Liquid ejection head and liquid ejection device

Abstract

To provide a technique that can suppress the occurrence of shift of an arrangement position of a discharging substrate even if a passage member is thermally expanded.SOLUTION: A module provided with a substrate for discharging liquid and a passage that is fluid-coupled to the substrate is inserted and fitted into a frame body supporting a supporting member supporting the substrate so that the frame body and the passage oppose to each other through a space in a direction crossing an inserting direction. When inserted and fitted into the frame body, the module is contacted with the frame body in the inserting direction and is supported thereon.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present invention relates to a liquid ejection head that can be widely used as, for example, a recording head capable of ejecting ink by an inkjet method, and to a liquid ejection apparatus equipped with the liquid ejection head. [Background technology]

[0002] Patent Document 1 discloses a technology for constructing a recording head that ejects ink using an inkjet method by joining an ejection module including an ejection substrate that has ejection ports for ejecting ink and pressure generating chambers that communicate with the ejection ports, and a flow path member that supplies ink to the ejection substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-039795 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the print head using the technology disclosed in Patent Document 1, the ejection substrate needs to be positioned with high precision in order to form a high-resolution image. However, in such a print head, the ejection module and the flow path member are integrally formed using an adhesive. Therefore, for example, when ink is adjusted to a high temperature and ejected, the flow path member becomes hot due to the ink temperature, causing thermal expansion, and there is a risk that the position of the ejection substrate positioned with high precision will become misaligned.

[0005] The present invention has been made in consideration of the above-mentioned problems, and aims to provide a technology that can suppress the occurrence of misalignment of the ejection substrate even if the flow path member that supplies ink to the ejection substrate thermally expands. [Means for solving the problem]

[0006] In order to achieve the above object, one embodiment of a liquid ejection head according to the present invention comprises a module having a substrate capable of ejecting liquid by driving an ejection energy generating element and a flow path member fluidly connected to the substrate, a support member that supports the substrate, and a frame body that supports the module and the support member, wherein the frame body supports the inserted module and also supports the support member on the insertion surface of the module, and has an opening that penetrates in the insertion direction of the module, the opening area on the upstream side of the insertion direction being larger than the opening area on the downstream side of the insertion direction, and when the module is inserted into the frame body, the frame body and the flow path member face each other across a space in a direction intersecting the insertion direction of the module, and are supported in abutting contact in the insertion direction. [Effects of the Invention]

[0007] According to the present invention, even if the flow path member that supplies ink to the ejection substrate undergoes thermal expansion, it is possible to prevent the ejection substrate from being displaced in its position. [Brief explanation of the drawings]

[0008] [Figure 1] Schematic diagram of a recording device [Figure 2] A perspective view of the recording head [Figure 3] A perspective view of the substrate and flow path. [Figure 4] Exploded view of the recording head [Figure 5] Perspective configuration diagram of the discharge module [Figure 6] Exploded view of the dispensing module [Figure 7] Cross section of line VII-VII in Figure 5(a) [Figure 8] Enlarged view of box VIII in Figure 7 [Figure 9] IX arrow view of Figure 2(a) [Figure 10] Cross section of Figure 9 along line XX [Figure 11] Cross section of line XI-XI in Figure 10 [Figure 12] 1 is a perspective view of a recording head according to a different embodiment; [Figure 13] 13 is a perspective view of the substrate and flow path of the recording head of FIG. 12; [Figure 14] Exploded view of the recording head in Figure 12 [Figure 15] XV arrow view of Figure 12(a) [Figure 16] Cross section of line XVI-XVI in Figure 15 [Figure 17] Cross section of line XVII-XVII in Figure 15 DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an example of an embodiment of a liquid ejection head and a liquid ejection device will be described in detail with reference to the accompanying drawings. Note that the following embodiment does not limit the present invention, and not all of the combinations of features described in the present embodiment are necessarily essential to the solution of the present invention. Furthermore, the positions, shapes, etc. of the components described in the embodiment are merely examples, and are not intended to limit the scope of the present invention to those alone.

[0010] (First embodiment) First, a liquid ejection head according to a first embodiment will be described with reference to FIGS. 1 to 11. In this embodiment, an inkjet print head (hereinafter simply referred to as a "print head") capable of printing on an object by driving a piezoelectric element to eject ink will be described as an example of the liquid ejection head. Note that the ejection energy generating element is not limited to a piezoelectric element, and an electrothermal conversion element (heater element) may also be used. In this case, ink is ejected by bubbles generated by the heater element. Furthermore, the liquid ejection method is not limited to the above-mentioned method, and various known methods may be used.

[0011] <Recording device> Fig. 1 is a schematic diagram of a recording apparatus equipped with a recording head, which is a liquid ejection head according to this embodiment. The recording apparatus 10 shown in Fig. 1 is a recording apparatus that ejects ink from the recording head using an inkjet method to record on a recording medium P. The liquid ejected from the recording head is not limited to ink, but may also be a processing liquid that performs a predetermined process on the ink ejected onto the recording medium P.

[0012] The recording device 10 includes a transport unit 12 that transports a recording medium P in the +Y direction, and a recording unit 14 that ejects ink onto the recording medium P transported by the transport unit 12 to perform recording. The transport unit 12 includes a belt 20 that is endlessly stretched around two rollers 16 and 18. The roller 16 is a drive roller that is driven by the drive of a drive motor, and the roller 18 is a driven roller that rotates when the driving force of the roller 16 is transmitted via the belt 20.

[0013] The recording unit 14 includes recording heads 22 arranged such that the ink ejecting surface faces the recording medium P transported by the transport unit 12. In this embodiment, the recording unit 14 includes recording heads 22 that eject ink of different colors. Specifically, the recording unit 14 includes a recording head 22C that ejects cyan (C) ink, a recording head 22M that ejects magenta (M) ink, a recording head 22Y that ejects yellow (Y) ink, and a recording head 22K that ejects black (K) ink. In the recording device 10, the recording heads 22 are arranged in the +Y direction in the order of recording head 22C, recording head 22M, recording head 22Y, and recording head 22K.

[0014] Each recording head 22 has a plurality of ejection ports for ejecting ink arranged in the X direction, which intersects with the Y direction (orthogonal in this embodiment). The length in the X direction of the ejection port array formed by arranging a plurality of ejection ports in the recording head 22 corresponds to the width (X direction) of the largest recording medium P that can be recorded by the recording device 10. Each recording head 22 is connected to an ink tank (not shown) that stores the corresponding ink, and ink is configured to circulate between the ink tank and the recording head 22. Note that various known techniques can be used for the configuration for circulating ink between the ink tank and the recording head 22, and therefore a detailed description thereof will be omitted.

[0015] In this embodiment, ink is circulated between the ink tank and the print head 22, but this is not limiting. For example, instead of circulating ink, two tanks may be provided on either side of the print head, and ink may flow from one tank to the other to cause ink to flow within the print head 22. In the printing device 10, C ink is ejected under the control of a control unit (not shown) that controls the printing device 10 when the printing start position on the printing medium P is positioned below the print head 22C. The printing medium P is then transported, and ink is similarly ejected from the print heads 22M, 22Y, and 22K to perform printing on the printing medium P. That is, in this embodiment, the printing device 10 performs printing on the printing medium by transporting the printing medium in the +Y direction once. The configuration of the printing device 10 is not limited to the full-line type configuration described above, and may be a serial scan type or a flatbed type.

[0016] <Recording head configuration> Next, the configuration of the recording head mounted on the recording device 10 will be described. Fig. 2 is a perspective view of the recording head, where (a) is a view from the downstream side in the +Z direction, and (b) is a view from the upstream side in the +Z direction. Fig. 3 is a perspective view of the substrate section and flow path section housed inside the recording head of Fig. 2, where (a) is the substrate section and (b) is the flow path section. Fig. 4 is an exploded view of the recording head.

[0017] The recording head 22 includes a substrate section 202 including a recording element substrate 200 capable of ejecting ink, and a flow path section 204 in which a flow path is formed for supplying and recovering ink to and from the recording element substrate 200 (see FIGS. 3(a) and 3(b)). In this embodiment, the recording head 22 will be described as including one recording element substrate 200. The recording head 22 is housed in a cover member 206 with the substrate section 202 and the flow path section 204 connected and supported by a support member 205 (hereinafter also referred to as a "frame"). At this time, a flow path connection section 324 (described later) for connecting to an external flow path protrudes from the upper side of the recording head 22 (see FIG. 2(a)). Furthermore, the recording element substrate 200 is exposed from the lower surface of the recording head 22 while being supported by a recording element substrate support member 406 (described later) (see FIG. 2(b)).

[0018] The substrate unit 202 includes a recording element substrate 200, a drive circuit substrate 304, a flexible wiring substrate 306, and an electric wiring substrate 308. The recording element substrate 200 is electrically connected to a control unit (not shown) that controls the entire recording apparatus via the drive circuit substrate 304, the flexible wiring substrate 306, and the electric wiring substrate 308. The recording element substrate 200 corresponds to the ejection substrate described in the Background Art section. That is, the recording element substrate 200 includes ejection orifices and pressure generating chambers that communicate with the ejection orifices. In the pressure generating chambers, pressure is generated by driving recording elements (ejection energy generating elements), and ink is ejected from the ejection orifices using this pressure. As the recording elements, various known elements such as electrothermal conversion elements and piezoelectric elements can be used.

[0019] The electric wiring board 308 includes an electric connection terminal 310. The electric wiring board 308 is connected to the flexible wiring board 306 via an electric connection portion 311 provided on the flexible wiring board 306. Openings 206a are provided at the top of two side surfaces of the cover member 206 that are parallel to the XZ plane. When the substrate portion 202 and the flow path portion 204 are housed inside the cover member 206, the electric connection terminals 310 are exposed to the outside through the openings 206a (see FIGS. 2(a) and 2(b)). Wiring connected to a control unit in the recording apparatus 10 is connected to the electric connection terminals 310. As a result, an ejection drive signal output from the control unit and power required for ejection are input from the electric connection terminals 310 and supplied to the recording element substrate 200 via the electric wiring board 308, the flexible wiring board 306, and the drive circuit board 304.

[0020] By consolidating the wiring using the electrical circuit on the electrical wiring board 308, the number of terminals on the electrical connection terminals 310 can be made smaller than the number of terminals on the recording element board 200. This reduces the number of electrical connections that need to be removed when replacing the recording head 22 in the recording apparatus 10. In addition, the recording element board 200 and a portion of the flexible wiring board 306 are supported by a recording element board support member 406. When the substrate portion 202 and the flow path portion 204 are housed within the cover member 206, the recording element board support member 406 is supported by the support member 205 to form the underside of the recording head 22. The recording element board support member 406 supports the recording element board 200 so that it is exposed from the bottom surface of the recording head 22.

[0021] The flow path section 204 includes a first flow path member 312, a second flow path member 314, and a third flow path member 316. The first flow path member 312 is connected, or so-called fluidically connected, to the second flow path member 314 so that a fluid can flow through a flow path formed therein. The second flow path member 314 is fluidically connected to the third flow path member 316. When the substrate section 202 and the flow path section 204 are connected, the first flow path member 312 is fluidically connected to the recording element substrate 200.

[0022] The flow path section 204 also includes a fourth flow path member 318, a fifth flow path member 320, and a liquid supply unit 322. The third flow path member 316 and the fourth flow path member 318 are flow path connected, and the fourth flow path member 318 and the fifth flow path member 320 are fluidly connected. The fifth flow path member 320 is connected to the liquid supply unit 322 via a connection portion 321 (see FIG. 4).

[0023] A flow path connection part 324 is provided on the upper surface of the liquid supply unit 322. Furthermore, a filter (not shown) for removing foreign matter from the flowing ink is provided inside the liquid supply unit 322 so as to communicate with each opening of the flow path connection part 324. The flow path connection part 324 is connected to an ink supply system in the recording apparatus 10. Specifically, one of the two flow path connection parts 324 provided in the liquid supply unit 322 is connected to the ink supply system so that ink is supplied into the liquid supply unit 322, and the other is connected to the ink supply system so that ink is collected from the liquid supply unit 322.

[0024] As described above, the flow path of the flow path portion 204 is fluidly connected to the flow path of the recording element substrate 200. Therefore, in this embodiment, the ink is configured to circulate in an ink flow path system including the flow path of the recording device 10 and the flow path of the recording head 22. The liquid supplied to the liquid supply unit 322 is supplied to the recording element substrate 200 through the fifth flow path member 320, the fourth flow path member 318, the third flow path member 316, the second flow path member 314, and the first flow path member 312. Then, ink that has been supplied to the recording element substrate 200 but not ejected is collected from the recording element substrate 200 by the liquid supply unit 322 through the first flow path member 312, the second flow path member 314, the third flow path member 316, the fourth flow path member 318, and the fifth flow path member 320.

[0025] In the recording head 22, an electric wiring board support part 402 is provided so as to surround the outer periphery of the liquid supply unit 322. When connecting the substrate part 202 and the flow path part 204, the electric wiring board 308 is supported by the electric wiring board support part 402. In this embodiment, a part of the substrate part 202 and a part of the flow path part 204 form an ejection module 404 (see FIG. 4). The substrate part 202 constituting the ejection module 404 includes a flexible wiring board 306, a drive circuit board 304, and a recording element substrate 200. The flow path part 204 constituting the ejection module 404 includes a first flow path member 312, a second flow path member 314, and a third flow path member 316.

[0026] <Configuration of the dispensing module> Next, the configuration of the discharge module 404 will be described in detail. Fig. 5 is a perspective view of the discharge module, where (a) is a view from the downstream side in the +Z direction and (b) is a view from the upstream side in the +Z direction. Fig. 6 is an exploded view of the discharge module. Fig. 7 is a cross-sectional view taken along line VII-VII in Fig. 5(a). Fig. 8 is an enlarged view of the area within frame VIII in Fig. 7.

[0027] In the ejection module 404, the recording element substrate 200 and the flexible wiring substrate 306 are bonded and supported by a recording element substrate support member 406 (see FIG. 6). An electrode for grounding the drive circuit substrate 304 is provided on the flexible wiring substrate 306, and the drive circuit substrate 304 is fixed with a conductive adhesive. In the recording element substrate support member 406, the recording element substrate 200 and the drive circuit substrate 304 are electrically connected by a bonding wire 802, and the drive circuit substrate 304 and the flexible wiring substrate 306 are electrically connected by a bonding wire 804 (see FIG. 8).

[0028] In order to suppress a temperature rise due to heat generated when the drive circuit board 304 is driven, the drive circuit board 304 is connected to the first flow path member 312 via a heat dissipation member 602 (see FIG. 6). In the discharge module 404, a refrigerant flow path 806 is formed by the first flow path member 312 and the second flow path member 314 directly above the drive circuit board 304. A refrigerant flows through this refrigerant flow path 806. Therefore, heat generated in the drive circuit board 304 is dissipated to the first flow path member 312 via the heat dissipation member 602. The heat dissipated to the first flow path member 312 is then absorbed by the refrigerant in the refrigerant flow path 806. For this reason, the first flow path member 312 is preferably formed from a material with high thermal conductivity, such as alumina.

[0029] In the ejection module 404, a liquid flow path section 702 is formed by the first flow path member 312, the second flow path member 314, and the third flow path member 316 (see FIG. 7). The liquid flow path section 702 includes a liquid flow path section 702a that stores ink to be supplied to the recording element substrate 200, and a liquid flow path section 702b that stores ink recovered from the recording element substrate 200. Ink is supplied to the liquid flow path section 702a from the liquid supply unit 322 via the fourth flow path member 318 and the fifth flow path member 320. The ink stored in the liquid flow path section 702b is recovered by the liquid supply unit 322 via the fourth flow path member 318 and the fifth flow path member 320.

[0030] In the ejection module 404, the first flow path member 312, the second flow path member 314, and the third flow path member 316 that constitute the ink flow path have lengths in the Y direction that are approximately the same. Furthermore, the second flow path member 314 and the third flow path member 316 have lengths in the X direction that are approximately the same. The first flow path member 312 is formed so that its length in the X direction is longer than those of the second flow path member 314 and the third flow path member 316 (see FIG. 10 ). The second flow path member 314 is bonded to the first flow path member 312 at approximately the center in the X direction. Therefore, when the first flow path member 312 and the second flow path member 314 are bonded together, predetermined regions to which the second flow path member 314 is not bonded are formed at both ends of the first flow path member 312 in the X direction (a predetermined direction). The first flow path member 312 has protrusions 502 that protrude in the Z direction in the predetermined regions formed at both ends in the X direction. The protrusions 502 extend in the Y direction at positions that will not come into contact with the second flow path member 314 when the second flow path member 314 is adhered onto the first flow path member 312. The protrusions 502 are formed in predetermined regions formed at both ends of the first flow path member 312 in the X direction, for example, without coming into contact with the second flow path member 314 adhered to the first flow path member 312.

[0031] <Connection state of the discharge module> Next, the joining of the ejection module 404 in the recording head 22 will be described. In the recording head 22, the substrate portion 202 and the flow path portion 204 are housed in the cover member 206 in a connected state, and at this time, the ejection module 404 is supported by the support member 205. Note that the cover member 206 is adhered to the support member 205 with, for example, an adhesive. FIG. 9 is a view seen from the arrow IX in FIG. 2(a). FIG. 10 is a cross-sectional view taken along line XX in FIG. 9. FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. 9.

[0032] In the discharge module 404, the flexible wiring board 306 is bent and supported by the support member 205 on the side surfaces parallel to the XZ plane of the first flow path member 312, the second flow path member 314, and the third flow path member 316 (see FIGS. 4 and 5(a)).

[0033] The support member 205 that supports the ejection module 404 has an opening 205a that penetrates in the Z direction (see FIG. 4). The opening 205a is composed of an upper opening 205a-1 located on the downstream side in the +Z direction and a lower opening 205a-2 located on the upstream side in the +Z direction (see FIGS. 10 and 11). The upper opening 205a-1 and the lower opening 205a-2 are substantially rectangular. The opening area of ​​the lower opening 205a-2 is designed to be larger than the opening area of ​​the upper opening 205a-1. More specifically, the opening area of ​​the upper opening 205a-1 is designed to be larger than the second flow path member 314 and smaller than the first flow path member 312. Furthermore, the lower opening 205a-2 is designed to be larger than the first flow path member 312 and smaller than the recording element substrate support member 406.

[0034] For this reason, the inner wall of opening 205a is bent at the boundary between upper opening 205a-1 and lower opening 205a-2, and wall surface 1102 (see FIG. 11) extending in the X direction and wall surface 1002 extending in the Y direction and substantially parallel to the XY plane are formed (see FIG. 10). That is, wall surface 1102 is formed at both ends of opening 205a in the Y direction, and wall surface 1002 is formed at both ends of opening 205a in the X direction. Wall surface 1002 has a predetermined length in the X direction and is sized so that, when discharge module 404 is supported by support member 205, it can be adhered to protrusions 502 formed at both ends of first flow path member 312 in the X direction.

[0035] The discharge module 404 is inserted from the upstream side in the +Z direction into the opening 205a of the support member 205 formed in this manner. When the discharge module 404 is inserted into the opening 205a, the second flow path member 314 and the third flow path member 316 pass through the lower opening 205a-2 and are inserted into the upper opening 205a-1. On the other hand, the first flow path member 312 is inserted into the lower opening 205a-2, but cannot be inserted into the upper opening 205a-1 because the protrusion 502 and the wall surface 1002 come into contact with each other.

[0036] Then, the discharge module 404 and the support member 205 are aligned so that the second flow path member 314 does not contact the inner wall of the upper opening 205a-1 and the first flow path member 312 does not contact the inner wall of the lower opening 205a-2. At this time, the first flow path member 312 and the second flow path member 314 are opposed to the support member 205 with a space in between. Specifically, a space is formed between the second flow path member 314 and the upper opening 205a-1, so that the second flow path member 314 and the upper opening 205a-1 are opposed to each other. Furthermore, a space is formed between the first flow path member 312 and the lower opening 205a-2, so that the first flow path member 312 and the lower opening 205a-2 are opposed to each other. Note that components such as the opening 205a, the first flow path member 312, and the second flow path member 314 are designed so that these spaces are large enough to accommodate thermal expansion of the first flow path member 312 and the second flow path member 314. In other words, each component is designed so that even if thermal expansion occurs in the first flow path member 312 and the second flow path member 314, these flow path members will not come into contact with the lower opening 205a-2 and the upper opening 205a-1, or even if they do come into contact, they will not deform the support member 205.

[0037] Furthermore, when the discharge module 404 and the support member 205 are aligned, only the convex portion 502 and the wall surface 1002 come into contact with each other, and by bonding these members with an adhesive, the discharge module 404 is fixed to and supported by the support member 205. In this manner, in the insertion direction of the discharge module 404, in this embodiment, the discharge module 404 is supported by the support member 205 in a state in which the convex portion 502 of the first flow path member 312 comes into contact with the wall surface 1002 of the support member 205. In this embodiment, the convex portion 502 functions as an abutment portion that abuts against the support member 205. Furthermore, the wall surface 1002 is the portion of the support member 205 that abuts against the convex portion 502 of the first flow path member 312.

[0038] Furthermore, when the ejection module 404 and the support member 205 are aligned, the recording element substrate support member 406 is supported on the insertion surface of the support member 205 for the ejection module 404, i.e., the bottom surface 205b. That is, in this embodiment, the ejection module 404 is supported on the support member 205 by inserting it into the support member 205. At this time, the +Z direction is the insertion direction for inserting the ejection module 404 into the support member 205.

[0039] The fourth flow path member 318 is fluidly connected to the ejection module 404 supported by the support member 205 in this manner via the seal member 1004, etc. Furthermore, the fifth flow path member 320, the liquid supply unit 322, etc. are fluidly connected to the fourth flow path member 318, and the electric wiring board support part 402, etc. are attached, and the recording head 22 is assembled.

[0040] As described above, in this embodiment, the discharge module 404 is supported by being inserted into the support member 205. At this time, the first flow path member 312 and the second flow path member 314 are arranged to face the support member 205 with a space therebetween in a direction intersecting the insertion direction of the discharge module 404. Note that this space is large enough to accommodate thermal expansion of the first flow path member 312 and the second flow path member 314. The first flow path member 312 is supported by abutting against the wall surface 1002 of the support member 205 in the insertion direction.

[0041] As a result, even if the first flow path member 312 and the second flow path member 314 thermally expand due to the temperature of the ink used, heat generated during operation of the drive circuit board 304, or heat generated when a large current flows through the flexible wiring board 306, the support member 205 is less likely to deform. Specifically, spaces that can accommodate thermal expansion of the flow path members are formed between the first flow path member 312 and the lower opening 205a-2 and between the second flow path member 314 and the upper opening 205a-1. Therefore, even if thermal expansion occurs in the first flow path member and the second flow path member, the flow path members are less likely to press the opening 205a, and the support member 205 is less likely to deform.

[0042] Furthermore, suppressing deformation of the support member 205 suppresses deformation of the recording element substrate support member 406 supported on the bottom surface 205b of the support member 205. This suppresses deviation of the arrangement position of the recording element substrate 200 supported on the recording element substrate support member 406.

[0043] (Second embodiment) Next, a liquid ejection head according to a second embodiment will be described with reference to Figures 12 to 17. In the following description, the same or corresponding components as those in the liquid ejection head according to the first embodiment will be denoted by the same reference numerals as those used in the first embodiment, and detailed description thereof will be omitted.

[0044] The second embodiment differs from the first embodiment in that the print head 22 has four print element substrates 200 capable of ejecting ink arranged in a staggered pattern.

[0045] <Recording head configuration> A recording head as a liquid ejection head in this embodiment will be described. Fig. 12 is a perspective view of the recording head in this embodiment, where (a) is a view from the downstream side in the +Z direction, and (b) is a view from the upstream side in the +Z direction. Fig. 13 is a perspective view of the recording section and flow path section housed inside the recording head in Fig. 12, where (a) is the substrate section and (b) is the flow path section. Fig. 14 is an exploded view of the recording head.

[0046] The recording head 22 includes a substrate section 1202 including a recording element substrate 200 capable of ejecting ink, and a flow path section 1204 in which a flow path is formed for supplying and recovering ink to and from the recording element substrate 200 (see FIGS. 13(a) and 13(b)). In this embodiment, the recording head 22 includes four recording element substrates 200, which are arranged in a staggered pattern. The recording head 22 is housed in a cover member 1206 with the substrate section 1202 and the flow path section 1204 connected and supported by a support member 1205. At this time, a flow path connection section 324 for connecting to an external flow path is exposed on the upper side of the recording head 22 (see FIG. 12(a)). Furthermore, the recording element substrate 200 is exposed on the lower surface of the recording head 22 while being supported by a recording element substrate support member 406 (see FIG. 12(b)).

[0047] The substrate unit 1202 includes four substrate groups 1300, each including a recording element substrate 200, a drive circuit substrate 304, and a flexible wiring substrate 306, and these four substrate groups 1300 are each connected to an electric wiring substrate 1308. The recording element substrate 200 is electrically connected to a control unit that controls the entire recording apparatus 10 via the drive circuit substrate 304, the flexible wiring substrate 306, and the electric wiring substrate 1308.

[0048] One electric wiring board 1308 is provided for each of the two board groups 1300. Therefore, the board unit 1202 is provided with two electric wiring boards 1308. The electric wiring boards 1308 are connected to the board groups 1300 via electrical connection portions 311 of the flexible wiring boards 306 in the two board groups 1300 that are arranged adjacent to each other in the X direction. Each electric wiring board 1308 is provided with an electric connection terminal 1310 corresponding to the respective board group 1300 to which it is connected. Therefore, two electric connection terminals 1310 are provided on the electric wiring board 1308. Specifically, on the electric wiring board 1308, an electric connection terminal 1310a corresponding to one of the board groups 1300 is provided facing the Y direction, and an electric connection terminal 1310b corresponding to the other board group 1300 is provided facing the +Z direction.

[0049] The cover member 1206 has openings 1206a at the top of two side surfaces parallel to the XZ plane. Two openings 1206b are also provided on the top surface of the cover member 1206. When the substrate section 1202 and the flow path section 1204 are housed within the cover member 1206, the electrical connection terminal 1310a is exposed to the outside through the opening 1206a, and the electrical connection terminal 1310b ejects ink from the opening 1206b (see FIGS. 12(a) and 12(b)). Wiring connected to a control unit in the recording device 10 is connected to the electrical connection terminal 1310. An ejection drive signal output from the control unit and power required for ejection are input from the electrical connection terminal 1310 and supplied to the recording element substrates 200 of each substrate group 1300.

[0050] By consolidating the wiring using the electrical circuit in the electrical wiring board 1308, the number of terminals in the electrical connection terminals 1310 can be made smaller than the number of terminals in the recording element board 200. This reduces the number of electrical connections that need to be removed when replacing the recording head 22 in the recording apparatus 10. Furthermore, in the board group 1300, the recording element board 200 and a portion of the flexible wiring board 306 are supported by a recording element board support member 406. When the substrate section 1202 and the flow path section 1204 are housed within the cover member 1206, the recording element board support member 406 is supported by the support member 1205 and is positioned on the underside of the recording head 22. The recording element board support member 406 supports the recording element board 200 so that it is exposed from the bottom surface of the recording head 22.

[0051] The flow path section 1204 includes four flow path groups 1350, each of which is fluidly connected to a first flow path member 312, a second flow path member 314, and a third flow path member 316. Each flow path group 1350 is connected to a substrate group 1300, and the recording element substrate 200 is fluidly connected to the first flow path member 312. The flow path section 1204 also includes two sets of a fourth flow path member 1318 and a fifth flow path member 1320. The fourth flow path member 1318 and the fifth flow path member 1320 are fluidly connected to each other and to two flow path groups 1350 adjacent to each other in the X direction. Therefore, the fourth flow path member 1318 and the fifth flow path member 1320 form a flow path that supplies ink to the two flow path groups 1350 and a flow path that recovers ink from the flow path groups 1350. The fourth flow path member 1318 is connected to the third flow path member 316 in the corresponding flow path group 1350 via a seal member 1452 (see FIG. 14).

[0052] The flow path sections 1204 are positioned adjacent to each other in the Y direction, and the sixth flow path member 1352 and the seventh flow path member 1354 are fluidly connected to the two fifth flow path members 1320 that are fluidly connected to the fourth flow path member 1318. Specifically, the sixth flow path member 1352 is fluidly connected to the two fifth flow path members 1320 via the seal member 1454, and the seventh flow path member 1354 is fluidly connected to the sixth flow path member 1352.

[0053] The flow path section 1204 includes a liquid supply unit 1322. The liquid supply unit 1322 is fluidly connected to the seventh flow path member 1354. Two flow path connections 324 are provided on the upper surface of the liquid supply unit 1322. Filters (not shown) for removing foreign matter from the flowing ink are provided inside the liquid supply unit 1322 so as to communicate with each opening of the flow path connections 324. The flow path connections 324 are connected to the ink supply system of the recording apparatus 10. Specifically, the flow path connections 324 provided in the liquid supply unit 1322 include a flow path connection 324a for supplying ink into the liquid supply unit 1322 and a flow path connection 324b for recovering ink from the liquid supply unit 1322. One of the two flow path connections 324 provided in the liquid supply unit 1322 supplies and recovers ink between the two flow path groups 1350 located upstream in the +Y direction. The other of the two flow path connecting portions 324 supplies and recovers ink between the two flow path groups 1350 located downstream in the +Y direction.

[0054] As described above, the flow paths of the flow path portion 1204 are fluidly connected to the flow paths of the four recording element substrates 200. Therefore, in this embodiment, ink is configured to circulate in an ink flow path system including the flow paths of the recording device 10 and the flow paths of the recording head 22. Ink supplied to the liquid supply unit 1322 flows through the seventh flow path member 1354, the sixth flow path member 1352, the fifth flow path member 1320, and the fourth flow path member 1318, into the flow path group 1350, and is supplied to the recording element substrate 200 via the flow path group 1350. Then, the ink supplied to the recording element substrate 200 passes from the recording element substrate 200 through the flow path group 1350, the fourth flow path member 1318, the fifth flow path member 1320, the sixth flow path member 1352, and the seventh flow path member 1354, and is collected by the liquid supply unit 1322.

[0055] In the print head 22, an electric wiring board support portion 1402 is provided so as to surround the outer periphery of the liquid supply unit 1322. When connecting the substrate portion 1202 and the flow path portion 1204, the electric wiring board support portion 1402 supports the electric wiring board 1308. In this embodiment, the substrate group 1300 and the flow path group 1350 form a discharge module 1404 (see FIG. 14). In other words, the print head 22 is provided with four discharge modules 1404. Note that the configuration of the discharge module 1404 is the same as the discharge module 404 described in the first embodiment, and therefore a detailed description thereof will be omitted in this embodiment.

[0056] <Connection state of the discharge module> Next, the joining of the ejection module 1404 in the recording head 22 will be described. In the recording head 22, the substrate portion 1202 and the flow path portion 1204 are housed in the cover member 1206 in a connected state, and at this time, the ejection module 1404 is supported by the support member 1205. Note that the cover member 1206 is adhered to the support member 1205 with, for example, an adhesive. Fig. 15 is a view taken along the arrow XV in Fig. 12(a), and Fig. 16 is a cross-sectional view taken along line XVI-XVI in Fig. 15. Fig. 17 is a cross-sectional view taken along line XVII-XVII in Fig. 15.

[0057] In the discharge module 1404, the flexible wiring substrate 306 is bent onto the side surfaces of the first flow path member 312, the second flow path member 314, and the third flow path member 316 that are parallel to the XZ plane, and is supported by the support member 1205 (see FIG. 14). The support member 1205 that supports the four discharge modules 1404 has four openings 205a that penetrate in the Z direction (see FIG. 14). The configuration of the openings 205a has been described in the first embodiment above, so a detailed description thereof will be omitted.

[0058] When the discharge module 1404 is supported by the support member 1205, the discharge module 1404 is inserted into each opening 205a of the support member 1205 from the upstream side in the +Z direction. When the discharge module 1404 is inserted into the opening 205a, the second flow path member 314 and the third flow path member 316 pass through the lower opening 205a-2 and are inserted into the upper opening 205a-1. On the other hand, the first flow path member 312 is inserted into the lower opening 205a-2, but cannot be inserted into the upper opening 205a-1 because the convex portion 502 comes into contact with the wall surface 1002.

[0059] Then, each ejection module 1404 and the support member 1205 are aligned so that the second flow path member 314 does not contact the inner wall of the upper opening 205a-1 and the first flow path member 312 does not contact the inner wall of the lower opening 205a-2. At this time, the first flow path member 312 and the second flow path member 314 are opposed to the support member 205 with a space between them. Specifically, a space is formed between the second flow path member 314 and the upper opening 205a-1, and the second flow path member 314 is opposed to the upper opening 205a-1. In addition, a space is formed between the first flow path member 312 and the lower opening 205a-2, and the first flow path member 312 is opposed to the lower opening 205a-2. Note that components such as opening 205a, first flow path member 312, and second flow path member 314 are designed so that these spaces are large enough to accommodate thermal expansion of first flow path member 312 and second flow path member 314. In other words, each component is designed so that even if thermal expansion occurs in first flow path member 312 and second flow path member 314, these flow path members do not come into contact with lower opening 205a-2 and upper opening 205a-1, or do not deform support member 1205 even if they do come into contact.

[0060] Furthermore, when each ejection module 1404 and the support member 1205 are aligned, the convex portions 502 and the wall surfaces 1002 come into contact with each other, and by bonding these members with an adhesive, each ejection module 1404 is fixed to and supported by the support member 1205. In this manner, in this embodiment, in the insertion direction of each ejection module 404, the ejection module 404 is supported by the support member 1205 with the convex portions 502 of the first flow path member 312 coming into contact with the wall surfaces 1002 of the support member 1205. Furthermore, when each ejection module 1404 and the support member 1205 are aligned, the recording element substrate support member 406 is supported by the bottom surface 1205b of the support member 1205.

[0061] The fourth flow path member 318 is fluidly connected to the ejection module 1404 supported by the support member 1205 in this manner via a seal member 1452. Furthermore, the fifth flow path member 320 is fluidly connected onto the fourth flow path member 318, and the sixth flow path member 1352 is fluidly connected via a seal member 1454, and the seventh flow path member 1354, the liquid supply unit 1322, etc. are fluidly connected thereon. Furthermore, the electric wiring board support part 402, etc. are attached, and the recording head 22 is assembled.

[0062] As described above, in this embodiment, four discharge modules 1404 are inserted into and supported by the support member 1205. In this case, the first flow path member 312 and the second flow path member 314 are arranged to face the support member 1205 with a space therebetween in a direction intersecting the insertion direction of the discharge modules 1404. Note that this space is large enough to accommodate thermal expansion of the first flow path member 312 and the second flow path member 314. The first flow path member 312 is supported by abutting against the wall surface 1002 of the support member 1205 in the insertion direction. As a result, the recording apparatus 10 according to this embodiment also achieves the same effects as those of the first embodiment.

[0063] (Other embodiments) The above-described embodiment may be modified as shown in the following (1) to (5).

[0064] (1) Although not specifically described in the above embodiment, it is preferable to use an adhesive that does not easily transmit heat, that is, an adhesive with low thermal conductivity, for bonding the protrusions 502 and the wall surfaces 1002. This prevents heat from being transferred from the first flow path member 312 to the support member 205 via the protrusions 502, thereby suppressing deformation of the support member 205 due to thermal expansion caused by the heat transferred to the support member 205. Furthermore, the adhesive for bonding the protrusions 502 and the wall surfaces 1002 may have a lower thermal conductivity than the first flow path member 312.

[0065] Furthermore, it is preferable that the support member 205 be made of a material with low thermal conductivity and linear expansion coefficient, for example, so that deformation of the support member 205 due to thermal expansion is reduced even if heat is transmitted to the support member 205 via the protrusions 502 and the adhesive.

[0066] (2) Although not specifically described in the above embodiment, the convex portions 502 may be made of a material capable of absorbing thermal expansion of the first flow path member 312, such as an elastic material. Alternatively, the adhesive for bonding the convex portions 502 to the wall surface 1002 may be an adhesive having properties capable of absorbing displacement of the convex portions 502 due to thermal expansion of the first flow path member 312, such as elasticity or stretchability. In addition, in the above embodiment, the convex portions 502 are formed so as not to come into contact with the second flow path member 314 bonded to the first flow path member 312 in predetermined regions formed at both ends of the first flow path member 312 in the X direction. However, this is not limited to this. In other words, the convex portions 502 may be formed so as to come into contact with the second flow path member 314 bonded to the first flow path member 312 in predetermined regions. In this case, the convex portions 502 are preferably formed of a material having low thermal conductivity and a low linear expansion coefficient.

[0067] (3) In the above embodiment, the first flow path member 312 is provided with the convex portions 502 at both ends in the X direction, and is supported by the wall surfaces 1002 of the support members 205, 1205 via the convex portions 502. However, the present invention is not limited to this. That is, both ends in the X direction of the first flow path member 312 may be directly supported by the wall surfaces 1002. Alternatively, abutting portions may be formed at both ends in the X direction of the first flow path member 312 so as to be flat without creating a step with the surface of the first flow path member 312 that is connected to the second flow path member 314. In this case, the abutting portions may be formed of an elastic material, as described in (2) above, or may be formed of a material with low thermal conductivity and a low linear expansion coefficient, as described in (3) above.

[0068] (4) In the above embodiment, thermal expansion in the X direction, which is the longitudinal direction of the recording element substrate 200, is of particular concern. Therefore, the first flow path member 312 is larger in size than the second flow path member 314 only in the X direction and is approximately the same size in the Y direction. However, this is not limited to this. For example, if thermal expansion in the Y direction is as much of a concern as thermal expansion in the X direction, the first flow path member 312 is made larger in size in both the X and Y directions than the second flow path member 314. Furthermore, convex portions 502 are provided at both ends in the X direction and both ends in the Y direction formed on the first flow path member 312 connected to the second flow path member 314, and the wall surface 1102 of the opening 205a is formed as a flat surface having a width in the Y direction. When aligning the ejection module 404 with the support member 205, the convex portions 502 facing each other in the X direction are abutted against and bonded to the wall surface 1002, and the convex portions 502 facing each other in the Y direction are abutted against and bonded to the wall surface 1102.

[0069] (5) The above embodiment and the various configurations shown in (1) to (4) above may be combined as appropriate. [Explanation of symbols]

[0070] 22 Recording head 200 Recording element substrate 205, 1205 Support member 312 First flow path member 314 Second flow path member 404 Dispensing Module 406 Recording element substrate support member 1002 Wall

Claims

1. a module including a substrate capable of ejecting liquid by driving ejection energy generating elements and a flow path member fluidically connected to the substrate; a support member for supporting the substrate; a frame that supports the module and the support member, The frame body is Supporting the inserted module and supporting the support member on the insertion surface of the module; an opening penetrating the module in an insertion direction, the opening area on the upstream side of the insertion direction being larger than the opening area on the downstream side of the insertion direction; The liquid ejection head is characterized in that, when the module is inserted into the frame body, the frame body and the flow path member face each other across a space in a direction intersecting the insertion direction of the module, and are supported in contact with each other in the insertion direction.

2. the flow path member is configured by a plurality of members connected in the insertion direction, 2. The liquid ejection head according to claim 1, wherein the contact portion of the flow path member that contacts the frame is formed on a member located upstream in the insertion direction.

3. a module including a substrate capable of ejecting liquid by driving ejection energy generating elements and a flow path member connecting the substrate to a flow path; a support member for supporting the substrate; a frame that supports the module and the support member, the frame supports the inserted module and supports the support member on an insertion surface of the module; When the module is inserted into the frame body, the frame body and the flow path member face each other across a space in a direction intersecting an insertion direction of the module, and are supported in contact with each other in the insertion direction, the flow path member is configured by a plurality of members connected in the insertion direction, The liquid ejection head according to claim 1, wherein the contact portion of the flow path member that contacts the frame is formed on a member located upstream in the insertion direction.

4. 4. The liquid ejection head according to claim 2, wherein a portion of said frame that comes into contact with said flow path member is formed substantially parallel to said support member that is supported by said frame.

5. the flow path member includes a first flow path member fluidly connected to the substrate and a second flow path member fluidly connected to the first flow path member; The first flow path member is The second flow path member is formed to be longer in a predetermined direction intersecting the insertion direction than the second flow path member, The liquid ejection head according to claim 2 , wherein the abutting portions are provided in regions formed at both ends in the predetermined direction when connected to the second flow path member.

6. 6. The liquid ejection head according to claim 2, wherein the adhesive that bonds the contact portion and the frame is an adhesive that does not easily transmit heat.

7. The liquid ejection head according to claim 2 , wherein the adhesive that bonds the contact portion and the frame has a thermal conductivity lower than that of the flow path member.

8. The liquid ejection head according to claim 2 , wherein the contact portion is made of an elastic material.

9. The liquid ejection head according to claim 2 , wherein the adhesive that bonds the contact portion and the frame body has elasticity.

10. The liquid ejection head according to claim 2 , wherein the contact portion is made of a material having a low thermal conductivity and a low coefficient of linear expansion.

11. The liquid ejection head according to claim 2 , wherein the contact portion is a convex portion that protrudes in the insertion direction.

12. The liquid ejection head according to claim 1 , wherein the module includes a flexible wiring board that transmits power and signals to the board.

13. The liquid ejection head according to claim 12, wherein the flexible wiring board includes a drive circuit board for supplying drive signals to the ejection energy generating elements.

14. The liquid ejection head according to claim 12 or 13, wherein the module is supported by the frame body with the flexible wiring board bent toward the side of the flow path member in a predetermined direction intersecting the insertion direction and parallel to the insertion direction.

15. The liquid ejection head according to claim 1 , wherein the frame is made of a material having a low thermal conductivity and a low coefficient of linear expansion.

16. The liquid ejection head according to claim 1 , wherein the ejection energy generating element is a piezoelectric element.

17. The liquid ejection head according to claim 1 , comprising a plurality of the modules.

18. A liquid ejection apparatus that ejects liquid using the liquid ejection head according to any one of claims 1 to 17.

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