Liquid ejection head and manufacturing method thereof

Abstract

To provide a liquid discharge head which makes a recording element substrate 1 less likely to be damaged by an adhesive and has less restriction on its downsizing.SOLUTION: A liquid discharge head includes: a recording element substrate 1 having discharge ports 14 which discharge liquid; a support member 5 supporting the recording element substrate 1; and an adhesive 31 which is provided between the recording element substrate 1 and the support member 5 and joins the recording element substrate 1 to the support member 5. The recording element substrate 1 has: a liquid supply port 17 which faces the support member 5 and communicates with the discharge ports 14; a first surface 21 which faces the support member 5 and surrounds the supply port 17; a second surface 22 which faces the support member 5 and is provided along at least a part of an outer edge part 21a of the first surface 21 and receded from the support member 5 more than the first surface 21. The adhesive 31 fills a first space 24 between the first surface 21 and the support member 5 and fills at least a part of a second space 25 between the second surface 22 and the support member 5.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a liquid ejection head that ejects liquid such as ink to perform recording, and a method for manufacturing the same. [Background technology]

[0002] A liquid ejection head has a recording element substrate having ejection ports for ejecting liquid and a support member that supports the recording element substrate, with the recording element substrate being bonded to the support member with an adhesive. Patent Document 1 discloses a liquid ejection head having a groove formed on the outer side of the bonding surface of the recording element substrate with the support member, at a position lower than the bonding surface. If the bonding surface is covered with a sealant, the recording element substrate is constrained by the sealant, which could result in damage to the recording element substrate. The groove receives the sealant and limits the area of ​​the recording element substrate that is covered by the sealant. This reduces the effect of the sealant on the recording element substrate and reduces the possibility of damage to the recording element substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-187804 Summary of the Invention [Problem to be solved by the invention]

[0004] When bonding the recording element substrate to the support member, adhesive is applied to a predetermined area of ​​the support member and then pressed against the adhesive by the recording element substrate. This spreads the adhesive over the bonding surface of the recording element substrate, ensuring a secure bond. At this time, some of the remaining adhesive spreads to the outer wall of the recording element substrate. The adhesive absorbs the liquid, swells, and presses against the recording element substrate. Because a cavity is formed inside the recording element substrate as a liquid supply port, the recording element substrate may deform inward and be damaged. As shown in Patent Document 1, providing a groove adjacent to the bonding surface reduces the amount of adhesive adhering to the outer wall of the recording element substrate, but providing the groove may limit the miniaturization of the recording element substrate.

[0005] SUMMARY OF THE INVENTION An object of the present invention is to provide a liquid ejection head in which the recording element substrate is less likely to be damaged by an adhesive and in which there are fewer restrictions on miniaturization. [Means for solving the problem]

[0006] According to one aspect of the present invention, a liquid ejection head includes a rectangular first recording element substrate having ejection ports for ejecting liquid, a support member for supporting the first recording element substrate, and an adhesive provided between the first recording element substrate and the support member for bonding the first recording element substrate to the support member. The first recording element substrate has a liquid supply port extending in the longitudinal direction of the first recording element substrate, facing the support member and communicating with the ejection ports. , support Facing the support member Shiko supply mouth Take a first surface surrounding the support member and a second surface facing the support member; The The recording element substrate has a second surface that is provided along the long side of the first recording element substrate at the outer edge of the first surface and is recessed from the first surface relative to the support member. the second surface is connected to the first surface, is inclined relative to the first surface, and is a concave surface recessed relative to the support member or a convex surface protruding relative to the support member; The adhesive fills a first space between the first surface and the support member, and also fills at least a portion of a second space between the second surface and the support member. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a liquid ejection head in which the recording element substrate is less likely to be damaged by the adhesive and in which there are fewer restrictions on miniaturization. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is an exploded perspective view of a liquid ejection head according to a first embodiment. [Figure 2] 2A and 2B are a plan view and a cross-sectional view of the liquid ejection head shown in FIG. [Figure 3] FIG. 2 is an enlarged cross-sectional view of the liquid ejection head shown in FIG. [Figure 4] FIG. 2 is an enlarged cross-sectional view of a liquid ejection head according to Comparative Example 1. [Figure 5]10A and 10B are schematic diagrams showing deformation of the recording element substrate of Comparative Example 1. [Figure 6] 10A and 10B are a plan view and a cross-sectional view of a liquid ejection head according to a second embodiment. [Figure 7] FIG. 7 is an enlarged cross-sectional view of the liquid ejection head shown in FIG. [Figure 8] FIG. 10 is an enlarged cross-sectional view of a liquid ejection head according to a third embodiment. [Figure 9] FIG. 10 is an enlarged cross-sectional view of a liquid ejection head according to Comparative Example 2. [Figure 10] FIG. 10 is an enlarged cross-sectional view of a liquid ejection head according to a fourth embodiment. [Figure 11] FIG. 10 is an enlarged cross-sectional view of a liquid ejection head according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0009] Several embodiments of the present invention will be described below with reference to the drawings. In the following embodiments, an inkjet head that ejects ink will be described, but the present invention can be widely applied to liquid ejection heads that eject liquids other than ink. In the following embodiments, the X direction refers to the direction parallel to the long sides of the recording element substrate, or the longitudinal direction of the recording element substrate, and the Y direction refers to the direction parallel to the short sides of the recording element substrate, or the lateral direction of the recording element substrate. The Z direction refers to the direction perpendicular to the X and Y directions.

[0010] (First embodiment) FIG. 1 is an exploded perspective view of a liquid ejection head 100 according to a first embodiment. FIG. 2(a) is a top view of the liquid ejection head 100 as viewed from the recording element substrate, and FIG. 2(b) is a cross-sectional view of the recording element substrate 1 and the support member 5 taken along line 2A-2A in FIG. 2(a). FIG. 3 is an enlarged view of portion A in FIG. 2(b). The liquid ejection head 100 includes a recording element substrate 1 (first recording element substrate), a support member 5 that supports the recording element substrate 1, and an electrical wiring member 2 that is electrically connected to the recording element substrate 1. When viewed in the Z direction, i.e., a direction perpendicular to the ejection port formation surface 10a, the recording element substrate 1 has a rectangular shape having a pair of parallel long sides 1L and a pair of parallel short sides 1S. An adhesive 31 is provided between the recording element substrate 1 and the support member 5, and the recording element substrate 1 is bonded to the support member 5 by the adhesive 31. The adhesive 31 has excellent fluidity and a certain hardness after curing. This allows the adhesive 31 to be applied uniformly to the wide bonding surface of the recording element substrate 1, and also makes it easy to ensure the accuracy of the bonding position of the recording element substrate 1.

[0011] The recording element substrate 1 includes a substrate 9 and an ejection port forming member 10. The ejection port forming member 10 is formed with ejection ports 14 for ejecting liquid and pressure chambers 15 for temporarily holding the liquid ejected from the ejection ports 14. The ejection ports 14 are arranged on an ejection port forming surface 10a, which is the surface of the ejection port forming member 10 opposite the support member 5. A large number of ejection ports 14 are arranged parallel to the long side 1L of the recording element substrate 1. The substrate 9 is provided with energy generating elements 16 that generate energy for ejecting the liquid. The energy generating elements 16 are thermoelectric conversion elements, but may also be other types of elements such as piezoelectric elements. The substrate 9 is formed with a liquid supply section 12, which is a flow path that supplies liquid to the pressure chambers 15. To supply liquid evenly to each ejection port 14, the supply section 12 is a hollow that is elongated in the longitudinal direction of the recording element substrate 1. The supply section 12 has a rectangular opening facing the support member 5. This opening forms a liquid supply port 17.

[0012] The support member 5 has a support plate 3 and a frame member 4 joined to the support plate 3. A liquid supply path 13 that communicates with a supply unit 12 is formed in the support plate 3. The frame member 4 surrounds the recording element substrate 1. By joining the support plate 3 and the frame member 4, a support member 5 having a recess is formed, and the recording element substrate 1 is joined to the support plate 3, which is the bottom surface of the recess. The support member 5 is joined to a sub-tank 6. The sub-tank 6 has a liquid supply port 7. Liquid is supplied from a main tank (not shown) through the liquid supply port 7 to the sub-tank 6, and then supplied from the sub-tank 6 to the support member 5.

[0013] The electrical wiring member 2 is an electrical wiring tape for sending electrical signals to the recording element substrate 1. The electrical wiring member 2 is joined to the frame member 4 with an adhesive (not shown). The electrical wiring member 2 is connected to an electrical wiring board 8, and the electrical wiring board 8 receives electrical signals from the main body of the liquid ejection device (not shown). Electrical connection portions 19 are formed by connecting the electrical connection pads 30 (see FIG. 5) of the recording element substrate 1 to the electrical wiring member 2 via leads 18. In other words, the electrical connection portions 19 are made up of the electrical connection pads 30 of the recording element substrate 1 and the leads 18. The electrical connection portions 19 are provided along (only) the short sides 1S on both sides of the recording element substrate 1.

[0014] The electrical connection portions 19 are covered or sealed with a first sealant 32. The first sealant 32 also fills the space below the leads 18, i.e., the space formed by the bottom surface of the support plate 3, the side surface of the frame member 4, the outer wall 20 of the recording element substrate 1, and the leads 18. The first sealant 32 must harden while maintaining a certain thickness, so a material with low fluidity is preferred. Furthermore, since the first sealant 32 comes into contact with a recovery unit (not shown) during use of the liquid ejection device, a material with both hardness and durability is preferred. Movement of the recording element substrate 1 in the X direction is restricted by the first sealant 32. The first sealant 32 also spreads to the long side 1L of the recording element substrate 1 due to capillary force and adheres to the outer wall 20 of the recording element substrate 1. However, because the amount of the first sealant 32 is limited, the portion of the long side 1L of the recording element substrate 1 near the short side 1S is covered with the first sealant 32, but the central portion is not. Therefore, the movement of the recording element substrate 1 in the Y direction is not greatly restricted.

[0015] A liquid ejection head 200 of the comparative example will now be described. FIG. 4 shows a cross-sectional view of the liquid ejection head 200 of the comparative example, similar to FIG. 3. The recording element substrate 1 of the liquid ejection head 200 of the comparative example has a liquid supply port 17 that faces the support member 5 and communicates with the ejection port 14, and a bonding surface 26 that faces the support member 5 and surrounds the supply port 17. An adhesive 31 is provided between the bonding surface 26 and the support member 5, and the recording element substrate 1 is bonded to the support member 5. The bonding surface 26 is a frame-shaped flat surface that extends from the supply section 12 of the recording element substrate 1 to the outer wall 20. Specifically, the adhesive 31 is applied or transferred to the support plate 3 in a predetermined pattern, the bonding surface 26 of the recording element substrate 1 is positioned relative to the adhesive 31, and the bonding surface 26 of the recording element substrate 1 is pressed against the adhesive 31. The adhesive 31 is then cured at a high temperature, and the recording element substrate 1 is bonded to the support member 5. When pressed, the adhesive 31 overflows onto the supply section 12 and the outer wall 20. The adhesive 31 overflowing onto the outer wall 20 forms a meniscus at the corner formed by the support plate 3 and the recording element substrate 1, spreads along the periphery of the recording element substrate 1, and hardens.

[0016] When recording is performed using the liquid ejection head 200 fabricated in this manner, the adhesive 31 that spreads along the long side 1L of the recording element substrate 1 absorbs ink, expands, and pushes the recording element substrate 1 in the short direction (Y direction) (arrow in Figure 4). If a large amount of the adhesive 31 protrudes onto the outer wall 20, the adhesive 31 spreads along the outer wall 20 of the recording element substrate 1 in the Z direction. As a result, the area of ​​the outer wall 20 of the recording element substrate 1 that is pressed by the adhesive 31 increases. This pushes the recording element substrate 1 inward, deforming the supply unit 12. Figure 5 is a schematic top view showing the deformation state when the recording element substrate 1 is damaged. Stress is generated at the corner 27 of the supply unit 12, causing cracks to form in the recording element substrate 1 starting from the corner 27, resulting in damage. The force pushing up the recording element substrate 1 in the Z direction also increases. Although the impact of the upward force in the Z direction is smaller than the pressing force in the Y direction, it can still lead to deformation or damage of the recording element substrate 1. In particular, a recording element substrate 1 having a large aspect ratio (ratio of the long side 1L dimension to the short side 1S dimension) and a supply section 12 shaped in accordance with the aspect ratio is significantly deformed by a load applied in the Y direction from the long side 1L.

[0017] 3, in this embodiment, the recording element substrate 1 has a liquid supply port 17 that faces the support member 5 and communicates with the ejection ports 14, a first surface 21 that faces the support member 5 and surrounds the supply port 17, a second surface 22, and a third surface 23. The second surface 22 faces the support member 5 and is recessed from the support member 5 relative to the first surface 21. The third surface 23 connects the first surface 21 and the second surface 22. In other words, the recording element substrate 1 has the supply port 17 that faces the support member 5 and communicates with the ejection ports 14, a facing portion 28 that faces the support member 5 and surrounds the supply port 17, an outer wall 20, and a cutout portion 29 formed across the facing portion 28 and the outer wall 20. The cutout portion 29 is a step 29a. The first surface 21 and the second surface 22 are parallel to each other, and the third surface 23 intersects with the first surface 21 and the second surface 22. Preferably, the third surface 23 is perpendicular to the first surface 21 and the second surface 22. This makes the third surface 23 a surface extending in the Z direction, making it easier to form. The adhesive 31 fills the first space 24 between the first surface 21 and the support member 5, and also fills at least a portion of the second space 25 between the second surface 22 and the support member 5. In other words, the adhesive 31 fills the first space 24 between the first surface 21 and the support member 5, and also fills at least a portion of the missing portion 29. In this embodiment, the adhesive 31 covers the entire surface of the second surface 22 and the third surface 23, fills the second space 25, and partially protrudes outside the outer wall 20 of the recording element substrate 1.

[0018] In this embodiment, the first surface 21, the second surface 22, and the third surface 23 are flat, but for example, the second surface 22 and the third surface 23 may be curved. As long as the second surface 22 is recessed relative to the support member 5 more than the first surface 21, the shapes of the second surface 22 and the third surface 23 or the shape of the second space 25 are not limited in any way. "Recessed" means that the average distance in the Z direction from the surface 5a of the support member 5 facing the recording element substrate 1 is greater for the second surface 22 than for the first surface 21. In extreme cases, a portion of the second surface 22 may protrude beyond the surface 5a of the support member 5 facing the recording element substrate 1. A plurality of second surfaces 22 and a plurality of third surfaces 23 may be provided as stair-like steps.

[0019] The second surface 22 or step 29a is provided along (only) the long side 1L of the recording element substrate 1. The second surface 22 is not provided along the short side 1S of the recording element substrate 1. This is because the short side 1S of the recording element substrate 1 is short, and the force pushing the recording element substrate 1 from the short side 1S in the X direction is small and negligible. Furthermore, considering the stability of the bonding of the electrical connection portion 19, the need for the second surface 22 is small. However, depending on the aspect ratio of the recording element substrate 1, the second surface 22 can also be provided along the short side 1S of the recording element substrate 1. Furthermore, while it is preferable to provide the second surface 22 along the entire length of the long side 1L of the recording element substrate 1, it is also possible to provide it only in the center of the long side 1L, for example. As shown in FIG. 5, the center of the long side 1L is the most susceptible to deformation, so providing the second surface 22 only in the center of the long side 1L is also effective. That is, the second surface 22 may be provided along at least a part of the outer edge 21 a of the first surface 21 .

[0020] When pressed, the adhesive 31 overflows onto the supply unit 12 and the outer wall 20 of the recording element substrate 1, but a portion of the adhesive 31 is contained in the second space 25. As shown in FIG. 3 , the adhesive 31 overflowing from the outer wall 20 forms a meniscus between the support plate 3, the recording element substrate 1, and the second space 25. Although a portion of the adhesive 31 rises up the outer wall 20, a portion of the adhesive 31 is contained in the second space 25, so the amount of adhesive 31 overflowing from the outer wall 20 is reduced. In other words, the height of the overflowing adhesive 31 in the Z direction is lower than in the comparative example. Therefore, the area over which the adhesive 31, which has absorbed ink and swelled, presses the recording element substrate 1 in the Y direction is reduced, and the force with which the adhesive 31 presses the outer wall 20 of the recording element substrate 1 in the Y direction is reduced. The reduction in the amount of adhesive 31 overflowing from the outer wall 20 in the Y direction also reduces the force with which the adhesive 31 presses the outer wall 20 of the recording element substrate 1. This reduces the possibility of damage to the recording element substrate 1. The adhesive material 31 accommodated in the second space 25 does not have a significant effect on the recording element substrate 1.

[0021] Furthermore, because the adhesive 31 contacts the recording element substrate 1 on the first to third surfaces 21, 22, and 23, the contact area between the adhesive 31 and the recording element substrate 1 increases. This anchor effect increases the bonding strength between the recording element substrate 1 and the support member 5, and the recording element substrate 1 is more firmly fixed to the support member 5. Furthermore, there is no need for a portion to hold the adhesive 31 that protrudes between the outer wall 20 of the recording element substrate 1 and the frame member 4. As described above, this embodiment not only reduces the possibility of damage to the recording element substrate 1, but is also effective in improving the bonding reliability between the recording element substrate 1 and the support member 5 and miniaturizing the liquid ejection head.

[0022] When printing was performed using the liquid ejection head 100 of the first embodiment, the ink ejection amount per ejection port 14 was 4.0×10 8 After applying the pulses, no damage was observed on the recording element substrate 1. In contrast, when printing was performed using the liquid ejection head 200 using the recording element substrate 1 of the comparative example, damage of 0.7×10 8 After the application of the pulses, a crack was found on the recording element substrate 1 starting from the corner 27 of the supply portion 12.

[0023] (Second embodiment) In this embodiment, multiple recording element substrates 1a, 1b, and 1c are provided, and the configuration of the sealing material has been changed accordingly from that of the first embodiment. Configurations and effects that are not described are the same as those of the first embodiment. Fig. 6(a) is a top view of the liquid ejection head 300 according to the second embodiment, as viewed from the recording element substrates 1a, 1b, and 1c of the liquid ejection head 300, and Fig. 6(b) is a cross-sectional view of the first to third recording element substrates 1a, 1b, and 1c and the support member 5, taken along line 6A-6A in Fig. 6(a). Fig. 7(a) is an enlarged view of part B in Fig. 6(b), and Fig. 7(b) is an enlarged view of part C in Fig. 7(a).

[0024] The liquid ejection head 300 has a first recording element substrate 1a, a second recording element substrate 1b, and a third recording element substrate 1c. The first to third recording element substrates 1a, 1b, and 1c are adjacent to one another and supported by a common support member 5. The first to third recording element substrates 1a, 1b, and 1c eject different liquids (e.g., inks of different colors), but their configurations are the same as the recording element substrate 1 of the first embodiment. A frame member 4 surrounds the first to third recording element substrates 1a, 1b, and 1c. A gap G1 between the first recording element substrate 1a and the second recording element substrate 1b is smaller than a gap G2 between the first recording element substrate 1a and the frame member 4 and a gap G2 between the third recording element substrate 1c and the frame member 4. Furthermore, the gap G1 between the second recording element substrate 1b and the third recording element substrate 1c is smaller than the gap G2 between the first recording element substrate 1a and the frame member 4 and the gap G2 between the third recording element substrate 1c and the frame member 4. This allows the liquid ejection head 100 to be made smaller.

[0025] In the first embodiment, the sealant filled under the leads 18 is the same as the sealant that seals the electrical connection portions 19. In contrast, in the second embodiment, small gaps G1 are provided between the first recording element substrate 1a and the second recording element substrate 1b and between the second recording element substrate 1b and the third recording element substrate 1c. These gaps G1 need to be filled to ensure stable sealing of the electrical connection portions 19. Therefore, the gaps G1 between the first recording element substrate 1a and the second recording element substrate 1b and between the second recording element substrate 1b and the third recording element substrate 1c are filled with a second sealant 33, which has higher fluidity than the first sealant 32. The second sealant 33 fills the gaps G1 by capillary force, and is filled up to the vicinity of the ejection-orifice forming surface 10a. Even after hardening, the second sealing material 33 has flexibility to relieve stress generated in the gap G1 due to dimensional changes of the first to third recording element substrates 1a, 1b, and 1c. The second sealing material 33 spreads around each of the recording element substrates 1a, 1b, and 1c due to capillary forces generated between the adhesive material 31 and the first to third recording element substrates 1a, 1b, and 1c, and between the adhesive material 31 and the support plate 3, and the adhesive material 31 is covered with the second sealing material 33. Then, the first sealing material 32 is applied along the short sides 1S of each of the recording element substrates 1a, 1b, and 1c to seal the electrical connection portions 19. The first sealing material 32 covers a portion of the upper surface of the second sealing material 33. Since the gap G2 between the first recording element substrate 1a and the third recording element substrate 1c and the frame member 4 is larger than the gap G1, the first sealing material 32 does not rise up to the ejection port formation surface 10a.

[0026] In this manner, when multiple recording element substrates 1a, 1b, and 1c are arranged adjacent to each other, particularly when three or more recording element substrates 1a, 1b, and 1c are arranged, the outer wall 20 of the outermost recording element substrate 1a or 1c, which faces the frame member 4, is pressed by the adhesive 31 and the second sealing material 33. The pressed area is also likely to be larger than in the first embodiment, and the stress on the recording element substrate 1 becomes more complex. In this embodiment, the first to third recording element substrates 1a, 1b, and 1c also have a liquid supply port 17 that faces the support member 5 and communicates with the ejection ports 14, a first surface 21 that faces the support member 5 and surrounds the supply port 17, a second surface 22, and a third surface 23. The second surface 22 faces the support member 5 and is provided along at least a portion of the outer edge portion 21a of the first surface 21, and is recessed from the support member 5 by the first surface 21. Therefore, a portion of the adhesive 31 is contained in the second space 25, and the amount of adhesive 31 that protrudes from the outer wall 20 is reduced. This reduces the area (height in the Z direction) that the adhesive 31 covers over the outer wall 20, and also reduces the total area (height in the Z direction) that the adhesive 31 and the second sealant 33 cover over the outer wall 20. As a result, the force with which the adhesive 31 and the second sealant 33, which have absorbed and swelled with ink, presses against the outer wall 20 of the recording element substrate 1 is also reduced. This embodiment has the effect of reducing the possibility of damage to the recording element substrates in a liquid ejection head in which multiple recording element substrates are arranged. This embodiment also has the effect of improving the bonding reliability between the recording element substrates 1a, 1b, and 1c and the support member 5, and of miniaturizing the liquid ejection head.

[0027] When printing was performed using the liquid ejection head 300 of the second embodiment, the ink ejection amount per ejection port 14 was 4.0×10 8 After applying the pulses 29a, no damage was observed on the recording element substrate 1. In contrast, when printing was performed with the liquid ejection head using the recording element substrate 1 without the step 29a in the second embodiment, damage of 0.6×10 8 After the application of the pulses, a crack was found on the recording element substrate 1 starting from the corner 27 of the supply portion 12.

[0028] (Third embodiment) 8 is an enlarged cross-sectional view of a liquid ejection head 100 according to a third embodiment of the present invention. Here, differences from the first and second embodiments will be mainly described. In the first and second embodiments, the entire second space 25 is filled with adhesive 31, and the adhesive 31 also spills onto the outer wall 20 of the recording element substrate 1, but in this embodiment, the adhesive 31 is filled only in a portion of the second space 25. The adhesive 31 covers the entire third surface 23, but it is sufficient that it covers at least a portion of the second surface 22.

[0029] 9 shows a liquid ejection head 400 of Comparative Example 2. Because the difference in height (the size of the step 29a) between the first surface 21 and the second surface 22 is large and the amount of adhesive 31 is small, the adhesive 31 adheres only to a portion of the third surface 23 and does not reach the second surface 22. In this case, the stress applied to the recording element substrate 1 is the same as when there is no step 29a. In this embodiment, as shown in FIG. 8, the adhesive 31 adheres to the second surface 22 due to capillary force generated in the corner formed by the second surface 22 and the third surface 23, so the amount of adhesive 31 that spills out can be reduced.

[0030] (Fourth embodiment) FIG. 10 is an enlarged cross-sectional view of a liquid ejection head 100 according to a fourth embodiment of the present invention. In this embodiment, a chamfer 29b is used instead of the step 29a. That is, the missing portion 29 is the chamfer 29b. The second surface 22 is connected to the first surface 21 and is inclined relative to the first surface 21. The second surface 22 is flat. The adhesive 31 fills the second space 25 and protrudes outside the outer wall 20 of the recording element substrate 1. Although not shown, as in the third embodiment, the adhesive 31 may fill only a portion of the second space 25. Although the storage volume of the adhesive 31 is smaller than that of the step 29a, this embodiment also achieves the same effects as the first to third embodiments. In particular, when the recording element substrate 1 is made of silicon, the chamfer 29b can be formed by anisotropic etching, as with the supply portion 12.

[0031] (Variation) The present invention is not limited to the above-described embodiment, and various modifications are possible. Referring to FIG. 11(a), the second surface 22 is a concave surface that is recessed toward the support member 5. The second surface 22 is a curved surface, but may also have a shape formed by connecting multiple flat surfaces. This modification allows for a larger amount of adhesive 31 to be accommodated. Referring to FIG. 11(b), the intersection of the second surface 22 with the outer wall 20 is chamfered (reference numeral 34). This modification also allows for a larger amount of adhesive 31 to be accommodated. Referring to FIG. 11(c), the second surface 22 is a concave surface that is recessed toward the support member 5. This modification allows for a larger amount of adhesive to be accommodated than in the fourth embodiment. Referring to FIG. 11(d), the second surface 22 is a convex surface that protrudes toward the support member 5. As a result, the outer wall 20 and the second surface 22 are formed as smooth surfaces, eliminating edges, making it less likely for cracks to originate from the edges.

[0032] (Method of manufacturing the liquid ejection head 100) Next, a method for manufacturing the liquid ejection head 100 will be described using the first embodiment as an example. First, a recording element substrate 1 is prepared, on which the energy generating elements 16, the ejection port forming member 10, etc. are provided. The second surface 22 of the recording element substrate 1 is formed by masking the first surface 21 of the joint with the support member 5 and then chemical polishing. The second surface 22 can also be formed by laser dicing. Alternatively, a blade dicing may be applied from the back surface (the surface on which the recording element substrates 1 are not formed) of the wafer on which the recording element substrates 1 are formed, and the steps 29a of adjacent recording element substrates 1 may be formed all at once. Thereafter, the boundaries between adjacent recording element substrates 1 are cut with a thin blade, and individual recording element substrates 1 are cut out from the wafer.

[0033] Next, adhesive 31 is applied to the support member 5 at a location where the recording element substrate 1 will be bonded, and the recording element substrate 1 is positioned relative to the support member 5. The adhesive 31 is applied or transferred to the support plate 3 in a predetermined pattern. The recording element substrate 1 is positioned relative to the support member 5 so that the supply port 17, first surface 21, and second surface 22 face the support member 5, the second surface 22 is recessed relative to the support member 5 more than the first surface 21, and the first surface 21 faces the adhesive 31. Next, the recording element substrate 1 is bonded to the support member 5 with the adhesive 31. By pressing the recording element substrate 1 against the support member 5, the adhesive 31 fills the first space 24 between the first surface 21 and the support member 5, and also fills at least a portion of the second space 25 between the second surface 22 and the support member 5.

[0034] Next, an adhesive is applied to the surface of the frame member 4 to which the electrical wiring member 2 is to be joined, and the electrical wiring member 2 is attached to a predetermined position on the frame member 4. Next, an electrical connection portion 19 between the recording element substrate 1 and the electrical wiring member 2 is formed by bonding. Next, a first sealing material 32 is applied to the periphery of the recording element substrate 1 using a dispenser, and while being sufficiently flowed, it fills the space between the recording element substrate 1 and the support member 5. Furthermore, the first sealing material 32 is applied to the electrical connection portion 19 (electrical connection pads 30 of the recording element substrate 1 and leads 18 of the electrical wiring substrate 8). Thereafter, the adhesive material 31 and the first sealing material 32 are heated and cured all at once. [Explanation of symbols]

[0035] 1, 1a, 1b, 1c First recording element substrate 5 Support member 21 First Side 22 Second Side 24 First Space 25 Second Space 31 Adhesive 100, 200, 300, 400 liquid ejection head

Claims

1. a first recording element substrate having a rectangular shape and an ejection port for ejecting a liquid; a support member for supporting the first recording element substrate; and an adhesive material provided between the first recording element substrate and the support member for bonding the first recording element substrate to the support member; The first recording element substrate includes: a liquid supply port extending in the longitudinal direction of the first recording element substrate, facing the support member and communicating with the ejection ports; a first surface facing the support member and surrounding the supply port; a second surface that faces the support member, is provided at an outer edge of the first surface along a long side of the first recording element substrate, and is recessed from the first surface with respect to the support member; the second surface is connected to the first surface, is inclined relative to the first surface, and is a concave surface recessed relative to the support member or a convex surface protruding relative to the support member; A liquid ejection head, wherein the adhesive fills a first space between the first surface and the support member, and also fills at least a portion of a second space between the second surface and the support member.

2. The liquid ejection head according to claim 1 , wherein the adhesive material fills only a portion of the second space.

3. 2. The liquid ejection head according to claim 1, wherein the adhesive fills the second space and protrudes outside the outer wall of the first recording element substrate.

4. a first recording element substrate having a rectangular shape and having ejection ports for ejecting a liquid; a support member for supporting the first recording element substrate; an adhesive material provided between the first recording element substrate and the support member and for joining the first recording element substrate to the support member; an electric wiring member electrically connected to the first recording element substrate; an electric connection portion between the first recording element substrate and the electric wiring member provided along a short side of the first recording element substrate; and a first sealant for sealing the electric connection portion; The first recording element substrate includes: a liquid supply port extending in the longitudinal direction of the first recording element substrate, facing the support member and communicating with the ejection ports; a first surface facing the support member and surrounding the supply port; a second surface that faces the support member, is provided at an outer edge of the first surface along a long side of the first recording element substrate, and is recessed from the first surface with respect to the support member; the adhesive fills a first space between the first surface and the support member, and also fills at least a portion of a second space between the second surface and the support member; a second recording element substrate adjacent to the first recording element substrate, supported by the support member, and having ejection ports for ejecting liquid; the support member has a frame member surrounding the first recording element substrate and the second recording element substrate, a gap between the first recording element substrate and the second recording element substrate is smaller than a gap between the first recording element substrate and the frame member; A liquid ejection head, wherein a second sealing material having higher fluidity than the first sealing material is filled between the first recording element substrate and the second recording element substrate.

5. The liquid ejection head according to claim 4 , wherein the adhesive material is covered with the second sealing material.

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