Gas-cooled high-power connecting rod

Abstract

[0006] Provided herein are embodiments of a radio frequency (RF) power connecting rod. In some embodiments, the RF power connecting rod includes: a first connecting rod having a first connecting end, a first socket end opposite the first connecting end, and a first hollow portion extending from the first connecting end to the first socket end; a second connecting rod having a second connecting end, a second socket end opposite the second connecting end, and a second hollow portion extending from the second connecting end to the second socket end, the second connecting end adjustably coupled to the first connecting end along an axial direction of the second connecting rod; a gas flow passage extending from one or more gas inlets in the first connecting rod through the first hollow portion to the second hollow portion and to one or more gas outlets disposed through the second connecting rod; and a first plug coupled to the first socket end and a second plug coupled to the second socket end.

Description

Field

[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure relate generally to substrate processing equipment, and more particularly to power connectors for substrate processing equipment.

[0002] Power connectors are used, for example, in substrate processing equipment to deliver power from a radio frequency (RF) power source to a processing chamber. Substrate processing equipment may include RF matching, which transforms the RF power source's complex circuit impedance into the required impedance and delivers RF energy from the RF power source to the processing chamber through the power connector. High power can heat up the connector, and high voltage differences can cause arcing between components, creating a safety hazard. Traditional power connectors are constructed with copper straps to deliver high power. However, copper straps have sharp edges that can cause arcing.

[0003] Accordingly, the present inventors have provided embodiments of improved power connectors for use in substrate processing equipment.

[0004]

[0006] Embodiments of a radio frequency (RF) power connecting rod are provided. In some embodiments, the RF power connecting rod includes: a first connecting rod having a first connecting end, a first socket end opposite the first connecting end, and a first hollow portion extending from the first connecting end to the first socket end; a second connecting rod having a second connecting end, a second socket end opposite the second connecting end, and a second hollow portion extending from the second connecting end to the second socket end, the second connecting end adjustably coupled to the first connecting end along an axial direction of the second connecting rod; a gas flow passage extending from one or more gas inlets in the first connecting rod through the first hollow portion to the second hollow portion and to one or more gas outlets disposed through the second connecting rod; and a first plug coupled to the first socket end and a second plug coupled to the second socket end.

[0005] In some embodiments, a radio frequency (RF) power connecting rod for use in a processing chamber includes: a first connecting rod having a first connecting end, a first socket end opposite the first connecting end, and a first hollow portion extending from the first connecting end to the first socket end; a second connecting rod having a second connecting end, a second socket end opposite the second connecting end, and a second hollow portion extending from the second connecting end to the second socket end, the second connecting end adjustably coupled to the first connecting end along an axial direction of the second connecting rod; a first plug rotatably coupled to the first socket end through an opening in the first socket end; and a second plug rotatably coupled to the second socket end through a second opening in the second socket end.

[0006] In some embodiments, the processing chamber includes a chamber body having an internal volume, a substrate support disposed within the internal volume, an RF power source coupled to the chamber body, and an RF power connection rod coupled to the RF power source to provide RF power to the substrate support, the RF power connection rod having a first connection end, a first socket end opposite the first connection end, and a first hollow portion extending from the first connection end to the first socket end, a second connection end, a second socket end opposite the second connection end, and a second hollow portion extending from the second connection end to the second socket end, the second connection end adjustably coupled to the first connection end along an axial direction of the second connecting rod, and a gas flow path extending from one or more gas inlets in the first connecting rod through the first hollow portion to the second hollow portion and to one or more gas outlets disposed via the second connecting rod, and a first plug rotatably coupled to the first socket end, and a second plug rotatably coupled to the second socket end.

[0007] Other and further embodiments of the present disclosure will be described below. [Brief explanation of the drawings]

[0008] Embodiments of the present disclosure, briefly summarized above and described in more detail below, can be understood by reference to the exemplary embodiments of the present disclosure that are illustrated in the accompanying drawings. However, the accompanying drawings depict only typical embodiments of the present disclosure and are therefore not to be construed as limiting the scope, as the present disclosure may include other embodiments that are equally effective. [Figure 1] 1 shows a schematic diagram of a processing chamber in accordance with at least some embodiments of the present disclosure. [Figure 2] 1 illustrates an isometric view of an RF power connection rod according to at least some embodiments of the present disclosure. [Figure 3] 1 shows a schematic cross-sectional isometric view of an RF power connection rod according to at least some embodiments of the present disclosure.

[0009] To facilitate understanding, the same reference numbers will be used wherever possible to indicate identical elements common to the figures. The figures are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated in other embodiments without further description. DETAILED DESCRIPTION

[0010] Provided herein are embodiments of power connectors that include radio frequency (RF) power connecting rods. RF power connecting rods generally include connecting rods designed to connect an output sensor of an RF power source to a processing chamber using a coaxial connecting hollow rod capable of transmitting high power and current without power and arcing fluctuations. RF power connecting rods offer the advantages of improved power handling through gas flow to cool the connecting rod, eliminating the possibility of arcing by eliminating sharp edges, and providing a compact design that efficiently uses space. The hollow rod coaxial connecting arrangement has the advantage of being able to accommodate axial variations due to assembly tolerances.

[0011] 1 shows a schematic diagram of a processing chamber 100 in accordance with at least some embodiments of the present disclosure. In some embodiments, processing chamber 100 is a plasma processing chamber, such as an etch processing chamber. However, other types of processing chambers configured for different processes can also be used or modified for use with the RF power connecting rod embodiments described herein.

[0012] In some embodiments, the processing chamber 100 is a vacuum chamber suitably adapted to maintain a subatmospheric pressure within the chamber interior volume 120 during substrate processing. The processing chamber 100 includes a chamber body 106 covered by a lid 104 that encloses a processing volume 119 located in the upper half of the chamber interior volume 120. The processing chamber 100 may also include one or more shields 105 that enclose various chamber components to prevent undesired reactions between these components and ionized processing materials. The chamber body 106 and lid 104 may be made of a metal, such as aluminum. The chamber body 106 may be grounded via a coupling to ground 115.

[0013] The substrate support 124 is disposed within the chamber interior volume 120 and supports and holds a substrate 122, such as a semiconductor wafer or other substrate held via an electrostatic or vacuum chuck. For example, the substrate support 124 may generally include a pedestal 150 and a hollow support shaft 112 that supports the pedestal 150. The pedestal 150 may include an electrostatic chuck 152 having one or more electrodes 154 disposed thereon, and a cooling plate 136. The hollow support shaft 112 provides conduits for providing, for example, backside gases, process gases, fluids, coolants, power, etc. to the pedestal 150. The substrate support 124 may include a ceramic ring 187 disposed around the electrostatic chuck 152.

[0014] In some embodiments, the hollow support shaft 112 is coupled to a lift mechanism 113, such as an actuator or motor, for vertically moving the electrostatic chuck 152 between an upper processing position (shown in FIG. 1 ) and a lower transfer position (not shown). A bellows assembly 110 is disposed around the hollow support shaft 112 and coupled between the pedestal 150 and the bottom surface 126 of the processing chamber 100 to provide a flexible seal that allows vertical movement of the pedestal 150 and prevents loss of vacuum within the processing chamber 100. The bellows assembly 110 also includes a lower bellows flange 164 that contacts an O-ring 165 or other suitable sealing element that contacts the bottom surface 126 to prevent loss of chamber vacuum.

[0015] The hollow support shaft 112 provides conduits for coupling a backside gas supply 141, a chucking power supply 140, and RF sources (e.g., an RF plasma power supply 170 and a bias power supply 117) to the pedestal 150. In some embodiments, the bias power supply 117 includes one or more RF bias power supplies. In some embodiments, the RF energy supplied by the RF plasma power supply 170 can have a frequency of about 13 MHz or greater. The backside gas supply 141 is disposed outside the chamber body 106 and supplies a heat transfer gas to the electrostatic chuck 152. In some embodiments, the RF plasma power supply 170 and the bias power supply 117 are coupled to the pedestal 150 through respective RF matching networks (only the RF matching network 116 is shown). In some embodiments, the substrate support 124 can alternatively include an AC, DC, or RF bias power supply.

[0016] RF power connecting rods 184 may be used to couple RF power between any components of the processing chamber 100. For example, the RF matching network 116 may be coupled to the RF power connecting rods 184 to provide high power, e.g., 1 kW or more, to the processing chamber 100. In some embodiments, the RF matching network 116 may be coupled to the output sensor 182 to provide RF power to the processing chamber 100 through the RF power connecting rods 184. In some embodiments, the bias power supply 117, the RF matching network 116, and the RF power connecting rods 184 may be disposed within the enclosure 158.

[0017] The substrate lift 130 can include lift pins 109 attached to a platform 108, which are mounted on a platform connected to a shaft 111 that is coupled to a second lift mechanism 132 for raising and lowering the substrate lift 130, thereby allowing the substrate 122 to be placed on and removed from the electrostatic chuck 152. The electrostatic chuck 152 can have through holes for receiving the lift pins 109. In some embodiments, a ceramic ring 187 can have through holes for receiving the lift pins 109. A bellows assembly 131 is coupled between the substrate lift 130 and the bottom surface 126 and provides a flexible seal that maintains the chamber vacuum during vertical movement of the substrate lift 130.

[0018] In some embodiments, the electrostatic chuck 152 includes a gas distribution channel 138 that extends from a lower surface of the electrostatic chuck 152 (e.g., the bottom surface of the cooling plate 136) to various openings in the upper surface of the electrostatic chuck 152. The gas distribution channel 138 is configured to supply a backside gas, such as nitrogen (N) or helium (He), to the upper surface of the electrostatic chuck 152 and act as a heat transfer medium. The gas distribution channel 138 is in fluid communication with a backside gas supply 141 via a gas conduit 142 to control the temperature and / or temperature profile of the electrostatic chuck 152 during use.

[0019] The processing chamber 100 is connected and in fluid communication with a vacuum system 114 that includes a throttle valve (not shown) and a vacuum pump (not shown) used to evacuate the processing chamber 100. The pressure within the processing chamber 100 can be adjusted by adjusting the throttle valve and / or the vacuum pump. The processing chamber 100 is also connected and in fluid communication with a process gas source 118. The process gas source 118 can supply one or more process gases to the processing chamber 100 to process a substrate disposed therein.

[0020] For example, during operation, a plasma 102 may be generated within the chamber internal volume 120 to perform one or more processes. The plasma 102 may be generated by coupling power from a plasma power source (e.g., RF plasma power source 170) to a process gas through one or more electrodes near or within the chamber internal volume 120 and igniting the process gas to generate the plasma 102. A bias power source (e.g., bias power source 117) provides bias power to the pedestal 150 to attract ions from the plasma toward the substrate 122.

[0021] FIG. 2 illustrates an isometric view of an RF power connecting rod 184 in accordance with at least some embodiments of the present disclosure. FIG. 3 illustrates a schematic cross-sectional isometric view of an RF power connecting rod 184 in accordance with at least some embodiments of the present disclosure. The RF power connecting rod 184 generally includes a first connecting rod 202 coupled to a second connecting rod 204. The first connecting rod 202 has a first connecting end 212 and a first socket end 222 opposite the first connecting end 212. In some embodiments, the first connecting rod 202 includes a first hollow portion 302 extending from the first connecting end 212 to the first socket end 222. In some embodiments, the first hollow portion 302 includes a first portion 324 and a second portion 328. In some embodiments, the first portion 324 is disposed between the second portion 328 and the first socket end 222. In some embodiments, the outer diameter of the second portion 328 is larger than the outer diameter of the first portion 324. The first connecting rod 202 is made of a conductive material such as copper or brass.

[0022] The second connecting rod 204 has a second connecting end 214 and a second socket end 224 opposite the second connecting end 214. In some embodiments, the second connecting rod 204 includes a second hollow portion 306 extending from the second connecting end 214 to the second socket end 224. The second connecting end 214 is adjustably coupled to the first connecting end 212 along an axial direction 250 of the second connecting rod 204, allowing for linear adjustment. The linear adjustment can be used to compensate for tolerance issues during assembly. In some embodiments, the second connecting end 214 is disposed in the first hollow portion 302, coupling the first connecting rod 202 to the second connecting rod 204. In some embodiments, the outer diameter of the first portion 324 is substantially the same as the outer diameter of the second connecting rod 204. The second connecting rod 204 is made of a conductive material, such as copper or brass.

[0023] In some embodiments, a conductive member 332 is disposed between the first connecting rod 202 and the second connecting rod 204 to facilitate coupling between the first connecting rod 202 and the second connecting rod 204. In some embodiments, the conductive member 332 is ring-shaped. The conductive member 332 can advantageously maintain a good electrical connection between the first connecting rod 202 and the second connecting rod 204. In some embodiments, the conductive member 332 is a biasable conductive member that provides a constant spring pressure between the first connecting rod 202 and the second connecting rod 204 to maintain a good electrical connection. In some embodiments, the biasable conductive member includes a plurality of contact surfaces and a plurality of louvers disposed therebetween.

[0024] The enclosure 158 can contain many processing chamber components in close proximity. Sharp corners and edges of power connectors can cause unwanted arcing. Therefore, the first connecting rod 202 and the second connecting rod 204 typically include rounded features and minimal sharp edges to effectively reduce or prevent arcing between the RF power connecting rod 184 and other processing chamber components. Additionally, the rounded features reduce the tendency for arcing, allowing processing chamber components to be placed closer to the RF power connecting rod 184, thereby reducing the footprint of the enclosure 158.

[0025] The RF power connecting rod 184 may be heated by the high power supplied therethrough. The RF power connecting rod 184 may advantageously include a gas passage 308 for cooling during use and facilitating the delivery of high RF power to the processing chamber. In some embodiments, the first connecting rod 202 and the second connecting rod 204 define a gas passage 308 therethrough. In some embodiments, the gas passage 308 extends from one or more gas inlets 314 in the first connecting rod 202, through the first hollow portion 302, to the second hollow portion 306, and to one or more gas outlets 318 disposed through the second connecting rod 204. In some embodiments, the one or more gas inlets 314 comprise two inlets. In some embodiments, the one or more gas outlets 318 comprise two outlets. A gas supply 310 may be coupled to the one or more gas inlets 314 to supply a cooling gas. The cooling gas may be air, an inert gas, or the like.

[0026] First plug 220 is coupled to first socket end 222. In some embodiments, first plug 220 includes a first plate 242 and a first tube 244 extending from first plate 242. In some embodiments, first socket end 222 includes an opening 248 for first plug 220 to extend therethrough. For example, in some embodiments, first plug 220 is rotatably coupled to first socket end 222 via first tube 244, which extends through and is rotatable within opening 248. In some embodiments, one or more first retaining rings 315 are disposed between first plug 220 and first socket end 222 to hold the assembly of first plug 220 and first socket end 222 together.

[0027] The second plug 226 is coupled to the second socket end 224. In some embodiments, the second plug 226 is rotatably coupled to the second socket end 224 via a second opening 342 in the second socket end 224. In some embodiments, the second plug 226 includes a second plate 262 and a second tube 348 extending from the second plate 262. In some embodiments, the second tube 348 extends into the second opening 342. In some embodiments, one or more second retaining rings 325 are disposed between the second tube 348 and the second socket end 224 to hold the assembly of the second plug 226 and the second socket end 224 together. In some embodiments, the one or more first retaining rings 315 and the one or more second retaining rings 325 are made of stainless steel.

[0028] In some embodiments, second plate 262 includes one or more holes for securing RF power connecting rod 184 to power sensor 182. In some embodiments, second plate 262 includes a post 232 extending from a side of second plate 262 opposite second tube 348. In some embodiments, vented screw 230 extends through post 232 to facilitate gas flow through second socket end 224 to cool second socket end 224 and power sensor 182 connected to second socket end 224.

[0029] In some embodiments, a housing 252 is coupled to the first socket end 222. The housing 252 is made of an insulating material and configured to facilitate coupling the RF power connection rod 184 to the processing chamber 100, such as the enclosure 158, the chamber body 106, or other chamber components. In some embodiments, the housing 252 is made of a plastic material. In some embodiments, the housing 252 includes a bottom plate 206 and a wall 264 extending from the bottom plate 206. The first plate 242 of the first plug 220 can include an opening 236 for securing the first plug 220 to the housing 252. The housing 252 can include an opening 272 for securing the housing 252 to a chamber component. In some embodiments, the opening 272 is disposed in the bottom plate 206.

[0030] In some embodiments, first plug 220 includes a third tube 256 extending from first plate 242 on a side of first plate 242 opposite first tube 244. In some embodiments, third tube 256 extends through an opening 254 in wall 264 of housing 252. In some embodiments, housing 252 includes an access tube 266 extending from a back surface 268 of wall 264 to provide access to first plug 220 for electrical connection. In some embodiments, bottom plate 206 of housing 252 includes a groove 270 corresponding to the shape of first socket end 222 to facilitate rotational movement of first socket end 222 relative to housing 252.

[0031] While the forgoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be made without departing from the basic scope thereof.

Claims

1. A radio frequency (RF) power connecting rod, a first connecting rod having a first connecting end, a first socket end opposite the first connecting end, and a first hollow portion extending from the first connecting end to the first socket end; a second connecting rod having a second connecting end, a second socket end opposite the second connecting end, and a second hollow portion extending from the second connecting end to the second socket end, the second connecting end adjustably coupled to the first connecting end along an axial direction of the second connecting rod, and gas flow passages extending from one or more gas inlets in the first connecting rod, through the first hollow portion to the second hollow portion, and to one or more gas outlets disposed through the second connecting rod; a first plug coupled to the first socket end; An RF power connection rod having a second plug coupled to the second socket end.

2. The RF power connecting rod of claim 1 , wherein a second connecting end is disposed within the first hollow portion and couples the first connecting rod to the second connecting rod.

3. 3. The RF power connecting rod of claim 2, further comprising a conductive member disposed between the first connecting rod and the second connecting rod to facilitate coupling between the first connecting rod and the second connecting rod.

4. 3. The RF power connecting rod of claim 2, wherein the first hollow portion includes a first portion and a second portion, the first portion being disposed between the second portion and the first socket end, and the second portion having a larger outer diameter than the first portion.

5. 10. The RF power connection rod of claim 1, further comprising a housing coupled to the first socket end, the housing being formed of an insulator and configured to facilitate coupling the RF power connection rod to a processing chamber.

6. 6. The RF power connecting rod of claim 5, wherein the housing is formed of a plastic material.

7. An RF power connecting rod according to any one of claims 1 to 6, wherein both the first socket end and the second socket end have an opening therethrough.

8. The RF power connecting rod of any one of claims 1 to 6, wherein the first connecting rod and the second connecting rod are formed from copper or brass.

9. 7. An RF power connecting rod according to any one of claims 1 to 6, comprising one or more first retaining rings disposed between the first plug and the first socket end, and one or more second retaining rings disposed between the second plug and the second socket end.

10. The RF power connection rod of any one of claims 1 to 6, wherein the second plug includes a second plate and a second tube extending from the second plate.

11. 7. An RF power connecting rod according to claim 1, wherein a first plug is coupled to the first socket end through an opening in the first socket end, and a second plug is coupled to the second socket end through a second opening in the second socket end.

12. 7. An RF power connecting rod according to claim 1, wherein the gas flow passages extend from one or more gas inlets in the first connecting rod, through the first hollow portion, to the second hollow portion, and to one or more gas outlets disposed through the second connecting rod.

13. 7. The RF power connection rod of claim 1, wherein a first end of the first plug extends through the first socket end and a second end of the first plug is coupled to the housing and configured to facilitate coupling the RF power connection rod to a processing chamber.

14. one or more first retaining rings disposed between the first plug and the first socket end; one or more second retaining rings disposed between the second plug and the second socket end; 7. An RF power connecting rod according to claim 1, further comprising a biasable conductive member disposed between the first connecting rod and the second connecting rod to facilitate coupling between the first connecting rod and the second connecting rod.

15. 1. A processing chamber comprising: a chamber body having an internal volume therein; a substrate support disposed within the interior volume; A processing chamber comprising an RF power connection rod according to any one of claims 1 to 6, coupled to a substrate support and adapted to provide RF power from an RF power source to the substrate support.

16. 16. The processing chamber of claim 15, comprising an RF power supply coupled to the chamber body and an RF power connecting rod.

17. 16. The processing chamber of claim 15, wherein the RF power connection rod is coupled to the RF power source through an RF match.

18. 16. The processing chamber of claim 15, wherein both the first socket end and the second socket end have an opening therethrough.

19. The processing chamber of claim 15 , wherein the RF power connection rod is disposed within the enclosure.

20. 17. The processing chamber of claim 16, further comprising an output sensor coupled to the second connecting rod.

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