EL stands for device, electronic machine

Abstract

To provide a display device with extremely high definition, a display device with higher display quality, a display device with an improved viewing angle characteristic, or a display device that is bendable.SOLUTION: Subpixels with the same color are arrayed in a zig-zag manner with respect to a predetermined direction. That is to say, when a certain subpixel is focused, two subpixels with the same color as the certain pixel are arrayed obliquely on the upper right and lower right or obliquely on the upper left and lower left. One pixel is formed of three subpixels arranged like a letter of L. Two pixels are combined and pixel units each including 3×2 subpixels are arranged in matrix.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] One aspect of the present invention relates to a display device.

[0002] Note that one embodiment of the present invention is not limited to the above technical fields. The technical field of one embodiment of the present invention is a semiconductor device, a display device, a light-emitting device, a lighting device, a power storage device, and the like. , a storage device, a driving method thereof, or a manufacturing method thereof can be cited as an example. can. [Background technology]

[0003] In recent years, there has been a demand for high-resolution display devices. For example, in home television sets (TV In televisions, the resolution is full high definition (19 pixels). 20 x 1080) is the mainstream, but in the future, 4K (pixel count 3840 x 21 Higher resolution television devices, such as 8K (7680 x 4320 pixels) and 8K (60x1080 pixels), is expected to progress.

[0004] On the other hand, mobile information terminal devices such as mobile phones, smartphones, and tablet terminals The resolution of display panels used in the display units of such devices is becoming higher and higher.

[0005] Representative display devices include liquid crystal display devices and organic EL (Electro Luminescence) escence element and light-emitting diode (LED) Light-emitting devices equipped with light-emitting elements such as OLEDs, and electronic paper that displays using electrophoresis, etc. Examples include:

[0006] For example, the basic structure of an organic EL element is a layer containing a light-emitting organic compound between a pair of electrodes. By applying a voltage to this element, light is emitted from the light-emitting organic compound. A display device using such an organic EL element is called a liquid crystal display device. Since it does not require a backlight, which was previously required in some devices, it is thin, lightweight, has high contrast, and consumes less power. For example, an example of a display device using an organic EL element is This is described in reference 1. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-324673 Summary of the Invention [Problem to be solved by the invention]

[0008] For example, the display panel mounted on a portable information terminal device has a larger display area than a television device. Because the area of ​​the region is small, higher definition is required to increase the resolution.

[0009] An object of one embodiment of the present invention is to provide a display device with extremely high definition. Another object is to provide a display device with improved display quality. It is an object of the present invention to provide a display device with improved characteristics. It is an object of the present invention to provide a display device that can be bent. Another object of the present invention is to provide a highly reliable display device. Another object is to provide a display device having a novel structure.

[0010] The description of these problems does not preclude the existence of other problems. It is not necessary to solve all of these problems. It is possible to extract issues other than those mentioned above. [Means for solving the problem]

[0011] One embodiment of the present invention is a display device having a plurality of pixel units. are arranged in a matrix along a first direction and a second direction intersecting the first direction. The pixel unit has first to sixth display elements. The first display element, the second display element, and the fifth display element are arranged in order along the first direction. The first, fourth, and sixth display elements are arranged in order along the first direction. the display element and the second display element, the third display element and the fourth display element, and the fifth display element The first and sixth display elements are arranged along the second direction. The display element is a display element that exhibits a first color, and the second display element and the fifth display element are a display element that exhibits a second color, and the third and sixth display elements that exhibit a third color; It is a display element.

[0012] In the above, it is preferable that the device further includes a first wiring and a second wiring. The pixel unit has first to sixth transistors, and the first transistor, the third transistor, The gates of the first transistor and the fifth transistor are electrically connected to the first wiring. , the gates of the second transistor, the fourth transistor, and the sixth transistor The port is preferably configured to be electrically connected to the second wiring.

[0013] In the above, it is preferable to have a third wiring, a fourth wiring, and a fifth wiring. When the first transistor and the second transistor are connected to one of the source and the drain, is electrically connected to the third wiring, and One of the source and the drain is electrically connected to a fourth wiring. One of the source and the drain of each of the sixth transistors is electrically connected to a fifth wiring. It is preferable to have the following configuration.

[0014] Alternatively, in the above, the third wiring, the fourth wiring, the fifth wiring, and the sixth wiring are included. In this case, it is preferable that the sources of the first transistor and the fourth transistor are One of the drains is electrically connected to a fourth wiring and is connected to the source or drain of the second transistor. One of the inputs is connected to the third wiring, and the source of the third transistor and the sixth transistor is connected to the third wiring. One of the source and drain of the fifth transistor is electrically connected to a fifth wiring. It is preferable that one of the drains is electrically connected to the sixth wiring.

[0015] In the above, the width of the arrangement period of the plurality of pixel units in the first direction is It is preferable that the width of the pixel unit is twice the width of the array period in the direction of . The width of the arrangement period in the first direction is preferably 12 μm or more and 150 μm or less. stomach.

[0016] The first to sixth transistors are transistors with a top gate structure. In this case, it is preferable that a seventh transistor be electrically connected to the first display element. Preferably, the seventh transistor has two gate electrodes sandwiching a semiconductor layer. It is more preferable to have a configuration in which:

[0017] Another aspect of the present invention is a display device including a plurality of first display elements, a plurality of second display elements, and a plurality of third display elements. The display device has three display elements. The first display element is a display element that exhibits a first color. the second display element is a display element that exhibits a second color, and the third display element is a display element that exhibits a third color. The display element is a display element that exhibits a color. The display element also includes a plurality of first rows and a plurality of second rows extending in a first direction. The first row, the second row, and the third row are oriented in a direction perpendicular to the first direction. The first display element is arranged in this order along the second direction. and the second display element are arranged alternately in a row, and the second row is arranged alternately in a row, and the third display element and the first The third column is a row in which the first and second display elements are alternately arranged, and the third column is a row in which the second and third display elements are alternately arranged. The first display element in the first column and the third display element in the second column are arranged alternately. A second display element in a third column and a second display element in a third column are aligned in the second direction.

[0018] In the above, it is preferable that the display device further includes signal lines and scanning lines. The first direction is a direction parallel to the extension direction of either the signal lines or the scanning lines, and the second direction is It is preferably a direction parallel to the other stretching direction. [Effects of the Invention]

[0019] According to one embodiment of the present invention, a display device with extremely high definition can be provided. Alternatively, a display device with improved viewing angle characteristics can be provided. Alternatively, a display device with an increased aperture ratio can be provided. A display device with high reliability can be provided. It is possible to provide a display device having such a configuration. [Brief explanation of the drawings]

[0020] [Figure 1] 1 shows a configuration example of a display device according to an embodiment. [Figure 2] 1 shows a configuration example of a display device according to an embodiment. [Figure 3] 1 is a circuit diagram of a display device according to an embodiment. [Figure 4] 1 is a circuit diagram of a display device according to an embodiment. [Figure 5] 1 is a circuit diagram of a display device according to an embodiment. [Figure 6] 1 is a circuit diagram of a display device according to an embodiment. [Figure 7] 1 is a circuit diagram of a display device according to an embodiment. [Figure 8] 1 is a circuit diagram of a display device according to an embodiment. [Figure 9] 1 shows a configuration example of a display device according to an embodiment. [Figure 10] 1 shows a configuration example of a display device according to an embodiment. [Figure 11] 1 shows a configuration example of a display device according to an embodiment. [Figure 12] 1 shows a configuration example of a display device according to an embodiment. [Figure 13] 1 shows a configuration example of a display device according to an embodiment. [Figure 14] 1 shows a configuration example of a display device according to an embodiment. [Figure 15] 1 shows a configuration example of a display device according to an embodiment. [Figure 16] 1 shows a configuration example of a display device according to an embodiment. [Figure 17] 1 shows a configuration example of a display device according to an embodiment. [Figure 18] 1 shows a configuration example of a display device according to an embodiment. [Figure 19] 1 shows a configuration example of a display device according to an embodiment. [Figure 20]1 shows a configuration example of a display device according to an embodiment. [Figure 21] 1 shows a configuration example of a display device according to an embodiment. [Figure 22] 1 shows a configuration example of a display device according to an embodiment. [Figure 23] 1 shows an example of the configuration of a touch panel according to an embodiment. [Figure 24] 1A to 1C illustrate a method for manufacturing a display device according to an embodiment. [Figure 25] 1A to 1C illustrate a method for manufacturing a display device according to an embodiment. [Figure 26] 1A to 1C illustrate a method for manufacturing a display device according to an embodiment. [Figure 27] 1A to 1C illustrate a method for manufacturing a display device according to an embodiment. [Figure 28] 1A to 1C illustrate a method for manufacturing a display device according to an embodiment. [Figure 29] 1. An electronic device according to an embodiment. [Figure 30] 1. An electronic device according to an embodiment. [Figure 31] 1. An electronic device according to an embodiment. [Figure 32] 1. An electronic device according to an embodiment. [Figure 33] 1. An electronic device according to an embodiment. [Figure 34] 3 shows an example of the configuration of a transistor according to the first embodiment. [Figure 35] 3 shows an example of the configuration of a transistor according to the first embodiment. [Figure 36] 1 shows electrical characteristics of a transistor according to Example 1. [Figure 37] 1 shows the configuration of a light-emitting element according to Example 2. [Figure 38] 10 shows electrical characteristics of the light-emitting element according to Example 2. [Figure 39] 10A to 10C are diagrams illustrating a method for manufacturing a display panel according to a second embodiment. [Figure 40] 10 is a photograph of a display panel according to Example 2. [Figure 41] 6 is a chromaticity diagram of a display panel according to a second embodiment. [Figure 42]10 shows the viewing angle dependence of chromaticity of a display panel according to Example 2. [Figure 43] 10 is a photograph of a display panel according to Example 3. DETAILED DESCRIPTION OF THE INVENTION

[0021] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiments, and various changes and modifications may be made in form and detail without departing from the spirit and scope of the present invention. Therefore, the present invention is based on the following embodiments. The present disclosure should not be construed as being limited to the contents of the preceding paragraph.

[0022] In the configuration of the invention described below, the same parts or parts having similar functions are The same reference numerals are used in common between different drawings, and repeated explanations thereof will be omitted. When referring to a function, the hatching pattern is the same and no specific symbol is attached. .

[0023] In each figure described in this specification, the size, layer thickness, or area of ​​each component is The figures may be exaggerated for clarity and are not necessarily limited to that scale. stomach.

[0024] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components. The number is not a numerical limitation.

[0025] A transistor is a type of semiconductor device that controls the amplification of current and voltage, and conduction or non-conduction. In this specification, the transistor can be , IGFET(Insulated Gate Field Effect Trans istor) and thin film transistor (TFT) ) is included.

[0026] Also, the functions of "source" and "drain" can be changed by using transistors with different polarities. Or, when the direction of the current changes during circuit operation, the positions may be swapped. Therefore, in this specification, the terms "source" and "drain" may be used interchangeably. It shall be possible.

[0027] (Embodiment 1) In this embodiment, a structural example of a display device according to one embodiment of the present invention will be described.

[0028] A display device according to one embodiment of the present invention has a plurality of pixels. Each pixel has a plurality of sub-pixels. Each sub-pixel includes a display element and a pixel circuit. Each pixel circuit has at least one transistor. The pixel has at least one electrode (also called a pixel electrode), which is electrically connected to the pixel circuit. The transistors in each pixel circuit are connected to the corresponding sub-pixels. The pixel circuit has a function as a selection transistor. In addition to transistors, other transistors, capacitance elements, diodes, and other elements, The components may have wiring or the like for connecting them.

[0029] In one aspect of the present invention, two adjacent pixels form a pixel unit. That is, each pixel unit has two sub-pixels that exhibit the same color. For example, if a pixel has three colors (e.g. For example, if a pixel has red (R), green (G), and blue (B) sub-pixels, the pixel unit has six sub-pixels. It is composed of sub-pixels.

[0030] When a pixel unit has six sub-pixels, three are arranged in the first direction and two in the second direction. It is preferable that the sub-pixels are arranged in a 3×2 matrix so that Preferably, one pixel is made up of three sub-pixels that form an L-shape.

[0031] In addition, sub-pixels of the same color are not aligned in a line in the second direction, but are displaced in a direction perpendicular to the second direction. It is preferable that the pixels are arranged in a staggered manner. Two sub-pixels that exhibit the same color are located diagonally to the upper right and lower right, respectively, or diagonally to the upper left and lower It is preferable to arrange the display so that it is positioned at the bottom left. This allows for extremely high-definition display. Even in such a configuration, it is possible to reduce the change in chromaticity when the viewing angle is changed.

[0032] For example, when the display device has three types of display elements of R, G, and B, the The following three types of rows may be arranged in order along the first direction: The first row is a row in which R and G alternate in a second direction, and the second row is a row in which G and B alternate in a second direction. The third row is a row in which B and R are alternately arranged in the second direction. These three columns are arranged so that display elements of the same color are not adjacent to each other in the first direction. Specifically, two display elements located on both sides of each other along the first direction of R are arranged in a row. The first column, the second column, and the third column are arranged so that one column is G and the other column is B. It is possible.

[0033] In addition, in the display device according to one embodiment of the present invention, a gate of a selection transistor included in a pixel circuit is electrically connected to a gate electrode. The device has multiple wirings (also called gate lines) electrically connected to the gate electrodes. This controls the on / off state of the selection transistor, thereby controlling the selection state of the sub-pixel. can.

[0034] In one embodiment of the present invention, a pixel has two or more sub-pixels, and a pixel has two or more lines and The number of gate lines electrically connected is equal to or less than the number of sub-pixels per pixel. At least one of the sub-pixels of the pixel is electrically connected to each of the plurality of gate lines. The configuration will be as follows.

[0035] As an example, a pixel has three sub-pixels and two gate lines are electrically connected to the pixel. More specifically, one of the gate lines is connected to the two sub-pixels. The other gate line is electrically connected to the gate of each selection transistor, and the remaining sub-pixels The gate of the select transistor is electrically connected to the gate of the select transistor.

[0036] By configuring the pixel of the display device according to one embodiment of the present invention as described above, the occupancy rate of the pixel can be reduced. This makes it easier to reduce the area, thereby increasing the definition of the display device. Below is one of the reasons why the pixel area can be reduced by using the above pixel configuration. explain.

[0037] In order to increase the resolution of a display device, it is necessary to reduce the area occupied by one pixel. One way to reduce the pixel footprint is to reduce the minimum feature size and the position between different layers. One method is to reduce the design rules that are determined by factors such as alignment accuracy. However, significant reductions in design rules are highly dependent on improvements in the performance of manufacturing equipment. For example, the cost of developing technology for manufacturing equipment such as exposure machines is extremely high. Furthermore, even if new manufacturing equipment is developed, it will take a huge amount of time to replace the existing equipment. This will require significant capital investment.

[0038] For comparison, a pixel may have three sub-pixels, and one gate line may be connected to each of the three sub-pixels. Consider the case where each selection transistor is connected. In this case, the gate line is preferably formed in a direction parallel to the direction of extension of the gate line. For example, three pixel circuits are arranged in a row per pixel. When this is the case, the ratio of the length of the pixel circuit in the direction in which the gate line extends to the length in the direction perpendicular to this is In addition, the image must fit within a rectangle with a ratio of approximately 1:3. When the pixel shape is a square, the gate line extension direction must be Instead of reducing only one of the length in the direction perpendicular to the direction in question, needs to be reduced to the same extent.

[0039] When manufacturing pixel circuits, there are design rules for the process, so the pixel circuits The size of the elements, electrodes, and contact holes, the width of the wiring connecting the elements, and the distance between the two elements The spacing between the elements and the wiring, etc., cannot be made smaller than a certain value. The pixel circuit is accommodated within the rectangular area, and the area occupied by the elements, wiring, etc. is reduced. No matter how much effort is put into arranging the gate lines, the length of the short side of the rectangle is It is difficult to reduce the length in the stretching direction to the same extent as the length in the long side direction. For each pixel circuit, it is necessary to provide one or more wirings that intersect the gate line at right angles. In the direction in which the gate lines extend, wiring and other structures are densely arranged compared to the direction perpendicular to the direction in which the gate lines extend. Therefore, it is more difficult to reduce the length of the gate line of the pixel circuit in the extension direction. do.

[0040] In the pixel according to one embodiment of the present invention, the number of pixel circuits arranged in the extending direction of the gate line can be reduced. Therefore, the length of the pixel in the direction in which the gate line extends can be made shorter than in the above-described configuration. Furthermore, the wiring that intersects the gate line at right angles can be easily arranged in the pixel circuit of one pixel. This allows two pixel circuits connected to different gate lines to share the same signal. The number of lines perpendicular to the corresponding gate lines can be reduced, and the direction of extension of the gate lines of the pixels can be reduced. It is therefore easier to make the length of the wire shorter.

[0041] In addition, one embodiment of the present invention has a structure including a pixel unit in which a pair of pixels are combined. More specifically, two pixel circuits are connected to a first gate line, and a second A first pixel having one pixel circuit connected to a gate line, and a second pixel having one pixel circuit connected to the first gate line. a second pixel having two pixel circuits connected to a second gate line; The pixel unit may have six pixel circuits, for example. For example, the ratio of the length of the gate line in the direction of extension to the length in the direction perpendicular to the gate line is approximately 2:1. It is preferable that the pixel circuit is arranged so as to fit within a rectangle. This allows for more efficient and dense arrangement of pixels, further reducing the area occupied by the pixels. In addition, compared to the comparative configuration shown above, the gate line connecting the pair of pixels is This makes it possible to reduce the number of wirings that intersect at right angles with the wiring by at least two or more.

[0042] In the display device of one embodiment of the present invention, the area occupied by the pixel can be made extremely small. Therefore, a display device having an extremely high-definition pixel portion can be realized. For example, the resolution of the pixel portion is For example, 400ppi or more and 3000ppi or less, or 500ppi or more and 3000ppi Preferably, 600 ppi or more and 3000 ppi or less, more preferably 800 ppi or less At most 3000 ppi, more preferably 1000 ppi to 3000 ppi For example, a display device with a resolution of 1058 ppi can be realized.

[0043] Such high-definition display devices are used in, for example, mobile phones, smartphones, and tablet devices. Relatively small electronic devices such as portable information terminals, smart watches, and other wearable devices It can be suitably used for child devices. It can also be used for finders of cameras, HMDs (Head-Mounted Displays), etc. It can also be used favorably for medical applications. The present invention can also be suitably used in display devices used in the like.

[0044] More specifically, one embodiment of the present invention can have the following structure, for example.

[0045] [Configuration example] A structural example of a display device according to one embodiment of the present invention will be described below.

[0046] [Example of display device configuration] FIG. 1(A) shows a schematic top view of a display device 10 exemplified below. Element portion 11, circuit 12, circuit 13, terminal portion 15a, terminal portion 15b, wiring 16a, wiring 16b 1A, the display device 10 has an IC 17 mounted thereon. This shows an example of this.

[0047] The pixel section 11 has a plurality of pixels and has the function of displaying an image.

[0048] The circuit 12 and the IC 17 output signals to drive the pixels in the pixel section 11. For example, the circuit 12 functions as a gate drive circuit. For example, IC17 is a circuit that functions as a source driver circuit. Here is an example where two circuits 12 are provided on either side of 1, and six ICs 17 are mounted. In addition, an IC that functions as a gate drive circuit is mounted, and the circuit 12 is not provided. Alternatively, a source driver circuit may be provided and IC 17 may not be mounted.

[0049] In addition, ICs and FPCs (Flexible Printed Circuits) are mounted on The form in which the FPC and IC are not mounted can also be called a display module. Such a display device can also be called a display panel.

[0050] The circuit 13 has a function of distributing one of the signals input from the IC 17 to two or more wirings. By providing circuit 13, IC1 The number of signals output by IC 17 can be reduced, and the number of terminals of IC 17 can be reduced. The number of parts can be reduced, especially when realizing extremely high-resolution display devices such as 4K and 8K. In this case, it is particularly effective to provide the circuit 13. If the circuit 13 is not necessary, it is not necessary to provide it. good.

[0051] The terminal portion 15a and the terminal portion 15b are provided with a plurality of terminals, and are used to connect an FPC, another IC, etc. Each terminal of the terminal portion 15a can be connected to the circuit 1 via one of the plurality of wirings 16a. Each terminal of the terminal portion 15b is electrically connected to I 2 via one of the plurality of wirings 16b. The output terminals of IC17 are electrically connected to the The wiring 16c is electrically connected to the circuit 13 through one of the wirings 16c.

[0052] FIG. 1B is a schematic top view showing an example of how pixel electrodes are arranged in the pixel section 11. As shown in FIG. The pixel section 11 has a plurality of pixel units 20. In FIG. 1(B), four pixel units The pixel unit 20 includes a pixel 21a and a pixel 21b. The pixel 21a has a pixel electrode 31a, a pixel electrode 32a, and a pixel electrode 33a. The pixel 21b has a pixel electrode 31b, a pixel electrode 32b, and a pixel electrode 33b. The electrodes function as electrodes of a display element, which will be described later. The pixel electrode is located inside the pixel electrode of the sub-pixel.

[0053] The six pixel electrodes of the pixel unit 20 are arranged in a matrix of two vertical rows and three horizontal rows. Here, the pixel electrode 31a, the pixel electrode 32a, and the pixel electrode 33a are respectively The pixel electrode 31b can be used as an electrode for a display element that exhibits different colors. 1a, pixel electrode 32b is connected to pixel electrode 32a, pixel electrode 33b is connected to pixel electrode 33a, and Each of these electrodes can be used as a display element electrode that displays the same color. Although the poles are shown to be the same size, they may be different sizes. The size of the display area 22 on the pixel electrode may be varied.

[0054] For ease of explanation, the pixel electrode 31a is a display element that exhibits red (R). Similarly, the pixel electrode 32a is a display element that exhibits green (G). The pixel electrode 33a is an electrode of a display element that exhibits blue (B), and is designated by the symbol G. Note that the pixel arrangement shown in Fig. 1B etc. is an example and is not limited to this. In addition, R, G, and B can be interchanged. Alternatively, a pixel array obtained by flipping the pixel array horizontally or vertically may be used.

[0055] For example, in a conventional display device, one method of arranging display elements of three colors, R, G, and B, is to use one There is a method to arrange three rectangular display elements in a square. A so-called stripe arrangement in which display elements of the same color are aligned in one direction between adjacent pixels In this arrangement, two adjacent display elements exhibiting different colors are arranged in a single pixel. In particular, in the case of extremely high-resolution display devices, the long sides of the display panels are arranged side by side. In this case, the distance between adjacent sub-pixels is shortened, so the light emitted from the display element of a certain sub-pixel However, the light passes through the color filter of the adjacent sub-pixel, causing color mixing when viewed from an oblique angle. If color mixing occurs, the image displayed in the pixel section 11 may be blurred (this is also called poor viewing angle characteristics). The higher the resolution, the lower the color reproducibility of the displayed image. The length of the short side of the substrate on which the color filter is formed and the substrate on which the pixel electrode is formed are shortened. Even a slight misalignment when bonding the substrates together can significantly reduce the aperture ratio and degrade color reproducibility. Therefore, the tolerance for misalignment becomes extremely small. This may result in a significant decrease in yield when manufacturing display panels.

[0056] In contrast, in a display device according to one embodiment of the present invention, pixel electrodes are arranged as shown in FIG. By doing so, the shape of the area occupied by one sub-pixel is different from the stripe shape described above. The shape is close to a square, i.e., the length of the long side is less than 3 times the length of the short side. This allows for the same resolution to be achieved even when sub-pixels of different colors are adjacent to each other. It is possible to shorten the length of the side. Even if the display ratio is high, the distance between adjacent display elements can be made sufficiently large. , not only does the viewing angle characteristic improve, but the tolerance for the positional misalignment of the substrate described above also increases, Yield is improved.

[0057] Here, there are two cases where the pixel electrode arrangement method shown in FIG. 1(B) is used, and where the above-mentioned stripe How much of an effect does misalignment of the board have on the layout of the board? First, let us consider the pixel resolution of 1058 ppi (pixel pitch 24μ). m), in the stripe array, the length of the short side of the area occupied by one sub-pixel (i.e., The horizontal pitch is 8 μm, and the length of the long side (i.e., the vertical pitch) is 24 μm. On the other hand, in the arrangement shown in FIG. 1B, the horizontal pitch of the pixel units 20 is 48 μm. The vertical pitch is 24 μm, and the length of the short side of the area occupied by one sub-pixel (i.e. The length of the long side (i.e., the pitch in the vertical direction) is 12 μm, and the length of the long side (i.e., the pitch in the horizontal direction) is 16 μm. These two are the substrate on which the display element is formed and the substrate on which the color filter is formed. When the substrate is misaligned by 2 μm, the maximum light emitted by one display element can be emitted without loss. The large angle (front direction is set to 0 degrees) was estimated. As a result, in the case of stripe arrangement, The angle was approximately 5.4 degrees in the arrangement shown in FIG. 1(B), whereas it was 33.9 degrees in the arrangement shown in FIG.

[0058] In this way, in the case of an extremely high-resolution display device, the arrangement method shown in FIG. 1(B) is used. By doing so, not only can a high viewing angle be achieved, but also the manufacturing yield can be improved. do.

[0059] FIG. 1C is a circuit diagram showing an example of how pixel circuits are arranged in the pixel section 11. (C) shows four pixel units 20. The pixel 21a includes a pixel circuit 41a, a pixel The pixel 21b has a pixel circuit 41b, a pixel circuit 42a, and a pixel circuit 43a. The pixel section 11 also includes wiring 51a, wiring 51b, Wiring 52a, wiring 52b, wiring 52c, wiring 53a, wiring 53b, wiring 53c, etc. are arranged. It is being done.

[0060] The wiring 51a and the wiring 51b are electrically connected to the circuit 12 shown in FIG. The wiring 52a, the wiring 52b, and the wiring 52c function as gate lines (also called scan lines). The lines 52c are electrically connected to the circuits 13 shown in FIG. 1(A) and are used as signal lines (data lines). The wiring 53a, the wiring 53b, and the The wiring 53c has a function of supplying a potential to the display element.

[0061] The pixel circuit 41a is electrically connected to the wiring 51a, the wiring 52a, and the wiring 53a. The pixel circuit 42a is electrically connected to the wiring 51b, the wiring 52a, and the wiring 53a. The pixel circuit 43a is electrically connected to the wiring 51a, the wiring 52b, and the wiring 53b. The pixel circuit 41b is electrically connected to the wiring 51b, the wiring 52b, and the wiring 53b. The pixel circuit 42b is electrically connected to the wiring 51a, the wiring 52c, and the wiring 53c. The pixel circuit 43b is electrically connected to the wiring 51b, the wiring 52c, and the wiring 53c. It continues.

[0062] The pixel circuit 41a is electrically connected to the pixel electrode 31a. a is the pixel electrode 32a, the pixel circuit 43a is the pixel electrode 33a, and the pixel circuit 41b is the pixel electrode 31b, the pixel circuit 42b is connected to the pixel electrode 32b, the pixel circuit 43b is connected to the pixel electrode 33b, and In FIG. 1C, the pixel electrodes shown in FIG. 1B and the pixel electrodes To make it easier to understand the correspondence with the circuits, the symbols R, G, and B are assigned to each pixel circuit. For ease of explanation, the pixel circuit and the pixel electrode are explained separately here. The pixel electrode may be part of a pixel circuit, or the pixel circuit may include a display element. stomach.

[0063] As shown in Figure 1(C), by using a configuration in which two gate lines are connected to one pixel, Conversely, the number of signal lines (source lines) can be halved compared to the stripe arrangement. This makes it possible to reduce the number of ICs 17 used as source driver circuits by half. This allows the number of parts to be reduced.

[0064] In FIG. 1C, one pixel unit 20 has a wiring (wiring 5) that functions as a signal line. 2a to 2c) show a configuration in which three wires are electrically connected, but as shown in FIG. 2(A), four wires are The lines may be electrically connected to the pixel units 20 .

[0065] 2A, the wiring 52d is electrically connected to the pixel circuit 42a. The wiring 52a is electrically connected to the pixel circuit 41a and the pixel circuit 41b. The wiring 52c is electrically connected to the pixel circuit 43a and the pixel circuit 43b. 2b. In the adjacent pixel units, the wiring 52c is shared. Therefore, the wiring 52c in the pixel unit 20 is connected to the wiring 52d in the adjacent pixel unit. is equivalent to

[0066] In this way, pixel circuits corresponding to the same color are connected to a single wiring that functions as a signal line. For example, in order to correct the luminance variations between pixels, If a signal adjusted by the color temperature is supplied to the wiring, the correction value may vary significantly for each color. Therefore, all pixel circuits connected to one signal line correspond to the same color. This makes it possible to easily perform correction.

[0067] In the configuration shown in FIG. 2A, the row direction (the direction in which the wiring 51a and the wiring 51b extend) When the number of pixel circuits arranged in the pixel circuit array is n, the number of wirings (such as wiring 52a) that function as signal lines is n. ) is n+1. In addition, the number of wirings functioning as a plurality of signal lines provided in the pixel section 11 is n+1. The two wires (the 1st and n+1th wires) at both ends of the In 2(A), the pixel circuit corresponding to G) is connected. As shown in FIG. 2A, these two wirings (wirings 52d and 52e in FIG. 2A) located at both ends of the pixel section 11 , the rightmost wiring 52c) is connected to the wiring 54 located outside the pixel section 11, for example. When the electrical connection is made by the above, the output signal of the circuit functioning as the signal line driver circuit This is preferable because it does not increase the number.

[0068] As shown in FIG. 2B, two types of pixel units 20 are arranged in the direction of extension of the wiring 52a etc. The wirings 52a and the like may be arranged alternately along the direction of extension of the wirings 52a and the like. The element units 20 are arranged in line symmetry with the extension direction of the wiring 51a and the like as the axis of symmetry. With this configuration, the sub-pixels are arranged in the direction in which the wiring 52a and the like extend. Since two sub-pixels of the same color are adjacent, there is little tolerance for misalignment between the color filter and the display element. The range can be made larger.

[0069] [Pixel circuit configuration example] A more specific example of the pixel circuit included in the pixel unit 20 will be described below. 3 shows an example of a circuit diagram of the pixel unit 20. In FIG. 3, as illustrated in FIG. In the case where four wirings (such as wiring 52a) functioning as signal lines are connected to the pixel unit 20, An example of this case is shown.

[0070] The pixel 21a includes a sub-pixel 71a, a sub-pixel 72a, and a sub-pixel 73a. The pixel includes sub-pixels 71b, 72b, and 73b. For example, the sub-pixel 71a has the pixel circuit 41a and the display element 60. Here, a case where a light emitting element such as an organic EL element is used as the display element 60 is shown.

[0071] Each pixel circuit includes a transistor 61, a transistor 62, a capacitance element 63, and For example, in the pixel circuit 41a, the gate of the transistor 61 is connected to the wiring 51. a, and one of the source and drain is electrically connected to the wiring 52a, and the source The other of the drains is electrically connected to the gate of the transistor 62 and one of the electrodes of the capacitor 63. The transistor 62 has one of its source and drain connected to one of the display elements 60. The other of the source and drain is electrically connected to the other electrode of the capacitor 63, The other electrode of the display element 60 is electrically connected to the wiring 53a. The other pixel circuits are electrically connected to the wiring as shown in Figure 3. The wiring to which the gate of the transistor 61 is connected, and either the source or drain of the transistor 61 The pixel circuit is the same as the pixel circuit except that the wiring to which the capacitor element 63 is connected and the wiring to which the other electrode of the capacitor element 63 is connected are different. It has the same configuration as the path 41a.

[0072] In FIG. 3, the transistor 61 functions as a selection transistor. The transistor 62 is connected in series with the display element 60 and has the function of controlling the current flowing through the display element 60. In FIG. 3, a transistor 61 that functions as a selection transistor and a display One electrode (pixel electrode) of the element 60 is electrically connected via a transistor 62. The capacitance element 63 is connected to the gate of the transistor 62. The transistor 61 has a function of holding the potential of the node. When the peak current and the leakage current through the gate of the transistor 62 are extremely small, The capacitance element 63 does not necessarily have to be provided.

[0073] As shown in FIG. 3, the transistors 62 are each electrically connected to a first gate. It is preferable to have a structure having a first gate and a second gate. By adopting this configuration, the current that can be passed through the transistor 62 can be increased. In particular, in a high-definition display device, the size of the transistor 62, particularly the channel width, is increased. This is preferable because the current can be increased without increasing the capacitance.

[0074] As shown in FIG. 4A, the transistor 62 has one gate. By adopting such a configuration, the step of forming the second gate is not required, In addition, as shown in FIG. It is also possible to have a configuration with two gates. By using such a configuration, The size of the transistors can also be reduced. The figure shows a configuration in which the first gate and the second gate are electrically connected to each other, but one of the gates is different. In this case, the potential applied to the wiring may be different. By adjusting the temperature, the threshold voltage of the transistor can be controlled.

[0075] In addition, one of the pair of electrodes of the display element 60 is electrically connected to the transistor 62. , corresponds to the pixel electrode (for example, pixel electrode 31a, etc.). In B), the electrode electrically connected to the transistor 62 of the display element 60 is the cathode, and the opposite electrode This configuration is used when the transistor 62 is an n-channel type. This is particularly effective when the transistor 62 is in the ON state. Since the potential given by the wiring 53a becomes the source potential, the resistance of the display element 60 varies. The current flowing through the transistor 62 can be kept constant regardless of fluctuations or variations.

[0076] As shown in FIG. 5A, the electrode of the display element 60 on the transistor 62 side is set as an anode. The electrode on the opposite side may be a cathode. The potential V1 applied to the other electrode of the element 60 is fixed to be lower than the potential applied to the wiring 53a, etc. In addition, the potential V1 can be a common potential or a ground potential that is used for other circuits. It is preferable to use a potential common to the potentials used in the other circuits, since this simplifies the circuit configuration.

[0077] In addition, as shown in Figure 2, one pixel unit has a wiring that functions as a signal line. Although the configuration in which four wires are connected is shown, it is also possible to connect three wires as shown in Figure 1(C). An example of the configuration of the pixel unit 20 in this case is shown in FIG.

[0078] In addition, a p-channel transistor may be used as the transistor in the pixel circuit. For example, Fig. 6(A) and (B) show the configurations shown in Fig. 5(A) and (B), respectively. 10 shows an example in which the transistor 62 is a p-channel transistor.

[0079] [Monitor circuit] In the case of extremely high-resolution display devices, the area that one sub-pixel can occupy is extremely small. Therefore, it is preferable to simplify the configuration of the pixel circuit. It is preferable that the display device is provided with a monitor circuit that outputs information on the brightness of the child to the outside. By using an external device, the signal to be input to the signal line according to the luminance variation of the display element can be By adjusting the amplitude of the signal, it is possible to correct the display unevenness. Regarding a configuration example of a monitor circuit for outputting the current flowing through the wiring 53 in the element circuit to the outside, I will explain.

[0080] The circuit 14 has a function of selectively outputting a current flowing through a display element of a pixel. The circuit 14 is also called a monitor circuit. In response to the current outputted from the circuit 14 for each pixel, By adjusting the potential of the signal supplied to the pixel, the brightness of each pixel in the pixel section 11 can be adjusted. In particular, when a high-definition pixel section 11 is to be formed, the occupied area of ​​the pixel can be corrected. In order to reduce the product, the pixel circuit of one pixel is simplified and provided outside the display device 10. It is preferable to use a method in which correction is performed by a device or circuit that is connected to the The pixel circuit has the above correction function and performs the correction within the pixel circuit (also called internal correction). In the case of using the above method, the circuit 14 may not be provided. It may be possible.

[0081] 7A shows a circuit diagram of an example of the configuration of the circuit 14. The circuit 14 includes m (m is 1 or more) The circuit 14 has a wiring 83. , wiring 84, and a plurality of wiring groups 53S are electrically connected. The circuit 14 includes one or more wirings 53a, 53b, and 53c. The output terminals 86 (output terminals 86_1 to 86_m) are electrically connected to each other. The output terminal 86 is electrically connected to one circuit 80 within the circuit 14 .

[0082] FIG. 7B shows a configuration example of a circuit 80. The circuit 80 includes a plurality of transistors 81 and a plurality of The transistor 81 has a gate electrically connected to a wiring 83. However, one of the source and drain is connected to one of the wirings (wiring 53a, wiring 53b) in the wiring group 53S. 3b or wiring 53c), and the other of the source or drain is electrically connected to wiring 84. The transistor 82 has a gate electrically connected to the terminal 85 and a source or one of the drains is electrically connected to one of the source and drain of the transistor 81; The other of the source and drain is electrically connected to an output terminal 86 .

[0083] A fixed potential can be applied to the wiring 84. For example, a potential higher than the potential V1 can be applied. Alternatively, a potential lower than the potential V1 can be applied. A signal for controlling the on / off of the pixel unit 11 can be given. During a period (also referred to as a display period), the transistor 81 is turned on, and the wiring 84 The given potential is supplied to each of the wiring group 53S via the transistor 81.

[0084] A signal for controlling the on and off states of the transistor 82 is applied to the terminal 85. Here, during the period when no image is displayed on the pixel section 11, the operation described below can be performed. This allows for a period during which the current flowing through each sub-pixel is output to the outside (also called a monitor period). Specifically, the plurality of transistors 81 are turned off, and the plurality of transistors 82 are turned on. By turning on one of the wirings in the wiring group 53S, one of the wirings in the wiring group 53S and the output terminal 86 and are turned on through the transistor 82. Therefore, the plurality of transistors 82 are selected in order. By selecting the wiring group 53S, the current flowing through each wiring of the wiring group 53S is output to the output terminal 86 in a time-division manner. It can be output.

[0085] In FIG. 7B, a transistor 82 is connected to one wiring (such as the wiring 53a). However, as shown in FIG. 7C, a plurality of adjacent wirings in the wiring group 53S are bundled together. Therefore, it is preferable to connect it to one transistor 82. The current output to the output terminal 86 is the sum of the currents output from a plurality of pixels. This allows for improved sensitivity. In particular, in high-resolution display devices, The size of the display element 60 is small, and the value of the current flowing through the display element 60 is also small. By adopting such a configuration, correction can be easily performed. By combining the wires, the number of output terminals 86 can be reduced, simplifying the circuit configuration. Cut.

[0086] Here, the above-mentioned circuit 14 that can be used when the circuit 14 that functions as a monitor circuit is provided. An example of a pixel configuration different from that shown in FIG.

[0087] The subpixel shown in FIG. 8A includes a transistor 61, a transistor 62, and a capacitor 63. The subpixel also includes a wiring 51, a wiring 52, a wiring 53, and a transistor 64. The wiring 55 is electrically connected to the wiring 51. The wiring 51 functions as a gate line. The line 52 is a wiring that functions as a signal line, and the line 53 is a wiring that is electrically connected to the circuit 14. A predetermined potential or signal can be supplied to the wiring 55.

[0088] In FIG. 8A, a transistor 61 has a gate electrically connected to a wiring 51 and a semiconductor layer. One of the source and drain is electrically connected to the wiring 52, and the other of the source and drain is One electrode of the capacitor 63 is electrically connected to the gate of the transistor 62. The transistor 62 has a wiring having a function of supplying a potential V2 to either the source or the drain. The other of the source and drain is electrically connected to one electrode of the display element 60 and the transistor. The capacitor element 63 is electrically connected to one of the source and drain of the other capacitor element 64. One electrode of the transistor 64 is electrically connected to the wiring 51. and the other of the source and the drain is electrically connected to a wiring 53. The other electrode of the display element 60 is electrically connected to a wiring having a function of supplying a potential V1. are.

[0089] In the configuration shown in FIG. 8A, the potential V1 can be set lower than the potential V2. In addition, when the anode and cathode of the display element 60 are interchanged, the potentials of these electrodes are interchanged. That's fine.

[0090] In the configuration shown in FIG. 8A, when a predetermined potential is applied to the gate of the transistor 62, The current flowing through the transistor 62 can be output to the wiring 53 via the transistor 64. For example, during the monitoring period, the potential of the wiring 51 is The potential of the wiring 52 is supplied to the gate of the transistor 62. The potential can be set to

[0091] In FIG. 8A, the gates of the transistors 61 and 64 are connected in a single circuit. Although the configuration is such that the wiring is electrically connected to the line 51, it is also possible to electrically connect these to other wirings. In FIG. 8B, a wiring 57 electrically connected to the gate of the transistor 64 is provided. By using such a configuration, for example, during the display period, The resistor 64 can be always in the OFF state, and an unintended current does not flow in the wiring 53 during this period. This is preferable because

[0092] The configuration shown in FIG. 8(C) differs from the above configuration mainly in that it does not have the wiring 55. ) the other electrode of the capacitor 63 is connected to the other electrode of the source or drain of the transistor 62. On the other hand, one electrode of the display element 60 and one of the source and drain of the transistor 64 are connected to each other. This configuration reduces the number of wires and allows for more efficient operation. A high-definition display device can be realized.

[0093] Also, in FIG. 8(D), similar to FIG. 8(B), the transistors 61 and 64 The diagram shows a configuration in which each gate is electrically connected to a different wiring.

[0094] In addition, in FIGS. 8(A) to 8(D), each transistor has one gate. As in the above, at least one or all of the transistors are electrically connected. Alternatively, one of the two gates may be a predetermined gate. A structure in which the threshold voltage of a transistor can be controlled by electrically connecting the transistor to a wiring that supplies potential. It may also be possible to use the following.

[0095] In the above description, the display element 60 is an element that displays a signal when a current flows through it. However, the present invention is not limited to this example. For example, a liquid crystal element may be used, which is displayed by applying a voltage. The elements shown can also be applied.

[0096] FIG. 8(E) shows an example in which a liquid crystal element is used as the display element 60. The configuration includes a transistor 61, a display element 60, and a capacitor 63. The other of the source and drain of the display element 60 is connected to one electrode of the capacitor element 63. The other electrode of the display element 60 and the other electrode of the capacitor element 63 are electrically connected to each other. The electrode is electrically connected to a wiring that supplies a potential V1.

[0097] [Example of pixel electrode arrangement method] Next, an example of a method for arranging pixel electrodes will be described.

[0098] FIG. 9A is a top view showing an example of how to arrange pixel electrodes and wirings in the pixel section 11. The wiring 51a and the wiring 51b are arranged alternately. Wiring 52a, wiring 52b, and wiring 52c that intersect with 51b are arranged in this order. The pixel electrodes are arranged in a matrix along the direction in which the wiring 51a and the wiring 51b extend. is doing.

[0099] As shown in FIG. 9A, the direction in which the wiring 52a of the pixel unit 20 extends (the first direction) When the period of arrangement in the extending direction (also referred to as the second direction) of the wiring 51a and the like is set as a period P, It is preferable that the period of arrangement (referred to as "period 2P") is twice that period. Here, the period P is preferably 12 μm or more and 150 μm or less. Preferably, the thickness is 12 μm or more and 120 μm or less, more preferably, 12 μm or more and 100 μm or less, and even more preferably, 12 μm or more and 100 μm or less. More preferably, the thickness can be set to 12 μm or more and 60 μm or less. A high-definition display device can be realized.

[0100] For example, when attention is paid to the pixel electrode 31a, the pixel electrode 31a is connected to the wiring 51a, the wiring 51b, The pixel electrode 3 is disposed inside the area surrounded by the wiring 52c and the wiring 52a. It is preferable that 1a is positioned so as not to overlap these four wirings. This reduces the parasitic capacitance of each wiring, allowing for higher resolution and a lower drive frequency. The number can be higher.

[0101] In particular, the pixel electrodes 31a and the like are connected to the wirings 52a, 52b, and 5 It is preferable that the wiring 52a and the like are provided so as not to overlap with the wiring 52c and the like. Electrical noise is transmitted through the parasitic capacitance between the pixel electrodes 31a, etc., and the pixel electrodes 31a, etc. This can prevent the luminance of the display element from changing due to the fluctuation in the potential.

[0102] The pixel electrodes 31a and the like overlap with the wiring 51a or wiring 52b and the like that function as scanning lines. This allows the area of ​​the pixel electrode 31a to be increased. In FIG. 9B, a part of the pixel electrode 31a is connected to the wiring. 51a (or wiring 52b).

[0103] When the pixel electrode of a certain sub-pixel and the wiring that functions as the scanning line are arranged to overlap, The wiring that functions as a scanning line where the poles overlap is the wiring that connects to the pixel circuit of that sub-pixel. For example, during the period when a signal for selecting the wiring 51a or the like is input, the corresponding subpixel Since this corresponds to the period in which the data is rewritten, the wiring 51a etc. is Even if electrical noise is transmitted through the parasitic capacitance between these, the brightness of the sub-pixels does not change. There's nothing to do.

[0104] [Pixel layout example] An example of the layout of the pixel unit 20 will be described below.

[0105] FIG. 10(A) shows an example of the layout of one sub-pixel. The sub-pixel shown in FIG. 10(A) is an example before the pixel electrode is formed. The circuit includes a resistor 61, a transistor 62, and a capacitor 63. The transistor 62 is a semiconductor It is a transistor with two gates sandwiching a body layer.

[0106] In FIG. 10(A) and other figures, the same hatching is used for the patterns formed by processing the same conductive film. The conductive film located at the bottom connects the wiring 51 and the transistor. One of the gates of the gate electrode 62 is formed. The gate of the transistor 61 and the other gate of the transistor 62 are formed. The conductive film formed later will form the wiring 52, the source electrodes of the transistors, and The drain electrode, one electrode of the capacitor element 63, etc. are formed. The wiring 53 and the like are formed by the conductive film formed on the surface of the capacitor element. It serves as the other electrode of 63.

[0107] FIG. 10B shows a layout of the pixel unit 20 using the sub-pixels exemplified in FIG. 10A. FIG. 10(B) also shows each pixel electrode and the display area 22. do.

[0108] Here, three sub-pixels electrically connected to the wiring 51a and three sub-pixels electrically connected to the wiring 51b are The three sub-pixels are symmetrical to each other. Sub-pixels of the same color are arranged in a zigzag pattern in the extending direction of the sub-pixels 52a, etc., and When the subpixels are connected to one wiring that functions as a signal line, the length of the wiring in the subpixels Since the brightness of the sub-pixels can be made uniform, the brightness variation between the sub-pixels can be suppressed.

[0109] By using this pixel layout, the minimum processing size can be reduced to 0.5 μm or more. Even in mass production lines where the average particle size is 6 μm or less, typically 1.5 μm to 4 μm, It becomes possible to manufacture a high-definition display device.

[0110] The above is a description of an example of a pixel layout.

[0111] The display device exemplified in this embodiment can realize an extremely high-definition display device. Furthermore, it is possible to provide a display device with improved display quality. It is possible to provide a display device having an increased aperture ratio.

[0112] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0113] (Embodiment 2) In this embodiment, an example of a display device having a part of a configuration different from that of the first embodiment will be described. In the following, explanations of parts that overlap with those in the first embodiment may be omitted.

[0114] The display device exemplified below differs from the display device of the first embodiment above mainly in the way pixel electrodes are arranged. Specifically, the display elements of the three sub-pixels in one pixel are In other words, the six sub-pixels of the pixel unit are arranged in one direction. The six pixel electrodes are arranged in one direction.

[0115] [Configuration example] [Example of display device configuration] FIG. 11(A) shows a schematic top view of a display device 10 described below. Pixel portion 11, circuit 12, circuit 13, circuit 14, terminal portion 15a, terminal portion 15b, and a plurality of wirings 16a, a plurality of wirings 16b, and a plurality of wirings 16c.

[0116] FIG. 11(B) is a schematic top view showing an example of how pixel electrodes are arranged in the pixel section 11. As shown in FIG. 11(B), the six pixel electrodes of the pixel unit 20 are arranged at equal intervals. Here, the pixel electrodes 31a, 32a, and 33a are arranged as follows: The pixel electrodes 31b can be used as electrodes of display elements that exhibit different colors. The pixel electrode 31a is connected to the pixel electrode 32b, and the pixel electrode 33b is connected to the pixel electrode 33a. The electrodes of the display elements can be made to show the same color. Although the pixel electrodes are shown as having the same size, they may be of different sizes. Alternatively, the size of the display area 22 on each pixel electrode may be made different.

[0117] FIG. 11C is a circuit diagram showing an example of how pixel circuits are arranged in the pixel section 11. 11(C) has the same configuration as that of FIG. 1(C).

[0118] The pixel circuit 41a is electrically connected to the pixel electrode 31a. The pixel circuit 43a is electrically connected to the pixel electrode 33a. The pixel circuit 41b is electrically connected to the pixel electrode 31b. The line 42b is electrically connected to the pixel electrode 32b. 11(B) and 3b. In FIG. 11(C), the pixel electrodes shown in FIG. To make it easier to understand the correspondence with the pixel circuits, each pixel circuit is labeled R, G, and B. .

[0119] By adopting such a configuration, display elements of the same color can be arranged in a line. This improves the viewing angle characteristics in the direction parallel to the direction in which display elements of the same color are arranged. In addition, by using this arrangement method, it is possible to form a color filter. When a display device is manufactured by bonding substrates fabricated with the same color, display elements of the same color are arranged. Even if a positional deviation occurs in the direction of the arrow, the color reproducibility does not deteriorate.

[0120] Note that the configuration of the pixel circuit is not limited to the example shown in FIG. 11C and may be the same as that shown in the first embodiment. The configurations shown in FIGS. 2 to 6, 8, etc. can be used as appropriate.

[0121] [Example of pixel electrode arrangement method] Next, the relative positional relationship between the pixel electrodes and various wirings will be described.

[0122] FIG. 12(A) is a schematic top view showing an example of a pixel electrode and wiring arrangement in the pixel section 11. The wiring 51a and the wiring 51b are arranged alternately. Wiring 52a, wiring 52b, and wiring 52c that intersect with wiring 1b are arranged in this order. In addition, the pixel electrodes are arranged along the extending direction of the wiring 51a and the wiring 51b.

[0123] In the pixel unit 20, the pixel electrode 31a and the pixel electrode 32a are connected to the wiring 52c and the wiring 5 The pixel electrode 33a and the pixel electrode 31b are disposed between the wiring 52a and the wiring 52b. The pixel electrode 32b and the pixel electrode 33b are disposed between the wiring 52b and the wiring 52b. In FIG. 12A, each pixel electrode and its adjacent Although the pixel electrodes are shown not to overlap with the wiring, a part of the pixel electrodes may overlap with the wiring.

[0124] In the pixel unit 20, each pixel electrode overlaps both the wiring 51a and the wiring 51b. In this way, the wiring that functions as the two gate lines overlaps the image. By providing a pixel electrode, the area of ​​the pixel electrode can be increased, and the aperture ratio of the pixel section can be increased. Cut.

[0125] Also, as shown in FIG. 12(B), between the wirings that function as two signal lines (for example, wiring Two pixel electrodes located between the wiring 52a and the wiring 52b are arranged relatively in the direction of extension of the wiring. In other words, the six pixels of one pixel unit 20 are preferably arranged in a staggered manner. The pixel electrodes are arranged in a zigzag pattern along the extension direction of the wiring that functions as the gate line. It is preferable that

[0126] Using FIG. 13(A), the positional relationship of the six pixel electrodes included in one pixel unit 20 is shown. In Fig. 13(A), the center of gravity of each pixel electrode in plan view is marked. Here, the center of gravity of the electrode in plan view is the shape (2 The geometric center of gravity of a 3-dimensional figure.

[0127] As shown in FIG. 13(A), three adjacent gate lines in the extension direction of the wiring functioning as gate lines are The line connecting the centers of gravity of the two pixel electrodes located at both ends and the line between them It is preferable to arrange the pixel electrodes so that the centers of gravity of the adjacent pixel electrodes do not coincide with each other. A line 30a connecting the center of gravity of pixel electrode 1a and the center of gravity of pixel electrode 33a, and a pixel electrode located between them The arrangement is such that the center of gravity of 32a does not overlap.

[0128] In addition, each of three pixel electrodes among six pixel electrodes included in one pixel unit 20 is The center of gravity of the pixel electrode is located on the first straight line, the centers of gravity of the other three pixel electrodes are located on the second straight line, and the center of gravity of the third pixel electrode is located on the It is preferable that the first line and the second line are parallel to each other and do not coincide with each other. A line 30a passing through the centers of gravity of the pixel electrodes 1a, 33a, and 32b, and a line 30b passing through the centers of gravity of the pixel electrodes 1a, 33a, and 32b are connected to the pixel electrodes 1a, 33b, and 32b. A line 30b passing through the centers of gravity of the electrode 32a, the pixel electrode 31b, and the pixel electrode 33b, are arranged so that they are parallel to each other and do not coincide.

[0129] In reality, there may be variations in the shape of the pixel electrodes, or the shape of the pixel electrodes may vary depending on the pixel. In cases where the center of gravity of three or more pixel electrodes is to be different depending on the color, the line connecting the centers of gravity of the three or more pixel electrodes is not a straight line. In such cases, the wiring that functions as the gate line is not straight, but is extended in a certain direction. If the centers of gravity of three or more pixel electrodes are located within a rectangular strip that is long in the direction of the arrow, these pixels The center of gravity of each pixel electrode can be considered to be located on a straight line. The center of gravity of the rectangle 30c is located within the range of the rectangle 30d. In this case, the width W of the strip-shaped rectangle in the short side direction is set to, for example, 1 / 1 of the pixel pitch. 0 or less, and preferably 1 / 20 or less of the pixel pitch.

[0130] Here, as shown in FIG. 12(B), one pixel electrode is a wiring that functions as a gate line. It is preferable to arrange the wiring so that it does not overlap with two or more of the above. When the potential of the pixel electrode changes, the potential of the pixel electrode that overlaps with the potential of the pixel electrode changes, and the voltage applied to the display element changes. In addition, if one pixel electrode is connected to one of the wirings that function as gate lines, If they are arranged so that they do not overlap, the aperture ratio of the pixels may decrease. Therefore, by configuring one pixel electrode to overlap with a wiring that functions as one gate line, It is possible to maintain a high aperture ratio while suppressing the influence of changes in the potential of the pixel electrode.

[0131] In particular, in one embodiment of the present invention, wirings that function as two gate lines are connected to one pixel. Therefore, as shown in FIG. 12(B), the positions of adjacent pixel electrodes are shifted, and one pixel electrode The electrode is a wiring that functions as a gate line connected to a pixel, or a gate that is connected to an adjacent pixel. It is advisable to place it so that it overlaps one of the wirings that functions as a root line. The wiring that functions as a gate line and overlaps with the pixel electrode of the pixel is oriented in the direction of scanning the gate line. In this case, it is preferable that the gate line corresponds to the previous row. The potential of the pixel electrode changes depending on the signal applied to the gate line, and the voltage applied to the display element changes accordingly. Even if a change occurs, the data is rewritten immediately afterwards, minimizing the impact on the display. can be reduced.

[0132] If the pixel electrode needs to be arranged so as to overlap with two gate lines, The area where the pixel electrode and the other gate line overlap is larger than the area where the pixel electrode and the other gate line overlap. In particular, it is necessary to make the area of ​​either the pixel electrode smaller than the area of ​​the pixel electrode. If the ratio of the area of ​​the overlapping portion with the gate line is less than 3%, the change in the potential of the gate line will Since there is almost no effect on the electrode potential, it can be considered that there is virtually no overlap. This may be possible.

[0133] FIG. 14(A) shows a different arrangement of pixel electrodes from that shown in FIG. 12. The pixel 21a is The pixel electrodes 32a and 33a are connected to the wiring (wiring 52a, etc.) that functions as a signal line. The pixel electrodes 3 are arranged alternately in the extension direction. 1a is placed.

[0134] In the example shown in FIG. 14B, in the extension direction of the wiring (wiring 52a, etc.) that functions as a signal line, In two adjacent columns of pixels, the pixel electrodes 32a and 33a are interchanged. That is, in two adjacent pixels, the pixel electrodes 32a are arranged in such a manner that the pixel electrodes 32a are in contact with each other and the pixel electrodes 32b are in contact with each other. The element electrodes 33a are provided adjacent to each other.

[0135] In the above description, for ease of understanding, symbols such as R, G, and B are used for each pixel electrode and pixel circuit. However, the present invention is not limited to this and these can be interchanged.

[0136] [Pixel layout example] An example of the layout of the pixel unit 20 will be described below.

[0137] 15(A) and 15(B) show layouts corresponding to the pixel unit 20 illustrated in FIG. 4(A). FIG. 15(A) shows an example of the structure of the layer below the pixel electrode 31a, etc., and FIG. 15B) shows a configuration in which pixel electrodes 31a and the like are provided in addition to the configuration of FIG. 15A. In FIG. 15(B), pixel electrodes of adjacent pixel units are clearly shown for clarity. not present.

[0138] In FIG. 15(A), wiring 51a, wiring 51b, etc. are formed from the first conductive film. Moreover, the wiring 52a and the like are formed by a second conductive film located in a layer above this. do.

[0139] In the subpixel 71a, the transistor 61 includes a semiconductor layer provided on the wiring 51a, The transistor 62 is made of a first conductive film and includes a part of the wiring 52a. The capacitor element includes a conductive layer, a semiconductor layer on the conductive layer, wiring 53a, etc. The element 63 is configured to include a part of the wiring 53a and a conductive layer made of the first conductive film. .

[0140] In FIG. 15B, each pixel electrode is connected to one of the sub-pixels adjacent in the direction in which the wiring 52a and the like extend. For example, the pixel electrode 32a is arranged so as to overlap with the transistor in the sub-pixel 71a. The capacitor 61, the capacitor element 63, and a part of the wiring and electrodes that constitute the sub-pixel 71a are overlapped. Such a configuration is particularly suitable for top-emitting light-emitting devices. By arranging the circuit below the pixel electrode in this way, Even if the area occupied by the element is reduced, a large aperture ratio can be achieved.

[0141] As shown in FIG. 15B, each pixel electrode functions as a signal line such as a wiring 52a. It is preferable to arrange it so that it does not overlap with the wiring. The pixel electrode can be connected to the signal line. When it is necessary to arrange them overlapping, the area of ​​the overlapping area is The ratio should be 10% or less, preferably 5% or less.

[0142] In addition, when the pixel electrode overlaps with the semiconductor layer of the transistor in the adjacent sub-pixel, A change in the potential of the transistor may cause a change in the threshold voltage. For example, in FIG. 15B, the pixel electrode 32a functions as a selection transistor for the sub-pixel 71a. The pixel electrode is provided so as to overlap the semiconductor layer of the transistor 61. The selection transistor of the sub-pixel corresponding to the previous row in the direction of the arrow can be provided so as to overlap with the selection transistor of the sub-pixel corresponding to the previous row. This is preferable. However, the adjacent sub-pixels that overlap with this pixel are in the non-selected state, and the selected transition of the adjacent sub-pixels The gate line of the adjacent sub-pixel is connected to the selection transistor of the sub-pixel. Since it is possible to apply a potential that reliably turns off the transistor, the threshold voltage is somewhat It is possible to drive the device so that no problems occur even if a change occurs.

[0143] 16(A) and 16(B) show that the display area 22 of each sub-pixel of the pixel unit is formed by a pair of gate electrodes. This is an example in which the wiring is arranged so as to fit between the wirings (wirings 51a and 51b) that function as lines. By using such an arrangement method, the signal lines in the two adjacent display areas 22 can be This can reduce the positional deviation in the extension direction of the wiring (such as the wiring 52a) that functions as a result of this. In this case, the wiring 51a and the wiring 52b may be configured not to be disposed at equal intervals.

[0144] The above is a description of an example of the configuration of the display device.

[0145] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0146] (Embodiment 3) In this embodiment, a cross-sectional structure example of a display device according to one embodiment of the present invention will be described.

[0147] [Cross-section example 1] [Cross-sectional configuration example 1-1] 17 is a schematic cross-sectional view of the display device 10. FIG. 17 shows, for example, a cross-sectional view of FIG. The cross section of the pixel section 11 corresponds to the cross section taken along the line A1-A2. This corresponds to the cross section corresponding to the cutting line B1-B2 in the drawing.

[0148] The display device 10 includes a first substrate 101 and a second substrate 102 bonded together by an adhesive layer 220. It has a combined configuration.

[0149] On the first substrate 101, there are provided terminal portions 15a, 15b, wiring 16a, wiring 16b, and a circuit. A transistor 251 constituting the circuit 13, a transistor 252 constituting the circuit 12, and a pixel portion 11, a transistor 61, a transistor 62, a capacitance element 63, a display element 60a, etc. On the first substrate 101, an insulating layer 211, an insulating layer 212, an insulating layer 213, an insulating layer 214, a spacer 215, etc. are provided.

[0150] The second substrate 102 is provided on the first substrate 101 side with an insulating layer 221, a light-shielding layer 231, and a coloring layer 2 32a, a colored layer 232b, a structure 230a, a structure 230b, etc. are provided.

[0151] The display element 60a is provided on the insulating layer 213. The display element 60a has a first electrode The pixel electrode 31 functions as a pixel electrode, an EL layer 222, and a second electrode 223. An optical adjustment layer 224a is provided between the insulating layer 214 and the EL layer 222. , and is provided to cover the edge of the pixel electrode 31 and the optical adjustment layer 224a.

[0152] 17, a display element 60b of an adjacent subpixel is connected to a transistor 61 and the like. The display element 60b has an optical adjustment layer 224b. Here, the colored layer 232a or the colored layer 232b is separated from the display element 60a and the display element 60b. When different colors are emitted through the optical adjustment layer 224a, as shown in FIG. It is preferable to make the thickness of the optical adjustment layer 224b different. This may also be configured as follows.

[0153] The transistor 61 functions as a switch for controlling the selection and non-selection of a subpixel. This transistor can also be called a select transistor. It is a transistor having a function of controlling the current flowing through the display element 60a. The circuit 12 and the circuit 13 are provided with a transistor 252 and a transistor 251. An example is shown.

[0154] The transistors included in the circuit 12, the circuit 13, and the pixel portion 11 all have the same structure. The transistors included in the circuit 12, the circuit 13, and the pixel portion 11 may be All transistors in the circuit may have the same structure, or transistors with different structures may be used in combination. It's fine.

[0155] In FIG. 17, transistor 251, transistor 252, transistor 61 and transistor A channel-etched bottom-gate transistor is applied to each of the transistors 62. In addition, a channel protection layer is disposed on the semiconductor layer 271. A protective bottom gate structure transistor may also be applied.

[0156] For example, the transistor 61 includes a conductive layer 275, part of which functions as a gate, and a semiconductor layer 2 71 and a pair of conductive layers 273, some of which function as source electrodes or drain electrodes. The other transistors have a similar configuration.

[0157] The capacitor element 63 is made up of a part of the conductive layer 275, a part of the insulating layer 211, and a part of the conductive layer 273. A part of each of the conductive layer 275 and the conductive layer 273 is a pair of electrodes. The insulating layer 211 functions as a dielectric.

[0158] In FIG. 17, the display elements 60a and 60b are light-emitting elements with a top-emission structure. The light emitted from the display element 60a and the display element 60b is reflected by the second substrate 1. With this configuration, the light is emitted to the display element 60a or the display element 60 By arranging transistors, capacitor elements, circuits, wiring, etc. on the lower side of b (the first substrate 101 side), This allows the aperture ratio of the pixel section 11 to be increased.

[0159] The second substrate 102 has a colored layer 23 on the surface facing the first substrate 101, the colored layer 23 overlapping the display element 60a. 2a and a colored layer 232b that overlaps with the display element 60b. The light-shielding layer 231 may be provided in the area where the colored layer 232a and the colored layer 232b are not provided. As shown in FIG. 17, the light-shielding layer 231 is provided at a position overlapping the circuit 12 and the circuit 13. In addition, a light-transmitting layer may be provided to cover the colored layer 232a, the colored layer 232b, and the light-shielding layer 231. A polymeric overcoat layer may be provided.

[0160] In addition, on the first substrate 101 side of the second substrate 102, in the region inside the adhesive layer 220, A structure 230a is provided, and a structure 230b is provided in an area outside the adhesive layer 220. The structure 230a and the structure 230b are formed by insulating layers at the ends of the second substrate 102. When a crack occurs in the second substrate 102 or the first substrate 221, the crack can be prevented from progressing. In FIG. 17, the structures 230a and 230b are the same as the light-shielding layer 231. The following is an example of a laminated structure of a layer made of the same film as the colored layer 232a. By using a laminated structure of two or more layers in this way, the progression of cracks can be further suppressed. In this case, the adhesive layer 220 is sandwiched between the structures 230. Although the configuration in which the structure 230a and the structure 230b are arranged is shown, it is also possible to arrange only one of them. If there is no risk of racking (for example, if the rigidity of the second substrate 102 etc. is high), The structure 230a and the structure 230b may not be provided.

[0161] The spacer 215 is provided on the insulating layer 214. The spacer 215 is The gap space is controlled so that the distance between the first substrate 101 and the second substrate 102 does not become shorter than necessary. The spacer 215 has a function as a spacer. The angle is preferably 45 degrees or more and 120 degrees or less, more preferably 60 degrees or more and 100 degrees or less, It is more preferable to have a portion where the angle is between 75 degrees and 90 degrees. As a result, a region where the thickness of the EL layer 222 is thin is easily formed on the side surface of the spacer 215. Therefore, a current flows between adjacent display elements via the EL layer 222. This can suppress the phenomenon of light emission. Since the distance between adjacent display elements is small, the spacer 215 having such a shape can be displayed. It is effective to provide the EL layer 222 between the elements. This is particularly effective when

[0162] The spacer 215 serves as a shielding mass when forming the EL layer 222, the second electrode 223, etc. When a mask is used, the mask has a function of preventing scratches on the surface to be formed. It's fine.

[0163] The spacer 215 overlaps the wiring (for example, the wiring 52, the wiring 53, etc.) that crosses the gate line. It is preferable that a stator is provided.

[0164] 17 shows an example of a display device 10 using a color filter system. The layer 232a or the colored layer 232b may be selected from red (R), green (G), and blue (B). It is also possible to use a configuration in which one color is expressed by three sub-pixels to which any of the three colors is applied. In addition, the use of white (W) and yellow (Y) sub-pixels improves color reproduction and reduces the This is preferable because it can reduce power consumption.

[0165] In the display element 60a, a microcavity is formed by the colored layer 232a and the optical adjustment layer 224a. The combination of Tee structures allows light with high color purity to be extracted from the display device 10. The thickness of the optical adjustment layer 224a may be set to be different depending on the color of each sub-pixel. Some sub-pixels may not have an optical adjustment layer.

[0166] In addition, an EL layer that emits white light is used as the EL layer 222 included in the display element 60a. By applying such a display element 60a, the EL layer 222 is formed in each sub-pixel. Since there is no need to paint the pixels separately, costs can be reduced and yields can be improved. It is also possible to provide optical adjustment layers with different thicknesses for each sub-pixel. The EL layer 222 may be painted differently for each sub-pixel. It is also possible to provide no layer or no coloring layer, or neither of them. In each sub-pixel, at least the light-emitting layer of the EL layer 222 is formed by coating, and the other layers are formed by coating. may be formed without being painted separately.

[0167] In FIG. 17, an FPC 241 electrically connected to the terminal portion 15a and an FPC 242 electrically connected to the terminal portion 15b are shown. 17 shows an example in which an FPC 242 is provided to connect to the The display device 10 can also be called a display module. The display device in this state can also be called a display panel.

[0168] The terminal portion 15a is electrically connected to the FPC 241 via the connection layer 243. Similarly, the connector 15b is electrically connected to the FPC 242 via a connection layer 243.

[0169] In FIG. 17, the terminal portion 15a is made of a conductive film that is the same as that of the wiring 16a and the pixel electrode 31. Similarly, the terminal portion 15b is also connected to the wiring 16b. In this way, the terminal portion 15a and the terminal portion 15b are formed in a laminated structure. By using a laminated structure of multiple conductive layers, not only is electrical resistance reduced, but mechanical strength is also improved. This is preferable because it can increase the degree of

[0170] Here, in Figure 17, the COF (Chip On Film) method is used on the FPC241. The figure shows an example in which IC244 is mounted. The IC244 may be, for example, a source driver circuit. The IC 244 can be mounted on the substrate 101 using a COG (carbon oxide film). It may also be directly mounted using a method such as a hip-on-glass method.

[0171] The insulating layers 211 and 221 are made of a material that is difficult for impurities such as water and hydrogen to diffuse. That is, it is preferable that the insulating layer 211 and the insulating layer 221 function as a barrier film. With this configuration, the first substrate 101 and the second substrate 102 can be Even if a moisture-permeable material is used, the display element 60a, transistors, etc. This effectively prevents impurities from entering through the display, resulting in a highly reliable display device. This makes it possible to achieve this position.

[0172] In FIG. 17, a hollow seal having a space 250 between a first substrate 101 and a second substrate 102 is shown. For example, the space 250 may be filled with an inert gas such as nitrogen or a rare gas. The space 250 may be filled with a liquid crystal material or a fluid material such as oil. Alternatively, the space 250 may be depressurized. However, the present invention is not limited to this, and may be a solid seal filled with resin or the like.

[0173] [Modification] FIG. 18 shows an example in which the transistor configuration is different.

[0174] The transistor 62, the transistor 251, and the transistor 252 are partially connected to the second A conductive layer 272 is provided to function as a gate electrode. This shows an example in which a semiconductor is sandwiched between two gate electrodes.

[0175] Applying a potential to one of the two gate electrodes to control the threshold voltage of the transistor This makes it possible to stabilize the electrical characteristics of the transistor.

[0176] In addition, the two gate electrodes can be electrically connected to each other to provide the same signal. Such a transistor has a field effect It is possible to increase the mobility and increase the on-current. Furthermore, it is possible to reduce the area occupied by the circuit portion. By using a transistor with a large on-state current, it is possible to increase the size of the display device. Even if the number of wires increases when the resolution is increased, the signal delay in each wire must be reduced. This makes it possible to suppress display unevenness.

[0177] In FIG. 18, transistor 62, transistor 251, and transistor 252 are connected to two A transistor having a gate electrode is applied, and the transistor 61 has one gate electrode. In this example, a transistor having a high on-state current is used. By applying a transistor with two gate electrodes, This makes it possible to reduce the size of the star (particularly the size in the channel width direction).

[0178] [Cross-sectional configuration example 1-2] 19 shows a circuit suitable for use when the pixel section 11, the circuit 13, and the circuit 14 are folded. 1 shows an example of the configuration of a display device.

[0179] In the display device 10 shown in FIG. 19, the first substrate 101 and the second substrate 102 are sealed with a sealing material 260. Therefore, an example of a case where a bonded solid sealing structure is provided is shown.

[0180] The first substrate 101 has an adhesive layer 261 on it, and an insulating layer 216 on it. Transistors, display elements, etc. are provided on the insulating layer 216. As with 21, a material that is resistant to the diffusion of impurities such as water and hydrogen can be used.

[0181] In addition, an adhesive layer 262 is provided between the second substrate 102 and the insulating layer 221 .

[0182] 19, the insulating layer 213 is formed on the pixel portion 11, the circuit 12, and the circuit 13. For example, when a resin material is used as the insulating layer 213, an opening is provided on the outside. In this case, it is preferable to provide an opening that surrounds the pixel portion 11, the circuit 12, the circuit 13, etc. By adopting such a configuration, the vicinity of the side surface of the insulating layer 213 that is in contact with the outside, the pixel section 11, the circuit 12 and the circuit 13 are not continuous, so that water can penetrate from the outside through the insulating layer 213. This can prevent impurities such as hydrogen from diffusing.

[0183] As shown in FIG. 19, a solid sealing structure is formed between the first substrate 101 and the second substrate 102. Therefore, it is easy to keep the distance between the first substrate 101 and the second substrate 1 A flexible substrate can be suitably used as the pixel portion 11. , the circuit 12 and the circuit 13 can be folded in part or in whole. For example, the display device 10 may be attached to a curved surface, or the pixel portion of the display device 10 may be folded. This allows for the realization of various types of electronic devices.

[0184] [Cross-section example 2] [Cross-sectional configuration example 2-1] FIG. 20 shows an example of a configuration where the transistor configuration is different. This corresponds to the cross section taken along the cutting line C1-C2 in (A).

[0185] The transistor 61 has a semiconductor layer 271 on the insulating layer 211 and a gate electrode on the semiconductor layer 271. A conductive layer 272 that functions as an electrode and a gate insulating layer between the semiconductor layer 271 and the conductive layer 272 an insulating layer 276 that functions as a semiconductor layer 271 and a conductive layer 272; and an insulating layer 212 that covers the semiconductor layer 271 and the conductive layer 272. A pair of conductive layers 273 functioning as a source electrode and a drain electrode is formed over the insulating layer 212. The conductive layer 273 is connected to the conductive layer of the semiconductor layer 271 through an opening provided in the insulating layer 276. It is electrically connected to the area not covered by layer 272 .

[0186] In addition, an insulating layer 217, an insulating layer 218, and an insulating layer 213 are provided over the conductive layer 273. A conductive layer 274 is provided on the insulating layer 218.

[0187] The transistor 62 and the transistor 252 have two gate electrodes sandwiching a semiconductor layer 271. The transistor 61 and the transistor 252 are covered by the insulating layer 211. A conductive layer 275, part of which functions as a gate electrode, is provided below the conductive layer 275.

[0188] Here, an opening is formed in a part of the insulating layer 218, and the conductive layer 274 is exposed through the opening. A part of the capacitor 63 is provided in contact with the upper surface of the insulating layer 217. a part of the conductive layer 274, and a part of the insulating layer 217 sandwiched therebetween. In this way, the thickness of the insulating layer located between the conductive layers that function as a pair of electrodes is reduced. This is preferable because it allows the capacitance value of the capacitive element to be increased.

[0189] [Cross-sectional configuration example 2-2] FIG. 21 shows a display device structure suitable for use when the pixel section 11, the circuit 13, etc. are folded. An example is shown below.

[0190] In the configuration shown in FIG. 21, the insulating layer 211 and the conductive layer 275 are disposed closer to the substrate 101. The insulating layer 216 and the first substrate 101 are bonded together by an adhesive layer 261. The second substrate 102 and the insulating layer 221 are bonded together by an adhesive layer 262. It has been done.

[0191] The above is the description of the cross-sectional configuration example 2.

[0192] [Variation 1] FIG. 22 shows an example in which a liquid crystal element is used as the display element 60. In FIG.

[0193] 22 shows an example of the cross-sectional structure of one sub-pixel as an example of the pixel section 11. The element 60 includes a pixel electrode 31 , a conductive layer 283 , and a liquid crystal 281 .

[0194] On the substrate 102 side, an overcoat 282 that covers the colored layer 232 and the light-shielding layer 231, and a conductive layer An electrical layer 283 is provided in a laminated manner.

[0195] In the case of a transmissive display device, the pixel electrode 31 and the conductive layer 283 are provided with a layer that transmits visible light. In addition, when a reflective display device is used, the pixel electrode 31 is made of a conductive material. A conductive material that reflects light is used.

[0196] In this example, the vertical alignment (VA) mode is used. 1 shows an example in which the liquid crystal element used in the present invention is applied to a display element 60.

[0197] VA mode is MVA (Multi-Domain Vertical Alignment). gnment) mode, PVA(Patterned Vertical Alignm) ent) mode, ECB (Electrically Controlled Bi fringence mode, CPA (Continuous Pinwheel Alignment) (ignment) mode, ASV (Advanced Super-View) mode, etc. etc. can be used.

[0198] The mode of the liquid crystal element is not limited to this, and may be, for example, IPS (In-Plane Switching) tching) mode, TN (Twisted Nematic) mode, FFS (Fr Inge Field Switching (ASM) mode, Axially Symmetry metric aligned Micro-cell) mode, OCB (Optica) lly Compensated Birefringence) mode, FLC (Fe rferoelectric Liquid Crystal) mode, AFLC (Anti Ferroelectric Liquid Crystal mode can be done.

[0199] Examples of liquid crystal materials include thermotropic liquid crystal, low molecular weight liquid crystal, polymer liquid crystal, and polymer Dispersion type liquid crystal, ferroelectric liquid crystal, antiferroelectric liquid crystal, etc. can be used. Liquids that exhibit smectic, cubic, chiral nematic, and isotropic phases Alternatively, a liquid crystal material exhibiting a blue phase can be used.

[0200] It should be noted that elements that can be used for the display element 60 are not limited to light-emitting elements and liquid crystal elements. For example, MEMS (Micro Electro Mechanical Systems) Display elements such as MEMS elements and electron-emitting elements can be used. The elements include shutter-type MEMS display elements and optical interference-type MEMS display elements. Carbon nanotubes may be used as the electron-emitting elements. Electronic paper may be used. Examples of electronic paper include microcapsule type, electrophoresis type, Uses elements that apply the electrowetting method, electronic liquid powder (registered trademark) method, etc. It is possible.

[0201] The above is a description of the modified example.

[0202] [Variation 2] An example of a touch panel having a touch sensor will be described below.

[0203] FIG. 23 shows a touch panel in which an on-cell type touch sensor is applied to the configuration shown in FIG. 20. An example of a rule is shown.

[0204] On the outer surface of the substrate 102, a conductive layer 291 and a conductive layer 292 are provided, and a conductive layer 293 is provided covering these. An insulating layer 294 is provided. A conductive layer 293 is provided over the insulating layer 294. The conductive layer 293 is provided to sandwich the conductive layer 291 through an opening provided in the insulating layer 294. The insulating layer 294 is electrically connected to the two conductive layers 292. The insulating layer 294 is bonded to the substrate 296. They are bonded together by layer 295 .

[0205] Capacitive coupling occurs between the conductive layer 291 and the conductive layer 292, and the magnitude of this capacitance is This changes when the object to be detected approaches. A plurality of conductive layers 291 and a plurality of conductive layers 292 are arranged in a grid pattern. This allows you to obtain location information.

[0206] A terminal portion 299 is provided in an area near the outer periphery of the substrate 102. , and is electrically connected to the FPC 297 via a connection layer 298 .

[0207] Here, the substrate 296 is also used as a substrate that is directly touched by a sensing object such as a finger or a stylus. In this case, a protective layer (ceramic coating, etc.) may be provided on the substrate 296. The protective layer is preferably made of, for example, silicon oxide, aluminum oxide, yttrium oxide, Inorganic insulating materials such as yttria-stabilized zirconia (YSZ) can be used. Alternatively, tempered glass may be used for the substrate 296. The tempered glass may be tempered by an ion exchange method, an air-cooling method, or the like. The material is subjected to physical or chemical treatment and compressive stress is applied to the surface. The touch sensor can be provided on one side of the tempered glass, and the other side can be used as a surface for, for example, an electronic device. By placing it on the top surface of the device and using it as a touch surface, the overall thickness of the device can be reduced. can.

[0208] As the touch sensor, for example, a capacitance type touch sensor can be applied. There are various types of capacitive touch sensors, such as surface capacitive touch sensors and projected capacitive touch sensors. There are various methods such as self-capacitance method and mutual capacitance method. When using the mutual capacitance method, simultaneous multi-point In the following, we will explain how to apply a projected capacitive touch sensor. This section explains the case where

[0209] However, the present invention is not limited to this, and it is also possible to detect the approach or contact of a detection object such as a finger or a stylus. Various sensors that can be used for this purpose can also be applied.

[0210] Here, wiring and the like that constitute the touch sensor are formed on the outer surface of the substrate 102, so-called Although the structure of the on-cell touch panel is shown, it is not limited to this. For example, an external type The configuration of an (out-cell type) touch panel or an in-cell type touch panel may also be applied. By using an on-cell or in-cell touch panel configuration, the display panel can be touched. Even if the function of the panel is added, the thickness can be reduced.

[0211] The above is a description of the cross-sectional configuration example.

[0212] [About each component] Each of the above components will be described below.

[0213] 〔substrate〕 A material having a flat surface can be used for the substrate of the display device. The substrate on the side from which the light is extracted is made of a material that transmits the light. For example, glass, quartz, ceramic Materials such as aramic, sapphire, and organic resins can be used.

[0214] By using a thin substrate, the display device can be made lighter and thinner. In addition, by using a substrate with a thickness that allows flexibility, a flexible display device can be realized. Cut.

[0215] Examples of glass include alkali-free glass, barium borosilicate glass, and aluminophobic glass. Usable materials include silicate glass.

[0216] Examples of materials that are flexible and transparent to visible light include: Thickness of glass, polyethylene terephthalate (PET), polyethylene naphthalate Polyester resins such as (PEN), polyacrylonitrile resins, polyimide resins, polymers methyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PE S) Resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamide imide resin, polyvinyl chloride resin, polytetrafluoroethylene (PTFE) resin, etc. In particular, it is preferable to use a material with a low thermal expansion coefficient, such as polyamideimide. Resin, polyimide resin, PET, etc. can be suitably used. Uses substrates impregnated with resin or substrates with a lower thermal expansion coefficient by mixing inorganic fillers into organic resin Since the substrate using such a material is light in weight, it is possible to The display device can also be made lighter.

[0217] In addition, the substrate on the side from which light is not extracted does not need to be light-transmitting. In addition to the substrate, a metal substrate or the like can also be used. Since heat can be easily conducted to the body, local temperature rises in the display device can be suppressed, which is preferable. I wish.

[0218] The material for the metal substrate is not particularly limited, but examples thereof include aluminum, copper, and nickel. Metals such as nickel, or alloys such as aluminum alloys or stainless steel are preferably used. It is possible.

[0219] In addition, insulating treatment is performed by oxidizing the surface of the metal substrate or forming an insulating film on the surface. For example, a substrate that has been subjected to a coating process such as spin coating or dipping, or an electrodeposition process may be used. The insulating film may be formed by deposition, evaporation, sputtering, or the like. In addition to leaving it in the air or heating it, an oxide film is formed on the surface of the substrate by anodizing or other methods. That's fine.

[0220] A hard coat layer (e.g., , silicon nitride layer, etc.) or a layer of material that can distribute pressure (for example, aramid resin layer, etc.) In addition, in order to prevent the deterioration of the life of the display element due to moisture, etc. Alternatively, a flexible substrate may be laminated with an insulating film having low water permeability. Inorganic insulating materials such as silicon, silicon oxynitride, aluminum oxide, and aluminum nitride are used. You can be there.

[0221] The substrate may be formed by laminating a plurality of layers. In particular, a substrate having a glass layer may be used. This improves the barrier properties against water and oxygen, making it possible to provide a highly reliable display device. For example, a substrate having a glass layer, an adhesive layer, and an organic resin layer stacked from the side closer to the light emitting element is used. By providing such an organic resin layer, it is possible to prevent breakage or cracks in the glass layer. The composite of such glass material and organic resin can suppress the generation of heat and improve the mechanical strength. By applying the composite material to the substrate, it becomes an extremely reliable flexible display device. It is possible.

[0222] [Transistor] The transistor included in the display device includes a conductive layer functioning as a gate electrode, a semiconductor layer, and A conductive layer serving as a source electrode, a conductive layer serving as a drain electrode, and a gate insulating layer and an insulating layer that functions as a dielectric layer.

[0223] Note that the structure of a transistor included in a display device of one embodiment of the present invention is not particularly limited. For example, planar, staggered, or inverted staggered transistors can be used. In addition, the transistor may have either a top gate type or a bottom gate type structure. Here, the staggered type means that the gate electrode is above the semiconductor layer and the source electrode and drain electrode are below the semiconductor layer. On the other hand, the inverted staggered type has a structure in which the in-electrode is located below the semiconductor layer. The gate electrode is located above the source electrode and the drain electrode. In the case of the semiconductor device, gate electrodes may be provided above and below the channel.

[0224] The crystallinity of the semiconductor material used in the transistor is not particularly limited. A semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single-crystal semiconductor, or a semiconductor having a partially crystalline region) If a semiconductor having crystallinity is used, This is preferable because it can suppress deterioration of the resistor characteristics.

[0225] In addition, semiconductor materials used in transistors include, for example, elements of Group 14 (silicon For the semiconductor layer, a compound semiconductor or an oxide semiconductor can be used. Typically, a semiconductor containing silicon, a semiconductor containing gallium arsenide, or an oxide containing indium A compound semiconductor or the like can be used.

[0226] In particular, it is preferable to use an oxide semiconductor having a band gap larger than that of silicon. If a semiconductor material with a wider band gap and lower carrier density than silicon is used, This is preferable because it can reduce the current in the off state of the transistor.

[0227] For example, the oxide semiconductor may contain at least indium (In) or zinc (Zn It is preferable that the oxide contains In-M-Zn (wherein M is Al, Ti, Metals such as Ga, Ge, Y, Zr, Sn, La, Ce or Hf) nothing.

[0228] In particular, the semiconductor layer has a plurality of crystal portions, and the c-axes of the crystal portions are aligned with the surface on which the semiconductor layer is formed. Or, the crystals are oriented approximately perpendicular to the upper surface of the semiconductor layer, and grain boundaries are observed between adjacent crystal portions. It is preferable to use an oxide semiconductor film that does not have a resist pattern.

[0229] Such oxide semiconductors have no crystal grain boundaries, so when the display panel is bent, The occurrence of cracks in the oxide semiconductor film due to stress is suppressed. Such oxide semiconductors are suitable for use in flexible display devices that are used in a curved state. It is possible.

[0230] In addition, by using such a crystalline oxide semiconductor for the semiconductor layer, This suppresses fluctuations in the resistance, thereby achieving a highly reliable transistor.

[0231] In addition, a transistor using an oxide semiconductor with a wider band gap than silicon is The low off-state current allows the charge stored in the capacitor connected in series with the transistor to be maintained for a long time. By applying such a transistor to a pixel, This makes it possible to stop the driving circuit while maintaining the gradation of each pixel. This makes it possible to realize a display device with reduced power consumption.

[0232] Alternatively, silicon is preferably used as the semiconductor in which the channel of the transistor is formed. Although amorphous silicon may be used as silicon, silicon having crystallinity is particularly preferred. It is preferable to use silicon. For example, microcrystalline silicon, polycrystalline silicon, single crystal silicon, etc. In particular, polycrystalline silicon has a lower temperature than single-crystal silicon. It can be formed without any additional process and has higher field effect mobility and higher reliability than amorphous silicon. By applying such a polycrystalline semiconductor to the pixel, the aperture ratio of the pixel can be improved. Even if an extremely high-definition pixel portion is provided, the scanning line driver circuit and the signal line driver circuit can be It is now possible to form circuits and pixels on the same substrate, reducing the number of components that make up electronic devices. It is possible.

[0233] Alternatively, transistors using different semiconductors may be mixed. Mixing silicon-based transistors and oxide semiconductor-based transistors In this case, for example, a transistor in a driver circuit or a Polycrystalline silicon is used for transistors that need to pass large currents, such as current control transistors. It is also preferable to apply a capacitor to transistors such as switching transistors in pixels. A capacitor is connected in series with the transistor, which holds the charge stored in it. Preferably, an oxide semiconductor is used.

[0234] [Conductive Layer] In addition to the gate, source, and drain of the transistor, various wiring and Materials that can be used for conductive layers such as electrodes include aluminum, titanium, chromium, and titanium dioxide. Aluminum, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or titanium Examples of such metals include tungsten and alloys containing tungsten as the main component. Films containing the materials can be used as single layers or as laminated structures. For example, silicon a single layer structure of aluminum film containing titanium; a two-layer structure of aluminum film laminated on titanium film; Two-layer structure with aluminum film laminated on stainless steel film, copper-magnesium-aluminum alloy Two-layer structure with copper film laminated on gold film, two-layer structure with copper film laminated on titanium film, tungsten Two-layer structure with copper film laminated on top of titanium film or titanium nitride film, and aluminum film laminated on top of that. A titanium film or a titanium nitride film is formed on the aluminum or copper film. Layer structure, molybdenum film or molybdenum nitride film, and aluminum film or A three-layer structure in which a copper film is laminated and a molybdenum film or molybdenum nitride film is formed on top of that It is also possible to use oxides such as indium oxide, tin oxide, or zinc oxide. In addition, copper containing manganese is preferable because it improves the controllability of the shape by etching. .

[0235] Further, the light-transmitting material can be used for conductive layers such as various wirings and electrodes that constitute a display device. Materials with this property include indium oxide, indium tin oxide, and indium zinc oxide. Conductive oxides such as zinc oxide and zinc oxide doped with gallium, or graphene are used. Or gold, silver, platinum, magnesium, nickel, tungsten, chromium , molybdenum, iron, cobalt, copper, palladium, titanium, or other metal materials, An alloy material containing the metal material can be used. Alternatively, a nitride of the metal material (e.g., nitride Titanium) may be used. Metal materials and alloy materials (or their nitrides) may be used. In the case where the conductive layer is made of a material other than the conductive material, the conductive layer may be thin enough to have light-transmitting properties. For example, an alloy of silver and magnesium and indium tin oxide can be used. It is preferable to use a laminated film or the like, since the conductivity can be increased.

[0236] [Insulating layer] Examples of insulating materials that can be used for the insulating layers, overcoats, spacers, etc. include: For example, resins such as acrylic and epoxy resins, and resins having siloxane bonds such as silicone resins. Others include silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, and aluminum oxide. Alternatively, inorganic insulating materials such as ammonium may be used.

[0237] It is also preferable that the light emitting element is provided between a pair of insulating films with low water permeability. This prevents impurities such as water from entering the light emitting element, and prevents a decrease in the reliability of the device. It can be controlled.

[0238] As insulating films with low water permeability, films containing nitrogen and silicon such as silicon nitride film and silicon nitride oxide film are used. and films containing nitrogen and aluminum, such as an aluminum nitride film. A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may also be used.

[0239] For example, the water vapor permeation rate of a low-permeability insulating film is 1×10 -5 [g / (m 2 ·day) ] or less, preferably 1 × 10 -6 [g / (m 2 ·day)] or less, preferably 1 × 1 0 -7 [g / (m 2 ·day)] or less, more preferably 1 × 10 -8 [g / (m 2 ·d ay)] below.

[0240] [Adhesive layer, sealing material] The adhesive layer and sealing material can be a photo-curable adhesive such as an ultraviolet curable adhesive, a reaction-curable adhesive, or a heat-curable adhesive. Various curing adhesives such as curable adhesives and anaerobic adhesives can be used. Examples include epoxy resin, acrylic resin, silicone resin, phenolic resin, and polyimide resin. Oil, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) Resins, EVA (ethylene vinyl acetate) resins, etc. In particular, epoxy resins, etc. A material with low moisture permeability is preferable. Two-component resin may also be used. A card or the like may also be used.

[0241] The resin may also contain a desiccant. For example, an oxide of an alkaline earth metal (an acid The material used is one that absorbs moisture by chemical adsorption, such as calcium oxide or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb water by physical adsorption. If a desiccant is included, impurities such as moisture can be absorbed into the functional element. This is preferable because it can suppress the intrusion of foreign matter and improve the reliability of the display panel.

[0242] Furthermore, by mixing a filler with a high refractive index or a light scattering material into the resin, it is possible to For example, titanium oxide, barium oxide, Zeolite, zirconium, etc. can be used.

[0243] [Light-emitting element] The light emitting element can be a self-luminous element, which can be illuminated by current or voltage. The category includes devices whose light intensity is controlled, such as light-emitting diodes (LEDs), organic An EL element, an inorganic EL element, etc. can be used.

[0244] Light-emitting elements are available in top-emission, bottom-emission, and dual-emission types. The electrode on the light extraction side uses a conductive film that transmits visible light. In addition, it is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted. stomach.

[0245] The EL layer has at least a light-emitting layer. The EL layer has a hole-injecting layer as a layer other than the light-emitting layer. high hole-transporting material, hole-blocking material, high electron-transporting material, electron injection materials with high electron transporting and hole transporting properties, or bipolar materials (materials with high electron transporting and hole transporting properties), etc. The film may further include a layer containing a metal oxide.

[0246] The EL layer can be made of either low molecular weight compounds or high molecular weight compounds. The layers constituting the EL layer may each be formed by a deposition method (including a vacuum deposition method). The layer can be formed by a method such as a transfer method, a printing method, an ink jet method, or a coating method.

[0247] When a voltage higher than the threshold voltage of the light-emitting element is applied between the cathode and anode, the EL layer is charged from the anode side. Holes are injected from the cathode side, and electrons are injected from the cathode side. The injected electrons and holes are The luminescent material contained in the EL layer emits light.

[0248] When a white light emitting element is used as the light emitting element, two or more types of light emitting elements are used in the EL layer. For example, it is preferable to use a configuration in which two or more luminescent materials each emit light of a complementary color. White light can be obtained by selecting a luminescent material so that the following relationship is established. Luminescent materials that emit light in R (red), G (green), B (blue), Y (yellow), O (orange), etc. Or among luminescent materials that emit light containing spectral components of two or more colors of R, G, and B, It is preferable that the spectrum of light emitted from the light-emitting element is in the visible light region. A light emitting element having two or more peaks within a wavelength range (for example, 350 nm to 750 nm) is used. It is preferable to use a material having a peak in the yellow wavelength region. Preferably, the material has spectral components in the green and red wavelength regions as well.

[0249] The EL layer is made up of a light-emitting layer containing a light-emitting material that emits one color and a light-emitting layer containing a light-emitting material that emits another color. For example, a plurality of light-emitting layers in the EL layer are preferably stacked. The layers may be stacked in contact with each other or separated by an area that does not contain any light-emitting material. For example, a fluorescent-emitting layer or a phosphorescent-emitting layer may be laminated between the fluorescent-emitting layer and the phosphorescent-emitting layer. The phosphorescent layer contains the same materials (for example, a host material and an assist material) as the phosphorescent layer, and A region that does not contain any optical material may be provided. This makes it easier to manufacture the light-emitting element. Furthermore, the driving voltage is reduced.

[0250] The light-emitting element may be a single element having one EL layer, or a light-emitting element having multiple EL layers. and a charge generating layer may be laminated therebetween to form a tandem element.

[0251] The conductive film that transmits visible light is made of, for example, indium oxide, indium tin oxide, indium tin oxide, Galvanic zinc oxide, zinc oxide, zinc oxide doped with gallium, etc. can be used. , gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, Metallic materials such as ballast, copper, palladium, or titanium, alloys containing these metallic materials, or Nitrides of these metal materials (for example, titanium nitride) can also be formed thin enough to have translucency. Furthermore, a laminated film of the above materials can be used as a conductive layer. For example, if a laminated film of an alloy of silver and magnesium and indium tin oxide is used, This is preferable because it can increase the electrical conductivity. Graphene and the like may also be used.

[0252] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, tungsten, or the like. Metallic materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, or palladium, or In addition, the above metal materials and alloys may contain lanthanum. Tungsten, neodymium, germanium, etc. may be added. Titanium, nickel Alternatively, an alloy containing neodymium and aluminum (aluminum alloy) may be used. Alternatively, an alloy containing silver and copper, palladium, or magnesium may be used. The alloy is preferable because of its high heat resistance. Furthermore, an aluminum film or an aluminum alloy film By laminating a metal film or a metal oxide film in contact with the aluminum film or the aluminum oxide film, The oxidation of the alloy film can be suppressed. Materials for such metal films and metal oxide films include: In addition, the conductive film and the metal material that transmit visible light may be used. For example, a laminated film of silver and indium tin oxide, a laminated film of silver and magnesium, A laminated film of an alloy of indium and indium tin oxide can be used.

[0253] The conductive layers may be formed by evaporation or sputtering. Using a discharge method such as inkjet printing, a printing method such as screen printing, or a plating method It can be formed.

[0254] The above-mentioned light-emitting layer, the substance having a high hole injection property, the substance having a high hole transport property, and the electrode The layer containing a substance having a high electron transporting property, a substance having a high electron injecting property, a bipolar substance, or the like is These include inorganic compounds such as quantum dots and polymer compounds (oligomers, dendrimers, polymers, etc.). For example, by using quantum dots in the light-emitting layer, It can also function as

[0255] The quantum dot materials include colloidal quantum dot materials, alloy quantum dot materials, Core-shell type quantum dot materials, core type quantum dot materials, etc. can be used. , materials containing elements from groups 12 and 16, 13 and 15, or 14 and 16 Alternatively, cadmium, selenium, zinc, sulfur, phosphorus, indium, tellurium, Quantum dot materials containing elements such as lead, gallium, arsenic, and aluminum may also be used.

[0256] [Colored layer] Materials that can be used for the coloring layer include metal materials, resin materials, pigments, and dyes. Examples include resin materials.

[0257] [Light blocking layer] Materials that can be used for the light-shielding layer include carbon black, metal oxides, and a plurality of metals. In addition, the light-shielding layer may contain the material of the coloring layer. For example, a material used for a colored layer that transmits light of a certain color can be used. and a layer structure of a film containing a material used for a colored layer that transmits light of other colors. By using the same material for the colored layer and the light-shielding layer, it is possible to standardize the equipment and simplify the process. This is preferable because it can be simplified.

[0258] [Connection layer] The connection layer that connects the FPC or IC to the terminals is made of anisotropic conductive film (ACF). Anisotropic Conductive Film (ACP) and Anisotropic Conductive Paste (ACP) Anisotropic Conductive Paste) can be used. do.

[0259] This concludes the explanation of each component.

[0260] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0261] (Fourth embodiment) In this embodiment mode, an example of a manufacturing method of a display device using a flexible substrate will be described. do.

[0262] Here, the display element, the circuit, the wiring, the electrode, the insulating layer, and the optical layer such as the colored layer and the light-shielding layer are The layers containing the optical components are collectively called the element layer. For example, the element layer may contain a display element. In addition to the display element, wiring electrically connected to the display element, transistors used in pixels and circuits, The sensor may also include elements such as a capacitor.

[0263] In this case, when the display element is completed (when the manufacturing process is completed), the element layer is supported. A flexible member that supports the substrate is called a substrate. This also includes extremely thin films of 10 nm or more and 300 μm or less.

[0264] A typical method for forming an element layer on a flexible substrate having an insulating surface is to There are two methods as follows: One is to form the element layer directly on a flexible substrate. The other method is to form an element layer on a support substrate that is different from the flexible substrate. After that, the element layer is peeled off from the support substrate, and the element layer is transferred to the substrate. Although not described in detail, in addition to the above two methods, a device layer may be formed on a non-flexible substrate. Alternatively, the substrate may be made flexible by thinning it by polishing or the like.

[0265] If the material constituting the substrate is heat resistant to the heat applied in the process of forming the element layer, It is preferable to form the element layer directly on the substrate, since this simplifies the process. When the element layer is formed while the plate is fixed to the support substrate, it is easy to transport the plate within and between devices. This is preferable because it is easier.

[0266] In addition, when a method of forming an element layer on a support substrate and then transferring the element layer to the substrate is used, the element layer is first transferred to the support substrate. A release layer and an insulating layer are stacked on a supporting substrate, and an element layer is formed on the insulating layer. The element layer is then transferred to the substrate. A material may be selected that allows peeling to occur at the interface between the peeling layer and the insulating layer or within the peeling layer. In this method, a material with high heat resistance is used for the support substrate and the peeling layer, and an element layer is formed. This allows for an increase in the upper limit of the temperature during the formation of a device layer, resulting in a device with higher reliability. This is preferable because it is possible.

[0267] For example, a layer containing a high melting point metal material such as tungsten as a peeling layer and a layer containing the metal material Layers containing oxide are stacked. In addition, silicon oxide, silicon nitride, etc. are used as insulating layers on the peeling layer. It is preferable to use a multi-layer structure of silicon, silicon oxynitride, silicon nitride oxide, etc. In this specification, an oxynitride is a compound containing more oxygen than nitrogen. Nitrogen oxide refers to a material that has a high nitrogen content compared to oxygen. Refers to the material.

[0268] The element layer and the support substrate can be separated by applying a mechanical force or by etching the separation layer. Examples include etching or infiltrating the peeled interface with a liquid. Alternatively, the difference in the thermal expansion coefficient of the two layers that form the peeling interface can be utilized to heat or The peeling may be carried out by cooling.

[0269] When peeling begins, a starting point for peeling is first formed, and peeling progresses from that starting point. The starting point of peeling is preferably a point where a part of the insulating layer or the peeling layer is locally heated by laser light or the like. and by physically cutting or penetrating a part of the insulating layer or peeling layer with a sharp object. It can be formed.

[0270] Furthermore, if peeling can be achieved at the interface between the support substrate and the insulating layer, it is not necessary to provide a peeling layer.

[0271] For example, glass is used as the support substrate, and an organic resin such as polyimide is used as the insulating layer. By doing so, it is possible to peel off the interface between the glass and the organic resin. The above organic resins can also be used as the substrate.

[0272] Alternatively, a heat generating layer is provided between the support substrate and the insulating layer made of organic resin, and the heat generating layer is heated. By doing so, the heat generating layer may be peeled off at the interface between the heat generating layer and the insulating layer. Materials that generate heat by passing current through them, materials that generate heat by absorbing light, and materials that generate heat by applying a magnetic field. For example, the heat generating layer can be made of various materials, such as a material that generates heat by heating. The material can be selected from semiconductors, metals, and insulators.

[0273] A more specific example of the manufacturing method will be described below. The flexible display device according to one embodiment of the present invention can be manufactured by changing the layer to be peeled off. A device can also be fabricated.

[0274] First, an island-shaped release layer 303 is formed on a fabrication substrate 301, and a layer to be peeled 3 is formed on the release layer 303. Separately, an island-shaped peeling layer 325 is formed on the fabrication substrate 321 (FIG. 24(A)). A layer 323 is formed, and a layer to be peeled 325 is formed on the peeling layer 323 (FIG. 24(B)).

[0275] Here, an example of forming an island-shaped release layer is shown, but the present invention is not limited to this. When peeling the peeled layer from the substrate, the interface between the substrate and the peeled layer, and the interface between the peeled layer and the layer to be peeled In this embodiment, a material is selected that allows separation to occur in the peeling layer. This example shows a case where peeling occurs at the interface of the peeling layer, but the combination of materials used for the peeling layer and the layer to be peeled may also cause peeling. In addition, when the layer to be peeled has a laminated structure, the layer in contact with the peeling layer The layer is specifically referred to as the first layer.

[0276] For example, when the peeling layer has a laminated structure of a tungsten film and a tungsten oxide film, Peeling occurs at the interface (or near the interface) between the tungsten film and the tungsten oxide film, A part of the peeling layer (here, the tungsten oxide film) may remain on the peeling side. The remaining release layer may then be removed.

[0277] The substrate used for the fabrication is a substrate that has at least heat resistance that can withstand the processing temperature during the fabrication process. The substrate for fabrication may be, for example, a glass substrate, a quartz substrate, a sapphire substrate, a semiconductor substrate, a ceramic substrate, or the like. A ceramic substrate, a metal substrate, a resin substrate, a plastic substrate, or the like can be used.

[0278] When a glass substrate is used as the substrate for preparation, an oxide film is formed between the substrate for preparation and the peeling layer as a base film. Forming insulating films such as silicon film, silicon oxynitride film, silicon nitride film, and silicon nitride oxide film This is preferable because it can prevent contamination from the glass substrate.

[0279] The release layer is made of tungsten, molybdenum, titanium, tantalum, niobium, nickel, or cobalt. Zirconium, Zinc, Ruthenium, Rhodium, Palladium, Osmium, Iridium an element selected from silicon, an alloy material containing the element, or a compound material containing the element, etc. The crystal structure of the silicon-containing layer may be amorphous, microcrystalline, or polycrystalline. Also, aluminum oxide, gallium oxide, zinc oxide, titanium dioxide, indium oxide, Gold, such as indium, indium tin oxide, indium zinc oxide, and In-Ga-Zn oxide The peeling layer may be made of a high melting point metal such as tungsten, titanium, or molybdenum. The use of a metal material is preferable because it increases the degree of freedom in the process of forming the peeled layer.

[0280] The release layer can be formed by, for example, sputtering, plasma CVD, or coating (spin coating). The peeling layer can be formed by a method such as a droplet ejection method, a dispensing method, or a printing method. is, for example, 10 nm or more and 200 nm or less, preferably 20 nm or more and 100 nm or less.

[0281] When the release layer has a single layer structure, it is made up of a tungsten layer, a molybdenum layer, or a combination of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten and tungsten. a layer containing an oxynitride, a layer containing an oxide or oxynitride of molybdenum, or a layer containing tungsten Alternatively, a layer containing an oxide or oxynitride of a mixture of silicon and molybdenum may be formed. The mixture of tungsten and molybdenum is, for example, a mixture of tungsten and molybdenum. Correct.

[0282] In addition, a layer containing tungsten and a layer containing tungsten oxide may be used as a peeling layer. When forming a structure, a layer containing tungsten is formed, and an insulating layer made of oxide is formed on top of it. By forming a film, a tungsten oxide film is formed at the interface between the tungsten layer and the insulating film. The surface of the tungsten-containing layer may be subjected to thermal oxidation. Oxidizing agents such as oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, and ozone water A layer containing tungsten oxide may be formed by treating with a solution or the like. Treatment and heating may be carried out using oxygen, nitrogen, or nitrous oxide, either alone or in combination with other gases. The plasma treatment or heat treatment may be performed under a mixed gas atmosphere. By changing the temperature, it is possible to control the adhesion between the release layer and the insulating film that will be formed later. be.

[0283] Note that if peeling can be performed at the interface between the formation substrate and the peeled layer, a peeling layer may not be provided. For example, glass is used as the substrate, and polyimide, polyester, or polyimide is placed in contact with the glass. Next, an organic resin such as polyolefin, polyamide, polycarbonate, or acrylic is formed. By performing laser irradiation or heat treatment, the adhesion between the formation substrate and the organic resin is improved. Then, insulating films and transistors are formed on the organic resin. Laser irradiation is performed at a higher energy density, or heat treatment is performed at a higher temperature than the previous heat treatment. By doing this, it is possible to separate the organic resin from the substrate at the interface. Separation may also be achieved by infiltrating a liquid into the interface between the substrate and the organic resin.

[0284] In this method, insulating films and transistors are formed on organic resins with low heat resistance, so In the manufacturing process, it is not possible to expose the substrate to high temperatures. Since the capacitor does not require a high-temperature manufacturing process, it can be suitably formed on an organic resin.

[0285] The organic resin may be used as a substrate for forming a device, or the organic resin may be removed. Alternatively, another substrate may be attached to the exposed surface of the layer to be peeled using an adhesive. Another substrate (support film) may be attached to the resin using an adhesive.

[0286] Alternatively, a metal layer is provided between the substrate and the organic resin, and a current is passed through the metal layer. The layer may be heated to effect peeling at the interface between the metal layer and the organic resin.

[0287] There is no particular limitation on the layer to be peeled. For example, in the case of forming a display device shown in FIG. In this case, the insulating layer 216, the transistors, the display elements, etc. are used as one of the layers to be peeled. The other peeled layer may be an insulating layer 221, each colored layer, and a light-shielding layer 222. 31, etc. can be formed.

[0288] The insulating layer (first layer) formed in contact with the peeling layer is a silicon nitride film or a silicon oxynitride film. The insulating film may be formed in a single layer or multiple layers using a silicon oxide film, a silicon nitride oxide film, or the like. However, the present invention is not limited to this, and an optimum material can be selected depending on the material used for the release layer. This can be done.

[0289] The insulating layer is formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. For example, it is possible to form a thin film at a temperature of 250°C or higher and 400°C or higher by plasma CVD. By forming the film at a temperature of 0.5 ° C. or less, a dense and highly moisture-proof film can be obtained. The thickness of the insulating layer is 10 nm to 3000 nm, and further 200 nm to 1500 nm. Below is preferred.

[0290] Next, the fabrication substrate 301 and the fabrication substrate 321 are placed so that the surfaces on which the peeled layers are formed face each other. The adhesive layer 307 is used to bond the two pieces together so that they face each other, and the adhesive layer 307 is cured (FIG. 24( C).

[0291] The bonding of the fabrication substrate 301 and the fabrication substrate 321 is preferably carried out under a reduced pressure atmosphere. It's nice.

[0292] In addition, FIG. 24C shows a case where the peeling layer 303 and the peeling layer 323 have different sizes. However, as shown in FIG. 24(D), a release layer of the same size may be used.

[0293] The adhesive layer 307 is connected to the peeling layer 303, the peeled layer 305, the peeled layer 325, and the peeling layer 323. The end of the adhesive layer 307 is placed on the release layer 303 or the release layer 323. It is preferable that the edge of the film is located inside at least one of the edges (the edge that is to be peeled first). This prevents the fabrication substrate 301 and the fabrication substrate 321 from adhering too closely to each other, and the subsequent peeling process can be carried out. This can prevent the yield from decreasing.

[0294] The adhesive layer 307 may be made of, for example, a light-curing adhesive such as an ultraviolet-curing adhesive, a reaction-curing adhesive, or a heat-curing adhesive. Various types of curing adhesives such as curing adhesives and anaerobic adhesives can be used. Adhesives include epoxy resin, acrylic resin, silicone resin, phenolic resin, and polyimide. Examples include amide resin, imide resin, PVC resin, PVB resin, EVA resin, etc. A material with low moisture permeability, such as epoxy resin, is preferable. It is preferable to use a material with low fluidity so that it can be used as a material for adhesive sheets, pressure sensitive adhesive sheets, etc. Alternatively, a sheet or film adhesive may be used. For example, OCA (optical adhesive) A clear adhesive film can be preferably used.

[0295] The adhesive may have adhesiveness before bonding, and may be adhesive by heating or irradiating with light after bonding. The adhesiveness may be exhibited by

[0296] The resin may also contain a desiccant. For example, an oxide of an alkaline earth metal (an acid The material used is one that absorbs moisture by chemical adsorption, such as calcium oxide or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb water by physical adsorption. Adsorbent materials may be used. If a desiccant is included, the function of the device will be impaired by the ingress of moisture from the atmosphere. This is preferable because it can suppress deterioration of the elements and improve the reliability of the device.

[0297] Next, a starting point for peeling is formed by irradiation with laser light (FIGS. 25(A) and 25(B)).

[0298] The fabrication substrate 301 and the fabrication substrate 321 may be peeled from either one of them. In this case, the substrate may be peeled off from a substrate on which a large peeling layer is formed, or from a substrate on which a small peeling layer is formed. The device may be peeled off from the substrate. When the device is fabricated, it may be peeled off from the substrate on which the device is formed, or from the other substrate. Here, an example in which the formation substrate 301 is peeled off first will be shown.

[0299] The laser beam is directed to the adhesive layer 307 in a cured state, the peeled layer 305, and the peeling layer 303, which are overlapped with each other. The area is irradiated (see arrow P1 in FIG. 25(A)).

[0300] By removing a part of the first layer, a starting point of peeling can be formed (the area surrounded by the dotted line in FIG. 25(B)). At this time, not only the first layer but also other layers of the layer to be peeled 305 and the peeling layer 3 03. A portion of the adhesive layer 307 may be removed.

[0301] The laser light is preferably irradiated from the substrate side on which the peeling layer to be peeled is provided. When the laser beam is irradiated to the region where the layer 303 and the peeling layer 323 overlap, By forming cracks only in the layer to be peeled 305 among the layer to be peeled 325, the substrate can be selectively fabricated. The plate 301 and the release layer 303 can be peeled off (see the area surrounded by the dotted line in FIG. 25(B)). Here, an example is shown in which a part of each layer constituting the peeled layer 305 is removed.

[0302] Then, the layer to be peeled 305 and the substrate 301 are separated from each other at the peeling starting point (FIG. 25(C)(D)). As a result, the peeled layer 305 is removed from the fabrication substrate 301 to the fabrication substrate 321. can be transposed to

[0303] For example, from the starting point of peeling, physical force (peel-off by hand or jig, roller The layer to be peeled 305 and the substrate 301 are separated by a process such as a process of separating the layer while rotating the substrate. That's fine.

[0304] In addition, a liquid such as water is permeated into the interface between the peeling layer 303 and the peeled layer 305 to form the fabrication substrate 3 The liquid may be separated from the peeling layer 303 and the peeled layer 305 by capillary action. By penetrating between the separation layers 305, separation can be easily achieved. Static electricity adversely affects the functional elements included in the peeled layer 305 (semiconductor elements are electrostatically It can suppress damage such as destruction by energy.

[0305] Next, the exposed peeled layer 305 and the substrate 331 are bonded together using an adhesive layer 333. The adhesive layer 333 is cured (FIG. 26(A)).

[0306] It is preferable that the peeled layer 305 and the substrate 331 are bonded together in a reduced pressure atmosphere. .

[0307] Next, a starting point for peeling is formed by irradiating with laser light (FIGS. 26(B) and 26(C)).

[0308] The laser beam is focused on the adhesive layer 333 in a cured state, the peeled layer 325, and the peeling layer 323, which are overlapped with each other. The area is irradiated (see arrow P2 in Figure 26(B)). This allows the formation of a peeling starting point (see the area surrounded by the dotted line in Figure 26(C). Here is an example of removing part of each layer that makes up 325.) In this case, not only the first layer but also Other layers of the layer to be peeled 325, or parts of the peeling layer 323 and adhesive layer 333 may be removed.

[0309] It is preferable that the laser light is irradiated from the side of the formation substrate 321 on which the peeling layer 323 is provided. .

[0310] Then, the peeled layer 325 and the fabrication substrate 321 are separated from each other at the peeling starting point (FIG. 26(D)). As a result, the layer to be peeled 305 and the layer to be peeled 325 are transferred to the substrate 331. It is possible.

[0311] After that, a substrate can be further attached to the layer to be peeled 325 .

[0312] The exposed peeled layer 325 and the substrate 341 are bonded together with an adhesive layer 343. 27A, the substrate 341 is pre-formed with an opening. This shows an example of this.

[0313] In this manner, the layer to be peeled can be sandwiched between the pair of flexible substrates.

[0314] Thereafter, as shown in FIG. 27(B), unnecessary end portions of the substrates 331, 341, etc. are cut off. At this time, the end portions of the layer to be peeled 305 and the layer to be peeled 325 may be removed at the same time. It may be cut.

[0315] By the above method, a flexible device can be manufactured. By using the configuration exemplified in the above embodiment, a flexible display device can be manufactured. can.

[0316] In the above-described method for manufacturing a display device according to one embodiment of the present invention, After bonding a pair of substrates having the above-mentioned structure, a starting point for peeling is formed by irradiating the substrate with laser light. Then, the peeling layer and the peeled layer are brought into a state where they can be easily peeled from each other, and then the peeling is carried out. This can improve the yield of the peeling process.

[0317] In addition, after a pair of substrates on which a peeled layer is formed are bonded together in advance, After peeling, a substrate constituting a device to be manufactured can be attached to the peeled layer. Therefore, when bonding the layers to be peeled together, it is necessary to bond the substrates having low flexibility together. This allows for more accurate alignment of the substrates than when bonding flexible substrates together. It can be improved.

[0318] As shown in FIG. 28(A), the edge of the region 351 to be peeled of the layer 305 is It is preferable that the edge of the peeling layer 303 is positioned inside the edge of the peeling layer 303. This improves the yield of the peeling process. In addition, when there are a plurality of regions 351, as shown in FIG. As shown in FIG. 28(C), a peeling layer 303 may be provided for each region 351. A plurality of regions 351 may be provided on one release layer 303 .

[0319] The above is a description of the method for manufacturing a flexible display device.

[0320] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0321] (Embodiment 5) In this embodiment, examples of electronic devices to which the display device of one embodiment of the present invention can be applied will be described. do.

[0322] Electronic devices and lighting devices can be manufactured using the display device of one embodiment of the present invention. By using such a display device, electronic devices and lighting devices with high display quality can be manufactured. By using such a display device, electronic devices and lighting devices with good viewing angle characteristics can be manufactured. By using the display device of one embodiment, electronic devices and lighting devices with reduced power consumption can be manufactured. In addition, highly reliable electronic devices and lighting devices can be manufactured using the display device of one embodiment of the present invention. .

[0323] Examples of electronic devices include television sets, desktop or notebook PCs, etc. Personal computers, computer monitors, digital cameras, digital videos Cameras, digital photo frames, mobile phones, portable game consoles, personal digital assistants, audio players Examples include live video equipment, large gaming machines such as pachinko machines, etc.

[0324] The electronic device or lighting device according to one embodiment of the present invention can be used for interior or exterior walls of a house or building, Alternatively, it can be incorporated along curved surfaces in the interior or exterior of a vehicle.

[0325] The electronic device of one embodiment of the present invention may include a secondary battery and may be powered by wireless power transmission. It is preferable that the secondary battery can be charged.

[0326] As the secondary battery, for example, a lithium polymer battery (lithium ion battery) using a gel electrolyte is used. Lithium-ion secondary batteries such as lithium-ion polymer batteries, nickel-metal hydride batteries, nickel-cadmium batteries, organic Examples include radical batteries, lead-acid batteries, secondary air batteries, nickel-zinc batteries, and silver-zinc batteries. do.

[0327] The electronic device according to one embodiment of the present invention may include an antenna. By doing so, it is possible to display images, information, etc. on the display unit. If the device has a secondary battery, the antenna may be used for contactless power transmission.

[0328] The electronic device according to one embodiment of the present invention includes a sensor (force, displacement, position, velocity, acceleration, angular velocity, rotation Number, distance, light, liquid, magnetism, temperature, chemicals, sound, time, hardness, electric field, current, voltage, power (including the ability to measure radiation, flow rate, humidity, gradient, vibration, odor or infrared) It may have.

[0329] The electronic device of one embodiment of the present invention can have various functions. (still images, videos, text images, etc.) on the display, touch panel function, calendar Functions such as displaying date and time, running various software (programs) functions, wireless communication functions, and functions to read programs or data recorded on recording media. It can have functions etc.

[0330] Furthermore, in an electronic device having a plurality of display units, one display unit is mainly used for displaying image information. and one display unit mainly displays text information, or multiple displays By displaying images that take parallax into consideration, it is possible to have a function for displaying a three-dimensional image. Furthermore, electronic devices with an image receiving unit have the function of taking still or moving images, Functions for automatically or manually correcting captured images, and for storing captured images on a recording medium (external or electronic) It can have functions such as saving the captured image to a memory card (built into the device) and displaying the captured image on the display. Note that the functions of the electronic device of one embodiment of the present invention are not limited to those described above, and various functions can be used. can have:

[0331] 29(A) to 29(E) show examples of electronic devices having a curved display unit 7000. The display unit 7000 has a curved display surface, and displays images along the curved display surface. The display unit 7000 may be flexible.

[0332] The display portion 7000 is manufactured using the display device or the like according to one embodiment of the present invention. This reduces power consumption and provides a highly reliable electronic device with a curved display. can.

[0333] An example of a mobile phone is shown in Figures 29(A) and 29(B). 29B. Each of the mobile phone 7110 shown in FIG. 29B includes a housing 7101, a display unit 7102, and a 000, operation button 7103, external connection port 7104, speaker 7105, microphone 71 29(B) further includes a camera 7107. Has.

[0334] Each mobile phone has a touch sensor on the display unit 7000. All operations, such as entering text, can be performed by touching the display 7000 with a finger or a stylus. It can be done.

[0335] In addition, by operating the operation button 7103, the power can be turned on and off, and the display unit 7000 For example, from the email creation screen, you can change the type of image displayed. You can switch to the main menu screen.

[0336] Also, a detection device such as a gyro sensor or an acceleration sensor may be provided inside the mobile phone. The orientation of the mobile phone (portrait or landscape) is then determined and the orientation of the screen display of the display unit 7000 is automatically adjusted. The screen orientation can be dynamically switched. Touching 7000, operating the operation button 7103, or using the microphone 7106 This can also be done by inputting, etc.

[0337] 29(C) and (D) show examples of the portable information terminal. The portable information terminal shown in FIG. 29(C) The portable information terminal 7200 and the portable information terminal 7210 shown in FIG. 29(D) each include a housing 7201 and a It has a display unit 7000. It also has operation buttons, an external connection port, a speaker, a microphone, and an The display unit 7000 may have an antenna, a camera, a battery, etc. The mobile information terminal is operated by touching the display unit 7000 with a finger or a stylus. This can be done.

[0338] The portable information terminal exemplified in this embodiment is, for example, a telephone, a notebook, an information viewing device, etc. Specifically, as a smartphone, The portable information terminal exemplified in this embodiment can be, for example, a mobile phone, a telephone E-mail, viewing and writing text, playing music, internet communication, computer games, etc. A variety of applications can be executed.

[0339] The portable information terminal 7200 and the portable information terminal 7210 are configured to display text and image information on a plurality of For example, as shown in Figure 29(C) and (D), three operation buttons can be displayed on the screen. A button 7202 can be displayed on one side, and rectangular information 7203 can be displayed on the other side. FIG. 29(C) shows an example in which information is displayed on the upper side of the mobile information terminal, and FIG. 29(D) shows an example in which information is displayed on the upper side of the mobile information terminal. Here is an example of information being displayed on the side of a mobile information terminal. The information may be displayed on the

[0340] Examples of such information include notifications from social networking services (SNS). , display notifying you of incoming e-mails or phone calls, subject of e-mails or sender name , date and time, battery level, antenna reception strength, etc. Instead of information, operation buttons, icons, etc. may be displayed at the position where the information is displayed.

[0341] For example, the user of the mobile information terminal 7200 may place the mobile information terminal 7200 in the breast pocket of his / her clothes. When the item is stored, the display (information 7203 in this example) can be confirmed.

[0342] Specifically, the telephone number or name of the caller of the incoming call is recorded on the mobile information terminal 7200. The user can take the mobile information terminal 7200 out of his / her pocket and You can check the display and decide whether to answer the call without taking it out.

[0343] FIG. 29(E) shows an example of a television device. The television device 7300 has a housing 7 The display unit 7000 is built into the housing 7301. 301 is shown as a supported configuration.

[0344] The television device 7300 shown in FIG. 29E is operated by an operation switch provided in the housing 7301. This can be done by a separate remote control 7311 or the display unit 70. The display unit 7000 may be provided with a touch sensor, and the operation can be performed by touching the display unit 7000 with a finger or the like. The remote control operator 7311 may display information to be output from the remote control operator 7311. The remote control unit 7311 may have a display unit that displays the operation keys or touch panel. The channel and volume can be controlled by the touch panel, and the information displayed on the display unit 7000 can be displayed. You can control the video that is displayed.

[0345] The television device 7300 includes a receiver, a modem, and the like. The receiver can receive general television broadcasts. By connecting to a wireless communication network, it can be transmitted in one direction (sender to receiver) or It is also possible to communicate information in both directions (between sender and receiver, or between receivers). be.

[0346] FIG. 29(F) shows an example of a lighting device having a curved light-emitting portion.

[0347] The light-emitting portion of the lighting device illustrated in FIG. 29F is formed using the display device or the like according to one embodiment of the present invention. According to one aspect of the present invention, a light emitting device having reduced power consumption, a curved light emitting portion, and A highly reliable lighting device can be provided.

[0348] The light-emitting unit 7411 of the lighting device 7400 shown in FIG. 29(F) has two convexly curved Therefore, the light emitting units are arranged symmetrically around the lighting device 7400. It can illuminate in all directions.

[0349] Furthermore, the light-emitting unit included in the lighting device 7400 may be flexible. The light emitting surface of the light emitting part can be freely adjusted according to the application. The structure may be bendable.

[0350] The lighting device 7400 includes a base 7401 having an operation switch 7403, and a It has a light emitting portion 7411 that is supported.

[0351] Here, the illumination device in which the light-emitting unit is supported by the base is exemplified. The housing may be fixed to the ceiling or hung from the ceiling. The light-emitting surface can be curved, so a specific area can be illuminated by curving the light-emitting surface concavely. It can be used to illuminate a small area, or the light-emitting surface can be curved convexly to illuminate an entire room.

[0352] 30(A) to (I) show a display device having a flexible and bendable display unit 7001. 1 shows an example of a portable information terminal.

[0353] The display portion 7001 is manufactured using a display device or the like according to one embodiment of the present invention. It is possible to apply a display device that can be bent to a diameter of 0.01 mm or more and 150 mm or less. The display portion 7001 may be provided with a touch sensor, and when the display portion 7001 is touched with a finger or the like, According to one aspect of the present invention, a flexible display can be used to operate a mobile information terminal. It is possible to provide a highly reliable electronic device having such a part.

[0354] 30(A) and (B) are perspective views showing an example of a portable information terminal. 00 denotes a housing 7501, a display unit 7001, a drawer member 7502, an operation button 7503, etc. It has.

[0355] The portable information terminal 7500 has a flexible display unit rolled up in a housing 7501. The display unit 7001 can be pulled out using a pull-out member 7502. do.

[0356] In addition, the mobile information terminal 7500 can receive video signals using a built-in control unit. The portable information terminal 7500 can display the captured image on the display unit 7001. The housing 7501 is equipped with a terminal for connecting a connector, The image signal and power may be supplied directly from the outside via wires.

[0357] In addition, the operation button 7503 can be used to turn the power on and off and to switch the displayed image. 30(A) and (B), the mobile information terminal 7500 In this example, the operation buttons 7503 are arranged on the surface of the mobile information terminal 7500. It may be placed on the same surface (front surface) as the display surface or on the back surface.

[0358] FIG. 30B shows a portable information terminal 7500 with the display portion 7001 pulled out. In this state, an image can be displayed on the display unit 7001. 30(A) in a rolled state and FIG. 30(B) in which the display unit 7001 is pulled out. The portable information terminal 7500 may be configured to display different images depending on the state. For example, as shown in FIG. In the state (A), the rolled-up part of the display unit 7001 is hidden. This allows the power consumption of the portable information terminal 7500 to be reduced.

[0359] When the display unit 7001 is pulled out, the display surface of the display unit 7001 is made flat. To fix the display unit 7001, a reinforcing frame may be provided on the side of the display unit 7001.

[0360] In addition to this configuration, a speaker is provided on the housing, and the audio signal received together with the video signal is output. The configuration may be such that sound is output.

[0361] Figures 30(C) to 30(E) show an example of a foldable mobile information terminal. In the unfolded state, Fig. 30(D) shows either the unfolded state or the folded state. In FIG. 30(E), the portable information terminal 76 is in a folded state. The portable information terminal 7600 is highly portable when folded and unfolded. In this mode, the seamless, large display area provides excellent visibility.

[0362] The display unit 7001 is supported by three housings 7601 connected by hinges 7602. By bending the two housings 7601 via the hinge 7602, the portable information The terminal 7600 can be reversibly transformed from an unfolded state to a folded state.

[0363] Figures 30(F) and (G) show an example of a foldable mobile information terminal. In FIG. 30(G), the display unit 7001 is folded inward. The mobile information terminal 7650 is shown folded with the side 7001 facing outwards. The terminal 7650 has a display portion 7001 and a non-display portion 7651. When not in use, the display unit 7001 can be folded inward. This can prevent the surface from getting dirty and scratched.

[0364] FIG. 30(H) shows an example of a flexible portable information terminal. The device has a housing 7701 and a display portion 7001. , 7703b, speakers 7704a and 7704b as audio output means, and external connection port 7 The portable information terminal 7700 may have a flexible The battery 7709 may be mounted on the display unit 7. It may be placed overlapping with 001.

[0365] The housing 7701, the display portion 7001, and the battery 7709 are flexible. The portable information terminal 7700 can be bent into a desired shape and twisted. For example, the display portion 7001 of the portable information terminal 7700 is Alternatively, the portable information terminal 7700 can be folded so that the outer side faces outward. The display unit 7701 and the housing 7701 can be rolled up and used. Since the mobile information terminal 7700 can freely deform, even if it is dropped, This has the advantage that it is less likely to be damaged even when an external force is applied to it unintentionally.

[0366] In addition, since the portable information terminal 7700 is lightweight, the upper part of the housing 7701 can be held with a clip or the like. Do not use it by holding it and hanging it, or by fixing the housing 7701 to the wall with a magnet or the like. It can be conveniently used in a variety of situations.

[0367] FIG. 30(I) shows an example of a wristwatch-type portable information terminal. The device has a keyboard 7801, a display unit 7001, an input / output terminal 7802, an operation button 7803, etc. The handheld terminal 7801 functions as a housing. The battery 7805 may be mounted on the display unit 70. It may be arranged overlapping with band 01 or band 7801, etc.

[0368] The band 7801, the display portion 7001, and the battery 7805 are flexible. Therefore, it is easy to bend the portable information terminal 7800 into a desired shape.

[0369] The operation button 7803 is used to set the time, turn the power on and off, and turn wireless communication on and off. It has various functions such as auto-start, silent mode activation and deactivation, power saving mode activation and deactivation, etc. For example, the operating system built into the portable information terminal 7800 can be Depending on the system, the functions of the operation buttons 7803 can be freely set.

[0370] In addition, by touching an icon 7804 displayed on the display unit 7001 with a finger or the like, the application You can launch the application.

[0371] The portable information terminal 7800 can also perform short-distance wireless communication in accordance with a communication standard. For example, by communicating with a wireless headset, You can also make calls using Lee.

[0372] The portable information terminal 7800 may also have an input / output terminal 7802. If the device has 802, it can directly exchange data with other information terminals via a connector. Charging can also be performed via the input / output terminal 7802. The charging operation of the mobile information terminal shown in the example is performed by non-contact power transmission without using input / output terminals. You may go.

[0373] FIG. 31(A) shows the exterior of the automobile 7900. FIG. 31(B) shows the driver's seat of the automobile 7900. The automobile 7900 includes a body 7901, wheels 7902, a windshield 7903, It has lights 7904, fog lights 7905, etc.

[0374] The display device of one embodiment of the present invention can be used for a display portion of an automobile 7900, for example. For example, the display units 7910 to 7917 in FIG. 31B may be used in conjunction with display devices of one embodiment of the present invention. A location can be provided.

[0375] The display portion 7910 and the display portion 7911 are provided on a windshield of the automobile. In one embodiment, an electrode of a display device is formed using a light-transmitting conductive material. Therefore, it is possible to provide a so-called see-through display device, which allows the opposite side to be seen through. If the display device is in a see-through state, it will not obstruct the view when driving a car 7900. Therefore, the display device of one embodiment of the present invention is installed on the windshield of the automobile 7900. In addition, when a transistor or the like is provided in the display device, an organic semiconductor Transistors using light-transmitting materials, such as organic transistors or transistors using oxide semiconductors, It is preferable to use a transistor having the following structure.

[0376] The display unit 7912 is provided on the pillar. The display unit 7913 is provided on the dashboard. For example, an image from an imaging means provided on the vehicle body is displayed on the display unit 7912. By doing so, it is possible to compensate for the visibility obstructed by the pillar. In the 913, it is possible to complement the view obstructed by the dashboard, and in the display unit 7914, This can complement the view blocked by the door. By projecting the image from the imaging means, blind spots can be compensated for and safety can be improved. In addition, by projecting images that complement the invisible parts, safety checks can be performed more naturally and without discomfort. This can be done.

[0377] The display unit 7917 is provided on the handle. 6, or display 7917 displays navigation information, speedometer, tachometer, It can provide various information such as distance traveled, fuel amount, gear status, air conditioning settings, and more. In addition, the display items and layout displayed on the display can be customized to suit the user's preferences. The above information can be displayed on the display units 7910 to 7914. can also be displayed.

[0378] Note that the display portions 7910 to 7917 can also be used as lighting devices.

[0379] The display portion to which the display device of one embodiment of the present invention is applied may be flat. The display device of one embodiment may have a configuration that does not have a curved surface or flexibility.

[0380] Figure 31 (C) and (D) show the digital signage. The digital signage includes a housing 8000, a display unit 8001, and a screen. It also has a speaker 8003, etc., and an LED lamp, operation keys (power switch, or operation It may have a variety of functions, including a switch, connection terminals, various sensors, a microphone, etc.

[0381] Figure 31(D) shows a digital signage attached to a cylindrical pillar.

[0382] The larger the display section 8001, the more information can be displayed at once. The wider the display part 8001 is, the more easily it is noticed by people, and for example, the more effective the advertisement is. can.

[0383] By applying a touch panel to the display unit 8001, images or videos can be displayed on the display unit 8001. It is not only a display but also allows users to operate it intuitively, which is desirable. Or when used to provide information such as traffic information, intuitive operation is required. This can improve usability.

[0384] The portable game machine shown in FIG. 31(E) includes a housing 8101, a housing 8102, a display portion 8103, and a display unit 8104. , a display unit 8104, a microphone 8105, a speaker 8106, operation keys 8107, It has Tyrus 8108 etc.

[0385] The portable game machine shown in FIG. 31(E) has two display units (display unit 8103 and display unit 810 Note that the number of display units included in the electronic device of one embodiment of the present invention is limited to two. If an electronic device has multiple display units, at least one At least one display portion may include the display device of one embodiment of the present invention.

[0386] FIG. 31(F) shows a notebook personal computer, which includes a housing 8111 and a display unit 811 2, a keyboard 8113, a pointing device 8114, etc.

[0387] The display device of one embodiment of the present invention can be applied to the display portion 8112.

[0388] Figure 32(A) shows the appearance of the camera 8400 with the viewfinder 8500 attached. show.

[0389] The camera 8400 includes a housing 8401, a display unit 8402, an operation button 8403, a shutter The camera 8400 has a button 8404 and the like. The camera 8400 also has a detachable lens 8406. It is attached.

[0390] Here, the camera 8400 is a camera in which the lens 8406 is removed from the housing 8401 and replaced. However, the lens 8406 and the housing may be integrated.

[0391] The camera 8400 can capture an image by pressing the shutter button 8404. The display portion 8402 also functions as a touch panel. It is also possible to take an image by

[0392] The housing 8401 of the camera 8400 has a mount with electrodes, and a viewfinder 850 In addition to the 0, strobe devices etc. can also be connected.

[0393] The finder 8500 includes a housing 8501, a display unit 8502, a button 8503, and the like. .

[0394] The housing 8501 has a mount that engages with the mount of the camera 8400, The mount can be attached to the camera 8400. The image received from the camera 8400 through the electrode is displayed on the display unit 8502. It can be done.

[0395] The button 8503 functions as a power button. The 8502 display can be switched on and off.

[0396] The display unit 8402 of the camera 8400 and the display unit 8502 of the finder 8500 are The display device according to one embodiment of the present invention can be applied.

[0397] In FIG. 32(A), the camera 8400 and the finder 8500 are separate electronic devices. However, these are configured to be detachable. The camera may also have a built-in viewfinder with a similar display device.

[0398] FIG. 32(B) shows the appearance of the head mounted display 8200.

[0399] The head-mounted display 8200 includes a mounting part 8201, a lens 8202, and a main body 82 8203, a display unit 8204, a cable 8205, etc. It has a built-in 8206 battery.

[0400] A cable 8205 supplies power from a battery 8206 to the main body 8203. 03 is equipped with a wireless receiver and the like, and image information such as received image data is displayed on a display unit 8204. In addition, the camera installed in the main body 8203 can record the movements of the user's eyeballs and eyelids. By capturing the user's viewpoint and calculating the coordinates of the user's viewpoint based on that information, It can be used as an input means.

[0401] Furthermore, the wearing unit 8201 may be provided with a plurality of electrodes at positions that come into contact with the user. The main body 8203 detects the current flowing through the electrodes in accordance with the movement of the user's eyeballs, The device may have a function to recognize the user's point of view. By doing so, the attachment unit 820 may have a function of monitoring the pulse of the user. The sensor 1 may have various sensors such as a temperature sensor, a pressure sensor, an acceleration sensor, etc. The device may have a function to display the user's biological information on the display unit 8204. The image displayed on the display unit 8204 is changed according to the movement of the part. Good too.

[0402] The display device of one embodiment of the present invention can be applied to the display portion 8204.

[0403] 32(C) and (D) show the appearance of the head mounted display 8300. .

[0404] The head-mounted display 8300 includes a housing 8301, two display units 8302, and an operation unit. It has a button 8303 and a band-like fastener 8304 .

[0405] The head mounted display 8300 is the same as the head mounted display 8200. In addition to the functions it has, it also has two displays.

[0406] By having two displays 8302, the user can see one display per eye. This allows for high-resolution images to be displayed even when using parallax for 3D display. The display portion 8302 can display an image. This keeps the distance from the user's eyes to the display surface constant. This allows users to see more natural images. Even if the image changes depending on the viewing angle, the image is displayed in the normal direction to the display surface. Since the user's eyes are positioned, the effect can be virtually ignored, resulting in a more realistic look. It is possible to display images with

[0407] The operation button 8303 has a function such as a power button. The display may have a button.

[0408] As shown in FIG. 32(E), a lens is provided between the display unit 8302 and the position of the user's eyes. The lens 8305 allows the user to magnify the display portion 8302. This increases the sense of realism, as shown in Figure 32(E). , and may have a dial 8306 that changes the position of the lens for diopter adjustment.

[0409] The display device of one embodiment of the present invention can be applied to the display portion 8302. Such a display device has extremely high definition, so it uses a lens 8305 as shown in Figure 32(E). Even when enlarged, the pixels are not visible to the user, providing a more realistic image. It is possible.

[0410] 33(A) to (C) show an example in which one display unit 8302 is provided. By adopting such a configuration, the number of parts can be reduced.

[0411] The display unit 8302 has two areas, one for the right eye and one for the left eye, each of which has a different image. Images can be displayed side by side, allowing for stereoscopic images to be displayed using binocular parallax. It is possible.

[0412] In addition, even if a single image that can be viewed by both eyes is displayed across the entire area of ​​the display unit 8302, This makes it possible to display a panoramic image across both ends of the field of view, The sense of realism increases.

[0413] 33C, a lens 8305 may be provided. Two images may be displayed side by side, or one image may be displayed on the display portion 8302 and The same image may be viewed with both eyes via the lens 8305.

[0414] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination. [Example]

[0415] In this example, a transistor that can be used for a display panel of one embodiment of the present invention was fabricated. did.

[0416] [Transistor structure] There are various transistor structures that can be used in the display panel. The two structures, a bottom gate structure with a etched structure and a top gate structure, are Explain the features.

[0417] FIG. 34(A1) shows an example of a schematic top view of a top-gate transistor. The transistor includes a semiconductor layer 801, a conductive layer 802, and a pair of conductive layers 803. A part of the conductive layer 802 functions as a gate electrode. It functions as a source electrode or a drain electrode.

[0418] 34(A2) and (A3) show the channel length direction and the channel 8 shows an example of a schematic cross-sectional view in the width direction. An insulating layer 804 is provided on a semiconductor layer 801. A conductive layer 802 is provided over an insulating layer 804, and an insulating layer 805 is provided to cover the conductive layer 802. A pair of conductive layers 803 is provided over the insulating layer 805. The insulating layer 804 is The insulating layer 805 serves as a gate insulating layer. The semiconductor layer 801 functions as a source region or a drain region. The conductive layer 803 is provided on the insulating layer 805 and has a pair of low resistance regions 808 that function as a conductive layer. It is connected to the low resistance region 808 through the opening.

[0419] FIG. 34(A4) shows a schematic cross-sectional view of the intersection of the conductive layer 802 and the conductive layer 803. For example, the conductive layer 802 is used as a wiring such as a scanning line, and the conductive layer 803 is used as a wiring such as a signal line. In the top gate structure, a conductive layer 802 and a conductive layer 803 are disposed between the conductive layer 802 and the conductive layer 803. Since it is easy to increase the thickness of the insulating layer 805 placed thereon, it is possible to use a bottom gate structure (described later). In comparison with the above, it is possible to reduce the parasitic capacitance between the conductive layer 802 and the conductive layer 803. do.

[0420] Figures 34(B1), (B2), and (B3) show channel-etched bottom gate A schematic top view of the structure, a schematic cross-sectional view in the channel length direction, and a schematic cross-sectional view in the channel width direction are shown. An insulating layer 804 is provided over the conductive layer 802, and a semiconductor layer 804 is formed on the insulating layer 804. A pair of conductive layers 803 is provided in contact with a part of the upper surface of the semiconductor layer 801. An insulating layer 805 is provided to cover the conductive layer 803 and the semiconductor layer 801 .

[0421] In the bottom gate structure, the semiconductor layer 801 and the conductive layer 803 can be directly connected. Therefore, there is no need to form an opening in the insulating layer, which was necessary in the top gate structure described above. This simplifies the process and also makes it easy to reduce the size of the transistor. In addition, a part of the conductive layer 803 in contact with the semiconductor layer 801 and the conductive layer 802 are arranged to overlap each other. Therefore, compared to the top gate structure described above, the source and drain electrodes can be It is easy to shorten the distance between them.

[0422] On the other hand, it is more difficult to reduce parasitic capacitance in the bottom gate structure than in the top gate structure. For example, the source electrode and gate electrode, and the drain electrode and gate A parasitic capacitance is formed at the portion where the electrode overlaps with the semiconductor layer 801 interposed therebetween. 4(B4), an insulating layer 804 is provided between the conductive layer 802 and the conductive layer 803. The thickness of the FET directly affects the electrical characteristics of the transistor, so it is important to change the thickness. Therefore, compared to the top gate structure described above, the conductive layer 802 and the conductive Therefore, it is difficult to reduce the parasitic capacitance between the conductive layers 803.

[0423] FIG. 35(A1) shows the top gate structure transistor shown in FIG. 34(A1). 8 shows an example in which a conductive layer 806 is provided. The conductive layer 806 sandwiches the semiconductor layer 801. It is located on the opposite side to the layer 802, and a part of it functions as a second gate electrode.

[0424] 35(A2) and (A3) show the channel length direction and the channel width direction of the transistor, respectively. An insulating layer 807 is provided to cover the conductive layer 806. The semiconductor layer 801 is provided on the upper side. The structure above the semiconductor layer 801 is the same as that shown in FIG. This is similar to (A2) etc.

[0425] As shown in FIGS. 35(A1) and (A3), the conductive layer 802 and the conductive layer 806 are The connection is made through openings provided in the insulating layers (insulating layer 804 and insulating layer 807) located at In this configuration, the current that can flow when the transistor is turned on (the on-current) is The conductive layer 802 and the conductive layer 806 are preferably formed by The transistors may be driven by applying different potentials without connecting them. This makes it possible to control the threshold voltage of the transistor.

[0426] 35(A4) is a schematic cross-sectional view of the intersection of the conductive layer 806 and the conductive layer 803. Between 806 and the conductive layer 803, an insulating layer 807, an insulating layer 804, and an insulating layer 805 are provided. Therefore, by using the conductive layer 806 and the conductive layer 803 as wiring, This makes it easier to reduce the parasitic capacitance between them.

[0427] In high-resolution display panels, the number of wiring crossings increases, which causes problems with parasitic capacitance. Furthermore, in high-definition display panels, the density of wiring increases, which increases the risk of parasitic Furthermore, if the parasitic capacitance increases, it becomes difficult to achieve high frequency drive. Therefore, the structure shown in FIG. 34(A1) and the structure shown in FIG. 35(A1) are This makes it suitable for applications that require higher resolution, higher definition, or higher frequency driving of display panels. It can be said that.

[0428] The transistor shown in FIG. 34(A1) and the transistor shown in FIG. 35(A1) are When these are applied to the transistors 61 and 62 in the pixel configuration shown in FIG. In this case, a transistor with a channel-etched bottom gate structure as shown in FIG. 34(B1) is used. Compared with the case where the FET is used, the parasitic capacitance of the source line (wiring 52a, etc.) is reduced by about 13% and the parasitic capacitance of the gate line (wiring It can be estimated that the parasitic capacitance of the MOSFET (e.g., MOSFET 51a) can be reduced by approximately 25%.

[0429] [Transistor characteristics] A transistor having the structure shown in FIGS. 35(A1), (A2), (A3), etc. is fabricated. The results of measuring the electrical characteristics of the transistor are shown in Figure 36. Here, the gate-source voltage (V The source-drain current (Id) (also called Vg-Id characteristics) was measured while changing the The measured transistor has a crystalline oxide semiconductor in the semiconductor layer, and As shown in Figure 36, the channel length is extremely small, and the channel width is 2 μm. Despite the small size, good characteristics are obtained.

[0430] A method for manufacturing the transistors shown in FIGS. 35(A1), (A2), and (A3) will be described. do.

[0431] A glass substrate was used as the substrate supporting the transistor.

[0432] The conductive layer 806 is made of a titanium film and a silicon film, each having a thickness of about 10 nm, which are formed by sputtering. A laminated film of a copper film with a thickness of about 300 nm was used.

[0433] The insulating layer 807 is made of nitride film having a thickness of about 400 nm, which is formed by plasma CVD. A laminated film of a silicon film and a silicon oxynitride film with a thickness of about 50 nm was used.

[0434] The semiconductor layer 801 is made of IGZO (IGZO) with a thickness of about 40 nm, which is formed by sputtering. The IGZO film was prepared by setting the substrate temperature at 170°C and the deposition gas The gas used was argon gas and oxygen gas in a ratio of 1:1, and the pressure was set at 0.2 Pa. The sputtering target was made of In, Ga, and Zn in a ratio of 4:2:4.1. A metal oxide target was used.

[0435] The insulating layer 804 is a silicon oxynitride film having a thickness of about 150 nm formed by plasma CVD. After the insulating layer 804 was formed, it was heated at 350° C. for 1 hour in a nitrogen atmosphere. The theory was carried out.

[0436] The conductive layer 802 is made of IG with a thickness of about 20 nm, which is formed by sputtering. A stacked film of a ZO film, a tungsten film with a thickness of about 15 nm, and a titanium film with a thickness of about 100 nm was formed. The IGZO film used had the same composition as the semiconductor layer 801. By providing a tungsten film in contact with the IGZO film, the conductivity of the IGZO film is increased. The IGZO film can be used as a part of the gate electrode.

[0437] The insulating layer 805 is made of nitride film having a thickness of about 100 nm, which is formed by plasma CVD. A laminated film of a silicon film and a silicon oxynitride film with a thickness of about 300 nm was used. A silicon nitride film containing a large amount of hydrogen is placed in contact with the portion of the conductive layer 801 that is not covered by the conductive layer 802. By forming the film, hydrogen diffuses into the portion, forming a low resistance region 808 in a self-aligned manner. It is possible.

[0438] The conductive layer 803 is made of titanium having a thickness of about 35 nm, which is formed by sputtering. A laminated film of a silicon film and a copper film with a thickness of approximately 300 nm was used.

[0439] This completes the description of the method for manufacturing a transistor.

[0440] By using such transistors in pixels and driver circuits of a display device, A high-resolution display device can be realized. [Example]

[0441] In this example, the display panel illustrated in Embodiment Mode 2 was manufactured.

[0442] [Light-emitting element] FIG. 37 shows a schematic diagram of the stacked structure of a light-emitting element. The light-emitting element is made up of two light-emitting units stacked together. The light-emitting element has a tandem structure in which a light-emitting layer containing a blue fluorescent material is formed. The light-emitting element has an emitting unit, an emitting layer containing a green phosphorescent material, and an emitting layer containing a red phosphorescent material. The light-emitting element has a light-emitting layer containing a blue fluorescent material and a green phosphorescent material. The organic EL element has an intermediate layer between the light-emitting layer containing the organic EL element and the light-emitting layer containing the organic EL element.

[0443] The intermediate layer used in the light-emitting element used in this example will be described. The intermediate layer is made of a blue fluorescent material. First, an electron transport layer is formed on the substrate side, then lithium oxide (LiO2) is evaporated, and copper phthalocyanine is deposited. CuPC (abbreviation: CuPC) was evaporated, and then 4,4',4''-(benzene-1,3,5- (triyl)tri(dibenzothiophene) (abbreviation: DBT3P-II) and molybdenum oxide (VI) was co-evaporated.

[0444] Here, when a tandem structure in which two or more light-emitting units are stacked is used as the light-emitting element, However, as pixel resolution increases, current flows between adjacent pixels through the intermediate layer. As a result, adjacent pixels that should not emit light will emit light. This phenomenon is called crosstalk. You can do it.

[0445] As a measure to suppress crosstalk, the use of highly conductive lithium oxide in the intermediate layer One approach is to reduce the thickness of the layer containing lithium oxide, but the other is to reduce the thickness of the layer containing lithium oxide, which has high conductivity. The thickness is extremely thin (approximately 0.1 nm), so it can be further thinned to emit light. It was difficult to fabricate the device from the viewpoint of controlling the film thickness. If the thickness were to be reduced further, there was a risk that the driving voltage of the light-emitting device would increase. The hole injection layer was fabricated by changing the concentration of DBT3P-II and molybdenum oxide. Attempts were made to suppress Rostok.

[0446] First, we developed two types of hole injection layers with different concentrations of organic and inorganic compounds. The light-emitting device was fabricated and its current-voltage characteristics were measured. The size of the light-emitting device was 2 mm square. The sample was fabricated with a ratio of DBT3P-II to molybdenum oxide in the hole injection layer of 1:0.25. The sample with the ratio of these two (Ref.1) was 1:0.175 (Sample1). Figure 38 shows the current-voltage characteristics of the two samples. It was confirmed that there was no deterioration in characteristics due to optimization of the injection layer.

[0447] [Color rendering evaluation] The following describes the results of fabricating a display panel and evaluating its color rendering properties.

[0448] [Fabrication of display panel] A method for manufacturing a display panel exemplified in this embodiment will be described. First, a peeling layer and a protective layer Two glass substrates with a laminated structure are prepared, and transistors and light-emitting devices are placed on one of the glass substrates. Optical elements and the like were formed on the other glass substrate, and color filters and the like were formed on the other glass substrate (FIG. 39(A)). Then, the two glass substrates were bonded together using an adhesive layer (FIG. 39(B)). The glass substrate on which the transistor and light emitting element are formed is peeled off and removed (Figure 39(C) )), and a film was attached using an adhesive layer (Figure 39(D)). The substrate on which the adhesive layer is formed is peeled off and removed (Figure 39(E)). A film was attached (Figure 39(F)). As a release layer, a tungsten film, a tungsten oxide film, A tungsten film and a silicon oxide film are stacked, with the tungsten oxide film as the boundary. A peeling method was used.

[0449] The display panel we created has a diagonal size of 2.78 inches and a pixel count of 2560x. 1440, resolution (pixel density) is 1058ppi, pixel size is 24μm x 24μm ( 8μm×RGB×24μm), aperture ratio is 30.4%. The frame frequency is 60H z, and the scan driver is built-in, and the source driver is built-in demultiplexer and C An IC implemented using the OF method was used in combination with the .

[0450] Here, comparative sample 2 (Ref.2), sample 2 (Sample2), and sample 3 (Sa Three types of display panels were fabricated: Comparative Sample 2 and Sample 3. This is a non-flexible display panel that uses a glass substrate without a separation layer. The display panel is flexible and formed by the above-mentioned method. The light-emitting devices used in the experiment had hole injection layer materials with conventional configurations, and samples 2 and 3 were , the material of the hole injection layer is optimized.

[0451] [Display panel] Figures 40(A) and (B) show photographs of the fabricated display panel (sample 3). Figure 40(B) shows the display surface in a flat state, while Figure 40(C) shows the display surface in a convex curve (with a radius of curvature of 17. 5mm).

[0452] [Color rendering] FIG. 41 shows chromaticity diagrams for Comparative Sample 2, Sample 2, and Sample 3. As shown in 1, Samples 2 and 3, in which the material of the hole injection layer of the light-emitting device was optimized, were comparatively It was confirmed that the color reproducibility was improved compared to Sample 1. It was confirmed that there was almost no difference in color reproducibility. The NTSC ratio of flexible sample 3 was about 8. The figure was high at 8%.

[0453] [Evaluation of viewing angle dependency] A display panel was fabricated and its viewing angle dependency was evaluated, and the results are described below.

[0454] [Fabrication of display panel] Sample 4 (Sample 4), a flexible display panel, was fabricated in the same manner as Sample 3. ) was produced.

[0455] [Viewing angle dependence] Next, the viewing angle dependency of chromaticity was measured for Sample 4. First, the direction perpendicular to the surface of the display panel is set to 0 degrees, and the angles are -60 degrees, -30 degrees, 0 degrees, and 30 degrees. The luminance spectrum was measured at five points, 60 degrees, 100 degrees, and 60 degrees. The chromaticity was calculated for each angle. The luminance spectrum was calculated by applying red, green, and blue light to the display panel. Measurements were made for four different displays: white, red, and white. The characteristics are measured in two directions: parallel to the direction in which the same color pixels are arranged on the display panel, and perpendicular to this direction. Measured on the street.

[0456] FIG. 42(A) shows the measurement results in the direction parallel to the arrangement direction of pixels of the same color, and FIG. 42(B) shows the measurement results in the direction parallel to the arrangement direction of pixels of the same color. , the measurement results in the direction perpendicular to the arrangement direction of pixels of the same color. is the rate of change in chromaticity when the data at 0 degrees is used as the reference. Even if light leakage occurs from adjacent pixels, the color of light will be the same, so the viewing angle dependency is relatively small. On the other hand, in Figure 42(B), the adjacent pixels are pixels of different colors, so the light from the adjacent pixels When leakage occurs, the change in chromaticity becomes large. In the case of sample 4 of this example, the angle is 60 degrees, and It was also confirmed that the rate of change in chromaticity (Δu'v') was a small value of less than 0.1.

[0457] [Bending resistance] Next, the bending resistance of Sample 4 was evaluated. First, the sample was bent so that the display surface was on the outside. The radius of curvature can be changed for both outward bending, where the display surface faces inward, and inward bending, where the display surface faces inward. The results showed that both the outer and inner bending tests were performed with a curvature radius of 5m. Even when bent to 1 mm, 4 mm, 3 mm, and 2 mm, there were no cracks or display defects. It was confirmed that no problems occurred and the unit operated normally.

[0458] In addition, the display surface is subjected to bending and stretching motions that alternate between a flat state and an inward or outward bending state. Both inward and outward bending were performed under the condition of a curvature radius of 3 mm and a curvature radius of 2 mm. Even after 100,000 repeated tests, no display defects or cracks occurred. [Example]

[0459] In this example, the display panel illustrated in Embodiment Mode 1 was manufactured.

[0460] [Fabrication of display panel] In this embodiment, glass substrates are used as the pair of substrates. A color filter and the like are formed on the other substrate, and these are bonded together. The layout of the pixel area and wiring was the same as that shown in Figure 1(A). The layout of the sub-pixels provided in the pixel section is shown in FIG. The layout shown in Example B) was applied. The example transistor with a top gate structure was applied.

[0461] The specifications of the manufactured display panel are shown in Table 1.

[0462] [Table 1]

[0463] The display panel size is 8.34 inches, the smallest in the world for an 8K4K display. h, and the pixel density is extremely high at 1058ppi. In addition, to improve the viewing angle characteristics, As exemplified in the first embodiment, the sub-pixels are arranged in a zigzag pattern. The pixel pitch is equivalent to 24 μm x 24 μm when using an RGB stripe arrangement. Correct.

[0464] Also, the semiconductor layer of the transistors of the pixel and gate driver (Scan Driver) As an oxide semiconductor that can achieve high field-effect mobility, the c-axis is aligned perpendicular to the film surface. C-Axis Aligned Crystalline Oxide Semiconductor (CAAC-OS) This resulted in the It is possible to realize high-resolution displays with built-in gate drivers.

[0465] In addition, the source driver is COG, but the source line is shared between the two sub-pixels. The number of ICs can be halved compared to a normal 8K4K display.

[0466] Figure 43 shows a photograph of the manufactured display panel. In Figure 43, not only the pixel part but also the wiring, The peripheral parts including the terminals, IC, and FPC are also shown.

[0467] In this way, we applied a top-gate transistor using CAAC-OS as the semiconductor layer. By using this technology, it is possible to reduce the parasitic capacitance of the source line and gate line, and it is the world's smallest We were able to create an 8K4K-OLED display of this size. The zigzag arrangement allows for a display that combines high definition with a wide viewing angle. It was made possible. [Explanation of symbols]

[0468] 10 Display device 11 Pixel section 12 circuits 13 Circuit 14 circuits 15a Terminal section 15b Terminal section 16a Wiring 16b Wiring 16c wiring 17 IC 20 pixel units 21a pixel 21b pixels 22 Display area 30a straight line 30b straight line 30c rectangle 30d rectangle 31 Pixel electrode 31a Pixel electrode 31b Pixel electrode 32a Pixel electrode 32b Pixel electrode 33a Pixel electrode 33b pixel electrode 41a Pixel circuit 41b Pixel circuit 42a Pixel circuit 42b Pixel circuit 43a Pixel circuit 43b Pixel circuit 51 Wiring 51a Wiring 51b Wiring 52 Wiring 52a wiring 52b Wiring 52c wiring 52d Wiring 53 Wiring 53a Wiring 53b Wiring 53c Wiring 53S wiring group 54 Wiring 55 Wiring 57 Wiring 60 Display element 60a Display element 60b Display element 61 Transistor 62 transistors 63 Capacitor element 64 transistors 71a subpixel 71b subpixel 72a subpixel 72b subpixel 73a subpixel 73b subpixel 80 circuits 81 Transistor 82 transistors 83 Wiring 84 Wiring 85 terminals 86 Output terminal 101 Substrate 102 Circuit Board 211 Insulating layer 212 Insulating layer 213 Insulating Layer 214 Insulating layer 215 Spacer 216 Insulating Layer 217 Insulating Layer 218 Insulating Layer 220 Adhesive layer 221 Insulating layer 222 EL layer 223 Electrode 224a Optical adjustment layer 224b Optical adjustment layer 230a Structure 230b Structure 231 Light blocking layer 232 Colored layer 232a Colored layer 232b Colored layer 241 FPC 242 FPC 243 Connection Layer 244 IC 250 space 251 transistors 252 transistors 260 Encapsulating material 261 Adhesive layer 262 Adhesive layer 271 Semiconductor Layer 272 Conductive Layer 273 Conductive Layer 274 Conductive Layer 275 Conductive Layer 276 Insulating Layer 281 LCD 282 Overcoat 283 Conductive Layer 291 Conductive Layer 292 Conductive Layer 293 Conductive Layer 294 Insulating Layer 295 Adhesive layer 296 PCB 297 FPC 298 Connection Layer 299 Terminal section 301 Fabricated substrate 303 Peeling layer 305 Peeling layer 307 Adhesive layer 321 Fabrication substrate 323 Peeling layer 325 Peeling layer 331 Substrate 333 Adhesive layer 341 Circuit Board 343 Adhesive layer 351 areas 801 Semiconductor layer 802 Conductive layer 803 Conductive layer 804 Insulation layer 805 Insulation layer 806 Conductive layer 807 Insulation layer 808 Low resistance region 7000 Display 7001 Display section 7100 Mobile Phone 7101 Housing 7103 Operation button 7104 External connection port 7105 Speaker 7106 Microphone 7107 Camera 7110 Mobile phone 7200 Personal Digital Assistant 7201 Case 7202 Operation button 7203 Information 7210 Mobile Information Terminal 7300 Television equipment 7301 Housing 7303 Stand 7311 Remote control device 7400 Lighting Equipment 7401 Daibu 7403 Operation switch 7411 Light-emitting part 7500 Mobile Information Terminal 7501 Case 7502 Materials 7503 Operation button 7600 Personal Digital Assistant 7601 Case 7602 Hinge 7650 Personal Digital Assistant 7651 Hidden part 7700 Personal Digital Assistant 7701 Housing 7703a Button 7703b Button 7704a Speaker 7704b Speaker 7705 External connection port 7706 Mike 7709 Battery 7800 Mobile Information Terminal 7801 band 7802 Input / output terminal 7803 Operation button 7804 Icons 7805 Battery 7900 Automobiles 7901 Car body 7902 Wheel 7903 Windshield 7904 Light 7905 Fog lamp 7910 Display section 7911 Display section 7912 Display section 7913 Display section 7914 Display section 7915 Display section 7916 Display section 7917 Display section 8000 chassis 8001 Display section 8003 Speaker 8101 Housing 8102 Housing 8103 Display section 8104 Display section 8105 Microphone 8106 Speaker 8107 Operation key 8108 Stylus 8111 Housing 8112 Display section 8113 keyboard 8114 Pointing Device 8200 Head Mounted Display 8201 Mounting part 8202 Lens 8203 Main unit 8204 Display section 8205 Cable 8206 Battery 8300 Head Mounted Display 8301 Housing 8302 Display section 8303 Operation button 8304 Fixtures 8305 Lens 8306 Dial 8400 Camera 8401 Housing 8402 Display section 8403 Operation button 8404 Shutter button 8406 Lens 8500 Finder 8501 Housing 8502 Display section 8503 Button

Claims

1. a first EL display element, a second EL display element, a first pixel circuit, and a second pixel circuit; the first EL display element has a first pixel electrode; the second EL display element has a second pixel electrode; the first EL display element and the second EL display element are display elements corresponding to red or green, the first pixel circuit is provided adjacent to the second pixel circuit, the first pixel circuit includes a first transistor, a second transistor, and a first capacitance element; the second pixel circuit includes a third transistor, a fourth transistor, and a second capacitance element; a gate of the first transistor is electrically connected to one of a source and a drain of the second transistor; a gate of the first transistor is electrically connected to one electrode of the first capacitance element; the other electrode of the first capacitance element is electrically connected to a first wiring; a gate of the second transistor is controlled by a first gate line; when the first transistor is turned on and the first wiring is electrically connected to the first pixel electrode via one of the source or drain of the first transistor, a channel formation region of the first transistor, and the other of the source or drain of the first transistor, a first current flows between the first wiring and the first pixel electrode via one of the source or drain of the first transistor, the channel formation region of the first transistor, and the other of the source or drain of the first transistor, when the second transistor is in an on state, a potential of a second wiring is applied to the gate of the first transistor via the other of the source and the drain of the second transistor, a channel formation region of the second transistor, and the one of the source and the drain of the second transistor; a gate of the third transistor is electrically connected to one of a source and a drain of the fourth transistor; a gate of the third transistor is electrically connected to one electrode of the second capacitance element; the other electrode of the second capacitor element is electrically connected to the first wiring; a gate of the fourth transistor is controlled by a second gate line; when the third transistor is turned on and the first wiring is brought into a conductive state with the second pixel electrode via one of the source or drain of the third transistor, a channel formation region of the third transistor, and the other of the source or drain of the third transistor, a second current flows between the first wiring and the second pixel electrode via one of the source or drain of the third transistor, the channel formation region of the third transistor, and the other of the source or drain of the third transistor, when the fourth transistor is in an on state, a potential of a third wiring is applied to a gate of the third transistor via the other of the source or the drain of the fourth transistor, a channel formation region of the fourth transistor, and the one of the source or the drain of the fourth transistor; the first pixel electrode has a region overlapping with a channel formation region of the first transistor, the first pixel electrode does not overlap with a channel formation region of the second transistor; the first pixel electrode does not overlap with a channel formation region of the third transistor; the first pixel electrode has a region overlapping with a channel formation region of the fourth transistor, the second pixel electrode does not overlap with a channel formation region of the second transistor, the second pixel electrode has a region overlapping with a channel formation region of the third transistor, the second pixel electrode does not overlap with a channel formation region of the fourth transistor, the first pixel electrode has an area overlapping with the first wiring, the second pixel electrode has an area overlapping with the first wiring, the first pixel electrode has a region overlapping a region between the first gate line and the second gate line; the second pixel electrode does not have a region overlapping with a region between the first gate line and the second gate line.

2. An electronic device comprising the EL display device according to claim 1.

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