Electronic Components

Abstract

To provide an electronic component capable of adjusting electromagnetic field coupling generated between multiple resonators.SOLUTION: An electronic component 1 includes a laminated body 2, a first shield 5A and a second shield 5B, and a first resonator 6 and a fifth resonator 10, and a shielded conductor 35 connected to the second shield 5B, and the shielded conductor 35 is arranged in a region extending in the third direction D3 between the first resonator 6 and the fifth resonator 10 when viewed from the third direction D3.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] Patent Document 1 discloses an electronic component including a body made of a dielectric, a plurality of resonators, a pair of shields, and a partition made of a conductor. In the electronic component described in Patent Document 1, each of the resonators includes a resonator conductor. The resonator conductor has a first end and a second end located at both ends in the longitudinal direction. The first end is connected to ground, and the second end is open. The partition extends to pass between the resonator conductors of the resonators and is electrically connected to each of the pair of shields. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-125804 A Summary of the Invention [Problem to be solved by the invention]

[0004] In electronic components equipped with resonators, it is necessary to form an attenuation pole to increase the attenuation in a target attenuation band. However, in electronic components equipped with multiple resonators, complex electromagnetic field coupling occurs between the resonators, making it difficult to form an attenuation pole. As a result, the electronic component cannot achieve the target attenuation.

[0005] An object of one aspect of the present invention is to provide an electronic component capable of adjusting electromagnetic field coupling occurring between a plurality of resonators. [Means for solving the problem]

[0006] (1) An electronic component according to one aspect of the present invention includes a laminate having a mounting surface and a main surface facing each other, a pair of first side surfaces facing each other, and a pair of second side surfaces facing each other; an input / output terminal and a ground terminal arranged on the mounting surface of the laminate; a first shield and a second shield arranged within the laminate, the first shield being electrically connected to the ground terminal and arranged closer to the mounting surface, and a second shield being electrically connected to the first shield and arranged closer to the main surface; a first resonator and a second resonator arranged between the first shield and the second shield within the laminate at a predetermined distance in the opposing direction of the pair of first side surfaces when viewed from the opposing direction of the pair of second side surfaces; and a conductor arranged between the first shield and the second shield within the laminate, extending along the opposing direction of the mounting surface and the main surface and connected to the second shield, wherein the conductor is arranged in a region extending in the opposing direction of the pair of second side surfaces between the first resonator and the second resonator when viewed from the opposing direction of the pair of second side surfaces.

[0007] In an electronic component according to one aspect of the present invention, the conductor is connected to the second shield and, when viewed from the opposing direction of the pair of second side surfaces, is disposed in a region between the first resonator and the second resonator that extends in the opposing direction of the pair of second side surfaces. This allows the conductor to adjust (suppress, shield) electromagnetic field coupling between the first resonator and the second resonator in the electronic component. Therefore, the electronic component can adjust electromagnetic field coupling occurring between multiple resonators. As a result, the electronic component can achieve a target attenuation.

[0008] (2) The electronic component according to (1), further comprising a plurality of conductors, each of which is arranged in a region. In this configuration, the electromagnetic coupling between the first resonator and the second resonator can be adjusted by adjusting the number and positions of the conductors.

[0009] (3) The electronic component according to (1) or (2), wherein each of the first resonator and the second resonator is electrically connected to the second shield. In this configuration, by connecting the conductor to the first resonator and the second resonator to the common second shield, it is possible to appropriately adjust the degree of electromagnetic coupling between the first resonator and the second resonator.

[0010] (4) The electronic component according to any one of (1) to (3), wherein the first resonator and the second resonator each include a first conductor and a second conductor arranged at different heights in the opposing direction between the mounting surface and the main surface, and a connecting conductor connecting the first conductor and the second conductor to the second shield, the first conductor being arranged closer to the main surface, the second conductor being arranged closer to the mounting surface, and the conductor being arranged closer to the first conductor than the second conductor. Of the first conductor and the second conductor connected to the second shield via the connecting conductor, the first conductor arranged closer to the second shield has a larger current flowing through it than the second conductor. Therefore, by arranging the conductor closer to the first conductor than the second conductor, the electromagnetic coupling between the first resonator and the second resonator can be effectively adjusted by the conductor.

[0011] (5) The electronic component according to (2), wherein at least one of the plurality of conductors is disposed in a region where the first resonator and the second resonator overlap when viewed from the opposing direction of the pair of first side surfaces. With this configuration, the conductor can effectively adjust the electromagnetic coupling between the first resonator and the second resonator.

[0012] (6) The electronic component according to any one of (1) to (5), wherein the first resonator and the second resonator have a symmetrical structure when viewed from the opposing direction of the mounting surface and the main surface. By making the first resonator and the second resonator have a symmetrical structure in this way, it is possible to facilitate the design of the electronic component.

[0013] (7) The electronic component according to any one of (1) to (6), further comprising a third resonator disposed between the first resonator and the second resonator in the opposing direction of the pair of first side surfaces, the third resonator being disposed at a position overlapping the conductor when viewed from the opposing direction of the mounting surface and the main surface. With this configuration, when there is a limit to the external size of the laminate, it is possible to effectively utilize the space within the laminate. [Effects of the Invention]

[0014] According to one aspect of the present invention, it is possible to adjust the electromagnetic field coupling occurring between a plurality of resonators. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a perspective view of an electronic component according to one embodiment. [Figure 2] FIG. 2 is a perspective view of an electronic component according to one embodiment. [Figure 3] FIG. 3(a) is a view of the electronic component as seen from the main surface side, and FIG. 3(b) is a view of the electronic component as seen from the mounting surface side. [Figure 4] FIG. 4 is a transparent perspective view of the electronic component. [Figure 5] FIG. 5 is a transparent perspective view of the electronic component. [Figure 6] FIG. 6 is a plan view showing the internal structure of a laminate of an electronic component. [Figure 7] FIG. 7 is an equivalent circuit diagram of the electronic component. [Figure 8] FIG. 8 is a transparent perspective view of the electronic component. [Figure 9] FIG. 9 is a plan view of the electronic component shown in FIG. [Figure 10] 10(a) is a diagram of the electronic component shown in FIG. 8 as seen from the side, and FIG. 10(b) is a diagram of the electronic component shown in FIG. 8 as seen from the side. [Figure 11] FIG. 11 is a transparent perspective view of the electronic component. [Figure 12] FIG. 12 is a plan view of the electronic component shown in FIG. [Figure 13]13(a) is a diagram of the electronic component shown in FIG. 11 as seen from the side, and FIG. 13(b) is a diagram of the electronic component shown in FIG. 11 as seen from the side. [Figure 14] FIG. 14 is a transparent perspective view of the electronic component. [Figure 15] FIG. 15 is a plan view of the electronic component shown in FIG. [Figure 16] 16(a) is a diagram of the electronic component shown in FIG. 14 viewed from the side, and FIG. 16(b) is a diagram of the electronic component shown in FIG. 14 viewed from the side. [Figure 17] FIG. 17 is a transparent perspective view of the electronic component. [Figure 18] FIG. 18 is a plan view of the electronic component shown in FIG. [Figure 19] 19(a) is a diagram of the electronic component shown in FIG. 17 viewed from the side, and FIG. 19(b) is a diagram of the electronic component shown in FIG. 17 viewed from the side. [Figure 20] FIG. 20 is a transparent perspective view of the electronic component. [Figure 21] FIG. 21 is a plan view of the electronic component shown in FIG. [Figure 22] FIG. 22 is a transparent perspective view of the electronic component. [Figure 23] FIG. 23 is a plan view of the electronic component shown in FIG. [Figure 24] 24(a) is a diagram of the electronic component shown in FIG. 22 as seen from the side, and FIG. 24(b) is a diagram of the electronic component shown in FIG. 22 as seen from the side. [Figure 25] FIG. 25 is a transparent perspective view of the electronic component. [Figure 26] FIG. 26 is a plan view of the electronic component shown in FIG. [Figure 27] 27(a) is a diagram of the electronic component shown in FIG. 25 as seen from the side, and FIG. 27(b) is a diagram of the electronic component shown in FIG. 25 as seen from the side. [Figure 28] FIG. 28 is a transparent perspective view of the electronic component. [Figure 29] FIG. 29 is a plan view of the electronic component shown in FIG. [Figure 30] 30(a) is a diagram of the electronic component shown in FIG. 28 viewed from the side, and FIG. 30(b) is a diagram of the electronic component shown in FIG. 28 viewed from the side. [Figure 31] FIG. 31(a) is a graph showing the resonance characteristics of the electronic component according to the comparative example, and FIG. 31(b) is a graph showing the resonance characteristics of the electronic component. [Figure 32] FIG. 32 is a graph showing the resonance characteristics of an electronic component. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are designated by the same reference numerals, and redundant description will be omitted.

[0017] 1 and 2 are perspective views of an electronic component according to one embodiment. FIG. 3(a) is a view of the electronic component as seen from the main surface side, and FIG. 3(b) is a view of the electronic component as seen from the mounting surface side. FIGS. 4 and 5 are see-through views of the electronic component. FIG. 6 is a plan view showing the internal structure of a laminate of the electronic component. As shown in FIGS. 1 to 6, the electronic component 1 includes a laminate 2, input / output terminals 3 and 4, a first shield 5A, a second shield 5B, a first resonator 6, a second resonator 7, a third resonator 8, a fourth resonator 9, and a fifth resonator (second resonator) 10. For ease of explanation, the laminate 2 is indicated by a two-dot chain line in FIGS. 4 to 6.

[0018] The laminate 2 has a rectangular parallelepiped shape. Examples of rectangular parallelepiped shapes include those with chamfered corners and ridges, and those with rounded corners and ridges. The laminate 2 has a pair of main surfaces 2a and 2b and four side surfaces 2c, 2d, 2e, and 2f as its outer surfaces. The main surfaces 2a and 2b face each other. The side surfaces (first side surfaces) 2c and 2d face each other. The side surfaces (second side surfaces) 2e and 2f face each other. Hereinafter, the facing direction of the main surfaces 2a and 2b is referred to as a first direction D1, the facing direction of the side surfaces 2c and 2d as a second direction D2, and the facing direction of the side surfaces 2e and 2f as a third direction D3. The first direction D1, the second direction D2, and the third direction D3 are substantially perpendicular to each other.

[0019] The principal surfaces 2a and 2b extend in the second direction D2 to connect the side surfaces 2c and 2d. The principal surfaces 2a and 2b also extend in the third direction D3 to connect the side surfaces 2e and 2f. The side surfaces 2c, 2d, 2e, and 2f extend in the first direction D1 to connect the principal surfaces 2a and 2b. The side surfaces 2c and 2d also extend in the third direction D3 to connect the side surfaces 2e and 2f. The side surfaces 2e and 2f extend in the second direction D2 to connect the side surfaces 2c and 2d.

[0020] The main surface 2b is a mounting surface, and is the surface that faces another electronic device (not shown) when the electronic component 1 is mounted on the other electronic device (for example, a circuit board or a laminated electronic component). A mark M is provided on the main surface 2a. The mark M indicates the orientation of the electronic component 1. Note that the mark M does not necessarily have to be provided.

[0021] The length of the laminate 2 in the first direction D1 is shorter than the length of the laminate 2 in the second direction D2 and the length of the laminate 2 in the third direction D3. The length of the laminate 2 in the second direction D2 is equal to the length of the laminate 2 in the third direction D3. The length of the laminate 2 in the second direction D2 may be shorter than the length of the laminate 2 in the third direction D3 or may be longer than the length of the laminate 2 in the third direction D3.

[0022] In this embodiment, "equivalent" does not only mean equal, but also may mean values ​​that include slight differences or manufacturing errors within a preset range. For example, if multiple values ​​are within a range of ±5% of the average value of the multiple values, the multiple values ​​are defined as equivalent.

[0023] The laminate 2 is formed by stacking a plurality of dielectric layers (not shown) in a first direction D1. That is, the stacking direction of the laminate 2 is the first direction D1. In an actual laminate 2, the plurality of laminate layers may be integrated to the extent that the boundaries between the layers are not visible, or may be integrated so that the boundaries between the layers are visible.

[0024] The dielectric layer is formed, for example, from a sintered ceramic green sheet containing a dielectric material, such as at least one selected from a BaTiO3-based material, a Ba(Ti,Zr)O3-based material, a (Ba,Ca)TiO3-based material, a glass material, or an alumina material.

[0025] The laminate 2 has a first dielectric constant portion 2A and second dielectric constant portions 2B and 2C. The first dielectric constant portion 2A has a higher dielectric constant than the second dielectric constant portions 2B and 2C. In other words, the second dielectric constant portions 2B and 2C have a lower dielectric constant than the first dielectric constant portion 2A. In this embodiment, the dielectric constant of the first dielectric constant portion 2A is, for example, 20 to 100. The dielectric constant of the second dielectric constant portions 2B and 2C is, for example, 3 to 10.

[0026] The first dielectric-constant portion 2A is disposed between the second dielectric-constant portion 2B and the second dielectric-constant portion 2C in the first direction D1. That is, the first dielectric-constant portion 2A is located in the center of the laminate 2 in the first direction D1 so as to be sandwiched between the second dielectric-constant portion 2B and the second dielectric-constant portion 2C. The surface of the second dielectric-constant portion 2B (the surface opposite to the surface facing (in contact with) the first dielectric-constant portion 2A) constitutes the main surface 2a of the laminate 2. The surface of the second dielectric-constant portion 2C (the surface opposite to the surface facing (in contact with) the first dielectric-constant portion 2A) constitutes the main surface 2b (mounting surface) of the laminate 2.

[0027] The thickness of the first dielectric-constant portion 2A in the first direction D1 is smaller (thinner) than the thickness of the second dielectric-constant portions 2B and 2C in the first direction D1. In other words, the thickness of the second dielectric-constant portions 2B and 2C in the first direction D1 is larger (thicker) than the thickness of the first dielectric-constant portion 2A in the first direction D1. In this embodiment, the thickness of the first dielectric-constant portion 2A is, for example, 0.16 mm. The thickness of the second dielectric-constant portions 2B and 2C is, for example, 0.64 mm. In this embodiment, the thicknesses of the second dielectric-constant portion 2B and the second dielectric-constant portion 2C are equal. The thickness of the second dielectric-constant portions 2B and 2C is, for example, four times the thickness of the first dielectric-constant portion 2A.

[0028] The input / output terminals 3 and 4 are each provided on the laminate 2. The input / output terminals 3 and 4 are each arranged on the main surface 2b of the laminate 2. The input / output terminals 3 and 4 are provided on the laminate 2 so as to be spaced apart from each other in the second direction D2. A plurality of ground terminals 11 are arranged on the main surface 2b of the laminate 2. The ground terminals 11 are ground terminals that are connected to the ground (not shown) of another electronic device.

[0029] The input / output terminals 3, 4, and ground terminal 11 each have a rectangular shape (rectangular shape). Each of the input / output terminals 3, 4, and ground terminal 11 is arranged such that each side extends along the second direction D2 or the third direction D3. The input / output terminals 3, 4, and ground terminal 11 protrude beyond the main surface 2b. That is, in this embodiment, the surfaces of the input / output terminals 3, 4, and ground terminal 11 are not flush with the main surface 2b. The input / output terminals 3, 4, and ground terminal 11 are made of a conductive material (for example, Cu).

[0030] Each of the input / output terminals 3, 4, and ground terminal 11 may be provided with a plating layer (not shown) containing, for example, Ni, Sn, Au, etc., by electrolytic plating or electroless plating. The plating layer may include, for example, a Ni plating film containing Ni and covering the input / output terminals 3, 4, and ground terminal 11, and an Au plating film containing Au and covering the Ni plating film.

[0031] 5 and 6, the first shield 5A and the second shield 5B are disposed within the laminate 2. The first shield 5A and the second shield 5B have the function of preventing electromagnetic waves from being emitted around the electronic component 1. The first shield 5A and the second shield 5B are made of a conductive material (for example, Cu).

[0032] The first shield 5A is disposed in the second dielectric constant portion 2C. The first shield 5A is disposed in a position closer to the main surface 2b in the second dielectric constant portion 2C (laminate 2). The second shield 5B is disposed in the second dielectric constant portion 2B. The second shield 5B is disposed in a position closer to the main surface 2a in the second dielectric constant portion 2B. The first shield 5A and the second shield 5B have a rectangular shape. The first shield 5A has cutouts at positions where the input / output terminals 3 and 4 are provided. Note that in FIGS. 5 and 6, parts of the first shield 5A and the second shield 5B are indicated by dashed lines.

[0033] The first shield 5A and the second shield 5B are electrically connected to the ground terminal 11. The first shield 5A and the second shield 5B are electrically connected to each other by a plurality of connecting conductors 12. Each of the plurality of connecting conductors 12 has a cylindrical (rod) shape and extends along the first direction D1. Each of the plurality of connecting conductors 12 is formed by, for example, a plurality of via conductors. The first shield 5A and the ground terminal 11 are electrically connected to each other by a plurality of connecting conductors 13. Each of the plurality of connecting conductors 13 is, for example, a via conductor.

[0034] Fig. 7 is an equivalent circuit diagram of the electronic component 1. As shown in Fig. 7, the electronic component 1 has an input / output port section 14, an input / output port section 15, a first resonator 6, a second resonator 7, a third resonator 8, a fourth resonator 9, a fifth resonator 10, a first coupling section C1, a second coupling section C2, a third coupling section C3, a fourth coupling section C4, a fifth coupling section C5, a sixth coupling section C6, a seventh coupling section C7, and an eighth coupling section C8.

[0035] In terms of the circuit configuration, the first resonator 6, the second resonator 7, the third resonator 8, the fourth resonator 9, and the fifth resonator 10 are provided between the input / output terminal 3 (input / output port section 14) and the input / output terminal 4 (input / output port section 15). In this embodiment, the expression "in terms of the circuit configuration" is used to indicate the arrangement on a circuit diagram, not the arrangement in a physical configuration. In this embodiment, in terms of the circuit configuration, the first resonator 6 on the first stage, the second resonator 7 on the second stage, the third resonator 8 on the third stage, the fourth resonator 9 on the fourth stage, and the fifth resonator 10 on the fifth stage are included between the input / output terminal 3 and the input / output terminal 4, in this order from the input / output terminal 3 side.

[0036] The first resonator 6, the second resonator 7, the third resonator 8, the fourth resonator 9, and the fifth resonator 10 are configured so that two adjacent resonators are electromagnetically coupled in the circuit configuration. Specifically, the first resonator 6 and the second resonator 7 are adjacent and electromagnetically coupled in the circuit configuration, the first resonator 6 and the third resonator 8 are adjacent and electromagnetically coupled in the circuit configuration, the second resonator 7 and the third resonator 8 are adjacent and electromagnetically coupled in the circuit configuration, the second resonator 7 and the fourth resonator 9 are adjacent and electromagnetically coupled in the circuit configuration, the third resonator 8 and the fourth resonator 9 are adjacent and electromagnetically coupled in the circuit configuration, the third resonator 8 and the fifth resonator 10 are adjacent and electromagnetically coupled in the circuit configuration, and the fourth resonator 9 and the fifth resonator 10 are adjacent and electromagnetically coupled in the circuit configuration.

[0037] The first coupling portion C1 is a capacitance formed by the magnetic coupling between the first resonator 6 and the second resonator 7. The second coupling portion C2 is a capacitance formed by the magnetic coupling between the second resonator 7 and the third resonator 8. The third coupling portion C3 is a capacitance formed by the magnetic coupling between the third resonator 8 and the fourth resonator 9. The fourth coupling portion C4 is a capacitance formed by the magnetic coupling between the fourth resonator 9 and the fifth resonator 10. The fifth coupling portion C5 is a capacitance formed by the magnetic coupling between the first resonator 6 and the third resonator 8. The sixth coupling portion C6 is a capacitance formed by the magnetic coupling between the third resonator 8 and the fifth resonator 10. The seventh coupling portion C7 is a capacitance formed by the magnetic coupling between the second resonator 7 and the fourth resonator 9. The eighth coupling portion C8 is a capacitance formed by the magnetic coupling between the first resonator 6 and the fifth resonator 10.

[0038] The first resonator 6, the second resonator 7, the third resonator 8, the fourth resonator 9, and the fifth resonator 10 are disposed in the laminate 2 between the first shield 5A and the second shield 5B.

[0039] Fig. 8 is a transparent perspective view of the electronic component 1. Fig. 9 is a plan view of the electronic component 1 shown in Fig. 8. Fig. 10(a) is a view of the electronic component 1 shown in Fig. 8 as seen from the side surface 2c, and Fig. 10(b) is a view of the electronic component 1 shown in Fig. 8 as seen from the side surface 2f. For ease of explanation, the laminate 2 is indicated by a two-dot chain line in Figs. 8 to 10.

[0040] As shown in Figures 8 and 9, the input / output port portion 14 has a conductor 20. As shown in Figures 10(a) and 10(b), the conductor 20 is arranged in the second dielectric constant portion 2C. As shown in Figures 8 and 9, the conductor 20 includes a conductor pattern 20A that is magnetically coupled to the first resonator 6, and a connection pattern 20B that electrically connects the input / output terminal 3 and the conductor pattern 20A. The conductor pattern 20A and the connection pattern 20B are integrally formed. The connection pattern 20B is connected to the input / output terminal 3 by a connection conductor 20C. The connection conductor 20C is formed, for example, by a plurality of via conductors.

[0041] The input / output port portion 15 has a conductor 21. As shown in FIGS. 10(a) and 10(b), the conductor 21 is disposed in the second dielectric constant portion 2C. As shown in FIGS. 8 and 9, the conductor 21 includes a conductor pattern 21A that is magnetically coupled to the fifth resonator 10, and a connection pattern 21B that electrically connects the input / output terminal 4 to the conductor pattern 21A. The conductor pattern 21A and the connection pattern 21B are integrally formed. The connection pattern 21B is connected to the input / output terminal 4 by a connection conductor 21C. The connection conductor 21C is formed, for example, by a plurality of via conductors.

[0042] Fig. 11 is a transparent perspective view of the electronic component 1. Fig. 12 is a plan view of the electronic component 1 shown in Fig. 11. Fig. 13(a) is a view of the electronic component 1 shown in Fig. 11 as seen from the side surface 2c, and Fig. 13(b) is a view of the electronic component 1 shown in Fig. 11 as seen from the side surface 2f. For ease of explanation, the laminate 2 is indicated by a two-dot chain line in Figs. 11 to 13.

[0043] As shown in FIGS. 11 and 12 , the first resonator 6 includes a first conductor 23A, a second conductor 23B, a connecting conductor 23C, and a connecting conductor 23D. The first conductor 23A and the second conductor 23B have, for example, a rectangular shape. The first conductor 23A and the second conductor 23B have the same size. The first conductor 23A and the second conductor 23B are electrically connected by the connecting conductor 23C and the connecting conductor 23D. Each of the connecting conductor 23C and the connecting conductor 23D has, for example, a cylindrical (rod) shape and extends along the first direction D1. Each of the connecting conductor 23C and the connecting conductor 23D is formed, for example, by a plurality of via conductors. The respective ends (ends on the main surface 2a side) of the connecting conductor 23C and the connecting conductor 23D are connected to the second shield 5B.

[0044] The first conductors 23A and the second conductors 23B are arranged at positions (different height positions) facing each other at a predetermined interval in the first direction D1. The first conductors 23A are arranged at a position closer to the main surface 2a of the laminate 2. The second conductors 23B are arranged at a position closer to the main surface 2b of the laminate 2. As shown in FIGS. 13(a) and 13(b), the first conductors 23A are arranged in the first dielectric constant portion 2A. The second conductors 23B are arranged in the second dielectric constant portion 2C. As shown in FIG. 12, the first conductors 23A and the second conductors 23B are arranged at positions closer to the side surface 2c in the second direction D2 of the laminate 2.

[0045] Fig. 14 is a transparent perspective view of the electronic component 1. Fig. 15 is a plan view of the electronic component 1 shown in Fig. 14. Fig. 16(a) is a view of the electronic component 1 shown in Fig. 14 as seen from the side surface 2c, and Fig. 16(b) is a view of the electronic component 1 shown in Fig. 14 as seen from the side surface 2f. For ease of explanation, the laminate 2 is indicated by a two-dot chain line in Figs. 14 to 16.

[0046] As shown in Figures 14 and 15, the second resonator 7 has a first conductor 24A and a second conductor 24B. The first conductor 24A has, for example, a substantially U-shape. The first conductor 24A includes a portion extending along the third direction D3 and portions extending from each end of the portion along the second direction D2. As shown in Figures 16(a) and 16(b), the first conductor 24A is disposed in the first dielectric constant portion 2A.

[0047] As shown in FIGS. 14 and 15, the second conductor 24B has, for example, a rectangular shape. The second conductor 24B is connected to the connecting conductor 24C and the connecting conductor 24D. The connecting conductor 24C and the connecting conductor 24D are connected to the first shield 5A and the second shield 5B. As shown in FIGS. 16(a) and 16(b), the second conductor 24B is disposed in the first dielectric constant portion 2A. The second conductor 24B is disposed closer to the main surface 2b than the first conductor 24A in the first direction D1. A portion of the second conductor 24B faces a portion of the first conductor 24A in the first direction D1. As shown in FIG. 15, the first conductor 24A and the second conductor 24B are disposed closer to the side surface 2c in the second direction D2 of the laminate 2.

[0048] Fig. 17 is a transparent perspective view of the electronic component 1. Fig. 18 is a plan view of the electronic component 1 shown in Fig. 17. Fig. 19(a) is a view of the electronic component 1 shown in Fig. 17 as seen from the side surface 2c, and Fig. 19(b) is a view of the electronic component 1 shown in Fig. 17 as seen from the side surface 2f. For ease of explanation, in Figs. 17 to 19, the laminate 2 is indicated by a two-dot chain line.

[0049] 17 and 18, the third resonator 8 has a first conductor 25A, a second conductor 25B, and a third conductor 25C. The third resonator 8 is disposed between the first resonator 6 and the fifth resonator 10 in the second direction D2. The first conductor 25A has, for example, a rectangular shape. The first conductor 25A extends along the third direction D3.

[0050] The second conductor 25B has, for example, a rectangular shape. The second conductor 25B is connected to the connecting conductors 25D, 25E, and 25F. The connecting conductors 25D and 25E are connected to the first shield 5A and the second shield 5B, respectively. The connecting conductor 25F is connected to the first shield 5A. The third conductor 25C has, for example, a rectangular shape. The third conductor 25C is connected to the connecting conductors 25G, 25H, and 25I. The connecting conductors 25G, 25H, and 25I are connected to the first shield 5A and the second shield 5B, respectively.

[0051] As shown in FIGS. 19(a) and 19(b), the first conductors 25A are arranged in the first dielectric constant portion 2A. As shown in FIG. 18, the first conductors 25A are arranged in the center of the laminate 2 in the second direction D2. The second conductors 25B are arranged in the first dielectric constant portion 2A. The second conductors 25B are arranged closer to the main surface 2b than the first conductors 25A in the first direction D1. A portion of the second conductors 25B faces a portion of the first conductors 25A in the first direction D1. The second conductors 25B are arranged closer to the side surface 2e in the third direction D3 of the laminate 2. The third conductors 25C are arranged closer to the main surface 2b than the first conductors 25A in the first direction D1. A portion of the third conductors 25C faces a portion of the first conductors 25A in the first direction D1. The third conductors 25C are arranged closer to the side surface 2f in the third direction D3 of the laminate 2.

[0052] As shown in FIGS. 14 and 15 , the fourth resonator 9 has a first conductor 26A and a second conductor 26B. The fourth resonator 9 has a symmetrical structure with the second resonator 7. The fourth resonator 9 has an axisymmetrical structure with the second resonator 7. The first conductor 26A has, for example, a substantially U-shape. The first conductor 26A includes a portion extending along the third direction D3 and portions extending from each end of the portion along the second direction D2. As shown in FIGS. 16( a) and 16(b), the first conductor 26A is disposed in the first dielectric constant portion 2A.

[0053] As shown in FIGS. 14 and 15 , the second conductor 26B has, for example, a rectangular shape. The second conductor 26B is connected to the connecting conductor 26C and the connecting conductor 26D. The connecting conductor 26C and the connecting conductor 26D are connected to the first shield 5A and the second shield 5B. As shown in FIGS. 16( a) and 16(b), the second conductor 26B is disposed in the first dielectric constant portion 2A. The second conductor 26B is disposed closer to the main surface 2b than the first conductor 26A in the first direction D1. A portion of the second conductor 26B faces a portion of the first conductor 26A in the first direction D1. As shown in FIG. 15 , the first conductor 26A and the second conductor 26B are disposed closer to the side surface 2d in the second direction D2 of the laminate 2.

[0054] 11 and 12, the fifth resonator 10 has a first conductor 27A, a second conductor 27B, a connecting conductor 27C, and a connecting conductor 27D. The fifth resonator 10 has a symmetrical structure with the first resonator 6. The fifth resonator 10 has an axisymmetrical structure with the first resonator 6. The fifth resonator 10 and the first resonator 6 are arranged in overlapping positions when viewed from the second direction D2. The first resonator 6 and the fifth resonator 10 are arranged with a predetermined gap between them in the second direction D2.

[0055] The first conductor 27A and the second conductor 27B have, for example, a rectangular shape. The first conductor 27A and the second conductor 27B have the same size. The first conductor 27A and the second conductor 27B are electrically connected by the connection conductor 27C and the connection conductor 27D. The connection conductor 27C and the connection conductor 27D each have, for example, a cylindrical (rod) shape and extend along the first direction D1. The connection conductor 27C and the connection conductor 27D each include, for example, a plurality of via conductors. The end portions (end portions on the main surface 2a side) of the connection conductor 27C and the connection conductor 27D are connected to the second shield 5B.

[0056] The first conductors 27A and the second conductors 27B are arranged at positions facing each other (at different heights) with a predetermined gap in between in the first direction D1. The first conductors 27A are arranged closer to the main surface 2a of the laminate 2. The second conductors 27B are arranged closer to the main surface 2b of the laminate 2. As shown in FIGS. 13(a) and 13(b), the first conductors 27A are arranged in the first dielectric constant portion 2A. The second conductors 27B are arranged in the second dielectric constant portion 2C. As shown in FIG. 12, the first conductors 27A and the second conductors 27B are arranged closer to the side surface 2d in the second direction D2 of the laminate 2.

[0057] FIG. 20 is a see-through perspective view of the electronic component 1. FIG. 21 is a plan view of the electronic component 1 shown in FIG. 20. As shown in FIGS. 20 and 21, the first resonator 6 and the second resonator 7 are magnetically coupled by a coupling conductor 28. The coupling conductor 28 has, for example, a rectangular shape. The coupling conductor 28 is disposed in the first dielectric constant portion 2A. The coupling conductor 28 is disposed at a position closer to the principal surface 2a in the first direction D1 than the first conductor 23A of the first resonator 6 and the first conductor 24A of the second resonator 7. The coupling conductor 28 faces the first conductor 23A of the first resonator 6 and the first conductor 24A of the second resonator 7.

[0058] Fig. 22 is a transparent perspective view of the electronic component 1. Fig. 23 is a plan view of the electronic component 1 shown in Fig. 22. Fig. 24(a) is a view of the electronic component 1 shown in Fig. 22 as seen from the side surface 2c side, and Fig. 24(b) is a view of the electronic component 1 shown in Fig. 22 as seen from the side surface 2f side.

[0059] As shown in FIGS. 22 and 23 , the second resonator 7 and the third resonator 8 are magnetically coupled by a coupling conductor 29. The coupling conductor 29 has, for example, a substantially L-shape. As shown in FIGS. 24( a) and 24(b), the coupling conductor 29 is disposed in the first dielectric constant portion 2A. The coupling conductor 29 is disposed at a position closer to the principal surface 2a than the first conductor 24A of the second resonator 7 and the first conductor 25A of the third resonator 8 in the first direction D1. The coupling conductor 29 faces the first conductor 24A of the second resonator 7 and the first conductor 25A of the third resonator 8.

[0060] 22 and 23, the third resonator 8 and the fourth resonator 9 are magnetically coupled by a coupling conductor 30. The coupling conductor 30 has, for example, a substantially L-shape. As shown in FIGS. 24(a) and 24(b), the coupling conductor 30 is disposed in the first dielectric constant portion 2A. The coupling conductor 30 is disposed at a position closer to the principal surface 2a than the first conductor 24A of the third resonator 8 and the first conductor 26A of the fourth resonator 9 in the first direction D1. The coupling conductor 30 faces the first conductor 25A of the third resonator 8 and the first conductor 26A of the fourth resonator 9.

[0061] Fig. 25 is a transparent perspective view of electronic component 1. Fig. 26 is a plan view of electronic component 1 shown in Fig. 25. Fig. 27(a) is a view of electronic component 1 shown in Fig. 25 as seen from side surface 2c, and Fig. 27(b) is a view of electronic component 1 shown in Fig. 25 as seen from side surface 2f.

[0062] As shown in FIGS. 25 and 26 , the first resonator 6 and the third resonator 8 are magnetically coupled by a coupling conductor 31. The coupling conductor 31 has, for example, a substantially L-shape. As shown in FIGS. 27( a) and 27(b), the coupling conductor 31 is disposed in the first dielectric constant portion 2A. The coupling conductor 31 is disposed at a position closer to the principal surface 2a than the first conductor 23A of the first resonator 6 and the first conductor 25A of the third resonator 8 in the first direction D1. The coupling conductor 31 faces the first conductor 23A of the first resonator 6 and the first conductor 25A of the third resonator 8.

[0063] As shown in FIGS. 25 and 26 , the third resonator 8 and the fifth resonator 10 are magnetically coupled by a coupling conductor 32. The coupling conductor 32 has, for example, a substantially L-shape. As shown in FIGS. 27( a) and 27(b), the coupling conductor 32 is disposed in the first dielectric constant portion 2A. The coupling conductor 32 is disposed at a position closer to the principal surface 2a in the first direction D1 than the first conductor 24A of the third resonator 8 and the first conductor 27A of the fifth resonator 10. The coupling conductor 32 faces the first conductor 25A of the third resonator 8 and the first conductor 27A of the fifth resonator 10.

[0064] Fig. 28 is a transparent perspective view of electronic component 1. Fig. 29 is a plan view of electronic component 1 shown in Fig. 28. Fig. 30(a) is a view of electronic component 1 shown in Fig. 28 as seen from side surface 2c, and Fig. 30(b) is a view of electronic component 1 shown in Fig. 28 as seen from side surface 2f.

[0065] As shown in FIGS. 28 and 29 , the first resonator 6 and the fifth resonator 10 are magnetically coupled by a coupling conductor 33. The coupling conductor 33 has, for example, a rectangular shape. As shown in FIGS. 30( a) and 30(b), the coupling conductor 33 is disposed at the boundary between the first dielectric constant portion 2A and the second dielectric constant portion 2C. The coupling conductor 33 is disposed at a position closer to the principal surface 2b than the first conductor 23A of the first resonator 6 and the first conductor 27A of the fifth resonator 10 in the first direction D1. The coupling conductor 33 faces the first conductor 23A of the first resonator 6 and the first conductor 27A of the fifth resonator 10.

[0066] The second resonator 7 and the fourth resonator 9 are magnetically coupled by a plurality of conductors (such as the connecting conductor 12 connecting the first shield 5A and the second shield 5B) arranged between the second resonator 7 and the fourth resonator 9 within the laminate 2.

[0067] As shown in FIG. 6 , the fourth resonator 9 and the fifth resonator 10 are magnetically coupled by a coupling conductor 34. The coupling conductor 34 has, for example, a rectangular shape. The coupling conductor 34 is disposed in the first dielectric constant portion 2A. The coupling conductor 34 is disposed at a position closer to the principal surface 2a in the first direction D1 than the first conductor 26A of the fourth resonator 9 and the first conductor 27A of the fifth resonator 10. The coupling conductor 34 faces the first conductor 26A of the fourth resonator 9 and the first conductor 27A of the fifth resonator 10.

[0068] As shown in FIG. 4, a shielding conductor 35 is disposed within the laminate 2. In this embodiment, a plurality of (for example, five) shielding conductors 35 are disposed. The shielding conductor 35 has, for example, a cylindrical (rod) shape and extends along the first direction D1. The shielding conductor 35 is disposed in the second dielectric constant portion 2B. The length of the shielding conductor 35 is smaller than the thickness of the second dielectric constant portion 2B. The length of the shielding conductor is, for example, 0.20 to 0.60 mm. The shielding conductor 35 is formed, for example, by a plurality of via conductors. Each end (end on the main surface 2a side) of the shielding conductor 35 is connected to the second shield 5B.

[0069] The shielding conductors 35 are arranged in a region extending in the third direction D3 between the first resonator 6 and the fifth resonator 10 when viewed from the third direction D3. This region extends from the side surface 2e to the side surface 2f when viewed from the first direction D1. The shielding conductors 35 are arranged in this region at predetermined intervals in the third direction D3. In this embodiment, the shielding conductors 35 are arranged in a region closer to the side surface 2f than the center of the laminate 2 in the third direction D3. At least one of the multiple shielding conductors 35 is arranged between the first resonator 6 and the fifth resonator 10 when viewed from the second direction D2. The shielding conductor 35 is arranged near the first conductor 23A of the first resonator 6 and the first conductor 27A of the fifth resonator 10. That is, the shielding conductor 35 is arranged closer to the first conductor 23A of the first resonator 6 and the first conductor 27A of the fifth resonator 10 than to the second conductor 23B of the first resonator 6 and the second conductor 27B of the fifth resonator 10.

[0070] The shielding conductor 35 is disposed at a position overlapping with the third resonator 8 when viewed from the first direction D1. In this embodiment, the shielding conductor 35 is disposed on a straight line along the third direction D3 at the center position of the laminate 2 in the second direction D2.

[0071] FIG. 31(a) is a graph showing the resonance characteristics of an electronic component according to a comparative example, and FIG. 31(b) is a graph showing the resonance characteristics of electronic component 1. FIGS. 31(a) and 31(b) show the frequency characteristics of attenuation when a signal is input from input / output terminal 3 and output from input / output terminal 4. In FIGS. 31(a) and 31(b), the horizontal axis represents frequency [MHz], and the vertical axis represents attenuation [dB]. Note that the characteristic diagrams shown in FIGS. 31(a) and 31(b) represent results obtained by simulation. The electronic component according to the comparative example does not include a shielding conductor.

[0072] 31(a), in the electronic component according to the comparative example, unnecessary coupling occurs between the first resonator and the fifth resonator, so the attenuation of the attenuation pole around 5800 MHz is the target 50 dB or less. As shown in FIG. 31(b), in the electronic component 1, the shielding conductor 35 can prevent unnecessary coupling between the first resonator 6 and the fifth resonator 10 (block the coupling), so the attenuation around 5800 MHz is 60 dB or less. That is, in the electronic component 1, the provision of the shielding conductor 35 makes it possible to achieve the target 50 dB or less.

[0073] Fig. 32 is a graph showing the resonance characteristics of the electronic component 1. Fig. 32 shows the frequency characteristics of attenuation when a signal is input from the input / output terminal 3 and output from the input / output terminal 4. In Fig. 32, the horizontal axis represents frequency [MHz], and the vertical axis represents attenuation [dB]. In Fig. 32, the solid line represents the characteristics when the shielding conductor 35 is 0.28 mm, the dashed line represents the characteristics when the shielding conductor 35 is 0.57 mm, and the dashed line represents the characteristics when no shielding conductor is provided.

[0074] 32, the attenuation can be adjusted by providing a shielding conductor 35. Furthermore, the position where the attenuation pole occurs and the attenuation in the target attenuation range can be adjusted (controlled) by changing the length of the shielding conductor 35.

[0075] As described above, in the electronic component 1 according to this embodiment, the shielding conductor 35 is connected to the second shield 5B and is disposed in a region extending in the third direction D3 between the first resonator 6 and the fifth resonator 10 when viewed from the third direction D3. This allows the shielding conductor 35 to adjust (suppress, shield) the electromagnetic field coupling between the first resonator 6 and the fifth resonator 10 in the electronic component 1. Therefore, the electronic component 1 can adjust the electromagnetic field coupling occurring between the multiple resonators. As a result, the electronic component 1 can achieve a target attenuation amount.

[0076] The electronic component 1 according to this embodiment includes a plurality of shielded conductors 35. Each of the plurality of shielded conductors 35 is disposed in the above-described region. In this configuration, the electromagnetic coupling between the first resonator 6 and the fifth resonator 10 can be adjusted by adjusting the number and positions of the shielded conductors 35.

[0077] In the electronic component 1 according to this embodiment, the first resonator 6 and the fifth resonator 10 are each electrically connected to the shielding conductor 35 via the second shield 5B. In this configuration, by connecting the shielding conductor 35 to the first resonator 6 and the fifth resonator 10 via the common second shield 5B, the degree of electromagnetic coupling between the first resonator 6 and the fifth resonator 10 can be appropriately adjusted.

[0078] In the electronic component 1 according to this embodiment, the first resonator 6 includes a first conductor 23A and a second conductor 23B disposed at different heights in the first direction D1, and connecting conductors 23C and 23D connecting the first conductor 23A and the second conductor 23B to the second shield 5B. The fifth resonator 10 includes a first conductor 27A and a second conductor 27B disposed at different heights in the first direction D1, and connecting conductors 27C and 27D connecting the first conductor 27A and the second conductor 27B to the second shield 5B. The first conductors 23A and 27A are disposed closer to the principal surface 2a, and the second conductors 23B and 27B are disposed closer to the principal surface 2b. The shielding conductor 35 is disposed closer to the first conductors 23A and 27A than the second conductors 23B and 27B. Of the first conductors 23A, 27A and the second conductors 23B, 27B connected to the second shield 5B via the connecting conductors 23C, 23D, 27C, 27D, a larger current flows through the first conductors 23A, 27A, which are located closer to the second shield 5B, than through the second conductors 23B, 27B. Therefore, by arranging the shielding conductor 35 closer to the first conductors 23A, 27A than to the second conductors 23B, 27B, the electromagnetic field coupling between the first resonator 6 and the fifth resonator 10 can be effectively adjusted by the shielding conductor 35.

[0079] In the electronic component 1 according to this embodiment, at least one of the multiple shielding conductors 35 is disposed in a region where the first resonator 6 and the fifth resonator 10 overlap when viewed from the second direction D2. In this configuration, the shielding conductor 35 can effectively adjust (suppress, shield) the electromagnetic field coupling between the first resonator 6 and the fifth resonator 10.

[0080] In the electronic component 1 according to this embodiment, the first resonator 6 and the fifth resonator 10 have a symmetrical structure when viewed from the first direction D1. By making the first resonator 6 and the fifth resonator 10 have a symmetrical structure in this way, the design of the electronic component 1 can be made easier.

[0081] The electronic component 1 according to this embodiment includes a third resonator 8 that is disposed between the first resonator 6 and the fifth resonator 10 in the second direction D2. The third resonator 8 is disposed at a position that overlaps with the shielding conductor 35 when viewed from the first direction D1. With this configuration, when there is a limit to the external size of the laminate 2, the space within the laminate 2 can be effectively utilized.

[0082] Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention.

[0083] In the above embodiment, the laminate 2 has a first dielectric constant portion 2A and two second dielectric constant portions 2B and 2C. However, the laminate 2 only needs to have a first dielectric constant portion and one second dielectric constant portion. Alternatively, the laminate 2 may be composed of only a first dielectric constant portion.

[0084] In the above embodiment, an example has been described in which the electronic component 1 includes the first resonator 6, the second resonator 7, the third resonator 8, the fourth resonator 9, and the fifth resonator 10. However, it is sufficient for the electronic component to include at least the first resonator 6 and the fifth resonator 10. The electronic component may also include further resonators.

[0085] In the above embodiment, the first conductor 23A and the second conductor 23B have the same size in the first resonator 6. However, the first conductor 23A and the second conductor 23B may have different sizes. Similarly, the first conductor 27A and the second conductor 27B in the fifth resonator 10 may have different sizes.

[0086] In the above embodiment, an example has been described in which, in the first resonator 6, the first conductor 23A is arranged in the first dielectric constant portion 2A of the laminate 2, and the second conductor 23B is arranged in the second dielectric constant portion 2C of the laminate 2. However, the first conductor 23A and the second conductor 23B may be arranged in the first dielectric constant portion 2A. Similarly, in the fifth resonator 10, the first conductor 27A and the second conductor 27B may be arranged in the first dielectric constant portion 2A.

[0087] In the above embodiment, an example was described in which five shielding conductors 35 are provided in the laminate 2. However, it is sufficient that at least one shielding conductor 35 is provided. [Explanation of symbols]

[0088] 1...electronic component, 2...laminated body, 2a...main surface, 2b...main surface (mounting surface), 2c, 2d...side surface (first side surface), 2e, 2f...side surface (second side surface), 3...input / output terminal, 4...input / output terminal, 5A...first shield, 5B...second shield, 6...first resonator, 8...third resonator, 10...fifth resonator (second resonator), 11...ground terminal, 23A...first conductor, 23B...second conductor, 23C, 23D...connecting conductor, 27A...first conductor, 27B...second conductor, 27C, 27D...connecting conductor.

Claims

1. a laminate having a mounting surface and a main surface facing each other, a pair of first side surfaces facing each other, and a pair of second side surfaces facing each other; an input / output terminal and a ground terminal disposed on the mounting surface of the laminate; a first shield and a second shield disposed within the laminate, the first shield being electrically connected to the ground terminal and disposed near the mounting surface, and the second shield being electrically connected to the first shield and disposed near the main surface; a first resonator and a second resonator that are disposed between the first shield and the second shield at a predetermined interval in the opposing direction of the pair of first side surfaces when viewed from the opposing direction of the pair of second side surfaces; a conductor that is disposed between the first shield and the second shield, extends along an opposing direction between the mounting surface and the main surface, and is connected to the second shield; the conductor is disposed in a region extending in the opposing direction of the pair of second side surfaces between the first resonator and the second resonator when viewed from the opposing direction of the pair of second side surfaces, An electronic component, wherein at least one other resonator is electrically connected between the first resonator and the second resonator in terms of a circuit configuration.

2. a plurality of the conductors; The electronic component according to claim 1 , wherein each of the plurality of conductors is disposed in the region.

3. The electronic component according to claim 1 , wherein each of the first resonator and the second resonator is electrically connected to the second shield.

4. the first resonator and the second resonator each include a first conductor and a second conductor that are arranged at different height positions in an opposing direction between the mounting surface and the main surface, and a connection conductor that connects the first conductor and the second conductor to the second shield, and the first conductor is disposed at a position close to the main surface, the second conductor is disposed at a position close to the mounting surface, The electronic component according to claim 1 , wherein the conductor is disposed closer to the first conductor than to the second conductor.

5. 3. The electronic component according to claim 2, wherein at least one of the plurality of conductors is arranged in the region where the first resonator and the second resonator overlap when viewed from the opposing direction of the pair of first side surfaces.

6. The electronic component according to claim 1 , wherein the first resonator and the second resonator have a symmetrical structure when viewed from a direction in which the mounting surface and the main surface face each other.

7. a third resonator disposed between the first resonator and the second resonator in the opposing direction of the pair of first side surfaces, The electronic component according to claim 1 , wherein the third resonator is disposed at a position overlapping the conductor when viewed from a direction in which the mounting surface and the main surface face each other.

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