Defect repair method, composite processing device, and computer program
The integrated defect repair method automates defect detection and repair processes using a composite machining apparatus, ensuring seamless parameter transfer and precise defect repair through automated parameter application.
Patent Information
- Application Number
- JP2024232756
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2044-12-27
AI Technical Summary
Existing defect repair methods require separate devices for each process and manual determination of operating parameters, lacking automation and efficient parameter sharing between processes.
A defect repair method using a composite machining apparatus with integrated control device and machining heads for automated defect detection, cutting, and additive manufacturing, enabling seamless parameter transfer between processes.
Facilitates fully automated defect repair by extracting parameters from previous processes and applying them to the next process, ensuring uniform application of molten metal and precise finishing, thus enhancing efficiency and accuracy.
Smart Images

Figure 0007810781000001_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to a defect repair method, a multi-tasking apparatus for carrying out the method, and a computer program. [Background technology]
[0002] A defect repair method is known that acquires the location of defects in a workpiece, performs cutting based on the defect location, and then supplies material to the cut area. The defect repair method described in Patent Document 1 includes a series of processes: inspecting the defect, forming a depression by removing the defective portion, supplying material to the depression, and, once the supplied material hardens, removing unnecessary portions of the hardened portion. In this process, defect inspection is performed using various sensors such as cameras, ultrasound, elastic waves, and X-rays. Defect removal is performed using a cutting mechanism such as a machining center or a removal processing mechanism using laser polishing. Material is supplied to the defective portion using a material supply mechanism including a nozzle. Unnecessary portions of the hardened portion are removed using a shaping mechanism such as a blade or file. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] Patent Publication No. 2018-158457 Summary of the Invention [Problem to be solved by the invention]
[0004] In the defect repair method disclosed in Patent Document 1, the above-mentioned series of processes are performed using separate devices, so it is generally necessary to prepare programs to operate each of these devices. Patent Document 1 does not disclose how the processing results of each process are shared between programs, and generally, there is a problem that the operating parameters of the next process must be manually determined based on the results of each process. [Means for solving the problem]
[0005] A defect repair method according to a first aspect of the present disclosure includes detecting a defect on a surface of a repair object using a shape measurement sensor and determining a first target point, the position of the defect on a first plane, using a control device. The defect repair method also includes controlling the first processing head by the control device to move a rotary tool rotatably attached to the first processing head about a rotation axis to the first target point, and controlling the first processing head by the control device to move the first processing head from the first target point in a first direction perpendicular to the first plane while rotating the rotary tool, thereby cutting the repair object around the defect and forming a depression in the surface of the repair object. The defect repair method also includes determining a second target point by the control device based on the first target point, the second target point being located inside the outer periphery of the depression as viewed in the first direction, controlling the second processing head by the control device to move the second processing head to the second target point for adding molten metal to the depression, and controlling the second processing head by the control device to perform additive manufacturing by adding molten metal to the depression.
[0006] According to a second aspect of the present disclosure, in the defect repair method according to the first aspect, the second target point is the same as the first target point.
[0007] According to a third aspect of the present disclosure, in the defect repair method according to the first or second aspect, the rotary tool is a ball end mill.
[0008] According to a fourth aspect of the present disclosure, in a defect repair method according to the first, third, or fourth aspect, determining a second target point includes calculating the second target point by a control device based on the position of the first target point and the tool diameter of the rotary tool.
[0009] According to a fifth aspect of the present disclosure, the defect repair method according to any of the first to fourth aspects further includes, after additive manufacturing, controlling the first machining head by a control device to move a finishing tool attached to the first machining head to perform finishing processing to remove molten metal that has overflowed from the recess.
[0010] According to a sixth aspect of the present disclosure, in a defect repair method according to any of the fifth aspects, controlling the first machining head to move a finishing tool to perform finishing processing includes changing the tool attached to the first machining head from a cutting rotary tool to a finishing tool.
[0011] According to a seventh aspect of the present disclosure, in a defect repair method according to the fifth or sixth aspect, the finishing tool is an end mill having a tool diameter larger than that of the rotary tool, and controlling the first machining head to move the finishing tool to perform finishing processing includes moving the finishing tool to a first target point.
[0012] According to an eighth aspect of the present disclosure, in the defect repair method according to any one of the first to seventh aspects, the shape measurement sensor is replaceably attached to the first processing head.
[0013] According to a ninth aspect of the present disclosure, in the defect repair method according to any one of the first to eighth aspects, the shape measurement sensor is an image sensor, and detecting defects on the surface to be repaired of the object to be repaired includes photographing the surface to be repaired with the image sensor and detecting areas corresponding to defects in the image detected by the image sensor through image processing. Preferably, detecting defects includes illuminating the surface to be repaired so that areas without defects on the surface to be repaired are overexposed, and detecting areas corresponding to defects in the image detected by the image sensor through threshold processing.
[0014] According to a tenth aspect of the present disclosure, in the defect repair method according to the ninth aspect, determining a first target point includes finding a reference point within the area when the first plane is considered to be the surface to be repaired, and determining the first target point based on the reference point, the line of sight direction of the image sensor, the viewpoint position of the image sensor, and the position and orientation of the first plane.
[0015] According to an eleventh aspect of the present disclosure, in the defect repair method according to any one of the first to tenth aspects, the depth of the depression in the first direction from the surface to be repaired is predetermined. The defect repair method further includes, before controlling the second machining head by the control device to perform additive manufacturing, determining by the control device a volume of the depression based on the tool diameter of the rotary tool and the depth of the depression, and determining by the control device a value obtained by adding an offset value to the determined volume as the amount of molten metal to be added to the depression.
[0016] According to a twelfth aspect of the present disclosure, in a defect repair method according to any of the first to eleventh aspects, the shape measurement sensor is a 3D scanner, and the method includes using a control device to obtain first data relating to a first plurality of points on the surface to be repaired that are estimated to be located at a surface position among a plurality of points detected by the 3D scanner, using the obtained first data to obtain a first parameter representing the surface position of the defect by the control device, and determining a first target point from the obtained first parameter.
[0017] According to a thirteenth aspect of the present disclosure, in a defect repair method according to any of the first to twelfth aspects, the shape measurement sensor is a 3D scanner, and the method includes: obtaining, by a control device, first data relating to a first plurality of points on the surface to be repaired that are estimated to be located at a surface position among a plurality of points detected by the 3D scanner; obtaining, by the control device, a second parameter representing the depth of the defect in a first direction from the surface to be repaired using the obtained first data; and determining, from the obtained second parameter, an amount to move the first processing head in the first direction from the first target point to form a depression.
[0018] A composite machining apparatus according to a fourteenth aspect of the present disclosure includes a control device configured to execute the defect repair method according to any one of the first to thirteenth aspects, a first machining head configured to mount a rotary tool, a finishing tool, and a shape measurement sensor, a first actuator configured to move the first machining head, a second machining head, and a second actuator configured to move the second machining head. The control device is configured to control the first actuator and the second actuator to move the first machining head and the second machining head.
[0019] According to a fifteenth aspect of the present disclosure, the multi-purpose machining apparatus according to the fourteenth aspect of the present disclosure further includes a tool exchange device that exchanges the rotary tool, finishing tool, and shape measurement sensor that are attached to the first machining head.
[0020] A computer program according to a sixteenth aspect of the present disclosure includes instructions that, when executed by a numerically controlled computer that is a control device, cause the numerically controlled computer to execute the defect repair method of any one of the first to fourteenth aspects.
[0021] The defect repair method according to the first aspect, the multi-tasking apparatus according to the fourteenth aspect including a control device configured to execute the defect repair method according to the first aspect, and the computer program according to the sixteenth aspect comprising instructions for causing a numerically controlled computer to execute the defect repair method according to the first aspect can provide a fully automated defect repair method by extracting second target points from first target points and using them in a program for additive manufacturing.
[0022] In the defect repair method according to the second aspect, the composite machining apparatus according to the 14th aspect including a control device configured to execute the defect repair method according to the second aspect, and the computer program according to the 16th aspect having instructions for causing a numerically controlled computer to execute the defect repair method of the second aspect, by aligning the second target point with the first target point, the second target point can use the information of the first target point as is, and the process of separately extracting the second target point can be omitted.
[0023] In the defect repair method according to the third aspect, the multi-tasking machine according to the fourteenth aspect including a control device configured to execute the defect repair method according to the third aspect, and the computer program according to the sixteenth aspect including instructions for causing a numerically controlled computer to execute the defect repair method according to the third aspect, by using a ball end mill as the rotary tool, it is possible to form a depression that continuously expands from the center of the depression toward the periphery. This allows molten metal to be applied uniformly to the depression in the automated defect repair method, thereby suppressing the occurrence of internal defects, etc. In particular, when moving from a first target point in a first direction, it is possible to realize an automated defect repair method in which molten metal is applied uniformly to the depression without creating a machining program for generating a specific path.
[0024] In the defect repair method according to the fourth aspect, the composite machining apparatus according to the fourteenth aspect including a control device configured to execute the defect repair method according to the fourth aspect, and the computer program according to the sixteenth aspect having instructions for causing a numerically controlled computer to execute the defect repair method according to the fourth aspect, molten metal can be reliably added to the depression by setting the second target point within the range of the tool diameter of the rotary tool from the first target point when viewed in the first direction.
[0025] In the defect repair method according to the fifth aspect, the combined machining apparatus according to the fourteenth aspect including a control device configured to execute the defect repair method according to the fifth aspect, and the computer program according to the sixteenth aspect having instructions for causing a numerically controlled computer to execute the defect repair method according to the fifth aspect, the finishing tool attached to the first machining head can remove molten metal that has overflowed from the depression, thereby smoothing the surface. Also, when the destinations of the rotating tool and the finishing tool are set to a common first target point, the process of extracting the destination of the finishing tool can be omitted.
[0026] In the defect repair method according to the sixth aspect, the combined machining apparatus according to the fourteenth aspect including a control device configured to execute the defect repair method according to the sixth aspect, and the computer program according to the sixteenth aspect having instructions for causing a numerically controlled computer to execute the defect repair method according to the sixth aspect, the same first machining head can be used to perform machining with a rotating tool and a finishing tool, thereby enabling the combined machining apparatus to be formed compactly. In particular, the combined machining apparatus according to the fifteenth aspect can fully automate the defect repair method because the rotating tool and the finishing tool can be exchanged using a tool exchanger.
[0027] In the defect repair method according to the seventh aspect, the composite machining apparatus according to the fourteenth aspect including a control device configured to execute the defect repair method according to the seventh aspect, and the computer program according to the sixteenth aspect having instructions for causing a numerically controlled computer to execute the defect repair method according to the seventh aspect, highly accurate defect repair can be performed by matching the position of the finishing tool with the position of the rotary tool and the position of the head of the composite machining apparatus.
[0028] In the defect repair method according to the eighth aspect, the composite machining apparatus according to the fourteenth aspect including a control device configured to execute the defect repair method according to the eighth aspect, and the computer program according to the sixteenth aspect having instructions for causing a numerically controlled computer to execute the defect repair method according to the eighth aspect, by attaching a shape measurement sensor to the first machining head that can be oriented in any position and posture, the shape measurement sensor can be aligned to a position and orientation that makes it easy to detect defects.
[0029] In the defect repair method according to the 9th aspect, the composite machining apparatus according to the 14th aspect including a control device configured to execute the defect repair method according to the 9th aspect, and the computer program according to the 16th aspect having instructions for causing a numerically controlled computer to execute the defect repair method of the 9th aspect, by defining a first plane, a first target point can be obtained based on the area corresponding to the defect in the image.
[0030] In the defect repair method according to the 10th aspect, the composite machining apparatus according to the 14th aspect including a control device configured to execute the defect repair method according to the 10th aspect, and the computer program according to the 16th aspect having instructions for causing a numerically controlled computer to execute the defect repair method of the 10th aspect, the first target point can be determined from the position of the reference point in the image using an affine transformation.
[0031] In the defect repair method according to the 11th aspect, the composite machining apparatus according to the 14th aspect including a control device configured to execute the defect repair method according to the 11th aspect, and the computer program according to the 16th aspect having instructions for causing a numerically controlled computer to execute the defect repair method according to the 11th aspect, molten metal is supplied in an amount equal to the volume of the depression plus an offset, so that the depression can be completely filled with molten metal.
[0032] In the defect repair method according to the 12th aspect, the composite machining apparatus according to the 14th aspect including a control device configured to execute the defect repair method according to the 12th aspect, and the computer program according to the 16th aspect having instructions for causing a numerically controlled computer to execute the defect repair method according to the 12th aspect, first data relating to a plurality of points detected from a 3D scanner can be used to obtain an equation in machine coordinates of a first plane and determine a first target point.
[0033] In the defect repair method according to the 13th aspect, the composite machining apparatus according to the 14th aspect including a control device configured to execute the defect repair method according to the 13th aspect, and the computer program according to the 16th aspect having instructions for causing a numerically controlled computer to execute the defect repair method according to the 13th aspect, the amount of movement from the first target point in the first direction is determined from the second parameter, so that the amount of cutting can be minimized and unnecessary cutting can be prevented. [Effects of the Invention]
[0034] The defect repair method, machine tool, and computer program disclosed herein can provide a fully automated defect repair method for point repair of small defects by extracting the parameters required for the next process from the results of each process and passing the extracted parameters to a program that operates the next process. [Brief explanation of the drawings]
[0035] [Figure 1] FIG. 1 is a schematic diagram illustrating an example of a multi-processing apparatus according to an embodiment. [Figure 2] FIG. 2 is another example of a schematic configuration diagram of the combined machining apparatus according to the embodiment. [Figure 3] FIG. 3 is an enlarged view of a connection portion between the shape measuring sensor and the first processing head. [Figure 4] FIG. 4 is another example of a schematic configuration diagram of the combined machining apparatus according to the embodiment. [Figure 5] FIG. 5 is another example of a schematic configuration diagram of a multi-tasking machine including a tool exchanger according to an embodiment. [Figure 6] FIG. 6 is a block diagram showing the internal configuration of the control device. [Figure 7] FIG. 7 is a flowchart showing a defect repair method implemented by the control device executing a repair program. [Figure 8] Figure 8 shows the arrangement of the shape measurement sensor and the surface to be repaired. [Figure 9] FIG. 9 shows an example of an image of the surface to be repaired captured by an image sensor. [Figure 10] FIG. 10 shows an example of defect reference points detected from the image of FIG. 7 by image processing. [Figure 11] FIG. 11 shows an example of the processing flow of step S3 in FIG. 7 when the shape measurement sensor is an image sensor. [Figure 12] FIG. 12 shows an example of the processing flow of step S4 in FIG. 7 when the shape measurement sensor is an image sensor. [Figure 13]FIG. 13 is a diagram showing the approach direction of the rotary tool. [Figure 14] FIG. 14 is a diagram showing the approach direction of the second processing head. [Figure 15] FIG. 15 is a diagram showing the approach direction of the finishing tool. [Figure 16] FIG. 16 is an example of a schematic configuration diagram of another combined machining apparatus according to an embodiment. [Figure 17] FIG. 17 is an example of a schematic configuration diagram of another combined machining apparatus according to an embodiment. [Figure 18] FIG. 18 shows the arrangement of the shape measurement sensor and the surface to be repaired when the shape measurement sensor is a 3D scanner. [Figure 19] FIG. 19 is a schematic diagram showing the state when a laser is applied to a defect CK. [Figure 20] FIG. 20 shows an example of the processing flow of step S3 in FIG. 7 when the shape measurement sensor is a 3D scanner. [Figure 21] FIG. 21 shows an example of the processing flow of step S4 in FIG. 7 when the shape measurement sensor is an image sensor. DETAILED DESCRIPTION OF THE INVENTION
[0036] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings showing embodiments thereof, in which the same reference numerals designate corresponding or substantially identical components. <Embodiment> <Configuration of the composite machining apparatus 100> FIG. 1 shows a schematic configuration diagram of a combined machining apparatus 100 according to an embodiment of the present invention. The combined machining apparatus 100 according to this embodiment is a combined machining apparatus capable of performing multiple processes on a workpiece, and is capable of performing both additive manufacturing and cutting. The combined machining apparatus 100 includes a cover (not shown) that covers the equipment that performs additive manufacturing and cutting, and an operation panel 102. The operation panel 102 includes an input / output device 103 that receives input from a user and outputs information to the user. The input / output device 103 may also be referred to as a user interface. The input / output device 103 is configured to receive input from a user and output information to the user. Specifically, the input / output device 103 includes a display that displays information to the user as images, a speaker that provides information to the user as sound, and a touch panel, buttons, and dials through which the user inputs information. The operation panel 102 also includes a machine control unit CL for controlling the combined machining apparatus 100. The detailed configuration of the control unit CL will be described later.
[0037] Referring to FIG. 1 , the multitasking machining apparatus 100 includes a holding mechanism 105, a cutting device 106, an additive manufacturing device 120, a first moving mechanism 107, and a second moving mechanism 108. The holding mechanism 105 is configured to hold a workpiece W. The cutting device 106 is configured to perform cutting on the workpiece W. The additive manufacturing device 120 is configured to perform additive manufacturing on the workpiece W. The first moving mechanism 107 is configured to move the cutting device 106 relative to the workpiece W. The second moving mechanism 108 is configured to move the additive manufacturing device 120 relative to the workpiece W. In this embodiment, the second moving mechanism 108 is a five-axis robot arm, but may be another mechanism. Alternatively, the cutting device 120 and the additive manufacturing device 120 may be configured to move relative to the workpiece W by the same moving mechanism. Examples of these will be described later at the end of this embodiment.
[0038] FIG. 1 shows the arrangement of the cutting device 106 and the additive manufacturing device 120 when the cutting device 106 processes the workpiece W. The holding mechanism 105 is configured to rotate the workpiece W about a rotation axis parallel to the Z axis in the figure. The cutting device 106 includes a first processing head 116. Tools and the like are attached to the first processing head 116 so that they can rotate about the rotation axis A1. The cutting processes performed by the cutting device 106 include turning, in which a turning tool attached to the first processing head 116 is brought into contact with the workpiece W rotated by the holding mechanism 105, and milling, in which a milling tool attached to the first processing head 116 is brought into contact with the workpiece W stationary by the holding mechanism 105, and processed. However, the cutting device 106 may perform cutting processes other than those described above.
[0039] The first moving mechanism 107 can move the first machining head 116 in the X-axis and Y-axis directions in addition to the Z-axis direction in FIG. 2. The X-axis direction is substantially perpendicular to the Z-axis direction and is a vertical direction. The Y-axis direction is substantially perpendicular to the X-axis and Z-axis directions and is a horizontal direction. The first moving mechanism 107 can also rotate the first machining head 116 around a rotation axis A2 that is horizontal to the Y-axis. As shown in FIG. 2, the first moving mechanism 107 includes a first actuator ACT1 configured to move the first machining head 116 and a power conversion device. The first actuator ACT1 is typically a servo motor, but may also be a stepping motor. The cutting device 106 further includes a servo motor that rotates the first machining head 116.
[0040] FIG. 2 shows the arrangement of the cutting apparatus 106 and the additive manufacturing apparatus 120 when inspecting the workpiece W for defects before machining the workpiece W with the cutting apparatus 106. A shape measurement sensor SS can also be attached to the first machining head 116. FIG. 2 is a schematic configuration diagram of the shape measurement sensor SS when the shape measurement sensor SS is an image sensor SS1. Specifically, the image sensor SS1 is a camera. FIG. 3 is an enlarged view of the connection portion between the shape measurement sensor SS and the first machining head 116. Referring to FIG. 3, the cutting apparatus 106 has a common tool interface INT1 in the first machining head 116 for connecting at least the rotating tool T1 and the finishing tool T2, and a connection interface INT2 in the non-rotating portion 117 on the outside of the first machining head 116 for connecting at least the shape measurement sensor SS. In this example, the shape measurement sensor SS has pull studs corresponding to the tool interface INT1 and the connection interface INT2, but it may also have a pull stud corresponding only to the connection interface INT2. This fixes the shape measurement sensor SS in a predetermined orientation around the rotation axis A1. If there are multiple orientations of the shape measurement sensor SS around the rotation axis A1 determined by the connection interface INT2, the orientation of the shape measurement sensor SS around the rotation axis A1 may be determined by calibration from the measurement results of the shape measurement sensor SS based on a measurement reference provided in the machining space where the workpiece W is placed or on the workpiece W. In another embodiment, the shape measurement sensor SS may be connected to the first machining head 116 only by the tool interface INT1. In this case, it is preferable that the orientation of the shape measurement sensor SS around the rotation axis A1 be determined by calibration from the measurement results of the shape measurement sensor SS based on a measurement reference provided in the machining space where the workpiece W is placed or on the workpiece W.
[0041] In this way, the shape measurement sensor SS is replaceably mounted on the first machining head 116. The first machining head 116 is configured to mount a rotary tool T1, a finishing tool T2, and the shape measurement sensor SS. A base BE for supporting the image sensor SS1 is connected to the tool interface INT. Note that this configuration of the shape measurement sensor SS is just one example, and it is desirable that the structure of the base BE be changed appropriately depending on the shape and size of the shape measurement sensor SS. Furthermore, the shape measurement sensor SS may be a three-dimensional scanner (3D scanner) SS2, which will be described later.
[0042] FIG. 4 shows the arrangement of the cutting device 106 and the additive manufacturing device 120 when machining a workpiece W using the additive manufacturing device 120. The additive manufacturing performed by the additive manufacturing device 120 refers to a technique in which an additive material is supplied to the workpiece W while an energy beam, such as a laser beam, arc discharge, or plasma, is concentrated to control the heat generation position, thereby selectively fusing and bonding the additive material to the workpiece W. In this embodiment, the additive material refers to metal powder, ceramic powder, or wire. Referring to FIGS. 2 and 3, the additive manufacturing device 120 includes a second machining head 122 and a transmission mechanism (not shown). The second machining head 122 is configured to output the additive material and the energy beam. The transmission mechanism is configured to transmit the additive material and the energy beam to the second machining head 122. The additive manufacturing device 120 also has other components, which will be described later.
[0043] The second movement mechanism 108 can move the second machining head 122 in the X-axis and Y-axis directions in addition to the Z-axis direction in FIGS. 1, 2, and 4. The second movement mechanism 108 can also rotate the additive manufacturing apparatus 120 around a rotation axis horizontal to the Y-axis. As shown in FIGS. 1, 2, and 4, the second movement mechanism 108 includes a second actuator ACT2 configured to move the second machining head 122. The second actuator ACT2 is typically a servo motor, but may also be a stepping motor. When interchanging the additive manufacturing apparatus 120 and the milling apparatus 106, the second movement mechanism 108 orients the robot arm upward (in the positive X-axis direction), as shown in FIGS. 1 and 2. This allows the additive manufacturing apparatus 120 and the milling apparatus 106 to be repositioned so that they do not interfere with each other.
[0044] As shown in FIG. 5 , the multitasking machine 100 may include a tool changer 109. The tool changer 109 is configured to change an implement attached to the first machining head 116. In this embodiment, the implement includes a rotary tool T1 used for cutting, a finishing tool T2 used for finishing, and a shape measurement sensor SS. That is, the tool changer 109 is configured to change the rotary tool T1, the finishing tool T2, and the shape measurement sensor SS attached to the first machining head 116. Specifically, the tool changer 109 includes a magazine arm 132 and a stocker 134. The magazine arm 132 is rotatable about an axis along the Z-axis direction. The magazine arm 132 is movable in the X-axis direction relative to the stocker 134. The stocker 134 stores a plurality of implements arranged in the X-axis direction.
[0045] The tool changer 109 changes a turning tool according to the following procedure. The cutting device 106 approaches the tool changer 109 in the Z-axis direction, with the rotation axis A1 aligned along the Z-axis direction. The magazine arm 132 has a first gripper at one end in the extension direction of the magazine arm 132 and a second gripper at the other end in the extension direction. The first gripper grips the tool attached to the first machining head 116 in order to remove the tool attached to the first machining head 116. More specifically, when the magazine arm 132 rotates by a predetermined rotation angle around an axis along the Z-axis direction, the first gripper grips the tool, and at the same time, the second gripper grips another tool stored in the stocker 134. When the column 110 moves away from the tool changer 109 in the Z-axis direction, the tool is removed from the tool spindle 114. In order to mount another tool on the tool spindle 114, the magazine arm 132 rotates about an axis along the Z-axis direction and moves the other tool gripped by the second gripper to the tool mounting position. When the column 110 approaches the tool changer 109 in the Z-axis direction, the other tool is mounted on the tool spindle 114. <Internal configuration of the control device CL> FIG. 6 is a block diagram showing the internal configuration of the control device CL. The control device CL is generally configured by a PLC (Programmable Logic Controller). In other words, it includes a programmable electronic circuit. The control device CL may also be referred to as a numerical control computer. Specifically, referring to FIG. 6, the control device CL includes a processor 31 such as a CPU (Central Processing Unit), a memory 32, and a power supply (not shown). The control device CL is configured to control the first actuator ACT1 and the second actuator ACT2 to move the first machining head 116 and the second machining head 122. The memory 32 is configured to control the shape measurement sensor SS, the first movement mechanism 107, the second movement mechanism 108, the tool changer 109, the cutting device 106, and the additive manufacturing device 120, and also to store a repair program PG for performing point repair. Note that the tool changer 109 may be omitted. When the processor 31 executes the repair program PG, a series of processes are performed, including detecting defects in the workpiece W, forming a depression by removing the defective portion, supplying material to the depression, and removing unnecessary portions of the hardened material.
[0046] The control device CL further includes a first input / output interface 33, a second input / output interface 34, a bus 35, and a power supply (not shown). The first input / output interface 33 is connected to the input / output device 103. The first input / output interface 33 is, for example, a video output interface, a sound output interface, or various serial / parallel interfaces such as USB. The second input / output interface 34 is connected to the cutting device 106, the additive manufacturing device 120, the first movement mechanism 107, the second movement mechanism 108, the tool changer 109, and the shape measurement sensor SS, and receives output signals from these devices. The second input / output interface 34 includes, for example, a serial interface such as USB, a parallel interface such as RS-232C or SCSI, or a video input interface such as HDMI (registered trademark) or DisplayPort. The bus 35 connects the processor 31, the memory 32, the first input / output interface 33, and the second input / output interface 34 to one another. The bus 35 transmits output signals from the shape measurement sensor SS to the processor 31, transmits signals between the processor 31 and the memory 32, and transmits control signals output from the processor 31 to the cutting device 106, the additive manufacturing device 120, the first movement mechanism 107, the second movement mechanism 108, and the tool changer 109 to the second input / output interface 34. <Operation of defect repair method by repair program> The repair program PG, when executed by the control device CL, includes instructions for causing the control device CL to execute a defect repair method described below. FIG. 7 is a flowchart of the defect repair method realized by the control device CL executing the repair program PG. Referring to FIG. 7, in the defect repair method, first, in step S1, if the multitasking machine 100 does not include a tool changer 109, an operator attaches the shape measurement sensor SS to the first machining head 116. If the multitasking machine 100 includes the tool changer 109, the control device CL controls the tool changer 109 to attach the shape measurement sensor SS to the first machining head 116. In other words, the repair program PG, when executed by the control device CL, includes instructions for controlling the tool changer 109 to attach the shape measurement sensor SS to the first machining head 116. Next, the control device CL controls the first moving mechanism 107 to position the shape measurement sensor SS in a position and orientation suitable for detecting the repair target surface ROS. That is, when executed by the control device CL, the repair program PG includes instructions for controlling the first moving mechanism 107 so as to place the shape measuring sensor SS in a position and orientation suitable for detecting the repair target surface ROS. This repair target surface ROS is the flat surface of the workpiece W on which defects CK are to be detected by the shape measuring sensor SS.
[0047] FIG. 8 illustrates the arrangement of the shape measurement sensor SS and the repair target surface ROS. As shown in FIG. 8, when the shape measurement sensor SS is an image sensor SS1 (camera), it is preferable that the shape measurement sensor SS be positioned and oriented so that the entire repair target surface ROS can be captured and as large as possible. If a three-dimensional shape model of the workpiece W and the holding method of the workpiece W by the holding mechanism 105 (information such as which surface of the workpiece W is hidden by the chuck) are known, the control device CL may control the first movement mechanism 107 based on these values to position the shape measurement sensor SS in a position and orientation suitable for detecting the repair target surface ROS. Alternatively, the control device CL may receive user input via the input / output device 103 and, based on the input, control the first movement mechanism 107 to position the shape measurement sensor SS in a position and orientation suitable for detecting the repair target surface ROS. The positional relationship between the reference position of the first machining head 116 determined by the control value of the first movement mechanism 107 and the position of the viewpoint VP of the image sensor SS1 (camera) is stored in advance in the memory 32, and the position of the viewpoint VP of the image sensor SS1 (camera) in the machine coordinate system is determined from the control value of the first movement mechanism 107. The relationship between the attitude of the first machining head 116 determined by the control value of the first movement mechanism 107 and the vector of the line of sight LoS of the image sensor SS1 (camera) is stored in advance in the memory 32, and the vector of the line of sight LoS expressed in the machine coordinate system is determined from the control value of the first movement mechanism 107. When the shape measurement sensor SS is the image sensor SS1 (camera), the control device CL stores the position of the viewpoint VP in the machine coordinate system of the image sensor SS1 (camera) and the line of sight LoS expressed as a vector in the machine coordinate system in the memory 32.
[0048] Next, in step S2 of FIG. 7, the control device CL determines a shape model of the first plane PL in which the surface ROS to be repaired is defined in the machine coordinate system. The shape model of the first plane PL is expressed by an equation of a plane in the machine coordinate system where the surface ROS to be repaired is estimated to exist. FIG. 8 shows an example in which the first plane PL is oriented parallel to the XY plane of the machine coordinate system. For example, the shape model of the first plane PL can be expressed as Z = a (a is a constant). This equation of the plane may be calculated by the control device CL from a three-dimensional shape model of the workpiece W and the holding method of the workpiece W by the holding mechanism 105. Alternatively, the user may input parameters for defining the first plane PL based on the arrangement of the workpiece W (for example, the z coordinate value when the surface ROS to be repaired is previously arranged parallel to the XY plane of the machine coordinate system) via the input / output device 103, and the control device CL may determine the shape model of the first plane PL based on the input parameters. Preferably, the user positions the workpiece W in advance so that the first plane PL is perpendicular to the default orientation of the first machining head 116, or positions the workpiece W in advance using the holding mechanism 105 so that the first plane PL is perpendicular to the default orientation of the first machining head 116.
[0049] Next, in step S3 of FIG. 7, the control device CL detects defects CK on the repair target surface ROS of the repair target object (workpiece W) using the shape measurement sensor SS. That is, the repair program PG, when executed by the control device CL, includes instructions for detecting defects CK on the repair target surface ROS of the repair target object (workpiece W) using the shape measurement sensor SS. A detailed example in which the shape measurement sensor SS is the image sensor SS1 will be described below. The multi-tasking machine 100 has a lighting device (not shown) capable of irradiating areas of the repair target surface ROS with strong light so that areas without defects CK are overexposed. FIG. 9 shows an example of an image of the repair target surface ROS captured by the image sensor SS1. Due to limitations in the drawings in the patent specification, the image is displayed in grayscale in FIG. 9, but a color image may also be used. FIG. 10 shows an example of the reference point RP of the defect CK detected from the image of FIG. 9 by image processing.
[0050] 11 shows an example of the processing flow of step S3 in FIG. 7 when the shape measurement sensor SS is the image sensor SS1. Referring to FIG. 11, in step S31, the control device CL controls the image sensor SS1 to capture an image of the repair target surface ROS. That is, the repair program PG, when executed by the control device CL, includes instructions to control the image sensor SS1 to capture an image of the repair target surface ROS. As a result, the control device CL obtains an image such as that shown in FIG. 9.
[0051] Next, in step S32, the control device CL detects an area corresponding to a defect CK in the detected image of the image sensor SS1 through image processing. That is, the repair program PG, when executed by the control device CL, includes instructions for detecting an area corresponding to a defect CK in the detected image of the image sensor SS1 through image processing. For example, the control device CL detects pixels estimated to be defective CKs using feature quantities such as luminance, hue, saturation, and brightness of each pixel in the image. When using blown-out highlights, the control device CL typically detects pixels estimated to be defective CKs when the luminance of each pixel in the image falls below a threshold. Then, the control device CL labels pixel groups representing the same defect CK among the pixels estimated to be defective CKs. Labeled pixel groups with a small number of pixel groups are removed as noise, and the control device CL detects labeled pixel groups exceeding a predetermined number as areas corresponding to defect CKs. Figure 10 distinguishes multiple defects CKs as CK1 to CK3.
[0052] Next, in step S4 of FIG. 7, the control device CL determines a first target point TP, which is the position of the defect CK on the first plane PL. That is, the repair program PG, when executed by the control device CL, includes instructions for determining the first target point TP, which is the position of the defect CK on the first plane PL. FIG. 12 shows an example of the processing flow of step S4 of FIG. 7 when the shape measurement sensor SS is the image sensor SS1. Referring to FIG. 12, in step S41, the control device CL determines a reference point RP within the area corresponding to the defect CK when the first plane PL is regarded as the repair target surface ROS. That is, the repair program PG, when executed by the control device CL, includes instructions for determining a reference point RP within the area corresponding to the defect CK when the first plane PL is regarded as the repair target surface ROS. In a typical example, the control device CL determines the center of gravity of the area corresponding to the defect CK as the reference point RP. Alternatively, the control device CL may determine the position of the reference point RP in the image by using the average of the maximum and minimum values of the ordinate of the area corresponding to the defect CK as the ordinate of the reference point RP and the average of the maximum and minimum values of the abscissa of the area corresponding to the defect CK as the abscissa of the reference point RP. In yet another example, the control device CL may determine the pixel corresponding to the defect CK that is discovered for the first time by scanning in order from a predetermined pixel as the reference point RP of the defect CK. In Figure 10, the reference points RP of the defects CK1 to CK3 are distinguished and represented as RP1 to RP3.
[0053] In step S42, the control device CL determines a first target point TP by utilizing affine transformation based on the reference point RP, the line of sight direction LoS of the image sensor SS1, the position of the viewpoint VP of the image sensor SS1, and the position and orientation of the first plane PL (the equation for the first plane PL). That is, the repair program PG, when executed by the control device CL, includes instructions to determine the first target point TP by utilizing affine transformation based on the reference point RP, the line of sight direction LoS of the image sensor SS1, the position of the viewpoint VP of the image sensor SS1, and the position and orientation of the first plane PL (the equation for the first plane PL). In Figure 13, the first target points TP corresponding to the reference points RP1 to RP3 are respectively represented as first target points TP1 to TP3.
[0054] Next, in step S5 of FIG. 7, the control device CL determines the tool diameter of the rotating tool T1 to be used to repair the defect CK. That is, the repair program PG, when executed by the control device CL, includes instructions for determining the rotating tool T1 to be used to repair the defect CK. This rotating tool T1 may be predetermined to have a tool diameter sufficiently larger than the expected size of the defect CK. Alternatively, the control device CL detects the pixel (shown as FP for defect CK1 in FIG. 10) that is farthest from the reference point RP among the pixels labeled as the pixel of the same defect CK in the image, obtains the three-dimensional position of that pixel by affine transformation, and calculates the distance from the first target point TP to estimate the minimum required length of the tool diameter. When there are multiple defects CK (defects CK1 to CK3) as shown in Figure 10, the control device CL determines the pixel that is farthest from each of the reference points RP1 to RP3 for each of the defects CK1 to CK3, and estimates the longest distance between the position of that pixel in the machine coordinate system and the position of each of the first target points TP1 to TP3 as the minimum required length of the tool diameter.The control device CL then determines, from among the available rotating tools T1, a rotating tool T1 that has a tool diameter longer than this length.It is preferable that this rotating tool T1 be a ball end mill.
[0055] Thereafter, the control device CL controls the tool changer 109 to mount the determined rotary tool T1 on the first machining head 116. That is, the repair program PG includes an instruction to control the tool changer 109 to mount the determined rotary tool T1 on the first machining head 116 when executed by the control device CL.
[0056] Next, in step S6 of Fig. 7, the control device CL controls the first machining head 116 to move the rotary tool T1, which is rotatably attached to the first machining head 116 about the rotation axis A1, to the first target point TP. In other words, the repair program PG, when executed by the control device CL, includes instructions to control the first machining head 116 to move the rotary tool T1, which is rotatably attached to the first machining head 116 about the rotation axis A1, to the first target point TP. Fig. 13 shows the approach direction (first direction D1) in which the rotary tool T1 approaches the first target point TP in this way.
[0057] 7, the control device CL controls the first machining head 116 to rotate the rotary tool T1 while orienting the rotation axis A1 in a first direction D1 perpendicular to the first plane PL and move the first machining head 116 from the first target point TP in the first direction D1, thereby cutting the object to be repaired (workpiece W) around the defect CK and forming a recess REC on the repair target surface ROS. That is, the repair program PG, when executed by the control device CL, includes instructions to control the first machining head 116 to rotate the rotary tool T1 while orienting the rotation axis A1 in the first direction D1 perpendicular to the first plane PL and move the first machining head 116 from the first target point TP in the first direction D1, thereby cutting the object to be repaired (workpiece W) around the defect CK and forming a recess REC on the repair target surface ROS. Here, when the shape measurement sensor SS is an image sensor SS1, the movement amount from the first target point TP in the first direction D1 is determined in advance. That is, the depth of the recess REC in the first direction D1 from the repair target surface ROS (first plane PL) is predetermined. As shown in Fig. 13, if there are multiple defects CK (defects CK1 to CK3), the operations of steps S6 and S7 are repeated for each of the defects CK1 to CK3. Fig. 14 shows the recesses REC generated in this manner as recesses REC1 to REC3.
[0058] 7, the control device CL moves the cutting device 106 away from the workpiece W and moves the second machining head 122 closer to the workpiece W, as shown in FIG. 4. Furthermore, as shown in FIG. 14, the control device CL determines a second target point TAP located inside the circumferential periphery CIR of the recess REC when viewed in the first direction D1, based on the first target point TP, for the second machining head 122 for applying molten metal to the recess REC, and controls the second machining head 122 to move to the second target point TAP. In other words, the repair program PG, when executed by the control device CL, includes instructions to determine a second target point TAP located inside the circumferential periphery CIR of the recess REC when viewed in the first direction D1, based on the first target point TP, for the second machining head 122 for applying molten metal to the recess REC, and to control the second machining head 122 to move to the second target point TAP.
[0059] Preferably, the second target point TAP is the same as the first target point TP. This is because, when the rotary tool T1 is a ball end mill, the deepest point DPP of the recess REC overlaps with the first target point TP when viewed in the first direction D1. However, if the second target point TAP is located within the outer periphery CIR of the recess REC, molten metal can be added to the recess REC. When the second target point TAP is shifted from the first target point TP, the second target point TAP is a point on the first plane PL that is separated from the first target point TP by within the radius of the rotary tool T1, or a point shifted from that point in the first direction D1. Therefore, determining the second target point TAP includes calculating the second target point TAP by the control device CL based on the position of the first target point TP and the tool diameter of the rotary tool T1. FIG. 12 illustrates the second target point TAP as a point on the first plane PL that is separated from the first target point TP by within the radius of the rotary tool T1.
[0060] Thereafter, in step S9 of FIG. 7, the control device CL determines the amount of molten metal to be added to the recess REC. The repair program PG, when executed by the control device CL, includes instructions for determining the amount of molten metal to be added to the recess REC. As described above, the depth of the recess REC in the first direction D1 from the repair target surface ROS (first plane PL) is predetermined. Therefore, the control device CL calculates the volume of the recess REC based on the tool diameter of the rotary tool T1 and the depth of the recess REC. The control device CL determines the value obtained by adding an offset value to the calculated volume as the amount of molten metal to be added to the recess REC. In other words, the repair program PG, when executed by the control device CL, includes instructions for calculating the volume of the recess REC based on the tool diameter of the rotary tool T1 and the depth of the recess REC. The repair program PG includes instructions for determining the value obtained by adding an offset value to the calculated volume as the amount of molten metal to be added to the recess REC.
[0061] Thereafter, in step S10 of FIG. 7, the control device CL controls the second machining head 122 to perform additive manufacturing by adding molten metal to the depression REC. That is, the repair program PG, when executed by the control device CL, includes instructions to control the second machining head 122 to perform additive manufacturing by adding molten metal to the depression REC. Specifically, the control device CL controls the second machining head 122 and an energy beam transmission device, etc., to output an energy beam such as a laser beam, arc discharge, or plasma while supplying molten metal to the workpiece W. FIG. 15 shows the solidified molten metal added by additive manufacturing as a bulge BUL. Furthermore, the solidified molten metal added to each of the depressions REC1 to REC3 in FIG. 14 is shown as bulges BUL1 to BUL3.
[0062] After additive manufacturing, in step S11 of FIG. 7 , the control device CL controls the first machining head 116 to move the finishing tool T2 attached to the first machining head 116 to perform finishing processing to remove the molten metal that has overflowed from the recess REC. That is, the repair program PG, when executed by the control device CL, comprises instructions for controlling the first machining head 116 to move the finishing tool T2 attached to the first machining head 116 to perform finishing processing to remove the molten metal that has overflowed from the recess REC. In this step, preferably, before moving the finishing tool T2, the control device CL controls the tool changer 109 to change the tool attached to the first machining head 116 from the rotating tool T1 to the finishing tool T2. That is, the repair program PG comprises instructions for controlling the tool changer 109 to change the tool attached to the first machining head 116 from the rotating tool T1 to the finishing tool T2. If the multitasking machine 100 does not include the tool changer 109, the rotating tool T1 may be replaced with the finishing tool T2 manually.
[0063] Preferably, the finishing tool T2 is an end mill having a larger tool diameter than the rotary tool T1. However, the finishing tool T2 may be an end mill having a smaller tool diameter than the rotary tool T1 or the same tool diameter as the rotary tool T1. When the finishing tool T2 is an end mill having a larger tool diameter than the rotary tool T1, the control device CL controls the first machining head 116 to move the finishing tool T2 to the first target point TP. That is, the repair program PG, when executed by the control device CL, includes instructions for controlling the first machining head 116 to move the finishing tool T2 to the first target point TP. This efficiently removes the protrusion BUL. When the finishing tool T2 is an end mill having a smaller tool diameter than the rotary tool T1 or the same tool diameter as the rotary tool T1, the control device CL controls the first machining head 116 to move the finishing tool T2 on a circumference centered on the first target point TP on the first plane PL. That is, the repair program PG, when executed by the control device CL, includes instructions for controlling the first machining head 116 to move the finishing tool T2 on a circle centered on the first target point TP on the first plane PL. <Actions and Effects of the Embodiment> In the defect repair method, multitasking machine 100, and repair program PG according to this embodiment, the control device CL determines a first target point TP, which is the position of the defect CK on the first plane PL, and then controls the first machining head 116 to move the rotary tool T1, which is rotatably attached to the first machining head 116 about the rotation axis A1, to the first target point TP. The control device CL then determines a second target point TAP, which is located inside the outer periphery CIR of the recess REC as viewed in the first direction D1, based on the first target point TP, and controls the second machining head 122 to move to the second target point TAP for adding molten metal to the recess REC. Therefore, a fully automated defect repair method can be provided by extracting the second target point TAP from the first target point TP and using it in a repair program PG for additive manufacturing. <Modification> FIG. 16 shows a modified example 100A of the multi-purpose machining apparatus in which another movement mechanism is used instead of the second movement mechanism 108. The multi-purpose machining apparatus 100A includes a second movement mechanism 108a instead of the second movement mechanism 108. The second movement mechanism 108a can move the additive manufacturing apparatus 120 in the X-axis and Y-axis directions in addition to the Z-axis direction in FIG. 2. The second movement mechanism 108a can also rotate the additive manufacturing apparatus 120 around a rotation axis horizontal to the Y-axis. When interchanging the additive manufacturing apparatus 120 and the milling apparatus 106, the second movement mechanism 108a lifts the additive manufacturing apparatus 120 above the milling apparatus 106 (in the positive X-axis direction). This allows the additive manufacturing apparatus 120 and the milling apparatus 106 to be rearranged so that they do not interfere with each other.
[0064] FIG. 17 shows a modified example 100B of the multi-tasking apparatus in which, instead of the first movement mechanism 107 and the second movement mechanism 108, a separate movement mechanism is used to move the cutting device 120 and the additive manufacturing device 120 relative to the workpiece W. The multi-tasking apparatus 100B includes a base 111, a saddle 112, and a column 113 instead of the first movement mechanism 107 and the second movement mechanism 108. The saddle 112 is supported on the base 111 so as to be movable in the left-right direction (Z direction in FIG. 17). The column 113 is supported on the saddle 112 so as to be movable in the front-rear direction (Y direction in FIG. 17). The cutting device 120 and the additive manufacturing device 120 are supported on the column 113 so as to be movable in the up-down direction (X direction in FIG. 17). In other words, the cutting device 120 and the additive manufacturing device 120 are supported on the base 111 so as to be movable in three directions perpendicular to each other. The multi-tasking apparatus 10 includes a holding mechanism 105 that is supported rotatably on a horizontal axis (axis A2 in FIG. 17) in the front-to-rear direction relative to the base 20 and an axis (axis A1 in FIG. 17) perpendicular to the horizontal axis. The workpiece W held by the holding mechanism 105 is held rotatably in two directions relative to the base 111. Although the multi-tasking apparatus 100A and the multi-tasking apparatus 100B have different configurations of the movement mechanisms, the control shown in FIG. 7 can be performed in accordance with the movement mechanism. Therefore, the defect repair method and repair program PG are applicable not only to the multi-tasking apparatus 100 but also to the multi-tasking apparatus 100A and the multi-tasking apparatus 100B.
[0065] Next, we will explain a modified example in which the shape measurement sensor SS is a three-dimensional scanner (3D scanner) SS2. This modified example will focus on the processing that differs from the processing when the shape measurement sensor SS is an image sensor SS1. Processing not described in this modified example can be considered the same as the processing when the shape measurement sensor SS is an image sensor SS1. Figure 18 shows the arrangement of the shape measurement sensor SS and the repair target surface ROS when the shape measurement sensor SS is a 3D scanner SS2. As shown in Figure 18, a typical 3D scanner SS2 has a laser output unit EM that outputs a laser beam in a cross shape in the center and two image sensors on either side of the laser output unit EM. In Figure 18, the viewpoints of these image sensors are indicated by VP1 and VP. The intersection P of the two linear lasers (shown in Figure 18 by dashed lines and two-dot dashed lines) can be scanned on the repair target surface ROS by changing the optical system of the laser output unit EM. By utilizing the parallax of this intersection point P between the two cameras, the shape measurement sensor SS can detect the three-dimensional position of the intersection point P in its local coordinate system Xr-Yr-Zr.
[0066] The positional relationship between the reference point Or in the local coordinate system Xr-Yr-Zr and the reference position of the first machining head 116, determined by the control value of the first movement mechanism 107, is pre-stored in the memory 32. The position of the reference point Or in the machine coordinate system can be determined from the control value of the first movement mechanism 107. Furthermore, the 3D scanner SS2 is attached to the first machining head 116 so that its orientation around the rotation axis A1 (as shown in FIG. 3) is fixed relative to the first machining head 116. Therefore, the rotation parameters for converting from the local coordinate system Xr-Yr-Zr to the machine coordinate system XYZ can be determined from the control value of the first movement mechanism 107. Therefore, once the position of the intersection point P in the local coordinate system Xr-Yr-Zr is known, the position in the machine coordinate system can be determined. Figure 19 is a schematic diagram of a laser beam irradiated on a defect CK. As shown in Figure 19, the laser position fluctuates at the defect CK portion. This fluctuation can be used to determine whether the repair target surface ROS is a defect CK or not.
[0067] FIG. 20 shows an example of the process flow of step S3 in FIG. 7 when the shape measurement sensor SS is a 3D scanner SS2. Referring to FIG. 20, in step S33, the control device CL determines first data relating to a first plurality of points on the repair target surface ROS that are estimated to be located at the surface position among the plurality of points detected by the 3D scanner SS2. That is, the repair program PG, when executed by the control device CL, includes instructions for determining first data relating to a first plurality of points on the repair target surface ROS that are estimated to be located at the surface position among the plurality of points detected by the 3D scanner SS2. This first data is three-dimensional position data relating to the portion displayed approximately on a straight line in the schematic diagram of FIG. 19. One detection method, for example, utilizes the equation of the first plane PL to determine the first data using threshold processing or the like based on the distance between the first plane PL and the detected three-dimensional position in machine coordinates. Furthermore, since the shape model of the first plane PL is a plane, the control device CL can determine the plane equation of the first plane PL by statistical estimation such as the least squares method from the three-dimensional positions of the multiple points detected by the 3D scanner SS2, and determine the points whose distance from the plane does not exceed a predetermined threshold as the first multiple points estimated to be located at the surface position. In step S34, the control device CL can consider points not included in the determined first data as defects.
[0068] FIG. 21 shows an example of the processing flow of step S4 in FIG. 5 when the shape measurement sensor SS is a 3D scanner SS2. Referring to FIG. 21, in step S43, the control device CL uses the obtained first data to obtain a first parameter representing the surface position of the defect CK. That is, the repair program PG, when executed by the control device CL, includes instructions for obtaining first data relating to a first plurality of points on the repair target surface ROS that are estimated to be located at the surface position among the plurality of points detected by the 3D scanner SS2. For example, the control device CL can obtain a collection of machine coordinates of points surrounding the defect CK using labeling from the first data. The average value of these machine coordinates can be considered as the center of gravity of the defect CK on the first plane PL. Therefore, the control device CL may obtain, for example, the average value of the machine coordinates of points surrounding the defect CK as the first parameter. In step S34, the control device CL determines a first target point TP from the obtained first parameter. That is, the repair program PG includes instructions for determining the first target point TP from the obtained first parameter. Specifically, the first parameter may be the machine coordinates of the first target point TP.
[0069] Furthermore, in step S7, the amount of movement from the first target point TP in the first direction D1 is predetermined. However, if the shape measurement sensor SS is a 3D scanner SS2, the amount of movement can be determined based on the depth of the defect CK. In this case, the control device CL uses the plane equation of the first plane PL determined in step S33 to determine the distance between the first plane PL and the three-dimensional coordinates of the point corresponding to the defect CK. The control device CL can then determine the maximum value of this distance as a second parameter representing the depth of the defect CK in the first direction D1 from the repair target surface ROS. The control device CL then determines the amount of movement of the first processing head 116 from the first target point TP in the first direction D1 to form the recess REC from the determined second parameter. For example, the amount of movement of the first processing head 116 from the first target point TP in the first direction D1 may be a value obtained by adding a predetermined offset to the second parameter. That is, when executed by the control device CL, the repair program PG includes instructions for using the plane equation of the first plane PL calculated in step S33 to calculate the distance between the first plane PL and the point corresponding to the defect CK from the three-dimensional coordinates of the point. The repair program PG also includes instructions for calculating the maximum value of this distance as a second parameter representing the depth of the defect CK in the first direction D1 from the repair target surface ROS. The repair program PG also includes instructions for determining the amount by which the first processing head 116 should be moved in the first direction D1 from the first target point TP to form the recess REC, based on the calculated second parameter.
[0070] In the above-described embodiment, an example is shown in which the repair target surface ROS is flat (first plane PL). However, if the shape measurement sensor SS is a 3D scanner SS2, the repair target surface ROS may have another shape. For example, it may be a cylindrical surface. In this case, an equation for a shape model of the repair target surface ROS may be prepared in advance, and the control device CL may use a least squares method or the like to determine statistically plausible coefficient values for the above equation. The first target point TP may be a point on the shape model of the repair target surface ROS determined in this manner. The first direction D1 may be defined as a direction perpendicular to the shape model of the repair target surface ROS at the first target point TP determined in this manner. Other aspects of the defect repair method according to the above-described embodiment can be similarly applied.
[0071] Some or all of the logic functions of the repair program PG may be implemented by a dedicated processor or integrated circuit. The repair program PG may be stored in the memory 32 or may be recorded on a removable, computer-readable storage medium, such as a disk (e.g., a floppy disk, optical disk, CD-ROM, or magnetic disk), an SD card, a USB memory, or an external hard disk. While the hardware configuration diagram of FIG. 6 illustrates an example in which one memory 32 stores the repair program PG and one processor 31 executes the repair program PG, the number of processors 31 and memories 32 possessed by the control device CL is not limited to one. The repair program PG may have multiple program modules, which may be stored in multiple different memories 32 and executed by multiple different processors 32.
[0072] In this application, the term "comprises" and its derivatives are open-ended terms that describe the presence of elements and do not exclude the presence of other elements not listed. This also applies to the terms "have," "include," and their derivatives.
[0073] The terms "member," "part," "element," "body," and "structure" may have multiple meanings, such as a single part or multiple parts.
[0074] Ordinal numbers such as "first" and "second" are merely terms used to identify components and do not have any other meaning (e.g., a particular order). For example, the presence of a "first element" does not imply the presence of a "second element," and the presence of a "second element" does not imply the presence of a "first element."
[0075] Words expressing degrees, such as "substantially," "about," and "approximately," can mean a reasonable deviation that does not significantly change the final result, unless otherwise specified in the embodiment. All numerical values described in this application can be interpreted to include words such as "substantially," "about," and "approximately."
[0076] In this application, the phrase "at least one of A and B" should be interpreted to include A only, B only, and both A and B.
[0077] It is apparent that various changes and modifications of the present invention are possible in light of the above disclosure, and therefore, the present invention may be practiced otherwise than as specifically disclosed herein without departing from the spirit of the present invention.
Claims
1. Detecting defects on the surface of the object to be repaired by a shape measurement sensor; determining a first target point, which is the position of the defect on a first plane on which the surface to be repaired is estimated to exist, by a control device; controlling the first machining head by the control device so as to move a rotary tool attached to the first machining head so as to be rotatable around a rotation axis to the first target point; controlling the first machining head by the control device so that the rotation axis is directed in a first direction perpendicular to the first plane while rotating the rotary tool, and the first machining head is moved from the first target point in the first direction, thereby cutting the object to be repaired around the defect and forming a depression in the surface of the object to be repaired; a second target point located inside the outer periphery of the depression as viewed in the first direction is determined by the control device based on the first target point, and a second processing head for adding molten metal to the depression is controlled by the control device to move the second processing head to the second target point; and controlling the second processing head by the control device to perform additive manufacturing by adding the molten metal to the depression at the second target point. Including, Defect repair methods.
2. the second target point is the same as the first target point; The defect repair method according to claim 1 .
3. The rotary tool is a ball end mill. The defect repair method according to claim 1 .
4. determining the second target point includes calculating the second target point by the control device based on the position of the first target point and a tool diameter of the rotary tool; Including, The defect repair method according to claim 1 .
5. Further comprising controlling the first processing head by the control device to move a finishing tool attached to the first processing head to perform finishing processing to remove the molten metal overflowing from the depression after the additive manufacturing. The defect repair method according to claim 1 .
6. controlling the first machining head to move the finishing tool to perform the finish machining includes changing a tool attached to the first machining head from the rotary tool to the finishing tool. The defect repair method according to claim 5 .
7. The defect repair method according to claim 1 , wherein the shape measurement sensor is replaceably attached to the first processing head.
8. The shape measurement sensor is an image sensor, Detecting the defects on the surface to be repaired of the object to be repaired includes: controlling the image sensor to capture an image of the surface to be repaired; detecting an area corresponding to the defect in the detected image of the image sensor by image processing; Including, The defect repair method according to claim 1 .
9. A method for detecting defects on a surface of an object to be repaired by a shape measurement sensor; determining a first target point, the location of the defect on a first plane, by a control device; controlling the first machining head by the control device so as to move a rotary tool attached to the first machining head so as to be rotatable around a rotation axis to the first target point; controlling the first machining head by the control device so that the rotation axis is directed in a first direction perpendicular to the first plane while rotating the rotary tool, and the first machining head is moved from the first target point in the first direction, thereby cutting the object to be repaired around the defect and forming a depression in the surface of the object to be repaired; a second target point located inside the outer periphery of the depression as viewed in the first direction is determined by the control device based on the first target point, and a second processing head for adding molten metal to the depression is controlled by the control device to move the second processing head to the second target point; controlling the second processing head by the control device to perform additive manufacturing by adding the molten metal to the recess; This includes: The shape measurement sensor is an image sensor, Detecting the defects on the surface to be repaired of the object to be repaired includes: controlling the image sensor to capture an image of the surface to be repaired; detecting an area corresponding to the defect in the detected image of the image sensor by image processing; This includes: Determining the first target point comprises: determining a reference point within the region when the first plane is regarded as the surface to be repaired; determining the first target point based on the reference point, the line of sight direction of the image sensor, the viewpoint position of the image sensor, and the position and orientation of the first plane; Including, Defect repair methods.
10. a depth of the depression in the first direction from the surface to be repaired is predetermined; before controlling the second machining head with the control device to perform the additive manufacturing; determining a volume of the recess by the control device based on a tool diameter of the rotary tool and the depth of the recess; The control device determines a value obtained by adding an offset value to the determined volume as the amount of the molten metal to be added to the recess. further comprising: The defect repair method according to claim 1 .
11. A method for detecting defects on a surface of an object to be repaired by a shape measurement sensor; determining a first target point, the location of the defect on a first plane, by a control device; controlling the first machining head by the control device so as to move a rotary tool attached to the first machining head so as to be rotatable around a rotation axis to the first target point; controlling the first machining head by the control device so that the rotation axis is directed in a first direction perpendicular to the first plane while rotating the rotary tool, and the first machining head is moved from the first target point in the first direction, thereby cutting the object to be repaired around the defect and forming a depression in the surface of the object to be repaired; a second target point located inside the outer periphery of the depression as viewed in the first direction is determined by the control device based on the first target point, and a second processing head for adding molten metal to the depression is controlled by the control device to move the second processing head to the second target point; controlling the second processing head by the control device to perform additive manufacturing by adding the molten metal to the recess; This includes: The shape measurement sensor is a 3D scanner, Among the plurality of points detected by the 3D scanner, first data relating to a first plurality of points on the surface to be repaired that are estimated to be located at the surface position of the surface to be repaired is obtained by the control device, and a first parameter representing the surface position of the defect is obtained by the control device using the obtained first data, and the first target point is determined from the obtained first parameter. Defect repair methods.
12. The shape measurement sensor is a 3D scanner, determining, by the control device, first data relating to a first plurality of points on the surface to be repaired that are estimated to be located at a surface position of the surface to be repaired from among the plurality of points detected by the 3D scanner; determining, by the control device, a second parameter representing a depth of the defect in the first direction from the surface to be repaired using the determined first data; and determining, from the determined second parameter, an amount by which the first processing head is to be moved in the first direction from the first target point in order to form the depression. The defect repair method according to claim 1 .
13. a control device configured to perform the defect repair method of claim 5 or 6; the first machining head configured to mount the rotary tool, the finishing tool, and the shape measurement sensor; a first actuator configured to move the first machining head; The second processing head; a second actuator configured to move the second machining head; Equipped with The control device is configured to control the first actuator and the second actuator to move the first machining head and the second machining head. Composite processing equipment.
14. a tool exchange device configured to exchange the rotary tool, the finishing tool, and the shape measurement sensor attached to the first machining head; The combined machining apparatus according to claim 13.
15. A computer program comprising instructions that, when executed by a numerically controlled computer that is a control device, cause the numerically controlled computer to carry out the defect repair method of any one of claims 1 to 12.
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