Mounting device and mounting method

Abstract

To provide a mounting device and a mounting method capable of realizing high accuracy mounting in which a mounting accuracy becomes 1 μm or less in a face-down mounting for mounting a chip component and a substrate in a manner that both of electrode surfaces face each other.SOLUTION: A mounting device comprises: an attachment tool having transparency and having a tool recognition mart, for holding a chip component; chip position recognition means for acquiring position information on a chip recognition mark and the tool recognition mark at the same time in a state where the chip component is held by the attachment tool; and substrate position recognition means for acquiring the position information on a substrate recognition mark and the tool recognition marl. On the basis of information obtained by the chip position recognition means and the information obtained by the substrate position recognition means, the substrate stage or the attachment tool is moved in a substrate inner surface direction and positioning of the chip component and the substrate is performed. A mounting method is also provided.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a mounting apparatus and a mounting method for mounting chip components on a substrate. In particular, it relates to a mounting apparatus and a mounting method for performing mounting by opposing the electrode surface of a chip component to the electrode surface of a substrate.

Background Art

[0002] As one form of mounting chip components such as semiconductor chips on a substrate such as a wiring board, there is face-down mounting in which the electrode surface of a chip component is opposed to the electrode surface of the substrate for mounting.

[0003] FIG. 17 shows an example of a substrate S for face-down mounting. A chip component is joined to a mounting location SC of the substrate S with the electrode surfaces facing each other. At this time, if the chip component is not accurately placed at the mounting location SC of the substrate S, the electrical connection between the substrate S and the chip component will be incomplete, causing poor quality of the semiconductor device. For this reason, on each mounting location SC of the substrate S, as substrate recognition marks AS, a substrate recognition first mark AS1 and a substrate recognition second mark AS2 are provided on the electrode surface side as shown in FIG. 17. On the other hand, the chip component also has chip recognition marks AC, namely a chip recognition first mark AC1 and a chip recognition second mark AC2. In the state shown in FIG. 18, the relative position of the chip component C with respect to the mounting location SC of the substrate S (in the direction within the plane of the substrate S) is obtained from the positional relationship between the substrate recognition first mark AS1 and the chip recognition first mark AC1 and the positional relationship between the substrate recognition second mark AS2 and the chip recognition second mark AC2, and the positional accuracy can be improved by correcting this.

[0004] Specifically, in the mounting apparatus shown in FIG. 19, upper and lower two-field cameras 500 are used. The upper field 50U of the upper and lower two-field cameras 500 includes the chip recognition first mark AC1 (or the chip recognition second mark AC2) in the field of view, and the lower field 50D includes the substrate recognition first mark AS1 (or the substrate recognition second mark AS2) in the field of view for imaging (FIG. 20).

[0005] By using these two-view cameras (upper and lower) to determine and correct the relative position of the chip component C with respect to the mounting location SC on the substrate S (in the direction of the substrate S plane), mounting with a maximum error of a few micrometers is possible. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2020-11970 [Overview of the project] [Problems that the invention aims to solve]

[0007] The maximum error value of a few micrometers was sufficient when the electrode pitch was 100 μm, using solder bumps as electrodes for chip component C in face-down mounting, also known as flip-chip mounting. However, when the electrode pitch is slightly over 50 μm, using Cu pillar bumps, there is no margin for error. Furthermore, with the advancement of high-density mounting and the resulting narrowing of electrode pitches, there are applications where the accuracy is insufficient.

[0008] Therefore, we are trying to further improve accuracy by using two cameras with vertical and horizontal fields of view. However, even if the chip component C is aligned with the mounting location SC on the substrate S with an error of less than 1 μm (in the direction of the substrate S plane) in the state shown in Figure 20, the maximum error during the mounting stage may exceed 1 μm. This is due to factors such as a slight inclination in the direction of descent when the chip C descends toward the substrate S from the state shown in Figure 20. For this reason, we are trying to solve this by increasing the processing accuracy and rigidity of each part of the mounting device so that the direction of descent is perpendicular to the surface that holds the substrate S, but this affects the cost of the device.

[0009] Therefore, if the substrate S and chip components C are aligned as close together as possible, it is expected that the mounting accuracy will improve. However, when using a two-view camera (upper and lower), it is difficult to significantly improve the current situation due to the thickness and focal length of the camera itself.

[0010] On the other hand, in face-up mounting, as shown in Figure 21, where the electrode surface of the substrate S and the electrode surface of the chip component C face the same direction, a mounting apparatus 100 with the configuration shown in Figure 22 can be used to observe the positional relationship between the first substrate recognition mark AS1 and the first chip recognition mark AC1, as shown in Figure 23(a), and the positional relationship between the second substrate recognition mark AS2 and the second chip recognition mark AC2, as shown in Figure 23(b), from the same direction. This makes it possible to align the substrate S and the chip component C while keeping them as close together as possible (Patent Document 1, etc.).

[0011] Therefore, in face-down mounting, by providing a chip recognition mark AC on the side opposite to the electrode surface of the chip component C, it is possible to align the substrate S and the chip component C in a state where they are as close together as possible, similar to the face-up mounting shown in Figure 23.

[0012] However, since the purpose of alignment is to ensure reliable bonding between the electrodes of the chip component C and the substrate S, the chip recognition mark AC needs to be applied with high precision relative to the electrodes of the chip component C. However, accurately and precisely positioning the chip recognition mark AC relative to the electrodes on the opposite side is extremely difficult, making it unsuitable as a means of performing high-precision face-down mounting. Furthermore, it is necessary to add a new process for drawing the recognition mark on the opposite side of the electrode surface, which is undesirable from the standpoint of process cost.

[0013] The present invention has been made in view of the above problems, and provides a mounting apparatus and mounting method that enables high-precision mounting with a mounting accuracy of 1 μm or less in face-down mounting, where electrode surfaces are mounted facing each other. [Means for solving the problem]

[0014] To solve the above problems, the invention described in claim 1 is: A mounting apparatus for mounting a chip component having a chip recognition mark for alignment and a substrate having a substrate recognition mark for alignment, with the side having the chip recognition mark and the side having the substrate recognition mark facing each other, An attachment tool having a tool recognition mark and having transparency, which holds the opposite side of the chip component to the side having the chip recognition mark; a mounting head that holds the attachment tool at its tip; a lifting means for raising and lowering the mounting head in a direction perpendicular to the substrate; a substrate stage for holding the substrate; and a chip position recognition means for simultaneously acquiring the position information of the chip recognition mark and the position information of the tool recognition mark while the chip component is held by the attachment tool. The system comprises a substrate position recognition means for acquiring the position information of the substrate recognition mark and the position information of the tool recognition mark, the mounting head, the lifting means, the substrate stage, the chip position recognition means, and a control unit connected to the substrate position recognition means, At least one of the substrate stage and the attachment tool is movable in the direction in the substrate plane, This mounting apparatus aligns the chip component with the substrate based on the information obtained by the chip position recognition means and the information obtained by the substrate position recognition means, by having the control unit move the substrate stage or the attachment tool in the direction of the substrate plane.

[0015] The invention described in claim 2 is the mounting device described in claim 1, The mounting apparatus is capable of moving the substrate position recognition means independently of the mounting head, and acquiring positional information of at least one of the substrate recognition mark and the tool recognition mark through the attachment tool.

[0016] The invention described in claim 3 is a mounting device according to claim 1 or claim 2, The bonding head is a mounting device having a tool positioning mechanism for adjusting the position of the attachment tool in the in-plane direction of the chip component.

[0017] The invention described in claim 4 is a mounting device according to any one of claims 1 to 3, A mounting device comprising a chip slider for mounting the chip component and a transfer rail for transferring the chip slider as components, and having a chip transfer means for transferring the chip component directly below the attachment tool.

[0018] The invention according to claim 5 is a mounting device according to claim 4, A mounting device in which the chip transfer means has a position adjustment means for adjusting the in-plane position of the chip component mounted on the chip slider.

[0019] The invention according to claim 6 is a mounting device according to any one of claims 1 to 5, A mounting device in which, in a state where the chip component is held by the attachment tool and faces the substrate, the substrate position recognition means simultaneously acquires the position information of the tool recognition mark and the substrate recognition mark.

[0020] The invention according to claim 7 is a mounting device according to any one of claims 1 to 5, A mounting device in which, in a state where the chip component is not held, the substrate position recognition means acquires the position information of the substrate recognition mark.

[0021] The invention according to claim 8 is a mounting device according to claim 7, A mounting device in which the attachment tool is brought close until the distance between the lower surface of the attachment tool and the upper surface of the substrate is substantially equal to the thickness of the chip component, and the position information of the tool recognition mark and the substrate recognition mark is simultaneously acquired.

[0022] The invention according to claim 9 is A mounting method of mounting a chip component having a chip recognition mark for alignment and a substrate having a substrate recognition mark for alignment by opposing the surface having the chip recognition mark and the surface having the substrate recognition mark, using the mounting device according to any one of claims 1 to 5, A mounting method comprising: a substrate holding process of holding the substrate on a substrate stage; a chip holding process of holding the chip component with an attachment tool having a tool recognition mark; a chip position information acquisition process of acquiring position information of the chip recognition mark and the tool recognition mark while the chip component is held by the attachment tool; a substrate position information acquisition process of acquiring position information of the tool recognition mark and the substrate recognition mark while the chip component is held by the attachment tool and facing the substrate; and an alignment process of adjusting the position of the chip component in the in-plane direction of the substrate based on relative position information of the chip recognition mark and the substrate recognition mark with respect to the tool recognition mark.

[0023] The invention according to claim 10 is A mounting method of mounting a chip component having a chip recognition mark for alignment and a substrate having a substrate recognition mark for alignment by opposing a surface having the chip recognition mark and a surface having the substrate recognition mark, using the mounting device according to any one of claims 1 to 5, comprising: a substrate holding process of holding the substrate on a substrate stage; a substrate position information acquisition process of acquiring position information of the substrate recognition mark; a chip holding process of holding the chip component with the attachment tool; a chip position information acquisition process of acquiring position information of the chip recognition mark and the tool recognition mark while the chip component is held by the attachment tool; and an alignment process of adjusting the position of the chip component in the in-plane direction of the substrate based on relative position information between the tool recognition mark and the chip recognition mark.

[0024] The invention according to claim 11 is the mounting method according to claim 10, The mounting method according to claim 10, In the substrate position information acquisition process, a mounting method of making the distance between the lower surface of the attachment tool and the upper surface of the substrate substantially equal to the thickness of the chip component and acquiring position information of the substrate recognition mark and the tool recognition mark.

Advantages of the Invention

[0025] This invention enables high-precision face-down mounting because the electrode surfaces of the chip component and the substrate can be aligned while facing each other and in close proximity. [Brief explanation of the drawing]

[0026] [Figure 1] This is a schematic diagram of an implementation device according to an embodiment of the present invention. [Figure 2] (a) is a front view and (b) is a side view illustrating the optical configuration according to an embodiment of the present invention. [Figure 3] Block diagram showing a control system according to an embodiment of the present invention. [Figure 4] This figure shows the state in which the chip position recognition means of the mounting apparatus according to an embodiment of the present invention has acquired (a) the position information of the first chip recognition mark and the position information of the first tool recognition mark, and (b) the position information of the second chip recognition mark and the position information of the second tool recognition mark. [Figure 5] This figure shows (a) an example image of a chip recognition first mark and a tool recognition first mark acquired by the chip position recognition means of a mounting apparatus according to an embodiment of the present invention, and (b) an example image of a chip recognition second mark and a tool recognition second mark. [Figure 6] This figure shows the state in which the substrate position recognition means of the mounting apparatus according to an embodiment of the present invention has acquired (a) the position information of the first substrate recognition mark and the position information of the first tool recognition mark, and (b) the position information of the second substrate recognition mark and the position information of the second tool recognition mark. [Figure 7] This figure shows (a) an example image of a first substrate recognition mark and a first tool recognition mark acquired by the substrate position recognition means of a mounting apparatus according to an embodiment of the present invention, and (b) an example image of a second substrate recognition mark and a second tool recognition mark. [Figure 8] This is a schematic diagram of a modified example 1 of the mounting device according to an embodiment of the present invention. [Figure 9]This figure illustrates the operation of a modified example 1 of the mounting device according to an embodiment of the present invention. [Figure 10] This is a schematic diagram of a modified example 2 of the mounting device according to an embodiment of the present invention. [Figure 11] This is a schematic diagram of a modified example 3 of the mounting device according to an embodiment of the present invention. [Figure 12] This diagram illustrates the mounting locations for individual chip components on a circuit board where multiple chip components are mounted with minimal gaps between them, as well as the individual board recognition marks. [Figure 13] This diagram illustrates the challenges in recognizing board recognition marks on a circuit board where multiple chip components are mounted with very little space between them. [Figure 14] This diagram illustrates the use of board recognition marks in diagonally adjacent mounting areas when mounting multiple chip components with small gaps between them. (a) shows an example where no chip components are mounted in the adjacent mounting area, and (b) shows an example where chip components are mounted in part of the adjacent mounting area. [Figure 15] This diagram illustrates an improved method for mounting multiple chip components with small gaps between them, using board recognition marks in adjacent mounting areas. (a) shows an example where no chip components are mounted in the adjacent mounting area, and (b) shows an example where chip components are mounted in part of the adjacent mounting area. [Figure 16] This figure illustrates a mounting method in which the substrate position information acquisition process is performed in advance using a mounting apparatus according to an embodiment of the present invention. [Figure 17] This diagram illustrates the mounting locations for individual chip components on a circuit board that mounts multiple chip components, as well as the individual board recognition marks. [Figure 18] This diagram shows the chip recognition mark and the board recognition mark facing each other when mounting chip components onto a circuit board. [Figure 19] This figure shows an example configuration of a mounting device that mounts chip components by aligning the chip recognition mark on the chip component with the board recognition mark on the circuit board. [Figure 20] This diagram shows the state in which the chip recognition mark on a chip component and the board recognition mark on a circuit board are aligned and positioned opposite each other. [Figure 21]This diagram shows the chip recognition mark on a chip component and the board recognition mark on a circuit board facing the same direction. [Figure 22] This figure shows an example of a mounting device configuration in which the chip recognition mark on the chip component and the board recognition mark on the circuit board are oriented in the same direction during mounting. [Figure 23] This diagram shows a mounting device that mounts chip components with the chip recognition mark on the chip component and the board recognition mark on the board facing the same direction. (a) shows the state in which the position information of the first board recognition mark and the position information of the first chip recognition mark are acquired, and (b) shows the state in which the position information of the first board recognition mark and the position information of the first chip recognition mark are acquired. [Modes for carrying out the invention]

[0027] Embodiments of the present invention will be described with reference to the figures. Figure 1 is a schematic diagram of the mounting device 1 in an embodiment of the present invention.

[0028] A mounting device is used to mount chip components onto a substrate such as a wiring board. The mounting device 1 shown in Figure 1 is configured to perform face-down mounting, where the electrode surface of the chip component is mounted facing the electrode surface of the substrate.

[0029] The mounting device 1 comprises a substrate stage 2, a lifting mechanism 3, a mounting head 4, a substrate position recognition mechanism 5, a chip transport mechanism 6, and a chip position recognition mechanism 7.

[0030] In the mounting apparatus 1 shown in Figure 1, the substrate stage 2 is composed of a stage movement control means 20 and a suction table 23. The suction table 23 is used to hold a substrate placed on its surface by adsorption, and the suction table 23 can be moved in the in-plane direction of the substrate surface while holding the substrate by the stage movement control means 20.

[0031] The stage movement control means 20 consists of a Y-direction stage movement control means 22 that can linearly move the suction table 23 in the Y direction, and an X-direction stage movement control means 21 that can linearly move the Y-direction stage movement control means 22 in the X direction and is provided on the base 200. The Y-direction movement control means 22 has the suction table 23 mounted on a movable part arranged on a slide rail, and the movable part is moved and its position controlled by a Y-direction servo 221. Similarly, the X-direction movement control means 21 has the Y-direction movement control means 22 mounted on a movable part arranged on a slide rail, and the movable part is moved and its position controlled by an X-direction servo 211.

[0032] The lifting mechanism 3 is fixed to a gantry-type frame (not shown), and its vertical drive shaft is provided perpendicular to the suction table 23, with the mounting head 4 connected to the vertical drive shaft. The lifting mechanism 3 drives the mounting head 4 up and down and also has the function of applying a pressurizing force according to the setting. Furthermore, in the mounting device 1, the lifting mechanism 3 is supported from two directions (by a gantry-type frame (not shown)) and is linearly connected to the mounting head 4, so that lateral force is less likely to be applied to the mounting head 4 when pressurizing is applied.

[0033] The mounting head 4 holds the chip component C and presses it onto the substrate (held on the suction table 23 of the substrate stage 2) in a state parallel to the substrate. The mounting head 4 consists of a head body 40, a heater unit 41, an attachment tool 42, and a tool position control means 43. The head body 40 is connected to the lifting means 3 via the tool position control means 43, and the heater unit 41 is fixedly positioned on its lower side. The heater unit 41 has a heating function and heats the chip component C via the attachment tool 42. The heater unit 41 also has a function to suction and hold the attachment tool 42 using a reduced pressure channel. The attachment tool 42 suction and holds the chip component C and is replaced according to the shape of the chip component C. The tool position control means 43 finely adjusts the position of the head body 40 in the vertical plane relative to the vertical drive axis of the lifting means 3, and accordingly the position of the attachment tool 42 and the chip component C held by the attachment tool 42 (in the XY plane in the figure) is adjusted.

[0034] The tool position control means 43 comprises an X-direction tool position control means 431, a Y-direction tool position control means 432, and a tool rotation control means 433. In the embodiment shown in Figure 1, the tool rotation control means 433 adjusts the rotation direction of the head body 40, the Y-direction tool position control means 432 adjusts the Y-direction position of the tool rotation control means 433, and the X-direction tool position control means 431 adjusts the X-direction position of the Y-direction position control means. However, the configuration is not limited to this, and it is sufficient if the X-direction position, Y-direction position, and rotation angle of the attachment tool 42 can be adjusted.

[0035] Figure 2 shows a diagram mainly of the area around the head body 40 (Figure 2(a) is a front view, and Figure 2(b) is a side view). In face-down mounting of this embodiment, chip recognition marks AC (first chip recognition mark AC1 and second chip recognition mark AC2) are provided at diagonal positions on the electrode surface C of the chip component, and substrate recognition marks AS (first substrate recognition mark AS1 and second substrate recognition mark AS2) are provided at approximate diagonal positions on the electrode surface S of the substrate, and both are facing the electrode surface of the substrate S of the mounting head 4.

[0036] Furthermore, in the present invention, a tool recognition mark AT is provided on the surface of the attachment tool 42 that holds the chip component C, and the first tool recognition mark AT1 and the second tool recognition mark AT2 are arranged to correspond to the positions of the first chip recognition mark AC1 and the second chip recognition mark AC2 of the chip component C to be held.

[0037] The mounting device 1 is configured to allow observation of the substrate recognition mark AS and the tool recognition mark AT through the mounting head 4. The attachment tool 42 is made of a transparent material, and a through-hole is provided to match the position of the substrate recognition mark AS. The heater section 41 also needs to be made of a transparent material or have an opening so that the tool recognition mark AT can be observed. In this embodiment, a through-hole 41H is provided as shown in Figure 2. The mounting head 4 also needs space for the image acquisition section 50 of the substrate position recognition means 5 to move in order to observe the substrate recognition mark AS and / or the tool recognition mark AT. In this embodiment, a head space 40V is provided as shown in Figure 2. That is, the head body 40 is structured with side plates connected on the heater 41 and a top plate connecting both side plates.

[0038] The substrate position recognition means 5 acquires position information of the substrate recognition mark AS and / or tool recognition mark AT, which is captured by focusing on the image through the mounting head 4 (through the attachment tool 42 and heater unit 41). In this embodiment, the substrate position recognition means 5 comprises an image acquisition unit 50, an optical path 52, and an imaging means 53 connected to the optical path 52.

[0039] The image acquisition unit 50 is positioned above the recognition target from which the imaging means 53 acquires an image, and is positioned to keep the recognition target within its field of view.

[0040] Furthermore, the substrate position recognition means 5 is configured to move in the in-plane direction of the substrate S (and chip components C) within the head space 40V by a drive mechanism (not shown). It is also desirable that the substrate S can move vertically (Z direction) to allow for adjustment of the focal position.

[0041] The mounting head 4 moves vertically relative to the substrate S by the lifting mechanism 3, and this movement can be performed independently of the operation of the substrate position recognition mechanism 5. Therefore, even when the mounting head 4 moves vertically, the substrate position recognition mechanism 5, which has entered the head space 40V, must be designed to avoid interference.

[0042] Furthermore, the movable range of the image acquisition unit 50 of the substrate position recognition means 5 is not limited to within the head space 40V; it is also possible to move outside the head space 40V on the substrate S to acquire position information of the substrate recognition mark AS.

[0043] The chip transport means 6 consists of a transport rail 60 and a chip slider 61. The chip slider 61 holds the chip component C supplied from a chip supply unit (not shown) and slides it to directly below the attachment tool 42 for transport.

[0044] Here, a chip supply unit (not shown) places the chip component C at a fixed position on the chip slider 61. If necessary, the placement position of the chip component C on the chip slider 61 may be recognized by a recognition mechanism (not shown). The chip transport means 6 may also have a position adjustment means for adjusting the position of the chip component C mounted on the chip slider 61 in the in-plane direction (XY direction). In this way, by controlling the position of the chip slider 61 and the chip component C placed on the chip slider 61, it is possible to transfer the chip component C within a predetermined range of the attachment tool 42. After the attachment tool 42 has held the chip component C, the chip slider 61, having released the hold on the chip component C, moves to a retracted position.

[0045] The chip position recognition means 7 captures an image of the chip recognition mark AC of the chip component C held by the attachment tool 42, as well as an image of the tool recognition mark AT, and acquires positional information of the chip recognition mark AC and the tool recognition mark AT.

[0046] As shown in the block diagram of Figure 3, the mounting device 1 includes a control unit 10 connected to a substrate stage 2, a lifting mechanism 3, a mounting head 4, a substrate position recognition mechanism 5, a transport mechanism 6, and a chip position recognition mechanism 7.

[0047] The control unit 10 essentially consists of a CPU and a memory device as its main components, and interposes with each device as needed. Furthermore, by incorporating a program, the control unit 10 can perform calculations using acquired data and output corresponding to the calculation results. It is also desirable that it includes a function to record acquired data and calculation results for use as data for new calculations.

[0048] The control unit 10 is connected to the substrate stage 2 and controls the operation of the X-direction stage movement control means 21 and the Y-direction stage movement control means 22 to control the in-plane movement of the suction table 23. The control unit 10 also controls the suction table 23 to control the suction holding and release of the substrate S.

[0049] The control unit 10 is connected to the lifting mechanism 3 and has the function of controlling the vertical position (Z direction) of the mounting head 4, as well as controlling the pressure applied when pressing the chip component C onto the substrate S.

[0050] The control unit 10 is connected to the mounting head 4 and has the function of controlling the adsorption, holding, and release of the chip component C by the attachment tool 42, the heating temperature of the heater unit 41, and the position of the head body 40 (and heater unit 41, attachment tool 42) in the XY plane using the tool position control means 43.

[0051] The control unit 10 is connected to the substrate position recognition means 5 and has the function of controlling the drive in the horizontal (XY plane) and vertical (Z direction) directions, as well as controlling the imaging means 53 to acquire image data. Furthermore, the control unit 10 has an image processing function and has the function of calculating the position of the substrate recognition mark AS and / or tool recognition mark AT from the image acquired by the imaging means 53.

[0052] The control unit 10 is connected to the chip transport means 6 and has the function of controlling the position of the chip slider 61 as it moves along the transport rail 60.

[0053] The control unit 10 is connected to the chip position recognition means 7 and has the function of controlling the horizontal (XY plane) drive of the chip position recognition means 7 and controlling an imaging means (not shown) to acquire image data. Furthermore, the image processing function of the control unit 10 has the function of calculating the position of the chip recognition mark AC and / or the tool recognition mark AT.

[0054] The process by which the mounting device 1 aligns and mounts chip components to the mounting locations SC on the substrate S will be explained below using Figures 4 to 7. Prior to this, the substrate S is held on the substrate stage 2 of the mounting device 1 after going through a substrate holding process. Here, it is desirable that the position information of the substrate S relative to the suction table 23 of the substrate stage 2 is acquired by image recognition means or the like and stored in the control unit 10.

[0055] Furthermore, the chip component C is transported by the chip transport means 6 and undergoes a chip holding process in which it is held by the attachment tool 42. Here, the chip component C is transferred from a chip supply unit (not shown) to a chip slider 61, and when it is transferred from the chip slider 61 to the attachment tool 42, a predetermined positional accuracy is ensured, and it is held by the attachment tool 42 with that predetermined positional accuracy.

[0056] Therefore, in the chip position information acquisition process shown in Figure 4, the chip position recognition means 7 can observe the chip recognition mark AC and the tool recognition mark AT within the same field of view at high magnification. That is, in the state shown in Figure 4(a), the chip recognition first mark AC1 and the tool recognition first mark AT1 can be imaged within the same field of view as shown in Figure 5(a), and relative position information of the chip recognition first mark AC1 and the tool recognition first mark AT1 can be obtained. Similarly, in the state shown in Figure 4(b), an image like that shown in Figure 5(b) can be obtained, and relative position information of the chip recognition second mark AC2 and the tool recognition second mark AT2 can be obtained. From the position information of the chip recognition mark AC and the tool recognition mark AT obtained at these two locations, the position information of the chip recognition first mark AC1 and the chip recognition second mark AC2 of the held chip component C can be calculated using the position information of the tool recognition first mark AT1 and the tool recognition second mark AT2.

[0057] In the mounting apparatus 1 shown in Figure 1, the chip position recognition means 7 is fixed to the suction table 23. Therefore, the stage movement control means 20 moves the suction table 23 so that the chip position recognition means 7 is positioned below the attachment tool 42.

[0058] After the chip position information acquisition process, the stage movement control means 20 moves the suction table 23 so that the chip mounting location SC is positioned directly below the attachment tool 42. Then, the lifting means 3 is driven to lower the mounting head 4, bringing it as close as possible to the substrate S without the chip component C coming into contact with it (Figure 6).

[0059] From this state, during the substrate position information acquisition process shown in Figure 6, the substrate position recognition means 5 observes the substrate recognition mark AS from above the attachment tool 42. Since the attachment tool 42 is transparent, the tool recognition mark AT can also be observed. Furthermore, as mentioned above, since the placement information of the substrate S on the suction table 23 has been obtained, the mounting location SC of the substrate S is positioned directly below the attachment tool 42, and the substrate position recognition means 5 can observe the substrate recognition mark AS and the tool recognition mark AT in the same field of view at high magnification. That is, in the state shown in Figure 6(a), the tool recognition first mark AT1 and the substrate recognition first mark AS1 can be imaged in the same field of view as shown in Figure 7(a). Similarly, in the state shown in Figure 6(b), the tool recognition second mark AT2 and the substrate recognition second mark AS2 can be imaged in the same field of view as shown in Figure 7(b).

[0060] Note that while Figure 7(a) shows the first chip recognition mark AC1 and Figure 7(b) shows the second chip recognition mark AC2, neither can be observed if the substrate position recognition means 5 is an imaging means in the visible light range. However, from the relative positional relationship between the chip recognition mark AC and the tool recognition mark AT obtained during the chip position information acquisition process, it is possible to obtain the positional information of the first chip recognition mark AC1 within the field of view shown in Figure 7(a) and the second chip recognition mark AC2 within the field of view shown in Figure 7(b).

[0061] Therefore, the positional relationship between the first chip recognition mark AC1 and the first substrate recognition mark AS1, and the positional relationship between the second chip recognition mark AC2 and the second substrate recognition mark AS2 can be determined, and in the alignment process, the control unit 10 controls the tool position control means 43 and / or the stage movement control means 20 to perform alignment in order to correct the misalignment of the chip component C relative to the mounting location SC on the substrate S.

[0062] Next, the lifting mechanism 3 is driven to lower the mounting head 4, bringing the chip component C into close contact with the substrate S. In the mounting process, the chip component C is pressurized to a predetermined pressure, and the heater section 40 is heated to join the electrodes of the substrate C and the chip component C. Here, since the descent distance from the alignment process to the mounting process is very small, mounting can be performed while maintaining the alignment accuracy achieved in the alignment process.

[0063] Incidentally, in the mounting apparatus 1 shown in Figure 1, the chip position recognition means 7 is provided on the suction table 23, but the placement of the chip position recognition means 7 is not limited to this. For example, in the modified example 1 shown in Figure 8, the chip position recognition means 7 is provided so as to be slidable along the transport rail 60 of the chip transport means 6, and can be placed below the attachment tool 42 as shown in Figure 9. Furthermore, as in the modified example 2 shown in Figure 10, it is also possible to align the chip position recognition means 7 with the substrate position recognition means 5. In this configuration, by providing the substrate position recognition means 5 on a drive means that can also move in the vertical direction, the chip position recognition means 7 can observe the chip component C held by the attachment tool 42.

[0064] Modification 3 in Figure 11 shows an example in which multiple mounting heads 4 (4A and 4B) are provided on a single substrate stage 23.

[0065] Incidentally, in recent years, as shown in Figure 12, a configuration has emerged in which the mounting location SC is placed on the substrate S with only a small gap between them. In this configuration, unlike the configuration shown in Figure 17 where the substrate recognition mark AS is outside the mounting location SC, the substrate recognition mark AS is placed inside the mounting location SC, as shown in Figure 12.

[0066] Therefore, even if the present invention is used in a configuration in which mounting locations SC are placed on the substrate S with only a small gap, as shown in Figure 13, the substrate recognition mark AS is hidden behind the chip components and cannot be observed during the substrate position information acquisition process.

[0067] Therefore, Figure 14 shows an example of using the substrate recognition marks AS of adjacent mounting locations. Specifically, in the mounting areas located diagonally opposite each other, the first substrate recognition mark AS1 of the mounting area in the upper right of the figure is used as the second substrate recognition mark Aso2, and the second substrate recognition mark AS2 of the mounting area in the lower left of the figure is used as the first substrate recognition mark Aso1, making it possible to observe it outside the chip component Ca (for alignment). However, if a chip component Cb is placed at the mounting location, the chip component Cb prevents observation of one of the diagonally opposite substrate recognition marks AS of the chip component Ca, as shown in Figure 14(b). For this reason, it is difficult to sequentially align and mount chip components C on the mounting location SC of the substrate S as shown in Figure 12 using the present invention.

[0068] However, this problem can be addressed by devising the placement of the substrate recognition marks AS provided at the mounting locations SC on the substrate S. Specifically, as shown in Figure 15, by providing the substrate recognition marks AS in the upper left corner of each mounting location SC, it is possible to perform alignment using the substrate recognition marks AS of the mounting locations to the right and below the chip component Ca, although not perfectly diagonally opposite the chip recognition marks AC of the chip component Ca to be aligned. An example of this is shown in Figure 15(a). By repeatedly moving to the right from this state and then moving to the left end of the lower row after reaching the right end, the chip component C can be aligned and mounted at each mounting location on the substrate S using the present invention.

[0069] Furthermore, by changing the order of the chip position information acquisition process and the substrate position information acquisition process, it is possible to perform alignment using the substrate recognition mark AS within the mounting location SC shown in Figure 12, without using the substrate recognition mark AS in the adjacent mounting area.

[0070] In other words, as shown in Figure 16, if the chip component C is not being held, the substrate position recognition means 5 can acquire relative position information of the tool recognition mark AT and the substrate recognition mark AS as part of the substrate position information acquisition process. Specifically, as shown in Figure 16, the attachment tool 42 is brought close to the substrate S, and the positional relationship between the tool recognition first mark AT1 and the substrate recognition first mark AS1 (Figure 16(a)) and the positional relationship between the tool recognition second mark AT2 and the substrate recognition second mark AS2 (Figure 16(b)) are acquired using the substrate position recognition means 5, and this relative position information is stored.

[0071] Subsequently, the attachment tool 42 is raised and the chip component C is held (chip holding process), and the positional relationship between the chip recognition first mark AC1 and the tool recognition first mark AT1, and the relative position information of the chip recognition second mark AC2 and the tool recognition second mark AT2 are acquired using the chip position recognition means 7 (chip position information acquisition process).

[0072] Based on the position information obtained in the above procedure, the tool position control means 43 calculates the amount by which it should move the attachment tool 42 in order to align the chip component C held by the attachment tool 42 with the mounting location SC on the substrate S, and performs the position adjustment by the tool position control means 43 (alignment process).

[0073] Subsequently, the lifting mechanism 3 is driven to lower the mounting head 4, bringing the chip component C into close contact with the substrate S. As part of the mounting process, the chip component C is pressurized to a predetermined pressure, and the heater unit 40 is heated to join the electrodes of the substrate S and the chip component C (mounting process).

[0074] Incidentally, during the mounting process, the distance between the top surface of the substrate S and the bottom surface of the attachment tool 42 corresponds to the thickness of the chip component C. Therefore, in the substrate position information acquisition process shown in Figure 16, if the distance G between the bottom surface of the attachment tool 42 and the top surface of the substrate S is made equal to the thickness of the chip component C, high-precision mounting becomes possible. For example, even if there is a slight inclination in the driving direction of the lifting mechanism 3, positional deviation during the mounting process can be suppressed by making the distance G during the substrate position information acquisition process equal to the thickness of the chip component C. However, even if one tries to make the distance G between the bottom surface of the attachment tool 42 and the top surface of the substrate S exactly the same as the thickness of the chip component C, there are variations in the thickness of the substrate S and the chip component C, so it is sufficient to make it approximately equal to the thickness of the chip component C. Here, approximately equal means that an error of plus or minus 30% or less relative to the design thickness of the chip component C is allowed.

[0075] In the example described above, the attachment tool 42 holds the chip component C, and then the chip position recognition means 7 determines the positional relationship between the chip recognition mark AC and the substrate recognition mark AS, and the alignment process is performed. However, the alignment may also be performed at the stage when the attachment tool 42 holds the chip component C. Specifically, when the chip component C mounted on the chip slider 61 of the chip transport means 6 is transferred to the attachment tool 42, the chip position recognition means 7 may acquire positional information of the chip recognition mark AC and the tool recognition mark AT, perform alignment (so that the chip recognition mark AC is in a predetermined positional relationship with respect to the substrate recognition mark AS), and then the attachment tool 42 may hold the chip component C. In this case, if the attachment tool 42 holds the chip component C by adjusting the position only on the chip slider 61 side without driving the tool position control means 43, the chip component C can be mounted to the mounting location SC with high precision simply by lowering the mounting head 4 with the lifting means 3. In other words, it is possible to perform the alignment process prior to the chip holding process.

[0076] By the way, in the above explanation, the position information of the tool recognition mark AT and the board recognition mark AS is acquired by the board position recognition means 5 during the board position information acquisition process. However, it is also possible to perform alignment without acquiring the position information of the tool recognition mark AT. In other words, the position of the tool recognition mark AT can be adjusted so that the position of the chip recognition mark AC matches the position information of the board recognition mark AS obtained by the board position recognition means 5 and stored in the control unit 10. [Explanation of symbols]

[0077] 1. Mounting device 2 PCB stage 3. Lifting and lowering means 4. Mounting Head 5 Board position recognition means 6. Chip transport means 7. Chip position recognition means 10 Control Unit 20 Stage movement control means 21 X-direction stage movement control means 22 Stage movement control means in the Y direction 23 Suction Table 40 Head Body 41 Heater section 42 Attachment Tools 43 Tool position control means 50 Image acquisition unit 52 Light path 53 Imaging means 60 transport rails 61 Chip Slider AC, AC1, AC2 Chip Recognition Marks AS, AS1, AS2 circuit board recognition marks AT, AT1, AT2 Tool Recognition Marks C chip component S substrate SC (chip component) mounting location

Claims

1. A chip component having a chip recognition mark for alignment, and a substrate recognition mark for alignment. A substrate having a mark, and the surface having the chip recognition mark and the surface having the substrate recognition mark An implementation device that implements by facing opposite sides, A transparent attachment tool having a tool recognition mark holds the opposite side of the chip component to the side having the chip recognition mark, A mounting head that holds the aforementioned attachment tool at its tip, A lifting mechanism for raising and lowering the mounting head in a direction perpendicular to the substrate, A substrate stage for holding the aforementioned substrate, A substrate position recognition means that acquires the position information of the substrate recognition mark and the position information of the tool recognition mark while the chip component is in a state before it is held by the attachment tool, A chip position recognition means that acquires the position information of the chip recognition mark and the position information of the tool recognition mark while the chip component is held by the attachment tool, The system comprises the mounting head, the lifting means, the substrate stage, the chip position recognition means, and a control unit connected to the substrate position recognition means, At least one of the substrate stage and the attachment tool is movable in the direction in the substrate plane, A mounting apparatus in which, based on the information obtained by the chip position recognition means and the information obtained by the substrate position recognition means, the control unit moves the substrate stage or the attachment tool in the direction in the substrate plane to align the chip component with the substrate.

2. The mounting device according to claim 1, The substrate position recognition means recognizes all the substrate recognition marks and tool recognition marks in the alignment of one chip component using a single substrate position recognition means. A mounting apparatus in which at least one of the substrate recognition mark and the tool recognition mark is recognized by the substrate position recognition means through the attachment tool.

3. A mounting device according to claim 1 or claim 2, A mounting apparatus having a mounting head that includes a tool positioning means for adjusting the position of the attachment tool in the in-plane direction of the chip component.

4. A mounting device according to any one of claims 1 to 3, A chip slider on which the chip component is mounted and a conveyor rail for transporting the chip slider. The chip is transported directly below the attachment tool, with the chip as a component. A mounting device equipped with a transport mechanism.

5. The mounting apparatus according to claim 4, A mounting apparatus in which the chip transport means has a position adjustment means for adjusting the in-plane position of the chip component mounted on the chip slider.

6. A mounting device according to any one of claims 1 to 5, A mounting apparatus in which, with the chip component held by the attachment tool and facing the substrate, the chip position recognition means acquires the position information of the tool recognition mark and the chip recognition mark within the same field of view.

7. A mounting device according to any one of claims 1 to 5, A mounting apparatus that brings the attachment tool close enough so that the distance between the lower surface of the attachment tool and the upper surface of the substrate is approximately equal to the thickness of the chip component, and simultaneously acquires positional information of the tool recognition mark and the substrate recognition mark.

8. Using the mounting apparatus described in any one of claims 1 to 5, A mounting method for mounting a chip component having a chip recognition mark for alignment and a substrate having a substrate recognition mark for alignment, wherein the side having the chip recognition mark and the side having the substrate recognition mark face each other, A substrate holding process for holding the substrate on a substrate stage, A process for acquiring substrate position information, in which an attachment tool having a tool recognition mark is positioned facing the substrate, and the position information of the tool recognition mark and the substrate recognition mark is acquired. A chip holding process in which the chip component is held by the attachment tool, A chip position information acquisition process in which the chip component is held by the attachment tool and the position information of the chip recognition mark and the tool recognition mark is acquired, A mounting method comprising an alignment process that adjusts the position of the chip component in the in-plane direction of the substrate based on relative position information of the chip recognition mark and the substrate recognition mark with respect to the tool recognition mark.

9. The implementation method according to claim 8, An implementation method in which, during the process of acquiring substrate position information, the distance between the lower surface of the attachment tool and the upper surface of the substrate is made approximately equal to the thickness of the chip component, and position information of the substrate recognition mark and the tool recognition mark is acquired.

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