Electronic component mounting equipment

Abstract

To provide an electronic component mounting device capable of continuously attaching an anisotropic conductive film (ACF) without stopping an electronic component mounting device.SOLUTION: An electronic component mounting device includes a supply device 10 that supplies a film-like electronic component, a first sticking device 50a that sticks an anisotropic conductive member to the film-like electronic component, a second sticking device 50b that sticks the anisotropic conductive member to the film-like electronic component, a mounting device 60 that mounts the film-like electronic component to which the anisotropic conductive member is adhered on a display panel D, and a transfer device 40 that receives the film-like electronic component from the supply device, adheres the component to the anisotropic conductive member by the first sticking device 50a or the second sticking device 50b, and then transfers the component to the mounting device 60.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an electronic component mounting apparatus. [Background technology]

[0002] Liquid crystal displays (LCDs) and organic light-emitting diode (OLED) displays (OLED) are widely used as displays for televisions, personal computers, and other devices. The manufacturing process for such displays includes a panel assembly process in which electronic components for driving the display panel are mounted. There are two known methods for this assembly process: a method in which the driver IC is directly mounted, and a method in which a film-type electronic component called COF (Chip On Film) is mounted on a film-type circuit board with the driver IC mounted on it.

[0003] The former is called COG (Chip On Glass) mounting because chip-type electronic components such as driver ICs are mounted on the glass substrate that constitutes the display panel, and the latter is called FOG (Film On Glass) mounting because film-type electronic components are mounted on the glass substrate. COG mounting uses an electronic component mounting device called a COG mounting device, while FOG mounting uses an electronic component mounting device called an OLB (Outer Lead Bonding) device or FOG mounting device.

[0004] Conventionally, the dividing line for display panel size was roughly 10 inches, with FOG mounting being used for large display panels over 10 inches, and COG mounting being used for small display panels under 10 inches. Therefore, even with regard to mounting equipment for mounting electronic components onto display panels, FOG mounting equipment was used for large display panels, and COG mounting equipment was used for small display panels.

[0005] In the display panel manufacturing process, there is an increasing demand for electronic component mounting equipment that can selectively perform COG mounting or FOG mounting. Here, COFs are punched out from tape-like materials and supplied. Driver ICs are supplied from trays. Therefore, such electronic component mounting equipment must be equipped with two types of supply devices: a punching supply device and a tray supply device.

[0006] In such electronic component mounting equipment, the driver IC or COF is pre-bonded to the display panel via an anisotropic conductive material called ACF (Anisotropic Conductive Film), and then mounted on the display panel by thermocompression bonding (hereinafter also referred to as final bonding). Specifically, the ACF is attached to the display panel prior to the pre-bonding, and the driver IC or COF is then pre-bonded and final bonded to the display panel. Such an ACF is a sheet-like member made of a thermosetting resin base material containing many small conductive particles, and is supplied as a tape-like member (hereinafter referred to as ACF tape) attached to a release tape.

[0007] On the other hand, there is a demand for an electronic component mounting device that can attach an ACF to a COF instead of a display panel and then mount the COF with the ACF attached to the display panel. A known example of an attachment device that attaches an ACF to a COF is disclosed in Patent Document 1. In Patent Document 1, an ACF tape with an ACF attached is supplied, and the ACF is attached to the COF. A slit is made in advance in this ACF to match the dimensions of the COF, and after the ACF is attached to the COF, the ACF attached to the COF and the ACF tape are separated by this slit when the release tape is peeled off from the COF. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-016594 Summary of the Invention [Problem to be solved by the invention]

[0009] However, when the ACF tape supplied by the application device runs out, it must be replaced with a new one. During this time, the electronic component mounting device must be stopped, which causes a temporary halt in production, which is a drawback.

[0010] An object of the present invention is to provide an electronic component mounting apparatus that can continuously apply ACF without stopping the electronic component mounting apparatus. [Means for solving the problem]

[0011] In order to achieve the above object, the electronic component mounting apparatus of the present invention comprises a supply device that supplies film-shaped electronic components, a first bonding device that bonds an anisotropic conductive material to the film-shaped electronic components, a second bonding device that bonds the anisotropic conductive material to the film-shaped electronic components, a mounting device that mounts the film-shaped electronic components with the anisotropic conductive material bonded to a display panel, and a delivery device that receives the film-shaped electronic components from the supply device and passes them to the mounting apparatus after the anisotropic conductive material has been bonded by the first bonding device or the second bonding device, The delivery device receives the film-shaped electronic component from the supply device and has a first arm that rotates, and a reference position is set on the first arm for aligning the first attachment device or the second attachment device with an attachment position where the anisotropic conductive member is attached, and the first arm receives the film-shaped electronic component from the supply device by aligning an end of the film-shaped electronic component with the reference position. . [Effects of the Invention]

[0012] The present invention makes it possible to continuously apply ACF without stopping the electronic component mounting apparatus. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a perspective view showing a film-like electronic component (A) and a chip-like electronic component (B) according to an embodiment. [Figure 2] 1 is a plan view showing the overall configuration of an electronic component mounting apparatus according to an embodiment; [Figure 3]1A is an explanatory diagram showing a process of mounting a film-type electronic component in an electronic component mounting apparatus according to an embodiment, and FIG. 1B is an explanatory diagram showing a process of mounting a chip-type electronic component. [Figure 4] 3A and 3B are explanatory views showing the punching and feeding device of the embodiment before punching and after punching, respectively. [Figure 5] 10A and 10B are explanatory diagrams illustrating a tray receiving process of the tray supplying device according to the embodiment. [Figure 6] FIG. 2 is a perspective view showing a first holding head and a second holding head of the embodiment. [Figure 7] 10A to 10C are explanatory diagrams illustrating the operation of the moving mechanism of the embodiment. [Figure 8] FIG. 2 is a plan view showing a reference position of the embodiment. [Figure 9] 1 is an explanatory diagram showing an attachment device according to an embodiment; [Figure 10] FIG. 2 is a functional block diagram showing a control device according to the embodiment. [Figure 11] 1 is a flowchart showing a mounting procedure for a film-shaped electronic component according to an embodiment. [Figure 12] 1 is a flowchart showing a mounting procedure for a film-shaped electronic component according to an embodiment. [Figure 13] 10A and 10B are explanatory diagrams showing the relationship between a reference position, a half-cut line, and an attachment position in the embodiment. [Figure 14] 1 is a flowchart showing a mounting procedure for a chip-type electronic component according to an embodiment. [Figure 15] FIG. 10 is an explanatory diagram illustrating alignment according to an embodiment. [Figure 16] FIG. 10 is an explanatory diagram showing the alignment of an ACF and a pressure head corresponding to COFs of various sizes in the prior art. DETAILED DESCRIPTION OF THE INVENTION

[0014] An embodiment of the present invention (hereinafter referred to as the present embodiment) will be specifically described with reference to the drawings. Note that the drawings are intended to show each member and each component in a schematic manner, and do not accurately show the dimensions, spacing, etc.

[0015] [composition] [Electronic components and mounting targets] The electronic components in this embodiment are a film-like electronic component F as shown in FIG. 1(A) and a chip-like electronic component C as shown in FIG. 1(B). The film-like electronic component F is a component in which electronic components are mounted on a flexible resin film and electrodes are formed on the edge of one surface. This film-like electronic component F is prepared as a component to be mounted by individually punching out a sheet-like or tape-like thin plate-like member in which multiple film-like electronic components F are integrally formed. The film-like electronic component F in this embodiment is also available in various sizes. The chip-like electronic component C is a driver IC. This chip-like electronic component C is prepared by being mounted on a tray T (see FIG. 3) in a state where it has been separated into individual products in advance.

[0016] The mounting target of the film-type electronic component F and the chip-type electronic component C is a component that electrically connects with the electrodes of the film-type electronic component F or the chip-type electronic component C. In this embodiment, the mounting target is a display panel D that constitutes a display device. In other words, it is a member that has a display function and electrodes.

[0017] [Electronic component mounting equipment] (Overall composition) The overall configuration of the electronic component mounting apparatus of this embodiment will be described with reference to Figures 2 and 3. As shown in Figure 2, the electronic component mounting apparatus includes a punching and supplying device 10, a tray supplying device 20, a delivery device 40, an adhering device 50, a mounting device 60, and a control device 80.

[0018] The punching and feeding device 10 is a device that punches out film-like electronic components F from a thin plate-like material ST and feeds the film-like electronic components F. The tray feeding device 20 is a device that feeds trays T on which chip-like electronic components C are accommodated.

[0019] The delivery device 40 is a device that receives film-like electronic components F from the punching and supplying device 10 and delivers the film-like electronic components F to the mounting device 60 via the bonding device 50. The delivery device 40 also receives chip-like electronic components C from the tray supplying device 20 and delivers them to the mounting device 60. A first holding head H1 is used to deliver the film-like electronic components F from the punching and supplying device 10 to the delivery device 40. A second holding head H2 is used to deliver the chip-like electronic components C from the tray supplying device 20 to the delivery device 40. The first holding head H1 and the second holding head H2 are detachably provided on the delivery device 40.

[0020] The bonding device 50 is a device that bonds an anisotropic conductive material called an ACF (Anisotropic Conductive Film) to the electrodes of a film-type electronic component F. The ACF is a sheet-like material that contains a large number of small conductive particles in a base resin. The mounting device 60 is a device that presses the film-type electronic component F or the chip-type electronic component C onto the display panel D that is the mounting target.

[0021] The control device 80 is a device that controls the punching and supplying device 10, the tray supplying device 20, the delivery device 40, the bonding device 50, and the mounting device 60. This control device 80 is configured, for example, by a dedicated electronic circuit or a computer that operates on a predetermined program. The control device 80 is programmed with the control contents of each part, and the program is executed by a processing device such as a PLC or CPU.

[0022] In addition, in a plane parallel to the installation surface of the electronic component mounting apparatus, the straight line from the punching and supplying apparatus 10 toward the mounting apparatus 60 is defined as the Y direction, and the direction perpendicular to this is defined as the X direction, with the axis along the Y direction being the Y axis and the axis along the X direction being the X axis. The XY plane formed by the Y axis and the X axis is parallel to the film-type electronic components F, the chip-type electronic components C, the display panel D, and the respective planes that support them. In the following description, the XY plane may also be referred to as the horizontal plane.

[0023] Furthermore, the direction perpendicular to the XY plane and pointing upward from the installation surface is defined as the Z direction, and the axis along the Z direction is defined as the Z axis. When the installation surface is horizontal, the Z axis is vertical. The Z axis is perpendicular to the film-type electronic components F, chip-type electronic components C, and display panel D and the planes that support them. In the following explanation, the Z direction is defined as upward, and the opposite direction is defined as downward. Furthermore, the rotation direction parallel to the XY plane around the Z axis is defined as the θ direction, and the rotation direction perpendicular to the XY plane around the Y axis is defined as the α direction. These directions are used to describe the positional relationships of the components of an electronic component mounting device, and do not limit the positional relationships or directions when the device is installed on the installation surface.

[0024] (Punching supply device) As shown in FIGS. 2 and 4, the punching and feeding device 10 includes a feeding section 110, a table 120, a die 130, and an elevating mechanism 140.

[0025] The supply unit 110 is a mechanism that includes a reel around which a thin plate-like material ST on which electronic components are formed is wound, and sequentially feeds out the punched portions of the electronic components (see FIG. 2). For this reason, the supply unit 110 is provided with a shaft on which the rotation center of the reel is attached and which serves as the rotation axis of the reel, and a feed roller that feeds out the thin plate-like material ST.

[0026] The table 120 is a base that supports the mold 130. The mold 130 includes a die 131 and a punch 132.

[0027] The die 131 is a flat plate-like member having a flat surface on which the thin plate-like material ST delivered from the supply unit 110 is placed, and in which a punching hole 131a is formed. The punching hole 131a is a through-hole that roughly matches the outer shape of the film-like electronic component F. The die 131 is fixed to the upper surface of the table 120, and the table 120 is provided with an opening 120a, which is a through-hole larger than the punching hole 131a, at a position corresponding to the punching hole 131a.

[0028] The punch 132 is a punching die having a substantially rectangular parallelepiped shape with an outer edge that substantially coincides with the inner edge of the punching hole 131a. The bottom surface of the punch 132 moves toward the thin plate-like material ST placed on the die 131 along the Z axis until it is inserted into the punching hole 131a, thereby punching out a film-like electronic component F from the thin plate-like material ST. Although not shown, a suction hole connected to a pneumatic circuit is formed in the bottom surface of the punch 132, and the punched film-like electronic component F is sucked and held by negative pressure.

[0029] The lifting mechanism 140 is a mechanism that moves the punch 132 along the Z axis to punch out the film-type electronic component F. The lifting mechanism 140 has a support part 141 and a drive part 142.

[0030] The support portion 141 is a component that supports the punch 132 so that it can be raised and lowered. The support portion 141 has support columns 141a and a support plate 141b. The support columns 141a are four rod-shaped members that stand upright on the die 131. The support plate 141b is a plate-shaped body that is attached to the upper ends of the support columns 141a in parallel to the upper surface of the die 131.

[0031] The drive unit 142 is connected to the punch 132 and is a device that drives the punch 132 in a direction toward and away from the die 131. An air cylinder or the like can be used as the drive source of the drive unit 142. The drive unit 142 has a shaft 142a. The shaft 142a is connected to the drive source and passes through the support plate 141b to be connected to the punch 132. The drive source moves the shaft 142a up and down, causing the punch 132 to punch out the film-type electronic component F. The lower moving end of the punch 132 is the receiving position for the first holding head H1. In other words, the punch 132 descends to suck and hold the punched film-type electronic component F, and then stops at a position where the first holding head H1 can receive it.

[0032] As shown in Fig. 2, a pair of punching and feeding devices 10 as described above are provided on the left and right sides along the X axis in a plan view. One punching and feeding device 10a and the other punching and feeding device 10b are disposed in positions sandwiching a transfer device 430, which will be described later, in a plan view. Hereinafter, when there is no need to distinguish between the punching and feeding devices 10a and 10b, they will be referred to as the punching and feeding device 10.

[0033] [Tray supply device] As shown in Fig. 5, the tray supply device 20 has a frame 210 and a gripping unit 220. The frame 210 is a pair of long, parallel members. The distance between the pair of frames 210 is approximately the width of the tray T, but allows the tray T to pass vertically. The gripping unit 220 is provided on opposing side surfaces of the frame 210, and is movable toward and away from the side surface of the tray T by a drive mechanism (not shown).

[0034] In the tray supply device 20, one tray T is held by the holding unit 220, and multiple trays T are stacked on top of it (FIG. 5(A)). The bottom surface of the lowest tray T is the surface opposite to the surface containing the chip-type electronic components C, and serves as a receiving position for the second holding head H2 (FIG. 5(B)).

[0035] 2, a pair of tray supply devices 20 as described above are provided on the left and right along the X axis in a plan view. One tray supply device 20a and the other tray supply device 20b are provided at positions sandwiching a transfer device 430, which will be described later, in a plan view. Hereinafter, when there is no need to distinguish between the tray supply devices 20a and 20b, they will be referred to as tray supply devices 20.

[0036] (Delivery device) 2 and 3, the delivery device 40 is a device that receives film-like electronic components F from the punching and supplying device 10 and delivers them to the mounting device 60 via the bonding device 50. The delivery device 40 also receives chip-like electronic components C from the tray supplying device 20 and delivers them to the mounting device 60. As shown in FIGS. 3 and 6 to 8, the delivery device 40 has a mounting unit 410, a moving mechanism 420, and a transporting device 430.

[0037] (Attachment part) The first holding head H1 or the second holding head H2 is attached to or detached from the attachment part 410. The attachment part 410 has a mounting part 411 and a locking part 412. The mounting part 411 is a cylindrical member on which the first holding head H1 or the second holding head H2 is mounted. The locking part 412 is a plurality of pins standing on the upper surface of the mounting part 411. The first holding head H1 and the second holding head H2 attached to or detached from such attachment part 410 will be described with reference to FIG. 6.

[0038] The first holding head H1 holds the film-shaped electronic component F supplied from the punching and supplying device 10 (see FIG. 3). The first holding head H1 has a holding portion H11, a connecting portion H12, and a support portion H13.

[0039] The holding portion H11 is a member having a substantially rectangular parallelepiped shape, with the longitudinal direction corresponding to the side along which the electrodes of the film-shaped electronic component F are arranged. Although not shown, suction holes connected to a pneumatic circuit are formed on the upper surface of the holding portion H11, and the punched film-shaped electronic component F is sucked and held by negative pressure.

[0040] The connecting part H12 is a substantially rectangular parallelepiped member that is placed on the mounting part 410. Although not shown, a hole into which the locking part 412 is inserted is provided on the bottom surface of the connecting part H12. The support part H13 is a substantially rectangular parallelepiped member that stands up from the upper surface of the connecting part H12 and supports the bottom part of the holding part H11.

[0041] The second holding head H2 holds the tray T supplied from the tray supply device 20 (see FIG. 3). The second holding head H2 has a holding portion H21, a connecting portion H22, and a support portion H23.

[0042] The holder H21 has a generally rectangular parallelepiped shape with the outer edge of its upper surface larger than the outer edge of the tray T. Although not shown, suction holes connected to a pneumatic circuit are formed on the upper surface of the holder H21, and the tray T is held by suction using negative pressure. The bottom surface of the tray T may have an uneven surface to prevent static electricity. In this case, since the uneven portions may not provide sufficient suction force, it is preferable to form the suction holes at positions corresponding to flat surfaces, avoiding the uneven portions. For example, suction holes may be formed at positions corresponding to the edges of the bottom surface of the tray T to ensure stable suction.

[0043] The connecting portion H22 is a substantially rectangular parallelepiped member that is placed on the mounting portion 410. Although not shown, a hole into which the locking portion 412 is inserted is provided on the bottom surface of the connecting portion H22. In other words, the connecting portions H12 and H22 of the first holding head H1 and the second holding head H2 have a common configuration so that they can be attached to and detached from the common mounting portion 410. The support portion H23 is a substantially rectangular parallelepiped member that stands up from the upper surface of the connecting portion H22 and supports the bottom of the holding portion H21.

[0044] (moving mechanism) As shown in Fig. 7(A), the movement mechanism 420 moves the mounting unit 410, to which the first holding head H1 is attached, between the punching and supplying device 10 and a transfer device 430, which will be described later. Alternatively, as shown in Fig. 7(B), the movement mechanism 420 moves the mounting unit 410, to which the second holding head H2 is attached, between the tray supplying device 20 and the transfer device 430. The movement mechanism 420 is configured by combining, for example, a drive source, a ball screw, a slider, etc., which are not shown, and is provided below the transfer device 430 so as to be movable in the X, Y, and Z directions.

[0045] (transfer device) 2, the transfer device 430 is a device that receives the film-type electronic components F held by the first holding head H1 and passes them to the mounting device 60 via the bonding device 50. The transfer device 430 is also a device that receives the chip-type electronic components C from the tray T held by the second holding head H2 and passes them to the mounting device 60.

[0046] As shown in FIGS. 2 and 3, the transfer device 430 has a first arm 431, a cleaning device B, a gauging device G, and a second arm 432.

[0047] The first arm 431 is a member that is rotatable on a surface parallel to the XY plane by a driving source such as a motor (not shown). The first arm 431 is a cross-shaped arm with four roughly rectangular parallelepiped arms extending in a cross direction from the center, and the center is fixed to a rotation axis of the driving source (not shown). Suction nozzles 431a connected to a pneumatic circuit are provided at the tips of the four arms. The suction nozzles 431a suck and hold the backsides of the electrode portions of the film-type electronic component F held by the first holding head H1 from above across the entire width in the direction in which the electrodes of the film-type electronic component F are arranged, using negative pressure from the vacuum source of the pneumatic circuit.

[0048] The first arm 431 intermittently rotates in 90° increments. More specifically, when viewed from the rotation axis of the first arm 431, the Y direction side where the punching and feeding device 10 is located is defined as the 12 o'clock direction, the first arm 431 intermittently rotates counterclockwise or clockwise so as to stop at the 12 o'clock position, the 9 o'clock position, the 6 o'clock position, and the 3 o'clock position. The first arm 431 intermittently rotates counterclockwise in the following order: it receives a film-type electronic component F from the first holding head H1 at the 12 o'clock position, has the ACF applied by the application device 50 at the 9 o'clock position, passes the film-type electronic component F with the ACF applied to it to the second arm 432 at the 6 o'clock position, and then passes the 3 o'clock position.

[0049] As shown in FIGS. 8(A) and 8(B), reference positions R1a and R1b that define the positions at which the film-type electronic component F is received are set at the tips of the four arms of the first arm 431.

[0050] The reference position R1a is, for example, a reference line parallel to the direction in which each arm extends and is set toward the right of the tip of each arm as viewed from the center of the first arm 431. When the film-type electronic component F held by suction on the first arm 431 is positioned at the 9 o'clock position by the rotation of the first arm 431, the reference position R1a is the reference position at which an ACF is adhered to the film-type electronic component F in a bonding device 50a (described later). Here, the reference position R1a is the end of the pressure head 530 of the bonding device 50a (described later) on the supply side of the tape-shaped material TP. The reference position R1a is the position at which the end of the film-type electronic component F (the right side as viewed from the center of the first arm 431) is aligned when the first arm 431 rotates counterclockwise to face the bonding device 50a (described later). This allows the film-type electronic component F, regardless of its dimensions, to be delivered to the first arm 431 so that one side of the film-type electronic component F is aligned with the reference position R1a. In other words, the film-shaped electronic component F is aligned in the X direction at the 12 o'clock position with reference to the reference position R1a, and as a result, when the first arm 431 rotates to face the adhesive device 50a, it is aligned in the Y direction with respect to the adhesive device 50a.

[0051] The reference position R1b is, for example, a reference line parallel to the direction in which each arm extends and is set toward the left of the tip of each arm as viewed from the center of the first arm 431. When the film-shaped electronic component F sucked and held by the first arm 431 is positioned at the 3 o'clock position by the rotation of the first arm 431, the reference position R1b is the reference position at which an ACF is adhered to the film-shaped electronic component F in a bonding device 50b (described later). In this case, the reference position R1b is the end of the pressure head 530 of the bonding device 50b (described later) on the supply side of the tape-shaped material TP. The reference position R1b is the position at which the end of the film-shaped electronic component F (the left side as viewed from the center of the first arm 431) is aligned when the first arm 431 rotates clockwise to face the bonding device 50b (described later). As a result, the film-shaped electronic component F is delivered to the first arm 431 so that one side of the film-shaped electronic component F is aligned with the reference position R1b, regardless of its dimensions. In other words, the film-shaped electronic component F is aligned in the X direction at the 12 o'clock position with reference to the reference position R1b, and as a result, when the first arm 431 rotates to face the adhesive device 50b, it is aligned in the Y direction with respect to the adhesive device 50b.

[0052] The cleaning device B is disposed below the first arm 431 at the 12 o'clock position. The cleaning device B is a device that removes dust and other debris adhering to the electrode portions of the punched film-type electronic components F. The cleaning device B has a brush B1. The brush B1 is provided so as to be rotatable around an axis in the X-axis direction by a driving source such as a motor (not shown). The cleaning device B is provided so as to be movable in a direction toward and away from the electrode portions of the film-type electronic components F held by the first arm 431 by a driving mechanism (not shown).

[0053] The gauging device G is disposed below the first arm 431 at the 12 o'clock position. The gauging device G has a protruding surface G1 parallel to the XZ plane. This protruding surface G1 is movable in the Y direction by a drive mechanism (not shown). As a result, the protruding surface G1 of the gauging device G pushes the film-shaped electronic component F, while it is being sucked by the suction nozzle 431a, toward the punching and feeding device 10, thereby shifting the relative position of the film-shaped electronic component F with respect to the suction nozzle 431a. That is, the gauging device G aligns the film-shaped electronic component F sucked by the suction nozzle 431a in the Y direction. As a result, when the film-shaped electronic component F faces the bonding device 50 due to the rotation of the first arm 431, it is aligned in the X direction with respect to the bonding device 50. In other words, by aligning the film-shaped electronic component F in the Y direction at the 12 o'clock position, the gauging device G aligns the film-shaped electronic component F in the X direction at the 9 o'clock position. By this alignment, the positions of the electrodes of the film-shaped electronic component F are aligned with the positions of the ACF supplied by the adhering device 50, and the ACF is adhered by the adhering device 50 with high precision.

[0054] The second arm 432 is disposed between the first arm 431 and the mounting device 60. The second arm 432 is a long member that is rotatable on a plane parallel to the XY plane by a driving source such as a motor. One end of the second arm 432 is fixed to a rotation shaft of the driving source (not shown). A rotating head 432a is provided at the tip of the second arm 432. The rotating head 432a is rotatable in the α direction around the longitudinal direction of the second arm 432 as an axis. The second arm 432 rotates intermittently in 180° increments. More specifically, it rotates intermittently in the counterclockwise or clockwise direction so as to stop at the 12 o'clock position and the 6 o'clock position.

[0055] The rotary head 432a is provided with a suction nozzle 432b that extends in the radial direction of the rotation circle. Although not shown, the suction nozzle 432b is connected to an air pressure circuit and uses negative pressure from a vacuum source to suck and hold the film-like electronic component F or chip-like electronic component C. The direction of the tip of the suction nozzle 432b can be changed 180 degrees by the rotary head 432a. In other words, the second arm 432 is configured as an inverting and transferring device that can invert the component it receives.

[0056] Therefore, when receiving a film-shaped electronic component F held by the suction nozzle 431a of the first arm 431, the suction nozzle 432b suctions and holds the electrode side of the film-shaped electronic component F from below, and when picking up chip-shaped electronic components C from the tray T held by the second holding head H2, the suction nozzle 432b suctions and holds the chip-shaped electronic components C one by one from above. That is, the punching and feeding device 10 punches out the film-shaped electronic components F with their electrode portions facing downward, and the first holding head H1 holds the film-shaped electronic components F punched out by the punching and feeding device 10 from below with their electrode portions still facing downward, and delivers them to the first arm 431. The suction nozzle 431a of the first arm 431 suctions and holds, from above, the film-shaped electronic components F held from below by the first holding head H1. Therefore, when the suction nozzle 432b receives the film-shaped electronic component F from the suction nozzle 431a, the film-shaped electronic component F is held from above by the suction nozzle 431a with the electrode portions facing downward, so the suction nozzle 432b suction-holds the electrode side from below. Also, the tray T held by the second holding head H2 contains chip-shaped electronic components C with their electrode portions facing upward, so the suction nozzle 432b suction-holds the chip-shaped electronic components C from above.

[0057] When the suction nozzle 432b suction-holds the film-type electronic component F, the rotary head 432a reaches the mounting device 60 with the electrode side facing downward. In other words, in this case, the rotary head 432a is not inverted. When the suction nozzle 432b suction-holds the chip-type electronic component C, the rotary head 432a turns the electrode side of the chip-type electronic component C downward before reaching the mounting device 60. In other words, in this case, the rotary head 432a is inverted.

[0058] [Application device] The bonding device 50 bonds an ACF to an electrode portion of a film-shaped electronic component F held by a suction nozzle 431a of a first arm 431. In this embodiment, a pair of bonding devices 50 are provided on the left and right sides along the X-axis in a plan view. One bonding device 50a and the other bonding device 50b are provided at positions sandwiching the transfer device 430 in a plan view. Specifically, the bonding device 50a is provided at the 9 o'clock position of the first arm 431, and the bonding device 50b is provided at the 3 o'clock position of the first arm 431. Hereinafter, when there is no need to distinguish between the bonding devices 50a and 50b, they will be referred to as the bonding device 50. As shown in FIG. 9 , the bonding device 50 includes a supply unit 51, a cutting unit 52, a bonding unit 53, a peeling unit 54, a conveying unit 55, and a recovery unit 56. The bonding device 50 shown in FIG. 9 is a bonding device 50a, and the bonding device 50b will be described as having a configuration symmetrical to the bonding device 50a with respect to the YZ plane.

[0059] (Supply Department) The supply unit 51 supplies the tape-shaped material TP to the adhering unit 53. The tape-shaped material TP is, for example, an adhesive tape T1 made of ACF adhered to a release tape T2. The release tape T2 is a tape that can be peeled off from the adhesive tape T1 and is formed of a resin film such as polyimide. The width of the tape-shaped material TP in this embodiment is approximately 0.5 to 3.5 mm.

[0060] The supply unit 51 has a supply reel 510, a tension mechanism 511, and path rollers 512. The supply reel 510 is a reel that winds the tape-shaped material TP and rotates to feed out the tape-shaped material TP. The tension mechanism 511 applies tension to the tape-shaped material TP. The tension mechanism 511 is a pair of rollers that are arranged at a distance above and below to guide the movement of the tape-shaped material TP as it is pulled out from the supply reel 510. One roller is a fixed roller 511a that does not move up and down, and the other roller is a movable roller 511b that can move up and down. The movable roller 511b moves up and down by a lifting mechanism (not shown). In other words, it moves in the direction of the black arrow in the figure. The path rollers 512 are rollers that change the direction of movement of the tape-shaped material TP from the tension mechanism 511 and feed it out toward the cutting unit 52.

[0061] (cutting part) The cutting unit 52 cuts the adhesive tape T1 of the tape-shaped material TP. Cutting only the adhesive tape T1 in this manner is hereinafter referred to as a half cut, and the slits formed in the adhesive tape T1 by the cutting unit 52 are referred to as half-cut lines HC. These half-cut lines HC are formed at intervals corresponding to the dimensions of the film-shaped electronic component F. The intervals between the half-cut lines HC are approximately the same as the length of the sides of the film-shaped electronic component F that are connected to the display panel. In other words, the intervals between the half-cut lines HC are determined according to the dimensions of the sides of the film-shaped electronic component F that are connected to the display panel to be mounted.

[0062] The cutting unit 52 is provided upstream of the adhering unit 53 and includes a cutter 520 and a backup member 521. The cutter 520 is a member that cuts the adhesive tape T1 in the width direction. That is, the blade at the tip of the cutter 520 extends in the width direction of the tape-shaped material TP. The cutter 520 moves the blade at the tip of the cutter 520 toward and away from the adhesive tape T1 by a movement mechanism (not shown). As described above, the cutter 520 forms half-cut lines HC on the tape-shaped material TP supplied by the supply unit 51 in accordance with the dimensions of the film-shaped electronic component F. The backup member 521 is a block having a substantially rectangular parallelepiped shape. The backup member 521 sandwiches the tape-shaped material TP between itself and the cutter 520 and has a flat surface 521a that comes into contact with the release tape T2.

[0063] (Attaching part) The adhering unit 53 adheres the adhesive tape T1 of the tape-shaped material TP to the electrode portion of the film-shaped electronic component F. The adhering unit 53 has a pressure head 530 and a backup member 531. The pressure head 530 is moved up and down by a lifting device (not shown). The tape-shaped material TP is pushed up, and the adhesive tape T1 is heated and pressed against the electrode portions of the film-shaped electronic component F. To this end, the pressure head 530 is provided with a heater (not shown) so that the contact surface with the tape-shaped material TP is heated to a predetermined temperature. Furthermore, a buffer member 530a is provided on the contact surface of the pressure head 530 with the tape-shaped material TP. This buffer member 530a is, for example, a sheet made of an elastic material, and prevents the adhesive tape T1, softened by heating, from adhering to the pressure head 530. The backup member 531 is a member that supports the first arm 431 from above when the pressure head 530 heats and presses the adhesive tape T1 to the electrode portions of the film-shaped electronic component F. The backup member 531 has a pair of support rollers 531a positioned opposite the pressure head 530, and the outer circumferential surfaces of the support rollers 531a support the upper surface of the first arm 431, which rotates to be aligned with the bonding device 50 and holds the film-shaped electronic component F by the suction nozzle 431a.

[0064] A sticking position R2 is set in the sticking unit 53. The sticking position R2 is a reference position where the half-cut line HC of the adhesive tape T1 on the tape-shaped material TP is aligned by the transport unit 55 described below, and in this case, it is the position of the end of the pressure head 530 on the supply unit 51 side in the running direction of the tape-shaped material TP.

[0065] (peeling part) The peeling unit 54 peels the release tape T2 from the adhesive tape T1 attached to the film-shaped electronic component F. The peeling unit 54 has peeling bars 540 and 541. The peeling bars 540 and 541 are, for example, round bars that come into contact with the release tape T2. The peeling bar 540 comes into contact with the front surface of the release tape T2, i.e., the surface on the adhesive tape T1 side, and the peeling bar 541 comes into contact with the back surface of the release tape T2. The peeling bars 540 and 541 are moved horizontally by a moving mechanism (not shown) toward the upstream side of the tape-shaped member TP (in the direction of the dotted arrow) while sandwiching the release tape T2, as shown in FIG. 9, thereby peeling the release tape T2 from the adhesive tape T1 that has been pressure-bonded to the film-shaped electronic component F.

[0066] (Transportation section) The transport unit 55 transports the tape-shaped material TP from the supply unit 51 to the recovery unit 56 via the bonding unit 53. In particular, the transport unit 55 transports the tape-shaped material TP to the bonding unit 53 so that the half-cut line HC is aligned with the bonding position R2. The transport unit 55 has a feed roller 550 and a feed motor (not shown). The feed roller 550 sandwiches the release tape T2 between a pair of rollers and moves the tape-shaped material TP from the supply unit 51 side to the recovery unit 56 side by rotating the rollers. The feed motor is a drive source that rotates the feed roller 550. The feed motor has a rotation shaft connected to the feed roller 550, and the rotation shaft rotates around the axis when driven by the motor, thereby rotating the feed roller 550 around the rotation axis.

[0067] (Collection Department) The recovery unit 56 recovers the release tape T2 peeled off from the adhesive tape T1 adhered to the electrode portions of the film-shaped electronic component F in the adhering unit 53. The recovery unit 56 has a recovery reel 560 and a path roller 561. The recovery reel 560 is a reel that winds up and recovers the release tape T2. The path roller 561 is a roller that changes the movement direction of the release tape T2 from the adhering unit 53 side and feeds it toward the recovery reel 560.

[0068] [Mounting equipment] As shown in FIGS. 2 and 3, the mounting device 60 is a device for thermocompression bonding the electrodes of the film-type electronic component F or the electrodes of the chip-type electronic component C to the electrodes of the display panel D via the ACF.

[0069] The mounting device 60 has a table 610 and a pressure bonding unit 620. The table 610 is a horizontal plate-like body on which the display panel D is placed. Although not shown, suction holes connected to an air pressure circuit are formed on the top surface of the table 610, and the display panel D is held by suction using negative pressure. The table 610 is provided so as to be movable in directions along the X-axis, Y-axis, and θ direction by a drive mechanism not shown.

[0070] 3, the pressure bonding section 620 has a pressure member 621 and a backup 622. The pressure member 621 uses a drive mechanism (not shown) to overlay the film-type electronic components F or chip-type electronic components C on the display panel D supported on the table 610, and applies heat and pressure. The pressure member 621 adsorbs and holds the film-type electronic components F or chip-type electronic components C using a holding section (not shown), and is heated by a heating device (not shown). The backup 622 is a member that supports the display panel D when the pressure member 621 heat-pressure bonds the film-type electronic components F or chip-type electronic components C via the ACF.

[0071] Although detailed description will be omitted in this embodiment, when the chip-type electronic components C are heat-pressed, it is assumed that an ACF is previously attached to the display panel D. Also, when the film-type electronic components F are heat-pressed, an ACF may be previously attached to the display panel D. In this case, the ACF is not attached by the attachment device 50.

[0072] The crimping unit 620 is a device for performing temporary crimping before final crimping. After the temporary crimping by the crimping unit 620, a final crimping is performed by a final crimping unit (not shown) arranged downstream.

[0073] [Control device] 10, the control device 80 has a mechanism control unit 81, a memory unit 82, and an input / output control unit 83. The mechanism control unit 81 controls the operation of each unit of the punching supply device 10, the tray supply device 20, the delivery device 40, the bonding device 50, and the mounting device 60. The memory unit 82 stores information necessary for control of this embodiment, such as programs and data for implementing each of the above units. The input / output control unit 83 is an interface that controls signal conversion and input / output between each unit to be controlled.

[0074] Furthermore, an input device 91 and an output device 92 are connected to the control device 80. The input device 91 is input means such as a switch, touch panel, keyboard, mouse, etc., which the operator uses to operate the electronic component mounting device via the control device 80. The output device 92 is output means such as a display device that makes information for checking the status of the electronic component mounting device visible to the operator.

[0075] [Effect] The operation of the electronic component mounting apparatus as described above will be explained separately for the case where a film-type electronic component F is mounted and the case where a chip-type electronic component C is mounted.

[0076] (Mounting of film-type electronic components) First, the procedure for mounting the film-shaped electronic component F will be described with reference to FIG. 3(A) and FIGS. 11 to 13. It is assumed that the first holding head H1 is pre-mounted on the mounting unit 410. The transport unit 55 positions the tape-shaped material TP, on which a half-cut line HC has been formed, so that the half-cut line HC is at the attachment position R2. As shown in FIG. 11, the movement mechanism 420 moves the first holding head H1 mounted on the mounting unit 410 so that it is directly below the punching and feeding device 10 (step S01). The punching and feeding device 10 punches out the film-shaped electronic component F (step S02). The punched film-shaped electronic component F descends while being sucked by the punch 132, and when the suction is released, it is sucked by the holding portion H11 of the first holding head H1. The first holding head H1 then receives the film-shaped electronic component F (step S03).

[0077] The movement mechanism 420 moves the first holding head H1 that has received the film-type electronic component F to below the suction nozzle 431a at the end of the first arm 431 (step S04). That is, the movement mechanism 420 moves the first holding head H1 so that the film-type electronic component F is located directly below the suction nozzle 431a of the arm that is positioned at the 12 o'clock position among the four arms of the first arm 431.

[0078] Furthermore, the moving mechanism 420 positions the film-shaped electronic component F in the X direction so that the end of the film-shaped electronic component F is aligned with the reference position R1a or R1b of the first arm 431 (step S05). Whether the end of the film-shaped electronic component F is aligned with the reference position R1a or R1b depends on the rotation direction of the first arm 431. That is, when the first arm 431 is rotated counterclockwise to bring the film-shaped electronic component F into opposition to the bonding device 50a, the end of the film-shaped electronic component F (the right side as viewed from the center of the first arm 431) is aligned with the reference position R1a. When the first arm 431 is rotated clockwise to bring the film-shaped electronic component F into opposition to the bonding device 50b, the end of the film-shaped electronic component F (the left side as viewed from the center of the first arm 431) is aligned with the reference position R1b. After aligning the end of the film-shaped electronic component F with the reference position R1a or R1b, the holding portion H11 of the first holding head H1 releases suction and the suction nozzle 431a performs suction, so that the first arm 431 receives the film-shaped electronic component F with the end of the film-shaped electronic component F aligned with the reference position R1a or R1b (step S06).

[0079] Next, at the 12 o'clock position, the cleaning device B rises and the rotating brush B1 comes into contact with the electrode portion of the film-type electronic component F, thereby cleaning the electrode portion of the film-type electronic component F (step S07). Furthermore, when the cleaning device B finishes cleaning and descends, the protruding surface G1 of the gauging device G moves toward the 12 o'clock position and comes into contact with the film-type electronic component F, thereby aligning the film-type electronic component F sucked by the suction nozzle 431a in the Y direction (step S08).

[0080] 12, the attachment of the ACF to the film-shaped electronic component F and the temporary pressure-bonding of the film-shaped electronic component F to the display panel D will be described. After cleaning by the cleaning device B and alignment by the gauging device G at the 12 o'clock position are completed, the first arm 431 is rotated counterclockwise or clockwise to position the film-shaped electronic component F on the attachment device 50a provided at the 9 o'clock position or the attachment device 50b provided at the 3 o'clock position (step S11). More specifically, the upper surface of the first arm 431 enters between the backup member 531 and the tape-shaped member TP while abutting against the support roller 531a, and the film-shaped electronic component F and the first arm 431 holding the film-shaped electronic component F by suction are positioned in a sandwiched manner.

[0081] At this time, the reference position R1a or R1b set for the first arm 431 is set to a position where the ACF will be applied when the first arm 431 is rotated and positioned in the application device 50 with the first arm 431 at the 12 o'clock position, so the reference position R1a or R1b set for the first arm 431 and the application position R2 set for the pressure head 530 coincide with each other. Also, as described above, the tape-shaped material TP on which the half-cut line HC is formed is positioned so that the half-cut line HC is at the application position R2. That is, as shown in FIG. 13(A), the reference position R1a, the half-cut line HC, and the application position R2 all coincide with each other. Also, as shown in FIG. 13(B), the reference position R1b, the half-cut line HC, and the application position R2 all coincide with each other. This allows the adhering device 50 to adhere ACF to film-shaped electronic components F of different dimensions without having to control the alignment of the half-cut line HC of the tape-shaped material TP or provide a movement mechanism to move the end of the pressure head 530 each time the dimensions of the film-shaped electronic component F change.

[0082] In this state, the support roller 531a of the backup member 531 supports the upper surface of the first arm 431. Next, the pressure head 530 is raised (step S12), pushing up the tape-shaped material TP from the release tape T2 side, and the half-cut adhesive tape T1 is adhered to the electrode portions of the film-shaped electronic component F (step S13). After the adhesive tape T1 has been adhered, the pressure head 530 is lowered and the peeling bars 540, 541 are moved horizontally upstream of the tape-shaped material TP, thereby peeling the release tape T2 from the adhesive tape T1 adhered to the electrode portions of the film-shaped electronic component F (step S14). In this way, the adhesive tape T1, i.e., the ACF, is adhered to the film-shaped electronic component F.

[0083] After the ACF is attached to the film-shaped electronic component F, the first arm 431 is rotated to position the film-shaped electronic component F at the 6 o'clock position, and the film-shaped electronic component F is moved above the suction nozzle 432b of the second arm 432, which is waiting at the 12 o'clock position (step S15). Then, suction by the suction nozzle 431a of the first arm 431 is released, and suction by the suction nozzle 432b is performed, thereby transferring the film-shaped electronic component F to the second arm 432 (step S16).

[0084] The second arm 432 rotates 180° in the XY plane to move the film-shaped electronic component F to the pressure-bonding section 620 of the mounting device 60 (step S17). The suction by the suction nozzle 432b of the second arm 432 is released, and the pressure member 621 performs suction, thereby holding the film-shaped electronic component F on the pressure member 621. Then, the pressure member 621 that has suctioned the film-shaped electronic component F descends, thereby thermocompression-bonding the electrodes of the film-shaped electronic component F to the electrodes of the display panel D via the ACF (step S18). After the suction by the pressure member 621 is released, the display panel D to which the film-shaped electronic component F has been temporarily pressure-bonded is transported to the full-pressure-bonding section and full-pressure-bonding is performed.

[0085] The supply of the film-shaped electronic components F is first carried out by one of the punching and supplying devices 10a. Then, when the supply section 110 of the punching and supplying device 10a runs out of thin plate-shaped materials ST, the supply is switched to the other punching and supplying device 10b, which continues to supply the film-shaped electronic components F. During this time, the reel of thin plate-shaped materials ST of the punching and supplying device 10a is replaced, and when the other punching and supplying device 10b runs out of thin plate-shaped materials ST, the supply of film-shaped electronic components F is switched back to the punching and supplying device 10a. This allows mounting to be carried out continuously without stopping the electronic component mounting apparatus.

[0086] 2, the supply and application of the tape-shaped material TP is first performed by one of the application devices 50a. Then, when the supply unit 51 of the application device 50a runs out of tape-shaped material TP, the application device switches to the other application device 50b, which continues to supply the tape-shaped material TP. In this case, as shown in FIG. 8(B), the rotation direction of the first arm 431 becomes clockwise, and the position where the end of the film-shaped electronic component F is aligned is changed from reference position R1a to reference position R1b. This allows ACF application to be continued without stopping the electronic component mounting apparatus. During this time, when the reel of tape-shaped material TP of the adhesive device 50a is replaced and the tape-shaped material TP of the other adhesive device 50b runs out, the adhesive device 50a switches back to supplying the tape-shaped material TP, and as shown in Figure 8(A), the rotation direction of the first arm 431 becomes counterclockwise again, and the position where the end of the film-shaped electronic component F is aligned is returned from the reference position R1b to the reference position R1a.

[0087] (Mounting of chip-type electronic components) Next, the procedure for mounting the chip-type electronic components C will be described with reference to FIGS. 3(B), 5, and 14. It is assumed that the second holding head H2 has been previously attached to the mounting unit 410. As shown in FIG. 5(A), the movement mechanism 420 moves the second holding head H2 attached to the mounting unit 410 so that it is located directly below the tray supply device 20 (step S21). As shown in FIG. 5(B), in the tray supply device 20, the holding portion H21 of the second holding head H2 comes into contact with the bottom surface of the lowest tray T and holds it by suction (step S22). Then, the holding portion H21 of the second holding head H2 receives the tray T by the following procedure (step S23).

[0088] As shown in Fig. 5(C), the tray supply device 20 releases the gripping by the gripping section 220. Then, as shown in Fig. 5(D), the second holding head H2 descends by the distance of one tray T. As shown in Fig. 5(E), the gripping section 220 grips the tray T one tray above the lowest tray T with the gripping section 220. As shown in Fig. 5(F), the second holding head H2 descends and hands the tray T over to the holding section H21.

[0089] The movement mechanism 420 moves the second holding head H2 that has received the tray T to below the suction nozzle 432b of the second arm 432 (step S24). That is, the movement mechanism 420 moves the second holding head H2 so that the tray T is located below the suction nozzle 432b of the second arm 432 that is positioned at the 12 o'clock position described above. The suction nozzle 432b of the second arm 432 faces the tray T held by the second holding head H2 due to the rotation of the rotary head 432a.

[0090] The moving mechanism 420 sequentially positions each chip-type electronic component C on the tray T at a position facing the suction nozzle 432b of the second arm 432. Note that this positioning is performed by a scanning unit (not shown) scanning the tray T. More specifically, the tray T is provided with storage sections divided into a grid pattern, and the chip-type electronic components C are stored in these storage sections. Each storage section is sequentially positioned at a position where the suction nozzle 432b of the second arm 432 will receive the chip-type electronic component C, that is, at a position directly below the suction nozzle 432b when the second arm 432 stops at the 12 o'clock position. Then, once one storage section on the tray T is positioned, the suction nozzle 432b starts suction, and the chip-type electronic component C is transferred to the second arm 432 (step S25).

[0091] The second arm 432 rotates 180° in the XY plane to move the chip-type electronic component C to the pressure-bonding unit 620 of the mounting apparatus 60 (step S26). During this movement, the rotary head 432a rotates in the α direction, and the chip-type electronic component C is inverted so that the electrodes thereof face downward. The suction by the suction nozzle 432b of the second arm 432 is released, and the pressure member 621 of the pressure-bonding unit 620 performs suction, thereby holding the chip-type electronic component C. Then, the electrode portions of the chip-type electronic component C are thermocompression-bonded to the electrodes of the display panel D via the ACF (step S27). After the suction by the pressure member 621 is released, the display panel D to which the chip-type electronic component C has been temporarily compressed is transported to the final compression-bonding unit for final compression-bonding.

[0092] When the removal of the chip-type electronic components C from one tray T is completed, the moving mechanism 420 transports the second holding head H2 holding the empty tray T to a storage unit for empty trays T prepared in the tray supply device 20 and delivers the tray T to this storage unit. Then, as described above, the moving mechanism 420 causes the second holding head H2 to receive the tray T containing the chip-type electronic components C and performs mounting on the tray T. The storage unit for empty trays T can be provided, for example, adjacent to the tray supply device 20 and configured in the same manner as the tray supply device 20. With this configuration, empty trays T can be stacked and stored in the reverse order of the tray supply device 20, that is, in the order of (F), (E), (D), (C), (B), and (A) in FIG. 5.

[0093] Such supply of trays T is first performed by one of the tray supply devices 20a. Then, when the trays T containing the chip-like electronic components C run out from the tray supply device 20a, the other tray supply device 20b is switched to continue supplying trays T. During this time, the trays T of the tray supply device 20a are replaced, and when the trays T of the other tray supply device 20b run out, the supply of trays T is switched back to the tray supply device 20a. This allows mounting to be continued without stopping the electronic component mounting apparatus.

[0094] [effect] (1) The electronic component mounting apparatus of this embodiment includes a supply device that supplies film-shaped electronic components F, a first bonding device 50a that bonds an anisotropic conductive material to the film-shaped electronic components F, a second bonding device 50b that bonds the anisotropic conductive material to the film-shaped electronic components F, a mounting device 60 that mounts the film-shaped electronic components F with the anisotropic conductive material bonded to them on a display panel D, and a delivery device 40 that receives the film-shaped electronic components F from the punching supply device 10 and passes them to the mounting device 60 after the anisotropic conductive material has been bonded to them by the first bonding device 50a or the second bonding device 50b.

[0095] As a result, even if the first bonding device 50a runs out of tape-shaped material TP, the second bonding device 50b can continue to bond the adhesive tape T1, i.e., the ACF, thereby improving productivity. Furthermore, since the first bonding device 50a can be replenished with tape-shaped material TP while the second bonding device 50b is bonding the ACF, the ACF can be continuously bonded without stopping the electronic component mounting apparatus. Furthermore, even if the first bonding device 50a breaks down, the second bonding device 50b can be operated, so there is no risk of an immediate drop in productivity.

[0096] (2) In this embodiment, the delivery device 40 is set with a reference position for aligning with the attachment position R2 where the first attachment device 50a or the second attachment device 50b attaches the anisotropic conductive material, and the delivery device 40 receives the film-shaped electronic component F from the supply device by aligning the end of the film-shaped electronic component F with the reference position.

[0097] In conventional technology, when adhering ACF to COFs of various sizes, it was necessary to align the edge of the pressure head with the slit in the ACF each time the COF size changed. For example, as shown in Figure 16, to accommodate COFs of different sizes, it was necessary to adjust the edge of the COF to align the slit in the ACF with the edge of the COF, and to add a movement mechanism to align the edge of the pressure head with the slit in the ACF, and to adjust this, which required time and effort.

[0098] On the other hand, in the electronic component mounting device of this embodiment, as shown in Fig. 15, even if the dimensions of the film-shaped electronic component F vary, its end can be aligned with the reference position R1. Therefore, even if the dimensions of the supplied film-shaped electronic component F change, the ACF can be accurately adhered to the film-shaped electronic component F without providing a movement mechanism for moving the pressure head 530 of the bonding device 50. This saves the time and effort required to align the pressure head 530 of the bonding device 50, thereby improving productivity, and also reduces costs by eliminating the movement mechanism for moving the pressure head 530.

[0099] (3) The reference positions in this embodiment include a first reference position R1a for aligning with the adhering position R2 of the first adhering device 50a and a second reference position R1b for aligning with the adhering position R2 of the second adhering device 50b. By providing a reference position for each adhering device 50 in this manner, the adhering devices 50 can be freely positioned in the overall configuration of the electronic component mounting apparatus. In particular, by providing the reference positions R1a and R1b symmetrically on the first arm 431, the adhering devices 50a and 50b can be provided symmetrically on the delivery device 40, thereby making effective use of space.

[0100] (4) The delivery device 40 of this embodiment includes a first arm 431 that receives the film-shaped electronic component F from the punching and supplying device 10, and a gauging device G that adjusts the position at which the first arm 431 receives the film-shaped electronic component F while aligning the end of the film-shaped electronic component F with the reference position R1. This makes it possible to align the anisotropically conductive member and the film-shaped electronic component F in the width direction of the anisotropically conductive member as well.

[0101] (5) The electronic component mounting apparatus of this embodiment further includes a tray supply device 20 that supplies trays T containing chip-type electronic components C, and the delivery device 40 receives the chip-type electronic components C from the tray supply device 20 and passes them to the mounting device 60, which then mounts the chip-type electronic components C on a display panel D to which an anisotropic conductive member has been previously attached. This makes it possible to selectively mount a film-type electronic component F to which an anisotropic conductive member has been attached on a display panel D, or mount a chip-type electronic component C on a display panel D to which an anisotropic conductive member has been attached.

[0102] [Variations] (1) In the above embodiment, a configuration has been described in which one punching supply device 10a and the other punching supply device 10b are simply alternately switched over, but it is also possible to mount thin plate-like members ST on which film-like electronic components F of different dimensions are formed on one punching supply device 10a and the other punching supply device 10b. According to this embodiment, it is not necessary to align the cuts in the ACF with the end of the COF every time the COF dimensions change, so it is possible to easily mount a plurality of film-like electronic components F of different dimensions on the display panel D without stopping the electronic component mounting apparatus.

[0103] (2) In the above embodiment, the punching and feeding device 10 that punches out the film-shaped electronic components F from the thin plate-shaped member ST is used as the configuration for feeding the film-shaped electronic components F, but this is not limited to this. For example, a feeding device that feeds the film-shaped electronic components F that have been punched out from the thin plate-shaped member ST in advance may be used.

[0104] (3) The bonding device 50 in the above embodiment includes the supply unit 51, the cutting unit 52, the bonding unit 53, the peeling unit 54, the conveying unit 55, and the collection unit 56, but is not limited to this. The bonding device 50 only needs to include at least the bonding unit 53, and the other components, i.e., the supply unit 51, the cutting unit 52, the peeling unit 54, the conveying unit 55, and the collection unit 56, may be configured differently from those of the bonding device 50.

[0105] (4) In the above embodiment, the adhesive tape T1 has the half-cut line HC formed thereon by the cutting portion 52, but this is not limited to this. The adhesive tape T1 may have cuts formed in advance to match the dimensions of the film-shaped electronic component F. Also, the adhesive tape T1 does not necessarily have to have cuts formed thereon. For example, the adhesive tape T1 may have countless tiny holes drilled all over its surface, and may be torn apart by the peel-off portion 54 at the edge of the film-shaped electronic component F.

[0106] (5) In the above embodiment, when the supply unit 51 of the bonding device 50a runs out of tape-shaped material TP, the bonding device 50a switches to the bonding device 50b. However, this is not limited to this. The bonding devices 50a and 50b may be operated in parallel. For example, first, the end of the film-shaped electronic component F is aligned with the reference position R1a and the first arm 431 is rotated counterclockwise. The bonding device 50a bonds the ACF to the film-shaped electronic component F, and then the film-shaped electronic component F is handed over to the second arm. Thereafter, the end of the film-shaped electronic component F is aligned with the reference position R1b and the first arm 431 is rotated clockwise. The bonding device 50b bonds the ACF to the film-shaped electronic component F, and then the film-shaped electronic component F is handed over to the second arm. In this case, even if one bonding device 50 breaks down, the other bonding device 50 can continue to operate.

[0107] (6) The electronic component mounting device is not limited to a configuration in which the first holding head H1 and the second holding head H2 are interchangeable, as long as they have the mounting units 410. For example, the device may have multiple mounting units 410, with the first holding head H1 fixed to one side and the second holding head H2 fixed to the other side. This makes it possible to switch between mounting film-type electronic components F and mounting chip-type electronic components C without having to exchange the first holding head H1 and the second holding head H2.

[0108] (7) The moving mechanisms 420 may be provided in pairs in the X-axis direction, sandwiching the transfer device 430. That is, one moving mechanism 420 may be provided corresponding to the punching and feeding device 10a and tray supply device 20a on one side, and the other moving mechanism 420 may be provided corresponding to the punching and feeding device 10b and tray supply device 20b on the other side. Note that the first holding head H1 and the second holding head H2 may also be provided in pairs, each corresponding to a pair of moving mechanisms 420.

[0109] (8) Because the movement paths of the film-type electronic components F and the chip-type electronic components C are common to the second arm 432, cameras for capturing images of the film-type electronic components F and the chip-type electronic components C can be installed at the two stop positions (12 o'clock and 6 o'clock positions) of the second arm 432, allowing for positioning and other tasks to be performed using a common camera. For example, at the 12 o'clock position, a pre-alignment camera is installed above the suction nozzle 432b. When the film-type electronic component F is held by the suction nozzle 432b, this camera captures images of alignment marks provided on both ends of the electrode portions of the film-type electronic component F, and recognizes the position of the film-type electronic component F based on these alignment marks. Recognition can be performed by the control device 80 using a known image recognition technique. Based on this recognized position, the relative positions of the suction nozzle 432b and the pressure member 621 are adjusted when the film-type electronic component F is handed over to the pressure member 621. By doing so, the accuracy of the position at which the film-type electronic component F is delivered to the pressure member 621 can be ensured.

[0110] Furthermore, when the chip-type electronic component C is taken out of the tray T, an image of the alignment mark provided on the electrode surface of the chip-type electronic component C is captured, and the position of the chip-type electronic component C is recognized based on this alignment mark. Based on this recognized position, the relative position of the suction nozzle 432b and the chip-type electronic component C when the chip-type electronic component C is taken out is adjusted. In this way, the accuracy of the position at which the film-type electronic component F is delivered to the pressure member 621 can be ensured.

[0111] Meanwhile, a pair of simultaneous recognition cameras is placed at the 6 o'clock position for temporary pressure bonding. The simultaneous recognition camera simultaneously captures and images within its field of view the alignment marks provided on one end of the electrode portions of the film-type electronic component F and the chip-type electronic component C, and the corresponding alignment marks on the display panel D. The pair of simultaneous recognition cameras is placed corresponding to the alignment marks on both ends of the film-type electronic component F and the chip-type electronic component C. This ensures accuracy whether the film-type electronic component F is temporarily pressure bonded or the chip-type electronic component C is temporarily pressure bonded.

[0112] [Other embodiments] Although the embodiments of the present invention and modifications of each part have been described above, these embodiments and modifications of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and modifications are included within the scope and spirit of the invention, and are also included in the invention described in the claims. [Explanation of symbols]

[0113] 10, 10a, 10b punching supply device 20, 20a, 20b Tray supply device 210 frames 220 Gripping part 40 Delivery device 410 Mounting part 420 Moving mechanism 430 Transfer device 431 First Arm 431a Suction nozzle 432 Second Arm 432a Rotating Head 432b Suction nozzle 50, 50a, 50b pasting device 51 Supply section 52 Cut section 53 Adhesive part 54 Peeling section 55 Conveyor 56 Recovery Department 60 Mounting equipment 80 Control device 91 Input Device 92 Output Devices B Cleaning device C Chip-type electronic components D Display panel F Film-type electronic components G Gauging Device H1 First holding head H2 Second holding head ST Thin plate member T-Tray

Claims

1. a supply device for supplying film-type electronic components; a first attachment device that attaches an anisotropic conductive member to the film-shaped electronic component; a second attachment device that attaches an anisotropic conductive member to the film-shaped electronic component; a mounting device that mounts the film-shaped electronic component having the anisotropic conductive member attached thereto on a display panel; a delivery device that receives the film-shaped electronic component from the supply device, and passes the film-shaped electronic component to the mounting device after the anisotropic conductive member has been attached by the first attachment device or the second attachment device; Equipped with the delivery device has a first arm that receives the film-shaped electronic component from the supply device and rotates; a reference position is set on the first arm for aligning the first arm with an attachment position where the first attachment device or the second attachment device attaches the anisotropic conductive member; The first arm is an electronic component mounting device that receives the film-shaped electronic component from the supply device by aligning an end of the film-shaped electronic component with the reference position.

2. The reference position is a first reference position for aligning with the adhering position of the first adhering device; a second reference position for aligning with the adhering position of the second adhering device; The electronic component mounting device according to claim 1 , comprising:

3. The delivery device is a gauging device that adjusts the position at which the first arm receives the film-type electronic component while aligning the end of the film-type electronic component with the reference position; Equipped with The electronic component mounting device according to claim 1 .

4. The bonding device is a backup member for supporting the first arm that has received the film-shaped electronic component; The backup member has a pair of support rollers, and supports the first arm on the outer circumferential surfaces of the support rollers. The electronic component mounting device according to claim 1 .

5. The apparatus further includes a tray supply device for supplying trays containing chip-type electronic components, the delivery device receives the chip-type electronic components from the tray supply device and delivers them to the mounting device; the mounting apparatus mounts the chip-type electronic components on a display panel to which an anisotropic conductive member has been attached in advance; 5. The electronic component mounting device according to claim 1.

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