Tank for heat dissipation and cooling system including same

The cooling system with submerged cooling tanks and shared heat exchanger and pump addresses inefficiencies in data center cooling, achieving low PUE and reduced land footprint through scalable and efficient heat dissipation.

JP7823078B2Active Publication Date: 2026-03-03フィルムス·メタル·テクノロジーズ·シンガポール·ピーティーイー·リミテッド
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Patent Information

Application Number
JP2023568543
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-05-07
Filing Date
2021-10-19
Publication Date
2026-03-03
Estimated Expiration
2041-10-19

AI Technical Summary

Technical Problem

Existing data center cooling systems face challenges in achieving low Power Utilization Effectiveness (PUE) and require a larger land footprint, as current air cooling and immersion cooling technologies do not meet stringent efficiency and space requirements.

Method used

A cooling system comprising multiple cooling tanks submerged in liquid coolant, connected by inlet and outlet pipes, a heat exchanger, and a coolant pump, which allows for scalable deployment and efficient heat dissipation, reducing PUE to below 1.03 and requiring a smaller land footprint.

Benefits of technology

The system achieves a PUE lower than 1.03 and higher power density, minimizing electricity waste and land usage by efficiently dissipating heat from computing devices in data centers.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The cooling system (100) includes a plurality of cooling tanks (101), each of the cooling tanks (101) configured to contain a liquid coolant; a set of connecting pipes (106) configured to fluidly connect the plurality of cooling tanks (101); a set of inlet pipes (102) fluidly connected to the plurality of cooling tanks (101) to supply liquid coolant into the plurality of cooling tanks (101); a set of outlet pipes (103) fluidly connected to the plurality of cooling tanks (101) to discharge liquid coolant carrying heat absorbed from the computing device (520) out of the plurality of cooling tanks (101); a heat exchanger (104) fluidly connected to each of the set of inlet pipes (102) and each of the set of outlet pipes (103); and a coolant pump (105) fluidly connected to each of the set of outlet pipes (103).
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Description

[Technical Field]

[0001] TECHNICAL FIELD The present disclosure relates to heat dissipation, and more particularly to a tank for heat dissipation and a cooling system including the same. [Background technology]

[0002] A data center typically hosts hundreds, thousands, or tens of thousands of computing devices or servers to perform computing tasks. These computing devices generate a tremendous amount of heat during operation. The heat generated by the computing devices must be dissipated for the computing devices to operate properly. Otherwise, the computing devices may be damaged due to heat buildup in the data center. Therefore, cooling systems are required to be installed in the data center to dissipate the heat. Both the computing devices and the cooling systems in a data center consume electricity. Power utilization effectiveness (PUE) is used to measure the efficiency of power usage, which is defined as the ratio of the total power consumed by the data center to the power delivered to the computing devices or servers performing computing tasks. For example, a data center consumes 10,000 kW of total power, which is used to power servers and other equipment, mainly the cooling system for cooling the servers. At the same time, 8,000 kW from the total power is used to power the servers. Therefore, the PUE for the data center is 10,000KW / 8,000KW = 1.25. A lower PUE typically means less electricity waste, lower operating costs, and a greater competitive advantage.

[0003] Air cooling and immersion cooling are currently being adopted in data centers. Immersion cooling has advantages over air cooling in data centers, and immersion cooling has a PUE that is much lower than that of cooling. For example, immersion cooling systems developed by Green Revolution Cooling, Inc. and Alibaba Group achieved PUEs of 1.05 and 1.07, respectively, in 2020, compared to an average PUE of 1.59. Furthermore, immersion cooling systems require a smaller land footprint for the same capacity, which means greater power density. However, with stringent requirements proposed for data center operation, such as lower PUE, smaller land footprint, or higher power density, there is a need for improved cooling systems to meet at least some of the requirements.

[0004] Any discussion of background art throughout the specification should not be taken as an admission that such background art is prior art, that such background art is publicly known, or that it forms part of the general knowledge in the field in Australia or any other country. Summary of the Invention

[0005] A cooling system is provided for cooling computing devices operating within a data center. a plurality of cooling tanks, each configured to contain a liquid coolant and sized to submerge the computing device in the liquid coolant, such that the liquid coolant absorbs heat generated by the computing device to cool the computing device; a set of connecting pipes configured to fluidly connect the plurality of cooling tanks so as to maintain a liquid coolant in each of the plurality of cooling tanks at a substantially same level; a set of inlet pipes fluidly connected to the plurality of cooling tanks so as to supply liquid coolant into the plurality of cooling tanks; a set of outlet pipes fluidly connected to the plurality of cooling tanks so as to discharge a liquid coolant that carries heat absorbed from the computing device out of the plurality of cooling tanks; a heat exchanger fluidly connected to each of the set of inlet pipes to supply liquid coolant into the set of inlet pipes and fluidly connected to each of the set of outlet pipes to receive liquid coolant carrying heat absorbed from the computing device from the set of outlet pipes, the heat exchanger configured to dissipate heat from the heat-carrying liquid coolant; and a coolant pump fluidly connected to each of the sets of outlet pipes, the coolant pump configured to facilitate circulation of liquid coolant within the plurality of cooling tanks, the set of inlet pipes, the set of outlet pipes, and the heat exchanger.

[0006] The set of inlet pipes may include a main inlet pipe and a plurality of branch inlet pipes extending from and fluidly connecting to the main inlet pipe, the main inlet pipe fluidly connecting to the heat exchanger, and each of the plurality of branch inlet pipes fluidly connecting to one of a plurality of cooling tanks.

[0007] The set of outlet pipes may include a main outlet pipe and a plurality of branch outlet pipes extending from and fluidly connecting to the main outlet pipe, the main outlet pipe fluidly connecting to the heat exchanger via a coolant pump, and each of the plurality of branch outlet pipes fluidly connecting to one of a plurality of cooling tanks.

[0008] Each of the connecting pipes may include a connection isolation valve for controlling the fluid connection between two adjacent cooling tanks.

[0009] Each of the plurality of branch inlet pipes may include a balancing valve for controlling the rate at which liquid coolant flows into the cooling tank to which the branch inlet pipe is fluidly connected.

[0010] Each of the plurality of branch outlet pipes may include an outlet isolation valve for stopping heat-carrying liquid coolant from flowing out of the cooling tank to which the branch outlet pipe is fluidly connected.

[0011] The cooling system may further include a drain-fill system, the drain-fill system comprising: Discharge and fill pumps, a coolant reservoir; a set of discharge-fill pipes including a main discharge-fill pipe and a plurality of branch discharge-fill pipes extending from the main discharge-fill pipe and fluidly connected to one of the cooling tanks; The main discharge-fill pipe is fluidly connected to a discharge-fill pump, which is fluidly connected to a coolant reservoir.

[0012] Each of the branch discharge-fill pipes may include a discharge-fill valve.

[0013] The discharge and filling pipe set is a discharge interconnection pipe fluidly connecting the main discharge-fill pipe to the main outlet pipe, the discharge interconnection pipe including a discharge interconnection valve for controlling fluid communication between the main discharge-fill pipe and the main outlet pipe; a fill interconnection pipe fluidly connecting the main discharge-fill pipe to the main outlet pipe, the fill interconnection pipe including a fill interconnection valve for controlling fluid communication between the main discharge-fill pipe and the main outlet pipe; As a result, liquid coolant can be discharged from one or more of the multiple cooling tanks into the main outlet pipe, and liquid coolant can be filled into one or more of the multiple cooling tanks from the main outlet pipe.

[0014] The cooling system is a water supply pipe fluidly connected to the heat exchanger to supply water into the heat exchanger for the heat exchanger to dissipate heat into the water; and a water discharge pipe fluidly connected to the heat exchanger to discharge the heat-bearing water from the heat exchanger. a cooling tower fluidly connected to the water supply pipe and the water discharge pipe, the cooling tower configured to supply water into the water supply pipe, receive hot water from the water discharge pipe, and release heat from the water to cool the water before supplying the water into the water supply pipe; The system may further include a water pump fluidly connected to the cooling tower and the water supply pipe to facilitate circulation of water within the water supply pipe, the water discharge pipe, the cooling tower, and the heat exchanger.

[0015] The heat exchanger is a set of coolant channels fluidly connected to the main outlet pipe to receive liquid coolant from the main outlet pipe, the liquid coolant carrying heat absorbed from the computing device, and fluidly connected to the main inlet pipe to supply liquid coolant into the main inlet pipe; and a set of water channels fluidly connected to the water supply pipe and the water discharge pipe, the set of water channels configured to be fluidly isolated from but thermally coupled to the set of coolant channels so that heat is dissipated from the liquid coolant to the water.

[0016] The cooling tower may include a temperature control mechanism for setting the temperature of the water supplied to the water supply pipes.

[0017] The cooling tower may include an evaporative cooling tower.

[0018] Each of the plurality of cooling tanks a container forming a working space to contain a liquid coolant, the container including a coolant inlet, a coolant outlet, a first connecting member, and a second connecting member, the coolant inlet configured to fluidly connect to one of a set of inlet pipes, the coolant outlet configured to fluidly connect to one of a set of outlet pipes, the first connecting member configured to fluidly connect to a first connecting pipe of the set of connecting pipes, and the second connecting member configured to fluidly connect to a second connecting pipe of the set of connecting pipes; and a separation panel extending within the working space of the container to separate the working space into a cooling space and a return space, wherein the cooling space is fluidly coupled to the coolant inlet and the return space is fluidly coupled to the coolant outlet, the first connecting member, and the second connecting member, the separation panel configured to cause liquid coolant in the cooling space to flow into the return space due to supply of liquid coolant into the cooling space via the coolant inlet, and the coolant outlet further configured to release liquid coolant carrying heat absorbed from the computing device out of the return space.

[0019] Each container of the plurality of cooling tanks comprises: a bottom panel having a first edge, a second edge adjacent to the first edge, a third edge adjacent to the second edge and opposite the first edge, and a fourth edge connecting the third edge to the first edge; a first sidewall extending from the first edge; a second sidewall extending from the second edge; a third sidewall extending from the third edge; a fourth sidewall extending from the fourth edge, The bottom panel, the first sidewall, the second sidewall, the third sidewall, and the fourth sidewall form a workspace.

[0020] The coolant inlet, the coolant outlet, the first connecting member, and the second connecting member may be located on the bottom panel.

[0021] The separation panel may extend from the bottom panel along the first side wall and the third side wall to separate the working space into a cooling space and a return space, such that the first side wall, the third side wall, the fourth side wall, the bottom panel, and the separation panel form a cooling space, and the first side wall, the second side wall, the third side wall, the bottom panel, and the separation panel form a return space.

[0022] The separation panel may have a first height that allows the cooling space to be in fluid communication with the return space above the separation panel such that fluid within the cooling space can flow into the return space.

[0023] The coolant outlet may extend from the bottom panel and may have an upper opening lower than the first height of the separation panel such that the upper opening of the coolant outlet is immersed in the liquid coolant that carries heat absorbed from the computing device and allows the heat-carrying liquid coolant to flow out of the return space.

[0024] Each of the plurality of cooling tanks may further include a coolant distribution panel including a plurality of holes and extending within the cooling space to cover the coolant inlet to evenly distribute the liquid coolant and regulate the pressure of the liquid coolant entering the cooling space.

[0025] At least a portion of the plurality of holes in the coolant distribution panel may be configured to be aligned with at least one of the computing devices.

[0026] The plurality of holes may have a diameter of 3 millimeters.

[0027] A cooling tank for cooling computing devices operating within a data center is provided. The cooling tank comprises: a container forming a working space to contain a liquid coolant, the container including a coolant inlet, a coolant outlet, a first connecting member, and a second connecting member, the coolant inlet configured to fluidly connect to one of a set of inlet pipes, the coolant outlet configured to fluidly connect to one of a set of outlet pipes, the first connecting member configured to fluidly connect to a first connecting pipe of the set of connecting pipes, and the second connecting member configured to fluidly connect to a second connecting pipe of the set of connecting pipes; and a separation panel extending within the working space of the container to separate the working space into a cooling space and a return space, wherein the cooling space is fluidly coupled to the coolant inlet and the return space is fluidly coupled to the coolant outlet, the first connecting member, and the second connecting member, the separation panel configured to cause liquid coolant in the cooling space to flow into the return space due to supply of liquid coolant into the cooling space via the coolant inlet, and the coolant outlet further configured to discharge liquid coolant carrying heat absorbed from the computing device flowing out of the return space.

[0028] The container is a bottom panel having a first edge, a second edge adjacent to the first edge, a third edge adjacent to the second edge and opposite the first edge, and a fourth edge connecting the third edge to the first edge; a first sidewall extending from the first edge; a second sidewall extending from the second edge; a third sidewall extending from the third edge; a fourth sidewall extending from the fourth edge, The bottom panel, the first sidewall, the second sidewall, the third sidewall, and the fourth sidewall form a workspace.

[0029] The coolant inlet, the coolant outlet, the first connecting member, and the second connecting member may be located on the bottom panel.

[0030] The separation panel may extend from the bottom panel along the first side wall and the third side wall to separate the working space into a cooling space and a return space, such that the first side wall, the third side wall, the fourth side wall, the bottom panel, and the separation panel form a cooling space, and the first side wall, the second side wall, the third side wall, the bottom panel, and the separation panel form a return space.

[0031] The separation panel may have a first height that allows the cooling space to be in fluid communication with the return space above the separation panel such that fluid within the cooling space can flow into the return space.

[0032] The coolant outlet may extend from the bottom panel and may have an upper opening lower than the first height of the separation panel such that the upper opening of the coolant outlet is immersed in the liquid coolant that carries heat absorbed from the computing device and allows the heat-carrying liquid coolant to flow out of the return space.

[0033] The cooling tank may further include a coolant distribution panel including a plurality of holes and extending within the cooling space to cover the coolant inlet to evenly distribute the liquid coolant and regulate the pressure of the liquid coolant entering the cooling space.

[0034] At least a portion of the plurality of holes in the coolant distribution panel may be configured to be aligned with at least one of the computing devices.

[0035] The plurality of holes may have a diameter of 3 millimeters.

[0036] Other aspects of the present invention are also disclosed in this disclosure.

[0037] Irrespective of any other form that may fall within the scope of the present disclosure, embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings in which: [Brief explanation of the drawings]

[0038] [Figure 1A]1 illustrates one embodiment of a cooling system according to the present disclosure. [Figure 1B] 1B illustrates a perspective view of the cooling system shown in FIG. 1A. [Figure 1C] 1 illustrates an example cooling system having a drain-fill system according to the present disclosure. [Figure 1D] 1 illustrates an example cooling system having a drain-fill system according to the present disclosure. [Figure 1E] 1 illustrates an example cooling system having a drain-fill system according to the present disclosure. [Figure 1F] 1 illustrates an example cooling system having a drain-fill system according to the present disclosure. [Figure 2] 1 illustrates a portion of a cooling system according to the present disclosure. [Figure 3] 1 illustrates an example of an inlet pipe set and an example of an outlet pipe set according to the present disclosure. [Figure 4] 1 illustrates one embodiment of a cooling tower according to the present disclosure. [Figure 5] FIG. 1 illustrates a perspective view of an exemplary cooling tank according to the present disclosure. [Figure 6] FIG. 1 illustrates a top view of an exemplary cooling tank according to the present disclosure. [Figure 7] FIG. 1 illustrates a front view of an exemplary cooling tank according to the present disclosure. [Figure 8] FIG. 2 illustrates a left side view of an exemplary cooling tank. [Figure 9] 1(a) and 1(b) illustrate an exemplary coolant distribution panel according to the present disclosure. [Figure 10A] 1 illustrates an example cooling system including more than one sub-cooling system according to the present disclosure. [Figure 10B] 1 illustrates an example cooling system including more than one sub-cooling system according to the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0039] It should be noted in the accompanying drawings and the following description that like or identical reference numbers in different drawings indicate the same or similar elements. Also, the dimension lines and related dimensions in the accompanying drawings are for illustrative purposes only and should not be construed as limitations on the present disclosure.

[0040] Figure 1A illustrates an example of a cooling system 100 according to the present disclosure. Figure 1B illustrates a perspective view of the cooling system 100 shown in Figure 1A.

[0041] The cooling system 100 can be used to cool computing devices operating in a data center. The cooling system 100 includes multiple cooling tanks. As shown in FIGS. 1A and 1B, the exemplary cooling system 100 includes 32 cooling tanks on two decks, i.e., an upper deck and a lower deck. 16 cooling tanks are disposed on each deck, and the 16 cooling tanks on each deck are arranged in two rows. As another example, the cooling system 100 may include 16 tanks on two decks, with 8 tanks on each deck. It should be noted that the cooling system 100 may include more or fewer decks or cooling tanks, and a different number of cooling tanks may be arranged on each of the decks, without departing from the scope of this disclosure. Furthermore, the cooling tanks on each deck may be arranged in one row or more than two rows without departing from the scope of this disclosure. The following description related to elements installed on the lower deck also applies to elements installed on the upper deck or other deck(s), if present. The following description relating to a row of cooling tanks on a deck also applies to another row of cooling tanks on the same deck. As another example, a cooling system 100 as described with reference to FIGS. 1A, 1B, and other related figures can be used as a sub-cooling system, and another cooling system 100 can be used as another sub-cooling system. Two sub-cooling systems 100 can be fluidly connected together to form a cooling system. Such cooling systems including more than one sub-cooling system 100 are also described in this disclosure. Furthermore, a pipe in this disclosure can be a straight pipe, a bent pipe, a curved pipe, or a combination of pipes in different shapes. A pipe can also include one or more segments that are fluidly connected. One or more segments of a pipe can extend in the same direction or in different directions. Furthermore, references to pipe segments do not define the structure of the pipe, but rather indicate different portions of the pipe for ease of explanation.

[0042] For ease of explanation, the multiple cooling tanks on the lower deck are referred to as 101. Although not depicted, the cooling tanks on the upper deck have the same structure and function in the same manner as the cooling tanks 101 on the lower deck. Each of the cooling tanks 101 is configured to contain a liquid coolant and be sized to immerse a computing device (not shown in FIGS. 1A and 1B, but shown in FIGS. 6-8) in the liquid coolant, so that the liquid coolant absorbs heat generated by the computing device to cool the computing device. During operation of the cooling system 100 and data center, one or more computing devices or servers are placed in each of the cooling tanks 101, and heat generated by the computing device is absorbed by the liquid coolant in the cooling tanks 101 to reduce the temperature of the computing device. As a result, the liquid coolant around the computing device heats up and its temperature increases. The liquid coolant can be, for example, cooling oil.

[0043] The cooling system 100 also includes a set of inlet pipes 102. The set of inlet pipes 102 is fluidly connected to the plurality of cooling tanks 101 to supply liquid coolant to the plurality of cooling tanks 101. The liquid coolant is supplied to the cooling tanks 101 from the bottom of the cooling tanks 101 via the set of inlet pipes 102.

[0044] The cooling system 100 also includes a set of outlet pipes 103 that are fluidly connected to the plurality of cooling tanks 101 to discharge liquid coolant that carries heat absorbed from the computing devices out of the plurality of cooling tanks 101. The heat-carrying liquid coolant is discharged out of the cooling tanks 101 through the bottom of the cooling tanks 101 via the set of outlet pipes 103.

[0045] The cooling system 100 also includes a heat exchanger 104. The heat exchanger 104 is fluidly connected, directly or indirectly, to each of the sets of inlet pipes 102 to supply liquid coolant to the sets of inlet pipes 102. The heat exchanger 104 is also fluidly connected, directly or indirectly, to each of the sets of outlet pipes 103 to receive liquid coolant carrying heat absorbed from the computing devices from the set of outlet pipes 103. The heat exchanger 104 is configured to dissipate heat from the heat-carrying liquid coolant. Thus, the temperature of the liquid coolant is reduced, and the liquid coolant is supplied to the set of inlet pipes 102 and then to the multiple cooling tanks 101 to cool the computing devices immersed in the liquid coolant therein.

[0046] The cooling system 100 also includes a coolant pump 105 in direct or indirect fluid communication with each of the sets of outlet pipes 103. The coolant pump 105 is configured to facilitate circulation of liquid coolant through the plurality of cooling tanks 101, the sets of inlet pipes 102, the sets of outlet pipes 103, and the heat exchanger 104.

[0047] In the cooling system 100, the heat exchanger 104 is fluidly connected to the multiple cooling tanks 101 via a set of inlet pipes 102 and a set of outlet pipes 103. Furthermore, the coolant pump 105 is fluidly connected to the multiple cooling tanks 101 via the set of outlet pipes 102. Because the heat exchanger 104 and the coolant pump 105 are shared by the multiple cooling tanks 101, such a structure eliminates the need for the multiple cooling tanks 101 to have their own individual heat exchangers and their own individual coolant pumps to dissipate heat and circulate liquid coolant. Thus, the cooling system 100 enables scalable deployment of data centers. A data center with such a cooling system can achieve a PUE lower than or even lower than 1.03, or a higher power density, requiring a smaller land footprint.

[0048] Figure 2 illustrates a portion of a cooling system 100 according to the present disclosure. Figure 3 illustrates one embodiment of a set of inlet pipes 102 and one embodiment of a set of outlet pipes 103 according to the present disclosure.

[0049] The set of inlet pipes 102 extend below the multiple cooling tanks 101, although not all of them are shown in FIG. 3 for ease of illustration. The set of inlet pipes 102 includes a main inlet pipe 1021 (also shown in FIG. 2) and multiple branch inlet pipes 1022 extending from the main inlet pipe 1021. The multiple branch inlet pipes 1022 are fluidly connected to the main inlet pipe 1021. The main inlet pipe 1021 is fluidly connected to the heat exchanger 104 (also shown in FIG. 2), and each of the multiple branch inlet pipes 1022 is fluidly connected to one of the multiple cooling tanks 101. Thus, liquid coolant flows through the heat exchanger 104 and the set of inlet pipes 102 (i.e., the main inlet pipe 1021 and the multiple branch pipes 1022) into the multiple cooling tanks 101. There may also be a support rack (not shown in FIG. 3) below the multiple cooling tanks 101 for supporting the multiple cooling tanks 101. The main inlet pipe 1021 may be fixed to a support rack.

[0050] Each of the multiple branch inlet pipes 1022 includes a balancing valve 1023 for controlling the rate at which liquid coolant flows into the cooling tank 101 to which the branch inlet pipe 1022 is fluidly connected. The liquid coolant in the branch inlet pipes 1022 has a higher pressure where the branch inlet pipe 1022 is closer to the heat exchanger 104 as the liquid coolant is pumped out of the heat exchanger 104 by the pump 105. The pressure in the branch inlet pipe 1022 drops along the main coolant inlet 1021 depending on how far the branch inlet pipe 1022 is from the heat exchanger 104. The balancing valves 1023 on the multiple branch inlet pipes 1022 are configured to ensure that the liquid coolant flows into the respective cooling tanks 101 through their corresponding branch inlet pipes 1022 at a uniform rate. The balancing valve(s) 1023 can also be closed to isolate one or more of the cooling tanks 101 as needed when one or more of the cooling tanks 101 need to be drained for operational requirements and serviceability, for example, as described with reference to the drain-fill system 120 shown in Figures 1C-1F.

[0051] A set of outlet pipes 103 extends beneath the plurality of cooling tanks 101. The set of outlet pipes 103 includes a main outlet pipe 1031 (also shown in FIG. 2) and a plurality of branch outlet pipes 1032 extending from the main outlet pipe 1031. The plurality of branch outlet pipes 1032 are fluidly connected to the main outlet pipe 1031. The main outlet pipe 1031 is fluidly connected to the heat exchanger 104 via a coolant pump 105. As shown in FIG. 2, the coolant pump 105 includes a pump inlet 1051 for drawing heat-carrying liquid coolant into the coolant pump 105 and a pump outlet 1052 for dissipating the heat-carrying liquid coolant from the pump 105. A first segment 1031-1 of the main outlet pipe 1031 is fluidly connected to a pump inlet 1051 of the coolant pump 105, and a second segment 1031-2 of the main outlet pipe 1031 is fluidly connected to a pump outlet 1052 of the coolant pump 105. Each of the plurality of branch outlet pipes 1032 is fluidly connected to one of the plurality of cooling tanks 101. Thus, heat-carrying liquid coolant flows out of the plurality of cooling tanks 101 via the set of outlet pipes 103 (i.e., the main outlet pipe 1031 and the plurality of branch outlet pipes 1032) and the coolant pump 105 and back to the heat exchanger 104. The heat in the liquid coolant is dissipated by the heat exchanger 104, and then the liquid coolant flows from the heat exchanger 104 into the plurality of cooling tanks 101 via the set of inlet pipes 102 (i.e., the main inlet pipe 1021 and the plurality of branch pipes 1022). The main outlet pipe 1031 may be secured to a support rack. Each of the branch outlet pipes 1032 may have an outlet isolation valve 1033. The outlet isolation valve(s) 1033 may be closed to isolate a portion of the cooling system 100 for operational requirements and serviceability, or to stop the flow of heat-carrying liquid coolant out of the cooling tank(s) 101 to which the branch outlet pipes 1032 are fluidly connected, as described with reference to the drain-fill system 120 shown in FIGS. 1C-1F.

[0052] As shown in FIG. 3 , the cooling system 100 further includes a set of connecting pipes 106. The set of connecting pipes 106 is configured to fluidly connect the multiple cooling tanks 101 so as to maintain liquid coolant in each of the multiple cooling tanks 101 at substantially the same level. Each of the set of connecting pipes 106 connects two adjacent cooling tanks 101 at the bottom of the cooling tanks 101. For example, the two connecting pipes 106 are fluidly connected to the cooling tanks 101 at the bottom of the cooling tanks 101. As shown in FIG. 3 , one of the two connecting pipes 106 fluidly connects the cooling tank 101 to the adjacent cooling tank 101 on one side, and the other of the two connecting pipes 106 fluidly connects the cooling tank 101 to the other adjacent cooling tank 101 on the other side. Each of the connecting pipes 106 may further have a connection isolation valve 1061 for controlling the fluid connection between the two adjacent cooling tanks 101. The connection isolation valves 1061 can be opened or closed to regulate the volume of liquid coolant in each of the cooling tanks 101. In particular, the connection isolation valves 1061 can be opened or closed to maintain liquid coolant in each of the cooling tanks 101 at substantially the same level. The connection isolation valves 1061 can also be closed to isolate portions of the cooling system 100 for operational requirements and serviceability. As an example, the connection isolation valves 1061 of two connecting pipes 106 fluidly connected to a cooling tank 101 can be closed to isolate the cooling tank 101. In this manner, liquid coolant stops flowing between the cooling tank 101 and its adjacent cooling tank 101. As a result, liquid coolant can be drained from or filled into the cooling tank 101 for service purposes, as described with reference to the drain-fill system 120 shown in FIGS. 1C-1F.

[0053] The cooling system 100 may further include a drain-fill system 120, as shown in Figures 1C-1F.

[0054] FIG. 1C illustrates a cooling system 100 having a drain-fill system 120. As shown in FIG. 1C, the drain-fill system 120 includes a drain-fill pump 130, a coolant reservoir 140, and a set of drain-fill pipes 150. The coolant reservoir 140 stores liquid coolant. The drain-fill pump 130 is fluidly connected to the coolant reservoir 140 and the set of drain-fill pipes 150. FIG. 1D is a partial top perspective view of the cooling system 100 illustrating the set of drain-fill pipes 150. FIG. 1E is a partial bottom perspective view of the cooling system 100 illustrating the set of drain-fill pipes 150. FIG. 1F is another partial bottom perspective view of the cooling system 100 illustrating the set of drain-fill pipes 150.

[0055] The drain-fill system 120 is configured to drain liquid coolant from one or more cooling tanks 101 and fill liquid coolant into one or more cooling tanks 101. In this manner, when one or more cooling tanks 101 need to be serviced, the drain-fill system 120 drains liquid coolant from one or more cooling tanks 101. After servicing is completed, the drain-fill system 120 fills liquid coolant into one or more cooling tanks 101. The process of draining and filling one or more cooling tanks 101 is described below with reference to the following examples.

[0056] Discharge and Fill Example 1 The set of discharge-fill pipes 150 includes a main discharge-fill pipe 1501 and a plurality of branch discharge-fill pipes 1502. The main discharge-fill pipe 1501 is fluidly connected to the discharge-fill pump 130, which is in turn fluidly connected to the coolant reservoir 140. The main discharge-fill pipe 1501 may include one or more segments. In particular, in the exemplary cooling system 100 including two decks and two rows of cooling tanks 101 on each deck, the main discharge-fill pipe 1501 includes a first segment 1501-1 fluidly connected to the discharge-fill pump 130, a second segment 1501-2 extending from the first segment 1501-1, a third segment 1501-3 extending from the second segment 1501-2 (for the lower deck), and a fourth segment 1501-4 extending from the second segment 1501-2 (for the upper deck). a fifth segment 1501-5 extending from the third segment 1501-3 (for the first row on the lower deck), a sixth segment 1501-6 extending from the third segment 1501-3 (for the second row on the lower deck), a seventh segment 1501-7 extending from the fourth segment 1501-4 (for the first row on the upper deck), and an eighth segment 1501-8 extending from the fourth segment 1501-4 (for the second row on the upper deck). It should be noted that the cooling system 100 may have a different number of segments without departing from the scope of this disclosure. As an example, if the cooling system 100 includes only one deck (e.g., a lower deck) and the deck includes only one row of cooling tanks 101 (e.g., the first row), the main discharge-fill pipe 1501 may include only a first segment 1501-1, a second segment 1501-2, a third segment 1501-3, and a fifth segment 1501-5.

[0057] Each of the branch discharge-fill pipes 1502 extends from the main discharge-fill pipe 1501, particularly the fifth segment 1501-5, the sixth segment 1501-6, the seventh segment 1501-7, or the eighth segment 1501-8, and is fluidly connected to one of the cooling tanks 101, for example, at the bottom of the cooling tanks 101. Each of the branch discharge-fill pipes 1502 also includes a discharge-fill valve 1503 that controls the fluid connection between the branch discharge-fill pipe 1502 and the corresponding cooling tank 101. When the discharge-fill valve 1503 is open, the branch discharge-fill pipe 1502 is fluidly connected to the cooling tank 101. On the other hand, when the discharge-fill valve 1503 is closed, the branch discharge-fill pipe 1502 is fluidly disconnected from the cooling tank 101.

[0058] When the cooling system 100 is in normal operation, all drain-fill valves 1503 are closed, disconnecting the fluid connection between the cooling tanks 101 and the drain-fill system 120. When one or more cooling tanks 101 need to be serviced, the coolant pumps 105 are stopped. In particular, if one or more cooling tanks 101 to be serviced are located on the upper deck, the coolant pump 105 for the upper deck is stopped. If one or more cooling tanks 101 to be serviced are located on the lower deck, the coolant pump 105 for the lower deck is stopped. If one or more cooling tanks 101 to be serviced are located on both decks, both coolant pumps 105 are stopped. After the coolant pump(s) 105 are stopped, one or more drain-fill valves 1503 connected to one or more cooling tanks 101 to be serviced are opened to fluidly connect the one or more cooling tanks 101 to the drain-fill system 120, in particular to the corresponding one or more branch drain-fill pipes 1502. Additionally, the corresponding balancing valve(s) 1023, outlet isolation valve(s) 1033, and connection isolation valve(s) 1061 are closed to isolate the one or more cooling tanks 101. The discharge-fill pump 130 then begins to discharge liquid coolant from the one or more cooling tanks 101 into the coolant reservoir 140 for servicing. In particular, the liquid coolant flows out of the one or more cooling tanks 101 via the corresponding one or more branch discharge-fill pipes 1502 and into one or more of the fifth segment 1501-5, sixth segment 1501-6, seventh segment 1501-7, and eighth segment 1501-8 of the main discharge-fill pipe 1501, depending on where the one or more cooling tanks 101 to be serviced are located. The liquid coolant then flows through the third segment 1501-3 and / or fourth segment 1501-4 of the main discharge-fill pipe 1501. The liquid coolant then flows through the second segment 1501-2 and the first segment 1501-1 of the main discharge-fill pipe 1501 and is discharged into the coolant reservoir 140. After the liquid coolant has been discharged from the one or more cooling tanks 101, service can be performed by a technician.After servicing is completed, the discharge-fill pump 130 is started in the reverse direction to fill the liquid coolant into the serviced cooling tank(s) 101. Specifically, the liquid coolant flows out from the coolant reservoir 140 through the first segment 1501-1 and the second segment 1501-2 of the main discharge-fill pipe 1501. The liquid coolant then flows through the third segment 1501-3 and / or the fourth segment 1501-4 of the main discharge-fill pipe 1501, depending on where the cooling tank(s) 101 to be serviced are located. The liquid coolant then flows through one or more of the fifth segment 1501-5, the sixth segment 1501-6, the seventh segment 1501-7, and the eighth segment 1501-8 of the main discharge-fill pipe 1501. The liquid coolant is then filled into the cooling tank(s) 101 via the corresponding one or more branch discharge-fill pipes 1502. After the liquid coolant has filled back into one or more cooling tanks 101, the corresponding one or more drain-fill valves 1503 are closed to sever the fluid connection between the cooling tanks 101 and the drain-fill system 120. Also, the corresponding closed balance valve(s) 1023, outlet isolation valve(s) 1033, and connection isolation valve(s) 1061 are opened, and the coolant pump(s) 105 are started. In this manner, the cooling system 100 returns to normal operation.

[0059] The drain and fill system 120 can also be used to fill all cooling tanks 101 of the cooling system 100 with liquid coolant stored in the coolant reservoir 140 when initializing the cooling system 100.

[0060] A problem with the above drain and fill system 120 is that even if only one cooling tank 101 (or several cooling tanks 101) needs to be serviced, the coolant pump(s) 105 need to be stopped. As a result, if both coolant pumps 105 are stopped, normal operation of the entire cooling system 100 may be interrupted, or if one of the coolant pumps 105 is stopped, normal operation of one deck of the cooling system 100 may be interrupted. A solution to the problem is described in Example 2 of Drain and Fill.

[0061] Draining and Filling Example 2 The set of discharge-fill pipes 150 further includes a discharge interconnection pipe 1504 that fluidly connects the main discharge-fill pipe 1501 to a first segment 1031-1 of the main outlet pipe 1031, which in turn fluidly connects to a pump inlet 1051 of the coolant pump 105. In the exemplary cooling system 100, the discharge interconnection pipe 1504 extends from the main discharge-fill pipe 1501 to the first segment 1031-1 of the main outlet pipe 1031 near the pump inlet 1051 of the coolant pump 105. In the exemplary cooling system 100, the discharge interconnection pipe 1504 connects the main discharge-fill pipe 1501 to the first segment 1031-1 of the main outlet pipe 1031 for both the upper deck and the lower deck. The discharge interconnection pipe 1504 includes a discharge interconnection valve 1505 for controlling fluid communication between the main discharge-fill pipe 1501 and the first segment 1031-1 of the main outlet pipe 1031. In the exemplary cooling system 100, the discharge interconnection pipe 1504 includes two discharge interconnection valves 1505 because the discharge interconnection pipe 1504 connects the main discharge-fill pipe 1501 to the first segment 1031-1 of the main outlet pipe 1031 for both the upper deck and the lower deck.

[0062] The discharge-fill pipe set 150 further includes a fill interconnection pipe 1506 that fluidly connects the main discharge-fill pipe 1501 to a second segment 1031-2 of the main outlet pipe 1031, which in turn fluidly connects to a pump outlet 1052 of the coolant pump 105. In the exemplary cooling system 100, the fill interconnection pipe 1506 extends from the main discharge-fill pipe 1501 to the second segment 1031-2 of the main outlet pipe 1031 near the pump outlet 1052 of the coolant pump 105. In the exemplary cooling system 100, the fill interconnection pipe 1506 connects the main discharge-fill pipe 1501 to the second segment 1031-2 of the main outlet pipe 1031 for both the upper deck and the lower deck. The fill interconnection pipe 1506 includes a fill interconnection valve 1507 for controlling fluid communication between the main discharge-fill pipe 1501 and the second segment 1031-2 of the main outlet pipe 1031. In the exemplary cooling system 100, the fill interconnection pipe 1506 includes two fill interconnection valves 1507 because the fill interconnection pipe 1506 connects the main discharge-fill pipe 1501 to the second segment 1031-2 of the main outlet pipe 1031 for both the upper deck and the lower deck.

[0063] When the cooling system 100 is in normal operation, the discharge interconnection valve(s) 1505 are closed to disconnect the fluid connection between the main discharge-fill pipe 1501 and the main outlet pipe 1031. The fill interconnection valve(s) 1507 are also closed to disconnect the fluid connection between the main discharge-fill pipe 1501 and the main outlet pipe 1031. When one or more cooling tanks 101 need to be serviced, the one or more discharge-fill valves 1503 connected to the one or more cooling tanks 101 to be serviced are opened to fluidly connect the one or more cooling tanks 101 to the discharge-fill system 120, and in particular to the corresponding one or more branch discharge-fill pipes 1502. The discharge interconnection valve(s) 1505 are also opened. Additionally, the corresponding balancing valve(s) 1023, outlet isolation valve(s) 1033, and connection isolation valve(s) 1061 are closed to isolate the one or more cooling tanks 101. In this manner, the liquid coolant in the cooling tank 101 is discharged into the main outlet pipe 1031, and in particular into the first segment 1031-1 of the main outlet pipe 1031. In particular, the liquid coolant flows out of one or more cooling tanks 101 via one or more corresponding branch discharge-fill pipes 1502 and into one or more of the fifth segment 1501-5, sixth segment 1501-6, seventh segment 1501-7, and eighth segment 1501-8 of the main discharge-fill pipe 1501, depending on where the one or more cooling tanks 101 to be served are located. The liquid coolant then flows through the third segment 1501-3 and / or the fourth segment 1501-4 of the main discharge-fill pipe 1501. The liquid coolant then flows through the second segment 1501-2 of the main discharge-fill pipe 1501 and the discharge interconnection pipe 1504. The liquid coolant is then discharged into the first segment 1031-1 of the main outlet pipe 1031. The liquid coolant is then discharged into the coolant pump 105 via the pump inlet 1051 of the coolant pump 105 and released into the heat exchanger 104 via the pump outlet 1052 of the coolant pump 105.The liquid coolant is then distributed to other cooling tanks 101 within the cooling system 100. Because this approach is used to drain the few cooling tanks 101 to be serviced, the liquid coolant in the few cooling tanks 101 does not substantially raise the level of liquid coolant in the other cooling tanks 101. After the liquid coolant has been drained from one or more cooling tanks 101, the drain interconnect valve(s) 1505 are closed, and one or more drain-fill valves 1503 are also closed. This prevents the coolant pump 105 from drawing air into the cooling system 100 during service, since the coolant pump 105 does not stop operating during service. Service can then be performed by a technician.

[0064] After servicing is completed, the fill interconnection valve(s) 1507 are opened to fluidly connect the main discharge-fill pipe 1501 to the main outlet pipe 1031, and one or more drain-fill valves 1503 are opened to fluidly connect the one or more cooling tanks 101 to the drain-fill system 120. In this manner, the liquid coolant in the main outlet pipe 1031 is filled into the one or more cooling tanks 101 that have been serviced. In particular, the liquid coolant flows out of the second segment 1301-2 of the main outlet pipe 1301, which fluidly connects to the pump outlet 1052 of the coolant pump 105, and through the fill interconnection pipe 1506. The liquid coolant then flows through the first segment 1501-1 and the second segment 1501-2 of the main discharge-fill pipe 1501. The liquid coolant then flows through the third segment 1501-3 and / or the fourth segment 1501-4 of the main discharge-fill pipe 1501, depending on where the one or more cooling tanks 101 are located. The liquid coolant then flows through one or more of the fifth segment 1501-5, sixth segment 1501-6, seventh segment 1501-7, and eighth segment 1501-8 of the main discharge-fill pipe 1501. The liquid coolant then fills into the one or more cooling tanks 101 via the corresponding one or more branch discharge-fill pipes 1502. After the liquid coolant has filled back into the one or more cooling tanks 101, the corresponding one or more drain-fill valves 1503 are closed to disconnect the fluid connection between the cooling tanks 101 and the drain-fill system 120, and the fill interconnection valve(s) 1507 are also closed to disconnect the fluid connection between the main discharge-fill pipe 1501 and the main outlet pipe 1031. Also, the corresponding closed balancing valve(s) 1023, outlet isolation valve(s) 1033, and connection isolation valve(s) 1061 are opened. In this manner, the cooling system 100 returns to normal operation.This approach is used to fill a small number of serviced cooling tanks 101 with liquid coolant in the main outlet pipe 1031 so that the liquid coolant filled in a small number of cooling tanks 101 does not substantially reduce the level of liquid coolant in the other cooling tanks 101.

[0065] Due to the exhaust interconnection pipe 1504 and the fill interconnection pipe 1506, the coolant pump(s) 105 do not need to be stopped or restarted. As a result, operation of the entire or partial cooling system 100 is not interrupted.

[0066] In the cooling system 100, the heat exchanger 104 can dissipate the heat in the liquid coolant in different ways. Examples are described below without excluding other embodiments.

[0067] 1A and 2, the cooling system 100 further includes a water supply pipe 107 that is fluidly connected to the heat exchanger 104 to supply water (e.g., cold water, as shown in FIG. 2) into the heat exchanger 104 for the heat exchanger 104 to dissipate heat into the water. The cooling system 100 also includes a water discharge pipe 108 that is fluidly connected to the heat exchanger 104 to discharge water having heat (i.e., hot water, as shown in FIG. 2) from the heat exchanger 104.

[0068] The cooling system 100 further includes a cooling tower 109. FIG. 4 illustrates an example of a cooling tower 109 according to the present disclosure. The cooling tower 109 is fluidly connected to the water supply pipe 107 and the water discharge pipe 108. The cooling tower 109 is configured to supply water into the water supply pipe 107, which then supplies the water to the heat exchanger 104 to dissipate heat from the liquid coolant and reduce the temperature of the liquid coolant. As a result, the water heats up and becomes hot water. The cooling tower 109 is also configured to receive hot water (i.e., hot water) from the water discharge pipe 108 and dissipate heat from the water to cool the water before supplying it back into the water supply pipe 107 and then into the heat exchanger 104. As a result, the temperature of the hot water decreases in the cooling tower 109, and the hot water becomes cold water. The cold water is then supplied back to the water supply pipe 107 and then to the heat exchanger 104.

[0069] 4, the cooling system 100 further includes one or more water pumps 110. The water pumps 110 are fluidly connected to the cooling tower 109 and the water supply pipes 107 to facilitate circulation of water through the water supply pipes 107, the water discharge pipes 108, the cooling tower 109, and the heat exchanger 104.

[0070] The cooling tower 109 may be an evaporative cooling tower for rejecting heat from the water to the atmosphere. The cooling tower 109 may also include a temperature control mechanism (not shown in FIG. 4) for setting the temperature of the water supplied to the water supply pipe 107.

[0071] The heat exchanger 104 can exchange heat with the cooling tower 109 in different ways, and examples of heat exchanger 104 are given below without excluding other embodiments.

[0072] The heat exchanger 104 includes a set of coolant channels fluidly connected to the main outlet pipe 1031 to receive liquid coolant carrying heat absorbed from the computing device from the main outlet pipe 1031. The set of coolant channels is also fluidly connected to the main inlet pipe 1021 to supply liquid coolant into the main inlet pipe 1021 after heat has been dissipated. The heat exchanger 104 further includes a set of water channels fluidly connected to the water supply pipe 107 and the water discharge pipe 108. The set of water channels is fluidly isolated from the set of coolant channels but is configured to be thermally coupled to the set of coolant channels so that heat can be dissipated from the liquid coolant to the water. In this way, the liquid coolant does not mix with the water, but heat within the liquid coolant can be dissipated from the liquid coolant to the water.

[0073] In particular, heat-carrying liquid coolant flows into the set of coolant channels of the heat exchanger 104 via the main outlet pipe 1031, and water flows into the set of water channels via the water supply pipe 107 of the heat exchanger 104. The set of coolant channels is positioned near the set of water channels to maintain fluid isolation and heat transfer. If the heat exchanger 104 is made of a thermally conductive material, such as copper, stainless steel, etc., the heat in the liquid coolant is released to the water, for example, due to the thermal conductivity of the material of the heat exchanger 104. The heat-bearing water flows back out of the set of water channels to the cooling tower 109 via the water discharge pipe 108. The heat is then released from the water to the atmosphere in the cooling tower 109. After the heat is dissipated to the water in the heat exchanger 104, the liquid coolant in the heat exchanger 104 is returned to the main inlet pipe 1021 and then supplied to the multiple cooling tanks 101 to cool the computing devices therein.

[0074] Examples of cooling tank 101 are illustrated in Figures 5-8. Figure 5 illustrates a perspective view of cooling tank 101 in accordance with the present disclosure. Figure 6 illustrates a top view of cooling tank 101 in accordance with the present disclosure. Figure 7 illustrates a front view of cooling tank 101 in accordance with the present disclosure. Figure 8 illustrates a left side view of cooling tank 101 in accordance with the present disclosure.

[0075] The cooling tank 101 includes a container 500. The container 500 forms a working space 501 for containing a liquid coolant. The container 500 includes a coolant inlet 502, a coolant outlet 503, a first connecting member 504, and a second connecting member 505. The coolant inlet 502 is configured to fluidly connect to one of the set of inlet pipes 102, in particular one of the branch inlet pipes 1022, to supply liquid coolant to the cooling tank 101. The coolant outlet 503 is configured to fluidly connect to one of the set of outlet pipes 103, in particular one of the branch outlet pipes 1032, to discharge liquid coolant that carries heat out of the cooling tank 101. The first connecting member 504 is configured to fluidly connect to a first connecting pipe (not shown in Figures 5-8) of the set of connecting pipes 106, and the second connecting member 505 is configured to fluidly connect to a second connecting pipe of the set of connecting pipes 106. The first connecting pipe fluidly connects the cooling tank 101 to an adjacent cooling tank 101 (as shown in Figure 3), and the second connecting pipe fluidly connects the cooling tank 101 to another adjacent cooling tank 101 (as shown in Figure 3).

[0076] The cooling tank 101 further includes a separation panel 506 extending within the workspace 501 of the container 500. The separation panel 506 is configured to separate the workspace 501 into a cooling space 5011 and a return space 5012. As shown in FIGS. 5 and 6 , the cooling space 5011 is fluidly coupled to the coolant inlet 502, and a computing device 520 (shown in FIGS. 6-8 ) is disposed within the cooling space 5011 during operation. The return space 5012 is fluidly coupled to the coolant outlet 503, the first connecting member 504, and the second connecting member 505. The separation panel 506 is configured to allow liquid coolant within the cooling space 5011 to flow into the return space 5012 due to the supply of liquid coolant into the cooling space 5011 via the coolant inlet 502. The coolant outlet 503 is further configured to discharge the liquid coolant, carrying heat absorbed from the computing device, out of the return space 5012.

[0077] The manner in which the liquid coolant flows within the cooling tank 101 is described with reference to FIGS. 7 and 8, and in particular the arrows in FIGS.

[0078] In the initialization phase, liquid coolant, i.e., cold coolant, is supplied into the cooling space 5011 via the coolant inlet 502. The cold coolant accumulates in the cooling space 5011, and the computing devices 520 in the cooling space 5011 are immersed in the cold coolant. Due to the amount of cold coolant supplied into the cooling space 5011 via the coolant inlet 502, the cold coolant in the cooling space 5011 flows over the separation panel 506. The cold coolant flows into the return space 5012 and fills the return space 5012 of each cooling tank 101.

[0079] Once the initialization of the cooling system 100 is complete and the computing device 520 begins to operate, the cold coolant around the computing device 520 heats up during the operation of the computing device 520, and the heat-carrying liquid coolant, i.e., the warm coolant, moves to the top of the cooling space 5011 due to convection.

[0080] Due to the increased cold coolant supplied into the cooling space 5011 via the coolant inlet 502, the warm coolant in the cooling space 5011 flows over the separation panel 506 and into the return space 5012. The warm coolant remains at the top of the return space 2012 due to its low density, and the cold coolant flowing into the return space 2012 during the initialization phase remains at the bottom of the return space 2012 due to its high density. The coolant outlet 503 is slightly lower than the separation panel 506 to discharge the warm coolant, i.e., the heat-carrying liquid coolant, out of the return space 5012.

[0081] 5 and 6, the container 500 of the cooling tank 101 includes a bottom panel 510 having a first edge 5101, a second edge 5102 adjacent to the first edge 5101, a third edge 5103 adjacent to the second edge 5102 and opposite the first edge 5101, and a fourth edge 5104 connecting the third edge 5103 to the first edge 5101. The container 500 further includes a first side wall 530 extending from the first edge 5101, a second side wall 540 extending from the second edge 5102, a third side wall 550 extending from the third edge 5103, and a fourth side wall 560 extending from the fourth edge 5104. A bottom panel 510, a first side wall 530, a second side wall 540, a third side wall 550, and a fourth side wall 560 form a workspace 501. A coolant inlet 502, a coolant outlet 503, a first connecting member 504, and a second connecting member 505 are located on the bottom panel 510.

[0082] 5 and 8 , the separation panel 506 extends from the bottom panel 510 along the first side wall 530 and the third side wall 550 to separate the working space 501 into a cooling space 5012 and a return space 5012. Thus, the first side wall 530, the third side wall 550, the fourth side wall 560, the bottom panel 510, and the separation panel 506 form a cooling space 5011 in which the computing device 520 is disposed. The first side wall 530, the second side wall 540, the third side wall 550, the bottom panel 510, and the separation panel 506 form a return space 5012.

[0083] 7 and 8, the separation panel 506 has a first height that allows the cooling space 5011 to be in fluid communication with the return space 5012 above the separation panel 506. The first height is less than the height of the side walls 530, 540, 550, 560 of the container 500. Thus, as shown by the arrows in FIGS. 7 and 8, the liquid coolant in the cooling space 5011 can flow over the separation panel 506 and into the return space 5012 due to the continued supply of liquid coolant into the cooling space 5011.

[0084] The coolant outlet 503 extends from the bottom panel 510 and has an upper opening 5031. The upper opening 5031 is slightly lower than the first height of the separation panel 506, such that the upper opening 5031 of the coolant outlet 503 is immersed in the liquid coolant carrying heat absorbed from the computing device, i.e., the warm coolant, because the warm coolant remains at the top of the return space 5012 due to its low density. The remaining liquid coolant, i.e., the cold coolant, in the return space 5012 remains below the warm coolant due to its high density. In the present disclosure, the warm coolant does not mix with the cold coolant below the warm coolant due to their different densities.

[0085] The coolant outlet 503 allows the warm coolant to flow out of the return space 5012. In other words, the coolant outlet 503 discharges the warm coolant out of the cooling tank 101, and the warm coolant then flows into a branch outlet pipe 1032 (not shown in FIGS. 5-8 ) that is fluidly connected to the coolant outlet 503.

[0086] The cooling tank 101 further includes a coolant distribution panel 507. Figures 9(a) and (b) illustrate an example of a coolant distribution panel 507 according to the present disclosure. Figure 9(b) is a partial view of Figure 9(a).

[0087] The coolant distribution panel 507 is a plate with a plurality of holes 5071. The coolant distribution panel 507 extends within the cooling space 5011 to cover the coolant inlet 502. As shown in FIGS. 7 and 8 , the coolant distribution panel 507 is positioned across the bottom panel 510 and is substantially parallel to the bottom panel 510. The coolant inlet 502 is located between the coolant distribution panel 507 and the bottom panel 510. The coolant distribution panel 507 divides the cooling space 5011 into a first portion between the coolant distribution panel 507 and the bottom panel 510 and into a second portion across the coolant distribution panel 507. Liquid coolant flows through the coolant inlet 502 into the first portion of the cooling space 5011 and then through the plurality of holes 5071 into the second portion of the cooling space 5011. The computing devices 520 are positioned over the coolant distribution panel 507 (particularly within the second portion of the cooling space 5011) to be immersed in liquid coolant flowing through the plurality of holes 5071. The plurality of holes 5071 are arranged to uniformly distribute the liquid coolant and regulate the pressure of the liquid coolant entering the cooling space 5011. Thus, by uniformly distributing the liquid coolant, the plurality of holes 5071 can avoid concentration of the liquid coolant flowing into the cooling space 5011 via the coolant inlets 502, and the impact of the liquid coolant on the computing devices 520 within the cooling space 5011 can be reduced. As an example, each of the plurality of holes has a diameter of 3 millimeters. In one embodiment, at least some of the plurality of holes 5071 of the coolant distribution panel 507 are configured to be aligned with at least one of the computing devices 520 to direct the liquid coolant to the computing devices 520.

[0088] 10A and 10B illustrate a cooling system 200 for cooling computing devices operating in a data center according to the present disclosure. The cooling system 200 includes more than one sub-cooling system, specifically a first sub-cooling system 210 and a second sub-cooling system 220, which is located adjacent to the first sub-cooling system 210. Each of the sub-cooling systems 210, 220 is the cooling system 100 described above.

[0089] The cooling system 200 further includes an inlet interconnection pipe 230 that fluidly connects the main inlet pipe 1021 of the first sub-cooling system 210 to the main inlet pipe 1021 of the second sub-cooling system 220 so as to allow liquid coolant to flow between the main inlet pipe 1021 of the first sub-cooling system 210 and the main inlet pipe 1021 of the second sub-cooling system 220.

[0090] The cooling system 100 (or 210, 220) as described above may include two decks, i.e., an upper deck and a lower deck in the exemplary cooling system 100 shown in Figures 1A to 1F, 10A and 10B, and the cooling system 200 may include two inlet interconnection pipes 230, one inlet interconnection pipe 230 fluidly connecting the main inlet pipe 1021 for the upper deck of the first sub-cooling system 210 to the main inlet pipe 1021 for the upper deck of the second sub-cooling system 220, and the other inlet interconnection pipe 230 fluidly connecting the main inlet pipe 1021 for the lower deck of the first sub-cooling system 210 to the main inlet pipe 1021 for the lower deck of the second sub-cooling system 220.

[0091] Without departing from the scope of the present disclosure, the cooling system 100 (or 210, 220) may include more decks, which means that the cooling system 200 may include more inlet interconnection pipes 230 for fluidly connecting the main inlet pipes 1021 to the corresponding decks of the sub-cooling systems 210, 220.

[0092] The cooling system 200 further includes an outlet interconnection pipe 240 that fluidly connects the main outlet pipe 1031 of the first sub-cooling system 210 with the main outlet pipe 1031 of the second sub-cooling system 220 so as to allow heat-carrying liquid coolant to flow between the main outlet pipe 1031 of the first sub-cooling system 210 and the main outlet pipe 1031 of the second sub-cooling system 220.

[0093] The cooling system 100 (or 210, 220) as described above may include two decks, i.e., an upper deck and a lower deck in the exemplary cooling system 100 shown in Figures 1A to 1F, 10A and 10B, and the cooling system 200 may include two outlet interconnecting pipes 240, one outlet interconnecting pipe 240 fluidly connecting the main outlet pipe 1031 for the upper deck of the first sub-cooling system 210 to the main outlet pipe 1031 for the upper deck of the second sub-cooling system 220, and the other outlet interconnecting pipe 240 fluidly connecting the main outlet pipe 1031 for the lower deck of the first sub-cooling system 210 to the main outlet pipe 1031 for the lower deck of the second sub-cooling system 220.

[0094] Without departing from the scope of the present disclosure, the cooling system 100 (or 210, 220) may include more decks, which means that the cooling system 200 may include more outlet interconnecting pipes 240 for fluidly connecting the main outlet pipe 1031 to the corresponding decks of the sub-cooling systems 210, 220.

[0095] In this way, if the coolant pump 105 or heat exchanger 104 of one of the first sub-cooling system 210 and the second sub-cooling system 220 becomes inoperative, for example, due to a failure (as a result of a fault detection process), planned maintenance, a testing regime, etc., which may stop the circulation or heat exchange of liquid coolant within the sub-cooling system 210 or 220, the coolant pump 105 and heat exchanger 104 of the other of the first sub-cooling system 210 and the second sub-cooling system 220 can be used to facilitate the circulation or heat exchange of liquid coolant within the sub-cooling system.

[0096] The inlet interconnection pipe 230 includes an inlet interconnection valve 2301 that controls the rate at which liquid coolant flows between the main inlet pipe 1021 of the first sub-cooling system 210 and the main inlet pipe 1021 of the second sub-cooling system 220 .

[0097] The outlet interconnection pipe 240 includes an outlet interconnection valve 2401 for controlling the rate at which heat-carrying liquid coolant flows between the main outlet pipe 1031 of the first sub-cooling system 210 and the main outlet pipe 1301 of the second sub-cooling system 220.

[0098] As an example, when the cooling system 200 is in normal operation, the inlet interconnection valve(s) 2301 and the outlet interconnection valve(s) 2401 are all closed to disconnect the fluid connection between the first sub-cooling system 210 and the second sub-cooling system 220. If the coolant pump 105 or the heat exchanger 104 of the first sub-cooling system 210 stops operating due to a different reason, the inlet interconnection valve(s) 2301 and the outlet interconnection valve(s) 2401 are opened to provide fluid connection between the first sub-cooling system 210 and the second sub-cooling system 220. In this manner, the circulation of liquid coolant within the first sub-cooling system 210 is facilitated by the coolant pump 105 and the heat exchanger 104 of the second sub-cooling system 220.

[0099] As another example, where the sub-cooling systems 210, 220 include more than one deck, e.g., an upper deck and a lower deck, if the coolant pump 105 or the heat exchanger 104 for the upper deck of the first sub-cooling system 210 stops operating due to a different reason, the inlet interconnection valve(s) 2301 and the outlet interconnection valve(s) 2401 for the upper deck are opened to provide fluid communication between the upper deck of the first sub-cooling system 210 and the upper deck of the second sub-cooling system 220. In this way, circulation of liquid coolant on the upper deck of the first sub-cooling system 210 is facilitated by the coolant pump 105 and the heat exchanger 104 for the upper deck of the second sub-cooling system 220.

[0100] As another example where the sub-cooling systems 210, 220 include more decks, if the coolant pump 105 or heat exchanger 104 for a particular deck of the first sub-cooling system 210 stops operating due to a different reason, the inlet interconnection valve(s) 2301 and the outlet interconnection valve(s) 2401 for the particular deck are opened to provide fluid communication between the particular deck of the first sub-cooling system 210 and the corresponding deck of the second sub-cooling system 220. In this way, the circulation of liquid coolant on this particular deck of the first sub-cooling system 210 is facilitated by the coolant pump 105 and the heat exchanger 104 for the corresponding deck of the second sub-cooling system 220.

[0101] Various modifications to these embodiments will be apparent to those skilled in the art from the description and accompanying drawings. The principles associated with the various embodiments described herein may be applied to other embodiments. Thus, the description is not intended to be limited to the embodiments shown in conjunction with the accompanying drawings, but is intended to be accorded the widest scope consistent with the principles and novel and inventive features disclosed or proposed herein. Accordingly, the present disclosure is expected to embrace all other such adaptations, modifications, and variations that fall within the scope of this disclosure and the appended claims.

[0102] In the claims following the invention, and in the foregoing description of the invention, unless otherwise interpreted by the context due to clear language or necessary implication, the word "comprise" or variations such as "comprises" or "comprising" are used in an inclusive sense, i.e., used to specify the presence of stated features but do not exclude the presence or addition of further features in various embodiments of the invention.

[0103] As used herein, any one of the terms "including" or "which includes" or "that includes" is also an open-ended term meaning to include at least the elements / features that follow the term below, but do not exclude others. Thus, "including" is synonymous with "comprising."

[0104] CROSS-REFERENCE TO RELATED APPLICATIONS The entirety of the priority application to this patent application, Australian Provisional Patent Application No. 2021901373, filed on May 7, 2021, is incorporated herein by reference.

Claims

1. 1. A cooling system for cooling computing devices operating in a data center, comprising: a plurality of cooling tanks, each configured to contain a liquid coolant and sized to submerge the computing device in the liquid coolant so that the liquid coolant absorbs heat generated by the computing device and cools the computing device; a set of connecting pipes configured to fluidly connect the plurality of cooling tanks so as to maintain the liquid coolant in each of the plurality of cooling tanks at substantially the same level; a set of inlet pipes fluidly connected to the plurality of cooling tanks to supply the liquid coolant into the plurality of cooling tanks; and a set of outlet pipes fluidly connected to the plurality of cooling tanks to discharge the liquid coolant carrying the heat absorbed from the computing device out of the plurality of cooling tanks; and a heat exchanger fluidly connected to each of the set of inlet pipes to supply the liquid coolant into the set of inlet pipes and fluidly connected to each of the set of outlet pipes to receive the liquid coolant carrying the heat absorbed from the computing device from the set of outlet pipes, the heat exchanger configured to dissipate the heat from the liquid coolant carrying the heat; a coolant pump fluidly connected to each of the sets of outlet pipes, the coolant pump configured to facilitate circulation of the liquid coolant through the plurality of cooling tanks, the set of inlet pipes, the set of outlet pipes, and the heat exchanger; The cooling system.

2. 2. The cooling system of claim 1, wherein the set of inlet pipes includes a main inlet pipe and a plurality of branch inlet pipes extending from and fluidly connecting to the main inlet pipe, the main inlet pipe fluidly connecting to the heat exchanger, and each of the plurality of branch inlet pipes fluidly connecting to one of the plurality of cooling tanks.

3. 3. The cooling system of claim 2, wherein the set of outlet pipes includes a main outlet pipe and a plurality of branch outlet pipes extending from and fluidly connecting to the main outlet pipe, the main outlet pipe fluidly connecting to the heat exchanger via the coolant pump, and each of the plurality of branch outlet pipes fluidly connecting to one of the plurality of cooling tanks.

4. The cooling system of claim 3 , wherein each of the connecting pipes includes a connection isolation valve for controlling fluid communication between two adjacent cooling tanks.

5. 5. The cooling system of claim 3, wherein each of the plurality of branch inlet pipes includes a balancing valve for controlling a rate at which the liquid coolant flows into the cooling tank to which the branch inlet pipe is fluidly connected.

6. 6. The cooling system of claim 3, wherein each of a plurality of branch outlet pipes includes an outlet isolation valve for stopping the heat-carrying liquid coolant from flowing out of the cooling tank to which the branch outlet pipe is fluidly connected.

7. The system further comprises a drain and fill system, a discharge and filling pump; a coolant reservoir; a set of discharge and fill pipes including a main discharge and fill pipe and a plurality of branch discharge and fill pipes extending from the main discharge and fill pipe and fluidly connected to one of the cooling tanks; the main discharge / fill pipe is fluidly connected to the discharge / fill pump, and the discharge / fill pump is fluidly connected to the coolant reservoir; The cooling system according to any one of claims 3 to 6.

8. The cooling system of claim 7 , wherein each of the branch discharge and fill pipes includes a discharge and fill valve.

9. The set of discharge and filling pipes is a discharge interconnection pipe fluidly connecting the main discharge / fill pipe to the main outlet pipe, the discharge interconnection pipe including a discharge interconnection valve for controlling fluid communication between the main discharge / fill pipe and the main outlet pipe; a fill interconnection pipe fluidly connecting the main discharge-fill pipe to the main outlet pipe, the fill interconnection pipe including a fill interconnection valve for controlling fluid communication between the main discharge-fill pipe and the main outlet pipe; As a result, the liquid coolant can be discharged from one or more of the plurality of cooling tanks into the main outlet pipe, and the liquid coolant can be filled into the one or more of the plurality of cooling tanks from the main outlet pipe.

9. The cooling system according to claim 7 or 8.

10. a water supply pipe fluidly connected to the heat exchanger to supply the water into the heat exchanger for the heat exchanger to dissipate the heat into the water; a water discharge pipe fluidly connected to the heat exchanger to discharge the water having the heat from the heat exchanger; a cooling tower fluidly connected to the water supply pipe and the water discharge pipe, the cooling tower configured to supply the water into the water supply pipe, receive the water having heat from the water discharge pipe, and release the heat from the water to cool the water before supplying the water into the water supply pipe; a water pump fluidly connected to the cooling tower and the water supply pipe to facilitate circulation of the water within the water supply pipe, the water discharge pipe, the cooling tower, and the heat exchanger; The cooling system of claim 9 further comprising:

11. The heat exchanger comprises: a set of coolant channels fluidly connected to the main outlet pipe to receive the liquid coolant carrying the heat absorbed from the computing device from the main outlet pipe, and fluidly connected to the main inlet pipe to supply the liquid coolant into the main inlet pipe; a set of water channels fluidly connected to the water supply pipe and the water discharge pipe, the set of water channels configured to be fluidly isolated from but thermally coupled to the set of coolant channels so that the heat is dissipated from the liquid coolant to the water; The cooling system of claim 10, comprising:

12. 12. The cooling system of claim 11, wherein the cooling tower includes a temperature control mechanism for setting the temperature of the water supplied to the water supply pipe.

13. The cooling system of any one of claims 10 to 12, wherein the cooling tower comprises an evaporative cooling tower.

14. Each of the plurality of cooling tanks a container forming a working space to contain the liquid coolant, the container including a coolant inlet, a coolant outlet, a first connecting member, and a second connecting member, the coolant inlet configured to fluidly connect to one of the sets of inlet pipes, the coolant outlet configured to fluidly connect to one of the sets of outlet pipes, the first connecting member configured to fluidly connect to a first connecting pipe of the set of connecting pipes, and the second connecting member configured to fluidly connect to a second connecting pipe of the set of connecting pipes; a separation panel extending within the working space of the container to separate the working space into a cooling space and a return space, the cooling space being fluidly coupled to the coolant inlet and the return space being fluidly coupled to the coolant outlet, the first connecting member, and the second connecting member, the separation panel configured to cause the liquid coolant in the cooling space to flow into the return space due to supply of the liquid coolant into the cooling space through the coolant inlet, the coolant outlet further configured to discharge the liquid coolant carrying the heat absorbed from the computing device out of the return space; The cooling system of claim 13 , comprising:

15. The container of each of the plurality of cooling tanks comprises: a bottom panel having a first edge, a second edge adjacent to the first edge, a third edge adjacent to the second edge and opposite the first edge, and a fourth edge connecting the third edge to the first edge; a first sidewall extending from the first edge; a second sidewall extending from the second edge; a third sidewall extending from the third edge; a fourth sidewall extending from the fourth edge; the bottom panel, the first sidewall, the second sidewall, the third sidewall, and the fourth sidewall form the workspace. The cooling system of claim 14.

16. The cooling system of claim 15 , wherein the coolant inlet, the coolant outlet, the first connecting member, and the second connecting member are located on the bottom panel.

17. 17. The cooling system of claim 16, wherein the separation panel extends from the bottom panel along the first side wall and the third side wall to separate the working space into the cooling space and the return space, such that the first side wall, the third side wall, the fourth side wall, the bottom panel, and the separation panel form the cooling space, and the first side wall, the second side wall, the third side wall, the bottom panel, and the separation panel form the return space.

18. 18. The cooling system of claim 17, wherein the separation panel has a first height that enables the cooling space to be in fluid communication with the return space above the separation panel such that the liquid coolant in the cooling space can flow into the return space.

19. 20. The cooling system of claim 18, wherein the coolant outlet extends from the bottom panel and has an upper opening that is lower than the first height of the separation panel such that the upper opening of the coolant outlet is immersed in the liquid coolant that carries the heat absorbed from the computing device and allows the liquid coolant that carries the heat to flow out of the return space.

20. 20. The cooling system of claim 15, wherein each of the plurality of cooling tanks further comprises a coolant distribution panel including a plurality of holes and extending within the cooling space to cover the coolant inlet to uniformly distribute the liquid coolant and regulate the pressure of the liquid coolant entering the cooling space.

21. The cooling system of claim 20 , wherein at least some of the plurality of holes in the coolant distribution panel are configured to be aligned with at least one of the computing devices.

22. The cooling system of any one of claims 20 to 21, wherein the diameter of the plurality of holes is 3 millimeters.

23. 1. A cooling system for cooling computing devices operating in a data center, comprising: A first sub-cooling system according to any one of claims 3 to 22; A second sub-cooling system according to any one of claims 3 to 22; an inlet interconnection pipe fluidly connecting the main inlet pipe of the first sub-cooling system with the main inlet pipe of the second sub-cooling system so as to allow liquid coolant to flow between the main inlet pipe of the first sub-cooling system and the main inlet pipe of the second sub-cooling system; an outlet interconnection pipe fluidly connecting the main outlet pipe of the first sub-cooling system with the main outlet pipe of the second sub-cooling system so as to allow the heat-carrying liquid coolant to flow between the main outlet pipe of the first sub-cooling system and the main outlet pipe of the second sub-cooling system; The cooling system.

24. 24. The cooling system of claim 23, wherein the inlet interconnection pipe includes an inlet interconnection valve that controls the rate at which the liquid coolant flows between the main inlet pipe of the first sub-cooling system and the main inlet pipe of the second sub-cooling system.

25. 25. The cooling system of claim 24, wherein the outlet interconnection pipe includes an outlet interconnection valve that controls the rate at which the heat-carrying liquid coolant flows between the main outlet pipe of the first sub-cooling system and the main outlet pipe of the second sub-cooling system.

26. 1. A cooling tank for cooling computing devices operating in a data center, comprising: a container forming a working space for containing a liquid coolant, the container including a coolant inlet, a coolant outlet, a first connecting member, and a second connecting member, the coolant inlet configured to fluidly connect to one of a set of inlet pipes, the coolant outlet configured to fluidly connect to one of a set of outlet pipes, the first connecting member configured to fluidly connect to a first connecting pipe of a set of connecting pipes, and the second connecting member configured to fluidly connect to a second connecting pipe of the set of connecting pipes; a separation panel extending within the working space of the container to separate the working space into a cooling space and a return space, the cooling space being fluidly coupled to the coolant inlet and the return space being fluidly coupled to the coolant outlet, the first connecting member, and the second connecting member, the separation panel configured to cause the liquid coolant in the cooling space to flow into the return space due to supply of the liquid coolant into the cooling space through the coolant inlet, the coolant outlet further configured to discharge the liquid coolant carrying heat absorbed from the computing device flowing out of the return space; The cooling tank.

27. The container comprises: a bottom panel having a first edge, a second edge adjacent to the first edge, a third edge adjacent to the second edge and opposite the first edge, and a fourth edge connecting the third edge to the first edge; a first sidewall extending from the first edge; a second sidewall extending from the second edge; a third sidewall extending from the third edge; a fourth sidewall extending from the fourth edge; the bottom panel, the first sidewall, the second sidewall, the third sidewall, and the fourth sidewall form the workspace.

27. The cooling tank of claim 26.

28. 28. The cooling tank of claim 27, wherein the coolant inlet, the coolant outlet, the first connecting member, and the second connecting member are located on the bottom panel.

29. 29. The cooling tank of claim 28, wherein the separation panel extends from the bottom panel along the first side wall and the third side wall to separate the working space into the cooling space and the return space, such that the first side wall, the third side wall, the fourth side wall, the bottom panel, and the separation panel form the cooling space, and the first side wall, the second side wall, the third side wall, the bottom panel, and the separation panel form the return space.

30. 30. The cooling tank of claim 29, wherein the separation panel has a first height that allows the cooling space to be in fluid communication with the return space above the separation panel such that the liquid coolant in the cooling space can flow into the return space.

31. 31. The cooling tank of claim 30, wherein the coolant outlet extends from the bottom panel and has an upper opening that is lower than the first height of the separation panel such that the upper opening of the coolant outlet is immersed in the liquid coolant that carries the heat absorbed from the computing device, allowing the liquid coolant that carries the heat to flow out of the return space.

32. 32. The cooling tank of claim 26, further comprising a coolant distribution panel including a plurality of holes and extending within the cooling space to cover the coolant inlet and regulate the pressure of the liquid coolant entering the cooling space.

33. 33. The cooling tank of claim 32, wherein at least some of the plurality of holes in the coolant distribution panel are configured to be aligned with at least one of the computing devices.

34. A cooling tank according to any one of claims 32 to 33, wherein the diameter of the plurality of holes is 3 millimeters.

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