Sensor shift structure in optical image stabilization suspension

Abstract

A suspension assembly is described that includes a rigid interposer circuit, a plurality of flexible circuits configured to be attached to the rigid interposer circuit and movable about X and Y axes relative to a stationary plate, and a sensor mounting area on the rigid interposer circuit.

Description

[Technical Field]

[0001] The present invention relates generally to optical image stabilization (OIS) suspension devices used in conjunction with cameras, including those incorporated into mobile devices such as phones and tablets. [Background technology]

[0002] Shape memory alloy ("SMA") camera lens optical image stabilization ("OIS") suspensions are generally known, and are described, for example, in U.S. Patent No. 6,229,999 to Howarth, U.S. Patent No. 6,229,999 to Miller, U.S. Patent No. 6,229,999 to Brown, U.S. Patent No. 6,229,999 to Ladwig, U.S. Patent No. 6,229,999 to Eddington, U.S. Patent No. 6,229,999 to Howarth ... The moving member and the support member are connected by a shape memory alloy SMA wire and controlled by a controller, which is driven to move the moving member relative to the support member about the X-axis (x-axis) and the Y-axis (y-axis) to stabilize the position of the image generated by the lens on the image sensor against vibrations that may be caused by the movement of a user's hand. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent No. 9,175,671 [Patent Document 2] U.S. Patent No. 9,366,879 [Patent Document 3] U.S. Patent No. 9,479,699 [Patent Document 4] US Patent Application Publication No. 2016 / 154251 [Patent Document 5] US Patent Application Publication No. 2015 / 135703 [Patent Document 6] US Patent Application Publication No. 2015 / 346507 [Patent Document 7] International Publication No. 2014 / 083318 [Patent Document 8] International Publication No. 2013 / 175197 [Patent Document 9] U.S. Patent No. 8,941,951 [Patent Document 10] U.S. Patent No. 8,885,299 [Patent Document 11] U.S. Patent No. 8,169,746 [Patent Document 12] U.S. Patent No. 8,144,430 [Patent Document 13] U.S. Patent No. 7,929,252 [Patent Document 14] U.S. Patent No. 7,388,733 [Patent Document 15] U.S. Patent No. 7,384,531 [Patent Document 16] U.S. Patent No. 5,862,015 Summary of the Invention [Problem to be solved by the invention]

[0004] However, there remains a continuing need for improved optical image stabilization OIS suspension devices. Optical image stabilization OIS suspensions of this type that are highly functional, robust, and efficient to manufacture would be particularly desirable. [Means for solving the problem]

[0005] A suspension assembly is described that includes a stationary member or plate, a moving member or plate movable relative to the stationary plate in an X-axis and a Y-axis, a sensor mounting region on the moving plate, and one or more shape memory alloy (SMA) elements extending between and coupled to the stationary plate and the moving plate. When driven by a controller, the shape memory alloy SMA elements move the moving plate and the sensor mounting region on the moving plate in the X-axis and the Y-axis relative to the stationary plate.

[0006] Other features and advantages of embodiments of the present invention will be apparent from the accompanying drawings and from the detailed description that follows. Embodiments of the present invention are illustrated, and not limited, in the figures of the accompanying drawings in which like references indicate like elements throughout and in which: [Brief explanation of the drawings]

[0007] [Figure 1] 1 illustrates a sensor-shift camera system with an optical image stabilization suspension according to an embodiment. [Figure 2] FIG. 2 is an exploded view of an optical image stabilization suspension assembly according to an embodiment. [Figure 3] FIG. 3 is a perspective view of the optical image stabilization suspension assembly shown in FIG. 2. [Figure 4] 1 is an exploded view of an optical image stabilization suspension assembly with a centering spring according to an embodiment. [Figure 5] 5 is a perspective view of the optical image stabilization suspension assembly shown in FIG. 4. [Figure 6] 4A and 4B illustrate a centering spring of an optical image stabilization suspension assembly according to an embodiment. [Figure 7] 1 is an exploded view of an optical image stabilization suspension assembly including four shape memory alloy SMA wires, according to an embodiment. [Figure 8] 8 is a perspective view of the optical image stabilization suspension assembly illustrated in FIG. 7. [Figure 9] 1 is an exploded view of an optical image stabilization suspension assembly including a looped shape memory alloy SMA wire, according to an embodiment. [Figure 10] FIG. 10 is a perspective view of the optical image stabilization suspension assembly shown in FIG. 9. [Figure 11] Parts 11a and 11 show a looped shape memory alloy SMA wire configuration for an optical image stabilization suspension assembly according to some embodiments. [Figure 12] 1 is a cross-sectional view of an optical image stabilization suspension assembly according to an embodiment. [Figure 13] 1 illustrates an optical image stabilization suspension assembly implemented as a square wire sensor assembly, according to an embodiment. [Figure 14] FIG. 14 is a perspective view of the optical image stabilization suspension assembly shown in FIG. 13. [Figure 15] 1 illustrates an optical image stabilization suspension assembly implemented as an arcuate sensor assembly, according to an embodiment. [Figure 16] FIG. 16 is a perspective view of the arcuate sensor assembly shown in FIG. 15. [Figure 17] 1 illustrates an optical image stabilization suspension assembly implemented as a bimetallic actuator according to an embodiment. [Figure 18] 1A-1C illustrate exemplary behavior of a shape memory alloy SMA material as it is heated, passing from a cold state to a hot state, and then returning to the cold state. [Figure 19]1 illustrates an optical image stabilization suspension assembly implemented as a bimetallic actuator according to an embodiment. [Figure 20] 1 illustrates a bimetallic actuator according to an embodiment in a flat (planar) pre-formed state. [Figure 21] 1 illustrates a half-barrel roll interposer for an optical image stabilization suspension assembly, according to an embodiment. [Figure 22] 22 illustrates a half barrel roll interposer in a flat state before being formed into the final half barrel roll interposer state illustrated in FIG. 21. [Figure 23] 1 illustrates an interposer with a 45 degree bend for an optical image stabilization suspension assembly according to an embodiment having a flexible circuit. [Figure 24] 10A-10C illustrate an interposer with a 45 degree bend for an optical image stabilization suspension assembly according to an embodiment having a flexible circuit. [Figure 25] 24 illustrates an interposer in a flat state before being formed into the final state of the interposer as illustrated in FIG. 23, with flexible circuits protruding from four sides of the interposer. [Figure 26] 10A and 10B illustrate an underside of a moving member with heat sink features of an optical image stabilization suspension assembly in accordance with an embodiment. [Figure 27] 10 is a bottom cross-sectional view of a moving member with heat sink features of an optical image stabilization suspension assembly in accordance with an embodiment. FIG. [Figure 28] 10 is a cross-sectional top view of a moving member with heat sink features and conductive plating of an optical image stabilization suspension assembly according to an embodiment. [Figure 29] 1A and 1B illustrate a moving member of an optical image stabilization suspension assembly according to an embodiment, the moving member including vias and conductive plating. [Figure 30]1 illustrates an optical image stabilization suspension assembly including one or more Hall sensors, according to an embodiment. [Figure 31] 1 is an exploded view of an optical image stabilization suspension assembly according to an embodiment, including one or more capacitance probes as movement sensors. [Figure 32] 10A and 10B are diagrams illustrating examples of determining movement using a capacitive probe according to an embodiment. [Figure 33] 1A-1C illustrate examples of determining a nominal or center position of an optical image stabilization suspension assembly according to embodiments. [Figure 34] 1 illustrates an optical image stabilization suspension assembly according to an embodiment, including strain gauges as motion sensors. [Figure 35] 1 is an exploded view of an optical image stabilization suspension assembly implemented as a bimetallic actuator according to an embodiment. [Figure 36] 36 is a perspective view of the optical image stabilization suspension assembly implemented as a bimetallic actuator shown in FIG. 35. [Figure 37] FIG. 1 is a cross-sectional view of a bimetallic actuator according to an embodiment comprising a bimorph actuator on an inner rail, flexible trace routing on an outer rail, and a movement sensor as described herein. [Figure 38] 1 is a top view of a bimetallic actuator according to an embodiment, the bimetallic actuator comprising a moving part and a fixed part; [Figure 39] 1 illustrates a layout pattern for forming an integrated shape memory alloy SMA bimorph X / Y actuator according to an embodiment. [Figure 40] 1 is an exploded view of an optical image stabilization suspension assembly implemented as an integrated shape memory alloy SMA actuator assembly according to an embodiment. [Figure 41]41 is a perspective view of an optical image stabilization suspension assembly implemented as an integrated shape memory alloy SMA actuator assembly as shown in FIG. 40. [Figure 42] 1 is a perspective view of an optical image stabilization suspension assembly implemented as an integrated shape memory alloy SMA actuator assembly according to an embodiment. FIG. [Figure 43] FIG. 1 is a side view of an optical image stabilization suspension assembly implemented as an integrated shape memory alloy SMA actuator assembly according to an embodiment. [Figure 44] 1 is a cross-sectional view of an optical image stabilization suspension assembly implemented as an integrated shape memory alloy SMA actuator assembly according to an embodiment. [Figure 45] 1 illustrates an optical image stabilization suspension assembly incorporating a rigid interposer circuit according to an embodiment. [Figure 46] 46 illustrates a flexible circuit of the optical image stabilization suspension assembly of FIG. 45 according to an embodiment. [Figure 47] 10A-10C illustrate the attachment of a flexible circuit to a rigid interposer circuit to form a single sensor shifting circuit according to an embodiment. [Figure 48] FIG. 1 illustrates a sensor shift circuit module according to an embodiment. [Figure 49] FIG. 49 is a cross-sectional view of the sensor-shifting circuit module of FIG. 48 according to an embodiment. [Figure 50] 1 illustrates a bonded tail region of a flexible circuit according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0008] An embodiment of the present invention includes an optical image stabilization (OIS) suspension device having a stationary or support member or plate, a moving member or plate, and one or more shape memory alloy (SMA) elements or wires extending between the stationary and moving plates. An image sensor is attached to the moving plate. Lens components, such as a lens holder and, optionally, an autofocus (AF) assembly, are attached to the stationary plate or fixedly attached to the stationary plate. The SMA wires are driven by a controller and move the moving plate and the image sensor on the moving plate relative to the stationary plate and the lens components in the X and Y axes (approximately X-Y), thereby stabilizing the position of the lens components and the image generated thereby on the image sensor. The OIS suspension can thereby compensate for vibrations that may be caused by the movement of a user's hand. These types of suspensions can be miniaturized and used, for example, with camera lenses and imaging systems integrated into cell phones, tablets, and other devices.

[0009] Embodiments of the present invention are described in the attached document entitled "Shape Memory Alloy SMA and Optical Image Stabilization OIS Sensor Shifting Components," which is incorporated herein by reference in its entirety and for all purposes. Processes and structures of the types described in the patent documents identified above in the Background section can be used in connection with these embodiments. Conventional additive and / or subtractive processes, such as wet (e.g., chemical) and dry (e.g., plasma) etching in conjunction with photolithography (e.g., using patterned and / or unpatterned photoresist masks), electroplating and electroless plating, sputtering processes, and mechanical forming methods (e.g., using punches and forms), can be used to fabricate optical image stabilization OIS suspension components in accordance with embodiments of the present invention. These types of additive and subtractive processes are known and used, for example, in connection with the manufacture of disk drive head suspensions and are generally disclosed in the following U.S. patents, all of which are incorporated herein by reference for all purposes:Patent Document 9 to Bennin et al., entitled "Head Suspension Flexure with Integrated Strain Sensor and Sputtered Traces"; Patent Document 10 to Bennin et al., entitled "Low Resistance Ground Joints for Dual Stage Actuation Disk Drive Suspensions"; Patent Document 11 to Rice et al., entitled "Integrated Lead Suspension with Multiple Trace Configurations"; Patent Document 12 to Hentges et al., entitled "Multi-Layer Ground Plane Structures for Integrated Lead Suspensions"; Patent Document 13 to Hentges et al., entitled "Multi-Layer Ground Plane Structures for Integrated Lead Suspensions"; Patent Document 14 to Swanson et al., entitled "Method for Making Noble Metal Conductive Leads for Suspension Assemblies"; Patent Document 15 to Peltoma et al., entitled "Plated Ground Features"; No. 5,629,999 to Evans et al. entitled "Head Suspension with Resonance Feedback Transducer," and U.S. Pat. No. 5,629,999 to Evans et al. entitled "Head Suspension with Resonance Feedback Transducer."

[0010] While described in connection with specific embodiments, those skilled in the art will recognize that changes can be made in form and detail without departing from the spirit and scope of the invention. In particular, although features of an embodiment are described individually or in connection with certain other features, features of the described embodiment can be combined with any or all features of other embodiments. As a non-limiting example, any or all of the described X / Y flexible circuit / connector, thermal management, and / or X / Y position feedback concepts can be incorporated into or combined with any of the sensor shift mechanism concepts.

[0011] 1 illustrates a sensor-shift camera system including an optical image stabilization suspension assembly according to an embodiment. The sensor-shift camera system includes a sensor-shift camera assembly 100 that includes a lens stack assembly 102 mounted to an autofocus AF assembly 104. The autofocus AF assembly 104 includes one or more lenses 106a-106d configured to focus an image onto an image sensor 108 using techniques including those known in the art. The autofocus AF assembly 104 is mounted to a camera housing 112.

[0012] The autofocus AF assembly 104 may be a voice coil magnet actuator (“VCM”) autofocus AF assembly or a shape memory alloy SMA actuator autofocus AF assembly. A voice coil magnet actuator VCM autofocus AF assembly uses a voice coil magnet actuator to generate motion in a direction perpendicular to the longitudinal axis of the image sensor 108, e.g., along the Z-axis 110 of the sensor-shift camera assembly 100, and moves one or more of the lenses 106 a-106 d to focus an image on the image sensor 108, using techniques including those known in the art. A shape memory alloy SMA actuator autofocus AF assembly uses a shape memory alloy SMA actuator to generate motion in a direction perpendicular to the longitudinal axis of the image sensor 108, e.g., along the Z-axis 110 of the sensor-shift camera assembly 100, and moves one or more of the lenses 106 a-106 d to focus an image on the image sensor 108, using techniques including those known in the art.

[0013] The image sensor 108 is mounted to an optical image stabilization suspension assembly 114. The optical image stabilization suspension assembly 114 is configured to move the image sensor 118 in a plane parallel to the longitudinal axis of the image sensor 120, e.g., in the X and Y directions relative to the Z axis 110 of the sensor-shift camera assembly 100. Shifting the image sensor 108 in the X and Y directions relative to the lens stack assembly 102 as a stationary lens stack assembly allows for the use of longer shape memory alloy SMA wires because the optical image stabilization suspension assembly 114 does not need to create space for the image beam. An advantage of using longer shape memory alloy SMA wires is that a longer stroke is achieved, providing the optical image stabilization suspension assembly 114 with the ability to compensate for greater movement.

[0014] According to various embodiments, the optical image stabilization suspension assembly 114 includes a stationary member 124, which may also be referred to as a stationary plate, and a moving member 122, which may also be referred to as a moving plate. The moving member 122 is configured to receive the image sensor 108. For example, the image sensor 108 is attached to the moving member 122 at a sensor mounting area on the moving member 122. For some embodiments, the sensor mounting area is located at or near the center of the moving member 122. For various embodiments, to reduce the height of the optical image stabilization suspension assembly 114, the image sensor 108 is attached to the moving member such that the image sensor 108 resides between the moving member 122 and the stationary member 124, which may reduce the overall height required for the sensor-shift camera assembly 100.

[0015] FIG. 2 shows an exploded view of an optical image stabilization suspension assembly according to embodiments. The optical image stabilization suspension assembly 214 is configured with an image sensor 208 disposed on and attached to a moving member 222. The moving member 222 includes moving member wire crimps 204a and 204b for attaching shape memory alloy SMA elements, such as shape memory alloy SMA wires 212a and 212b, to the moving member 222. The shape memory alloy SMA wires 212a and 212b are disposed between the moving member 222 and a stationary member 224. The stationary member 224 includes stationary member wire crimps 216a and 216b for attaching the shape memory alloy SMA wires 212a and 212b to the stationary member 224. The stationary member 224 also includes one or more slide bearings 210a-210d according to some embodiments. Any number of slide bearings 210a-210d may be used. Some embodiments include three slide bearings 210a-210d. The slide bearings 210a-210d may be made from a low-friction material to allow relative sliding between the moving member 222 and the stationary member 224. In some embodiments, the slide bearings 210a-210d are ball bearings with features formed on the stationary member 224 to accommodate the ball bearings.

[0016] For various embodiments, either the moving member wire crimps 204a, 204b or the stationary member wire crimps 216a, 216b can be offset from the respective moving member 222 and stationary member 224 to position the shape memory alloy SMA wires 212a, 212b at different heights between the stationary member 224 and the moving member 222 so that the shape memory alloy SMA wires 212a, 212b do not contact each other. For another embodiment, a centering spring is used to counteract the tension of the shape memory alloy SMA wires 212a, 212b and is configured to press the moving member 222 onto the slide bearings 210a-210d. Figure 3 is a perspective view of the optical image stabilization suspension assembly shown in Figure 2. When the shape memory alloy SMA wires 212a, 212b are actuated (activated) using techniques including those known in the art, movement of the moving member 222 in the X-axis and Y-axis directions occurs. In some embodiments, different powers can be supplied to each shape memory alloy SMA wire 212a, 212b to move the moving member 222 in the X-axis and Y-axis directions.

[0017] 4 is an exploded view of an optical image stabilization suspension assembly including a centering spring according to an embodiment. The optical image stabilization suspension assembly is configured with an image sensor 408 disposed on and attached to a moving member 422. The moving member 422 includes moving member wire crimps 404a and 404b for attaching shape memory alloy SMA wires 412a and 412b to the moving member 422. The shape memory alloy SMA wires 412a and 412b are disposed between the moving member 422 and a stationary member 424. The stationary member 424 includes stationary member wire crimps 416a and 416b for attaching the shape memory alloy SMA wires 412a and 412b to the stationary member 424. The stationary member 424 also includes one or more slide bearings 410a-410d as described herein, according to some embodiments. For various embodiments, either the moving member wire crimps 404a, 404b and the stationary member wire crimps 416a, 416b can be offset from the respective moving member 422 and stationary member 424 to place the shape memory alloy SMA wires 412a, 412b at different heights between the stationary member 224 and the moving member 422, as described herein.

[0018] The moving member 422 includes centering springs (430a, 430b), such as a first centering spring 430a and a second centering spring 430b. Another embodiment includes a moving member 422 including four centering springs. The stationary member 424 includes centering springs (432a, 432b), such as a first centering spring 432a and a second centering spring 432b. Another embodiment includes a stationary member 424 including four centering springs. The first and second centering springs 430a, 430b and the first and second centering springs 432a, 432b are used to act against the tensile force of the shape memory alloy SMA wires 412a, 412b and are configured to press the moving member 422 onto the slide bearings 410a-410d. FIG. 5 is a perspective view of the optical image stabilization suspension assembly shown in FIG. 4. When the shape memory alloy SMA wires 412a, 412b are actuated (activated) using techniques including those known in the art, movement of the moving member 422 in the X and Y axes occurs.

[0019] FIG. 6 illustrates a centering spring of an optical image stabilization suspension assembly, according to embodiments. The centering spring 602 includes a first formed spring arm 604a aligned with a first direction of movement of the member, such as the X-axis. The centering spring 602 further includes a second formed spring arm 604b aligned with a second direction of movement of the member, such as the Y-axis. According to various embodiments, the first formed spring arm 604a and the second formed spring arm 604b are 90-degree formed spring arms such that the longitudinal axis of the first formed spring arm 604a and the second formed spring arm 604b form a 90-degree angle. The spring arms are integrally formed with either the moving member or the stationary member and are formed from the same material. Forming the first formed spring arm 604a and the second formed spring arm 604b as 90-degree formed spring arms helps reduce spring stiffness. The first shaped spring arm 604a and the second shaped spring arm 604b are coupled to each other via an unformed corner 608. The unformed corner 608 is configured to provide clearance for the shape memory alloy (SMA) wire attached to the wire crimp. The centering spring 602 further includes a spring foot 606. The spring foot 606 is configured to be attached to an adjacent member. For example, the spring foot 606 of the shaped spring arm of the moving member is attached to the stationary member. The spring foot 606 of the shaped spring of the stationary member is attached to the moving member.

[0020] 7 is an exploded view of an optical image stabilization suspension assembly including four shape memory alloy SMA wires according to an embodiment. The optical image stabilization suspension assembly is configured with an image sensor 708 disposed on and attached to a moving member 722. The moving member 722 includes moving member wire crimps 704a-704d for attaching shape memory alloy SMA wires 712a-712d to the moving member 722. The shape memory alloy SMA wires 712a-712d are disposed between the moving member 722 and a stationary member 724. The stationary member 724 includes stationary member wire crimps 716a-716d for attaching the shape memory alloy SMA wires 712a-712d to the stationary member 724. The shape memory alloy SMA wires 712a-712d are oriented crosswise but offset from one another, with wire crimps configured to be provided at each corner of the moving member 722 and the stationary member 724. Two parallel shape memory alloy SMA wires running from the first corner to the second corner of the optical image stabilization suspension assembly are attached to their respective crimps, one to the stationary crimp and the other to the moving crimp. Each wire of the pair is configured to provide opposing movement when activated. This eliminates the need to rely on a centering spring to return the optical image stabilization suspension assembly to a center position. The shape memory alloy SMA wires 712a-712d are configured to pull relative to one another. Since the bias in tension force will cause movement, when it is desired to return the optical image stabilization suspension assembly to the center, the activation bias of the shape memory alloy SMA wires 712a-712d is changed to the inverse of the other. The stationary member 724 according to some embodiments also includes one or more slide bearings 710a-710d as described herein.For various embodiments, any of the moving member wire crimps 704a-704d and stationary member wire crimps 716a-716d can be offset from the respective moving member 722 and stationary member 724 to position the shape memory alloy SMA wires 712a-712d at different heights between the stationary member 724 and the moving member 722, as described herein. Figure 8 is a perspective view of the optical image stabilization suspension assembly illustrated in Figure 7. When the shape memory alloy SMA wires 712a-712d are activated using techniques including those known in the art, movement of the moving member 722 in the X-axis and Y-axis directions occurs.

[0021] 9 is an exploded view of an optical image stabilization suspension assembly including a looped shape memory alloy SMA wire, according to embodiments. The optical image stabilization suspension assembly is configured with an image sensor 908 disposed on and attached to a moving member 922. The moving member 922 includes moving member wire crimps 904a and 904b for attaching shape memory alloy SMA wires 912a and 912b to the moving member 922. The shape memory alloy SMA wires 912a and 912b are disposed between the moving member 922 and a stationary member 924. The stationary member 924 includes stationary member wire crimps 916a and 916b for attaching the shape memory alloy SMA wires 912a and 912b to the stationary member 924. According to some embodiments, the stationary member 924 also includes one or more slide bearings 910a-910d as described herein. According to various embodiments, each slide bearing 910a-910d is configured with a pulley feature. In some embodiments, the pulley feature is separate from one or more of the slide bearings 910a-910d. The pulley feature is configured to allow one or more shape memory alloy SMA wires 912a, 912b, also referred to herein as pin features, wrapped around or engaged with the pulley feature to slide freely around the pulley feature. The pulley features can be arranged in any configuration to generate motion in the moving member 922 as a moving plate. Pulley features separate from the slide bearings can be attached to the member using adhesives, welding, and other techniques known in the art.

[0022] For various embodiments, any of the moving member wire crimps 904a, 904b and the stationary member wire crimps 916a, 916b can be offset from the respective moving member 922 and stationary member 924 to allow for positioning of the shape memory alloy SMA wires 912a, 912b at different heights between the stationary member 924 and the moving member 922, as described herein. Other embodiments are configured using centering springs as described herein. Various embodiments may further include four shape memory alloy SMA wires and eight wire crimps as described herein. FIG. 10 is a perspective view of the optical image stabilization suspension assembly illustrated in FIG. 9. When the shape memory alloy SMA wires 912a, 912b are activated using techniques including those known in the art, movement of the moving member 922 in the X-axis and Y-axis directions occurs.

[0023] Portions "11a" and "11b" of FIG. 11 illustrate looped shape memory alloy SMA wire configurations for optical image stabilization suspension assemblies according to some embodiments. The four pulley features 1102a-1102d in portion "11a" of FIG. 11 each have two shape memory alloy SMA wires (1112a, 1112b). A first end of the first shape memory alloy SMA wire 1112a is attached to a first wire crimp 1116a on the stationary member, also referred to as a stationary crimp. The first shape memory alloy SMA wire 1112a is wrapped around the first pulley feature 1102a on the stationary member and the second pulley feature 1102b on the stationary member (each also referred to as a stationary pulley feature). A second end of the first shape memory alloy SMA wire 1112a is attached to a second wire crimp 1116b on the moving member, also referred to as a moving crimp. This configuration results in a pulling motion when the first shape memory alloy SMA wire 1112a is activated using techniques known in the art, including applying voltage, current, or heat to the shape memory alloy SMA wire.

[0024] A first end of the second shape memory alloy SMA wire 1112b is attached to a second wire crimp 1116c on the stationary member, also referred to as a stationary crimp. The second shape memory alloy SMA wire 1112b is wrapped around a third pulley feature 1102c (also referred to as a stationary pulley feature) on the stationary member and a fourth pulley feature 1102d (also referred to as a moving pulley feature) on the moving member. A second end of the second shape memory alloy SMA wire 1112b is attached to a second wire crimp 1116d on the moving member, also referred to as a moving crimp. This configuration provides a pushing action when the second shape memory alloy SMA wire 1112b is activated using techniques known in the art, including applying voltage, current, or heat to the shape memory alloy SMA wire.

[0025] Portion "11b" of FIG. 11 illustrates two pulley features (1104a, 1104b) with two shape memory alloy SMA wires (1114a, 1114b). A first end of the first shape memory alloy SMA wire 1114a is attached to a first wire crimp 1118a, also referred to as a stationary crimp, on the stationary member. The first shape memory alloy SMA wire 1114a is wrapped around the first pulley feature 1104a (also referred to as a stationary pulley feature) on the stationary member. A second end of the first shape memory alloy SMA wire 1114a is attached to a second wire crimp 1118b, also referred to as a moving crimp, on the moving member. This configuration provides a pushing action when the first shape memory alloy SMA wire 1114a is activated using techniques known in the art, including applying voltage, current, or heat to the shape memory alloy SMA wire.

[0026] A first end of the second shape memory alloy SMA wire 1114b is attached to a second wire crimp 1118c on the stationary member, also referred to as a stationary crimp. The second shape memory alloy SMA wire 1114b is wrapped around a second pulley feature 1104b (also referred to as a moving pulley feature) on the moving member. A second end of the second shape memory alloy SMA wire 1114b is attached to a second wire crimp 1118d on the moving member, also referred to as a moving crimp. This configuration results in a pulling motion when the second shape memory alloy SMA wire 1114b is activated using techniques known in the art, including applying voltage, current, or heat to the shape memory alloy SMA wire.

[0027] One or more of the shape memory alloy SMA wire and pulley feature configurations illustrated in portions "11a" and "11b" of Figure 11 are enabled using optical image stabilization suspension assemblies according to some embodiments to move a moving member in directions along longitudinal and latitudinal axes, e.g., the X and Y axes. Thus, an image sensor attached to the moving member can be moved to counteract any external forces resulting from movement of a camera system equipped with the optical image stabilization suspension assembly.

[0028] 12 is a diagram illustrating a cross section of an optical image stabilization suspension assembly according to embodiments. The optical image stabilization suspension assembly is configured with an image sensor disposed on and attached to a moving member 1222. The moving member 1222 includes first and second moving member wire crimps 1204a and 1204b for attaching shape memory alloy SMA wires 1212a and 1212b to the moving member 1222. The shape memory alloy SMA wires 1212a and 1212b are disposed between the moving member 1222 and a stationary member 1224. The stationary member 1224 includes first and second stationary member wire crimps 1216a and 1216b for attaching the shape memory alloy SMA wires 1212a and 1212b to the stationary member 1224. According to some embodiments, the stationary member 1224 also includes one or more slide bearings 1210, as described herein. Any number of slide bearings 1210 may be used and any configuration is possible.

[0029] As described herein, one or more of the first and second moving member wire crimps 1204a, 1204b and the first and second stationary member wire crimps 1216a, 1216b can be offset from either or both of the respective moving member 1222 and stationary member 1224 to position the shape memory alloy SMA wires 1212a, 1212b at different heights or Z-axis offsets between the stationary member 1224 and the moving member 1222 so that the shape memory alloy SMA wires 1212a, 1212b do not contact each other. As shown in cross section in Figure 12, the first moving member wire crimp 1204a on the moving member 1222 is offset from the second moving member wire crimp 1204b on the moving member 1222 so as to have an offset in the direction of an axis perpendicular to the plane 1230 of the moving member 1222, e.g., the Z-axis. The offset of the first and second moving member wire crimps 1204a, 1204b results in a wire offset 1240 of the shape memory alloy SMA wires 1212a, 1212b, which can be used to prevent the shape memory alloy SMA wires 1212a, 1212b from interfering with each other during activation (actuation) of one or both of the shape memory alloy SMA wires 1212a, 1212b.

[0030] 13 illustrates an optical image stabilization suspension assembly implemented as a square wire sensor assembly according to an embodiment. The optical image stabilization suspension assembly is configured with an image sensor 1308 disposed on and attached to a moving member 1322. The moving member 1322 includes moving member wire crimps 1304a-1304d for attaching shape memory alloy SMA wires 1312a-1312d to the moving member 1322. The shape memory alloy SMA wires 1312a-1312d are disposed between the moving member 1322 and a stationary member 1324. The stationary member 1324 includes stationary member wire crimps 1316a-1316d for attaching the shape memory alloy SMA wires 1312a-1312d to the stationary member 1324. According to some embodiments, the stationary member 1324 further includes one or more slide bearings 1310a-1310c. Any number of slide bearings 1310a-1310c may be used. Some embodiments include three slide bearings 1310a-1310c. The slide bearings 1310a-1310c can be made from a low-friction material to better allow for relative sliding between the moving member 1322 and the stationary member (slide member) 1324. In some embodiments, the slide bearings 1310a-1310c are ball bearings with features formed on the stationary member 1324 to accommodate the ball bearings.

[0031] According to various embodiments, the square wire sensor assembly is configured with four shape memory alloy SMA wires 1312a-1312d attached to the periphery of the square wire sensor assembly. The four shape memory alloy SMA wires 1312a-1312d pull each other to return the moving member 1322 to a center position. The periphery-attached shape memory alloy SMA wires 1312a-1312d allow the moving member 1322 to be positioned closer to the stationary member 1324 than optical image stabilization suspension assemblies that have shape memory alloy SMA wires between the moving member and the stationary member. Therefore, a thinner camera profile can be achieved. Furthermore, in some embodiments, the center portion 1342 of the moving member 1322 is configured to fit within a void 1344 (e.g., a recess or pocket in the moving member), also referred to as Z-height space, within the stationary member 1324. Some embodiments of the square wire sensor assembly may include an optional base member 1340. In such an embodiment, the central portion 1342 may be configured to fit within a void 1346 formed in the base member 1340 .

[0032] The square wire sensor assembly according to some embodiments optionally includes spring arms 1348a and 1348b. The spring arms 1348a and 1348b are formed on the moving member 1322 and are configured to assist in centering the moving member 1322 and to hold the moving member 1322 relative to the slide bearings 1310a-1310c. For example, the spring arms 1348a and 1348b are configured to assist in moving the moving member to a center position of the square wire sensor assembly when the shape memory alloy SMA wires 1312a-1312d are not activated. For one embodiment, the spring arms 1348a and 1348b include arc-shaped portions and are configured to extend between the moving member 1322 and the stationary member 1324.

[0033] Figure 14 shows a perspective view of the optical image stabilization suspension assembly illustrated in Figure 13. When the shape memory alloy SMA wires 1312a-1312d are activated using techniques including those known in the art, movement of the moving member 1322 in the X-axis and Y-axis directions occurs. In some embodiments, different power is supplied to each parallel pair of shape memory alloy SMA wires 1312a-1312d to move the moving member 1322 in the X-axis and Y-axis directions.

[0034] 15 illustrates an optical image stabilization suspension assembly implemented as an arcuate sensor assembly, according to an embodiment. The optical image stabilization suspension assembly is configured with an image sensor 1508 disposed on and attached to a moving member 1522. The moving member 1522 includes pin features 1504a-1504d, also referred to herein as pulley features, disposed at outer corners of the moving member 1522. The pin features 1504a-1504d are configured such that at least one of four shape memory alloy SMA wires 1512a-1512d is wound around the pin features 1504a-1504d. The shape memory alloy SMA wires 1512a-1512d are disposed around the outer circumference of a stationary member 1524. The stationary member 1524 includes eight wire crimps 1516a-1516h for attaching the four shape memory alloy SMA wires 1512a-1512d between the wire crimps 1516a-1516h. Some embodiments of the stationary member 1524 further include one or more slide bearings 1510a-1510d. Any number of slide bearings 1510a-1510d may be used. Some embodiments include three slide bearings 1510a-1510d. The slide bearings 1510a-1510c can be made from a low-friction material to better enable relative sliding between the moving member 1522 and the stationary member (slide member) 1524. In some embodiments, the slide bearings 1510a-1510d are ball bearings with features formed on the stationary member 1524 to accommodate the ball bearings.

[0035] According to various embodiments, the arc-shaped sensor assembly is configured with four shape memory alloy SMA wires 1512a-1512d attached to the periphery of the arc-shaped sensor assembly. The four shape memory alloy SMA wires 1512a-1512d pull each other to return the moving member 1522 to a center position. By attaching the shape memory alloy SMA wires 1512a-1512d to the periphery, the moving member 1522 can be positioned closer to the stationary member 1524 than in optical image stabilization suspension assemblies that have shape memory alloy SMA wires between the moving member and the stationary member. Therefore, a thinner camera profile can be achieved.

[0036] FIG. 16 shows a perspective view of the arcuate sensor assembly illustrated in FIG. 15. When the shape memory alloy SMA wires 1512a-1512d are activated using techniques including those known in the art, movement of the moving member 1522 in the X-axis and Y-axis directions occurs. According to some embodiments, when the shape memory alloy SMA wires 1512a-1512d are activated and contract, they apply a normal force to the pin features around which they are wrapped. Varying amounts of applied force between the four shape memory alloy SMA wires 1512a-1512d acting on the respective pin features 1504a-1504d around which they are wrapped are used to move the moving member 1522 in the X-axis and Y-axis directions. By wrapping the shape memory alloy SMA wires 1512a-1512d around their respective pin features 1504a-1504d, the length of the shape memory alloy SMA wires 1512a-1512d increases and the stroke increases. Because the stroke increases by the shape memory alloy SMA wires 1512a-1512d shortening in length when the wires are activated, the moving plate will move an increased amount of distance.

[0037] FIG. 17 illustrates an optical image stabilization suspension assembly implemented as a bimetallic actuator according to an embodiment. The optical image stabilization suspension assembly is configured with an image sensor disposed on and attached to a moving member 1722. The moving member 1722 includes spring arms 1704a-1704d disposed on the exterior of the moving member 1722. According to various embodiments, the spring arms 1704a-1704d are coupled to the moving member 1722 via respective struts 1706a-1706d. A shape memory alloy (SMA) element, such as shape memory alloy (SMA) material 1708a-1708d, is applied to each of the spring arms 1704a-1704d. The shape memory alloy (SMA) material 1708a-1708d is attached to the spring arms 1704a-1704d using adhesives, solder, laser welding, resistance welding, and other techniques known in the art. For some embodiments including spring arms 1704a-1704d formed of a conductive material such as stainless steel, shape memory alloy SMA material 1708a-1708d is disposed on an insulating layer formed on the spring arms 1704a-1704d using techniques including those known in the art. For other embodiments, the shape memory alloy SMA material is electrically and structurally attached to the spring arms only at the ends of the shape memory alloy SMA material, while the central region of the shape memory alloy SMA material is allowed to be free from the spring arms. The free central region allows the shape memory alloy SMA material to be pulled straight during actuation, while the spring arms bend in an arc. The spring arms can include an electrical circuit for driving power through the shape memory alloy SMA material for actuation, also known as activation.

[0038] The shape memory alloy SMA material 1708a-1708d can be applied to either side of the spring arms 1704a-1704d, i.e., to the side of the spring arms 1704a-1704d facing the moving member 1722 or to the side of the spring arms 1704a-1704d facing away from the moving member 1722. In some embodiments, the shape memory alloy SMA material 1708a-1708d is applied to both sides of the spring arms 1704a-1704d.

[0039] The shape memory alloy SMA materials 1708a-1708d bend the spring arms 1704a-1704d when heated to cause movement of the moving member 1722 in the X-axis and Y-axis directions. A controller can be used to apply regulated power to the shape memory alloy so that one or more spring arms 1704a-1704d provide full movement of the moving member 1722 in the X-axis and Y-axis directions. Figure 18 shows an exemplary behavior of the shape memory alloy SMA material as it is heated and passes from a cold state to a hot state and then back to the cold state using techniques known in the art. For example, the shape memory alloy SMA materials 1708a-1708d can be heated with an electric current.

[0040] The spring arms 1704a-d further include static feet 1710a-d configured to be attached to a static member such that when the shape memory alloy SMA material 1708a-d is activated, the moving member 1722 moves relative to the static member.

[0041] FIG. 19 illustrates an optical image stabilization suspension assembly implemented as a bimetallic actuator, according to an embodiment. Similar to the bimetallic actuator described with reference to FIG. 17, the bimetallic actuator includes four spring arms formed at 90 degrees to each other. This provides high stiffness along the Z-axis, which is perpendicular to the moving member 1922, while reducing stiffness due to low resistance to movement along the X- and Y-axes. For various embodiments, the spring arms are formed wide. This wide spring arm allows for more traces to be formed on the spring arms. In some embodiments, each spring arm includes eight traces and eight electrostatic pads at the end of each spring arm for a total of 32 traces. However, any number of traces and electrical pads may be formed on the traces of the spring arms. In some embodiments, the traces are routed toward the center of the moving member 1922 to connect to the image sensor. FIG. 19 illustrates a continuously formed 90-degree section of a spring arm. Other embodiments include spring arms formed with multiple 90-degree formed sections separated by unformed sections along the working length of the spring arm. Figure 20 illustrates a bimetallic actuator according to an embodiment in a flat, pre-formed state. The bimetallic actuator is similar to the bimetallic actuator described with reference to Figures 17 and 19. The final form of the bimetallic actuator is formed from the flat state to form the bimetallic actuator illustrated in Figures 17 and 19.

[0042] FIG. 21 illustrates a half-barrel roll interposer for an optical image stabilization suspension assembly, according to embodiments. The half-barrel roll interposer, according to some embodiments, is integrated with a moving member such as those described herein. For other embodiments, the half-barrel roll interposer is a separate component from the moving member and is configured to be attached to the moving member. Each half-barrel roll interposer includes one or more flexible circuits protruding from the side and having multiple traces bent 180 degrees. The 180-degree bend allows the moving member to flex along the X and Y axes. In some embodiments, the 180-degree bend form lines may be at a 45-degree angle relative to the X and Y axes. This may provide low and uniform resistance for movement in both the X and Y axes. The circuit traces of the flexible circuits are connected to pads located around the image sensor located on the half-barrel roll interposer. The flexible circuit is configured to roll and twist during movement in the X and Y axes. The flexible circuit includes pads for connecting to stationary circuitry underlying the half barrel roll interposer. Additionally, shape memory alloy SMA wires and spring arms as described herein can be incorporated into the half barrel roll interposer. Figure 22 shows a half barrel roll interposer in a flat state before being formed into the final half barrel roll interposer illustrated in Figure 21.

[0043] FIG. 23 illustrates an interposer with a 45-degree bend for an optical image stabilization suspension assembly, according to embodiments. The interposer includes four flexible circuits as described herein protruding from one side. The flexible circuits are formed with contours at 45 degrees to the X and Y axes within the plane of the moving member. For some embodiments, the flexible circuits have reduced thickness in the bend region to further reduce stiffness in the X and Y axes to provide easy movement in the X and Y axes directions. FIG. 24 illustrates an interposer with a 45-degree bend for an optical image stabilization suspension assembly, according to embodiments, having flexible circuits as described herein protruding from four sides of the interposer. The interposer can be configured with flexible circuits protruding from one to four sides of the interposer. FIG. 25 shows an interposer in a flat state before being formed into the final state of the interposer as shown in FIG. 24, with flexible circuits protruding from four sides of the interposer.

[0044] FIG. 26 illustrates a bottom view of a moving member including a heat sink feature for an optical image stabilization suspension assembly, according to embodiments. The heat sink feature 2502 is located below the area where the image sensor 2508 is attached to the moving member 2522 and is configured to aid in the removal of heat from the area around the image sensor 2508. The heat sink feature 2502 can be created by metal etching or stamping grooves of various designs. The heat sink feature can also include a separate highly conductive material attached to the bottom surface of the moving member with a conductive adhesive or solder. The highly conductive plated metal can be on the top and / or bottom side of the moving member where the image sensor is attached. In some embodiments, vias can be formed in the moving member to allow the highly conductive plated metal to more efficiently conduct heat from the top surface to the heat sink feature on the bottom surface. FIG. 27 illustrates a bottom cross-sectional view of a moving member including a heat sink feature for an optical image stabilization suspension assembly, according to embodiments. 28 shows a cross-sectional view from above of a moving member including a heat sink feature and conductive plating 2510 of an optical image stabilization suspension assembly according to an embodiment. The conductive plating 2510 can be gold, nickel, copper, or other material that aids in the conduction of heat from the image sensor 2508. In addition to the heat sink feature, according to some embodiments, the moving member 2522 includes vias formed therein to allow the conductive plating 2510 to more efficiently conduct heat from the top side to the heat sink feature 2502 below.

[0045] 29 illustrates a moving member of an optical image stabilization suspension assembly according to an embodiment including vias and conductive plating. Vias 2802 are formed in the base metal of a moving member 2822 of the optical image stabilization suspension assembly to create a thermal path away from the image sensor 2808. In some embodiments, the vias 2802 are formed below the location of the image sensor 2808. Conductive plating 2810 is disposed on the top and bottom sides of the moving member 2822 and within the vias 2802 to create a thermal path away from the image sensor 2808.

[0046] 30 illustrates an optical image stabilization suspension assembly according to an embodiment, the optical image stabilization suspension assembly including one or more Hall sensors. The optical image stabilization suspension assembly includes a moving member 2922 and a stationary member 2924 configured to move an image sensor 2908 using techniques including those described herein. The optical image stabilization suspension assembly further includes one or more Hall sensors 2904 disposed on the moving member 2922. One or more magnets 2906 are disposed on the stationary member 2924 near the respective Hall sensors 2904. In some embodiments, the Hall sensors 2904 are disposed on the moving member 2922 near magnets used in the autofocus (AF) assembly. Other embodiments include one or more Hall sensors attached to the stationary member 2924 and one or more magnets attached to the moving member 2922. The position of the moving member 2922 relative to the stationary member 2924 is determined by sensing changes in the strength of a magnetic field generated by the one or more magnets 2906 using the one or more Hall sensors 2904, using techniques including those known in the art.

[0047] FIG. 31 illustrates an exploded view of an optical image stabilization suspension assembly according to an embodiment, including one or more capacitance probes as motion sensors. The optical image stabilization suspension assembly includes a moving member 3022 and a stationary member 3024 configured to move an image sensor 3008 using techniques, including those described herein. The optical image stabilization suspension assembly also includes one or more capacitance probes. The capacitance probe has a first portion 3004 formed on the moving member 3022 and a second portion 3006 formed on the stationary member 3024. The first portion 3004 and second portion 3006 of the capacitance probe are formed of a conductive material, such as copper, and are gold-plated. The first portion 3004 and second portion 3006 can be circular, rectangular, or triangular in shape. The shape can be such that the amount of change in capacitance seen when the moving member 3022 moves in one direction is greater than the amount of change in capacitance seen in the other direction. That is, one capacitance probe can be designed to sense only movement along the X-axis, while the other capacitance probe can be designed to sense movement along the Y-axis. Movement is determined by creating a change in the overlap area between the first portion 3004 and the second portion 3006. For example, more capacitance means that the moving member 3022 has moved in one direction relative to the stationary member 3024. As illustrated in FIG. 32, less capacitance means that the moving member 3022 has moved in the opposite direction relative to the stationary member 3024. As shown in FIG. 33, when the overlap area of ​​the first portion 3004 and the second portion 3006 is the same for each capacitance probe, the capacitance is approximately the same, indicating its nominal or center position of the optical image stabilization suspension assembly.

[0048] According to an embodiment, electrical leads or traces are connected to the first and second portions 3004, 3006 of the capacitance probe using flexible circuits or connectors. The distance between the moving member 3022 and the stationary member 3024 can be adjusted for a desired nominal capacitance value. Reducing the distance between the two plates of the capacitance probe results in higher capacitance, and this distance is held constant as the moving member 3022 moves in the X and Y axes.

[0049] FIG. 34 illustrates an optical image stabilization (OIS) suspension assembly according to an embodiment, including strain gauges as motion sensors. The OIS suspension assembly includes a moving member 3322 including spring arms according to embodiments described herein, configured to move an image sensor using techniques including those described herein. The OIS suspension assembly includes one or more strain gauge sensors 3304 attached to one or more of the spring arms. In some embodiments, the strain gauge sensors 3304 are attached to high-stress areas of the spring arms. As the moving member 3322 moves, the spring arms experience strain that can be measured by strain gauges attached to or built on the spring arms. By reading various amounts of strain from the gauges, a complete X / Y position can be determined, for example, using a controller with an algorithm. Such strain gauge sensors 3304 include those similar to and manufactured by processes such as those described in U.S. Patent No. 6,299,497 to Bennin et al. and U.S. Patent No. 6,299,497 to Evans et al.

[0050] Another embodiment of the motion sensor includes a feedback position sensor that uses a lens fiducial with an image controller tracking algorithm. According to some embodiments, the lens is stationary in the X-axis and Y-axis directions. A mark or fiducial is formed on one of the lenses of the camera system that is visible by the image sensor. For example, the fiducial can be on the far end of the lens, and therefore on the far end of the image circle on the image sensor, and on a region of the image cropped from the stored image. Another example includes having a fiducial on a structure in the camera system other than on the lens that is within the sensing range of the image sensor. The camera controller is configured to track the position of one or more fiducials to determine which pixel of the sensor it is used for. The position of the one or more fiducials is fed back to the optical image stabilization suspension assembly via the controller to move the assembly to perform position correction.

[0051] FIG. 35 is an exploded view of an optical image stabilization suspension assembly implemented as a bimetallic actuator, according to an embodiment. Such a bimetallic actuator is an integrated shape memory alloy SMA bimorph X / Y actuator with a sensor shift trace as a motion sensor. As shown in FIG. 35, the integrated shape memory alloy SMA bimorph X / Y actuator includes two shape memory alloy SMA actuators 3502, one at each corner of the integrated shape memory alloy SMA bimorph X / Y actuator 3504. The integrated shape memory alloy SMA bimorph X / Y actuator 3504 is configured to rest on one or more slide bearings 3510 on a base member 3524. Any number of slide bearings 3510 may be used. Some embodiments include three slide bearings 3510. The slide bearings 3510 can be made of a low-friction material to better enable relative sliding between the integrated shape memory alloy SMA bimorph X / Y actuator 3504 and the base member 3524. In some embodiments, the slide bearing 3510 is a ball bearing with features formed on the base member 3524 to accommodate the ball bearing. Figure 36 is a perspective view of the optical image stabilization suspension assembly implemented as a bimetallic actuator illustrated in Figure 35.

[0052] Figure 37 shows a cross-section of a bimetallic actuator according to an embodiment including an integrated shape memory alloy SMA bimorph X / Y actuator 3504 as a bimorph actuator on an inner rail, flexible trace routing 3506 on an outer rail, and a motion sensor as described herein. The trace routing 3506 is configured to transmit an electrical signal to a component that provides an activation signal to the integrated shape memory alloy SMA bimorph X / Y actuator 3504. The pair of integrated shape memory alloy SMA bimorph X / Y actuators 3504 at each corner of the integrated shape memory alloy SMA bimorph X / Y actuator 3504 is formed using shape memory alloy SMA material and, when activated using techniques described herein, creates a moving portion 3602 as shown in Figure 38. Figure 38 is a top view of a bimetallic actuator according to an embodiment including a moving portion 3602 and a fixed portion 3604. The fixed portion 3604 is attached to the base member 3524 by techniques including, but not limited to, adhesives and solder. In this manner, the moving portion 3602 is configured to be movable in the X-axis and Y-axis directions relative to the fixed portion 3604 and the base member 3524. Furthermore, a motion sensor as described herein is also incorporated into the integrated shape memory alloy SMA bimorph X / Y actuator 3504. Figure 39 shows a layout pattern for forming the integrated shape memory alloy SMA bimorph X / Y actuator by using etching and deposition techniques comprising those known in the art.

[0053] 40 is an exploded view of an optical image stabilization suspension assembly implemented as an integrated shape memory alloy SMA actuator assembly according to embodiments. The integrated shape memory alloy SMA actuator assembly includes wire crimps, traces, and sensors integrated into a shape memory alloy SMA actuator member 4022 using techniques described herein. The optical image stabilization suspension assembly is configured with an image sensor disposed on and attached to the shape memory alloy SMA actuator member 4022. The shape memory alloy SMA actuator member 4022 includes wire crimps 4004 for attaching four shape memory alloy SMA wires 4012 to the shape memory alloy SMA actuator member 4022 using techniques including those described herein. According to some embodiments, the wire crimps 4004 are configured as one or more crimp subassemblies, each including a static crimp and a moving crimp. The shape memory alloy SMA actuator member 4022 is configured to be attached to a base member 4024. The base member 4024, according to some embodiments, also includes one or more slide bearings 4010 as described herein. Any number of slide bearings 4010 may be used, and any configuration may be possible.

[0054] FIG. 41 is a perspective view of an optical image stabilization suspension assembly implemented as an integrated shape memory alloy SMA actuator assembly, as shown in FIG. 40. The shape memory alloy SMA actuator member 4022 includes trace termination pads on opposing sides of the shape memory alloy SMA actuator member 4022 to provide electrical signals through traces on the member. FIG. 42 is a perspective view of an optical image stabilization suspension assembly implemented as an integrated shape memory alloy SMA actuator assembly, according to embodiments. The shape memory alloy SMA actuator includes trace rails 4220 formed on spring arms configured to center the shape memory alloy SMA actuator using techniques including those described herein. According to some embodiments, the trace rails 4220 include 16 traces on each of two spring arms. FIG. 43 shows a side view of an optical image stabilization suspension assembly implemented as an integrated shape memory alloy SMA actuator assembly, according to embodiments. According to some embodiments, the trace rails 4220 are formed at a 90-degree angle to reduce stiffness in the X-axis and Y-axis directions. 44 is a cross-sectional view of an optical image stabilization suspension assembly implemented as an integrated shape memory alloy SMA actuator assembly according to an embodiment. The integrated shape memory alloy SMA actuator includes a moving portion 4006 and a fixed portion 4008. The fixed portion 4008 is attached to a base member 4024. The fixed portion 4008 is attached to the base member 4024 by techniques including, but not limited to, adhesives and soldering. In this manner, the moving portion 4006 is configured to be movable in the X-axis and Y-axis directions relative to the fixed portion 4008 and the base member 4024. Additionally, a motion sensor as described herein is also integrated into the integrated actuator.

[0055] FIG. 45 illustrates an optical image stabilization suspension assembly incorporating a rigid interposer circuit, according to embodiments. The optical image stabilization suspension assembly is configured with an image sensor 4508 disposed on and attached to a rigid interposer circuit 4522 at a sensor mounting area. The rigid interposer circuit 4522 is an electrical interface configured to route signals between the image sensor 4508 and multiple flexible circuits 4548a-d. The rigid interposer circuit 4522 is configured to redistribute signals, such as input / output (I / O) signals and power signals, to the image sensor 4508. According to some embodiments, one or more of the flexible circuits are independent of the other flexible circuits 4548a-d and include different contacts and / or signal traces than the other flexible circuits 4548a-d. For some embodiments, four separate and independent flexible circuits 4548a-4548d are used in conjunction with a rigid interposer circuit 4522, with each flexible circuit 4548a-4548d having a unique set of contacts and / or signal traces.

[0056] The image sensor 4508 is mounted on a sensor mounting area of ​​a rigid interposer circuit 4522. The rigid interposer circuit 4522 is attached to a plurality of flexible circuits 4548a-4548d. The flexible circuits 4548a-4548d are configured to have low stiffness to allow movement of the rigid interposer circuit 4522. The flexible circuits 4548a-4548d are configured to be electrically coupled to a stationary printed circuit board (PCB). For some embodiments, the rigid interposer circuit 4522 and the flexible circuits 4548a-4548d are electrically coupled via contact pads and solder using techniques including those known in the art. The rigid interposer circuit 4522 is configured to electrically couple the image sensor 4508 to the stationary printed circuit board PCB through conductive traces.

[0057] 46 illustrates a flexible circuit 4548a according to some embodiments. The flexible circuit 4548a according to some embodiments is manufactured to be flat and shaped for subsequent attachment to the rigid interposer circuit 4522. This can reduce manufacturing costs as well as shipping and handling costs. In some embodiments, the flexible circuit 4548a is configured to have low stiffness to allow movement of the rigid interposer circuit 4522 in the X and Y axes.

[0058] FIG. 47 illustrates flexible circuits 4548a-4548d aligned along path 60 for attachment to a rigid interposer circuit 4522 to form a single sensor-shifting circuit 4550, according to one embodiment. FIG. 48 illustrates a sensor-shifting circuit module 4800 according to one embodiment of the present disclosure. FIG. 49 is a cross-sectional view of the sensor-shifting circuit module 4800. The sensor-shifting circuit module 4800, according to some embodiments, includes an outer housing 4820, an inner housing 4840, and an image sensor 4508 mounted to a rigid interposer circuit 5022. The rigid interposer circuit 5022 includes one or more circuits 4810 disposed on a surface of the rigid interposer circuit 5022. The image sensor 4508 may be electrically coupled to the one or more circuits 4810 using gold ball wirebonds 4801 or other known wirebonding techniques. The one or more circuits 4810 located on the same side as the image sensor 4508 allow the image sensor 4508 to be electrically coupled to the flexible circuits 5048a-5048d via the one or more circuits 4810 on the same side of the rigid interposer circuit 5022 to which the image sensor 4508 is attached. This eliminates the need for blind vias, which require additional manufacturing steps and are difficult to test to ensure proper connection. According to some embodiments, one or more of the flexible circuits are independent of and include different circuitry, contacts, and / or signal traces than the other flexible circuits 5048a-5048d. For some embodiments, four separate and independent flexible circuits 5048a-5048d are used with the rigid interposer circuit 4522, with each flexible circuit 5048a-5048d including its own unique set of one or more circuitry, contacts, and / or signal traces.

[0059] In some embodiments, the image sensor can be gold wire stitched to the circuitry 4810 for high-speed signal integrity. The optical image stabilization suspension assembly is further configured to allow general flexibility in determining which connections go directly from the flexible circuits 5048a-d to the image sensor and which go through the rigid interposer circuit 5022. For alternative embodiments, the optical image stabilization suspension assembly can omit the rigid interposer circuit 5022. For example, using a general-purpose substrate provides rigidity under the image sensor without circuitry. The optical image stabilization suspension assembly can independently carry every single sensor electrical connection on the flexible circuits 5048a-d. According to some embodiments, the connections can be gold wire stitched from the flexible circuits 5048a-d to the image sensor.

[0060] 50 illustrates a bonding tail region (bonded tail region) of a flexible circuit 5048a according to an embodiment of the present disclosure. The sensor-shifting circuit module is configured to move the image sensor in a plane parallel to the longitudinal axis of the image sensor, e.g., in the X-axis and Y-axis directions relative to the Z-axis of the sensor-shifting circuit module. The flexible circuit 5048a can include a bonding tail region 4549 configured to be attached to a printed circuit board PCB. The flexible circuit 5048a can further include an attachment feature 4550 adjacent the bonding tail region 5049, the attachment feature 4550 configured to reduce stress on the sensor-shifting circuit from movement in the Z-axis.

[0061] In some embodiments, the rigid interposer circuit 5022 includes one or more circuits 4810 configured to mount one or more components thereon. The components may be electrically coupled only to the image sensor 4508. In some embodiments, the components are electrically coupled to the image sensor and are formed as part of one or more circuits and one or more flexible circuits 5048a-5048d. The components include, but are not limited to, power converters, regulators, capacitors, resistors, inductors, integrated circuits, and other similar types. Because the components can be mounted closer to the image sensor 4508, this allows for improved performance over components mounted on the circuit board on the other side of the flexible circuit 5048a. The improved sensor-shifting circuit module 4800 allows for improved impedance control of high-speed channels / signals as a result of improved impedance control and shorter signal / channel lengths, thereby improving high-speed signal integrity. Furthermore, the configuration of the sensor-shifting circuit module 4800 does not require blind vias, thereby improving reliability and enabling economical manufacturing. Specifically, since there are no blind vias, it is possible to reduce manufacturing costs and improve manufacturing yields.

[0062] The sensor-shifting circuit module 4800 also allows for separation of power and signal traces. Because the components reside on the rigid interposer circuit 5022, this waives the requirement that all of the power traces run through the flex circuit. In some embodiments, fewer power traces need to run on the flexible circuit, allowing a separate flexible circuit to be used for signal traces as well as a separate flexible circuit for power traces. In another embodiment, the power components can be mounted on the rigid interposer circuit close to the image sensor. As a result, the flexible circuit does not need to be configured to receive power. Thus, the flexible circuit can be used primarily for signal traces.

[0063] While the present invention has been described with reference to different embodiments, those skilled in the art will recognize that changes can be made in form and detail without departing from the spirit and scope of the invention. For example, while described as a dual camera assembly, other embodiments of the invention are configured for three or more cameras. Features of different illustrated embodiments may be combined with each other in still other embodiments. Accordingly, the specification and drawings should be regarded in an illustrative rather than a restrictive sense.

Claims

1. a rigid interposer circuit; a sensor mounting area on the rigid interposer circuit; and a plurality of flexible circuits configured to electrically couple the rigid interposer circuit to a printed circuit board, each of the plurality of flexible circuits comprising one or more bends, the one or more bends comprising a first bend that connects each of the plurality of flexible circuits to the rigid interposer circuit and the printed circuit board (PCB) thereby providing reduced stiffness to allow the rigid interposer circuit to move relative to the printed circuit board, each of the plurality of flexible circuits comprising a bonding tail region configured to be attached to the printed circuit board, and an attachment feature adjacent the bonding tail region, the attachment feature configured to reduce stress on a suspension assembly from movement in the Z axis; A suspension assembly comprising:

2. the suspension assembly further comprising an image sensor mounted to the rigid interposer circuit at the sensor mounting area.

10. The suspension assembly of claim 1.

3. the image sensor is attached to the rigid interposer circuit using gold ball wire bonds; 3. The suspension assembly of claim 2.

4. the sensor mounting area is electrically coupled to one or more flexible circuits via one or more circuits disposed on the rigid interposer circuit; 10. The suspension assembly of claim 1.

5. the one or more flexible circuits are configured to mount components on the rigid interposer circuit; 5. The suspension assembly of claim 4.

6. at least one of the plurality of flexible circuits receives a signal trace; 10. The suspension assembly of claim 1.

7. At least one of the plurality of flexible circuits that does not receive the signal trace receives a power signal.

7. The suspension assembly of claim 6.

8. the rigid interposer circuit is configured to receive at least one power component; 10. The suspension assembly of claim 1.

9. The suspension assembly further includes an inner housing and an outer housing.

10. The suspension assembly of claim 1.

10. a rigid interposer circuit; a plurality of flexible circuits configured to be attached to the rigid interposer circuit and movable relative to the rigid interposer circuit in an X-axis and a Y-axis, each of the plurality of flexible circuits comprising one or more bends, the one or more bends comprising a first bend that connects each of the plurality of flexible circuits to the rigid interposer circuit and a printed circuit board (PCB) thereby providing reduced stiffness to allow the rigid interposer circuit to move relative to the printed circuit board, each of the plurality of flexible circuits comprising a bonding tail region configured to be attached to the printed circuit board and an attachment feature adjacent the bonding tail region, the attachment feature configured to reduce stress on the sensor-shifting circuit module from movement in the Z-axis; and a sensor mounting area on the rigid interposer circuit; a sensor shift circuit module comprising:

11. the sensor-shifting circuit module further comprises an image sensor attached to the rigid interposer circuit at the sensor mounting area. The sensor shift circuit module of claim 10.

12. the image sensor is attached to the rigid interposer circuit using wire bonding techniques; The sensor shifting circuit module of claim 11 .

13. the sensor mounting area is within a Z-height space defined by the rigid interposer circuit; The sensor shift circuit module of claim 10.

14. a lens mounted generally fixedly relative to said rigid interposer circuit in X and Y axes and optionally including an autofocus mechanism; The sensor shift circuit module of claim 10.

15. at least one of the plurality of flexible circuits receives a signal trace; The sensor shift circuit module of claim 10.

16. At least one of the plurality of flexible circuits that does not receive the signal trace receives a power signal.

16. The sensor shifting circuit module of claim 15.

17. the rigid interposer circuit is configured to receive at least one power component; The sensor shift circuit module of claim 10.

18. The sensor shift circuit module further comprises an inner housing and an outer housing. The sensor shift circuit module of claim 10.

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