Liquid cooling device and heat dissipation assembly structure using the same

Abstract

To provide a liquid cooling device and a heat dissipation assembly structure using the same, which are publicly available for cooling a plurality of heating electronic devices arranged in an elongated manner.SOLUTION: In a heat dissipation assembly structure 1, a liquid cooling device 3 includes a bottom cover 30 and a base housing 2. The base housing is rectangular, and includes: an inflow chamber 21; an outflow chamber 22; flow dividing chambers 41a to 41c; a partition wall 20; first through holes 23a to 23c; second through holes; and a flow dividing structure. The inflow chamber and the outflow chamber are disposed between a bottom surface of a base and the bottom cover. A plurality of diverting chambers are provided on a top surface. The plurality of first through holes and the plurality of second through holes are disposed along a Y-axis direction so as to be adjacent to two long side sides facing each other. Each diversion chamber communicates with an inflow chamber and communicates with the outflow chamber via the second through hole. The flow dividing structure is disposed on the bottom cover or the first surface to achieve a uniform flow rate of the parallel flow paths.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a heat dissipation assembly structure, and particularly to a liquid cooling device having a flow splitting structure and a heat dissipation assembly structure using the same, which can provide a uniform flow path for a plurality of heat-generating electronic devices arranged in an elongated manner, respectively, and effectively improve the heat dissipation efficiency.

Background Art

[0002] Conventional electronic devices are often combined with a heat dissipation assembly structure to dissipate internal heat. High-power modules used in inverters often generate high heat, and in order to achieve effective heat dissipation, it is necessary to combine with a water-cooled heat dissipation assembly structure.

[0003] The traction inverter of an automotive motor usually includes three high-power modules arranged to form an elongated structure, and a series flow path design is often adopted for the combined water-cooled heat dissipation module. After the cooling fluid enters the heat exchange chamber from the inlet flow path, it continuously passes through a plurality of fins to dissipate heat, and finally is discharged from the outlet flow path. This structure is simple in design, but the temperature of the downstream fins becomes high, and the reliability of the downstream power module decreases. Furthermore, due to the continuous fin design, the impedance of the operating fluid of the system increases significantly, and the flow rate decreases. How to design the flow path of the liquid cooling device and construct a heat dissipation assembly structure suitable for a plurality of heat-generating electronic devices arranged in an elongated manner is a major issue in this field.

[0004] Therefore, it is necessary to provide a liquid cooling device and a heat dissipation assembly structure using the same, which introduce a flow splitting structure into a plurality of parallel flow paths, effectively reduce the temperature difference of a plurality of electronic devices in the heat dissipation assembly structure and the impedance of the cooling fluid, and eliminate the disadvantages of the prior art.

Summary of the Invention

Problems to be Solved by the Invention

[0005] The object of the present invention is to provide a liquid cooling device and a heat dissipation assembly structure using the same, which effectively reduce the temperature difference between multiple electronic devices in a heat dissipation assembly structure and the impedance of the cooling fluid by introducing a flow division structure into multiple parallel flow channels.

[0006] Another object of the present invention is to provide a liquid cooling device and a heat dissipation assembly structure using the same. To meet the heat dissipation requirements of multiple electronic devices arranged in a single direction, the liquid cooling device provides a parallel flow path design in an elongated base housing. The upper surface of the base housing is partitioned into multiple flow divider chambers connected to heat dissipation fins that are thermally coupled to the multiple electronic devices, and the lower surface of the base housing is partitioned into an inlet chamber and an outlet chamber by a partition wall. By installing the flow divider structure, the cooling fluid in the inlet chamber is uniformly divided into equal parts, then enters the multiple flow divider chambers through multiple through-holes on adjacent long sides, and merges and is discharged into the outlet chamber through through-holes on other long sides. The multiple flow divider chambers form multiple lateral flow paths corresponding to two through-holes on the long sides, and the multiple lateral flow paths are connected in parallel between the inlet chamber and the outlet chamber, dissipating heat individually to the multiple electronic devices with equal flow rates of cooling fluid. Since the flow directions of the multiple lateral channels are perpendicular to the extending direction of the long side, a short-path design is employed so that the lateral channels of the multiple diversion chambers are located between the two opposing long sides of the elongated base housing, rather than being designed along the extending direction of the long side. This shortens the length of the channels and achieves the objective of improving uniform heat dissipation performance. As a result, the cooling channel inlet and outlet can provide the cooling fluid inlet and outlet from different ends of the long side. Furthermore, the through-holes that are positioned and extend along the two opposing long sides have the same width as the diversion chambers communicating between them, and the multiple channels formed are evenly divided by at least one diversion structure. This ensures that the electronic devices corresponding to the multiple diversion chambers in the heat dissipation assembly structure have similar heat dissipation conditions, allowing for rapid and even removal of heat generated from multiple electronic devices and effectively improving overall heat dissipation efficiency. [Means for solving the problem]

[0007] To achieve the above objective, the present invention provides a liquid cooling device comprising a base housing, an upper cover, and a bottom cover. The base housing is an elongated rectangle and has a first side, a second side, a third side, a fourth side, a first surface, and a second surface, the first and second sides being arranged opposite each other and extending along a first direction. The base housing comprises an inlet chamber, an outlet chamber, a plurality of diversion chambers, a partition wall, a plurality of first through holes, a plurality of second through holes, and at least one diversion structure. The bottom cover is spatially opposite the first surface and is connected to the first side, second side, third side, and fourth side. The inlet chamber is provided between the first surface and the bottom cover. The outlet chamber is provided between the first surface and the bottom cover. The plurality of diversion chambers are provided on the second surface and are configured to be thermally coupled to a plurality of fins. The partition wall is provided between the inlet chamber and the outlet chamber and is connected between the first surface and the bottom cover. Multiple first through-holes are provided adjacent to the first side surface and arranged along the first direction, each communicating between the inlet chamber and the multiple diversion chambers. Multiple second through-holes are provided adjacent to the second side surface and arranged along the first direction, each communicating between the outlet chamber and the multiple diversion chambers, with the multiple diversion chambers corresponding to the multiple first through-holes where adjacent to the first side surface and the multiple second through-holes where adjacent to the second side surface. At least one diversion structure is provided on the bottom cover and protrudes toward the inlet or outlet chamber to provide a diversion function. The cooling fluid enters the multiple diversion chambers through the inlet chamber and the multiple first through-holes, respectively, and after heat exchange with the multiple fins, the cooling fluid enters the outlet chamber through the multiple diversion chambers and the multiple second through-holes, respectively, and is then discharged.

[0008] In one embodiment, the liquid cooling device further includes a cooling channel inlet and a cooling channel outlet, the cooling channel inlet being provided through the bottom cover and communicating with the inlet chamber, and the cooling channel outlet being provided through the bottom cover and communicating with the outlet chamber.

[0009] In one embodiment, at least one flow diversion structure is circular and is positioned along the centerline between any two adjacent first through-holes, or along the centerline between any two adjacent second through-holes, to provide a flow diversion function.

[0010] In one embodiment, at least one flow diversion structure is elongated, positioned separately from the partition wall, and extends along a second direction perpendicular to a first direction.

[0011] In one embodiment, at least one flow-diverting structure is composed of irregular bends in a partition wall.

[0012] In one embodiment, the plurality of first through holes and the plurality of second through holes are all slotted holes and extend along the first direction.

[0013] In one embodiment, the liquid cooling device further comprises an upper cover having an upper and lower surface facing each other, with the heat dissipation surface provided on the upper surface, and the lower surface connected to the first, second, third, fourth, and second surfaces of the base housing to form a plurality of flow diversion chambers, and a plurality of fins housed within the plurality of flow diversion chambers and extending from the lower surface toward the second surface.

[0014] In one embodiment, the number of each of the multiple flow-dividing chambers, multiple first through-holes, and multiple second through-holes is equal to M, where M is an integer and M ≥ 2.

[0015] In one embodiment, a plurality of flow-dividing chambers, a plurality of first through-holes, and a plurality of second through-holes form M flow channels, and the flow direction of the M flow channels is perpendicular to the first direction.

[0016] To achieve the above objective, the present invention further provides a liquid cooling device comprising a base housing. The base housing is an elongated rectangle and has a first side, a second side, a third side, a fourth side, a first surface, and a second surface, the first and second sides being arranged opposite each other and extending along a first direction. The base housing comprises an inlet chamber, an outlet chamber, a plurality of diversion chambers, a partition wall, a plurality of first through holes, a plurality of second through holes, and at least one diversion structure. The inlet chamber is provided on the first surface. The outlet chamber is provided on the first surface. The plurality of diversion chambers are provided on the second surface and are configured to be thermally coupled to a plurality of fins. The partition wall is provided between the inlet chamber and the outlet chamber. The plurality of first through holes are provided adjacent to the first side, arranged along the first direction, and each communicates with the inlet chamber and the plurality of diversion chambers. Multiple second through-holes are provided adjacent to the second side surface and arranged along the first direction, each communicating between the outlet chamber and the multiple diversion chambers, the multiple diversion chambers corresponding to the multiple first through-holes where adjacent to the first side surface and the multiple second through-holes where adjacent to the second side surface. At least one diversion structure is provided on the first surface and is located in the inlet chamber or outlet chamber, or connected to a partition wall, to provide a diversion function. Cooling fluid enters the multiple diversion chambers, respectively, through the inlet chamber and the multiple first through-holes, and after heat exchange with the multiple fins, the cooling fluid enters the outlet chamber from the multiple diversion chambers and the multiple second through-holes, respectively, and is then discharged.

[0017] In one embodiment, the liquid cooling device further includes a cooling channel inlet and a cooling channel outlet, the cooling channel inlet being located adjacent to the third side and communicating with the inlet chamber, and the cooling channel outlet being located adjacent to the fourth side and communicating with the outlet chamber.

[0018] In one embodiment, the liquid cooling device further includes a bottom cover, which is connected to the first, second, third, fourth, and first surfaces of the base housing and to a partition wall, forming an inlet chamber and an outlet chamber, with a cooling channel inlet and a cooling channel outlet provided through the bottom cover.

[0019] In one embodiment, at least one end of a flow diversion structure is connected to a partition wall, and the other end extends along a second direction perpendicular to the first direction.

[0020] In one embodiment, at least one flow diversion structure is circular and is positioned along the centerline between any two adjacent first through-holes, or along the centerline between any two adjacent second through-holes, to provide a flow diversion function.

[0021] In one embodiment, at least one flow diversion structure is elongated, positioned separately from the partition wall, and extends along a second direction perpendicular to a first direction.

[0022] In one embodiment, at least one flow-diverting structure is composed of irregular bends in a partition wall.

[0023] In one embodiment, the plurality of first through holes and the plurality of second through holes are all elongated holes and extend along the first direction.

[0024] In one embodiment, the liquid cooling device further comprises an upper cover having an upper and lower surface facing each other, the lower surface being connected to a first side, second side, third side, fourth side, and second surface of the base housing to form a plurality of flow diversion chambers, the plurality of fins being housed within the plurality of flow diversion chambers, extending from the lower surface toward the second surface, and the upper surface being provided with a heat dissipation surface that is thermally coupled to the plurality of fins.

[0025] In one embodiment, the number of each of the multiple flow-dividing chambers, multiple first through-holes, and multiple second through-holes is equal to M, where M is an integer and M ≥ 2.

[0026] To achieve the above object, the present invention further provides a heat dissipation assembly structure including a liquid cooling device and a plurality of electronic devices. The liquid cooling device includes a base housing and a bottom cover. The base housing has a first side surface, a second side surface, a third side surface, a fourth side surface, a first surface, and a second surface. The first side surface and the second side surface are arranged opposite to each other and extend along a first direction. The base housing includes an inflow chamber, an outflow chamber, a plurality of diversion chambers, a partition wall, a plurality of first through holes, a plurality of second through holes, and at least one diversion structure. The bottom cover is spatially opposed to the first surface and is connected to the first side surface, the second side surface, the third side surface, and the fourth side surface. The inflow chamber is provided between the first surface and the bottom cover. The outflow chamber is provided between the first surface and the bottom cover. The plurality of diversion chambers are provided on the second surface and are configured to be thermally coupled to a plurality of fins. The plurality of fins are connected to a heat dissipation surface. The partition wall is provided between the inflow chamber and the outflow chamber. One end connected to the third side surface of the partition wall is close to the second side surface, and the other end connected to the fourth side surface of the partition wall is close to the first side surface. The plurality of first through holes are provided adjacent to the first side surface and are arranged along the first direction, and each communicates between the inflow chamber and the plurality of diversion chambers. The plurality of second through holes are provided adjacent to the second side surface and are arranged along the first direction, and each communicates between the outflow chamber and the plurality of diversion chambers. The plurality of diversion chambers correspond to the plurality of first through holes at a location adjacent to the first side surface and correspond to the plurality of second through holes at a location adjacent to the second side surface. The at least one diversion structure is provided on the bottom cover or the first surface and protrudes toward the inflow chamber or the outflow chamber to provide a diversion function. The plurality of electronic devices are provided on the heat dissipation surface and are arranged along the first direction and are thermally coupled to the plurality of fins. The cooling fluid enters the plurality of diversion chambers through the inflow chamber and the plurality of first through holes respectively, exchanges heat with the plurality of fins, dissipates the heat of the plurality of electronic devices, and then the cooling fluid flows from the plurality of diversion chambers through the plurality of second through holes into the outflow chamber.

Brief Description of the Drawings

[0027] The following detailed description of the present invention and schematic diagrams of the embodiments are provided to enable those skilled in the art to fully understand the above content and do not limit the present invention.

[0028] [Figure 1] It is a perspective structural view of a heat dissipation assembly structure according to the first embodiment of the present invention. [Figure 2] It is a perspective structural view of a heat dissipation assembly structure according to the first embodiment of the present invention.

[0029] [Figure 3] It is an exploded structural view of a heat dissipation assembly structure according to the first embodiment of the present invention. [Figure 4] It is an exploded structural view of a heat dissipation assembly structure according to the first embodiment of the present invention.

[0030] [Figure 5] It is a schematic diagram showing the flow direction of the cooling fluid on the first surface of the liquid cooling device according to the first embodiment of the present invention.

[0031] [Figure 6] It is a schematic diagram showing the flow direction of the cooling fluid on the second surface of the liquid cooling device according to the first embodiment of the present invention.

[0032] [Figure 7] It is an exploded structural view of a heat dissipation assembly structure according to the second embodiment of the present invention. [Figure 8] It is an exploded structural view of a heat dissipation assembly structure according to the second embodiment of the present invention.

[0033] [Figure 9] It is a schematic diagram showing the flow direction of the cooling fluid on the first surface of the liquid cooling device according to the second embodiment of the present invention.

[0034] [Figure 10] It is an exploded structural view of a heat dissipation assembly structure according to the third embodiment of the present invention.

[0035] [Figure 11] This is a schematic diagram showing the flow direction of the cooling fluid on the first surface of a liquid cooling device according to a third embodiment of the present invention.

[0036] [Figure 12] This is an exploded view of the heat dissipation assembly structure according to the fourth embodiment of the present invention.

[0037] [Figure 13] This is a schematic diagram showing the flow direction of the cooling fluid on the first surface of a liquid cooling device according to a fourth embodiment of the present invention.

[0038] [Figure 14] The following are examples of other different flow division structures in the liquid cooling device of the present invention. [Figure 15] The following are examples of other different flow division structures in the liquid cooling device of the present invention. [Figure 16] The following are examples of other different flow division structures in the liquid cooling device of the present invention.

[0039] [Figure 17] This is a perspective view of a heat dissipation assembly structure according to a fifth embodiment of the present invention. [Figure 18] This is a perspective view of a heat dissipation assembly structure according to a fifth embodiment of the present invention.

[0040] [Figure 19] This is an exploded view of the heat dissipation assembly structure according to the fifth embodiment of the present invention. [Figure 20] This is an exploded view of the heat dissipation assembly structure according to the fifth embodiment of the present invention.

[0041] [Figure 21] This is a schematic diagram showing the flow direction of the cooling fluid on the first surface of a liquid cooling device according to a fifth embodiment of the present invention.

[0042] [Figure 22] This is a schematic diagram showing the flow direction of the cooling fluid on the second surface of a liquid cooling device according to a fifth embodiment of the present invention. [Modes for carrying out the invention]

[0043] Several typical embodiments illustrating the features and advantages of the present invention will be described in detail in the following description. The present invention can have various variations in different embodiments, none of which depart from the scope of the invention, and the description and drawings are used essentially for illustrative purposes and are not intended to limit the invention. For example, where the following description of the present invention describes placing a first feature above or above a second feature, it indicates that embodiments include those in which the placed first feature is in direct contact with the second feature, and also includes those in which an additional feature is placed between the first and second features, thereby preventing the first feature from directly contacting the second feature. Furthermore, overlapping reference numerals and / or symbols may be used in different embodiments of the present invention. These overlaps are for the purpose of simplification and clarity and are not used to limit the relationships between each embodiment and / or the aforementioned external structures. Also, spatial terms such as “top,” “bottom,” “summit,” “bottom,” and similar terms may be used to briefly describe the relationship between components or feature elements in the drawings and other components or feature elements. In addition to the orientations shown in the drawings, spatial terms are used to include different orientations of the device in use or operation. The aforementioned device may be positioned separately (e.g., rotated 90 degrees or positioned in another orientation), and the descriptions of spatially related terms used therein should be interpreted accordingly. Furthermore, when one component is said to be “connected” or “joined” to another component, it may be directly connected or joined to the other component, or there may be an intervening component. The broad range of numerical values ​​and parameters in this disclosure are approximations, but numerical values ​​should be described as accurately as possible in specific examples. Furthermore, terms such as “first,” “second,” etc., may be used in the claims to describe different components, but these components should not be limited by these terms, and it should be understood that these components described in embodiments are indicated by different component symbols. These terms are for distinguishing different components.For example, the first component may be referred to as the second component, and similarly, the second component may be referred to as the first component, without departing from the scope of the embodiment. As used herein, the term "and / or" includes any combination of one or more of the related items listed.

[0044] Figures 1 and 2 are perspective views of a heat dissipation assembly structure according to a first embodiment of the present invention. Figures 3 and 4 are exploded views of the heat dissipation assembly structure according to a first embodiment of the present invention. Figure 5 is a schematic diagram showing the flow direction of the cooling fluid on the first surface of the liquid cooling device according to a first embodiment of the present invention. Figure 6 is a schematic diagram showing the flow direction of the cooling fluid on the second surface of the liquid cooling device according to a first embodiment of the present invention. Refer to Figures 1 to 6. In this embodiment, the present invention provides a heat dissipation assembly structure 1 comprising an elongated liquid cooling device 3 and a plurality of electronic devices 9a, 9b, and 9c. The liquid cooling device 3 mainly comprises an elongated rectangular base housing 2, an upper cover 40, and a bottom cover 30. In this embodiment, the base housing 2 has a first side surface 11, a second side surface 12, a third side surface 13, a fourth side surface 14, a first surface 101, and a second surface 102. The first side surface 11 and the second side surface 12 are arranged opposite each other and are the longer sides that extend along a first direction such as the Y axis. The third side 13 and the fourth side 14 are short sides that are positioned opposite each other and are connected between the first side 11 and the second side 12, respectively. The first surface 101 and the second surface 102 are the bottom and top surfaces of the base housing 2, respectively, and are two surfaces that are opposite each other. In this embodiment, the distance between the first side 11 and the second side 12 (i.e., width) of the base housing 2 is smaller than the distance between the third side 13 and the fourth side 14 (i.e., length), thereby forming an elongated rectangular base housing 2. That is, the length of the long sides of the first side 11 and the second side 12 is longer than the length of the short sides of the third side 13 and the fourth side 14. In this embodiment, the base housing 2 includes an inlet chamber 21, an outlet chamber 22, a plurality of flow diversion chambers 41a, 41b, 41c, a partition wall 20, a plurality of first through holes 23a, 23b, 23c, a plurality of second through holes 24a, 24b, 24c, at least one flow diversion structure 33a, 33b, a cooling channel inlet 31, and a cooling channel outlet 32. In this embodiment, the bottom cover 30 is spatially opposite the first surface 101 and connected to the first side surface 11, the second side surface 12, the third side surface 13, and the fourth side surface 14. The inlet chamber 21 is provided between the first surface surface 101 and the bottom cover 30.The outflow chamber 22 is provided between the first surface 101 and the bottom cover 30. The partition wall 20 is provided between the inflow chamber 21 and the outflow chamber 22 and is connected between the first surface 101 and the bottom cover 30. In this embodiment, one side of the bottom cover 30 is assembled with the first side surface 11, second side surface 12, third side surface 13, fourth side surface 14 and the first surface 101 of the base housing 2, and is connected to the partition wall 20 to form the inflow chamber 21 and the outflow chamber 22, and the cooling channel inlet 31 and the cooling channel outlet 32 ​​are provided penetrating the bottom cover 30. In this embodiment, the cooling channel inlet 31 is provided adjacent to the third side surface 13 and communicates with the inflow chamber 21. The cooling channel outlet 32 ​​is provided adjacent to the fourth side surface 14 and communicates with the outflow chamber 22. Of course, the present invention is not limited to the method of assembling the bottom cover 30 and the base housing 2. After the bottom cover 30 is assembled with the elongated rectangular base housing 2, the space of the first surface 101 is divided by a partition wall 20 into an inlet chamber 21 and an outlet chamber 22, and the inlet chamber 21 and the outlet chamber 22 are symmetrical to each other. Of course, the present invention is not limited to this. In this embodiment, the liquid cooling device 3 forms a plurality of flow diversion chambers 41a, 41b, and 41c by assembling, for example, the upper cover 40 and the base housing 2. The upper cover 40 has an upper surface and a bottom surface that face each other, and the heat dissipation surfaces 43 corresponding to the electronic devices 9a, 9b, and 9c are located on the upper surface of the upper cover 40, and the bottom surface of the upper cover 40 is assembled with the first side surface 11, the second side surface 12, the third side surface 13, the fourth side surface 14, and the second surface 102 of the base housing 2 to form a plurality of flow diversion chambers 41a, 41b, and 41c. The present invention is not limited to the method of assembling the upper cover 40 and the base housing 2.

[0045] In this embodiment, the multiple fins 42 are provided, for example, on the bottom surface of the upper cover 40, housed within the multiple flow diversion chambers 41a, 41b, 41c, and extend from the bottom surface of the upper cover 40 toward the second surface 102. In other embodiments, the multiple fins 42 are provided, for example, on the second surface 102, connected to the upper cover 40, and thermally coupled to the upper heat dissipation surface 43. Of course, the present invention is not limited thereto. By assembling the upper cover 40 and the base housing 2, the multiple flow diversion chambers 41a, 41b, 41c are provided on the second surface 102 and are configured to be thermally coupled to the multiple fins 42. The multiple fins 42 are also connected to the heat dissipation surface 43, which dissipates heat from the multiple electronic devices 9a, 9b, 9c on it.

[0046] In this embodiment, the multiple first through holes 23a, 23b, and 23c are provided adjacent to the first side surface 11 and arranged along the first direction (i.e., the Y-axis direction), and each communicates with the inlet chamber 21 and the multiple diversion chambers 41a, 41b, and 41c. The multiple second through holes 24a, 24b, and 24c are provided adjacent to the second side surface 12 and arranged along the first direction (i.e., the Y-axis direction), and each communicates with the outlet chamber 22 and the multiple diversion chambers 41a, 41b, and 41c. The multiple diversion chambers 41a, 41b, and 41c correspond to the multiple first through holes 23a, 23b, and 23c at locations adjacent to the first side surface 11, and to the multiple second through holes 24a, 24b, and 24c at locations adjacent to the second side surface 12. The number of diversion chambers 41a, 41b, 41c, the number of first through-holes 23a, 23b, 23c, and the number of second through-holes 24a, 24b, 24c are all equal, at three each. The diversion chamber 41a, the first through-hole 23a, and the second through-hole 24a form flow path F1. The diversion chamber 41b, the first through-hole 23b, and the second through-hole 24b form flow path F2. The diversion chamber 41c, the first through-hole 23c, and the second through-hole 24c form flow path F3. The three flow paths F1, F2, and F3 are connected in parallel between the inlet chamber 21 and the outlet chamber 22, and the flow directions of the three flow paths F1, F2, and F3 are perpendicular to the first direction (Y-axis direction) and parallel to the X-axis direction.

[0047] In this embodiment, the flow dividers 33a and 33b are provided on one surface of the bottom cover 30, protruding toward the inlet chamber 21, and can be configured to be, for example, close to the first surface 101 but not in contact with the first surface 101. The flow dividers 33a and 33b have, for example, a rectangular shape, and their extension length in the second direction (i.e., the X-axis direction) can be adjusted according to the actual requirements. One end of the flow dividers 33a and 33b is in contact with the partition wall 20, and the other end of the flow dividers 33a and 33b extends along a second direction parallel to the X-axis, and the second direction is perpendicular to the first direction. As a result, the flow divider 33a provides a flow divider function to the adjacent first through holes 23a and 23b. The flow divider 33b provides a flow divider function to the adjacent first through holes 23b and 23c. In this invention, by installing flow division structures 33a and 33b, the parallel flow paths F1, F2, and F3 can more effectively meet the heat dissipation requirements of the multiple electronic devices 9a, 9b, and 9c arranged in a single direction. In other embodiments, even if either of the flow division structures 33a or 33b is omitted, a uniform flow division can be formed, and the parallel flow paths F1, F2, and F3 can still meet the heat dissipation requirements of the multiple electronic devices 9a, 9b, and 9c arranged in a single direction.

[0048] In this embodiment, the electronic devices 9a, 9b, and 9c are, for example, three power devices used in a multiphase inverter, and are configured to output a motor drive current. Since each power device needs to have input and output electrical connections, they need to be arranged in a single direction and electrically connected to the outside on two long sides of the heat dissipation assembly structure 1. In the heat dissipation assembly structure 1, to satisfy the heat dissipation requirements of the multiple electronic devices 9a, 9b, and 9c arranged in a single direction, the multiple electronic devices 9a, 9b, and 9c are provided on the heat dissipation surface 43, arranged along a first direction (i.e., the Y-axis direction), and thermally coupled with the multiple fins 42. If the multiple electronic devices 9a, 9b, and 9c are power devices of the multiphase inverter, they may be electrically connected to the outside via the first side 11 or the second side 12. Of course, the present invention is not limited thereto. In this embodiment, after the cooling fluid enters the inlet chamber 21 from the cooling channel inlet 31, the cooling fluid is evenly distributed by the flow division action of the flow division structures 33a and 33b within the inlet chamber 21, and can enter the multiple flow division chambers 41a, 41b, and 41c through the multiple first through holes 23a, 23b, and 23c, respectively. The cooling fluid in the multiple flow division chambers 41a, 41b, and 41c exchanges heat with the multiple fins 42, dissipating heat from the multiple electronic devices 9a, 9b, and 9c. Subsequently, the cooling fluid in the multiple flow division chambers 41a, 41b, and 41c merges into the outlet chamber 22 through the multiple second through holes 24a, 24b, and 24c, respectively. Finally, it is discharged from the cooling channel outlet 32.

[0049] In this embodiment, the multiple flow diversion chambers 41a, 41b, and 41c form multiple lateral flow channels F1, F2, and F3 corresponding to the first through holes 23a, 23b, and 23c on the first side surface 11 and the second through holes 24a, 24b, and 24c on the second side surface 12. Due to the flow diversion action of the flow diversion structures 33a and 33b, the multiple lateral flow channels F1, F2, and F3 are connected in parallel between the inlet chamber 21 and the outlet chamber 22, allowing the heat of the multiple electronic devices 9a, 9b, and 9c to be dissipated by a cooling fluid of equal flow rate. Since the flow directions of the multiple lateral flow channels F1, F2, and F3 are perpendicular to the long side, i.e., the extending direction of the first side surface 11 and the second side surface 12, a short-path design is adopted rather than being designed along the extending direction of the long side. This allows the lateral flow channels F1, F2, and F3 of the multiple diversion chambers 41a, 41b, and 41c to flow along the shortest path within the elongated base housing 2, thereby shortening the length of the flow channels and achieving the objective of improving uniform heat dissipation performance. As a result, the cooling channel inlet 31 and the cooling channel outlet 32 ​​can provide cooling fluid inlets and outlets from different ends on the long side, for example, ends adjacent to the third side surface 13 and the fourth side surface 14. In this embodiment, the multiple first through holes 23a, 23b, and 23c and the multiple second through holes 24a, 24b, and 24c are all slotted holes and extend along the first direction (i.e., the Y-axis direction). Multiple first through holes 23a, 23b, 23c and multiple second through holes 24a, 24b, 24c, and multiple flow division chambers 41a, 41b, 41c have the same width W in the first direction, and through the uniform flow division by the multiple flow channels F1, F2, F3 formed and the flow division structures 33a, 33b, the electronic devices 9a, 9b, 9c corresponding to the multiple flow division chambers 41a, 41b, 41c in the heat dissipation assembly structure 1 can have similar heat dissipation conditions, and the heat generated from the multiple electronic devices 9a, 9b, 9c can be removed quickly and uniformly, effectively improving the overall heat dissipation efficiency.

[0050] Figures 7 and 8 are exploded views of a heat dissipation assembly structure according to a second embodiment of the present invention. Figure 9 is a schematic diagram showing the flow direction of the cooling fluid on the first surface of a liquid cooling device according to a second embodiment of the present invention. In this embodiment, the structures of the heat dissipation assembly structure 1a and the liquid cooling device 3a are similar to those of the heat dissipation assembly structure 1 and the liquid cooling device 3 shown in Figures 1 to 6, and the same reference numerals represent the same components, structures, and functions, which are omitted from this description. Refer to Figures 6 to 9. In this embodiment, the flow dividers 25a and 25b are provided on the first surface 101 of the base housing 2a and are located within the outlet chamber 22. The flow dividers 25a and 25b protrude from the first surface 101 and are in contact with, for example, the bottom cover 30, but are not limited thereto. The flow dividers 25a and 25b have, for example, a rectangular shape, and their extension length in the second direction (i.e., the X-axis direction) can be adjusted according to actual requirements. One end of the flow division structures 25a and 25b is connected to the partition wall 20, and the other end of the flow division structures 25a and 25b extends along a second direction parallel to the X-axis, which is perpendicular to the first direction. As a result, flow division structure 25a provides a flow division function to the adjacent second through holes 24a and 24b. Flow division structure 25b provides a flow division function to the adjacent second through holes 24b and 24c. In this invention, by installing flow division structures 25a and 25b, the parallel flow paths F1, F2 and F3 can more effectively meet the heat dissipation requirements of the multiple electronic devices 9a, 9b and 9c arranged in a single direction. In other embodiments, uniform flow division can be achieved by moving the flow division structures 25a and 25b to the inlet chamber 21, or by omitting either of the flow division structures 25a and 25b, and as a result, the parallel flow paths F1, F2, and F3 satisfy the heat dissipation requirements of the multiple electronic devices 9a, 9b, and 9c arranged in a single direction.

[0051] Figure 10 is an exploded view of the heat dissipation assembly structure according to the third embodiment of the present invention. Figure 11 is a schematic diagram showing the flow direction of the cooling fluid on the first surface of the liquid cooling device according to the third embodiment of the present invention. In this embodiment, the structures of the heat dissipation assembly structure 1b and the liquid cooling device 3b are similar to those of the heat dissipation assembly structure 1 and the liquid cooling device 3 shown in Figures 1 to 6, and the same reference numerals represent the same components, structures, and functions, which are omitted from this description. Refer to Figures 6, 10, and 11. In this embodiment, the partition wall 20a of the base housing 2b is irregularly bent to separate the inlet chamber 21 and the outlet chamber 22. By irregularly bending the partition wall 20a, a flow diversion function is provided to a plurality of first through holes 23a, 23b, 23c or a plurality of second through holes 24a, 24b, 24c, so that the parallel flow paths F1, F2, F3 can satisfy the heat dissipation requirements of a plurality of electronic devices 9a, 9b, 9c arranged in a single direction. In other words, at least one flow-dividing structure 25c can be formed, for example, by irregularly bending a partition wall 20a. In this embodiment, after the cooling fluid enters the inlet chamber 21 from the cooling channel inlet 31, the cooling fluid is evenly divided by the flow-dividing action of at least one flow-dividing structure 25c in the inlet chamber 21, and can enter the multiple flow-dividing chambers 41a, 41b, 41c through a plurality of first through-holes 23a, 23b, 23c, respectively. The cooling fluid in the multiple flow-dividing chambers 41a, 41b, 41c exchanges heat with a plurality of fins 42 to dissipate heat from the plurality of electronic devices 9a, 9b, 9c. Subsequently, the cooling fluid in the multiple flow-dividing chambers 41a, 41b, 41c merges into the outlet chamber 22 through a plurality of second through-holes 24a, 24b, 24c, respectively. Finally, it is discharged from the cooling channel outlet 32. Of course, the present invention is not limited thereto.

[0052] Figure 12 is an exploded view of the heat dissipation assembly structure according to the fourth embodiment of the present invention. Figure 13 is a schematic diagram showing the flow direction of the cooling fluid on the first surface of the liquid cooling device according to the fourth embodiment of the present invention. In this embodiment, the structure of the heat dissipation assembly structure 1c and the liquid cooling device 3c is similar to the heat dissipation assembly structures 1, 1a and liquid cooling devices 3, 3a shown in Figures 1 to 9, and the same reference numerals represent the same components, structure and function, and their explanation is omitted here. Refer to Figures 6, 7, 12, and 13. In this embodiment, the present invention provides a heat dissipation assembly structure 1c comprising an elongated liquid cooling device 3c and a plurality of electronic devices 9a, 9b, 9c. The liquid cooling device 3c mainly comprises an elongated rectangular base housing 2c, an upper cover 40, and a bottom cover 30. In this embodiment, the base housing 2c has a first side surface 11, a second side surface 12, a third side surface 13, a fourth side surface 14, a first surface 101, and a second surface 102. The first side 11 and the second side 12 are positioned opposite each other and are the longer sides extending along a first direction such as the Y-axis. The third side 13 and the fourth side 14 are positioned opposite each other and are the shorter sides, connected between the first side 11 and the second side 12, respectively. The first surface 101 and the second surface 102 are the bottom and top surfaces of the base housing 2c, respectively, and are two surfaces that face each other. In this embodiment, the distance between the first side 11 and the second side 12 (i.e., width) of the base housing 2c is smaller than the distance between the third side 13 and the fourth side 14 (i.e., length), thereby forming an elongated rectangular base housing 2c. That is, the lengths of the longer sides of the first side 11 and the second side 12 are longer than the lengths of the shorter sides of the third side 13 and the fourth side 14. In this embodiment, the integrated base housing 2c comprises an inlet chamber 21, an outlet chamber 22, a plurality of flow diversion chambers 41a, 41b, 41c, a partition wall 20, a plurality of first through holes 23a, 23b, 23c, a plurality of second through holes 24a, 24b, 24c, at least one flow diversion structure 25a, 25b, a cooling channel inlet 31, and a cooling channel outlet 32. In this embodiment, the inlet chamber 21 is provided on the first surface 101 and spatially opposite the first side surface 11 and the third side surface 13.The outlet chamber 22 is provided on the first surface 101 and spatially faces the second side surface 12 and the fourth side surface 14. The partition wall 20 is provided between the inlet chamber 21 and the outlet chamber 22. One end of the partition wall 20 connected to the third side surface 13 is close to the second side surface 12, and the other end connected to the fourth side surface 14 is close to the first side surface 11. In this embodiment, the bottom cover 30 is assembled with the first side surface 11, second side surface 12, third side surface 13, fourth side surface 14, and first surface 101 of the base housing 2c, and is connected to the partition wall 20 to form the inlet chamber 21 and the outlet chamber 22. The cooling channel inlet 31 and the cooling channel outlet 32 ​​are provided penetrating the bottom cover 30. In this embodiment, the cooling channel inlet 31 is provided adjacent to the third side surface 13 and communicates with the inlet chamber 21. The cooling channel outlet 32 ​​is provided adjacent to the fourth side surface 14 and communicates with the outflow chamber 22. Of course, the present invention is not limited to the method of assembling the bottom cover 30 and the base housing 2c. After the bottom cover 30 is assembled with the elongated rectangular base housing 2c, the space of the first surface 101 is partitioned by the partition wall 20 into an inflow chamber 21 and an outflow chamber 22, and the inflow chamber 21 and the outflow chamber 22 are symmetrical to each other. In this embodiment, the liquid cooling device 3c forms a plurality of flow division chambers 41a, 41b, 41c by assembling, for example, the upper cover 40 and the base housing 2c. The upper cover 40 has an upper and lower surface facing each other, and the heat dissipation surface 43 corresponding to the electronic devices 9a, 9b, and 9c is located on the upper surface of the upper cover 40, and the lower surface of the upper cover 40 is assembled with the first side surface 11, second side surface 12, third side surface 13, fourth side surface 14, and second surface 102 of the base housing 2c to form a plurality of flow diversion chambers 41a, 41b, and 41c. The present invention is not limited to the method of assembling the upper cover 40 and the base housing 2c.

[0053] In this embodiment, the multiple fins 42 are provided, for example, on the bottom surface of the upper cover 40, housed within the multiple flow diversion chambers 41a, 41b, 41c, and extend from the bottom surface of the upper cover 40 toward the second surface 102. In other embodiments, the multiple fins 42 are provided, for example, on the second surface 102, connected to the upper cover 40, and thermally coupled to the upper heat dissipation surface 43. Of course, the present invention is not limited thereto. By assembling the upper cover 40 and the base housing 2c, the multiple flow diversion chambers 41a, 41b, 41c are provided on the second surface 102 and are configured to be thermally coupled to the multiple fins 42. The multiple fins 42 are also connected to the heat dissipation surface 43, which dissipates heat from the multiple electronic devices 9a, 9b, 9c on it.

[0054] In this embodiment, the multiple first through holes 23a, 23b, and 23c are provided adjacent to the first side surface 11 and arranged along the first direction (i.e., the Y-axis direction), and each communicates with the inlet chamber 21 and the multiple diversion chambers 41a, 41b, and 41c. The multiple second through holes 24a, 24b, and 24c are provided adjacent to the second side surface 12 and arranged along the first direction (i.e., the Y-axis direction), and each communicates with the outlet chamber 22 and the multiple diversion chambers 41a, 41b, and 41c. The multiple diversion chambers 41a, 41b, and 41c correspond to the multiple first through holes 23a, 23b, and 23c at locations adjacent to the first side surface 11, and to the multiple second through holes 24a, 24b, and 24c at locations adjacent to the second side surface 12. The number of diversion chambers 41a, 41b, 41c, the number of first through-holes 23a, 23b, 23c, and the number of second through-holes 24a, 24b, 24c are all equal, at three each. The diversion chamber 41a, the first through-hole 23a, and the second through-hole 24a form flow path F1. The diversion chamber 41b, the first through-hole 23b, and the second through-hole 24b form flow path F2. The diversion chamber 41c, the first through-hole 23c, and the second through-hole 24c form flow path F3. The three flow paths F1, F2, and F3 are connected in parallel between the inlet chamber 21 and the outlet chamber 22, and the flow directions of the three flow paths F1, F2, and F3 are perpendicular to the first direction (Y-axis direction) and parallel to the X-axis direction.

[0055] In this embodiment, the flow dividers 25a and 25b are provided on the first surface 101 and located within the inlet chamber 21. One end of the flow dividers 25a and 25b is connected to the partition wall 20, and the other end of the flow dividers 25a and 25b extends along a second direction parallel to the X-axis, which is perpendicular to the first direction. As a result, the flow divider 25a provides a flow divider function to the adjacent first through-holes 23a and 23b. The flow divider 25b provides a flow divider function to the adjacent first through-holes 23b and 23c. In this invention, by installing the flow dividers 25a and 25b, the parallel flow paths F1, F2, and F3 can more effectively meet the heat dissipation requirements of the multiple electronic devices 9a, 9b, and 9c arranged in a single direction.

[0056] In this embodiment, the electronic devices 9a, 9b, and 9c are, for example, three power devices used in a multiphase inverter and are configured to output a motor drive current. Since each power device needs to have input and output electrical connections, they need to be arranged in a single direction and electrically connected to the outside on two long sides of the heat dissipation assembly structure 1c. In the heat dissipation assembly structure 1c, to satisfy the heat dissipation requirements of the multiple electronic devices 9a, 9b, and 9c arranged in a single direction, the multiple electronic devices 9a, 9b, and 9c are provided on the heat dissipation surface 43, arranged along a first direction (i.e., the Y-axis direction) and thermally coupled with the multiple fins 42. If the multiple electronic devices 9a, 9b, and 9c are power devices of the multiphase inverter, they may be electrically connected to the outside via the first side 11 or the second side 12. Of course, the present invention is not limited thereto. In this embodiment, after the cooling fluid enters the inlet chamber 21 from the cooling channel inlet 31, the cooling fluid is evenly distributed by the flow division action of the flow division structures 25a and 25b within the inlet chamber 21, and can enter the multiple flow division chambers 41a, 41b, and 41c through the multiple first through holes 23a, 23b, and 23c, respectively. The cooling fluid in the multiple flow division chambers 41a, 41b, and 41c exchanges heat with the multiple fins 42, dissipating heat from the multiple electronic devices 9a, 9b, and 9c. Subsequently, the cooling fluid in the multiple flow division chambers 41a, 41b, and 41c merges into the outlet chamber 22 through the multiple second through holes 24a, 24b, and 24c, respectively. Finally, it is discharged from the cooling channel outlet 32.

[0057] In this embodiment, the multiple flow diversion chambers 41a, 41b, and 41c form multiple lateral flow channels F1, F2, and F3 corresponding to the first through holes 23a, 23b, and 23c of the first side surface 11 and the second through holes 24a, 24b, and 24c of the second side surface 12. Due to the flow diversion action of the flow diversion structures 25a and 25b, the multiple lateral flow channels F1, F2, and F3 are connected in parallel between the inlet chamber 21 and the outlet chamber 22, allowing the heat of the multiple electronic devices 9a, 9b, and 9c to be dissipated by a cooling fluid of equal flow rate. Since the flow directions of the multiple lateral flow channels F1, F2, and F3 are perpendicular to the long side, i.e., the extending direction of the first side surface 11 and the second side surface 12, a short-path design is adopted rather than being designed along the extending direction of the long side. This allows the lateral flow channels F1, F2, and F3 of the multiple diversion chambers 41a, 41b, and 41c to flow along the shortest path within the elongated base housing 2c, thereby shortening the length of the flow channels and achieving the objective of improving uniform heat dissipation performance. As a result, the cooling channel inlet 31 and the cooling channel outlet 32 ​​can provide inlets and outlets for the cooling fluid from different ends on the long side, for example, ends adjacent to the third side surface 13 and the fourth side surface 14. In this embodiment, the multiple first through-holes 23a, 23b, and 23c and the multiple second through-holes 24a, 24b, and 24c are all slotted holes and extend along the first direction (i.e., the Y-axis direction). Multiple first through holes 23a, 23b, 23c and multiple second through holes 24a, 24b, 24c, and multiple flow division chambers 41a, 41b, 41c have the same width W in the first direction, and through the uniform flow division by the multiple flow channels F1, F2, F3 formed and the flow division structures 25a, 25b, the electronic devices 9a, 9b, 9c corresponding to the multiple flow division chambers 41a, 41b, 41c in the heat dissipation assembly structure 1c can have similar heat dissipation conditions, and the heat generated from the multiple electronic devices 9a, 9b, 9c can be removed quickly and uniformly, effectively improving the overall heat dissipation efficiency.

[0058] In this embodiment, the flow division structures 25a and 25b have, for example, a rectangular shape, and their extension length in the second direction (i.e., the X-axis direction) can be adjusted according to actual requirements. In other embodiments, uniform flow division can be formed even if either of the flow division structures 25a or 25b is omitted, and as a result, the parallel flow paths F1, F2, and F3 satisfy the heat dissipation requirements of the multiple electronic devices 9a, 9b, and 9c arranged in a single direction. Figure 14 shows a second embodiment of the flow division structure in the liquid cooling device of the present invention. In this embodiment, the structure of the base housing 2d is similar to that of the base housing 2c shown in Figures 12 to 13, and the same reference numerals represent the same components, structure, and function, which are omitted from this description. Refer to Figures 6 and 12 to 14. In this embodiment, the base housing 2d comprises a flow division structure 25b and a flow division structure 25d. The flow division structure 25b and the flow division structure 25d are located in the inlet chamber 21 and the outlet chamber 22, respectively. The flow divider structure 25b located in the inlet chamber 21 has one end connected to the partition wall 20 and the other end extending toward the first side surface 11 along the second direction (i.e., the X-axis direction), providing a flow divider function to adjacent first through-holes 23b and 23c, and helping to equalize the flow rates of the flow paths F2 and F3. The flow divider structure 25d located in the outlet chamber 22 has one end connected to the partition wall 20 and the other end extending toward the second side surface 12 along the second direction (i.e., the X-axis direction), providing a flow divider function to adjacent second through-holes 24a and 24b, and helping to equalize the flow rates of the flow paths F1 and F2. In this invention, by installing the flow divider structures 25b and 25d, the flow rates of the parallel flow paths F1, F2 and F3 can be evenly divided to meet the heat dissipation requirements of multiple electronic devices 9a, 9b and 9c arranged in a single direction.

[0059] Figure 15 shows a third embodiment of the flow division structure in the liquid cooling device of the present invention. In this embodiment, the structure of the base housing 2e is similar to that of the base housing 2c shown in Figures 12 to 13, and the same reference numerals represent the same components, structure and function, and their description is omitted here. Refer to Figures 6, 12, 13, and 15. In this embodiment, the base housing 2e comprises a flow division structure 25e and a flow division structure 25f. Both flow division structures 25e and 25f are provided in the inlet chamber 21 but are not connected to the partition wall 20. In this embodiment, both flow division structures 25e and 25f are circular. The flow division structure 25e is located on the centerline between two adjacent first through holes 23a and 23b. The flow division structure 25f is located on the centerline between two adjacent first through holes 23b and 23c. In other embodiments, the flow divider 25e may be located in the outlet chamber 22 and positioned on the centerline between two adjacent second through-holes 24a and 24b, or the flow divider 25f may be located in the outlet chamber 22 and positioned on the centerline between two adjacent second through-holes 24b and 24c. Of course, the installation of the flow dividers 25e and 25f can be adjusted according to actual needs, and the present invention is not limited thereto. In the present invention, by installing the flow dividers 25e and 25f, the flow rates of the parallel flow paths F1, F2 and F3 can be evenly divided to meet the heat dissipation requirements of multiple electronic devices 9a, 9b and 9c arranged in a single direction.

[0060] Figure 16 shows a fourth embodiment of the flow divider structure in the liquid cooling device of the present invention. In this embodiment, the structure of the base housing 2f is similar to that of the base housing 2c shown in Figures 12 to 13, and the same reference numerals represent the same components, structure and function, and their description is omitted here. Refer to Figures 6, 12, 13, and 16. In this embodiment, the base housing 2f comprises a flow divider structure 25g and a flow divider structure 25h. Both flow divider structures 25g and 25h are provided in the inlet chamber 21, but are not connected to the partition wall 20, and are connected only to the first surface 101 or the bottom cover 30. In this embodiment, both flow divider structures 25g and 25h have a slender, elongated shape and are spaced apart from the partition wall 20. The flow divider structure 25g extends along the centerlines of two adjacent first through holes 23a and 23b. The flow divider structure 25f extends along the centerlines of two adjacent first through holes 23b and 23c. In other words, both the flow division structures 25g and 25h extend along a second direction (i.e., the X-axis direction) perpendicular to the first direction. In this invention, by installing the flow division structures 25g and 25h, the flow rates of the parallel channels F1, F2, and F3 can be evenly divided to satisfy the heat dissipation requirements of multiple electronic devices 9a, 9b, and 9c arranged in a single direction. Of course, the installation of the flow division structures 25g and 25h can be adjusted according to actual needs, and this invention is not limited thereto.

[0061] Figures 17 and 18 are perspective views of a heat dissipation assembly structure according to the fifth embodiment of the present invention. Figures 19 and 20 are exploded views of the heat dissipation assembly structure according to the fifth embodiment of the present invention. Figure 21 is a schematic diagram showing the flow direction of the cooling fluid on the first surface of the liquid cooling device according to the fifth embodiment of the present invention. Figure 22 is a schematic diagram showing the flow direction of the cooling fluid on the second surface of the liquid cooling device according to the fifth embodiment of the present invention. In this embodiment, the structure of the heat dissipation assembly structure 1d and the liquid cooling device 3d is similar to the structure of the heat dissipation assembly structure 1c and the liquid cooling device 3c shown in Figures 12 to 13, and the same reference numerals represent the same components, structure and function, and their explanation is omitted here. In this embodiment, the heat dissipation assembly structure 1d comprises an elongated liquid cooling device 3d and at least two electronic devices 9a and 9b. The base housing 2g of the liquid cooling device 3d comprises at least two flow diversion chambers 41a, 41b, at least two first through holes 23a, 23b, at least two second through holes 24a, 24b, and at least one flow diversion structure 25. The flow diversion chambers 41a, 41b, the first through holes 23a, 23b, and the second through holes 24a, 24b correspond to each other, their numbers are equal, and their numbers are equal to the number of electronic devices 9a, 9b. In other embodiments, the number of flow diversion chambers 41a, 41b, the first through holes 23a, 23b, the second through holes 24a, 24b, and electronic devices 9a, 9b is M, where M is an integer and M ≥ 2. In other words, the multiple flow-dividing chambers 41a, 41b, the multiple first through-holes 23a, 23b, and the multiple second through-holes 24a, 24b form M flow paths F1, F2, and the flow directions of the M flow paths F1, F2 are perpendicular to the first direction (i.e., the Y-axis direction). The number of flow-dividing structures 25 is N, where N is an integer, N≧1, and preferably N+1=M.

[0062] In this embodiment, the flow divider structure 25 is provided on the first surface 101, positioned within the inlet chamber 21, and connected to the partition wall 20, providing a flow divider function to any two adjacent first through-holes 23a, 23b. In other embodiments, the flow divider structure 25 is positioned within the inlet chamber 21, the outlet chamber 22, or spaced apart from the partition wall 20, providing a flow divider function to any two adjacent first through-holes 23a, 23b or any two adjacent second through-holes 24a, 24b. Due to the flow divider action of the flow divider structure 25, the multiple lateral flow channels F1, F2 are connected in parallel between the inlet chamber 21 and the outlet chamber 22, allowing heat to be dissipated from the multiple electronic devices 9a, 9b with equal flow rates of cooling fluid. Since the flow directions of the multiple lateral flow channels F1 and F2 are perpendicular to the extension directions of the first side surface 11 and the second side surface 12, the lateral flow channels F1 and F2 of the multiple flow division chambers 41a and 41b flow along the shortest path within the elongated base housing 2g, thereby shortening the length of the flow channels and achieving the objective of improving uniform heat dissipation performance. As a result, the cooling fluid can enter the inlet chamber 21 through the cooling flow channel inlet 31 adjacent to the third side surface 13, and the flow division structure 25 evenly divides the multiple flow channels F1 and F2, so that the electronic devices 9a and 9b corresponding to the multiple flow division chambers 41a and 41b in the heat dissipation assembly structure 1d can have similar heat dissipation conditions, allowing the heat generated from the multiple electronic devices 9a and 9b to be removed quickly and uniformly, effectively improving the overall heat dissipation efficiency. Of course, the number of flow division structures 25 corresponds to the number of flow division chambers 41a, 41b, first through-holes 23a, 23b, second through-holes 24a, 24b, and electronic devices 9a, 9b, and can be adjusted according to actual needs. The present invention is not limited thereto and will not be repeated here.

[0063] As described above, the present invention provides a liquid cooling device and a heat dissipation assembly structure using the same, which effectively reduces the temperature difference between multiple electronic devices in a heat dissipation assembly structure and the impedance of the cooling fluid by introducing a flow division structure into multiple parallel flow channels. To meet the heat dissipation requirements of multiple electronic devices arranged in a single direction, the liquid cooling device provides a parallel flow channel design in an elongated base housing. The upper surface of the base housing is partitioned into multiple flow division chambers connected to heat dissipation fins that are thermally coupled to the multiple electronic devices, and the lower surface of the base housing is partitioned into an inlet chamber and an outlet chamber by a partition wall. By installing the flow division structure, the cooling fluid in the inlet chamber is evenly divided and then enters the multiple flow division chambers through multiple through-holes on adjacent long sides, and merges and is discharged into the outlet chamber through through-holes on other long sides. The multiple flow division chambers form multiple lateral flow channels corresponding to two through-holes on the long sides, and the multiple lateral flow channels are connected in parallel between the inlet chamber and the outlet chamber, dissipating heat individually from the multiple electronic devices with equal flow rates of cooling fluid. Since the flow directions of the multiple lateral channels are perpendicular to the extending direction of the long side, a short-path design is employed so that the lateral channels of the multiple diversion chambers are located between the two opposing long sides of the elongated base housing, rather than being designed along the extending direction of the long side. This shortens the length of the channels and achieves the objective of improving uniform heat dissipation performance. As a result, the cooling channel inlet and outlet can provide the cooling fluid inlet and outlet from different ends of the long side. Furthermore, the through-holes that are positioned and extend along the two opposing long sides have the same width as the diversion chambers communicating between them, and the multiple channels formed are evenly divided by at least one diversion structure. This ensures that the electronic devices corresponding to the multiple diversion chambers in the heat dissipation assembly structure have similar heat dissipation conditions, allowing for rapid and even removal of heat generated from multiple electronic devices and effectively improving overall heat dissipation efficiency.

[0064] Those skilled in the art may make various modifications to this invention, but will not deviate from the scope defined by the claims. [Explanation of symbols]

[0065] 1, 1a, 1b, 1c, 1d: Heat dissipation assembly structure 2, 2a, 2b, 2c, 2d, 2e, 2f, 2g: Base housing 3, 3a, 3b, 3c, 3d: Liquid cooling device 101: 1st surface 102:Second surface 11:1st side 12:Second side 13:Third side 14:Fourth side 20, 20a: Bulkhead 21: Inflow Chamber 22: Outlet Chamber 23a, 23b, 23c: 1st through hole 24a, 24b, 24c: 2nd through hole 25, 25a, 25b, 25c, 25d, 25e, 25f, 25g, 25h: Divided structure 30: Bottom cover 31: Cooling channel inlet 32: Cooling channel outlet 33a, 33b: Separate flow structure 40: Top cover 41a, 41b, 41c: Flow shunting chambers 42: Finn 43: Heat dissipation surface 9a, 9b, 9c: Electronic devices F1, F2, F3: Flow channels W: Width X, Y, Z: Axes

Claims

1. A liquid cooling device comprising a base housing and a bottom cover, The base housing has a first side surface, a second side surface, a third side surface, a fourth side surface, a first surface, and a second surface, the first side surface and the second side surface are arranged facing each other and extend along a first direction, The bottom cover is spatially opposite to the first surface and is connected to the first side, second side, third side, and fourth side. The base housing comprises an inlet chamber, an outlet chamber, a plurality of flow-dividing chambers, a partition wall, a plurality of first through-holes, a plurality of second through-holes, and at least one flow-dividing structure. The inflow chamber is provided between the first surface and the bottom cover, The outflow chamber is provided between the first surface and the bottom cover, The plurality of flow division chambers are provided on the second surface and are configured to be thermally coupled to the plurality of fins, The partition wall is provided between the inlet chamber and the outlet chamber and is connected between the first surface and the bottom cover. The plurality of first through holes are provided adjacent to the first side surface, arranged along the first direction, and each communicates between the inlet chamber and the plurality of flow diversion chambers. The plurality of second through-holes are provided adjacent to the second side surface, arranged along the first direction, and each communicates between the outflow chamber and the plurality of diversion chambers, and the plurality of diversion chambers correspond to the plurality of first through-holes at locations adjacent to the first side surface and to the plurality of second through-holes at locations adjacent to the second side surface. The at least one flow divider structure is provided on the bottom cover and protrudes toward the inlet chamber or the outlet chamber to provide a flow divider function, and the cooling fluid enters the plurality of flow dividers chambers through the inlet chamber and the plurality of first through-holes, respectively, and after heat exchange with the plurality of fins, the cooling fluid enters the outlet chamber through the plurality of flow dividers chambers and the plurality of second through-holes, respectively, and is then discharged. Liquid cooling device.

2. It is further equipped with a cooling channel inlet and a cooling channel outlet, The cooling channel inlet is provided through the bottom cover and communicates with the inflow chamber. The cooling channel outlet is provided through the bottom cover and communicates with the outflow chamber. The liquid cooling device according to claim 1.

3. The liquid cooling apparatus according to claim 1, wherein the at least one flow-dividing structure is circular and is positioned on the centerline between any two adjacent first through-holes, or on the centerline between any two adjacent second through-holes, to provide a flow-dividing function.

4. The liquid cooling apparatus according to claim 1, wherein the at least one flow divider structure is elongated, is positioned separately from the partition wall, and extends along a second direction perpendicular to the first direction.

5. The liquid cooling device according to claim 1, wherein the at least one flow separation structure is formed by the irregular bending of the partition wall.

6. The liquid cooling device according to claim 1, wherein the plurality of first through holes and the plurality of second through holes are all elongated holes and extend along the first direction.

7. It also has a top cover, The upper cover has an upper surface and a lower surface facing each other, the lower surface being connected to the first side, second side, third side, fourth side, and second surface of the base housing to form the plurality of flow diversion chambers, the plurality of fins being housed within the plurality of flow diversion chambers, extending from the lower surface toward the second surface, and the upper surface being provided with a heat dissipation surface that is thermally coupled to the plurality of fins. The liquid cooling device according to claim 1.

8. The liquid cooling apparatus according to claim 1, wherein the number of each of the plurality of flow division chambers, the plurality of first through holes, and the plurality of second through holes is equal to M, where M is an integer and M ≥ 2.

9. The liquid cooling apparatus according to claim 8, wherein the plurality of flow division chambers, the plurality of first through-holes, and the plurality of second through-holes form M flow paths, and the flow direction of the M flow paths is perpendicular to the first direction.

10. A liquid cooling device comprising a base housing, The base housing has a first side surface, a second side surface, a third side surface, a fourth side surface, a first surface, and a second surface, the first side surface and the second side surface are arranged facing each other and extend along a first direction, The base housing comprises an inlet chamber, an outlet chamber, a plurality of flow-dividing chambers, a partition wall, a plurality of first through-holes, a plurality of second through-holes, and at least one flow-dividing structure. The inflow chamber is provided on the first surface, The outflow chamber is provided on the first surface, The plurality of flow division chambers are provided on the second surface and are configured to be thermally coupled to the plurality of fins, The partition wall is provided between the inlet chamber and the outlet chamber. The plurality of first through holes are provided adjacent to the first side surface, arranged along the first direction, and each communicates between the inlet chamber and the plurality of flow diversion chambers. The plurality of second through-holes are provided adjacent to the second side surface, arranged along the first direction, and each communicates between the outflow chamber and the plurality of diversion chambers, and the plurality of diversion chambers correspond to the plurality of first through-holes at locations adjacent to the first side surface and to the plurality of second through-holes at locations adjacent to the second side surface. The at least one flow divider structure is provided on the first surface and positioned in the inlet chamber or the outlet chamber, or connected to the partition wall, to provide a flow divider function, and the cooling fluid enters the plurality of flow dividers chambers through the inlet chamber and the plurality of first through-holes, respectively, and after heat exchange with the plurality of fins, the cooling fluid enters the outlet chamber through the plurality of flow dividers chambers and the plurality of second through-holes, respectively, and is then discharged. Liquid cooling device.

11. It is further equipped with a cooling channel inlet and a cooling channel outlet, The cooling channel inlet is provided adjacent to the third side surface and communicates with the inflow chamber. The cooling channel outlet is provided adjacent to the fourth side surface and communicates with the outflow chamber. The liquid cooling device according to claim 10.

12. It also has a bottom cover, The bottom cover is connected to the first side, second side, third side, fourth side, and first surface of the base housing and to the partition wall, forming the inlet chamber and the outlet chamber, and the cooling channel inlet and the cooling channel outlet are provided through the bottom cover. The liquid cooling device according to claim 11.

13. The liquid cooling device according to claim 10, wherein one end of the at least one flow divider structure is connected to the partition wall, and the other end extends along a second direction perpendicular to the first direction.

14. The liquid cooling device according to claim 10, wherein the at least one flow-dividing structure is circular and is positioned on the centerline between any two adjacent first through-holes, or on the centerline between any two adjacent second through-holes, to provide a flow-dividing function.

15. The liquid cooling apparatus according to claim 10, wherein the at least one flow divider structure is elongated, is positioned separately from the partition wall, and extends along a second direction perpendicular to the first direction.

16. The liquid cooling device according to claim 10, wherein the at least one flow separation structure is formed by the irregular bending of the partition wall.

17. The liquid cooling device according to claim 10, wherein the plurality of first through holes and the plurality of second through holes are all elongated holes and extend along the first direction.

18. It also has a top cover, The upper cover has an upper surface and a lower surface facing each other, the lower surface being connected to the first side, second side, third side, fourth side, and second surface of the base housing to form the plurality of flow diversion chambers, the plurality of fins being housed within the plurality of flow diversion chambers, extending from the lower surface toward the second surface, and the upper surface being provided with a heat dissipation surface that is thermally coupled to the plurality of fins. The liquid cooling device according to claim 10.

19. The liquid cooling apparatus according to claim 10, wherein the number of each of the plurality of flow division chambers, the plurality of first through holes, and the plurality of second through holes is equal to M, where M is an integer and M ≥ 2.

20. A heat dissipation assembly structure comprising a liquid cooling device and multiple electronic devices, The liquid cooling device comprises a base housing and a bottom cover. The base housing has a first side surface, a second side surface, a third side surface, a fourth side surface, a first surface, and a second surface, the first and second side surfaces being arranged opposite each other and extending along a first direction, the bottom cover being spatially opposite the first surface and connected to the first side surface, the second side surface, the third side surface, and the fourth side surface, The base housing comprises an inlet chamber, an outlet chamber, a plurality of flow-dividing chambers, a partition wall, a plurality of first through-holes, a plurality of second through-holes, and at least one flow-dividing structure. The inflow chamber is provided between the first surface and the bottom cover, The outflow chamber is provided between the first surface and the bottom cover, The plurality of flow division chambers are provided on the second surface and are configured to be thermally coupled to the plurality of fins, The partition wall is provided between the inlet chamber and the outlet chamber and is connected between the first surface and the bottom cover. The plurality of first through holes are provided adjacent to the first side surface, arranged along the first direction, and each communicates between the inlet chamber and the plurality of flow diversion chambers. The plurality of second through-holes are provided adjacent to the second side surface, arranged along the first direction, and each communicates between the outflow chamber and the plurality of diversion chambers, and the plurality of diversion chambers correspond to the plurality of first through-holes at locations adjacent to the first side surface and to the plurality of second through-holes at locations adjacent to the second side surface. The at least one flow division structure is provided on the bottom cover or the first surface and protrudes toward the inlet chamber or the outlet chamber to provide a flow division function. The plurality of electronic devices are provided on a heat dissipation surface, arranged along the first direction, and thermally coupled with the plurality of fins. The cooling fluid enters the plurality of diversion chambers through the inlet chamber and the plurality of first through-holes, respectively, and dissipates heat from the plurality of electronic devices through heat exchange with the plurality of fins. Subsequently, the cooling fluid flows from the plurality of diversion chambers through the plurality of second through-holes to the outlet chamber. Heat dissipation assembly structure.

Images