Mold, resin molding device, and method for manufacturing resin molded product

Abstract

To provide a molding die that can prevent the deformation of a lead frame even when using a lead frame without a frame member.SOLUTION: A molding die 1000 of the present invention is used for resin molding that exposes the back surface of a pad 301 of a lead frame 300. The molding die comprises an upper die 100 and a lower die 200. At least one of the upper die 100 and lower die 200 has a deformation suppression mechanism 122a, 222a, or 222ax that prevents deformation of the lead frame 300 during clamping. This deformation suppression mechanism comes into contact with at least part of the end surface of the lead frame 300 to prevent the deformation of the lead frame 300.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a molding die, a resin molding device, and a method for manufacturing a resin molded product. [Background technology]

[0002] Electronic elements such as ICs and semiconductor chips (hereinafter sometimes simply referred to as "chips") are often used after being resin-sealed (molded with resin). More specifically, for example, by resin-sealing a chip, the chip can be made into a resin-sealed electronic component (also referred to as a finished electronic component, package, etc.; hereinafter sometimes simply referred to as an "electronic component").

[0003] In the manufacture of electronic components, as described in Patent Document 1, for example, a lead frame (or simply referred to as a frame) on which a chip is mounted is sealed with resin (resin molding).

[0004] In Figure 1 of Patent Document 1, in order to solve the problem that distortion occurs in the lead frame due to thermal expansion during resin molding, and the tie bar (1g) deforms to absorb the distortion, a protrusion (4b) is provided in the mold at a position adjacent to the outer periphery of the tie bar. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Utility Model Application Publication No. 03-100413 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the method of providing protrusions on a mold to suppress tie bar deformation as in Patent Document 1, if the lead frame design changes, the shape, position, size, etc. of the protrusions must be changed, i.e., the mold must be changed. Specifically, for example, if the number of leads on the lead frame or the spacing between the leads (lead pitch) is different, the shape, position, size, etc. of the protrusions on the mold must be changed accordingly.

[0007] Therefore, an object of the present invention is to provide a molding die, a resin molding device, and a method for manufacturing a resin molded product that can suppress deformation of a lead frame without changing the molding die even if the lead frame design is different. [Means for solving the problem]

[0008] To achieve this objective, the mold of the present invention comprises: A molding die for resin molding with the back surface of the pad of the lead frame exposed, It has an upper mold and a lower mold, At least one of the upper mold and the lower mold is provided with a deformation suppression mechanism that suppresses deformation of the lead frame when the molds are clamped, The deformation suppression mechanism contacts at least a portion of the end face of the lead frame to suppress deformation of the lead frame.

[0009] The resin molding apparatus of the present invention includes the molding die of the present invention.

[0010] The method for producing a resin molded article of the present invention comprises: A method for manufacturing a resin molded product, comprising exposing the back surface of a pad of a lead frame and molding the resin using a molding die, The method for producing the resin molded product includes: a lead frame placing step of placing the lead frame on the lower die; a lead frame deformation suppression step of suppressing deformation of the lead frame by the deformation suppression mechanism, With the deformation of the lead frame suppressed by the deformation suppression mechanism, the upper mold and the lower mold are clamped together to resin-molde the lead frame. [Effects of the Invention]

[0011] According to the present invention, it is possible to provide a molding die, a resin molding device, and a method for manufacturing a resin molded product that can suppress deformation of a lead frame without changing the molding die even if the lead frame design is different. [Brief explanation of the drawings]

[0012] [Figure 1] 1(a) to 1(c) are cross-sectional views showing steps in one example of the molding die of the present invention and the method for producing a resin molded article of the present invention using the same. [Figure 2] FIG. 2 is a plan view showing an example of the overall configuration of a resin molding apparatus according to the present invention. [Figure 3] 3(a) to 3(c) are cross-sectional views showing steps in another example of the molding die of the present invention and the method for producing a resin molded article of the present invention using the same. [Figure 4-1] Figure 4-1(a) is a plan view showing an example of a lower mold in the molding die of the present invention, and Figure 4-1(b) is a plan view showing another example of a lower mold in the molding die of the present invention. [Figure 4-2] Figures 4-2(c) and 4-2(d) are plan views showing another example of the lower mold in the molding die of the present invention, and Figure 4-2(e) is a partially enlarged view of the lower mold in Figure 4-1(b) when a lead frame is placed therein. [Figure 5] Fig. 5(a) is a cross-sectional view showing an example of a deformation suppression mechanism in the molding die of the present invention. Fig. 5(b) is a cross-sectional view showing another example of a deformation suppression mechanism in the molding die of the present invention. Fig. 5(c) is a cross-sectional view showing yet another example of a deformation suppression mechanism in the molding die of the present invention. Fig. 5(d) is a cross-sectional view showing yet another example of a deformation suppression mechanism in the molding die of the present invention. [Figure 6]Fig. 6(a) is a plan view showing an example of a lead frame used in the molding die of the present invention and the method for producing a resin molded product of the present invention using the same. Fig. 6(b) is an enlarged view of a portion of the lead frame of Fig. 6(a). Fig. 6(c) is a perspective view of the portion shown in Fig. 6(b). Fig. 6(d) is a schematic cross-sectional view of the lead frame of Fig. 6(a) when placed in the lower die of a general molding die. [Figure 7] FIG. 7 is an image diagram showing deformation of the tie bars in the lead frame shown in FIG. [Figure 8] FIG. 8 is a cross-sectional view showing an example of a state in which the deformation suppression mechanism in the molding die of the present invention is in contact with the end face of the lead frame shown in FIG. 6, and is an enlarged view of a part of FIG. 3(a). [Figure 9] Fig. 9 is a cross-sectional view showing an example of a state in which the deformation suppression mechanism in the molding die of the present invention is in contact with the end face of the lead frame shown in Fig. 6. Fig. 9(a) is an overall plan view, Fig. 9(b) is an enlarged view of a portion, and Fig. 9(c) is an enlarged perspective view of a portion. [Figure 10] FIG. 10 is a cross-sectional view showing an example of a deformation suppression mechanism in the molding die of the present invention. [Figure 11] 11(a) to 11(c) are cross-sectional views showing the process of deformation of the tie bars in the lead frame shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0013] In the present invention, the molding die is not particularly limited, but may be, for example, a metal mold or a ceramic mold.

[0014] In the present invention, unless otherwise specified, the term "suppressing" the deformation of the lead frame is not limited to suppressing the amount of deformation of the lead frame to a small amount, but also includes the case where the amount of deformation of the lead frame is reduced to zero. For example, in the present invention, the term "suppressing" the displacement of the leads is not limited to suppressing the amount of displacement of the leads to a small amount, but also includes the case where the amount of displacement of the leads is reduced to zero, unless otherwise specified.

[0015] In the present invention, "contact with at least a part of the end face" may refer to contact with a part of the end face or contact with the entire end face. In addition, when contacting a part of the end face, the part in contact with the end face may be a surface, a line, or a point.

[0016] In the present invention, the resin molded product is not particularly limited, but may be, for example, an electronic component in which a chip is resin-encapsulated. Generally, the term "electronic component" refers to either a chip before resin encapsulation or a chip in a resin-encapsulated state. However, in the present invention, a chip before resin encapsulation is also referred to as an "electronic element," and a resin-encapsulated chip is referred to as an "electronic component" (an electronic component as a finished product). In other words, in the present invention, "chip" and "electronic element" are synonymous, and specific examples include chips such as ICs, semiconductor chips, semiconductor elements for power control, resistor elements, and capacitor elements. A "semiconductor element" refers, for example, to a circuit element made from a semiconductor material. The "chip" or "electronic element" in the present invention is not particularly limited as long as it is a chip before resin encapsulation, and does not have to be in chip form.

[0017] In the present invention, the resin material before molding and the resin after molding are not particularly limited and may be, for example, a thermosetting resin such as an epoxy resin or a silicone resin, or a thermoplastic resin. They may also be composite materials partially containing a thermosetting resin or a thermoplastic resin. In the present invention, examples of the form of the resin material before molding include powdered or granular resin (including granular resin), liquid resin, sheet-like resin, and tablet-like resin. In the present invention, liquid resin may be liquid at room temperature, and also includes molten resin that melts and becomes liquid when heated. The resin may be in any other form as long as it can be supplied to the cavity of a mold, a pot, or the like.

[0018] In the method for producing a resin molded article of the present invention, the resin molding method is not particularly limited, and may be, for example, transfer molding, injection molding, compression molding, or the like.

[0019] According to the present invention, for example, as described above, deformation of the lead frame can be suppressed even if the design of the lead frame, such as the number of leads and the spacing between leads, is different. Furthermore, in the present invention, the lead frame may have a frame member, but as will be described later, the lead frame may not have a frame member. According to the present invention, even if the lead frame does not have a frame member, i.e., even if the outermost part (the position closest to the outside) of the lead frame is not connected, deformation of the lead frame can be suppressed, allowing for appropriate resin molding. This eliminates the need for a process of cutting and removing the outermost frame member of the lead frame. Furthermore, the elimination of the frame member reduces the cost of the lead frame.

[0020] Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. For the sake of convenience, the drawings are drawn in a schematic manner with appropriate omissions and exaggerations.

[0021] In this embodiment, an example of the molding die of the present invention, an example of the method for producing the resin molded product of the present invention using the same, and an example of the lead frame used therefor will be described.

[0022] First, an example of a lead frame used in this embodiment will be described. In this embodiment, the back surface (the surface on which no chip is mounted) of the pad (a chip-mounting plate, also called a die pad) of the lead frame is exposed during molding. FIG. 6(a) is a plan view showing an example of a lead frame used in a molding die according to this embodiment and a method for manufacturing a resin molded product of the present invention using the molding die, which will be described later. FIG. 6(b) is an enlarged view of the area enclosed by a rectangular frame in the upper left corner of FIG. 6(a). In FIG. 6(b), only the leftmost row of pads is shown, and the pads in the inner rows are omitted. FIG. 6(c) is a perspective view of the portion shown in FIG. 6(b). As shown in the figure, this lead frame 300 has pads 301, tie bars 302, hanger pins 303, leads 304, and connecting members 311. The lead frame 300 is rectangular, and long, plate-like connecting members 311 are arranged on two long sides of the rectangle of the lead frame 300. The leads 304 are arranged on both sides of the pads 301 in parallel with the connecting members 311. The tie bars 302 are rod-shaped, and a plurality of tie bars 302 are arranged so as to intersect the leads 304 perpendicularly. Both ends of each tie bar 302 are connected to the connecting members 311. The pads 301 are rectangular, and there are a plurality of them. The pads 301 are arranged so as to be sandwiched between two adjacent tie bars 302. As shown in FIG. 6(c), each pad 301 is suspended from the tie bar 302 by a suspension pin 303. The thickness of the suspension pin 303 is not particularly limited, but is, for example, thinner than the leads 304. As shown in the figure, this lead frame 300 does not have a frame member that surrounds the entire structure including the pads 301, tie bars 302, leads 304, and suspension pins 303. That is, as shown in FIG. 6(b), ) As shown, there are no outermost frame members on the lead frame 300 . As shown in Figure 6(b),In the portion where the lead frame 300 is cut, there are leads 304, not a frame member. The connecting members 311 merely sandwich the pads 301, tie bars 302, leads 304, and hanger pins 303 from both sides, and do not surround the entire lead frame 300. This type of lead frame 300 does not have a frame member, and the outermost leads 304 are not connected, so it is possible to achieve weight reduction, resource saving, cost reduction, etc., compared to lead frames with frame members. On the other hand, this lead frame 300 has lower strength than lead frames with frame members, and therefore the tie bars 302, etc. in particular, are easily deformed. Also, as shown in FIG. 6(b) ) As shown in the figure, one tie bar 302 is long and rod-shaped, and multiple pads 301 are connected to it. Specifically, as shown in FIG. 6(a), each tie bar 302 extends from the connection portion with one connecting member 311 to the connection portion with the other connecting member 311. The long length of the tie bar 302 also makes the tie bar 302 prone to deformation. In the lead frame 300 of FIG. 6, the tie bar 302 connects two connecting members 311 to maintain the framework of the lead frame 300, and also plays a role in fixing the pads 301 via the hanger pins 303. The tie bar 302 also plays a role in preventing resin leakage from the mold cavity.

[0023] 6(d) shows the lead frame 300 of FIG. 6(a) placed on the lower die of a typical molding die. As shown in the figure, the lead frame 300 is placed so that the pads 301 contact the bottom surface of the lower die cavity 201, the hanger pins 303 extend obliquely upward from the pads 301, and the tie bars 302 to which the hanger pins 303 are connected and the leads 304 connected to the tie bars are placed in a state of being slightly floating above the die surface of the lower die 200.

[0024] When resin is molded using a typical molding die, there is a risk that the tie bars 302 will bend outward due to the pressure applied when the die is clamped, as shown in the conceptual diagram of FIG. 7. This phenomenon will be explained in more detail using the cross-sectional process views of FIGS. 11(a) to 11(c). As shown in the diagram, the molding die 1000 has an upper die 100 and a lower die 200. The upper die 100 has an upper die cavity 101. The lower die 200 has a lower die cavity 201. The upper die cavity 101 and the lower die cavity 201 are located opposite each other. When the upper die 100 and the lower die 200 are clamped together, the upper die cavity 101 and the lower die cavity 201 come together to form a die cavity, and resin molding can be performed within the die cavity.

[0025] When resin molding is performed using the molding die 1000 of Fig. 11 and the lead frame 300 of Fig. 6, the situation shown in the cross-sectional process views of Fig. 11(a) to (c) occurs. Note that in Fig. 11(a) to (c), the left end of the figure is the outermost side of the lead frame 300, and the right side of the figure is the inner side of the lead frame 300.

[0026] First, as shown in FIG. 11( a), the lead frame 300 is placed on the lower mold 200. As shown in the figure, the lead frame 300 is placed so that the pads 301 are in contact with the bottom surface of the lower mold cavity 201. As described above, the pads 301 are suspended from the tie bars 302 by the suspension pins 303. To ensure that the back surfaces of the pads 301 are exposed during molding, the height of the suspension pins 303 is designed to be slightly higher than the depth of the lower mold cavity 201 so that the pads 301 are in reliable contact with the bottom surface of the lower mold cavity 201 or so that the pads 301 can be pressed against the cavity bottom. Therefore, as shown in the figure, the leads 304 are slightly floating above the lower mold 200. Although the tie bars 302 are not shown in FIGS. 11( a) to 11(c), they are arranged so as to perpendicularly intersect with the leads 304 as shown in FIG. 6. Therefore, in FIG. 11( a ), the tie bars 302 are also slightly floating above the lower mold 200 , similar to the leads 304 .

[0027] Next, the lower mold 200 is raised as shown by the arrow X31 in Figure 11(b), whereby the leads 304 come into contact with the upper mold 100 as shown in the figure, and at this time the tie bars 302 also come into contact with the upper mold.

[0028] The lower mold 200 is then further raised, and the upper mold 100 and the lower mold 200 are clamped together as shown by arrow X32 in FIG. 11(c). This causes the upper mold cavity 101 and the lower mold cavity 201 to join together to form a mold cavity, allowing resin molding to occur within the mold cavity. At this time, the hanger pins 303 are pushed by the clamping pressure and tend to expand laterally, but the upper mold 100 and the lower mold 200 come into contact with the lead frame 300 without any gaps, resulting in clamping. In a lead frame having a frame member, the tie bars 302 and the frame member attempt to suppress deformation of the lead frame due to the lateral displacement of the hanger pins 303. However, in the case of the lead frame 300 of this embodiment, which does not have a frame member, the tie bars 302 attempt to suppress the lateral displacement of the hanger pins 303, but they end up significantly deforming (deflecting). The deformation of the tie bars 302 increases as the position of the tie bars 302 becomes closer to the outside of the lead frame 300, and the amount of deformation of the outermost tie bar 302 (closest to the outside) is the largest (see FIG. 7).

[0029] The present inventors have conducted extensive research into ways to suppress this deformation of the lead frame and have arrived at the present invention.

[0030] 1(a) to 1(c) are process cross-sectional views showing a molding die of this embodiment and some of the steps of a method for manufacturing a resin molded product of this embodiment using the same. As shown in the figures, molding die 1000 of this embodiment is the same as molding die 1000 of FIG. 11 except that upper die 100 has lead frame holding mechanism 120, and lead frame holding mechanism 120 has deformation suppression section 122a, which will be described later. Deformation suppression section 122a corresponds to the "deformation suppression mechanism" in the molding die of the present invention.

[0031] The lead frame pressing mechanism 120 includes an elastic member 121 and a pressing member 122. The pressing member 122 in this embodiment has a rectangular shape in a plan view and is large enough to press down all of the outermost leads 304 (the position closest to the outside) of the lead frame 300 (see FIG. 4 to be described later). -1 The same shape as the pressing member 222 in (b) is shown in FIG. -1 Unlike in (b), the pressing member 122 is provided on the upper mold 100, and is provided in a position where it can press down the outermost leads 304 at both ends of the lead frame 300. The pressing member 122 is attached to the main body of the upper mold 100 via an elastic member 121, and is provided so as to protrude from the mold surface of the upper mold 100 (see FIG. 1(a)). The pressing member 122 can move up and down by expanding and contracting the elastic member 121. At the bottom end of the pressing member 122, the portion where the deformation suppressing portion 122a is not provided becomes flush with the mold surface of the upper mold 100 when the mold is clamped.

[0032] A deformation suppression portion 122a is provided on a portion of the lower end of the pressing member 122. The deformation suppression portion 122a is provided on a portion of the lower end of the pressing member 122 that is outward when viewed from the leads 304. At the lower end of the pressing member 122, the portion where the deformation suppression portion 122a is provided protrudes downward further than the portion where the deformation suppression portion 122a is not provided. The pressing member 122 can press the leads 304 at the portion where the deformation suppression portion 122a is not provided. As will be described later, the deformation suppression portion 122a contacts at least a portion of the end face of the leads 304 (i.e., the end face of the lead frame 300) to suppress displacement of the leads 304, thereby suppressing deformation of the lead frame 300. Note that in FIG. 1, for clarity of illustration, the deformation suppression portion 122a and the other portions of the pressing member 122 are illustrated separately. However, this is not limited thereto, and the deformation suppression portion 122a and the other portions of the pressing member 122 may be integrally formed.

[0033] A method for manufacturing a resin molded product using molding die 1000 of Fig. 1 can be performed, for example, as follows: Lead frame 300 shown in Figs. 1(a) to 1(c) is the same as lead frame 300 shown in Fig. 6.

[0034] First, as shown in FIG. 1(a), a lead frame 300 is placed on the lower mold 200 (lead frame placing step). At this time, as shown in the figure, the lead frame 300 is placed so that the pads 301 are in contact with the bottom surface of the lower mold cavity 201. As described above, the pads 301 are suspended from the tie bars 302 by the suspension pins 303. As in FIG. 11, the height of the suspension pins 303 is designed to be slightly higher than the depth of the lower mold cavity 201. Therefore, the tie bars 302 and leads 304 are slightly floating above the mold surface of the lower mold 200, as shown in the figure.

[0035] Next, as shown by the arrow X11 in FIG. 1(b), the lower mold 200 is raised. As a result, as shown in the figure, the outermost leads 304 are pressed downward by the portions of the pressing member 122 where the deformation suppressing portions 122a are not provided. At this time, the deformation suppressing portions 122a provided on the pressing member 122 come into contact with at least a portion of the end faces (side faces) of the leads 304 (FIG. 4 -2 1(e)). This suppresses displacement of the leads 304. Furthermore, suppressing displacement of the leads 304 suppresses deformation of the entire lead frame 300. However, in this state, the deformation suppressing portion 122a and the end face of the leads 304 may not come into contact with each other, leaving a slight gap. In that case, the leads 304 will be displaced in the step of FIG. 1(c) described below, causing the deformation suppressing portion 122a to come into contact with the end face of the leads 304, suppressing displacement of the leads 304 and suppressing deformation of the entire lead frame 300. Specifically, for example, this is the same as the description of the second embodiment and FIG. 10 described below.

[0036] Next, as shown by arrow X12 in FIG. 1(c), the lower mold 200 is further elevated, and the upper mold 100 and the lower mold 200 are clamped together. At this time, the elastic member 121 contracts, and the presser member 122 rises. This clamping causes the upper mold cavity 101 and the lower mold cavity 201 to join together to form a mold cavity, allowing resin molding to occur within the mold cavity. At this time, as in FIG. 11(c), the tie bars 302 are pressed by the clamping pressure, mainly deforming the hanger pins 303, so that the upper mold 100, the lead frame 300 (leads 304 of the lead frame 300), and the lower mold 200 come into contact with each other without any gaps, thereby clamping the mold. In this embodiment, as described above, the deformation suppression portion 122a suppresses deformation of the leads 304, thereby suppressing deformation of the entire lead frame 300, including the tie bars 302.

[0037] 1(b) and 1(c), the step of pressing the leads 304 with the pressing member 122 to suppress deformation of the tie bar 302 and the step of bringing the deformation suppressing portion 122a into contact with at least a portion of the end surface of the leads 304 to suppress displacement of the leads 304 can each be considered to be part of the "lead frame deformation suppressing step" in the manufacturing method of a resin molded product of the present invention. However, as will be described later, the "lead frame deformation suppressing step" of the present invention is not limited to this. For example, in FIGS. 1(b) and 1(c), only the step of bringing the deformation suppressing portion 122a into contact with at least a portion of the end surface of the leads 304 to suppress displacement of the leads 304 may be considered to be the "lead frame deformation suppressing step" in the manufacturing method of a resin molded product of the present invention.

[0038] In this embodiment, the resin molding method is not particularly limited and may be similar to or equivalent to a general resin molding method. The resin molding method in this embodiment may be, for example, transfer molding, injection molding, compression molding, or the like, as described above. More specifically, for example, after the step of FIG. 1(a) and before the step of FIG. 1(b), a solid resin material (not shown) may be supplied into the lower mold cavity 201 and melted by the heat of the molding die 1000 to form a resin. The form of this resin material is also not particularly limited, as described above, and may be a powdered or granular resin (including a granular resin), a sheet-like resin, a tablet-like resin, or the like. Alternatively, for example, after clamping the mold as shown in FIG. 1(c), a liquid resin (not shown) may be injected into the mold cavity formed by combining the upper mold cavity 101 and the lower mold cavity 201 and solidified (cured) to form a resin. The liquid resin is also not particularly limited and may be, for example, a resin that is liquid at room temperature, as described above, or a molten resin that is melted by heating to form a liquid.

[0039] Furthermore, the lead frame that can be used in the present invention is not limited to the configurations shown in FIGS. 6 and 7 and may be any type of lead frame. According to the present invention, as described above, deformation of the lead frame can be suppressed even when a lead frame without a frame member is used. For this reason, it is preferable to use a lead frame without a frame member in the present invention. Using a lead frame without a frame member, for example, can reduce the weight of the lead frame, conserve resources, and reduce costs, as described above. For example, the absence of a frame member in a lead frame eliminates the need for a process of cutting and removing the frame member of the lead frame after resin molding, thereby enabling corresponding cost reductions. Note that, in the present invention, a lead frame "without a frame member" refers to the absence of a frame member surrounding the entire lead frame (e.g., the entire lead frame including the pads, leads, tie bars, and hanger pins). For example, in the lead frame 300 shown in FIG. 6, two connecting members 311 are located on the long sides of the rectangular lead frame 300 but are not located on the short sides of the rectangular lead frame 300. That is, as described above, the connecting member 311 merely sandwiches the pads 301, leads 304, tie bars 302, and hanger pins 303 from both sides, but does not entirely surround them. Therefore, the connecting member 311 is not a "frame member." In the present invention, a lead frame without a frame member may be, for example, a lead frame in which at least a portion of the peripheral edge of the lead frame does not have a connecting member. The lead frame 300 in FIG. 6 has connecting members on two sides of the peripheral edge and no connecting members on the other two sides. However, in the present invention, the lead frame without a frame member is not limited to this. For example, the lead frame without a frame member may be a lead frame in which three sides of the peripheral edge have connecting members and the other side does not have a connecting member, or a lead frame in which one side of the peripheral edge has a connecting member and the other three sides do not have a connecting member. Furthermore, the lead frame without a frame member may be a lead frame in which, for example, 10% or more, 20% or more, 30% or more, 40% or more, or 50% or more of the length of the peripheral edge does not have a connecting member.In the present invention, a lead frame without a frame member may be, for example, a lead frame in which leads, tie bars, hanger pins, or pads are arranged along at least a portion of the periphery of the lead frame. A lead frame with a frame member has a frame member arranged along the entire periphery of the lead frame, whereas a lead frame without a frame member has a member other than a frame member arranged along at least a portion of the periphery. This member other than a frame member may be, for example, a lead, tie bar, hanger pin, or pad, as described above. For example, the lead frame 300 in FIG. 6 has leads 304 arranged along two sides of the periphery, as described above. In the present invention, a lead frame without a frame member may be, for example, a lead frame in which leads, tie bars, hanger pins, or pads are arranged along one, two, three, or four of the four sides of the periphery. In the present invention, a lead frame without a frame member may be, for example, a lead frame in which leads, tie bars, hanger pins, or pads are arranged along 10% or more, 20% or more, 30% or more, 40% or more, or 50% or more of the length of the periphery. However, as mentioned above, the lead frame that can be used in the present invention is not particularly limited and can be any.

[0040] As described above, the resin molding apparatus of the present invention is a resin molding apparatus that includes the molding die of the present invention. The configuration of the resin molding apparatus of the present invention is not particularly limited, and may be the same as or equivalent to a general resin molding apparatus, for example, except that it includes the molding die of the present invention. The overall configuration of the resin molding apparatus in this embodiment is also not particularly limited, and may be, for example, as shown in Figure 2. Figure 2 will be described below.

[0041] An example of the overall configuration of a resin molding apparatus of the present invention is shown in the plan view of Figure 2. As shown in the figure, this resin molding apparatus 1 includes, as its components, a supply module 2 that supplies lead frames 300 and resin tablets T before resin sealing (resin molding), two resin molding modules 1000A and 1000B that perform resin molding, and an unloading module 4 that unloads the resin molded product. Note that the components, supply module 2, resin molding modules 1000A and 1000B, and unloading module 4, can be attached to and detached from the other components, and can be replaced.

[0042] The resin molding apparatus 1 also includes a conveying mechanism 5 (hereinafter referred to as "loader 5") that conveys the lead frames 300 and resin tablets T supplied by the supply module 2 to the resin molding modules 1000A and 1000B, and a conveying mechanism 6 (hereinafter referred to as "unloader 6") that conveys the resin molded products resin-molded by the resin molding modules 1000A and 1000B to the carry-out module 4. The resin tablets T can be turned into molten resin by melting them. Furthermore, the molten resin can be solidified (cured) to become sealing resin that seals the lead frames 300.

[0043] The supply module 2 of this embodiment is an integrated module of a substrate supply module 7 and a resin supply module 8.

[0044] The board supply module 7 has a board output section 71 and a board supply section 72. The board output section 71 outputs the lead frames 300 in the magazine to the board alignment section. The board supply section 72 receives the lead frames 300 from the board output section 71, aligns the received lead frames 300 in a predetermined direction, and hands them over to the loader 5.

[0045] The resin supply module 8 has a resin sending section 81 and a resin supply section 82. The resin sending section 81 receives the resin tablets T from a stocker (not shown) and sends out the resin tablets T to the resin supply section 82. The resin supply section 82 receives the resin tablets T from the resin sending section 81, aligns the received resin tablets T in a predetermined direction, and passes them to the loader 5.

[0046] Each of resin molding modules 1000A and 1000B has molding die 1000. Each molding die 1000 has lower die 200 and upper die 100, as shown in FIG.

[0047] Additionally, a heating portion (not shown) such as a heater may be embedded in each of the upper mold 100 and the lower mold 200. The upper mold 100 and the lower mold 200 can be heated by this heating portion.

[0048] 2 operates, for example, as follows. First, the substrate feeding unit 71 feeds the lead frames 300 in the magazine to the substrate supply unit 72. The substrate supply unit 72 aligns the received lead frames 300 in a predetermined direction and delivers them to the loader 5. Concurrently, the resin feeding unit 81 feeds the resin tablets T received from a stocker (not shown) to the resin supply unit 82. The resin supply unit 82 delivers the required number of received resin tablets T (four in FIG. 2) to the loader 5.

[0049] Next, the loader 5 simultaneously transports the received two lead frames 300 and four resin tablets T to the molding die 1000. The loader 5 supplies the lead frames 300 to the mounting portion of the lower die 200 and the resin tablets T to the inside of the pot formed in the lower die 200, respectively.

[0050] Thereafter, the upper mold 100 and the lower mold 200 are clamped together. Then, a resin tablet T in a pot block (not shown) is heated and melted, and the molten resin is pressed by a plunger (not shown). As a result, the molten resin is injected into the mold cavities (see FIGS. 1(a) to 1(c)) formed in the upper mold 100 and the lower mold 200 through a runner (resin passage) and a gate. Subsequently, the molten resin is heated for the required time for hardening, thereby hardening the molten resin to form a hardened resin. As a result, the pad 301 in the mold cavity is sealed in hardened resin (sealing resin) molded to correspond to the shape of the mold cavity.

[0051] Next, after the required time for curing has elapsed, the upper mold 100 and the lower mold 200 are opened to release the resin molded product (not shown). Thereafter, the resin molded product that has been resin-sealed by the molding die 1000 is accommodated in the substrate accommodation section 401 of the carry-out module 4 using the unloader 6.

[0052] The overall operation of the resin molding apparatus 1, including the above-described series of operations, is controlled by a control unit 9. In FIG. 1, this control unit 9 is provided in the supply module 2, but it may be provided in another module. The control unit 9 is configured, for example, by a dedicated or general-purpose computer having a CPU, internal memory, AD converter, input / output inverter, etc.

[0053] Next, another embodiment of the present invention will be described.

[0054] In this embodiment, another example of the molding die of the present invention and an example of the method for manufacturing a resin molded product of the present invention using the same will be described. The lead frame used in this embodiment is the same as the lead frame used in embodiment 1.

[0055] 3(a) to 3(c) are process cross-sectional views showing the molding die of this embodiment and some of the steps of the method for manufacturing a resin molded product of this embodiment using the same. As shown in the figures, molding die 1000 of this embodiment is the same as molding die 1000 of FIG. 11 except that lower die 200 has lead frame pressing mechanism 220, and lead frame pressing mechanism 220 has deformation suppression section 222a, which will be described later. Deformation suppression section 222a corresponds to the "deformation suppression mechanism" in the molding die of the present invention.

[0056] In the molding die 1000 of this embodiment, the upper die 100 does not have the lead frame pressing mechanism 120, and instead the lower die 200 has a lead frame pressing mechanism 220. The lead frame pressing mechanism 220 includes an elastic member 221 and a pressing member 222. The pressing member 222 of this embodiment has a rectangular shape in plan view (see FIG. 4 described later) large enough to press down all of the outermost leads 304 (the position closest to the outside) of the lead frame 300. -1 3(b)) and is provided at a position where it can press down the outermost leads 304 at both ends of the lead frame 300. The presser member 222 is attached to the main body of the lower mold 200 via an elastic member 221, and is provided so as to protrude from the mold surface of the lower mold 200 (see FIG. 3(a)). In this embodiment, the protrusion of the presser member 222 is preferably a distance that can support the portions of the leads 304 and tie bars 302 of the lead frame 300 that are floating above the mold surface of the lower mold when placed on the lower mold 200. The presser member 222 can move up and down by expanding and contracting the elastic member 221. The portion of the upper end of the presser member 222 where the deformation suppression portion 222a is not provided becomes flush with the mold surface of the lower mold 200 when the mold is clamped.

[0057] A deformation suppression portion 222a is provided on a portion of the upper end of the pressing member 222. The deformation suppression portion 222a is provided on a portion of the upper end of the pressing member 222 that is outward when viewed from the leads 304. At the upper end of the pressing member 222, the portion where the deformation suppression portion 222a is provided protrudes upward relative to the portion where the deformation suppression portion 222a is not provided. The pressing member 222 can press the leads 304 at the portion where the deformation suppression portion 222a is not provided. As will be described later, the deformation suppression portion 222a contacts at least a portion of the end face of the leads 304 (i.e., the end face of the lead frame 300) to suppress displacement of the leads 304, thereby suppressing deformation of the lead frame 300. Note that in FIG. 3, for clarity of illustration, the deformation suppression portion 222a and other portions of the pressing member 222 are illustrated separately. However, this is not limited thereto, and the deformation suppression portion 222a and other portions of the pressing member 222 may be integrally formed.

[0058] A method for manufacturing a resin molded product using the molding die 1000 of Fig. 3 can be performed, for example, as follows: As described above, the lead frame 300 shown in Fig. 3(a) to (c) is the same as the lead frame used in the first embodiment, i.e., the lead frame 300 shown in Fig. 6.

[0059] First, as shown in FIG. 3( a), the lead frame 300 is placed on the lower mold 200 (lead frame placing step). As in the first embodiment, the lead frame 300 is placed so that the pads 301 contact the bottom surface of the lower mold cavity 201. Furthermore, because the height of the suspension pins 303 is designed to be slightly greater than the depth of the lower mold cavity 201, the tie bars 302 and the leads 304 are slightly raised above the mold surface of the lower mold 200. In this embodiment, as described above, the pressing member 222 of the lead frame pressing mechanism 220 is provided so as to protrude from the lower mold 200 by this raised distance due to the elastic member 221. Therefore, at this time, the pressing member 122 supports the outermost leads 304 and the tie bars 302 of the lead frame 300 from below. Furthermore, at this time, the deformation suppressing portion 222 a contacts at least a portion of the end surface of the lead 304 to suppress displacement of the lead 304, thereby suppressing deformation of the entire lead frame 300. Therefore, deformation of the outermost tie bar 302 is also suppressed more than in the case of embodiment 1. However, in this state, there may be a slight gap between the deformation suppression portion 222a and the end face of the lead 304 and they are not in contact. In that case, the lead 304 will be displaced in the step shown in FIG. 3(b) or 3(c) described below, causing the deformation suppression portion 222a to come into contact with the end face of the lead 304, suppressing the displacement of the lead 304 and suppressing deformation of the entire lead frame 300 including the tie bar 302. Specifically, this is as shown in FIG. 10 described below, for example.

[0060] 8 shows an enlarged view of a portion of FIG. 3(a). As shown in FIG. 3(a) and FIG. 8, the pressing member 222 supports the outermost leads 304 and tie bar 302 of the lead frame 300 from below, and the deformation suppressing portion 222a contacts at least a portion of the end face of the leads 304. As described above, this suppresses displacement of the leads 304, thereby suppressing deformation of the entire lead frame 300 including the tie bar 302.

[0061] 9A and 9B show a plan view and a perspective view of the state of FIG. 3A. FIG. 9A is a plan view of the entire lead frame 300 and the deformation suppression portion 222a. The lead frame 300 is the same as the lead frame 300 of FIG. 6. FIGS. 9B and 9C are enlarged views of a portion of FIG. 9A where the deformation suppression portion 222a is in contact with at least a portion of the end surface of the lead 304. FIG. 9B is a plan view, and FIG. 9C is a perspective view. As shown in FIGS. 9B and 9C, the deformation suppression portion 222a is in contact with at least a portion of the end surface of the lead 304.

[0062] Furthermore, the enlarged cross-sectional view of FIG. 10 illustrates the state of the deformation suppression portion 222a and the leads 304 in the state of FIG. 3(a). As shown in the figure, the deformation suppression portion 222a and the end faces of the leads 304 are not in contact with each other, leaving a slight gap G. By providing a slight margin in this dimension, the leads 304 are less likely to get caught on the deformation suppression portion 222a when the lead frame 300 is placed on the lower mold 200. In this case, the leads 304 are displaced in the process shown in FIG. 3(b) or 3(c), which will be described later, and the deformation suppression portion 222a and the end faces of the leads 304 come into contact with each other. As a result, the leads 304 cannot be displaced further in the direction of the deformation suppression portion 222a, thereby suppressing deformation of the entire lead frame 300, including the tie bars 302. 10 , the surface α of the deformation suppression portion 222a that comes into contact with the end faces of the leads 304 is not completely parallel to the end faces of the leads 304, but is slightly inclined so as to move away from the end faces of the leads 304 as it goes upward. This makes it easier to place the lead frame 300 on the lower mold 200, as the leads 304 are less likely to get caught on the deformation suppression portion 222a. Furthermore, when the surface α of the deformation suppression portion 222a that comes into contact with the end faces of the leads 304 is not completely parallel to the end faces of the leads 304 but is slightly inclined, the deformation suppression portion 222a may come into contact with the leads 304 only at the lower ends of the end faces of the leads 304, for example.

[0063] In the present invention, the state in which the deformation suppression mechanism is in contact with at least a portion of the end face of the lead frame means that, as described above, the portion of the deformation suppression mechanism that is in contact with the end face of the lead frame may be a "plane," but may also be a "line," or a "point." For example, as described above, the plane α in FIG. 10 may be in contact with the lead 304 only at the lower end of the end face of the lead 304 (i.e., a "line").

[0064] Next, as shown by an arrow X21 in FIG. 3(b), the lower mold 200 is raised to bring the tie bars 302 and leads 304 into contact with the upper mold 100.

[0065] Next, as shown by arrow X22 in FIG. 3(c), the lower mold 200 is further raised, and the upper mold 100 and the lower mold 200 are clamped together. At this time, the elastic member 221 contracts, and the presser member 222 descends. This clamping operation causes the upper mold cavity 101 and the lower mold cavity 201 to join together to form a mold cavity, allowing resin molding to occur within the mold cavity. At this time, as in FIG. 1(c) of the first embodiment, the tie bar 302 is pressed by the clamping pressure, and the upper mold 100, the lead frame 300 (the leads 304 of the lead frame 300), and the lower mold 200 come into contact with each other without any gaps, thereby clamping the mold. At this time, as in FIG. 1(c) of the first embodiment, the deformation suppressing portion 222a suppresses displacement of the leads 304, thereby suppressing deformation of the entire lead frame 300, including the tie bar 302. Because the deformation of the tie bar 302 is suppressed, the tie bar 302 does not bend outward, as shown in FIG. 7.

[0066] 3(a) to 3(c), the step of pressing the leads 304 with the pressing member 222 to suppress deformation of the tie bar 302 and the step of bringing the deformation suppressing portion 222a into contact with the end surface of the leads 304 to suppress displacement of the leads 304 can each be considered to be part of the "lead frame deformation suppressing step" in the manufacturing method of a resin molded product of the present invention. However, the "lead frame deformation suppressing step" of the present invention is not limited thereto. For example, in FIGS. 3(a) to 3(c), only the step of bringing the deformation suppressing portion 122a into contact with the end surface of the leads 304 to suppress displacement of the leads 304 may be considered as the "lead frame deformation suppressing step" in the manufacturing method of a resin molded product of the present invention.

[0067] In this embodiment, the resin molding method is not particularly limited, and may be the same as or equivalent to a general resin molding method, or may be the same as the resin molding method described in embodiment 1. Furthermore, the overall configuration and operation of the resin molding device are not particularly limited, and may be the same as that shown in FIG. 2 (embodiment 1), for example.

[0068] Furthermore, the present invention is not limited to only Embodiments 1 and 2. In this embodiment, various examples of the molding die of the present invention will be described.

[0069] Figure 4 -1 (a) Lower mold 200 does not have a lower mold holding member 222, and instead has a deformation suppression portion (deformation suppression mechanism) 222ax provided on the main body of the lower mold 200 instead of the lower mold holding member 222. One deformation suppression portion 222ax is provided on each of the outer sides of the left and right outermost lower mold cavities 201. At the upper end of the lower mold 200, the portion where the deformation suppression portion 222ax is provided protrudes upward compared to the portion where the deformation suppression portion 222ax is not provided. Similar to the deformation suppression portion 222a described in FIG. 3 and FIGS. 8 to 10, the deformation suppression portion 222ax comes into contact with at least a part of the end face of the lead 304 (i.e., the end face of the lead frame 300) to suppress displacement of the lead 304, thereby suppressing deformation of the lead frame 300.

[0070] Figure 4 -1 The lower mold 200 in (b) is the same as the lower mold 200 in Figs. 3 and 8 to 10, and has a pressing member 222 on each side of the lower mold cavity 201. As described above, the pressing member 222 is provided with the deformation suppressing portion 222a. -2 (e) is Fig. 4 -1 FIG. 10B is a partially enlarged view of the lower mold when the lead frame is placed thereon.

[0071] Figure 4 -2 The lower mold 200 in (c) is shown in FIG. -1 This is an example in which the pressing member 222 in (b) is divided into a plurality of parts (here, divided into three parts). -1 As in (b), each member is provided with a deformation suppression portion 222a. In this example, the pressing member 222 is divided into equal sizes, but the central portion, which deforms more significantly, may be larger than the other portions. The number of divisions and the size of the divided pressing member 222 are desirably designed to match the shape of the lead frame to be molded.

[0072] Figure 4 -2 In the lower mold 200 of (d), the pressing member 222 has a length and width sufficient to press only the central portion of the outermost lead 304 of the lead frame 300, and is provided at a position that presses only the central portion of the outermost lead 304. -2 The lower mold 200 in (d) is shown in FIG. -1 It is the same as the lower mold 200 in (b). Hold The member 222 has a -1 As in (b), a deformation suppression portion 222a is provided. -2 The lower mold 200 of (d) can be applied when the shape of the lead frame to be molded is significantly deformed in the central portion, for example.

[0073] In the molding die of the present invention, the position of the pressing member is not particularly limited, but it is preferably located at a position where it can press down on the weaker (less powerful) parts of the lead frame in order to prevent deformation of the lead frame. The position where the pressing member is provided is preferably, for example, a position where it can press down on the tie bars, and it is particularly preferable that it can press down on the outermost tie bars. This is because, as mentioned above, tie bars have low strength and are easily deformed, and the outermost tie bars are more easily deformed. Also, as shown in FIG. 4 -1 (b) and Figure 4-2(c) Although the examples shown in (a) to (d) are examples in which the deformation suppression mechanism is provided in a part of the pressing member, the present invention is not limited to this, and the pressing member and the deformation suppression mechanism may be formed separately. For example, as shown in FIG. -1 In the example shown in (a) where the deformation suppression section (deformation suppression mechanism) 222ax is provided on the main body of the lower mold 200, the lower mold 200 may have a pressing member in addition to the deformation suppression section 222ax.

[0074] Figure 4 -1 (a) ~(b) and Figure 4-2(c) Although the examples of the configuration of the lower mold 200 are shown in (d), in the molding die of the present invention, the deformation suppression mechanism and the pressing member may be provided in the upper mold as described above.

[0075] In the molding die of the present invention, as described above, the pressing member is preferably provided as far outward as possible to suppress deformation of the tie bars, and more preferably in a position where it can suppress deformation of the outermost tie bars. This is because, as described above, the outermost tie bars tend to be more easily deformed. The pressing member can be, for example, as shown in FIG. -1 As shown in (b), one lead can be used to hold down the outermost lead, or as shown in Figure 4 -2 As shown in (c) or (d), other parts of the lead frame may be provided to hold down the parts where deformation is large. The shape of the holding member is as shown in Figure 4-1(b). and Figure 4-2(c)The shape of the presser member is not limited to the rectangular shape in plan view exemplified in (a) to (d), and may be, for example, a pin shape or a round shape. However, considering ease of processing and uniform application of force, a rectangular shape in plan view is preferable. Furthermore, the position of the lead frame pressed by the presser member is not limited to the lead portion, and may be both the lead portion and the tie bar portion, or only the tie bar portion. Furthermore, the molding die of the present invention may or may not have a presser member. Furthermore, in the molding die of the present invention, the deformation suppression mechanism may be integral with the presser member, or may be formed separately from the presser member, as described above. Furthermore, when the molding die of the present invention has a presser member, the presser member may be provided on both the upper mold and the lower mold, or on only one of them.

[0076] The molding die of the present invention is not limited to these. The cross-sectional views of Figures 5(a) to (d) show some examples of the molding die of the present invention. Figures 5(a) to (d) are enlarged cross-sectional views of only the outermost parts of upper mold 100 and lower mold 200 of molding die 1000, respectively.

[0077] 5(a) shows an example in which pressing members are provided on both the upper mold 100 and the lower mold 200, and furthermore, a deformation suppressing portion (deformation suppressing mechanism) is provided on the pressing member of the lower mold 200. In FIG. 5(a), the upper mold 100 has the lead frame pressing mechanism 120 (including an elastic member 121 and a pressing member 122) similar to the upper mold 100 of FIG. 1, except that it does not have the deformation suppressing portion 122a. In FIG. 5(a), the lower mold 200 has the lead frame pressing mechanism 220 (including an elastic member 221 and a pressing member 222) similar to the lower mold 200 of FIG. 3, and the upper end of the pressing member 222 is provided with the deformation suppressing portion 222a similar to FIG. 3. Also, the lower mold 200 of FIG. 5(a) has the lead frame pressing mechanism 220 (including an elastic member 221 and a pressing member 222) similar to that of FIG. 4. -1 It is the same as the lower mold 200 in (b).

[0078] 5(b) shows an example in which neither the upper mold 100 nor the lower mold 200 is provided with a pressing member, and only the lower mold 200 is provided with a deformation suppressing portion 222ax. -1It is the same as the lower mold 200 in (a).

[0079] 5(c) shows an example in which the upper mold 100 is not provided with a pressing member, and the lower mold 200 is provided with a lead frame pressing mechanism 220 (including an elastic member 221 and a pressing member 222) similar to those in FIGS. 3 and 5(a). The upper end of the pressing member 222 is provided with a deformation suppressing portion 222a similar to those in FIGS. 3 and 5(a). The lower mold 200 in FIG. 5(c) has a lead frame pressing mechanism 220 (including an elastic member 221 and a pressing member 222) similar to those in FIGS. 4 -1 It is the same as the lower mold 200 in (b).

[0080] 5(d) shows an example in which a lower mold 200 is not provided with a pressing member, and an upper mold 100 is provided with a lead frame pressing mechanism 120 (including an elastic member 121 and a pressing member 122) similar to that in FIG. 1. The pressing member 122 is provided with a deformation suppression portion 122a similar to that in FIG. 1. The upper mold 100 and lower mold 200 in FIG. 5(d) are the same as those in FIG.

[0081] As described above, the molding die of the present invention may have a presser member provided on both the upper and lower dies, or only one of them, or none at all. It is particularly preferable that a presser member be provided only on the lower die, and not on the upper die. Without a presser member provided on the upper die, the tie bar 302 is not deformed by the presser member 122 of the upper die, as shown in FIG. 1(b), making it easier to suppress the amount of deformation of the lead frame 300. On the other hand, if a presser member is provided on the lower die, the presser member 222 of the lower die can function as a dam to prevent resin leakage from the lower die cavity 201, as shown in FIG. 3(b), for example. Furthermore, in the molding die of the present invention, as described above, a deformation suppression mechanism may be provided on both the upper and lower dies, only one of them, or none at all, but it is preferable that a deformation suppression mechanism be provided on at least the lower die. If the lower mold is provided with a deformation suppression mechanism, as shown in FIG. 3(a), the end face of the lead frame 300 can be fitted into a deformation suppression section (deformation suppression mechanism) 222a simultaneously when the lead frame 300 is placed on the lower mold 200, thereby suppressing deformation of the entire lead frame 300, including the tie bars 302. It is particularly preferable that the lower mold is provided with a presser member, and the presser member of the lower mold is provided with a deformation suppression mechanism. With such a configuration, as shown in FIGS. 3(a) and 3(b), for example, the deformation suppression section (deformation suppression mechanism) 222a provided on the presser member 222 can easily suppress deformation of the entire lead frame 300, including the tie bars 302. Furthermore, with such a configuration, the presser member 222 of the lower mold can also function as a dam to prevent resin leakage from the lower mold cavity 201, as described above.

[0082] Furthermore, the present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately combined, modified, or selected and adopted as needed within the scope of the spirit of the present invention.

[0083] Some or all of the above embodiments may be described as, but are not limited to, the following supplementary notes. (Appendix 1) A molding die for resin molding with the back surface of the pad of the lead frame exposed, It has an upper mold and a lower mold, At least one of the upper mold and the lower mold is provided with a deformation suppression mechanism that suppresses deformation of the lead frame when the molds are clamped, The deformation suppression mechanism is a molding die that contacts at least a portion of an end face of the lead frame to suppress deformation of the lead frame. (Appendix 2) the lead frame further has leads, tie bars, and hanger pins in addition to the pads; the pad is suspended from the tie bar by the suspension pin; the lead frame has a frame member that surrounds the entire structure including the pads, the leads, the tie bars, and the hanger pins; an end surface of the lead frame includes an end surface of the frame member; the deformation suppression mechanism contacts at least a portion of an end face of the frame member to suppress displacement of the frame member, thereby suppressing deformation of the lead frame. The mold described in Appendix 1. (Appendix 3) the lead frame further has leads, tie bars, and hanger pins in addition to the pads; the pad is suspended from the tie bar by the suspension pin; the lead frame does not have a frame member that surrounds the entire structure including the pads, the leads, the tie bars, and the hanger pins; an end surface of the lead frame includes an end surface of the lead; the deformation suppression mechanism contacts at least a part of an end surface of the lead to suppress displacement of the lead, thereby suppressing deformation of the lead frame; The mold described in Appendix 1. (Appendix 4) 4. The molding die according to claim 2, further comprising a pressing member that presses the lead frame to suppress deformation of the tie bar. (Appendix 5) 5. The mold according to claim 4, wherein the pressing member is provided on at least one of the upper mold and the lower mold. (Appendix 6) 6. The molding die according to claim 4, wherein the pressing member is provided with a deformation suppressing mechanism that suppresses deformation of the lead frame. (Appendix 7) 7. The molding die according to any one of claims 4 to 6, wherein the pressing member is provided at a position where it can press the outermost portion of the lead frame. (Appendix 8) A resin molding device including the molding die according to any one of appendices 1 to 7. (Appendix 9) A method for manufacturing a resin molded product, comprising exposing the back surface of a pad of a lead frame and molding the resin using a molding die, The method for producing the resin molded product includes: a lead frame placing step of placing the lead frame on the lower die; a lead frame deformation suppression step of suppressing deformation of the lead frame by the deformation suppression mechanism, A method for manufacturing a resin molded product, in which the upper mold and the lower mold are clamped together while the deformation of the lead frame is suppressed by the deformation suppression mechanism, and the lead frame is resin-molded. [Explanation of symbols]

[0084] 1 Resin molding equipment 2 Supply Module 4. Unloading module 5. Transfer mechanism (loader) 6. Conveyor mechanism (unloader) 7. Substrate supply module 8 Resin Supply Module 9 Control Unit 71 Substrate sending section 72 Substrate supply section 81 Resin delivery section 82 Resin supply section 100 upper mold 101 Upper cavity 120 Lead frame holding mechanism 121 Elastic member 122 Holding member 122a Deformation suppression section (deformation suppression mechanism) 200 Lower mold 201 Lower die cavity 220 Lead frame holding mechanism 221 Elastic Members 222 Holding member 222a Deformation suppression section (deformation suppression mechanism) 222ax Deformation suppression part (deformation suppression mechanism) 300 lead frames 301 Pad 302 Tie Bar 303 Hanging pin 311 Connecting members 401 Substrate storage section 1000 molds 1000A, 1000B resin molded module A: A frame line indicating that the lead frame 300 does not have a frame member B Frame line indicating that tie bar 302 is long T Resin Tablet X11, X12, X21, X22, X31, X32 Arrows indicating the direction in which the lower die 200 rises Y11, Y12, Y13 Arrows indicating that parallel forces are applied to tie bar 302 G Gap α: the surface of the deformation suppression portion 222a that comes into contact with the end surface of the lead 304

Claims

1. A molding die for resin molding with the back surface of the pad of the lead frame exposed, It has an upper mold and a lower mold, At least one of the upper mold and the lower mold is provided with a lead frame pressing mechanism that is movable up and down, and a deformation suppressing mechanism that suppresses deformation of the lead frame when the molds are clamped, The deformation suppression mechanism contacts at least a portion of the end face of the lead frame to suppress deformation of the lead frame, and is a molding die that is positioned at the contact portion with the lead frame in the lead frame holding mechanism.

2. A molding die for resin molding with the back surface of the pad of a lead frame exposed, It has an upper mold and a lower mold, At least one of the upper mold and the lower mold is provided with a deformation suppression mechanism that suppresses deformation of the lead frame when the molds are clamped, the deformation suppression mechanism contacts at least a portion of an end surface of the lead frame to suppress deformation of the lead frame; the lead frame further has leads, tie bars, and hanger pins in addition to the pads; the pad is suspended from the tie bar by the suspension pin; the lead frame has a frame member that surrounds the entire structure including the pads, the leads, the tie bars, and the hanger pins; an end surface of the lead frame includes an end surface of the frame member; The deformation suppression mechanism is a molding die that suppresses deformation of the lead frame by contacting at least a portion of an end face of the frame member to suppress displacement of the frame member.

3. A molding die for resin molding with the back surface of the pad of a lead frame exposed, It has an upper mold and a lower mold, At least one of the upper mold and the lower mold is provided with a deformation suppression mechanism that suppresses deformation of the lead frame when the molds are clamped, the deformation suppression mechanism contacts at least a portion of an end surface of the lead frame to suppress deformation of the lead frame; the lead frame further has leads, tie bars, and hanger pins in addition to the pads; the pad is suspended from the tie bar by the suspension pin; the lead frame does not have a frame member that surrounds the entire structure including the pads, the leads, the tie bars, and the hanger pins; an end surface of the lead frame includes an end surface of the lead; The deformation suppression mechanism is a molding die that suppresses deformation of the lead frame by contacting at least a portion of the end face of the lead to suppress displacement of the lead.

4. 4. The molding die according to claim 2, further comprising a pressing member that presses the lead frame to suppress deformation of the tie bars.

5. 5. The mold according to claim 4, wherein the pressing member is provided on at least one of the upper mold and the lower mold.

6. 5. The molding die according to claim 4, wherein the pressing member is provided with a deformation suppressing mechanism for suppressing deformation of the lead frame.

7. 5. The molding die according to claim 4, wherein said pressing member is provided at a position where it can press the outermost portion of said lead frame.

8. A resin molding device comprising the molding die according to claim 1 .

9. A method for manufacturing a resin molded product, comprising exposing the back surface of a pad of a lead frame and molding the resin using a molding die, The mold is the mold according to any one of claims 1 to 3, The method for producing the resin molded product includes: a lead frame placing step of placing the lead frame on the lower die; a lead frame deformation suppression step of suppressing deformation of the lead frame by the deformation suppression mechanism, A method for manufacturing a resin molded product, in which the upper mold and the lower mold are clamped together while the deformation of the lead frame is suppressed by the deformation suppression mechanism, and the lead frame is resin-molded.

Images