Processing system and method for manufacturing molded products

The processing system addresses the waste issue of discarded protective films by incorporating a transport and heating mechanism to repair and reuse protective films, enhancing resource efficiency.

JP7822886B2Active Publication Date: 2026-03-03FUJI ELECTRIC CO LTD +1
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-07-21
Publication Date
2026-03-03

AI Technical Summary

Technical Problem

Conventional punching techniques require discarding protective films after use, leading to resource wastage and environmental impact.

Method used

A processing system that includes a transport mechanism for protective films, a heating mechanism to melt the surface of the protective film after punching, and a mechanism to reuse the protective film by repairing incisions formed during the punching process.

Benefits of technology

Enables the reuse of protective films, reducing waste and environmental impact by effectively utilizing resources.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To realize the reuse of a protective film used in a punching process.SOLUTION: A processing system 100A comprises: a processing mechanism 40 that performs a punching process on a resin film 10 using a punching blade 43; a conveying mechanism 30 for conveying a protective film 20 that contacts a tip of the punching blade 43 that has penetrated the resin film 10 in the punching process; and a heating mechanism 60 for melting a surface of the protective film 20 in contact with the punching blade 43.SELECTED DRAWING: Figure 1
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Description

[Technical Field]

[0001] The present disclosure relates to processing techniques. [Background technology]

[0002] Processing techniques for punching films using a punching blade have been proposed. For example, Patent Document 1 discloses a technique for forming cuts with a blade in a film transported on a cylinder roller. A protective film is placed between the cylinder roller and the film to protect the tip of the blade. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-66359 Summary of the Invention [Problem to be solved by the invention]

[0004] Since the tip of the blade that penetrates the film comes into contact with the protective film and forms a notch in the film, the protective film used in punching processing must be discarded. Therefore, under conventional techniques, there is room for improvement, for example, from the perspective of effectively utilizing resources to reduce environmental impact. In consideration of the above circumstances, one aspect of the present disclosure aims to realize the reuse of protective films. [Means for solving the problem]

[0005] In order to solve the above problems, a processing system according to one aspect of the present disclosure includes a processing mechanism that performs punching processing of a workpiece using a punching blade, a transport mechanism that transports a protective film that comes into contact with the tip of the punching blade that has penetrated the workpiece during the punching processing, and a heating mechanism that melts the surface of the protective film that comes into contact with the punching blade.

[0006] A method for manufacturing a molded product according to one aspect of the present disclosure manufactures a molded product by punching a workpiece using a punching blade, transporting a protective film that contacts the tip of the punching blade that has penetrated the workpiece during the punching process, and melting the surface of the protective film that contacts the punching blade. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a configuration diagram of a machining system according to a first embodiment. [Figure 2] 4 is an explanatory diagram of the relationship between a resin film, a protective film, and a punching blade. FIG. [Figure 3] 10 is a flowchart of a processing operation. [Figure 4] FIG. 10 is an explanatory diagram regarding heating of a protective film. [Figure 5] FIG. 10 is a configuration diagram of a machining system according to a second embodiment. [Figure 6] 10 is a flowchart of a processing operation in a second embodiment. [Figure 7] 10A and 10B are explanatory diagrams relating to heating of a protective film in a modified example. [Figure 8] 10A and 10B are explanatory diagrams relating to heating of a protective film in a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0008] The embodiments for carrying out the present disclosure will be described with reference to the drawings. Note that the dimensions and scale of each element in each drawing may differ from those of the actual product. Furthermore, the embodiment described below is an exemplary embodiment that may be envisioned when carrying out the present disclosure. Therefore, the scope of the present disclosure is not limited to the embodiment exemplified below.

[0009] 1. First embodiment FIG. 1 is a configuration diagram of a processing system 100A in the first embodiment. The processing system 100A in the first embodiment is a manufacturing device that produces a molded product P of a predetermined shape by punching a strip-shaped film (hereinafter referred to as a "resin film") 10 to be processed. The resin film 10 is a flexible thin plate made of various resin materials. For example, the resin film 10 is made of a resin material such as polypropylene (PP), polyethylene terephthalate (PET), or polyvinyl chloride (PVC). Note that, although a circular molded product P is exemplified in the following description, the shape of the molded product P is arbitrary.

[0010] As illustrated in FIG. 1, the processing system 100A has multiple winding axes Z (Za1, Za2, Zb1, Zb2) that are installed parallel to one another. Each winding axis Z is installed horizontally. Winding axis Za1 and winding axis Za2 are located at the same height. Similarly, winding axis Zb1 and winding axis Zb2 are located at the same height. Winding axis Za1 is located vertically above winding axis Zb1.

[0011] The winding shaft Za1 and the winding shaft Za2 are reels around which the resin film 10 is wound. Specifically, a cylindrical product roll material 11 is formed by winding the resin film 10 around the winding shaft Za1, and a cylindrical used roll material 12 is formed by winding the resin film 10 around the winding shaft Za2.

[0012] The winding shaft Zb1 and the winding shaft Zb2 are reels around which a strip-shaped film (hereinafter referred to as "protective film") 20 used in the punching process of the resin film 10 is wound. Specifically, a protective roll material 21 is formed by winding the protective film 20 around the winding shaft Zb1, and a recovered roll material 22 is formed by winding the protective film 20 around the winding shaft Zb2.

[0013] The protective film 20 is a flexible thin plate made of various resin materials. For example, like the resin film 10, the protective film 20 is made of a resin material such as polypropylene (PP), polyethylene terephthalate (PET), or polyvinyl chloride (PVC).

[0014] The materials of the resin film 10 and the protective film 20 may be the same or different. The relationship between the mechanical properties of the resin film 10 and the mechanical properties of the protective film 20 is also arbitrary. For example, the resin film 10 and the protective film 20 may have the same rigidity or hardness, or one of the resin film 10 and the protective film 20 may have higher rigidity or hardness than the other. The relationship between the dimensions of the resin film 10 and the protective film 20 is also arbitrary. For example, the resin film 10 and the protective film 20 may have the same dimensions, such as film thickness or width, or one of the resin film 10 and the protective film 20 may have a larger dimension than the other.

[0015] 1, the processing system 100A includes a transfer mechanism 30, a processing mechanism 40, a removal mechanism 50, a heating mechanism 60, and a control system 70. The control system 70 is a computer system that controls each element of the processing system 100A.

[0016] The conveying mechanism 30 is a mechanism that conveys the resin film 10 and the protective film 20 in the X direction. The X direction is, for example, the horizontal direction. The resin film 10 is unwound from the product roll material 11 below the winding axis Za1. On the other hand, the protective film 20 is unwound from the protective roll material 21 above the winding axis Zb1. Therefore, the resin film 10 unwound from the product roll material 11 and the protective film 20 unwound from the protective roll material 21 are conveyed in the X direction while overlapping each other. The resin film 10 and the protective film 20 are in close proximity to or in contact with each other. The X direction is an example of a "predetermined direction."

[0017] The conveying mechanism 30 includes a supply mechanism 31 and a discharge mechanism 32. A processing mechanism 40 is installed between the supply mechanism 31 and the discharge mechanism 32. The supply mechanism 31 conveys the resin film 10 unwound from the product roll material 11 and the protective film 20 unwound from the protective roll material 21 in the X direction to supply them to the processing mechanism 40. Specifically, the supply mechanism 31 includes a supply roller 311 and a supply roller 312. The resin film 10 and the protective film 20 are sandwiched between the supply roller 311 and the supply roller 312. One or both of the supply rollers 311 and 312 are rotated by an electric motor (not shown), thereby conveying the resin film 10 and the protective film 20 in the X direction. The conveying mechanism 30 of the first embodiment conveys the resin film 10 and the protective film 20 at equal speeds. That is, the resin film 10 and the protective film 20 move integrally.

[0018] The discharge mechanism 32 transports the resin film 10 and the protective film 20 in the X direction after processing by the processing mechanism 40. Specifically, the discharge mechanism 32 includes a discharge roller 321 and a discharge roller 322. The resin film 10 and the protective film 20 are sandwiched between the discharge roller 321 and the discharge roller 322. One or both of the discharge rollers 321 and 322 are rotated by an electric motor (not shown), thereby transporting the resin film 10 and the protective film 20 in the X direction. Note that a transport device such as an air feeder may be used as the supply mechanism 31 or the discharge mechanism 32.

[0019] Processing mechanism 40 is a mechanism that performs punching processing on resin film 10, and is equipped with mold 41, mold 42, punching blade 43, and drive mechanism 44. Mold 41 is a highly rigid structure that includes a planar processing surface 411. Mold 42 is a highly rigid structure that includes a planar processing surface 421. Mold 41 and mold 42 are installed so that processing surface 411 and processing surface 421 face each other with a gap between them. Resin film 10 and protective film 20 transported by transport mechanism 30 pass through the space between processing surface 411 and processing surface 421 in the X direction.

[0020] The punching blade 43 is a blade used for punching the resin film 10. Specifically, the punching blade 43 is formed in a planar shape corresponding to the shape of the molded product P. The punching blade 43 is fixed to the processing surface 411 of the mold 41, and protrudes from the processing surface 411 toward the processing surface 421. For example, a Thomson blade or an etching blade is used as the punching blade 43.

[0021] The drive mechanism 44 is configured by, for example, an electric motor or a hydraulic mechanism, and is a mechanism that vertically reciprocates the die 41 and the punching blade 43. In other words, the punching blade 43 repeatedly approaches and moves away from the processing surface 421 of the die 42.

[0022] 2 is an explanatory diagram of the relationship between the resin film 10 and the protective film 20 and the punching blade 43. When the punching blade 43 descends, the resin film 10 and the protective film 20 are pressed downward in the vertical direction, so that the resin film 10 and the protective film 20 come into close contact with each other without any gaps, and the protective film 20 comes into close contact with the processing surface 421 of the mold 42 without any gaps.

[0023] 2, the tip E of the punching blade 43 repeatedly moves in the vertical direction between positions H1 and H2. Position H1 is the position where the tip E of the punching blade 43 is closest to the processing surface 421. Position H2 is the position where the tip E of the punching blade 43 is farthest from the processing surface 421.

[0024] 2, the distance between position H1 and processing surface 421 is less than the film thickness of the protective film 20. Therefore, when tip E is lowered to position H1, punching blade 43 penetrates resin film 10. In other words, when tip E is lowered to position H1, molded product P having a shape corresponding to punching blade 43 is separated from resin film 10.

[0025] The tip E of the punching blade 43 that has penetrated the resin film 10 comes into contact with the protective film 20. As illustrated in FIG. 2 , the tip E of the punching blade 43 at position H1 faces the processing surface 421 at a predetermined distance. That is, even when the punching blade 43 is closest to the processing surface 421, the tip E does not come into contact with the processing surface 421. Therefore, even when the tip E is closest to the processing surface 421 of the mold 42, the punching blade 43 does not penetrate the protective film 20. Specifically, when the tip E has descended to position H1, the tip E is located at a point midway through the protective film 20 in the thickness direction. Therefore, a cut N is formed in the surface Q of the protective film 20 that faces the resin film 10 (hereinafter referred to as the "protective surface") as the punching blade 43 descends. The cut N is a bottomed groove that corresponds to the planar shape of the punching blade 43. As can be understood from the above explanation, during punching, the tip E of the punching blade 43 is protected by the protective film 20 and does not come into contact with the processing surface 421 of the mold 42. Therefore, the possibility of the tip E being damaged due to a collision with the processing surface 421 is reduced.

[0026] The removal mechanism 50 in FIG. 1 is a mechanism for removing a molded product P manufactured by punching. For example, the removal mechanism 50 is configured with a suction mechanism that transports the molded product P to a storage location while suctioning it. The suction mechanism is configured with a mechanism such as a three-axis robot. The molded product P transported to the storage location is assembled into various products. The specific configuration of the removal mechanism 50 is arbitrary.

[0027] After being punched by the processing mechanism 40, the resin film 10 is transported in the X direction by the transport mechanism 30 and wound around the winding shaft Za2. The processed resin film 10 is wound around the winding shaft Za2 to form a used roll material 12. The used roll material 12 is removed from the winding shaft Za2 at an appropriate time and is ultimately discarded.

[0028] The heating mechanism 60 in FIG. 1 is installed in the X direction relative to the processing mechanism 40. The punched protective film 20 that has passed through the processing mechanism 40 is transported in the X direction by the transport mechanism 30 and reaches the heating mechanism 60. The heating mechanism 60 heats the punched protective film 20. Specifically, the heating mechanism 60 heats the protective film 20 to melt the protective surface Q. An incision N formed in the protective surface Q by contact with the tip E of the punching blade 43 is repaired by melting the protective surface Q. In other words, the inner surfaces facing each other at the incision N are fused together, thereby eliminating the incision N.

[0029] The heating mechanism 60 is a heating press including a first portion 61, a second portion 62, a heat source 63, and a drive mechanism 64. The first portion 61 and the second portion 62 are formed, for example, from a metal material with high thermal conductivity. The first portion 61 is a structure including a planar heating surface 611. The heating surface 611 faces the protective surface Q of the protective film 20. The second portion 62 is a structure including a planar heating surface 621. The first portion 61 and the second portion 62 are disposed so that the heating surfaces 611 and 621 face each other. The protective film 20 conveyed by the conveyance mechanism 30 passes through the space between the heating surfaces 611 and 621 in the X direction. The heat source 63 heats the heating surface 611. For example, an electric heating wire or the like is used as the heat source 63. The heat source 63 may be disposed in the second portion 62.

[0030] The drive mechanism 64 is configured, for example, by an electric motor or a hydraulic mechanism, and is a mechanism for moving the first portion 61 and the second portion 62 toward and away from each other. Specifically, the drive mechanism 64 moves the first portion 61 back and forth relative to the second portion 62. When the first portion 61 is heated by the heat source 63, the drive mechanism 64 moves the first portion 61 and the second portion 62 toward each other, whereby the heated surfaces 611 and 621 apply pressure to the protective film 20. The heating and pressure described above melt the protective surface Q of the protective film 20 as described above. When the first portion 61 and the second portion 62 are closest to each other, the heated surfaces 611 and 621 face each other with a predetermined distance between them. The thickness of the protective film 20 after processing by the heating mechanism 60 is set to a predetermined thickness corresponding to the distance between the heated surfaces 611 and 621. The drive mechanism 64 may reciprocate the second portion 62 relative to the first portion 61, or may move both the first portion 61 and the second portion 62.

[0031] As described above, in the first embodiment, by hot-pressing the protective film 20 using the first portion 61 and the second portion 62, it is possible to easily repair the incision N in the protective surface Q while maintaining the flatness of the protective film 20. Note that it is also possible to envision a configuration in which the drive mechanism 64 moves the second portion 62 relative to the first portion 61, or a configuration in which the drive mechanism 64 moves both the first portion 61 and the second portion 62.

[0032] After being treated by the heating mechanism 60, the protective film 20 is transported in the X direction by the transport mechanism 30 and wound around the winding axis Zb2. The protective film 20 is wound around the winding axis Zb2 to form a recovered roll material 22. The recovered roll material 22 is removed from the winding axis Zb2 at an appropriate time. The recovered roll material 22 is attached to the winding axis Zb1 and reused as the protective roll material 21. As can be understood from the above explanation, the winding axis Zb2 manufactures the protective roll material 21 by winding up the protective film 20. In other words, the protective film 20 is recovered as the protective roll material 21. Therefore, the process of reusing the protective film 20 as the protective roll material 21 is easier than in a case where, for example, the protective film 20 is recovered separately from the protective roll material 21 (for example, in a folded state) and then wound around the winding axis Zb1 after recovery. The winding axis Zb1 is an example of a "first winding axis," and the winding axis Zb2 is an example of a "second winding axis."

[0033] FIG. 3 is a flowchart of the operation of the processing system 100A (hereinafter referred to as "processing operation"). The control system 70 controls each element of the processing system 100A so that the processing system 100A operates according to the procedure illustrated in FIG. 3. The processing operation is repeated at a predetermined cycle. The processing operation illustrated in FIG. 3 is an example of a "method for manufacturing a molded product."

[0034] When the processing operation starts, the conveying mechanism 30 conveys the resin film 10 and the protective film 20 in the X direction by a movement amount δ (S1). As illustrated in FIG. 1, the movement amount δ corresponds to the period in the X direction of the molded product P formed in the resin film 10. The processing mechanism 40 performs a punching process on the resin film 10 (S2). As described above, as a result of the punching process, a portion of the resin film 10 is manufactured as the molded product P, and a cut N corresponding to the shape of the punching blade 43 is formed on the protective surface Q of the protective film 20.

[0035] The take-out mechanism 50 transports the molded product P formed by punching from the resin film 10 to a storage location (S3). The resin film 10 is transported by a predetermined amount by the transport mechanism 30 and wound up around the winding shaft Za2 (S4).

[0036] The heating mechanism 60 then applies heat and pressure to the punched protective film 20 to melt the protective surface Q (S5). The heating time by the heating mechanism 60 is set to an appropriate time length, for example, one second or less. The protective film 20 is transported by a predetermined distance by the transport mechanism 30 and wound around the winding shaft Zb2 (S6).

[0037] As can be understood from the above explanation, each time the resin film 10 and the protective film 20 are conveyed by the movement amount δ (S1), the processing mechanism 40 performs the punching process (S2), the take-out mechanism 50 takes out the molded product P (S3), the resin film 10 is taken up (S4), the protective film 20 is heated by the heating mechanism 60 (S5), and the protective film 20 is taken up (S6). As illustrated in Fig. 3, the take-up of the resin film 10 (S4) and the heating (S5) and take-up (S6) of the protective film 20 are performed in parallel with each other.

[0038] 3 may be performed in any order. For example, the winding of the resin film 10 (S4) and the heating of the protective film 20 (S5) and the winding of the protective film 20 (S6) do not need to be performed in parallel. For example, the heating of the protective film 20 (S5) and the winding of the protective film 20 (S6) may be performed after the winding of the resin film 10 (S4), or the heating of the protective film 20 (S5) and the winding of the protective film 20 (S6) may be performed after the winding of the resin film 10 (S4).

[0039] 4 is an explanatory diagram regarding heating of the protective film 20 by the heating mechanism 60. As illustrated in FIG. 4, in the first embodiment, the dimension of the heating surface 611 in the X direction is equal to the movement amount δ by the conveying mechanism 30. In the above embodiment, one heating by the heating mechanism 60 is performed each time the protective film 20 is conveyed by the movement amount δ.

[0040] The range R (R1, R2, ...) in Figure 4 is a range of the protective film 20 spanning a length δ in the X direction. At time t1, the range R1 of the protective film 20 spanning a length δ is heated by the heating mechanism 60. At time t2, when the protective film 20 has moved an amount δ, the range R2 of the protective film 20 spanning a length δ is heated by the heating mechanism 60. Furthermore, at time t3, when the protective film 20 has moved a further amount δ, the range R3 of the protective film 20 spanning a length δ is heated by the heating mechanism 60. As illustrated above, each range R (R1, R2, ...) of the protective film 20 spanning a length δ is heated sequentially by the heating mechanism 60 for each processing operation. The ranges R heated for each processing operation do not overlap with each other in the X direction.

[0041] As described above, in the first embodiment, the incision N formed on the protective surface Q of the protective film 20 by contact with the tip E of the punching blade 43 is repaired by heating the protective surface Q with the heating mechanism 60. Therefore, the repaired protective film 20 can be reused for processing the resin film 10.

[0042] In the first embodiment, the conveying mechanism 30 conveys the protective film 20 in the X direction, and the heating mechanism 60 is located in the X direction relative to the processing mechanism 40. Therefore, with the simple configuration of conveying the protective film 20 in the X direction, it is possible to protect the punching blade 43 during punching of the resin film 10 and to repair the protective surface Q of the protective film 20 by the heating mechanism 60.

[0043] 2. Second embodiment A second embodiment of the present disclosure will be described. Note that, for elements in the following exemplary aspects that have the same functions as those in the first embodiment, the same reference numerals as those in the first embodiment will be used, and detailed descriptions of each will be omitted as appropriate.

[0044] 5 is a configuration diagram of a processing system 100B according to the second embodiment. The processing system 100B according to the second embodiment is configured such that the winding axis Za2 in the processing system 100A according to the first embodiment is replaced with a transport mechanism 80, a cutting mechanism 90, and a waste container 95.

[0045] The conveying mechanism 80 is a mechanism that conveys the resin film 10 after the take-out mechanism 50 has removed the molded product P to the cutting mechanism 90, and is composed of a plurality of conveying rollers 81. The cutting mechanism 90 is a mechanism that cuts the resin film 10 into waste pieces D of a predetermined size. Specifically, the cutting mechanism 90 is equipped with a first cutting blade 91 and a second cutting blade 92. The resin film 10 is cut by the first cutting blade 91 and the second cutting blade 92 moving toward and away from each other. The waste container 95 is a container that stores the waste pieces D after cutting by the cutting mechanism 90. For example, the waste pieces D fall from the cutting mechanism 90 into the waste container 95.

[0046] Fig. 6 is a flowchart of the machining operation in the second embodiment. The control system 70 controls each element of the machining system 100B so that the machining system 100B operates according to the procedure illustrated in Fig. 3. As in the first embodiment, the machining operation is repeated at a predetermined cycle.

[0047] The conveyance by the movement amount δ (S1), the punching process by the processing mechanism 40 (S2), and the removal of the molded product P by the removal mechanism 50 (S3) are the same as in the first embodiment. After the above operations are performed, the cutting mechanism 90 cuts the resin film 10 to generate waste pieces D (S4a). The waste pieces D are stored in a waste container 95. The waste pieces D in the waste container 95 are discarded at an appropriate time. As described above, cutting is performed by the cutting mechanism 90 every time the resin film 10 is conveyed by the movement amount δ (S1), so the resin film 10 is cut into waste pieces D of length δ.

[0048] In parallel with the cutting of the resin film 10 (S4a), the heating mechanism 60 heats the protective film 20 (S5) and the protective film 20 is taken up (S6), as in the first embodiment. That is, in the processing operation of the second embodiment, the taking up of the resin film 10 (S4) in the first embodiment is replaced by cutting of the resin film 10 (S4a).

[0049] 6 may be performed in any order. For example, cutting of the resin film 10 (S4a) and heating of the protective film 20 (S5) and winding of the protective film 20 (S6) do not need to be performed in parallel. For example, cutting of the resin film 10 (S4a) may be performed first, followed by heating of the protective film 20 (S5) and winding of the protective film 20 (S6), or cutting of the resin film 10 (S4a) may be performed first, followed by heating of the protective film 20 (S5) and winding of the protective film 20 (S6).

[0050] The second embodiment also achieves the same effects as the first embodiment. Furthermore, in the second embodiment, the resin film 10 after punching is cut to a predetermined size, so that the resin film 10 after processing can be easily disposed of.

[0051] 3. Variations Specific modified embodiments that can be added to each of the embodiments exemplified above are exemplified below. Two or more embodiments arbitrarily selected from the following examples may be combined as appropriate within the scope of not being mutually contradictory.

[0052] (1) In each of the above-described embodiments, the resin film 10 and the protective film 20 are transported under the same conditions. However, as exemplified in the following embodiments, the transport conditions for the resin film 10 and the protective film 20 may be different.

[0053] [Aspect 1] The conveying speed of the resin film 10 may be different from the conveying speed of the protective film 20. For example, the conveying speed of the resin film 10 may be higher than the conveying speed of the protective film 20, or the conveying speed of the resin film 10 may be lower than the conveying speed of the protective film 20.

[0054] [Aspect 2] The movement amount δ1 of the resin film 10 per conveyance may be different from the movement amount δ2 of the protective film 20 per conveyance. For example, a configuration in which the movement amount δ1 of the resin film 10 exceeds the movement amount δ2 of the protective film 20, or a configuration in which the movement amount δ1 of the resin film 10 is smaller than the movement amount δ2 of the protective film 20 is conceivable.

[0055] [Aspect 3] The transport frequency of the resin film 10 and the transport frequency of the protective film 20 may be different. The transport frequency is the number of transports per unit time. For example, a configuration is envisaged in which the transport frequency of the resin film 10 exceeds the transport frequency of the protective film 20. Specifically, a configuration is envisaged in which the protective film 20 is transported only once every time the resin film 10 is transported a predetermined number of times. In the above configuration, the punching blade 43 repeatedly comes into contact with the same position on the protective film 20 multiple times. A configuration is also envisaged in which the transport frequency of the resin film 10 is lower than the transport frequency of the protective film 20.

[0056] Two or more embodiments may be selected from the above-described embodiments 1 to 3. For example, the conveying speed, the movement amount δ, and the conveying frequency may be different between the resin film 10 and the protective film 20. That is, the resin film 10 and the protective film 20 may be conveyed independently of each other. For example, a mechanism for conveying the resin film 10 and a mechanism for conveying the protective film 20 may be installed separately.

[0057] (2) In each of the above-described embodiments, the resin film 10 and the protective film 20 are conveyed by a movement amount δ corresponding to the period of the molded product P in the resin film 10. In the above-described embodiments, the ranges in which the incisions N are formed in the protective film 20 do not overlap with each other. However, the ranges in which the incisions N are formed in the protective film 20 may partially overlap in the X direction. For example, A: The conveying speed of the resin film 10 is faster than the conveying speed of the protective film 20. B: The movement amount δ1 of the resin film 10 exceeds the movement amount δ2 of the protective film 20. C: A configuration in which the transport frequency of the resin film 10 exceeds the transport frequency of the protective film 20 In this case, the cuts N formed in the protective film 20 for each punching process can overlap each other in the X direction.

[0058] (3) In the above-described embodiments, the heating mechanism 60 heats the protective film 20 every time the resin film 10 and the protective film 20 are transported by the movement amount δ. However, the temporal relationship between the transport of the protective film 20 and the heating by the heating mechanism 60 is not limited to the above examples. For example, FIG. 7 illustrates a configuration in which the dimension of the heating surface 611 of the heating mechanism 60 in the X direction is twice the movement amount δ. In FIG. 7, as shown in the following example, one heating by the heating mechanism 60 is performed every two times the protective film 20 is transported by the movement amount δ.

[0059] 7 is a range of the protective film 20 spanning a length δ in the X direction, similar to the example in FIG. 4. At time t1, a range of the protective film 20 with a length of 2δ, which is made up of ranges R1 and R2, is heated by the heating mechanism 60. At time t2, when the protective film 20 has moved by the amount δ, heating by the heating mechanism 60 is not performed. Then, at time t3, when the protective film 20 has moved further by the amount δ, a range of the protective film 20 with a length of 2δ, which is made up of ranges R3 and R4, is heated by the heating mechanism 60. According to the above embodiment, the number of times heating by the heating mechanism 60 can be reduced compared to the first embodiment (FIG. 4).

[0060] (4) In Figures 4 and 7, an example is shown in which the ranges R heated by the heating mechanism 60 do not overlap with each other, but a configuration in which the ranges heated for each processing operation on the protective film 20 partially overlap with each other is also envisioned.

[0061] 8, similarly to FIG. 7, illustrates a configuration in which the dimension of the heating surface 611 of the heating mechanism 60 in the X direction is twice the movement amount δ of the conveying mechanism 30. In the above configuration, one heating operation by the heating mechanism 60 may be performed each time the protective film 20 is conveyed by the movement amount δ.

[0062] For example, at time t1, areas R1 and R2 of the protective film 20 are heated by the heating mechanism 60. Heating by the heating mechanism 60 is also performed at time t2, when the protective film 20 has moved by the amount δ. That is, at time t2, areas R2 and R3 of the protective film 20 are heated. At time t3, when the protective film 20 has further moved by the amount δ, a range of length 2δ consisting of areas R3 and R4 of the protective film 20 is heated by the heating mechanism 60. As shown in the above example, each area R of the protective film 20 is heated twice in an overlapping manner. According to the above embodiment, compared to the embodiment in which each area R of the protective film 20 is heated only once (FIGS. 4 and 7), the incision N formed in the protective surface Q can be effectively repaired even if the length of time for each heating by the heating mechanism 60 is short.

[0063] (5) In the above-described embodiments, in a configuration in which the protective film 20 is located directly below the resin film 10, the resin film 10 is processed by the punching blade 43 descending from above the resin film 10, but the method of punching is not limited to the above examples. For example, in a configuration in which the protective film 20 is located directly above the resin film 10, the resin film 10 may be processed by the punching blade 43 ascending from below the resin film 10. In the above configuration, an incision N corresponding to the planar shape of the punching blade 43 is formed in the protective surface Q, which is the underside of the protective film 20. The heating mechanism 60 repairs the incision N by heating the protective surface Q.

[0064] (6) In each of the above-described embodiments, the conveying mechanism 30 (supply mechanism 31 and discharge mechanism 32) is exemplified, but the configuration for conveying the resin film 10 and the protective film 20 is not limited to the above examples. For example, the resin film 10 and the protective film 20 may be conveyed by rotating the winding axes Z (Za1, Za2, Zb1, Zb2) using a driving device such as an electric motor. In the above configuration, the driving device and each winding axis Z correspond to the "conveying mechanism."

[0065] (7) In each of the above-described embodiments, a resin film 10 is exemplified, but the object (hereinafter referred to as the "workpiece") to be processed by the processing system 100 (100A, 100B) is not limited to the resin film 10. For example, a sheet of paper, cloth, or the like may be processed by the processing system 100 as the workpiece. Also, a sheet of metal such as aluminum (e.g., aluminum film) may be processed by the processing system 100 as the workpiece.

[0066] (8) The term "nth" (n is a natural number) in this application is used only as a formal and convenient label to distinguish each element in the description and does not have any substantive meaning. Therefore, there is no room for restrictive interpretation of the position of each element or the order of manufacture, etc., based on the term "nth." [Explanation of symbols]

[0067] 100A, 100B... processing system, 10... resin film, 11... product roll material, 12... used roll material, D... waste piece, 20... protective film, 21... protective roll material, 22... recovered roll material, 30... conveying mechanism, 31... supply mechanism, 311... supply roller, 312... supply roller, 32... discharge mechanism, 321... discharge roller, 322... discharge roller, 40... processing mechanism, 41, 42... mold, 411, 421... processing surface, 43... punching blade, 44... drive mechanism, 50... removal mechanism, 60... heating mechanism, 61... first part, 62... second part 62, 611, 621... heating surface, 63... heat source, 64... drive mechanism, 70... control system, 80... conveying mechanism, 81... conveying roller, 90... cutting mechanism, 91... first cutting blade, 92... second cutting blade, 95... waste container.

Claims

1. a processing mechanism that performs punching processing on a workpiece using a punching blade; a conveying mechanism that conveys a protective film that comes into contact with a tip of the punching blade that has penetrated the workpiece during the punching process; a heating mechanism that melts the surface of the protective film that comes into contact with the punching blade; A processing system comprising:

2. The heating mechanism includes: a first portion including a first heating surface; a second portion including a second heating surface opposite the first heating surface; The protective film is pressed by the first heating surface and the second heating surface. The processing system of claim 1 .

3. the transport mechanism transports the protective film in a predetermined direction; The heating mechanism is positioned in the predetermined direction relative to the processing mechanism. The processing system according to claim 1 or 2.

4. the transport mechanism transports the protective film unwound from a protective roll material installed on a first winding shaft, The protective film is heated by the heating mechanism. The processing system of claim 1 .

5. a cutting mechanism for cutting the workpiece into a predetermined size after the punching process; The processing system of claim 1 further comprising:

6. We manufacture molded products by punching the workpiece using a punching blade. conveying a protective film that comes into contact with the tip of the punching blade that has penetrated the workpiece during the punching process; The surface of the protective film that comes into contact with the punching blade is melted. Manufacturing method of molded products.

Citation Information

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