Heterogeneous integrated module equipped with thermal management system

Abstract

Some examples described herein provide a heterogeneous integrated module (HIM) including a thermal management device. In one example, the device (e.g., the HIM) includes a wiring substrate, a first component, a second component, and a thermal management device. The first component and the second component are communicatively coupled to each other via the wiring substrate. The thermal management device is in thermal communication with the first component and the second component. The thermal management device has a first thermal energy flow path for dissipating thermal energy generated by the first component and a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.

Description

Technical Field

[0001] The present invention was made with government support under contract number HR0011-19-3-0004 awarded by the Defense Advanced Research Projects Agency. The United States government has certain rights in this invention.

[0002] Examples of the present disclosure generally relate to heterogeneous integration modules that include a thermal management device.

Background Art

[0003] In particular, electronic devices such as those included in tablets, computers, copiers, digital cameras, smartphones, control systems, and automated teller machines often include one or more integrated circuit dies for several desired functions. The dies can consume various amounts of power. By consuming power, the dies can generate thermal energy. If the thermal energy is not dissipated by heat transfer, the thermal energy can accumulate in the die. If the thermal energy accumulates excessively and the die becomes too hot, harmful effects can occur. For example, the physical characteristics of devices within the die can be changed by excessive temperature. As an example, the threshold voltage of transistors within the die can change as the temperature changes. Further, the movement of metal within the die can increase with an increase in thermal energy. Therefore, the thermal management of electronic devices including dies becomes a concern.

Summary of the Invention

[0004] Some examples described herein provide a heterogeneous integration module (HIM) that includes a thermal management device. In such HIMs, components with various operating temperature specifications can be incorporated in close proximity to avoid significant delays in signal propagation between components and degradation of signals propagated between components. Further, the components can operate at their respective rated temperatures.

[0005] An example of the present disclosure is an apparatus. The apparatus includes a wiring board, a first component, a second component, and a thermal control device. The first and second components are coupled to each other via the wiring board so as to be able to communicate with each other. The thermal control device is in thermal communication with the first and second components. The thermal control device has a first thermal energy channel for dissipating thermal energy generated by the first component and a second thermal energy channel for dissipating thermal energy generated by the second component. The first thermal energy channel has a lower thermal resistivity than the second thermal energy channel.

[0006] Another example of the present disclosure is a system. The system includes a heterogeneous integrated module. The heterogeneous integrated module includes a wiring board, a first component mounted on the wiring board, a second component mounted on the wiring board, a first thermal interface material disposed on the first component, a second thermal interface material disposed on the second component, and a thermal management device. The first and second components are coupled to each other via the wiring board so as to be communicative. The thermal management device is in contact with the first and second thermal interface materials. The thermal management device has a first thermal energy channel from the point where it is in contact with the first thermal interface material and a second thermal energy channel from the point where it is in contact with the second thermal interface material. The first thermal energy channel has a lower thermal resistivity than the second thermal energy channel.

[0007] A further example of the present disclosure is a method for forming a heterogeneous integrated module. A wiring board is fitted with a first component and a second component. A thermal management device is fixed in thermal communication with the first and second components. The thermal management device has a first thermal energy channel for the thermal energy generated by the first component and a second thermal energy channel for the thermal energy generated by the second component. The first thermal energy channel has a lower thermal resistivity than the second thermal energy channel.

[0008] These and other embodiments will be understood by referring to the detailed description below.

[0009] To ensure a detailed understanding of the above features, a more specific explanation, rather than a concise summary, may be provided by referring to exemplary implementations, some of which are shown in the attached drawings. However, it should be noted that the attached drawings only show typical implementations and should therefore not be considered to limit the scope of implementations. [Brief explanation of the drawing]

[0010] [Figure 1] A simplified cross-sectional view of a first heterogeneous integrated module (HIM) equipped with a thermal management device is shown, illustrating several examples. [Figure 2] A simplified cross-sectional view of a second HIM equipped with a thermal management device is shown, illustrating several examples. [Figure 3] The diagram shows channel patterns in contact regions using several examples. [Figure 4] The following are layout diagrams of systems with a first HIM or second HIM, based on several examples. [Figure 5] This is a flowchart illustrating the methods for forming a HIM (Human Information Model) using several examples. [Modes for carrying out the invention]

[0011] For ease of understanding, the same reference numerals are used to indicate identical elements common to multiple figures, where possible. An element from one example may be usefully incorporated into other examples.

[0012] Several examples described herein provide heterogeneous integrated modules (HIMs) including a thermal management device. The HIM includes a first component and a second component mounted on a wiring board. The first and second components are communicatively coupled to each other via the wiring board. The first and second components may have different operating temperature specifications. For example, the first component may have a target operating temperature lower than that of the second component. In some examples, the first component may be an active optical device and / or an active photonic device, and the second component may be an active electrical device (e.g., a die having a processor, a programmable logic integrated circuit (IC), an application-specific IC (ASIC), or a combination thereof). The thermal management device is in thermal communication with the first and second components to dissipate the thermal energy generated by them. The thermal energy channel through the thermal management device for dissipating the thermal energy generated by the first component may have a lower thermal resistance than the thermal energy channel through the thermal management device for dissipating the thermal energy generated by the second component. Such HIMs can incorporate components with varying operating temperature specifications in close proximity to avoid significant delays in signal propagation between components and to prevent degradation of signals propagated between components. Furthermore, the components can operate at their respective rated temperatures. As described herein, HIMs may be particularly useful in computing devices and / or networking devices (e.g., optical fiber devices).

[0013] Various features are described below with reference to the figures. Note that the figures may or may not be drawn to scale, and that elements of similar structure or function are represented by the same reference numerals throughout the drawings. Note that the figures are intended solely to facilitate the description of the features. The figures are not intended as a comprehensive description of the invention in the patent application or as a limitation on the scope of the claimed invention. Furthermore, the illustrated examples do not necessarily have all the embodiments or advantages shown. Embodiments or advantages described in relation to a particular example are not necessarily limited to that example and may be implemented in any other example, even if not illustrated or explicitly described as such.

[0014] Figure 1 shows a simplified cross-sectional view of a first HIM100 equipped with a thermal management device in several examples. The first HIM100 includes a first component 102 and a second component 106. The first component 102 generally has an operating temperature specification lower than that of the second component 106. For example, the first component 102 is or may include an active optical device and / or active photonic device (e.g., for generating optical signals for optical fiber ports), and the second component 106 is or may include an electrical device (e.g., a die including a processor, programmable logic IC, ASIC, etc., or a combination thereof), and the optical device and / or photonic device has a lower operating temperature than the electrical device. The thermal management device of the first HIM100 helps to control the operating temperatures of the first component 102 and the second component 106 within their respective specifications, as will be described later.

[0015] The first HIM 100 includes an interposer 110 and a package substrate 112. The first component 102 is attached to the first surface of the interposer 110 by an external connector 114, and the second component 106 is attached to the first surface of the interposer 110 by an external connector 116. The external connectors 114 and 116 can be, for example, microbumps, and can form electrical connections and physical attachments between the first component 102 and the interposer 110, and between the second component 106 and the interposer 110, respectively. The second surface of the interposer 110 (opposite the first surface of the interposer 110) is attached to the first surface of the package substrate 112 by an external connector 118. The external connector 118 can be, for example, a controlled collapse chip connection (C4), and can form electrical connections and physical attachments between the interposer 110 and the package substrate 112. An external connector 120 is attached to the second side of the package substrate 112 (the side opposite to the first side of the package substrate 112). The external connector 120 can be, for example, a ball grid array (BGA) ball and may be used to attach the package substrate 112 to a printed circuit board (PCB) (not shown).

[0016] The arrangement of the first component 102, the second component 106, the interposer 110, and the package substrate 112 is for illustrative purposes only. The HIM can have different configurations with more or fewer components. For example, the first component 102 and the second component 106 can be attached to the package substrate 112 by external connectors without an interposer. In other examples, the first component 102 and the second component 106 can be integrated into a single fan-out package. In the illustrated example, the first component 102 and the second component 106 are electrically and / or communicatively coupled to each other via the interposer 110, or via the metallization of the interposer, package substrate, and / or single fan-out package. Generally, the first component 102 and the second component 106 are electrically and / or communicatively coupled to each other via a wiring board. In some examples, the first component 102 and the second component 106 are closer together than in conventional technologies that did not integrate similar components into the HIM, and therefore, signal propagation delay and signal degradation due to the wiring length connecting the first component 102 and the second component 106 can be reduced.

[0017] The thermal management device of the first HIM100 includes a main section 140, a vertical support section 142, and a flange section 144. The main section 140 is substantially horizontal and overlaps the first component 102 and the second component 106, and is in thermal communication with them. The vertical support section 142 extends vertically downward (for example, toward the package substrate 112) from around the main section 140. The flange section 144 extends horizontally away from the lower part of the vertical support section 142 that is close to the package substrate 112, and perpendicular to that lower part.

[0018] The main section 140 of the thermal control device has an integrated island section 146. The integrated island section extends vertically downward from the bottom surface of the main section 140 at a position corresponding to the first component 102 (for example, in the same direction as the vertical support section 142 extends). A separate island 148 is mechanically coupled to the bottom surface of the main section 140 at a position corresponding to the second component 106. A first thermal interface material (TIM) 150 is positioned in contact between the main section 140 and the separate island 148. A number of screws 152 are each inserted into the separate island 148 at a circumferential position, inserted into their respective springs 154, and screwed (for example, threaded) into the bottom surface of the main section 140. The separate island 148 may float along the length of the screws 152. The springs 154 apply a downward force to the separate island 148 (for example, in the direction away from the bottom surface of the main section 140). Opposing forces may be applied to the separate island 148 (for example, partially by the first component 102, as described later). Depending on the magnitude of these forces, the separate island 148 may be in one of several positions along the length of the screw 152.

[0019] The second TIM 156 is located on the back surface of the first component 102, and the third TIM 158 is located on the back surface of the second component 106. The integrated island section 146 is in contact with the second TIM 156, and therefore the thermal control device is in thermal communication with the first component 102. The separate island 148 is in contact with the third TIM 158, and therefore the thermal control device is in thermal communication with the second component 106.

[0020] The thermal control device is mechanically coupled to the package substrate 112. The thermal control device can be mechanically coupled to the package substrate in a number of ways. In the illustrated example, a reinforcing member 160 (e.g., a ring reinforcing member) is bonded to the package substrate 112, for example, by epoxy. The reinforcing member 160 has a blind hole 162. The thermal control device has a guide pin 164 extending vertically downward from a vertical support 142. The guide pin 164 is inserted into the blind hole 162 in an aligned manner. By inserting the guide pin 164 into the blind hole 162, the thermal control device can be aligned with the reinforcing member 160, and further, with the first component 102 and the second component 106. Multiple screws 166 are inserted through their respective springs 168 and screwed into the reinforcing member 160 (e.g., by screwing them in) through the flange portion 144. The flange portion 144 (and therefore the thermal control device) may float along the length of the screw 166. The spring 168 applies a downward force to the flange portion 144. An opposing force may be applied to the main portion 140 (for example, partially to the first component 102). Depending on the magnitude of these forces, the flange portion 144 may be in one of several positions along the length of the screw 166.

[0021] Those skilled in the art will readily understand that the components of the first HIM 100 may be manufactured with varying tolerances and / or warpage (e.g., due to thermal cycling). The screw and spring configuration described above allows the thermal control device to be securely fastened to the first HIM 100 without generating additional stress on the first HIM 100. For example, the force of the spring 168 pushing downwards on the flange portion 144 (and thus the main portion 140 and the integrated island portion 146) allows the thermal control device to be securely held in a position where the integrated island portion 146 is in contact with the second TIM 156. Without the spring 168, the screw 166 could be over-torqued, potentially causing additional harmful stress on the first HIM 100, or under-torqued, potentially allowing the integrated island portion 146 to move away from contact with the second TIM 156. Furthermore, in this example, where the position of the thermal control device is primarily determined by the first component 102, the screws 152 and springs 154 can accommodate any further tolerances so that the separate island 148 can still contact the third TIM 158. Before the thermal control device is positioned and fixed in the reinforcing member 160, the first TIM 150 may fill the maximum space between the bottom surface of the main part 140 and the separate island 148, and when the separate island 148 contacts the third TIM 158, the first TIM 150 may be compressed and pushed out from between the main part 140 and the separate island 148.

[0022] In the illustrated example, the thermal management device is mechanically coupled to the package substrate 112 (for example, via a reinforcing member 160). In other examples, the thermal management device may be mechanically coupled to another component instead of the package substrate. For example, the vertical support 142 of the thermal management device may be located around the package substrate, and the thermal management device may be mechanically coupled to the PCB. The reinforcing member 160 may be bonded or soldered to the PCB, and the thermal management device may be fixed to the reinforcing member 160 as described with respect to Figure 1.

[0023] The heat exchanger and liquid pump and / or compressor (HEFP / C) 180 is attached to the upper surface of the main part 140 of the heat management device. The HEFP / C 180 can be attached to the main part 140 by TIM and / or screws. The HEFP / C 180 can receive thermal energy from the main part 140, transfer the thermal energy to a liquid, and circulate the liquid so that it returns from the outlet 182 through another heat exchanger to the inlet 184. The HEFP / C 180 can also include, for example, a liquid compressor that compresses the vapor received at the inlet 184 into a liquid. The flow of the liquid through the HEFP / C 180 and other heat exchangers can be single-phase (e.g., liquid phase) or two-phase (e.g., liquid phase, gas phase, or a mixture thereof). In the two-phase case, the heat management device may enable the refrigerant function to cool the first component 102 and the second component 106. In some examples, the HEFP / C 180 can provide self-filtration for cleaning the liquid flowing through the HEFP / C 180. For example, the HEFP / C 180 can include an internal volume through which the liquid flows. The internal volume can be large enough to allow the liquid to accumulate inside. When the liquid accumulates in the internal volume of the HEFP / C 180, the flow rate of the liquid may become low enough to allow the fine particles in the liquid to settle from the liquid, providing self-filtration.

[0024] The thermal management device allows for the formation of various thermal energy channels with varying thermal resistances. A first thermal energy channel can be located between the first component 102 and the HEFP / C180 and can pass through the second TIM 156, the integrated island section 146, and the main section 140. As is evident, there is no change in material or interface between the integrated island section 146 and the main section 140. A second thermal energy channel can be located between the second component 106 and the HEFP / C180 and can pass through the third TIM 158, the separate island 148, the first TIM 150, and the main section 140. The first TIM 150 is located between the separate island 148 and the main section 140 in the second thermal energy channel. The combination of materials used for the main section 140 (and therefore the integrated island section 146 as well), TIMs 150, 156, 158, and the separate island 148 can be selected so that the thermal energy channels have varying thermal resistances. For example, assuming that the second TIM 156 and the third TIM 158 are made of the same material, and the main section 140 and the separate island 148 are made of the same material, the first TIM 150 can be a TIM with high thermal resistivity. This makes it possible for the second thermal energy channel to have a higher thermal resistivity than the first thermal energy channel. In this example, the first TIM 150 can function as a thermal brake.

[0025] During operation, both the first component 102 and the second component 106 generate thermal energy, for example, due to the consumption of electrical energy that can be partially converted into thermal energy. The thermal energy generated by the first component 102 can flow through the HEFP / C180 in the first thermal energy flow path, and then the HEFP / C180 can transfer this thermal energy for dissipation. The thermal energy generated by the second component 106 can flow through the HEFP / C180 in the second thermal energy flow path, and then the HEFP / C180 can transfer this thermal energy for dissipation. Since the first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path, the first component 102 can dissipate thermal energy at a faster rate than the second component 106, and the second component 106 can be maintained at a higher operating temperature than the first component 102. This enables both the first component 102 and the second component 106 to operate within different but more desirable temperature ranges from each other.

[0026] Figure 2 shows a simplified cross-sectional view of the second HIM2,00 including a thermal management device according to some examples. The second HIM2,00 of FIG. 2 includes many of the same or similar components shown in and described with respect to the first HIM1,00 of FIG. 1. Therefore, for the sake of brevity, further description of such components is omitted here.

[0027] In the second HIM200, instead of the integrated island portion 146 of the first HIM100, there is a separate island 202 and a fourth TIM204. The separate island 202 is mechanically coupled to the bottom surface of the main portion 140 at a position corresponding to the first component 102. The fourth TIM204 is positioned in contact between the main portion 140 and the separate island 202. Multiple screws 206 are each inserted through the separate island 202 at their circumferential positions, inserted through their respective springs 208, and screwed (e.g., threaded) into the bottom surface of the main portion 140. The separate island 202 may float along the length of the screws 206. The springs 208 apply a downward force to the separate island 202 (e.g., away from the bottom surface of the main portion 140). An opposite force may be applied to the separate island 202 (e.g., partially by the first component 102). Depending on the magnitude of these forces, the separate island 202 may be in one of several positions along the length of the screw 206. The separate island 202 is in contact with the second TIM 156, and therefore the thermal control device is in thermal communication with the first component 102.

[0028] The thermal management device allows for the formation of various thermal energy channels with varying thermal resistances. In this example, the first thermal energy channel can be located between the first component 102 and the HEFP / C180 and can pass through the second TIM 156, the separate island 202, the fourth TIM 204, and the main section 140. The second thermal energy channel is as described above with respect to Figure 1. The combination of materials used for the main section 140, TIMs 150, 156, 158, 204, and the separate islands 148, 202 can be selected so that the thermal energy channels have different thermal resistances. For example, assuming that the second TIM 156 and the third TIM 158 are made of the same material and the separate islands 148, 202 are made of the same material, the first TIM 150 can be a TIM with a high thermal resistivity, and the fourth TIM 204 can be a TIM with a low thermal resistivity. This makes it possible for the second thermal energy channel to have a higher thermal resistivity than the first thermal energy channel. In this example, the first TIM150 can function as a thermal brake.

[0029] During operation, both the first component 102 and the second component 106 generate thermal energy. The thermal energy generated by the first component 102 can flow through the first thermal energy channel, and the thermal energy generated by the second component 106 can flow through the second thermal energy channel. Since the first thermal energy channel has a lower thermal resistivity than the second thermal energy channel, the first component 102 can dissipate thermal energy at a faster rate than the second component 106, and the second component 106 can be maintained at a higher operating temperature than the first component 102. This allows both the first component 102 and the second component 106 to operate within different but more desirable temperature ranges.

[0030] Figure 3 shows channel patterns of the contact area 300 in several examples. The contact area 300 is located on the island surface 302. The island surface 302 can be the surface of an integrated island section 146, a separate island 148, or a separate island 202, with each TIM 156, 158 in contact with its surface. The contact area 300 has channels 304 that are microfabricated or etched into the island surface 302. When the thermal control device of Figure 1 or Figure 2 is used with the HIM, air in the TIM can settle into the channels 304 in the contact area 300, thereby bringing each integrated island section 146, separate island 148, or separate island 202 closer to the component on which the TIM is located. The closer the integrated island 146, separate island 148, or separate island 202 is to the component, the smaller the thermal resistance between the thermal management device and the component, thereby increasing the conductivity of thermal energy from the component to the thermal management device for dissipation. In some examples, the contact region 300 in which the channel is formed may protrude from the main part of the island surface 302.

[0031] Channel 304 intersects at several points. The first subset of channel 304 extends in the first direction (e.g., vertically in the figure), and the second subset of channel 304 extends perpendicular to the first direction (e.g., horizontally in the figure), intersecting with the first subset of channel 304 at several points. The third subset of channel 304 extends at a 45-degree angle from the first direction, and the fourth subset of channel 304 extends at a 135-degree angle from the first direction, perpendicular to the direction in which the third subset of channel 304 extends. The fourth subset of channel 304 intersects with the third subset of channel 304, and the first and second subsets of channel 304 intersect in the quadrilateral shape formed by the first and second subsets of channel 304, and are centered. Adjacent parallel pairs of the first and second subsets of channel 304 have a first pitch, and adjacent parallel pairs of the third and fourth subsets of channel 304 have a second pitch, which is about half the first pitch.

[0032] Figure 4 shows a layout diagram of a system comprising a first HIM100 or a second HIM200 (indicated as "100 / 200") in several examples. The system includes a PCB 402. Power supplies 404, a first load package 406, and a second load package 408 are located on and mounted to the PCB 402. Several optical ports 410 are located on and mounted to the PCB 402. The HIM100 / 200 is located on and mounted to the PCB 402 (for example, via an external connector 120 (not shown)). Various components of the HIM100 / 200 are shown in the layout diagram but are not described here, except to note that the first component 102 and the second component 106 are shown with dashed lines due to their location below the main part 140 of the thermal management unit.

[0033] The heat exchanger is located in the second load package 408 and is liquid-coupled to the HEFP / C180. The heat exchanger includes fins 420 and meandering tubes 422. The meandering tubes 422 intersect each of the fins 420 at several different locations and are mechanically attached to each of the fins 420 at those locations. The meandering tubes 422 are further liquid-coupled to the outlet 182 and inlet 184 of the HEFP / C180.

[0034] During operation, the thermal energy received by the HEFP / C180 from the first component 102 and / or the second component 106 is transferred to the liquid (e.g., liquid phase and / or gaseous phase water) within the HEFP / C180. The HEFP / C180 then discharges the liquid through the meandering tube 422 and out the outlet 182. The thermal energy carried by the liquid can be transferred by heat conduction to the meandering tube 422 and then to the fins 420. The liquid flowing through the meandering tube 422 may be in the liquid phase, gaseous phase, or a mixture of the liquid and gaseous phases. The thermal energy can be dissipated from the meandering tube 422 and the fins 420 by a flow of gas (e.g., air) 424. For example, the liquid from which the thermal energy has been dissipated is circulated through the meandering tube 422 to the inlet 184 of the HEFP / C180. The HEFP / C180 may also compress the liquid received at the inlet 184 (e.g., from gaseous phase to liquid phase) to provide a refrigerant function. The HEFP / C180 can continuously recirculate the liquid at a rate of approximately 1.1 L / min and a pressure of approximately 4 PSI. In this example, the heat exchanger, which includes a meandering tube 422 and fins 420, can function as a primary heat sink for thermally managing active devices on the PCB 402.

[0035] In some examples, the system in Figure 4 has a form factor of 15 inches high, 17 inches wide, and 1.7 inches thick. In some of these examples, the system is thought to be able to dissipate 1 kW of thermal energy. For example, power supply 404 may generate approximately 100 W to 150 W, the first load package 406 and the second load package 408 may each generate approximately 200 W, PCB 402 may generate approximately 50 W, the first component 102 may generate approximately 40 W, and the second component 106 may generate approximately 205 W. This thermal energy can be dissipated by the system.

[0036] Figure 5 is a flowchart of method 500 for forming HIM in several examples. The various operations of method 500 can be performed sequentially or in parallel. In block 502, the first component 102 and the second component 106 are assembled on the wiring board so as to be electrically and communicatively coupled to each other. The first component 102 and the second component 106 can be assembled on the wiring board by acceptable art which would be readily apparent to those skilled in the art. In the illustrated examples above, the first component 102 and the second component 106 are attached to the interposer 110 by reflowing external connectors 114, 116, etc. The interposer 110 is attached to the package substrate 112 by reflowing external connector 118, etc.

[0037] In block 504, a thermal control device is formed. The main part 140, vertical support part 142, guide pin 164, and, where applicable, integrated island part 146 of the thermal control device can be machined from any thermal conductive material such as metal materials such as copper, aluminum, or aluminum titanium. Similarly, the separate island 148 and, where applicable, separate island 202 of the thermal control device can be machined from any thermal conductive material such as metal materials such as copper, aluminum, or aluminum titanium. The material of the main part 140 and the respective materials of the separate islands 148 and 202 can be the same or different. The first TIM 150 can be applied to the separate island 148, and then the separate island 148 can be fixed to the bottom surface of the main part 140 using screws 152 and springs 154. Where applicable, the fourth TIM 204 can be applied to the separate island 202, and then the separate island 202 can be fixed to the bottom surface of the main part 140 using screws 206 and springs 208. The first TIM 150 and the fourth TIM 204 can each be, for example, a thermal grease containing a liquid matrix and a thermally conductive filler. When both the first TIM 150 and the fourth TIM 204 are installed, the first TIM 150 may have a lower filler ratio to matrix and / or lower thermal conductivity than the fourth TIM 204.

[0038] In block 506, the thermal control device is fixed to the first component 102 and the second component 106. The thermal control device is fixed in thermal communication with the first component 102 and the second component 106. Depending on how the first component 102 and the second component 106 are assembled, the thermal control device can be fixed to the first component 102 and the second component 106 by mechanically coupling the thermal control device to, for example, the package substrate or PCB. In the above example, the thermal control device is mechanically coupled to the package substrate 112. According to the above example, a reinforcing member 160 having blind holes 162 (corresponding to guide pins 164) can be manufactured by machining a rigid material such as metal. The reinforcing member 160 can be attached to the package substrate 112 by adhesive. In some examples where the reinforcing member 160 is attached to the PCB, the reinforcing member 160 can be attached by adhesive or by soldering the reinforcing member 160 to the metal on the surface of the PCB. The second TIM 156 and the third TIM 158 are applied to the first component 102 and the second component 106, respectively. The second TIM 156 and the third TIM 158 can each be, for example, a thermal grease containing a liquid matrix and a thermally conductive filler. The second TIM 156 and the third TIM 158 can have the same material composition, or the third TIM 158 can have a lower filler ratio to matrix and / or lower thermal conductivity than the second TIM 156. The thermal control device can then be positioned on the first component 102 and the second component 106 and attached to the reinforcing member 160 in its positioned position by inserting guide pins 164 into blind holes 162 and by screws 166 and springs 168.

[0039] Subsequently, if the HIM is not assembled to the PCB, it can be mounted to the PCB as shown and described in relation to Figure 4. The HEFP / C180 can be mounted to a thermal control device by TIM and / or screws, etc., and can be liquid-coupled to a heat exchanger such as one having a meandering tube 422 and fins 420, as shown and described in relation to Figure 4. The HIM in the system contained on the PCB can operate as described above.

[0040] The disclosed technology may also be represented by the following non-limiting examples.

[0041] Example 1. An apparatus comprising a wiring board, a first component, a second component, the first and second components being coupled to each other via the wiring board in a manner that allows communication between them, and a thermal control device that is in thermal communication with the first and second components, having a first thermal energy channel for dissipating thermal energy generated by the first component, and a second thermal energy channel for dissipating thermal energy generated by the second component, wherein the first thermal energy channel has a lower thermal resistivity than the second thermal energy channel.

[0042] Example 2. The apparatus according to Example 1, wherein the first component is an optical device, a photonic device, or a combination thereof, and the second component is an electrical device.

[0043] Example 3. The apparatus according to Example 1, wherein a first thermal interface material is arranged on a first component, a second thermal interface material is arranged on a second component, and a thermal control device is arranged in contact with the first and second thermal interface materials.

[0044] Example 4. The thermal management device according to Example 3, comprising a main part, an integrated island part formed integrally with the main part, a separate island attached to the main part, and a third thermal interface material disposed between the separate island and the main part, wherein the integrated island part is in contact with the first thermal interface material, a first thermal energy flow path passes through the integrated island part and the main part, the separate island is in contact with the second thermal interface material, and a second thermal energy flow path passes through the separate island, the third thermal interface material, and the main part.

[0045] Example 5. The thermal management device according to Example 3, comprising a main part, a first separate island attached to the main part, a third thermal interface material disposed between the first separate island and the main part, a second separate island attached to the main part, and a fourth thermal interface material disposed between the second separate island and the main part, wherein the first separate island is in contact with the first thermal interface material, a first thermal energy flow path passes through the first separate island, the third thermal interface material, and the main part, and the second separate island is in contact with the second thermal interface material, a second thermal energy flow path passes through the second separate island, the fourth thermal interface material, and the main part.

[0046] Example 6. The apparatus according to Example 1, further comprising a heat exchanger attached to a thermal control device, the heat exchanger including a liquid pump, a compressor, or a combination thereof.

[0047] Example 7. The apparatus according to Example 1, further comprising a package substrate and a reinforcing member mechanically attached to the package substrate, wherein the wiring board is an interposer, each of the first and second components is attached to the interposer, the interposer is attached to the package substrate, the reinforcing member is around the sides of the interposer, and the thermal control device includes a main part, a support part extending perpendicularly from the main part, and a flange part extending perpendicularly from the support part and away from the main part, the main part is in thermal communication with the first and second components, and the flange part is attached to the reinforcing member.

[0048] Example 8. A system comprising heterogeneous integrated modules, wherein the heterogeneous integrated modules include a wiring board, a first component mounted on the wiring board, a second component mounted on the wiring board, wherein the first and second components are coupled to each other via the wiring board in a manner that allows communication, a first thermal interface material disposed on the first component, a second thermal interface material disposed on the second component, and a thermal management device in contact with the first and second thermal interface materials, wherein the thermal management device has a first thermal energy channel from a point in contact with the first thermal interface material, a second thermal energy channel from a point in contact with the second thermal interface material, and the first thermal energy channel has a lower thermal resistivity than the second thermal energy channel.

[0049] Example 9. The system according to Example 8, wherein the first component is an optical device, a photonic device, or a combination thereof, and the second component is an electrical device.

[0050] Example 10. The thermal management device comprises a main part, an integrated island part formed integrally with the main part, a separate island attached to the main part, and a third thermal interface material disposed between the separate island and the main part, wherein the integrated island part is in contact with the first thermal interface material, a first thermal energy flow path passes through the integrated island part and the main part, the separate island is in contact with the second thermal interface material, and a second thermal energy flow path passes through the separate island, the third thermal interface material, and the main part, as described in Example 8.

[0051] Example 11. The system according to Example 8, wherein the thermal management device comprises a main part, a first separate island attached to the main part, a third thermal interface material disposed between the first separate island and the main part, a second separate island attached to the main part, and a fourth thermal interface material disposed between the second separate island and the main part, wherein the first separate island is in contact with the first thermal interface material, a first thermal energy channel passes through the first separate island, the third thermal interface material, and the main part, and the second separate island is in contact with the second thermal interface material, a second thermal energy channel passes through the second separate island, the fourth thermal interface material, and the main part.

[0052] Example 12. The system according to Example 8, further comprising a printed circuit board having heterogeneous integrated modules mounted on the printed circuit board.

[0053] Example 13. The system according to Example 12, further comprising: a first heat exchanger attached to a thermal control device, the first heat exchanger including a liquid pump, a compressor, or a combination thereof; and a second heat exchanger located on a printed circuit board, the second heat exchanger comprising a meandering tube and fins, the meandering tube being attached to the fins and extending through the fins, and the meandering tube being liquid-coupled to the first heat exchanger.

[0054] Example 14. The system according to Example 13, wherein the first heat exchanger includes an internal volume through which a liquid flows and which allows a liquid to accumulate during operation.

[0055] Example 15. The system according to Example 8, wherein the heterogeneous integrated module further comprises a package substrate and a reinforcing material mechanically attached to the package substrate, the wiring board is an interposer, each of the first and second components is attached to the interposer, the interposer is attached to the package substrate, the reinforcing material is around the sides of the interposer, and the thermal management device includes a main part, a support part extending perpendicularly from the main part, and a flange part extending perpendicularly from the support part and away from the main part, the main part is in thermal communication with the first and second components, and the flange part is attached to the reinforcing material.

[0056] Example 16. A method for forming a heterogeneous integrated module, comprising assembling a first component and a second component onto a wiring board, and fixing a thermal control device that is in thermal communication with the first component and the second component, wherein the thermal control device has a first thermal energy channel for thermal energy generated by the first component, a second thermal energy channel for thermal energy generated by the second component, and the first thermal energy channel has a lower thermal resistivity than the second thermal energy channel.

[0057] Example 17. The method according to Example 16, wherein the first component is an optical device, a photonic device, or a combination thereof, and the second component is an electrical device.

[0058] Example 18. The method according to Example 16, wherein the thermal management device comprises a main part, an integrated island part formed integrally with the main part, a separate island attached to the main part, and a thermal interface material disposed between the separate island and the main part, and a first thermal energy channel passes through the integrated island part and the main part, and a second thermal energy channel passes through the separate island, the thermal interface material and the main part.

[0059] Example 19. The method according to Example 16, wherein the thermal control device comprises a main part, a first separate island attached to the main part, a first thermal interface material disposed between the first separate island and the main part, a second separate island attached to the main part, and a second thermal interface material disposed between the second separate island and the main part, wherein a first thermal energy channel passes through the first separate island, the first thermal interface material, and the main part, and a second thermal energy channel passes through the second separate island, the second thermal interface material, and the main part.

[0060] Example 20. The method according to Example 16, wherein assembling the first and second components to the wiring board includes attaching the first and second components to an interposer which is a wiring board, attaching the interposer to a package substrate, and fixing the thermal management device, and fixing the thermal management device includes attaching a reinforcing material to the package substrate and attaching the thermal management device to the reinforcing material.

[0061] While the above description is directed to a specific example, other and further examples may be devised without deviating from its basic scope, the scope of which will be determined by the following claims.

Claims

1. Wiring board and The first component and, A second component wherein the first component and the second component are connected to each other via the wiring board so as to be able to communicate with each other, The system comprises a thermal control device that is in thermal communication with the first and second components, The thermal management device comprises a main part that overlaps the first and second components, and a first separate island attached to the main part via a first spring that applies force between the main part and the first separate island, and in contact with a first thermal interface material arranged on the second component, wherein the thermal management device has a first thermal energy channel for dissipating thermal energy generated by the first component, and a second thermal energy channel for dissipating thermal energy generated by the second component, and the first thermal energy channel has a lower thermal resistivity than the second thermal energy channel.

2. The apparatus according to claim 1, wherein the first component is an optical device, a photonic device, or a combination thereof, and the second component is an electrical device.

3. The second thermal interface material is placed on the first component, The thermal control device is positioned in contact with the second thermal interface material. The apparatus according to claim 1 or 2.

4. The aforementioned thermal control device An integrated island section formed integrally with the main section, A third thermal interface material is disposed between the first separate island and the main part. Furthermore, The integrated island portion comes into contact with the second thermal interface material. The first thermal energy channel passes through the integrated island section and the main section, The second thermal energy channel passes through the first separate island, the third thermal interface material, and the main part. The apparatus according to claim 3.

5. The aforementioned thermal control device A second separate island is attached to the main part via a second spring that applies force between the main part and the second separate island, A third thermal interface material is disposed between the second separate island and the main part, A fourth thermal interface material is disposed between the first separate island and the main part. Furthermore, The second separate island contacts the second thermal interface material, The first thermal energy channel passes through the second separate island, the third thermal interface material, and the main part, The second thermal energy channel passes through the first separate island, the fourth thermal interface material, and the main part. The apparatus according to claim 3.

6. The apparatus according to any one of claims 1 to 5, further comprising a heat exchanger attached to the heat management device, wherein the heat exchanger includes a fluid pump, a compressor, or a combination thereof.

7. Package substrate and Reinforcement material mechanically attached to the aforementioned package substrate and Furthermore, The aforementioned wiring board is an interposer, Each of the first and second components is attached to the interposer, The interposer is attached to the package substrate, The reinforcing material is located around the side of the interposer, The thermal control device further includes a support portion extending perpendicularly from the main portion and a flange portion extending perpendicularly from the support portion and away from the main portion, The main part is in thermal communication with the first component and the second component. The flange portion is attached to the reinforcing member. The apparatus according to any one of claims 1 to 6.

8. A system comprising heterogeneous integrated modules, The aforementioned heterogeneous integrated module, Wiring board and The first component attached to the aforementioned wiring board, A second component attached to the wiring board, wherein the first component and the second component are coupled to each other via the wiring board so as to be able to communicate with each other, A first thermal interface material arranged in the first component, The second thermal interface material arranged in the second component, The system comprises a thermal control device that contacts the first thermal interface material and the second thermal interface material, The thermal management device comprises a main part that overlaps the first and second components, and a first separate island attached to the main part via a first spring that applies force between the main part and the first separate island, and which is in contact with the second thermal interface material, wherein the thermal management device has a first thermal energy channel from a point in contact with the first thermal interface material and a second thermal energy channel from a point in contact with the second thermal interface material, and the first thermal energy channel has a lower thermal resistivity than the second thermal energy channel.

9. The system according to claim 8, wherein the first component is an optical device, a photonic device, or a combination thereof, and the second component is an electrical device.

10. The aforementioned thermal control device An integrated island section formed integrally with the main section, A third thermal interface material is disposed between the first separate island and the main part. Furthermore, The integrated island portion comes into contact with the first thermal interface material. The first thermal energy channel passes through the integrated island section and the main section, The second thermal energy channel passes through the first separate island, the third thermal interface material, and the main part. The system according to claim 8 or 9.

11. The aforementioned thermal control device A second separate island is attached to the main part via a second spring that applies force between the main part and the second separate island, A third thermal interface material is disposed between the second separate island and the main part, A fourth thermal interface material is disposed between the first separate island and the main part. Furthermore, The second separate island contacts the first thermal interface material, The first thermal energy channel passes through the second separate island, the third thermal interface material, and the main part, The first separate island contacts the second thermal interface material, The second thermal energy channel passes through the first separate island, the fourth thermal interface material, and the main part. The system according to claim 8 or 9.

12. The system according to any one of claims 8 to 11, further comprising a printed circuit board on which the heterogeneous integrated modules are attached.

13. A first heat exchanger attached to the aforementioned heat management device, comprising a fluid pump, a compressor, or a combination thereof, A second heat exchanger arranged on the printed circuit board, comprising a meandering tube and fins, wherein the meandering tube is attached to the fins and extends through the fins, and the meandering tube is fluidly coupled to the first heat exchanger. The system according to claim 12, further comprising:

14. The system according to claim 13, wherein the first heat exchanger includes an internal volume through which a fluid flows and which allows the fluid to accumulate during operation.

15. The aforementioned heterogeneous integrated module, Package substrate and Reinforcement material mechanically attached to the aforementioned package substrate and Furthermore, The aforementioned wiring board is an interposer, Each of the first and second components is attached to the interposer, The interposer is attached to the package substrate, The reinforcing material is located around the side of the interposer, The thermal control device further includes a support portion extending perpendicularly from the main portion and a flange portion extending perpendicularly from the support portion and away from the main portion, The main part is in thermal communication with the first component and the second component. The flange portion is attached to the reinforcing member. The system according to any one of claims 8 to 14.

16. Assembling the first and second components onto the wiring board, This includes fixing a thermal control device that is in thermal communication with the first and second components, A method for forming a heterogeneous integrated module, wherein the thermal management device comprises a main part overlapping the first and second components, and a first separate island attached to the main part via a first spring that applies force between the main part and a first separate island, and in contact with a first thermal interface material disposed on the second component, and the thermal management device has a first thermal energy channel for thermal energy generated by the first component and a second thermal energy channel for thermal energy generated by the second component, the first thermal energy channel having a lower thermal resistivity than the second thermal energy channel.

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