Holding member

Abstract

To provide a holding member that can improve the heat uniformity of a surface that holds a target object.SOLUTION: An electrostatic chuck 1 has a ceramic member 10, a base member 20, a bonding layer 30, and an RTD 41 provided on a bottom surface 12 of the ceramic member 10. The RTD 41 is covered by a filler 42. When viewed from an X-axis or Y-axis direction, a space δ is provided between a filler 42 and a top surface 21 of the base member 20, or between the filler 42 and the bonding layer 30.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a holding member for holding an object. [Background technology]

[0002] As a document relating to a holding member, Patent Document 1 discloses an electrostatic chuck in which a temperature detection unit is disposed on the underside of a ceramic member that holds a semiconductor wafer. In this electrostatic chuck, the temperature detection unit is accommodated in a recess in the underside of the ceramic member, the interior of the recess is filled with a filler, and the opening of the recess is closed with a lid. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-157617 Summary of the Invention [Problem to be solved by the invention]

[0004] In the electrostatic chuck disclosed in Patent Document 1, depending on the filling condition of the filler filled in the recess, there is a risk that the filler may be in contact with some parts of the lid that contacts the bonding layer and not in other parts. This may cause unevenness in heat transfer from the base member (i.e., heat transfer from the ceramic member to the base member via the bonding layer), which may reduce the thermal uniformity of the surface of the ceramic member that holds the semiconductor wafer.

[0005] Therefore, the present disclosure has been made to solve the above-mentioned problems, and aims to provide a holding member that can improve the thermal uniformity of the surface that holds an object. [Means for solving the problem]

[0006] One form of the present disclosure made to solve the above problem is a holding member for holding an object, the holding member having a first plate-shaped member having a first surface and a second surface opposite the first surface, a second plate-shaped member having a third surface and a fourth surface opposite the third surface, a bonding layer disposed between the second surface of the first plate-shaped member and the third surface of the second plate-shaped member and bonding the first plate-shaped member and the second plate-shaped member, and a temperature detection unit disposed on the second surface of the first plate-shaped member, wherein the temperature detection unit is covered by a protective unit, and when viewed from a direction perpendicular to the arrangement direction of the first plate-shaped member and the second plate-shaped member, a space is provided between the protective unit and the third surface of the second plate-shaped member or between the protective unit and the bonding layer.

[0007] According to this aspect, since the protective portion does not contact the third surface or the bonding layer of the second plate-shaped member, it is possible to suppress uneven heat transfer from the second plate-shaped member in the area where the temperature detection portion is disposed. As a result, it is possible to obtain an expected temperature distribution on the first surface of the first plate-shaped member, which is the surface that holds the object. Therefore, by separately adjusting the temperature distribution on the surface that holds the object, it is possible to improve thermal uniformity.

[0008] In the above aspect, it is preferable that the first plate-shaped member has a wiring layer therein, the temperature detection unit and the wiring layer are electrically connected via lead wires provided on the second surface of the first plate-shaped member, and the second surface of the first plate-shaped member and the surface of the temperature detection unit facing the first plate-shaped member are adhered together with an adhesive or double-sided tape.

[0009] According to this aspect, by adhering the second surface of the first plate-shaped member and the surface of the temperature detection unit facing the first plate-shaped member with an adhesive or double-sided tape adjusted to a desired thickness, the distance between the second surface of the first plate-shaped member and the surface of the temperature detection unit facing the first plate-shaped member can be made constant. This ensures constant heat transfer from the second surface of the first plate-shaped member to the temperature detection unit in the area where the temperature detection unit is located. This allows the temperature of the second surface of the first plate-shaped member to be accurately detected by the temperature detection unit. Based on the temperature of the second surface of the first plate-shaped member thus accurately detected, the temperature of the first surface of the first plate-shaped member, which is the surface that holds the object, can be accurately predicted. This allows for more precise temperature distribution adjustment on the surface that holds the object, improving thermal uniformity.

[0010] In the above aspect, it is preferable that the first plate-shaped member has a wiring layer therein, the temperature detection unit and the wiring layer are electrically connected via a conductive portion provided inside the first plate-shaped member, the conductive portion is electrically connected to the surface of the temperature detection unit facing the first plate-shaped member, and the second surface of the first plate-shaped member and the surface of the temperature detection unit facing the first plate-shaped member are bonded together by solder or a conductive adhesive.

[0011] According to this aspect, the second surface of the first plate-shaped member and the surface of the temperature detection unit facing the first plate-shaped member are bonded with solder or a conductive adhesive adjusted to a desired thickness, thereby ensuring a reliable electrical connection between the temperature detection unit and the internal wiring layer of the first plate-shaped member via the conductive portion. Furthermore, the distance between the second surface of the first plate-shaped member and the surface of the temperature detection unit facing the first plate-shaped member can be kept constant. This ensures consistent heat transfer from the second surface of the first plate-shaped member to the temperature detection unit in the area where the temperature detection unit is located. This allows the temperature of the second surface of the first plate-shaped member to be accurately detected by the temperature detection unit. Based on the temperature of the second surface of the first plate-shaped member thus accurately detected, the temperature of the first surface of the first plate-shaped member, which is the surface that holds the object, can be accurately predicted. This allows for more precise temperature distribution adjustment on the surface that holds the object, improving thermal uniformity.

[0012] In the above aspect, it is preferable that the bonding layer is not formed in an area overlapping the protective portion when viewed from the arrangement direction of the first plate-shaped member and the second plate-shaped member.

[0013] According to this aspect, there is no bonding layer on the second plate-shaped member side of the protective portion, and the protective portion and the third surface of the second plate-shaped member face each other with a space therebetween. This more reliably prevents the protective portion from contacting the third surface of the second plate-shaped member or the bonding layer. This more reliably prevents uneven heat transfer from the second plate-shaped member in the region where the temperature detection unit is located. [Effects of the Invention]

[0014] According to the holding member of the present disclosure, it is possible to improve the temperature uniformity of the surface that holds the object. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a schematic perspective view of an electrostatic chuck according to an embodiment of the present invention. [Figure 2]3A and 3B are cross-sectional views of the RTD and its surroundings as viewed from the X-axis direction and the Y-axis direction in the first embodiment. [Figure 3] FIG. 10 is an image showing that the bonding layer is not formed in the area overlapping the filler when viewed from the Z-axis direction. [Figure 4] 10A and 10B are cross-sectional views of an RTD and its surroundings as viewed from the X-axis direction and the Y-axis direction in a modified example of the first embodiment. [Figure 5] 10A and 10B are cross-sectional views of an RTD and its surroundings as viewed from the X-axis direction and the Y-axis direction in the second embodiment. [Figure 6] FIG. 10 is a diagram showing that the filler was in contact with the bonding layer in the conventional method. [Figure 7] FIG. 10 is a diagram showing that the distance between the lower surface of a ceramic member and the upper surface of an RTD varies in a conventional case. DETAILED DESCRIPTION OF THE INVENTION

[0016] An embodiment of a holding member according to the present disclosure will be described. In this embodiment, an electrostatic chuck 1 will be described as an example of the holding member.

[0017] <Overall explanation of electrostatic chuck> The electrostatic chuck 1 of this embodiment is a device that attracts and holds a semiconductor wafer W by electrostatic attraction, and is used, for example, to fix the semiconductor wafer W in a vacuum chamber of a semiconductor manufacturing device. The semiconductor wafer W is an example of the "target object" of the present disclosure.

[0018] 1, the electrostatic chuck 1 includes a ceramic member 10, a base member 20, and a bonding layer 30 that bonds the ceramic member 10 to the base member 20. The ceramic member 10 is an example of a "first plate-shaped member" in the present disclosure, and the base member 20 is an example of a "second plate-shaped member" in the present disclosure.

[0019] In the following description, for convenience of explanation, the X, Y, and Z axes are defined as shown in Fig. 1. Here, the Z axis is the axis in the central axis direction of the electrostatic chuck 1 (the vertical direction in Fig. 1), and the X and Y axes are axes in the radial direction of the electrostatic chuck 1. In other words, the Z axis direction is the arrangement direction of the ceramic member 10 and the base member 20, and the X and Y axis directions are directions perpendicular to the arrangement direction of the ceramic member 10 and the base member 20.

[0020] As shown in FIG. 1, the ceramic member 10 is a plate-shaped, more specifically, disk-shaped member, and is made of ceramics (ceramic substrate).

[0021] Although various ceramics are used as the ceramic, it is preferable to use ceramics whose main component is, for example, aluminum oxide (alumina, Al2O3) or aluminum nitride (AlN) from the viewpoints of strength, wear resistance, plasma resistance, etc. Here, the main component means the component with the highest content (for example, a component with a volume content of 90 vol% or more).

[0022] 1, the ceramic member 10 has a holding surface 11 (upper surface) that holds the semiconductor wafer W, and a lower surface 12 that is provided on the opposite side of the holding surface 11 in the thickness direction (i.e., the Z-axis direction) of the ceramic member 10. The holding surface 11 is an example of a "first surface" in the present disclosure, and the lower surface 12 is an example of a "second surface" in the present disclosure.

[0023] The ceramic member 10 has a diameter of, for example, about 180 to 400 mm. The ceramic member 10 has a thickness of, for example, about 2 to 6 mm. The ceramic member 10 preferably has a thermal conductivity in the range of 10 to 50 W / mK (more preferably, 18 to 30 W / mK).

[0024] The ceramic member 10 also includes a chuck electrode (adsorption electrode) (not shown) inside it. When a voltage is applied to the chuck electrode from a power supply (not shown), an electrostatic attraction force is generated in the chuck electrode, and the semiconductor wafer W is attracted to and held on the holding surface 11 by this electrostatic attraction force.

[0025] The ceramic member 10 also includes a heater (not shown) therein.

[0026] 2 and other figures, the ceramic member 10 is provided with an RTD 41, which is a resistance temperature detector, on its lower surface 12. The RTD 41 is housed inside a recess 13 formed in the lower surface 12, and is fixed to the lower surface 12 so as to be covered with a filler 42. The material of this filler 42 is, for example, a silicone-based, epoxy-based, or acrylic-based material.

[0027] A plurality of RTDs 41 are provided. For example, one RTD 41 is provided in each of a plurality of zones that are equally divided on the lower surface 12 of the ceramic member 10. The RTD 41 is an example of a "temperature detection portion" in the present disclosure, and the filler 42 is an example of a "protection portion" in the present disclosure.

[0028] The base member 20 is disposed on the opposite side of the ceramic member 10 from the holding surface 11. The base member 20 is formed, for example, in a cylindrical shape. The base member 20 is made of, for example, a metal (e.g., aluminum or an aluminum alloy), but may be made of a material other than metal.

[0029] 1, the base member 20 has an upper surface 21 and a lower surface 22 provided on the opposite side of the upper surface 21 in the Z-axis direction. The upper surface 21 of the base member 20 is thermally connected to the lower surface 12 of the ceramic member 10 via a bonding layer 30. The base member 20 also has a cooling flow path 23 through which cooling water flows. The upper surface 21 is an example of a "third surface" in the present disclosure, and the lower surface 22 is an example of a "fourth surface" in the present disclosure.

[0030] The diameter of the base member 20 is, for example, about 180 to 400 mm. The thickness (dimension in the Z-axis direction) of the base member 20 is, for example, about 20 to 50 mm. The thermal conductivity of the base member 20 (assumed to be made of aluminum) is preferably within the range of 160 to 250 W / mK (preferably about 230 W / mK).

[0031] The bonding layer 30 is disposed between the lower surface 12 of the ceramic member 10 and the upper surface 21 of the base member 20, and bonds the ceramic member 10 and the base member 20 in a heat-transferable manner. In this way, the lower surface 12 of the ceramic member 10 and the upper surface 21 of the base member 20 are thermally connected.

[0032] The bonding layer 30 is made of an adhesive material of a resin (such as a silicone resin, an acrylic resin, or an epoxy resin) containing a thermally conductive filler. The thickness (dimension in the Z-axis direction) of the bonding layer 30 is, for example, about 0.1 to 1.5 mm. The thermal conductivity of the bonding layer 30 is, for example, 1.0 W / mK. The thermal conductivity of the bonding layer 30 (assumed to be a silicone resin) is preferably within the range of 0.1 to 2.0 W / mK (preferably 0.5 to 1.5 W / mK).

[0033] In the electrostatic chuck 1 described above, the base member 20 is cooled by flowing cooling water through the cooling flow passages 23 provided in the base member 20, and as a result, heat is drawn from the ceramic member 10 to the base member 20 via the bonding layer 30, i.e., heat is drawn from the base member 20, thereby cooling the ceramic member 10. Cooling the ceramic member 10 can then cool the semiconductor wafer W held on the holding surface 11 and adjust the temperature distribution of the holding surface 11.

[0034] In this embodiment, the temperature of the lower surface 12 of the ceramic member 10 is detected by the RTD 41, and based on the detection result, the temperature of the holding surface 11 of the ceramic member 10 is predicted, and the temperature distribution on the holding surface 11 of the ceramic member 10 is adjusted to maintain thermal uniformity.

[0035] <Regarding the RTD and its surroundings> The RTD 41 is fixed to the lower surface 12 of the ceramic member 10 so as to be covered with the filler 42. Conventionally, as shown in FIG. 6, when the filler 42 touches the bonding layer 30, depending on the part of the filler 42, it touches or does not touch the bonding layer 30, resulting in uneven heat dissipation from the base member 20 in the region where the RTD 41 is disposed. Therefore, it was impossible to obtain the expected temperature distribution on the holding surface 11 of the ceramic member 10, and there was a risk that the heat uniformity of the holding surface 11 would deteriorate.

[0036] Also, when fixing the RTD 41 to the lower surface 12 of the ceramic member 10 with the filler 42, conventionally, as shown in FIG. 7, the distance between the lower surface 12 of the ceramic member 10 and the upper surface 47 of the RTD 41 has not been particularly controlled. Therefore, as shown in FIGS. 6 and 7, there are variations in the distance between the lower surface 12 of the ceramic member 10 and the upper surface 47 of the RTD 41 among multiple RTDs 41, or variations occur depending on the part in one RTD 41.

[0037] And since the distance between the lower surface 12 of the ceramic member 10 and the RTD 41 was not constant in this way, there was uneven heat transfer from the lower surface 12 of the ceramic member 10 equipped with a heater or the like to the RTD 41. Therefore, the accurate temperature of the lower surface 12 of the ceramic member 10 could not be measured by the RTD 41, and the reliability of the temperature of the lower surface 12 of the ceramic member 10 was low. Therefore, since the accurate temperature of the holding surface 11 of the ceramic member 10 could not be predicted, the expected temperature distribution could not be obtained on the holding surface 11 of the ceramic member 10, and the heat uniformity of the holding surface 11 had deteriorated.

[0038] Therefore, in the present embodiment, as in the following examples, the heat uniformity of the holding surface 11 of the ceramic member 10 is improved.

[0039] (First Embodiment) First, a first embodiment will be described. In this embodiment, as shown in Fig. 2, a ceramic member 10 has a wiring layer 43 therein. This wiring layer 43 is connected to, for example, a terminal portion (not shown). The RTD 41 and the wiring layer 43 are electrically connected via a lead wire 44 and an electrode pad 45 provided on the lower surface 12 of the ceramic member 10 and a via 46 provided inside the ceramic member 10.

[0040] 2, in this embodiment, the bonding layer 30 is cut in the area where the filler 42 and the lead wire 44 are provided. As a result, when the electrostatic chuck 1 is viewed from the Z-axis direction, as shown in FIG. 3, the bonding layer 30 is formed in the area that does not overlap with the filler 42, but is not formed in the area that overlaps with the filler 42.

[0041] 2, the end 30a of the cut portion of the bonding layer 30 does not have to be flush with the side surface 13a of the recess 13 of the ceramic member 10. For example, the position of the end 30a of the cut portion of the bonding layer 30 may be shifted to the left in FIG. 2 from the position of the side surface 13a of the recess 13 of the ceramic member 10. However, the distance by which the position of the end 30a of the cut portion of the bonding layer 30 is shifted to the left in FIG. 2 from the position of the side surface 13a of the recess 13 of the ceramic member 10 is set to a size (e.g., 0.05 mm to 1.00 mm) that does not affect the ability of heat to be drawn from the base member 20 by cutting the bonding layer 30.

[0042] By cutting the bonding layer 30 in this manner, a space δ is provided between the filler 42 and the upper surface 21 of the base member 20 when viewed from the X-axis direction or the Y-axis direction. This prevents the filler 42 from contacting the base member 20 or the bonding layer 30, thereby preventing uneven heat transfer from the base member 20 in the region where the RTD 41 is disposed. This allows for an expected temperature distribution on the holding surface 11 of the ceramic member 10. Therefore, by separately adjusting the temperature distribution on the holding surface 11, it is possible to improve thermal uniformity. The distance between the lower end of the filler 42 and the upper surface 21 of the base member 20 in the space δ is, for example, 0.1 mm or more and 5.0 mm or less.

[0043] The lower surface 12 of the ceramic member 10 and an upper surface 47 of the RTD 41 on the ceramic member 10 side are bonded together by an adhesive 48. The adhesive 48 is formed using an adhesive or double-sided tape (which may be combined with the filler 42), and its thickness is adjusted to be uniform throughout. For example, the thickness of the adhesive 48 is 0.01 mm to 1.0 mm. The adhesive may be made of a silicone, epoxy, or acrylic material, for example. The double-sided tape may be made of a silicone, acrylic, or other material, for example.

[0044] This makes it possible to keep the distance between the lower surface 12 of the ceramic member 10 and the upper surface 47 of the RTD 41 constant throughout the entire bonding portion 48. Therefore, heat transfer from the lower surface 12 of the ceramic member 10 to the RTD 41 becomes constant in the region where the RTD 41 is disposed, improving the reliability of the temperature measured by the RTD 41.

[0045] In particular, if the adhesive portion 48 is formed using double-sided tape, the distance between the lower surface 12 of the ceramic member 10 and the upper surface 47 of the RTD 41 can be easily kept constant throughout the entire adhesive portion 48 by adjusting the thickness of the double-sided tape.

[0046] 4, the bonding layer 30 may not be cut in the range of the filler 42 and the lead wire 44, and a space δ may be provided between the filler 42 and the bonding layer 30 when viewed from the X-axis direction or the Y-axis direction. In another modification, the bonding layer 30 may be cut only in the range where the filler 42 is provided.

[0047] In this embodiment, when viewed from the X-axis direction or the Y-axis direction, a space δ is provided between the filler 42 and the upper surface 21 of the base member 20, or between the filler 42 and the bonding layer 30.

[0048] In this way, the filler 42 does not come into contact with the upper surface 21 of the base member 20 or the bonding layer 30, which makes it possible to suppress uneven heat transfer from the base member 20 in the region where the RTD 41 is disposed. As a result, an expected temperature distribution can be obtained on the holding surface 11 of the ceramic member 10. Therefore, by separately adjusting the temperature distribution on the holding surface 11, it is possible to improve thermal uniformity.

[0049] Furthermore, the lower surface 12 of the ceramic member 10 and the upper surface 47 of the RTD 41 are bonded together with an adhesive or double-sided tape (that is, an adhesive portion 48).

[0050] This allows the lower surface 12 of the ceramic member 10 and the upper surface 47 of the RTD 41 to be bonded together with an adhesive or double-sided tape adjusted to a desired thickness, thereby making it possible to maintain a constant distance between the lower surface 12 of the ceramic member 10 and the upper surface 47 of the RTD 41. This reduces the variation in the distance between the lower surface 12 of the ceramic member 10 and the upper surface 47 of the RTD 41 among multiple RTDs 41, and also reduces the variation in the distance between different locations within a single RTD 41. This reduces the heat transfer from the lower surface 12 of the ceramic member 10 to the RTD 41 in the area where the RTD 41 is located. This allows the RTD 41 to accurately detect the temperature of the lower surface 12 of the ceramic member 10. Based on the thus accurately detected temperature of the lower surface 12 of the ceramic member 10, the temperature of the holding surface 11 of the ceramic member 10 can be accurately predicted. This allows the temperature distribution on the holding surface 11 to be adjusted more precisely, improving thermal uniformity.

[0051] In addition, the bonding layer 30 is cut in the area where the filler 42 and lead wire 44 are provided, and as shown in Figure 3, when viewed from the Z-axis direction, the bonding layer 30 is not formed in the area overlapping the filler 42.

[0052] In this way, the bonding layer 30 is not present on the base member 20 side of the filler 42, and the filler 42 and the upper surface 21 of the base member 20 face each other with a space δ therebetween. This more reliably prevents the filler 42 from coming into contact with the upper surface 21 of the base member 20 or the bonding layer 30. This more reliably prevents uneven heat transfer from the base member 20 in the region where the RTD 41 is placed.

[0053] (Second Example) Next, a second embodiment will be described, focusing on the differences from the first embodiment.

[0054] 5, the lead wire 44 is not provided, and the RTD 41 and the wiring layer 43 are electrically connected to each other through a via 49. The via 49 is provided inside the ceramic member 10 and connects an upper surface 47 of the RTD 41 to the wiring layer 43. The via 49 is an example of the "conductive portion" of the present disclosure.

[0055] The lower surface 12 of the ceramic member 10 and the upper surface 47 of the RTD 41 are bonded together by a conductive adhesive 51. This conductive adhesive 51 is formed of solder or a conductive adhesive. As a result, the upper surface 47 of the RTD 41 and the via 49 are electrically connected together via the solder or the conductive adhesive. For example, the thickness of the conductive adhesive 51 is 0.01 mm to 1.0 mm. The conductive adhesive is, for example, an epoxy-based, silicone-based, or acrylic resin adhesive containing a conductive filler such as silver, nickel, or gold.

[0056] According to this embodiment, the lower surface 12 of the ceramic member 10 and the upper surface 47 of the RTD 41 are bonded together by solder or a conductive adhesive.

[0057] In this way, by bonding the lower surface 12 of the ceramic member 10 and the upper surface 47 of the RTD 41 with solder or a conductive adhesive adjusted to the desired thickness, the RTD 41 and the wiring layer 43 inside the ceramic member 10 can be reliably electrically connected through the via 49.

[0058] Furthermore, by bonding the lower surface 12 of the ceramic member 10 and the upper surface 47 of the RTD 41 with solder or a conductive adhesive adjusted to a desired thickness, the distance between the lower surface 12 of the ceramic member 10 and the upper surface 47 of the RTD 41 can be made constant. That is, the distance between the lower surface 12 of the ceramic member 10 and the upper surface 47 of the RTD 41 is less likely to vary among multiple RTDs 41, and is also less likely to vary depending on the location of a single RTD 41. This ensures consistent heat transfer from the lower surface 12 of the ceramic member 10 to the RTD 41 in the region where the RTD 41 is located. Therefore, the temperature of the lower surface 12 of the ceramic member 10 can be accurately detected by the RTD 41. Based on the result of the detection of the temperature of the lower surface 12 of the ceramic member 10 thus accurately detected, the temperature of the holding surface 11 of the ceramic member 10 can be accurately predicted. Therefore, the temperature distribution on the holding surface 11 can be adjusted more precisely, improving thermal uniformity.

[0059] In addition, the number of parts can be reduced by eliminating the lead wire 44. Furthermore, since there is no need for a part to attach the lead wire 44, the configuration can be simplified and temperature singularities on the holding surface 11 of the ceramic member 10 can be reduced.

[0060] It should be noted that these are merely examples and do not limit the present disclosure in any way, and it goes without saying that various improvements and modifications are possible within the scope of the gist thereof.

[0061] For example, the above-described embodiment can be applied to a thermistor or a thermocouple as well as the RTD 41 as the temperature detection portion provided on the lower surface 12 of the ceramic member 10. [Explanation of symbols]

[0062] 1. Electrostatic chuck 10 Ceramic materials 11 Holding surface 12 Bottom side 20 Base member 30 Bonding layer 41 RTD 42 Filler 43 Wiring layer 44 lead wire 47 Top 48 Adhesive part 49 Beer 51 Conductive adhesive part W Semiconductor wafer δ Gap

Claims

1. A holding member for holding an object, a first plate-like member having a first surface and a second surface provided on the opposite side of the first surface; a second plate-shaped member including a third surface, a fourth surface provided on the opposite side to the third surface, and a coolant flow path for flowing a coolant; a bonding layer disposed between the second surface of the first plate-shaped member and the third surface of the second plate-shaped member, bonding the first plate-shaped member and the second plate-shaped member together; a temperature detection unit provided on the second surface of the first plate-shaped member, the temperature detection unit is covered by a protection unit, When viewed from a direction perpendicular to the arrangement direction of the first plate-shaped member and the second plate-shaped member, a space is provided between the protective portion and the third surface of the second plate-like member or between the protective portion and the bonding layer, the first plate-shaped member and the second plate-shaped member are thermally connected; A holding member characterized by:

2. The holding member of claim 1, the first plate-shaped member has a wiring layer therein, the temperature detection unit and the wiring layer are electrically connected via a lead wire provided on the second surface of the first plate-like member, the second surface of the first plate-shaped member and the surface of the temperature detection unit facing the first plate-shaped member are bonded together with an adhesive or double-sided tape so that the distance between them is constant; A holding member characterized by:

3. The holding member of claim 1, the first plate-shaped member has a wiring layer therein, the temperature detection unit and the wiring layer are electrically connected via a conductive portion provided inside the first plate-like member; the conductive portion is electrically connected to a surface of the temperature detection portion facing the first plate-like member, the second surface of the first plate-shaped member and the surface of the temperature detection unit facing the first plate-shaped member are bonded together by solder or a conductive adhesive so that the distance between them is constant; A holding member characterized by:

4. 4. The holding member according to claim 1, When viewed from the arrangement direction of the first plate-shaped member and the second plate-shaped member, the bonding layer is not formed in an area overlapping the protective portion; A holding member characterized by:

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