Mold, resin molding device, and method for manufacturing resin molded product

Abstract

To provide a molding mold capable of preventing a substrate from falling from an upper mold even when the substrate is warped.SOLUTION: A molding mold for resin molding by compression molding includes: an upper mold in which a plurality of substrate suction holes for adsorbing a substrate and a plurality of film suction holes for adsorbing a release film are opened on a lower surface; a lower mold placed below the upper mold in a vertical direction; and a plurality of press members provided on the upper mold so as to be movable up and down so that their lower ends can protrude downward from the lower surface of the upper mold.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a molding die, a resin molding device, and a method for manufacturing a resin molded product. [Background technology]

[0002] Patent Document 1 discloses a resin sealing device in which an upper die release film is placed on an upper die and a workpiece is placed on the upper die release film. Specifically, a plurality of workpiece suction holes are formed in the upper die release film, and a suction device such as a pump sucks the workpiece through the workpiece suction holes, thereby holding the workpiece on the upper die. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-153146 Summary of the Invention [Problem to be solved by the invention]

[0004] However, with the technology described in Patent Document 1, when the mold is opened after resin sealing, warping may occur in the workpiece due to the difference in thermal shrinkage rate between the workpiece and the resin. If warping occurs in the workpiece and the workpiece separates from the workpiece suction holes in the upper mold release film, the workpiece suction holes open, and the suction device sucks in the surrounding air through the workpiece suction holes. This reduces the suction force of the workpiece, and the workpiece may fall from the upper mold.

[0005] Furthermore, the resin sealing device in Patent Document 1 uses an upper mold release film, but even in a resin sealing device that does not use an upper mold release film, there is a possibility that the workpiece may fall if it warps, as in the example described in Patent Document 1.

[0006] The present invention has been made in consideration of the above-described circumstances, and the problem it aims to solve is to provide a molding die, a resin molding device, and a method for manufacturing a resin molded product that can prevent a substrate from falling from the upper die even if warping occurs in the substrate. [Means for solving the problem]

[0007] The problem to be solved by the present invention is as described above, and in order to solve this problem, the molding die according to the present invention is a molding die for molding a resin by compression molding, and comprises an upper die having a plurality of substrate suction holes for suctioning a substrate and a plurality of film suction holes for suctioning a release film formed in a lower surface thereof, a lower die disposed below the upper die in the vertical direction, and a lower die disposed on the upper die so as to be movable up and down so that its lower end can protrude downward from the lower surface of the upper die. and pressing the release film adsorbed to the upper die against the substrate adsorbed to the upper die. and a plurality of pressing members.

[0008] A resin molding apparatus according to the present invention includes the molding die and a mold clamping mechanism for clamping the molding die.

[0009] Furthermore, the method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product using the resin molding apparatus, and includes a film placement process for placing the release film on the molding mold, a loading process for loading a resin material into the molding mold, a mold clamping process for clamping the molding mold, a resin molding process for hardening the resin material to mold a resin, and a mold opening process for opening the molding mold. [Effects of the Invention]

[0010] According to the present invention, even if warpage occurs in the substrate, the substrate can be prevented from falling off the upper mold. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a front cross-sectional view showing the configuration of a resin molding apparatus according to a first embodiment. [Figure 2] 1A is a bottom view of the adsorption member, and FIG. 1B is a bottom view of the release film provided on the upper mold. [Figure 3] 1 is a flowchart showing a method for manufacturing a resin molded product. [Figure 4] FIG. 2 is a front cross-sectional view showing the resin molding apparatus in a state where a substrate is sucked onto an upper die. [Figure 5] FIG. 2 is a front cross-sectional view showing the resin molding apparatus during a resin molding process. [Figure 6] FIG. 10 is a front cross-sectional view of the resin molding apparatus showing a state in which the substrate is deformed after the mold is opened. [Figure 7] FIG. 10 is a front cross-sectional view showing the configuration of a resin molding device when a substrate is sandwiched between an upper mold and a lower mold. [Figure 8] FIG. 10 is a front cross-sectional view showing the configuration of a resin molding apparatus according to a second embodiment. [Figure 9] FIG. 10 is a front cross-sectional view of the resin molding apparatus showing a state in which the substrate is deformed after the mold is opened. [Figure 10] FIG. 10 is a front cross-sectional view showing the configuration of a resin molding device when a substrate is sandwiched between an upper mold and a lower mold. DETAILED DESCRIPTION OF THE INVENTION

[0012] <Resin molding apparatus 100 (first embodiment)> First, a resin molding apparatus 100 according to a first embodiment will be described with reference to FIG.

[0013] The resin molding apparatus 100 shown in FIG. 1 is an apparatus capable of resin molding by compression molding. The resin molding apparatus 100 according to this embodiment can produce a resin molded product by resin-encapsulating electronic elements such as semiconductor chips fixed to a substrate W, which is a molding target. The substrate W can be a semiconductor substrate such as a silicon wafer, a metal substrate, a glass substrate, a ceramic substrate, or a resin substrate. The substrate W may or may not be wired. In each embodiment described below, a circular or rectangular substrate W is used. Note that FIG. 2 shows an example in which a circular substrate W is used. The resin molding apparatus 100 mainly includes a molding die 110, a pump 150, a mold clamping mechanism 160, and the like.

[0014] The molding die 110 forms a cavity C into which a thermosetting resin material R is poured. The molding die 110 mainly includes a lower die 120, an upper die 130, and a pressing member 140.

[0015] The lower mold 120 mainly comprises a lower mold base member 121, a bottom member 122, side members 123, an elastic member 124, and the like.

[0016] The lower mold base member 121 supports a bottom member 122 and a side member 123, which will be described later.

[0017] The bottom surface member 122 forms the bottom surface of the cavity C. The bottom surface member 122 is formed, for example, in a circular or rectangular shape when viewed from above. The bottom surface member 122 is formed to have an appropriate vertical width. The bottom surface member 122 is placed on the upper surface of the lower mold base member 121.

[0018] The side surface member 123 surrounds the bottom surface member 122 from the sides. The side surface member 123 is formed to have an appropriate vertical width. A hollow portion is formed in the side surface member 123, penetrating the center of the side surface member 123 from top to bottom. The hollow portion of the side surface member 123 is formed in a shape that generally matches the outer shape of the bottom surface member 122 in a plan view.

[0019] In this way, the side surface member 123 is formed in a frame shape that is circular or rectangular in plan view. The bottom surface member 122 is placed in the hollow portion of the side surface member 123. The side surface member 123 is placed on the upper surface of the lower mold base member 121 via an elastic member 124, which will be described later. The upper surface of the side surface member 123 is located higher than the upper surface of the bottom surface member 122. A cavity C for resin molding is defined by the side surface member 123, the bottom surface member 122, and an upper mold 130, which will be described later.

[0020] The elastic member 124 is disposed between the side member 123 and the lower die base member 121. The elastic member 124 is formed, for example, by a compression coil spring that can expand and contract in the vertical direction.

[0021] In addition, suction holes (not shown) for suctioning and holding the release film F are appropriately formed on the upper surface of the lower mold 120 (bottom surface member 122 and side surface member 123). By creating a negative pressure in these suction holes using a pump or the like (not shown), the release film F can be suctioned and held.

[0022] The upper mold 130 is disposed vertically above the lower mold 120. It mainly comprises an upper mold base member 131, an adsorption member 132, and the like.

[0023] The upper mold base member 131 supports the suction member 132, which will be described later. The upper mold base member 131 is formed, for example, in a circular or rectangular shape when viewed from above. The upper mold base member 131 is formed to have an appropriate vertical width. The upper mold base member 131 is formed with a central recess 131a, a central through-hole 131b, an annular recess 131c, and outer through-holes 131d.

[0024] The central recess 131a is a recessed portion formed in the center of the lower surface of the upper mold base member 131. The central recess 131a is formed, for example, in a circular or rectangular shape when viewed from the bottom. The central recess 131a is formed so as to cover the range in which the substrate suction holes 132a and through-holes 132c of the suction member 132, which will be described later, are formed.

[0025] The central through-hole 131b is a hole formed near the center of the central recess 131a so as to penetrate the upper mold 130 from top to bottom.

[0026] The annular recess 131c is a recessed portion formed in an annular shape that surrounds the central recess 131a from the outside on the lower surface of the upper mold base member 131. The annular recess 131c is formed, for example, in an annular shape when viewed from the bottom. The annular recess 131c is formed on the lower surface of the upper mold base member 131 with an appropriate gap between it and the central recess 131a so that it is not connected to the central recess 131a.

[0027] The outer through-holes 131d are holes formed in the annular recess 131c so as to penetrate vertically through the upper mold 130. A plurality of outer through-holes 131d are formed along the annular recess 131c.

[0028] The suction member 132 suctions and holds the release film F and the substrate W. The suction member 132 is formed, for example, in a circular or rectangular shape in a plan view (the same shape as the upper mold base member 131). The suction member 132 is formed to have an appropriate vertical width. The suction member 132 is fixed to the lower surface of the upper mold base member 131. The suction member 132 is formed with substrate suction holes 132a, film suction holes 132b, and through-holes 132c.

[0029] The substrate suction holes 132a shown in Figures 1 and 2(a) are for suctioning the substrate W. The substrate suction holes 132a are formed so as to penetrate the suction member 132 from top to bottom. As shown in Figure 2(a), a plurality of substrate suction holes 132a are formed in an area facing the substrate W to be suctioned. In the example shown in Figure 2(a), a circular substrate W is used, so the substrate suction holes 132a are also formed over a circular area. The substrate suction holes 132a are formed so as to be continuous with the central recess 131a of the upper mold base member 131.

[0030] 1 and 2(a) is for adsorbing the release film F. The film adsorption holes 132b are formed so as to penetrate vertically through the adsorption member 132. A plurality of film adsorption holes 132b are formed so as to be arranged in a ring shape along the annular recess 131c of the upper mold base member 131.

[0031] The through-hole 132c is for arranging a pressing member 140, which will be described later. The through-hole 132c is formed so as to penetrate the adsorption member 132 from top to bottom. As shown in FIG. 2(a), the through-hole 132c is formed so as to face the outer periphery of the substrate W to be adsorbed. A plurality of the through-holes 132c are formed so as to be arranged in a ring shape along the circumferential direction of the substrate W.

[0032] 2(a), the substrate suction holes 132a and the through-holes 132c are formed inside an area surrounded by a plurality of film suction holes 132b. Specifically, the substrate suction holes 132a and the through-holes 132c are formed inside an area (a substantially circular area in bottom view) defined by connecting adjacent film suction holes 132b.

[0033] Furthermore, the substrate suction hole 132a is formed inside an area surrounded by the plurality of through holes 132c. Specifically, the substrate suction hole 132a is formed inside an area (a substantially circular area in bottom view) defined by connecting adjacent through holes 132c.

[0034] In Figure 2(a), the sizes of the substrate suction holes 132a, etc. are shown as being extremely different to make it easier to distinguish between the substrate suction holes 132a, the film suction holes 132b, and the through holes 132c, but the sizes of the substrate suction holes 132a, etc. are not limited to the example shown in the figure and can be set arbitrarily.

[0035] 1 presses downward the release film F adsorbed to the upper die 130. The pressing member 140 mainly includes a pressing portion 141 and a restricting portion 142.

[0036] The pressing portion 141 is a portion formed in a vertically long columnar (rod-like) shape. The cross section of the pressing portion 141 is formed in a circular shape, similar to the through-hole 132c of the adsorption member 132. The length of the pressing portion 141 is formed to be longer than the vertical width of the adsorption member 132. The pressing portion 141 is inserted into the through-hole 132c. The pressing portion 141 can freely move up and down relative to the through-hole 132c.

[0037] A tapered portion 141a is formed at the lower end of the pressing portion 141 so that the diameter gradually decreases downward. By forming the tapered portion 141a, the corner of the lower end of the pressing portion 141 can be made obtuse, which can prevent damage to the release film F. Note that damage to the release film F can also be prevented by making the corner of the lower end of the pressing portion 141 curved (R-shaped).

[0038] The restricting portion 142 is a portion that restricts the downward movement of the pressing portion 141. The restricting portion 142 is formed at a vertical midpoint of the pressing portion 141. The cross section of the restricting portion 142 is formed in a shape that prevents it from passing through the through hole 132c of the adsorption member 132. In this embodiment, the cross section of the restricting portion 142 is formed to be larger than the cross section of the pressing portion 141 and the through hole 132c. For example, the cross section of the restricting portion 142 is formed in a circular shape that is slightly larger than the cross section of the pressing portion 141. The restricting portion 142 can be formed from a separate member from the pressing portion 141, or can be formed from a member that is integrated with the pressing portion 141.

[0039] The pressing portion 141 of the pressing member 140 (the portion below the restricting portion 142) is inserted into the through-hole 132c from above the adsorption member 132. When the pressing portion 141 of the pressing member 140 is inserted into the through-hole 132c, the pressing member 140 moves downward due to its own weight. When the lower end of the pressing portion 141 protrudes downward from the lower surface of the adsorption member 132 by a predetermined amount, the restricting portion 142 comes into contact with the upper surface of the adsorption member 132, and the downward movement of the pressing member 140 is restricted. The upper portion of the pressing member 140 is housed inside the central recess 131a of the upper mold base member 131.

[0040] The pump 150 is used to suck air. The pump 150 is connected to the central through-hole 131b and the outer through-hole 131d of the upper mold base member 131 via an appropriate hose or the like. When the pump 150 is operated, a vacuum is drawn through the outer through-hole 131d and the annular recess 131c to the film suction holes 132b of the suction member 132, creating a negative pressure. This allows the release film F to be adsorbed and held on the lower surface of the suction member 132.

[0041] Furthermore, when the pump 150 is operated, the substrate suction holes 132a of the suction member 132 are evacuated via the central through-hole 131b and the central recess 131a, creating a negative pressure. In this way, negative pressure can be applied to multiple substrate suction holes 132a simultaneously via the central recess 131a. Here, as shown in FIG. 2(b), a large number of minute through-holes F1 are formed in the release film F that is suctioned to the suction member 132 (upper mold 130). The through-holes F1 are formed so as to be located inside the area surrounded by the through-holes 132c of the suction member 132 when the release film F is suctioned to the suction member 132. The through-holes F1 can be formed, for example, using a laser or an appropriate tool (such as a needle or a cutter). When the substrate suction holes 132a of the suction member 132 are under negative pressure, the through-holes F1 of the release film F held by the suction member 132 are also under negative pressure, allowing the substrate W to be suctioned and held against the bottom surface of the release film F.

[0042] In this embodiment, an example is shown in which one pump 150 is used to create negative pressure in the central through-hole 131b and the outer through-hole 131d, but it is also possible to create negative pressure in the central through-hole 131b and the outer through-hole 131d using separate pumps 150, for example.

[0043] The mold clamping mechanism 160 performs mold clamping and mold opening by raising and lowering the lower mold 120. The mold clamping mechanism 160 mainly includes a base 161, a drive mechanism 162, and the like.

[0044] Base 161 supports forming die 110 etc. Base 161 is disposed below forming die 110 (lower die 120).

[0045] The drive mechanism 162 is for raising and lowering the lower mold 120. A ball screw mechanism, a hydraulic cylinder, a toggle mechanism, or the like can be used as the drive mechanism 162. The drive mechanism 162 is disposed between the base 161 and the lower mold base member 121.

[0046] The operation of each part of the resin molding apparatus 100 described above is appropriately controlled by a control device (not shown).

[0047] <Manufacturing method for resin molded products> Next, an example of a method for manufacturing a resin molded product using the resin molding apparatus 100 will be described.

[0048] 3, the method for manufacturing a resin molded product according to this embodiment mainly includes a film placement step S10, a carry-in step S20, a mold clamping step S30, a resin molding step S40, a mold opening step S50, and a carry-out step S60. These steps will be described in order below.

[0049] The film placement step S10 is a step of placing a release film F (see FIG. 1) on the lower mold 120 and the upper mold 130.

[0050] Specifically, in the film placement step S10, two release films F are carried into the molding die 110 by a predetermined conveying device. The two release films F are adsorbed and held on the upper surface of the lower die 120 and the lower surface of the upper die 130, respectively.

[0051] At this time, one release film F is adsorbed to the lower mold 120 and is arranged so as to follow the shape of the upper surface of the lower mold 120. The other release film F is adsorbed to the film adsorption holes 132b of the upper mold 130, which has been put under negative pressure by the operation of the pump 150. The release film F adsorbed to the upper mold 130 is pressed slightly downward by the pressing member 140 protruding from the adsorption member 132, so that a portion of the release film F is held in a state where it is floating above the lower surface of the upper mold 130.

[0052] By providing the release film F on the molding die 110, it is possible to prevent the resin material R from adhering to the surface of the molding die 110. Furthermore, if foreign matter is adhering to the surface of the upper die 130, the release film F is disposed between the upper die 130 and the substrate W, which prevents the foreign matter from coming into direct contact with the substrate W and suppresses damage to the substrate W. Furthermore, if foreign matter is adhering to the surface of the molding die 110 (release film F), the foreign matter can be easily removed by replacing the release film F.

[0053] The release film F may be placed on either the lower mold 120 or the upper mold 130 first, or the release film F may be placed on the lower mold 120 and the upper mold 130 simultaneously.

[0054] After the release film F is adsorbed to the lower mold 120 and the upper mold 130, the process moves from the film placement step S10 to the carry-in step S20.

[0055] The loading step S20 is a step of loading the resin material R and the substrate W into the molding die 110.

[0056] Specifically, in the carrying-in step S20, the resin material R is carried into the molding die 110 by a predetermined carrying device. The resin material R is accommodated inside the lower die 120 (inside the side member 123). Note that the resin material R can be in various states, such as a solid powdered or granular resin (including a granular resin) or a liquid resin.

[0057] In addition, in the carrying-in step S20, the substrate W is carried into the forming mold 110 by a predetermined transport device. As shown in Fig. 4, the substrate W is adsorbed into the substrate adsorption holes 132a of the upper mold 130, which has been made negative pressure by the operation of the pump 150. As a result, the substrate W is held in close contact with the lower surface of the adsorption member 132 via the release film F. At this time, the pressing member 140 is pushed upward by the substrate W adsorbed to the adsorption member 132.

[0058] The order in which the resin material R and the substrate W are carried in is not particularly limited, and either one may be carried into the molding die 110 first, or they may be carried into the molding die 110 at the same time.

[0059] After the resin material R and the substrate W have been loaded, the loading step S20 is followed by the mold clamping step S30.

[0060] The mold clamping step S30 is a step of closing (clamping) the forming mold 110 (lower mold 120 and upper mold 130).

[0061] Specifically, in the mold clamping step S30, first, a heating mechanism (not shown) provided in the lower mold 120 melts the resin material R contained in the cavity C if it is solid, or reduces the viscosity if it is liquid. Next, the drive mechanism 162 is driven, causing the lower mold 120 to rise toward the upper mold 130. When the lower mold 120 rises to a predetermined position, the upper surface of the side member 123 comes into contact with the lower surface of the upper mold 130, and the lower mold 120 (the space containing the resin material R) is blocked from above by the upper mold 130.

[0062] As shown in Fig. 5, when the drive mechanism 162 is further driven, the bottom member 122 of the lower mold 120 further rises toward the upper mold 130. At this time, the side member 123 does not rise because it is in contact with the upper mold 130. In other words, the bottom member 122 rises relative to the side member 123. When the bottom member 122 rises, the resin material R contained in the lower mold 120 is pressurized. When the bottom member 122 has risen to a certain extent, mold clamping is completed.

[0063] When clamping the mold, it is preferable to reduce the pressure by sucking out the air inside the molding die 110. This allows the air and gas in the resin material R to be discharged.

[0064] After the mold clamping is completed, the mold clamping step S30 is followed by the resin molding step S40.

[0065] The resin molding step S40 is a step of hardening the resin material R to perform resin molding.

[0066] Specifically, in the resin molding step S40, the resin material R is kept pressurized for a predetermined time as shown in Fig. 5. This allows the resin material R to harden and resin molding can be performed on the substrate W. Note that the illustrated example shows a method of resin molding that extends to the outside of the substrate W (overmolding).

[0067] After the resin material R has hardened, the process moves from the resin molding step S40 to the mold opening step S50.

[0068] The mold opening step S50 is a step of opening (opening) the forming mold 110 (lower mold 120 and upper mold 130).

[0069] 6, in the mold opening step S50, the driving mechanism 162 is driven, and the lower mold 120 descends so as to separate from the upper mold 130. As a result, the lower mold 120 separates from the lower surface of the upper mold 130.

[0070] Here, the resin-molded substrate W (resin molded product) may be deformed (warped) due to the difference in thermal shrinkage rate between the substrate W and the resin material R. For example, FIG. 6 shows an example in which the outer periphery of the resin-molded substrate W is bent downward. When such deformation occurs, in a conventional resin molding apparatus, the substrate W may move away from the substrate suction hole 132a (through hole F1), causing the substrate suction hole 132a to be opened (a state in which the air inside the substrate suction hole 132a is connected to the air surrounding the resin molding apparatus (outside air)). When the substrate suction hole 132a is opened, the surrounding air is sucked into the central recess 131a through the substrate suction hole 132a, reducing the negative pressure generated by the pump 150 and potentially causing the substrate W to fall.

[0071] Therefore, in this embodiment, the pressing member 140 is provided to prevent the substrate W from falling. Specifically, as shown in FIG. 6, when the outer peripheral portion of the resin-molded substrate W bends downward, the pressing member 140 moves downward due to its own weight. The movement of the pressing member 140 presses the release film F downward so as to follow the substrate W. This allows the through holes F1 of the release film F to remain in close contact with the substrate W, so that the substrate suction holes 132a are not opened and the negative pressure created by the pump 150 can be maintained. Therefore, the suction force of the substrate W is not reduced, and the substrate W can be prevented from falling.

[0072] After the mold opening is completed, the mold opening step S50 is followed by the carry-out step S60.

[0073] The carrying-out step S60 is a step of carrying out the resin molded article from the molding die 110. In the carrying-out step S60, the resin molded article is carried out from the molding die 110 by a predetermined conveying device.

[0074] In this way, in this embodiment, even if deformation occurs in the resin-molded substrate W (resin molded product), it is possible to suppress a decrease in the suction force of the pump 150 and prevent the substrate W from falling.

[0075] 6 and other figures show an example in which resin molding is performed up to the outside of the substrate W (overmolding), but the present invention is not limited to this. For example, as shown in Fig. 7, when clamping the mold, the outer periphery of the substrate W can be sandwiched between the side members 123 of the lower mold 120 and the suction members 132 of the upper mold 130, so that resin molding can be performed only on the lower surface of the substrate W.

[0076] <Resin molding apparatus 200 (second embodiment)> A resin molding apparatus 200 according to the second embodiment will be described below with reference to FIGS.

[0077] The resin molding apparatus 200 according to the second embodiment differs from the resin molding apparatus 100 according to the first embodiment in that the upper mold 130 includes an elastic member 133, an annular member 134, and a spacer 135. Therefore, the following mainly describes this difference, and a description of the same configuration as in the first embodiment will be omitted.

[0078] The elastic member 133 shown in FIG. 8 is for pressing the pressing member 140 downward. In this embodiment, a compression coil spring is used as the elastic member 133. The elastic member 133 is disposed in the central recess 131a of the upper mold base member 131. The elastic member 133 is disposed between the regulating portion 142 of the pressing member 140 and the upper mold base member 131, and constantly urges the pressing member 140 downward. This increases the force with which the pressing member 140 presses the release film F downward, allowing the release film F to more reliably follow the substrate W.

[0079] The annular member 134 is a member arranged to surround from the outside the substrate W that is sucked onto the suction member 132. The annular member 134 is formed in a circular ring shape or a rectangular ring shape when viewed from the bottom. A recess 132d that is circular in bottom view or a rectangular ring shape when viewed from the bottom is formed in the bottom surface of the suction member 132 so as to surround the substrate suction holes 132a and the through-holes 132c from the outside. The annular member 134 is arranged in the recess 132d of the suction member 132.

[0080] The spacer 135 is used to adjust the vertical position of the annular member 134. The spacer 135 is formed in the same shape (circular ring or rectangular ring) as the annular member 134 when viewed from the bottom. The spacer 135 is formed so that its vertical width is smaller than that of the annular member 134. The spacer 135 is disposed between the annular member 134 and the adsorption member 132.

[0081] By disposing spacers 135 between the annular member 134 and the adsorption member 132, the lower surface of the annular member 134 is disposed so as to protrude downward below the lower surface of the adsorption member 132. The protrusion amount of the annular member 134 can be adjusted as desired by changing the vertical width of the spacers 135 or by changing the number of spacers 135.

[0082] Film suction holes 134a are formed in the annular member 134 and the spacer 135 at positions corresponding to the film suction holes 132b of the suction member 132. The film suction holes 134a are formed to pass through the annular member 134 and the spacer 135 from top to bottom, and are connected to the film suction holes 132b.

[0083] In this way, the lower surface of the upper mold 130 is formed in a stepped shape by a first surface X1 on which the substrate suction holes 132a and the through holes 132c are formed, and a second surface X2 formed below the first surface X1 and on which the film suction holes 134a are formed.

[0084] Using the resin molding apparatus 200 configured in this manner, a resin molded product can be manufactured in the same steps as in the first embodiment (see FIG. 3).

[0085] In the film placement step S10, the release film F provided on the upper mold 130 is adsorbed to the film adsorption holes 134a of the annular member 134.

[0086] 9, in the mold opening step S50, when the outer peripheral portion of the resin-molded substrate W (resin molded product) is bent downward, the pressing member 140 moves downward, as in the first embodiment. At this time, since the pressing member 140 is pressed downward by the elastic member 133, it is possible to make the release film F easily follow the substrate W.

[0087] Furthermore, since the release film F is attracted to the annular member 134, which is positioned below the attracting member 132, the release film F can be pressed downward without difficulty by the pressing member 140. This makes it easier for the release film F to follow the substrate W. Particularly in this embodiment, the position of the second surface X2 in the vertical direction (up and down position) can be adjusted by the spacer 135. Therefore, for example, by determining the amount of deformation of the substrate W in advance and adjusting the position of the second surface X2 so that it is at a position according to this amount of deformation, it is possible to make it easier for the release film F to follow the substrate W.

[0088] 8 and 9 show an example (overmolding) in which resin molding is performed up to the outside of the substrate W, but the present invention is not limited to this. For example, as shown in Fig. 10, when clamping the mold, it is also possible to sandwich the outer periphery of the substrate W between the side member 123 of the lower mold 120 and the suction member 132 of the upper mold 130, thereby performing resin molding only on the lower surface of the substrate W. In this case, the thickness of the substrate W is set to be thicker than the step between the lower surface of the suction member 132 and the lower surface of the annular member 134.

[0089] Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and appropriate modifications are possible within the scope of the technical idea of ​​the invention described in the claims.

[0090] For example, the number, shape, arrangement, etc. of the substrate suction holes 132a, film suction holes 132b, and pressing members 140 can be changed as desired.

[0091] 2 shows an example in which a circular substrate W (see FIG. 2) is used, the shape of the substrate W is not limited to this, and for example, a rectangular substrate W may be used. Furthermore, the arrangement of the substrate suction holes 132a, film suction holes 132b, and pressing members 140 may be changed as desired depending on the shape of the substrate W. For example, when a rectangular substrate W is used, the pressing members 140 may be arranged in a rectangular shape along the outer periphery of the substrate W. Furthermore, the shape of each part (molding die 110, etc.) of the resin molding apparatus 100 may be changed as desired to a circular shape in a plan view, a rectangular shape in a plan view, or the like depending on the shape of the substrate W (circular, rectangular, etc.).

[0092] Furthermore, in the above-described embodiments, an example has been shown in which the outer peripheral portion of the substrate W is bent downward (see FIG. 6, etc.), but this deformation of the substrate W is just one example, and the manner of deformation may vary depending on the shape of the substrate W, the resin material R used for resin molding, and the like. Therefore, it is desirable to arrange the pressing members 140 so as to be able to accommodate various modes of deformation of the substrate W. For example, it is desirable to arrange the pressing members 140 evenly in locations where the substrate W may bend downward. By arranging them in this manner, no matter which location of the substrate W bends downward, the pressing members 140 arranged in that location can press down the release film F, allowing the release film F to follow the substrate W.

[0093] Furthermore, the present invention is not limited to the molding die 110 (resin molding apparatus 100 / 200) in which a release film F is provided on the upper die 130 to prevent contamination of the upper die 130 (such as adhesion of the resin material R), but can also be applied to other molding dies (resin molding apparatuses). For example, in a configuration in which the upper surface of the cavity C is completely covered by the substrate W, such as the resin molding apparatuses 100 / 200 shown in FIGS. 7 and 10, the resin material R does not adhere to the upper die 130. In this case, from the perspective of preventing contamination of the upper die 130, it is not necessary to provide the release film F on the upper die 130. However, even in a molding die that does not require the use of a release film F to prevent contamination, etc., it is possible to use the release film F, the pressing member 140, etc., as in the above-described embodiments, from the perspective of preventing the substrate W from falling.

[0094] In addition, in each of the above embodiments, an example has been shown in which the upper part of the pressing member 140 is disposed in the central recess 131a of the upper die base member 131 to which negative pressure is applied by the pump 150 (see FIG. 1), but the present invention is not limited to this, and the arrangement of the pressing member 140 can be changed as desired. For example, the pressing member 140 can be disposed in a recess provided separately from the central recess 131a, or can be disposed so as to penetrate the upper die 130 from top to bottom.

[0095] Furthermore, in the second embodiment, an example was shown in which a compression coil spring was used as the elastic member 133 that presses down the pressing member 140 (see FIG. 8, etc.), but the present invention is not limited to this, and various other elastic members (for example, a leaf spring, a tension coil spring, etc.) can also be used. Furthermore, in the second embodiment, an example was shown in which the elastic member 133 is used to press down the pressing member 140, but the configuration for pressing the pressing member 140 is not limited to this. For example, instead of an elastic member, it is also possible to press down the pressing member 140 using various actuators such as a motor or an air cylinder.

[0096] Furthermore, the manufacturing method of a resin molded product shown in each of the above embodiments (see FIG. 3) is an example and can be modified as appropriate. For example, each of the above embodiments shows an example in which a release film F is placed on the molding die 110 in the film placement step S10, and then the resin material R is carried in the carry-in step S20, but it is also possible to place the resin material R on the release film F to be placed on the lower die 120, and then place the release film F together with the resin material R on the lower die 120.

[0097] Furthermore, in each of the above embodiments, an example was shown in which a thermosetting resin material was used as the resin material R, but the present invention is not limited to this, and a thermoplastic resin material may also be used.

[0098] <Additional Notes> The mold 110 of the first aspect of the present disclosure comprises: A molding die 110 for resin molding by compression molding, an upper mold 130 having a plurality of substrate suction holes 132a for suctioning the substrate W and a plurality of film suction holes 132b for suctioning the release film F formed in the lower surface thereof, the upper mold 130 having openings therein; a lower mold 120 disposed below the upper mold in the vertical direction; a plurality of pressing members 140 provided on the upper mold 130 so as to be movable up and down so that their lower ends can protrude downward from the lower surface of the upper mold 130; It is equipped with: According to the molding die 110 of the first aspect of the present disclosure, even if warpage occurs in the substrate W, it is possible to prevent the substrate W from falling off the upper die 130. That is, the pressing member 140 can press down the release film F so as to follow the deformation of the substrate W, thereby preventing the substrate suction holes 132a from opening and maintaining a negative pressure for suctioning the substrate W.

[0099] In the second side mold 110 according to the first side, The plurality of pressing members 140 are arranged inside an area surrounded by the plurality of film suction holes 132b when viewed in the vertical direction, The plurality of substrate suction holes 132a are formed inside an area surrounded by the plurality of pressing members 140 when viewed in the vertical direction. According to the molding die 110 of the second aspect of the present disclosure, by pressing down the release film F with the pressing member 140 arranged outside the substrate suction hole 132a, it is possible to make it easier for the release film F to follow the warping of the outer peripheral portion of the substrate W.

[0100] The mold 110 of the third side according to the first or second side is The device further includes an elastic member 133 that presses the pressing member 140 downward. According to the molding die 110 of the third aspect of the present disclosure, the force with which the pressing member 140 presses down the release film F is increased, making it easier for the release film F to conform to the warpage of the substrate W.

[0101] In a molding die 110 of a fourth side according to any one of the first to third sides, The pressing member 140 is provided with a restricting portion 142 that restricts downward movement. According to the molding die 110 of the fourth aspect of the present disclosure, it is possible to prevent the pressing member 140 from falling off.

[0102] In a fifth side mold 110 according to any one of the first to fourth sides, The lower end of the pressing member 140 is tapered or has rounded corners. According to the molding die 110 of the fifth aspect of the present disclosure, damage to the release film F can be prevented.

[0103] In a sixth side mold 110 according to any one of the first to fifth sides, The lower surface of the upper mold 130 is a first surface X1 on which the pressing member 140 is disposed; a second surface X2 in which a plurality of the film suction holes 134a are formed and which is positioned below the first surface X1; It is equipped with: According to the molding die 110 of the sixth aspect of the present disclosure, the pressing member 140 can press the release film F downward without any strain.

[0104] In the molding die 110 of the seventh side according to the sixth side, The upper mold 130 is configured so that the position of the second surface X2 in the vertical direction can be adjusted. According to the molding die 110 of the seventh aspect of the present disclosure, by adjusting the position of the second surface X2 to a position corresponding to the warpage of the substrate W, it is possible to make the release film F more easily conform to the warpage of the substrate W.

[0105] The resin molding apparatus 100 / 200 of the eighth aspect is a mold 110 according to any one of the first to seventh sides; a mold clamping mechanism 160 that clamps the forming mold 110; It is equipped with: According to the resin molding apparatuses 100 and 200 of the eighth aspect of the present disclosure, even if the substrate W is warped, it is possible to prevent the substrate W from falling off the upper mold 130.

[0106] A manufacturing method of a resin molded product according to a ninth aspect of the present invention includes: A method for manufacturing a resin molded product using a resin molding apparatus 100 / 200 according to an eighth aspect, a film placement step S10 of placing the release film F on the molding die 110; a loading step S20 of loading a resin material R into the molding die 110; a mold clamping step S30 for clamping the forming mold 110; a resin molding step S40 in which the resin material R is hardened to perform resin molding; a mold opening step S50 for opening the molding die 110; Includes. According to the method for manufacturing a resin molded product of the ninth aspect of the present disclosure, even if the substrate W is warped, it is possible to prevent the substrate W from falling off the upper mold 130. [Explanation of symbols]

[0107] 100 Resin molding equipment 110 Molding mold 120 Lower mold 130 Upper mold 132a Board suction hole 132b Film suction hole 133 Elastic Members 140 Pressing member 142 Regulatory Department 160 Mold clamping mechanism 200 Resin molding equipment

Claims

1. A molding die for resin molding by compression molding, an upper mold having a plurality of substrate suction holes for suctioning a substrate and a plurality of film suction holes for suctioning a release film formed on a lower surface thereof, the upper mold having such openings; a lower mold disposed below the upper mold in the vertical direction; a plurality of pressing members that are provided on the upper mold so as to be movable up and down so that their lower ends can protrude downward from the lower surface of the upper mold, and that press the release film that is adsorbed to the upper mold against the substrate that is adsorbed to the upper mold; A molding die comprising:

2. the pressing members are arranged inside an area surrounded by the film suction holes when viewed in the vertical direction, the plurality of substrate suction holes are formed inside an area surrounded by the plurality of pressing members when viewed in the vertical direction; The mold according to claim 1 .

3. Further, an elastic member is provided to press the pressing member downward. The mold according to claim 1 .

4. The pressing member has a restricting portion that restricts downward movement. The mold according to claim 1 .

5. The lower end of the pressing member is formed to be tapered or have rounded corners. The mold according to claim 1 .

6. The lower surface of the upper mold is a first surface on which the pressing member is disposed; a second surface having a plurality of the film suction holes formed therein and positioned below the first surface; Equipped with The mold according to claim 1 .

7. The upper mold is configured so that the position of the second surface in the vertical direction can be adjusted. The mold according to claim 6.

8. The mold according to any one of claims 1 to 7, a mold clamping mechanism that clamps the molding die; A resin molding device comprising:

9. A method for manufacturing a resin molded product using the resin molding apparatus according to claim 8, a film placement step of placing the release film on the molding die; a loading step of loading a resin material into the molding die; a mold clamping step of clamping the molding die; a resin molding step of hardening the resin material to perform resin molding; a mold opening step of opening the molding mold; A method for producing a resin molded product, comprising:

Images