Selective blocking of metal surfaces using bifunctional self-assembled monolayers

Abstract

A method for selectively depositing on a metal surface is disclosed. Some embodiments of the present disclosure utilize a hydrocarbon having at least two functional groups, at least one of which is selected from an amino group, a hydroxyl group, an ether linkage, or a combination thereof, to form a self-assembled monolayer (SAM) on the metal surface.

Description

[Technical Field]

[0001]

[0001] Embodiments of the present disclosure generally relate to methods for forming semiconductor structures. More particularly, some embodiments of the present disclosure are directed to methods for selectively depositing on non-metallic surfaces using self-assembled monolayers using precursors, where the precursors include at least two functional groups selected from an alkene, an alkyne, a ketone, a hydroxyl, an aldehyde, an ester, or a combination thereof. [Background technology]

[0002]

[0002] Generally, an integrated circuit (IC) refers to a collection of electronic devices (e.g., transistors) formed on a small chip of semiconductor material, typically silicon. An IC usually contains one or more metallization layers with metal lines for connecting the IC's electronic devices to each other and to external connections. Layers of interlayer insulating material are usually placed between the IC's metallization layers for insulation.

[0003]

[0003] As IC sizes decrease, the spacing between metal lines decreases. Typically, interconnect structures are fabricated using planar processes that involve aligning and connecting metallization on one layer with metallization on another layer.

[0004]

[0004] To improve the performance of electronic devices, it is important to reduce via resistance, which is usually controlled by minimizing cladding and reducing the resistance of the via material.

[0005]

[0005] Therefore, there is a continuing need in the art for methods to reduce via resistance. Summary of the Invention

[0006] One or more embodiments of the present disclosure are directed to a method of forming a semiconductor structure. In some embodiments, the method includes selectively depositing a self-assembled monolayer (SAM) on a first surface of a substrate by exposing the substrate to a first precursor, wherein the substrate has at least one feature comprising a first surface and a second surface, and the first precursor includes at least two functional groups, at least one functional group being selected from an amino group, a hydroxyl group, an ether linkage, or a combination thereof; selectively depositing a liner on the second surface by exposing the substrate to a second precursor; and removing the self-assembled monolayer (SAM). In some embodiments, the first surface comprises a metal. In some embodiments, the second surface comprises a dielectric material.

[0007] In one or more embodiments, the method includes exposing a substrate having at least one feature including a first surface and a second surface to at least one first precursor to selectively deposit a self-assembled monolayer (SAM) on a first surface of the substrate, the substrate having at least one feature including a first surface and a second surface; exposing the substrate to a second precursor to selectively deposit a liner on the second surface; and removing the self-assembled monolayer (SAM). In some embodiments, the first surface comprises a metal selected from one or more of copper (Cu), cobalt (Co), ruthenium (Ru), tungsten (W), and molybdenum (Mo). In some embodiments, the second surface comprises a dielectric material. In some embodiments, the first precursor has a molecular weight in the range of 50 Daltons to 500 Daltons. In some embodiments, the first precursor has a vapor pressure in the range of 100 mTorr to 100 Torr at 120° C. In some embodiments, the first precursor is represented by formula (xiv) to formula (xviii): TIFF0007822472000001.tif108170, where each n is independently 1 to 20 and each R is independently selected from H, a C1-C10 alkyl group, or an aryl group.

[0008] In one or more embodiments, the method includes exposing a substrate having at least one feature, the substrate including a first surface and a second surface, to at least one first precursor to selectively deposit a self-assembled monolayer (SAM) on a first surface of the substrate, the substrate having at least one feature including a first surface and a second surface; exposing the substrate to a second precursor to selectively deposit a liner on the second surface; and removing the self-assembled monolayer (SAM). In some embodiments, the first surface comprises a metal selected from one or more of copper (Cu), cobalt (Co), ruthenium (Ru), tungsten (W), and molybdenum (Mo). In some embodiments, the second surface comprises a dielectric material. In some embodiments, the first precursor has a molecular weight in the range of 50 Daltons to 500 Daltons. In some embodiments, the first precursor has a vapor pressure in the range of 100 mTorr to 100 Torr at 120° C. In some embodiments, the first precursor is represented by formula (xix) to formula (xxvii): TIFF0007822472000002.tif77170, wherein each R is independently selected from H, a C1-C10 alkyl group, or an aryl group.

[0009]

[0009] So that the features of the present disclosure described above can be understood in detail, a more particular description of the present disclosure briefly summarized above will be had by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the present disclosure is open to other equally effective embodiments, and therefore the accompanying drawings illustrate only typical embodiments of the present disclosure and should not be considered as limiting the scope of the present disclosure. [Brief explanation of the drawings]

[0010] [Figure 1]

[0010] A process flow diagram of a method according to one or more embodiments of the present disclosure is shown. [Figure 2A]

[0011] 1 illustrates a cross-sectional view of an exemplary substrate during processing in accordance with one or more embodiments of the present disclosure. [Figure 2B] 1 illustrates a cross-sectional view of an exemplary substrate during processing in accordance with one or more embodiments of the present disclosure. [Figure 2C] 1 illustrates a cross-sectional view of an exemplary substrate during processing in accordance with one or more embodiments of the present disclosure. [Figure 2D] 1 illustrates a cross-sectional view of an exemplary substrate during processing in accordance with one or more embodiments of the present disclosure. [Figure 2E] 1 illustrates a cross-sectional view of an exemplary substrate during processing in accordance with one or more embodiments of the present disclosure. [Figure 2F] 1 illustrates a cross-sectional view of an exemplary substrate during processing in accordance with one or more embodiments of the present disclosure. [Figure 3]

[0012] 1 illustrates an exemplary cluster tool in accordance with one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0011]

[0013] Before describing several example embodiments of the present disclosure, it is to be understood that the present disclosure is not limited to the details of construction or process steps set forth in the following description. The present disclosure is capable of other embodiments and of being practiced or carried out in various ways.

[0012]

[0014] The term "substrate," as used herein and in the appended claims, refers to a surface or portion of a surface upon which a process acts. Those skilled in the art will also understand that references to a substrate may refer to only a portion of a substrate unless the context clearly indicates otherwise. Furthermore, references to deposition on a substrate may refer to both a bare substrate and a substrate having one or more films or features deposited or formed thereon.

[0013]

[0015] As used herein, "substrate" refers to any substrate or material surface formed on a substrate on which film processing is performed during a manufacturing process. For example, substrate surfaces on which processing may be performed include materials such as silicon, silicon oxide, strained silicon, silicon-on-insulator (SOI), carbon-doped silicon oxide, amorphous silicon, doped silicon, germanium, gallium arsenide, glass, sapphire, and any other materials such as metals, metal nitrides, metal alloys, and other conductive materials, depending on the application. Substrates include, but are not limited to, semiconductor wafers. Substrates may be exposed to pretreatment processes to polish, etch, reduce, oxidize, hydroxylate, anneal, UV cure, electron beam (e-beam) cure, and / or bake the substrate surface. In addition to film processing directly on the surface of the substrate itself, in the present disclosure, any of the disclosed film processing steps may also be performed on underlying layers formed on the substrate, as disclosed in more detail below. The term "substrate surface" is intended to include such underlying layers as the context indicates. Thus, for example, if a film / layer or partial film / layer is being deposited on a substrate surface, the exposed surface of the newly deposited film / layer becomes the substrate surface.

[0014]

[0016] As used herein, "atomic layer deposition" or "cyclic deposition" refers to the sequential exposure of two or more reactive compounds to deposit layers of material on a substrate surface. As used herein and in the appended claims, the terms "reactive compound," "reactive gas," "reactive species," "precursor," "process gas," and the like are used interchangeably and refer to substances having species capable of reacting with the substrate surface or materials on the substrate surface in a surface reaction (e.g., chemisorption, oxidation, reduction). The substrate or portions of the substrate are exposed to the precursors (or reactive gases) sequentially or substantially sequentially. As used throughout this specification, "substantially sequential" means that the majority of the duration of precursor exposure does not overlap with exposure to a co-reagent, although there may be some overlap.

[0015]

[0017] Metals can be grown by atomic layer deposition for many applications. One or more embodiments of the present disclosure advantageously provide a process for atomic layer deposition to form metal-containing films. As used herein and in the appended claims, the term "metal-containing film" refers to a film containing metal atoms, having about 1 atomic % or more of metal, about 2 atomic % or more of metal, about 3 atomic % or more of metal, about 4 atomic % or more of metal, about 5 atomic % or more of metal, about 10 atomic % or more of metal, about 15 atomic % or more of metal, about 20 atomic % or more of metal, about 25 atomic % or more of metal, about 30 atomic % or more of metal, about 35 atomic % or more of metal, about 40 atomic % or more of metal, about 45 atomic % or more of metal, about 50 atomic % or more of metal, about 55 atomic % or more of metal, about 60 atomic % or more of metal, or about 65 atomic % or more of metal. In some embodiments, the metal-containing film comprises one or more of a metal, a metal nitride, a metal carbide, or a metal oxide. Those skilled in the art will recognize that the use of a molecular formula such as MO (where M is a metal) does not imply a particular stoichiometric relationship between elements, but simply the identity of the major constituent of the film. For example, MO refers to a film having a major composition of metal and oxygen atoms. In some embodiments, the major composition of a particular film (i.e., the sum of the atomic percentages of the particular atoms) is greater than or equal to about 95%, 98%, 99%, or 99.5% of the film on an atomic basis.

[0016]

[0018] As used herein, the phrases "metallic material surface" or "non-metallic material surface" refer to the surface of a metallic material or a non-metallic material, respectively. For purposes of this disclosure, a non-metallic material is any material that exhibits the properties of a poor conductor or a good insulator. A non-metallic material may contain metal atoms (e.g., tantalum nitride, titanium nitride) and still fall within the scope of non-metallic materials. In some embodiments, the term "conductive material" is used in place of a metallic material. In some embodiments, the term "dielectric material" is used in place of a non-metallic material.

[0017]

[0019] As used herein, phrases such as "selectively depositing on a first surface over a second surface" mean that a first amount or thickness is deposited on the first surface and a second amount or thickness is deposited on the second surface, where the second amount or thickness is less than the first amount or thickness, or in some embodiments, no amount is deposited on the second surface.

[0018]

[0020] As used herein, the term "over" does not refer to a physical orientation of one surface on top of another, but rather to the relationship of thermodynamic or kinetic properties of a chemical reaction relative to one surface and another. For example, selectively depositing a film on a metallic material surface over a non-metallic material surface means that a film is deposited on the metallic material surface and little or no film is deposited on the non-metallic material surface, or that the formation of a film on the metallic material surface is thermodynamically or kinetically favored compared to the formation of a film on the non-metallic material surface.

[0019]

[0021] Reducing contact resistance (Rc) is important for semiconductor structures at the 3 nm node (N3) and beyond. One or more embodiments of the present disclosure are directed to a method for selectively forming a self-assembled monolayer (SAM) on a first surface of a substrate above a second surface. The substrate includes a metallic material (conductive material) having a first surface and a non-metallic material (dielectric material) having a second surface. In some embodiments, the first surface may be described as a metallic material surface or a conductive material surface. In some embodiments, the first surface includes one or more of copper (Cu), cobalt (Co), ruthenium (Ru), tungsten (W), and molybdenum (Mo). In some embodiments, the second surface may be described as a non-metallic material surface or a dielectric material surface. In some embodiments, the methods described herein have middle end of line (MEOL) and back end of line (BEOL) applications.

[0020]

[0022] 1, which is a process flow diagram, one or more embodiments of the present disclosure are directed to a method 100 of forming an electronic device. The method illustrated in FIG. 1 is representative of an integrated process.

[0021]

[0023] 2A-2F illustrate cross-sectional views of an exemplary device 200 during processing method 100 in accordance with one or more embodiments of the present disclosure. Referring to FIG. 2A, a substrate 210 is provided having a barrier layer 215, a metal liner 220, a conductive layer 225, an etch stop layer 230, and a dielectric layer 235 thereon. In one or more embodiments, the dielectric layer 235 has at least one feature 240. In some embodiments, the substrate 210 is a wafer, e.g., a semiconductor substrate. In some embodiments, the substrate 210 is an etch stop layer on a wafer.

[0022]

[0024] For illustrative purposes, FIG. 2A shows substrate 210 with a single feature 240. However, one skilled in the art will understand that multiple features may be present. As shown in FIG. 2A , feature 240 includes a first surface 245 and a second surface 250. In some embodiments, first surface 245 is the bottom surface of feature 240. In some embodiments, second surface 250 is the sidewall of feature 240. Feature 240 may be any suitable shape, including, but not limited to, a trench, a via that carries current between layers when filled with metal, and a line that carries current within the same device layer. It will be understood that in one or more embodiments, conductive layer 225 forms a metal line that carries current within the same device layer. In some embodiments, feature 240 defines a gap within dielectric layer 235. As used herein, the term “feature” refers to any intentional surface irregularity. Suitable examples of features include, but are not limited to, a trench having a top, two sidewalls, and a bottom, and a peak having a top and two sidewalls. The feature can have any suitable aspect ratio (ratio of the depth of the feature to the width of the feature). In some embodiments, the aspect ratio is about 1:1, 2:1, 3:1, 4:1, 5:1, 10:1, 15:1, 20:1, 25:1, 30:1, 35:1, or 40:1 or greater.

[0023]

[0025] In one or more embodiments, the barrier layer 215 is a conformal layer. The barrier layer 215 may comprise any suitable material known to one of ordinary skill in the art and may be deposited by any suitable technique known to one of ordinary skill in the art. In some embodiments, the barrier layer is selected from titanium nitride (TiN), tantalum nitride (TaN), or tungsten nitride (WN). In particular embodiments, the barrier layer 215 comprises tantalum nitride (TaN). In some embodiments, the barrier layer 215 is formed by ALD. In some embodiments, the barrier layer 215 prevents diffusion of materials across itself into underlying layers.

[0024]

[0026] In one or more embodiments, the metal liner 220 may comprise any suitable metallic material known to those skilled in the art and may be deposited by any technique known to those skilled in the art. In one or more embodiments, the metal liner 220 comprises one or more of copper (Cu), cobalt (Co), ruthenium (Ru), iridium (Ir), rhodium (Rh), molybdenum (Mo), tungsten (W), aluminum (Al), nickel (Ni), and platinum (Pt). In one or more embodiments, the metal liner 220 comprises one or more of a single layer of tungsten (W) or a single layer of molybdenum (Mo). In some embodiments, the metal liner 220 comprises or consists essentially of tungsten or molybdenum. As used herein and in the appended claims, the term "consists essentially of" means that the material is about 95%, 98%, or 99% or more on an atomic basis.

[0025]

[0027] In one or more embodiments, the conductive layer 225 comprises a metal or metallic material. In some embodiments, the metal or metallic material can be any suitable metallic material. In some embodiments, the metallic material of the present disclosure is a conductive material. Suitable metallic materials include, but are not limited to, metals, conductive metal nitrides, conductive metal oxides, metal alloys, silicon, combinations thereof, and other conductive materials.

[0026]

[0028] As used herein and in the appended claims, terms such as "oxide" mean that a material contains one or more specified elements. The term should not be construed to imply a specific ratio of elements. Thus, "oxide" or the like can contain elements in stoichiometric or non-stoichiometric ratios.

[0027]

[0029] In one or more embodiments, the metal or metallic material may comprise any suitable metal known to those skilled in the art. In some embodiments, the metal or metallic material is selected from one or more of copper (Cu), cobalt (Co), ruthenium (Ru), iridium (Ir), rhodium (Rh), molybdenum (Mo), tungsten (W), aluminum (Al), nickel (Ni), and platinum (Pt). In some embodiments, the metal or metallic material consists essentially of copper (Cu), cobalt (Co), ruthenium (Ru), iridium (Ir), rhodium (Rh), molybdenum (Mo), tungsten (W), aluminum (Al), nickel (Ni), or platinum (Pt). In some embodiments, the metal or metallic material consists essentially of copper, cobalt, ruthenium, tungsten, or molybdenum. In some embodiments, the metallic material comprises or consists essentially of tungsten or molybdenum.

[0028]

[0030] In one or more embodiments, the etch stop layer 230 comprises any suitable material known to those skilled in the art. In one or more embodiments, the etch stop layer 230 is made of silicon nitride (SiN), silicon carbide (SiC), aluminum oxide (AlO), or a combination of these. x ), and aluminum nitride (AlN). In some embodiments, the etch stop layer 230 may be deposited using a technique selected from CVD, PVD, and ALD.

[0029]

[0031] In one or more embodiments, a portion of the metal liner 220 and the etch stop layer 230 are removed, exposing a bottom first surface 245 of at least one feature 240. In some embodiments, the bottom first surface 245 is a portion of the top surface of the conductive material 225, thereby exposing a portion of the conductive material 225.

[0030]

[0032] In one or more embodiments, dielectric layer 235 can be any suitable material. In some embodiments, dielectric layer 235 insulates adjacent devices and prevents leakage. Suitable dielectric materials include, but are not limited to, silicon oxide (e.g., SiO), silicon nitride (e.g., SiN), silicon carbide (e.g., SiC), and combinations thereof (e.g., SiCON). Suitable dielectric materials also include aluminum oxide, aluminum nitride, and low-k dielectric materials. In some embodiments, the dielectric material consists essentially of silicon dioxide (SiO). In some embodiments, dielectric layer 235 includes silicon nitride. In some embodiments, dielectric layer 235 consists essentially of silicon nitride.

[0031]

[0033] In one or more embodiments, the dielectric layer 235 is deposited using any suitable deposition technique, such as, but not limited to, chemical vapor deposition ("CVD"), physical vapor deposition ("PVD"), molecular beam epitaxy ("MBE"), metalorganic chemical vapor deposition ("MOCVD"), atomic layer deposition ("ALD"), spin-on, or other deposition techniques known to those skilled in the art of microelectronic device fabrication.

[0032]

[0034] In one or more embodiments, the substrate 210 is independently maintained at an operating pressure during one or more steps of the method 100. In some embodiments, the operating pressure is 100 Torr or less, 80 Torr or less, 70 Torr or less, 60 Torr or less, 50 Torr or less, 40 Torr or less, 30 Torr or less, 20 Torr or less, 15 Torr or less, 10 Torr or less, 5 Torr or less, 1 Torr or less, 500 mTorr or less, 200 mTorr or less, 100 mTorr or less, or 50 mTorr or less. In some embodiments, the operating pressure is 10 Torr, 20 Torr, 30 Torr, 40 Torr, 50 Torr, or 100 Torr. In some embodiments, the substrate 210 is maintained at a pressure of 1 mTorr to 100 Torr, 1 mTorr to 80 Torr, 1 mTorr to 60 Torr, 1 mTorr to 40 Torr, 1 mTorr to 20 Torr, 1 mTorr to 10 Torr, 1 mTorr to 5 Torr, 1 mTorr to 1 Torr, 1 mTorr to 500 mTorr, 1 mTorr to 200 mTorr, 1 mTorr to 100 mTorr, 1 mTorr to 50 Torr, 500 mTorr to 100 Torr, 500 mTorr to 80 Torr, 500 mTorr to 60 Torr, 500 mTorr to 40 Torr, 500 mTorr to 2 The pressure is maintained within the range of 0 Torr, 500 mTorr to 10 Torr, 500 mTorr to 5 Torr, 500 mTorr to 1 Torr, 1 Torr to 100 Torr, 1 Torr to 80 Torr, 1 Torr to 60 Torr, 1 Torr to 40 Torr, 1 Torr to 20 Torr, 1 Torr to 10 Torr, 1 Torr to 5 Torr, 10 Torr to 100 Torr, 10 Torr to 80 Torr, 10 Torr to 60 Torr, 10 Torr to 40 Torr, 10 Torr to 20 Torr, 20 Torr to 100 Torr, 20 Torr to 80 Torr, 20 Torr to 60 Torr, or 20 Torr to 40 Torr.

[0033]

[0035] In some embodiments, the temperature of the substrate is controlled during method 100. The temperature of the substrate may also be referred to as an operating temperature. In some embodiments, the operating temperature is 450°C or less, 400°C or less, 350°C or less, 300°C or less, 275°C or less, 250°C or less, 225°C or less, 200°C or less, 150°C or less, 100°C or less, or 80°C or less. In some embodiments, the operating temperature is in the range of 60°C to 450°C, 60°C to 350°C, 60°C to 250°C, 60°C to 150°C, 60°C to 100°C, 100°C to 450°C, 100°C to 350°C, 100°C to 250°C, 100°C to 200°C, 200°C to 450°C, 200°C to 350°C, 200°C to 300°C, 300°C to 450°C, 300°C to 350°C, or 400°C to 450°C during deposition of the self-assembled monolayer (SAM) 255.

[0034]

[0036] 1 , the exemplary method 100 begins with an optional pre-cleaning step 102. The pre-cleaning step can be any suitable pre-cleaning process known to one of ordinary skill in the art. Suitable pre-cleaning steps include, but are not limited to, soaking, native oxide removal, and the like. In some embodiments, the pre-cleaning step 102 cleans the first surface 245 and the second surface 250. In some embodiments, the pre-cleaning step 102 results in a substantially oxide-free surface of the substrate 210, e.g., the first surface 245 and / or the second surface 250. As used herein, the term “substantially oxide-free” means that the surface has less than 10%, less than 5%, less than 4%, less than 3%, less than 2%, or less than 1% oxygen on an atomic basis.

[0035]

[0037] In step 104, the substrate 210 is exposed to a first precursor to deposit a self-assembled monolayer (SAM) 255. As used herein, the phrase "substrate is exposed" means that the entire substrate, including the individual materials and layers thereon, is exposed to a specified process or condition. FIG. 2B shows a self-assembled monolayer (SAM) 255 deposited on a first surface 245 of a feature 240. In some embodiments, the self-assembled monolayer (SAM) 255 is selectively deposited on the first surface 245 of the feature 240 on the second surface 250. In some embodiments, the self-assembled monolayer (SAM) is not deposited on the second surface 250 of the feature 240. In one or more embodiments, the self-assembled monolayer (SAM) 255 is deposited on the exposed first surface 245 of the conductive layer 225 at the bottom of the feature 240. Note that, as discussed above, a portion of metal liner 220 and a portion of etch stop layer 230 are removed, e.g., by etching, to expose a portion of conductive layer 225 at the bottom of feature 240, e.g., first surface 245. In some embodiments, step 104 is a dry deposition process.

[0036]

[0038] In some embodiments, "selectively" means that the material of interest forms on the selected surface at about 1.5, 2, 3, 4, 5, 7, 10, 15, 20, 25, 30, 35, 40, 45, or 50 times or more the rate of formation on the non-selected surface. Stated another way, the selectivity of the described process for selected versus non-selected surfaces is about 3:2, 2:1, 3:1, 4:1, 5:1, 7:1, 10:1, 15:1, 20:1, 25:1, 30:1, 35:1, 40:1, 45:1, or 50:1 or more.

[0037]

[0039] In one or more embodiments, the first precursor reversibly binds to the metal. In some embodiments, the self-assembled monolayer (SAM) 255 formed by the first precursor remains substantially intact during subsequent steps of method 100. As used herein, the term "substantially" refers to up to 99%, 98%, 95%, 90%, or 80% of the self-assembled monolayer (SAM) 255 remaining intact during subsequent steps of method 100.

[0038]

[0040] In some embodiments, the first precursor comprises at least one, at least two, or at least three functional groups. In some embodiments, the functional groups are designed to enable reverse-selective ALD deposition. In some embodiments, the functional groups comprise an unsaturated hydrocarbon (e.g., an alkene, an alkyne, a phenyl, or a combination thereof), a ketone, a hydroxyl, an aldehyde, an ester, or a combination thereof. In some embodiments, the first precursor comprises at least one unsaturated group. In some embodiments, the first precursor comprises at least one hydroxyl group. In some embodiments, the first precursor comprises at least one aldehyde group. In some embodiments, the first precursor comprises at least one ketone group. In some embodiments, the first precursor comprises at least one ester group. In some embodiments, the first precursor comprises at least two functional groups. In some embodiments, the at least two functional groups are independently selected from an unsaturated hydrocarbon (e.g., an alkene, an alkyne, a phenyl, or a combination thereof), a ketone, a hydroxyl, an aldehyde, an ester, or a derivative thereof. In some embodiments, each of the at least three functional groups is independently selected from an unsaturated hydrocarbon (e.g., alkene, alkyne, phenyl, or a combination thereof), a ketone, a hydroxyl, an aldehyde, an ester, or a derivative thereof. In some embodiments, surface engineering using the bifunctional groups enables selective ALD deposition against electrical resistance at the via contact interface. In some embodiments, the bifunctional groups function as a conjugated system. In some embodiments, the conjugated system includes lone pair groups.

[0039]

[0041] Without intending to be bound by theory, it is believed that the d orbitals of metallic materials are related to the sp 2 It is believed that the unsaturated hydrocarbon begins to share electrons with the orbital. Thus, in some embodiments, the unsaturated hydrocarbon includes at least one compound having at least one double bond between two carbon atoms. In some embodiments, the unsaturated hydrocarbon includes at least one compound having at least one triple bond between two carbon atoms. Stated differently, in some embodiments, the unsaturated hydrocarbon includes at least one compound having a general formula according to formula (i) or formula (ii) below: In some embodiments, R1, R2, R3, R4, R5, and R6 are H, —R7OH, —CH(OH)R8, —C(OH)R9R 10 , and -COR 11 In some embodiments, R, R, R, R 10 and R 11 is independently selected from H and an alkyl group. As used in this respect, an alkyl group contains 1 to 30 carbon atoms. In some embodiments, an alkyl group contains 1 to 4 carbon atoms. In some embodiments, an alkyl group is a linear group (e.g., a straight-chain saturated or unsaturated hydrocarbon). In some embodiments, an alkyl group is a branched group (e.g., a branched saturated or unsaturated hydrocarbon). In some embodiments, an alkyl group is a cyclic group (e.g., a cyclic saturated or unsaturated hydrocarbon).

[0040]

[0042] While not intending to be bound by theory, it is believed that the likelihood of polymerization advantageously increases as the number of multiple unsaturated bonds increases. Polymerization may make the self-assembled monolayer (SAM) 255 less likely to peel off during subsequent steps of method 100. Furthermore, without intending to be bound by theory, it is believed that the unsaturated hydrocarbon self-assembled monolayer (SAM) 255 inhibits one or more of the nucleation or growth rate of subsequent films on first surface 245. Thus, in some embodiments, the first precursor includes at least one unsaturated bond, and first surface 245 includes copper, cobalt, ruthenium, tungsten, molybdenum, or a combination thereof.

[0041]

[0043] In some embodiments, precursors with a single hydroxyl group are effective in enabling reverse-selective ALD deposition. In some embodiments, a self-assembled monolayer (SAM) 255 formed with a precursor containing a single hydroxyl group bombards the etch stop layer 230 and / or modifies the non-metallic surface 250. Thus, in one or more embodiments, a bifunctional group with a lone electron pair and a conjugated system is designed for a metallic surface 245 comprising copper, cobalt, ruthenium, tungsten, molybdenum, or a combination thereof. In other words, in some embodiments, the self-assembled monolayer (SAM) 255 selectively blocks the metallic surface 245 while leaving the non-metallic surface 250 intact during subsequent steps of the method 100. The metallic surface 245 comprises copper, cobalt, ruthenium, tungsten, molybdenum, or a combination thereof.

[0042]

[0044] In some embodiments, the first precursor comprises a structure according to formula (iii) below: wherein R7 is selected from H and a C1-C4 group, and R8 is a C1-C4 group. TIFF0007822472000004.tif29170

[0043]

[0045] In some embodiments, the first precursor comprises a structure according to formula (iv): wherein each of R7 and R9 is independently selected from H and a C1-C4 group. TIFF0007822472000005.tif29170

[0044]

[0046] In some embodiments, the first precursor comprises a structure according to formula (v): 10 are each independently selected from H and a C1-C4 group. TIFF0007822472000006.tif29170

[0045]

[0047] In some embodiments, the first precursor comprises a structure according to formula (v): 11 , R 12 , R 13 and R 14 are each independently selected from H and a C1-C4 group. TIFF0007822472000007.tif29170

[0046]

[0048] In some embodiments, the first precursor is selected from the group consisting of structures of formula (vi), formula (vii), formula (viii), formula (ix), formula (x), formula (xi), formula (xii), and formula (xiii): TIFF0007822472000008.tif115170

[0047]

[0049] In some embodiments, a precursor having two functional groups allows for reverse selective ALD deposition. In some embodiments, a self-assembled monolayer (SAM) 255 is formed with a precursor containing at least two functional groups, where at least one functional group is selected from an amino group, a hydroxyl group, an ether linkage, or a combination thereof, to impact the etch stop layer 230 and / or modify the non-metallic surface 250. Thus, in some embodiments, the self-assembled monolayer (SAM) 255 selectively blocks the metallic surface 245 while leaving the non-metallic surface 250 intact during subsequent steps of the method 100. The metallic surface 245 comprises copper, cobalt, ruthenium, tungsten, molybdenum, or a combination thereof.

[0048]

[0050] In some embodiments, the first precursor is represented by Formula (xiv) to Formula (xviii): TIFF0007822472000009.tif108170, wherein each n is independently 1 to 20 and each R is independently selected from H, a C1-C10 alkyl group, or an aryl group.

[0049]

[0051] In some embodiments, the first precursor is represented by formula (xix) to formula (xxvii): TIFF0007822472000010.tif77170, wherein each R is independently selected from H, a C1-C10 alkyl group, or an aryl group.

[0050]

[0052] In one or more embodiments, the first precursor has a molecular weight in the range of 50 to 500 daltons, 100 to 500 daltons, 200 to 500 daltons, 300 to 500 daltons, 400 to 500 daltons, 50 to 400 daltons, 100 to 400 daltons, 200 to 400 daltons, 300 to 400 daltons, 50 to 300 daltons, 100 to 300 daltons, 200 to 300 daltons, 50 to 200 daltons, 100 to 200 daltons, or 50 to 100 daltons. In some embodiments, the first precursor has a molecular weight less than 500 daltons, less than 400 daltons, less than 300 daltons, or less than 100 daltons.

[0051]

[0053] In one or more embodiments, the first precursor is heated to a temperature of 120° C. at 100 mTorr to 100 Torr, 300 mTorr to 100 Torr, 500 mTorr to 100 Torr, 800 mTorr to 100 Torr, 100 mTorr to 50 Torr, 300 mTorr to 50 Torr, 500 mTorr to 50 Torr, 800 mTorr to 50 Torr, 100 mTorr to 10 Torr, 300 mTorr to 10 Torr, 500 mTorr to 10 Torr Torr, 800 mTorr to 10 Torr, 100 mTorr to 1 Torr, 300 mTorr to 1 Torr, 500 mTorr to 1 Torr, 800 mTorr to 1 Torr, 100 mTorr to 8 mTorr, 300 mTorr to 800 mTorr, 500 mTorr to 800 mTorr, 100 mTorr to 500 mTorr, 300 mTorr to 500 mTorr, or 100 mTorr to 300 mTorr. In some embodiments, the first precursor has a vapor pressure of 100 mTorr or greater, 300 mTorr or greater, 500 mTorr or greater, 800 mTorr or greater, 1 Torr or greater, 10 Torr or greater, 50 Torr or greater, or 90 Torr or greater.

[0052]

[0054] In one or more embodiments, the substrate 210 can be exposed to the first precursor at any suitable flow rate to form a self-assembled monolayer (SAM) 255. In some embodiments, the substrate 210 is exposed to the first precursor at a flow rate in the range of 50 sccm to 2000 sccm, 100 sccm to 2000 sccm, 500 sccm to 2000 sccm, 1000 sccm to 2000 sccm, 1500 sccm to 2000 sccm, 50 sccm to 100 sccm, or 75 sccm to 100 sccm. In some embodiments, the flow rate of the first precursor is 2000 sccm or less, 1500 sccm or less, 1000 sccm or less, 600 sccm or less, 500 sccm or less, 400 sccm or less, 300 sccm or less, 250 sccm or less, 200 sccm or less, 150 sccm or less, 100 sccm or less, 75 sccm or less, or 50 sccm or less.

[0053]

[0055] In some embodiments, the substrate 210 is immersed in the vapor of the first precursor. In some embodiments, the immersion period can be any suitable period for forming a self-assembled monolayer (SAM) 255. In some embodiments, the immersion period is 10 seconds or more, 20 seconds or more, 30 seconds or more, 45 seconds or more, 60 seconds or more, 80 seconds or more, 120 seconds or more, 150 seconds or more, or 200 seconds or more.

[0054]

[0056] In one or more embodiments, the first precursor is a liquid at the operating temperature and / or pressure. In one or more embodiments, the first precursor is a solid at the operating temperature and / or pressure. In some embodiments, the first precursor is stored in an ampoule or cylinder from which the first precursor is delivered to the substrate 210. In some embodiments, the first precursor is a liquid at the operating temperature and / or pressure from 0.1 Torr to 150 Torr, 0.1 Torr to 100 Torr, 0.1 Torr to 50 Torr, 0.1 Torr to 10 Torr, 0.1 Torr to 1 Torr, 0.1 Torr to 0.5 Torr, 0.5 Torr to 150 Torr, 0.5 Torr to 100 Torr, 0.5 Torr to 50 Torr, 0.5 Torr to 1 ... In some embodiments, the first precursor has a vapor pressure in the range of about 0.1 Torr to 10 Torr, 0.5 Torr to 1 Torr, 1 Torr to 150 Torr, 1 Torr to 100 Torr, 1 Torr to 50 Torr, 1 Torr to 10 Torr, 10 Torr to 150 Torr, 10 Torr to 100 Torr, 10 Torr to 50 Torr, 50 Torr to 150 Torr, 50 Torr to 100 Torr, or 100 Torr to 150 Torr. In some embodiments, the first precursor has a vapor pressure of about 0.1 Torr or greater at the operating temperature and / or pressure.

[0055]

[0057] In one or more embodiments, the first precursor is substantially free of one or more of metals, halogens, or nitrogen. As used in this manner, the term "substantially free" means that the first precursor has less than 10% by weight on an atomic basis, less than 5% by weight on an atomic basis, less than 3% by weight on an atomic basis, or less than 1% by weight on an atomic basis.

[0056]

[0058] In one or more embodiments, the first precursor further comprises a carrier gas. In some embodiments, the carrier gas is a non-reactive gas. In some embodiments, the carrier gas comprises a noble gas. In some embodiments, the noble gas comprises one or more of helium (He), neon (Ne), or argon (Ar). In some embodiments, the carrier gas comprises argon (Ar).

[0057]

[0059] In some embodiments, the flow of carrier gas is configured to carry the first precursor from the container to the substrate 210. In some embodiments, the flow rate of argon (Ar) gas configured to carry the first precursor to the substrate 210 is controlled.

[0058]

[0060] Referring to FIG. 1 , in step 106, substrate 210 is exposed to a second precursor to selectively deposit a liner on second surface 250. FIG. 2C illustrates liner 260 being selectively deposited on second surface 250. In some embodiments, liner 260 is formed on second surface 250 but not on first surface 245. In some embodiments, liner 260 is a conformal layer. Liner 260 may comprise any suitable material known to those skilled in the art and may be deposited by any suitable technique known to those skilled in the art. In some embodiments, liner 260 comprises a metal nitride. In some embodiments, liner 260 comprises tantalum nitride (TaN), titanium nitride (TiN), or a combination thereof. In some embodiments, liner 260 has the same properties as barrier layer 215. In some embodiments, liner 260 is selectively deposited by atomic layer deposition (ALD). In some embodiments, self-assembled monolayer (SAM) 255 selectively blocks metal interface 245, leaving non-metal surface 250 intact for selective ALD deposition. In some embodiments, liner 260 is deposited by sequentially exposing substrate 210 to metal precursors and reactants. In some embodiments, liner 260 is formed without the use of plasma. In some embodiments, liner 260 has a thickness in the range of about 2 Å to about 20 Å. In some embodiments, liner 260 is formed in a single ALD cycle. In some embodiments, liner 260 is formed in 1 to 40 ALD cycles. In one or more embodiments, each of the 1 to 40 ALD cycles is configured to deposit a thickness of liner 260 of about 0.5 Å.

[0059]

[0061] Referring to FIG. 1 , in step 108, the self-assembled monolayer (SAM) 255 is removed. FIG. 2D shows the self-assembled monolayer (SAM) 255 removed from the first surface 245. The self-assembled monolayer (SAM) 255 is removed by an etching process. In some embodiments, the etching process may include any suitable means, including, but not limited to, a plasma cleaning process. In one or more embodiments, the self-assembled monolayer (SAM) 255 is removed by plasma treatment. In some embodiments, the plasma includes one or more of hydrogen (H ), nitrogen (N ), or argon (Ar) plasma. As used herein, a plasma including hydrogen, nitrogen, or argon refers to a plasma formed from the molecular form of the named species. In some embodiments, the plasma consists essentially of hydrogen, nitrogen, argon, or a combination thereof. In some embodiments, the self-assembled monolayer (SAM) 255 is removed without substantially damaging the liner 260.

[0060]

[0062] The power of the plasma can vary depending on the composition, packing, and / or thickness of the self-assembled monolayer (SAM) and the composition and / or thickness of the surrounding material. In some embodiments, the plasma power is in the range of about 20 W to about 500 W, about 20 W to about 400 W, about 20 W to about 250 W, about 50 W to about 500 W, about 100 W to about 500 W, about 100 W to about 450 W, about 100 W to about 500 W, or about 200 W to about 400 W. In some embodiments, the plasma power is about 50 W, about 200 W, or about 400 W.

[0061]

[0063] The duration of plasma exposure can vary depending on the composition, packing, and / or thickness of the self-assembled monolayer (SAM) 255 and the composition and / or thickness of the surrounding material. In some embodiments, the substrate is exposed to the plasma for a period of time within a range from about 2 seconds to about 60 seconds, from about 3 seconds to about 30 seconds, or from about 5 seconds to about 10 seconds. In some embodiments, the substrate is exposed to the plasma for a period of time of about 3 seconds, about 5 seconds, about 10 seconds, or about 30 seconds.

[0062]

[0064] 1 and 2E, in step 110, adhesion layer 265 is deposited on barrier layer 260 and first surface 245. FIG. 2F shows adhesion layer 265 deposited on barrier layer 260 and first surface 245. In some embodiments, adhesion layer 265 is conformally deposited on barrier layer 260 and first surface 245. In some embodiments, the thickness of adhesion layer 265 on barrier layer 260 is the same as the thickness of adhesion layer 265 on first surface 245. In some embodiments, the thickness of adhesion layer 265 on barrier layer 260 is different from the thickness of adhesion layer 265 on first surface 245. In some embodiments, the thickness of adhesion layer 265 on barrier layer 260 is greater than the thickness of adhesion layer 265 on first surface 245. In some embodiments, adhesion layer 265 may comprise any suitable material known to one of ordinary skill in the art and may be deposited by any suitable technique known to one of ordinary skill in the art.

[0063]

[0065] 1 and 2F, in step 112, method 100 includes depositing conductive material 270 in at least one feature 240 by exposing the substrate to a third precursor. In some embodiments, the third precursor includes a metal. In some embodiments, the third precursor includes copper, cobalt, ruthenium, tungsten, molybdenum, or a combination thereof. In some embodiments, conductive material 270 is deposited on adhesion layer 265 by a gap-fill process. In some embodiments, the gap-fill process includes a bottom-up fill or a conformal fill. FIG. 2G shows conductive material 270 forming an interconnect within feature 245.

[0064]

[0066] The conductive material 270 can be any suitable material known to those skilled in the art, in some embodiments, the conductive fill material 270 includes one or more of copper (Cu), cobalt (Co), ruthenium (Ru), tungsten (W), and molybdenum (Mo).

[0065]

[0067] In some embodiments, feature 240 includes a bottom and a top. In some embodiments, the bottom includes a via. In some embodiments, the top includes a trench. In some embodiments, a first conductive fill material is grown in a bottom-up manner to fill the via portion that comprises the bottom of feature 240. In some embodiments, a second conductive material is deposited on the top. In some embodiments, the first conductive material and the second conductive material are the same. In some embodiments, the first conductive material and the second conductive material are different. In some embodiments, the entire feature 240 is filled at once with a single conductive material, filling both the bottom and top of feature 240 in a single process.

[0066]

[0068] Conductive material 270 can be deposited by any suitable technique known to those skilled in the art. In some embodiments, conductive material 270 is deposited by one or more of a chemical vapor deposition (CVD) process, an atomic layer deposition (ALD) process, or a physical vapor deposition (PVD) process. In some embodiments, conductive material 270 is deposited to overfill feature 240 and form an overload on the surface of substrate 210. The overload is then removed by any suitable technique (e.g., etching, chemical mechanical planarization (CMP), etc.).

[0067]

[0069] Without intending to be bound by theory, it is believed that the self-assembled monolayer (SAM) 255 only slightly increases the resistance of the conductive fill material 270 compared to the increase in resistance typically seen with most barrier layers (e.g., film 260). Therefore, removal of the self-assembled monolayer (SAM) 255 is an optional process that may further reduce the resistance of the conductive fill material 270. In some embodiments, removal of the self-assembled monolayer (SAM) 255 reduces the resistance of the metal interconnect 270 by 30%, 20%, 10%, or 5%.

[0068]

[0070] An additional embodiment of the present disclosure is directed to a processing tool 900 for forming the described devices and methods, as shown in FIG. 3 . Various multi-processing platforms, such as the Centura®, Dual ACP, Producer® GT, and Endura® platforms available from Applied Materials®, as well as other processing systems, may be utilized. In one or more embodiments, the cluster tool 900 includes at least one central transfer station 921, 931 having multiple sides. Robots 925, 935 are disposed within the central transfer stations 921, 931 and configured to move the robot blade and wafer to each of the multiple sides.

[0069]

[0071] The cluster tool 900 includes multiple processing chambers 902, 904, 906, 908, 910, 912, 914, 916, and 918, also referred to as process stations, connected to a central transfer station. The various processing chambers provide distinct processing regions separated from adjacent processing stations. The processing chambers may be any suitable chamber, including, but not limited to, selective metal deposition chambers, barrier metal deposition chambers, metal deposition chambers, PVD metal deposition chambers, CVD metal deposition chambers, self-assembled monolayer (SAM) deposition chambers, liner metal deposition chambers, plasma chambers, pre-clean chambers, etch chambers, one or more transfer spaces, wafer orientation / degassing chambers, cryogenic cooling chambers, etc. The specific arrangement of processing chambers and components may vary depending on the cluster tool and should not be construed as limiting the scope of the present disclosure.

[0070]

[0072] In one or more embodiments, the cluster tool 900 includes a self-assembled monolayer (SAM) deposition chamber for exposing the substrate to a planar hydrocarbon to form a self-assembled monolayer (SAM). In one or more embodiments, the cluster tool 900 includes a pre-clean chamber connected to a central transfer station.

[0071]

[0073] 3, a factory interface 950 is connected to the front of the cluster tool 900. The factory interface 950 includes a loading chamber 954 and an unloading chamber 956 on the front 951 of the factory interface 950. Although the loading chamber 954 is shown on the left and the unloading chamber 956 is shown on the right, one skilled in the art will understand that this represents only one possible configuration.

[0072]

[0074] The size and shape of the loading chamber 954 and unloading chamber 956 can vary depending on, for example, the substrates being processed in the cluster tool 900. In the illustrated embodiment, the loading chamber 954 and unloading chamber 956 are sized to hold a wafer cassette with multiple wafers arranged within the cassette.

[0073]

[0075] The robot 952 resides within the factory interface 950 and can move between a loading chamber 954 and an unloading chamber 956. The robot 952 can transfer wafers from a cassette in the loading chamber 954 through the factory interface 950 to a load lock chamber 960. The robot 952 can also transfer wafers from the load lock chamber 962 through the factory interface 950 to a cassette in the unloading chamber 956. As will be appreciated by those skilled in the art, the factory interface 950 can include multiple robots 952. For example, the factory interface 950 can include a first robot that transfers wafers between the loading chamber 954 and the load lock chamber 960 and a second robot that transfers wafers between the load lock chamber 962 and the unloading chamber 956.

[0074]

[0076] The illustrated cluster tool 900 has a first section 920 and a second section 930. The first section 920 is connected to a factory interface 950 through load lock chambers 960, 962. The first section 920 includes a first transfer chamber 921 with at least one robot 925 disposed therein. The robot 925 is also referred to as a robotic wafer transport mechanism. The first transfer chamber 921 is centrally located relative to the load lock chambers 960, 962, the processing chambers 902, 904, 916, 918, and the buffer chambers 922, 924. In some embodiments, the robot 925 is a multi-arm robot capable of independently moving multiple wafers at a time. In one or more embodiments, the first transfer chamber 921 includes multiple robotic wafer transfer mechanisms. The robot 925 in the first transfer chamber 921 is configured to move wafers between chambers surrounding the first transfer chamber 921. Individual wafers are carried on a wafer transport blade located at the distal end of the first robotic mechanism.

[0075]

[0077] After processing the wafer in the first section 920, the wafer may pass through a pass-through chamber to the second section 930. For example, chambers 922, 924 may be unidirectional or bidirectional pass-through chambers. The pass-through chambers 922, 924 may be used, for example, to cryogenically cool the wafer before processing in the second section 930, or to allow wafer cooling or post-processing before returning to the first section 920.

[0076]

[0078] A system controller 990 is in communication with the first robot 925, the second robot 935, the first plurality of processing chambers 902, 904, 916, 918, and the second plurality of processing chambers 906, 908, 910, 912, 914. The system controller 990 may be any suitable component capable of controlling the processing chambers and robots. For example, the system controller 990 may be a computer including a central processing unit, memory, appropriate circuitry, and storage.

[0077]

[0079] The processes may generally be stored in the memory of the system controller 990 as software routines that, when executed by a processor, cause the processing chamber to perform the processes of the present disclosure. The software routines may be stored and / or executed by a second processor (not shown) located remotely from the hardware controlled by the processor. Some or all of the methods of the present disclosure may also be performed in hardware. Thus, the processes may be implemented in software and executed using a computer system, for example, in hardware as an application-specific integrated circuit or other type of hardware implementation, or as a combination of software and hardware. The software routines, when executed by a processor, transform a general-purpose computer into a special-purpose computer (controller) that controls chamber operation to perform the processes.

[0078]

[0080] In one or more embodiments, the processing tool 900 includes a central transfer station 921, 931 with at least one robot 925, 935 configured to transfer wafers, one or more of a selective via fill station, a reverse selective deposition station, a self-assembled monolayer (SAM) formation station, a CVD station, or a PVD station connected to the central transfer station, an optional pre-clean station connected to the central transfer station, and at least one controller connected to one or more of the central transfer station, the selective via fill station, the reverse selective deposition station, the self-assembled monolayer (SAM) formation station, the CVD station, the PVD station, or the optional pre-clean station. In one or more embodiments, the at least one controller has at least one configuration selected from: a configuration for transferring wafers between stations using a robot; a configuration for selectively filling vias; a configuration for exposing a substrate to a planar hydrocarbon to form a self-assembled monolayer (SAM); a configuration for reverse selective deposition of a barrier layer; a configuration for depositing a metal; and a configuration for pre-cleaning wafers.

[0079]

[0081] In one or more embodiments, the processing tool includes a pre-clean chamber having a substrate support therein, a selective metal deposition chamber, a barrier metal deposition chamber, a metal deposition chamber, a PVD metal deposition chamber, a CVD metal deposition chamber, a self-assembled monolayer (SAM) deposition chamber optionally including an optional pre-clean, an optional liner metal deposition chamber, an optional plasma chamber, an optional etch chamber, and a robot configured to access the pre-clean chamber, the selective deposition chamber, the optional self-assembled monolayer (SAM) deposition chamber, the barrier metal deposition chamber, the PVD metal deposition chamber, the optional plasma chamber, the optional etch chamber, the optional liner metal deposition chamber, and the CVD metal deposition chamber. and a PVD metal deposition chamber, a controller connected to the pre-clean chamber, the selective deposition chamber, the optional self-assembled monolayer (SAM) deposition chamber, the barrier metal deposition chamber, the PVD metal deposition chamber, the optional plasma chamber, the optional etch chamber, the optional liner metal deposition chamber, the CVD metal deposition chamber, and the PVD metal deposition chamber, and a robot, wherein the controller has one or more configurations selected from cleaning the substrate, selectively forming a self-assembled monolayer (SAM), selectively depositing a liner, optionally forming a metal liner, forming a metallization layer, optionally etching the substrate, and optionally removing the self-assembled monolayer (SAM).

[0080]

[0082] Throughout this specification, references to "one embodiment," "a particular embodiment," "one or more embodiments," or "an embodiment" mean that a particular feature, structure, material, or characteristic described in connection with an embodiment is included in at least one embodiment of the present disclosure. Thus, the appearances of the phrases "in one or more embodiments," "a particular embodiment," "in one embodiment," or "an embodiment" in various places throughout this specification do not necessarily refer to the same embodiment of the present disclosure. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.

[0081]

[0083] Although the disclosure herein has been described with reference to particular embodiments, those skilled in the art will recognize that the described embodiments are merely illustrative of the principles and applications of the present disclosure. It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed method and apparatus without departing from the spirit and scope of the present disclosure. Accordingly, the present disclosure includes modifications and variations that come within the scope of the appended claims and their equivalents.

Claims

1. 1. A method of forming a semiconductor structure, the method comprising: Selectively depositing a self-assembled monolayer (SAM) on a first surface of a substrate by exposing the substrate to a first precursor, the substrate having at least one feature comprising the first surface and a second surface, the first precursor Formula (xiv) to Formula (xviii) or Formula (xix) to Formula (xxvii) wherein each n is independently 1 to 20 and each R is independently selected from H, a C1-C10 alkyl group, or an aryl group; Selectively depositing a self-assembled monolayer (SAM); selectively depositing a liner on the second surface by exposing the substrate to a second precursor; removing the self-assembled monolayer (SAM); Including, The method, wherein the first surface comprises a metal and the second surface comprises a dielectric material.

2. 10. The method of claim 1, wherein selectively depositing the self-assembled monolayer (SAM) comprises forming the SAM on the first surface and not on the second surface.

3. The method of claim 1 , wherein selectively depositing the liner comprises forming the liner on the second surface and not on the first surface.

4. 10. The method of claim 1, further comprising cleaning the substrate prior to depositing the self-assembled monolayer (SAM) to form a substantially oxide-free substrate surface.

5. The method of claim 1 , wherein the first surface comprises one or more of copper (Cu), cobalt (Co), ruthenium (Ru), tungsten (W), and molybdenum (Mo).

6. The method of claim 1 , further comprising depositing an adhesion layer on the first surface and on the liner after removing the self-assembled monolayer (SAM).

7. The method of claim 1 , wherein the at least one feature comprises one or more of a trench and a via.

8. 10. The method of claim 1, further comprising depositing a conductive material in the at least one feature by exposing the substrate to a third precursor, the third precursor comprising a metal.

9. The method of claim 8 , wherein depositing the conductive material comprises one or more of bottom-up gap fill and conformal gap fill.

10. 10. The method of claim 1, wherein the first precursor is substantially free of one or more of metals, halogens, or nitrogen, said substantially free referring to less than 5% by weight on an atomic basis.

11. The method of claim 1 , wherein the first precursor comprises at least one unsaturated group.

12. The method of claim 1 , wherein the first precursor comprises at least one hydroxyl group.

13. The method of claim 1 , wherein the first precursor comprises at least one ether group.

14. The method of claim 1 , wherein the first precursor comprises at least one amine group.

15. The method of claim 1 , wherein the first precursor has a molecular weight in the range of 50 to 500 daltons.

16. 10. The method of claim 1, wherein the first precursor has a vapor pressure in the range of 100 mTorr to 100 Torr at 120°C.

17. 1. A method of forming a semiconductor structure, the method comprising: exposing a substrate to at least one first precursor to selectively deposit a self-assembled monolayer (SAM) on a first surface of the substrate, the substrate having at least one feature comprising the first surface and a second surface; exposing the substrate to a second precursor to selectively deposit a liner on the second surface; removing the self-assembled monolayer (SAM); Including, the first surface comprises a metal selected from one or more of copper (Cu), cobalt (Co), ruthenium (Ru), tungsten (W), and molybdenum (Mo); the second surface comprises a dielectric material; the first precursor has a molecular weight in the range of 50 to 500 daltons; The first precursor is represented by formula (xiv) to formula (xviii): wherein each n is independently 1 to 20 and each R is independently selected from H, a C1-C10 alkyl group, or an aryl group.

18. 1. A method of forming a semiconductor structure, the method comprising: exposing a substrate to at least one first precursor to selectively deposit a self-assembled monolayer (SAM) on a first surface of the substrate, the substrate having at least one feature comprising the first surface and a second surface; exposing the substrate to a second precursor to selectively deposit a liner on a second surface; removing the self-assembled monolayer (SAM); Including, the first surface comprises a metal selected from one or more of tungsten (W) and molybdenum (Mo); the second surface comprises a dielectric material; the first precursor has a vapor pressure in the range of 100 mTorr to 100 Torr at 120°C; The first precursor is represented by formula (xix) to formula (xxvii): wherein each R is independently selected from H, a C1-C10 alkyl group, or an aryl group.

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