as specified in JIS F 0808:2009. In this embodiment of the present invention, we confirmed that the dustproofness meets IP5X and the waterproofness meets IPX6. In a conducted emissions test, a pseudo power supply circuit network is connected between the power supply and the power port of the test specimen (the marine LED lighting device 1 of this embodiment), and the noise voltage between the power port and ground is measured. Figure 7 shows the results of a conducted emissions test for the marine LED lighting device 1 of this embodiment. In Figure 7, the vertical axis represents noise level, and the horizontal axis represents frequency. Figure 7(a) shows the case where the heat dissipation substrate 12 is not grounded, and Figure 7(b) shows the case where the heat dissipation substrate 12 is grounded. As is clear from these test results, when the heat dissipation board 12 was not grounded (Fig. 7(a)), the measured values ​​exceeded the criterion in the high frequency range of 0.1 MHz or higher, whereas in the marine LED lighting device 1 of this embodiment, the power supply board 4 is connected to the heat dissipation board 12 via ground wires A3 and A4, so the measured noise voltage was below the criterion (Fig. 7(b)), confirming that the device has sufficient electromagnetic compatibility. This is because the radiative noise generated by, for example, the switching elements of the power supply board 4 is absorbed by the heat dissipation board 12 by grounding the heat dissipation board 12, thereby reducing the noise level.

[0032] Next, the operation of the LED lighting device for a vessel 1 configured as described above will be described.

[0033] The LED components 27 on the LED board 5 can emit or not emit light depending on the power supplied and controlled from the power supply board 4, and can blink or adjust the brightness or color as needed. The light emitted by the LED components 27 passes through the globe 3 and illuminates the outside.

[0034] Heat generated by the semiconductor components 22 on the power supply board 4 is thermally conducted to the heat dissipation connecting member 6 via the heat dissipation sheet 35, and is radiated from the surface of the heat dissipation connecting member 6 to the first space S1, and is also thermally conducted through the heat dissipation connecting member 6 to the mounting base 7 of the main body 2, and is radiated to the outside from the outer surface of the main body 2. In addition, heat generated by the LED components 27 on the LED board 5 is radiated to the internal space S of the globe 3 and the second space S2.

[0035] A heat dissipation substrate 12 is provided on the mounting base 7 of the main body 2, and the heat dissipation substrate 12 is in contact with the heat dissipation connecting member 6, so that heat generated by the semiconductor components 22 on the power supply board 4 is thermally conducted to the heat dissipation substrate 12 through the heat dissipation connecting member 6, and is radiated from the entire surface of the heat dissipation substrate 12 to the first space S1, and is also thermally conducted to the mounting base 7 of the main body 2, and is radiated to the outside from the outer surface of the main body 2.

[0036] In addition, since the LED substrate 5 is provided with a heat sink 29 facing the second space S2, the heat generated by the LED components 27 of the LED substrate 5 is thermally conducted to the heat sink 29 and dissipated from the entire surface of the heat sink 29 into the second space S2.

[0037] A first spacer 15 is provided between the mounting base 7 and the power supply board 4, and a second spacer 26 is provided between the power supply board 4 and the LED board 5, so that heat generated in the semiconductor components 22 on the power supply board 4 is thermally conducted to the mounting base 7 via the first spacer 15, heat generated in the LED components 27 on the LED board 5 is thermally conducted to the power supply board 4 via the second spacer 26, and heat is thermally conducted from the power supply board 4 to the mounting base 7 via the first spacer 15, and is then radiated to the outside from the outer surface of the main body 2.

[0038] In this way, the heat from the semiconductor component 22 is dissipated from the heat dissipation connecting member 6 and the surface of the heat dissipation substrate 12 into the first space S1, and the heat from the LED component 27 is dissipated from the surface of the heat dissipation plate 29 into the second space S2, so that the heat transfer area is large, heat dissipation is sufficient, the operation of these components is stabilized, and their durability is improved.

[0039] Since the heat dissipation connecting member 6 and the semiconductor component 22 are in contact with each other via the heat dissipation sheet 35, electrical insulation between the heat dissipation connecting member 6 and the semiconductor component 22 can be ensured.

[0040] The bare wire portion of the power cable A connected to the input terminal 23 of the power supply board 4, the mounting surface of the power supply board 4, and the mounting surface of the LED board 5 are coated with a waterproof coating agent, thereby improving water resistance against moisture that penetrates into the inside of the globe 3 through the inside of the power cable A connected to the semiconductor component 22.

[0041] The globe 3 is attached to the main body 2 with screws and is detachable, so if condensation occurs inside the globe 3, the lighting device 1 can be used for a long period of time by removing the globe 3 and removing the moisture inside before attaching it to the main body 2.

[0042] The present invention is not limited to the above-described embodiments, and modifications and variations can be made within the scope of the invention as defined in the claims.

[0043] For example, the heat dissipation connecting member 6 is formed in an inverted U shape with the contact portion 32 and both leg portions 33, but it may also be in a T shape or an inverted L shape. [Explanation of symbols]

[0044] 1…LED lighting equipment for ships 2...Main unit 3. Gloves 4...Power supply board 5...LED board 6...Heat dissipation connecting member 7...Mounting base 12...Heat dissipation board 15...First spacer 22...Semiconductor parts 26...Second spacer 27...LED parts 29...Heat sink 35...Heat dissipation sheet A...Power cable A3...Earth wire A4...Earth wire S...interior space S1…first space S2…Second space

Claims

1. In an LED lighting device for a vessel, light emitted from an LED component disposed in an internal space surrounded by a main body and a globe is diffused to the outside by passing through the globe. a power supply board on which semiconductor components are mounted, the power supply board being disposed on the mounting base of the main body across a first space; an LED board on which the LED components are mounted, the LED board being disposed across a second space from the power supply board; a gap is formed between the inner surface of the globe and each outer periphery of the power supply substrate and the LED substrate; the main body comprises the mounting base, a first cylindrical portion having a female thread on its inner surface, and a second cylindrical portion having a male thread on its outer surface; The globe is detachably provided by threading a male screw formed on an outer surface of the globe into a female screw of the first cylindrical portion of the main body, The second cylindrical portion is attached to a mounting base of the LED lighting device for a marine vessel. An LED lighting device for a vessel.

2. The LED lighting device for a vessel according to claim 1, wherein a heat dissipation substrate facing the first space is provided on the mounting base of the main body.

3. 2. The LED lighting device for a vessel according to claim 1, wherein the LED board is provided with a heat sink facing the second space.

4. a first spacer that regulates the distance of the first space is provided between the mounting base and the power supply board; 2. The LED lighting device for a vessel according to claim 1, further comprising a second spacer provided between the power supply board and the LED board to regulate the distance of the second space.

5. 2. The LED lighting device for a vessel according to claim 1, wherein the bare wire portion of the power cable connected to the semiconductor component, the mounting surface of the power supply board, and the mounting surface of the LED board are coated.

6. 3. The LED lighting device for a vessel according to claim 2, wherein a ground wire of a power cable passing through the mounting base of the main body is connected to the heat dissipation board.

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