Component mounter and individual substrate suction control method

Abstract

To eliminate the need to mount individual substrates on all mounting portions of a transport jig when fixing the individual substrate mounted on the mounting portion of the transport jig by suction.SOLUTION: Board mounting information indicating the presence or absence of an individual board B in each of a plurality of mounting holes 22 is acquired (Step S102), and suction by a suction unit 76 is controlled on the basis of the board mounting information. In other words, suction control is performed, on the basis of the board mounting information, to cause the suction unit 76 with an individual board B in the corresponding mounting hole 22 of a plurality of suction units 76 to perform suction, and to cause the suction unit 76 without the individual board B in the corresponding mounting hole 22 to not perform suction (Steps S103, S104).SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a technique for fixing a substrate carried into a component mounting machine in order to mount components on the substrate, and more particularly to a technique for fixing an individual substrate mounted on a mounting location of a transport jig having multiple mounting locations. [Background technology]

[0002] Patent Document 1 discloses a component mounter that mounts components on a film-like substrate such as a flexible substrate by suctioning the substrate using a backup member that contacts the substrate from below. In some cases, individual substrates are used as the mounting targets for component mounting in such a component mounter. Specifically, a transport jig with multiple mounting locations is prepared, and the individual substrates are mounted on the mounting locations of the transport jig and then carried into the component mounter together with the transport jig. The component mounter is also equipped with a suction mechanism that suctions the multiple mounting locations, and the individual substrates mounted on each of the multiple mounting locations are fixed by being sucked in by the suction mechanism. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-154627 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above method, if there are any mounting locations among the multiple mounting locations provided on the transport jig where no individual substrate is mounted, it may be impossible to generate sufficient suction force at each mounting location, and the individual substrate may not be firmly fixed. This causes the inconvenience of having to mount individual substrates at all mounting locations on the transport jig.

[0005] The present invention has been made in consideration of the above-mentioned problems, and aims to eliminate the need to mount individual substrates at all mounting locations on a transport jig that has multiple mounting locations capable of mounting individual substrates, when fixing the individual substrates mounted at the mounting locations on the transport jig by suction. [Means for solving the problem]

[0006] The component mounting machine of the present invention comprises a jig loading section that loads a transport jig having multiple mounting locations each capable of mounting an individual board into a predetermined loading position; an individual board suction section that has multiple suction sections corresponding to the multiple mounting locations of the transport jig at the loading position, and the suction sections suck the corresponding mounting locations; an information acquisition section that acquires board mounting information indicating the presence or absence of an individual board at each of the multiple mounting locations; and a suction control section that performs suction control based on the board mounting information acquired by the information acquisition section, causing suction sections of the multiple suction sections that have an individual board at the corresponding mounting location to perform suction, and not causing suction sections that do not have an individual board at the corresponding mounting location to perform suction.

[0007] The individual substrate suction control method of the present invention comprises the steps of: transporting a transport jig to a predetermined loading position, the transport jig having a plurality of mounting locations each capable of mounting an individual substrate; acquiring substrate mounting information indicating the presence or absence of an individual substrate at each of the plurality of mounting locations of the individual substrate suction units, the individual substrate suction units having a plurality of suction sections corresponding to the plurality of mounting locations of the transport jig at the loading position, the suction sections sucking the corresponding mounting locations; and performing suction control based on the substrate mounting information, in which suction sections of the plurality of suction sections that have an individual substrate at the corresponding mounting location perform suction, and suction sections that do not have an individual substrate at the corresponding mounting location do not perform suction.

[0008] In the present invention (component mounter and individual substrate suction control method) configured as described above, multiple suction units are provided corresponding to multiple mounting locations on a transport jig loaded into the loading position, and each suction unit sucks its corresponding mounting location. At this time, board mounting information indicating the presence or absence of an individual substrate at each of the multiple mounting locations is acquired, and suction by the suction units is controlled based on the board mounting information. That is, suction control is performed based on the board mounting information to cause the suction units with individual substrates present at their corresponding mounting locations to perform suction, and to prevent the suction units without individual substrates from performing suction. In this way, suction is selectively performed on mounting locations with individual substrates present among the multiple mounting locations. Therefore, by sucking mounting locations without individual substrates, insufficient suction force is prevented for mounting locations with individual substrates. As a result, when fixing individual substrates mounted at mounting locations on a transport jig having multiple mounting locations each capable of mounting individual substrates by suction, it is not necessary to mount individual substrates at all of the mounting locations on the transport jig.

[0009] The component mounter may also be configured such that the information acquisition unit has a sensor at each of the multiple mounting locations that detects the presence or absence of an individual board at the mounting location, and acquires the results of the sensor's detection of the individual board as board mounting information. In this configuration, board mounting information can be accurately acquired based on the results of detection of the presence or absence of an individual board at each mounting location by the sensor provided at each of the multiple mounting locations.

[0010] The component mounter may also be configured so that the information acquisition unit acquires, as board mounting information, the results of confirming the presence or absence of individual boards at each of a plurality of mounting locations based on board data that indicates the positions on the transport jig where components are to be mounted. In this configuration, board mounting information can be acquired by confirming the presence or absence of individual boards at each of a plurality of mounting locations based on the board data, eliminating the need for a sensor to detect individual boards.

[0011] The component mounter may also be configured such that the individual substrate suction unit has a suction table facing the loading position from below and a suction pump, the suction unit has a suction port that opens on the top surface of the suction table toward the corresponding mounting location and a valve provided between the suction port and the suction pump, and by opening the valve, the suction port and the suction pump are connected to each other to cause the suction pump to suck the suction port, while by closing the valve, the suction port and the suction pump are disconnected to limit suction through the suction port by the suction pump, and the suction control unit opens the valve of a suction unit among the multiple suction units that has an individual substrate at its corresponding mounting location and closes the valve of a suction unit that does not have an individual substrate at its corresponding mounting location. In this configuration, by opening and closing the valve provided in each of the multiple suction units, suction can be selectively performed on a mounting location among the multiple mounting locations that has an individual substrate. [Effects of the Invention]

[0012] As described above, according to the present invention, when individual substrates mounted at mounting locations on a transport jig having multiple mounting locations each capable of mounting an individual substrate are fixed by suction, it is not necessary to mount individual substrates at all mounting locations on the transport jig. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a plan view schematically showing a component mounter. [Figure 2] 2 is a perspective view showing a schematic relationship between a transport jig carried into the component mounter of FIG. 1 and a suction backup of the component mounter; [Figure 3] 5A and 5B are diagrams illustrating the configuration and operation of a lifting mechanism that lifts and lowers the suction backup. [Figure 4] FIG. 10 is a perspective view schematically showing the relationship between the suction backup located at the raised position and the transport jig. [Figure 5] FIG. 2 is a diagram schematically illustrating the configuration of a suction mechanism that sucks the suction port of the suction backup. [Figure 6] FIG. 2 is a block diagram showing an electrical configuration of the component mounter of FIG. 1. [Figure 7]10 is a flowchart showing an example of board fixing performed by the component mounter. [Figure 8] 10 is a flowchart showing a modified example of board fixing executed by the component mounter. DETAILED DESCRIPTION OF THE INVENTION

[0014] Fig. 1 is a plan view that shows a component mounter in a simplified manner, and Fig. 2 is a perspective view that shows a simplified relationship between the transport jig that is carried into the component mounter in Fig. 1 and the suction backup of the component mounter. In Fig. 1, Fig. 2, and the following figures, the horizontal X direction, the horizontal Y direction that is perpendicular to the X direction, and the vertical Z direction are indicated as appropriate.

[0015] As shown in FIG. 2 , the transport jig 2 has a jig plate 21 and a plurality of mounting holes 22 penetrating the jig plate 21 in the Z direction. The jig plate 21 has a rectangular shape defined by sides parallel to the X direction and sides parallel to the Y direction in a plan view from the Z direction. The plurality of mounting holes 22 are arranged in a matrix in the X and Y directions on the jig plate 21. However, the shape of the jig plate 21 and the arrangement of the mounting holes 22 are not limited to the example shown in FIG. 2 . A piece of substrate B can be detachably mounted in the mounting hole 22. That is, the mounting hole 22 has a shape corresponding to the piece of substrate B, and the piece of substrate B can be fitted into the mounting hole 22 from above. The piece of substrate B fitted into the mounting hole 22 is mounted in the mounting hole 22 by engaging with the inner wall of the mounting hole 22. For example, the piece of substrate B can be fitted into the mounting hole 22 by a protrusion provided on the inner wall of the mounting hole 22.

[0016] 1, the component mounter 4 is equipped with a pair of transport conveyors 41 that carry the transport jig 2 into a predetermined jig carry-in position Lj. These transport conveyors 41 extend parallel to the Y direction and are arranged in the X direction at an interval corresponding to the width of the transport jig 2, and transport the transport jig 2 in the Y direction (transport direction) while supporting both ends of the transport jig 2 in the X direction from below. These transport conveyors 41 hold the transport jig 2 carried into the jig carry-in position Lj horizontally.

[0017] Furthermore, the component mounter 4 is provided with a pair of X-axis rails 421 parallel to the X direction, an X-axis ball screw 422 parallel to the X direction, and an X-axis motor 423 (servo motor) that rotates and drives the X-axis ball screw 422, and a Y-axis rail 424 parallel to the Y direction is supported by the pair of X-axis rails 421 so as to be movable in the X direction and is fixed to the nut of the X-axis ball screw 422. A Y-axis ball screw 425 parallel to the Y direction and a Y-axis motor 426 (servo motor) that rotates and drives the Y-axis ball screw 425 are attached to the Y-axis rail 424, and the head unit 43 is fixed to the nut of the Y-axis ball screw 425 so as to be movable in the Y direction on the Y-axis rail 424. Therefore, the X-axis motor 423 rotates the X-axis ball screw 422 to move the head unit 43 in the X direction, and the Y-axis motor 426 rotates the Y-axis ball screw 425 to move the head unit 43 in the Y direction.

[0018] The head unit 43 has a so-called rotary type mounting head 431. That is, the mounting head 431 has a plurality of (eight) nozzles 432 arranged circumferentially at equal angular intervals around a rotation axis, and the plurality of nozzles 432 are rotatable around the rotation axis. However, the specific configuration of the head unit 43 is not limited to the rotary type, and it may also be an in-line type in which a plurality of mounting heads 431 are arranged in a row.

[0019] As shown in FIG. 1 , two component supply units 44 are aligned in the X direction on each side of the pair of conveyors 41 in the Y direction. A plurality of tape feeders 441 are aligned in the Y direction and detachably attached to each component supply unit 44. Each tape feeder 441 extends in the X direction and has a component supply point 442 at its end on the conveyor 41 side in the X direction. A component supply reel around which a tape is wound contains small pieces of components P, such as integrated circuits, transistors, and capacitors, at predetermined intervals. The tape feeder 441 is loaded with the tape unwound from the component supply reel. The tape feeder 441 intermittently feeds the tape in the X direction toward the conveyor 41. As a result, the components P on the tape are fed in the X direction (feed direction) and sequentially supplied to the component supply points 442 of the tape feeder 441.

[0020] The mounting head 431 then picks up and places the component P using each nozzle 432. Specifically, the mounting head 431 moves above the tape feeder 441 and brings the nozzle 432 into contact with the component P supplied to the component supply location 442 by the tape feeder 441. The mounting head 431 then generates a predetermined negative pressure in the mounting head 431, causing the nozzle 432 to pick up the component P. While holding the component P in this way, the mounting head 431 moves above the individual board B attached to the transport jig 2 at the jig carry-in position Lj and places the component P on the individual board B. In this way, the mounting process of picking up the component P and placing it on the individual board B is performed on each individual board B attached to the transport jig 2.

[0021] The mounter 4 also includes a suction backup 6 for fixing the individual board B on which the components P are to be mounted. As shown in FIG. 2 , the suction backup 6 faces from below the jig carry-in position Lj, where a pair of transport conveyors 41 carry in the transport jig 2. In the X direction, the width of the suction backup 6 is narrower than the distance between the transport conveyors 41, and in a plan view from the Z direction, the suction backup 6 is located inside the transport conveyors 41. The suction backup 6 has a rectangular parallelepiped backup plate 61, which, in a plan view from the Z direction, has a rectangular shape defined by sides parallel to the X direction and sides parallel to the Y direction. An upper surface 611 of the backup plate 61 is a horizontal plane facing from below the transport jig 2 at the jig carry-in position Lj. The suction backup 6 also has a plurality of suction ports 62 opening at the upper surface 611 of the backup plate 61. The plurality of suction ports 62 opening in the backup plate 61 are provided corresponding to the plurality of mounting holes 22 penetrating the jig plate 21, respectively, and each suction port 62 faces the corresponding mounting hole 22 from below. Note that, although the suction ports 62 have a rectangular shape in the example of Fig. 2, the shape of the suction ports 62 is not limited to a rectangular shape and may be, for example, a circular shape.

[0022] Furthermore, the mounter 4 is equipped with board sensors Sb (for example, proximity sensors or distance sensors) that detect the presence or absence of an individual board B in each of the multiple mounting holes 22. That is, multiple board sensors Sb are provided corresponding to the multiple mounting holes 22, respectively, and each board sensor Sb detects the presence or absence of an individual board B in the corresponding mounting hole 22. The multiple board sensors Sb are arranged on the upper surface 611 of the backup plate 61, and each board sensor Sb is disposed adjacent to the suction port 62 that corresponds to the same mounting hole 22.

[0023] As shown in FIG. 3, this mounter 4 is equipped with an elevating mechanism 71 that elevates the suction backup 6. FIG. 3 is a diagram schematically illustrating the configuration and operation of the elevating mechanism that elevates the suction backup. The elevating mechanism 71 has a push-up plate 711 that is held horizontally and a drive unit 712 that drives the push-up plate 711 in the Z direction. The drive unit 712 is an actuator such as a solenoid or a cylinder. The suction backup 6 is held horizontally on the upper surface of the push-up plate 711, and the drive unit 712 moves the suction backup 6 on the push-up plate 711 in the Z direction between a lowered position Ld and an elevated position Lu that is above the lowered position Ld.

[0024] As shown in the "lowered position Ld" column of FIG. 3, the suction backup 6 at the lowered position Ld faces from below the transport jig 2 supported at the jig carry-in position Lj by the transport conveyor 41. When the drive unit 712 raises the suction backup 6 from the lowered position Ld to the raised position Lu, the upper surface 611 of the suction backup 6 abuts against the lower surface of the transport jig 2, lifting the transport jig 2 from the transport conveyor 41 (the "halfway" column of FIG. 3). A pair of clamp plates 73 are disposed above the pair of transport conveyors 41, spaced apart in the X direction. When the suction backup 6 rises to the raised position Lu and the upper surface of the transport jig 2 placed on the upper surface 611 of the suction backup 6 abuts against the pair of clamp plates 73 from below, the drive unit 712 stops raising the suction backup 6 (the "raised position Lu" column of FIG. 3).

[0025] 4 is a perspective view showing a schematic relationship between the suction backup 6 in the raised position and the transport jig. As shown in FIG. 4, when the suction backup 6 is in the raised position Lu, each of the plurality of suction ports 62 communicates with the corresponding mounting hole 22. Each of the plurality of substrate sensors Sb is located close to the corresponding mounting hole 22 and detects the presence or absence of an individual substrate B mounted in that mounting hole 22.

[0026] As shown in FIG. 5 , the mounter 4 also includes a suction mechanism 75 that generates negative pressure in the suction port 62 of the suction backup 6 to suck the suction port 62. FIG. 5 is a schematic diagram illustrating the configuration of the suction mechanism that sucks the suction port of the suction backup. The suction mechanism 75 includes an exhaust pump 751 and an exhaust pipe 752 connected to the exhaust pump 751. The suction mechanism 75 also includes multiple suction units 76 that respectively correspond to the multiple suction ports 62. Each suction unit 76 includes a suction pipe 761 connected to the corresponding suction port 62 and a valve 762 attached to the suction pipe 761. One end of the suction pipe 761 is connected to the exhaust pipe 752 and communicates with the exhaust pump 751, and the other end of the suction pipe 761 is connected to the suction port 62. The valve 762 is attached to the suction pipe 761 between the suction port 62 and the exhaust pipe 752.

[0027] In the suction mechanism 75, the exhaust pump 751 exhausts air from the suction pipe 761 of each suction unit 76 via the exhaust pipe 752. Furthermore, by opening the valve 762, the exhaust pipe 752 at both ends of the suction pipe 761 to which the valve 762 is attached is connected to the suction port 62 via the suction pipe 761, allowing the exhaust pump 751 to suck the suction port 62. On the other hand, by closing the valve 762, the suction port 62 at both ends of the suction pipe 761 to which the valve 762 is attached is disconnected from the exhaust pipe 752, thereby restricting suction of the suction port 62 by the exhaust pump 751.

[0028] Furthermore, the suction mechanism 75 has a pressure gauge 753 that measures the negative pressure generated in the exhaust pipe 752 by the exhaust pump 751. This pressure gauge 753 is attached to the exhaust pipe 752 between the multiple suction units 76 and the exhaust pump 751, and measures the negative pressure at the intake port of the exhaust pump 751.

[0029] According to the suction mechanism 75, an individual substrate B mounted in a mounting hole 22 facing a suction port 62 whose corresponding valve 762 is open is fixed to the mounting hole 22 by the suction force generated by the exhaust pump 751 at the suction port 62. Furthermore, when an individual substrate B is mounted in all of the mounting holes 22 facing the suction port 62 whose corresponding valve 762 is open, the pressure gauge 753 measures a pressure below the threshold negative pressure, whereas when an individual substrate B is not mounted in some of the mounting holes 22, those mounting holes 22 are open to the atmosphere, and the pressure gauge 753 measures a pressure above the threshold negative pressure.

[0030] Fig. 6 is a block diagram showing the electrical configuration of the component mounter of Fig. 1. The component mounter 4 has a calculation unit 91 and a memory unit 92. The calculation unit 91 is a processor such as a CPU (Central Processing Unit), and the memory unit 92 is a storage device such as an SSD (Solid State Drive). The calculation unit 91 has a main control unit 910, a UI control unit 911, an elevation control unit 912, a pump control unit 913, a pressure acquisition unit 914, a valve control unit 915, an information acquisition unit 916, and a head control unit 917.

[0031] The main control unit 910 performs overall control of the entire component mounter 4. The UI control unit 911 controls the UI (User Interface) 49 provided in the component mounter 4. The UI 49 has, for example, an output device such as a display, and input devices such as a mouse and keyboard. However, the output device and input device of the UI 49 do not need to be configured separately, and they may be configured integrally using a touch panel display.

[0032] The lifting control unit 912 controls the drive unit 712 that raises and lowers the suction backup 6, thereby moving the suction backup 6 between the lowered position Ld and the raised position Lu. The pump control unit 913 controls exhaust by the exhaust pump 751. The pressure acquisition unit 914 acquires the pressure inside the exhaust pipe 752 measured by the pressure gauge 753. The valve control unit 915 controls the opening and closing of the valve 762 of each of the multiple suction units 76. The information acquisition unit 916 receives the detection results of the individual substrate B by the substrate sensor Sb from each of the multiple substrate sensors Sb, and thereby acquires substrate mounting information that indicates the presence or absence of the individual substrate B in the mounting hole 22 for each of the multiple mounting holes 22.

[0033] The head control unit 917 controls the X-axis motor 423, the Y-axis motor 426, and the head unit 43 based on the board data Db stored in the memory unit 92, thereby mounting components on the individual board B. In other words, the board data Db indicates the mounting position (in other words, the position of the land) set for the transport jig 2 carried into the jig carry-in position Lj, and the component P to be mounted at that mounting position. Because the mounting target for the component P is the individual board B, the mounting position is set to overlap with one of the multiple mounting holes 22 in the transport jig 2 into which the individual board B will be mounted.

[0034] As described above, when mounting components P on individual substrate B, the individual substrate B is fixed. FIG. 7 is a flowchart showing an example of substrate fixing performed by the component mounter. The flowchart in FIG. 7 is executed under the control of the main control unit 910. In step S101, the lift control unit 912 causes the drive unit 712 to lift the suction backup 6 from the lowered position Ld to the raised position Lu. When the suction backup 6 is positioned at the raised position Lu, the information acquisition unit 916 acquires the detection results of each of the multiple substrate sensors Sb as substrate mounting information indicating the presence or absence of individual substrate B in each of the multiple mounting holes 22 (step S102).

[0035] In step S103, the valve control unit 915 checks, based on the board mounting information, which of the multiple mounting holes 22 in the transport jig 2 are the substrate mounting holes 22 into which the individual board B has been mounted and which are the non-board mounting holes 22 into which the individual board B has not been mounted. Then, the valve control unit 915 opens the valve 762 of the suction unit 76 corresponding to the substrate mounting hole 22 (in other words, the valve 762 attached to the suction pipe 761 connected to the substrate mounting hole 22), while closing the valve 762 of the suction unit 76 corresponding to the non-board mounting hole 22 (in other words, the valve 762 attached to the suction pipe 761 connected to the substrate mounting hole 22).

[0036] In step S104, pump control unit 913 starts exhaust pump 751, and exhaust by exhaust pump 751 begins. As a result, suction is applied to suction port 62 communicating with open valve 762, and individual substrate B mounted in mounting hole 22 opposite suction port 62 is fixed to mounting hole 22. On the other hand, suction is not applied to suction port 62 communicating with closed valve 762.

[0037] In step S105, the pressure acquisition unit 914 acquires the measured pressure measured by the pressure gauge 753 and compares the measured pressure with the threshold negative pressure. If the measured pressure is less than the threshold negative pressure, the pressure acquisition unit 914 determines that the suction of the individual substrate B has been successful ("YES" in step S106), and the main control unit 910 determines that the fixing of the individual substrate B has been completed (step S107). On the other hand, if the measured pressure is equal to or greater than the threshold negative pressure, the pressure acquisition unit 914 determines that the suction of the individual substrate B has failed ("NO" in step S106), and the UI control unit 911 notifies the operator via the UI 49 that a suction error has occurred for the individual substrate B (step S108).

[0038] In the embodiment described above, a plurality of suction units 76 are provided corresponding to the plurality of mounting holes 22 (mounting locations) of the transport jig 2 loaded into the jig loading position Lj (loading position), and each suction unit 76 performs suction on the corresponding mounting hole 22. At this time, board mounting information indicating the presence or absence of an individual substrate B in each of the plurality of mounting holes 22 is acquired (step S102), and suction by the suction units 76 is controlled based on this board mounting information. That is, suction control is performed based on the board mounting information to cause the suction units 76, among the plurality of suction units 76, whose corresponding mounting holes 22 have an individual substrate B to perform suction, and to prevent the suction units 76, whose corresponding mounting holes 22 do not have an individual substrate B, from performing suction (steps S103 and S104). In this way, suction is selectively performed on the mounting holes 22 that have an individual substrate B among the plurality of mounting holes 22. Therefore, by not performing suction on the mounting holes 22 that do not have an individual substrate B, insufficient suction force for the mounting holes 22 that have an individual substrate B is prevented. As a result, when fixing by suction the individual substrate B mounted in the mounting holes 22 of the transport jig 2, which has a plurality of mounting holes 22 into each of which an individual substrate B can be mounted, it is not necessary to mount the individual substrate B in all of the mounting holes 22 of the transport jig 2.

[0039] Furthermore, the information acquisition unit 916 has a board sensor Sb in each of the multiple mounting holes 22 that detects the presence or absence of an individual board B in the mounting hole 22, and acquires the result of the board sensor Sb detecting the individual board B as board mounting information. In this configuration, board mounting information can be accurately acquired based on the result of detecting the presence or absence of an individual board B in each mounting hole 22 by the board sensor Sb provided for each of the multiple mounting holes 22.

[0040] Furthermore, the suction mechanism 75 (individual substrate suction unit) has a suction backup 6 (suction table) facing the jig carry-in position Lj from below, and an exhaust pump 751 (suction pump). On the other hand, the suction unit 76 has a suction port 62 that opens on the upper surface 611 of the suction backup 6 toward the corresponding mounting hole 22, and a valve 762 provided between the suction port 62 and the exhaust pump 751. Therefore, when the valve 762 is opened, the suction port 62 and the exhaust pump 751 communicate with each other, and the suction port 62 is sucked by the exhaust pump 751, whereas when the valve 762 is closed, the suction port 62 and the exhaust pump 751 are disconnected, and the suction of the suction port 62 by the exhaust pump 751 is restricted. In response to this, the valve control unit 915 (suction control unit) opens the valve 762 of the suction unit 76 of which the individual substrate B is present in the corresponding mounting hole 22, among the plurality of suction units 76, and closes the valve 762 of the suction unit 76 of which the individual substrate B is not present in the corresponding mounting hole 22 (step S103). In this configuration, by opening and closing the valve 762 provided in each of the plurality of suction units 76, suction can be selectively performed on the mounting hole 22 of which the individual substrate B is present, among the plurality of mounting holes 22.

[0041] As described above, in this embodiment, the transport jig 2 corresponds to an example of a "transport jig" of the present invention, the mounting hole 22 corresponds to an example of a "mounting location" of the present invention, the component mounter 4 corresponds to an example of a "component mounter" of the present invention, the pair of transport conveyors 41 correspond to an example of a "jig carry-in section" of the present invention, the suction backup 6 corresponds to an example of a "suction table" of the present invention, the suction port 62 corresponds to an example of a "suction port" of the present invention, the suction mechanism 75 corresponds to an example of an "individual substrate suction section" of the present invention, and the exhaust Pump 751 corresponds to an example of a "suction pump" of the present invention, suction unit 76 corresponds to an example of a "suction unit" of the present invention, valve 762 corresponds to an example of a "valve" of the present invention, valve control unit 915 corresponds to an example of a "suction control unit" of the present invention, information acquisition unit 916 corresponds to an example of an "information acquisition unit" of the present invention, individual substrate B corresponds to an example of an "individual substrate" of the present invention, jig loading position Lj corresponds to an example of a "loading position" of the present invention, and substrate sensor Sb corresponds to an example of a "sensor" of the present invention.

[0042] The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described embodiment without departing from the spirit of the present invention. For example, substrate fixing may be performed as shown in FIG. 8. FIG. 8 is a flowchart showing a modified example of substrate fixing performed by a component mounter. The flowchart in FIG. 8 assumes a case where an operator has previously set the opening and closing of each valve 762 depending on the presence or absence of an individual substrate B in each of the multiple mounting holes 22 of the transport jig 2, or a case where, after board production has been interrupted, board production is resumed while maintaining the opening and closing states of each valve 762 before the interruption. The flowchart in FIG. 8 is executed under the control of the main control unit 910.

[0043] In step S201, the lift control unit 912 causes the drive unit 712 to lift the suction backup 6 from the lowered position Ld to the raised position Lu. When the suction backup 6 is positioned at the raised position Lu, the pump control unit 913 starts the exhaust pump 751, and exhaust by the exhaust pump 751 begins (step S202). As a result, the suction port 62 communicating with the open valve 762 is sucked, and the individual substrate B mounted in the mounting hole 22 opposite the suction port 62 is fixed to the mounting hole 22. On the other hand, the suction port 62 communicating with the closed valve 762 is not sucked.

[0044] In step S203, the pressure acquisition unit 914 acquires the measured pressure measured by the pressure meter 753 and compares the measured pressure with the threshold negative pressure. If the measured pressure is less than the threshold negative pressure, the pressure acquisition unit 914 determines that the suction of the individual substrate B has been successful ("YES" in step S204), and the main control unit 910 determines that the fixing of the individual substrate B has been completed (step S205). On the other hand, if the measured pressure is equal to or greater than the threshold negative pressure, the pressure acquisition unit 914 determines that the suction of the individual substrate B has failed ("NO" in step S204), and the process proceeds to step S206.

[0045] In step S206, the information acquisition unit 916 acquires the detection results of each of the multiple board sensors Sb as board mounting information indicating the presence or absence of individual board B in each of the multiple mounting holes 22. In step S207, the valve control unit 915 identifies, based on the board mounting information, board mounting holes 22 in which individual board B has been mounted and board non-mounted holes 22 in which individual board B has not been mounted, among the multiple mounting holes 22 in the transport jig 2. Then, the valve control unit 915 opens the valve 762 of the suction unit 76 corresponding to the board mounting hole 22, while closing the valve 762 of the suction unit 76 corresponding to the board non-mounted hole 22. Then, the process returns to step S203.

[0046] In this modified example, suction is also selectively performed on mounting holes 22 that have individual substrates B among the multiple mounting holes 22. Therefore, by not suctioning mounting holes 22 that do not have individual substrates B, it is possible to prevent insufficient suction force for mounting holes 22 that have individual substrates B. As a result, when fixing, by suction, individual substrates B mounted in mounting holes 22 of transport jig 2, which has multiple mounting holes 22 that can each accommodate individual substrates B, it is not necessary to mount individual substrates B in all of the mounting holes 22 of transport jig 2.

[0047] Furthermore, the method for acquiring board mounting information indicating the presence or absence of individual boards B in each of the multiple mounting holes 22 of the transport jig 2 is not limited to the method using the board sensor Sb described above. That is, in step S102 or S206, the information acquisition unit 916 may acquire board mounting information based on board data Db indicating the position (mounting position) at which the component P is to be mounted in the transport jig 2. That is, it can be determined that, of the multiple mounting holes 22 of the transport jig 2, individual boards B will be mounted in those mounting holes 22 that overlap with the mounting positions indicated by the board data Db, and that individual boards B will not be mounted in those mounting holes 22 that do not overlap with the mounting positions indicated by the board data Db. Therefore, board mounting information can be acquired based on the board data Db. In this configuration, board mounting information can be acquired by checking the presence or absence of individual boards B in each of the multiple mounting holes 22 based on the board data Db, eliminating the need for a board sensor Sb that detects the board data Db.

[0048] Furthermore, the mounter 4 may be provided with a camera that captures an image of the transport jig 2 in order to capture an image of the transport jig 2 that has been carried into the jig carry-in position Lj or a fiducial mark attached to the individual board B. In such a case, board mounting information can be acquired based on the image of the transport jig 2 captured by the camera. [Explanation of symbols]

[0049] 2...Transport jig 22...Mounting hole 4...Component mounting machine 41...Transport conveyor (jig loading section) 6...Adsorption backup 62...Suction port 75...Suction mechanism 751...Exhaust pump 76…Suction part 762...Valve 915... Valve control unit (suction control unit) 916…Information acquisition department B...Individual board Lj...Jig loading position (loading position) Sb...Substrate sensor (sensor)

Claims

1. a jig loading section that loads a transport jig having a plurality of mounting positions each capable of mounting an individual circuit board into a predetermined loading position; an individual substrate suction unit having a plurality of suction units respectively corresponding to the plurality of mounting locations of the transport jig at the loading position, the suction units sucking the corresponding mounting locations; an information acquisition unit that acquires board mounting information indicating the presence or absence of the individual board at each of the plurality of mounting locations; a suction control unit that performs suction control to cause one of the plurality of suction units, in which the individual substrate is present at the corresponding mounting location, to perform suction, and to prevent one of the suction units, in which the individual substrate is not present at the corresponding mounting location, from performing suction, based on the board mounting information acquired by the information acquisition unit; A component mounting machine comprising:

2. 2. The component mounting machine according to claim 1, wherein the information acquisition unit has a sensor at each of the plurality of mounting locations that detects the presence or absence of the individual substrate at the mounting location, and acquires the results of the sensor detecting the individual substrate as the substrate mounting information.

3. 2. The component mounter according to claim 1, wherein the information acquisition unit acquires as the board mounting information the results of confirming whether or not the individual board is present at each of the plurality of mounting locations based on board data indicating the position at which the component is to be mounted on the transport jig.

4. the individual substrate suction unit includes a suction table facing the carry-in position from below, and a suction pump; The suction unit has a suction port that opens on the top surface of the suction table toward the corresponding mounting location, and a valve provided between the suction port and the suction pump, and by opening the valve, the suction port and the suction pump are communicated to suck the suction port by the suction pump, while by closing the valve, the suction port and the suction pump are disconnected to limit suction of the suction port by the suction pump, 4. The component mounting machine according to claim 1, wherein the suction control unit opens the valve of a suction unit among the plurality of suction units that has the individual substrate at the corresponding mounting location, while closing the valve of a suction unit that does not have the individual substrate at the corresponding mounting location.

5. a step of carrying a transport jig having a plurality of mounting positions each capable of mounting an individual circuit board to a predetermined loading position; a step of acquiring substrate mounting information indicating the presence or absence of the individual substrate at each of the mounting locations of the individual substrate suction units that have a plurality of suction units respectively corresponding to the mounting locations of the transport jig at the loading position and that suck the mounting locations corresponding to the suction units; a step of performing suction control based on the board mounting information, in which a suction unit among the plurality of suction units where the individual board is present at the corresponding mounting location performs suction, and a suction unit where a suction unit where the individual board is not present at the corresponding mounting location does not perform suction; An individual substrate suction control method comprising:

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