RFID devices

Abstract

To provide a transaction card including an electronic component, and method for manufacturing the transaction card.SOLUTION: A process for manufacturing transaction cards includes the steps of: forming an opening in a card body of a transaction card; inserting an electronic component into the opening; and disposing a non-conductive material around the electronic component. The transaction card includes a molded electronic component.SELECTED DRAWING: Figure 6A-6C

Description

[Technical Field]

[0001] This application is a continuation-in-part (CIP) of U.S. Patent Application No. 16 / 320,597, filed January 25, 2019 (Status: Pending), which is a national stage application of PCT Application No. PCT / US2017 / 43954, filed July 26, 2017, which claims priority to U.S. Provisional Patent Application No. 62 / 367,362, filed July 26, 2016, all of which are entitled "OVERMOLDED ELECTRONIC COMPONENTS FOR TRANSACTION CARDS AND METHODS OF MAKING THEREOF." This application is also a continuation-in-part (CIP) of U.S. Patent Application No. 16 / 164,322 (Status: Pending), filed October 18, 2018, entitled "OVERMOLDED ELECTRONIC COMPONENTS FOR TRANSACTION CARDS AND METHODS OF MAKING THEREOF," which is itself a continuation-in-part (CIP) of PCT Patent Application No. PCT / US2017 / 43954. All of the above-referenced patent documents are incorporated herein by reference in their entirety for all purposes.

[0002] TECHNICAL FIELD This application relates to transaction cards having electronic components and methods of manufacturing the same. [Background technology]

[0003] Metal transaction cards present unique challenges when they contain electronic components such as inductively coupled IC chips, RF electronic circuits, and standalone electronic inlays. To accommodate these components, the metal is machined into various shapes, and the components are then placed within the cavities and either left exposed or concealed beneath a printed sheet of plastic or other decorative element. The decorative element can be affixed to the card through various processes, such as platen lamination, contact adhesive, curable adhesive, or "press fit," or any bonding method known in the art. Often, RF shielding is required within the cavities, further complicating the card assembly while maintaining the card's desirable aesthetics.

[0004] Some of these required machining shapes remove large amounts of metal or leave slits or holes through the card, which weaken its strength and are aesthetically undesirable. To strengthen the card and provide a desirable surface, overmolding and insert molding techniques have been developed to encapsulate electronic inlays within the card and to strengthen the card shape. Furthermore, this development also improves RF performance compared to existing designs because it allows for the removal of relatively more metal in the critical RF transmit and receive areas while maintaining structural rigidity and a desirable appearance. Summary of the Invention

[0005] Aspects of the present invention relate to transaction cards, processes for manufacturing transaction cards, as well as transaction cards manufactured according to the disclosed methods.

[0006] According to one aspect, the present invention provides a process for manufacturing a transaction card and the transaction card manufactured thereby, the process including forming an opening in a transaction card body to receive an electronic component, inserting the electronic component into the opening, and molding a molding compound around the electronic component.

[0007] In yet another aspect, the present invention relates to an RDID device having a metal frame, an opening in the metal frame, and an RFID inlay disposed inside the opening. The RFID inlay includes a substrate, an RFID transponder chip attached to the substrate, and an inductively coupled antenna in the substrate connected to the RFID transponder chip. At least one filler layer can be disposed within the frame opening between the chip layer and one of the surfaces of the metal frame, and at least one layer can be laminated on at least one surface of the metal frame.

[0008] It is to be understood that both the foregoing general description and the following detailed description are intended to be illustrative, but not restrictive, of the invention.

[0009] The present invention can be more fully understood from the following detailed description when taken in conjunction with the accompanying drawings, in which like elements bear the same reference numerals. When there are several like elements, a single reference numeral may be assigned to multiple like elements, with lower case letters referring to the specific element. Lower case letters may be omitted when referring to elements collectively or to one or more of the elements but not specifically. This emphasizes that, according to common practice, the various features of the drawings are not drawn to scale unless otherwise noted. Conversely, the dimensions of the various features may be expanded or reduced for clarity. The drawings include the following figures: [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 2 is a flow diagram of selected steps of a process for manufacturing a transaction card according to an aspect of the present invention. [Figure 2A-2B] FIG. 2A is a photograph depicting an electronic component before overmolding in accordance with an embodiment of the present invention, and FIG. 2B is a photograph depicting an electronic component after overmolding in accordance with an embodiment of the present invention. [Figures 3A-3D] FIG. 3A is a schematic view of the front of a transaction card before insert molding according to an embodiment of the present invention; FIG. 3B is a schematic view of the back of a transaction card before insert molding according to an embodiment of the present invention; FIG. 3C is a schematic view of the front of a transaction card after insert molding according to an embodiment of the present invention; and FIG. 3D is a schematic view of the back of a transaction card after insert molding according to an embodiment of the present invention. [Figure 4A-4B] 1A-1D are schematic diagrams of selected steps of an overmolding process for manufacturing a transaction card according to an aspect of the present invention. [Figures 5A-5C] FIG. 5A is an image depicting the front side of an example card having an encapsulated antenna surrounding an IC chip, FIG. 5B is an image depicting the back side of the example card of FIG. 5A, and FIG. 5C is a perspective view of the isolated example encapsulated antenna prior to insertion of an IC chip therein. [Figures 6A-6C] 6A is a schematic plan view of an exemplary contactless RFID device according to one embodiment of the present invention before encapsulating the chip layer within an opening in a frame; FIG. 6B is a schematic view of the exemplary contactless RFID device of FIG. 6A in cross section through line 6B-6B after encapsulating the chip layer; and FIG. 6C is a schematic end view of the exemplary contactless RFID device of FIG. 6B. [Figure 7A-7C] 7A is a schematic plan view of an exemplary contactless RFID device according to another embodiment of the present invention before encapsulating the chip layer within an opening in a frame; FIG. 7B is a schematic view of the exemplary contactless RFID device of FIG. 7A in cross section through line 7B-7B after encapsulating the chip layer; and FIG. 7C is a schematic end view of the exemplary contactless RFID device of FIG. 7B. [Figures 8A-8C] 8A is a schematic plan view of an exemplary DI-RFID device according to another embodiment of the present invention before encapsulating the chip layer within an opening in a frame; FIG. 8B is a schematic view of the exemplary DI-RFID device of FIG. 8A in cross section through line 8B-8B after encapsulating the chip layer; and FIG. 8C is a schematic end view of the exemplary contactless RFID device of FIG. 8B. DETAILED DESCRIPTION OF THE INVENTION

[0011] Aspects of the present invention relate to transaction cards, processes for manufacturing transaction cards, as well as transaction cards manufactured according to the disclosed methods. The term "transaction" as used herein is intended to be very broad in scope, thereby including any type of information exchange between a card and a card reader. The term "transaction card" as used herein is not limited to standard credit card size and can encompass any form of device capable of being used to perform any type of transaction, including transaction types typically performed by credit cards, debit cards, ID cards, loyalty cards, transit cards, and the like. ID cards can include contactless proximity or transit wallets, as well as visual ID cards with a printed photograph of the identified bearer.

[0012] 1, a flow diagram depicting selected steps of a process 100 for manufacturing a transaction card according to an embodiment of the present invention is shown. It should be noted that in connection with the processes described herein, it will be understood from the description herein that one or more steps may be omitted and / or performed in a process sequence other than that described while still achieving desirable results.

[0013] In step 110, an opening is formed in the card body of the transaction card. The opening can be sized to accommodate one or more molded electronic components. The opening can extend partially through the card body (e.g., by forming a pocket, etc.) or completely through the card body (thereby forming a hole). In some embodiments, the hole formed through the card body can then be completely or partially covered on one side with an applied material, such as a plastic material bonded by adhesive, such as element 307c shown in FIG. 3D. As depicted in FIG. 3D, element 307c overlaps the area surrounding the hole to form a pocket bounded on the periphery by the edges of the hole in the card body and at the bottom end by applied material 307c. The applied material can be the same as or compatible with the molded material that is later filled into the pocket. In some embodiments, as shown in FIG. 3D, the applied material 307c overlapping the area surrounding the hole in the card body can have a through hole 308 with a smaller area than the hole in the card body to provide a "shelf" 309 of applied material inside the perimeter of the hole in the card body.

[0014] The card bodies of the present invention can be constructed from any suitable material, including any suitable metal such as stainless steel, bronze, copper, titanium, tungsten carbide, nickel, palladium, silver, gold, platinum, aluminum, or any alloy that contributes the majority of its body (structure) and weight to the card. Additionally or alternatively, the card bodies described herein can be constructed from any suitable polymeric (e.g., polycarbonate, polyester) or inorganic (e.g., glass, ceramic) material, or any combination of any of the foregoing materials.

[0015] In step 120, an electronic component is inserted into an opening in the card body.

[0016] The molding material is molded around the electronic component in step 130. Note that the order of steps 120 and 130 may vary depending on the particular application.

[0017] In one embodiment, step 130 includes an overmolding process in which molding material is molded around (and typically over) the electronic component such that the molding material covers at least a portion of the surface of the electronic component. Overmolding of the electronic component can be accomplished using conventional and commercially available equipment, such as an ENGLE insert (Engel Austria GmbH, Austria) and a Cavist MoldMan™ (Reno, NV).

[0018] Electronic component 201 is shown before ( FIG. 2A ) and after ( FIG. 2B ) overmolding. While overmolded component 200 is depicted as having molding material 205 completely covering electronic component 201, those skilled in the art will appreciate that varying degrees of overmolding may achieve desired structural rigidity, function, and transaction aesthetics. Specifically, as shown in FIGS. 2A and 2B , electronic contacts in the form of wires 210 and 220 connected to component 200 each have an unencapsulated end that protrudes from the overmolding to allow electrical connection to the component. While depicted as wires in FIGS. 2A and 2B , it should be understood that electronic contacts or other unencapsulated portions, not limited to electrical contacts, may have any shape or form. It should further be understood that in certain embodiments, such as those in which a technically desirable degree of bonding between unencapsulated and encapsulated components can be achieved through the encapsulation layer, the components may be fully encapsulated.

[0019] 1, if an overmolding process is utilized, step 130 can be performed before performing step 120. That is, the electronic component can be separately overmolded prior to insertion into the opening in the card body. Prior to insertion of the overmolded electronic component, the overmolded component can be further machined to remove excess molding material and / or to create features in the molding material that can be used to secure the overmolded component within the opening in the card body. For example, with reference to FIG. 2B, a lip can be machined into the molding material 205 so that the overmolded component 200 can be secured within the opening in the card body.

[0020] Alternatively, overmolding in step 130 can be performed after performing step 120. In this embodiment, the electronic component is inserted into the card body opening. The molding material is then forced into the card body opening and formed on one or more exposed surfaces, including at least the top surface, of the electronic component. Those skilled in the art will appreciate that the card body material can be selected to withstand the pressure and heat associated with overmolding without substantially deforming when the molding material flows into the card body opening.

[0021] If an insert molding process is utilized, step 130 may be performed before performing step 120. A conventional insert molding process involves inserting an electronic component into a mold, followed by injection of a molding material into the mold cavity to form a molded electronic component. The molded electronic component may be fully or partially encapsulated by molding material according to the insert molding process.

[0022] Referring to Figures 3A-3D, schematic diagrams of selected steps of an insert molding process for manufacturing a transaction card in accordance with an embodiment of the present invention are depicted. In these figures, areas 305 and 308 in Figures 3A-3D represent holes through the card. Areas 307a-b in Figure 3A and area 307c in Figures 3B-3D represent partially covered holes (pockets) in the card body through which molding material can capture and locate purchases. Figure 3B depicts a finished molded card with the insert-molded material of molded component 310 visible. While the insert-molded material is shown contrasting with the background card material for illustrative purposes, the molded component is not limited to any particular degree of color or shading contrast relative to the background card and may have the same material as the front of the card or a material selected to have a color or shading selected to match the color or shading of the front of the card to minimize its visibility in the finished card. For example, in a card body having a material different from the molding material (e.g., a metal or ceramic body and a thermoplastic molding material), the color of the molding material can be selected to have a color and tone that matches as closely as possible the material of the body, including using components in the molding material that are the same as or similar to the card body material (e.g., the inclusion of a powdered metal in the molding material that is the same as the body metal). In other embodiments, a molding material that contrasts with the card body can be used. FIG. 3A depicts the front side of a transaction card 300 including an opening 305 extending entirely through the card body 302. A plurality of fastening features 307a,b provide areas for the molding material to adhere or otherwise bond. In the depicted embodiment, the fastening features 307a,b are blind holes (e.g., pockets). A similar set of fastening features 307c is also found on the opposite back side of the transaction card 300 in FIG. 3B.The shapes of the opening 305 and the locking features 307a,b are selected to improve the RF performance of the metal transaction card 300. The locking features 307a,b,c can have a material that is the same as or otherwise compatible with the molding material and different from the card body material, such that the molding material and the locking feature material fuse together or are otherwise bonded with a bond that is relatively stronger than any bond created between the molding material and the card body.

[0023] 3C depicts the front side of the transaction card 300 after the insert-molded electronic component 310 has been placed within the opening 305. In the depicted embodiment, the molded electronic component 310 will be visible on the transaction card 300. The shape of the molded electronic component 310 allows it to remain secured to the transaction card 300 through the biasing action created by the securing features 307 a, b, c. Alternatively, or additionally, the molded electronic component 310 can be adhered to the opening 305 of the transaction card 300 using an epoxy resin such as bisphenol, novolac, aliphatic, and glycidyl amine.

[0024] Excess molding material can be removed (eg, by milling or machining) from molded electronic component 310 to incorporate additional electronic components or other desired components.

[0025] 4A depicts an exemplary overmolding process in which a pocket 403 is machined into a card body 402 to receive an electronic component 405. In the depicted embodiment, the electronic component 405 is a printed circuit board (PCB), specifically an RFID module. While the pocket 403 is depicted as traversing a large portion of the backside of the card body 402, one skilled in the art will appreciate that relatively small openings of various shapes may be appropriate depending on the electronic component to be housed.

[0026] Pocket 403 may be sized to receive and secure electronic component 405 in place, or it may be sized to allow excess molding material between the inner lip of pocket 403 and the outer edge of electronic component 405. Additionally or alternatively, electronic component 405 may be glued to pocket 403 using epoxy, as described above.

[0027] An over-molded faceplate 410 forms the back side of the transaction card 400. The over-molded faceplate 410 can fully or partially encapsulate the electronic components 405. The over-molded faceplate 410 can be prepared separately and then attached to the pocket 403 (e.g., using a suitable epoxy as described above), or it can be formed by over-molding a layer of molding material directly into the pocket 403.

[0028] In one exemplary embodiment, the molding material used in the over-molded faceplate is a plastic material that may improve RF transmission, where the transaction card 400 is constructed from metal or other RF interference material.

[0029] Also, as is known in the art, transaction cards having an RFID chip module for inductively coupling with a card reader at a point-of-sale (POS) terminal typically have an embedded booster antenna structure configured to inductively couple the embedded antenna to the RFID chip, with the combined antenna, RFID chip, and card reader creating a circuit for transmitting information from the card to the card reader. Thus, in an exemplary embodiment in which the RFID module is an encapsulated or partially encapsulated component (or one of multiple electronic components processed as described herein), the antenna structure can be provided in any number of ways. In one embodiment, the antenna structure can be embedded within a layer applied to the card after the molding process described herein. The antenna-bearing layer may be laminated to the card using a non-thermal process (such as with an adhesive), or may be laminated to the card using a thermal lamination process carried out at a temperature, pressure, and duration that does not re-melt, deform, or otherwise adversely interfere with the molding on one or more electronic components, or a backing sheet (metal or some other material that is not affected by thermal lamination) may be provided in such a thermal lamination step to prevent any re-melting or deformation of the molding from protruding from the opposite surface as the lamination step is being performed.

[0030] In another embodiment, the molding step can include an overmolding step that covers not only the electronic components as described herein but also at least a portion of the card surface on which the antenna structure will later be disposed. For example, in addition to encapsulating or partially encapsulating the RFID chip, a flood overmolding step can be performed that covers at least one entire surface of the card (usually the back surface, but alternatively the front surface) in a layer having a desired thickness. The antenna can then be embedded in the overmolded layer using, for example, an ultrasonic process known in the art. Also, any content that is printed on the card surface can be printed on the overmolded layer, or an additional printed layer can be attached via adhesive, lamination, or the like. In other embodiments, the antenna can be printed on the molding surface or applied as part of another layer that is attached to the molding surface via adhesive, lamination, or the like. It should be understood that the foregoing are non-limiting examples, and that endless possibilities exist for downstream processing of the resulting product of the processes described herein to provide molded electronic components within a card, and that certain aspects of the present invention are in no way limited by subsequent process steps.

[0031] In another embodiment shown in Figures 5A-5C, a booster antenna 502 for inductively coupling with an RFID's antenna can have the form of an annular metal frame that generally surrounds the RFID chip (e.g., a dual interface (DI) RFID chip). As depicted in Figures 5A-5C, the antenna has a discontinuity or slit 506 that extends from the inner edge to the outer edge of the annular antenna. Such antennas are generally described and characterized as "amplifiers" in U.S. Patent No. 8,608,082 to Le Garrec et al. (the '082 patent) and as "coupling frames" in U.S. Patent No. 9,812,782 to Finn et al. (as well as others), both of which are incorporated herein by reference. Thus, as described above and in commonly assigned U.S. patent application Ser. No. 15 / 928,813, filed March 22, 2018, entitled "DI CAPACITIVE EMBEDDED METAL CARD," which is incorporated herein by reference, the metal card body itself can function as an antenna or amplifier, with a slit (e.g., 504 depicted in FIGS. 5A and 5B) extending from the periphery of the card to the pocket in which the RFID chip is mounted. The slit can have any shape, including, without limitation, the stepped shape depicted in FIGS. 5A and 5B, any of the shapes described in the '813 application and related applications, or any of the shapes disclosed in the above-mentioned references.

[0032] As shown in FIG. 5C , the metal antenna 502 is surrounded by encapsulant material to form an outer surround 520 and an inner region 522, and the encapsulant material also fills the slit 506, thereby connecting the inner region to the outer surround. For illustrative purposes, the antenna is depicted in FIG. 5C without the encapsulant covering it in the Z direction so that the antenna remains visible in the drawing. Also, in embodiments in which the metal-body card 500 is utilized for signal amplification, the encapsulant material may fill the slit 504 in the metal body. However, it should be understood that the slit 504 need not be present in all embodiments. It should further be understood that the card body may have multiple slits. Additional exemplary alternative slit locations 554, 564, and 574 are depicted in dashed lines. For example, in one embodiment, the combination of slits 504 and 554 intersecting the chip pocket may form a bisection along the entire length of the card, or the combination of slits 564 and 574 intersecting the chip pocket may together form a bisection along the entire width of the card. Note that the term "bisection" is intended to mean that a line divides the card into two sections, but that these sections are not necessarily equal in size. While depicted as approximately centered on the antenna aligned with the same line on opposite sides of the antenna, the combined slits can have any relationship to the antenna and to each other, including slits on different sides of the antenna lying on parallel or non-parallel lines, slits connecting to adjacent portions of the antenna but not on opposite sides, slits not parallel to the edge of the card, or one or both of the slits being non-linear. In embodiments where the card is bisected, the remaining portions of the card can be bonded together by overmolding or other non-conductive adhesive or filler.Although the preferred embodiment includes only a single bifurcation of the card body into two separate portions, multiple body slits can also divide the card into more than two separate portions. A bifurcation configuration can generally minimize eddy currents.

[0033] Thus, the encapsulated antenna 502 as depicted in FIG. 5C defines a metal containment plug 550 that may be fabricated in its entirety and then inserted into an opening in the card body, or that may be fabricated in situ within the opening in the card body, such as by overmolding. After the plug is inserted or molded in situ within the pocket, a pocket can be created within the interior region 522 of the plug (e.g., by milling or any process known in the art) to receive the RFID chip. One advantage of such a design is that the metal card body can be formed with a through-hole to receive the plug 550. Preferably, the through-hole can be formed by a method other than milling, such as stamping, etching, lathe cutting, or the like. Alternatively, the card body may be first formed with a through-hole (as described in U.S. Provisional Patent Application No. 67 / 730,282, filed September 12, 2018, entitled "METAL-DOPED EPOXY RESIN TRANSACTION CARD AND PROCESS FOR MANUFACTURE," which is assigned to the assignee of the present application and incorporated herein by reference), which may be particularly advantageous for card bodies that are ceramic, cast metal, or metal-doped epoxy. As a result, the milling step to create a pocket to accept the RFID chip needs to be performed only in the non-metallic encapsulant, which is easier and requires less milling time than metal. As is known in the art, the pocket for accepting the RFID chip may be a stepped hole having a first, relatively large area on the front surface of the card and a second, relatively smaller area on the back side of the card. By enlarging the area of ​​the pocket in the card body where the RFID chip is inserted, the overall length of the slit 504 that must be cut in the metal card body (in embodiments where a slit is present) is minimized, which also saves manufacturing time.These improvements facilitate increased power output and efficiency.

[0034] In some embodiments, it may not be necessary or desirable for the card body to function as part of the booster antenna. In such embodiments, the opening in the card body may be relatively larger than that depicted in FIGS. 5A-5C such that the outer surround 520 has a width W that separates the metal of the antenna 502 in the plug 550 from the card body, operable to acceptably minimize electrical / magnetic interference from the card body. The shape of the plug 550 in such embodiments may be relatively rectangular, with the innermost edge 560 of the plug positioned toward the relative center of the card body 500 to guide a portion of the RF signal toward the center of the card, while the location of the DI-RFID chip remains essentially unchanged as depicted to comply with relevant standards for contact location.

[0035] Although described herein in the context of metal card bodies, similar shapes can also be utilized in non-metallic cards. In addition to the manufacturing methods described herein being suitable for card bodies of any material (although particularly advantageous for metal, ceramic, and ceramic-coated metal bodies), the antenna 502 can also be deployed in plastic (e.g., PVC) card bodies, for example, by ultrasonically (or otherwise) embedding a metal component within the plastic as an inlay within the card, thereby replacing a copper wire or etched antenna inlay. The depicted antenna shape 502 can be represented as a planar, annular member having a substantially closed perimeter with a slit 506 connecting the inner perimeter of the annular member with the outer perimeter. While depicted as a single member in the exemplary embodiment, the antenna structure is not limited to such and can have multiple members. In contrast, a copper wire or etched antenna inlay typically produces a spiral pattern of lines or wires with spaces separating the spiral turns radially.

[0036] Those skilled in the art will understand that appropriate molding materials will depend on the type of molding process being used in step 130. For example, if insert or overmolding is being utilized, thermoplastic materials such as TechnoMelt® dissolvable adhesive (Henkel) can be used, which can include one or more materials from the group consisting of EVA, polyolefins including metallocene polyalphaolefins, atactic polyalphaolefins, block copolymers, polyurethane hot melts, and polyamides, as well as thermoset materials such as glass fiber reinforced polyester, polyurethane, Bakelite® synthetic resin, Duroplast, melamine, diallyl phthalate, and polyimides. Those skilled in the art will understand that other materials that can be made flowable in an overmolding or insert molding process can be used as well, including, without limitation, powdered metals including rhodium, aluminum, titanium, magnesium, copper, brass, nickel, Monel, Inconel, steel, and alloys of the foregoing.

[0037] In another embodiment, the molding material used in the overmolding or insert molding process is a plastic material having a molding temperature range of about 150-300°C.

[0038] 6A-6C depict a particular embodiment 600 of a metal RFID device having a body in the form of a metal frame 610 with an opening in the card body defining an outer periphery 611 and an inner periphery 612 of the metal frame. At least one body discontinuity 620 extends from the outer periphery to the inner periphery of the metal frame. At least one electronic component is disposed within the opening, and layers 640, 642 of non-conductive material are disposed around the electronic component. The electronic component includes an RFID chip 632 disposed within a substrate 634 with an antenna 636 also disposed within the substrate and connected to the RFID chip. Collectively, the RFID chip, antenna, and substrate may be referred to as an RFID module. Thus, the RFID device 600 includes a metal frame 610 with opposing surfaces 614, 615, an outer periphery 611, and an opening in the metal frame defining the inner periphery 612 and extending from at least one of the opposing surfaces 614, 615 for a depth. As depicted in FIGS. 6A-6C, the opening is coextensive from the top surface 614 to the bottom surface 615 with a depth equal to the thickness T of the metal frame. A chip layer 630—having a non-conductive substrate 634, an RFID transponder chip 632 attached to the substrate 634, and a module antenna 636 within the substrate connected to the RFID transponder chip—is disposed within the opening. The module antenna may be etched or may have a structure known in the art for being disposed within the substrate. One or more filler layers 640, 642 may be disposed within the frame opening between the chip layer and one of the surfaces of the metal frame. One or more layers 650, 652 may be laminated onto at least one surface of the metal frame. As depicted in FIG. 6B, through holes 660 extending between the upper and lower surfaces of the device, between the upper surface of upper layer 650 and the lower surface of lower layer 652, are preferably aligned over a portion of the device disposed between inner surface 611 and outer surface 612 of the metal layer.While shown in Figures 6A-6C as having both an antenna 636 in the chip layer and a discontinuity 620 in the metal frame, it should be understood that some components may have only one or the other, but not both, and other embodiments may have both as depicted.

[0039] One process for fabricating device 600 can include applying layer 652 to the bottom surface 615 of metal frame 610 before stacking layers 642, 630, and 640 within the openings, then disposing layer 650 over the openings and laminating the stack so that layers 640 and 642 encase chip layer 630. The metal frame can be constructed by cutting an opening in a metal blank, by forming metal in the desired shape, or by slicing a section from an extruded bar. While depicted as having dimensions extending to the inner perimeter 612 of metal frame 610, it should be understood that chip layer 630 can have a much smaller footprint such that layers 640 and 642 completely encase chip layer 630 on all sides. It should further be understood that in configurations where the outer periphery of substrate 634 is smaller than inner periphery 612 of the frame, an intermediate layer of non-conductive material (not shown) may be disposed between layers 640 and 642 with a cutout to accommodate the periphery of substrate 634.

[0040] In another embodiment depicted in Figures 7A-7D, RFID device 700 has metal frame 710 defining opposing surfaces 714, 715, an outer periphery 711, and an inner periphery 712, with an opening in the metal frame extending from surface 714 to a depth D. As depicted in Figures 7A-7C, the opening has a depth D that is less than a thickness T of the metal frame from top surface 714 to bottom surface 715. A chip layer 730—including a substrate 734, an RFID transponder chip 732 attached to substrate 734, and a module antenna 736 within the substrate connected to the RFID transponder chip—is disposed inside the opening. Thus, the opening includes a pocket having a bottom and a ferrite layer 742 disposed between the chip layer and the pocket bottom, and a filler layer 740 is disposed within the pocket between chip layer 730 and top surface 714 of the metal frame. Layer 750 is laminated onto the top surface 714 of metal frame 710 and onto filler layer 740 .

[0041] One process for manufacturing device 700 can include creating a pocket opening in a metal blank (by milling, etching, or laser) to define metal frame 710, stacking layers 742, 730, and 740 within the opening, disposing layer 750 over the opening, and laminating the stacked components together. As depicted in Figures 7A-7C, RFID device 700 has through-holes 760 extending between the upper and lower layers of the device, preferably aligned within the portion of the device between inner surface 711 and outer surface 712 of the metal layers, between the upper and lower surfaces 715 of upper layer 750 of the metal layers as depicted in Figure 7A. As further depicted in Figure 7B (not shown in Figures 7A-7C to reduce clutter, and also not shown although applicable to the designs of Figures 6A-6C and 8A-8C), aperture 760 may be particularly well suited to receiving an item 780, such as a component of a device configured to hold one or more keys, such as a key ring or key chain. Thus, devices 600 and 700 may be smaller in size than typically associated with credit cards and relatively sized to be suitable to function as a key fob or key tag.

[0042] 6A-6C and 7A-7C depict contactless-only RFID devices, it should be understood that the RFID device in any of the foregoing may be a dual-interface device capable of interfacing with both contactless and connection-based readers. Thus, as depicted in FIGS. 8A-8C, RFID device 800 includes metal frame 810 defining opposing surfaces 814, 815, outer periphery 811, and inner periphery 812, with an opening in metal frame extending from surface 814 for a depth. Chip layer 830—including substrate 834, RFID transponder chip 832 attached to substrate 834, and module antenna 836 in the substrate connected to the RFID transponder chip—is disposed inside the opening. 8B, in which the opening has a pocket with a bottom, a filler layer 840 is disposed within the pocket between the chip layer 830 and the top surface 814 of the metal frame, with a ferrite layer 842 disposed between the chip layer and the pocket bottom. Layer 850 is laminated onto the top layer 814 of the metal frame 810 and onto filler layer 840. The DI chip extends to the top surface of top layer 850 for contact-based functionality.

[0043] One process for fabricating device 800 can include creating a pocket opening (by milling, etching, or laser) in a metal blank to define metal frame 810, stacking layers 842, 830, and 840 (with a cutout to accommodate chip 832) within the opening, disposing layer 850 (with a cutout to accommodate chip 832) over the opening, and laminating the stacked components together. In another embodiment, when the stack of layers 842, 830, 840, and 850 is laminated together, only antenna 836 can be present on substrate 830, and a hole for receiving chip 832 is then created and chip 832 is inserted. The subsequent lamination step can be performed at a temperature suitable to reflow the dissolvable layer to encapsulate all but the top contact surface of chip 832.

[0044] Also, although depicted as a pocket having a depth less than the thickness of the metal frame in Figure 8B, it should be understood that the DI-tip (or contact-only) design may also be suitable for use with designs in which the opening extends the entire thickness of the metal frame, such as the embodiment depicted in Figures 6A-6C. Furthermore, variations of such an embodiment include those having only antenna 836, those having antenna 836 and a slit similar to slit 620, and those having both an antenna and a slit.

[0045] To maintain functionality within standard card readers intended for credit card-sized payment devices, the orientation of the DI chip (with the short edge of the contact pads of chip 832 parallel to the leading edge 870 of the device), the location of DI chip 832 (left of center), and the dimensions of metal frame 810 are identical to those of the leftmost portion of a standard DI credit card (as viewed from the front or top surface of the card). This structure allows the device to be inserted into a contact-based card reader in the direction of arrow P with leading edge 870 oriented first, thereby making device 800 distinguishable from a standard credit card from the perspective of the card reader.

[0046] It should be understood that none of embodiments 600, 700, or 800 are limited to any particular location for the through-hole for accommodating the key carrier components, and that in a DI (or contact-only) device, the hole should be located in a location that does not create interference during insertion into the card reader. Locations in the upper left- or upper right-hand corners of the device (e.g., where hole 860a is shown in FIG. 8A ) are acceptable, and in configurations where the hole is located on an appendage 874 that protrudes from the card's trailing edge 872, such as in the location where hole 860b is depicted in FIG. 8 , the overall dimensions of the device in the card insertion direction can be reduced. While depicted in FIG. 8A , it is semicircular in shape, appendage 874 can have any desired shape. While only a single through-hole may be required per device, some devices may have multiple. Although depicted as having through-holes 660, 760, 860a, 860b in particular locations in the drawings, the holes may be located anywhere that does not interfere with the functional elements of the device (or the intended use of the device, such as, for example, use in a card reader in the case of a contact-containing module), although locations in the metal corners of the frame may be particularly desirable.

[0047] Although depicted as rectangular, it should be understood that devices 600, 700, 800 may have any desired shape (most specifically, devices 600 and 700 are not depicted as having contact functionality). Device 800 requires a shape for insertion into a card reader in relevant portions, but its overall shape is not limited.

[0048] While described herein in specific embodiments having an opening and a non-conductive laminate layer and / or substrate surrounding the RFID transceiver chip, it should be understood that the RFID chip and / or antenna may be encapsulated using any of the techniques described herein. Furthermore, while the descriptions of some embodiments herein refer to a "card" and others to a "device" suitable for use on a key fob, it should be understood that any of the designs disclosed herein may be suitable for use in any size, not limited to standard transaction card sizes or the relatively small sizes intended for attachment to a key fob. As is known in the art, a standard transaction card (e.g., credit, debit, gift card) conforms to the CR80 or ISO / IEC 7810:2003 standard and has nominal dimensions of approximately 3.5 inches by 2 inches, or more specifically, 3.37 inches (85.6 mm) by 2.125 inches (53.98 mm), with a thickness of 0.03125 inches (0.76 mm) and rounded corners with a 3.18 mm radius. As will be understood by those skilled in the art, the above dimensions are nominal dimensions with respective tolerances. Although referred to herein as a "key holder," it should be understood that the through-holes described herein may be attached to any type of member suitable for passing through the hole, with or without a key attached to that same member, including a chain, ring, lanyard, rope, necklace, bracelet, post, etc.

[0049] Although the invention is illustrated and described herein with reference to specific embodiments, it is not intended that the invention be limited to the details shown. Rather, various changes in the details can be made within the scope and degree of equivalence of the claims and without departing from the invention. The above-described embodiment can be described as follows, but is not limited to the following. [Configuration 1] 1. A process for manufacturing a transaction device having an upper and lower surface, comprising: forming a metal frame defining an outer periphery, an inner periphery defined by an opening, and at least one body discontinuity from the outer periphery to the inner periphery of the metal frame; inserting at least one electronic component into the opening, the electronic component having an RFID module; disposing a non-conductive material around the electronic component; forming a hole extending between the upper and lower surfaces of the device; A process having [Configuration 2] 2. The process of claim 1, wherein the opening extends partially or entirely through the metal frame. [Configuration 3] 3. The process of claim 1 or 2, wherein the opening is a pocket in the metal frame, and wherein disposing the non-conductive material around the at least one electronic component comprises disposing the non-conductive material on at least a top surface of the at least one electronic component. [Configuration 4] 4. The process of any one of configurations 1 to 3, wherein the RFID module comprises an antenna connected to or configured to inductively couple to an RFID chip. [Configuration 5] 5. The process of any one of the preceding claims, further comprising the step of disposing at least one further layer on the non-conductive material. [Configuration 6] 6. The process of claim 5, wherein the at least one further layer is a printed layer. [Configuration 7] The process of configuration 5, wherein the step of disposing the at least one further layer on the non-conductive material comprises the step of adhesively attaching the one further layer to the non-conductive material or laminating the at least one further layer. [Configuration 8] The process of configuration 5, wherein the opening extends entirely through the metal frame, and the at least one further layer has a first further layer disposed on one side of the opening before inserting the at least one electrical component, and wherein the step of disposing the non-conductive material around the at least one electronic component comprises disposing a first layer of non-conductive material in the opening between the at least one further layer and the at least one electronic component, and disposing a second layer of non-conductive material on top of the at least one electronic component. [Configuration 9] 9. The process of embodiment 8, further comprising disposing a second additional layer on top of the second layer of non-conductive material. [Configuration 10] 10. The process of any one of the preceding claims, wherein the holes extend through the metal frame between the inner periphery and the outer periphery. [Configuration 11] 11. A transaction device manufactured according to the process of any one of claims 1 to 10. [Configuration 12] 1. A transaction device having an upper and lower surface, a metal frame defining an outer periphery, an inner periphery defined by an opening in the metal frame, and at least one body discontinuity from the outer periphery to the inner periphery of the metal frame; at least one electronic component within the opening, the electronic component having an RFID transponder chip; a non-conductive material disposed around the electronic component; a hole extending between the upper and lower surfaces of the device; A transaction device comprising: [Configuration 13] 13. The transaction device of configuration 12, wherein the opening extends partially or entirely through the card body. [Configuration 14] 13. The transaction device of configuration 12, wherein the opening is a pocket in the card body and the non-conductive material is disposed on at least a top surface of the at least one electronic component. [Configuration 15] 13. The transaction device of claim 12, further comprising a module antenna connected to or configured to inductively couple to the RFID transponder chip module. [Configuration 16] 16. The transaction device of embodiment 15, wherein the RFID transponder chip and module antenna are disposed within a substrate. [Configuration 17] 1. An RFID device, comprising: a metal frame defining first and second opposite surfaces, an outer periphery, and an inner periphery, the metal frame having an opening therein extending from at least one of the opposite surfaces to a depth; a chip layer disposed inside the opening, the chip layer having a substrate, an RFID transponder chip attached to the substrate, and a module antenna within the substrate connected to the RFID transponder chip; at least one filler layer disposed within the opening in the frame between the chip layer and one of the surfaces of the metal frame; at least one layer laminated on at least one surface of the metal frame; An RFID device having: [Configuration 18] 18. The RFID device of claim 17, wherein the depth of the opening extends from the first surface through less than a thickness of the metal frame such that the opening has a pocket with a bottom, the device having a ferrite layer disposed between the first surface of the chip layer and the pocket bottom, and the filler layer disposed on the second surface of the chip layer. [Configuration 19] 19. The RFID device of claim 18, wherein the device has only a single laminated layer extending over the first surface of the metal frame and the filler layer. [Configuration 20] 18. The RFID device of Configuration 17, wherein the depth of the opening is coextensive with the thickness of the metal frame, and wherein the metal frame has discontinuities in the form of discontinuities extending between the first and second opposite surfaces and an outer and inner periphery, the device further comprising first and second filler layers on opposite sides of the chip layer and first and second layers laminated on the opposite surfaces of the metal frame and the respective first and second layers. [Configuration 21] 18. The RFID device of embodiment 17, further comprising an aperture extending between the top and bottom surfaces of the device. [Configuration 22] 22. The RFID device of claim 21, wherein the device further comprises a key ring or key chain component having a member disposed within the hole, the member comprising a device component configured to hold one or more keys. [Configuration 23] 18. The RFID device of claim 17, wherein the RFID transponder chip comprises a dual interface chip with contact pads, and the contact pads are accessible from an exterior surface of the device. [Configuration 24] 18. The RFID device of embodiment 17, wherein the RFID transponder chip is completely surrounded by a non-conductive material. [Configuration 25] 25. The RFID device of claim 24, wherein the RFID transponder chip is embedded within a non-conductive substrate and includes a laminated filler layer in contact with at least one surface of the RFID transponder chip embedded within the non-conductive substrate. [Configuration 26] 26. The RFID device of claim 25, comprising the laminated filler layer and a ferrite layer in contact with both the top and bottom surfaces of the RFID transponder chip embedded within the non-conductive substrate. [Configuration 27] 26. The RFID device of Configuration 25, having the laminated filler layer in contact with only one surface of the RFID transponder chip embedded within the non-conductive substrate, and a ferrite layer in contact with an opposite surface of the RFID transponder chip module embedded within the non-conductive substrate. [Configuration 28] 1. A process for manufacturing a transaction device, comprising, in sequential order: (a) forming a metal frame defining an outer periphery, an inner periphery defined by an opening, and at least one body discontinuity from the outer periphery to the inner periphery of the metal frame, the opening extending entirely through the metal frame; (b) disposing a first overframe layer on the metal frame on one side of the opening; (c) inserting at least one electronic component into the opening, the electronic component having an RFID module; (d) disposing a first fill layer of non-conductive material in the opening between the first layer and the at least one electronic component, and disposing a second fill layer of non-conductive material on top of the at least one electronic component, thereby disposing a non-conductive material around the electronic component; A process having [Configuration 29] 30. The process of embodiment 28, further comprising disposing a second overframe layer on top of the second layer of non-conductive material. [Configuration 30] 30. The process of embodiment 29, further comprising forming a hole extending between the upper and lower surfaces of the device. [Configuration 31] 31. A transaction device manufactured according to the process of any one of claims 28 to 30.

Claims

1. 1. An RFID device having a top surface and a bottom surface opposite the top surface, a metal frame defining a first surface, a second surface opposing the first surface, an outer periphery, and an inner periphery, and an opening in the metal frame extending in a depth direction from at least one of the opposing surfaces; a chip layer disposed inside the opening, the chip layer having a substrate, an RFID transponder chip attached to the substrate, and a module antenna within the substrate connected to the RFID transponder chip; at least one filler layer disposed within the opening of the metal frame between the chip layer and one of the surfaces of the metal frame; at least one layer laminated on at least one surface of the metal frame; and An RFID device wherein the depth of the opening extends from the first surface to less than the thickness of the metal frame such that the opening has a pocket with a bottom, the device further comprising a ferrite layer disposed between the first surface of the chip layer and the bottom of the pocket, and the filling layer is disposed on the second surface of the chip layer.

2. 10. The RFID device of claim 1, wherein the device comprises a single laminated layer extending over the first surface of the metal frame and the filler layer.

3. 10. The RFID device of claim 1, further comprising a hole extending between the top and bottom surfaces of the device.

4. 4. The RFID device of claim 3, wherein the device comprises a key ring or key chain component further comprising a member disposed within the hole, the member comprising a component of the device configured to hold one or more keys.

5. 3. The RFID device of claim 2, wherein the RFID transponder chip comprises a dual interface chip with contact pads, and the contact pads are accessible from an exterior surface of the device.

6. 10. The RFID device of claim 1, wherein the RFID transponder chip is completely surrounded by a non-conductive material.

7. 1. An RFID device, comprising: a metal frame defining first and second opposing surfaces, an outer periphery, and an inner periphery, the metal frame having an opening extending in a depth direction from at least one of the opposing surfaces; a chip layer disposed inside the opening, the chip layer having a substrate, an RFID transponder chip attached to the substrate, and a module antenna within the substrate connected to the RFID transponder chip; at least one filler layer disposed within the opening of the metal frame between the chip layer and one of the surfaces of the metal frame; at least one layer laminated on at least one surface of the metal frame and on the at least one filler layer; and An RFID device wherein the RFID transponder chip is embedded within a non-conductive substrate, and the filler layer is in contact with at least one surface of the RFID transponder chip embedded within the non-conductive substrate.

8. 8. The RFID device of claim 7, wherein a ferrite layer is in contact with a surface of the RFID transponder chip embedded within the non-conductive substrate.

9. 8. The RFID device of claim 7, further comprising: a laminated filler layer in contact with only one surface of the RFID transponder chip embedded within the non-conductive substrate; and a ferrite layer in contact with a surface of the RFID transponder chip embedded within the non-conductive substrate opposite the module.

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