Light emitting device, light emitting module, and method for manufacturing the light emitting device

Abstract

To provide a light-emitting device, a light-emitting module, and a method of manufacturing a light-emitting device capable of eliminating a need for identification of a terminal to facilitate mounting.SOLUTION: A light-emitting device comprises: a base material; a pair of first wires on a first surface of the base material; a first light-emission part and a second light-emission part on the pair of first wires; a pair of second wires on a second surface of the base material; a third light-emission part and a fourth light-emission part on the pair of second wires; a first connection member electrically connecting between one of the pair of first wires and one of the pair of second wires; a second connection member electrically connecting between the other of the pair of first wires and the other of the pair of second wires; a first terminal arranged on the first surface and electrically connected with the first connection member; and a second terminal arranged on the second surface and electrically connected with the second connection member. The first and second light-emission parts are connected in anti-parallel. The third and fourth light-emission parts are connected in anti-parallel.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The embodiments relate to a light emitting device, a light emitting module, and a method for manufacturing a light emitting device. [Background technology]

[0002] There are light emitting devices capable of double-sided emission. In such double-sided emission light emitting devices, a voltage higher than that applied to the cathode terminal is applied to the anode terminal, causing a current to flow through the light emitting device, causing the light emitting device to emit light, just like in single-sided emission light emitting devices (for example, Patent Document 1, etc.).

[0003] When mounting such a light-emitting device, it is necessary to distinguish between the anode terminal and the cathode terminal. However, due to miniaturization of light-emitting devices, it may become difficult to distinguish between the terminals, which may make mounting the light-emitting device difficult.

[0004] There is a demand for facilitating mounting of a light emitting device that emits light from both sides by eliminating the need to identify the terminals. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] International Publication No. 2013 / 115379 Summary of the Invention [Problem to be solved by the invention]

[0006] The embodiments aim to provide a light emitting device that eliminates the need to identify terminals and facilitates mounting, a light emitting module that uses the light emitting device, and a method for manufacturing the light emitting device. [Means for solving the problem]

[0007] A light emitting device according to an embodiment includes a substrate having a first surface and a second surface opposite the first surface, a pair of first wirings arranged on the first surface, a first light-emitting portion and a second light-emitting portion arranged on the pair of first wirings, a pair of second wirings arranged on the second surface, a first connection member electrically connecting one of the pair of first wirings to one of the pair of second wirings, a second connection member electrically connecting the other of the pair of first wirings to the other of the pair of second wirings, a first terminal arranged on the first surface and electrically connected to the first connection member, and a second terminal arranged on the second surface and electrically connected to the second connection member. The first light-emitting portion includes a first anode electrode electrically connected to one of the pair of first wirings and a first cathode electrode electrically connected to the other of the pair of first wirings. The second light-emitting unit includes a second cathode electrode electrically connected to one of the pair of first wirings and a second anode electrode electrically connected to the other of the pair of first wirings. The third light-emitting unit includes a third anode electrode electrically connected to one of the pair of second wirings and a third cathode electrode electrically connected to the other of the pair of second wirings. The fourth light-emitting unit includes a fourth cathode electrode electrically connected to one of the pair of second wirings and a fourth anode electrode electrically connected to the other of the pair of second wirings.

[0008] A manufacturing method for a light emitting device according to an embodiment includes the steps of preparing a substrate having a first surface and a second surface opposite the first surface, forming a pair of first wirings on the first surface, connecting a first light emitting element to the pair of first wirings, forming a pair of second wirings on the second surface, connecting a second light emitting element to the pair of second wirings, forming a first connecting member that electrically connects one of the pair of first wirings to one of the pair of second wirings, and forming a second connecting member that electrically connects the other of the pair of first wirings to the other of the pair of second wirings. The first light-emitting element includes a first light-emitting unit, a first anode electrode for the first light-emitting unit electrically connected to one of the pair of first wirings, a first cathode electrode for the first light-emitting unit electrically connected to the other of the pair of first wirings, the second light-emitting unit, a second cathode electrode for the second light-emitting unit electrically connected to one of the pair of first wirings, and a second anode electrode for the second light-emitting unit electrically connected to the other of the pair of first wirings. The second light-emitting element includes a third light-emitting unit, a third anode for the third light-emitting unit electrically connected to one of the pair of second wirings, a third cathode for the third light-emitting unit electrically connected to the other of the pair of second wirings, a fourth light-emitting unit, a fourth cathode for the fourth light-emitting unit electrically connected to one of the pair of second wirings, and a fourth anode for the fourth light-emitting unit electrically connected to the other of the pair of second wirings. [Effects of the Invention]

[0009] According to this embodiment, it is possible to provide a light emitting device that eliminates the need to identify terminals and facilitates mounting, a light emitting module that uses the light emitting device, and a method for manufacturing the light emitting device. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic perspective view illustrating a light emitting device according to a first embodiment. [Figure 2] FIG. 1 is a schematic side view illustrating the light emitting device according to the first embodiment. [Figure 3A]1 is a schematic diagram illustrating a light emitting device according to a first embodiment as viewed from above. [Figure 3B] 1 is a schematic diagram illustrating the light emitting device according to the first embodiment as viewed from below. [Figure 4A] FIG. 3B is a schematic cross-sectional view taken along line IVA-IVA in FIG. 3A. [Figure 4B] 4B is a schematic cross-sectional view taken along line IVB-IVB in FIG. 3A. FIG. [Figure 4C] FIG. 3B is a schematic cross-sectional view taken along the line IVC-IVC in FIG. 3A. [Figure 5A] FIG. 10 is a schematic cross-sectional view illustrating a part of a light emitting device according to a first modified example of the first embodiment. [Figure 5B] FIG. 10 is a schematic cross-sectional view illustrating a part of a light emitting device according to a first modified example of the first embodiment. [Figure 6A] 10 is a schematic top view illustrating a part of a light emitting device according to Modification 2 of the first embodiment. FIG. [Figure 6B] FIG. 10 is a schematic side view illustrating a part of a light emitting device according to a second modification of the first embodiment. [Figure 6C] FIG. 10 is a schematic top view illustrating a part of a light emitting device according to a third modification of the first embodiment. [Figure 6D] FIG. 10 is a schematic side view illustrating a part of a light emitting device according to a third modification of the first embodiment. [Figure 7A] FIG. 2 is a schematic exploded perspective view for explaining the operation of the light emitting device according to the first embodiment. [Figure 7B] FIG. 2 is a schematic diagram illustrating the operation of the light emitting device according to the first embodiment as viewed from above. [Figure 7C] 6 is a schematic cross-sectional view for explaining the operation of the light emitting device according to the first embodiment, taken along the line VIIC-VIIC in FIG. 2. FIG. [Figure 8A] 2A to 2C are schematic perspective views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 8B] 2A to 2C are schematic perspective views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 8C] 2A to 2C are schematic perspective views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 9A] 2A to 2C are schematic perspective views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 9B] 2A to 2C are schematic perspective views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 9C] 2A to 2C are schematic perspective views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 9D] 2A to 2C are schematic perspective views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 10A] 2A to 2C are schematic perspective views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 10B] 2A to 2C are schematic perspective views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 10C] 2A to 2C are schematic perspective views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 11] FIG. 10 is a schematic perspective view illustrating a light emitting device according to a second embodiment. [Figure 12] FIG. 10 is a schematic side view illustrating the light emitting device according to the second embodiment. [Figure 13] FIG. 10 is a schematic side view illustrating the light emitting device according to the second embodiment as viewed from another side. [Figure 14A] FIG. 10 is a schematic diagram illustrating a light emitting device according to a second embodiment as viewed from above. [Figure 14B] FIG. 10 is a schematic diagram illustrating a light emitting device according to a second embodiment as viewed from below. [Figure 15A] 14B is a schematic cross-sectional view taken along line XVA-XVA in FIG. 14A. [Figure 15B] 14B is a schematic cross-sectional view taken along line XVB-XVB in FIG. 14A. [Figure 16A] 14A is a schematic cross-sectional view for explaining the operation of the light emitting device according to the second embodiment, taken along line XVIA-XVIA in FIG. 14A. FIG. [Figure 16B] 14B is a schematic cross-sectional view for explaining the operation of the light emitting device according to the second embodiment, taken along line XVIB-XVIB in FIG. 14A. FIG. [Figure 17A] 10A to 10C are schematic perspective views illustrating a method for manufacturing a light emitting device according to a second embodiment. [Figure 17B] 10A to 10C are schematic perspective views illustrating a method for manufacturing a light emitting device according to a second embodiment. [Figure 17C] 10A to 10C are schematic perspective views illustrating a method for manufacturing a light emitting device according to a second embodiment. [Figure 18A] 10A to 10C are schematic perspective views illustrating a method for manufacturing a light emitting device according to a second embodiment. [Figure 18B] FIG. 18B is a schematic cross-sectional view of part XVIIIB in FIG. 18A. [Figure 19A] 10A to 10C are schematic perspective views illustrating a method for manufacturing a light emitting device according to a second embodiment. [Figure 19B] FIG. 19B is a schematic cross-sectional view of part XIXB in FIG. 19A. [Figure 20A] 10A to 10C are schematic perspective views illustrating a method for manufacturing a light emitting device according to a second embodiment. [Figure 20B] 10A to 10C are schematic side views illustrating a method for manufacturing the light emitting device according to the second embodiment. [Figure 21A] 10A to 10C are schematic perspective views illustrating a method for manufacturing a light emitting device according to a second embodiment. [Figure 21B] 10A to 10C are schematic perspective views illustrating a method for manufacturing a light emitting device according to a second embodiment. [Figure 22A] 10 is a schematic side view illustrating a light-emitting module according to a third embodiment. FIG. [Figure 22B] 10 is a schematic diagram illustrating a light-emitting module according to a third embodiment as viewed from above. FIG. [Figure 23A] FIG. 10 is a schematic side view illustrating a light-emitting module according to a fourth embodiment. [Figure 23B] 10 is a schematic diagram illustrating a light-emitting module according to a fourth embodiment as viewed from above. FIG. [Figure 24A]FIG. 10 is a schematic side view illustrating the light-emitting module according to the fifth embodiment. [Figure 24B] 10 is a schematic diagram illustrating a light emitting module according to a fifth embodiment as viewed from above. FIG. [Figure 25] FIG. 13 is a schematic side view illustrating a light-emitting module according to a sixth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the size ratio between parts, etc. are not necessarily the same as those in reality. Furthermore, even when the same part is shown, the dimensions and ratios may be different depending on the drawing. In the present specification and the drawings, elements similar to those described above with reference to the previous drawings may be designated by the same reference numerals, and detailed description thereof may be omitted. In addition, the drawings may show end faces as cross sections.

[0012] (First embodiment) FIG. 1 is a schematic perspective view illustrating the light emitting device according to this embodiment. FIG. 2 is a schematic side view illustrating the light emitting device according to this embodiment. FIG. 3A is a schematic top view illustrating the light emitting device according to this embodiment. FIG. 3B is a schematic bottom view illustrating the light emitting device according to this embodiment. 1, 2, 3A, and 3B, the light emitting device 1 of this embodiment includes a base material 10, a pair of first wirings 20, a first light emitting element 40a, a pair of second wirings 30, a second light emitting element 40b, a first connecting member 51, a second connecting member 52, a first terminal 61, and a second terminal 62. The light emitting device 1 of this embodiment further includes a first light-transmissive member 71 and a second light-transmissive member 72.

[0013] In the following description of this embodiment, three-dimensional coordinates may be used. The substrate 10 has a first surface 11a and a second surface 11b. The second surface 11b is located opposite the first surface 11a. The first surface 11a is parallel to the XY plane. The second surface 11b is parallel to the first surface 11a. Therefore, the second surface 11b is also parallel to the XY plane. The X axis is parallel to a line connecting the center of the first anode electrode A1 and the center of the first cathode electrode K1 of the first light-emitting unit 41 in the XY plane view. The Z axis is perpendicular to the XY plane, and the direction from the second surface 11b to the first surface 11a is the positive direction. In this specification, "parallel" includes a range of approximately 0° to ±5° between two lines, sides, surfaces, etc.

[0014] The positive direction of the Z axis is sometimes referred to as "up" or "above," and the negative direction of the Z axis is sometimes referred to as "down" or "below." However, the direction along the Z axis is not necessarily the direction in which gravity is applied. In the light-emitting devices of this embodiment and the second embodiment described below, when describing the configuration of the first surface side, the positive direction of the Z axis is also referred to as "up" or "above," and when describing the configuration of the second surface side, the negative direction of the Z axis is sometimes referred to as "up" or "above," for example, as "on the second surface." These are also intended to make the explanation easier to understand, and are not limited to the actual "up" or "above."

[0015] As shown in FIGS. 1 and 2, the light emitting device 1 has a first light-transmissive member 71 disposed on the first surface 11a of the base. The surface of the first light-transmissive member 71 opposite to the surface facing the first surface 11a is the light extraction surface S1. The light emitting device 1 has a second light-transmissive member 72 disposed on the second surface 11b of the base. The surface of the second light-transmissive member 72 opposite to the surface facing the second surface 11b is the light extraction surface S2. Therefore, the light emitting device 1 is a double-sided light emitting device having the light extraction surface S1 and the light extraction surface S2 opposite to the light extraction surface S1. For ease of explanation, the surface of the first light-transmissive member 71 opposite to the surface facing the first surface 11a is referred to as the light extraction surface S1. However, light extracted from the first light-transmissive member 71 to the outside is not limited to being extracted from the light extraction surface S1, but can also be extracted from a side surface located between the light extraction surface S1 and the surface of the first light-transmissive member 71 facing the first surface 11a. Similarly, the surface of the second light-transmissive member 72 located opposite to the surface facing the second surface 11b is set as the light extraction surface S2. However, light extracted from the second light-transmissive member 72 to the outside is not limited to being extracted from the light extraction surface S2, but can also be extracted from a side surface located between the surface of the second light-transmissive member 72 facing the second surface 11b and the light extraction surface S2. The same applies to a first light-transmissive member 271 and a second light-transmissive member 272 described below.

[0016] In this example, the substrate 10 is a plate-like member having a substantially square shape in the XY plane. The substrate 10 is not limited to a square shape in the XY plane, but may be a plate-like member having a rectangular shape or a polygonal shape other than a square or rectangle. In this example, the substrate 10 includes a first substrate 10a and a second substrate 10b. The first substrate 10a and the second substrate 10b are, for example, plate-like members having the same shape and thickness in the XY plane. The first substrate 10a is bonded to the second substrate 10b, for example, with a translucent adhesive. In this case, the surface of the first substrate 10a opposite the first surface 11a faces the surface of the second substrate 10b opposite the second surface 11b.

[0017] The substrate 10a and the substrate 10b may be made of a non-transparent material or a transparent material. Examples of the non-transparent material include silicon nitride or a resin containing a pigment or a reflective filler. Examples of the transparent material include glass or a resin. The substrate 10a and the substrate 10b may be made of the same material or different materials. In the following description, the substrate 10 will be described as including the substrates 10a and 10b. However, the substrate 10 may be made of a single member.

[0018] As shown in FIGS. 2 and 3A, a pair of first wirings 20 is disposed on the first surface 11a. The pair of first wirings 20 includes a first conductor (one of the pair of first wirings) 21 and a second conductor (the other of the pair of first wirings) 22. The first conductor 21 and the second conductor 22 are disposed on the first surface 11a with a gap G1 interposed therebetween. The gap G1 is provided along the Y-axis direction at approximately the center of the X-axis direction on the first surface 11a. The gap G1 separates the pair of first wirings 20 into the first conductor 21 and the second conductor 22. The length of the gap G1 in the X-axis direction is set to be slightly shorter than the distance between the anode electrode and cathode electrode of each of the first light-emitting section 41 and the second light-emitting section 42.

[0019] As shown in FIGS. 2 and 3B, the pair of second wirings 30 is disposed on the second surface 11b. The pair of second wirings 30 includes a third conductor (the other of the pair of second wirings) 33 and a fourth conductor (one of the pair of second wirings) 34. The third conductor 33 and the fourth conductor 34 are disposed on the second surface 11b via a gap G2. The gap G2 is provided along the Y-axis direction at approximately the center of the X-axis direction on the second surface 11b. The gap G2 separates the pair of second wirings 30 into the third conductor 33 and the fourth conductor 34. As with the gap G1, the length of the gap G2 in the X-axis direction is set to be slightly shorter than the distance between the anode electrode and cathode electrode of each of the third light-emitting section 43 and the fourth light-emitting section 44.

[0020] The first conductor 21, the second conductor 22, the third conductor 33, and the fourth conductor 34 may be, for example, a conductive film of copper (Cu), aluminum (Al), or an alloy containing these, or may be an Ag paste, or may be a translucent conductive film of indium tin oxide (ITO), zinc oxide (ZnO), etc. If the first conductor 21, the second conductor 22, the third conductor 33, and the fourth conductor 34 are translucent conductive films, part of the light amount on one side is added to the light amount on the other side, thereby making it possible to improve the overall luminous efficiency of the light emitting device 1.

[0021] 2 and 3A, the first light-emitting element 40a includes a first light-emitting section 41 and a second light-emitting section 42. In this example, the first light-emitting section 41 and the second light-emitting section 42 are separated by a space. The first light-emitting section 41 and the second light-emitting section 42 are arranged on a pair of first wirings 20. The first light-emitting section 41 and the second light-emitting section 42 are arranged so that the line connecting their respective anode electrodes and cathode electrodes is parallel to the X-axis.

[0022] The first light-emitting unit 41 has a first anode electrode A1 and a first cathode electrode K1. The second light-emitting unit 42 has a second anode electrode A2 and a second cathode electrode K2. In FIG. 3A, the first anode electrode A1 and the second anode electrode A2 are represented by a "+" symbol, and the first cathode electrode K1 and the second cathode electrode K2 are represented by a "-" symbol.

[0023] In the first light-emitting unit 41, the first anode electrode A1 is connected to the first conductor 21, and the first cathode electrode K1 is connected to the second conductor 22. In the second light-emitting unit 42, the second anode electrode A2 is connected to the second conductor 22, and the second cathode electrode K2 is connected to the first conductor 21. The first anode electrode A1 and the second cathode electrode K2 are electrically connected to each other via the first conductor 21. The first cathode electrode K1 and the second anode electrode A2 are electrically connected to each other via the second conductor 22. In other words, the first light-emitting unit 41 and the second light-emitting unit 42 are connected in anti-parallel by a pair of first wirings 20.

[0024] In the first light-emitting unit 41, a voltage higher than that applied to the first cathode electrode K1 is applied to the first anode electrode A1, causing a current to flow, and the first light-emitting unit 41 emits light with a brightness corresponding to the current flowing. Similarly, in the second light-emitting unit 42, a voltage higher than that applied to the second anode electrode A2 is applied to the second cathode electrode K2, causing a current to flow, and the second light-emitting unit 42 emits light with a brightness corresponding to the current flowing.

[0025] Therefore, even if a voltage higher than the voltage applied to the second conductor 22 is applied to the first conductor 21, or even if a voltage higher than the voltage applied to the first conductor 21 is applied to the second conductor 22, either the first light-emitting section 41 or the second light-emitting section 42 will emit light.

[0026] 2 and 3B, the second light-emitting element 40b includes a third light-emitting section 43 and a fourth light-emitting section 44. In this example, the third light-emitting section 43 and the fourth light-emitting section 44 are separated by a space. The third light-emitting section 43 and the fourth light-emitting section 44 are disposed on a pair of second wirings 30. The third light-emitting section 43 and the fourth light-emitting section 44 are disposed such that the line connecting their respective anode electrodes and cathode electrodes is parallel to the X-axis.

[0027] The third light-emitting unit 43 has a third anode electrode A3 and a third cathode electrode K3. The fourth light-emitting unit 44 has a fourth anode electrode A4 and a fourth cathode electrode K4. In FIG. 3B, the third anode electrode A3 and the fourth anode electrode A4 are represented by a "+" symbol, and the third cathode electrode K3 and the fourth cathode electrode K4 are represented by a "-" symbol.

[0028] In the third light-emitting unit 43, the third anode electrode A3 is connected to the third conductor 33, and the third cathode electrode K3 is connected to the fourth conductor 34. In the fourth light-emitting unit 44, the fourth anode electrode A4 is connected to the fourth conductor 34, and the fourth cathode electrode K4 is connected to the third conductor 33. The third anode electrode A3 and the fourth cathode electrode K4 are electrically connected to each other via the third conductor 33. The third cathode electrode K3 and the fourth anode electrode A4 are electrically connected to each other via the fourth conductor 34. In other words, the third light-emitting unit 43 and the fourth light-emitting unit 44 are connected in anti-parallel by a pair of second wirings 30.

[0029] The third light-emitting unit 43 and the fourth light-emitting unit 44 have the same configuration as the first light-emitting unit 41 and the second light-emitting unit 42, and operate in the same manner. That is, in the third light-emitting unit 43, a current flows and the unit emits light when a voltage higher than the voltage applied to the third cathode electrode K3 is applied to the third anode electrode A3. The third light-emitting unit 43 emits light with a brightness corresponding to the current flowing through it. In the fourth light-emitting unit 44, a voltage higher than the voltage applied to the fourth anode electrode A4 is applied to the fourth cathode electrode K4, and the unit emits light with a brightness corresponding to the current flowing through it.

[0030] Therefore, even if a voltage higher than the voltage applied to the fourth conductor 34 is applied to the third conductor 33, or even if a voltage higher than the voltage applied to the third conductor 33 is applied to the fourth conductor 34, either the third light-emitting section 43 or the fourth light-emitting section 44 will emit light.

[0031] The first light-emitting section 41, the second light-emitting section 42, the third light-emitting section 43, and the fourth light-emitting section 44 each include, in addition to the above-mentioned anode electrode and cathode electrode, for example, a semiconductor growth substrate and a semiconductor laminate structure. In each of the light-emitting sections 41 to 44, the anode electrode and the cathode electrode are disposed on the surface of the semiconductor laminate structure facing the first base material 10a, and the semiconductor growth substrate is disposed on the surface of the semiconductor laminate structure opposite to the first base material 10a. The semiconductor laminate structure is made of In x Al y Ga 1-x-yThe layer includes N (0≦x, 0≦y, x+y≦1) layers and emits, for example, blue light. Blue light has a peak wavelength in the range of 420 nm to 490 nm, for example, about 467 nm.

[0032] As shown in FIGS. 2, 3A, and 3B, the first connection member 51 is disposed so as to penetrate from the first surface 11a to the second surface 11b of the substrate 10. One end of the first connection member 51 is connected to the first conductor 21 on the first surface 11a side. The other end of the first connection member 51 is connected to the fourth conductor 34 on the second surface 11b side. The second connection member 52 is disposed so as to penetrate from the first surface 11a to the second surface 11b of the substrate 10. One end of the second connection member 52 is connected to the second conductor 22 on the first surface 11a side. The other end of the second connection member 52 is connected to the third conductor 33 on the second surface 11b side.

[0033] The first conductor 21 and the fourth conductor 34 are electrically connected via a first connecting member 51. The second conductor 22 and the third conductor 33 are electrically connected via a second connecting member 52.

[0034] The first connecting member 51 and the second connecting member 52 may be made of, for example, copper (Cu), aluminum (Al), or an alloy containing these, or may be made of Ag paste. The first connecting member 51 and the second connecting member 52 are each disposed to penetrate the base material 10. In this example, the first connecting member 51 and the second connecting member 52 fill all of the through holes provided in the base material 10. However, this example is not limiting, and the first connecting member 51 and the second connecting member 52 may also be disposed in layers along inner walls 51W, 52W that define the through holes that penetrate from the first surface 11a to the second surface 11b.

[0035] The first terminal 61 is disposed on the first connection member 51 and connected to the first connection member 51. The first connection member 51 is connected to the first conductor 21 and the fourth conductor 34. Therefore, the first terminal 61 is electrically connected to the first conductor 21 and the fourth conductor 34 via the first connection member 51. The second terminal 62 is disposed on the second connection member 52 and connected to the second connection member 52. The second connection member 52 is connected to the second conductor 22 and the third conductor 33. Therefore, the second terminal 62 is electrically connected to the second conductor 22 and the third conductor 33 via the second connection member 52.

[0036] In this example, the first terminal 61 and the second terminal 62 are rectangular in the XY plane view. The shapes of the first terminal 61 and the second terminal 62 in the XY plane view are not limited to rectangular and may be circular. As in this example, when the area of ​​the first terminal 61 is larger than the area of ​​the first connection member 51 in the XY plane view, the first terminal 61 is also connected to the first conductor 21. Therefore, from the viewpoint of more efficiently supplying current from the external power supply to the first connection member 51, it is preferable that the area of ​​the first terminal 61 is larger than the area of ​​the first connection member 51 in the XY plane view. Similarly, it is preferable that the dimensions of the shape of the second terminal 62 are larger than the dimensions of the shape of the second connection member 52 in the XY plane view.

[0037] In this example, the surface of the first terminal 61 parallel to the XY plane is arranged to be flush with the light extraction surface S1, and the surface of the second terminal 62 parallel to the XY plane is arranged to be flush with the light extraction surface S2.

[0038] One node of the anti-parallel circuit of the first light-emitting unit 41 and the second light-emitting unit 42 is electrically connected to one node of the anti-parallel circuit of the third light-emitting unit 43 and the fourth light-emitting unit 44 via the first conductor 21, the first connecting member 51, and the fourth conductor 34. The other node of the anti-parallel circuit of the first light-emitting unit 41 and the second light-emitting unit 42 is electrically connected to the other node of the anti-parallel circuit of the third light-emitting unit 43 and the fourth light-emitting unit 44 via the second conductor 22, the second connecting member 52, and the third conductor 33.

[0039] The voltage difference between the first terminal 61 and the second terminal 62, regardless of its positive or negative polarity, causes a current to flow through any one of the light-emitting units in the anti-parallel circuit on the first surface 11a, causing them to emit light, and causes a current to flow through any one of the light-emitting units in the anti-parallel circuit on the second surface 11b, causing them to emit light. The first light-emitting unit 41 and the second light-emitting unit 42 are arranged opposite the third light-emitting unit 43 and the fourth light-emitting unit 44 across the base material 10, and therefore emit light from both the first surface 11a and the second surface 11b of the base material 10.

[0040] The first terminal 61 is disposed on the first connection member 51 on the first surface 11a side, and the second terminal 62 is disposed on the second connection member 52 on the second surface 11b side. Therefore, by connecting the positive and negative electrodes of an external power source for causing the light emitting device to emit light to the first terminal disposed on the first surface 11a side and the second terminal disposed on the second surface side, electrical connection between the two electrodes can be achieved.

[0041] As shown in FIGS. 1 and 2 , the first light-transmissive member 71 covers the first light-emitting portion 41 and the second light-emitting portion 42. In this example, the first light-transmissive member 71 further covers the first conductor 21 and the second conductor 22, and is also disposed within the gap G1. The first light-transmissive member 71 covers a portion of the side surface of the first terminal 61. The second light-transmissive member 72 is disposed so as to cover the third light-emitting portion 43 and the fourth light-emitting portion 44. In this example, the second light-transmissive member 72 further covers the third conductor 33 and the fourth conductor 34, and is also disposed within the gap G2. The second light-transmissive member 72 is disposed so as to cover a portion of the side surface of the second terminal 62.

[0042] The first light-transmissive member 71 and the second light-transmissive member 72 are arranged to insulate the first conductor 21, the second conductor 22, the third conductor 33, the fourth conductor 34, the first light-emitting section 41, the second light-emitting section 42, the third light-emitting section 43, and the fourth light-emitting section 44 from the external environment and protect the light-emitting device 1 from the intrusion of dust, moisture, and the like. The first light-transmissive member 71 and the second light-transmissive member 72 are made of, for example, resin. The first light-transmissive member 71 and the second light-transmissive member 72 may or may not include a wavelength conversion material such as a phosphor. The phosphor may be, for example, a fluoride-based phosphor such as a KSF-based phosphor, a KSAF-based phosphor, or an MGF-based phosphor, a nitride phosphor, a quantum dot phosphor, a YAG phosphor, a β-sialon phosphor, or the like.

[0043] The surface of the first light-transmissive member 71 parallel to the XY plane may be in the same plane as the surface of the first terminal 61 parallel to the XY plane, or may be in a different plane. The surface of the second light-transmissive member 72 parallel to the XY plane may be in the same plane as the surface of the second terminal 62 parallel to the XY plane, or may be in a different plane.

[0044] The arrangement of the first light-emitting section 41, the second light-emitting section 42, the third light-emitting section 43 and the fourth light-emitting section 44 will be described. FIG. 4A is a schematic cross-sectional view taken along line IVA-IVA in FIG. 3A. FIG. 4B is a schematic cross-sectional view taken along line IVB-IVB in FIG. 3A. FIG. 4C is a schematic cross-sectional view taken along the line IVC-IVC in FIG. 3A. As shown in FIGS. 4A and 4B , the first light-emitting section 41 has a light-extraction surface 41S located opposite the surface on which the electrodes are disposed. The second light-emitting section 42 has a light-extraction surface 42S located opposite the surface on which the electrodes are disposed. The third light-emitting section 43 has a light-extraction surface 43S located opposite the surface on which the electrodes are disposed. The fourth light-emitting section 44 has a light-extraction surface 44S located opposite the surface on which the electrodes are disposed. Note that light extracted from the first light-emitting section 41 to the outside is not limited to being extracted from the light-extraction surface 41S, but can also be extracted from a side surface of the first light-emitting section 41 located between the surface on which the electrodes are disposed and the light-extraction surface. The same applies to the second light-emitting section 42, the third light-emitting section 43, and the fourth light-emitting section, and therefore further description will be omitted.

[0045] In the light-emitting device 1 of this embodiment, the first light-emitting section 41 and the second light-emitting section 42 are disposed opposite the third light-emitting section 43 and the fourth light-emitting section 44, with the base material 10 interposed therebetween. The first light-emitting section 41 and the second light-emitting section 42 are disposed so that their light-extraction surfaces 41S and 42S face the positive direction of the Z axis. The third light-emitting section 43 and the fourth light-emitting section 44 are disposed so that their light-extraction surfaces 43S and 44S face the negative direction of the Z axis. Light emitted from the light-extraction surfaces 41S and 42S of the first light-emitting section 41 and the second light-emitting section 42 is emitted from the light-extraction surface S1 on the first surface 11a side defined by the first light-transmissive member 71. Light emitted from the light-extraction surfaces 43S and 44S of the third light-emitting section 43 and the fourth light-emitting section 44 is emitted from the light-extraction surface S2 on the second surface 11b side defined by the second light-transmissive member 72. As described above, the light emitted from the light emitting portion is also emitted from the side surfaces of the first light-transmissive member 71 and the second light-transmissive member 72.

[0046] As already explained, on the first surface 11a side, the first light-emitting portion 41 and the second light-emitting portion 42 are connected in anti-parallel, and on the second surface 11b side, the third light-emitting portion 43 and the fourth light-emitting portion 44 are connected in anti-parallel. As shown in FIGS. 4A to 4C , the anti-parallel circuit on the first surface 11a side is connected in parallel to the anti-parallel circuit on the second surface 11b side by the first connecting member 51 and the second connecting member 52. Therefore, by applying a voltage to the first terminal 61 that is higher than the voltage applied to the second terminal 62, the first light-emitting portion 41 on the first surface 11a side emits light, and on the second surface 11b side, a current flows through the fourth light-emitting portion 44, causing the fourth light-emitting portion 44 to emit light.

[0047] In this example, the first light-emitting unit 41 and the third light-emitting unit 43 are arranged so that the outer periphery of the first light-emitting unit 41 roughly overlaps the outer periphery of the third light-emitting unit 43 in an XY plane view. The second light-emitting unit 42 and the fourth light-emitting unit 44 are arranged so that the outer periphery of the second light-emitting unit 42 roughly overlaps the outer periphery of the fourth light-emitting unit 44 in an XY plane view. In this example, one of the light-emitting units whose outer peripheries overlap in an XY plane view emits light, and the other does not emit light.

[0048] The light-emitting section emits light when a current flows through it, and therefore generates heat according to the magnitude of the current. The heat generated by the light-emitting section is dissipated via the first conductor 21 and the second conductor 22. In the case of the light-emitting device 1 shown in FIGS. 4A to 4C, the heat-generating locations on the first surface 11a side of the first conductor 21 and the second conductor 22 are different from the heat-generating locations on the second surface 11b side, and as a result, the heat-generating locations are dispersed, and the heat generated by the light-emitting section is dissipated more efficiently.

[0049] (Variation 1) 5A and 5B are schematic cross-sectional views illustrating a part of a light emitting device according to Modification 1 of this embodiment. 5A and 5B, in light-emitting device 101, first light-emitting section 41 is disposed at a position facing fourth light-emitting section 44 across base material 10, and second light-emitting section 42 is disposed at a position facing third light-emitting section 43 across base material 10. In other words, in Modification 1, the arrangement of third light-emitting section 43 and fourth light-emitting section 44 differs from the example described with reference to FIGS. 4A to 4C.

[0050] FIG. 5A is a schematic cross-sectional view taken along line IVA-IVA in FIG. 3A when the third light-emitting section 43 and the fourth light-emitting section 44 are arranged as described above. FIG. 5B is a schematic cross-sectional view taken along line IVB-IVB in FIG. 3A when the third light-emitting section 43 and the fourth light-emitting section 44 are arranged as described above.

[0051] In Modification 1, the arrangement of the light-emitting units 43 and 44 is different from that described with reference to FIGS. 4A to 4C. However, the electrical connections of the first light-emitting unit 41 to the fourth light-emitting unit 44 are the same as those described with reference to FIGS. 4A to 4C. By applying a voltage to the first terminal 61 that is higher than the voltage applied to the second terminal 62, the first light-emitting unit 41 emits light on the first surface 11a side, and the fourth light-emitting unit 44 emits light on the second surface 11b side. By applying a voltage to the second terminal 62 that is higher than the voltage applied to the first terminal 61, a current flows through the second light-emitting unit 42 on the first surface 11a side, causing the second light-emitting unit 42 to emit light, and a current flows through the third light-emitting unit 43 on the second surface 11b side, causing the third light-emitting unit 43 to emit light.

[0052] In the light emitting device 101 of Modification 1, overlapping light emitting portions emit light in the XY plane view, and therefore the light emitting device 101 appears to emit light from a single point in the XY plane view. Therefore, a portion of the light amount for the other surface is added to the amount of light emitted from the light extraction surface S1 on the first surface 11a side and the light extraction surface S2 on the second surface 11b side, and the light emitting efficiency of the light emitting device 101 can be improved.

[0053] 4A to 5B, the light-emitting unit on the first surface 11a is arranged opposite the light-emitting unit on the second surface 11b in the XY plane view. However, the light-emitting unit on the first surface 11a does not necessarily have to be arranged opposite the light-emitting unit on the second surface 11b. Also, the two light-emitting units on the first surface 11a and the two light-emitting units on the second surface 11b do not have to be arranged parallel to each other. Furthermore, the directions in which the two light-emitting units on the first surface 11a are arranged may differ from the directions in which the two light-emitting units on the second surface 11b are arranged.

[0054] (Variation 2) FIG. 6A is a schematic plan view illustrating a part of a light emitting device according to Modification 2 of the present embodiment. FIG. 6B is a schematic right side view illustrating a part of the light emitting device according to Modification 2 of the present embodiment. In the second modification, the light emitting element 120 has a configuration in which the first light emitting section 41 and the second light emitting section 42 are connected via the substrate 121.

[0055] As shown in FIGS. 6A and 6B, the light-emitting element 120 includes a first light-emitting section 41, a second light-emitting section 42, and a substrate 121. The first light-emitting section 41 includes a light-extraction surface 41S, a first anode electrode A1, and a first cathode electrode K1. The first anode electrode A1 and the first cathode electrode K1 are arranged on the surface opposite the light-extraction surface 41S. The second light-emitting section 42 includes a light-extraction surface 42S, a second anode electrode A2, and a second cathode electrode K2. The second anode electrode A2 and the second cathode electrode K2 are arranged on the surface opposite the light-extraction surface 42S.

[0056] The substrate 121 has a light extraction surface 121S and a light-emitting unit mounting surface 121R. The light-emitting unit mounting surface 121R is the surface located opposite the light extraction surface 121S. The first light-emitting unit 41 and the second light-emitting unit 42 are disposed on the light-emitting unit mounting surface 121R of the substrate 121. The substrate 121 is made of, for example, silicon (Si), sapphire, or glass. The substrate 121 is translucent so that light can be extracted from the light extraction surface 121S.

[0057] The first light-emitting unit 41 and the second light-emitting unit 42 are arranged in parallel. As shown in FIG. 3A etc., the first light-emitting unit 41 and the second light-emitting unit 42 are arranged so that the electrodes are electrically connected via the first conductor 21 and the second conductor 22. The first light-emitting unit 41 is arranged on the light-emitting unit installation surface 121R so that the light extraction surface 41S faces the light-emitting unit installation surface 121R. The second light-emitting unit 42 is arranged on the light-emitting unit installation surface 121R so that the light extraction surface 42S faces the light-emitting unit installation surface 121R.

[0058] By using the light emitting element 120 in which two light emitting portions are connected, the manufacturing process of the light emitting device 1 is shortened and simplified.

[0059] 6A and 6B, the first light-emitting section 41 and the second light-emitting section 42 are connected via a first substrate 121. However, the present invention is not limited to this, and the light-emitting element may be formed by stacking a semiconductor laminate structure on a semiconductor growth substrate and dividing the semiconductor laminate structure without dividing the growth substrate. In this configuration, two semiconductor laminate structures are provided on the growth substrate, and light can be emitted from each of the two semiconductor laminate structures. (Variation 3) FIG. 6C is a schematic plan view illustrating a part of the light emitting device according to Modification 3 of the present embodiment. FIG. 6D is a schematic right side view illustrating a part of the light emitting device according to Modification 3 of the present embodiment. Modification 3 is similar to Modification 2 in that the light emitting element 120a has a configuration in which the first light-emitting section 41 and the second light-emitting section 42 are connected via the substrate 122. Modification 3 differs from Modification 2 in the location where the substrate 122 and the light-emitting section are connected. That is, in Modification 2, the light extraction surface 41S of the first light-emitting section 41 and the light extraction surface 42S of the second light-emitting section 42 are connected to the substrate 121. In contrast, in Modification 3, a surface orthogonal to the light extraction surface of the first light-emitting section 41 and a surface orthogonal to the light extraction surface 42S of the second light-emitting section 42 are connected to the substrate 122. The same applies to the third light-emitting section 43 and the fourth light-emitting section 44.

[0060] 6C and 6D, the light-emitting element 120a includes a first light-emitting section 41, a second light-emitting section 42, and a substrate 122. The substrate 122 is disposed between the first light-emitting section 41 and the second light-emitting section 42. The substrate 122 is disposed to connect the first light-emitting section 41 to the second light-emitting section 42 to form a single light-emitting element 120a. The substrate 122 may be made of the same material as the substrate 121, or may be made of an adhesive that connects the light-emitting sections together.

[0061] According to the third modification, the manufacturing process of the light emitting device 1 is simplified, and since the substrate 121 in the second modification is not present, the light emitting device 1 can be made thinner.

[0062] The operation of the light emitting device 1 of this embodiment will be described. FIG. 7A is a schematic exploded perspective view for explaining the operation of the light emitting device according to this embodiment. FIG. 7B is a schematic plan view for explaining the operation of the light emitting device according to this embodiment. 7C is a schematic cross-sectional view for explaining the operation of the light emitting device according to this embodiment, taken along line VIIC-VIIC in FIG. 2. FIG. 7A to 7C schematically show the operation when a power supply I0 is connected to a first terminal 61 and a second terminal 62. In this example, one output of the power supply I0 is connected to the terminal 61, and the other output is connected to the terminal 62. The power supply I0 is connected so that a voltage higher than the voltage applied to the second terminal 62 is applied to the first terminal 61, causing a current to flow into the first terminal 61 and a current to flow out from the second terminal 62.

[0063] 7A, the light emitting device 1 allows the current flowing in from the first terminal 61 to flow out from the second terminal 62. More specifically, the current supplied to the light emitting device 1 flows through the following path.

[0064] As shown by the arrows in FIG. 7B, current flowing in from the first terminal 61 flows through the first conductor 21 and reaches the first anode electrode A1 of the first light-emitting unit 41. The current flows into the first anode electrode A1 and flows out from the first cathode electrode K1. The current flowing out from the first cathode electrode K1 flows through the second conductor 22 and reaches the second terminal 62 via the second connecting member 52 and the third conductor 33. In this way, on the first surface 11a side of the substrate 10 shown in FIG. 7A, current flows through the first light-emitting unit 41, causing the first light-emitting unit 41 to emit light.

[0065] As shown by the arrows in FIG. 7C, the current flowing in from the first terminal 61 is branched to the first connecting member 51, flows through the fourth conductor 34, and reaches the fourth anode electrode A4 of the fourth light-emitting unit 44. The current flows into the fourth anode electrode A4 and flows out from the fourth cathode electrode K4. The current flowing out from the fourth cathode electrode flows through the third conductor 33 and flows out from the second terminal 62. In this way, on the second surface 11b side of the substrate 10 shown in FIG. 7A, a current flows through the fourth light-emitting unit 44, causing the fourth light-emitting unit 44 to emit light.

[0066] Although not shown, the operation when a power supply is connected so that a voltage higher than the voltage applied to the first terminal 61 is applied to the second terminal 62, causing current to flow into the second terminal 62 and flow out from the first terminal 61 will be described in a similar manner. That is, on the first surface 11a side, the current flowing in from the second terminal 62 reaches the second anode electrode A2 of the second light-emitting unit 42 via the second connecting member 52 and the second conductor 22. The current flows into the second anode electrode A2 and flows out from the second cathode electrode K2. The flowing out current reaches the first terminal 61 via the first conductor. In this way, on the first surface 11a side of the substrate 10, current flows through the second light-emitting unit 42, causing the second light-emitting unit 42 to emit light.

[0067] On the second surface 11b of the substrate 10, the current flowing in from the second terminal 62 reaches the third anode electrode A3 of the third light-emitting unit 43 via the third conductor 33. The current flowing into the third anode electrode A3 flows out from the third cathode electrode K3 and reaches the first terminal 61 via the fourth conductor 34, the first connecting member 51, and the first conductor 21. In this way, on the second surface 11b side of the substrate 10, the current flows through the third light-emitting unit 43, causing the third light-emitting unit 43 to emit light.

[0068] A method for manufacturing the light emitting device 1 of this embodiment will be described. 8A to 10C are schematic perspective views illustrating a method for manufacturing the light emitting device 1 according to this embodiment. 8A to 10A are diagrams illustrating the steps for each substrate. Elements related to the first substrate 10a are indicated by reference numerals, and elements related to the second substrate 10b are indicated in parentheses. Elements that do not require any particular distinction are indicated by the same reference numerals in the first substrate 10a and the second substrate 10b. As shown in FIG. 8A, a first substrate 10a and a second substrate 10b are prepared. The first substrate 10a has a first surface 11a. Two through holes 1012a and 1012b are provided in the first substrate 10a, penetrating from the first surface 11a to the surface located on the opposite side. The through holes 1012a and 1012b are circular in XY plane view. The through holes 1012a and 1012b are not limited to being circular in XY plane view, but may also be rectangular. The second substrate 10b has a second surface 11b. The second substrate 10b has two through holes 1012a and 1012b, penetrating from the second surface 11b to the surface located on the opposite side.

[0069] In this example, the first substrate 10a and the second substrate 10b have the same shape and dimensions and are made of the same material. In the manufacturing method of this example, conductors are formed on the two substrates 10a and 10b having the same shape, etc., in the same process, and light-emitting units are placed and connected.

[0070] As shown in FIG. 8B, a conductive seed layer 1020 is formed on the first surface 11a. A conductive seed layer 1030 is formed on the second surface 11b. The seed layers 1020 and 1030 are formed on the entire surfaces of the first surface 11a and the second surface 11b, respectively, by sputtering or the like. The seed layers 1020 and 1030 may be a single metal layer made of copper (Cu) or titanium (Ti), or may be formed by stacking multiple metal layers. In this process, through holes 1012c and 1012d are formed in the seed layers 1020 and 1030. The shapes of the through holes 1012c and 1012d in the XY plane are substantially the same as the shapes of the two through holes 1012a and 1012b shown in FIG. 8A in the XY plane.

[0071] 8C, a resist layer 1002 is formed on the seed layer 1020. A resist layer 1002 is also formed on the seed layer 1030. The resist layer 1002 is applied onto the seed layers 1020 and 1030 by, for example, a spin coater.

[0072] As shown in FIG. 9A, the resist layer 1002 of the first substrate 10a is exposed to light to form a resist pattern (resist) 1003. Similarly, the resist layer 1002 of the second substrate 10b is exposed to light to form a resist pattern 1003. The resist pattern 1003 is formed linearly along the Y-axis direction at approximately the center in the X-axis direction on the seed layers 1020 and 1030. In areas where the resist layer 1002 has been removed, leaving the resist pattern 1003, the seed layers 1020 and 1030 are exposed. The length WG of the resist pattern 1003 in the X-axis direction is approximately equal to the separation distance between the first conductor 21 and the second conductor 22. The same is true for the second surface 11b, where the length WG is approximately equal to the separation distance between the third conductor 33 and the fourth conductor 34.

[0073] The first light-emitting unit 41 and the second light-emitting unit 42 are each placed on a resist pattern 1003. The first light-emitting unit 41 is arranged so that a line connecting the first anode electrode A1 and the first cathode electrode K1 is parallel to the X-axis. In this case, the first anode electrode A1 is arranged so that it is located in the positive direction of the X-axis relative to the first cathode electrode K1. The first light-emitting unit 41 is arranged so that the resist pattern 1003 is located between the first anode electrode A1 and the first cathode electrode K1. The second light-emitting unit 42 is arranged so that the second anode electrode A2 and the second cathode electrode K2 are parallel to the X-axis. The second cathode electrode K2 is arranged so that it is located in the positive direction of the X-axis relative to the second anode electrode A2. The second light-emitting unit 42 is arranged so that the resist pattern 1003 is located between the second cathode electrode K2 and the second anode electrode A2.

[0074] Similarly, for the second base material 10b, the third light-emitting unit 43 and the fourth light-emitting unit 44 are each placed on the resist pattern 1003. The third light-emitting unit 43 is arranged so that the line connecting the third anode electrode A3 and the third cathode electrode K3 is parallel to the X-axis. In this case, the third anode electrode A1 is arranged so that it is located in the positive direction of the X-axis relative to the third cathode electrode K1. The third light-emitting unit 43 is arranged so that the resist pattern 1003 is located between the third anode electrode A3 and the third cathode electrode K3. The fourth light-emitting unit 44 is arranged so that the fourth anode electrode A4 and the fourth cathode electrode K4 are parallel to the X-axis. In this case, the fourth cathode electrode K4 is arranged so that it is located in the positive direction of the X-axis relative to the fourth anode electrode A4. The fourth light-emitting unit 44 is arranged so that the resist pattern 1003 is located between the fourth cathode electrode K4 and the fourth anode electrode A4.

[0075] When the first light-emitting section 41, the second light-emitting section 42, the third light-emitting section 43, and the fourth light-emitting section 44 are placed on the resist pattern 1003, they are adhered to the resist pattern 1003 by, for example, an adhesive. Alternatively, the first light-emitting section 41, the second light-emitting section 42, the third light-emitting section 43, and the fourth light-emitting section 44 may be placed directly on the resist pattern 1003 using an adhesive resist.

[0076] As shown in FIG. 9B, on the first surface 11a, plating layers 1021a and 1022a are formed using the seed layer 1020 shown in FIG. 9A as a seed. The plating layers 1021a and 1022a are formed by being divided along the Y-axis direction at approximately the center in the X-axis direction by the resist pattern 1003. By forming the plating layer 1021a, the first anode electrode A1 and the second cathode electrode are plated and bonded to the plating layer 1021a. By forming the plating layer 1022a, the first cathode electrode K1 and the second anode electrode A2 are plated and bonded to the plating layer 1022a. On the second surface 11b, plating layers 1033a and 1034a are formed using the seed layer 1030 shown in FIG. 9A as a seed. The plating layers 1033a and 1034a are formed by being divided along the Y-axis direction at approximately the center in the X-axis direction by the resist pattern 1003. By forming the plating layer 1033a, the third anode electrode A3 and the fourth cathode electrode K4 are plated and bonded to the plating layer 1033a. By forming the plating layer 1034a, the third cathode electrode K3 and the fourth anode electrode A4 are plated and bonded to the plating layer 1034a.

[0077] On the first surface 11a, through-holes 12a are formed that penetrate the plating layer 1021a, the seed layer 1020, and the base material 10a, and through-holes 12b are formed that penetrate the plating layer 1022a, the seed layer, and the base material 10a. On the second surface 11b, through-holes 12a are formed that penetrate the plating layer 1033a, the seed layer 1030, and the base material 10b, and through-holes 12b are formed that penetrate the plating layer 1034a, the seed layer 1030, and the base material 10b.

[0078] As shown in FIG. 9C , the resist pattern 1003 is removed, and the seed layer 1020 is exposed from the resist pattern 1003. A well-known technique is used to remove the resist pattern 1003. For example, the resist pattern 1003 formed on the first substrate 10a is immersed in a mixed solution containing sulfuric acid, an organic solvent, or the like, together with the plating layer 1020a, the first light-emitting portion 41, and the second light-emitting portion 42, to be peeled off. The same applies to the removal of the resist pattern 1003 formed on the second substrate 10b.

[0079] As shown in FIG. 9D , the seed layer 1020 (exposed portion of the seed layer 1020) exposed by removing the resist pattern 1003 shown in FIG. 9A is removed by, for example, etching. Removal of the seed layer 1020 forms a gap G1, resulting in seed layers 1021 and 1022 separated by the gap G1. The seed layer 1021 and the plating layer 1021a may be collectively referred to as the “first conductor 21.” The seed layer 1022 and the plating layer 1022a may be collectively referred to as the “second conductor 22.” Similarly, the seed layer 1030 exposed on the second surface 11b side is also removed by, for example, etching, resulting in a gap G2. Removal of the seed layer 1030 forms a gap G2, resulting in seed layers 1033 and 1034 separated by the gap G2. The seed layer 1033 and the plating layer 1033a may be collectively referred to as the “third conductor 33.” The seed layer 1034 and the plating layer 1034a may be collectively referred to as the "fourth conductor 34." As a result, a pair of first wirings 20 including the first conductor 21 and the second conductor 22 is formed, and a pair of second wirings 30 including the third conductor 33 and the fourth conductor 34 is formed.

[0080] In order to avoid complication of notation, in FIGS. 10A to 10C, the plating layers and seed layers are omitted from the illustration, and the conductors are represented as first conductors 21 to fourth conductors 34. 10A, the first light-transmissive member 71 is formed to cover the first conductor 21, the second conductor 22, the first light-emitting portion 41, and the second light-emitting portion 42. At this time, the first light-transmissive member 71 is formed so as not to cover the through-hole 12a and its surroundings. Similarly, on the second surface 11b, the second light-transmissive member 72 is formed so as to cover the third conductor 33, the fourth conductor 34, the third light-emitting portion 43, and the fourth light-emitting portion 44. At this time, the second light-transmissive member 72 is prevented from covering the through-hole 12b and its surroundings by forming a resist mask or the like. In this example, the first light-transmissive member 71 is provided in the gap G1, and the second light-transmissive member 72 is provided in the gap G2.

[0081] In the manner described above, an intermediate member A is formed, which includes the first base material 10a, the pair of first wirings 20, the first light-emitting section 41, the second light-emitting section 42, and the first light-transmissive member 71. Similarly, an intermediate member B is formed, which includes the second base material 10b, the pair of second wirings 30, the third light-emitting section 43, the fourth light-emitting section 44, and the second light-transmissive member 72.

[0082] As shown in FIG. 10B , intermediate members A and B are bonded to each other. When bonding intermediate members A and B together, the surface of first substrate 10a opposite the first surface 11a is positioned opposite the surface of second substrate 10b opposite the second surface 11b, and these surfaces are bonded together. At this time, first through hole 12c is formed by aligning the position of through hole 12a of intermediate member A with the position of through hole 12b of intermediate member B. Furthermore, second through hole 12d is formed by aligning the position of through hole 12b of intermediate member A with the position of through hole 12a of intermediate member B. First through hole 12c and second through hole 12d penetrate from the first surface 11a to the second surface 11b. In this way, by separately producing intermediate members A and B and bonding them together, the manufacturing process can be simplified.

[0083] The first connection member 51 is formed by filling the first through hole 12c with a conductive material. The second connection member 52 is formed by filling the second through hole 12d with a conductive material (see FIGS. 10B and 10C). The first connection member 51 and the second connection member 52 are not limited to being formed by filling a conductive material, but may also be formed by forming a layer of conductive material along the inner walls that define the first through hole 12c and the second through hole 12d using a plating technique or the like.

[0084] 10C , the first terminal 61 is formed on the intermediate member A side so as to be connected to the end of the first connecting member 51. The second terminal 62 is formed on the intermediate member B side so as to be connected to the end of the second connecting member 52. The first connecting member 51 and the first terminal 61 do not have to be formed separately as described above, but may also be formed simultaneously. The second connecting member and the second terminal 62 do not have to be formed separately, but may also be formed simultaneously.

[0085] The above-described manufacturing method uses the first base material 10a and the second base material 10b with through holes formed therein. However, the present invention is not limited to this. For example, first base materials 10a and 10b without through holes may be prepared, and intermediate members each having a pair of wirings, a light-emitting portion, and a translucent member may be formed thereon, and the through holes may be formed after forming these intermediate members, or may be formed after bonding the intermediate members together.

[0086] In the above-described manufacturing method, substantially identical intermediate members A and B are formed and then bonded together to form the light emitting device 1. However, this is not limiting, and each of the components may be formed on the first surface and the second surface of a single base material.

[0087] The effects of the light emitting device 1 of this embodiment will be described. The light emitting device 1 of this embodiment has a pair of first wirings 20 on the first surface 11a of the base material 10, and a first light emitting portion 41 and a second light emitting portion 42 on the pair of first wirings 20. The first light emitting portion 41 and the second light emitting portion 42 are connected in anti-parallel via a first conductor 21 and a second conductor 22. The light emitting device 1 also has a pair of second wirings 30 on the second surface 11b of the base material 10, and a third light emitting portion 43 and a fourth light emitting portion 44 on the pair of second wirings 30. The pair of first wirings 20 includes the first conductor 21 and the second conductor 22, and the pair of second wirings 30 includes the third conductor 33 and the fourth conductor 34. The third light emitting portion 43 and the fourth light emitting portion 44 are connected in anti-parallel via the third conductor 33 and the fourth conductor 34.

[0088] As described above, in the light emitting device 1 of the present embodiment, light emitting units connected in anti-parallel are arranged on each of the first surface 11a and the second surface 11b of the base material 10. The two sets of anti-parallel connected circuits are connected in parallel by the first connecting member 51 and the second connecting member 52. Therefore, regardless of the positive or negative polarity of the voltage applied to the first terminal 61 and the second terminal 62, one of the anti-parallel connected light emitting units arranged on each of the first surface 11a and the second surface 11b emits light, and the light emitting units emit light on both surfaces of the base material 10.

[0089] In the light emitting device 1 of this embodiment, the first connecting member 51 and the second connecting member 52 are formed to penetrate the base material 10. This reduces the area required for connecting the two anti-parallel connected light emitting circuits arranged on both sides of the base material 10, thereby achieving further miniaturization.

[0090] In the light emitting device 1 of this embodiment, the first terminal 61 and the second terminal 62 are located on opposite surfaces. In this case, by sandwiching the light emitting device 1 between light-transmitting plates having a light-transmitting conductive film, which will be described later in relation to Figures 22A and 22B, electrical connection can be made without distinguishing polarity.

[0091] (Second embodiment) FIG. 11 is a schematic perspective view illustrating the light emitting device according to this embodiment. FIG. 12 is a schematic front view illustrating the light emitting device according to this embodiment. FIG. 13 is a schematic side view illustrating the light emitting device according to this embodiment. FIG. 14A is a schematic plan view illustrating the light emitting device according to this embodiment. FIG. 14B is a schematic bottom view illustrating the light emitting device according to this embodiment. 11 to 14B, a light emitting device 201 of this embodiment includes a base 210, a pair of first wirings 220, a first light emitting element 40a, a pair of second wirings 230, a second light emitting element 40b, a first connecting member 251, a second connecting member 252, first terminals 261-1 and 261-2, and second terminals 262-1 and 262-2. The light emitting device 201 further includes a first light-transmissive member 271 and a second light-transmissive member 272.

[0092] As with the first embodiment, the present embodiment may be described using three-dimensional coordinates. The substrate 210 has a first surface 211a and a second surface 211b. The second surface 211b is located opposite the first surface 211a. The first surface 211a is parallel to the XY plane. The X axis is parallel to a line connecting the first anode electrode A1 and the first cathode electrode K1 of the first light-emitting unit 41. In the present embodiment, as described with reference to FIGS. 12 and 13, the substrate 210 has a first recess 210a on the first surface 211a side and a second recess 210b on the second surface 211b side. As described with reference to FIGS. 15A and 15B, the first recess 210a and the second recess 210b are each defined by multiple surfaces. In this case, it is assumed that the top surfaces 212a and 216a and the bottom surface 214a of the first surface 211a are arranged parallel to the XY plane.

[0093] The Z axis is perpendicular to the XY plane, and the direction from the second surface 211b to the first surface 211a is the positive direction. The positive direction of the Z axis is sometimes referred to as "up" or "upward," and the negative direction of the Z axis is sometimes referred to as "down" or "downward." However, as in the other embodiments described above, the direction along the Z axis is not necessarily the direction in which gravity is applied.

[0094] 11 and 13, in the light emitting device 201, a first light-transmissive member 271 is disposed on the first surface 211a side of the base material 210. The surface of the first light-transmissive member 271 opposite to the surface facing the first surface 211a is the light extraction surface S201. In addition, in the light emitting device 201, a second light-transmissive member 272 is disposed on the second surface 211b side of the base material 210. The surface of the second light-transmissive member 272 opposite to the surface facing the second surface 211b is the light extraction surface S202. Therefore, the light emitting device 201 is a double-sided light emitting device having the light extraction surface S201 and the light extraction surface S202 opposite to the light extraction surface S201.

[0095] In the light emitting device 201 of this embodiment, a first connecting member 251 and a second connecting member 252 are also arranged on the two side surfaces located between the light extraction surfaces S201 and S202, and can function as two terminals similar to the first terminals 261-1 and 261-2 and the second terminals 262-1 and 262-2.

[0096] 12 and 13, in a light emitting device 201, a base material 210 has a first recess 210a on a first surface 211a side and a second recess 210b on a second surface 211b side. A first light-transmissive member 271 covers the first recess 210a, and a second light-transmissive member 272 covers the second recess 210b.

[0097] The base material 210 may be made of a non-transparent material or a transparent material. The base material 210 may be made of the material described in the first embodiment. The first translucent member 271 and the second translucent member 272 may be made of the material described in the first embodiment.

[0098] As shown in FIGS. 12 and 14A, the pair of first wirings 220 is disposed on the first surface 211a. The pair of first wirings 220 includes a first conductor 221 and a second conductor 222. The first conductor 221 and the second conductor 222 are provided on the first surface 211a with a gap G201 interposed therebetween. The gap G201 is provided along the Y axis at approximately the center in the X axis direction on the first surface 211a. The gap G201 separates the pair of first wirings 220 into the first conductor 221 and the second conductor 222. The length of the gap G201 in the X axis direction is set to be slightly shorter than the distance between the anode electrode and cathode electrode of each of the first light-emitting section 41 and the second light-emitting section 42.

[0099] As shown in FIGS. 12 and 14B, the pair of second wirings 230 is disposed on the second surface 211b. The pair of second wirings 230 includes a third conductor 233 and a fourth conductor 234. The third conductor 233 and the fourth conductor 234 are disposed on the second surface 211b with a gap G202 interposed between them. The gap G202 is provided along the Y axis at approximately the center of the X axis direction on the second surface 211b. The gap G202 separates the pair of second wirings 230 into the third conductor 233 and the fourth conductor 234. The length of the gap G202 in the X axis direction is set according to the distance between the anode electrode and cathode electrode of each of the third light-emitting section 43 and the fourth light-emitting section 44.

[0100] The first conductor 221, the second conductor 222, the third conductor 233 and the fourth conductor 234 can be made of the same conductive material as in the first embodiment.

[0101] 14A, in the first light-emitting unit 41, the first anode electrode A1 is connected to the first conductor 221, and the first cathode electrode K1 is connected to the second conductor 222. In the second light-emitting unit 42, the second anode electrode A2 is connected to the second conductor 222, and the second cathode electrode K2 is connected to the first conductor 221. The first anode electrode A1 and the second cathode electrode K2 are electrically connected to each other via the first conductor 221. The first cathode electrode K1 and the second anode electrode A2 are electrically connected to each other via the second conductor 222. The first light-emitting unit 41 and the second light-emitting unit 42 are connected in anti-parallel by a pair of first wirings 220.

[0102] As shown in FIG. 14B , in the third light-emitting unit 43, the third anode electrode A3 is connected to the third conductor 233, and the third cathode electrode K3 is connected to the third conductor 233. In the fourth light-emitting unit 44, the fourth anode electrode A4 is connected to the fourth conductor 234, and the fourth cathode electrode K4 is connected to the third conductor 233. The third anode electrode A3 and the fourth cathode electrode K4 are electrically connected to each other via the third conductor 233. The third cathode electrode K3 and the fourth anode electrode A4 are electrically connected to each other via the fourth conductor 234. The third light-emitting unit 43 and the fourth light-emitting unit 44 are connected in anti-parallel by a pair of second wirings 230.

[0103] The first light-emitting section 41, the second light-emitting section 42, the third light-emitting section 43, and the fourth light-emitting section 44 have the same configuration as in the first embodiment described above. The light-emitting elements 120 and 120a described in relation to Figures 6A to 6D may also be used.

[0104] The first light-emitting section 41 and the second light-emitting section 42 are arranged to face the third light-emitting section 43 and the fourth light-emitting section 44 across the base material 210. In this example, the first light-emitting section 41 is arranged to face the third light-emitting section 43 across the base material 210, and the second light-emitting section 42 is arranged to face the fourth light-emitting section 44 across the base material 210. As described in relation to FIGS. 5A and 5B , the first light-emitting section 41 may be arranged to face the fourth light-emitting section 44 across the base material 210, and the second light-emitting section 42 may be arranged to face the third light-emitting section 43 across the base material 210.

[0105] FIG. 15A is a schematic cross-sectional view taken along line XVA-XVA in FIG. 14A. FIG. 15B is a schematic cross-sectional view taken along line XVB-XVB in FIG. 14A. The relationship between the first surface 211a and the first recess 210a will be described. As shown in FIGS. 15A and 15B, the first surface 211a includes a top surface 212a, an inner side surface 213a, a bottom surface 214a, an inner side surface 215a, and a top surface 216a. The first recess 210a is defined by the top surface 212a, the inner side surface 213a, the bottom surface 214a, the inner side surface 215a, and a top surface 216a. The two top surfaces 212a and 216a are planes parallel to the XY plane and are coplanar. In this example, the two top surfaces 212a and 216a are separated in the X-axis direction, and the bottom surface 214a is located between the top surface 212a and the top surface 216a in the XY plane view. The bottom surface 214a is a plane parallel to the XY plane. An inner surface 213a is disposed between the top surface 212a and the bottom surface 214a, and the inner surface 213a is provided continuously from the top surface 212a to the bottom surface 214a. An inner surface 215a is disposed between the top surface 216a and the bottom surface 214a, and the inner surface 215a is provided continuously from the top surface 216a to the bottom surface 214a.

[0106] The relationship between the second surface 211b and the second recess 210b will be described. The second surface 211b includes a top surface 212b, an inner side surface 213b, a bottom surface 214b, an inner side surface 215b, and a top surface 216b. The second recess 210b is defined by a top surface 212b, an inner side surface 213b, a bottom surface 214b, an inner side surface 215b, and a top surface 216b. The two top surfaces 212b and 216b are planes parallel to the XY plane and are coplanar. In this example, the two top surfaces 212b and 216b are separated in the X-axis direction, and the bottom surface 214b is located between the top surface 212b and the top surface 216b in the XY plane view. The bottom surface 214b is a plane parallel to the XY plane. An inner surface 213b is disposed between the top surface 212b and the bottom surface 214b, and the inner surface 213b is provided continuously from the top surface 212b to the bottom surface 214b. An inner surface 215b is disposed between the top surface 216b and the bottom surface 214b, and the inner surface 215b is provided continuously from the top surface 216b to the bottom surface 214b.

[0107] That is, the first recess 210a is defined by inner surfaces 213a and 215a in the Y-axis direction. The first recess 210a does not have any inner surfaces in the X-axis direction. The second recess 210b is defined by inner surfaces 213b and 215b in the Y-axis direction. The second recess 210b does not have any inner surfaces in the X-axis direction.

[0108] 15A, on the first surface 211a side, the first conductor 221 is continuously provided across the top surface 212a, the inner side surface 213a, the bottom surface 214a, the inner side surface 215a, and the top surface 216a. In this example, the first conductor 221 also serves as the first terminals 261-1 and 261-2. However, the first terminals 261-1 and 261-2 may be separately disposed on the first conductor 221. The first conductor 221 formed on the top surface 212a functions as the first terminal 261-1. The first conductor 221 formed on the top surface 216a functions as the first terminal 261-2. There may be one first terminal, or, as in this example, there may be multiple first terminals.

[0109] 15A, the fourth conductor 234 is disposed over almost the entire bottom surface 214b on the second surface 211b side. The fourth conductor 234 is not disposed on the top surfaces 212b and 216b or the inner surfaces 213b and 215b.

[0110] 15B, on the first surface 211a side, the second conductors 222 are arranged over almost the entire bottom surface 214a. The second conductors 222 are not arranged on the top surfaces 212a and 216a or the inner surfaces 213a and 215a.

[0111] On the second surface 211b side, the third conductor 233 is arranged across the top surface 212b, the inner side surface 213b, the bottom surface 214b, the inner side surface 215b, and the top surface 216b. In this example, the third conductor 233 also serves as the second terminals 262-1 and 262-2. This is not limiting, and the second terminals 262-1 and 262-2 may be arranged separately on the third conductor 233. The third conductor 233 formed on the top surface 212b functions as the second terminal 262-1. The third conductor 233 formed on the top surface 216b functions as the second terminal 262-2. There may be one second terminal, or, as in this example, there may be multiple second terminals.

[0112] On the first surface 211a side, the first conductor 221 electrically connects the first light-emitting portion 41 and the second light-emitting portion 42 to the first terminals 261-1 and 261-2. On the second surface 211b side, the third conductor 233 electrically connects the third light-emitting portion 43 and the fourth light-emitting portion 44 to the second terminals 262-1 and 262-2.

[0113] In this example, the light-emitting device 201 includes a substrate 210 having recesses on both the first surface 211a side and the second surface 211b side. The length in the Z-axis direction of the first recess 210a, i.e., the depth, is set to be deeper than the length in the Z-axis direction of the first light-emitting unit 41 and the second light-emitting unit 42 when they are placed on the pair of first wirings 220, i.e., the mounting height. Similarly, on the second surface 211b side, the depth of the second recess 210b is set to be deeper than the mounting height of the third light-emitting unit 43 and the fourth light-emitting unit 44. By arranging the light-emitting units so that they are housed in the recesses, it is possible to reduce the length in the Z-axis direction of the light-emitting device 201 itself, i.e., the thickness. Note that the light-emitting device 201 may have a recess on either the first surface 211a side or the second surface 211b side, or it is not necessary to have recesses on both the first surface 211a side and the second surface 211b side.

[0114] The configuration regarding the electrical connection between the first conductor 221 and the fourth conductor 234 will be described. FIG. 16A is a schematic cross-sectional view for explaining the operation of the light emitting device according to this embodiment, and is a cross-sectional view taken along line XVIA-XVIA in FIG. 14A. FIG. 16B is a schematic cross-sectional view for explaining the operation of the light emitting device according to this embodiment, and is a cross-sectional view taken along line XVIB-XVIB in FIG. 14A. 12, side surface 218a is one of the four side surfaces between first surface 211a and second surface 211b of substrate 210 that is parallel to gap G201 and located on the side of first conductor 221 and fourth conductor 234. Side surface 218b is the surface located opposite side surface 218a and located on the side of second conductor 222 and third conductor 233.

[0115] 12 and 16A, the first connection member 251 is disposed over the entire surface of the side surface 218a of the base material 210. The first connection member 251 is connected to the first conductor 221 and the fourth conductor 234. As described in relation to FIG. 15A, the first terminals 261-1 and 261-2 also serve as the first conductor 221 and are electrically connected to the first conductor 221. Therefore, the first terminals 261-1 and 261-2 are electrically connected to the first conductor 221 and the fourth conductor 234.

[0116] 12 and 16B, the second connection member 252 is disposed over the entire surface of the side surface 218b of the base material 210. The second connection member 252 is connected to the second conductor 222 and the third conductor 233. As described in relation to FIG. 15B, the second terminals 262-1 and 262-2 also serve as the third conductor 233 and are electrically connected to the third conductor 233. Therefore, the second terminals 262-1 and 262-2 are electrically connected to the second conductor 222 and the third conductor 233.

[0117] Therefore, the first terminals 261-1 and 261-2 are electrically connected to the first anode electrode A1, the second cathode electrode K2, the third cathode electrode K3, and the fourth anode electrode A4, and the second terminals 262-1 and 262-2 are electrically connected to the first cathode electrode K1, the second anode electrode A2, the third anode electrode A3, and the fourth cathode electrode K4.

[0118] In this example, flexible conductive films 281-1 and 281-2 are disposed on the first terminals 261-1 and 261-2, respectively. Flexible conductive films 282-1 and 282-2 are disposed on the second terminals 262-1 and 262-2, respectively. An example of a material for the flexible conductive films is conductive resin. The conductive resin is a resin containing metal particles. The flexible conductive film can be disposed on the first terminal 61 and the second terminal 62 of the light emitting device 1.

[0119] The path of current when the light emitting device 201 of this embodiment is in operation will be described with reference to FIGS. 16A and 16B. 16A and 16B, in this example, a power supply I0 is connected to first terminals 261-1 and 261-2 so as to apply a voltage higher than the voltage applied to second terminals 262-1 and 262-2. Power supply I0 causes current to flow into first terminals 261-1 and 261-2 and causes current to flow out from second terminals 262-1 and 262-2.

[0120] As shown by the arrows in FIG. 16A, a current flowing in from the first terminal 261-1 flows through the first conductor 221 and reaches the first anode electrode A1 of the first light-emitting unit 41. The current flows into the first anode electrode A1 and flows out from the first cathode electrode K1. The current flowing out from the first cathode electrode K1 flows through the second conductor 222, and reaches the second terminal 262-1 via the second connecting member 252 and the fourth conductor 234. In this way, on the first surface 211a side of the substrate 210, a current flows through the first light-emitting unit 41, causing the first light-emitting unit 41 to emit light. Note that no current flows into the second cathode electrode K2 of the second light-emitting unit 42, and therefore the second light-emitting unit 42 does not emit light.

[0121] As shown by the arrows in FIG. 16B, the current flowing in from the first terminal 261-1 is diverted to the first connecting member 251, flows through the fourth conductor 234, and reaches the fourth anode electrode A4 of the fourth light-emitting unit 44. The current flows into the fourth anode electrode A4 and flows out from the fourth cathode electrode K4. The current flowing out from the fourth cathode electrode flows through the third conductor 233 and flows out from the second terminal 262-1. In this way, on the second surface 211b side of the substrate 210, a current flows in the fourth light-emitting unit 44, causing the fourth light-emitting unit 44 to emit light. Note that no current flows into the third cathode electrode K2 of the third light-emitting unit 43, and therefore the third light-emitting unit 43 does not emit light.

[0122] Even if the polarity of the power supply I0 connected to the first terminals 261-1, 261-2 and the second terminals 262-1, 262-2 is changed, the light-emitting portion of the light-emitting device 201 emits light on both the first surface 211a side and the second surface 211b side, just like in the first embodiment.

[0123] A method for manufacturing the light emitting device 201 of this embodiment will be described. 17A to 18A are schematic perspective views illustrating the method for manufacturing the light emitting device according to this embodiment. FIG. 18B is a schematic cross-sectional view of part XVIIIB in FIG. 18A. FIG. 19A is a schematic perspective view illustrating a method for manufacturing a light emitting device according to this embodiment. FIG. 19B is a schematic cross-sectional view of part XIXB in FIG. 19A. FIG. 20A is a schematic perspective view illustrating the method for manufacturing the light emitting device according to this embodiment. FIG. 20B is a schematic perspective view illustrating the method for manufacturing the light emitting device according to this embodiment. 21A and 21B are schematic perspective views illustrating a method for manufacturing a light emitting device according to this embodiment. As shown in FIG. 17A, a substrate 1210 is prepared. The substrate 1210 has a surface 1211a and a surface 1211b opposite the surface 1211a. The surfaces 1211a and 1211b are parallel to the XY plane. The substrate 1210 has a recess 1210a on the surface 1211a side, and a similar recess on the surface 1211b side. The recess 1210a is groove-shaped along the X-axis direction, with multiple recesses 1210a formed parallel to the Y-axis direction. The recess on the surface 1211b side is also groove-shaped along the X-axis direction, with multiple recesses formed parallel to the Y-axis direction. The recess on the surface 1211b side is formed so that the outer circumferences of the recess 1210a and the recess 1210a almost overlap in the XY plane view. The lengths in the Z-axis direction of the recess 1210a and the recess on the surface 1211b side, i.e., the depth, are set based on the length in the Z-axis direction of the light-emitting section. For example, the depth of the recess 1210a and the recess on the surface 1211b side is set so that when the light emitting unit is placed in the recess 1210a and the recess on the surface 1211b side, the light emitting unit is sufficiently buried in the recess 1210a and the recess on the surface 1211b side.

[0124] The recess 1210a and the recess on the surface 1211b side can be formed using a well-known processing technique. For example, the recess 1210a and the recess on the surface 1211b side can be formed by cutting the base material with a laser processing machine or the like, or the recess 1210a and the recess on the surface 1211b side can be formed by etching using a mask.

[0125] 17B, ​​the base material 1210 is divided using a blade BLD. One blade BLD is arranged along the Y-axis direction, and the base material 1210 is divided at approximately equal intervals in the X-axis direction.

[0126] As shown in Fig. 17C, a block 2210 is formed by cutting with the blade BLD. The block 2210 is a member including a plurality of base materials 210 shown in Fig. 11 and the like, arranged continuously in the Y-axis direction. The cut surfaces of the block 2210 are side surfaces 2218a and 2218b of the block 2210. The side surface 2218b is the surface located opposite the side surface 2218a.

[0127] 18A and 18B, the divided block 2210 shown in FIG. 17C has a first surface 211a and a second surface 211b. The first surface 211a includes a top surface 1212a, an inner surface 213a, a bottom surface 214a, an inner surface 215a, and a top surface 1216a. The second surface 211b includes a top surface 1212b, an inner surface 213b, a bottom surface 214b, an inner surface 215b, and a top surface 1216b.

[0128] 18A , the block 2210a is covered with a conductive layer. Specifically, a first conductive layer 1220a is formed over the entire first surface 211a, a second conductive layer 1220b is formed over the entire second surface 211b, a third conductive layer 1220c is formed over the entire side surface 2218a, and a fourth conductive layer 1220d is formed over the entire side surface 2218b. The first conductive layer 1220a, the second conductive layer 1220b, the third conductive layer 1220c, and the fourth conductive layer 1220d may be formed simultaneously or sequentially, for example, on the first surface 211a, the second surface 211b, the side surface 2218a, and the side surface 2218b, respectively. The first conductive layer 1220a, the second conductive layer 1220b, the third conductive layer 1220c, and the fourth conductive layer 1220d may be formed by sputtering, for example.

[0129] 18B, block 2210a has first recess 210a on first surface 211a and second recess 210b on second surface 211b. First recess 210a is defined by inner side surface 213a, bottom surface 214a, and inner side surface 215a. Second recess 210b is defined by inner side surface 213b, bottom surface 214b, and inner side surface 215b.

[0130] As shown in FIGS. 19A and 19B, gaps G201 and G202 are formed to form block 2210b. Gap G201 is formed on the first surface 211a side. Gap G202 is formed on the second surface 211b side. Gap G201 is formed by inserting a blade BLD on the first surface 211a side so that the blade BLD is aligned along the Y axis direction at approximately the center of block 2210b in the X axis direction. Gap G202 is formed by inserting a blade BLD on the second surface 211b side so that the blade BLD is aligned along the Y axis direction at approximately the center of block 2210b in the X axis direction.

[0131] The blade BLD divides a portion of the base material of the block 2210b and the conductive layer 1220a on the first surface 211 side to form separated first conductors 1221a and second conductors 1222a. The blade BLD divides the conductive layer 1220b on the second surface 211b side to form separated third conductors 1221b and fourth conductors 1222b. Since the third conductive layer 1220c is formed on the side surface 2218a, the first conductors 1221a and the fourth conductors 1222b are electrically connected via the third conductive layer 1220c. Since the fourth conductive layer 1220d is formed on the side surface 2218b, the second conductors 1222a and the third conductors 1221b are electrically connected via the fourth conductive layer 1220d. In addition to the above, the conductive layer may be divided so as not to divide a portion of the base material. The substrate and the conductive layer may be divided not only by a blade but also by laser irradiation or etching.

[0132] Thereafter, block 2210b is divided along the X-axis direction at approximately the center of upper surface 1212a in the Y-axis direction, and then divided along the X-axis direction at approximately the center of upper surface 1216a in the Y-axis direction. When block 2210b is divided, first conductor 1221a, second conductor 1222a, third conductor 1221b, fourth conductor 1222b, third conductive layer 1220c, and fourth conductive layer 1220d are also divided at the same positions as base material 210.

[0133] 20A and 20B, the first conductor 221 is formed by dividing the first conductor 1221a along the X-axis direction. The second conductor 222 is formed by dividing the second conductor 1222a along the X-axis direction and removing a portion of the divided second conductor 1222a to form the second conductor 222. The removed portions are the conductor portions on the top surfaces 212a and 216a and the conductor portions on the inner surfaces 213a and 215a. The second conductor 222 is the conductor portion remaining on the bottom surface 214a.

[0134] The third conductor 233 is formed by dividing the third conductor 1221b along the X-axis direction. The fourth conductor 234 is formed by dividing the fourth conductor 1222b along the X-axis and removing a portion of the divided fourth conductor 1222b to form the fourth conductor 234. The removed portions are the portions of the conductor on the top surfaces 212b and 216b and the portions of the conductor on the inner surfaces 213b and 215b. The fourth conductor 234 is the portion of the conductor that remains on the bottom surface 214b.

[0135] By the dividing step of the block 2210b, the third conductive layer 1220c is divided into first connecting members 251. By the dividing step of the block 2210b, the fourth conductive layer 1220d is divided into second connecting members 252.

[0136] On the first surface 211a side, the first conductor 221 on the upper surfaces 212a and 216a is left as it is and serves as first terminals 261-1 and 261-2 connected to the fourth conductor 234 and the first connecting member 251. On the second surface 211b side, the third conductor 233 on the upper surfaces 212b and 216b is left as it is and serves as second terminals 262-1 and 262-2 connected to the second conductor 222 and the second connecting member 252.

[0137] A laser processing machine, for example, is used to remove a portion of the divided second conductors 1222a to form the second conductors 222 and to remove a portion of the divided fourth conductors 1222b to form the fourth conductors 234. An appropriate laser wavelength is selected depending on the metal material from which the second conductors 222 and the fourth conductors 234 are formed.

[0138] 21A , on the first surface 211a side, the first light-emitting unit 41 and the second light-emitting unit 42 are placed in the first recess 210a. The first light-emitting unit 41 and the second light-emitting unit 42 are each placed from the first conductor 221 to the second conductor 222. One electrode of the first light-emitting unit 41 and the second light-emitting unit 42 is connected to the first conductor 221, and the other electrode of the first light-emitting unit 41 and the second light-emitting unit 42 is connected to the second conductor 222.

[0139] On the second surface 211b side, the third light-emitting unit 43 and the fourth light-emitting unit 44 are placed in the second recess 210b. The third light-emitting unit 43 and the fourth light-emitting unit 44 are each placed from the third conductor 233 to the fourth conductor 234. One electrode of the third light-emitting unit 43 and the fourth light-emitting unit 44 is connected to the third conductor 233, and the other electrode of the third light-emitting unit 43 and the fourth light-emitting unit 44 is connected to the fourth conductor 234.

[0140] 21B, the first light-transmissive member 271 is arranged to cover the first light-emitting unit 41 and the second light-emitting unit 42. The first light-transmissive member 271 is arranged to cover the first light-emitting unit 41 and the second light-emitting unit 42, as well as the inner side surface 213a, the bottom surface 214a, and the inner side surface 215a shown in FIG. 15A. The second light-transmissive member 272 is arranged to cover the third light-emitting unit 43 and the fourth light-emitting unit 44. The second light-transmissive member 272 is arranged to cover the third light-emitting unit 43 and the fourth light-emitting unit 44, as well as the inner side surface 213b, the bottom surface 214b, and the inner side surface 215b shown in FIG. 15A.

[0141] In this manner, the light emitting device 201 of this embodiment is manufactured.

[0142] The effects of the light emitting device 201 of this embodiment will be described. The light emitting device 201 of this embodiment has the same effects as the light emitting device 1 of the other embodiments described above.

[0143] In addition to the same effects as in the first embodiment, the following effects are achieved. In the light-emitting device 201 of this embodiment, the first connecting member 251 and the second connecting member 252 are disposed on the two side surfaces 218a and 218b of the base material 210 of the light-emitting device 201, respectively. This allows connection to wiring from an external power source at a position perpendicular to the light-extraction surface. In other words, by sandwiching the light-emitting device 201 between two wiring members connected to an external power source via the first connecting member 251 and the second connecting member 252, light can be extracted toward the area sandwiched between the two wiring members. This improves the flexibility of placement and mounting when incorporating the light-emitting device 201. Note that if the first connecting member 251 and the second connecting member 252 are used as terminals, the first and second terminals do not need to be disposed. By not disposing the first and second terminals, the process of forming the terminals described in connection with FIGS. 20A and 20B can be simplified.

[0144] (Third embodiment) In the following embodiments, a light emitting module in which the above-described light emitting devices 1 and 201 are arranged will be described. FIG. 22A is a schematic front view illustrating the light-emitting module according to this embodiment. FIG. 22B is a schematic plan view illustrating the light-emitting module according to this embodiment. As shown in FIGS. 22A and 22B, a light emitting module 301 of this embodiment includes a light emitting device 1, a first light-transmissive plate 310, and a second light-transmissive plate 320.

[0145] The first light-transmitting plate 310 includes a light-transmitting base material 311 and a first light-transmitting conductive layer 312. The first light-transmitting conductive layer 312 is disposed on one surface 311a of the light-transmitting base material 311. The second light-transmitting plate 320 includes a light-transmitting base material 321 and a second light-transmitting conductive layer 322. The second light-transmitting conductive layer 322 is disposed on one surface 321a of the light-transmitting base material 321.

[0146] The light-emitting module 301 of this embodiment includes the light-emitting device 1 of the first embodiment. In the following description, three-dimensional coordinates different from those used for the light-emitting device 1 of the first embodiment are used. In the three-dimensional coordinates of this embodiment, one surface 311a of the first light-transmissive substrate 311 is a plane parallel to the XY plane. The second light-transmissive plate 320 has a surface 321a parallel to the surface 311a of the first light-transmissive substrate 311, and therefore the surface 321a is also a plane parallel to the XY plane. In this example, multiple light-emitting devices 1 are arranged. The multiple light-emitting devices 1 are arranged on the XY plane along the X-axis direction and along the Y-axis direction. The Z-axis is perpendicular to the XY plane, and the direction from the surface 321a of the second light-transmissive substrate 321 to the surface 311a of the first light-transmissive substrate 311 is considered positive. As in the other embodiments described above, even when the positive and negative directions of the Z axis are referred to as "up" and "down," the direction along the Z axis is not limited to the direction of gravity.

[0147] The first translucent conductive layer 312 disposed on the first translucent plate 310 faces the second translucent conductive layer 322 disposed on the second translucent plate 320. The light emitting device 1 is disposed between the first translucent plate 310 and the second translucent plate 320.

[0148] More specifically, the first translucent conductive layer 312 is disposed opposite one of the light extraction surfaces S1 and S2 of the light emitting device 1. When the first translucent conductive layer 312 faces the light extraction surface S1, the first translucent conductive layer 312 is electrically connected to the first terminal 61 on the light extraction surface S1 side. The second translucent conductive layer 322 is disposed opposite the light extraction surface S2 and is electrically connected to the second terminal 62 on the light extraction surface S2 side.

[0149] When the first translucent conductive layer 312 faces the light extraction surface S2, the first translucent conductive layer 312 is connected to the second terminal 62 on the light extraction surface S2 side. The second translucent conductive layer 322 is disposed facing the light extraction surface S1 and connected to the first terminal 61 on the light extraction surface S1 side. In the example of FIG. 22A , the light emitting device 1 located on the most negative side of the X axis has its light extraction surface S1 facing the first translucent conductive layer 312, and the first terminal 61 is connected to the first translucent conductive layer 312. The light emitting device 1 next to this light emitting device 1 has its light extraction surface S2 facing the first translucent conductive layer 312, and the second terminal is connected to the first translucent conductive layer 312.

[0150] As described above, the light emitting device 1 can have flexible conductive films on the first terminal 61 and the second terminal 62. The provision of the flexible conductive films improves the electrical connection between the light emitting device 1 and the first and second light transmissive plates 320. More specifically, even if the light emitting device 1 is sandwiched at an angle with respect to the first and second light transmissive plates 310 and 320, or if the first and second light transmissive plates 310 and 320 are warped, the provision of the flexible conductive films increases the contact area between the light emitting device 1 and the first and second light transmissive plates 310 and 320, thereby ensuring a reliable electrical connection.

[0151] In the light-emitting module 301, the light-emitting device 1 may be electrically connected to the first light-transmissive plate 310 and the second light-transmissive plate 320 by being bonded to them via a conductive adhesive, or may be electrically connected by direct contact without using a conductive adhesive. The same applies to light-emitting modules 401 and 501 described below.

[0152] When a plurality of light emitting devices 1 are arranged, as described above, there may be a light emitting device 1 having a first terminal 61 connected to the first translucent conductive layer 312 and a light emitting device 1 having a second terminal 62 connected to the first translucent conductive layer 312. However, this is not limiting, and the first terminals 61 of all the light emitting devices 1 may be connected to the first translucent conductive layer, or the second terminals 62 of all the light emitting devices 1 may be connected to the first translucent conductive layer.

[0153] 22, the first translucent conductive layer 312 is disposed over the entire surface of the first translucent base material 311 facing the second translucent plate 320. This ensures electrical connection between the light emitting device 1 and the first translucent plate 310 regardless of where the light emitting device 1 is disposed on the surface of the first translucent base material 311 facing the second translucent plate 320. Furthermore, since no pattern is required for disposing the light emitting device in the first translucent conductive layer 312, the process of forming the first translucent conductive layer 312 on the first translucent plate 310 can be simplified. The same applies to the second translucent conductive layer 322.

[0154] 22A, a plurality of light emitting devices 1 can be connected to one first translucent conductive layer 312. Also, a plurality of light emitting devices 1 can be connected to one second translucent conductive layer 322. This allows current to be supplied from the translucent conductive layer to the plurality of light emitting devices 1, and allows the plurality of light emitting devices 1 to be lit simultaneously. The same applies to the fourth, fifth, and sixth embodiments described below.

[0155] The translucent base materials 311 and 321 are plate-shaped members having surfaces parallel to the XY plane on both sides, and are made of, for example, glass or resin. The first translucent conductive layer 312 and the second translucent conductive layer 322 are made of, for example, ITO or ZnO.

[0156] The light emitting module 301 may include one light emitting device 1 or multiple light emitting devices 1. By including multiple light emitting devices, the light emitting module 301 can be used as a planar light source. The multiple light emitting devices 1 are arranged at equal intervals in the X-axis direction and the Y-axis direction as shown in the example of FIG. 22B. When multiple light emitting devices 1 are arranged, all of the light emitting devices 1 do not necessarily have to be arranged regularly as shown in FIG. 22B, but may also be arranged irregularly.

[0157] The effects of the light emitting module 301 of this embodiment will be described. The light-emitting module 301 of this embodiment includes a light-emitting device 1. The light-emitting device 1 emits light from both sides, even when a voltage higher than the voltage applied to the second terminal 62 is applied to the first terminal 61, or even when a voltage lower than the voltage applied to the second terminal 62 is applied to the first terminal 61. Therefore, the light-emitting device 1 can be mounted in the light-emitting module 301 without considering the polarity of the wiring connected to the first terminal 61 and the second terminal 62. Furthermore, since it is not necessary to consider the polarity of the first terminal 61 and the second terminal 62 of the light-emitting device 1, the manufacture of the light-emitting module 301 can be simplified and productivity can be improved.

[0158] In the light emitting device 1 of the light emitting module 301 of this embodiment, the first terminal 61 and the second terminal 62 are located on one light extraction surface S1 and the opposite light extraction surface S2, respectively. By sandwiching the light emitting device 1 between two light-transmitting plates 310, 320 having light-transmitting conductive layers from the light extraction surface S1 side and the light extraction surface S2 side, the connection between the light emitting device 1 and the wiring member from the external power source is completed. This also simplifies the manufacture of the light emitting module 301 and improves productivity.

[0159] (Fourth embodiment) FIG. 23A is a schematic front view illustrating the light-emitting module according to this embodiment. FIG. 23B is a schematic plan view illustrating the light-emitting module according to this embodiment. The light emitting device 201 in the second embodiment can be substituted for the light emitting device 1 in the light emitting module 301 of the third embodiment and applied to the light emitting module 401. The same components are denoted by the same reference numerals, and detailed descriptions thereof may be omitted. 23A and 23B, a light-emitting module 401 of this embodiment includes a light-emitting device 201, a first light-transmissive plate 310, and a second light-transmissive plate 320. The first light-transmissive plate 310 and the second light-transmissive plate 320 are the same as those in the third embodiment, and detailed descriptions thereof may be omitted. In this embodiment, the same three-dimensional coordinates as in the third embodiment will be used for the explanation.

[0160] The light emitting device 201 is the light emitting device described in the second embodiment. The light emitting device 201 has light extraction surfaces S201 and S202. The light extraction surface S202 is the surface located opposite the light extraction surface S201. The light emitting device 201 has first terminals 261-1 and 261-2 on the light extraction surface S201 side, and second terminals 262-1 and 262-2 on the light extraction surface S202 side. Flexible conductive films 281-281-2 are arranged on the first terminals 261-1 and 261-2, respectively, and flexible conductive films 282-1 and 282-2 are arranged on the second terminals 262-1 and 262-2, respectively. In the following description, to avoid complication in illustration and notation, the flexible conductive film located on the light extraction surface S201 side will be denoted by the symbol 281, and the flexible conductive film located on the light extraction surface S202 side will be denoted by the symbol 282.

[0161] The first light-transmitting conductive layer 312 is disposed to face either the light extraction surface S201 or S202 of the light emitting device 201. When the first light-transmitting conductive layer 312 faces the light extraction surface S201, the first light-transmitting conductive layer 312 is electrically connected to the flexible conductive film 281 on the first terminal 261. The second light-transmitting conductive layer 322 is electrically connected to the flexible conductive film 282 on the second terminal 262.

[0162] When the first translucent conductive layer 312 faces the light extraction surface S202, the first translucent conductive layer 312 is electrically connected to the flexible conductive film 282 on the second terminal 262. The second translucent conductive layer 322 is electrically connected to the flexible conductive film 281 on the first terminal 261.

[0163] As in the third embodiment, the light emitting module 401 may include one light emitting device 201 or multiple light emitting devices 201. When multiple light emitting devices 201 are included, the opposing relationship between the light extraction surface and the translucent conductive layer may be different for each light emitting device 201, as in the third embodiment.

[0164] The effects of the light emitting module 401 of this embodiment will be described. The light emitting module 401 of this embodiment has the same effects as the light emitting module 301 of the third embodiment, and also has the following effects. The light-emitting module 401 of this embodiment includes a light-emitting device 201. The light-emitting device 201 has a first recess 210a on the first surface 211a side of a base material 210, and a second recess 210b on the second surface 211b side. The first light-emitting element 40a including the light-emitting portions 41 and 42 is disposed in the first recess 210a, and the second light-emitting element 40b including the light-emitting portions 43 and 44 is disposed in the second recess 210b. This allows the light-emitting device 201 to be thinner, and also reduces the gap between the light-emitting device 201 when disposed between two light-transmitting plates. This allows the light-emitting module 401 to be thinner.

[0165] (Fifth embodiment) FIG. 24A is a schematic front view illustrating the light-emitting module according to this embodiment. FIG. 24B is a schematic plan view illustrating the light-emitting module according to this embodiment. In the light emitting module 501 of this embodiment, the arrangement of the light emitting device 201 differs from that of the fourth embodiment. The same components are denoted by the same reference numerals, and detailed description thereof may be omitted. 24A and 24B, a light-emitting module 501 of this embodiment includes a light-emitting device 201, a first light-transmissive plate 310, and a second light-transmissive plate 320. The light-emitting device 201, the first light-transmissive plate 310, and the second light-transmissive plate 320 are the same as those in the fourth embodiment.

[0166] In the light-emitting module 501 of this embodiment, the light-emitting device 201 includes a first connecting member 251 and a second connecting member 252. The first connecting member 251 is disposed on a first side surface 218a of a base material 210 constituting the light-emitting device 201, and the second connecting member 252 is disposed on a second side surface 218b located opposite the first side surface 218a. The light-emitting device 201 is electrically connected to the first light-transmitting conductive layer 312 and the second light-transmitting conductive layer 322 via the first connecting member 251 and the second connecting member 252.

[0167] More specifically, the first translucent conductive layer 312 is disposed opposite the first connecting member 251 or the second connecting member 252. When the first translucent conductive layer 312 faces the first connecting member 251, the first translucent conductive layer 312 is electrically connected to the first connecting member 251. The second translucent conductive layer 322 is electrically connected to the second connecting member 252. When the first translucent conductive layer 312 faces the second connecting member 252, the first translucent conductive layer 312 is electrically connected to the second translucent conductive layer 322. When the first translucent conductive layer 312 faces the second connecting member 252, the first translucent conductive layer 312 is electrically connected to the second connecting member 252. The second translucent conductive layer 322 is electrically connected to the first connecting member 251.

[0168] In the light emitting module 501 of this embodiment, the light emitting device 201 is disposed so that the light extraction surfaces S201 and S202 are perpendicular to or intersect with the XY plane.

[0169] As in the third and fourth embodiments, the light-emitting module 501 may include one light-emitting device 201 or multiple light-emitting devices 201. When the light-emitting module 501 includes multiple light-emitting devices 201, the opposing relationship between the connection member and the translucent conductive layer may be different for each light-emitting device 201, as in the third and fourth embodiments.

[0170] The effects of the light emitting module 501 of this embodiment will be described. The light-emitting module 501 of this embodiment achieves the same effects as the light-emitting module 301 of the third embodiment. In addition, the light-emitting module 501 of this embodiment achieves the following effects. That is, in the light-emitting module 501, the two light-extraction surfaces S201 and S202 of the light-emitting device 201 are disposed not parallel to the XY plane but perpendicular to or at an angle to the XY plane. The XY plane is parallel to one surface 311a of the light-transmissive base material 311 of the first light-transmissive plate 310 and one surface 321a of the light-transmissive base material 321 of the second light-transmissive plate 320, respectively. Therefore, the light-emitting device 201 emits light with the highest luminance in the direction along the X axis. This makes it possible to ensure the amount of light in the peripheral portions of the light-emitting module 501, which are difficult for light to reach. This makes it possible to realize a light-emitting module 501 with a more uniform amount of light when viewed as a whole.

[0171] (Sixth embodiment) FIG. 25 is a schematic front view illustrating the light-emitting module according to this embodiment. 25, a light-emitting module 601 of this embodiment includes a light-emitting device 201, a first light-transmissive plate 310, a support member 610, and an optical member 620. Although Fig. 25 shows a light-emitting module 501 including one light-emitting device 201, the number of light-emitting devices 201 is not limited to one, and there may be multiple light-emitting devices 201. The light emitting device 201 of this embodiment is the light emitting device of the second embodiment, and the first light transmissive plate (third light transmissive plate) 310 is the first light transmissive plate of the third to fifth embodiments, and includes a light transmissive base material 311 having a first light transmissive conductive layer (third light transmissive conductive layer) 312 arranged on one surface. The same components are given the same reference numerals, and detailed description thereof may be omitted.

[0172] In the three-dimensional coordinate system of this embodiment, one surface 611a of the support member 610 is a surface parallel to the XY plane. The X-axis and Y-axis can be set in any direction. In this example, the light emitting device 201 and the optical member 620 are arranged along the X-axis direction. The direction and positive and negative of the Z-axis are the same as in the third embodiment.

[0173] The first light-transmitting plate 310 is disposed opposite the support member 610 .

[0174] The support member 610 is a plate-like member having a surface 611a, on which the light emitting device 201 and the optical member 620 are placed and supported. A conductive layer (conductive portion) 612 is disposed on one surface 611a of the support member 610. The conductive layer 612 has an area in the XY plane large enough to allow the connection member of the light emitting device 201 to be placed and connected thereto. The support member 610 and the conductive layer 612 may or may not be light-transmitting.

[0175] The optical element 620 is disposed on the surface 611a of the support member 610. The optical element 620 is placed on the surface 611a and disposed in the optical path of light emitted from the light emitting device 201. In this example, the optical element 620 is a reflector having an inclined surface 621 at an angle θ from the surface 611a. The angle θ is set according to the direction in which light incident on the optical element 620 is reflected. The light incident on the inclined surface 621 may be entirely reflected by the inclined surface 621, or a portion of the light may be reflected and the other light may be transmitted. The inclined surface 621 may be flat, or may have a convex or concave surface. Depending on the application of the light emitting module 601, other optical elements such as a prism or a filter may be used to efficiently extract light from the light emitting device.

[0176] The light emitting device 201 is disposed between the first translucent plate 310 and the support member 610. The light emitting device 201 is disposed such that the first connecting member 251 or the second connecting member 252 faces the conductive layer 612. In this example, the light emitting device 201 is disposed such that the second connecting member 252 faces the conductive layer 612, and the second connecting member 252 is connected to the conductive layer 612. The light emitting device 201 is disposed such that the first connecting member 251 faces the first translucent conductive layer 312, and the first connecting member 251 is connected to the first translucent conductive layer 312. The first connecting member 251 is disposed such that it faces the conductive layer 612, and is connected to the conductive layer 612. The second connecting member 252 may be disposed such that it faces the first translucent conductive layer 312, and is connected to the first translucent conductive layer 312. Note that in this example, one light emitting device 201 is disposed. However, this is not limiting, and multiple units may be arranged.

[0177] The optical member 620 is disposed between the first light-transmissive plate 310 and the support member 610. In this example, the optical member 620 is disposed so that the inclined surface 621 faces the light extraction surface of the light emitting device 201. In this example, the light emitting device 201 and the optical member 620 are disposed so that the light extraction surface S202 of the light emitting device 201 faces the inclined surface 621. The light emitting device 201 may be disposed so that the light extraction surface S201 faces the inclined surface 621.

[0178] In the light-emitting module 601, the light-emitting device 201 may be electrically connected to the first light-transmissive plate (third light-transmissive plate) 310 and the conductive layer 612 of the support member 610 in a state of being bonded via a conductive adhesive, or may be electrically connected by direct contact without using a conductive adhesive.

[0179] The operation of the light emitting module 601 of this embodiment will be described. In the light-emitting module 601 of this embodiment, the optical paths of the light emitted from both the light extraction surfaces S201 and S202 can be made different. In this example, the light from the light extraction surface S201 is emitted along the gap between the first light-transmissive plate 310 and the support member 610, as indicated by the thick straight arrow in Fig. 25. The light from the other light extraction surface S202 is reflected by the inclined surface 621 of the optical member 620 and emitted via the first light-transmissive plate 310, as indicated by the bent thick arrow in Fig. 25.

[0180] The effects of the light emitting module 601 of this embodiment will be described. The light-emitting module 601 of this embodiment includes a light-emitting device 201. The light-emitting device 201 has a first connecting member 251 on one side and a second connecting member 252 on the other side. The light-emitting device 201 is sandwiched between a third light-transmissive plate 310 and a support member 610, and is electrically connected to wiring members (the third light-transmissive plate 310 and the support member 610) from an external power source via the first connecting member 251 and the second connecting member 252. As a result, light from the light-emitting device 201 is emitted mainly in a direction parallel to a surface 611a of the support member 610. The optical member can change the optical path of light from one light extraction surface of the light-emitting device 201 or can process the emitted light, enabling a variety of optical effects.

[0181] According to the embodiment described above, it is possible to realize a light emitting device that eliminates the need to identify terminals and facilitates mounting, a light emitting module using the light emitting device, and a method for manufacturing the light emitting device.

[0182] Although several embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, as well as within the scope of the invention and its equivalents as set forth in the claims. Furthermore, the above-described embodiments can be implemented in combination with each other. [Explanation of symbols]

[0183] 1, 201...light emitting device, 10, 210...substrate, 10a...first substrate, 10b...second substrate, 12a...first through hole, 12b...second through hole, 20, 220...pair of first wirings, 21, 221...first conductor, 22, 222...second conductor, 30, 230...pair of second wirings, 33, 233...third conductor, 34, 234...fourth conductor, 41...first light emitting portion, 42...second light emitting portion, 43...third light emitting portion, 44...fourth light emitting portion, 51, 251...first connecting member, 52, 252...second connecting member, 61, 261-1, 261-2...first terminal, 62, 262-1, 262-2 ...second terminal, 71, 271...first light-transmitting member, 72, 272...second light-transmitting member, 120, 120a...light-emitting element, 281, 281-1, 281-2, 282, 282-1, 282-2...flexible conductive film, 210a...first recess, 210b...second recess, 218a...first side surface, 218b...second side surface, 1002...resist layer, 1003...resist pattern, 1020, 1030...seed layer, 1220...conductive layer, S1, S2, 41S, 42S, 43S, 44S, S201, S202...light extraction surface, G1, G2, G201, G202...gap

Claims

1. a substrate having a first surface and a second surface opposite the first surface; a pair of first wirings arranged on the first surface; a first light-emitting portion and a second light-emitting portion disposed on the pair of first wirings; a pair of second wirings arranged on the second surface; a third light-emitting section and a fourth light-emitting section disposed on the pair of second wirings; a first connection member that electrically connects one of the pair of first wirings and one of the pair of second wirings; a second connection member that electrically connects the other of the pair of first wirings to the other of the pair of second wirings; a first terminal disposed on the first surface and electrically connected to the first connection member; a second terminal disposed on the second surface and electrically connected to the second connection member; Equipped with The first light-emitting unit a first anode electrode electrically connected to one of the pair of first wirings; a first cathode electrode electrically connected to the other of the pair of first wirings; Including, The second light-emitting unit is a second cathode electrode electrically connected to one of the pair of first wirings; a second anode electrode electrically connected to the other of the pair of first wirings; Including, The third light-emitting unit is a third anode electrode electrically connected to one of the pair of second wirings; a third cathode electrode electrically connected to the other of the pair of second wirings; Including, The fourth light-emitting unit is a fourth cathode electrode electrically connected to one of the pair of second wirings; a fourth anode electrode electrically connected to the other of the pair of second wirings; Including, the first connecting member and the second connecting member are respectively disposed on side surfaces of the base material that are located between the first surface and the second surface; the first surface of the base material includes a first upper surface, a first inner side surface continuous with the first upper surface, and a first recess defined by a first bottom surface; one of the pair of first wirings is disposed on the first upper surface, the first inner side surface, and the first bottom surface, and is electrically connected to the first connection member at at least one of the first upper surface, the first inner side surface, and the first bottom surface; the other of the pair of first wirings is disposed on the first bottom surface and is electrically connected to the second connection member at the first bottom surface; the first terminal is disposed on the first upper surface; The light emitting device, wherein the first light emitting portion and the second light emitting portion are disposed on the first bottom surface via the pair of first wirings.

2. the first connection member is disposed in a first through-hole that penetrates the base material from the first surface to the second surface; The light emitting device according to claim 1 , wherein the second connection member is disposed in a second through-hole that penetrates the base from the first surface to the second surface.

3. the side surface of the substrate includes a first side surface and a second side surface located opposite the first side surface, the first connecting member is disposed on the first side surface, The light emitting device according to claim 1 , wherein the second connecting member is disposed on the second side surface.

4. the second surface of the base material includes a second recess defined by a second upper surface, a second inner side surface continuous with the second upper surface, and a second bottom surface; one of the pair of second wirings is disposed on the second bottom surface and is electrically connected to the first connection member at the second bottom surface; the other of the pair of second wirings is disposed on the second top surface, the second inner side surface, and the second bottom surface, and is electrically connected to the second connection member at at least one of the second top surface, the second inner side surface, and the second bottom surface; the second terminal is disposed on the second upper surface; The light emitting device according to claim 1 , wherein the third light emitting portion and the fourth light emitting portion are disposed on the second bottom surface via the pair of second wirings.

5. 5. The light emitting device according to claim 1, wherein the base material is light transmissive.

6. 6. The light emitting device according to claim 1, further comprising a light-transmitting member covering the first light emitting portion and the second light emitting portion.

7. a substrate having a first surface and a second surface opposite the first surface; a pair of first wirings arranged on the first surface; a first light-emitting portion and a second light-emitting portion disposed on the pair of first wirings; a pair of second wirings arranged on the second surface; a third light-emitting section and a fourth light-emitting section disposed on the pair of second wirings; a first connection member that electrically connects one of the pair of first wirings and one of the pair of second wirings; a second connection member that electrically connects the other of the pair of first wirings to the other of the pair of second wirings; a first terminal disposed on the first surface and electrically connected to the first connection member; a second terminal disposed on the second surface and electrically connected to the second connection member; a flexible conductive film disposed on each of the first terminal and the second terminal; Equipped with The first light-emitting unit a first anode electrode electrically connected to one of the pair of first wirings; a first cathode electrode electrically connected to the other of the pair of first wirings; Including, The second light-emitting unit is a second cathode electrode electrically connected to one of the pair of first wirings; a second anode electrode electrically connected to the other of the pair of first wirings; Including, The third light-emitting unit is a third anode electrode electrically connected to one of the pair of second wirings; a third cathode electrode electrically connected to the other of the pair of second wirings; Including, The fourth light-emitting unit is a fourth cathode electrode electrically connected to one of the pair of second wirings; a fourth anode electrode electrically connected to the other of the pair of second wirings; A light emitting device comprising:

8. a first transparent plate including a first transparent conductive layer; a second light-transmitting plate including a second light-transmitting conductive layer; a light-emitting device according to any one of claims 1 to 7; Equipped with the first light-transmitting plate and the second light-transmitting plate are arranged such that the first light-transmitting conductive layer and the second light-transmitting conductive layer face each other; the light emitting device is disposed between the first light-transmitting plate and the second light-transmitting plate; the first terminal is electrically connected to the first light-transmitting conductive layer; The second terminal is electrically connected to the second light-transmitting conductive layer.

9. a first transparent plate including a first transparent conductive layer; a second light-transmitting plate including a second light-transmitting conductive layer; a light-emitting device according to any one of claims 1 to 7; Equipped with the first light-transmitting plate and the second light-transmitting plate are arranged such that the first light-transmitting conductive layer and the second light-transmitting conductive layer face each other; the light emitting device is disposed between the first light-transmitting plate and the second light-transmitting plate; the first connection member is electrically connected to the first light-transmitting conductive layer, The second connection member is electrically connected to the second light-transmitting conductive layer.

10. a support member including a conductive portion; a third light-transmitting plate including a third light-transmitting conductive layer disposed opposite the support member; an optical member disposed between the support member and the third light-transmitting plate; the light-emitting device according to claim 1 , 3 or 4 , disposed between the support member and the third light-transmitting plate; Equipped with the conductive portion is electrically connected to the first connection member, the third light-transmitting conductive layer is electrically connected to the second connection member, The optical member includes an inclined surface that forms a predetermined angle with respect to a surface of the support member on which the optical member is disposed.

Images