Mounting decision device

Abstract

To determine whether implementation is performed with good accuracy using simple processing.SOLUTION: A decision implementation device that determines whether multiple pins can be inserted into the corresponding pin holes when mounting a component having multiple pins with a circular or oval cross section on a board having multiple pin holes with a circular or oval shape obtains an image of the component, process the acquired images to find the center position of the tips of multiple pins, obtains the diameter difference between the pin diameter and the pin hole diameter, and determines for each of the pins, implementation can be performed by determining whether the center position of the tip of the pin is included in a circular or elliptical region with a diameter corresponding to the diameter difference centered on the ideal position of the pin.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present disclosure relates to a mounting feasibility determination device. [Background technology]

[0002] Conventionally, there has been known a component insertion device that inserts multiple leads provided on a component into multiple holes provided on a board. For example, Patent Document 1 discloses a device that compares the positions of the leads of a component obtained from a camera image with insertion hole position information stored in a memory, and if the two match, inserts the component into the board, and if there is a misalignment, corrects (deforms) the corresponding leads before inserting the component into the board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 3-278600 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the component insertion device disclosed in Patent Document 1 does not consider the allowable range of the amount of lead bending.

[0005] The main object of the present disclosure is to determine with high accuracy whether a component having a pin with a circular or elliptical cross section can be mounted on a board having multiple circular or elliptical pin holes using a simple process. [Means for solving the problem]

[0006] The present disclosure has adopted the following means to achieve the above-mentioned main object.

[0007] The mounting feasibility determination device of the present disclosure includes: 1. A mountability determination device for determining whether a component having a plurality of pins with a circular or elliptical cross section can be inserted into a corresponding pin hole when the component has a plurality of pins with a circular or elliptical cross section and a substrate having a plurality of pin holes with a circular or elliptical cross section, acquiring an image of the component, and processing the acquired image to determine the center positions of the tips of the plurality of pins; A diameter difference between the diameter of the pin and the diameter of the pin hole is obtained; determining whether or not the center position of the tip of each pin is included in a circular or elliptical area having a diameter corresponding to the diameter difference and centered on the ideal position of the pin, thereby determining whether or not the pin can be mounted; The gist of this is as follows.

[0008] This mountability determination device defines a circular or elliptical area for each pin, with the ideal pin position as the center and a diameter corresponding to the diameter difference between the pin and the pinhole, as the allowable area, and determines whether the center position of the pin's tip is included in the allowable area. This allows for easy and accurate mountability determination. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic configuration diagram of a component mounting system 1. FIG. [Figure 2] FIG. 1 is a schematic configuration diagram of a component mounter 10. [Figure 3] FIG. 2 is a perspective view of a part camera 24 and a pin light source 26. [Figure 4] 2 is a block diagram showing the electrical connections of the component mounter 10. FIG. [Figure 5] 10 is a flowchart illustrating an example of an inspection mode determination routine. [Figure 6] FIG. 10 is an explanatory diagram showing an example of an inspection mode selection image Im1. [Figure 7] 10 is a flowchart illustrating an example of a component mounting routine. [Figure 8] 10 is a flowchart showing an example of a pin bent inspection subroutine. [Figure 9] FIG. 10 is an explanatory diagram showing an example of a binarized image Im2. [Figure 10] FIG. 10 is an explanatory diagram showing an example of an allowable range T. [Figure 11] 10 is an explanatory diagram showing a state in which the amount of bending of the pin P is within an allowable range. FIG. [Figure 12] 10 is an explanatory diagram showing a state in which the amount of bending of the pin P is not within the allowable range. FIG. [Figure 13] FIG. 10 is an explanatory diagram for determining whether or not component C can be mounted. [Figure 14] 10 is a flowchart showing a modified example of the bent pin inspection subroutine. [Figure 15] 10 is an explanatory diagram showing a modified example of the allowable range T. FIG. [Figure 16] 10 is an explanatory diagram showing how to determine whether the amount of bending of a pin P is within an allowable range. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] Next, embodiments of the present disclosure will be described with reference to the drawings.

[0011] Fig. 1 is a schematic configuration diagram of a component mounting system 1. Fig. 2 is a schematic configuration diagram of a component mounter 10. Fig. 3 is a perspective view of a part camera 24 and a pin light source 26. Fig. 4 is a block diagram showing the electrical connection relationship of the component mounter 10. The left-right direction (X-axis direction), front-rear direction (Y-axis direction), and up-down direction (Z-axis direction) are as shown in Figs. 1 to 3.

[0012] As shown in Fig. 1, the component mounting system 1 includes a component mounting line 2 and a management device 70 (see Fig. 4). The component mounting line 2 is configured by arranging a plurality of component mounters 10 along the X direction. After the board S is carried into the component mounter 10 arranged on the far left, components C are mounted on the board S by each component mounter 10. The board S is then transported to the right and is then carried out of the component mounter 10 arranged on the far right.

[0013] The component mounter 10 takes out components C supplied from a component supply device 21 and mounts them on a board S. In this embodiment, the component C (e.g., a connector) has a plurality of pins P (e.g., pins with a circular or elliptical cross-sectional shape) arranged at predetermined intervals on its back surface, and inserts each pin P of the component C (e.g., a connector) into a corresponding pin hole H of a board S having a plurality of pin holes H arranged at predetermined intervals. As shown in FIG. 2, the component mounter 10 includes a component supply device 21, a transport device 22, a head moving device 30, a head 40, a part camera 24, a mark camera 25, a pin light source 26 (see FIG. 3), a display device 27, a disposal box 28, and a control device 60 (corresponding to the mounting feasibility determination device of the present disclosure, see FIG. 4).

[0014] The component supply device 21 may be, for example, a tray supply device that supplies a tray having a large number of storage pockets for storing the components C.

[0015] The transport device 22 drives a pair of conveyor belts to transport the substrate S as the object to be inserted from left to right. The transport device 22 has, for example, a pair of conveyor belts that are installed at a predetermined interval in the front-to-back direction (Y-axis direction) and span across the left and right (X-axis direction).

[0016] The head moving device 30 moves the head 40 in the front-to-back and left-to-right directions (X and Y axes), and as shown in FIG. 2, includes an X-axis slider 32 and a Y-axis slider 34. The X-axis slider 32 is supported by a pair of upper and lower X-axis guide rails 33 installed in front of the Y-axis slider 34 to extend in the left-to-right direction (X axis direction). The X-axis slider 32 moves in the X axis direction along the X-axis guide rails 33 by driving an X-axis actuator 36 (see FIG. 4). The Y-axis slider 34 is supported by a pair of left and right Y-axis guide rails 35 installed in the upper part of the housing 12 to extend in the front-to-back direction (Y axis direction). The Y-axis slider 34 moves in the Y axis direction along the Y-axis guide rails 35 by driving a Y-axis actuator 38 (see FIG. 4). The position of the X-axis slider 32 in the X axis direction is detected by an X-axis position sensor 37 (see FIG. 4). Furthermore, the position of Y-axis slider 34 in the Y-axis direction is detected by Y-axis position sensor 39 (see FIG. 4). A head 40 is attached to X-axis slider 32. Therefore, head 40 moves along the XY plane (horizontal plane) by driving and controlling head moving device 30 (X-axis actuator 36 and Y-axis actuator 38).

[0017] The head 40 is equipped with a suction nozzle 41 that picks up (suctions) and holds the component C. Although not shown, a negative pressure source is connected to the suction nozzle 41 via an electromagnetic valve (open / close valve), and the suction nozzle 41 receives negative pressure from the negative pressure source to pick up the component C. The suction nozzle 41 moves up and down (in the Z-axis direction) by being driven by a Z-axis actuator 42 (see FIG. 4). The position in the Z-axis direction is detected by a Z-axis position sensor 43 (see FIG. 4).

[0018] When a component C supplied by the component supply device 21 is picked up and mounted (inserted) onto the board S transported by the transport device 22, the part camera 24 captures an image of the component C from below as the component C passes above the part camera 24. As shown in FIG. 2, the part camera 24 is installed between the component supply device 21 and the transport device 22. The image captured by the part camera 24 is used to determine the amount of positional deviation of the component C held by the suction nozzle 41 relative to the suction nozzle 41, and to calculate the amount of bending of the pins P when determining whether each pin P of the component C can be inserted into the corresponding pin hole H of the board S.

[0019] Mark camera 25 captures images from above of board S carried in by transport device 22 and components C supplied by component supply device 21. As shown in FIG. 2, mark camera 25 is attached to X-axis slider 32, and moves in the X and Y-axis directions together with head 40 by head moving device 30. The image captured by mark camera 25 is output to control device 60.

[0020] Pin light sources 26 irradiate light onto component C (tips of pins P) from the side when part camera 24 captures an image of component C. Pin light sources 26 irradiate laser light in a direction perpendicular to the optical axis of part camera 24. Four pin light sources 26 are attached to the top surface of part camera 24 at 90° intervals.

[0021] The display device 27 is a device that displays status information regarding the state of the component mounter 10, work information regarding setup changes and replenishment of components C due to component shortages, etc. The display device 27 is, for example, a liquid crystal display. As shown in FIGS. 1 and 2, the display device 27 is attached to the upper front of the housing 12. In this embodiment, the display device 27 has a touch panel attached to the screen so that it can be operated by an operator.

[0022] The disposal box 28 is a box for disposing of the abnormal part C. The disposal box 28 is installed adjacent to the part camera 24 between the part supply device 21 and the transport device 22.

[0023] As shown in FIG. 4, the control device 60 is configured as a microprocessor centered around a CPU 61. In addition to the CPU 61, the control device 60 also includes a ROM 62, a storage (e.g., an HDD or SSD) 63, a RAM 64, and an input / output interface 65. These are electrically connected via a bus 66. Position signals from the X-axis position sensor 37, the Y-axis position sensor 39, and the Z-axis position sensor 43 are input to the control device 60. Image signals from the parts camera 24 and the mark camera 25 are also input to the control device 60. An operation signal is also input to the display device 27 (touch panel). The control device 60 outputs drive signals to the component supply device 21, the conveying device 22, the X-axis actuator 36, the Y-axis actuator 38, and the Z-axis actuator 42. The control device 60 also outputs control signals to the parts camera 24, the mark camera 25, the pin light source 26, and the display device 27.

[0024] As shown in Fig. 4, the management device 70 is configured as a microprocessor centered around a CPU 71, and in addition to the CPU 71, it is equipped with a ROM 72, a storage 73, and a RAM 64. The management device 70 is connected to the control device 60 so that it can communicate with the control device 60. The storage 73 stores shape data for each component C to be mounted on the board S. The storage 73 also stores a production schedule. The production schedule stores information such as which components C should be mounted on the board S and in what order in the component mounter 10, and how many boards S (products) mounted in this way should be produced. The shape data will be described later.

[0025] Next, the operation of the component mounter 10 configured as described above will be described. When the component mounter 10 mounts a component C picked up by the suction nozzle 41 on the board S, the component C is imaged from below by the part camera 24, and the amount of bending of the pins P is determined based on the image captured by the part camera 24 to determine whether the amount of bending of the pins P is within the tolerance range T. This determines whether each pin P of the component C can be inserted into the corresponding pin hole H of the board S, i.e., whether the component C can be mounted on the board S. First, the inspection mode determination process for determining the shape within the tolerance range T will be described with reference to FIGS. 5 and 6. FIG. 5 is a flowchart illustrating an example of the inspection mode determination routine. FIG. 6 is an explanatory diagram illustrating an example of the inspection mode selection image Im1. This process is executed by the CPU 61 of the control device 60 upon receiving a start instruction from the operator before the component mounting routine, which will be described later, is executed. In this embodiment, the cross-sectional shape of the pin P and the shape of the pin hole H are both circular.

[0026] When this routine starts, the CPU 61 of the control device 60 causes the display device 27 to display an inspection mode selection image Im1 as shown in FIG. 6 (S100). When the inspection mode selection image Im1 is displayed on the display device 27, the operator selects an inspection mode. When the operator selects an inspection mode, the CPU 61 accepts the selection of the inspection mode from the operator (S110). Then, the CPU 61 stores the shape of the allowable range T (inspection mode) accepted from the operator in the storage 63 (S120). After S120, the CPU 61 ends this routine.

[0027] Next, the component mounting process performed by the component mounter 10 will be described with reference to FIGS. 7 to 13. FIG. 7 is a flowchart showing an example of a component mounting routine. FIG. 8 is a flowchart showing an example of a pin bend inspection subroutine. FIG. 9 is an explanatory diagram showing an example of a binarized image Im2. FIG. 10 is an explanatory diagram showing an example of the allowable range T. FIG. 11 is an explanatory diagram showing a state in which the amount of bend of the pin P is within the allowable range T. FIG. 12 is an explanatory diagram showing a state in which the amount of bend of the pin P is not within the allowable range T. FIG. 13 is an explanatory diagram when determining whether or not the component C can be mounted. The component mounting routine is executed by the CPU 61 of the control device 60 when an instruction to start production is received from a management device 70 (not shown) in accordance with a production schedule.

[0028] When this routine starts, the CPU 61 of the control device 60 first controls the transport device 22 so that the substrate S is carried to a predetermined position, and also controls a substrate fixing device (not shown) so that the substrate S is fixed at the predetermined position (S200). Next, the CPU 61 causes the suction nozzle 41 to pick up the component C supplied from the component supply device 21 (S210). Specifically, the CPU 61 controls the head moving device 30 (X-axis actuator 36 and Y-axis actuator 38) so that the suction nozzle 41 moves above the supply position of the component C by the component supply device 21, and then controls the Z-axis actuator 42 so that the suction nozzle 41 moves down, and also controls the solenoid valve so that negative pressure is supplied to the suction nozzle 41.

[0029] Next, the CPU 61 turns on the pin light source 26 (S220) and causes the part camera 24 to capture an image of the underside of the component C picked up by the suction nozzle 41 (S230). Specifically, the CPU 61 controls the head moving device 30 so that the suction nozzle 41 that has picked up the component C moves above the part camera 24. Next, the CPU 61 controls the Z-axis actuator 42 so that the tips of the pins P of the component C descend to a position where they are illuminated by the light emitted from the pin light source 26. Then, the CPU 61 controls the part camera 24 so that the image of the component C is captured from the underside. After S230, the CPU 61 controls the pin light source 26 to be turned off. After S230, the CPU 61 executes a pin bend inspection subroutine (see FIG. 8) (S240).

[0030] When the pin bent inspection subroutine starts, the CPU 61 first binarizes the image of the component C captured in S230 (S400). Specifically, the CPU 61 colors pixels whose brightness value is less than a predetermined value black, and pixels whose brightness value is equal to or greater than the predetermined value white. As a result, the tip of the pin P becomes white, and the remaining portion becomes black. In this embodiment, the image obtained in this manner is referred to as a binarized image Im2.

[0031] Next, as shown in FIG. 9(a), the CPU 61 detects areas of white pixels from the binarized image Im2 as candidates for pins P (S410). Next, the CPU 61 compares the areas of pins P defined in the shape data with the areas detected as candidates for pins P in S410 to determine whether all pins P have been detected (S420). Here, the shape data is data that stores the outer shape of the component C, the type of component C to be mounted on the board S, the cross-sectional shape of the pins P on the component C, the diameter of the pins P, the center position of each pin P relative to the center position of the component C (hereinafter referred to as the relative pin position), etc., and is received from the management device 70 along with an instruction to start production. If a negative determination is made in S420, the CPU 61 determines that there is an abnormality in the component C (S540).

[0032] On the other hand, if the determination in S420 is affirmative, the CPU 61 calculates the center position O1 of the pin candidate in the binary image Im2 (S430). Specifically, as shown in Fig. 9(b), the CPU 61 calculates the X coordinate and Y coordinate of the center of gravity of each pin candidate (white area) in an XY plane with a predetermined point (for example, the front left corner of the binary image Im2) as the center position O1(x1, y1) of each pin candidate in the binary image Im2.

[0033] Next, as shown in FIG. 9(c), the CPU 61 calculates the center position O2 of the component C on the XY plane based on the center position O1 of the pin candidate calculated in S430 and the relative pin position (S440). This process is performed, for example, as follows. Hereinafter, the position of each pin P when it is assumed that each pin P is at a relative pin position with respect to a predetermined position in the binary image Im2 will be referred to as a virtual pin position. First, the CPU 61 calculates, for each pin P, the square of the distance between the center position O1 of the pin candidate calculated in S430 and the virtual pin position. Next, the CPU 61 calculates the sum of the squares of the distances between the center position O1 of each pin P and the virtual pin position. Then, the CPU 61 calculates the predetermined position at which the sum of the squares of the distances is smallest as the center position O2(x2, y2) of the component C in the binary image Im2.

[0034] 9(d), the CPU 61 calculates the ideal position I(x3, y3) of each pin P (center position) in the binary image Im2 based on the relative pin position and the center position O2 of the component C in the binary image Im2 (S460). Here, the ideal position I is the center position of each pin P in the binary image Im2 if each pin P were placed according to the relative pin position defined in the shape data. Specifically, the CPU 61 adds the relative pin position to the center position O2(x2, y2) of the component C in the binary image Im2 calculated in S440 to calculate the ideal position I(x3, y3).

[0035] Next, the CPU 61 acquires the diameter L1 of the pin hole H and the diameter L2 of the pin P (S460). Here, the diameter L1 of the pin hole H is determined depending on the type of the board S and the type of the component C to be mounted. The diameter L2 of the pin P is stored in the shape data. Next, the CPU 61 calculates the difference between the diameter L1 of the pin hole H and the diameter L2 of the pin P (hereinafter referred to as the diameter difference) (S470).

[0036] 9(e), the CPU 61 calculates the pin misalignment amount δ(dx, dy) in the X and Y directions of each pin P relative to the ideal position I of each pin P based on each center position O1(x1, y1) calculated in S430 and the ideal position I(x3, y3) of each pin P calculated in S460 (S480). This process is executed as follows. That is, the CPU 61 calculates the pin misalignment amount dx(x1-x3) in the X-axis direction by subtracting the X-coordinate value of the ideal position I from the X-coordinate value of the center position O1, and calculates the pin misalignment amount dy(y1-y3) in the Y-axis direction by subtracting the Y-coordinate value of the ideal position I from the Y-coordinate value of the center position O1.

[0037] Then, the CPU 61 determines whether the inspection mode determined in the inspection mode determination routine was a circle or a rectangle (S490).

[0038] If the inspection mode is circular, the CPU 61 sets the allowable range T to a circular area having a diameter of 2r and centered on the ideal position I, as shown in FIG. 10(a) (S500). Here, the length r is the radius of the circle, and the length 2r is a length less than the above-mentioned diameter difference. On the other hand, if the inspection mode is rectangular, the CPU 61 sets the allowable range T to a square area having a side length of 2r and centered on the ideal position I, as shown in FIG. 10(b) (S510). Note that in FIGS. 10(a) and 10(b), for ease of explanation, the pinhole H is shown by a dashed line.

[0039] After S500 or S510, the CPU 61 determines whether the center position of each pin P is within the tolerance range T (S520). If it is determined in S490 that the inspection mode is circular, the CPU 61 determines whether each pin P is within a circle (tolerance range T) with a radius of length r and centered at the center position O1 of the pin P and the ideal position I. In this embodiment, the CPU 61 determines whether the distance between the center position O1 of each pin P and the ideal position I is less than the length r. Specifically, if the deviation amount dx in the X-axis direction and the deviation amount dy in the Y-axis direction of the deviation amount δ of all pins P satisfy equation (1), the CPU 61 makes a positive determination; otherwise, it makes a negative determination.

[0040]

number

[0041] FIG. 11(a) shows an example of a state in which the center position O1 of the pin P is within the circular tolerance range T, and FIG. 12(a) shows an example of a state in which the center position O1 of the pin P is not within the circular tolerance range T. FIG. 13(a) shows an example of a state in which all the pins P are within the circular tolerance range T. For ease of explanation, the pin holes H are indicated by dashed lines in FIGS. 11(a), 12(a), and 13(a).

[0042] Furthermore, if it is determined in S490 that the inspection mode is rectangle, the CPU 61 determines for each pin P whether the center position O1 is included within the allowable range T of the rectangle, that is, whether the pin misalignment amount dx in the X-axis direction is less than the length r and the pin misalignment amount dx in the Y-axis direction is less than the length r. Specifically, if the misalignment amount dx in the X-axis direction and the misalignment amount dy in the Y-axis direction of the misalignment amount δ of all pins P satisfy equations (2) and (3), the CPU 61 makes a positive determination, and if not, makes a negative determination.

[0043]

number

[0044] FIG. 11(b) shows an example of a state in which the center position O1 of the pin P is within the rectangular allowable range T, and FIG. 12(b) shows an example of a state in which the center position O1 of the pin P is not within the rectangular allowable range T. FIG. 13(b) shows an example of a state in which all of the pins P are within the circular allowable range T. For ease of explanation, in FIGS. 11(b), 12(b), and 13(b), the pin holes H are indicated by dashed lines.

[0045] If a positive determination is made in S520, the CPU 61 determines that the component C is normal (S530). On the other hand, if a negative determination is made in S520, the CPU 61 determines that the component C is abnormal (S540). After S530 or S540, the CPU 61 proceeds to S250 of the component mounting routine (see FIG. 7).

[0046] After S530 or S540 of the bent pin inspection subroutine, the CPU 61 determines whether the component C is normal (S250). If the determination in S250 is negative, the CPU 61 discards the component C picked up by the suction nozzle 41 (S260). Specifically, the CPU 61 controls the head moving device 30 so that the suction nozzle 41 moves above the disposal box 28. Then, the CPU 61 controls the solenoid valve so that the suction of the component C is released. After S260, the CPU 61 returns to S210 again.

[0047] On the other hand, if the determination in S250 is affirmative, the CPU 61 mounts the component C on the board S (S270). Specifically, the CPU 61 controls the head moving device 30 so that the component C picked up by the suction nozzle 41 moves to above the mounting position on the board S. Then, the CPU 61 controls the Z-axis actuator 42 so that the component C is pressed against the board S, and also controls the solenoid valve so that the suction of the component C is released.

[0048] Next, CPU 61 determines whether all components C to be mounted by its own device have been mounted (S280). If a negative determination is made in S280, CPU 61 returns to S210 again. On the other hand, if a positive determination is made in S280, CPU 61 controls the substrate holding device to release the fixation of substrate S, and controls transport device 22 to transport substrate S downstream (S290).

[0049] Then, the CPU 61 determines whether or not the planned number of substrates S has been produced (S300). If a negative determination is made in S300, the CPU 61 returns to S200 again. On the other hand, if a negative determination is made in S300, the CPU 61 ends this routine.

[0050] The control device 60 described above in detail defines, for each pin P, a circular area having a diameter corresponding to the difference in diameter between the pin P and the pinhole H, with the center position O1 of the tip of the pin P at the ideal position I of the pin P as the center, as the tolerance range T, and determines whether the center position O1 of the tip of the pin P is included in the tolerance range T. This makes it possible to determine with good accuracy whether mounting is possible through simple processing.

[0051] The control device 60 also determines whether multiple pins P with circular cross sections can be inserted into circular pin holes H, and determines whether each pin P can be mounted by determining whether the center position O1 of the tip of the pin P is contained within a circular area smaller than a circle whose center is the ideal position I of the pin P and whose diameter is the difference between the diameter of the insertion hole L1 and the diameter L2 of the pin P. This makes it possible to easily and accurately determine whether a pin P with a circular cross section can be inserted into a circular pin hole H.

[0052] Furthermore, the control device 60 can switch between a first determination process for determining whether mounting is possible by determining, for each pin P, whether the center position of the tip of the pin P is included within a circular area having a diameter corresponding to the diameter difference and centered on the ideal position I of the pin P, and a second determination process for determining, for each pin P, whether the center position O1 of the tip of the pin P is included within a rectangular area having a diameter difference and centered on the ideal position I of the pin P. This allows the criteria for determining whether mounting is possible to be changed as necessary.

[0053] It goes without saying that the present disclosure is not limited to the above-described embodiments, and can be embodied in various forms as long as they fall within the technical scope of the present disclosure.

[0054] In the above-described embodiment, the CPU 61 determines whether a pin P with a circular cross section can be inserted into a circular pin hole H of the board S. However, the CPU 61 may also determine whether a pin P with an elliptical cross section can be inserted into an elliptical pin hole H of the board S. In this case, it is sufficient if either an elliptical or rectangular shape can be selected as the inspection mode in the inspection mode determination routine. Also, in this case, a pin bend inspection subroutine such as that shown in FIG. 14 may be executed in S240 of the component mounting routine.

[0055] In the pin bend inspection subroutine shown in FIG. 14, after S450, the CPU 61 acquires the major axis A1 of the pin hole H, the minor axis B1 of the pin hole H, the major axis A2 of the pin P, and the minor axis B2 of the pin P (S600). Here, the major axis A1 and the minor axis B1 of the pin hole H are determined depending on the type of board S and the type of component C to be mounted. The major axis A2 and the minor axis B2 of the pin P are stored in the shape data. Then, the CPU 61 calculates the difference between the major axis A1 of the pin hole H and the major axis A2 of the pin P (hereinafter referred to as the major axis difference), and calculates the difference between the minor axis B1 of the pin hole H and the minor axis B2 of the pin P (hereinafter referred to as the minor axis difference) (S610). Next, the CPU 61 calculates the deviation δ(dx, dy) of each pin P from the ideal position I of each pin P (S480). Specifically, the CPU 61 calculates the deviation amount dx in the X-axis (major axis) direction and the deviation amount dy in the Y-axis (minor axis) direction in the same manner as in the above-described embodiment.

[0056] Then, the CPU 61 determines whether the inspection mode determined in the inspection mode determination routine is elliptical or rectangular (S620). If it is determined in S620 that the inspection mode is elliptical, the CPU 61 sets the allowable range T to an elliptical region having a major axis of length 2a and a minor axis of length 2b, centered on the ideal position I of the pin center, as shown in FIG. 15(a) (S630). Here, length a is the major axis, and length 2a is less than the difference between the major axes, and length b is the minor axis, and length 2b is less than the difference between the minor axes. On the other hand, if the inspection mode is rectangular in S620, the CPU 61 sets the allowable range T to an elliptical region having a major axis of length 2a and a minor axis of length 2b, centered on the ideal position I of the pin center, as shown in FIG. 15(b) (S640).

[0057] After S630 or S640, the CPU 61 determines whether the center positions O1 of all pins P are within the tolerance range T (S650). If the inspection mode is determined to be elliptical in S620, the CPU 61 determines for each pin P whether the center position O1 of the pin P is within the tolerance range T, which is an ellipse having the ideal position I as its center, the major axis having a length 2a, and the minor axis having a length 2b. Specifically, if the deviation amount dx in the X-axis direction and the deviation amount dy in the Y-axis direction of all pins P satisfy equation (4), the CPU 61 makes a positive determination, and if not, makes a negative determination.

[0058]

number

[0059] An example of a state in which the center position O1 of the pin P is within the allowable range T of the ellipse is shown in FIG. 16(a).

[0060] If it is determined in S620 that the inspection mode is rectangle, the CPU 61 determines whether the center position O1 of each pin P is included within the allowable range T of the rectangle. In this embodiment, the CPU 61 determines whether the pin misalignment amount dx in the X-axis direction is less than the length a and the pin misalignment amount dy in the Y-axis direction is less than the length b. Specifically, if the misalignment amount dx in the X-axis direction and the misalignment amount dy in the Y-axis direction of the misalignment amount δ of all pins P satisfy equations (5) and (6), the CPU 61 makes a positive determination, and if they do not satisfy equations, the CPU 61 makes a negative determination.

[0061]

number

[0062] An example of a state in which the center position O1 of the pin P is within the allowable range T of the ellipse is shown in Figure 16(b). For ease of explanation, the pin hole H is indicated by a dashed line in Figures 15 and 16. In Figure 14, the same steps as those in Figure 8 are given the same step numbers, and detailed explanations are omitted.

[0063] In the above-described embodiment, the allowable range T was set based on the diameter difference between the pin hole H and the pin P. However, the allowable range T may also be set based on input by the operator. That is, when setting the allowable range T for a circle, the radius may be input as long as it does not exceed the length r. When setting the allowable range T for a square, the length of one side may be input as long as it does not exceed the length 2r. When setting the allowable range T for an ellipse, the major axis may be input as long as it does not exceed the length a, and the minor axis may be input as long as it does not exceed the length b. When setting the allowable range T for a rectangle, the length of the long side may be input as long as it does not exceed the length 2a, and the length of the short side may be input as long as it does not exceed the length 2b.

[0064] In the above-described embodiment, the margin for calculating the diameter 2r based on the diameter difference may be set by an operator. This also applies to the case where the major axis 2a or the minor axis 2b is set in the modified example of the pin bend inspection subroutine (see FIG. 14).

[0065] In the above-described embodiment, either the circular or rectangular inspection mode can be selected. However, the inspection mode may be limited to the circular mode only. Alternatively, the inspection mode may be limited to the elliptical mode only. [Industrial Applicability]

[0066] The present disclosure is applicable to the component mounting machine manufacturing industry and the like. [Explanation of symbols]

[0067] 1 Component mounting system, 2 Component mounting line, 10 Component mounter, 12 Housing, 21 Component supply device, 22 Conveyor device, 24 Parts camera, 25 Mark camera, 26 Pin light source, 27 Display device, 28 Disposal box, 30 Head moving device, 32 X-axis slider, 33 X-axis guide rail, 34 Y-axis slider, 35 Y-axis guide rail, 36 X-axis actuator, 37 X-axis position sensor, 38 Y-axis actuator, 39 Y-axis position sensor, 40 Head, 41 Suction nozzle, 42 Z-axis actuator, 43 Z-axis position sensor, 60 Control device, 61 CPU, 62 ROM, 63 Storage, 64 RAM, 65 Input / output interface, 66 Bus, 70 Management device, 71 CPU, 72 ROM, 73 Storage, 74 RAM, A1 Major axis, A2 Major axis, B1 Minor axis, B2 Minor axis, C Component, H Pin hole, I Ideal position, Im1 inspection mode selected image, Im2 binary image, L1 diameter, L2 diameter, O1 center position, O2 center position, P pin, r length, a length, b length, S board, T tolerance range, dx deviation amount in X-axis direction, dy deviation amount in Y-axis direction, δ deviation amount.

Claims

1. 1. A mountability determination device for determining whether a component having a plurality of pins with a circular or elliptical cross section can be inserted into a corresponding pin hole when the component has a plurality of pins with a circular or elliptical cross section and a substrate having a plurality of pin holes with a circular or elliptical cross section, acquiring an image of the component, and processing the acquired image to determine the center positions of the tips of the plurality of pins; A diameter difference between the diameter of the pin and the diameter of the pin hole is obtained; determining whether or not the center position of the tip of each pin is included in a circular or elliptical area having a diameter corresponding to the diameter difference and centered on the ideal position of the pin, thereby determining whether or not the pin can be mounted; Mounting feasibility determination device.

2. The mounting possibility determination device according to claim 1, This is a method for determining whether or not a plurality of pins with circular cross sections can be inserted into circular pin holes, and for each pin, it is determined whether or not the center position of the tip of the pin is included within a circular area that is smaller than a circle whose center is the ideal position of the pin and whose diameter is the difference between the diameter of the pin hole and the diameter of the pin, thereby determining whether or not the pin can be mounted. Mounting feasibility determination device.

3. The mounting possibility determination device according to claim 1, This method determines whether or not multiple pins with elliptical cross sections can be inserted into elliptical pin holes, and determines whether or not the center position of the tip of each pin is included within an elliptical area smaller than an ellipse having the ideal position of the pin as the center, the major axis being the difference between the major axis of the pin hole and the major axis of the pin, and the minor axis being the difference between the minor axis of the pin hole and the minor axis of the pin, thereby determining whether or not the pin can be mounted. Mounting feasibility determination device.

4. The mounting possibility determination device according to claim 1, A first determination process is capable of determining whether or not the mounting is possible by determining, for each pin, whether the center position of the tip end of the pin is included within a circular or elliptical area having a diameter corresponding to the diameter difference and centered on the ideal position of the pin, and a second determination process is capable of determining, for each pin, whether the center position of the tip end of the pin is included within a rectangular area having a diameter corresponding to the diameter difference and centered on the ideal position of the pin. Mounting feasibility determination device.

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