Data creation device and component mounting system

Abstract

To provide a data creation device and a component mounting system that can appropriately set groups of suction components to be simultaneously suctioned by taking into account the positional relationship with surrounding components when mounting the suction components on a substrate that are simultaneously suctioned by multiple suction nozzles.SOLUTION: A control unit (32) of a data creation device (3) creates a plurality of simultaneous suction groups (GN) indicating groups of suction components that are simultaneously suctioned by a plurality of suction nozzles (25 N). The control unit (32) determines whether the positional relationship between each suction component belonging to the simultaneous suction group (GN) and the surrounding component on the substrate is a predetermined closely adjacent positional relationship. Then, the control unit (32) selects a registered group included in the registered data from among the remaining simultaneous suction groups after excluding a specific simultaneous suction group that satisfies a predetermined exclusion condition from among the plurality of simultaneous suction groups (GN).SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a data creation device that creates data related to the control of a component mounter, and a component mounting system that includes the same. [Background technology]

[0002] As disclosed in Patent Document 1, a component mounter is known that simultaneously picks up components supplied by a component supply unit using multiple suction nozzles and mounts each of the components picked up by the multiple suction nozzles onto a board. The component mounter disclosed in Patent Document 1 calculates the positional relationship between the components and the suction nozzles when simultaneously picking up the components based on the external shape of each of the components to be picked up simultaneously. This makes it possible to simultaneously pick up components using multiple suction nozzles that each have an appropriate positional relationship with the components. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-121761 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the positional relationship on the board between components picked up simultaneously by multiple suction nozzles and the surrounding components placed around the picked up components may be a closely spaced relationship between the picked up components and the surrounding components. In this case, depending on the amount of deviation in the pickup positions of the simultaneously picked up components relative to the suction nozzles, there is a risk of interference between the suction nozzles and the surrounding components when the picked up components picked up by the suction nozzles are placed on the board. Conventionally, when components are picked up simultaneously by multiple suction nozzles, the closely spaced relationship between the picked up components and the surrounding components on the board has not necessarily been taken into consideration. Therefore, there is room for improvement in appropriately setting groups of simultaneously picked up components, taking into account their positional relationship with the surrounding components when placing them on the board.

[0005] An object of the present invention is to provide a data creation device and a component mounting system that can appropriately set groups of components to be simultaneously picked up by multiple suction nozzles, taking into account their positional relationships with surrounding components when mounting the components on a board. [Means for solving the problem]

[0006] According to one aspect of the present invention, a data creation device creates registration data as part of component pickup and placement data for controlling a component mounter having a component supply unit that supplies components to each of a plurality of component supply positions and a head unit including a plurality of suction nozzles that pick up each of the components supplied to the plurality of component supply positions and place the picked up components on a board, the data creation device including a control unit that performs processing to create the registration data. The control unit performs the following processing to create a plurality of simultaneous pickup groups, each representing a group of at least two components that are picked up simultaneously by the plurality of suction nozzles for each of the components supplied to the plurality of component supply positions; a determination process to determine, for each of the plurality of simultaneous pickup groups, whether each of the simultaneous pickup groups satisfies a predetermined close-adjacent positional relationship on the board between each of the simultaneous pickup groups and surrounding components mounted around each of the simultaneous pickup groups; and a selection process to select a registration group to be included in the registration data from the remaining simultaneous pickup groups, excluding a specific simultaneous pickup group that satisfies a predetermined exclusion condition based on the determination result of the determination process.

[0007] According to this data creation device, the control unit creates multiple simultaneous pickup groups representing groups of components simultaneously picked up by multiple pickup nozzles. The control unit also determines, for each simultaneous pickup group, whether the positional relationship between each pickup component and its surrounding components on the board satisfies a predetermined close-adjacent relationship. The control unit then selects a registered group to be registered in component pickup placement data related to control of the component mounter from the remaining simultaneous pickup groups, excluding specific simultaneous pickup groups that satisfy a predetermined exclusion condition based on the determination result regarding the positional relationship between each pickup component and its surrounding components on the board. This allows for appropriate simultaneous pickup groups to be included in the registration data for component pickup placement data, taking into account whether the positional relationship between pickup components simultaneously picked up by multiple pickup nozzles and their surrounding components when placed on the board satisfies a close-adjacent relationship.

[0008] Furthermore, the simultaneous pickup group selected as a registered group included in the registered data that is part of the component pickup placement data is a group that takes into consideration whether each pickup component simultaneously picked up by multiple pickup nozzles will be in a closely adjacent positional relationship with surrounding components on the board, thereby reducing the risk of interference between the pickup nozzles and surrounding components due to the closely adjacent positional relationship when each pickup component belonging to the selected simultaneous pickup group is placed on the board by the pickup nozzles.

[0009] In the above-mentioned data creation device, the control unit may recognize a simultaneous pickup group in which the number of components determined to be in the closely adjacent positional relationship corresponding to each pickup component in the selection process is equal to or greater than a predetermined number as the specific simultaneous pickup group that satisfies the exclusion condition.

[0010] In this aspect, specific simultaneous pickup groups in which the number of pickup components that are closely adjacent to surrounding components on the board is equal to or exceeds a predetermined number can be excluded from the selection candidates when selecting a registration group to be registered in the component pickup and placement data.

[0011] In the above-mentioned data creation device, the control unit may, in the judgment process, calculate a nozzle prediction range indicating the predicted range of the suction nozzle when each of the pickup components is placed on the board, and calculate a surrounding component prediction range indicating the predicted range of the surrounding components on the board, and may determine that each of the pickup components and the surrounding components are in the closely adjacent positional relationship when the nozzle prediction range and the surrounding component prediction range overlap.

[0012] In this aspect, the control unit can determine whether each pickup component belonging to a simultaneous pickup group will be in a closely adjacent positional relationship with its surrounding components on the board based on the nozzle prediction range and the surrounding component prediction range. Here, the nozzle prediction range indicates the predicted range of the pickup nozzles when each pickup component simultaneously picked up by the multiple pickup nozzles is placed on the board, and the surrounding component prediction range indicates the predicted range of the surrounding components on the board. If the nozzle prediction range and the surrounding component prediction range overlap, it is predicted that each pickup component belonging to a simultaneous pickup group will be in a closely adjacent positional relationship with its surrounding components on the board to the extent that there is a risk of interference between the pickup nozzles and the surrounding components. That is, the control unit can determine whether a closely adjacent positional relationship will be established based on the nozzle prediction range and the surrounding component prediction range, using the risk of interference between the pickup nozzles and the surrounding components as an indicator.

[0013] In the data creation device, the control unit may perform an acquisition process to acquire component size data indicating the size of the component, pickup range data indicating the range within which the pickup nozzle can pick up components, nozzle size data indicating the size of the pickup nozzle, and mounting deviation tolerance data indicating the allowable range of deviation in the mounting position of the component on the board. In this case, the control unit calculates the nozzle prediction range and the surrounding component prediction range in the determination process based on the data acquired by the acquisition process.

[0014] In this embodiment, the control unit can accurately calculate the predicted nozzle range based on the component size data, pickup range data, and mounting deviation tolerance data for each pickup component belonging to the simultaneous pickup group, and the nozzle size data for the pickup nozzles that simultaneously pick up each pickup component.The control unit can also accurately calculate the predicted surrounding component range based on the component size data and mounting deviation tolerance data for the surrounding components.

[0015] In the data creation device, the control unit may select the registered group from the remaining simultaneous pickup groups in the selection process based on a predetermined evaluation value relating to the mounting efficiency of each pickup component on the board.

[0016] In this aspect, the control unit can select a simultaneous pickup group as a registered group included in the registered data that is part of the component pickup placement data, taking into account an evaluation value regarding the placement efficiency when each pickup component that is simultaneously picked up by multiple suction nozzles is placed on a board.

[0017] A component mounting system according to another aspect of the present invention includes a component mounter having a component supply unit that supplies components to each of a plurality of component supply positions, and a head unit that includes a plurality of suction nozzles that pick up each of the components supplied to the plurality of component supply positions and mount the picked-up components on a board, and the above-mentioned data creation device that creates registration data to be registered in component suction and mounting data related to control of the component mounter.

[0018] According to this component mounting system, the mounter is controlled based on the registered component pickup placement data created by the data creation device. The registered data includes information about simultaneous pickup groups that indicate groups of components to be simultaneously picked up by multiple pickup nozzles. Therefore, for each component belonging to a simultaneous pickup group, the mounter can simultaneously pick up components supplied by the component supply unit using multiple pickup nozzles, and place each component picked up by the multiple pickup nozzles onto a board. [Effects of the Invention]

[0019] As described above, according to the present invention, it is possible to provide a data creation device and a component mounting system that can appropriately set groups of components to be simultaneously picked up by multiple suction nozzles, taking into account their positional relationships with surrounding components when the components are mounted on a board. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a block diagram of a component mounting system to which a data creation device according to an embodiment of the present invention is applied; [Figure 2] 2 is a plan view showing the configuration of a mounter body of a component mounter provided in the component mounting system. FIG. [Figure 3] FIG. 2 is an enlarged front view showing a head unit provided in the mounting machine main body. [Figure 4] 10A and 10B are diagrams illustrating a component suction process and a component mounting process when a mounting control unit of a component mounter controls a head unit. [Figure 5] 10 is a flowchart showing a processing flow performed by a control unit of the data creation device. [Figure 6] 10A and 10B are diagrams illustrating the processing contents of a group creation process, a determination process, and a selection process performed by a control unit of the data creation device. [Figure 7] 10A and 10B are diagrams illustrating a determination method in a determination process of a control unit of the data creation device. DETAILED DESCRIPTION OF THE INVENTION

[0021] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A data creation device and a component mounting system according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0022] [Overall configuration of component mounting system] As shown in Fig. 1, the component mounting system 1 includes a component mounter 2 and a data creation device 3. In the component mounting system 1, the component mounter 2 and the data creation device 3 are connected so that data can be communicated. The component mounter 2 produces electronic circuit boards on which components such as electronic components are mounted on a substrate such as a printed circuit board, based on component pickup and placement data D1 stored in a memory unit 2D. The data creation device 3 creates registration data D8 as part of the component pickup and placement data D1 related to the control of the component mounter 2.

[0023] [Component mounter configuration] The mounter 2 will be described with reference to Figs. 2 to 4 in addition to Fig. 1. Note that directional relationships will be described below using XY Cartesian coordinates that are orthogonal to each other on a horizontal plane. One side in the X-axis direction will be referred to as the "+X side," and the other side opposite to the one side in the X-axis direction will be referred to as the "-X side." Similarly, one side in the Y-axis direction will be referred to as the "+Y side," and the other side opposite to the one side in the Y-axis direction will be referred to as the "-Y side."

[0024] The component mounter 2 comprises a mounter main body 2A, a mount communication unit 2B, a mount control unit 2C, and a memory unit 2D. The mounter main body 2A constitutes the structural portion that performs the component pickup and placement operation. The mount communication unit 2B is an interface circuit that realizes communication with the data creation device 3. The memory unit 2D stores component pickup and placement data D1 that is referenced when the mounter main body 2A performs the component pickup and placement operation. The mount control unit 2C reads out the component pickup and placement data D1 stored in the memory unit 2D and controls the component pickup and placement operation of the mounter main body 2A based on the component pickup and placement data D1.

[0025] A solder paste pattern is printed on the board PP before the mounting machine main body 2A mounts components on the board PP on which the solder paste pattern has been printed by a printing device. As shown in FIG. 2, the mounting machine main body 2A includes a main body frame 21, a conveyor 23, a component supply unit 24, a head unit 25, and a board support unit 28.

[0026] The main body frame 21 is a structure on which the various components of the mounting machine main body 2A are arranged, and has a generally rectangular shape in a plan view seen from a direction (vertical direction) perpendicular to both the X-axis direction and the Y-axis direction. The conveyor 23 extends in the X-axis direction and is arranged on the main body frame 21. The conveyor 23 transports the board PP in the X-axis direction. The board PP transported on the conveyor 23 is positioned by the board support unit 28 at a predetermined work position (a component mounting position where components are mounted on the board PP). The board support unit 28 positions the board PP by supporting the board PP with push-up pins.

[0027] The component supply units 24 are arranged in regions on the +Y side and the -Y side of the main frame 21 in the Y-axis direction, with the conveyor 23 between them. The component supply units 24 supply components E0 to multiple component supply positions 24P (FIG. 4) aligned in the X-axis direction. Specifically, the component supply units 24 supply components E0 to each component supply position 24P using multiple feeders 24F aligned in the X-axis direction. The component supply unit 24 is defined with a set position for each feeder 24F for each component E0 to be picked up by a suction nozzle 25N of a mounting head 251 provided in the head unit 25 (described later). The feeders 24F are detachably attached to the component supply unit 24. There are no particular limitations on the feeders 24F as long as they can hold multiple components E0 and supply the held components E0 to the component supply positions 24P set within the feeders, and they may be, for example, tape feeders. The tape feeder is a feeder that has a reel on which a component storage tape that stores components E0 at predetermined intervals is wound, and is configured to supply components E0 by feeding the component storage tape from the reel. As long as the components E0 held by the feeder 24F are the same, for example, in the case of a tape feeder, as long as a reel on which a component storage tape that stores components E0 of the same type is wound is attached, the feeder 24F will supply the same type of components E0.

[0028] The head unit 25 is held by a moving frame 27. A fixed rail 261 extending in the Y-axis direction and a ball screw shaft 262 rotated by a Y-axis servo motor 263 are arranged on the main body frame 21. The moving frame 27 is placed on the fixed rail 261, and a nut portion 271 provided on the moving frame 27 is threadedly engaged with the ball screw shaft 262. The moving frame 27 also has a guide member 272 extending in the X-axis direction and a ball screw shaft 273 driven by an X-axis servo motor 274. The head unit 25 is movably held by the guide member 272, and a nut portion provided on the head unit 25 is threadedly engaged with the ball screw shaft 273. The moving frame 27 moves in the Y-axis direction due to operation of the Y-axis servo motor 263, and the head unit 25 moves in the X-axis direction relative to the moving frame 27 due to operation of the X-axis servo motor 274. That is, head unit 25 is movable in the Y-axis direction in conjunction with the movement of movable frame 27, and is also movable in the X-axis direction along movable frame 27. Head unit 25 is movable between component supply unit 24 and a predetermined working position for board PP transported by conveyor 23.

[0029] The head unit 25 includes multiple mounting heads 251 arranged in the X-axis direction. Each mounting head 251 has a suction nozzle 25N attached to its tip (lower end). That is, the head unit 25 has multiple suction nozzles 25N arranged in the X-axis direction. Each suction nozzle 25N picks up a component E0 supplied to each component supply position 24P by each feeder 24F arranged at each set position of the component supply unit 24, and places the picked-up component E1 at a target placement position AP on the board PP. Each suction nozzle 25N can be connected to a negative pressure generator, a positive pressure generator, or the atmosphere via an electric switching valve. That is, supplying negative pressure to each suction nozzle 25N enables the suction nozzle 25N to suction and hold the component E1, and then supplying positive pressure releases the suction and hold of the component E1.

[0030] The mounting head 251 can move up and down in the Z-axis direction (vertical direction) relative to the frame of the head unit 25, and can rotate around a head axis extending in the Z-axis direction. The mounting head 251 can move up and down along the Z-axis direction between a pickup position where the suction nozzle 25N can pick up the component E0 supplied to the component supply position 24P by the feeder 24F, and a retracted position above the pickup position. That is, when the suction nozzle 25N picks up the component E0 supplied to the component supply position 24P, the mounting head 251 moves down from the retracted position to the pickup position. When the mounting head 251 is positioned at the pickup position, the suction nozzle 25N picks up the component E0 supplied to the component supply position 24P. Meanwhile, with the component E1 picked up by the suction nozzle 25N, the mounting head 251 moves up from the pickup position to the retracted position. Furthermore, the mounting head 251 can move up and down along the Z-axis between the retracted position and a mountable position where the component E1 picked up by the suction nozzle 25N can be mounted at the target mount position AP on the substrate PP. That is, when mounting the component E1 picked up by the suction nozzle 25N on the substrate PP, the mounting head 251 moves down from the retracted position toward the mountable position. When the mounting head 251 is positioned at the mountable position, the suction nozzle 25N mounts the component E1 on the substrate PP.

[0031] Although the above description has been given of a structure in which head unit 25 is provided with a plurality of mounting heads 251 arranged in the X-axis direction, the structure of head unit 25 is not limited to this. Head unit 25 may have a so-called rotary head type structure in which a plurality of mounting heads 251 are arranged at predetermined intervals in the rotation direction on a rotating body that can rotate around an axis extending in the Z-axis direction.

[0032] As shown in FIG. 2, a first imaging unit 29A is installed on the main frame 21 between the component supply unit 24 and the conveyor 23. The first imaging unit 29A is an imaging camera equipped with an imaging element such as a CMOS (Complementary Metal-Oxide-Semiconductor) or a CCD (Charged-Coupled Device). While the head unit 25 moves from the component supply position 24P of the feeder 24F toward the work position of the board PP, the first imaging unit 29A captures an image of the component E1 picked up by the suction nozzle 25N from below, thereby acquiring a component image. The component image acquired by the first imaging unit 29A is input to the mounting control unit 2C.

[0033] A second imaging section 29B is also attached to the head unit 25. The second imaging section 29B is an imaging camera equipped with an imaging element such as a CMOS or CCD. The second imaging section 29B images marks and the like affixed to the top surface of the substrate PP transported by the conveyor 23 from above, and obtains a substrate recognition image for recognizing the substrate PP.

[0034] 1, the memory unit 2D stores component suction placement data D1. The component suction placement data D1 is data related to the control of the component mounter 2, which is referenced by the mounting control unit 2C when controlling the head unit 25. The component suction placement data D1 includes, for example, placement order data D2, component supply position data D3, component data D4, target placement position data D5, nozzle data D6, placement deviation tolerance data D7, and registration data D8.

[0035] The mounting order data D2 indicates the mounting order in which each pickup component E1 picked up by the multiple suction nozzles 25N is to be mounted on the target mounting position AP on the board PP. The component supply position data D3 indicates the position of each component supply position 24P for components E0 supplied by the multiple feeders 24F arranged in the component supply unit 24. The component data D4 indicates information about components to be mounted on the board PP, such as the components E0 supplied to each component supply position 24P, the pickup components E1 picked up from each component supply position 24P by the multiple suction nozzles 25N, and surrounding components E2 mounted around the pickup components E1 on the board PP. The component data D4 includes component type data D41 indicating the type of component, and component size data D42 indicating the size of the component, such as the outer dimensions of the component in the X-axis and Y-axis directions, and the height of the component in the Z-axis direction.

[0036] The target placement position data D5 is data indicating coordinate information regarding the target placement position AP of the component set on the board PP. The target placement position data D5 includes, for example, the coordinate X of the target placement position AP of the component in the X-axis direction on the board PP, and the coordinate Y of the target placement position AP of the component in the Y-axis direction on the board PP. The nozzle data D6 is data regarding the pickup nozzle 25N. The nozzle data D6 includes nozzle size data D61 and pickup possible range data D62. The nozzle size data D61 is data indicating the size of the outer dimensions of the pickup nozzle 25N extending in the X-axis and Y-axis directions when the pickup nozzle 25N is viewed in the axial direction of the pickup nozzle 25N (Z-axis direction). The pickup possible range data D62 is data indicating the range within which the pickup nozzle 25N can pick up a component. The placement deviation tolerance data D7 is data indicating the tolerance for the amount of deviation of the actual placement position (actual placement position) of the component on the board PP from the target placement position AP.

[0037] The registration data D8 is data created by the data creation device 3 (described later), and includes simultaneous pickup groups GN, which indicate groups of at least two pickup components E1 simultaneously picked up by multiple pickup nozzles 25N for each component supplied to multiple component supply positions 24P. Each pickup component E1 belonging to a simultaneous pickup group GN is associated with the pickup nozzle 25N that picks it up. The registration data D8 includes multiple simultaneous pickup groups GN so as to cover all components mounted on the circuit board PP. In other words, each component mounted on the circuit board PP belongs to one of the simultaneous pickup groups GN included in the registration data D8. The multiple simultaneous pickup groups GN included in the registration data D8 are divided into multiple sets according to the number of pickup nozzles 25N in the head unit 25. The total number of pickup components E1 belonging to the simultaneous pickup groups GN in one set is the same as the number of pickup nozzles 25N in the head unit 25. In other words, the sets of simultaneous pickup groups GN are set so that all pickup nozzles 25N in the head unit 25 are associated with each other.

[0038] The mounting control unit 2C is made up of a CPU (Central Processing Unit), a storage area such as an HDD (Hard Disk Drive) or flash memory that stores a control program, RAM (Random Access Memory) used as a work area for the CPU, etc. The mounting control unit 2C controls the operation of each of the constituent elements, including the head unit 25, of the mounting machine main body 2A by having the CPU execute the control program stored in the HDD or flash memory, and by referencing the component pickup and placement data D1 stored in the storage unit 2D.

[0039] The mounting control unit 2C controls the conveyance operation of the conveyor 23 to transport the board PP, and also controls the component supply operation of each of the plurality of feeders 24F arranged in the component supply unit 24.

[0040] Furthermore, the mounting control unit 2C controls the movement of the head unit 25 in the X-axis and Y-axis directions, the lifting and rotation of the mounting head 251, and the suction and release of the suction nozzle 25N, thereby controlling the component suction operation by the suction nozzle 25N and the component mounting operation onto the board PP. At this time, the mounting control unit 2C refers to the component suction mounting data D1.

[0041] [Head unit control by the implemented control unit] The control of head unit 25 by mounting control unit 2C will be described with reference to Fig. 4. Mounting control unit 2C performs component pickup process T1 and component placement process T2. Mounting control unit 2C repeats component pickup process T1 and component placement process T2 until all components have been placed on board PP.

[0042] (Parts suction processing) In the component pickup process T1, the mounting control unit 2C causes each of the multiple pickup nozzles 25N in the head unit 25 to pick up a component. Specifically, the mounting control unit 2C identifies the pickup component E1 to be picked up by the pickup nozzle 25N based on the component data D4, in accordance with the component mounting order on the board PP indicated by the mounting order data D2. At this time, the mounting control unit 2C identifies the simultaneous pickup group GN to which the pickup component E1 belongs based on the registration data D8. Of the multiple simultaneous pickup groups GN included in the registration data D8, the mounting control unit 2C identifies one set of simultaneous pickup groups GN corresponding to one component pickup process T1. Based on the component supply position data D3, the mounting control unit 2C identifies each component supply position 24P to which each pickup component E1 belonging to the simultaneous pickup group GN is supplied.

[0043] The mounting control unit 2C then controls the movement of the head unit 25 so that each suction nozzle 25N associated with each pickup component E1 belonging to the simultaneous pickup group GN is positioned above each identified component supply position 24P. Based on the pickup possible range data D62 included in the nozzle data D6, the mounting control unit 2C controls the movement of the head unit 25 so that each suction nozzle 25N is positioned above the component pickup possible range indicated by the pickup possible range data D62. When the head unit 25 arrives at a position where each suction nozzle 25N is positioned above each component supply position 24P, the mounting control unit 2C controls the lifting and rotating operations of the mounting head 251 to cause the suction nozzle 25N to pick up a component. The mounting control unit 2C controls the lifting and rotating operations of the mounting head 251 and the suction operations of the suction nozzles 25N so that each pickup component E1 belonging to the simultaneous pickup group GN is simultaneously picked up by the corresponding pickup nozzle 25N.

[0044] (Component mounting process) Once the pickup components E1 have been picked up by each of the multiple suction nozzles 25N in the head unit 25, the mounting control unit 2C performs the component mounting process T2. In the component mounting process T2, the mounting control unit 2C mounts each of the pickup components E1 picked up by the multiple suction nozzles 25N at a target mounting position AP on the board PP. Specifically, the mounting control unit 2C identifies the target mounting positions AP on the board PP at which each of the pickup components E1 picked up by the multiple suction nozzles 25N will be mounted, based on the target mounting position data D5. Then, the mounting control unit 2C controls the movement operation of the head unit 25 so that the suction nozzle 25N that has picked up the pickup component E1 to be mounted at the target mounting position AP is positioned above the identified target mounting position AP.

[0045] When the head unit 25 arrives at a position where the suction nozzle 25N that has picked up the picked-up component E1 is positioned above the target mounting position AP, the mounting control unit 2C controls the lifting and rotational movements of the mounting head 251 and controls the suction release operation of the suction nozzle 25N so that the picked-up component E1 picked up by the suction nozzle 25N is mounted at the target mounting position AP. At this time, the mounting control unit 2C controls the lifting and rotational movements of the mounting head 251 and the suction release operation of the suction nozzle 25N so that the amount of deviation of the actual mounting position of the picked-up component E1 on the board PP from the target mounting position AP falls within the tolerance range indicated by the mounting deviation tolerance data D7. As a result, each picked-up component E1 picked up by the multiple suction nozzles 25N is mounted at its respective target mounting position AP on the board PP.

[0046] 4, the positional relationship on the board PP between the components E1 simultaneously picked up by multiple suction nozzles 25N and the peripheral components E2 placed around the components E1 on the board PP may be such that the spacing between the components E1 and the peripheral components E2 is narrow. In this case, depending on the amount of deviation in the pickup positions of the simultaneously picked up components E1 relative to the suction nozzles 25N, there is a risk of interference between the suction nozzles 25N and the peripheral components E2 when the components E1 picked up by the suction nozzles 25N are placed on the board PP. For this reason, it is necessary to appropriately set a simultaneous pickup group GN, which indicates a group of simultaneously picked up components E1, taking into account the positional relationship of the components E1 simultaneously picked up by multiple suction nozzles 25N relative to the peripheral components E2 when they are placed on the board PP.

[0047] Therefore, as shown in FIG. 1, the component mounting system 1 according to this embodiment includes a data creation device 3.

[0048] [Data creation device configuration] The data creation device 3 will be described with reference to Fig. 1 as well as Fig. 5 to Fig. 7. The data creation device 3 is a device that creates registration data D8 including simultaneous pickup groups GN, which is part of component pickup mounting data D1 related to the control of the component mounter 2. As shown in Fig. 1, the data creation device 3 includes a communication unit 31 and a control unit 32.

[0049] The communication unit 31 is an interface circuit that realizes communication with the mounting communication unit 2B of the component mounter 2. The communication unit 31 can receive component pickup placement data D1 stored in the memory unit 2D of the component mounter 2 through data communication with the mounting communication unit 2B. The communication unit 31 also transmits registration data D8 including the simultaneous pickup group GN created by the control unit 32 of the data creation device 3 to the component mounter 2. When the mounting communication unit 2B receives the registration data D8 transmitted from the data creation device 3 in the component mounter 2, the registration data D8 is registered as part of the component pickup placement data D1 stored in the memory unit 2D.

[0050] The control unit 32 is composed of a CPU, a storage area such as a HDD or flash memory that stores a control program, and RAM used as a work area for the CPU. The control unit 32 performs each process of creating the registration data D8 by the CPU executing the control program stored in the HDD or flash memory. As shown in Fig. 5, the control unit 32 performs an acquisition process S1, a group creation process S2, a determination process S3, a selection process S4, and a registration process S5 as processes of creating the registration data D8.

[0051] (Acquisition process) In the acquisition process S1, the control unit 32 acquires the component suction placement data D1 from the component mounter 2 via the communication unit 31. The control unit 32 may acquire the component suction placement data D1 from a management device other than the component mounter 2. Furthermore, if the data creation device 3 is equipped with a storage unit, the control unit 32 may acquire the component suction placement data D1 from the storage unit.

[0052] (Group creation process) As shown in FIG. 6, in the group creation process S2, the control unit 32 creates multiple simultaneous pickup groups GN, each representing a group of at least two pickup components E1 simultaneously picked up by multiple pickup nozzles 25N, for each component supplied to multiple component supply positions 24P. Each pickup component E1 belonging to a simultaneous pickup group GN is associated with the pickup nozzle 25N that picks it up. The control unit 32 creates multiple simultaneous pickup groups GN based on various data, such as component supply position data D3, component data D4, and target placement position data D5, included in the component pickup placement data D1. In the example shown in FIG. 6, the control unit 32 creates three simultaneous pickup groups GN: simultaneous pickup groups GN1, GN2, and GN3. Simultaneous pickup group GN1 includes two pickup components E1, each associated with a pickup nozzle 25N1 and a pickup nozzle 25N3, respectively. Simultaneous pickup group GN2 includes two pickup components E1, each associated with a pickup nozzle 25N1 and a pickup nozzle 25N2, respectively. The simultaneous pickup group GN3 includes three pickup components E1, and each pickup component E1 is associated with a pickup nozzle 25N1, a pickup nozzle 25N3, and a pickup nozzle 25N5, respectively.

[0053] (Determination process) In the determination process S3, the control unit 32 determines, for each of the simultaneous pickup groups GN, whether each pickup component E1 and the surrounding components E2 mounted around each pickup component E1 on the board PP have a predetermined narrow adjacent relationship. In the example shown in Fig. 6, for simultaneous pickup group GN1, the control unit 32 determines that neither of the two pickup components E1 associated with pickup nozzle 25N1 and pickup nozzle 25N3 has a narrow adjacent relationship with the surrounding components E2. For simultaneous pickup group GN2, the control unit 32 determines that the pickup component E1 associated with pickup nozzle 25N1 does not have a narrow adjacent relationship with the surrounding components E2, and determines that the pickup component E1 associated with pickup nozzle 25N2 has a narrow adjacent relationship with the surrounding components E2. For simultaneous pickup group GN3, the control unit 32 determines that the pickup component E1 associated with pickup nozzle 25N1 is not in a closely adjacent positional relationship with the surrounding component E2, and determines that the two pickup components E1 associated with pickup nozzle 25N3 and pickup nozzle 25N5, respectively, are in a closely adjacent positional relationship with the surrounding component E2.

[0054] The determination process S3 of the control unit 32 will be described in detail with reference to Fig. 7. In the determination process S3, the control unit 32 calculates a predicted nozzle range AA indicating the predicted existence range of each pickup nozzle 25N associated with each pickup component E1 when each pickup component E1 belonging to the simultaneous pickup group GN is placed on the board PP, and also calculates a predicted surrounding component range BB indicating the predicted existence range of the surrounding components E2 on the board PP.

[0055] The control unit 32 calculates the predicted nozzle range AA and the predicted surrounding component range BB based on various data included in the component pickup placement data D1 acquired in the acquisition process S1. Specifically, when calculating the predicted nozzle range AA, the control unit 32 calculates a pickup component range AA1, which indicates the range of pickup component E1 centered on the target placement position AP indicated by the target placement position data D5 corresponding to the pickup component E1, based on the component size data D42 included in the component data D4 corresponding to each pickup component E1 belonging to the simultaneous pickup group GN. Furthermore, the control unit 32 calculates a placement deviation consideration range AA2, which indicates the range surrounding the pickup component range AA1 from the outside, based on the placement deviation tolerance data D7 corresponding to the pickup component E1, taking into account the allowable range of deviation of the actual placement position of the pickup component E1 on the board PP from the target placement position AP. The control unit 32 then calculates the predicted nozzle range AA, which indicates the predicted location of the pickup nozzle 25N, based on the nozzle size data D61 and pickup possible range data D62 included in the nozzle data D6 corresponding to the pickup component E1. In this way, the control unit 32 can accurately calculate the predicted nozzle range AA based on the various data included in the component pickup and placement data D1.

[0056] Meanwhile, when calculating the surrounding component prediction range BB, the control unit 32 calculates a surrounding component range BB1 ​​indicating the range of surrounding components E2 centered on the target placement position AP indicated by the target placement position data D5 corresponding to the surrounding component E2, based on the component size data D42 included in the component data D4 corresponding to the surrounding component E2. Then, based on the placement deviation tolerance data D7 corresponding to the surrounding component E2, the control unit 32 calculates a surrounding component prediction range BB indicating the predicted range of presence of the surrounding component E2 on the board PP, which is an area surrounding the surrounding component range BB1 ​​from the outside, taking into account the allowable range of deviation of the actual placement position of the surrounding component E2 on the board PP from the target placement position AP. In this way, the control unit 32 can accurately calculate the surrounding component prediction range BB based on various data included in the component pickup placement data D1.

[0057] After calculating the nozzle prediction range AA and the surrounding component prediction range BB, the control unit 32 determines whether the positional relationship on the board PP between each pickup component E1 and the surrounding components E2 belonging to the simultaneous pickup group GN is a close adjacent positional relationship, depending on whether the nozzle prediction range AA and the surrounding component prediction range BB overlap. As shown in FIG. 7, if the nozzle prediction range AA and the surrounding component prediction range BB do not overlap, the control unit 32 determines that the positional relationship on the board PP between each pickup component E1 and the surrounding components E2 is not a close adjacent positional relationship. On the other hand, if the nozzle prediction range AA and the surrounding component prediction range BB overlap, the control unit 32 determines that the positional relationship on the board PP between each pickup component E1 and the surrounding components E2 is a close adjacent positional relationship.

[0058] As described above, the predicted nozzle range AA indicates the predicted location range of each pickup nozzle 25N associated with each pickup component E1 when each pickup component E1 belonging to the simultaneous pickup group GN is placed on the circuit board PP. The predicted surrounding component range BB indicates the predicted location range of a surrounding component E2 on the circuit board PP. When the predicted nozzle range AA and the predicted surrounding component range BB overlap, it is predicted that each pickup component E1 belonging to the simultaneous pickup group GN will be positioned closely adjacent to the surrounding component E2 on the circuit board PP, to the extent that there is a risk of interference between the pickup nozzle 25N and the surrounding component E2. That is, the control unit 32 can determine whether a close adjacent relationship will be formed based on the predicted nozzle range AA and the predicted surrounding component range BB, using the risk of interference between the pickup nozzle 25N and the surrounding component E2 as an index.

[0059] (Selection process) After determining whether each pickup component E1 and the surrounding components E2 belonging to the simultaneous pickup group GN are closely adjacent to each other for each simultaneous pickup group GN, the control unit 32 performs a selection process S4. As shown in Fig. 6, in the selection process S4, the control unit 32 selects a simultaneous pickup group GN as a registered group included in the registered data D8 of the component pickup placement data D1 from the remaining simultaneous pickup groups GN created in the group creation process S2, excluding a specific simultaneous pickup group GN that satisfies a predetermined exclusion condition based on the determination result of the determination process S3. In the example shown in Fig. 6, the control unit 32 selects a simultaneous pickup group GN2 included in the registered data D8 of the component pickup placement data D1 from the remaining simultaneous pickup groups GN1 and GN2, excluding a specific simultaneous pickup group GN3 that satisfies the predetermined exclusion condition based on the determination result of the determination process S3, from the multiple simultaneous pickup groups GN1, GN2, and GN3.

[0060] Specifically, the control unit 32 recognizes a simultaneous pickup group GN in which the number of pickup components E1 determined to be in a closely adjacent positional relationship with each other in the simultaneous pickup group GN is a predetermined number (e.g., "2") or more as a specific simultaneous pickup group GN that satisfies the exclusion condition. In the example shown in Fig. 6, the control unit 32 recognizes the simultaneous pickup group GN3 in which the number of pickup components E1 determined to be in a closely adjacent positional relationship with each other in the simultaneous pickup group GN is a predetermined number (e.g., "2") or more as a specific simultaneous pickup group GN that satisfies the exclusion condition. This allows the specific simultaneous pickup group GN3 in which the number of pickup components E1 determined to be in a closely adjacent positional relationship with the surrounding components E2 on the board PP is a predetermined number (e.g., "2") or more to be excluded from the selection candidates when selecting a simultaneous pickup group GN as a registered group included in the registered data D8 that is part of the component pickup placement data D1.

[0061] The control unit 32 then selects the simultaneous pickup group GN2 included in the registered data D8 of the component pickup placement data D1 from the remaining simultaneous pickup groups GN1 and GN2, excluding a specific simultaneous pickup group GN3, based on a predetermined evaluation value EV related to the placement efficiency of each pickup component E1 on the board PP. The evaluation value EV related to placement efficiency can be, for example, the cycle time, which indicates the time required to place each pickup component E1 on the board PP. The control unit 32 can select the simultaneous pickup group GN as a registered group included in the registered data D8 of the component pickup placement data D1, taking into account the evaluation value EV related to the placement efficiency when each pickup component E1 simultaneously picked up by the multiple pickup nozzles 25N is placed on the board PP.

[0062] (Registration process) When the simultaneous pickup group GN is selected as a registered group included in the registered data D8 that is part of the component pickup placement data D1, the control unit 32 performs a registration process S5. In the registration process S5, the control unit 32 creates the registered data D8 by registering the simultaneous pickup group GN selected in the selection process S4 as part of the component pickup placement data D1.

[0063] 5, the control unit 32 determines whether registration of simultaneous pickup groups GN corresponding to all pickup nozzles 25N in the head unit 25 has been completed (step S6). If registration of simultaneous pickup groups GN corresponding to all pickup nozzles 25N has not been completed (NO in step S6), the control unit 32 repeats the group creation process S2, the determination process S3, the selection process S4, and the registration process S5 until sets of simultaneous pickup groups GN corresponding to all pickup nozzles 25N have been registered as registered data D8 in the component pickup placement data D1. Then, the control unit 32 repeats the process of registering sets of simultaneous pickup groups GN as registered data D8 in the component pickup placement data D1 until all components to be placed on the board PP have been covered.

[0064] As described above, in the data creation device 3 according to this embodiment, the control unit 32 creates multiple simultaneous pickup groups GN representing groups of pickup components E1 simultaneously picked up by multiple pickup nozzles 25N in the group creation process S2. Furthermore, in the determination process S3, the control unit 32 determines for each of the multiple simultaneous pickup groups GN whether the pickup components E1 and the surrounding components E2 belonging to the simultaneous pickup group GN satisfy a predetermined closely adjacent positional relationship on the board PP. Then, in the selection process S4, the control unit 32 selects a simultaneous pickup group GN as a registered group included in the registration data D8 that is part of the component pickup placement data D1 related to the control of the component mounter 2 from the remaining simultaneous pickup groups GN, excluding specific simultaneous pickup groups GN that satisfy a predetermined exclusion condition based on the determination result of the determination process S3. This makes it possible to appropriately set the simultaneous pickup group GN as a registered group included in the registered data D8 that is part of the component pickup placement data D1, taking into consideration whether the positional relationship of the pickup component E1, which is simultaneously picked up by multiple pickup nozzles 25N, with respect to the surrounding components E2 when placed on the board PP will be a closely adjacent positional relationship.

[0065] Furthermore, the simultaneous pickup group GN selected in the selection process S4 as a registered group included in the registration data D8 that is part of the component pickup placement data D1 is a group that takes into consideration whether each pickup component E1 picked up simultaneously by the multiple pickup nozzles 25N will be in a closely adjacent positional relationship with the surrounding components E2 on the board PP. Therefore, when each pickup component E1 belonging to the selected simultaneous pickup group GN is placed on the board PP by the pickup nozzle 25N, the risk of interference between the pickup nozzle 25N and the surrounding components E2 due to the closely adjacent positional relationship can be reduced. [Explanation of symbols]

[0066] 1. Component mounting system 2. Component Mounting Machine 24 Parts supply unit 24P supply position 25 Head Unit 251 Mounting Head 25N suction nozzle 3 Data creation device 32 Control section D1 Parts pickup and placement data D8 Registration Data E1 suction part E2 Surrounding parts GN Simultaneous Adsorption Group

Claims

1. A data creation device that creates registration data as part of component suction and placement data related to control of a component mounter having a component supply unit that supplies components to each of a plurality of component supply positions, and a head unit that includes a plurality of suction nozzles that pick up each of the components supplied to the plurality of component supply positions and place the picked-up components on a board, a control unit that performs processing to create the registration data; The control unit an acquisition process for acquiring component size data indicating the size of the component, pickup range data indicating the range within which the pickup nozzle can pick up the component, nozzle size data indicating the size of the pickup nozzle, and mounting deviation tolerance data indicating the tolerance for the amount of deviation in the mounting position of the component on the board; a group creation process for creating a plurality of simultaneous pickup groups each representing a group of at least two components to be simultaneously picked up by the plurality of pickup nozzles for each of the components to be supplied to the plurality of component supply positions; a determination process for determining, for each of the plurality of simultaneous pickup groups, whether or not each pickup component and the peripheral components mounted around each pickup component on the board have a predetermined closely adjacent positional relationship; a selection process for selecting a registered group included in the registration data from the remaining simultaneous adsorption groups after excluding a specific simultaneous adsorption group that satisfies a predetermined exclusion condition based on the determination result of the determination process from the plurality of simultaneous adsorption groups; In the determination process, a data creation device calculates a nozzle prediction range indicating the predicted range of the suction nozzle when each of the pickup components is placed on the board based on the data acquired by the acquisition process, and calculates a surrounding component prediction range indicating the predicted range of the surrounding components on the board, and determines that each of the pickup components and the surrounding components have the closely adjacent positional relationship when the nozzle prediction range and the surrounding component prediction range overlap.

2. 2. The data creation device according to claim 1, wherein the control unit recognizes, in the selection process, a simultaneous pickup group in which a number of components determined to have the closely adjacent positional relationship corresponding to each pickup component is equal to or greater than a predetermined number as the specific simultaneous pickup group that satisfies the exclusion condition.

3. 2. The data creation device according to claim 1, wherein the control unit selects the registration group from the remaining simultaneous pickup groups based on a predetermined evaluation value relating to the mounting efficiency of each of the pickup components on the board in the selection process.

4. a component mounter including: a component supply unit that supplies components to each of a plurality of component supply positions; and a head unit that includes a plurality of suction nozzles that pick up each of the components supplied to the plurality of component supply positions and mount the picked-up components on a substrate; A component mounting system comprising: the data creation device according to any one of claims 1 to 3, which creates registration data as part of component suction and placement data relating to control of the component mounter.

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