Wiring devices

Abstract

To provide a wiring device which enables a limited space in the device to be effectively utilized.SOLUTION: A wiring device 1 comprises: a first substrate (e.g., a master substrate 100) on which a first circuit block 2 is disposed; a second substrate (e.g., a slave substrate 200) on which a second circuit block 3 is disposed; a case (e.g., a body C3) which houses the first substrate and the second substrate; a heat radiation member 60 disposed between the first substrate and the case; and an insulation sheet 71 which electrically insulates an electronic component disposed on the first substrate from the case. The first circuit block 2 includes at least one circuit among: a circuit that outputs a signal to the second circuit block 3; and a circuit that receives a signal from the second circuit block 3. The second substrate is electrically connected to the first substrate. The insulation sheet 71 is provided with an opening in which the heat radiation member 60 is fitted.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE The present disclosure relates generally to wiring devices, and more particularly to wiring devices that include a substrate. [Background technology]

[0002] A conventional wiring device known is a USB (Universal Serial Bus) outlet (wiring device) disclosed in Patent Document 1. The USB outlet described in Patent Document 1 includes a housing having a cover and a body. The body has a storage recess. Circuit components are stored in the storage recess. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-178097 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, USB outlets (wiring devices) have tended to become larger due to the large number of electronic components installed. To prevent USB outlets from becoming larger, it is necessary to make effective use of the limited space.

[0005] The present disclosure has been made in view of the above-mentioned problems, and aims to provide a wiring device that can effectively utilize the limited space inside the device. [Means for solving the problem]

[0006] A wiring device according to one aspect of the present disclosure includes a first substrate on which a first circuit block is arranged, a second substrate on which a second circuit block is arranged, a case that houses the first substrate and the second substrate, a heat dissipation member arranged between the first substrate and the case, and an insulating sheet that insulates electronic components arranged on the first substrate from the case. The first circuit block includes at least one circuit selected from the group consisting of a circuit that outputs a signal to the second circuit block and a circuit that receives a signal from the second circuit block. The second substrate is electrically connected to the first substrate. The insulating sheet has an opening into which the heat dissipation member is fitted. [Effects of the Invention]

[0007] According to the present disclosure, the limited space within the device can be effectively utilized. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a block diagram showing the configuration of a wiring device according to one embodiment. [Figure 2] FIG. 2 is another block diagram showing the configuration of the wiring device. [Figure 3] FIG. 3 is a perspective view of the wiring fixture. [Figure 4] FIG. 4 is an exploded perspective view of the wiring device. [Figure 5] FIG. 5 is a cross-sectional view taken along line X1-X1 in FIG. [Figure 6] FIG. 6 is a cross-sectional view taken along line X2-X2 in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] The embodiments and modifications described below are merely examples of the present disclosure, and the present disclosure is not limited to the following embodiments and modifications. Various modifications other than the following embodiments and modifications are possible depending on the design, etc., as long as they do not deviate from the technical concept of the present disclosure.

[0010] (Embodiment) A wiring device 1 according to this embodiment will be described below with reference to FIGS.

[0011] (1) Overview The wiring apparatus 1 according to the present embodiment is, for example, a USB outlet to which a USB plug provided at the end of a USB (Universal Serial Bus) cable can be connected, and satisfies the USB-PD (Power Delivery) standard. For example, the wiring apparatus 1 complies with the USB-PD 3.0 or later charging standard. Since the wiring apparatus 1 complies with the USB-PD charging standard, it can output relatively large amounts of power, for example, 240 W (48 V, 5 A) or 100 W (20 V, 5 A). The wiring apparatus 1 according to the present embodiment supplies power to an electrical device (for example, a smartphone) electrically connected to a USB cable. The wiring apparatus 1 according to the present embodiment is an indoor wiring apparatus that is attached to, for example, the wall of a building. The building in which the wiring apparatus 1 is installed may be, for example, a detached house, an apartment building, an office, a store, a nursing home, or the like.

[0012] The wiring device 1 is attached to a construction surface (here, a wall surface of a building) with an electric wire electrically connected to the wiring device 1. In this wiring device 1, a USB plug of a USB cable is inserted into a through-hole 80 (see FIG. 3) formed in the front surface of a cover C2 (see FIG. 3) provided on the wiring device 1, thereby electrically connecting the USB plug and enabling power to be supplied from the wiring device 1 to an electrical device. Here, the wiring device 1 is a flush-mounted wiring device, and is attached to the construction surface using a mounting frame. Specifically, the wiring device 1 is attached to the construction surface by fixing the mounting frame to which the wiring device 1 is attached to, for example, a flush-mounted box. The flush-mounted box here is a box-shaped member with an open front surface, and is installed in a wall so that its front surface is exposed forward through a mounting hole formed in the construction surface.

[0013] 2, the wiring fixture 1 includes a mother board 100 (first board) on which a first circuit block 2 is arranged, and a daughter board 200 (second board) on which a second circuit block 3 is arranged. The first circuit block 2 includes at least one of a circuit that outputs a signal to the second circuit block 3 and a circuit that receives a signal from the second circuit block 3. The daughter board 200 is electrically connected to the mother board 100. In this embodiment, the first circuit block 2 includes both a circuit that outputs a signal to the second circuit block 3 and a circuit that receives a signal from the second circuit block 3.

[0014] According to this configuration, the circuits included in the wiring fixture 1 are arranged separately on the mother board 100 and the daughter board 200. That is, the circuits included in the wiring fixture 1 are divided between the mother board 100 and the daughter board 200. This makes it possible to arrange the daughter board 200 in the space left open when the mother board 100 is arranged. As a result, the limited space within the wiring fixture 1 can be used effectively. This makes it possible to prevent the wiring fixture 1 from becoming larger.

[0015] 5, the wiring fixture 1 includes a substrate (mother substrate 100) on which a plurality of electronic components are arranged, a case (body C3) that houses the substrate, a spacer 9, and a heat dissipation member 60. The spacer 9 is disposed between the substrate and the case and is in contact with the substrate and the case. The heat dissipation member 60 is disposed between the substrate and the case. The substrate, the case, and the spacer 9 are fastened together with screws 6.

[0016] With this configuration, heat generated by multiple electronic components can be dissipated from the case via the heat dissipation member 60. Furthermore, since the board, case, and spacer 9 are fastened together with screws 6, the positioning of the board can be easily performed. Therefore, it is possible to improve heat dissipation while maintaining the internal volume.

[0017] (2) Composition The wiring device 1 according to this embodiment will be described in detail below. In the following description, unless otherwise specified, the up-down, left-right, and front-rear directions of the wiring device 1 are defined by arrows shown in FIGS. 3 to 6. That is, when the wiring device 1 is viewed from the front in a state where it is attached to an installation surface, the vertical direction is defined as the up-down direction, the normal direction to the installation surface is defined as the front-rear direction, and the direction perpendicular to both the up-down direction and the front-rear direction is defined as the left-right direction. However, these directions are not intended to define the direction in which the wiring device 1 is used. Furthermore, the arrows shown in FIGS. 3 to 6 are merely provided to aid in the description and do not have any substance.

[0018] 1, the wiring device 1 according to the present embodiment includes a common filter 10, a diode bridge 20, a normal filter 30, an isolated DC / DC converter 40, and an output circuit 50. The wiring device 1 includes a power supply unit 5 as shown in FIGS. 3 and 4.

[0019] The power supply unit 5 is provided on the lower right side of the wiring device 1. The power supply unit 5 includes a quick-connect terminal. The quick-connect terminal is electrically connected to a distribution board connected to the commercial power supply 1000. The quick-connect terminal is electrically connected to the common filter 10 via wires 5a and 5b.

[0020] The common filter 10 filters the power (current) supplied from the commercial power supply 1000, and passes the current with reduced common mode noise.

[0021] The diode bridge 20 includes a plurality of rectifying diodes 21. The plurality of rectifying diodes 21 form a bridge circuit. The diode bridge 20 rectifies the current that has passed through the common filter 10. The AC power rectified by the diode bridge 20 is converted into DC power by the normal filter 30.

[0022] 4 and 6, the normal filter 30 includes a coil 31 and a plurality of (one in the illustrated example) capacitors 32. The normal filter 30 filters the rectified current and passes the current with reduced normal mode noise. Furthermore, the normal filter 30 converts the AC power rectified by the diode bridge 20 into DC power.

[0023] The isolated DC / DC converter 40 is an active clamp flyback circuit. As shown in FIGS. 1 and 2, the isolated DC / DC converter 40 includes an active clamp circuit having a regenerative capacitor 41, an isolation transformer 42, and a switching device 43. As shown in FIG. 1, the switching device 43 includes, for example, a GaN device. Note that the switching device 43 may also be an IGBT (Insulated Gate Bipolar Transistor) or a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). The isolated DC / DC converter 40 converts DC power with reduced common-mode noise and normal-mode noise into DC power of a predetermined voltage. For example, the isolated DC / DC converter 40 converts DC power with a voltage of 20 V into DC power with a voltage of 5 V. Alternatively, the isolated DC / DC converter 40 converts DC power with a voltage of 5 V into DC power with a voltage of 20 V. Note that the switching device 43 is omitted in FIGS. 4 to 6.

[0024] As shown in FIG. 5 , the output circuit 50 includes a plurality of output terminals 51 (two in the illustrated example). The output terminal 51 is, for example, a USB socket. The output terminal 51 is, for example, a USB Type-C terminal. The output terminal 51 is electrically connected to the isolated DC / DC converter 40. The output terminal 51 can be connected to a USB plug of a USB cable. When the USB plug of the USB cable is connected to the output terminal 51, it becomes possible to supply power of a predetermined voltage to an electrical device.

[0025] 2, the wiring device 1 includes a mother board 100 on which a first circuit block 2 is arranged, and a daughter board 200 on which a second circuit block 3 is arranged. The first circuit block 2 includes at least one circuit selected from a circuit that outputs a signal to the second circuit block 3 and a circuit that receives a signal from the second circuit block 3. The daughter board 200 is electrically connected to the mother board 100.

[0026] The mother board 100 is a printed wiring board including, for example, an insulating plate made of glass-epoxy resin and a pattern conductor formed on the insulating plate. A plurality of electronic components are arranged on the mother board 100. The plurality of electronic components include a switching device 43 and one or more heat-generating components 4. Here, the plurality of heat-generating components 4 are components that generate heat at a predetermined value or more. The plurality of heat-generating components 4 include a diode bridge 20. The diode bridge 20 includes a rectifying diode 21. That is, the plurality of heat-generating components 4 include the rectifying diodes 21. The diode bridge 20 may be packaged with the plurality of rectifying diodes 21. In this case, the packaged diode bridge 20 is arranged on the mother board 100. The plurality of heat-generating components 4 also include an isolation transformer 42. That is, the first circuit block 2 includes a plurality of electronic components. In other words, the first circuit block 2 includes the rectifying diode 21 and the isolation transformer 42. Here, the circuit included in the first circuit block 2 and outputting a signal to the second circuit block 3 corresponds to a circuit configured of rectifying diodes 21, i.e., the diode bridge 20. The circuit included in the first circuit block 2 and receiving a signal from the second circuit block 3 corresponds to a circuit that configures the diode bridge 20 and the isolation transformer 42.

[0027] Substrate 200 includes first substrate 201 (third substrate) and second substrate 202 (fourth substrate). First substrate 201 and second substrate 202 are printed wiring boards including, for example, an insulating plate made of glass-epoxy resin and pattern conductors formed on the insulating plate.

[0028] Second circuit block 3 includes at least some of the common filter functions of common filter 10. Here, circuits including all of the common filter functions are arranged on first daughter board 201. In other words, all of the circuits that make up common filter 10 are arranged on first daughter board 201.

[0029] The second circuit block 3 includes at least a portion of the normal filter functions of the normal filter 30. Here, a portion of the circuits for the normal filter functions is arranged on the second daughter board 202. That is, a portion of the circuits constituting the normal filter 30 is arranged on the second daughter board 202. For example, the remaining circuits constituting the normal filter 30 are arranged on the mother board 100.

[0030] In other words, second circuit block 3 includes a first function that is at least a part of the common filter function, and a second function that is at least a part of the normal filter function. A circuit that constitutes the first function of second circuit block 3 is arranged on first daughter board 201. A circuit that constitutes the second function of second circuit block 3 is arranged on second daughter board 202. In this embodiment, the first function is all of the common filter function, and the second function is all of the normal filter function.

[0031] Also, the second daughter board 202 is provided with a regenerative capacitor 41 included in the isolated DC / DC converter 40. In other words, some of the functions of the isolated DC / DC converter 40 are provided on the second daughter board 202. In this embodiment, heat-generating components among the electronic components that make up the isolated DC / DC converter 40 are provided on the mother board 100, and the other electronic components are provided on the daughter board 200. In other words, the other electronic components provided on the daughter board 200 are provided with a regenerative capacitor 41 included in the isolated DC / DC converter 40. In this embodiment, heat-generating components among the electronic components that make up the isolated DC / DC converter 40 are provided on the mother board 100, and the other electronic components are provided on the daughter board 200. The electronic components include electronic components that generate less than a predetermined heat value. Note that all of the functions of the isolated DC / DC converter 40 may be arranged on the main board 100. In other words, the regenerative capacitor 41 may be arranged on the main board 100.

[0032] Daughter boards 200 (first daughter board 201, second daughter board 202) are provided with multiple pin connectors 210 for connection to mother board 100. Mother board 100 is also provided with multiple connection portions 110 for inserting the multiple pin connectors 210 provided on first daughter board 201 and second daughter board 202. That is, mother board 100 and daughter board 200 are electrically connected by inserting the multiple pin connectors 210 into the multiple connection portions 110 in a one-to-one relationship. The multiple pin connectors 210 of first daughter board 201 (one in FIG. 5) are located behind first daughter board 201. The multiple pin connectors 210 of second daughter board 202 (one in FIG. 6) are located behind second daughter board 202. The multiple connection portion 110 (one in FIG. 5) that connects to the multiple pin connectors 210 of first daughter board 201 is located below mother board 100. That is, first daughter board 201 is electrically connected to mother board 100 below mother board 100. Multiple connection parts 110 (one in FIG. 6) that connect to multiple pin connectors 210 of second daughter board 202 are arranged at the upper left end of mother board 100. That is, second daughter board 202 is electrically connected to mother board 100 at the upper left end of mother board 100.

[0033] When the mother board 100 and the daughter board 200 are connected by pin connectors 210, the normal line A1 of the mother board 100 intersects with the normal line of the daughter board 200. Specifically, the normal line A1 of the mother board 100 intersects with the normal line A2 of the first daughter board 201, and the normal line A1 of the mother board 100 intersects with the normal line A3 of the second daughter board 202.

[0034] 2 and 5, the wiring device 1 includes an output circuit board 300. The output circuit board 300 is a printed wiring board including, for example, an insulating plate made of glass-epoxy resin and a pattern conductor formed on the insulating plate. An output circuit 50 is disposed on the output circuit board 300. That is, a plurality of output terminals 51 are disposed on the output circuit board 300.

[0035] As shown in FIG. 3, the wiring device 1 includes a housing C1. The housing C1 includes a cover C2 and a body C3 (case). The body C3 is formed in a box shape with one side (front) open. The cover C2 is attached to the body C3 so as to close the opening. In this embodiment, the cover C2 is attached to the body C3 by being fastened with a plurality of screws 8. The cover C2 is made of PBT (polybutylene terephthalate) resin. The body C3 is made of aluminum die-cast.

[0036] The cover C2 has a plurality of through holes 80 (two in the illustrated example). The through holes 80 correspond one-to-one to the output terminals 51. When the wiring apparatus 1 is assembled, the output terminals 51 face the through holes 80 of the cover C2, respectively. Therefore, by inserting a USB plug of a USB cable into the through hole 80, the USB plug is electrically connected to the output terminal 51, enabling power to be supplied from the wiring apparatus 1 to an electrical device.

[0037] The cover C2 houses the main board 100 and the sub board 200. The body C3 houses the output circuit board 300.

[0038] The wiring fixture 1 also includes a spacer 9 and a heat dissipation member 60. The wiring fixture 1 further includes a screw 6 and a nut .

[0039] The spacer 9 is molded from resin. For example, the spacer 9 is molded from PBT resin. The spacer 9 has a rectangular cylindrical shape. The spacer 9 is disposed between the mother board 100 and the body C3 (case), and is in contact with the mother board 100 and the body C3 when the wiring device 1 is assembled. The mother board 100, the body C3, and the spacer 9 are fastened together with screws 6. Fastening the mother board 100, the body C3, and the spacer 9 together with the screws 6 makes it easy to position the mother board 100.

[0040] The mother board 100 (board), body C3 (case), and spacer 9 are fastened together by screws 6 and nuts 7. The screws 6 are, for example, flat head machine screws 6a, and are molded from resin. The nuts 7 are also molded from resin and are used in combination with the screws 6. For example, the screws 6 and nuts 7 are molded from PBT resin.

[0041] A countersunk hole 81 is formed in the bottom C31 of the body C3, penetrating in the front-to-rear direction. Furthermore, a through-hole 101 is formed in the mother board 100, penetrating in the front-to-rear direction. A screw 6 is inserted successively through the countersunk hole 81 of the body C3, the spacer 9, and the through-hole of the mother board 100. The screw 6 inserted through the countersunk hole 81 of the body C3, the spacer 9, and the through-hole of the mother board 100 is combined with a nut 7, thereby fastening the mother board 100, the body C3, and the spacer 9 together. As a result, the mother board 100 is fixed to the housing C1 by the screw 6, and the distance between the bottom C31 of the body C3 and the mother board 100 in the front-to-rear direction is maintained at the dimension of the spacer 9.

[0042] The heat dissipation member 60 is disposed between the mother board 100 and the body C3 (case). The heat dissipation member 60 is, for example, a thermal sheet made of elastic silicone. The heat dissipation member 60 dissipates heat from the heat-generating components 4 disposed on the mother board 100 to the outside via the body C3. In this embodiment, multiple heat dissipation members 60 (three in FIG. 4 ) are disposed between the mother board 100 and the body C3 (case). That is, the daughter board 200 is disposed on the opposite side of the mother board 100 from the heat dissipation members 60. When the mother board 100 is viewed from the front-to-rear direction, the multiple heat dissipation members 60 overlap at least a portion of the mother board 100 (see FIGS. 4 and 5 ). More specifically, at least a portion of at least one of the multiple heat dissipation members 60 (e.g., heat dissipation member 61) overlaps at least a portion of the heat-generating component 4 (e.g., isolation transformer 42) disposed on the mother board 100 (substrate). The wiring device 1 may be configured to include one heat dissipation member 60.

[0043] The mother board 100 (board), the body C3 (case), and the spacer 9 are fastened together with the screws 6 and nuts 7, so that the heat dissipation member 60 is compressed by the mother board 100 and the bottom C31 of the body C3. This improves the heat dissipation of the heat-generating components 4, which are electronic components arranged on the mother board 100.

[0044] As described above, a plurality of electronic components are arranged on the mother board 100. The plurality of electronic components include heat-generating components arranged between the mother board 100 (board) and the body C3 (case). The heat dissipation member 60 is provided to cover the heat-generating components arranged between the mother board 100 and the body C3. The heat-generating components arranged between the mother board 100 and the body C3 are, for example, rectifying diodes 21 (see FIGS. 4 and 5).

[0045] As shown in Figures 4 to 6, the wiring device 1 includes a plurality of insulating sheets 70. The plurality of insulating sheets 70 insulates between electronic components arranged on the mother board 100 or the daughter board 200 and other components or members. The plurality of insulating sheets 70 includes a first insulating sheet 71, a second insulating sheet 72, and a third insulating sheet 73.

[0046] The first insulating sheet 71 includes a side sheet 75 that covers the side surface C32 of the body C3, and a bottom sheet 76 that covers the bottom surface C31 of the body C3. That is, the first insulating sheet 71 insulates the body C3 from the electronic components arranged on the mother board 100 and the electronic components arranged on the daughter boards 200 (first daughter board 201, second daughter board 202). The first insulating sheet 71 has a plurality of openings formed therein. The openings correspond one-to-one to the heat dissipation members 60. A corresponding heat dissipation member 60 is fitted into each of the openings. That is, the heat dissipation member 60 comes into contact with the bottom surface of the body C3 (see FIGS. 5 and 6).

[0047] Second insulating sheet 72 is disposed between isolation transformer 42 and output circuit board 300 so as to cover the front of isolation transformer 42 disposed on mother board 100. In other words, second insulating sheet 72 provides insulation between isolation transformer 42, which is an electronic component disposed on mother board 100, and output circuit board 300.

[0048] Third insulating sheet 73 is disposed between common filter 10 and output circuit board 300 so as to cover the front of common filter 10 disposed on first daughter board 201. That is, third insulating sheet 73 provides insulation between common filter 10, which is an electronic component disposed on daughter board 200 (first daughter board 201), and output circuit board 300.

[0049] The wiring device 1 may be configured to include only one insulating sheet 70, for example, only the first insulating sheet 71.

[0050] (3) Effects As described above, the wiring fixture 1 according to this embodiment includes a mother board 100 (first board) on which the first circuit block 2 is arranged, and a daughter board 200 (second board) on which the second circuit block 3 is arranged. The first circuit block 2 includes at least one circuit selected from a circuit that outputs a signal to the second circuit block 3 and a circuit that receives a signal from the second circuit block 3. The daughter board 200 is electrically connected to the mother board 100. In this embodiment, the first circuit block 2 includes both a circuit that outputs a signal to the second circuit block 3 and a circuit that receives a signal from the second circuit block 3.

[0051] According to this configuration, the circuits included in the wiring fixture 1 are arranged separately on the mother board 100 and the daughter board 200. That is, the circuits included in the wiring fixture 1 are divided between the mother board 100 and the daughter board 200. This makes it possible to arrange the daughter board 200 in the space left open when the mother board 100 is arranged. As a result, the limited space within the wiring fixture 1 can be used effectively. This makes it possible to prevent the wiring fixture 1 from becoming larger.

[0052] The wiring fixture 1 according to this embodiment also includes a substrate (mother substrate 100) on which multiple electronic components are arranged, a case (body C3) that houses the substrate, a spacer 9, and a heat dissipation member 60. The spacer 9 is disposed between the substrate and the case and is in contact with the substrate and the case. The heat dissipation member 60 is disposed between the substrate and the case. The substrate, the case, and the spacer 9 are fastened together with screws 6.

[0053] With this configuration, heat generated by multiple electronic components can be dissipated from the case via the heat dissipation member. Furthermore, because the board, case, and spacer 9 are fastened together with screws 6, the board can be easily positioned while compressing the heat dissipation member 60. This allows for improved heat dissipation while maintaining the internal volume.

[0054] (4) Variations The following are examples of modifications: The modifications described below can be applied in appropriate combination with the above-described embodiment.

[0055] In the embodiment, the mother board 100 and the body C3 are configured to be fastened together at one location by a screw via a spacer 9, but this configuration is not limiting. The mother board 100 and the body C3 may be fastened together by a screw 6 (flat head machine screw 6a) via a plurality of spacers 9 corresponding to each of the plurality of screw fastening locations provided.

[0056] The screw 6 may be a type of screw other than the countersunk head screw 6a.

[0057] In the embodiment, the daughter board 200 is configured to include a first daughter board 201 and a second daughter board 202, but is not limited to this configuration. There may be only one daughter board 200. In this case, both the common filter 10 and the normal filter may be arranged on one daughter board 200. Alternatively, one daughter board 200 may have either the common filter 10 or the normal filter arranged on it. When one daughter board 200 has either the common filter 10 or the normal filter arranged on it, the other is arranged on the mother board 100.

[0058] In the embodiment, daughter boards 200 (first daughter board 201, second daughter board 202) are configured to be electrically connected to mother board 100 via multiple pin connectors 210, but this configuration is not limiting. Daughter boards 200 (first daughter board 201, second daughter board 202) may also be electrically connected to mother board 100 via a single pin connector 210. Alternatively, daughter boards 200 (first daughter board 201, second daughter board 202) may be electrically connected to mother board 100 via one or more wires.

[0059] (5) Summary Based on the above-described embodiments, the present specification discloses the following aspects.

[0060] (5.1) First Summary The wiring device (1) of the first aspect includes a first substrate (mother substrate 100) on which a first circuit block (2) is arranged, and a second substrate (daughter substrate 200) on which a second circuit block (3) is arranged. The first circuit block (2) includes at least one circuit selected from the group consisting of a circuit that outputs a signal to the second circuit block (3) and a circuit that receives a signal from the second circuit block (3). The second substrate is electrically connected to the first substrate.

[0061] This configuration allows the second board to be placed in the empty space left behind when the first board is placed, thereby making it possible to effectively utilize the limited space within the wiring device 1. This prevents the wiring device 1 from becoming too large.

[0062] In the wiring device (1) of the second aspect, in the first aspect, the normal line (A1) of the first substrate and the normal lines (A2, A3) of the second substrate intersect.

[0063] This configuration allows for effective use of the limited space within the wiring device (1).

[0064] In the wiring device (1) of the third aspect, the first board and the second board are connected by a pin connector (210) in the second aspect.

[0065] With this configuration, the first substrate and the second substrate can be easily connected.

[0066] In the wiring device (1) of the fourth aspect, in any one of the first to third aspects, the first circuit block (2) includes a plurality of heat-generating components (4).

[0067] This configuration allows a plurality of heat generating components (4) to be arranged on one board.

[0068] In the wiring device (1) of the fifth aspect, in the fourth aspect, the plurality of heat-generating components (4) include rectifying diodes (21).

[0069] According to this configuration, the rectifier diode (21) can be arranged together with the other heat generating components (4) on one board.

[0070] In the wiring device (1) of the sixth aspect, in the fourth or fifth aspect, the plurality of heat-generating components (4) includes an insulating transformer (42).

[0071] This configuration allows the isolation transformer (42) to be mounted together with the other heat-generating components (4) on one board.

[0072] In the wiring fixture (1) of a seventh aspect, in any one of the fourth to sixth aspects, the plurality of electronic components includes a switching device (43).

[0073] According to this configuration, the switching device (43) can be arranged together with other heat generating components (4) on one board.

[0074] In the wiring device (1) of the eighth embodiment, in the seventh embodiment, the switching device (43) includes a GaN device (44).

[0075] This configuration allows the GaN device (44) to be placed on one substrate together with other heat-generating components (4).

[0076] In the wiring device (1) of the ninth aspect, in any one of the first to eighth aspects, the second circuit block (3) includes at least a part of the common filter function.

[0077] According to this configuration, at least a part of the function of the common filter (10) can be included in the second circuit block (3).

[0078] In the wiring device (1) of a tenth aspect, in any one of the first to eighth aspects, the second circuit block (3) includes at least a part of the normal filter function.

[0079] According to this configuration, at least a part of the function of the normal filter (30) can be included in the second circuit block (3).

[0080] In the wiring device (1) of an eleventh aspect, in any one of the first to eighth aspects, the second substrate includes a third substrate (first daughter substrate 201) and a fourth substrate (second daughter substrate 202). The second circuit block (3) includes a first function that is at least a part of the common filter function and a second function that is at least a part of the normal filter function. A circuit that constitutes the first function of the second circuit block (3) is arranged on the third substrate. A circuit that constitutes the second function of the second circuit block (3) is arranged on the fourth substrate.

[0081] According to this configuration, the first function of the common filter (10) and the second function of the normal filter (30) can be included in the second circuit block (3).

[0082] The wiring device (1) of a twelfth aspect is any of the first to eleventh aspects, and further includes a case (for example, a body C3) and a heat dissipation member (60). The case houses a first board and a second board. The heat dissipation member (60) is disposed between the case and the first board. The second board is disposed on the opposite side of the first board from the heat dissipation member (60).

[0083] This configuration allows for effective use of the limited space within the wiring device (1).

[0084] (5.2) Second Summary The wiring device (1) of the first aspect includes a substrate (e.g., a mother substrate 100) on which a plurality of electronic components are arranged, a case (e.g., a body C3) that houses the substrate, a spacer (9), and a heat dissipation member (60). The spacer (9) is disposed between the substrate and the case and is in contact with the substrate and the case. The heat dissipation member (60) is disposed between the substrate and the case. The substrate, the case, and the spacer (9) are fastened together with screws (6).

[0085] This configuration allows heat generated by multiple electronic components to be dissipated from the case via the heat dissipation member. Furthermore, the board, case, and spacer 9 are fastened together with screws 6, making it easy to position the board. This allows for improved heat dissipation while maintaining the internal volume.

[0086] In the wiring device 1 of the second aspect, the board, the case, and the spacer 9 of the first aspect are fastened together by screws 6 and nuts 7. The screws 6, nuts 7, and spacer 9 are molded from resin.

[0087] According to this configuration, the screws (6), nuts (7) and spacers (9) are made of resin, so that an insulating distance can be ensured.

[0088] In the wiring device (1) of the third embodiment, the screw (6) in the second embodiment is a flat head machine screw (6a). A countersunk hole (81) is formed in the case.

[0089] According to this configuration, by using flat head machine screws (6a) as the screws (6), it is possible to prevent the screws (6) from protruding from the case.

[0090] In the wiring device (1) of the fourth aspect, in any one of the first to third aspects, the plurality of electronic components includes a rectifying diode (21).

[0091] This configuration improves the heat dissipation of the rectifier diode (21).

[0092] In the wiring device (1) of a fifth aspect, in any one of the first to fourth aspects, the plurality of electronic components includes an isolation transformer (42).

[0093] This configuration improves the heat dissipation of the isolation transformer (42).

[0094] In the wiring device (1) of the sixth aspect, in any one of the first to fifth aspects, the plurality of electronic components includes a switching device (43).

[0095] This configuration improves the heat dissipation of the switching device (43).

[0096] In the wiring device (1) of the seventh embodiment, in the sixth embodiment, the switching device (43) includes a GaN device (44).

[0097] This configuration can improve the heat dissipation of the GaN device (44).

[0098] In the wiring device (1) of the eighth aspect, in any one of the first to seventh aspects, the case is formed by aluminum die-casting.

[0099] This configuration can improve the efficiency of heat dissipation.

[0100] In a wiring device (1) of a ninth aspect, in any one of the first to eighth aspects, the plurality of electronic components includes a heat-generating component (4) disposed between the board and the case, and the heat-dissipating member (60) is provided so as to cover the heat-generating component (4).

[0101] This configuration improves the heat dissipation of the heat-generating component (4) covered with the heat dissipation member (60).

[0102] In a wiring device (1) of a tenth aspect, in any one of the first to ninth aspects, the plurality of electronic components includes a heat-generating component (4). When the board is viewed from above, at least a portion of the heat-dissipating member (60) overlaps with at least a portion of the heat-generating component (4) provided on the board.

[0103] This configuration improves the heat dissipation of the heat generating components (4) mounted on the board. [Explanation of symbols]

[0104] 1 Wiring devices 2. First Circuit Block 3 Second circuit block 4 Heat-generating components 6 screws 6a flat head machine screw 7 Nuts 9 Spacers 10 Common Filter 21 Rectifier diode 30 Normal Filter 42 Isolation transformer 43 Switching Devices 44 GaN devices 60 Heat dissipation material 61 Heat dissipation material 81 Countersunk Hole 100 mother board (board, first board) 200 Sub-board (second board) 201 1st daughter board (3rd board) 202 Second daughter board (fourth board) 210-pin connector A1 Normal A2 normal A3 normal C3 Body (Case)

Claims

1. a first substrate on which a first circuit block is disposed; a second substrate on which a second circuit block is disposed; a case that accommodates the first substrate and the second substrate; a heat dissipation member disposed between the first substrate and the case; an insulating sheet that insulates between the electronic components arranged on the first substrate and the case, the first circuit block includes at least one circuit selected from a circuit that outputs a signal to the second circuit block and a circuit that receives a signal from the second circuit block; the second substrate is electrically connected to the first substrate; The insulating sheet is provided with an opening into which the heat dissipation member is fitted. Wiring equipment.

2. a normal to the first substrate and a normal to the second substrate intersect with each other; The wiring device according to claim 1 .

3. The first board and the second board are connected by a pin connector. The wiring device according to claim 2 .

4. the first circuit block includes a plurality of heat-generating components; The wiring device according to any one of claims 1 to 3.

5. the plurality of heat-generating components include rectifying diodes; The wiring device according to claim 4.

6. the plurality of heat-generating components include an isolation transformer; The wiring device according to claim 4 or 5.

7. the plurality of heat-generating components include a switching device; The wiring device according to any one of claims 4 to 6.

8. the switching device comprises a GaN device. The wiring device according to claim 7.

9. the second circuit block includes at least a part of a common filter function; The wiring device according to any one of claims 1 to 8.

10. the second circuit block includes at least a part of a normal filter function; The wiring device according to any one of claims 1 to 8.

11. the second substrate includes a third substrate and a fourth substrate, the second circuit block includes a first function that is at least a part of a common filter function and a second function that is at least a part of a normal filter function; a circuit that configures the first function of the second circuit block is disposed on the third substrate; a circuit that configures the second function of the second circuit block is disposed on the fourth substrate; The wiring device according to any one of claims 1 to 8.

12. the second substrate is disposed on the opposite side of the first substrate from the heat dissipation member; The wiring device according to any one of claims 1 to 11.

Images