Camera module

Abstract

To provide a camera module.SOLUTION: A camera module according to one aspect of the present invention comprises: a housing including a body unit and an accommodation unit; an outermost lens arranged on an upper part of the accommodation unit; a substrate coupled to a lower part of the housing; a connector coupled to a lower surface of the substrate; a heating member arranged on one side of the outermost lens; and a transmission member for connecting the heating member and the connector. The substrate includes a first groove formed on a side surface thereof so as to be penetrated by the transmission member. The housing includes a partition wall extending from a lower surface thereof so as to be coupled to an upper surface of the substrate.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a camera module. [Background technology]

[0002] In recent years, ultra-miniature camera modules have been developed and are widely used in small electronic products such as smartphones, notebooks, game consoles, etc.

[0003] As automobiles become more widespread, miniature cameras are increasingly being used in vehicles as well as in small electronic products. For example, they are being installed in black box cameras for vehicle protection or to collect objective information on traffic accidents, rearview cameras that allow drivers to monitor blind spots at the rear of the vehicle through a screen to ensure safety when reversing, and perimeter detection cameras that can monitor the area around the vehicle.

[0004] The camera may include a lens, a lens holder that accommodates the lens, an image sensor that converts an image of a subject captured by the lens into an electrical signal, and a printed circuit board on which the image sensor is mounted. The housing that defines the exterior of the camera has a sealed structure to prevent contamination of the internal components from foreign matter, including moisture.

[0005] Due to the nature of automobiles being outdoors, the temperature inside and outside the automobile varies depending on the season. For example, the temperature inside the automobile is higher than the temperature outside in summer and drops below zero in winter. Therefore, sudden temperature changes can cause frost and condensation to form on the camera lens and glass. This can result in unsatisfactory photographs or even product failure. Summary of the Invention [Problem to be solved by the invention]

[0006] The problem to be solved by the present invention is to provide a camera module that can prevent the occurrence of condensation containing frost on the lens. [Means for solving the problem]

[0007] To achieve the above object, a camera module according to one aspect of the present invention includes a housing including a body portion and an accommodating portion extending in an optical axis direction from a central region of the body portion, an outermost lens disposed in an upper portion of the accommodating portion, a substrate coupled to a lower portion of the housing, a connector coupled to a lower surface of the substrate, a heating member disposed on one side of the outermost lens, and a transmission member connecting the heating member and the connector, wherein the substrate includes a first groove formed on a side surface thereof and penetrated by the transmission member, and the housing includes a partition extending from a lower surface thereof and coupled to an upper surface of the substrate.

[0008] The partition wall may overlap a frame region on the upper surface of the substrate in the optical axis direction.

[0009] In addition, a frame region of the upper surface of the substrate may contact the lower surface of the barrier rib, and the upper surface of the substrate may be sealed from the outside by the barrier rib.

[0010] The receiving portion may include a hole extending in the optical axis direction, and the transmitting member may be connected to the connector by passing through the hole and the first groove in sequence.

[0011] The lens may further include at least one lens disposed in the receiving portion and disposed on one side of the outermost lens, the hole may be spaced apart from the at least one lens in a direction perpendicular to the optical axis, and the at least one lens may be threadedly coupled to an inner peripheral surface of the receiving portion.

[0012] The receiving portion may further include a second groove formed on a lower surface thereof, the second groove overlapping the at least one lens in a direction perpendicular to the optical axis.

[0013] The transmission member may include a first region connected to the heating member, a second region connected to the connector, and a third region connecting the first region and the second region.

[0014] Also, the third region of the transmission member may be at least partially bent.

[0015] The lens holder may further include a retainer coupled to an upper portion of the receiving portion to fix the outermost lens.

[0016] The lens assembly may also include an O-ring disposed between the outermost lens and the retainer.

[0017] To achieve the above object, a camera module according to one aspect of the present invention includes a housing including a body portion and a receiving portion extending from a central region of the body portion in an optical axis direction, an outermost lens disposed in an upper portion of the receiving portion, a substrate coupled to a lower portion of the housing, a heating member disposed on one side of the outermost lens, and a transmission member connecting the heating member and the substrate, wherein the receiving portion includes a hole extending in an optical axis direction, and the substrate includes a first groove formed to be recessed inward on a side surface, and the transmission member passes through the hole and the first groove.

[0018] The housing may also include a partition wall extending downward from a lower surface thereof and coupled to an upper surface of the substrate.

[0019] The partition wall may overlap a frame region on the upper surface of the substrate in the optical axis direction.

[0020] In addition, a frame region of the upper surface of the substrate may contact the lower surface of the barrier rib, and the upper surface of the substrate may be sealed from the outside by the barrier rib.

[0021] The lens may further include at least one lens disposed in the receiving portion and disposed on one side of the outermost lens, the hole may be spaced apart from the at least one lens in a direction perpendicular to the optical axis, and the at least one lens may be threadedly coupled to an inner peripheral surface of the receiving portion.

[0022] The receiving portion may further include a second groove formed on a lower surface thereof, the second groove overlapping the at least one lens in a direction perpendicular to the optical axis.

[0023] The substrate may further include a connector disposed on a lower surface thereof, and one side of the transmission member may be connected to the connector.

[0024] The transmission member may include a first region connected to the heating member, a second region connected to the connector, and a third region connecting the first region and the second region.

[0025] Also, the third region of the transmission member may be at least partially bent.

[0026] The lens holder may include a retainer coupled to an upper portion of the receiving portion to fix the outermost lens, and an O-ring disposed between the outermost lens and the retainer.

[0027] To achieve the above object, a camera module according to one aspect of the present invention includes a housing including a body portion and a receiving portion extending from a central region of the body portion in an optical axis direction, an outermost lens disposed at an upper portion of the receiving portion, a substrate coupled to a lower portion of the housing, a connector coupled to a lower surface of the substrate, a heating member disposed on one side of the outermost lens, and a transmission member connecting the heating member and the connector, wherein the substrate includes a groove formed on a side surface thereof and penetrated by the transmission member, and the housing includes a partition extending from a lower surface thereof and coupled to an upper surface of the substrate.

[0028] The partition wall may overlap a frame region on the upper surface of the substrate in the optical axis direction.

[0029] In addition, a frame region of the upper surface of the substrate may contact the lower surface of the barrier rib, and the upper surface of the substrate may be sealed from the outside by the barrier rib.

[0030] The partition wall may also include a hole through which the transmission member passes.

[0031] The transmission member may include a first region connected to the heating member, a second region connected to the connector, and a third region connecting the first region and the second region and passing through the hole.

[0032] Also, at least a portion of the third region may be folded.

[0033] In addition, the hole may be penetrated by the transmitting member and then sealed by a sealing member.

[0034] The optical fiber display device may further include at least one lens disposed in the receiving portion, and a spacer disposed between an inner surface of the receiving portion and the at least one lens.

[0035] The device may also include a fixing member disposed below the spacer and coupled to an inner surface of the receiving portion.

[0036] The outer surface of the fixing member may be screwed to the inner surface of the receiving portion.

[0037] The spacer may include a space formed between an inner surface of the receiving portion and the spacer, and the transmission member may pass through the space.

[0038] The lens may further include an O-ring disposed between an inner surface of the receiving portion and the outermost lens.

[0039] According to one aspect of the present invention for achieving the above object, a camera module includes a housing including a body portion and a receiving portion extending in an optical axis direction from a central region of the body portion, an outermost lens disposed at an upper portion of the receiving portion, a substrate coupled to a lower portion of the housing, a heating member disposed on one side of the outermost lens, a transmission member connecting the heating member and the substrate, at least one lens disposed in the receiving portion, and a spacer disposed between an inner surface of the receiving portion and the at least one lens, wherein the substrate includes a groove formed to be recessed inward on a side thereof, and the transmission member passes through a separation space formed between the inner surface of the receiving portion and the spacer and the groove.

[0040] The housing may also include a partition wall extending from a lower surface thereof and coupled to an upper surface of the substrate.

[0041] In addition, a frame region of the upper surface of the substrate may contact the lower surface of the barrier rib, and the upper surface of the substrate may be sealed from the outside by the barrier rib.

[0042] The partition wall may also include a hole through which the transmission member passes.

[0043] The transmission member may include a first region connected to the heating member, a second region connected to the connector, and a third region connecting the first region and the second region and passing through the hole.

[0044] Also, at least a portion of the third region may be folded.

[0045] In addition, the hole may be penetrated by the transmitting member and then sealed by a sealing member.

[0046] The device may further include a fixing member disposed below the spacer and coupled to an inner surface of the receiving portion, and an outer surface of the fixing member may be threadably coupled to the inner surface of the receiving portion.

[0047] According to one aspect of the present invention, there is provided a camera module including a housing including a body portion and a receiving portion extending in an optical axis direction from a central region of the body portion, an outermost lens disposed at an upper portion of the receiving portion, a substrate coupled to a lower portion of the housing, a heating member disposed on one side of the outermost lens, a transmission member connecting the heating member and the substrate, at least one lens disposed in the receiving portion, and a spacer disposed between an inner surface of the receiving portion and the at least one lens, wherein the housing includes a partition extending from a lower surface thereof to be coupled to an upper surface of the substrate, the partition including a hole, and the transmission member passing through a separation space formed between the inner surface of the receiving portion and the spacer and the hole. [Effects of the Invention]

[0048] This embodiment can provide a camera module that can prevent the occurrence of condensation containing frost on the lens. [Brief explanation of the drawings]

[0049] [Figure 1] 1 is a perspective view of a camera module according to a first embodiment of the present invention. [Figure 2] 1 is an exploded perspective view of a camera module according to a first embodiment of the present invention. [Figure 3] 1 is a cross-sectional view of a camera module according to a first embodiment of the present invention. [Figure 4] 1 is a perspective view of a housing according to a first embodiment of the present invention. [Figure 5] 1 is a perspective view of a housing according to a first embodiment of the present invention. [Figure 6] 1 is a perspective view of a housing according to a first embodiment of the present invention. [Figure 7]FIG. 2 is a bottom view of the housing according to the first embodiment of the present invention. [Figure 8] 1 is a perspective view of a heating member and a transmission member according to a first embodiment of the present invention. FIG. [Figure 9] 1 is a perspective view of a substrate and an image sensor according to a first embodiment of the present invention. [Figure 10] FIG. 10 is a perspective view of a camera module according to a second embodiment of the present invention. [Figure 11] FIG. 10 is an exploded perspective view of a camera module according to a second embodiment of the present invention. [Figure 12] FIG. 10 is a cross-sectional view of a camera module according to a second embodiment of the present invention. [Figure 13] FIG. 13 is an enlarged view of part A in FIG. 12. [Figure 14] FIG. 10 is a bottom view of a housing according to a second embodiment of the present invention. [Figure 15] FIG. 10 is a perspective view of a heating member and a transmission member according to a second embodiment of the present invention. [Figure 16] FIG. 10 is a perspective view of a substrate and an image sensor according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0050] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0051] However, the technical concept of the present invention is not limited to the described embodiments, but can be embodied in various different forms, and one or more of the components of the embodiments can be selectively combined or substituted within the scope of the technical concept of the present invention.

[0052] Furthermore, unless otherwise clearly defined and described, terms (including technical and scientific terms) used in the embodiments of the present invention shall be interpreted as meanings that are commonly understood by a person having ordinary knowledge in the technical field to which the present invention belongs, and terms commonly used together with predefined terms may be interpreted in light of the contextual meaning of the relevant art.

[0053] Furthermore, the terms used in the embodiments of the present invention are intended to explain the embodiments and are not intended to limit the present invention.

[0054] In this specification, the singular can include the plural unless otherwise specified in the context, and when it is stated as "A and (and) at least one (or more) of B and C," it can include one or more of all possible combinations of A, B, and C.

[0055] Furthermore, when describing components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. are used. These terms are used only to distinguish the components from other components, and do not limit the nature, order, or sequence of the components.

[0056] Furthermore, when a component is described as being 'coupled', 'coupled', or 'connected' to another component, this includes not only the case where the component is directly 'coupled', 'coupled', or 'connected' to the other component, but also the case where the component is 'coupled', 'coupled', or 'connected' by another component between the component and the other component.

[0057] Furthermore, when described as being formed or disposed "above" or "below" a component, "above" or "below" refers not only to the case where two components are in direct contact with each other, but also to the case where one or more additional components are formed or disposed between the two components. Furthermore, when described as "above" or "below," it can mean not only an upper direction but also a lower direction based on one component.

[0058] The 'optical axis direction' used below is defined as the optical axis direction of the lens module. Meanwhile, the 'optical axis direction' can correspond to the 'up and down direction', 'z-axis direction', etc.

[0059] Hereinafter, a first embodiment of the present invention will be described in more detail with reference to the accompanying drawings.

[0060] FIG. 1 is a perspective view of a camera module according to a first embodiment of the present invention. FIG. 2 is an exploded perspective view of a camera module according to a first embodiment of the present invention. FIG. 3 is a cross-sectional view of a camera module according to a first embodiment of the present invention. FIGS. 4 to 6 are perspective views of a housing according to a first embodiment of the present invention. FIG. 7 is a bottom view of a housing according to a first embodiment of the present invention. FIG. 8 is a perspective view of a heating member and a transmission member according to a first embodiment of the present invention. FIG. 9 is a perspective view of a substrate and an image sensor according to a first embodiment of the present invention.

[0061] Referring to Figures 1 to 9, the camera module 10 according to the first embodiment of the present invention may include a housing 100, a lens module 200, a retainer 300, an O-ring 400, a substrate 500, an image sensor 600, a heating member 700, and a transmission member 800, but may be implemented without some of these components, and additional components are not excluded.

[0062] The camera module 10 according to the first embodiment of the present invention may include a housing 100. The housing 100 may form the exterior of the camera module 10. A lens module 200, a retainer 300, an O-ring 400, a substrate 500, an image sensor 600, a heating member 700, and a transmission member 800 may be disposed in the housing 100. The housing 100 may be combined with an additional housing (not shown) disposed below the housing 100. The housing 100 may be disposed below the retainer 300. The housing 100 may include a body portion 102, a receiving portion 104, and a partition wall 130.

[0063] The housing 100 may include a body part 102. The body part 102 may form the exterior of the camera module 10. The body part 102 may be formed in a hexahedron shape with an open bottom. The body part 102 may have a receiving part 104. The receiving part 104 may be formed in a central region of the body part 102. The body part 102 may be formed integrally with the receiving part 104. The body part 102 may be combined with an additional housing disposed below. A first partition 132 may be formed at the bottom of the body part 102.

[0064] The housing 100 may include a receiving portion 104. The receiving portion 104 may be formed as an extension from the body portion 102. The receiving portion 104 may be formed in a central region of the body portion 102. The receiving portion 104 may extend in the optical axis direction. The receiving portion 104 may be formed integrally with the body portion 102. The receiving portion 104 may be formed in a circumferential shape. The receiving portion 104 may include an opening, a hole 110, and a second groove 120. A second partition 134 may be formed at a lower portion of the receiving portion 104.

[0065] The receiving portion 104 may include an opening. An opening extending in the optical axis direction may be formed in a central region of the receiving portion 104. A lens module 200 may be disposed in the receiving portion 104. The lens module 200 may be disposed in the opening of the receiving portion 104. At least one lens 210 may be disposed in the opening of the receiving portion 104. The at least one lens 210 may be screw-coupled to an inner peripheral surface of the opening of the receiving portion 104. An outermost lens 220 may be disposed in an upper region of the receiving portion 104. An upper portion of the opening of the receiving portion 104 may be sealed by the outermost lens 220. The outermost lens 220 may be exposed at the upper portion of the receiving portion 104.

[0066] The receiving portion 104 may include a hole 110. The hole 110 may extend in the optical axis direction. The hole 110 may be spaced apart from the opening of the receiving portion 104 in a direction perpendicular to the optical axis. The hole 110 may be located in a partial area based on the cross section of the receiving portion 104. The hole 110 may be penetrated by the transmission member 800. The hole 110 may overlap with at least one lens 210 in a direction perpendicular to the optical axis. The hole 110 may not overlap with the image sensor 600 disposed on the upper surface of the substrate 500 in the optical axis direction.

[0067] The receiving portion 104 may include a second groove 120. The second groove 120 may be formed on a lower surface of the receiving portion 104. The second groove 120 may be formed to be recessed upward from the lower surface of the receiving portion 104. The second groove 120 may extend in the optical axis direction. The second groove 120 may overlap with at least one lens 210 in a direction perpendicular to the optical axis. The second groove 120 may be spaced apart from the hole 110. The second groove 120 may overlap with the hole 110 in a direction perpendicular to the optical axis. This reduces the amount of raw material used in the camera module 10, thereby reducing weight and costs.

[0068] The housing 100 may include a partition 130. The partition 130 may be formed at the bottom of the housing 100. The partition 130 may protrude downward from the bottom surface of the housing 100. The partition 130 may be coupled to the top surface of the substrate 500. The bottom surface of the partition 130 may be coupled to the top surface of the substrate 500. The partition 130 may overlap the frame region of the substrate 500 in the optical axis direction. The bottom surface of the partition 130 may contact the frame region of the substrate 500. The bottom surface of the partition 130 may be formed in a shape corresponding to the frame region of the substrate 500. The partition 130 may seal the top surface of the substrate 500 from the outside, thereby preventing foreign matter from penetrating into the image sensor 600 and other elements. The partition 130 may include a first partition 132, a second partition 134, a first coupling hole 136, and a boss 138.

[0069] The partition 130 may include a first partition 132. The first partition 132 may be formed on a lower portion of the body portion 102. The first partition 132 may protrude downward from a lower surface of the body portion 102. The first partition 132 may be coupled to an upper surface of the substrate 500. The first partition 132 may be connected to a second partition 134. The first partition 132 may be formed integrally with the second partition 134. The first partition 132 may contact a frame region of the upper surface of the substrate 500.

[0070] The partition 130 may include a second partition 134. The second partition 134 may be formed on a lower portion of the receiving portion 104. The second partition 134 may protrude downward from a lower surface of the receiving portion 104. The second partition 134 may be coupled to an upper surface of the substrate 500. The second partition 134 may be connected to the first partition 132. The second partition 134 may be formed integrally with the first partition 132. The second partition 134 may contact a region adjacent to the first groove 510 in a frame region of the upper surface of the substrate 500.

[0071] The partitions 130 may include first coupling holes 136. The first coupling holes 136 may be formed on the lower surfaces of the partitions 130. The first coupling holes 136 may overlap the second coupling holes 536 formed in the substrate 500 in the optical axis direction. The first coupling holes 136 may be formed in a shape corresponding to the second coupling holes 536 formed in the substrate 500. Like the second coupling holes 536 formed in the substrate 500, the first coupling holes 136 may be penetrated by a fastening member, for example, a screw. This allows the lower surfaces of the partitions 130 to be coupled to the upper surface of the substrate 500. The first coupling holes 136 may include two first coupling holes 136. The two first coupling holes 136 may be formed at positions symmetrical to each other with respect to the optical axis. This may improve the coupling stability between the lower surfaces of the partitions 130 and the upper surface of the substrate 500.

[0072] The partition 130 may include a boss 138. The boss 138 may be formed on a lower surface of the partition 130. The boss 138 may overlap with a through-hole 538 formed in the substrate 500 in the optical axis direction. The boss 138 may be formed in a shape corresponding to the through-hole 538 formed in the substrate 500. The boss 138 may be inserted into the through-hole 538 formed in the substrate 500. This may guide the positioning of the housing 100 and the substrate 500 relative to each other. The boss 138 may include two bosses 138. The two bosses 138 may be formed at positions symmetrical to each other with respect to the optical axis. This may improve the positioning force of the housing 100 and the substrate 500 relative to each other.

[0073] The camera module 10 according to the first embodiment of the present invention may include a lens module 200. The lens module 200 may be disposed in the housing 100. The lens module 200 may be disposed in the receiving portion 104 of the housing 100. The lens module 200 may be disposed in an opening of the receiving portion 104 of the housing 100. The lens module 200 may include at least one lens 210 and an outermost lens 220.

[0074] The lens module 200 may include at least one lens 210. The at least one lens 210 may be disposed in the receiving portion 104. The at least one lens 210 may be threadably coupled to an inner peripheral surface of the receiving portion 104. The at least one lens 210 may be disposed on one side of or below the outermost lens 220. The at least one lens 210 may overlap the hole 110 of the receiving portion 104 in a direction perpendicular to the optical axis. The at least one lens 210 may overlap the second groove 120 of the receiving portion 104 in a direction perpendicular to the optical axis. Each lens of the at least one lens 210 may be made of, but is not limited to, a synthetic resin material, a glass material, or a quartz material. The at least one lens 210 may be made of various materials.

[0075] The lens module 200 may include an outermost lens 220. The outermost lens 220 may be disposed on the upper part of the receiving part 104. The outermost lens 220 may seal the opening of the receiving part 104. The outermost lens 220 may be fixed to the receiving part 104 by a retainer 300. The outermost lens 220 may be made of a synthetic resin material, a glass material, a quartz material, or the like, but is not limited thereto, and may be made of various materials.

[0076] The camera module 10 according to the first embodiment of the present invention may include a retainer 300. The retainer 300 may be coupled to the housing 100. The retainer 300 may be coupled to an upper portion of the receiving portion 104 of the housing 100. The retainer 300 may fix the outermost lens 220. After the outermost lens 220 and at least one lens 210 are inserted into the upper portion of the receiving portion 104 and assembled into the receiving portion 104, the retainer 300 may be coupled to the upper portion of the receiving portion 104 to fix the outermost lens 220 to the receiving portion 104. At this time, one end of the retainer 300 may be JPEG0007828400000001.jpg9161 The retainer 300 has a shape similar to that of a letter "1" and can be pressed downward to fix the outermost lens 220 accommodated in the receiving portion 104. The other end of the retainer 300 can be connected to the outer circumferential surface of the receiving portion 104 by snap-fitting or screws. The other end of the retainer 300 can be connected to the receiving portion 104 by an adhesive such as epoxy.

[0077] The camera module 10 according to the first embodiment of the present invention may include an O-ring 400. The O-ring 400 may be disposed between the lens module 200 and the retainer 300. The O-ring 400 may be disposed between the outermost lens 220 and the retainer 300. The O-ring 400 may be made of an elastic material. The O-ring 400 may be formed in a ring shape. This prevents damage to components that may occur when the retainer 300 presses downward on the outermost lens 220 of the lens module 200.

[0078] The camera module 10 according to the first embodiment of the present invention may include a substrate 500. The substrate 500 may be disposed in the housing 100. The substrate 500 may be disposed at a lower portion of the housing 100. The substrate 500 may be coupled to a lower portion of the housing 100. The substrate 500 may be coupled to a lower surface of a partition 130 of the housing 100. A frame region on an upper surface of the substrate 500 may overlap with the partition 130 in the optical axis direction. The frame region on the upper surface of the substrate 500 may contact a lower surface of the partition 130. The upper surface of the substrate 500 may be sealed from the outside by the partition 130. This may prevent foreign matter from penetrating into the image sensor 600 and other elements disposed on the upper surface of the substrate 500.

[0079] The substrate 500 may be electrically connected to the image sensor 600. The image sensor 600 may be disposed on the substrate 500. The image sensor 600 may be disposed on an upper surface of the substrate 500. The image sensor 600 may be mounted on an upper surface of the substrate 500. The substrate 500 may be electrically connected to the transmission member 800. The substrate 500 may be electrically connected to the connector 520. The connector 520 may be disposed on a lower surface of the substrate 500. The connector 520 may be mounted on a lower surface of the substrate 500. The substrate 500 may be electrically connected to the transmission member 800 via the connector 520.

[0080] The substrate 500 may include a printed circuit board (PCB) or a flexible printed circuit board (FPCB).

[0081] The substrate 500 may include a first groove 510. The first groove 510 may be formed on a side surface of the substrate 500. The first groove 510 may be recessed from a side surface of the substrate 500. The first groove 510 may be spaced apart from the image sensor 600. The first groove 510 may be penetrated by the transmission member 800. A cross section of the first groove 510 may be rectangular. At least a portion of the first groove 510 may overlap with the hole 110 of the housing 100 in the optical axis direction. The first groove 510 may be located outside the partition 130. Specifically, the first groove 510 may be located outside the second partition 134.

[0082] The substrate 500 may include second coupling holes 536. The second coupling holes 536 may be formed through the substrate 500. The second coupling holes 536 may overlap the first coupling holes 136 formed in the partition walls 130 in the optical axis direction. The second coupling holes 536 may be formed in a shape corresponding to the first coupling holes 136 formed in the partition walls 130. Like the first coupling holes 136 formed in the partition walls 130, the second coupling holes 536 may be penetrated by a fastening member, for example, a screw. This allows the upper surface of the substrate 500 to be coupled to the lower surface of the partition walls 130. The second coupling holes 536 may include two second coupling holes 536. The two second coupling holes 536 may be formed at positions symmetrical to each other with respect to the optical axis. This may improve the coupling stability between the upper surface of the substrate 500 and the lower surface of the partition walls 130.

[0083] The substrate 500 may include a through hole 538. The through hole 538 may be formed to penetrate the substrate 500. The through hole 538 may overlap with the boss 138 formed on the partition wall 130 in the optical axis direction. The through hole 538 may be formed to have a shape corresponding to the boss 138 formed on the partition wall 130. The through hole 538 may be penetrated by the boss 138 formed on the partition wall 130. This may guide the positioning of the housing 100 and the substrate 500 relative to each other. The through hole 538 may include two through holes 538. The two through holes 538 may be formed at positions symmetrical to each other with respect to the optical axis. This may improve the positioning force of the housing 100 and the substrate 500 relative to each other.

[0084] The camera module 10 according to the first embodiment of the present invention may include an image sensor 600. The image sensor 600 may be disposed on the upper surface of the substrate 500. The image sensor 600 may be mounted in a central region of the upper surface of the substrate 500. The image sensor 600 may be disposed below the lens module 200. The image sensor 600 may be spaced apart from the first groove 510. The image sensor 600 may be electrically connected to the substrate 500. For example, the image sensor 600 may be bonded to the substrate 500 using surface mounting technology (SMT). For another example, the image sensor 600 may be bonded to the substrate 500 using flip chip technology.

[0085] The camera module 10 according to the first embodiment of the present invention may include a heating member 700. The heating member 700 may be disposed in the lens module 200. The heating member 700 may be disposed on one side of the outermost lens 220. The heating member 700 may be disposed on the lower surface of the outermost lens 220. The heating member 700 may be made of a transparent material. The heating member 700 may be formed in a shape that does not interfere with light passing through the lens module 200. For example, the heating member 700 may be formed in a C-shape.

[0086] The heating member 700 may be electrically connected to the transfer member 800. The heating member 700 may generate heat by receiving power from the substrate 500 via the transfer member 700. The heating member 700 may be a transparent heating film coated with indium tin oxide (ITO), which has conductivity and can generate heat due to its own resistance. The heating member 700 may be formed by, for example, a coating process or deposition process of an ITO material. However, this is merely an example, and the material of the heating member 700 is not limited thereto and may be variously changed as long as it can generate heat when a current is supplied thereto.

[0087] The camera module 10 according to the first embodiment of the present invention may include a transmission member 800. The transmission member 800 may electrically connect the heating member 700 and the substrate 500. The transmission member 800 may connect the heating member 700 and the connector 520. The transmission member 800 may be electrically connected to the heating member 700. The transmission member 800 may be electrically connected to the substrate 500 via the connector 520. The transmission member 800 may supply current from the substrate 500 to the heating member 700. At least a portion of the transmission member 800 may be bent. The transmission member 800 may sequentially pass through the hole 110 of the receiving portion 104 and the first groove 510 of the substrate 500. The transmission member 800 may be a flexible printed circuit board (FPCB).

[0088] The transmission member 800 may include a first region 810 connected to the heating member 700, a second region 820 connected to the connector 520, and a third region 830 connecting the first region 810 and the second region 820. At least a portion of the third region 830 may be bent. The third region 830 may pass through the hole 110 of the receiving portion 104 and the first groove 510 of the substrate 500 in sequence. This may improve space efficiency.

[0089] According to the camera module 10 of the first embodiment of the present invention, the heating member 700 can prevent the occurrence of condensation containing frost on the outermost lens 220.

[0090] Furthermore, the camera module 10 according to the first embodiment of the present invention can prevent foreign matter from penetrating into the image sensor 600 through the partition 130, thereby improving space efficiency.

[0091] Hereinafter, a second embodiment of the present invention will be described in more detail with reference to the accompanying drawings.

[0092] FIG. 10 is a perspective view of a camera module according to a second embodiment of the present invention. FIG. 11 is an exploded perspective view of a camera module according to the second embodiment of the present invention. FIG. 12 is a cross-sectional view of a camera module according to the second embodiment of the present invention. FIG. 13 is an enlarged view of portion A in FIG. 12. FIG. 14 is a bottom view of a housing according to the second embodiment of the present invention. FIG. 15 is a perspective view of a heating member and a transmission member according to the second embodiment of the present invention. FIG. 16 is a perspective view of a substrate and an image sensor according to the second embodiment of the present invention.

[0093] Referring to Figures 10 to 16, the camera module 1010 according to the second embodiment of the present invention may include a housing 1100, a lens module 1200, an O-ring 1300, a spacer 1400, a fixing member 1500, a substrate 1600, an image sensor 1700, a heating member 1800, and a transmission member 1900, but may be implemented without some of these components, and other additional components are not excluded.

[0094] The camera module 1010 according to the second embodiment of the present invention may include a housing 1100. The housing 1100 may form the exterior of the camera module 1010. A lens module 1200, an O-ring 1300, a spacer 1400, a fixing member 1500, a substrate 1600, an image sensor 1700, a heating member 1800, and a transmission member 1900 may be disposed in the housing 1100. The housing 1100 may be coupled to an additional housing (not shown) disposed below the housing 1100. The housing 1100 may include a body portion 1102, a receiving portion 1104, and a partition wall 1130.

[0095] The housing 1100 may include a body part 1102. The body part 1102 may form the exterior of the camera module 1010. The body part 1102 may be formed in a hexahedron shape with an open bottom. The body part 1102 may have a receiving part 1104. The receiving part 1104 may be formed in a central region of the body part 1102. The body part 1102 may be formed integrally with the receiving part 1104. The body part 1102 may be combined with an additional housing disposed below. The body part 1102 may have a first partition 1132 and a second partition 1134 formed below it.

[0096] The housing 1100 may include a receiving portion 1104. The receiving portion 1104 may be formed by extending from the body portion 1102. The receiving portion 1104 may be formed in a central region of the body portion 1102. The receiving portion 1104 may extend in the optical axis direction. The receiving portion 1104 may be formed integrally with the body portion 1102. The receiving portion 1104 may be formed in a circumferential shape. The top surface of the outermost lens 1220 may be disposed on the inner surface of the receiving portion 1104. The top end of the receiving portion 1104 may be JPEG0007828400000002.jpg10158-shaped, which can prevent the outermost lens 1220 from being ejected to the outside. A spacer 1400 can be disposed between the receiving portion 1104 and the at least one lens 1210. A separation space formed in a portion of the space between the receiving portion 1104 and the spacer 1400 can be penetrated by a transmission member 1900.

[0097] A step may be formed on the inner surface of the receiving portion 1104. The upper surface of the spacer 1400 may be seated on the step formed on the inner surface of the receiving portion 1104. The frame region of the upper surface of the spacer 1400 may be seated on the step formed on the inner surface of the receiving portion 1104. This ensures a space in which the outermost lens 1220 is disposed.

[0098] The receiving portion 1104 may include an opening 1120. The opening 1120 may be formed in a central region of the receiving portion 1104, extending in the optical axis direction. A lens module 1200 may be disposed in the receiving portion 1104. The lens module 1200 may be disposed in the opening 1120 of the receiving portion 1104. At least one lens 1210 may be disposed in the opening 1120 of the receiving portion 1104. An outermost lens 1220 may be disposed in an upper region of the opening 1120 of the receiving portion 1104. The radius of the opening 1120 of the receiving portion 1104 may be larger than the radius of the at least one lens 1210. A spacer 1400 may be disposed in the opening 1120 of the receiving portion 1104. A portion of the transmission member 1900 may be disposed in a portion of the opening 1120 of the receiving portion 1104. The housing 1100 may include a partition 1130. The partitions 1130 may be formed at the bottom of the housing 1100. The partitions 1130 may protrude downward from the bottom surface of the housing 1100. The partitions 1130 may be coupled to the top surface of the substrate 1600. The bottom surfaces of the partitions 1130 may be coupled to the top surface of the substrate 1600. The partitions 1130 may overlap the frame region of the substrate 1600 in the optical axis direction. The bottom surfaces of the partitions 1130 may contact the frame region of the substrate 1600. The bottom surfaces of the partitions 1130 may be formed in a shape corresponding to the frame region of the substrate 1600. The partitions 1130 may seal the top surface of the substrate 1600 from the outside, thereby preventing foreign matter from penetrating into the image sensor 1700 and other elements. The partitions 1130 may include a first partition 1132, a second partition 1134, a first coupling hole 1136, and a boss 1138.

[0099] The partitions 1130 may include first partitions 1132. The first partitions 1132 may be formed on a lower portion of the body portion 1102. The first partitions 1132 may protrude downward from a lower surface of the body portion 1102. The first partitions 1132 may be coupled to an upper surface of the substrate 1600. The first partitions 1132 may be connected to second partitions 1134. The first partitions 1132 may be integrally formed with the second partitions 1134. The first partitions 1132 may contact a frame region on the upper surface of the substrate 1600. The first partitions 1132 may be spaced farther from the optical axis than the second partitions 1134.

[0100] The partitions 1130 may include second partitions 1134. The second partitions 1134 may be formed on a lower portion of the body portion 1102. The second partitions 1134 may protrude downward from a lower surface of the body portion 1102. The second partitions 1134 may be coupled to an upper surface of the substrate 1600. The second partitions 1134 may be connected to the first partitions 1132. The second partitions 1134 may be formed integrally with the first partitions 1132. The second partitions 1134 may contact a region adjacent to the first grooves 1610 in a frame region on the upper surface of the substrate 1600. The second partitions 1134 may be disposed closer to the optical axis than the first partitions 1132.

[0101] The second partition 1134 may include a hole 1134a. The hole 1134a may be formed in an upper region of the second partition 1134. The hole 1134a may be penetrated by the transfer member 1900. After a portion of the transfer member 1900 is disposed, the hole 1134a may be sealed with a sealing member (not shown). In this case, the sealing member may include a thermosetting resin such as epoxy. This may prevent foreign matter from entering the image sensor 1700.

[0102] The partitions 1130 may include first coupling holes 1136. The first coupling holes 1136 may be formed on the lower surfaces of the partitions 1130. The first coupling holes 1136 may overlap the second coupling holes 1630 formed in the substrate 1600 in the optical axis direction. The first coupling holes 1136 may be formed in a shape corresponding to the second coupling holes 1630 formed in the substrate 1600. Like the second coupling holes 1630 formed in the substrate 1600, the first coupling holes 1136 may be penetrated by a fastening member, for example, a screw. This allows the lower surfaces of the partitions 1130 to be coupled to the upper surface of the substrate 1600. The first coupling holes 1136 may include two first coupling holes 1136. The two first coupling holes 1136 may be formed symmetrically with respect to the optical axis. This may improve the coupling stability between the lower surfaces of the partitions 1130 and the upper surface of the substrate 1600.

[0103] The partition 1130 may include a boss 1138. The boss 1138 may be formed on a lower surface of the partition 1130. The boss 1138 may overlap with a through-hole 1640 formed in the substrate 1600 in the optical axis direction. The boss 1138 may be formed to have a shape corresponding to the through-hole 1640 formed in the substrate 1600. The boss 1138 may be inserted into the through-hole 1640 formed in the substrate 1600. This may guide the positioning of the housing 1100 and the substrate 1600 relative to each other. The boss 1138 may include two bosses 1138. The two bosses 1138 may be formed at positions symmetrical to each other with respect to the optical axis. This may improve the positioning force of the housing 1100 and the substrate 1600 relative to each other.

[0104] The camera module 1010 according to the second embodiment of the present invention may include a lens module 1200. The lens module 1200 may be disposed in the housing 1100. The lens module 1200 may be disposed in the receiving portion 1104 of the housing 1100. The lens module 1200 may be disposed in the opening 1120 of the receiving portion 1104 of the housing 1100. The lens module 1200 may include at least one lens 1210 and an outermost lens 1220.

[0105] The lens module 1200 may include at least one lens 1210. The at least one lens 1210 may be disposed in the receiving portion 1104. The radius of the at least one lens 1210 may be smaller than the radius of the opening 1120 of the receiving portion 1104. The at least one lens 1210 may be disposed on one side of or below the outermost lens 1220. The at least one lens 1210 may overlap with the spacer 1400 in a direction perpendicular to the optical axis. The at least one lens 1210 may be supported by the spacer 1400. The at least one lens 1210 may be fixed in position and supported by a fixing member 1500. The at least one lens 1210 may include a plurality of lenses having terminals connected to each other. The plurality of lenses having terminals connected to each other may be supported by a plurality of spacers 1410, 1420, respectively. Each lens of the at least one lens 1210 may be made of, but is not limited to, a synthetic resin material, a glass material, or a quartz material, and may be made of various materials.

[0106] The lens module 1200 may include an outermost lens 1220. The outermost lens 1220 may be disposed on the upper portion of the receiving portion 1104. The outermost lens 1220 may seal the opening 1120 of the receiving portion 1104. At least a portion of an upper surface of the outermost lens 1220 may contact an upper region of the inner surface of the receiving portion 1104. At least a portion of a lower surface of the outermost lens 1220 may contact an upper surface of the at least one lens 1210. The radius of the outermost lens 1220 may be larger than the radius of the at least one lens 1210. The outermost lens 1220 may be fixed to the receiving portion 1104 by the upper end of the receiving portion 1104 and the at least one lens 1102. The outermost lens 1220 may be made of, but is not limited to, a synthetic resin material, a glass material, a quartz material, or the like, and may be made of various materials.

[0107] The camera module 1010 according to the second embodiment of the present invention may include an O-ring 1300. The O-ring 1300 may be disposed between the housing 1100 and the lens module 1200. The O-ring 1300 may be disposed between the outermost lens 1220 and the receiving portion 1104 of the housing 1100. The O-ring 1300 may be formed of an elastic material. The O-ring 1300 may be formed in a ring shape. This prevents damage to components that may occur when the upper end of the receiving portion 1104 of the housing 1100 presses downward on the outermost lens 1220 of the lens module 1200. In addition, the O-ring 1300 may perform a waterproofing function to prevent moisture from entering the interior of the camera module 1010 through the receiving portion 1104.

[0108] The camera module 1010 according to the second embodiment of the present invention may include a spacer 1400. The spacer 1400 may be disposed in the housing 1100. The spacer 1400 may be disposed in the receiving portion 1104 of the housing 1100. The spacer 1400 may be disposed in the opening 1120 of the receiving portion 1104 of the housing 1100. The spacer 1400 may be disposed between an inner surface of the receiving portion 1104 of the housing 1100 and the at least one lens 1210 to support the at least one lens 1210. The spacer 1400 may be disposed between an inner surface of the receiving portion 1104 of the housing 1100 and the lens module 1200.

[0109] The spacer 1400 may be made of aluminum, which can reduce heat loss from the heating member 1800 and increase the amount of heat flowing into the outermost lens 1210.

[0110] A separation space 1110 may be formed between the spacer 1400 and the inner surface of the receiving portion 1104 of the housing 1100. The separation space 1110 formed between the spacer 1400 and the inner surface of the receiving portion 1104 of the housing 1100 may be penetrated by the transmission member 1900.

[0111] The spacer 1400 may include a plurality of spacers 1410 and 420. When at least one lens 1210 includes a plurality of lenses having terminals with each other, the plurality of lenses may be supported via a plurality of spacers 1410 and 420, respectively.

[0112] The camera module 1010 according to the second embodiment of the present invention may include a fixing member 1500. The fixing member 1500 may be disposed in the housing 1100. The fixing member 1500 may be disposed in the receiving portion 1104 of the housing 1100. The fixing member 1500 may be disposed between an inner surface of the receiving portion 1104 of the housing 1100 and at least one lens 1210. The fixing member 1500 may be disposed on one side or a lower portion of the spacer 1400. An upper surface of the fixing member 1500 may be in contact with a lower surface of the spacer 1400. An outer surface of the fixing member 1500 may be coupled to an inner surface of the receiving portion 1104 of the housing 1100. The outer surface of the fixing member 1500 may be coupled to an inner surface of the receiving portion 1104 of the housing 1100 by a screw or a tap. In this case, the fixing member 1500 may have a thread formed on the outer surface thereof corresponding to the thread formed on the inner surface of the receiving portion 1104 of the housing 1100. This allows the lens module 1200 and the spacer 1400 to be fixed in position.

[0113] The radius of the fixing member 1500 may be larger than the radius of the spacer 1400, thereby stably supporting the spacer 1400. The lower region of the fixing member 1500 may support at least one lens 1210. The lower end of the inner surface of the fixing member 1500 may be JPEG0007828400000003.jpg11162 is formed in a square shape and can support the lower end of at least one lens 1210. As a result, at least one lens 1210 can be stably supported.

[0114] A separation space 1110 may be formed between the fixing member 1500 and the inner surface of the receiving portion 1104 of the housing 1100. The separation space 1110 formed between the fixing member 1500 and the inner surface of the receiving portion 1104 of the housing 1100 may be penetrated by the transmission member 1900.

[0115] In the second embodiment of the present invention, the fixing member 1500 is disposed between the at least one lens 1210 and the inner surface of the receiving portion 1104, but the fixing member 1500 may be disposed below the spacer 1400 and the at least one lens 1210. In this case, the lower end of the spacer 1400 and the lower end of the at least one lens 1210 may be disposed on the same plane.

[0116] The camera module 1010 according to the second embodiment of the present invention may include a substrate 1600. The substrate 1600 may be disposed in the housing 1100. The substrate 1600 may be disposed at a lower portion of the housing 1100. The substrate 1600 may be coupled to a lower portion of the housing 1100. The substrate 1600 may be coupled to a lower surface of a partition 1130 of the housing 1100. A frame region on an upper surface of the substrate 1600 may overlap with the partition 1130 in the optical axis direction. The frame region on the upper surface of the substrate 1600 may contact a lower surface of the partition 1130. The upper surface of the substrate 1600 may be sealed from the outside by the partition 1130. This may prevent foreign matter from penetrating into the image sensor 1700 and other elements disposed on the upper surface of the substrate 1600.

[0117] The substrate 1600 may be electrically connected to the image sensor 1700. The image sensor 1700 may be disposed on the substrate 1600. The image sensor 1700 may be disposed on an upper surface of the substrate 1600. The image sensor 1700 may be mounted on an upper surface of the substrate 1600. The substrate 1600 may be electrically connected to the transmission member 1900. The substrate 1600 may be electrically connected to the connector 1620. The connector 1620 may be disposed on a lower surface of the substrate 1600. The connector 1620 may be mounted on a lower surface of the substrate 1600. The substrate 1600 may be electrically connected to the transmission member 1900 via the connector 1620.

[0118] The substrate 1600 may include a printed circuit board (PCB) or a flexible printed circuit board (FPCB).

[0119] The substrate 1600 may include a groove 1610. The groove 1610 may be formed on a side surface of the substrate 1600. The groove 1610 may be recessed from a side surface of the substrate 1600. The groove 1610 may be spaced apart from the image sensor 1700. The groove 1610 may be penetrated by the transmission member 1900. The cross section of the groove 1610 may be rectangular. The groove 1610 may not overlap with the receiving portion 1104 of the housing 1100 in the optical axis direction. The groove 1610 may be located outside the partition 1130. Specifically, the groove 1610 may be located outside the second partition 1134.

[0120] The substrate 1600 may include second coupling holes 1630. The second coupling holes 1630 may be formed through the substrate 1600. The second coupling holes 1630 may overlap the first coupling holes 1136 formed in the partition walls 1130 in the optical axis direction. The second coupling holes 1630 may be formed to have a shape corresponding to the first coupling holes 1136 formed in the partition walls 1130. Like the first coupling holes 1136 formed in the partition walls 1130, the second coupling holes 1630 may be penetrated by a fastener, such as a screw. This allows the upper surface of the substrate 1600 to be coupled to the lower surface of the partition walls 1130. The second coupling holes 1630 may include two second coupling holes 1630. The two second coupling holes 1630 may be formed symmetrically with each other with respect to the optical axis. This may improve the coupling stability between the upper surface of the substrate 1600 and the lower surface of the partition walls 1130.

[0121] The substrate 1600 may include a through hole 1640. The through hole 1640 may be formed through the substrate 1600. The through hole 1640 may overlap with the boss 1138 formed on the partition wall 1130 in the optical axis direction. The through hole 1640 may be formed in a shape corresponding to the boss 1138 formed on the partition wall 1130. The through hole 1640 may be penetrated by the boss 1138 formed on the partition wall 1130. This may guide the positioning of the housing 1100 and the substrate 1600 relative to each other. The through hole 1640 may include two through holes 1640. The two through holes 1640 may be formed at positions symmetrical to each other with respect to the optical axis. This may improve the positioning force of the housing 1100 and the substrate 1600 relative to each other.

[0122] The camera module 1010 according to the second embodiment of the present invention may include an image sensor 1700. The image sensor 1700 may be disposed on the upper surface of the substrate 1600. The image sensor 1700 may be mounted in a central region of the upper surface of the substrate 1600. The image sensor 1700 may be disposed below the lens module 1200. The image sensor 1700 may be spaced apart from the groove 1610. The image sensor 1700 may be electrically connected to the substrate 1600. For example, the image sensor 1700 may be bonded to the substrate 1600 using surface mounting technology (SMT). For another example, the image sensor 1700 may be bonded to the substrate 1600 using flip chip technology.

[0123] The camera module 1010 according to the second embodiment of the present invention may include a heating member 1800. The heating member 1800 may be disposed in the lens module 1200. The heating member 1800 may be disposed on one side of the outermost lens 1220. The heating member 1800 may be disposed on the lower surface of the outermost lens 1220. The heating member 1800 may be made of a transparent material. The heating member 1800 may be formed in a shape that does not interfere with light passing through the lens module 1200. For example, the heating member 1800 may be formed in a C-shape.

[0124] The heating member 1800 may be electrically connected to the transfer member 1900. The heating member 1800 may generate heat by receiving power from the substrate 1600 via the transfer member 1900. The heating member 1800 may be a transparent heating film coated with indium tin oxide (ITO), which has conductivity and can generate heat through its own resistance. The heating member 1800 may be formed by, for example, a coating process or deposition process of an ITO material. However, this is merely an example, and the material of the heating member 1800 is not limited thereto and may be variously changed as long as it can generate heat when a current is supplied thereto.

[0125] The camera module 1010 according to the second embodiment of the present invention may include a transmission member 1900. The transmission member 1900 may electrically connect the heating member 1800 and the substrate 1600. The transmission member 1900 may connect the heating member 1800 and the connector 1620. The transmission member 1900 may be electrically connected to the heating member 1800. The transmission member 1900 may be electrically connected to the substrate 1600 via the connector 1620. The transmission member 1900 may supply current from the substrate 1600 to the heating member 1800. At least a portion of the transmission member 1900 may be bent. The transmission member 1900 may sequentially pass through the separation space 1110, the hole 1134a of the partition wall 1130, and the groove 1620 of the substrate 1600. The transmission member 1900 may be a flexible printed circuit board (FPCB).

[0126] The transmission member 1900 may include a first region 1910 connected to the heating member 1800, a second region 1920 connected to the connector 1620, and a third region 1930 connecting the first region 1910 and the second region 1920. The third region 1930 may be at least partially bent. The third region 1930 may pass through the isolation space 1110, the hole 1134a of the partition wall 1130, and the groove 1620 of the substrate 1600 in that order. This may improve space efficiency.

[0127] According to the camera module 1010 of the second embodiment of the present invention, the heating member 1800 can prevent the occurrence of condensation including frost on the outermost lens 1220.

[0128] Furthermore, the camera module 1010 according to the second embodiment of the present invention can prevent foreign matter from penetrating into the image sensor 1700 through the partition 1130, thereby improving space efficiency.

[0129] Furthermore, the camera module 1010 according to the second embodiment of the present invention can increase space efficiency and reduce heat loss through the spacer 1400 .

[0130] The outermost lens 1220 is arranged to be fixed by the receiving portion 1104 without using a separate case to assemble it to the camera module 1010. This reduces the number of steps for assembling the camera module 1010. In addition, the cross-sectional area of ​​the camera module 1010 can be reduced, which is effective in reducing heat loss from the camera module 1010.

[0131] A modification of this embodiment may include both a portion of the configuration of the first embodiment and a portion of the configuration of the second embodiment. That is, a modification may include the first embodiment, but may omit a portion of the configuration of the first embodiment and include a portion of the configuration of the corresponding second embodiment. Alternatively, a modification may include the second embodiment, but may omit a portion of the configuration of the second embodiment and include a portion of the corresponding first embodiment.

[0132] Although the embodiments of the present invention have been described above with reference to the accompanying drawings, it should be understood by those skilled in the art that the present invention can be embodied in other specific forms without changing the technical spirit or essential characteristics thereof. Therefore, it should be understood that the above-described embodiments are illustrative in all respects and are not limiting.

Claims

1. a housing including a body portion and a receiving portion extending in an optical axis direction from a central region of the body portion; an outermost lens disposed in the upper part of the housing portion; a substrate coupled to a lower portion of the housing; a connector coupled to a lower surface of the substrate; a heating member disposed on one side of the outermost lens; a transmission member connecting the heating member and the connector, the receiving portion includes a hole extending in an optical axis direction, and a second groove spaced apart from the hole and formed on a lower surface of the receiving portion; the substrate includes a first groove formed on a side surface thereof and penetrated by the transmission member; the housing includes a partition wall extending from a lower surface thereof and coupled to an upper surface of the substrate; the first groove is located outside the partition wall and at least a portion of the first groove overlaps with the hole of the receiving portion in the optical axis direction; the second groove of the accommodating portion overlaps with the inside of the partition wall in the optical axis direction.

2. The camera module according to claim 1 , wherein the partition wall overlaps with a frame region on the upper surface of the substrate in the optical axis direction.

3. a frame region on the upper surface of the substrate contacts a lower surface of the partition wall; The camera module according to claim 2 , wherein the upper surface of the substrate is sealed from the outside by the partition wall.

4. The camera module of claim 1 , wherein the transmission member is connected to the connector by passing through the hole and the first groove in that order.

5. At least one lens is disposed in the receiving portion and disposed on one side of the outermost lens, the hole is spaced apart from the at least one lens in a direction perpendicular to the optical axis; The camera module according to claim 4 , wherein the at least one lens is threadably coupled to an inner circumferential surface of the housing portion.

6. A camera module as described in Claim 5, wherein the second groove overlaps with the at least one lens in a direction perpendicular to the optical axis.

7. the transmission member includes a first region connected to the heating member, a second region connected to the connector, and a third region connecting the first region and the second region; The camera module according to claim 4 , wherein the third region of the transmission member is at least partially bent.

8. The camera module of claim 1 , further comprising a retainer coupled to an upper portion of the receiving portion to fix the outermost lens.

9. 9. The camera module of claim 8, further comprising an O-ring disposed between the outermost lens and the retainer.

10. a housing including a body portion and a receiving portion extending in an optical axis direction from a central region of the body portion; an outermost lens disposed in the upper part of the housing portion; a substrate coupled to a lower portion of the housing; a heating member disposed on one side of the outermost lens; a transmission member connecting the heating member and the substrate, the receiving portion includes a hole extending in an optical axis direction, and a second groove spaced apart from the hole and formed on a lower surface of the receiving portion; the substrate includes a first groove formed in a concave shape from a side surface to an inner side, The transmission member passes through the hole and the first groove, the housing includes a partition wall extending from a lower surface thereof and coupled to an upper surface of the substrate; the first groove is located outside the partition wall and at least a portion of the first groove overlaps with the hole of the receiving portion in the optical axis direction; the second groove of the accommodating portion overlaps with the inside of the partition wall in the optical axis direction.

11. the housing includes a partition wall extending downward from a bottom surface thereof and coupled to a top surface of the substrate; the partition wall overlaps with a frame region on the upper surface of the substrate in the optical axis direction; a frame region on the upper surface of the substrate contacts a lower surface of the partition wall; The camera module according to claim 10 , wherein the upper surface of the substrate is sealed from the outside by the partition wall.

12. At least one lens is disposed in the receiving portion and disposed on one side of the outermost lens, the hole is spaced apart from the at least one lens in a direction perpendicular to the optical axis; The camera module according to claim 10 or 11, wherein the at least one lens is screw-coupled to an inner circumferential surface of the housing portion.

13. A camera module as described in Claim 12, wherein the second groove overlaps with the at least one lens in a direction perpendicular to the optical axis.

14. a connector disposed on a lower surface of the substrate; One side of the transmission member is connected to the connector, and the transmission member has a first region connected to the heating member and a second region connected to the connector. a second region connecting the first region and the second region, and a third region connecting the first region and the second region, The camera module according to any one of claims 11 to 13, wherein the third region of the transmission member is at least partially bent.

15. a retainer coupled to an upper portion of the receiving portion and fixing the outermost lens; The camera module according to any one of claims 11 to 14, further comprising an O-ring disposed between the outermost lens and the retainer.

Images