Multilayer board modules and electronic devices

Abstract

The objective of the present invention is to reduce weight. This multilayer substrate module (100) includes: a rigid part (101) in which a first multilayer substrate (1), a dielectric component (3), and a second multilayer substrate (2) are stacked; and a flexible part (102) in which the first multilayer substrate (1) and the second multilayer substrate (2) are stacked without the intermediary of the dielectric component (3). The rigid part (101) has a radiation electrode (4) and a ground electrode (5). At least one of a plurality of first conductive layers (12a, 12b, 12c) and a second conductive layer (22) has a conductor part that is included in the flexible part (102) and the rigid part (101). The thickness (T2) of the flexible part (102) is thinner than the thickness (T1) of the rigid part (101).

Description

Technical Field

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[0001] The present invention generally relates to a multilayer substrate module and an electronic device, and more particularly to a multilayer substrate module provided with a radiation electrode and an electronic device provided with the multilayer substrate module.

Background Art

[0002] Patent Document 1 discloses a millimeter-wave module (multilayer substrate module) including an insulating substrate, a dielectric block (dielectric component), and an antenna.

[0003] The insulating substrate has a first main surface and a second main surface that are parallel to each other and are disposed at different positions in the thickness direction. The dielectric block is disposed inside the insulating substrate. The dielectric block is disposed between the first main surface and the second main surface of the insulating substrate. The dielectric constant of the dielectric block is different from the dielectric constant of the insulating substrate.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the millimeter-wave module (multilayer substrate module) disclosed in Patent Document 1, a dielectric block (dielectric component) is disposed inside the insulating substrate, resulting in an increase in the thickness and weight of the insulating substrate.

[0006] An object of the present invention is to provide a multilayer substrate module and an electronic device capable of achieving weight reduction.

Means for Solving the Problems

[0007] A multilayer substrate module according to one aspect of the present invention comprises a first laminated substrate, a second laminated substrate, and a dielectric component. The first laminated substrate has a plurality of first insulating layers and a plurality of first conductive layers, and the plurality of first insulating layers and the plurality of first conductive layers are laminated together. The second laminated substrate has a second insulating layer and a second conductive layer, and the second insulating layer and the second conductive layer are laminated together. The dielectric component is disposed between the first laminated substrate and the second laminated substrate. In the multilayer substrate module, the portion where the first laminated substrate, the dielectric component, and the second laminated substrate are laminated together is defined as a rigid portion, and the portion where the first laminated substrate and the second laminated substrate are laminated together without the dielectric component is defined as a flexible portion. The rigid portion has a radiating electrode and a ground electrode. The radiating electrode includes a portion of one of the plurality of first conductive layers and second conductive layers in the thickness direction of the rigid portion. The radiating electrode overlaps the dielectric component in the thickness direction. The ground electrode includes a portion of one of the plurality of first conductive layers and faces the radiating electrode in the thickness direction. At least one of the plurality of first conductive layers and the second conductive layer has a conductive portion included in the flexible portion and the rigid portion. The thickness of the flexible portion is thinner than the thickness of the rigid portion.

[0008] An electronic device according to one aspect of the present invention comprises a multilayer substrate module according to the above aspect and a housing. The housing houses the multilayer substrate module. [Effects of the Invention]

[0009] The multilayer substrate module and electronic device according to the above embodiment of the present invention can be made lighter. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a cross-sectional view of the main part of a multilayer substrate module according to Embodiment 1. [Figure 2] Figure 2 is a cross-sectional view of the same multilayer substrate module. [Figure 3]Figure 3 is a cross-sectional view of the same multilayer substrate module, corresponding to the section taken along line III-III in Figure 1. [Figure 4] Figure 4 is an exploded perspective view of the same multilayer substrate module. [Figure 5] Figure 5 shows the same multilayer substrate module disassembled, in a partially broken perspective view. [Figure 6] Figure 6 is an explanatory diagram of the manufacturing method for the multilayer substrate module described above. [Figure 7] Figure 7 is a cross-sectional view of the main part of an electronic device equipped with the multilayer substrate module described above. [Figure 8] Figure 8 is a cross-sectional view of a multilayer substrate module according to Embodiment 2. [Figure 9] Figure 9 is another cross-sectional view of the same multilayer substrate module. [Figure 10] Figure 10 is an explanatory diagram of the manufacturing method for the multilayer substrate module described above. [Figure 11] Figure 11 is a cross-sectional view of a multilayer substrate module according to Embodiment 3. [Figure 12] Figure 12 is a cross-sectional view of the main part of a multilayer substrate module according to Embodiment 4. [Figure 13] Figure 13 is a cross-sectional view of the same multilayer substrate module, corresponding to the section taken along line XIII-XIII in Figure 12. [Figure 14] Figure 14 is an explanatory diagram of the manufacturing method for the multilayer substrate module described above. [Figure 15] Figure 15 is an exploded perspective view of the same multilayer substrate module. [Figure 16] Figure 16 is a cross-sectional view of a multilayer substrate module according to Embodiment 5. [Figure 17] Figure 17 is a partially broken plan view of another example of an electronic device comprising the multilayer substrate module of Embodiment 1. [Figure 18] Figure 18 is a cross-sectional view of the same electronic device, taken along the line XVIII-XVIII in Figure 17. [Figure 19] Figure 19 is a cross-sectional view of a key part of another example of an electronic device comprising the multilayer substrate module of Embodiment 1.

Best Mode for Carrying Out the Invention

[0011] Hereinafter, Embodiments 1 to 5 and the like will be described with reference to the drawings. The drawings referred to in the following Embodiments 1 to 5 and the like are schematic drawings, and the sizes and thicknesses of the components in the drawings do not necessarily reflect the actual dimensions, and the ratios of the sizes and thicknesses between the components also do not necessarily reflect the actual dimensional ratios.

[0012] (Embodiment 1) The multilayer substrate module and the electronic device according to Embodiment 1 will be described with reference to FIGS. 1 to 7.

[0013] (1) Multilayer substrate module As shown in FIGS. 1 and 2, the multilayer substrate module 100 according to Embodiment 1 includes a first laminated substrate 1, a second laminated substrate 2, and a dielectric component 3. In the multilayer substrate module 100, a portion where the first laminated substrate 1, the dielectric component 3, and the second laminated substrate 2 are laminated is defined as a rigid portion 101, and a portion where the first laminated substrate 1 and the second laminated substrate 2 are laminated without passing through the dielectric component 3 is defined as a flexible portion 102. The rigid portion 101 has a radiating electrode 4. In each of FIGS. 1 to 7, a rectangular coordinate system having three axes, an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other, is defined, and an axis along the thickness direction D1 (see FIG. 1) of the rigid portion 101 is denoted as the Z-axis. The X-axis, the Y-axis, and the Z-axis are all virtual axes, and the arrows indicating "X", "Y", and "Z" in the drawings are merely for explanation and do not have any physical entity.

[0014] Further, the multilayer substrate module 100 according to Embodiment 1 further includes a first cover layer 8 and a second cover layer 9. Further, the multilayer substrate module 100 according to Embodiment 1 further includes an electronic component E1.

[0015] The multilayer substrate module 100 is housed in the casing 501 of the electronic device 500, for example, as shown in Figure 7. The electronic device 500 is, for example, a communication device. The communication device is, for example, a mobile phone (e.g., a smartphone), but is not limited to a mobile phone; it may also be, for example, a notebook personal computer, a wearable device (e.g., a smartwatch), etc.

[0016] (1.1) First laminated substrate As shown in Figures 1 to 3, the first laminated substrate 1 has multiple (three in the example of Figure 1) first insulating layers 11a, 11b, 11c and multiple (three in the example of Figure 1) first conductive layers 12a, 12b, 12c, and the multiple first insulating layers 11a, 11b, 11c and the multiple first conductive layers 12a, 12b, 12c are laminated together. The first laminated substrate 1 has a main surface 10 on the side opposite to the second laminated substrate 2. Furthermore, the first laminated substrate 1 has multiple first interlayer connecting conductors 13a, multiple first interlayer connecting conductors 13b, and multiple first interlayer connecting conductors 13c.

[0017] Each of the multiple first insulating layers 11a, 11b, and 11c is made of, for example, a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer. The thermoplastic resin is not limited to a liquid crystal polymer, but may also be, for example, PTFE (polytetrafluoroethylene).

[0018] The thickness of each of the multiple first insulating layers 11a, 11b, and 11c is, for example, between 10 μm and 120 μm.

[0019] Each of the multiple first conductive layers 12a, 12b, and 12c is conductive. The material of each of the multiple first conductive layers 12a, 12b, and 12c includes, for example, copper.

[0020] The thickness of each of the multiple first conductive layers 12a, 12b, and 12c is, for example, 3 μm to 40 μm.

[0021] The multiple first conductive layers 12a, 12b, and 12c are formed in a predetermined pattern defined for each layer. The first conductive layer 12a is formed, for example, by patterning copper foil attached to the first insulating layer 11a. The first conductive layer 12b is formed, for example, by patterning copper foil attached to the first insulating layer 11b. The first conductive layer 12c is formed by patterning copper foil attached to the first insulating layer 11c. Each of the multiple first conductive layers 12a, 12b, and 12c includes a plurality of conductive portions.

[0022] In this embodiment, the first conductive layer 12a, which is the furthest from the dielectric component 3 among the plurality of first conductive layers 12a, 12b, and 12c, has a ground electrode 5 (hereinafter also referred to as the first ground electrode 5). More specifically, one of the plurality of conductive parts included in the first conductive layer 12a constitutes the first ground electrode 5. In this embodiment, the first ground electrode 5 is included in the rigid part 101 and the flexible part 102. The first ground electrode 5 overlaps with the radiating electrode 4 in a plan view from the thickness direction D1 of the rigid part 101. The first ground electrode 5 faces the radiating electrode 4 in the thickness direction D1 of the rigid part 101. The first ground electrode 5 also faces the signal line 7 connected to the radiating electrode 4. The first ground electrode 5 overlaps with the signal line 7 in the thickness direction of the multilayer substrate module 100. The multilayer substrate module 100 has a strip line 70 including the signal line 7, the first ground electrode 5 and the second ground electrode 6. The thickness direction of the multilayer substrate module 100 differs depending on the position of the flexible portion 102 when the flexible portion 102 of the multilayer substrate module 100 is bent, as shown in Figure 7.

[0023] In this embodiment, as shown in Figure 1, among the multiple first conductive layers 12a, 12b, and 12c, the multiple conductive portions included in the first conductive layer 12b, which is the second furthest from the dielectric component 3, include a ground conductor portion 15. The ground conductor portion 15 is connected to the first ground electrode 5 via one of the multiple first interlayer connecting conductors 13a.

[0024] In this embodiment, the first conductive layer 12c closest to the dielectric component 3 among the plurality of first conductive layers 12a, 12b, and 12c has a signal line 7. More specifically, one of the plurality of conductive parts contained in the first conductive layer 12c constitutes the signal line 7. In this embodiment, the signal line 7 is contained in the rigid part 101 and the flexible part 102.

[0025] Furthermore, the multiple conductor portions included in the first conductive layer 12c include a ground conductor portion 16 that is connected to the first ground electrode 5 via one of the multiple first interlayer connecting conductors 13b, etc.

[0026] Each of the multiple first interlayer connecting conductors 13a, 13b, and 13c is electrically conductive. Each of the multiple first interlayer connecting conductors 13a, 13b, and 13c includes, for example, copper, a copper-tin alloy, and a resin. The multiple first interlayer connecting conductors 13a are formed, for example, by filling the multiple via holes formed in the first insulating layer 11a with a conductive paste containing copper, a low-melting-point metal (e.g., tin), and a resin, with each of the multiple via holes formed in the first insulating layer 11a being blocked by a portion of copper foil, and then heating the paste. The multiple first interlayer connecting conductors 13b are formed, for example, by filling the multiple via holes formed in the first insulating layer 11b with a conductive paste containing copper, a low-melting-point metal (e.g., tin), and a resin, with each of the multiple via holes formed in the first insulating layer 11b being blocked by a portion of copper foil, and then heating the paste. Multiple interlayer connecting conductors 13c are formed, for example, by filling multiple via holes formed in the first insulating layer 11c with a conductive paste containing copper, a low-melting-point metal (e.g., tin), and resin, and then heating it, with each of the multiple via holes being blocked by a portion of copper foil.

[0027] (1.2) Second layer substrate The second laminated substrate 2 is laminated on the first laminated substrate 1. More specifically, the second laminated substrate 2 is laminated on the first laminated substrate 1 so as to cover the dielectric component 3 on the first laminated substrate 1. The second laminated substrate 2 has a main surface 20 on the side opposite to the first laminated substrate 1.

[0028] The second laminated substrate 2 has a second insulating layer 21 and a second conductive layer 22, with the second insulating layer 21 and the second conductive layer 22 being laminated together. The second laminated substrate 2 further has a plurality of interlayer connecting conductors 23. In this embodiment, the second insulating layer 21 is bonded to the first insulating layer 11c. More specifically, in this embodiment, the second insulating layer 21 and the first insulating layer 11c are self-adhered, and no adhesive layer is interposed between the second insulating layer 21 and the first insulating layer 11c.

[0029] The material of the second insulating layer 21 includes, for example, a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer. The thermoplastic resin is not limited to a liquid crystal polymer, but may be, for example, PTFE. In this embodiment, the material of the second insulating layer 21 and the materials of each of the multiple first insulating layers 11a, 11b, and 11c contain the same material as the main constituent material. The main constituent material means the main component.

[0030] The thickness of the second insulating layer 21 is, for example, 10 μm or more and 120 μm or less.

[0031] The second conductive layer 22 is conductive. The material of the second conductive layer 22 includes, for example, copper.

[0032] The thickness of the second conductive layer 22 is, for example, 3 μm or more and 40 μm or less.

[0033] The second conductive layer 22 is formed in a predetermined pattern. The second conductive layer 22 includes a plurality of conductive portions. The second conductive layer 22 is formed, for example, by patterning copper foil attached to the second insulating layer 21.

[0034] In this embodiment, the second conductive layer 22 has a radiating electrode 4. More specifically, one of the multiple conductive portions included in the second conductive layer 22 constitutes the radiating electrode 4. In this embodiment, the radiating electrode 4 is included in the rigid portion 101.

[0035] In a plan view from the thickness direction D1 of the rigid portion 101, the radiating electrode 4 is, for example, square-shaped, but is not limited to a square shape; for example, it may be rectangular.

[0036] The radiating electrode 4 overlaps the dielectric component 3 in the thickness direction D1 of the rigid portion 101. More specifically, in this embodiment, the entire radiating electrode 4 and the position of the dielectric component 3 overlap in the thickness direction D1 of the rigid portion 101. In the multilayer substrate module 100 of this embodiment, the antenna (patch antenna) AT1 is formed by the radiating electrode 4, the portion of the first ground electrode 5 that overlaps the radiating electrode 4 in the thickness direction D1 of the rigid portion 101, and the portion of the rigid portion 101 between the radiating electrode 4 and the first ground electrode 5 in the thickness direction D1 of the rigid portion 101. In antenna AT1, the capacitance formed between the radiating electrode 4 and the first ground electrode 5 also affects the antenna characteristics, so in this embodiment, in order to reduce this capacitance, the radiating electrode 4 and the first ground electrode 5 are spaced apart in the thickness direction D1 of the rigid portion 101.

[0037] Furthermore, in this embodiment, the second conductive layer 22 has a ground electrode 6 (hereinafter also referred to as the second ground electrode 6) that is different from the first ground electrode 5. More specifically, one of the multiple conductive portions included in the second conductive layer 22 constitutes the second ground electrode 6. The second ground electrode 6 is included in the rigid portion 101 and the flexible portion 102. In this embodiment, the second ground electrode 6 is laminated on the second insulating layer 21, spanning the portion of the second insulating layer 21 included in the rigid portion 101 and the portion of the second insulating layer 21 included in the flexible portion 102.

[0038] In this embodiment, in a plan view from the thickness direction D1 of the rigid portion 101, the second ground electrode 6 surrounds the radiating electrode 4 (see Figure 4). The second ground electrode 6 and the radiating electrode 4 are spaced apart from each other.

[0039] Each of the multiple interlayer conductors 23 is conductive. Each of the multiple interlayer conductors 23 includes, for example, copper, a copper-tin alloy, and a resin. The multiple interlayer conductors 23 are formed, for example, by filling the multiple via holes formed in the second insulating layer 21 with a conductive paste containing copper, a low-melting-point metal (e.g., tin), and a resin, and then heating it, with each of the multiple via holes formed in the second insulating layer 21 being blocked by a portion of copper foil.

[0040] One of the multiple interlayer connecting conductors 23 is connected to the radiating electrode 4. The interlayer connecting conductor 23 connected to the radiating electrode 4 functions as the feed point of the antenna AT1. Another of the multiple interlayer connecting conductors 23 is connected to the second ground electrode 6 and the first ground electrode 5 of the first laminated substrate 1.

[0041] (1.3) Dielectric components The dielectric component 3 is placed between the first laminated substrate 1 and the second laminated substrate 2.

[0042] In this embodiment, the dielectric component 3 is covered by a first laminated substrate 1 and a second laminated substrate 2. More specifically, in this embodiment, the dielectric component 3 is placed on the first laminated substrate 1 and sealed by the second laminated substrate 2. The dielectric component 3 has a first main surface 311 on the side of the first laminated substrate 1, a second main surface 312 on the opposite side of the first main surface 311, and an outer peripheral surface 313 connecting the first main surface 311 and the second main surface 312. In this embodiment, the outer peripheral surface 313 includes four sides 314 (see Figures 4 and 5). In the dielectric component 3, the first main surface 311 is covered by the first laminated substrate 1, and the second main surface 312 and the outer peripheral surface 313 are covered by the second laminated substrate 2.

[0043] The thickness of the dielectric component 3 in the thickness direction D1 of the rigid portion 101 is greater than the thickness of the second laminated substrate 2. In this embodiment, the thickness of the second laminated substrate 2 is the sum of the thickness of the second insulating layer 21 and the thickness of the second conductive layer 22.

[0044] In this embodiment, the dielectric component 3 includes a dielectric substrate 31 and a through electrode 32 that penetrates the dielectric substrate 31. The through electrode 32 connects a second interlayer connecting conductor 23 connected to a radiating electrode 4 in the second laminated substrate 2 and a first interlayer connecting conductor 13c connected to a signal line 7 in the first laminated substrate 1.

[0045] In this embodiment, the material of the dielectric substrate 31 includes ceramic. That is, in this embodiment, the dielectric material of the dielectric component 3 includes ceramic. The ceramic is, for example, LTCC (Low Temperature Co-fired Ceramics). The ceramic is not limited to LTCC, but may also be, for example, HTCC (High Temperature Co-fired Ceramics). Furthermore, the dielectric material of the dielectric component 3 is not limited to ceramic, but may also be, for example, a glass epoxy resin of FR-4 (Flame Retardant Type 4) grade. In this case, the dielectric component 3 includes, for example, a glass epoxy resin substrate of FR-4 grade. The material of the through electrode 32 includes, for example, copper.

[0046] In this embodiment, the relative permittivity of the dielectric material of dielectric component 3 is greater than the relative permittivity of each of the materials of the multiple first insulating layers 11a, 11b, and 11c. Furthermore, the relative permittivity of the dielectric material of dielectric component 3 is greater than the relative permittivity of the material of the second insulating layer 21. For example, the relative permittivity of LTCC is 6.5 in the frequency range of 1 GHz to 25 GHz, and the relative permittivity of liquid crystal polymer is 2.8 in the frequency range of 1 GHz to 25 GHz.

[0047] In this embodiment, the Young's modulus of the dielectric material of dielectric component 3 is greater than the Young's modulus of each of the materials of the plurality of first insulating layers 11a, 11b, and 11c, and the Young's modulus of the dielectric material of dielectric component 3 is greater than the Young's modulus of the material of the second insulating layer 21. For example, the Young's modulus of LTCC is 100 GPa, and the Young's modulus of liquid crystal polymer is 5 GPa.

[0048] (1.4) First Cover Layer The first cover layer 8 covers the main surface 10 of the first laminated substrate 1 on the side opposite to the second laminated substrate 2.

[0049] The first cover layer 8 includes, for example, a polyimide film and an adhesive layer. The material of the adhesive layer includes, for example, an acrylic resin, a silicone resin, an epoxy resin, or a urethane resin.

[0050] (1.5) Second Cover Layer The second cover layer 9 is provided on the main surface 20 of the second laminated substrate 2, opposite to the side facing the first laminated substrate 1. The main surface 20 of the second laminated substrate 2 includes the main surface 220 of the second conductive layer 22 (see Figure 2) and the portion of the main surface 210 of the second insulating layer 21 (see Figure 2) that is not covered by the second conductive layer 22. In the thickness direction D1 of the rigid portion 101, the second cover layer 9 has an opening 90 that exposes the rigid portion 101. Therefore, the second cover layer 9 does not cover the radiating electrode 4.

[0051] The second cover layer 9 includes, for example, a polyimide film and an adhesive layer. The material of the adhesive layer includes, for example, an acrylic resin, a silicone resin, an epoxy resin, or a urethane resin.

[0052] (1.6) Electronic components As shown in Figure 2, the electronic component E1 is located on the flexible portion 102. More specifically, the electronic component E1 is located on the main surface 20 of the second laminated substrate 2 within the flexible portion 102. "The electronic component E1 is located on the flexible portion 102" includes both the fact that the electronic component E1 is mechanically connected to the flexible portion 102 and the fact that the electronic component E1 is electrically connected to the flexible portion 102.

[0053] Electronic component E1 is, for example, a connector. Electronic component E1 is not limited to a connector; it may be another electronic component such as an IC chip or a surface-mount electronic component (e.g., a chip inductor, a chip capacitor, etc.).

[0054] (2) Thickness of multilayer substrate module In the multilayer substrate module 100, as shown in Figure 1, the thickness T1 of the rigid portion 101 and the thickness T2 of the flexible portion 102 are different. The "thickness T2 of the flexible portion 102" refers to the thickness of the portion of the flexible portion 102 where the second laminated substrate 2 and the first laminated substrate 1 are parallel, and not the thickness of the portion where the second laminated substrate 2 is inclined relative to the first laminated substrate 1 near the boundary with the rigid portion 101. In the multilayer substrate module 100, the thickness T2 of the flexible portion 102 is thinner than the thickness T1 of the rigid portion 101.

[0055] (3) Manufacturing method of multilayer substrate module In the manufacturing method of the multilayer substrate module 100 of this embodiment, for example, as shown in Figure 6, a first laminated substrate 1, a dielectric component 3, and a second laminated substrate 2 are prepared. For example, the first laminated substrate 1 is placed on a metal plate (not shown), and the dielectric component 3 is placed on the first laminated substrate 1. Then, the second laminated substrate 2 is placed so as to cover the first laminated substrate 1 and the dielectric component 3, and the first laminated substrate 1 and the second laminated substrate 2 are self-adhered by pressing from above while heating. This forms a rigid portion 101 (see Figure 2) and a flexible portion 102 (see Figure 2). Then, the electronic component E1 is mounted on the flexible portion 102 to obtain the multilayer substrate module 100 (see Figure 2).

[0056] (4)Electronic equipment As shown in Figure 7, the electronic device 500 according to Embodiment 1 comprises a multilayer substrate module 100 and a housing 501 that houses the multilayer substrate module 100. The electronic device 500 further comprises a printed circuit board 505 and a connector 506.

[0057] The housing 501 has a radio wave transparent portion 503 that transmits radio waves emitted from the radiating electrode 4 of the multilayer substrate module 100. The radio wave transparent portion 503 is a resin portion that overlaps with the radiating electrode 4 in the thickness direction of the rigid portion 101, but it is not limited to a resin portion and may be an opening, for example.

[0058] In the electronic device 500, the connector 506 is located on a printed circuit board 505 housed within the enclosure 501. As shown in Figure 7, the multilayer circuit board module 100 is bent by plastically deforming the thermoplastic resin of the flexible portion 102, and the multilayer circuit board module 100 maintains its shape on its own. The connector 506 is detachably connected to the electronic component E1 of the multilayer circuit board module 100. The printed circuit board 505 is, for example, a motherboard. The printed circuit board 505 contains, for example, a signal processing circuit that processes high-frequency signals.

[0059] (5) Effects In the multilayer substrate module 100 according to Embodiment 1, the portion where the first laminated substrate 1, the dielectric component 3, and the second laminated substrate 2 are stacked is defined as the rigid portion 101, and the portion where the first laminated substrate 1 and the second laminated substrate 2 are stacked without the dielectric component 3 is defined as the flexible portion 102. The rigid portion 101 has a radiating electrode 4 and a ground electrode 5. The radiating electrode 4 includes a portion of one of the multiple first conductive layers 12a, 12b, 12c and the second conductive layer 22 (the second conductive layer 22) in the thickness direction D1 of the rigid portion 101, and overlaps with the dielectric component 3 in the thickness direction D1. The ground electrode 5 includes a portion of one of the multiple first conductive layers 12a, 12b, 12c (the first conductive layer 12a) and faces the radiating electrode 4 in the thickness direction D1. At least one of the multiple first conductive layers 12a, 12b, 12c and the second conductive layer 22 (the first conductive layer 12c) has a conductive portion (signal line 7) included in the flexible portion 102 and the rigid portion 101. The thickness T2 of the flexible portion 102 is thinner than the thickness T1 of the rigid portion 101.

[0060] According to the above configuration, it is possible to reduce the weight of the multilayer substrate module 100. More specifically, in the multilayer substrate module 100 according to Embodiment 1, the rigid portion 101 has a radiating electrode 4 and a ground electrode 5, and the thickness T2 of the flexible portion 102 is thinner than the thickness T1 of the rigid portion 101, so it is possible to reduce the weight without degrading the antenna performance (the performance of the antenna AT1 including the radiating electrode 4 and the ground electrode 5).

[0061] Furthermore, in the multilayer substrate module 100 according to Embodiment 1, the relative permittivity of the dielectric material of the dielectric component 3 is greater than the relative permittivity of each of the materials of the multiple first insulating layers 11a, 11b, and 11c, and the relative permittivity of the dielectric material of the dielectric component 3 is greater than the relative permittivity of the material of the second insulating layer 21.

[0062] According to the above configuration, it becomes possible to miniaturize the antenna AT1, which includes the radiating electrode 4 and the ground electrode 5.

[0063] Furthermore, in the multilayer substrate module 100 according to Embodiment 1, the conductive portion included in the second conductive layer 22 has a second ground electrode 6 that is different from the first ground electrode 5 which is the ground electrode 5, and the second ground electrode 6 is included in the rigid portion 101 and the flexible portion 102.

[0064] With the above configuration, compared to the case where the second ground electrode 6 is separated into a portion included in the rigid portion 101 and a portion included in the flexible portion 102 and connected via an interlayer connecting conductor, it becomes possible to stabilize the potential of the second ground electrode 6 and improve noise immunity.

[0065] Furthermore, in the multilayer substrate module 100 according to Embodiment 1, the second ground electrode 6 surrounds the radiating electrode 4 when viewed in a plan view from the thickness direction D1 of the rigid portion 101.

[0066] According to the above configuration, it is possible to improve noise immunity and also improve the directivity of the antenna AT1, which includes the radiating electrode 4 and the ground electrode 5.

[0067] Furthermore, in the multilayer substrate module 100 according to Embodiment 1, the first conductive layer 12c, which is closest to the dielectric component 3 among the plurality of first conductive layers 12a, 12b, and 12c, has a signal line 7 that is included in the rigid portion 101 and the flexible portion 102. Also, in the multilayer substrate module 100, the first ground electrode 5 is included in the rigid portion 101 and the flexible portion 102. The first ground electrode 5 faces the signal line 7. The second ground electrode 6 of the second conductive layer 22 is included in the rigid portion 101 and the flexible portion 102. The second ground electrode 6 faces the signal line 7 via the second insulating layer 21 and the first insulating layer 11c, which is closest to the dielectric component 3 among the plurality of first insulating layers 11a, 11b, and 11c.

[0068] With the above configuration, the multilayer substrate module 100 can increase the distance between the signal line 7 and the first ground electrode 5, thereby reducing the capacitance formed between the signal line 7 and the first ground electrode 5, and it can also increase the distance between the signal line 7 and the second ground electrode 6, thereby reducing the capacitance formed between the signal line 7 and the second ground electrode 6. As a result, the multilayer substrate module 100 can widen the line width of the signal line 7, thereby reducing the resistance of the signal line 7 and reducing losses in the signal line 7. Furthermore, with the above configuration, since the capacitance formed between the signal line 7 and the first ground electrode 5 and the capacitance formed between the signal line 7 and the second ground electrode 6 can be reduced, the area of ​​each of the first ground electrode 5 and the second ground electrode 6 can be increased, making it possible to stabilize the ground potential more.

[0069] Furthermore, since the electronic device 500 according to Embodiment 1 comprises a multilayer substrate module 100 and a housing 501, it is possible to reduce the weight of the multilayer substrate module 100.

[0070] (Modified version of Embodiment 1) For example, the second laminated substrate 2 is not limited to having one second insulating layer 21 and one second conductive layer 22, but may also have a configuration having multiple second insulating layers 21 and multiple second conductive layers 22. In this case, the second laminated substrate 2 only needs to have multiple second insulating layers 21 and multiple second conductive layers 22 laminated together.

[0071] Furthermore, the material of each of the first insulating layers 11a, 11b, and 11c may be polyimide. In this case, each of the multiple first interlayer connecting conductors 13a, multiple first interlayer connecting conductors 13b, and multiple first interlayer connecting conductors 13c may be made of through-hole plating. Also, in the first laminated substrate 1, the first interlayer connecting conductors 13a, 13b, and 13c that are connected to each other may be made of a single through-hole plating. In this case, the material of the through-hole plating is, for example, copper.

[0072] In the multilayer substrate module 100, each of the first cover layer 8 and the second cover layer 9 is not limited to a configuration including a polyimide film and an adhesive layer, but may also be, for example, a resist layer. The resist layer can be formed using, for example, spin coating technology and photolithography technology.

[0073] In the multilayer substrate module 100, when viewed from a plan view from the thickness direction D1 of the rigid portion 101, the entirety of the radiating electrode 4 and a part of the dielectric component 3 overlap, but either the entirety of the radiating electrode 4 overlaps the entirety of the dielectric component 3, or a part of the radiating electrode 4 overlaps the entirety of the dielectric component 3.

[0074] (Embodiment 2) The multilayer substrate module 100A according to Embodiment 2 will be described with reference to Figures 8 to 10. Regarding the multilayer substrate module 100A according to Embodiment 2, components similar to those in the multilayer substrate module 100 according to Embodiment 1 (see Figures 1 to 7) are denoted by the same reference numerals and their descriptions are omitted. In Figures 8 to 10, as in Figures 1 to 7, a Cartesian coordinate system is defined with three mutually orthogonal axes: the X, Y, and Z axes, and the axis along the thickness direction D1 of the rigid portion 101 (see Figure 8) is indicated as the Z axis.

[0075] (1) Composition The multilayer substrate module 100A according to Embodiment 2 differs from the multilayer substrate module 100 according to Embodiment 1 in that it includes a dielectric component 3A instead of the dielectric component 3 of the multilayer substrate module 100 according to Embodiment 1. Furthermore, in the multilayer substrate module 100A according to Embodiment 2, the radiating electrode 4 includes a part of the first conductive layer 12c and overlaps with the dielectric component 3A in the thickness direction D1. In addition, the first conductive layer 12b has a conductive portion (signal line 7) included in the flexible portion 102 and the rigid portion 101.

[0076] The dielectric material of dielectric component 3A includes ceramic. The ceramic is, for example, LTCC. The ceramic is not limited to LTCC, but may also be, for example, HTCC. Furthermore, the dielectric material of dielectric component 3A is not limited to ceramic, but may also be, for example, FR-4 grade glass epoxy resin. When the dielectric material of dielectric component 3A is glass epoxy resin, dielectric component 3A includes, for example, a glass epoxy resin substrate equivalent to FR-4 grade glass epoxy resin.

[0077] The dielectric component 3A is a dielectric lens in contact with the second insulating layer 21. More specifically, the dielectric lens has a plano-convex lens shape. In this embodiment, the first main surface 311 of the dielectric component 3A is flat and in contact with the radiating electrode 4, and the second main surface 312 of the dielectric component 3A is curved and in contact with the second insulating layer 21.

[0078] Embodiment 2 Multilayer PCB module100A further comprises a plurality of dielectric components 30 arranged between the first laminated substrate 1 and the second laminated substrate 2. Dielectric component 3A is one of the plurality of dielectric components 30. The dielectric materials of the plurality of dielectric components 30 are the same. The relative permittivity of the dielectric materials of the plurality of dielectric components 30 is the same. "The relative permittivity of the dielectric materials of the plurality of dielectric components 30 is the same" means that the relative permittivity of the dielectric materials of the plurality of dielectric components 30 does not have to be exactly the same value. "The relative permittivity of the dielectric materials of the plurality of dielectric components 30 is the same" includes the case where the relative permittivity of the dielectric material of any one dielectric component 30 among the plurality of dielectric components 30 is used as a reference value, and the relative permittivity of the dielectric material of the other dielectric components 30 is a value of 90% or more and 110% or less of the reference value. In addition, the Young's modulus of the dielectric materials of the plurality of dielectric components 30 is the same. "The Young's modulus of the dielectric materials of the plurality of dielectric components 30 is the same" means that the Young's modulus of the dielectric materials of the plurality of dielectric components 30 does not have to be exactly the same value. "The Young's moduli of the dielectric materials of the multiple dielectric components 30 are the same" includes cases where the Young's moduli of the dielectric materials of the other dielectric components 30 are between 90% and 110% of the Young's moduli of any one dielectric component 30 among the multiple dielectric components 30, using the Young's moduli of the dielectric material of one of the multiple dielectric components 30 as a reference value. The shapes of the multiple dielectric components 30 are the same, but they may be different.

[0079] The rigid portion 101 further includes a plurality of radiating electrodes 40 that correspond one-to-one with a plurality of dielectric components 30. The plurality of radiating electrodes 40 are 1 Multilayer substrate 1 The 1 conductive layer 12c It is included in. Radiating electrode 4 is one of multiple radiating electrodes 40. Multiple radiating electrodes 40 The materials are the same to each other. The shapes of the multiple radiating electrodes 40 are the same to each other, but may be different to each other.

[0080] The multilayer substrate module 100A in this embodiment constitutes a MIMO (Multi Input Multi Output) radar.

[0081] In this embodiment, the multilayer substrate module 100A further comprises an electronic component E2, as shown in Figure 9. The electronic component E2 is located on the main surface 10 of the first laminated substrate 1 in the flexible portion 102 of the multilayer substrate module 100A. The electronic component E2 is, for example, a radar IC chip. The radar IC chip is an IC chip that includes signal processing circuits and the like for functioning as a millimeter-wave radar together with the antenna AT1 and the signal line 7. The electronic component E2 is connected to the signal line 7 via one of a plurality of land electrodes 18 included in the first conductive layer 12a, one of a plurality of first interlayer connecting conductors 13a, and one of a plurality of first interlayer connecting conductors 13b.

[0082] (2) Thickness of multilayer substrate module In the multilayer substrate module 100A, the thickness T1 of the rigid portion 101 and the thickness T2 of the flexible portion 102 are different. The "thickness T2 of the flexible portion 102" refers to the thickness of the portion in the flexible portion 102 where the second laminated substrate 2 and the first laminated substrate 1 are parallel, and not the thickness of the portion where the thickness changes near the boundary with the rigid portion 101. In the multilayer substrate module 100A, the thickness T2 of the flexible portion 102 is thinner than the thickness T1 of the rigid portion 101.

[0083] (3) Manufacturing method of multilayer substrate module In the manufacturing method of the multilayer substrate module 100A of this embodiment, for example, as shown in Figure 10, a first laminated substrate 1, a plurality of dielectric components 30, and a second laminated substrate 2 are prepared. For example, the first laminated substrate 1 is placed on a metal plate (not shown), and the plurality of dielectric components 30 are placed on the first laminated substrate 1. Then, the second laminated substrate 2 is placed so as to cover the first laminated substrate 1 and the plurality of dielectric components 30, and the first laminated substrate 1 and the second laminated substrate 2 are self-adhered by pressing from above while heating. This forms a rigid portion 101 and a flexible portion 102. Then, the electronic component E2 is mounted on the flexible portion 102 to obtain the multilayer substrate module 100A.

[0084] (4) Effects The multilayer substrate module 100A according to Embodiment 2, like the multilayer substrate module 100 according to Embodiment 1, has the radiating electrode 4 and the ground electrode 5 included in the rigid portion 101, and the thickness T2 of the flexible portion 102 is thinner than the thickness T1 of the rigid portion 101, making it possible to reduce weight without degrading antenna performance.

[0085] Furthermore, in the multilayer substrate module 100A according to Embodiment 2, the relative permittivity of the dielectric material of the dielectric component 3A is greater than that of the second insulating layer 21. As a result, the multilayer substrate module 100A can reduce the abrupt change in the relative permittivity between the dielectric lens and air, thereby reducing impedance mismatch. In addition, the multilayer substrate module 100A according to Embodiment 2 can refract the radio waves emitted from the radiating electrode 4, making it possible to make the antenna characteristics uniform regardless of the direction of radio wave radiation.

[0086] (Embodiment 3) The multilayer substrate module 100B according to Embodiment 3 will be described with reference to Figure 11. Regarding the multilayer substrate module 100B according to Embodiment 3, components similar to those in the multilayer substrate module 100A according to Embodiment 2 (see Figures 8 to 10) are denoted by the same reference numerals and their description is omitted. In Figure 11, as in Figures 8 to 10, a Cartesian coordinate system is defined having three mutually orthogonal axes: the X, Y, and Z axes, with the axis along the thickness direction D1 of the rigid portion 101 being represented as the Z axis.

[0087] (1) Composition The multilayer substrate module 100B according to Embodiment 3 differs from the multilayer substrate module 100A according to Embodiment 2 in that it further includes an electronic component E3 located on the rigid portion 101.

[0088] Electronic component E3 is, for example, a radar IC chip. Electronic component E3 is connected to the signal line 7 via one of the multiple land electrodes 18 contained in the first conductive layer 12a, one of the multiple first interlayer connecting conductors 13a, and one of the multiple first interlayer connecting conductors 13b.

[0089] (2) Effects The multilayer substrate module 100B according to Embodiment 3, like the multilayer substrate module 100 according to Embodiment 1, has the radiating electrode 4 included in the rigid portion 101, and the thickness T2 of the flexible portion 102 is thinner than the thickness T1 of the rigid portion 101, making it possible to reduce weight without degrading antenna performance.

[0090] Furthermore, in the multilayer substrate module 100B according to Embodiment 3, since the electronic component E3 is arranged on the rigid portion 101, it is possible to improve the mounting reliability of the electronic component E3.

[0091] (Embodiment 4) The multilayer substrate module 100C according to Embodiment 4 will be described with reference to Figures 12 to 15. Regarding the multilayer substrate module 100C according to Embodiment 4, components similar to those in the multilayer substrate module 100 according to Embodiment 1 (see Figures 1 to 7) are denoted by the same reference numerals and their description is omitted. In Figures 12 to 15, as in Figures 1 to 7, a Cartesian coordinate system is defined having three mutually orthogonal axes: the X, Y, and Z axes, with the axis along the thickness direction D1 of the rigid portion 101 (see Figure 12) being represented as the Z axis.

[0092] (1) Composition In the multilayer substrate module 100C according to Embodiment 4, as shown in Figure 12, the flexible portion 102 has a cavity 14 formed in the first insulating layer 11c that is closest to the second laminated substrate 2 among a plurality of (three in the example of Figure 12) first insulating layers 11a, 11b, and 11c.

[0093] As shown in Figures 14 and 15, the first laminated substrate 1 has a cavity 14 formed in the first insulating layer 11c, so the thickness of the first laminated substrate 1 can be reduced in the region where the cavity 14 is formed. The cavity 14 is not limited to being formed only in the first insulating layer 11c, but may also be formed across the first insulating layer 11c and the first insulating layer 11b.

[0094] In the multilayer substrate module 100C, the cavity 14 is filled by a portion of the second insulating layer 21 of the second laminated substrate 2.

[0095] (2) Thickness of multilayer substrate module In the multilayer substrate module 100C, as shown in Figure 12, the thickness T1 of the rigid portion 101 and the thickness T2 of the flexible portion 102 are different. The "thickness T2 of the flexible portion 102" refers to the thickness of the portion in the flexible portion 102 where the second laminated substrate 2 and the first laminated substrate 1 are parallel, and not the thickness of the portion where the thickness changes near the boundary with the rigid portion 101. In the multilayer substrate module 100C, the thickness T2 of the flexible portion 102 is thinner than the thickness T1 of the rigid portion 101.

[0096] (3) Manufacturing method of multilayer substrate module In the manufacturing method of the multilayer substrate module 100C of this embodiment, for example, as shown in Figures 14 and 15, the first laminated substrate 1 and invite The electrical components 3 and the second laminated substrate 2 are prepared. For example, the first laminated substrate 1 is placed on a metal plate (not shown), and the dielectric components 3 are placed on the first laminated substrate 1. Then, the second laminated substrate 2 is placed so as to cover the first laminated substrate 1 and the dielectric components 3, and the first laminated substrate 1 and the second laminated substrate 2 are self-adhered by pressing from above while heating. This forms a rigid portion 101 and a flexible portion 102. Subsequently, the flexible portion 102 is bent to obtain a multilayer substrate module 100C.

[0097] (4) Effects The multilayer substrate module 100C according to Embodiment 4, like the multilayer substrate module 100 according to Embodiment 1, has the radiating electrode 4 and the ground electrode 5 included in the rigid portion 101, and the thickness T2 of the flexible portion 102 is thinner than the thickness T1 of the rigid portion 101, making it possible to reduce weight without degrading antenna performance.

[0098] Furthermore, in the multilayer substrate module 100C according to Embodiment 4, since the flexible portion 102 has a cavity 14 formed in the first insulating layer 11c, the thickness T2 of the flexible portion 102 can be made thinner, making the flexible portion 102 easier to bend.

[0099] (Embodiment 5) The multilayer substrate module 100D according to Embodiment 5 will be described with reference to Figure 16. Regarding the multilayer substrate module 100D according to Embodiment 5, components similar to those in the multilayer substrate module 100 according to Embodiment 1 (see Figures 1 to 7) are denoted by the same reference numerals and their descriptions are omitted.

[0100] (1) Composition The multilayer substrate module 100D according to Embodiment 5 further comprises a plurality of dielectric components 30. The plurality of dielectric components 30 include a first dielectric component 301 and a second dielectric component 302 having a different shape from the first dielectric component 301.

[0101] In the multilayer substrate module 100D according to Embodiment 5, the first dielectric component 301 is the dielectric component 3 of the multilayer substrate module 100 according to Embodiment 1 (see Figure 1), and the second dielectric component 302 is the dielectric component 3A of the multilayer substrate module 100A according to Embodiment 2 (see Figure 8).

[0102] (2) Thickness of multilayer substrate module In the multilayer substrate module 100D, the thicknesses T11 and T12 of the rigid portion 101 and the thickness T2 of the flexible portion 102 are different. The "thickness T2 of the flexible portion 102" refers to the thickness of the portion in the flexible portion 102 where the second laminated substrate 2 and the first laminated substrate 1 are parallel, and not the thickness of the portion where the thickness changes near the boundary with the rigid portion 101. In the multilayer substrate module 100D, the thickness T2 of the flexible portion 102 is thinner than the thicknesses T11 and T12 of the rigid portion 101. The thickness T11 of the rigid portion 101 is the thickness of the portion in the rigid portion 101 that includes the radiating electrode 4 and the first dielectric component 301. The thickness T12 of the rigid portion 101 is the thickness of the portion in the rigid portion 101 that includes the second dielectric component 302.

[0103] (3) Effects The multilayer substrate module 100D according to Embodiment 5, like the multilayer substrate module 100 according to Embodiment 1, has the radiating electrode 4 and ground electrode 5 included in the rigid portion 101, and the thickness T2 of the flexible portion 102 is thinner than the thicknesses T11 and T12 of the rigid portion 101, making it possible to reduce weight without degrading antenna performance.

[0104] The embodiments described above (1 to 5) are merely one of many embodiments of the present invention. The embodiments described above (1 to 5) can be modified in various ways depending on the design, etc., as long as the objectives of the present invention are achieved, and may be combined as appropriate.

[0105] As described above, the multilayer substrate module 100 according to Embodiment 1 (see Figure 7) allows for miniaturization of the antenna AT1, which includes the radiating electrode 4 and the ground electrode 5. As a result, as shown in Figures 17 and 18, in the electronic device 500 equipped with the multilayer substrate module 100, a portion of the antenna AT1 can be placed in the opening 504 of the housing 501 of the electronic device 500 without impairing the rigidity of the housing 501. This allows the electronic device 500 to have more space for other components to be placed inside the housing 501. In the examples of Figures 17 and 18, there may be cushioning material or the like between a portion of the rigid part 101 including the antenna AT1 (the portion that protrudes more than the flexible part 102) and the inner surface of the opening 504 of the housing 501. In the examples of Figures 17 and 18, the opening 504 of the housing 501 reduces the number of obstructions in the direction of radiation of the antenna AT1, making it possible to save space without degrading antenna performance.

[0106] Furthermore, the electronic device 500 may have a configuration in which the housing 501 has a recess instead of an opening 504 in which a part of the rigid portion 101 including the antenna AT1 of the multilayer substrate module 100 is placed. In this configuration as well, it is possible to increase the space for placing other components within the housing 501.

[0107] Furthermore, in the electronic device 500, for example, as shown in Figure 19, the multilayer substrate module 100 may be configured to bend within the housing 501 of the electronic device 500 to avoid other components 510 within the housing 501.

[0108] (Appearance) This specification discloses the following aspects:

[0109] A multilayer substrate module (100; 100A; 100B; 100C; 100D) according to the first embodiment comprises a first laminated substrate (1), a second laminated substrate (2), and a dielectric component (3; 3A). The first laminated substrate (1) has a plurality of first insulating layers (11a, 11b, 11c) and a plurality of first conductive layers (12a, 12b, 12c), with the plurality of first insulating layers (11a, 11b, 11c) and the plurality of first conductive layers (12a, 12b, 12c) being laminated. The second laminated substrate (2) has a second insulating layer (21) and a second conductive layer (22), with the second insulating layer (21) and the second conductive layer (22) being laminated. The dielectric component (3; 3A) is disposed between the first laminated substrate (1) and the second laminated substrate (2). In the multilayer substrate modules (100;100A;100B;100C;100D), the portion where the first laminated substrate (1), dielectric components (3;3A), and second laminated substrate (2) are stacked is defined as the rigid portion (101), and the portion where the first laminated substrate (1) and second laminated substrate (2) are stacked without the dielectric components (3;3A) is defined as the flexible portion (102). The rigid portion (101) has a radiating electrode (4) and a ground electrode (5). The radiating electrode (4) includes a portion of one of the conductive layers (second conductive layer 22; first conductive layer 12c) among a plurality of first conductive layers (12a, 12b, 12c) and a second conductive layer (22) in the thickness direction (D1) of the rigid portion (101). The radiating electrode (4) overlaps with the dielectric components (3;3A) in the thickness direction (D1). The ground electrode (5) includes a portion of one of the plurality of first conductive layers (12a, 12b, 12c) (first conductive layer 12a) and faces the radiating electrode (4) in the thickness direction (D1). At least one of the plurality of first conductive layers (12a, 12b, 12c) and the second conductive layer (22) has a conductive portion included in the flexible portion (102) and the rigid portion (101). The thickness (T2) of the flexible portion (102) is thinner than the thickness (T1) of the rigid portion (101).

[0110] This embodiment makes it possible to reduce weight.

[0111] In the multilayer substrate module (100;100A;100B;100C;100D) according to the second embodiment, in the first embodiment, the relative permittivity of the dielectric material of the dielectric component (3;3A) is greater than the relative permittivity of each of the materials of the plurality of first insulating layers (11a, 11b, 11c), and the relative permittivity of the dielectric material of the dielectric component (3;3A) is greater than the relative permittivity of the material of the second insulating layer (21).

[0112] According to this embodiment, it is possible to improve antenna performance.

[0113] In the third embodiment of the multilayer substrate module (100;100A;100B;100C;100D), in the first or second embodiment, the Young's modulus of the dielectric material of the dielectric component (3;3A) is greater than the Young's modulus of the materials of each of the multiple first insulating layers (11a, 11b, 11c), and the Young's modulus of the dielectric material of the dielectric component (3;3A) is greater than the Young's modulus of the material of the second insulating layer (21).

[0114] According to this embodiment, the impact applied to the dielectric component (3;3A) from outside the multilayer substrate module (100;100A;100B;100C;100D) can be mitigated by the first laminated substrate (1) and the second laminated substrate (2). Furthermore, according to this embodiment, the rigidity of the rigid portion (101) can be improved, and the bendability of the flexible portion (102) can be improved.

[0115] In the multilayer substrate module (100;100A;100B;100C;100D) according to the fourth embodiment, in any one of the first to third embodiments, the material of each of the multiple first insulating layers (11a, 11b, 11c) and the material of the second insulating layer (21) are the same material.

[0116] According to this embodiment, it is possible to reduce the warping of the multilayer substrate modules (100;100A;100B;100C;100D) when they are not bent.

[0117] The multilayer substrate module (100;100A;100B;100C;100D) according to the fifth embodiment is such that, in any one of the first to fourth embodiments, the material of each of the plurality of first insulating layers (11a, 11b, 11c) and the material of the second insulating layer (21) include a thermoplastic resin.

[0118] According to this embodiment, it becomes possible to make the multilayer substrate module (100; 100A; 100B; 100C; 100D) thinner and to improve the bendability of the flexible part (102).

[0119] In the multilayer substrate module (100;100A;100B;100C;100D) according to the sixth embodiment, in any one of the first to fifth embodiments, the dielectric material of the dielectric component (3;3A) includes ceramic.

[0120] According to this embodiment, it is possible to improve the rigidity of the rigid portion (101).

[0121] In the multilayer substrate module (100;100A) according to the seventh embodiment, in any one of the first to sixth embodiments, the second conductive layer (22) includes a conductor portion. The conductor portion of the second conductive layer (22) has a second ground electrode (6) that is different from the first ground electrode (5), which is the ground electrode (5).

[0122] According to this embodiment, the second ground electrode (6) is laminated on the second insulating layer (21) spanning both the portion of the second insulating layer (21) included in the rigid portion (101) and the portion of the second insulating layer (21) included in the flexible portion (102), thereby improving noise immunity.

[0123] In the multilayer substrate module (100;100C;100D) according to the eighth embodiment, in the seventh embodiment, the second ground electrode (6) surrounds the radiating electrode (4) in a plan view of the rigid portion (101) viewed from the thickness direction (D1).

[0124] According to this embodiment, it is possible to further improve noise immunity.

[0125] In the multilayer substrate module (100;100A;100C;100D) according to the ninth embodiment, in the seventh or eighth embodiment, one of the plurality of first conductive layers (12a, 12b, 12c) has a conductor portion. The conductor portion of the one of the plurality of first conductive layers (12c, 12b) has a signal line (7). The signal line (7) is included in a rigid portion (101) and a flexible portion (102). The first ground electrode (5) is included in the rigid portion (101) and the flexible portion (102). The first ground electrode (5) faces the signal line (7). The second ground electrode (6) faces the signal line (7) via the second insulating layer (21) and the first insulating layer (11c) that is closest to the dielectric component (3;3A) among the multiple first insulating layers (11a, 11b, 11c).

[0126] According to this embodiment, the line width of the signal line (7) can be increased, thereby reducing the resistance of the signal line (7) and reducing losses in the signal line (7).

[0127] In the multilayer substrate module (100A; 100B; 100D) according to the tenth embodiment, in any one of the first to ninth embodiments, the radiating electrode (4) includes a portion of the first conductive layer (12c) that is closest to the dielectric component (3A) among a plurality of first conductive layers (12a, 12b, 12c). The dielectric component (3A) is a dielectric lens having a curved surface and in contact with the second insulating layer (21).

[0128] According to this embodiment, it is possible to improve the directivity of the radio waves emitted from the radiating electrode (4).

[0129] A multilayer substrate module (100; 100A; 100B; 100C; 100D) according to the 11th embodiment further comprises electronic components (E1; E2) arranged in the flexible portion (102) in any one of the first to tenth embodiments.

[0130] According to this embodiment, it is possible to make the multilayer substrate modules (100; 100A; 100B; 100C; 100D) equipped with electronic components (E1) thinner.

[0131] A multilayer substrate module (100B) according to the twelfth embodiment further comprises an electronic component (E3) located on the rigid portion (101) in any one of the first to eleventh embodiments.

[0132] According to this embodiment, it is possible to improve the mounting reliability of electronic components (E3).

[0133] In the multilayer substrate module (100C) according to the 13th embodiment, in any one of the first to 12 embodiments, the flexible portion (102) has a cavity (14) formed in the first insulating layer (11c) that is closest to the second laminated substrate (2) among the plurality of first insulating layers (11a, 11b, 11c).

[0134] According to this embodiment, the flexible part (102) becomes easier to bend.

[0135] A multilayer substrate module (100A; 100B) according to the 14th embodiment further comprises a plurality of dielectric components (30) disposed between a first laminated substrate (1) and a second laminated substrate (2) in any one of the first to 13 embodiments. Dielectric component (3) is one of the plurality of dielectric components (30). The rigid portion (101) further includes a plurality of radiating electrodes (40) corresponding one-to-one to the plurality of dielectric components (30). Radiating electrode (4) is one of the plurality of radiating electrodes (40).

[0136] According to this embodiment, it can be used as a MIMO radar.

[0137] In the multilayer substrate module (100D) according to the 15th embodiment, in the 14th embodiment, the plurality of dielectric components (30) include a first dielectric component (301) and a second dielectric component (302) having a different shape from the first dielectric component (301).

[0138] A multilayer substrate module (100; 100A; 100B; 100C; 100D) according to the 16th embodiment further comprises a first cover layer (8) and a second cover layer (9) in any one of the 1st to 15th embodiments. The first cover layer (8) covers the main surface (10) of the first laminated substrate (1) on the side opposite to the second laminated substrate (2). The second cover layer (9) is provided on the main surface (20) of the second laminated substrate (2) on the side opposite to the first laminated substrate (1). In the thickness direction (D1) of the rigid portion (101), the second cover layer (9) has an opening (90) that exposes the rigid portion (101).

[0139] According to this embodiment, it is possible to improve reliability.

[0140] The electronic device (500) according to the 17th embodiment comprises one multilayer substrate module (100; 100A; 100B; 100C; 100D) from any of the 1st to 16th embodiments, and a housing (501). The housing (501) houses the multilayer substrate module (100; 100A; 100B; 100C; 100D).

[0141] This embodiment makes it possible to reduce weight. [Explanation of symbols]

[0142] 1. First stacked substrate 10 Main surface 11a, 11b, 11c First insulating layer 12a, 12b, 12c first conductive layer 13a, 13b, 13c First interlayer connecting conductors 14 Cavity 2. Second layer substrate 20 Main surface 21 Second insulating layer 22 Second conductive layer 23. Second Interlayer Connecting Conductor 3. 3A dielectric components 30 Dielectric Components 301 First Dielectric Component 302 Second Dielectric Component 4 Radiation electrode 40 Radiation electrode 5. Ground electrode (first ground electrode) 6. Ground electrode (second ground electrode) 7 Signal lines 8. First Cover Layer 9. Second Cover Layer 90 aperture 100, 100A, 100B, 100C, 100D Multilayer PCB Modules 101 Rigid section 102 Flexible section 500 Electronic equipment 501 cabinet E1 Electronic Components E2 Electronic components E3 electronic components Thickness T1, T11, T12 T2 thickness

Claims

1. A first laminated substrate having a plurality of first insulating layers and a plurality of first conductive layers, wherein the plurality of first insulating layers and the plurality of first conductive layers are laminated together, A second laminated substrate having a second insulating layer and a second conductive layer, wherein the second insulating layer and the second conductive layer are laminated together, A dielectric component disposed between the first laminated substrate and the second laminated substrate is provided, The portion in which the first laminated substrate, the dielectric component, and the second laminated substrate are stacked is defined as the rigid portion, and the portion in which the first laminated substrate and the second laminated substrate are stacked without the dielectric component in between is defined as the flexible portion. The rigid portion is, In the thickness direction of the rigid portion, the rigid portion includes a part of one of the plurality of first conductive layers and the second conductive layer, and the radiating electrode overlaps the dielectric component in the thickness direction, It includes a part of one of the plurality of first conductive layers and a ground electrode facing the radiating electrode in the thickness direction, At least one of the plurality of first conductive layers and the second conductive layer has a conductive portion included in the flexible portion and the rigid portion, The thickness of the flexible portion is thinner than the thickness of the rigid portion. Multilayer circuit board module.

2. The relative permittivity of the dielectric material of the dielectric component is greater than the relative permittivity of each of the materials of the plurality of first insulating layers, and the relative permittivity of the dielectric material of the dielectric component is greater than the relative permittivity of the material of the second insulating layer. The multilayer substrate module according to claim 1.

3. The Young's modulus of the dielectric material of the dielectric component is greater than the Young's modulus of the material of each of the plurality of first insulating layers, and the Young's modulus of the dielectric material of the dielectric component is greater than the Young's modulus of the material of the second insulating layer. A multilayer substrate module according to claim 1 or 2.

4. The material of each of the plurality of first insulating layers and the material of the second insulating layer include the same material, A multilayer substrate module according to claim 1 or 2.

5. Each of the materials of the plurality of first insulating layers and the material of the second insulating layer include a thermoplastic resin. A multilayer substrate module according to claim 1 or 2.

6. The material of the dielectric component includes ceramic. A multilayer substrate module according to claim 1 or 2.

7. The second conductive layer includes the conductor portion, The conductive portion of the second conductive layer has a second ground electrode that is different from the first ground electrode, which is the ground electrode. A multilayer substrate module according to claim 1 or 2.

8. In a plan view of the rigid portion as seen from the thickness direction, the second ground electrode surrounds the radiating electrode. The multilayer substrate module according to claim 7.

9. One of the plurality of first conductive layers has the conductor portion, The conductor portion of one of the plurality of first conductive layers has a signal line included in the rigid portion and the flexible portion. The first ground electrode is included in the rigid portion and the flexible portion and faces the signal line. The second ground electrode faces the signal line via the second insulating layer and the first insulating layer among the plurality of first insulating layers that is closest to the dielectric component. The multilayer substrate module according to claim 7.

10. The radiating electrode includes a portion of the first conductive layer that is closest to the dielectric component among the plurality of first conductive layers, The dielectric component is a dielectric lens having a curved surface and in contact with the second insulating layer. A multilayer substrate module according to claim 1 or 2.

11. The flexible portion further comprises electronic components arranged therein. A multilayer substrate module according to claim 1 or 2.

12. The rigid portion further comprises electronic components arranged therein. A multilayer substrate module according to claim 1 or 2.

13. The flexible portion has a cavity formed in the first insulating layer closest to the second laminated substrate among the plurality of first insulating layers. A multilayer substrate module according to claim 1 or 2.

14. The system further comprises a plurality of dielectric components disposed between the first laminated substrate and the second laminated substrate, The dielectric component is one of the plurality of dielectric components, The rigid portion further includes a plurality of radiating electrodes that correspond one-to-one with the plurality of dielectric components, The aforementioned radiation electrode is one of the plurality of radiation electrodes. A multilayer substrate module according to claim 1 or 2.

15. The plurality of dielectric components are First dielectric component, A second dielectric component having a different shape from the first dielectric component, The multilayer substrate module according to claim 14.

16. A first cover layer covering the main surface of the first laminated substrate on the side opposite to the second laminated substrate, The second laminated substrate further comprises a second cover layer provided on the main surface of the second laminated substrate opposite to the first laminated substrate side, In the thickness direction of the rigid portion, the second cover layer has an opening that exposes the rigid portion. A multilayer substrate module according to claim 1 or 2.

17. A multilayer substrate module according to claim 1 or 2, The system comprises a housing that houses the aforementioned multilayer substrate module, electronic equipment.

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