Imaging device

Abstract

In an imaging device (1) having a device body (3) to / from which an interchangeable lens (2) having a lens mount (8) is attachable / detachable, the device body (3) is provided with: a mount ring (19) with which the lens mount (8) is engaged in a state where the interchangeable lens (2) is mounted; an element unit (20) having an imaging element (21); a holding frame (23) that holds the element unit (20); and a Peltier element (25) which has a heat-conductible first heat transfer part (25a) in contact with the holding frame (23) and a heat-conductible second heat transfer part (25b) in contact with the mount ring (19) and which is capable of switching a heat conduction state. By switching, in a state where the interchangeable lens (2) is mounted to the device body (3), the heat conduction state of the Peltier element (25) to a state where heat is transferred from the first heat transfer part (25a) to the second heat transfer part (25b), the dissipation efficiency of heat generated in the imaging element is improved.

Description

[Technical Field]

[0001] The present technology relates to a technical field of an imaging device in which an interchangeable lens is detachably attached. [Background technology]

[0002] Some imaging devices, such as mobile terminals (e.g., mobile phones) and cameras that function as imaging devices, have an imaging element disposed inside the device body. In imaging devices with an imaging element, the amount of heat generated inside the device body has increased in recent years due to improvements in performance, such as an increase in the number of pixels. When the amount of heat generated inside the device body increases, noise is more likely to occur due to an increase in the temperature of the imaging element, which may result in a deterioration in image quality.

[0003] Therefore, it is important for imaging devices to take heat dissipation measures to prevent the occurrence of the above-mentioned problems, and there are imaging devices that take heat dissipation measures against the heat generated in such imaging elements (see, for example, Patent Document 1).

[0004] In the imaging device described in Patent Document 1, a first transmission member is attached to the back surface of the imaging element, a Peltier element is attached to the back surface of the first transmission member, the rear surface of a second transmission member is attached to the back surface of the Peltier element, and the front end of the second transmission member is in contact with the outer cylindrical portion of the interchangeable lens (see Figure 10 of Patent Document 1). Heat generated in the imaging element is transmitted in order to the first transmission member, the Peltier element, and the second transmission member, and then transmitted from the cylindrical portion of the second transmission member positioned around the imaging element to the interchangeable lens, where it is released to the outside. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-295166 Summary of the Invention [Problem to be solved by the invention]

[0006] In an imaging device, it is desirable that heat generated in the imaging element be transmitted through an optimal path and dissipated to the outside without affecting the imaging element along the transmission path.

[0007] Furthermore, when the imaging element is in an operating state, such as when taking a picture with the imaging device, the photographer is often holding the device body, and if heat generated in the imaging element is transferred to the photographer holding the device body, the photographer may feel uncomfortable and the usability may be reduced. Therefore, it is desirable to improve the heat dissipation efficiency of the heat generated in the imaging element while minimizing the transfer of heat to the photographer.

[0008] Therefore, an object of the imaging device of the present technology is to improve heat dissipation efficiency while ensuring a good usability. [Means for solving the problem]

[0009] An imaging device according to the present technology includes a device body to which an interchangeable lens having a lens mount is detachably attached, the device body including a mount ring to which the lens mount engages when the interchangeable lens is attached, a sensor unit having an imaging element, a holding frame that holds the sensor unit, and a Peltier element having a first heat transfer portion and a second heat transfer portion that are capable of conducting heat, the holding frame being in contact with the first heat transfer portion and the mount ring being in contact with the second heat transfer portion, and the heat conduction state of the Peltier element being switchable, and when the interchangeable lens is attached to the device body, the heat conduction state of the Peltier element is switched to a state in which heat is transferred from the first heat transfer portion to the second heat transfer portion. The interchangeable lens is provided with an anti-reflection member that prevents reflection of light, and a light-shielding member that is in contact with the second heat transfer portion and at least a portion of which faces the anti-reflection member is provided. It is something.

[0010] An imaging device according to another aspect of the present technology includes an interchangeable lens having a lens mount and a device body to which the interchangeable lens is detachably attached, the device body including a mount ring to which the lens mount is engaged when the interchangeable lens is attached, a sensor unit having an imaging element, a holding frame that holds the sensor unit, and a Peltier element having a first heat transfer portion and a second heat transfer portion capable of conducting heat, the holding frame being in contact with the first heat transfer portion and the mount ring being in contact with the second heat transfer portion, and the heat conduction state of the Peltier element being switchable, and when the interchangeable lens is attached to the device body, the heat conduction state of the Peltier element is switched to a state in which heat is transferred from the first heat transfer portion to the second heat transfer portion. The interchangeable lens is provided with an anti-reflection member that prevents reflection of light, and a light-shielding member that is in contact with the second heat transfer portion and at least a portion of which faces the anti-reflection member is provided. It is something.

[0011] As a result, in the imaging device according to the present technology and another imaging device according to the present technology, when an interchangeable lens is attached to the device body, the heat conduction state of the Peltier element is switched, and the heat generated in the imaging element is transmitted by the Peltier element from the holding frame via the mount ring to the interchangeable lens and then released to the outside from the interchangeable lens. [Brief explanation of the drawings]

[0012] [Figure 1] 2 to 11, which show an embodiment of the present technology, and this figure is a perspective view showing the device body and the interchangeable lens in a separated state. [Figure 2] FIG. 2 is a perspective view showing a part of the interchangeable lens. [Figure 3] FIG. [Figure 4] FIG. 2 is a side view, partly in cross section, showing the state in which an interchangeable lens is attached to the device body. [Figure 5] FIG. [Figure 6] FIG. 10 is a flowchart showing an example of changing the mode of heat dissipation depending on the type of interchangeable lens, etc. [Figure 7] 10 is a cross-sectional view showing the heat transfer path etc. when an interchangeable lens is attached to the device body via an adapter. [Figure 8] 9 and 10 show the configuration of a collapsible imaging device, and this figure is a cross-sectional view showing a state in which the lens barrel is housed in the barrel support. [Figure 9] 10 is a cross-sectional view showing a state in which the lens barrel is extended from the barrel support portion. FIG. [Figure 10] 10A and 10B are cross-sectional views showing examples in which the Peltier elements are arranged at different positions. [Figure 11] FIG. 1 is a block diagram of an imaging device. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, an embodiment of an imaging device according to the present technology will be described with reference to the accompanying drawings.

[0014] In the following embodiments, the imaging device of the present technology is applied to a single-lens reflex camera, which is a still camera among imaging devices such as cameras. However, the application range of the present technology is not limited to single-lens reflex cameras. The present technology can be widely applied to various imaging devices other than single-lens reflex cameras, such as still cameras and video cameras.

[0015] In the following description, the front, back, up, down, left and right directions are indicated in the direction from the photographer's perspective when shooting with a still camera. Therefore, if we use the optical axis passing through the center of the lens or mount ring of the still camera as a reference, the object side (subject) in the optical axis direction is the front, and the image plane side in the optical axis direction is the rear. Note that the front, back, up, down, left and right directions shown below are for the sake of convenience, and the implementation of this technology is not limited to these directions.

[0016] <General configuration of the imaging device> The imaging device 1 has a device body 3 to which an interchangeable lens 2 is attached / detached (see FIG. 1). The imaging device 1 is made up of the device body 3, but may also be made up of the device body 3 and the interchangeable lens 2.

[0017] <Interchangeable lens configuration> Next, the configuration of the interchangeable lens 2 will be described (see FIGS. 1 to 3).

[0018] The interchangeable lens 2 is detachably attached to the device body 3, and is configured with the necessary parts arranged inside and outside an outer cylinder 4.

[0019] The outer barrel 4 is made of, for example, a metal material. Adjustment rings 5, 5 are rotatably supported in a line up at the front and rear on the outer circumferential surface of the outer barrel 4. The adjustment rings 5, 5 have functions such as focusing adjustment, zooming adjustment, and aperture light amount adjustment.

[0020] A plurality of lens groups 6, 6, ... are arranged at intervals in the optical axis direction (front-rear direction) inside the outer barrel 4. Each lens group 6 has at least one lens.

[0021] An anti-reflection member 7 made of, for example, a metal material is attached to the inner peripheral surface of the outer barrel 4. The anti-reflection member 7 has the function of preventing unwanted reflection of light incident on the interchangeable lens 2, and is made of a dark, for example, black, material. The anti-reflection member 7 has a cylindrical circumferential portion 7a and an inner flange-like opposing portion 7b that protrudes inward from the rear end of the circumferential portion 7a.

[0022] The rear end of the interchangeable lens 2 is provided as a lens mount 8. The lens mount 8 is formed, for example, from a metal material, and has an annular base ring portion 9, a cylindrical connecting portion 10 that protrudes rearward from the inner periphery of the base ring portion 9, and arc-shaped engaging protrusions 11, 11, 11 that protrude outward from the rear end of the connecting portion 10. The rear end of the circumferential portion 7a and the opposing portion 7b of the antireflection member 7 are positioned on the inner periphery of the lens mount 8.

[0023] A terminal portion 12 is attached to the lower end of the rear surface of the anti-reflection member 7 of the interchangeable lens 2. The terminal portion 12 is formed in an arc shape and has a base portion 12a made of an insulating material and connection terminals 12b, 12b, ... positioned side by side in the circumferential direction of the base portion 12a. Parts of the connection terminals 12b, 12b, ... are exposed on the rear surface side of the base portion 12a.

[0024] <Device configuration> Next, the configuration of the device main body 3 will be described (see FIGS. 1, 3 and 4).

[0025] The device main body 3 is configured with required parts arranged inside and outside an outer casing 13. Various operation parts 14, 14, ... are arranged on the top or rear surface of the outer casing 13 (see FIG. 1). The operation parts 14 include, for example, a power button, a shutter button, a zoom knob, a mode switching knob, etc.

[0026] A viewfinder section 15 is provided at the top end of the device body 3. A user of the imaging device 1 can view an image of a subject through the display or viewfinder section 15, and can also view captured images or videos on the display.

[0027] A part of the device body 3, for example the right end where the shutter button is provided, is provided as a grip part 16. The front part of the grip part 16 protrudes so that it bulges forward more than the other parts, and is the part that is held by the user's hand when taking a picture with the imaging device 1, etc.

[0028] Grip section 16, which protrudes so that the front portion bulges out further forward than the other portions, is held in the hand during shooting, ensuring a stable grip of imaging device 1. Furthermore, by providing the portion where the shutter button is provided as grip section 16, the user can operate the shutter button with the same hand that holds grip section 16, making it possible to take pictures easily and quickly, facilitating shooting and reducing lost shooting opportunities.

[0029] However, when the imaging device 1 is in use, including when taking pictures, heat generated in each part arranged inside the device body 3 is transferred to the outer casing 13, causing the temperature of the grip part 16 to rise and causing discomfort to the user, so measures to dissipate the heat generated in each part arranged inside the device body 3 are necessary.

[0030] A display (not shown) is supported on the rear surface of the outer casing 13. A circular opening 13a is formed in the front surface of the outer casing 13, and a mount 17 for attaching the interchangeable lens 2 is provided around the opening 13a (see FIGS. 1 and 3). The mount 17 has a substantially cylindrical attachment protrusion 18 and a mount ring 19 attached to the attachment protrusion 18.

[0031] The mount ring 19 has an annular coupling ring portion 19a and arc-shaped mount engaging portions 19b, 19b, 19b that protrude inward from the coupling ring portion 19a, and the mount engaging portions 19b, 19b, 19b are spaced apart in the circumferential direction.

[0032] A sensor unit 20 is disposed inside the outer casing 13 (see FIG. 4). The sensor unit 20 includes an imaging element 21 such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor), an optical filter (not shown) that has the function of absorbing light of a predetermined wavelength, a circuit board (not shown) for supplying power to the imaging element 21, and a holding frame 22 that holds the imaging element 21. The holding frame 22 is formed, for example, in a substantially rectangular frame shape from a metal material.

[0033] The imaging element 21 is positioned behind the opening 13a and has a horizontally long rectangular shape (rectangular shape). The imaging element 21 has its outer periphery held by a holding frame 22 from the front side.

[0034] The holding frame 22 is held by the outer casing 13 via a holding frame 23. The holding frame 23 is formed, for example, in a frame shape from a metal material, and has a substantially circular outer shape. The outer periphery of the holding frame 22 is held by the holding frame 23, and a portion of the holding frame 23 is attached to the outer casing 13.

[0035] On the front surface of the holding frame 23, biasing springs 24, 24, 24 are attached spaced apart in the circumferential direction (see FIG. 3). The biasing springs 24 are, for example, leaf springs, and have the function of biasing the lens mount 8 of the interchangeable lens 2 forward when the interchangeable lens 2 is attached to the device body 3, thereby ensuring a stable attachment state of the interchangeable lens 2 to the device body 3.

[0036] Peltier elements 25, 25, 25 are attached to the front surface of the holding frame 23 at positions between the biasing springs 24, 24, 24 (see FIGS. 3 and 4). The number of Peltier elements 25 attached to the holding frame 23 is not limited to three and can be any number. The Peltier elements 25, 25, 25 are attached, for example, to the upper end and both left and right ends on the front surface of the holding frame 23, and are positioned at intervals of approximately 90 degrees in the circumferential direction.

[0037] The Peltier element 25 is formed in a shape in which the front-to-rear direction is the thickness direction, and is structured, for example, such that a conductive layer having a semiconductor element is provided between a pair of ceramic substrates spaced apart in the thickness direction. One end (rear end) of the Peltier element 25 in the thickness direction is provided as a first heat transfer portion 25a, and the other end (front end) in the thickness direction is provided as a second heat transfer portion 25b. The Peltier element 25 has the function of transferring heat in the thickness direction, and functions as a conduction state switching portion that can switch the heat conduction state (conduction direction) depending on the direction of the supplied current.

[0038] Therefore, in Peltier element 25, it is possible to switch so that heat is transferred from first heat transfer portion 25a to second heat transfer portion 25b or from second heat transfer portion 25b to first heat transfer portion 25a depending on the direction of current. However, in imaging device 1, current is supplied to Peltier element 25 so that heat is transferred from first heat transfer portion 25a to second heat transfer portion 25b, and when no current is supplied to Peltier element 25, active heat conduction is not performed and Peltier element 25 is in a natural conduction state.

[0039] A part of outer casing 13 is in surface contact with first heat transfer portion 25a of Peltier element 25 from one surface (outer surface) perpendicular to the thickness direction (see FIG. 4). Heat insulating member 26 is attached to the outer surface of Peltier element 25, and heat insulating member 26 provides thermal insulation between outer casing 13 and second heat transfer portion 25b.

[0040] In the thickness direction, the first heat transfer portion 25a of the Peltier element 25 is in surface contact with the front surface of the holding frame 23, and the second heat transfer portion 25b is in surface contact with the rear surface of the coupling ring portion 19a of the mount ring 19. Therefore, when a current is supplied to the Peltier element 25, heat is transferred from the holding frame 23 to the mount ring 19 by the Peltier element 25.

[0041] An arc-shaped contact portion 27 is attached to the lower end of the front surface of the holding frame 23, and the contact portion 27 has a plurality of contacts 27a, 27a, . . . aligned in the circumferential direction (see FIG. 1).

[0042] A light-shielding member 28 is disposed between the mount ring 19 and the holding frame 22 (see FIGS. 3 and 4). The light-shielding member 28 is formed of a dark-colored material, for example, black, and has the function of preventing unwanted light from entering the imaging element 21 and preventing unwanted reflection of light inside the device body 3. The light-shielding member 28 is formed, for example, in an annular shape from a metal material. The front surface of the outer periphery of the light-shielding member 28 is in surface contact with the rear surface of the mount ring 19, and the outer periphery is in surface contact with the second heat transfer portion 25b of the Peltier element 25. A portion of the light-shielding member 28 is positioned opposite the opposing portion 7b of the anti-reflection member 7 when the interchangeable lens 2 is attached to the device body 3. The portion of the light-shielding member 28 positioned opposite the opposing portion 7b is provided as a facing portion 28a.

[0043] A heat insulating member 29 is disposed between the light blocking member 28 and the holding frame 23, and heat insulation between the light blocking member 28 and the holding frame 23 is achieved by the heat insulating member 29. A part of the heat insulating member 29 is also positioned between the light blocking member 28 and the first heat transfer portion 25a of the Peltier element 25, and the heat insulating member 29 also achieves heat insulation between the light blocking member 28 and the first heat transfer portion 25a.

[0044] Furthermore, if there is a possibility of heat transfer between the light-shielding member 28 and the holding frame 22, a heat-insulating member may also be provided between the light-shielding member 28 and the holding frame 22 (position P shown in Figure 4).

[0045] A printed wiring board (not shown) is disposed inside the device body 3. The printed wiring board is formed, for example, in a horizontally elongated shape and is used as a control board that controls the entire imaging device 1. Various electronic components and integrated circuits (LSI) are mounted on the printed wiring board, and these electronic components and integrated circuits serve as heat sources that generate heat when in operation. In particular, the operating frequency of integrated circuits increases as the amount of image information output from the imaging element 21 increases and image processing speeds increase, resulting in increased heat generation, but processing performance decreases at high temperatures. Therefore, the imaging device 1 requires sufficient heat dissipation measures for the heat generated in the integrated circuits.

[0046] <Attaching and detaching the interchangeable lens to the device body> The operation of attaching and detaching the interchangeable lens 2 to and from the device body 3 will be described below.

[0047] The interchangeable lens 2 can be attached to the device body 3 by inserting the engagement protrusions 11, 11, 11 of the lens mount 8 between the mount engagement portions 19b, 19b, 19b of the mount portion 17, and rotating the entire interchangeable lens 2 around the optical axis relative to the device body 3.

[0048] When the interchangeable lens 2 is attached to the device body 3, the engagement protrusions 11, 11, 11 are urged forward by the respective urging springs 24, 24, 24, and the front surfaces of the engagement protrusions 11, 11, 11 are pressed against the rear surfaces of the mount engagement portions 19b, 19b, 19b, respectively. At this time, the connection terminals 12b, 12b, ... provided on the terminal portion 12 of the interchangeable lens 2 are each connected to the contacts 27a, 27a, ... provided on the contact portion 27 of the device body 3. This enables the exchange of signals and the supply of power between the interchangeable lens 2 and the device body 3.

[0049] When the interchangeable lens 2 is attached to the device body 3, the opposing portion 7b of the anti-reflection member 7 provided on the interchangeable lens 2 and the opposing portion 28a of the light-blocking member 28 provided on the device body 3 are positioned opposite each other.

[0050] The interchangeable lens 2 can be removed from the device body 3 by rotating the entire interchangeable lens 2 around the optical axis relative to the device body 3 in the opposite direction to that used when the lens was attached, and pulling out the engagement protrusions 11, 11, 11 from between the mount engagement portions 19b, 19b, 19b, respectively.

[0051] <Heat transfer path> The transmission path of heat generated in the device body 3 will be described below (see FIG. 5).

[0052] The following describes the transfer path of heat generated in the image pickup element 21 and the integrated circuit, which generate a large amount of heat.

[0053] When using the imaging device 1, particularly when taking a photograph, the interchangeable lens 2 is attached to the device body 3 as described above, the power is turned on, and each part of the imaging device 1 is put into a driving state. At this time, when the power is turned on by operating the power button, for example, current is supplied to the Peltier elements 25, 25, 25. Therefore, the Peltier element 25 is put into a state in which heat is conducted from the first heat transfer portion 25a to the second heat transfer portion 25b.

[0054] Heat generated in the imaging element 21 is transferred from the element unit 20 mainly to the holding frame 23 or the outer casing 13, and heat generated in the integrated circuit is transferred mainly to the outer casing 13 from the printed wiring board.

[0055] The heat transferred to the holding frame 23 is transferred from the holding frame 23 to the mount ring 19 by the Peltier element 25, and then from the mount ring 19 to the outer tube 4 of the interchangeable lens 2 (see arrow A). At this time, because the interchangeable lens 2 does not have a heat source that generates a large amount of heat, it is kept at a lower temperature than the device body 3, and the efficiency of heat transfer from the device body 3 to the image sensor 21 is high, so the heat transferred to the outer tube 4 is released to the outside.

[0056] Meanwhile, the heat transferred to the outer casing 13 is also transferred from the holding frame 23 to the mount ring 19 by the Peltier element 25, and then from the mount ring 19 to the outer barrel 4 of the interchangeable lens 2 (see arrow B). The heat transferred from the outer casing 13 to the outer barrel 4 is also released to the outside from the outer barrel 4. At this time, because the heat insulating member 26 provides thermal insulation between the outer casing 13 and the second heat transfer section 25b, the heat transferred from the outer casing 13 to the mount ring 19 by the Peltier element 25 is not transferred to the outer casing 13.

[0057] In this way, the imaging device 1 has a heat-blocking member 26 provided between the outer casing 13 and the second heat transfer section 25b of the Peltier element 25, so that the heat transferred from the first heat transfer section 25a to the second heat transfer section 25b is not transferred to the outer casing 13, thereby improving the efficiency of heat transfer from the outer casing 13 to the interchangeable lens 2.

[0058] Furthermore, a portion of the heat transferred from the imaging element 21 or the outer casing 13 to the mount ring 19 by the Peltier element 25 is transferred from the mount ring 19 to the light-shielding member 28 (see arrow C). At this time, because the facing portion 7b of the anti-reflection member 7 and the facing portion 28a of the light-shielding member 28 are positioned opposite each other, the heat transferred from the mount ring 19 to the light-shielding member 28 is transferred by radiation from the light-shielding member 28 to the anti-reflection member 7 (see arrow D). The heat transferred from the light-shielding member 28 to the anti-reflection member 7 is transferred from the anti-reflection member 7 to the outer cylinder 4, or is conducted through the anti-reflection member 7 and released to the outside (see arrow E).

[0059] In this way, the interchangeable lens 2 is provided with an anti-reflection member 7 that prevents light reflection, and the device body 3 is provided with a light-shielding member 28 that is in contact with the second heat transfer section 25b of the Peltier element 25 and at least a portion of which faces the anti-reflection member 7.

[0060] Therefore, when the interchangeable lens 2 is attached to the device body 3, a portion of the heat transferred from the first heat transfer section 25a to the second heat transfer section 25b is transferred to the light-shielding member 28 and then transferred from the light-shielding member 28 to the anti-reflection member 7 by radiation, thereby further improving the heat dissipation performance of the heat generated in the device body 3.

[0061] As described above, some of the heat transferred to the mount ring 19 is transferred from the mount ring 19 to the light-shielding member 28, but since the heat-insulating member 29 provides insulation between the light-shielding member 28 and the first heat-transfer portion 25a of the Peltier element 25, the heat transferred from the mount ring 19 to the light-shielding member 28 is not transferred to the first heat-transfer portion 25a.

[0062] In this way, in the device body 3, the light blocking member 28 and the first heat transfer section 25a are insulated by the heat insulating member 29, so that the heat transferred to the light blocking member 28 is not transferred to the first heat transfer section 25a, thereby improving the transfer efficiency from the light blocking member 28 to the interchangeable lens 2.

[0063] In addition, in the device main body 3, the heat insulating member 29 also provides insulation between the light blocking member 28 and the holding frame 23, so that heat transferred from the mount ring 19 to the light blocking member 28 is not transferred to the holding frame 23.

[0064] In this way, in the imaging device 1, the holding frame 23 and the light-shielding member 28 are insulated by the insulating member 29, so that heat transferred to the light-shielding member 28 is not transferred to the holding frame 23, thereby further improving the efficiency of transfer from the light-shielding member 28 to the interchangeable lens 2.

[0065] Furthermore, in the imaging device 1, as described above, a plurality of Peltier elements 25 are arranged spaced apart in the circumferential direction of the mount ring 19.

[0066] Therefore, heat is transferred from the first heat transfer portion 25a to the second heat transfer portion 25b at multiple positions around the circumferential direction of the mount ring 19, so that the amount of heat transferred from the device body 3 to the interchangeable lens 2 increases, thereby further improving the heat dissipation performance of the heat generated in the device body 3.

[0067] In particular, by attaching the Peltier elements 25, 25, 25 to the upper end and both left and right ends on the front surface of the holding frame 23, the Peltier elements 25, 25, 25 are positioned near the front exposed portion of the light blocking member 28 where the contact portion 27 is not attached. Therefore, the amount of heat transferred to the mount ring 19 that is transferred to the light blocking member 28 increases, and the amount of heat transferred by radiation from the light blocking member 28 to the opposing portion 7b of the anti-reflection member 7 increases, thereby further improving the heat dissipation efficiency.

[0068] Furthermore, when the interchangeable lens 2 is attached to the device body 3 between the mount ring 19 and the holding frame 23, a plurality of biasing springs 24 are arranged spaced apart around the circumferential direction of the mount ring 19 to press the lens mount 8 against the mount ring 19, and a Peltier element 25 is positioned between the plurality of biasing springs 24.

[0069] Therefore, since the Peltier elements 25 and the springs 24 are arranged alternately in the circumferential direction of the mount ring 19, the Peltier elements 25 do not interfere with the springs 24, and the size can be reduced by making effective use of space, while improving the heat dissipation performance of the heat generated in the device main body 3.

[0070] <Heat dissipation according to the type of interchangeable lens, etc.> Next, an example of changing the heat dissipation mode depending on the type of interchangeable lens 2 will be described with reference to a flowchart (see FIG. 6).

[0071] (A) An attachment object including an interchangeable lens is attached to the device body.

[0072] (B) When the attachment target is attached to the device body, the device body reads the ID (Identification) of the attachment target.

[0073] (C) The attachment target is identified based on the ID read by the device body.

[0074] (D) Examples of attachment targets that can be identified include a genuine interchangeable lens for the device body (D1), an interchangeable lens that is not a genuine product for the device body but meets the specifications for the device body (D2), an interchangeable lens that is not a genuine product for the device body and does not meet the specifications for the device body (D3), and a lens that is not a genuine attachment target for the device body (D2). A lens that is not a genuine attachment target for the device body includes a lens that is not an interchangeable lens, and is one in which the ID is not recognized.

[0075] (E) If the attachment target is a genuine interchangeable lens (D1), proceed to the next step (F). If the attachment target is an interchangeable lens that meets the specifications for the device body (D2), a constant current is supplied to the Peltier element, but if the attachment target is an interchangeable lens that does not meet the specifications for the device body (D3) or if the attachment target is not one that can be attached to the device body originally (D2), no current is supplied to the Peltier element and the Peltier element remains in a non-driven state.

[0076] (F) The type of interchangeable lens is identified in the device body based on the ID read in (C).

[0077] (G) Interchangeable lenses whose type is specified include, for example, a first type (G1) that requires a high thermal conductivity in the Peltier element, a second type (G2) that requires a medium thermal conductivity in the Peltier element, and a third type (G3) that requires a low thermal conductivity in the Peltier element.

[0078] (H) In the case of the first type (G1), a large current is supplied to the Peltier element, bringing the Peltier element into a state of high thermal conductivity; in the case of the second type (G2), a medium current is supplied to the Peltier element, bringing the Peltier element into a state of medium thermal conductivity; and in the case of the third type (G3), a small current is supplied to the Peltier element, bringing the Peltier element into a state of low thermal conductivity.

[0079] As described above, by switching the heat conduction state in the Peltier element 25 depending on the type of interchangeable lens 2 attached to the device body 3, it is possible to change the amount of heat transferred by the Peltier element 25 depending on the type of interchangeable lens 2 attached to the device body 3. Therefore, it is possible to ensure optimal heat dissipation performance depending on the type of interchangeable lens 2 attached to the device body 3, and by supplying a current amount to the Peltier element 25 as needed, it is possible to reduce power consumption by suppressing the supply of unnecessary current.

[0080] Furthermore, by specifying the attachment object to be attached to the device main body 3 and switching the heat conduction state of the Peltier element 25, it becomes possible to supply current to the Peltier element 25 as needed and adjust the amount of current according to the specified interchangeable lens 2, thereby ensuring optimal heat dissipation performance for each interchangeable lens 2 while reducing power consumption.

[0081] Note that the imaging device 1 may be configured, for example, so that the heat conduction state of the Peltier element 25 can be switched depending on the mode set in the device body 3. For example, in the shooting state, a large amount of heat is generated from the imaging element 21, etc., and a large amount of heat is generated from the entire device body 3, so that the amount of heat generated in the device body 3 in the shooting state is greater than that in the state in which the captured image is played back on the display.

[0082] Therefore, for example, when the shooting mode is set, the Peltier element 25 may be set to a conduction state in which the amount of heat conducted is greatest, and when a mode other than the shooting mode is set, the Peltier element 25 may be set to a conduction state in which the amount of heat conducted is least.

[0083] By switching in this manner, it becomes possible to change the amount of heat conducted by the Peltier element 25 according to the mode set in the device main body 3, thereby ensuring optimal heat dissipation performance according to the type of mode set in the device main body 3.

[0084] Furthermore, in the imaging device 1, a switching operation unit that switches the heat conduction state in the Peltier element 25 may be provided as one of the operation units .

[0085] By providing such a switching operation unit, the heat conduction state in the Peltier element 25 is switched in response to operation of the switching operation unit, so that the heat dissipation state from the device body 3 is changed in response to the usage state of the imaging device 1, thereby improving the usability of the imaging device 1 for the user.

[0086] <Summary> As described above, the imaging device 1 is provided with a Peltier element 25 having a first heat transfer section 25a and a second heat transfer section 25b, enabling heat transfer between the first heat transfer section 25a and the second heat transfer section 25b, with the holding frame 23 in contact with the first heat transfer section 25a and the mount ring 19 in contact with the second heat transfer section 25b, and enabling the heat conduction state to be switched, and when the interchangeable lens 2 is attached to the device body 3, the heat conduction state in the Peltier element 25 is switched to a state in which heat is transferred from the first heat transfer section 25a to the second heat transfer section 25b.

[0087] Therefore, when the interchangeable lens 2 is attached to the device body 3, the heat conduction state of the Peltier element 25 is switched, and the heat generated in the image sensor 21 is transmitted by the Peltier element 25 from the holding frame 23 via the mount ring 19 to the interchangeable lens 2 and then released to the outside from the interchangeable lens 2.

[0088] As a result, when the imaging element 21 is in an operating state, such as when the imaging device 1 is taking a picture, the outer casing 13 of the device body 3 does not become hot, and the heat generated in the imaging element 21 is unlikely to be transmitted to the photographer holding the device body 3, particularly the photographer holding the grip portion 16, making it possible for the photographer to use the imaging device 1 without feeling any discomfort, and improving heat dissipation efficiency while ensuring a good usability.

[0089] Furthermore, the interchangeable lens 2 does not have a heat source that generates a large amount of heat, and is therefore kept at a lower temperature than the device main body 3. In addition, the outer tube 4 has a large surface area and a large heat dissipation area, so that the heat generated in the device main body 3 is transferred to the interchangeable lens 2 and released from the interchangeable lens 2 to the outside, thereby ensuring high heat dissipation efficiency.

[0090] Furthermore, since the outer casing 13 is in contact with the first heat transfer portion 25a of the Peltier element 25, when the interchangeable lens 2 is attached to the device body 3, heat is transferred from the outer casing 13 to the interchangeable lens 2 via the mount ring 19 by the Peltier element 25, thereby further improving the heat dissipation performance of the heat generated in the device body 3.

[0091] <Other> While the above example shows the lens mount 8 of the interchangeable lens 2 being attached to the mount section 17 of the device body 3, there are cases in the imaging device 1 where the interchangeable lens 2 is attached to the device body 3 via an adapter 50 (see FIG. 7). In this case, the lens mount provided at the rear end of the adapter 50 is attached to the mount section 17, and the attached section 30 provided at the rear end of the interchangeable lens 2 is attached to the attachment section 51 provided at the front end of the adapter 50.

[0092] In such a configuration, the mounting portion 51 of the adapter 50 and the mounted portion 30 of the interchangeable lens 2 require high strength, and so are often both formed from metal materials. By providing the adapter 50 with a heat transfer path that transfers heat transferred to the mount ring 19 of the device body 3 to the mounting portion 51, it is possible to ensure high heat dissipation performance.

[0093] By providing a heat transfer path that transfers heat transferred to the mount ring 19 to the attachment portion 51, the heat is transferred from the attachment portion 51 to the attachment receiving portion 30 and then released to the outside from the outer tube 4 of the interchangeable lens 2. Therefore, just as in the case where the interchangeable lens 2 is attached to the device body 3 without the adapter 50, it is possible to improve heat dissipation efficiency while ensuring a good usability of the imaging device 1.

[0094] Furthermore, heat can also be dissipated using the Peltier element 25 in a so-called retractable imaging device 1A in which the lens barrel 40 can be extended for zooming or the like (see FIGS. 8 to 10).

[0095] In the imaging device 1A, for example, a lens barrel 40 is composed of a first barrel portion 41 and a second barrel portion 42, and the first barrel portion 41 can be extended relative to a barrel support portion 43, and the second barrel portion 42 can be extended relative to the first barrel portion 41 (see FIGS. 8 and 9). The outer peripheries of the first barrel portion 41 and the second barrel portion 42 are formed, for example, from a metal material.

[0096] The lens barrel support 43 is formed, for example, from a metal material and has a plate-shaped base surface 43a facing the front-rear direction and a cylindrical tubular portion 43b protruding forward from the outer periphery of the base surface 43a, with the image sensor 21 attached to the center of the base surface 43a. Peltier elements 25, 25, ... are attached to the tubular portion 43b of the lens barrel support 43, for example, near the front end, with the Peltier elements 25, 25, ... spaced apart in the circumferential direction.

[0097] In this configuration, first barrel section 41 is in surface contact with Peltier element 25 in both a stored state where it is located inside barrel support section 43 and an extended stored state where it is extended from barrel support section 43. Therefore, heat generated in device body 3A, particularly heat generated in image sensor 21, is transferred from barrel support section 43 to lens barrel 40 by Peltier element 25 and released to the outside in both the stored state and the extended state, thereby improving heat dissipation efficiency while ensuring a good usability.

[0098] In the imaging device 1A, Peltier elements 25, 25, . . . may be attached to the base surface portion 43a at positions around the imaging element 21, spaced apart from each other in the circumferential direction (see FIG. 10).

[0099] In such a configuration, heat generated in the device main body 3A, particularly heat generated in the image sensor 21, is transferred by radiation from the Peltier element 25 to the first lens barrel portion 41 and then released to the outside from the lens barrel 40, thereby improving heat dissipation efficiency while ensuring a good usability.

[0100] In the above, an example of a Peltier element 25 is shown as a conduction state switching unit that can switch the heat conduction state (transfer direction) depending on the direction of the supplied current, but the conduction state switching unit may be a means other than the Peltier element 25.

[0101] <One embodiment of the imaging device> An example of the configuration of an embodiment of an imaging device according to the present technology will be described below (see FIG. 11).

[0102] An interchangeable lens 2 having a camera block 90 that performs an imaging function is attached to the imaging device 100 (imaging device 1, imaging device 1A). If the imaging device 100 has a lens barrel 40, the camera block 90 is provided in the imaging device 100.

[0103] The imaging device 100 has a camera signal processing unit 91 that performs signal processing such as analog-to-digital conversion of captured image signals, and an image processing unit 92 that performs recording and playback processing of image signals. The imaging device 100 also has a display unit 93 that displays captured images, etc., an R / W (reader / writer) 94 that writes and reads image signals to and from a memory 99, a CPU (Central Processing Unit) 95 that controls the entire imaging device 100, and a memory block 96 that controls the entire imaging device 100. The camera includes a lens drive control unit 96 that controls the drive of the attached lens, and an operation unit 97 including various switches and the like that are operated by the user as required.

[0104] The imaging device 100 is provided with an imaging element 98 such as a CCD or CMOS that converts an optical image captured by the camera block 90 into an electrical signal.

[0105] The camera signal processing unit 91 performs various signal processing on the output signal from the image sensor 98, such as converting it into a digital signal, removing noise, correcting image quality, and converting it into a luminance and color difference signal.

[0106] The image processing unit 92 performs processes such as compression encoding, decompression decoding of image signals based on a predetermined image data format, and conversion of data specifications such as resolution.

[0107] The display unit 93 has a function of displaying various data such as the operating status of the user on the operation unit 97 and captured images. Note that the imaging device 100 does not necessarily have to be provided with the display unit 93, and may be configured so that captured image data is sent to another display device and the image is displayed thereon.

[0108] The R / W 94 writes image data encoded by the image processing unit 92 into the memory 99 and reads image data recorded in the memory 99 .

[0109] The CPU 95 functions as a control processing unit that controls each circuit block provided in the imaging device 100, and controls each circuit block based on an instruction input signal from an operation unit 97, etc.

[0110] The lens drive control unit 96 controls the drive source that moves the lens based on a control signal from the CPU 95 .

[0111] The operation unit 97 outputs to the CPU 95 an instruction input signal in response to an operation by the user.

[0112] The memory 99 is, for example, a semiconductor memory that is detachable from a slot connected to the R / W 94 or a semiconductor memory that is pre-installed inside the imaging device 100.

[0113] The operation of the imaging device 100 will be described below.

[0114] In a standby state for photographing, a photographed image signal is output to the display unit 93 via the camera signal processing unit 91 under the control of the CPU 95, and is displayed as a camera-through image. Furthermore, when an instruction input signal is input from the operation unit 97, the CPU 95 outputs a control signal to the lens drive control unit 96, and the lens is moved under the control of the lens drive control unit 96.

[0115] When a photographing operation is performed in response to an instruction input signal from the operation unit 97, the photographed image signal is output from the camera signal processing unit 91 to the image processing unit 92, where it is compressed and encoded and converted into digital data in a predetermined data format. The converted data is output to the R / W 94 and written to the memory 99.

[0116] When image data recorded in memory 99 is to be reproduced, predetermined image data is read from memory 99 by R / W 94 in response to an operation on operation unit 97, and after expansion and decoding processing is performed by image processing unit 92, the reproduced image signal is output to display unit 93 and the reproduced image is displayed.

[0117] In this technology, "imaging" refers to a process that includes only a part or all of a series of processes, from a photoelectric conversion process that converts light captured by the imaging element 98 into an electrical signal, to a process by the camera signal processing unit 91 that converts the output signal from the imaging element 98 into a digital signal, noise removal, image quality correction, conversion into luminance and color difference signals, etc., to a compression / encoding / decompression / decoding process of the image signal based on a predetermined image data format and a conversion process of data specifications such as resolution, etc., by the image processing unit 92, and a process of writing the image signal to the memory 99 by the R / W 94.

[0118] That is, "imaging" may refer only to the photoelectric conversion process of converting the light captured by the image sensor 98 into an electrical signal, or may refer to the process from the photoelectric conversion process of converting the light captured by the image sensor 98 into an electrical signal to the process of converting the output signal from the image sensor 98 into a digital signal by the camera signal processing unit 91, noise removal, image quality correction, conversion into luminance and color difference signals, etc. ... to the process of converting the output signal from the image sensor 98 into an electrical signal by the image processing unit 92. It may also refer to the processes from the photoelectric conversion process of converting the light captured by the image sensor 98 into an electrical signal to the camera signal processing unit 91 converting the output signal from the image sensor 98 into a digital signal, noise removal, image quality correction, conversion into luminance and color difference signals, etc., to the compression coding, expansion decoding process of the image signal based on a predetermined image data format and conversion of data specifications such as resolution by the image processing unit 92, and it may also refer to the process of writing the image signal to the memory 99 by the R / W 94.

[0119] In the above processes, the order of the processes may be changed as appropriate.

[0120] In addition, in the present technology, the camera block 90 and the imaging device 100 may be configured to include only some or all of the imaging element 98, camera signal processing unit 91, image processing unit 92, and R / W 94 that perform the above processing.

[0121] Furthermore, the camera block 90 may be configured to include some of the imaging element 98, the camera signal processing unit 91, the image processing unit 92, and the R / W 94.

[0122] <This technology> The present technology can also be configured as follows.

[0123] (1) a device body to which an interchangeable lens having a lens mount is detachably attached; The device body includes: a mount ring with which the lens mount is engaged when the interchangeable lens is attached; a sensor unit having an imaging element; a holding frame for holding the element unit; a Peltier element having a first heat transfer portion and a second heat transfer portion capable of conducting heat, the holding frame being in contact with the first heat transfer portion and the mount ring being in contact with the second heat transfer portion, and the heat conduction state being switchable; When the interchangeable lens is attached to the device body, the heat conduction state of the Peltier element is switched to a state in which heat is transferred from the first heat transfer portion to the second heat transfer portion. Imaging device.

[0124] (2) The interchangeable lens is provided with an anti-reflection member that prevents light reflection, a light-shielding member that is in contact with the second heat transfer portion and at least a portion of which faces the anti-reflection member; The imaging device according to (1) above.

[0125] (3) A heat insulating member is provided between the light blocking member and the first heat transfer portion. The imaging device according to (2) above.

[0126] (4) The heat insulating member insulates the holding frame from the light blocking member. The imaging device according to (3) above.

[0127] (5) The device main body is provided with an outer casing in which at least predetermined components are arranged, The outer casing is in contact with the first heat transfer portion. The imaging device according to any one of (1) to (4).

[0128] (6) A heat insulating member is provided between the outer casing and the second heat transfer portion. The imaging device according to (5) above.

[0129] (7) The heat conduction state of the Peltier element is switched depending on the type of the interchangeable lens attached to the device body. The imaging device according to any one of (1) to (6).

[0130] (8) The heat conduction state of the Peltier element is switched depending on the mode set in the device body. The imaging device according to any one of (1) to (7).

[0131] (9) A plurality of the Peltier elements are arranged at intervals in the circumferential direction of the mount ring. The imaging device according to any one of (1) to (8).

[0132] (10) a plurality of biasing springs are arranged at intervals in the circumferential direction of the mount ring between the mount ring and the holding frame, the biasing springs pressing the lens mount against the mount ring when the interchangeable lens is attached to the device body; The Peltier element is positioned between the plurality of biasing springs. The imaging device according to (9) above.

[0133] (11) A switching operation unit is provided to switch the heat conduction state of the Peltier element. The imaging device according to any one of (1) to (10).

[0134] (12) an interchangeable lens having a lens mount and a device body to which the interchangeable lens is detachably attached; The device body includes: a mount ring with which the lens mount is engaged when the interchangeable lens is attached; a sensor unit having an imaging element; a holding frame for holding the element unit; a Peltier element having a first heat transfer portion and a second heat transfer portion capable of conducting heat, the holding frame being in contact with the first heat transfer portion and the mount ring being in contact with the second heat transfer portion, and the heat conduction state being switchable; When the interchangeable lens is attached to the device body, the heat conduction state of the Peltier element is switched to a state in which heat is transferred from the first heat transfer portion to the second heat transfer portion. Imaging device. [Explanation of symbols]

[0135] 1. Imaging device 2 Interchangeable lenses 3. Device body 7 Anti-reflective material 8 Lens Mount 13 Outer casing 19 Mount ring 20 element units 21 Image sensor 23 Retaining Frame 24 bias spring 25 Peltier element 25a First heat transfer section 25b Second heat transfer section 26 Heat insulating material 28 Light blocking material 29 Heat insulating materials 98 Image sensor 100 Imaging device

Claims

1. a device body to which an interchangeable lens having a lens mount is detachably attached; The device body includes: a mount ring with which the lens mount is engaged when the interchangeable lens is attached; a sensor unit having an imaging element; a holding frame for holding the element unit; a Peltier element having a first heat transfer portion and a second heat transfer portion capable of conducting heat, the holding frame being in contact with the first heat transfer portion and the mount ring being in contact with the second heat transfer portion, and the heat conduction state being switchable; a heat conduction state of the Peltier element is switched to a state in which heat is transferred from the first heat transfer portion to the second heat transfer portion when the interchangeable lens is attached to the device body; The interchangeable lens is provided with an anti-reflection member that prevents light reflection, a light-shielding member that is in contact with the second heat transfer portion and at least a portion of which faces the anti-reflection member; Imaging device.

2. A heat insulating member is provided between the light blocking member and the first heat transfer portion. The imaging device according to claim 1 .

3. The heat insulating member insulates the holding frame from the light blocking member. The imaging device according to claim 2 .

4. The device main body is provided with an outer casing in which at least predetermined components are arranged, The outer casing is in contact with the first heat transfer portion. The imaging device according to claim 1 .

5. A heat insulating member is provided between the outer casing and the second heat transfer portion. The imaging device according to claim 4 .

6. The heat conduction state of the Peltier element is switched depending on the type of the interchangeable lens attached to the device body. The imaging device according to claim 1 .

7. The heat conduction state of the Peltier element is switched depending on the mode set in the device body. The imaging device according to claim 1 .

8. A plurality of the Peltier elements are arranged at intervals in the circumferential direction of the mount ring. The imaging device according to claim 1 .

9. a plurality of biasing springs are arranged at intervals in the circumferential direction of the mount ring between the mount ring and the holding frame, the biasing springs pressing the lens mount against the mount ring when the interchangeable lens is attached to the device body; The Peltier element is positioned between the plurality of biasing springs. The imaging device according to claim 8 .

10. A switching operation unit is provided to switch the heat conduction state of the Peltier element. The imaging device according to claim 1 .

11. an interchangeable lens having a lens mount and a device body to which the interchangeable lens is detachably attached; The device body includes: a mount ring with which the lens mount is engaged when the interchangeable lens is attached; a sensor unit having an imaging element; a holding frame for holding the element unit; a Peltier element having a first heat transfer portion and a second heat transfer portion capable of conducting heat, the holding frame being in contact with the first heat transfer portion and the mount ring being in contact with the second heat transfer portion, and the heat conduction state being switchable; a heat conduction state of the Peltier element is switched to a state in which heat is transferred from the first heat transfer portion to the second heat transfer portion when the interchangeable lens is attached to the device body; The interchangeable lens is provided with an anti-reflection member that prevents light reflection, a light-shielding member that is in contact with the second heat transfer portion and at least a portion of which faces the anti-reflection member; Imaging device.

Images